WO2017170879A1 - 硬化性組成物、硬化物の製造方法、およびその硬化物 - Google Patents
硬化性組成物、硬化物の製造方法、およびその硬化物 Download PDFInfo
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- WO2017170879A1 WO2017170879A1 PCT/JP2017/013284 JP2017013284W WO2017170879A1 WO 2017170879 A1 WO2017170879 A1 WO 2017170879A1 JP 2017013284 W JP2017013284 W JP 2017013284W WO 2017170879 A1 WO2017170879 A1 WO 2017170879A1
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C08F2/00—Processes of polymerisation
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and more particularly to a curable composition having excellent viscosity and adhesion, a method for producing a cured product, and a cured product thereof.
- Curable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members and the like. Various reports have been made regarding the improvement of such a curable composition.
- Patent Documents 1 to 3 listed below propose an energy beam curable composition containing a cationic polymerizable component and a radical polymerizable component, and a cured product thereof.
- Patent Document 1 proposes an adhesive composition for polarizing plates that is excellent in initial curability and adhesiveness.
- Patent Document 2 when manufacturing the polarizing plate which uses a resin film with low moisture permeability as a protective film, even if the humidity of a coating environment is high, it is excellent in sclerosis
- a low-viscosity photo-curing adhesive that has good strength and does not cause problems even after an endurance test and also has good adhesive strength after the end of the moist heat resistance test has been proposed.
- Patent Document 3 proposes an active energy ray-polymerizable resin composition that can satisfy both high heat resistance, high refractive index and transparency, including an unsaturated alicyclic epoxy ester compound.
- JP 2014-105218 A JP2015-143352A JP2015-168757A
- an object of the present invention is to provide a curable composition having excellent viscosity and adhesion, a method for producing a cured product, and a cured product thereof.
- the curable composition of the present invention comprises 20 to 90 parts by mass of the cationic polymerizable component (A), 1 to 10 parts by mass of the cationic polymerization initiator (B), and 1 to 30 parts by mass of the radical polymerizable component (C).
- Part and radical polymerization initiator (D) 0 to 10 parts by mass so that the total of the cationic polymerizable component (A) and the radical polymerizable component (C) is 100 parts by mass
- the cationic polymerizable component (A) comprises an aromatic epoxy compound (A1), a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product (A2) of a polyhydric alcohol alkylene oxide adduct, and an oxetane compound (A3).
- the aromatic epoxy compound (A1) is 35 to 50 parts by mass with respect to 100 parts by mass in total of the cationic polymerizable component (A) and the radical polymerizable component (C).
- the radical polymerizable component (C) is an epoxy group and an ethylenically unsaturated group compound (C1), an acrylate ester of an alcohol having 2 to 20 carbon atoms, or an alcohol having 2 to 20 carbon atoms.
- Methacrylic acid ester (C2) is an essential component.
- the cationically polymerizable component (A1) is preferably a polyfunctional aromatic epoxy compound.
- the said oxetane compound (A3) is a polyfunctional oxetane compound.
- the acrylate ester of alcohol having 2 to 20 carbon atoms or the methacrylate ester (C2) of alcohol having 2 to 20 carbon atoms is an acrylic resin having a cyclic structure.
- An acid ester or a methacrylic acid ester is preferred.
- the cyclic structure has the following group: It is preferable that it is 1 or more types chosen from more.
- the method for producing a cured product of the present invention is characterized in that the curable composition of the present invention is irradiated with active energy rays or heated.
- the cured product of the present invention is a cured product of the curable composition of the present invention.
- the present invention it is possible to provide a curable composition excellent in viscosity and adhesion, a method for producing a cured product, and a cured product thereof.
- the curable composition of the present invention is particularly useful for adhesives.
- the curable composition of the present invention comprises 20 to 90 parts by mass of the cationic polymerizable component (A), 1 to 10 parts by mass of the cationic polymerization initiator (B), and 1 to 30 parts by mass of the radical polymerizable component (C).
