WO2017221542A1 - 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 - Google Patents
繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 Download PDFInfo
- Publication number
- WO2017221542A1 WO2017221542A1 PCT/JP2017/016267 JP2017016267W WO2017221542A1 WO 2017221542 A1 WO2017221542 A1 WO 2017221542A1 JP 2017016267 W JP2017016267 W JP 2017016267W WO 2017221542 A1 WO2017221542 A1 WO 2017221542A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- epoxy resin
- fiber
- reinforced composite
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- the present invention relates to a two-pack type epoxy resin composition used for a fiber-reinforced composite material, and a fiber-reinforced composite material using the same.
- Fiber reinforced composite materials composed of reinforced fibers and matrix resins can be designed using the advantages of reinforced fibers and matrix resins, so the applications are expanded to aerospace, sports and general industrial fields. .
- the reinforcing fiber glass fiber, aramid fiber, carbon fiber, boron fiber, or the like is used.
- the matrix resin either a thermosetting resin or a thermoplastic resin is used, but a thermosetting resin that can be easily impregnated into the reinforcing fiber is often used.
- the thermosetting resin epoxy resin, unsaturated polyester resin, vinyl ester resin, phenol resin, bismaleimide resin, cyanate resin and the like are used.
- a prepreg method For the production of a fiber reinforced composite material, methods such as a prepreg method, a hand lay-up method, a filament winding method, a pultrusion method, and an RTM (Resin Transfer Molding) method are applied.
- a prepreg method For the production of a fiber reinforced composite material, methods such as a prepreg method, a hand lay-up method, a filament winding method, a pultrusion method, and an RTM (Resin Transfer Molding) method are applied.
- RTM Resin Transfer Molding
- the RTM method capable of dealing with complex shapes using high-rigidity and high-strength carbon fibers as continuous fibers is a promising forming method.
- a base made of reinforcing fibers is placed in the lower mold and then the upper mold is closed. After the matrix resin is injected from the resin injection port and impregnated into the reinforcing fibers, the resin is cured and the upper mold is opened.
- productivity is a major issue in disseminating carbon fiber composite materials to automobiles, which becomes a barrier and is only slightly adopted in some luxury cars.
- a two-component epoxy resin composition is often used from the viewpoint of moldability.
- the two-pack type epoxy resin composition is stored in a state in which a main agent liquid containing an epoxy resin as a main component and a hardener liquid containing a curing agent as a main component are put in separate containers, and immediately before use. It is an epoxy resin composition used by mixing two liquids of the main agent liquid and the curing agent liquid.
- an epoxy resin composition that is handled in a state where all components including a main agent and a curing agent are mixed into one is called a one-pack type epoxy resin composition.
- a one-pack type epoxy resin composition since the curing reaction proceeds during storage, frozen storage is required.
- the curing agent is often selected to be a solid with low reactivity, and in order to impregnate the reinforcing fiber with the one-pack type epoxy resin composition, it is not necessary to use a press roll or the like at high pressure. Must not.
- both the main agent liquid and the hardener liquid are liquid, and the epoxy resin composition obtained by mixing these main liquid and hardener liquid is also a low viscosity liquid. Therefore, the reinforcing fiber can be easily impregnated. Further, since the main agent liquid and the curing agent liquid can be stored separately, the storage conditions can be stored for a long time without any particular limitation.
- the epoxy resin composition after mixing and preparation is stable under a low temperature hold of 40 ° C., suppressing an increase in viscosity for a long time. That is, it is excellent in viscosity stability at a temperature of 40 ° C.
- the epoxy resin composition has a low viscosity, and the increase in viscosity is suppressed during the injection process, so that any substrate can be used. Is also excellent in impregnation.
- an epoxy resin composition for fiber reinforced composite materials in which an alicyclic epoxy resin and a bifunctional or higher liquid epoxy resin are combined as a main component, and an acid anhydride curing agent and an accelerator are combined with a bifunctional or higher reactive diluent.
- Patent Document 1 an epoxy resin for solar cell encapsulant with excellent balance of transparency, flexibility and rigidity by combining alicyclic epoxy resin, aliphatic epoxy resin of specific molecular weight and curing agent with main component Resin composition (see Patent Document 2), saturated aliphatic compound containing alicyclic structure and carboxylic anhydride group in epoxy resin having alicyclic structure, and quaternary phosphonium salt-based curing accelerator And a resin composition for sealing a light-emitting diode (see Patent Document 3) that is excellent in light transmittance, ultraviolet resistance, and heat resistance.
- Patent Document 2 an epoxy resin for solar cell encapsulant with excellent balance of transparency, flexibility and rigidity by combining alicyclic epoxy resin, aliphatic epoxy resin of specific molecular weight and curing agent with main component Resin composition (see Patent Document 2), saturated aliphatic compound containing alicyclic structure and carboxylic anhydride group in epoxy resin having alicyclic structure, and quaternary phosphonium salt-based curing
- the resin plastic materials proposed in Patent Documents 1 to 3 cannot be cured at a sufficiently high speed. Furthermore, the resin plastic material proposed in Patent Document 4 has a problem that the cured product is colored when it is molded at a high temperature to shorten the curing time.
- the object of the present invention is to improve the above-mentioned drawbacks of the prior art, and have excellent viscosity stability at a low temperature (for example, 40 ° C.) of the epoxy resin composition after mixing and maintain a low viscosity when injected into a reinforcing fiber.
- a two-component epoxy resin composition that has excellent impregnation properties, is cured in a short time during molding, provides a fiber-reinforced composite material with high transparency of the cured product, and excellent molded product quality, and fiber reinforcement formed using the same It is to provide a composite material.
- the present invention is intended to solve the above problems, and one aspect (referred to as the present invention 1) of the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention is as follows.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention includes the following components [A] to [E], and includes component [A], component [B], and component [C].
- the content of the component [A] is 5 to 45% by mass
- the content of the component [B] is 5 to 50% by mass
- the component [C] is 100% by mass in total.
- the component [A] is 3,4,3 ', 4'-diepoxybicyclohexyl.
- Another aspect of the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention is as follows.
- the two-component epoxy resin composition for fiber-reinforced composite material of the present invention includes the following component [a], component [C], component [D] and component [E], and component [a] and The two-component epoxy resin composition for fiber-reinforced composite material, wherein the content of the component [a] is 15 to 70% by mass with respect to the total of 100% by mass of the component [C].
- Ingredient [a] 3,4,3 ′, 4′-diepoxybicyclohexyl
- Ingredient [C] Bisphenol type epoxy resin
- Ingredient [D] Acid anhydride
- Ingredient [E] Quaternary ammonium salt A compound selected from the group consisting of quaternary phosphonium salts and imidazolium salts.
- the component [B] further contains an aliphatic epoxy resin.
- the component [B] is an aliphatic epoxy resin having a molecular weight of 300 or less.
- the present invention 1 and the present invention 2 may be collectively abbreviated as the present invention, and so on.
- the component [E] is a quaternary phosphonium halide.
- the component [E] is quaternary phosphonium bromide.
- the component [E] is tetraphenylphosphonium halide.
- the component [E] with respect to 100 parts by mass in total of the component [A], the component [B] and the component [C].
- the content of component [E] is 3 to 25 parts by mass with respect to a total of 100 parts by mass of component [a] and component [C].
- the component [C] is a bisphenol A type epoxy resin.
- the component [F] further contains reinforcing fibers.
- the component [F] is carbon fiber.
- the component [D] is an acid anhydride having an alicyclic structure.
- the fiber-reinforced composite material of the present invention is obtained by curing the above-described two-component epoxy resin composition for fiber-reinforced composite material.
- the epoxy resin composition after mixing and preparation is excellent in viscosity stability at a low temperature (for example, 40 ° C.), maintains a low viscosity when injected into a reinforcing fiber, and can be applied to any substrate.
- a low temperature for example, 40 ° C.
- fiber-reinforced composite materials that can provide fiber-reinforced composite materials that have excellent impregnation properties, cure in a short time during molding, have excellent heat resistance, high transparency, and excellent molded product quality with high productivity.
- a two-pack type epoxy resin composition is obtained.
- the two-component epoxy resin composition for fiber-reinforced composite material of the present invention cures in a short time during molding and gives a high-quality fiber-reinforced composite material. It can be provided with high productivity.
- the application of fiber-reinforced composite materials for automobiles is especially advanced, and it can be expected to contribute to the improvement of fuel economy and the reduction of greenhouse gas emissions by further reducing the weight of automobiles.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention 1 includes the following components [A] to [E], and is the sum of the components [A], [B] and [C]
- the content of the component [A] is 5 to 45% by mass with respect to 100% by mass
- the content of the component [B] is 5 to 50% by mass
- the component [C] The content of is 5 to 50% by mass.
- Component [A] used in the present invention 1 is an alicyclic epoxy resin.
- An alicyclic epoxy resin has the following chemical formula in its molecule:
- the epoxy resin which has a cyclohexene oxide structure shown by these.
- Examples of the alicyclic epoxy resin having a cyclohexene oxide structure that can be used as the component [A] in the present invention 1 include, for example, vinylcyclohexene dioxide, dipentene dioxide, 3,4-epoxycyclohexanecarboxylic acid 3,4 -Epoxy cyclohexylmethyl, bis (3,4-epoxy cyclohexylmethyl) adipate, dicyclopentadiene dioxide, bis (2,3-epoxycyclopentyl) ether, ⁇ -caprolactone modified 3,4-epoxycyclohexenylmethyl- 3 ′, 4′-epoxycyclohexenylcarboxylate, epoxidized butanetetracarboxylic acid tetrakis- (3-cyclohexenylmethyl) modified ⁇ -caprolactone, oligomer of 4-vinylcyclohexene dioxide, and 3, , 3 ', 4'-diep
- alicyclic epoxy resin As the component [A], even if the cyclohexene oxide structure is ring-opened to form a cured product, since there are many cyclohexane structures therein, an improvement in heat resistance is expected. . In addition, most of the alicyclic epoxy resins have low viscosity, and by incorporating the alicyclic epoxy resin, the viscosity of the epoxy resin composition itself can be kept low, and improvement in the impregnation property to the base material is expected. .
- the cyclohexane structure is a single bond to each other, so that further improvement in heat resistance is expected, and the viscosity is lower. Therefore, the viscosity of the epoxy resin composition itself can be kept low, and the impregnation property to the base material is expected to be improved.
- Component [B] used in the present invention 1 is an aliphatic epoxy resin.
- An aliphatic epoxy resin means an aliphatic glycidyl ether obtained from an alcohol having a plurality of hydroxyl groups.
- Examples of the aliphatic epoxy resin that can be used as the component [B] in the present invention 1 include, for example, diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,4-butanediol, , 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolethane diglycidyl ether, trimethylolethane Triglycidyl ether, diglycidyl ether of trimethylolpropane, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of pentaerythritol Diglycidyl ether of dodeca hydro bisphenol
- the viscosity of the epoxy resin composition itself can be kept low, and an improvement in impregnation into the substrate is expected.
- the aliphatic epoxy resin of component [B] is preferably an aliphatic epoxy resin having a molecular weight of 300 or less, more preferably an aliphatic epoxy resin having a molecular weight of 150 to 300, and more preferably 170 to 260. Aliphatic epoxy resins are a particularly preferred embodiment.
