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WO2017006392A1 - Dispositif d'émission de lumière - Google Patents

Dispositif d'émission de lumière Download PDF

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Publication number
WO2017006392A1
WO2017006392A1 PCT/JP2015/069301 JP2015069301W WO2017006392A1 WO 2017006392 A1 WO2017006392 A1 WO 2017006392A1 JP 2015069301 W JP2015069301 W JP 2015069301W WO 2017006392 A1 WO2017006392 A1 WO 2017006392A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
wiring
substrate
terminal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/069301
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English (en)
Japanese (ja)
Inventor
中村　毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Priority to JP2017526800A priority Critical patent/JPWO2017006392A1/ja
Priority to PCT/JP2015/069301 priority patent/WO2017006392A1/fr
Publication of WO2017006392A1 publication Critical patent/WO2017006392A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals

Definitions

  • the present invention relates to a light emitting device.
  • the organic EL element has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode.
  • a voltage between the first electrode and the second electrode it is necessary to apply a voltage between the first electrode and the second electrode.
  • a plurality of first terminals are provided by providing a first terminal for each side of a rectangular light emitting section, and the plurality of first terminals are different from each other of the first electrodes.
  • a plurality of second terminals are provided, and the plurality of second terminals are connected to different portions of the second electrode.
  • each of the plurality of first terminals is connected to a lead wiring or the like, and each of the plurality of second terminals is connected. It is necessary to connect lead wiring to the cable.
  • a plurality of first terminals and second terminals are formed in the light emitting device, and the number of lead wires and the like increases, so that the work for connecting the control unit and the lead wires becomes complicated, and the light emitting device It will be complicated.
  • Patent Document 1 describes that second terminals are arranged at four corners of a rectangular substrate, and first terminals are arranged at portions along the side of the substrate.
  • the terminals respectively installed at the four corners are connected to each other via the second conductive layer formed on the light emitting part, and the terminals respectively installed on the four sides are also formed on the light emitting part.
  • the first conductive layers are connected to each other.
  • the first metal layer and the second metal layer are, for example, a metal sheet having a thickness of 1 ⁇ m to 1 mm, or a sputtered film. Note that an insulating layer is formed between the first conductive layer and the second conductive layer in a region overlapping with the light emitting portion.
  • Patent Document 2 in a display device having an EL light emitting layer in a pixel, a plurality of first terminals are arranged along the first side of the substrate, and a plurality of second terminals are arranged along the second side of the substrate. It is described that the plurality of first terminals are arranged in a zigzag pattern, and the plurality of second terminals are arranged in a zigzag pattern.
  • connection structure for connecting the control unit of the light emitting unit and the light emitting unit is simplified while preventing in-plane distribution in the luminance of the light emitting unit. Difficult to do.
  • One of the objects of the present invention is to provide a novel structure capable of satisfying these two.
  • the invention according to claim 1 is a substrate; A light emitting unit formed on the substrate and having a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode; A plurality of first terminals formed on the substrate and electrically connected to the first electrode; A plurality of second terminals formed on the substrate and electrically connected to the second electrode; A first wiring disposed on the substrate and connected to the plurality of first terminals; A second wiring disposed on the substrate and connected to the plurality of second terminals; With Portions of the first wiring and the second wiring that are located on the same surface of the substrate are light emitting devices that do not overlap each other.
  • FIG. 6 is a plan view showing a configuration of a light emitting device according to Modification Example 1.
  • FIG. 8 is a sectional view taken along line AA in FIG. It is the figure which attached the 1st wiring and the 2nd wiring to the light-emitting device shown in FIG.
  • FIG. 12 is a plan view showing a configuration of a light emitting device according to Modification 2.
  • FIG. It is the figure which looked at the light-emitting device shown in FIG. 10 from the light-emitting surface side.
  • FIG. 11 is a diagram in which a second wiring and a first terminal region 212 are added to FIG. It is the figure which added the 1st wiring to FIG.
  • FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment.