- the radical polymerization initiator (D) is contained in an amount of 0 to 10 parts by mass so that the total of the cationic polymerizable component (A) and the radical polymerizable component (C) is 100 parts by mass.
- the cationic polymerizable component (A) includes an aromatic epoxy compound (A1) and a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product of a polyhydric alcohol alkylene oxide adduct. (A2) and an oxetane compound (A3) as essential components, and the aromatic epoxy compound (A1) is 100 parts by mass in total of the cationic polymerizable component (A) and the radical polymerizable component (C). And 35 to 50 parts by mass.
- the radically polymerizable component (C) is a compound having an epoxy group and an ethylenically unsaturated group (C1), an acrylate ester of an alcohol having 2 to 20 carbon atoms, or an alcohol having 2 to 20 carbon atoms.
- the methacrylic acid ester (C2) is an essential component.
- the cationically polymerizable component (A) according to the curable composition of the present invention is a compound that undergoes polymerization or crosslinking reaction by a cationic polymerization initiator activated by irradiation with energy rays or heating.
- a cationic polymerization initiator activated by irradiation with energy rays or heating.
- An epoxy compound, an oxetane compound, a vinyl ether compound, etc. are mentioned.
- the cationic polymerizable component (A) is a cationic polymerizable component (A), an aromatic epoxy compound (A1), a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a polyvalent compound.
- an aromatic epoxy compound (A1) a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more
- a polyvalent compound e.glycidylated product of the alcohol alkylene oxide adduct and the oxetane compound (A3) are essential components
- an alicyclic epoxy compound and a vinyl ether compound can also be used as other epoxy compounds.
- the aromatic epoxy compound (A1) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound include a polyhydric phenol having at least one aromatic ring such as phenol, cresol, butylphenol, or the like.
- Mono / polyglycidyl etherified products of the alkylene oxide adducts for example, bisphenol A, bisphenol F, or glycidyl etherified compounds of compounds obtained by further adding alkylene oxide to these and epoxy novolac resins; two such as resorcinol, hydroquinone and catechol Mono / polyglycidyl etherified products of aromatic compounds having the above phenolic hydroxyl groups; aromatic compounds having two or more alcoholic hydroxyl groups such as phenyldimethanol, phenyldiethanol, phenyldibutanol and the like
- aromatic epoxy compound (A1) commercially available products can be used.
- Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX -721, on-coat EX-1020, on-coat EX-1030, on-coat EX-1040, on-coat EX-1050, on-coat EX-1051, on-coat EX-1010, on-coat EX-1011, on-coat 1012 (Nagase Chemtex Co., Ltd.); Ogsol PG-100, Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (DIC Corporation) ESN-475 (Manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); Epicoat YX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA,
- Examples of the glycidylated product of polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A2) of a polyhydric alcohol alkylene oxide adduct include those obtained by glycidylating a polyhydric alcohol or a polyhydric alcohol alkylene oxide adduct.
- the molecular weight of the compound is 200 or more.
- Examples of the glycidylated product of polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product of polyhydric alcohol alkylene oxide adduct (A2) include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neo Pentyl glycol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, dicyclo Glycidyl ethers of polyhydric alcohols such as pentadiene dimethanol diglycidyl ether, propylene glycol, trimethylo Tri
- glycidylated product of a polyhydric alcohol or a polyhydric alcohol alkylene oxide adduct (A1) a monoglycidyl ether of a higher aliphatic alcohol, a glycidyl ester of a higher fatty acid, epoxidized soybean oil, octyl epoxy stearate, Examples include epoxy butyl stearate, epoxidized soybean oil, and epoxidized polybutadiene.
- glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A2) of a polyhydric alcohol alkylene oxide adduct those having a saturated condensed ring are preferable because the curability and adhesion of the cured product are improved.
- glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A2) of a polyhydric alcohol alkylene oxide adduct commercially available products can be used.