- Examples of aliphatic epoxy resins having a molecular weight of 300 or less that can be used as component [B] in the present invention 1 include diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, and diglycidyl of 1,4-butanediol.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention 2 contains a component [B] (aliphatic epoxy resin).
- Component [C] used in the present invention 1 is a bisphenol-type epoxy resin.
- a bisphenol type epoxy resin is a kind of aromatic glycidyl ether obtained from phenol having a plurality of hydroxyl groups, and is a glycidyl ether obtained from bisphenol.
- Examples of the bisphenol type epoxy resin of component [C] in the present invention 1 include diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl ether of bisphenol AD, and diglycidyl ether of bisphenol S. .
- bisphenol A type epoxy resin which is diglycidyl ether of bisphenol A, is particularly excellent in the balance of the above properties. Therefore, the component [C in the two-pack type epoxy resin composition for fiber-reinforced composite material of the first aspect of the present invention] ] Is particularly preferably used.
- the component [C] bisphenol type epoxy resin preferably has a number of repeating units in the range of 0 to 0.2, more preferably in the range of 0 to 0.1.
- the number of repeating units is the following chemical formula
- Such a bisphenol-type epoxy resin preferably has an epoxy equivalent in the range of 170 to 220, and more preferably in the range of 170 to 195.
- the epoxy equivalent generally has a relationship such that it increases as the number of the above repeating units increases and decreases as it decreases.
- the epoxy equivalent is less than 170, low molecular weight impurities may be included, which may lead to deterioration of the surface quality due to volatilization during molding.
- an epoxy equivalent exceeds 220, while the viscosity of an epoxy resin composition rises and the impregnation property to a reinforced fiber deteriorates, the rigidity of the fiber reinforced composite material obtained may become inadequate.
- the content of component [A], component [B], and component [C] is as described above for component [A] and component [B]. And the content of the component [A] is 5 to 45% by mass and the content of the component [B] is 5 to 50% by mass with respect to a total of 100% by mass of the component [C]. It is important that the content of the component [C] is 5 to 50% by mass.
- the two-component epoxy resin composition for fiber-reinforced composite material of the present invention 2 includes the following component [a], component [C], component [D] and component [E], and the component [a]
- the content of the component [a] is 15 to 70% by mass with respect to the total of 100% by mass of the component [C].
- Ingredient [a] 3,4,3 ′, 4′-diepoxybicyclohexyl
- Ingredient [C] Bisphenol type epoxy resin
- the present invention 2 includes the component [a] 3,4,3 ′, 4′-diepoxybicyclohexyl as the component [A] of the present invention 1, and the component [B] of the present invention 1 is an optional component.
- the content of the component [a] is 15 to 70% by mass with respect to the total of 100% by mass of the component [a] and the component [C].
- the content is preferably mass%, and more preferably 20 to 45 mass%.
- the two-component epoxy resin composition for fiber-reinforced composite material according to the first aspect of the present invention includes other components as long as it does not impair the characteristics of the present invention.
- An epoxy resin can be contained.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention 2 is necessary as long as the characteristics of the present invention are not impaired in addition to the above-mentioned component [a] and component [C].
- other epoxy resins can be included.
- epoxy resins other than component [A], component [a], component [B] and component [C] include aromatic glycidyl ether obtained from phenol having a plurality of hydroxyl groups, glycidyl amine obtained from amine, and carboxyl Examples thereof include glycidyl esters obtained from carboxylic acids having a plurality of groups.
- aromatic glycidyl ether examples include novolak polyglycidyl ether obtained from phenol, alkylphenol, etc., resorcinol diglycidyl ether, hydroquinone diglycidyl ether, 4,4'-dihydroxybiphenyl diglycidyl ether, 4,4 ' -Diglycidyl ether of dihydroxy-3,3 ', 5,5'-tetramethylbiphenyl, diglycidyl ether of 1,6-dihydroxynaphthalene, diglycidyl ether of 9,9'-bis (4-hydroxyphenyl) fluorene, Triglycidyl ether of tris (p-hydroxyphenyl) methane, tetraglycidyl ether of tetrakis (p-hydroxyphenyl) ethane, and diglycidyl ether of bisphenol A and a bifunctional isocyanate Diglycidyl ether having oxazolidone backbone
- glycidylamine examples include diglycidylaniline, diglycidyltoluidine, triglycidylaminophenol, tetraglycidyldiaminodiphenylmethane, tetraglycidylxylylenediamine, halogens thereof, alkyl-substituted products, and hydrogenated products.
- glycidyl esters examples include phthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, and dimer acid diglycidyl ester.
- Component [D] used in the present invention is an acid anhydride.
- component [D] is a carboxylic anhydride, which acts as a curing agent for the epoxy resin.
- the number of acid anhydride groups in the acid anhydride is desirably 4 or less per molecule.
- an acid anhydride having an aromatic ring but having no alicyclic structure such as phthalic anhydride
- succinic anhydride is used.
- acid anhydrides that have neither an aromatic ring structure nor an alicyclic structure are used, but they are easy to handle with a low-viscosity liquid, and from the viewpoint of heat resistance and mechanical properties of the cured product, an alicyclic structure is used.
- the acid anhydride having is preferably used.
- an acid anhydride having a cycloalkane ring or a cycloalkene ring is more preferably used as the component [D].
- the acid anhydride having such an alicyclic structure include, for example, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyldihydronadic acid anhydride, 1,2,4,5- Cyclopentanetetracarboxylic dianhydride, 1,2,3,6-tetrahydrophthalic anhydride, methyl-1,2,3,6-tetrahydrophthalic anhydride, nadic acid anhydride, methyl nadic acid anhydride, Bicyclo [2,2,2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride and 4- (2,5-dioxotetrahydrofuran-3-yl) -3-methyl- Examples include 1,2,5,6-tetrahydrophthalic anhydride.
- hexahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride, nadic acid anhydride and acid anhydrides selected from their alkyl-substituted types are the viscosity of the epoxy resin composition, the heat resistance of the resulting cured product, Since it is excellent in balance with mechanical properties such as elastic modulus, it is preferably used as component [D] in the present invention.
- component [D] hexahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride, nadic acid anhydride and acid anhydrides selected from their alkyl-substituted types
- component [D] the viscosity of the epoxy resin composition
- the heat resistance of the resulting cured product Since it is excellent in balance with mechanical properties such as elastic modulus, it is preferably used as component [D] in the present invention.
- an acid anhydride having an alicyclic structure is used as the component [D]
- Component [A], component [a], component [B], and the relationship between the content of component [C] and component [D] in the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention are as follows. D] ratio of the number of acid anhydride groups (H) to the total number of epoxy groups (E) in component [A], component [a], component [B], and component [C], H / E
- the blending amount is preferably in the range of 0.8 to 1.1, more preferably in the range of 0.85 to 1.05, and in the range of 0.9 to 1.0. It is a more preferable aspect that the blending amount satisfies the above.
- the H / E ratio is less than 0.8, the polymerization between the excessively existing epoxy resins proceeds, and the physical properties of the cured product may be deteriorated. Also, when the H / E ratio exceeds 1.1, the concentration of the reaction points of the system decreases due to excessive curing agent components, the reaction rate decreases, and sufficient high-speed curability cannot be exhibited. There is.
- Component [E] Compound selected from the group consisting of quaternary ammonium salts, quaternary phosphonium salts and imidazolium salts
- Component [E] of the present invention is a compound selected from the group consisting of quaternary ammonium salts, quaternary phosphonium salts, and imidazolium salts. These compounds act as a curing accelerator for rapid curing.
- the quaternary ammonium salt has a small increase in viscosity at room temperature after mixing the main agent liquid and the curing agent liquid. Since the curing time tends to be short, the fiber-reinforced composite material can be molded with high productivity while being excellent in the impregnation property to the reinforcing fiber base when molding the fiber-reinforced composite material.
- quaternary ammonium salt used as the component [E] in the present invention include, for example, a quaternary ammonium oxoacid salt composed of a quaternary ammonium cation and an oxoacid anion, a quaternary ammonium cation and a 17th acid.
- quaternary ammonium oxoacid salt examples include, for example, tetramethylammonium perchlorate, tetramethylammonium sulfate, tetramethylammonium acetate, tetramethylammonium hydrogensulfate, tetraethylammonium nitrate, and perchloric acid.
- Examples include ammonium p-toluenesulfonate, tetraethylammonium p-toluenesulfonate, and tetrabutylammonium salicylate.
- quaternary ammonium halide examples include, for example, tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tributylmethylammonium chloride, decyltrimethylammonium chloride, trimethyl-n-octylammonium chloride, lauryltrimethyl.
- Ammonium chloride dodecyltrimethylammonium chloride, trimethyldodecylammonium chloride, trimethylmyristylammonium chloride, tetradecyltrimethylammonium chloride, trimethyltetradecylammonium chloride, tetrapropylammonium chloride, cetyltrimethylammonium chloride, hexadecyltrimethylammonium chloride, trimethy Octadecylammonium chloride, tri-n-octylmethylammonium chloride, dilauryldimethylammonium chloride, tetrabutylammonium chloride, dimethyldioctadecylammonium chloride, dimethyldistearylammonium chloride, tetrapentylammonium chloride, tetraamylammonium chloride, phenyltrimethylammonium chloride Benzyltrimethylammonium chloride, 1,
- examples of the quaternary ammonium borate salts include, for example, tetramethylammonium tetrafluoroborate, triethylmethylammonium tetrafluoroborate, tetraethylammonium tetrafluoroborate, cetyltrimethylammonium tetrafluoroborate, hexadecyltrimethylammonium tetrafluoro
- Examples thereof include borate, tetrabutylammonium tetrafluoroborate, 1-ethyl-1-methylpyrrolidinium tetrafluoroborate, and tetrabutylammonium tetraphenylborate.
- quaternary ammonium halides are preferably used and quaternary ammonium bromides are more preferably used from the viewpoints of solubility in epoxy resin and curing agent and cost.
- the quaternary phosphonium halide is 10 minutes after mixing all components at a temperature T1 of 30 ° C. to 60 ° C. at a level that does not impair impregnation.
- the viscosity after 1 minute from mixing is 1.5 times or more and 2.5 times or less, and the viscosity after 20 minutes after mixing is 1.0 to 2.0 times the viscosity after 10 minutes from mixing. Since it exhibits the following viscosity behavior and it is easy to control the flow of the resin, it is preferably used as the component [E] in the present invention.
- the shape of a molded body made of a fiber reinforced composite material has become complicated, and in order to cope with this, the mold can be divided into a plurality of parts. Therefore, after impregnating the reinforcing fiber base material when molding the fiber reinforced composite material, there is a possibility that the resin enters a slight gap between the parts of the mold and the burr of the molded body increases. Resin flow is controlled by a moderate increase in resin viscosity. For example, in the RTM method, it is difficult for the resin to enter a small gap between mold parts, and the burr of the molded product can be reduced. In the filament winding method, the resin flow is reduced. Can reduce dripping.
- Examples of the quaternary phosphonium salt used as the component [E] in the present invention include a quaternary phosphonium oxoacid salt composed of a quaternary phosphonium cation and an oxoacid anion, a quaternary phosphonium cation and a group 17 element.
- Quaternary phosphonium halides consisting of quaternary phosphonium halides
- quaternary phosphonium borates consisting of quaternary phosphonium cations and boron containing anions
- quaternary phosphonium hexafluorophosphates consisting of quaternary phosphonium cations and phosphate anions Can be mentioned.
