WO2017150382A1 - 面発光レーザ - Google Patents
面発光レーザ Download PDFInfo
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- WO2017150382A1 WO2017150382A1 PCT/JP2017/007164 JP2017007164W WO2017150382A1 WO 2017150382 A1 WO2017150382 A1 WO 2017150382A1 JP 2017007164 W JP2017007164 W JP 2017007164W WO 2017150382 A1 WO2017150382 A1 WO 2017150382A1
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18358—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] containing spacer layers to adjust the phase of the light wave in the cavity
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
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- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4006—Injection locking
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- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
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- H01S5/00—Semiconductor lasers
- H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30
- H01S5/5063—Amplifier structures not provided for in groups H01S5/02 - H01S5/30 operating above threshold
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18344—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
- H01S5/1835—Non-circular mesa
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18363—Structure of the reflectors, e.g. hybrid mirrors comprising air layers
- H01S5/18366—Membrane DBR, i.e. a movable DBR on top of the VCSEL
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18375—Structure of the reflectors, e.g. hybrid mirrors based on metal reflectors
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18377—Structure of the reflectors, e.g. hybrid mirrors comprising layers of different kind of materials, e.g. combinations of semiconducting with dielectric or metallic layers
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- H01S5/00—Semiconductor lasers
- H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30
- H01S5/5045—Amplifier structures not provided for in groups H01S5/02 - H01S5/30 the arrangement having a frequency filtering function
Definitions
- the present invention relates to a surface-emitting type semiconductor laser, and more particularly to its high output.
- the single wavelength output of a surface emitting laser has been limited to the mW level. If watt-class high-power operation is possible, laser radar (LIDAR) mounted on wavelength scanning light source for optical tomography (OCT), light source for medium- and long-distance optical communication, automobiles, drones, robots, etc. ) Light source, monitoring system, automatic inspection device at the manufacturing site, laser dryer for printer, etc.
- LIDAR laser radar
- OCT optical tomography
- Non-Patent Document 1 that suppresses higher-order mode oscillation by performing surface processing has been proposed, but the area size of 10 microns or less is the limit, The output cannot exceed 10 mW.
- an array structure in which a large number of surface emitting lasers are two-dimensionally integrated can achieve a high output of 10 W or more, but because the phase and wavelength of each element are not uniform, oscillation There are problems such as a wide spectrum width, a large beam divergence angle, and a lens that cannot be focused.
- Non-patent Document 3 A surface emitting laser using a two-dimensional photonic crystal (Non-patent Document 3) achieves a watt-class high output and good beam quality, but it is necessary to form a fine periodic structure in a semiconductor, In manufacturing, there is a problem from the viewpoint of reliability.
- Non-Patent Documents 4 and 5 a surface emitting laser with an optical amplification function in which a VCSEL (vertical cavity surface emitting laser) and a slow light SOA (semiconductor optical amplifier) are arranged in the lateral direction of the substrate.
- VCSEL vertical cavity surface emitting laser
- SOA semiconductor optical amplifier
- the present invention has been made in such a situation, and one of exemplary purposes of an embodiment thereof is to provide a surface emitting laser having a high output.
- the surface emitting laser includes an output unit having a horizontally long VCSEL (vertical cavity surface emitting laser) structure, and a drive circuit that injects a current larger than an oscillation threshold value into the VCSEL structure of the output unit and maintains the oscillation state.
- VCSEL vertical cavity surface emitting laser
- the output unit receives coherent seed light at one end in the longitudinal direction of the VCSEL structure, propagates slow light in the longitudinal direction of the VCSEL structure while performing multiple reflection in the vertical direction within the VCSEL structure, and from the upper surface of the VCSEL structure. Take out the output light.
- the vertical, horizontal, horizontal, and vertical directions in this specification are for convenience not related to directions during actual operation.
- high output can be obtained by operating as an amplifier that amplifies seed light from the outside in a state where the output portion of the VCSEL structure is laser-oscillated.
- the wavelength ⁇ 1 of the seed light and the oscillation wavelength ⁇ 2 of the VCSEL structure of the output unit may satisfy ⁇ 1 ⁇ ⁇ 2. Thereby, it can suppress that the light couple
- the seed light source that generates the seed light may be integrated adjacent to the longitudinal direction while sharing the VCSEL structure with the output unit. Thereby, the surface emitting laser can be further reduced in size and cost.