- Examples of the oxetane compound (A3) include 3,7-bis (3-oxetanyl) -5-oxa-nonane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2- Bis [(3-ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether Triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, Bifunctional aliphatic oxygen such as 1,6-bis (3-ethyl-3-o
- oxetane compound (A3) commercially available products can be used.
- the above alicyclic epoxy compound refers to a compound in which an oxirane ring is directly bonded to a saturated ring without a bonding group.
- Specific examples of the alicyclic epoxy compound include a polyglycidyl etherified product of a polyhydric alcohol having at least one alicyclic ring, cyclohexene oxide obtained by epoxidizing a cyclohexene or cyclopentene ring-containing compound with an oxidizing agent, A cyclopentene oxide containing compound is mentioned.
- Alicyclic epoxy compounds include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy- 1-methylhexanecarboxylate is preferred from the viewpoint of improving adhesion.
- alicyclic epoxy compound Commercially available products can be used as the alicyclic epoxy compound, and examples thereof include Celoxide 2021P, Celoxide 2081, Celoxide 2000, and Celoxide 3000 (manufactured by Daicel Corporation).
- Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2- Examples thereof include hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether.
- an aromatic epoxy compound (A1), a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product (A2) and an oxetane compound (A3) of a polyhydric alcohol alkylene oxide adduct an aromatic epoxy compound (A1), a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product (A2) and an oxetane compound (A3) of a polyhydric alcohol alkylene oxide adduct
- the proportion of the alicyclic epoxy compound and vinyl ether compound used is 30 to 80 parts by mass of the aromatic epoxy compound (A1) with respect to 100 parts by mass in total of the cationic polymerizable component (A) and the radical polymerizable component (C).
- Glycidylated product of polyhydric alcohol having a molecular weight of 200 or more or glycidylated product of polyhydric alcohol alkylene oxide adduct (A2) 10 to 30 parts by mass, oxetane compound (A3) 10 to 30 parts by mass, alicyclic epoxy compound 0 to 20 Parts by weight, 0 to 20 parts by weight of the vinyl ether compound.
- Viscosity, coating property, is preferably improved reactivity and curability.
- the cationic polymerization initiator (B) may be any compound as long as it can release a substance that initiates cationic polymerization by energy ray irradiation or heating.
- it is a double salt that is an onium salt that releases a Lewis acid upon irradiation with energy rays, or a derivative thereof.
- Representative examples of such compounds include the following general formula: [A] r + [B] r- And cation and anion salts represented by the formula:
- the cation [A] r + is preferably onium, and the structure thereof is, for example, the following general formula: [(R 1 ) a Q] r + Can be expressed as
- R 1 is an organic group having 1 to 60 carbon atoms and any number of atoms other than carbon atoms.
- a is an integer of 1 to 5.
- the a R 1 s are independent and may be the same or different.
- at least one is preferably an organic group as described above having an aromatic ring.
- the anion [B] r- is preferably a halide complex, and the structure thereof is, for example, the following general formula: [LY b ] r- Can be expressed as
- L is a metal or metalloid which is a central atom of a halide complex
- B P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like.
- Y is a halogen atom.
- b is an integer of 3 to 7.
- anion [LY b ] r- of the above general formula examples include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF 4 ) ⁇ , Examples include hexafluorophosphate (PF 6 ) ⁇ , hexafluoroantimonate (SbF 6 ) ⁇ , hexafluoroarsenate (AsF 6 ) ⁇ , hexachloroantimonate (SbCl 6 ) ⁇ and the like.
- the anion [B] r- is represented by the following general formula: [LY b-1 (OH)] r-
- the thing of the structure represented by can also be used preferably. L, Y, and b are the same as described above.
- Other anions that can be used include perchlorate ion (ClO 4 ) ⁇ , trifluoromethylsulfite ion (CF 3 SO 3 ) ⁇ , fluorosulfonate ion (FSO 3 ) ⁇ , and toluenesulfonate anion.