- Tetraphenylborate Tetraphenylborate, tetraethylphosphonium tetrafluoroborate, tetrabutylphosphonium tetrafluoroborate, tetrabutylphosphonium tetraphenylborate, tri-tert-butylphosphonium tetraphenylborate, tri-tert-butylphosphonium tetrafluoroborate, Examples include tricyclohexylphosphonium tetrafluoroborate and tetraphenylphosphonium tetra-p-tolylborate.
- -1-yloxytris (dimethylamino) phosphonium hexafluorophosphate, 1H-benzotriazol-1-yloxytripyrrolidinophosphonium hexafluorophosphate, bromotripyrrolidinophosphonium hexafluorophosphate, bromotris (dimethylamino) phosphonium Hexafluorophosphate, chlorotripyrrolidinophosphonium hexafluorophosphate, tetraethylphosphonium hexafluorophosphate, and tetrabutylphosphonium Such as hexafluorophosphate, and the like.
- quaternary phosphonium salt used as the component [E] in the present invention the solubility in the components [A] to [C] and the component [D], the cost, the above-mentioned specific viscosity behavior expression, and From the viewpoint of physical properties of the cured product, quaternary phosphonium halides are preferably used, and quaternary phosphonium bromides or tetraphenylphosphonium halides are more preferably used.
- the imidazolium salt has a short curing time in spite of little increase in viscosity at room temperature after mixing the main agent liquid and the curing agent liquid. Since there is a tendency, it is possible to form the fiber-reinforced composite material with high productivity while being excellent in the impregnation property to the reinforcing fiber base when the fiber-reinforced composite material is formed.
- imidazolium salt used as component [E] in the present invention include, for example, 1-butyl-3-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-butyl-3-methyl.
- Imidazolium tetrafluoroborate 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-2,3-dimethylimidazolium chloride, 1-butyl-2 , 3-dimethylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide, 1-butyl-3-methylimidazole Um tetrachloroferrate, 1-butyl-3-methylimidazolium iodide, 1-butyl-2,3-dimethylimidazolium bis (trifluoromethanesulfonyl) imide, 1-butyl-3-methylimidazolium trifluoro (tri Fluoro
- the content of the component [E] used in the preferred embodiment of the present invention is 3 to 3 parts per 100 parts by mass in total of the component [A], the component [B] and the component [C].
- the amount is preferably 25 parts by mass, more preferably 5 to 20 parts by mass.
- the amount is preferably 3 to 25 parts by mass, more preferably 5 to 20 parts by mass with respect to 100 parts by mass in total of the component [a] and the component [C].
- the amount of the component [E] is less than 3 parts by mass, the time required for curing becomes long and sufficient high-speed curability may not be exhibited.
- the time which maintains low viscosity becomes short and the impregnation to a reinforced fiber may become difficult.
- the viscosity of two-component epoxy resin composition In the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention, the above-mentioned components are properly blended, and the viscosity after 1 minute from the mixing of all components at a temperature of 40 ° C. is 65 to 150 mPa ⁇ s. It is preferable that the pressure be 65 to 130 mPa ⁇ s. This is because the viscosity at a molding temperature can be lowered by setting the viscosity after 1 minute from mixing of all components at a temperature of 40 ° C. to 150 mPa ⁇ s or less, and a reinforcing fiber base can be formed when molding a fiber-reinforced composite material.
- the injection time into the material is shortened and the cause of non-impregnation can be reduced.
- the viscosity 1 minute after mixing all components at a temperature of 40 ° C. to 65 mPa ⁇ s or more, the viscosity at the molding temperature does not become too low, and the reinforcing fiber base material is formed when molding the fiber-reinforced composite material. This is because it is possible to prevent pits that are generated by entraining air during injection into the glass, and to prevent the occurrence of unimpregnated regions caused by non-uniform impregnation.
- the viscosity in the present invention is determined by measuring the viscosity immediately after mixing and preparing the two-component epoxy resin composition based on a measurement method using a cone-plate type rotational viscometer in ISO 2884-1 (1999).
- Examples of the viscosity measuring device include TVE-33H type manufactured by Toki Sangyo Co., Ltd.
- the viscosity immediately after mixing preparation is the viscosity one minute after mixing preparation.
- t90 is expressed by the following formula (formula 1 It is a preferable aspect to have a specific temperature T2 that satisfies (1). ⁇ 0.5 ⁇ t90 ⁇ 5 (Formula 1) (In the formula, t90 represents the time (minutes) for the cure index to reach 90% from the start of measurement at the specific temperature T2).
- Dielectric measurement cannot be uniquely associated with viscosity and elastic modulus, but is useful for obtaining a curing profile of a thermosetting resin that changes from a low viscosity liquid to a high elastic modulus amorphous solid.
- a curing profile is obtained from a time change of ion viscosity (equivalent resistivity) calculated from a complex dielectric constant measured by applying a high-frequency electric field to a thermosetting resin.
- an MDE-10 cure monitor manufactured by Holometrix-Micromet can be used as the dielectric measurement device.
- a Viton O-ring having an inner diameter of 32 mm and a thickness of 3 mm is installed on the lower surface of the programmable mini press MP2000 in which a TMS-1 inch type sensor is embedded in the lower surface, and the temperature of the press is set to a predetermined value. Set to temperature T.
- the epoxy resin composition is poured inside the O-ring, the press is closed, and the time change of the ionic viscosity of the epoxy resin composition is followed.
- Dielectric measurement is performed at frequencies of 1, 10, 100, 1000, and 10000 Hz, and the logarithm Log ( ⁇ ) of ion viscosity independent of frequency is obtained by using software (Umetric) attached to the apparatus.
- the cure index at the curing required time t was determined by the following formula (formula 2), and the time for the cure index to reach 90% was defined as t90.
- Cure index ⁇ log ( ⁇ t) ⁇ log ( ⁇ min) ⁇ / ⁇ log ( ⁇ max) ⁇ log ( ⁇ min) ⁇ ⁇ 100 (Expression 2) ⁇ Cure index: (Unit:%) ⁇ t: Ionic viscosity at time t (unit: ⁇ ⁇ cm) ⁇ ⁇ min: Minimum value of ion viscosity (unit: ⁇ ⁇ cm) ⁇ max: Maximum value of ion viscosity (unit: ⁇ ⁇ cm).
- the ionic viscosity can be measured after gelation, and increases with the progress of curing, and saturates as the curing is completed. Therefore, it can be used to track the progress of the curing reaction.
- the value obtained by standardizing the logarithm of the ionic viscosity so that the minimum value is 0% and the saturation value (maximum value) is 100% is called the cure index, and describes the curing profile of the thermosetting resin. Used to do. By using the time for the cure index to reach 90% as an index related to the curing time, preferable conditions can be described because the curing can be performed in a short time.
- the molding temperature (heat curing temperature) of the epoxy resin composition that is, the specific temperature T2 is preferably in the range of 100 to 140 ° C.
- the range of the specific temperature T2 is preferably in the range of 100 to 140 ° C.
- the two-pack type epoxy resin composition for fiber-reinforced composite material according to the present invention is mainly composed of a main agent liquid containing component [A], component [a], component [B] and component [C], and component [D].
- the curing agent liquid containing as a component (the main component here means the maximum amount of the component on a mass basis in the curing agent liquid) is blended in the above-described blending amounts and used. It is obtained by mixing the main agent liquid and the curing agent liquid so as to have the above-mentioned blending amount immediately before.
- the above-described component [E] can be blended in both the main agent liquid and the curing agent liquid, but is more preferably included in the curing agent liquid.
- ingredients may be formulated in either base material liquid and the curing agent solution, it can be used as a mixture in either or both advance.
- the main agent liquid and the curing agent liquid are preferably heated separately before mixing, and mixed using a mixer immediately before use, such as injection into a mold, to obtain a two-part epoxy resin composition. This is a preferred embodiment from the viewpoint of the pot life of the resin.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention can contain reinforcing fibers as component [F] as necessary.
- the reinforcing fiber of component [F] glass fiber, aramid fiber, carbon fiber, boron fiber and the like are preferably used.
- carbon fiber is preferably used as the component [F] because a fiber-reinforced composite material having excellent mechanical properties such as strength and elastic modulus can be obtained while being lightweight.
- the reinforcing fiber either a short fiber or a continuous fiber can be used, and both can be used in combination.
- continuous fibers are preferably used as the reinforcing fibers of this component [F].
- the form of the reinforcing fiber may be used as a strand, but the reinforcing fiber may be used as a reinforcing fiber base material processed into a mat, woven fabric, knit, braid, unidirectional sheet or the like.
- a woven fabric is preferably used because it is relatively easy to increase the fiber volume content Vf (details will be described later) of the fiber-reinforced composite material and the handleability is excellent.
- the higher the woven fabric filling rate the easier it is to obtain a fiber-reinforced composite material having a higher fiber volume content Vf. Therefore, the filling ratio of the woven fabric is preferably 0.10 to 0.85, more preferably 0.40 to 0.85, and still more preferably 0.50 to 0.85.
- the filling rate of the woven fabric is a ratio of the net volume of the reinforcing fiber to the apparent volume of the woven fabric, and is obtained by the following formula.
- ⁇ W / (1000t ⁇ ⁇ f) (Wherein, W represents the basis weight (unit: g / m 2 ), t represents the thickness (unit: mm), and ⁇ f represents the density of the reinforcing fiber (unit: g / cm 3 ).)
- the fabric weight and thickness of the fabric used here are determined in accordance with JIS R 7602 (1995).
- a fiber reinforced composite material is obtained.
- a molding method of the fiber reinforced composite material of the present invention a molding using a two-pack type epoxy resin composition such as a hand lay-up method, a filament winding method, a pultrusion method, an RTM (Resin Transfer Molding) method, etc. The method is preferably used.
- the RTM molding method is particularly preferably used from the viewpoint of productivity and the degree of freedom of shape of the molded body.
- the RTM molding method is a molding method in which a reinforcing fiber composite material is obtained by injecting a resin into a reinforcing fiber base disposed in a mold and curing it.
- the method for producing the fiber-reinforced composite material of the present invention will be described taking the RTM molding method as an example.
- the two-pack type epoxy resin composition for fiber-reinforced composite material according to the present invention is obtained.
- the fiber reinforced composite material of the present invention is impregnated by injecting the heated two-component epoxy resin composition for fiber reinforced composite material into a reinforced fiber base disposed in a mold heated to a specific temperature T. It is a preferred embodiment that it is produced by curing in the mold.
- the temperature at which the two-component epoxy resin composition for fiber-reinforced composite material is heated is determined from the relationship between the initial viscosity of the two-component epoxy resin composition and the increase in viscosity, from the viewpoint of impregnation into the reinforcing fiber substrate.
- the temperature is preferably 30 to 70 ° C, more preferably 40 to 60 ° C.
- the injection pressure of the two-component epoxy resin composition for fiber-reinforced composite materials is usually 0.1 to 1.0 MPa, and VaRTM (Vacuum Assist Resin Transfer Molding) in which the epoxy resin composition is injected by vacuum suction inside the mold. ) Method can also be used, but it is preferably 0.1 to 0.6 MPa in view of the injection time and the economical efficiency of the equipment. Even when pressure injection is performed, generation of voids can be suppressed by reducing the pressure in the mold before injecting the two-component epoxy resin composition.
- the reinforcing fiber used is as described in [Component [F]: Reinforcing fiber].