  • FIG. 2 is a diagram illustrating a state in which the first wiring 210 and the second wiring 220 are attached to the light emitting device 10.
  • FIG. 3 is a view in which the sealing portion 160 is removed from FIG.
  • FIG. 4 is a view in which the second electrode 130 is removed from FIG.
  • FIG. 5 is a diagram in which the insulating layer 150 and the organic layer 120 are removed from FIG.
  • the light emitting device 10 includes a substrate 100, a light emitting unit 140, a plurality of first terminals 112, a plurality of second terminals 132, a first wiring 210, and a second wiring 220.
  • the light emitting unit 140 is formed on the substrate 100 and includes a first electrode 110, an organic layer 120, and a second electrode 130.
  • the organic layer 120 is located between the first electrode 110 and the second electrode 130.
  • the plurality of first terminals 112 are formed on the substrate 100, and all of the first terminals 112 are electrically connected to the first electrode 110.
  • the plurality of second terminals 132 are formed on the substrate 100, and all of them are electrically connected to the second electrode 130.
  • the first wiring 210 is disposed on the substrate 100 and is electrically connected to the plurality of first terminals 112.
  • the second wiring 220 is disposed on the substrate 100 and is electrically connected to the plurality of second terminals 132. And the part located in the same surface of the board
  • the substrate 100 is formed of a light-transmitting material such as glass or a light-transmitting resin.
  • the substrate 100 may be formed of a material that does not have translucency.
  • the substrate 100 is, for example, a polygon such as a rectangle.
  • the substrate 100 may have flexibility.
  • the thickness of the substrate 100 is, for example, not less than 10 ⁇ m and not more than 1000 ⁇ m.
  • the thickness of the substrate 100 is, for example, 200 ⁇ m or less.
  • the material of the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. Is formed.
  • an inorganic barrier film such as SiN x or SiON is formed on at least the light emitting surface (preferably both surfaces) of the substrate 100 in order to suppress moisture from passing through the substrate 100. ing.
  • the planar shape of the substrate 100 is a polygon, for example, a rectangle. However, the planar shape of the substrate 100 may be a circle or an ellipse. In the example shown in each figure, the substrate 100 is rectangular.
  • a light emitting unit 140 is formed on the substrate 100.
  • the light emitting unit 140 is a surface light source and has a structure for generating light emission, for example, an organic EL element.
  • This organic EL element has a configuration in which a first electrode 110, an organic layer 120, and a second electrode 130 are laminated in this order.
  • the first electrode 110 is a transparent electrode having optical transparency.
  • the transparent conductive material constituting the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide) or the like. is there.
  • the thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm.
  • the first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method.
  • the first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.
  • the second electrode 130 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 130 has a light shielding property.
  • the thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110.
  • the second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method.
  • the materials of the first electrode 110 and the second electrode 130 described above are used when light is transmitted through the substrate 100, that is, when light emission from the light emitting device 10 is performed through the substrate 100 (that is, bottom emission type). It is an example. In other cases, light may pass through the side opposite to the substrate 100. That is, the light emission from the light emitting device 10 is performed without passing through the substrate 100 (top emission type).
  • top emission type one of two types of stacked structures of a reverse product type and a forward product type can be adopted. In the reverse product type, the material of the first electrode 110 and the material of the second electrode 130 are opposite to those of the bottom emission type.
  • the material of the second electrode 130 is used as the material of the first electrode 110, and the material of the first electrode 110 is used as the material of the second electrode 130.
  • the material of the first electrode 110 is formed on the material of the second electrode 130, the organic layer 120 is further formed thereon, and the second electrode 130 is further formed thinly thereon.
  • the material for forming the thin film is, for example, the material exemplified as the material of the second electrode 130 or an MgAg alloy.
  • the thickness of the second electrode 130 is preferably 30 nm or less.
  • the light emitting device 10 according to the present embodiment may be of any structure of a bottom emission type and the two types of top emission types described above.
  • the organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order.
  • a hole transport layer may be formed between the hole injection layer and the light emitting layer.
  • an electron transport layer may be formed between the light emitting layer and the electron injection layer.
