[go: up one dir, main page]

WO2016174713A1 - Ruban adhésif pour le démoulage - Google Patents

Ruban adhésif pour le démoulage Download PDF

Info

Publication number
WO2016174713A1
WO2016174713A1 PCT/JP2015/062691 JP2015062691W WO2016174713A1 WO 2016174713 A1 WO2016174713 A1 WO 2016174713A1 JP 2015062691 W JP2015062691 W JP 2015062691W WO 2016174713 A1 WO2016174713 A1 WO 2016174713A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
release
adhesive tape
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/062691
Other languages
English (en)
Japanese (ja)
Inventor
靖史 土屋
岩本　太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teraoka Seisakusho Co Ltd
Original Assignee
Teraoka Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teraoka Seisakusho Co Ltd filed Critical Teraoka Seisakusho Co Ltd
Priority to PCT/JP2015/062691 priority Critical patent/WO2016174713A1/fr
Priority to JP2017515303A priority patent/JP6601921B2/ja
Priority to CN201580079243.1A priority patent/CN107530918B/zh
Publication of WO2016174713A1 publication Critical patent/WO2016174713A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets

Definitions

  • the present invention relates to a pressure-sensitive adhesive tape useful for a mold release application, for example, in a molding method in which a fiber reinforced prepreg is laminated and heated and pressed to be cured to obtain a molded product of fiber reinforced plastic (FRP).
  • FRP fiber reinforced plastic
  • Fiber reinforced plastic made by impregnating and curing a base material (matrix) such as epoxy resin into reinforcing fibers such as glass fiber, carbon fiber, and aramid fiber is lightweight but has high strength characteristics, fatigue resistance, Since it has excellent properties such as moldability and chemical resistance, it is widely used in various applications such as electrical / electronic equipment, automobile equipment, sports equipment, aerospace industry and the like.
  • matrix such as epoxy resin
  • aramid fiber Fiber reinforced plastic
  • a molding method in which a continuous reinforced fiber is laminated with a fiber reinforced prepreg impregnated with an uncured resin, and is heated and cured.
  • a release agent such as wax to the press surface in order to improve the release property between the press surface of the mold and the FRP.
  • the release agent such as wax to the press surface
  • the release effect is reduced each time the molding is repeated. Therefore, it is necessary to apply the release agent every time molding is performed, which is disadvantageous in terms of work time and cost. It is.
  • a release agent may adhere to the surface of the obtained molded product, which may adversely affect post-processing of the molded product such as bonding and painting.
  • Patent Document 1 discloses a method of cleaning the release agent by treating the surface of a molded product with a corona flame or a plasma flame, but this method further requires expensive equipment for performing the treatment. Become.
  • Patent Document 2 discloses a release film including a release layer formed of a C1-4 alkylated melamine-formaldehyde resin.
  • the release film disclosed here is not an adhesive tape because it does not have an adhesive layer.
  • this method is not a method of continuously performing molding a plurality of times while the release film is adhered to the press surface side, but a release film is installed between the prepreg and the press surface for each molding. After the molding, the release film is peeled off from the surface of the molded product. Therefore, it is disadvantageous in terms of working time and cost.
  • Patent Document 3 discloses a pressure-sensitive adhesive tape for release having a base layer composed of a polytetrafluoroethylene rolled base film and an adhesive layer.
  • Patent Document 4 discloses a heat sealer in which both ends of the width of the fluororesin tape are bonded to the ends of the heat radiation bar with an adhesive.
  • Patent Document 5 discloses a fluororesin adhesive tape having a base material made of a fluororesin film and an adhesive layer.
  • the pressure-sensitive adhesive tape for release of Patent Document 3 is used to prevent the melt-extruded resin from adhering to the laminate roll, and the fluororesin tape of Patent Document 4 is used for a heat sealer.
  • the fluororesin adhesive tape of Patent Document 5 is used for heat-resistant binding of coils and motors, roll protection of laminators and coaters, or heat-resistant release for heat sealing. Therefore, the tapes of Patent Documents 3 to 5 have not been studied for release applications in hot press molding of fiber reinforced prepregs.
  • An object of the present invention is to provide a pressure-sensitive adhesive tape for mold release that does not have uneven marks on the release surface of the tape even when hot-pressed at a high temperature, and a molded product having a good appearance can be obtained even if continuously molded. It is in.
  • the present invention relates to a release pressure-sensitive adhesive tape having at least a fluororesin-based film for forming a release surface and an adhesive layer, wherein the adhesive layer is a type 00 durometer hardened according to ASTM D2240.