- Fiber volume content of fiber reinforced composite material In order for the fiber-reinforced composite material of the present invention to have a high specific strength or specific elastic modulus, its fiber volume content Vf is preferably 40 to 85%, more preferably 45 to 85%. .
- the fiber volume content Vf of the fiber reinforced composite material referred to here is a value defined and measured by the following in accordance with ASTM D3171 (1999), and is an epoxy resin composition with respect to the reinforced fiber substrate. Is in a state after being injected and cured. That is, the measurement of the fiber volume content Vf of the fiber reinforced composite material can be expressed by the following (Formula 3) from the thickness h of the fiber reinforced composite material.
- Fiber volume content Vf (%) (Af ⁇ N) / ( ⁇ f ⁇ h) / 10 (Formula 3) (In the formula, Af is the mass per fiber substrate per 1 m 2 (g / m 2 ), N is the number of laminated fiber substrates (sheets), ⁇ f represents the density of reinforcing fiber (g / cm 3 ), and h represents the thickness (mm) of the fiber-reinforced composite material (test piece).
- the thickness of the fiber reinforced composite material can be correctly measured. As described in JIS K 7072 (1991), JIS B 7502 (1994). Measure with a micrometer specified in the above or with a precision equivalent to or better than this. If the fiber reinforced composite material has a complicated shape and cannot be measured, cut out a sample (a sample having a certain shape and size for measurement) from the fiber reinforced composite material and measure it. be able to.
- the fiber-reinforced composite material of the present invention is excellent in mechanical properties such as strength and elastic modulus while being lightweight. Therefore, it is preferably used for structural members and outer plates of aircraft, space satellites, industrial machines, railway vehicles, ships, and automobiles. Moreover, since the fiber reinforced composite material of the present invention is excellent in color tone and surface quality, it is particularly preferably used for automotive outer panel applications.
- Epoxy resin “Celoxide” (registered trademark) 2021P (manufactured by Daicel Corporation): alicyclic epoxy resin, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl, epoxy equivalent 137 "Celoxide” (registered trademark) 3000 (manufactured by Daicel Corporation): alicyclic epoxy resin, dipentene dioxide, epoxy equivalent 93.5 "Celoxide” (registered trademark) 8000 (manufactured by Daicel Corporation): alicyclic epoxy resin, 3,4,3 ', 4'-diepoxybicyclohexyl, epoxy equivalent 100 ⁇ "HELOXY” TM Modifier 67 (manufactured by HEXION): aliphatic epoxy resins, diglycidyl ethers of 1,4-butanediol having an epoxy equivalent of 130, molecular weight 202 "HELOXY” TM Modifier
- Acid anhydride HN-5500 (manufactured by Hitachi Chemical Co., Ltd.): methyl hexahydrophthalic acid anhydride, “Kayahard” (registered trademark) MCD (manufactured by Nippon Kayaku Co., Ltd.): methyl nadic acid anhydride.
- ⁇ Preparation of epoxy resin composition Based on the blending ratios listed in Tables 1 to 5, an epoxy resin was blended to form a main solution. Each acid anhydride of component [D] and quaternary ammonium salt, quaternary phosphonium salt, imidazolium salt, and other substances of component [E] are blended at the blending ratios shown in Tables 1 to 5. To obtain a hardener solution. An epoxy resin composition was prepared by using these main agent liquid and curing agent liquid and mixing them at the mixing ratios shown in Tables 1 to 5.
- Dielectric measurements were taken to track the cure of the epoxy resin.
- an MDE-10 cure monitor manufactured by Holometrix-Micromet was used as a dielectric measurement apparatus.
- a Viton O-ring with an inner diameter of 32 mm and a thickness of 3 mm was installed on the lower surface of the programmable mini press MP2000 with a TMS-1 inch type sensor embedded in the lower surface, the press temperature was set to 120 ° C, and the O-ring
- the epoxy resin composition was poured inside, the press was closed, and the time change of the ionic viscosity of the epoxy resin composition was followed.
- Dielectric measurement was performed at each frequency of 1, 10, 100, 1000, and 10000 Hz, and logarithm Log ( ⁇ ) of frequency-independent ion viscosity was obtained using attached software.
- Cure index ⁇ log ( ⁇ t) ⁇ log ( ⁇ min) ⁇ / ⁇ log ( ⁇ max) ⁇ log ( ⁇ min) ⁇ ⁇ 100 (Expression 2) ⁇ Cure index: (Unit:%) ⁇ t: Ionic viscosity at time t (unit: ⁇ ⁇ cm) ⁇ ⁇ min: Minimum value of ion viscosity (unit: ⁇ ⁇ cm) ⁇ max: Maximum value of ion viscosity (unit: ⁇ ⁇ cm).
- ⁇ Creation of cured resin plate> A copper spacer having a thickness of 2 mm, in which a square with a side of 50 mm was cut out, was placed on the lower surface of the press device, the press temperature was set to 120 ° C., the epoxy resin composition was poured inside the spacer, and the press was closed. After 20 minutes, the press was opened to obtain a cured resin plate.
- Tg of cured resin About 10 mg of a test piece is cut out from a cured resin plate, sealed in an aluminum sample pan, and Tg is measured using a DSC (Differential Scanning Calorimetry) apparatus (Diamond DSC manufactured by Perkin Elmer). It was. The measurement conditions are a heating rate of 10 ° C./min. The temperature was raised twice in the temperature range of 0 to 250 ° C., and the temperature at which the baseline shifted during the second temperature rise was defined as Tg.
- DSC Different Scanning Calorimetry
- the measurement conditions were a spectral transmittance in a wavelength range of 380 to 780 nm under a condition that does not include a D65 light source, a 10 ° field of view, and regular reflection light.
- ⁇ 5 was defined as “no color”, and the others were defined as “present”.
- Carbon fiber woven fabric CO6343 (carbon fiber: T300-3K, woven structure: plain weave, basis weight: 198 g / m 2 , manufactured by Toray Industries, Inc.) as a reinforcing fiber in a mold having a plate-like cavity of 350 mm ⁇ 700 mm ⁇ 2 mm
- a mold having a plate-like cavity of 350 mm ⁇ 700 mm ⁇ 2 mm
- the main agent liquid and the curing agent liquid were mixed using a resin injection machine and injected at a pressure of 0.2 MPa. Twenty minutes after the start of injection of the epoxy resin composition, the mold was opened and demolded to obtain a fiber-reinforced composite material.
- the amount of voids in the fiber reinforced composite material is less than 1%, and “A” indicates that the voids are not substantially present, and no resin-impregnated portion is observed in the appearance of the fiber reinforced composite material.
- the amount of voids in the fiber reinforced composite material was calculated from the area ratio of the voids in the fiber reinforced composite material by observing a smoothly polished fiber reinforced composite material cross section with a tilt-down optical microscope.
- the epoxy resin composition was mixed and prepared as described above, and the viscosity measurement and dielectric measurement were performed as described above.
- the resin cured plate was produced by the above-described method using this epoxy resin composition, and the glass transition temperature Tg was measured and the color evaluation was performed.
- the fiber reinforced composite material was produced by the above-mentioned method using the epoxy resin composition.
- Example 1 As shown in Table 1, alicyclic epoxy resin “Celoxide” (registered trademark) 2021P 45 parts by mass, aliphatic epoxy resin “HELOXY TM Modifier 107” 15 parts by mass, and bisphenol A type epoxy resin “ "Epototo” (registered trademark) YD-128 "40 parts by weight of the main agent solution and 107 parts by weight of the acid anhydride” HN-5500 "12 parts by weight of tetraphenylphosphonium bromide are heated at a temperature of 80 ° C to be compatible An epoxy resin composition comprising the cured curing agent solution was mixed and prepared.
- the epoxy resin composition of Example 1 showed a sudden increase in viscosity until 10 minutes after mixing and was maintained at a temperature of 40 ° C., and increased viscosity was suppressed until 20 minutes thereafter. The state was maintained. Further, since the epoxy resin composition of Example 1 has a short demoldable time represented by t90 at a temperature of 130 ° C., it is also effective for shortening the molding time in molding a fiber-reinforced composite material. I understood that. Moreover, the cured product of this epoxy resin composition has a Tg higher than the molding temperature (130 ° C.) and is not colored. When the fiber reinforced composite material produced using this epoxy resin composition is removed from the mold, The mold could be easily removed without deformation, and there were few burrs on the molded body. The results are shown in Table 1.
- Example 2 The amounts of aliphatic epoxy resin “HELOXY TM Modifier 107”, bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128, and acid anhydride “HN-5500” shown in Table 1, respectively.
- the same operation as in Example 1 was carried out except that.
- All of the epoxy resin compositions of these examples were excellent in the viscosity increase after mixing and preparation, and then the viscosity stability at a temperature of 40 ° C., and the demoldable time was short.
- the cured products of these epoxy resin compositions had Tg higher than the molding temperature (130 ° C.) and were not colored, the fiber reinforced composite materials produced using these epoxy resin compositions were taken out from the mold. At that time, the mold could be easily removed without deformation, and there were few burrs.
- Table 1 The results are shown in Table 1.
- Example 6 Alicyclic epoxy resin “Celoxide” (registered trademark) 3000, aliphatic epoxy resin “HELOXY TM Modifier 107”, bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128, acid anhydride “HN-5500” and ethyltriphenylphosphonium bromide were carried out in the same manner as in Example 1 except that the amounts shown in Table 1 were used.
- the epoxy resin composition of this Example 6 was excellent in viscosity increase after mixing preparation and viscosity stability at a temperature of 40 ° C., and the demoldable time was short.
- Example 10 45 parts by mass of alicyclic epoxy resin “Celoxide” (registered trademark) 2021P, 30 parts by mass of aliphatic epoxy resin “HELOXY TM Modifier 67”, and bisphenol A type epoxy resin “Epototo” (registered trademark) YD -128 "Curing by mixing 10 parts by mass of tetramethylammonium bromide at 80 ° C with 123 parts by mass of the main agent liquid consisting of 25 parts by mass and the acid anhydride" Kayahard "(registered trademark) MCD” An epoxy resin composition composed of the agent solution was mixed and prepared.
- Example 11 45 parts by mass of alicyclic epoxy resin “Celoxide” (registered trademark) 2021P, 30 parts by mass of aliphatic epoxy resin “HELOXY TM Modifier 67”, and bisphenol A type epoxy resin “Epototo” (registered trademark) YD -128 "25 parts by mass of the main agent solution and 123 parts by mass of the acid anhydride” Kayahard "(registered trademark) MCD 11 parts by mass of 1-butyl-3-methylimidazolium chloride were heated at a temperature of 80 ° C. An epoxy resin composition composed of a hardener solution that was compatible with each other was mixed and prepared.
- Example 12 Except that the amount of the bisphenol F type epoxy resin “Epototo” (registered trademark) YDF-170 and the acid anhydride “HN-5500” was changed to the amount shown in Table 2, the examples were used. It carried out like 4.
- the epoxy resin composition of Example 12 was excellent in viscosity increase after mixing and viscosity stability at a temperature of 40 ° C., and the demoldable time was short.
- the cured product of this epoxy resin composition had a Tg in the vicinity of the molding temperature (130 ° C.) but was not colored, the fiber reinforced composite material produced using this epoxy resin composition was a mold. When removing from the container, it can be easily removed without deformation, and there are few burrs. The results are shown in Table 2.