- Trinitrobenzenesulfonate anion camphor sulfonate, nonafluorobutane sulfonate, hexadecafluorooctane sulfonate, tetraarylborate, tetrakis (pentafluorophenyl) borate and the like.
- the onium salts it is particularly effective to use the following aromatic onium salts (a) to (c).
- aromatic onium salts (a) to (c) one of them can be used alone, or two or more of them can be mixed and used.
- Aryl diazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
- Diaryls such as diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-butylphenyl) iodonium hexafluorophosphate, and tricumyliodonium tetrakis (pentafluorophenyl) borate Iodonium salt
- Sulfonium salts such as sulfonium cations represented by the following group I or group II and hexafluoroantimony ions, hexafluorophosphate ions, tetrakis (pentafluorophenyl) borate ions, etc.
- Aromatic sulfonium salts having the following structure are used as cationic polymerization initiators (B ) It is more preferable to contain at least 0.1% by mass with respect to 100% by mass.
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 are each independently a hydrogen atom, a halogen atom, or a carbon atom number.
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or 1 carbon atom.
- R 30 , R 31 , R 32 , R 33 and R 34 each independently represents a hydrogen atom, a halogen atom or 1 to 10 carbon atoms. Represents an alkyl group.
- the halogen atom include fluorine, chlorine, bromine and iodine.
- R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Is methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t-amyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3- Methoxypropyl, 4-methoxybutyl, 2-
- the alkoxy group having 1 to 10 carbon atoms includes methoxy, ethoxy, propyloxy, isopropyloxy, butyloxy, s-butyloxy, t-butyloxy, isobutyloxy, pentyloxy, isoamyloxy, t-amyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-methoxyethyloxy, 3-methoxypropyloxy, 4- Methoxybutyloxy, 2-butoxye
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 R 29 , R 35 , R 36 , R 37 , R 38 and R 39 are ester groups having 2 to 10 carbon atoms such as methoxycarbonyl, ethoxycarbonyl, isopropyloxycarbonyl, phenoxycarbonyl, acetoxy, propionyl Examples include oxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, t-butylcarbonyloxy, methoxyacetyloxy, benzoyloxy and the like.
- the radical polymerizable component (C) according to the curable composition of the present invention is a compound (C1) having an epoxy group and an ethylenically unsaturated group, an acrylate ester of an alcohol having 2 to 20 carbon atoms, or the number of carbon atoms.
- the methacrylic acid ester (C2) of alcohol 2 to 20 is an essential component.
- an acrylic ester or a methacrylic ester having a cyclic structure is preferable, and more preferably, the cyclic structure is at least one selected from the following group.
- Examples of the compound (C1) having an epoxy group and an ethylenically unsaturated group include epoxy acrylate or epoxy methacrylate.
- epoxy acrylate or epoxy methacrylate Specifically, conventionally known aromatic epoxy resins, alicyclic epoxy resins, An acrylate obtained by reacting an aliphatic epoxy resin or the like with acrylic acid or methacrylic acid.
- epoxy acrylates or epoxy methacrylates particularly preferred are acrylates or methacrylates of glycidyl ethers of alcohols.
- Examples of the acrylate of alcohol having 2 to 20 carbon atoms or the methacrylate (C2) of alcohol having 2 to 20 carbon atoms include aromatic or aliphatic alcohols having at least one hydroxyl group in the molecule, and alkylenes thereof. Examples thereof include acrylates or methacrylates obtained by reacting an oxide adduct with acrylic acid or methacrylic acid.
- radically polymerizable component (C) a compound that is polymerized or cross-linked by a radical polymerization initiator activated by energy ray irradiation or heating other than (C1) or (C2) can be used. Examples include urethane compounds, unsaturated polyester compounds, and styrene compounds.
- the proportion of the component (C1) and the component (C2) in the radical polymerizable component (C) is preferably 50% by mass or more.
- the radical initiator (D) according to the curable composition of the present invention is not particularly limited, and known ones can be used.
- ketone compounds such as acetophenone compounds, benzyl compounds, benzophenone compounds, and thioxanthone compounds, oxime compounds, and the like can be used.