  • the organic layer 120 may be formed by a vapor deposition method.
  • at least one layer of the organic layer 120 for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition.
  • all the layers of the organic layer 120 may be formed using the apply
  • the edge of the first electrode 110 is covered with an insulating layer 150.
  • the insulating layer 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes a light emitting region of the light emitting unit 140. By providing the insulating layer 150, it is possible to suppress a short circuit between the first electrode 110 and the second electrode 130 at the edge of the first electrode 110.
  • the insulating layer 150 is formed by applying a resin material to be the insulating layer 150 and then exposing and developing the resin material. This step is performed, for example, after forming the first electrode 110 and before forming the organic layer 120.
  • the light emitting part 140 is sealed by a sealing part 160.
  • the sealing portion 160 is formed using, for example, a metal such as glass or aluminum, or a resin.
  • the sealing portion 160 is a polygon or a circle similar to that of the substrate 100 and has a shape in which a recess is provided at the center.
  • the edge of the sealing portion 160 is fixed to the substrate 100 with an adhesive. Thereby, the space surrounded by the sealing portion 160 and the substrate 100 is sealed. And the light emission part 140 is located in this sealed space.
  • the sealing part 160 may be a sealing film.
  • the sealing film is formed of, for example, an insulating material, more specifically, an inorganic material such as aluminum oxide or titanium oxide.
  • the thickness of the sealing film is preferably 300 nm or less. Moreover, the thickness of the sealing film is, for example, 50 nm or more.
  • the sealing film is formed using, for example, an ALD (Atomic Layer Deposition) method, but may be formed using another film forming method such as a CVD method or a sputtering method.
  • the light emitting device 10 has a first terminal 112 and a second terminal 132 in a region of the substrate 100 located outside the sealing portion 160.
  • the first terminal 112 is electrically connected to the first electrode 110
  • the second terminal 132 is electrically connected to the second electrode 130.
  • the first terminal 112 and the second terminal 132 are formed using, for example, Au, An, or Al.
  • the first terminal 112 and the second terminal 132 may be formed of a metal multilayer film.
  • the first terminal 112 and the second terminal 132 are both disposed along the edge of the substrate 100. Specifically, the first terminal 112 and the second terminal 132 are both arranged along at least two sides (preferably all sides) of the substrate 100. In the example shown in FIGS. 1 to 5, the second terminal 132 is disposed in a region including the central portion of each side of the substrate 100, and the first terminal 112 is disposed near the corner of the substrate 100. Yes.
  • the first terminal 112 when viewed in a direction along the side of the substrate 100, the first terminal 112 is disposed so as to sandwich the second terminal 132 for each side of the substrate 100. Further, the first terminal 112 (first first terminal 112) and the second terminal 132 (first second terminal 132) arranged along the first side of the substrate 100 are included in the edge of the substrate 100. A first terminal 112 (second first terminal 112) and a second terminal 132 which are located between the portion serving as the first side and the light emitting unit 140 and are disposed along the second side of the substrate 100. The (second second terminal 132) is located between the light emitting unit 140 and the portion of the edge of the substrate 100 that becomes the second side.
  • the second terminals 132 arranged along a certain side are located closer to the light emitting unit 140 than the first terminals 112 arranged along the side.
  • the first second terminal 132 is located closer to the light emitting unit 140 than the first first terminal 112
  • the second second terminal 132 is closer to the light emitting unit 140 than the second first terminal 112. Located nearby.
  • the difference between the distance from the light emitting unit 140 to the first terminal 112 and the distance from the light emitting unit 140 to the second terminal 132 is equal to or greater than the width of the first wiring 210. Thereby, a space through which the first wiring 210 is passed is provided between the second terminal 132 and the edge of the substrate 100.
  • a first lead wire 114 is provided between the first terminal 112 and the first electrode 110, and a second lead is provided between the second terminal 132 and the second electrode 130.
  • a wiring 134 is provided. Since both the first lead wiring 114 and the second lead wiring 134 are formed in the same process as the first electrode 110, they are formed using the same transparent electrode material as the first electrode 110.