- the wavelength ⁇ 1 of the seed light and the oscillation wavelength ⁇ 2 of the VCSEL structure of the output unit may satisfy ⁇ 1 ⁇ 2. Thereby, suppression (isolation) of return light from the output unit to the seed light source can be increased, and beam quality can be improved.
- the VCSEL structure of the seed light source and the output unit may have an air gap layer, and the thickness of the air gap layer on the seed light source side may be variable by a micromachine structure. Thereby, ⁇ 1 ⁇ 2 can be realized.
- the VCSEL structure of the seed light source and the output unit may have a different number of layers in the seed light source and the output unit. More specifically, the upper DBR (Distributed Bragg Reflector) of the VCSEL structure of the output unit may have more layers than the upper DBR of the VCSEL structure of the seed light source. Thereby, ⁇ 1 ⁇ 2 can be realized.
- the upper DBR Distributed Bragg Reflector
- the VCSEL structure on the seed light source side may include a low refractive index layer. Thereby, ⁇ 1 ⁇ 2 can be realized.
- the seed light source may have a composite resonator structure. Thereby, ⁇ 1 ⁇ 2 can be realized.
- the output part may be bent zigzag. As a result, higher output can be obtained in a smaller area.
- the refractive index of the optical confinement layer constituting the active layer VCSEL structure may be smaller than the average refractive index of the upper DBR and the lower DBR. Thereby, the waveguide mode by total reflection can be cut off.
- At least one of good beam quality, narrow spectrum width, and high output can be obtained.
- This surface emitting laser includes an output portion having a horizontally long VCSEL (vertical cavity surface emitting laser) structure.
- the output unit operates in an oscillation state in which a current larger than the oscillation threshold is injected.
- the output unit receives coherent seed light at one end in the longitudinal direction of the VCSEL structure, propagates slow light in the longitudinal direction of the VCSEL structure while performing multiple reflection in the vertical direction within the VCSEL structure, and from the upper surface of the VCSEL structure. Take out the output light.
- this surface emitting laser by maintaining the oscillation state, highly efficient optical amplification is possible and high output can be obtained. Further, by inputting coherent light having a single wavelength wavefront as seed light, it is possible to obtain output light with high output and high beam quality with uniform wavefront.
- FIG. 1 is a cross-sectional view of a surface emitting laser 1 according to an embodiment.
- a first surface emitting laser hereinafter referred to as a seed light source 2
- a second surface emitting laser hereinafter referred to as an output unit 4
- the output unit 4 has a horizontally long VCSEL (vertical cavity surface emitting laser) structure 40.
- the length of the output unit 4 may be about 1000 times the length of the seed light source 2.
- the VCSEL structure 40 includes a lower DBR (Distributed Bragg Reflector) 26, an active layer 42, and an upper DBR 44 formed on the semiconductor substrate 10.
- DBR Distributed Bragg Reflector
- the seed light source 2 has a VCSEL structure 20 common to the output unit 4 and generates coherent seed light L1. Inside the seed light source 2, the light is repeatedly reflected in the vertical direction and amplified by stimulated emission, and a part of the light is sent to one end (coupling surface 3) in the longitudinal direction of the VCSEL structure of the adjacent output unit 4 as the seed light L 1. Join.
- the VCSEL structure 20 on the seed light source 2 side includes a lower DBR 26, an active layer 22, and an upper DBR 24 formed on the semiconductor substrate 10.
- a high reflection mirror 30 is formed on the upper surface of the upper DBR 24.
- the high reflection mirror 30 is preferably a metal such as gold (Au) or a dielectric multilayer mirror.
- the drive circuit 5 injects a current I DRV larger than the oscillation threshold I TH into the VCSEL structure 40 of the output unit 4 to operate in the oscillation state.
- the output unit 4 receives the seed light L1 on the coupling surface 3, and propagates the seed light L1 in the longitudinal direction of the VCSEL structure 40 while performing multiple reflection in the vertical direction in the VCSEL structure.
- the output light L2 is extracted from the upper surface of the VCSEL structure 40.
- the upper reflective surface, ie, the upper DBR 44 of the cavity of the output unit 4 may be designed with a reflectivity of about 95 to 99%, for example.