- Example 13 Except that 45 parts by mass of alicyclic epoxy resin “Celoxide” (registered trademark) 8000, acid anhydride “HN-5500”, and ethyltriphenylphosphonium bromide were used in the amounts shown in Table 3, respectively. Performed as in Example 1.
- the epoxy resin composition of Example 13 was excellent in the viscosity increase after mixing preparation and the subsequent viscosity stability at a temperature of 40 ° C., and the demoldable time was short.
- the cured product of this epoxy resin composition had a Tg higher than the molding temperature (130 ° C.) and was not colored, the fiber-reinforced composite material produced using this epoxy resin composition was taken out from the mold. The mold could be easily removed without deformation, and there were few burrs.
- Table 3 The results are shown in Table 3.
- Example 14 to 17 An alicyclic epoxy resin “Celoxide” (registered trademark) 8000, a bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128, an acid anhydride “HN-5500”, and tetraphenylphosphonium bromide, Each was carried out in the same manner as in Example 1 except that the amounts shown in Table 3 were used. All of the epoxy resin compositions of these examples were excellent in viscosity increase after mixing and preparation, viscosity stability at a temperature of 40 ° C., and the demoldable time was short.
- Comparative Example 1 Excluding the component [B] aliphatic epoxy resin, 55 parts by weight of bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128 and 104 parts by weight of acid anhydride “HN-5500” was carried out in the same manner as in Example 1.
- the epoxy resin composition of Comparative Example 1 is superior in viscosity increase after mixing preparation and viscosity stability at a temperature of 40 ° C., but does not contain the component [B], and therefore, compared with the examples of the present invention. The viscosity was high and the impregnation property of the resin into the reinforcing fiber was poor. The results are shown in Table 4.
- Comparative Example 2 Except that the alicyclic epoxy resin “Celoxide” (registered trademark) 2021P ”is 50 parts by mass, does not contain the component [C] bisphenol type epoxy resin, and the acid anhydride“ HN-5500 ”is 114 parts by mass. This was carried out in the same manner as in Example 5.
- the epoxy resin composition of Comparative Example 2 is excellent in viscosity increase after mixing preparation and viscosity stability at a temperature of 40 ° C., but contains too much component [A] and does not contain component [C].
- Viscosity is too low compared to the examples of the invention, and when forming a fiber reinforced composite material, air is entrained when injected into the reinforced fiber base material, resulting in non-impregnated non-impregnated areas, resulting in impregnation Inferior.
- Table 4 The results are shown in Table 4.
- Comparative Example 3 55 parts by mass of the aliphatic epoxy resin “HELOXY TM Modifier 68”, 20 parts by mass of the bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128, and the acid anhydride “HN-5500” 116 It implemented similarly to Example 4 except having set it as the mass part.
- the epoxy resin composition of Comparative Example 3 is excellent in viscosity increase after mixing preparation and viscosity stability at a temperature of 40 ° C., since it has too much component [B], it is hardened compared to the examples of the present invention. Since the Tg of the material was lower than the molding temperature (130 ° C.), it was deformed when the fiber-reinforced composite material was demolded. The results are shown in Table 4.
- Example 4 25 parts by mass of an alicyclic epoxy resin “Celoxide” (registered trademark) 2021P, 37 parts by mass of an aliphatic epoxy resin “HELOXY TM Modifier 107”, and a bisphenol A type epoxy resin “Epototo” (registered trademark) This was carried out in the same manner as in Example 1 except that 38 parts by mass of YD-128 ”, the curing agent liquid did not contain components [D] and [E], and metaxylenediamine was 21 parts by mass. .
- the epoxy resin composition of Comparative Example 5 does not contain the component [E]
- the epoxy resin composition has a high viscosity increase rate at a temperature of 40 ° C. and is inferior in viscosity stability as compared with the examples of the present invention.
- the impregnation property to the reinforcing fiber is inferior and the cured product is colored. The results are shown in Table 4.
- Comparative Example 7 50 parts by mass of the aliphatic epoxy resin “HELOXY TM Modifier 107” and 50 parts by mass of the bisphenol A type epoxy resin “Epototo” (registered trademark) YD-128, excluding the aliphatic epoxy resin of component [A] , And the acid anhydride “HN-5500” was used in the same manner as in Example 1, except that the amount was 97 parts by mass.
- the epoxy resin composition of Comparative Example 7 is excellent in viscosity increase after mixing preparation and viscosity stability at a temperature of 40 ° C., since it does not contain the component [A], it is a cured product as compared with the examples of the present invention. Since the Tg of the material was lower than the molding temperature (130 ° C.), it was deformed when the fiber-reinforced composite material was demolded. The results are shown in Table 5.
- the viscosity was higher than in the examples of the present invention, and the impregnation property of the resin into the reinforcing fibers was inferior.
- the epoxy resin composition of Comparative Example 9 containing a large amount of alicyclic epoxy resin (3,4,3 ′, 4′-diepoxybicyclohexyl) has increased viscosity after mixing and viscosity stability at a temperature of 40 ° C.
- the epoxy epoxy resin composition of the present invention is suitable for molding a fiber reinforced composite material, and a fiber reinforced composite material excellent in appearance and surface quality by a RTM method or the like can be quickly produced with high productivity. It is obtained with.
- the epoxy epoxy resin composition of the present invention is excellent in molding large-sized fiber-reinforced composite materials, and is particularly suitable for application to automobile members.
- the two-pack type epoxy resin composition for fiber-reinforced composite material of the present invention is excellent in workability at the time of preparing an epoxy resin, excellent in viscosity stability at a low temperature (for example, 40 ° C.) of the epoxy resin composition after mixing preparation, Since it cures in a short time during molding and gives a high-quality fiber-reinforced composite material, a high-quality fiber-reinforced composite material can be provided with high productivity by the RTM method or the like. As a result, the application of fiber-reinforced composite materials for automobiles is especially advanced, and it can be expected to contribute to the improvement of fuel economy and the reduction of greenhouse gas emissions by further reducing the weight of automobiles.
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
・成分[A]:脂環式エポキシ樹脂
・成分[B]:脂肪族エポキシ樹脂
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウム塩、及びイミダゾリウム塩からなる群から選ばれた化合物。
・成分[a]:3,4,3’,4’-ジエポキシビシクロヘキシル
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウム塩およびイミダゾリウム塩からなる群から選ばれた化合物。
・成分[A]:脂環式エポキシ樹脂
・成分[B]:脂肪族エポキシ樹脂
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウ塩、及びイミダゾリウム塩からなる群から選ばれた化合物。
本発明1で用いられる成分[A]は、脂環式エポキシ樹脂である。脂環式エポキシ樹脂とは、分子中に次の化学式
本発明1で用いられる成分[B]は、脂肪族エポキシ樹脂である。脂肪族エポキシ樹脂とは、水酸基を複数有するアルコールから得られる脂肪族グリシジルエーテルを意味する。
本発明1で用いられる成分[C]は、ビスフェノール型エポキシ樹脂である。ビスフェノール型エポキシ樹脂は、水酸基を複数有するフェノールから得られる芳香族グリシジルエーテルの一種であり、ビスフェノールから得られるグリシジルエーテルである。
・成分[a]:3,4,3’,4’-ジエポキシビシクロヘキシル
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウム塩、及びイミダゾリウム塩からなる群から選ばれた化合物。