  • the first terminal 112 is formed on the first lead wire 114, and the second terminal 132 is formed on the second lead wire 134.
  • the first lead-out wiring 114 is located at the corner of the substrate 100.
  • the first electrode 110, the first terminal 112, and the first lead wiring 114 are formed as one transparent conductive layer.
  • the second terminal 132 is separated from the transparent conductive layer.
  • the transparent conductive layer to be the first electrode 110, the first terminal 112, and the first lead-out wiring 114 is a part of a polygonal edge having the same number of sides as the substrate 100 (however, a corner portion). (Not).
  • the 2nd lead-out wiring 134 is arrange
  • the plurality of first terminals 112 are connected to each other using the first wiring 210
  • the plurality of second terminals 132 are connected to each other using the second wiring 220.
  • the first wiring 210 and the second wiring 220 are, for example, tape-shaped members.
  • the first wiring 210 and the first terminal 112 are fixed to each other using, for example, a conductive adhesive.
  • the second wiring 220 and the second terminal 132 are also fixed to each other using, for example, a conductive adhesive.
  • the structure for connecting the first wiring 210 to the first terminal 112 and the structure for connecting the second wiring 220 to the second terminal 132 are not limited thereto.
  • the first wiring 210 and the second wiring 220 at least the surface (first surface) facing the substrate 100 has conductivity.
  • the surface (second surface) opposite to the substrate 100 of the first wiring 210 and the second wiring 220 has an insulating property except for a first terminal region 212 and a second terminal region 222 described later. It is preferable.
  • the first wiring 210 and the second wiring 220 are formed using a thin metal (for example, copper) or a material obtained by plating a metal (for example, a surface of copper plated with gold or tin). ing.
  • the first wiring 210 and the second wiring 220 can be easily connected to the first conductive member 310 and the second conductive member 320 described later using solder or the like.
  • the first wiring 210 and the second wiring 220 may be formed by forming an insulating layer on one surface of the metal tape using, for example, a coating method. Good.
  • the first wiring 210 and the second wiring 220 may be conductive cloth adhesive tape.
  • the plurality of first terminals 112 are arranged so that they can be connected by a single stroke, and the plurality of second terminals 132 are also arranged so that they can be connected by a single stroke. Therefore, the first wiring 210 can be connected to all the first terminals 112 by extending so as to connect the adjacent first terminals 112.
  • the second wiring 220 can be connected to all the second terminals 132 by extending so as to connect the adjacent second terminals 132.
  • substrate 100 among the 1st wiring 210 and the 2nd wiring 220 is folded in order to bend the 1st wiring 210 and the 2nd wiring 220.
  • the first wiring 210 and the second wiring 220 are both disposed on the same surface of the substrate 100 as the light emitting unit 140. As described above, the first terminal 112 is disposed farther from the light emitting unit 140 than the second terminal 132. Therefore, even if the first terminals 112 are connected to each other using the first wiring 210, the first wiring 210 is located between the second wiring 220 and each side of the substrate 100. For this reason, the first wiring 210 does not overlap the second wiring 220.
  • the first wiring 210 is provided with a first terminal region 212
  • the second wiring 220 is provided with a second terminal region 222.
  • One end of the first conductive member 310 is connected to the first terminal region 212
  • one end of the second conductive member 320 is connected to the second terminal region 222.
  • the first conducting member 310 and the second conducting member 320 are, for example, lead wires or lead frames.
  • the other end of the first conducting member 310 and the other end of the second conducting member 320 are both connected to a terminal of a control unit that controls the light emitting unit 140 (for example, a terminal of a control circuit board).
  • the first terminal region 212 is a region that conducts vertically in the first wiring 210
  • the second terminal region 222 is a region that conducts the first surface and the second surface in the second wiring 220.
  • the control unit of the light emitting unit 140 is electrically connected to the plurality of first terminals 112 via one first conducting member 310 and also connected to the plurality of first terminals via one second conducting member 320.