- the wavelength ⁇ 1 of the seed light L1 and the oscillation wavelength ⁇ 2 of the VCSEL structure of the output unit 4 satisfy ⁇ 1 ⁇ ⁇ 2.
- the seed light source 2 and the output unit 4 are integrated in the horizontal direction. In the structure to be converted, it is preferable that ⁇ 1 ⁇ 2. Thereby, the return light from the output unit 4 to the seed light source 2 is suppressed, and the beam quality can be improved.
- the semiconductor substrate 10 is a III-V group semiconductor and may be a GaAs substrate.
- An n-side electrode (not shown) is formed on the back surface of the semiconductor substrate 10.
- the active layer 22 (42) has a multiple quantum well structure of In 0.2 Ga 0.8 As / GaAs (indium gallium arsenide / gallium arsenide).
- the active layer 22 (42) may have a three-layer quantum well structure.
- a lower spacer layer and an upper spacer layer which are undoped Al 0.3 Ga 0.7 As layers are formed on both sides of the multiple quantum well structure as necessary.
- the operation of the surface emitting laser 1 in FIG. 1 will be described.
- a light intensity distribution as indicated by reference numeral 100 is generated, and a part thereof oozes out as seed light L1 on the output unit 4 side.
- a current I larger than the threshold current ITH is injected to enter an oscillation state.
- the spontaneous emission light generated at the output unit 4 and the stimulated emission light using it as a seed are reflected and amplified in the vertical direction, and the light L3 having the wavelength ⁇ 2 Is emitted.
- the surface emitting laser 1 of FIG. 1 oscillation using the seed light L1 coupled to the coupling surface 3 of the output unit 4 as a seed is dominant instead of spontaneous emission, and therefore the light L3 having the wavelength ⁇ 2 is suppressed. . Then, the seed light L1 is amplified while performing multiple reflection in the vertical direction and slow light propagation in the right direction in the drawing. The amplified light L2 is emitted from the upper surface of the output unit 4.
- FIG. 2 is a diagram showing input / output characteristics of the output unit 4 of the surface emitting laser 1 of FIG.
- the horizontal axis represents the intensity of the combined light, that is, the seed light L1
- the vertical axis represents the light output of the surface emitting laser 1.
- the amplification characteristics in the prior art are indicated by dotted lines.
- a current smaller than the threshold current I TH is supplied to the slow light SOA, which limits the light output to a small level.
- a high output operation can be realized by oscillating the output unit 4 and saturating the gain with respect to the coupled light intensity.
- FIG. 3 is a diagram showing a measurement system used in the experiment.
- An electrode 50 for current injection is formed on the upper surface of the output unit 4.
- the seed light L1 from the light source formed outside the output unit 4 is incident on the coupling surface 3 of the output unit 4 at an appropriate angle.
- the seed light L1 was coupled to the output unit 4 using an optical fiber.
- the output light L2 is measured by the photodetector 6.
- the region that is sandwiched between the electrodes 50 contributes to amplification.
- the produced output portion 4 has a lateral length L of 1 mm.
- the emission angle of the output light L2 depends on the wavelength ⁇ 1 of the seed light L1.
- the oscillation wavelength ⁇ 2 of the output unit 4 is 980 nm.
- FIG. 4A shows the amplification characteristics of the output unit 4
- FIG. 4B shows the spectrum of the output light L2
- FIG. 4C shows the beam angle and beam width. 4A to 4C show the measurement results.
- the horizontal axis indicates the intensity of the combined light (seed light) L1
- the vertical axis indicates the intensity of the output light L2.
- the injection current is 180 mA. From the saturation characteristic of the gain, it can be seen that the output unit 4 operates in the oscillation state. An output light L2 exceeding 30 mW is obtained with respect to a combined light intensity of 1 mW, and a significantly higher output can be obtained as compared with the prior art having a similar structure.
- the output light L2 has a single wavelength with a narrow spectral width.
- high beam quality with a beam width of about 0.1 ° is obtained without condensing light by an optical system such as a lens.
- FIG. 5 is a diagram illustrating a simulation result of the amplification characteristic of the output unit 4.
- FIG. 6 is a sectional view of the surface emitting laser 1a according to the first embodiment.