  • a pressure-sensitive adhesive tape for release comprising an adhesive composition having a thickness of 60 or more at 23 ° C. and 30 or more at 150 ° C.
  • the pressure-sensitive adhesive tape for mold release of the present invention has the specific configuration as described above, even if it is hot-pressed at a high temperature, the release surface of the tape does not have uneven marks, and it has a good appearance even if it is continuously molded as it is. A molded product having is obtained.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of the pressure-sensitive adhesive tape for release of the present invention.
  • the adhesive layer 2 is provided on one surface of the fluororesin-based film 1 for constituting the release surface.
  • an application tape 3 is laminated on the other surface (release surface) of the fluororesin film 1, and a release liner 4 is laminated on the surface of the adhesive layer 2 opposite to the fluororesin film 1.
  • FIG. 1 shows a configuration in which the fluororesin film 1 functions as a base material for the adhesive tape.
  • a base material other than the fluororesin film 1 is interposed between the fluororesin film 1 and the adhesive layer 2. You may do it.
  • the fluororesin film 1 in the present invention is not particularly limited, and various fluororesin films that are known to be usable for mold release can be used.
  • the fluororesin film 1 may be a film made of a homopolymer of a fluororesin monomer, or a film made of a copolymer having a fluororesin monomer as a main structure and including other monomer structures. There may be.
  • the film which consists of a composition which has a fluororesin as a main component and also contains other resin may be sufficient.
  • a known additive may be included.
  • fluororesin examples include tetrafluoroethylene resin (PTFE), tetrafluoroethylene-ethylene copolymer (ETFE), tetrafluoroethylene-hexafluoropropylene copolymer (PFEP), and tetrafluoroethylene.
  • PTFE tetrafluoroethylene resin
  • ETFE tetrafluoroethylene-ethylene copolymer
  • PFEP tetrafluoroethylene-hexafluoropropylene copolymer
  • PFA -Perfluoroalkyl vinyl ether copolymer
  • PCTFE trifluorochloroethylene resin
  • PVDF vinylidene fluoride resin
  • PVDF vinyl
  • Examples of conventional films used for mold release include, in addition to the fluororesin film 1, for example, a silicone-coated polyethylene terephthalate film, a polymethylpentene film, and a polypropylene film.
  • the silicone-coated polyethylene terephthalate film the silicone component may migrate, and the same problem as when a release agent is applied to the press surface may occur.
  • the polymethylpentene film is excellent in releasability, but the film is easily wrinkled during molding.
  • Polypropylene film has low heat resistance and insufficient releasability.
  • the fluororesin film 1 used in the present invention does not have such a problem.
  • the thickness of the fluororesin film 1 is not particularly limited, but is preferably 3 to 200 ⁇ m, more preferably 3 to 60 ⁇ m.
  • the fluororesin film 1 is preferably thicker. Therefore, the fact that a relatively thin fluororesin film as in the present invention provides an excellent effect is an unexpected effect for those skilled in the art.
  • the bending moment (waist) of the adhesive tape will be weak, for example, the film will curl and difficult to stick to the adherend, causing creases or adhesion when sticking to the adherend Air bubbles tend to remain between the surfaces.
  • this point can be improved by, for example, laminating the application tape 3 on the release surface to increase the bending moment (waist) of the adhesive tape.
  • the surface on which the pressure-sensitive adhesive layer 2 of the fluororesin-based film 1 is provided may be subjected to an easy adhesion treatment as necessary.
  • the easy adhesion treatment include primer treatment, corona treatment, etching treatment, and plasma treatment.
  • the pressure-sensitive adhesive layer 2 in the present invention is a layer made of a pressure-sensitive adhesive composition.
  • regulated by ASTM D 2240 of this adhesive composition is 60 or more in 23 degreeC, Preferably it is 75 or more, and is 30 or more in 150 degreeC, Preferably it is 35 or more.
  • the durometer hardness is particularly high at a high temperature (150 ° C.)
  • the mold release surface of the tape does not have uneven marks, and it has a good appearance even if it is continuously molded as it is. Goods are obtained.
  • the durometer hardness at normal temperature (23 ° C.) is high, the bending moment (waist) of the tape will be moderately strong and tend to be attached to the adherend.
  • the durometer hardness is a value obtained by laminating the pressure-sensitive adhesive composition until the thickness reaches 6 mm and measuring this as a measurement sample, as specifically described in the examples described later.