本発明1の繊維強化複合材料用2液型エポキシ樹脂組成物には、上記の成分[A]~[C]の他に、本発明の特性を損なわない範囲で、必要に応じて、他のエポキシ樹脂を含有させることができる。また、同様に、本発明2の繊維強化複合材料用2液型エポキシ樹脂組成物にも、上記の成分[a]および成分[C]の他に、本発明の特性を損なわない範囲で、必要に応じて、他のエポキシ樹脂を含有させることができる。
本発明で用いられる成分[D]は、酸無水物である。具体的には、成分[D]はカルボン酸無水物であり、これはエポキシ樹脂の硬化剤として作用する。酸無水物における酸無水物基は、一分子中に4個以下であることが望ましい態様である。
本発明の成分[E]は、第四級アンモニウム塩、第四級ホスホニウム塩およびイミダゾリウム塩からなる群から選ばれた化合物である。これらの化合物は、速硬化性発現のための硬化促進剤として作用する。
第四級アンモニウム塩は、上記の特徴(※)に加えて、特に主剤液と硬化剤液を混合した後の常温下での粘度上昇が少ないにもかかわらず、硬化時間が短い傾向があるため、繊維強化複合材料を成形する際に強化繊維基材への含浸性に優れているとともに、高い生産性で繊維強化複合材料を成形することが可能となる。
第四級ホスホニウムハライドは、上記の特徴(※)に加えて、含浸性を損なわないレベルで30℃以上60℃以下の温度T1において、全成分混合から10分後の粘度が混合から1分後の粘度の1.5倍以上2.5倍以下で、かつ、混合から20分後の粘度が混合から10分後の粘度の1.0倍以上2.0倍以下という粘度挙動を示し、樹脂のフローをコントロールしやすいことから、本発明における成分[E]として好ましく用いられる。
イミダゾリウム塩は、上記の特徴(※)に加えて、特に主剤液と硬化剤液を混合した後の常温下での粘度上昇が少ないにもかかわらず、硬化時間が短い傾向があるため、繊維強化複合材料を成形する際に強化繊維基材への含浸性に優れるとともに、高い生産性で繊維強化複合材料を成形することが可能となる。
本発明の繊維強化複合材料用2液型エポキシ樹脂組成物は、前記した成分を適正に配合して、40℃の温度における全成分混合から1分後の粘度を65~150mPa・sにすることが好ましく、65~130mPa・sにすることがより好ましい態様である。これは、40℃の温度における全成分混合から1分後の粘度を150mPa・s以下とすることにより、成形温度における粘度を低くすることができ、繊維強化複合材料を成形する際に強化繊維基材への注入時間が短くなり、未含浸の原因を低減することができるからである。また、40℃の温度における全成分混合から1分後の粘度を65mPa・s以上とすることにより、成形温度での粘度が低くなりすぎず、繊維強化複合材料を成形する際に強化繊維基材への注入時に空気を巻き込んで生じるピットを防ぐことができ、含浸が不均一になって生じる未含浸領域の発生を防ぐことができるからである。
本発明の繊維強化複合材料用2液型エポキシ樹脂組成物は、定温保持下での誘電測定で求められるキュアインデックスが90%となる時間をt90としたとき、t90が、次の式(式1)を満たす特定温度T2を有することが好ましい態様である。
・0.5≦t90≦5・・・・・(式1)
(式中、t90は、特定温度T2における測定開始からキュアインデックスが90%に到達する時間(分)を表す)。
・キュアインデックス={log(αt)-log(αmin)}/{log(αmax)-log(αmin)}×100・・・(式2)
・キュアインデックス:(単位:%)
・αt:時間tにおけるイオン粘度(単位:Ω・cm)
・αmin:イオン粘度の最小値(単位:Ω・cm)
・αmax:イオン粘度の最大値(単位:Ω・cm)。
本発明の繊維強化複合材料用2液型エポキシ樹脂組成物は、まず、成分[A]、成分[a]、成分[B]および成分[C]を含む主剤液と、成分[D]を主成分(ここでいう主成分とは、硬化剤液中において質量基準で最大量の成分であることを意味する。)として含む硬化剤液とを、それぞれ前記した配合量で配合しておき、使用直前に前記した配合量となるように、主剤液と硬化剤液を混合して得られる。前記した成分[E]は、主剤液と硬化剤液のどちらにも配合することができるが、硬化剤液に含まれることがより好ましい態様である。
本発明の繊維強化複合材料用2液型エポキシ樹脂組成物には、必要に応じ、成分[F]として強化繊維を含有させることができる。成分[F]の強化繊維としては、ガラス繊維、アラミド繊維、炭素繊維およびボロン繊維等が好適に用いられる。中でも、軽量でありながら、強度や弾性率等の力学物性が優れる繊維強化複合材料が得られるという理由から、成分[F]としては炭素繊維が好適に用いられる。
・W/(1000t・ρf)
(式中、Wは目付(単位:g/m2)、tは厚み(単位:mm)、そしてρfは強化繊維の密度(単位:g/cm3)をそれぞれ表す。)
ここで用いる織物の目付と厚みは、JIS R 7602(1995)に準拠して求められる。
本発明の繊維強化複合材料用2液型エポキシ樹脂組成物と成分[F]である強化繊維を組み合わせ、続いて繊維強化複合材料用2液型エポキシ樹脂組成物を硬化させることにより、本発明の繊維強化複合材料が得られる。本発明の繊維強化複合材料の成形方法としては、ハンドレイアップ法、フィラメントワインディング法、プルトルージョン法、RTM(Resin Transfer Molding:樹脂注入成形)法などの、2液型エポキシ樹脂組成物を用いる成形方法が好適に用いられる。これらのうち、生産性や成形体の形状自由度という観点から、特にRTM成形法が好適に用いられる。RTM成形法とは、成形型内に配置した強化繊維基材に樹脂を注入し硬化して強化繊維複合材料を得る成形法である。
本発明の繊維強化複合材料が高い比強度あるいは比弾性率をもつためには、その繊維体積含有率Vfが、好ましくは40~85%であり、より好ましくは45~85%の範囲内である。ここで言う、繊維強化複合材料の繊維体積含有率Vfとは、ASTM D3171(1999)に準拠して、下記により定義され、測定される値であり、強化繊維基材に対してエポキシ樹脂組成物が注入され、硬化された後の状態でのものをいう。すなわち、繊維強化複合材料の繊維体積含有率Vfの測定は、繊維強化複合材料の厚みhから、下記の(式3)を用いて表すことができる。
・繊維体積含有率Vf(%)=(Af×N)/(ρf×h)/10 ・・・(式3)
(式中、Afは繊維基材1枚・1m2当たりの質量(g/m2)、Nは繊維基材の積層枚数(枚)、
ρfは強化繊維の密度(g/cm3)、そしてhは繊維強化複合材料(試験片)の厚み(mm)を、それぞれ表す。)
繊維基材1枚・1m2当たりの質量Afや、繊維基材の積層枚数Nおよび強化繊維の密度ρfが明らかでない場合は、JIS K 7075(1991)に基づく燃焼法または硝酸分解法および硫酸分解法のいずれかにより、繊維強化複合材料の繊維体積含有率を測定することができる。この場合に用いられる強化繊維の密度は、JIS R 7603(1999)に基づき測定した値を用いる。
各実施例の2液型エポキシ樹脂組成物を得るために、次の樹脂原料を用いた。表中のエポキシ樹脂組成物の含有割合の単位は、特に断らない限り「質量部」を意味する。
・“セロキサイド”(登録商標)2021P((株)ダイセル製):脂環式エポキシ樹脂、3,4-エポキシシクロヘキサンカルボン酸3,4-エポキシキクロヘキシルメチル、エポキシ当量137
・“セロキサイド”(登録商標)3000((株)ダイセル製):脂環式エポキシ樹脂、ジペンテンジオキシド、エポキシ当量93.5
・“セロキサイド”(登録商標)8000((株)ダイセル製):脂環式エポキシ樹脂、3,4,3’,4’-ジエポキシビシクロヘキシル、エポキシ当量100
・“HELOXY”TM Modifier 67(HEXION製):脂肪族エポキシ樹脂、1,4-ブタンジオールのジグリシジルエーテル、エポキシ当量130、分子量202
・“HELOXY”TM Modifier 68(HEXION製):脂肪族エポキシ樹脂、ネオペンチルグリコールのジグリシジルエーテル、エポキシ当量135、分子量216
・“HELOXY”TM Modifier 107(HEXION製):脂肪族エポキシ樹脂、シクロヘキサンジメタノールのジグリシジルエーテル、エポキシ当量159、分子量256
・“エポトート”(登録商標)YD-128(新日鉄住金化学(株)製):ビスフェノールA型エポキシ樹脂、エポキシ当量189
・“エポトート”(登録商標)YDF-170(新日鉄住金化学(株)製):ビスフェノールF型エポキシ樹脂、エポキシ当量170。
・HN-5500(日立化成(株)製):メチルヘキサヒドロフタル酸無水物
・“カヤハード”(登録商標)MCD(日本化薬(株)製):メチルナジック酸無水物。
・テトラメチルアンモニウムブロミド(東京化成工業(株)製)
・テトラフェニルホスホニウムブロミド(東京化成工業(株)製)
・エチルトリフェニルホスホニウムブロミド(東京化成工業(株)製)
・テトラフェニルホスホニウムクロリド(東京化成工業(株)製)
・1-ブチル-3-メチルイミダゾリウムクロリド(東京化成工業(株)製)。
・メタキシリレンジアミン(東京化成工業(株)製)
・トリ-p-トリルホスフィン(東京化成工業(株)製)
・1,2-ジメチルイミダゾール(四国化成工業(株)製)。
表1~5に記載した配合比により、エポキシ樹脂を配合し主剤液とした。表1~5に記載した配合比で、成分[D]の各酸無水物と成分[E]の第四級アンモニウム塩、第四級ホスホニウム塩、イミダゾリウム塩、および、その他の物質を配合して硬化剤液とした。これらの主剤液と硬化剤液とを用い、これらを表1~5に記載した配合比で混合して、エポキシ樹脂組成物を調製した。
ISO 2884-1(1999)における円錐平板型回転粘度計を使用した測定方法に準拠し、エポキシ樹脂組成物の混合調製後の粘度を測定し、粘度安定性の指標とした。装置には、東機産業(株)製のTVE-33H型を用いた。ここでローターは1゜34’×R24を用い、測定温度は40℃とし、サンプル量は1cm3とした。
エポキシ樹脂の硬化を追跡するために、誘電測定を行った。誘電測定装置として、Holometrix-Micromet社製のMDE-10キュアモニターを使用した。TMS-1インチ型センサーを下面に埋め込んだプログラマブルミニプレスMP2000の下面に、内径が32mmで、厚さが3mmのバイトン製Oリングを設置し、プレスの温度を120℃に設定し、Oリングの内側にエポキシ樹脂組成物を注ぎプレスを閉じ、エポキシ樹脂組成物のイオン粘度の時間変化を追跡した。誘電測定は、1、10、100、1000および10000Hzの各周波数で行い、付属のソフトウェアを用いて、周波数非依存のイオン粘度の対数Log(α)を得た。
・キュアインデックス={log(αt)-log(αmin)}/{log(αmax)-log(αmin)}×100 ・・・(式2)
・キュアインデックス:(単位:%)
・αt:時間tにおけるイオン粘度(単位:Ω・cm)
・αmin:イオン粘度の最小値(単位:Ω・cm)
・αmax:イオン粘度の最大値(単位:Ω・cm)。
プレス装置下面に、一辺50mmの正方形をくり抜いた、厚さ2mmの銅製スペーサーを設置し、プレスの温度を120℃に設定し、エポキシ樹脂組成物をスペーサーの内側に注ぎ、プレスを閉じた。20分後にプレスを開け、樹脂硬化板を得た。
樹脂硬化板から約10mgの試験片を切り出し、アルミニウム製サンプルパンに封入し、DSC(Differential Scanning Calorimetry、示差走査熱量分析)装置(パーキン・エルマー社製Diamond DSC)を用いて、Tgの測定を行った。測定条件は、昇温速度10℃/分である。0~250℃の温度範囲で2回昇温し、2回目の昇温時にベースラインがシフトした温度をTgとした。
上記の樹脂硬化板について、着色の有無を判断した。具体的には、樹脂硬化板から切り出した30mm角で、厚さが2mmの試験片を使用し、分光測色計(CM-700d、コニカミノルタ(株)製)を用いて、樹脂硬化物の色調をL*a*b*表色系で表した。L*a*b*表色系は物質の色を表すのに用いられているものでL*で明度を表し、a*とb*で色度を表す。ここで、a*は赤方向、-a*は緑方向、b*は黄方向、-b*は青方向を示す。測定条件は波長380~780nmの範囲において、D65光源、10°視野、正反射光を含まない条件での分光透過率を測定した。このとき、|a*|≦2であって、かつ|b*|≦5であるものは着色「無し」とし、それ以外を着色「有り」とした。
力学試験用の繊維強化複合材料として、下記のRTM成形法によって作製した繊維強化複合材料を用いた。
上記の繊維強化複合材料の作製の際の樹脂注入工程における含浸性について、繊維強化複合材料中のボイド量を基準に次の3段階で比較評価した。繊維強化複合材料中のボイド量が1%未満と、ボイドが実質的に存在しないものを「A」とし、繊維強化複合材料の外観に樹脂未含浸部分は認められないが、繊維強化複合材料中のボイド量が1%以上であるものを「B」とし、そして繊維強化複合材料の外観に樹脂未含浸部分が認められるものを「C」として、「A」と「B」を合格とした。
上記の繊維強化複合材料の作製の際の脱型工程における作業性について、次の3段階で比較評価した。金型を開き、繊維強化複合材料をスパチュラで金型から引き剥がす際、抵抗なく簡単に脱型されるものを「A」とし、抵抗はあるものの繊維強化複合材料が塑性変形することなく脱型できるもの(脱型作業に時間を要するため実用上は「A」に劣る)を「B」とし、脱型困難もしくは脱型の際に繊維強化複合材料が塑性変形してしまうものを「C」として、「A」と「B」を合格とした。
上記方法により作製された繊維強化複合材料のバリの発生について、次の3段階で目視により比較評価した。バリが発生しなかったものを「A」とし、僅かに発生したものを「B」とし、全周にわたり発生したものを「C」として、「A」と「B」を合格とした。
表1に示したように、脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」45質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 107」15質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」40質量部からなる主剤液と、酸無水物「HN-5500」107質量部にテトラフェニルホスホニウムブロミド12質量部を80℃の温度で加熱して相溶させた硬化剤液とからなるエポキシ樹脂組成物を混合調製した。この実施例1のエポキシ樹脂組成物は、40℃の温度での保持時に、混合調製後10分後までは急な粘度上昇を示し、そこから20分後までは増粘が抑えられ、低粘度状態が維持されていた。また、この実施例1のエポキシ樹脂組成物は、130℃の温度でのt90で表される脱型可能時間が短いため、繊維強化複合材料の成形において、成形時間の短縮にも効果的であることが分かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、また着色も無く、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、また成形体のバリも少なかった。結果を表1に示す。
脂肪族エポキシ樹脂「“HELOXY”TM Modifier 107」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」と、酸無水物「HN-5500」とを、それぞれ表1に示した量としたこと以外は、実施例1と同様に実施した。これらの実施例のエポキシ樹脂組成物は、いずれも混合調製後の粘度上昇とその後の40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、これらのエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、着色も無かったため、これらのエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、またバリも少なかった。結果を表1に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 68」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」、酸無水物「HN-5500」、およびテトラフェニルホスホニウムクロリドを、それぞれ表1に示した量としたこと以外は、実施例1と同様に実施した。これらの実施例のエポキシ樹脂組成物は、いずれも混合調製後の粘度上昇と40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、これらのエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を近傍ではあるが上回り、着色も無かったため、これらのエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ(実施例5は若干脱型に時間を要した。)、またバリも少なかった。結果を表1に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)3000」、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 107」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」、酸無水物「HN-5500」、およびエチルトリフェニルホスホニウムブロミドを、それぞれ表1に示した量としたこと以外は、実施例1と同様に実施した。本この実施例6のエポキシ樹脂組成物は、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を近傍ではあるが上回り、着色も無かったため、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に若干時間を要したものの変形することなく容易に脱型することができ、またバリも少なかった。