- the VCSEL structures 20 and 40 of the seed light source 2a and the output unit 4a have air gap layers 28 and 48, and the seed light source 2a side has a micromachine structure, so-called MEMS (Micro Electro Mechanical Systems) structure.
- MEMS Micro Electro Mechanical Systems
- the thickness of the air gap layer 28 is variable. By changing the thickness of the air gap layer 28, the position of the high reflection mirror 30 can be controlled, thereby changing the cavity length of the seed light source 2a and shortening the oscillation wavelength ⁇ 1.
- the drive circuit 5 is omitted.
- FIG. 7 is a sectional view of the surface emitting laser 1b according to the second embodiment.
- the upper DBR 44 of the VCSEL structure 40 of the output unit 4b may have more layers than the upper DBR 24 of the VCSEL structure of the seed light source 2b.
- the difference between the upper DBR 44 and the upper DBR 24 is shown as a phase control layer 52.
- the phase control layer 52 can be formed by selective growth. According to the second embodiment, ⁇ 1 ⁇ 2 can be realized by increasing the cavity length of the output unit 4b.
- FIG. 8 is a cross-sectional view of the surface emitting laser 1c according to the third embodiment.
- the VCSEL structure 20 of the seed light source 2c includes a low refractive index layer 54.
- the low refractive index layer 54 is a part of the upper DBR 24 and can be formed by selective oxidation. By forming the refractive index of a part of the upper DBR 24 low, the effective cavity length of the seed light source 2c can be shortened, and ⁇ 1 ⁇ 2 can be realized.
- FIG. 9 is a plan view of the surface emitting laser 1d according to the fourth embodiment.
- the seed light source 2d has a composite resonator structure.
- the composite resonator can be designed by the shape of the oxidation opening 56.
- the wavelength of the seed light source 2d is modulated (Vernier effect), and ⁇ 1 ⁇ It can be ⁇ 2.
- FIG. 10 is a layout diagram of the surface emitting laser 1e according to the fifth embodiment.
- the output unit 4e is laid out two-dimensionally.
- the output part 4e is bent zigzag, and the length L is thereby extended.
- output light L2 having a very small divergence angle can be obtained from the output unit 4e. Therefore, the output unit 4e is two-dimensionally arranged to provide two-dimensional narrow emission.
- FIG. 11 is a diagram showing a cross-sectional structure of the surface emitting laser 1f according to the sixth embodiment.
- the refractive index of the light confinement layer constituting the active layer 42 is smaller than the average refractive index of the upper DBR layer 44 and the lower DBR layer 46.
- the waveguide mode by total reflection can be cut off.
- the guided mode cutoff it is possible to reduce the consumption of energy by lateral parasitic oscillation, or amplified spontaneous growth of the emitted light L 4 by a waveguide mode.
- the output light from the surface emitting laser can be increased by increasing the length of the surface emitting laser.
- FIGS. 12A and 12B are diagrams showing simulation results of the refractive index distribution and electric field distribution of the surface emitting laser of FIG.
- FIG. 12B is an enlarged view of FIG.
- the horizontal axes in FIGS. 12A and 12B represent relative positions in the stacking direction.
- FIG. 13 is a diagram showing a simulation result of the optical confinement coefficient of the surface emitting laser of FIG.
- the horizontal axis represents the Al composition of the active region, and the vertical axis represents the optical confinement factor.
- the optical confinement factor was calculated for each of the waveguide mode light (i) and the slow light mode light (ii).
- the waveguide mode by total reflection can be cut off by making the refractive index of the light confinement layer smaller than the average refractive index of the upper DBR and the lower DBR.
- the Al composition of the optical confinement layer For example, by setting the Al composition of the optical confinement layer to about 0.55, the optical confinement factor of the waveguide mode becomes almost zero, and the optical confinement factor for the seed light can be maintained at a constant value of 4% (0.04). ing. Thereby, the amplified spontaneous emission light by the waveguide mode can be suppressed and the seed light can be amplified.
- the seed light source 2 and the output unit 4 do not necessarily have to be integrated, and they may be separated as shown in FIG.