  • the type of the pressure-sensitive adhesive composition is not particularly limited as long as it has the durometer hardness described above.
  • Specific examples of the pressure-sensitive adhesive include, for example, a silicone-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive.
  • a silicone-based pressure-sensitive adhesive is preferable from the viewpoint of heat resistance.
  • silicone-based pressure-sensitive adhesive examples include silicone raw rubber (polydimethylsiloxane long-chain polymer mainly composed of D units [(CH 3 ) 2 SiO]) and MQ resin (M units [(CH 3 ) 3 SiO 1/2] the adhesive comprising a polymer) of a silicone resin having a three-dimensional structure consisting of Q units [SiO 2] and the like.
  • a pressure-sensitive adhesive composed of a silicone raw rubber and an MQ resin is superior in adhesiveness compared to a silicone raw rubber alone.
  • silicone-based pressure-sensitive adhesive include addition-curable silicone pressure-sensitive adhesives and peroxide-curable pressure-sensitive adhesives. Two or more types of silicone pressure-sensitive adhesives may be used in combination.
  • the durometer hardness of the pressure-sensitive adhesive layer 2 there are various methods for setting the durometer hardness of the pressure-sensitive adhesive layer 2 to the specific high value described above.
  • a silicone-based pressure-sensitive adhesive for example, the amount of low-molecular components such as silicone oil contained in the pressure-sensitive adhesive is reduced, or the amount of Q resin (that is, Q unit [SiO 2 ]) that affects hardness is reduced.
  • Q resin that is, Q unit [SiO 2 ]
  • the durometer hardness can be adjusted by appropriately selecting the type and amount of additives described later to be added to the pressure-sensitive adhesive composition.
  • Additives may be added to the pressure-sensitive adhesive composition for the purpose of improving various properties such as the durometer hardness of the pressure-sensitive adhesive layer 2, the shear storage modulus G ′, and the adhesiveness.
  • additives include inorganic fillers such as carbon black and silica; polyorganosiloxanes such as silicone resin, polydimethylsiloxane and polydimethylphenylsiloxane; and antioxidants such as phenolic antioxidants and amine antioxidants. Agents; silane coupling agents.
  • the pressure-sensitive adhesive composition used in the present invention can be obtained using a commercially available product.
  • a commercially available silicone-based pressure-sensitive adhesive is cured using a curing catalyst such as a platinum catalyst to obtain a pressure-sensitive adhesive composition having desired physical properties.
  • a pressure-sensitive adhesive composition having desired physical properties can be obtained by curing using a curing agent such as an isocyanate-based curing agent or an epoxy-based curing agent.
  • the pressure-sensitive adhesive layer 2 can be formed, for example, by applying a pressure-sensitive adhesive composition to one side of the fluororesin-based film 1 and curing it using a curing catalyst or a curing agent as described above.
  • a solvent may be added.
  • the solvent include aromatic solvents such as toluene and xylene; aliphatic solvents such as hexane, octane and isoparaffin; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; ester solvents such as ethyl acetate and isobutyl acetate.
  • ether solvents such as diisopropyl ether and 1,4-dioxane.
  • the coating method is not particularly limited, and a known method may be used. Specific examples include coating using a comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater or gravure coater; screen coating; dip coating; cast coating. It is done.
  • the thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, but is preferably 3 to 100 ⁇ m, more preferably 3 to 80 ⁇ m.
  • the application tape 3 is a tape that is laminated in advance on the release surface side in order to give an appropriate bending moment (waist) when the adhesive tape has a weak bending moment (waist) and is difficult to stick to an adherend. is there. Specifically, it is laminated to improve the ease of work when attaching the release adhesive tape to the adherend, and it is peeled off to expose the release surface after application. Is.
  • the type of application tape 3 is not particularly limited, and a known application tape can be used. Specific examples thereof include those obtained by applying a pressure sensitive adhesive such as a rubber pressure sensitive adhesive, an acrylic pressure sensitive adhesive, or a silicone pressure sensitive adhesive to one surface of a base material such as fine paper, glassine paper, or synthetic resin film. In order to prevent the release adhesive tape itself from being peeled off from the adherend when the application tape 3 is peeled off, it is preferable to select one having a sufficiently weak peeling force against the release surface.
  • a pressure sensitive adhesive such as a rubber pressure sensitive adhesive, an acrylic pressure sensitive adhesive, or a silicone pressure sensitive adhesive
  • the release liner 4 is for protecting the pressure-sensitive adhesive layer 2 of the pressure-sensitive adhesive tape, and is peeled off immediately before application, exposing the pressure-sensitive adhesive layer 2 and applying the pressure-sensitive adhesive tape to the adherend.