- the cationic polymerizable component (A) is 20 to 90 parts by mass
- the cationic polymerization initiator (B) is 1 to 10 parts by mass, preferably 1 to 6 parts by mass
- the radical polymerization is 1 to 30 parts by mass
- the radical polymerization initiator (D) is 0 to 10 parts by mass. If the blending ratio is other than the above, the curability and adhesion of the cured product may be deteriorated.
- the total of the cationic polymerizable component (A) and the radical polymerizable component (C) is 100 parts by mass.
- the component (A1) is 35 to 50 parts by mass with respect to 100 parts by mass in total of the cationic polymerizable component (A) and the radical polymerizable component (C).
- a sensitizer and / or a sensitization aid can be further used as necessary.
- the sensitizer is a compound that exhibits maximum absorption at a wavelength longer than the maximum absorption wavelength indicated by the cationic polymerization initiator (B) and promotes the polymerization initiation reaction by the cationic polymerization initiator (B).
- the sensitization aid is a compound that further promotes the action of the sensitizer.
- Sensitizers and sensitizers include anthracene compounds and naphthalene compounds.
- anthracene compound examples include those represented by the following formula (1).
- R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 2 to 12 carbon atoms, and R 52 represents a hydrogen atom. Or an alkyl group having 1 to 6 carbon atoms.
- anthracene compound represented by the above formula (1) include the following compounds.
- naphthalene compound examples include those represented by the following formula (2).
- R 53 and R 54 each independently represents an alkyl group having 1 to 6 carbon atoms.
- naphthalene compound represented by the above formula (2) include the following compounds.
- 4-methoxy-1-naphthol 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyloxy-1-naphthol, 1,4-dimethoxynaphthalene
- Examples thereof include 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene, 1,4-dibutoxynaphthalene and the like.
- the use ratio of the sensitizer and the sensitization aid to the cationic polymerizable component (A) is not particularly limited, and may be used at a generally normal use ratio within a range not inhibiting the purpose of the present invention. From the viewpoint of improving curability, the amount of the sensitizer and the sensitizer is 0.1 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable component (A).
- a silane coupling agent can be used as necessary.
- the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, and ethyltrimethoxysilane.
- Alkyl-functional alkoxysilanes vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, and other alkenyl-functional alkoxysilanes, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, ⁇ Epoxy-functional alkoxysilanes such as glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N- ⁇ (aminoethyl) - ⁇ Aminofunctional alkoxysilanes such as amino
- the amount of the silane coupling agent used is not particularly limited, but is usually in the range of 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of solids in the curable composition.
- the properties of the cured product can be improved by using a thermoplastic organic polymer as necessary.
- the thermoplastic organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly (meth) acrylic acid, styrene- (meth) acrylic acid copolymer, Examples include (meth) acrylic acid-methyl methacrylate copolymer, glycidyl (meth) acrylate-polymethyl (meth) acrylate copolymer, polyvinyl butyral, cellulose ester, polyacrylamide, and saturated polyester.
- the UV-absorbing agent is inactivated at room temperature, and the protective group is released by heating to a predetermined temperature, light irradiation, acid, etc. and activated.
- a compound exhibiting ultraviolet absorbing ability can also be used.
- coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, antifoaming agents, thickeners, surfactants, leveling agents, difficulty
- resin additives such as flame retardants, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, UV absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc. may be added. it can.
- a solvent that can dissolve or disperse the components (A), (B), (C), and (D) that are usually used without any particular limitation
- the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1 Ether solvents such as 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, acetic acid-n-propyl, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl
- Paraffin solvents Paraffin solvents; halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, and 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; propylene carbonate, carbitol solvents Aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, water and the like. These solvents can be used as one or a mixture of two or more.
- the water content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less because the curability, adhesiveness, and liquid storage stability are improved. Too much moisture is not preferred because it may cause cloudiness or components may precipitate.