- DESCRIPTION OF SYMBOLS 1 ... Surface emitting laser, 2 ... Seed light source, 4 ... Output part, 5 ... Drive circuit, 6 ... Photo detector, 8 ... Optical system, 10 ... Semiconductor substrate, 20 ... VCSEL structure, 22 ... Active layer, 24 ... Upper DBR, 26 ... Lower DBR, 28 ... Air gap layer, 30 ... High reflection mirror, 40 ... VCSEL structure, 42 ... Active layer, 44 ... Upper DBR, 46 ... Lower DBR, 48 ... Air gap layer, 50 ... Electrode, 52 ... Phase Control layer, 54 ... low refractive index layer, L1 ... seed light, L2 ... output light.
- the present invention can be used for a laser device.
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Abstract
Description
なお、本明細書における上下、横方向、水平方向、垂直方向は、実動作時における方向とは無関係な便宜的なものである。
はじめに実施の形態に係る面発光レーザの概要を説明する。この面発光レーザは、横長のVCSEL(垂直共振器面発光レーザ)構造の出力部を備える。出力部は、発振しきい値より大きな電流が注入された発振状態で動作する。出力部は、VCSEL構造の長手方向の一端にコヒーレントなシード光を受け、シード光をVCSEL構造内で垂直方向に多重反射させながら、VCSEL構造の長手方向にスローライト伝搬させ、VCSEL構造の上面から出力光を取り出す。
図1は、実施の形態に係る面発光レーザ1の断面図である。この面発光レーザ1は、第1の面発光レーザ(以下、シード光源2と称する)と第2の面発光レーザ(以下、出力部4と称する)を、同一半導体基板上に、横方向に形成したものである。概要で述べたように出力部4は、横長のVCSEL(垂直共振器面発光レーザ)構造40を有している。出力部4の長さは、シード光源2の長さの1000倍程度としてもよい。VCSEL構造40は、半導体基板10上に形成された下部DBR(Distributed Bragg Reflector)26、活性層42、上部DBR44を備える。
図6は、第1実施例に係る面発光レーザ1aの断面図である。この面発光レーザ1aにおいて、シード光源2aおよび出力部4aのVCSEL構造20,40は、エアギャップ層28,48を有し、マイクロマシン構造、いわゆるMEMS(Micro Electro Mechanical Systems)構造により、シード光源2a側のエアギャップ層28の厚みが可変に構成される。エアギャップ層28の厚みを変化させることで、高反射ミラー30の位置を制御でき、これによりシード光源2aのキャビティ長が変化し、発振波長λ1を短くできる。なお以降の図では、駆動回路5を省略する。
図7は、第2実施例に係る面発光レーザ1bの断面図である。この面発光レーザ1bにおいて、出力部4bのVCSEL構造40の上部DBR44は、シード光源2bのVCSEL構造の上部DBR24よりも層数が多くてもよい。上部DBR44と上部DBR24の差分は、位相制御層52として示されている。位相制御層52は、選択成長によって形成することができる。第2実施例によれば、出力部4bのキャビティ長を長くすることにより、λ1<λ2を実現できる。
図8は、第3実施例に係る面発光レーザ1cの断面図である。この面発光レーザ1cにおいて、シード光源2cのVCSEL構造20は、低屈折率層54を含む。低屈折率層54は、上部DBR24の一部であり、選択酸化により形成することができる。上部DBR24の一部の層の屈折率を低く形成することにより、シード光源2cの実効的なキャビティ長を短くでき、λ1<λ2を実現できる。
図9は、第4実施例に係る面発光レーザ1dの平面図である。この面発光レーザ1dにおいて、シード光源2dは複合共振器構造を有する。複合共振器は、酸化開口56の形状によって設計できる。複合共振器の干渉状態を制御することにより、具体的には、2個の共振器のFSR(自由スペクトル間隔)を異ならしめることによって、シード光源2dの波長を変調し(バーニア効果)、λ1<λ2とすることができる。