結果を表1に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 68」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」、酸無水物「HN-5500」、およびテトラフェニルホスホニウムクロリドを、それぞれ表2に示した量としたこと以外は、実施例4と同様に実施した。これらの実施例のエポキシ樹脂組成物は、いずれも混合調製後の粘度上昇と40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、これらのエポキシ樹脂組成物の硬化物はTgが成形温度(130℃)を上回り、着色も無かったため、これらのエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、またバリも少なかった。結果を表2に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」45質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 67」30質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」25質量部からなる主剤液と、酸無水物「“カヤハード”(登録商標)MCD」123質量部にテトラメチルアンモニウムブロミド10質量部を80℃の温度で加熱して相溶させた硬化剤液とからなるエポキシ樹脂組成物を混合調製した。この実施例10のエポキシ樹脂組成物は、40℃の温度で保持しても増粘倍率が低く抑えられ、低粘度状態が維持されていた。また、130℃の温度でのt90で表される脱型可能時間が短いため、繊維強化複合材料の成形において、成形時間の短縮にも効果的であることが分かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、また着色も無かった。このため、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、成形品を金型から取り出す際に変形することなく容易に脱型することができた。結果を表2に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」45質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 67」30質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」25質量部からなる主剤液と、酸無水物「“カヤハード”(登録商標)MCD」123質量部に1-ブチル-3-メチルイミダゾリウムクロリド11質量部を80℃の温度で加熱して相溶させた硬化剤液とからなるエポキシ樹脂組成物を混合調製した。この実施例11のエポキシ樹脂組成物は、40℃の温度の温度で保持しても増粘倍率が低く抑えられ、低粘度状態が維持されていた。また、この実施例11のエポキシ樹脂組成物は、130℃の温度でのt90で表される脱型可能時間が短いため、繊維強化複合材料の成形において、成形時間の短縮にも効果的であることが分かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、また着色も無かった。このため、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、成形品を金型から取り出す際に変形することなく容易に脱型することができた。結果を表2に示す。
ビスフェノール型エポキシ樹脂をビスフェノールF型エポキシ樹脂「“エポトート”(登録商標)YDF-170」と、酸無水物「HN-5500」の量を、表2に示した量としたこと以外は、実施例4と同様に実施した。この実施例12のエポキシ樹脂組成物は、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を近傍ではあるが上回り、着色も無かったため、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、またバリも少なかった。結果を表2に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)8000」45質量部、酸無水物「HN-5500」、およびエチルトリフェニルホスホニウムブロミドを、それぞれ表3に示した量としたこと以外は、実施例1と同様に実施した。この実施例13のエポキシ樹脂組成物は、混合調製後の粘度上昇とその後の40℃の温度での粘度安定性に優れており、また脱型可能時間が短かった。また、このエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、着色も無かったため、このエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、またバリも少なかった。結果を表3に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)8000」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」、酸無水物「HN-5500」、およびテトラフェニルホスホニウムブロミドを、それぞれ表3に示した量としたこと以外は、実施例1と同様に実施した。これらの実施例のエポキシ樹脂組成物は、いずれも混合調製後の粘度上昇と40℃の温度での粘度安定性に優れ、また脱型可能時間が短かった。また、これらのエポキシ樹脂組成物の硬化物は、Tgが成形温度(130℃)を上回り、着色も無かったため、これらのエポキシ樹脂組成物を用いて作製した繊維強化複合材料は、金型から取り出す際に変形することなく容易に脱型することができ、またバリも少なかった。結果を表3に示す。
成分[B]の脂肪族エポキシ樹脂を含まず、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」55質量部と、酸無水物「HN-5500」104質量部としたこと以外は、実施例1と同様に実施した。この比較例1のエポキシ樹脂組成物では、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れているものの、成分[B]を含まないため、本発明の実施例に比べて高粘度であり、強化繊維への樹脂の含浸性が劣った。結果を表4に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」を50質量部とし、成分[C]ビスフェノール型エポキシ樹脂を含まず、酸無水物「HN-5500」を114質量部としたこと以外は、実施例5と同様に実施した。この比較例2のエポキシ樹脂組成物では、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れるものの、成分[A]が多すぎるとともに、成分[C]を含まないため、本発明の実施例に比べて粘度が低すぎ、繊維強化複合材料を成形する際に強化繊維基材への注入時に空気を巻き込み、含浸が不均一になって未含浸領域が発生し、結果として含浸性が劣った。結果を表4に示す。
脂肪族エポキシ樹脂「“HELOXY”TM Modifier 68」を55質量部とし、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」を20質量部とし、酸無水物「HN-5500」116質量部としたこと以外は、実施例4と同様に実施した。この比較例3のエポキシ樹脂組成物では、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れるものの、成分[B]が多すぎるため、本発明の実施例に比べて硬化物のTgが成形温度(130℃)を下回るため、繊維強化複合材料を脱型する際に変形してしまった。結果を表4に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」25質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 107」を37質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」38質量部からなる主剤液と、硬化剤液に成分[D]と成分[E]を含まず、メタキシレンジアミン21質量部としたこと以外は、実施例1と同様に実施した。この比較例4のエポキシ樹脂組成物では、成分[D]および成分[E]を含まないためエポキシ樹脂組成物の粘度が高く、また増粘倍率が高く粘度の安定性に劣るため、このエポキシ樹脂組成物を用いた繊維強化複合材料成形では、強化繊維への含浸性が劣った。結果を表4に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)3000」25質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 68」を37質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」38質量部からなる主剤液と、硬化剤液に酸無水物「HN-5500」125質量部に、成分[E]の代わりに1,2-ジメチルイミダゾールを10質量部としたこと以外は、実施例1と同様に実施した。この比較例5のエポキシ樹脂組成物では、成分[E]を含まないため、本発明の実施例に比べ40℃の温度での増粘倍率が高く粘度の安定性に劣るため、このエポキシ樹脂組成物を用いた繊維強化複合材料成形では、強化繊維への含浸性が劣り、硬化物が着色していた。結果を表4に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)2021P」45質量部、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 68」を30質量部、およびビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」25質量部からなる主剤液と、硬化剤液に酸無水物「HN-5500」108質量部に、成分[E]の代わりにトリ-p-トリルホスフィンを10質量部としたこと以外は、実施例1と同様に実施した。この比較例6のエポキシ樹脂組成物では、成分[E]を含まないため、本発明の実施例に比べ硬化時間が長くなっており、また、混合調製後の粘度上昇は発現しなかった。また、硬化物は着色した。このエポキシ樹脂組成物を用いた繊維強化複合材料成形は、成形体に多数のバリが生じ成形体の品位が低下した。結果を表4に示す。
成分[A]の脂肪族エポキシ樹脂を含まず、脂肪族エポキシ樹脂「“HELOXY”TM Modifier 107」を50質量部、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」50質量部、および酸無水物「HN-5500」97質量部としたこと以外は、実施例1と同様に実施した。この比較例7のエポキシ樹脂組成物では、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れるものの、成分[A]を含まないため、本発明の実施例に比べて硬化物のTgが成形温度(130℃)を下回るため、繊維強化複合材料を脱型する際に変形してしまった。結果を表5に示す。
脂環式エポキシ樹脂「“セロキサイド”(登録商標)8000」、ビスフェノールA型エポキシ樹脂「“エポトート”(登録商標)YD-128」、酸無水物「HN-5500」、およびテトラフェニルホスホニウムブロミドを、それぞれ表5に示した量としたこと以外は、実施例1と同様に実施した。脂環式エポキシ樹脂(3,4,3’,4’-ジエポキシビシクロヘキシル)の少ない比較例8のエポキシ樹脂組成物は、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れているものの、本発明の実施例に比べて高粘度であり、強化繊維への樹脂の含浸性が劣った。また、脂環式エポキシ樹脂(3,4,3’,4’-ジエポキシビシクロヘキシル)の多い比較例9のエポキシ樹脂組成物は、混合調製後の粘度上昇と40℃の温度での粘度安定性に優れているものの、本発明の実施例に比べて粘度が低すぎ、繊維強化複合材料を成形する際に強化繊維基材への注入時に空気を巻き込み、含浸が不均一になって未含浸領域が発生し、結果として含浸性が劣った。結果を表5に示す。
Claims (14)
- 次の成分[A]~成分[E]を含み、かつ、成分[A]、成分[B]および成分[C]の合計100質量%に対して、前記成分[A]の含有量が5~45質量%であり、前記成分[B]の含有量が5~50質量%であり、そして前記成分[C]の含有量が5~50質量%であることを特徴とする繊維強化複合材料用2液型エポキシ樹脂組成物。
・成分[A]:脂環式エポキシ樹脂
・成分[B]:脂肪族エポキシ樹脂
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウム塩およびイミダゾリウム塩からなる群から選ばれた化合物。 - 成分[A]が、3,4,3’,4’-ジエポキシビシクロヘキシルである請求項1記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 次の成分[a]、成分[C]、成分[D]および成分[E]を含み、かつ、前記成分[a]および前記成分[C]の合計100質量%に対して、前記成分[a]の含有量が15~70質量%であることを特徴とする繊維強化複合材料用2液型エポキシ樹脂組成物。
・成分[a]:3,4,3’,4’-ジエポキシビシクロヘキシル
・成分[C]:ビスフェノール型エポキシ樹脂
・成分[D]:酸無水物
・成分[E]:第四級アンモニウム塩、第四級ホスホニウム塩およびイミダゾリウム塩からなる群から選ばれた化合物。 - 更に、次の成分[B]を含む請求項3記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
・成分[B]:脂肪族エポキシ樹脂 - 成分[B]が、分子量300以下の脂肪族エポキシ樹脂である請求項1、2および4のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[E]が、第四級ホスホニウムハライドである請求項1~5のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[E]が、第四級ホスホニウムブロミドである請求項1~6のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[E]が、テトラフェニルホスホニウムハライドである請求項1~7のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[A]、成分[B]および成分[C]の合計100質量部に対して、成分[E]の含有量が3~25質量部であるか、または、成分[a]および成分[C]の合計100質量部に対して、成分[E]の含有量が3~25質量部である請求項1~8のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[C]が、ビスフェノールA型エポキシ樹脂である請求項1~9のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- さらに、次の成分[F]を含む請求項1~10のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
・成分[F]:強化繊維 - 成分[F]が、炭素繊維である請求項11記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 成分[D]が、脂環式構造を有する酸無水物である請求項1~12のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物。
- 請求項9~13のいずれかに記載の繊維強化複合材料用2液型エポキシ樹脂組成物を、硬化してなる繊維強化複合材料。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17815013.2A EP3476877A4 (en) | 2016-06-24 | 2017-04-25 | TWO-COMPONENT EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL |
| KR1020187034113A KR20190022488A (ko) | 2016-06-24 | 2017-04-25 | 섬유 강화 복합 재료용 2액형 에폭시 수지 조성물 및 섬유 강화 복합 재료 |
| US16/311,884 US20190194447A1 (en) | 2016-06-24 | 2017-04-25 | Two-pack epoxy resin compositon for fiber-reinforced composite material, and fiber-reinforced composite material |
| CN201780037382.7A CN109312054A (zh) | 2016-06-24 | 2017-04-25 | 纤维增强复合材料用二液型环氧树脂组合物及纤维增强复合材料 |
| JP2017522687A JPWO2017221542A1 (ja) | 2016-06-24 | 2017-04-25 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-125530 | 2016-06-24 | ||
| JP2016125530 | 2016-06-24 | ||
| JP2016-241872 | 2016-12-14 | ||