- the curable composition of the present invention is applied onto a support substrate by a known means such as a roll coater, a curtain coater, various types of printing, and immersion. Moreover, after once applying on support bases, such as a film, it can also transfer on another support base
- the material for the support substrate is not particularly limited and may be any commonly used material, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetylpropionyl.
- inorganic materials such as glass
- Cellulose esters such as cellulose and nitrocellulose; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxy Polyesters such as ethane-4,4′-dicarboxylate and polybutylene terephthalate; polystyrene; polyethylene, polypropylene, polymethylpente Polyolefin such as polyvinyl acetate, polyvinyl compounds such as polyvinyl chloride and polyvinyl fluoride, acrylic resins such as polymethyl methacrylate and polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxy Polymer materials such as ethylene, norbornene resin, and cycloolefin polymer (COP) can be used.
- the support substrate may
- examples of energy rays include ultraviolet rays, electron beams, X-rays, radiation, high frequencies, and the like, and ultraviolet rays are most preferable economically.
- examples of the ultraviolet light source include an ultraviolet laser, a mercury lamp, a xenon laser, and a metal halide lamp.
- the conditions for the method of curing the curable composition of the present invention by heating are 70 to 250 ° C. and 1 to 100 minutes. After performing pre-baking (PAB), pressurization and post-baking (PEB) may be performed, or baking may be performed at several different temperatures.
- the heating conditions vary depending on the type and mixing ratio of each component, but are, for example, 70 to 180 ° C., 5 to 15 minutes for an oven, and 1 to 5 minutes for a hot plate.
- a cured film can be obtained by heat treatment at 180 to 250 ° C., preferably 200 to 250 ° C., for 30 to 90 minutes for an oven and 5 to 30 minutes for a hot plate.
- curable composition of the present invention or a cured product thereof include adhesives, glasses, optical materials represented by imaging lenses, paints, coating agents, lining agents, inks, resists, liquid resists, printing Plates, color TVs, PC monitors, personal digital assistants, digital cameras, organic EL, touch panels and other display elements, insulating varnishes, insulating sheets, laminates, printed boards, semiconductor devices, LED packages, liquid crystal inlets, organic Sealants for EL, optical elements, electrical insulation, electronic parts, separation membranes, molding materials, putty, glass fiber impregnating agents, sealants, passivation films for semiconductors and solar cells, interlayers Insulating film, protective film, prism lens sheet used for backlight of liquid crystal display device, Fresnel label used for screen of projection TV, etc. Lens parts of lens sheets such as lens sheets, lenticular lens sheets, or backlights using such sheets, optical lenses such as micro lenses, optical elements, optical connectors, optical waveguides, castings for optical modeling, etc. Can be mentioned
- a transparent support As a display device, a transparent support, an undercoat layer, an antireflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coating layer, a lubricating layer, a protective layer, etc., as necessary
- cured material of this invention can be used for each layer.
- Compound (A1-1) Bisphenol type diglycidyl ether
- Compound (A2-1) Neopentyl glycol diglycidyl ether
- Compound (A3-1) Aron oxetane OXT-221 (manufactured by Toagosei Co., Ltd.)