図5に示したように、出力部4の横方向の長さLを長くするほど、高出力を取り出すことが可能である。図10は、第5実施例に係る面発光レーザ1eのレイアウト図である。出力部4eは、2次元的にレイアウトされる。たとえば出力部4eは、ジグザグに折り曲げられており、これにより長さLが伸ばされている。図4(c)に示したように、出力部4eからは、広がり角のきわめて小さな出力光L2を得ることができ、したがって出力部4eを2次元的に配置することで、2次元的狭出射で高出力なビームを生成できる。このようなビームは、レンズやミラー等の光学系8で集光することにより、回折限界近くまで絞ることも可能であり、多くの用途が期待される。
図11は、第6実施例に係る面発光レーザ1fの断面構造を示す図である。この実施例では、活性層42を構成する光閉じ込め層の屈折率が、上部DBR層44、下部DBR層46の平均屈折率よりも小さくなっている。これにより、全反射による導波モードをカットオフにすることができる。導波モードをカットオフにすることで、導波モードによる横方向の寄生発振、あるいは増幅自然放出光L4の成長によるエネルギーの消費を抑制することができる。その結果、当該面発光レーザの長さを長くすることで、面発光レーザからの出力光を増大できる。
シード光源2と出力部4は必ずしも集積化される必要はなく、図3に示したように、それらは分離していてもよい。
Claims (10)
- 横長のVCSEL(垂直共振器面発光レーザ)構造の出力部と、
前記VCSEL構造に、発振しきい値より大きな電流を注入し、発振状態を維持する駆動回路と、
を備え、
前記出力部は、前記VCSEL構造の長手方向の一端にコヒーレントなシード光を受け、前記シード光を前記VCSEL構造内で垂直方向に多重反射させながら、前記VCSEL構造の長手方向にスローライト伝搬させ、前記VCSEL構造の上面から出力光を取り出すことを特徴とする面発光レーザ。 - 前記シード光の波長λ1と前記出力部のVCSEL構造の発振波長λ2は、λ1≠λ2を満たすことを特徴とする請求項1に記載の面発光レーザ。
- 前記シード光を生成するシード光源は、前記出力部と前記VCSEL構造を共有して前記長手方向に隣接して集積化されることを特徴とする請求項1に記載の面発光レーザ。
- 前記シード光の波長λ1と前記出力部のVCSEL構造の発振波長λ2は、λ1<λ2を満たすことを特徴とする請求項3に記載の面発光レーザ。
- 前記シード光源および前記出力部の前記VCSEL構造は、エアギャップ層を有し、マイクロマシン構造により、前記シード光源側の前記エアギャップ層の厚みが可変に構成されることを特徴とする請求項3または4に記載の面発光レーザ。
- 前記出力部の前記VCSEL構造の上部DBR(Distributed Bragg Reflector)は、前記シード光源の前記VCSEL構造の上部DBRよりも層数が多いことを特徴とする請求項3または4に記載の面発光レーザ。
- 前記シード光源の前記VCSEL構造は、低屈折率層を含むことを特徴とする請求項3または4に記載の面発光レーザ。
- 前記シード光源は、複合共振器構造を有することを特徴とする請求項3または4に記載の面発光レーザ。
- 前記出力部は、ジグザグに折り曲げられていることを特徴とする請求項1から8のいずれかに記載の面発光レーザ。
- 前記活性層VCSEL構造を構成する光閉じ込め層の屈折率は、前記上部DBR、前記下部DBRの平均屈折率よりも小さく、全反射による導波モードをカットオフにすることを特徴とする請求項1に記載の面発光レーザ。
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| JP2019074361A (ja) * | 2017-10-13 | 2019-05-16 | 国立大学法人東京工業大学 | 3次元計測用プロジェクタおよび3次元計測装置 |
| CN110620332A (zh) * | 2018-06-19 | 2019-12-27 | 富士施乐株式会社 | 半导体光放大器、光输出装置以及距离测量装置 |
| JP2022043541A (ja) * | 2020-09-04 | 2022-03-16 | 国立大学法人東京工業大学 | 半導体レーザおよび光デバイス |
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| JP2019046880A (ja) * | 2017-08-30 | 2019-03-22 | 国立大学法人東京工業大学 | 面発光レーザ |
| JP7239920B2 (ja) * | 2019-03-01 | 2023-03-15 | 富士フイルムビジネスイノベーション株式会社 | 半導体光増幅素子、半導体光増幅器、光出力装置、および距離計測装置 |
| CN111478180B (zh) * | 2020-04-23 | 2022-06-10 | 西安电子科技大学 | 片上集成慢光波导的半导体激光器 |
| IL310710B2 (en) | 2024-02-07 | 2025-12-01 | Semiconductor Devices Ltd | Surface Beam-Based Laser System |
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