| JP2016241872 | 2016-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017221542A1 true WO2017221542A1 (ja) | 2017-12-28 |
Family
ID=60783386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2017/016267 Ceased WO2017221542A1 (ja) | 2016-06-24 | 2017-04-25 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190194447A1 (ja) |
| EP (1) | EP3476877A4 (ja) |
| JP (1) | JPWO2017221542A1 (ja) |
| KR (1) | KR20190022488A (ja) |
| CN (1) | CN109312054A (ja) |
| WO (1) | WO2017221542A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022000498A (ja) * | 2020-05-19 | 2022-01-04 | ヌーリオン ケミカルズ インターナショナル ベスローテン フェノーツハップNouryon Chemicals International B.V. | 脂肪族エポキシ末端ポリスルフィドポリマー |
| WO2024195771A1 (ja) * | 2023-03-23 | 2024-09-26 | デンカ株式会社 | 硬化体の製造方法、成形体の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11364690B2 (en) * | 2018-02-08 | 2022-06-21 | Giant Manufacturing Co., Ltd. | Resin-based composite structure and method for forming resin-based composite structure |
| EP3825341A1 (de) * | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Matrixharz für laminate mit hoher transparenz, geringer vergilbung und hohen glasübergangstemperaturen |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4617588B1 (ja) * | 1969-03-06 | 1971-05-15 | ||
| JPS627720A (ja) * | 1985-07-03 | 1987-01-14 | Hitachi Ltd | エポキシ樹脂組成物 |
| JPS62290718A (ja) * | 1986-06-11 | 1987-12-17 | Hitachi Ltd | エポキシ樹脂組成物とこれらを用いてフライバツクトランスを製造する方法 |
| JPH0284425A (ja) * | 1988-06-24 | 1990-03-26 | Somar Corp | 液状エポキシ樹脂組成物 |
| JP2002003582A (ja) * | 2000-04-17 | 2002-01-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法 |
| JP2004051960A (ja) * | 2002-05-27 | 2004-02-19 | Nitto Denko Corp | 樹脂シート、およびそれを用いた液晶セル基板 |
| JP2006036862A (ja) * | 2004-07-23 | 2006-02-09 | Daicel Chem Ind Ltd | 電気絶縁性注型用エポキシ樹脂組成物及び硬化物、並びに熱硬化性接着剤組成物 |
| WO2008044397A1 (en) * | 2006-10-11 | 2008-04-17 | Sumitomo Bakelite Co., Ltd. | Transparent composite sheet |
| WO2010119903A1 (ja) * | 2009-04-14 | 2010-10-21 | チッソ株式会社 | ガラス繊維複合化シルセスキオキサン成形体とその製造方法 |
| WO2011078205A1 (ja) * | 2009-12-24 | 2011-06-30 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置 |
| JP2013001711A (ja) * | 2011-06-10 | 2013-01-07 | Yokohama Rubber Co Ltd:The | 繊維強化複合材料用エポキシ樹脂組成物 |
| WO2014061648A1 (ja) * | 2012-10-15 | 2014-04-24 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物 |
| WO2014103759A1 (ja) * | 2012-12-28 | 2014-07-03 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及びフィルム |
| WO2015046030A1 (ja) * | 2013-09-30 | 2015-04-02 | 東レ株式会社 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
| JP2015193830A (ja) * | 2014-03-26 | 2015-11-05 | 三洋化成工業株式会社 | 繊維強化複合材料用樹脂組成物、繊維強化複合材料用樹脂組成物含浸強化繊維及び繊維強化複合材料 |
| JP2016000801A (ja) * | 2014-05-21 | 2016-01-07 | 三菱化学株式会社 | エポキシ樹脂用希釈剤、及びエポキシ樹脂組成物 |
| WO2016158757A1 (ja) * | 2015-03-27 | 2016-10-06 | 東レ株式会社 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4515009B2 (ja) | 2002-01-30 | 2010-07-28 | 住友化学株式会社 | 発光ダイオード封止用樹脂組成物 |
| JP2004099467A (ja) * | 2002-09-05 | 2004-04-02 | Daicel Chem Ind Ltd | 脂環式エポキシ化合物の製造方法 |
| EP1541567A4 (en) * | 2002-09-05 | 2010-11-17 | Daicel Chem | PROCESS FOR THE PREPARATION OF DIEPOXY ALICYCLIC COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICALLY INSULATING OILS, AND EPOXY RESIN COMPOSITIONS FOR ELECTRO ISOLATION |
| JP4737530B2 (ja) | 2005-11-02 | 2011-08-03 | 河西工業株式会社 | 自動車用内装部品の製造方法 |
| JP5354868B2 (ja) * | 2006-07-06 | 2013-11-27 | 株式会社ダイセル | 脂環式ジエポキシ化合物の製造方法、エポキシ樹脂組成物の製造方法、及び硬化物の製造方法 |
| EP2194085B1 (en) * | 2007-09-27 | 2018-01-03 | Mitsubishi Gas Chemical Company, Inc. | Epoxy resin composition, cured object obtained therefrom, and light-emitting diode |
| JP5683073B2 (ja) | 2009-01-20 | 2015-03-11 | 三菱化学株式会社 | 太陽電池封止材用エポキシ樹脂組成物及び太陽電池 |
-
2017
- 2017-04-25 EP EP17815013.2A patent/EP3476877A4/en not_active Withdrawn
- 2017-04-25 US US16/311,884 patent/US20190194447A1/en not_active Abandoned
- 2017-04-25 KR KR1020187034113A patent/KR20190022488A/ko not_active Withdrawn
- 2017-04-25 CN CN201780037382.7A patent/CN109312054A/zh not_active Withdrawn
- 2017-04-25 JP JP2017522687A patent/JPWO2017221542A1/ja active Pending
- 2017-04-25 WO PCT/JP2017/016267 patent/WO2017221542A1/ja not_active Ceased
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4617588B1 (ja) * | 1969-03-06 | 1971-05-15 | ||
| JPS627720A (ja) * | 1985-07-03 | 1987-01-14 | Hitachi Ltd | エポキシ樹脂組成物 |
| JPS62290718A (ja) * | 1986-06-11 | 1987-12-17 | Hitachi Ltd | エポキシ樹脂組成物とこれらを用いてフライバツクトランスを製造する方法 |
| JPH0284425A (ja) * | 1988-06-24 | 1990-03-26 | Somar Corp | 液状エポキシ樹脂組成物 |
| JP2002003582A (ja) * | 2000-04-17 | 2002-01-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法 |
| JP2004051960A (ja) * | 2002-05-27 | 2004-02-19 | Nitto Denko Corp | 樹脂シート、およびそれを用いた液晶セル基板 |
| JP2006036862A (ja) * | 2004-07-23 | 2006-02-09 | Daicel Chem Ind Ltd | 電気絶縁性注型用エポキシ樹脂組成物及び硬化物、並びに熱硬化性接着剤組成物 |
| WO2008044397A1 (en) * | 2006-10-11 | 2008-04-17 | Sumitomo Bakelite Co., Ltd. | Transparent composite sheet |
| WO2010119903A1 (ja) * | 2009-04-14 | 2010-10-21 | チッソ株式会社 | ガラス繊維複合化シルセスキオキサン成形体とその製造方法 |
| WO2011078205A1 (ja) * | 2009-12-24 | 2011-06-30 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置 |
| JP2013001711A (ja) * | 2011-06-10 | 2013-01-07 | Yokohama Rubber Co Ltd:The | 繊維強化複合材料用エポキシ樹脂組成物 |
| WO2014061648A1 (ja) * | 2012-10-15 | 2014-04-24 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物 |
| WO2014103759A1 (ja) * | 2012-12-28 | 2014-07-03 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及びフィルム |
| WO2015046030A1 (ja) * | 2013-09-30 | 2015-04-02 | 東レ株式会社 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
| JP2015193830A (ja) * | 2014-03-26 | 2015-11-05 | 三洋化成工業株式会社 | 繊維強化複合材料用樹脂組成物、繊維強化複合材料用樹脂組成物含浸強化繊維及び繊維強化複合材料 |
| JP2016000801A (ja) * | 2014-05-21 | 2016-01-07 | 三菱化学株式会社 | エポキシ樹脂用希釈剤、及びエポキシ樹脂組成物 |
| WO2016158757A1 (ja) * | 2015-03-27 | 2016-10-06 | 東レ株式会社 | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP3476877A4 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022000498A (ja) * | 2020-05-19 | 2022-01-04 | ヌーリオン ケミカルズ インターナショナル ベスローテン フェノーツハップNouryon Chemicals International B.V. | 脂肪族エポキシ末端ポリスルフィドポリマー |
| JP7394807B2 (ja) | 2020-05-19 | 2023-12-08 | ヌーリオン ケミカルズ インターナショナル ベスローテン フェノーツハップ | 脂肪族エポキシ末端ポリスルフィドポリマー |
| US11851531B2 (en) | 2020-05-19 | 2023-12-26 | Nouryon Chemicals International B.V. | Aliphatic epoxy-terminated polysulfide polymer |
| WO2024195771A1 (ja) * | 2023-03-23 | 2024-09-26 | デンカ株式会社 | 硬化体の製造方法、成形体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3476877A4 (en) | 2020-01-01 |
| KR20190022488A (ko) | 2019-03-06 |
| CN109312054A (zh) | 2019-02-05 |
| JPWO2017221542A1 (ja) | 2019-05-09 |
| EP3476877A1 (en) | 2019-05-01 |
| US20190194447A1 (en) | 2019-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5733301B2 (ja) | 繊維強化複合材料rtm成形用エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 | |
| JP6137407B2 (ja) | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 | |
| JP5604771B2 (ja) | エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 | |
| JP6007794B2 (ja) | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 | |
| US20160237273A1 (en) | Two-pack epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material | |
| WO2017221542A1 (ja) | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 | |
| JP2010163573A (ja) | エポキシ樹脂組成物およびそれを用いた繊維強化複合材料 | |
| WO2018029743A1 (ja) | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 | |
| JP2014214169A (ja) | 繊維強化複合材料用2液型エポキシ樹脂組成物および繊維強化複合材料 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ENP | Entry into the national phase |
Ref document number: 2017522687 Country of ref document: JP Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: 20187034113 Country of ref document: KR Kind code of ref document: A |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17815013 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 2017815013 Country of ref document: EP Effective date: 20190124 |