  • the two terminals 132 are electrically connected.
  • the first terminal region 212 is located in a portion of the first wiring 210 that does not overlap the first terminal 112 (for example, the end of the first wiring 210), and the second terminal region 222 is the second wiring 220.
  • the second terminal 132 is not overlapped (for example, the end of the second wiring 220).
  • at least part of the first terminal region 212 may overlap with the first terminal 112, and at least part of the second terminal region 222 may overlap with the second terminal 132.
  • FIG. 6 is a plan view showing a modification of FIG. In this modification, the end portion that becomes the first terminal region 212 of the first wiring 210 is located on the sealing portion 160. In addition, the end portion that becomes the second terminal region 222 of the second wiring 220 is also located on the sealing portion 160.
  • the first electrode 110 is formed on the substrate 100.
  • the first lead wiring 114 and the second lead wiring 134 are also formed.
  • the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order.
  • the first terminal 112 and the second terminal 132 are formed at any timing after the first lead wiring 114 and the second lead wiring 134 are formed.
  • the light emitting unit 140 is sealed using the sealing unit 160. Thereafter, the first wiring 210 is connected to the plurality of first terminals 112, and the second wiring 220 is connected to the plurality of second terminals 132.
  • the first conduction member 310 is connected to the first terminal region 212 of the first wiring 210, and the second conduction member 320 is connected to the second terminal region 222 of the second wiring 220.
  • This connection is performed using, for example, solder or a spring pin.
  • a plurality of first terminals 112 and a plurality of second terminals 132 are formed on the substrate 100.
  • the plurality of first terminals 112 are connected to each other by the first wiring 210
  • the second terminal 132 is connected to each other by the second wiring 220.
  • a voltage for example, for an anode
  • a voltage for example, a potential for a cathode
  • first wiring 210, the second wiring 220, the first conduction member 310, and the second conduction member 320 may be one each. For this reason, the structure which connects the control part of the light emission part 140 to the light emission part 140 can also be simplified. Moreover, the manufacturing cost of the light-emitting device 10 when including the process of attaching the first conducting member 310 and the second conducting member 320 is also reduced.
  • FIG. 7 is a plan view illustrating a configuration of the light emitting device 10 according to the first modification, and corresponds to FIG. 1 in the embodiment.
  • FIG. 8 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 9 is a diagram in which the first wiring 210 and the second wiring 220 are attached to the light emitting device 10 shown in FIG.
  • the light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except for the following points.
  • the second terminal 132 is located on the sealing portion 160. And the light emission part 140 and the sealing part 160 are widened toward the edge of the board
  • the second terminal 132 and the second lead wiring 134 are connected to each other via the conductive portion 136.
  • the conductive portion 136 is a metal foil such as a copper foil, for example, and is disposed along the side surface of the sealing portion 160. However, the conductive portion 136 may be formed by a vapor deposition method or the like.
  • FIG. 10 is a plan view illustrating a configuration of a light emitting device 10 according to the second modification, and corresponds to FIG. 1 in the embodiment.
  • FIG. 11 is a view of the light emitting device 10 as viewed from the light emitting surface side (that is, a view as viewed from the side opposite to FIG. 10).
  • 12 is a diagram in which the second wiring 220 and the first terminal region 212 are added to FIG. 10
  • FIG. 13 is a diagram in which the first wiring 210 is added to FIG.
  • the light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except for the following points.
  • the first terminal 112 is provided on the surface of the substrate 100 opposite to the light emitting unit 140. Also in this case, the first terminal 112 is located near the edge of the substrate 100 and does not overlap the light emitting unit 140. The first terminal 112 is electrically connected to the first lead wiring 114 through the through hole 116. For this reason, the first wiring 210 is also disposed on the surface of the substrate 100 opposite to the light emitting unit 140. However, the first terminal region 212 is separated from the first wiring 210 and is disposed on the same surface of the substrate 100 as the light emitting unit 140. Note that the first lead wiring 114 shown in FIG. 1 and the like is covered with an insulating layer 150.