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Abstract
Description
前記カチオン重合性成分(A)が、芳香族エポキシ化合物(A1)と、分子量200以上の多価アルコールのグリシジル化物、または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A2)と、オキセタン化合物(A3)と、を必須成分とし、前記芳香族エポキシ化合物(A1)が、前記カチオン重合性成分(A)と前記ラジカル重合性成分(C)の合計100質量部に対して、35~50質量部であり、
前記ラジカル重合性成分(C)が、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20であるアルコールのアクリル酸エステルあるいは炭素原子数2~20であるアルコールのメタクリル酸エステル(C2)を必須成分とすることを特徴とするものである。
より選ばれる一種以上であることが好ましい。
本発明の硬化性組成物は、カチオン重合性成分(A)20~90質量部と、カチオン重合開始剤(B)1~10質量部と、ラジカル重合性成分(C)1~30質量部と、ラジカル重合開始剤(D)0~10質量部とを、カチオン重合性成分(A)とラジカル重合性成分(C)の合計が100質量部となるように含有する。本発明の硬化性組成物においては、カチオン重合性成分(A)は、芳香族エポキシ化合物(A1)と、分子量200以上の多価アルコールのグリシジル化物、または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A2)と、オキセタン化合物(A3)と、を必須成分とし、かつ、芳香族エポキシ化合物(A1)が、カチオン重合性成分(A)とラジカル重合性成分(C)の合計100質量部に対して、35~50質量部である。また、ラジカル重合性成分(C)が、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20であるアルコールのアクリル酸エステルあるいは炭素原子数2~20であるアルコールのメタクリル酸エステル(C2)を必須成分とする。
[A]r+[B]r-
で表される陽イオンと陰イオンの塩を挙げることができる。
[(R1)aQ]r+
で表すことができる。
[LYb]r-
で表すことができる。
[LYb-1(OH)]r-
で表される構造のものも好ましく用いることができる。L,Y,bは上記と同様である。また、その他用いることのできる陰イオンとしては、過塩素酸イオン(ClO4)-、トリフルオロメチル亜硫酸イオン(CF3SO3)-、フルオロスルホン酸イオン(FSO3)-、トルエンスルホン酸陰イオン、トリニトロベンゼンスルホン酸陰イオン、カンファースルフォネート、ノナフロロブタンスルフォネート、ヘキサデカフロロオクタンスルフォネート、テトラアリールボレート、テトラキス(ペンタフルオロフェニル)ボレート等を挙げることができる。
下記の[表1]、[表2]に示す配合で各成分を十分に混合して、各々実施例1~9の硬化性組成物および比較例1~5の硬化性組成物を得た。なお、実施例および比較例の配合量の単位は質量部である。
化合物(A1-1):ビスフェノール型ジグリシジルエーテル
化合物(A2-1):ネオペンチルグリコールジグリシジルエーテル
化合物(A3-1):アロンオキセタンOXT-221(東亞合成(株)社製)
化合物B-1:下記式(3)で表される化合物および下記式(4)で表される化合物の混合物のプロピレンカーボネート50%溶液
化合物(C1-1):エポキシエステルM-600A(共栄社化学(株)社製)
化合物(C1-2):エポキシエステル70PA(共栄社化学(株)社製)
化合物(C1-3):エポキシエステル200PA(共栄社化学(株)社製)
化合物(C2-1):1,6-ヘキサンジオールジアクリレート
化合物(C2-2):4-ヒドロキシブチルアクリレート
化合物(C2-3):A-9300S(多官能アクリレート;新中村化学工業(株)社製)
化合物(C2-4):ビスコート#150(テトラヒドロフルフリルアクリレート;大阪有機化学工業(株)社製)
化合物(D-1):イルガキュア184(BASF社製)
得られた実施例1~9および比較例1~5の硬化性組成物のそれぞれについて、25℃における粘度をE型粘度計で測定した。結果を[表1]および[表2]に併記する。
上記で得られた実施例1~9および比較例1~5の硬化性組成物を、一枚のコロナ処理PMMAフィルム(住友化学株式会社:テクノロイ125S001)にそれぞれ塗布した後、もう一枚のコロナ放電処理を施したCOP(シクロオレフィンポリマー、日本ゼオン製:品番ゼオノアフィルム14-060)フィルムとラミネーターを用いて貼り合わせ、無電極紫外光ランプを用いて1000mJ/cm2に相当する光をCOPフィルム越しに照射して接着して試験片を得た。得られた試験片の90度ピール試験を行った。
上記で得られた実施例1~9および比較例1~5の硬化性組成物を、一枚のTACフィルム(富士フィルム:品番FT-TD60ULP)に塗布した後、もう一枚のコロナ放電処理を施したCOP(シクロオレフィンポリマー、日本ゼオン製:品番ゼオノアフィルム14‐060)フィルムとラミネーターを用いて貼り合わせ、無電極紫外光ランプを用いて150mJ/cm2に相当する光をCOPフィルム越しに照射して接着して硬化速度を評価した。照射30秒未満で、剥がす際に抵抗を感じる場合を○、30秒以上でも容易にはがせる場合を×として評価した。硬化時間が短いほど、硬化性が良好なことを意味する。