  • the second terminal 132 is located near the edge of the substrate 100. Accordingly, as in the first modification, the sealing unit 160 and the light emitting unit 140 are wider than the embodiment. In other words, a region (non-light emitting region) where the light emitting portion 140 is not formed in the substrate 100 is narrow.
  • the second wiring 220 overlaps the first terminal 112 and the first wiring 210 through the substrate 100.
  • the substrate 100 is formed of an insulating material, the second wiring 220 is not short-circuited to the first terminal 112 or the first wiring 210.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Le dispositif selon l'invention comprend une section d'émission de lumière (140) formée sur un substrat (100), et comprenant une première électrode (110), une couche organique (120), et une seconde électrode (130). La couche organique (120) est positionnée entre la première électrode (110) et la seconde électrode (130). Une pluralité de premières bornes (112) sont formées sur le substrat (100), et sont électriquement connectées à la première électrode (110). Une pluralité de secondes bornes (132) sont formées sur le substrat (100), et sont électriquement connectées à la seconde électrode (130). Un premier câblage (210) est disposé sur le substrat (100), et il est électriquement connecté aux premières bornes (112). Un second câblage (220) est disposé sur le substrat (100), et il est électriquement connecté aux secondes bornes (132). Une partie du premier câblage (210) et une partie du second câblage (220), qui sont disposées sur la même surface du substrat (100), ne se chevauchent pas.
PCT/JP2015/069301 2015-07-03 2015-07-03 Dispositif d'émission de lumière Ceased WO2017006392A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017526800A JPWO2017006392A1 (ja) 2015-07-03 2015-07-03 発光装置
PCT/JP2015/069301 WO2017006392A1 (fr) 2015-07-03 2015-07-03 Dispositif d'émission de lumière

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/069301 WO2017006392A1 (fr) 2015-07-03 2015-07-03 Dispositif d'émission de lumière

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WO2017006392A1 true WO2017006392A1 (fr) 2017-01-12

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536476A (ja) * 1991-07-26 1993-02-12 Kohjin Co Ltd 分散型ｅｌ素子
JP2007005243A (ja) * 2005-06-27 2007-01-11 Matsushita Electric Works Ltd 照明装置および照明器具
JP2007287503A (ja) * 2006-04-18 2007-11-01 Sharp Corp 有機ｅｌディスプレイ
WO2009125696A1 (fr) * 2008-04-11 2009-10-15 ローム株式会社 Élément électroluminescent organique
JP2010192822A (ja) * 2009-02-20 2010-09-02 Panasonic Electric Works Co Ltd 有機ｅｌモジュール
JP2010232286A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 面状発光素子に対する給電方法
JP2011204664A (ja) * 2010-03-04 2011-10-13 Rohm Co Ltd 有機ｅｌ装置
JP2013182853A (ja) * 2012-03-05 2013-09-12 Dainippon Printing Co Ltd 薄膜素子用基板、薄膜素子、有機エレクトロルミネッセンス表示装置、および電子ペーパー

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536476A (ja) * 1991-07-26 1993-02-12 Kohjin Co Ltd 分散型ｅｌ素子
JP2007005243A (ja) * 2005-06-27 2007-01-11 Matsushita Electric Works Ltd 照明装置および照明器具
JP2007287503A (ja) * 2006-04-18 2007-11-01 Sharp Corp 有機ｅｌディスプレイ
WO2009125696A1 (fr) * 2008-04-11 2009-10-15 ローム株式会社 Élément électroluminescent organique
JP2010192822A (ja) * 2009-02-20 2010-09-02 Panasonic Electric Works Co Ltd 有機ｅｌモジュール
JP2010232286A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 面状発光素子に対する給電方法
JP2011204664A (ja) * 2010-03-04 2011-10-13 Rohm Co Ltd 有機ｅｌ装置
JP2013182853A (ja) * 2012-03-05 2013-09-12 Dainippon Printing Co Ltd 薄膜素子用基板、薄膜素子、有機エレクトロルミネッセンス表示装置、および電子ペーパー

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