Claims (8)
- カチオン重合性成分(A)20~90質量部と、カチオン重合開始剤(B)1~10質量部と、ラジカル重合性成分(C)1~30質量部と、ラジカル重合開始剤(D)0~10質量部とを、前記カチオン重合性成分(A)と前記ラジカル重合性成分(C)の合計が100質量部となるように含有し、
前記カチオン重合性成分(A)が、芳香族エポキシ化合物(A1)と、分子量200以上の多価アルコールのグリシジル化物、または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A2)と、オキセタン化合物(A3)と、を必須成分とし、前記芳香族エポキシ化合物(A1)が、前記カチオン重合性成分(A)と前記ラジカル重合性成分(C)の合計100質量部に対して、35~50質量部であり、
前記ラジカル重合性成分(C)が、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20であるアルコールのアクリル酸エステルあるいは炭素原子数2~20であるアルコールのメタクリル酸エステル(C2)を必須成分とすることを特徴とする硬化性組成物。 - 前記カチオン重合性成分(A1)が、多官能芳香族エポキシ化合物である請求項1記載の硬化性組成物。
- 前記オキセタン化合物(A3)が、多官能オキセタン化合物である請求項1記載の硬化性組成物。
- 前記炭素原子数2~20であるアルコールのアクリル酸エステルあるいは炭素原子数2~20であるアルコールのメタクリル酸エステル(C2)が、環状構造を有するアクリル酸エステルまたはメタクリル酸エステルである請求項1記載の硬化性組成物。
- 請求項1~5のうちいずれか一項記載の硬化性組成物に、活性エネルギー線を照射することを特徴とする硬化性組成物の硬化方法。
- 請求項1~5のうちいずれか一項記載の硬化性組成物を、加熱することを特徴とする硬化性組成物の硬化方法。
- 請求項1~5のうちいずれか一項記載の硬化性組成物の硬化物であることを特徴とする硬化物。
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- 2017-03-30 WO PCT/JP2017/013284 patent/WO2017170879A1/ja not_active Ceased
- 2017-03-30 KR KR1020187026681A patent/KR102265025B1/ko active Active
- 2017-03-30 CN CN201780018739.7A patent/CN108884297B/zh active Active
- 2017-03-30 JP JP2018509442A patent/JP6883020B2/ja active Active
- 2017-03-31 TW TW106111177A patent/TWI732844B/zh active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2017179202A (ja) * | 2016-03-31 | 2017-10-05 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
| JP7008398B2 (ja) | 2016-03-31 | 2022-01-25 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
| EP3418782B1 (en) * | 2016-12-26 | 2023-05-03 | LG Chem, Ltd. | Polarizer protection film, polarizing plate comprising the same, liquid crystal display comprising the polarizing plate, and coating composition for polarizer protecting film |
| JP2022042418A (ja) * | 2020-09-02 | 2022-03-14 | 株式会社Adeka | 組成物、硬化物、硬化物の製造方法 |
| JP7594388B2 (ja) | 2020-09-02 | 2024-12-04 | 株式会社Adeka | 組成物、硬化物、硬化物の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017170879A1 (ja) | 2019-02-14 |
| CN108884297A (zh) | 2018-11-23 |
| JP6883020B2 (ja) | 2021-06-02 |
| KR20180132635A (ko) | 2018-12-12 |
| CN108884297B (zh) | 2020-08-14 |
| TW201807140A (zh) | 2018-03-01 |
| KR102265025B1 (ko) | 2021-06-14 |
| TWI732844B (zh) | 2021-07-11 |
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