  • the type of release liner 4 is not particularly limited, and a known release liner can be used. Specific examples thereof include those obtained by subjecting the surface of a base material such as fine paper, glassine paper, and synthetic resin film to a release agent treatment.
  • a release agent such as a silicone resin or a fluorine-substituted alkyl-modified silicone resin may be used.
  • the release liner to be laminated on the silicone-based pressure-sensitive adhesive layer is preferably one obtained by releasing the surface of a polyethylene terephthalate film with a fluorine-substituted alkyl-modified silicone resin.
  • the release adhesive tape of the present invention was obtained by cutting two release adhesive tapes into 38 mm ⁇ 70 mm, and bonding the adhesive layers together to form a test piece.
  • the bending moment defined by JIS P 8125 of the piece is preferably 2.0 mN ⁇ m or more, more preferably 2.4 to 10 mN ⁇ m. By having such a bending moment (waist), the ease of attachment is improved.
  • the pressure-sensitive adhesive tape for release of the present invention is useful as a pressure-sensitive adhesive tape for release for accelerating releasability between a press die and a molded product, for example, when continuously hot press-molding at a high temperature.
  • the temperature of the hot press is preferably 40 to 250 ° C, more preferably 150 to 200 ° C.
  • FRP fiber reinforced plastic
  • Fiber reinforced plastic is obtained by impregnating and curing a base material (matrix) such as epoxy resin in reinforcing fibers such as glass fiber, carbon fiber, and aramid fiber.
  • a base material such as epoxy resin
  • reinforcing fibers such as glass fiber, carbon fiber, and aramid fiber.
  • part means “part by mass”.
  • Example 1 Addition-curing silicone adhesive stock solution (trade name SD4584, manufactured by Toray Dow Corning Silicone Co., Ltd.) having a solid content concentration of 60% by mass, toluene 50 parts as a diluting solvent, platinum catalyst (trade name NC-25, 0.9 parts of Toray Dow Corning Silicone Co., Ltd.) were uniformly mixed to obtain an adhesive liquid (1).
  • the pressure-sensitive adhesive liquid (1) was applied to one side of a primer-treated 51 ⁇ m-thick tetrafluoroethylene resin (PTFE) film so that the thickness after drying was 25 ⁇ m, and the temperature was 130 ° C. in a drying oven. And dried to form an adhesive layer.
  • a release liner 50 ⁇ m thick PET film treated with a release agent with a fluorine-substituted alkyl-modified silicone resin was bonded to the pressure-sensitive adhesive layer to obtain a pressure-sensitive adhesive tape for release.
  • Example 2 Addition-curing silicone adhesive stock solution (trade name KR-3700, manufactured by Shin-Etsu Chemical Co., Ltd.) having a solid content concentration of 60% by mass, toluene 50 parts as a diluting solvent, platinum catalyst (trade name CAT-PL-) 0.5 part (50T, manufactured by Shin-Etsu Chemical Co., Ltd.) was uniformly mixed to obtain an adhesive liquid (2). And the adhesive tape for mold release was obtained by the method similar to Example 1 except having used the adhesive liquid (2).
  • KR-3700 manufactured by Shin-Etsu Chemical Co., Ltd.
  • platinum catalyst trade name CAT-PL-
  • Example 3 100 parts of an acrylic adhesive stock solution (acrylic copolymer (A)) described in Production Example 1 of International Publication No. 2014/002203, 67 parts of toluene as a diluting solvent, isocyanate curing agent (trade name Coronate L-45E) 0.6 parts of Tosoh Corporation) and 10 parts of an epoxy curing agent (trade name E-5XM, manufactured by Soken Chemical Co., Ltd.) were uniformly mixed to obtain an adhesive liquid (3).
  • an acrylic adhesive stock solution (acrylic copolymer (A)) described in Production Example 1 of International Publication No. 2014/002203
  • isocyanate curing agent trade name Coronate L-45E
  • Tosoh Corporation Tosoh Corporation
  • E-5XM an epoxy curing agent
  • the pressure-sensitive adhesive liquid (3) was applied to one side of a 51 ⁇ m thick PTFE film so that the thickness after drying was 25 ⁇ m. This was dried at 60 ° C. in a drying oven to remove the solvent, and further dried at 130 ° C. to crosslink and cure the pressure-sensitive adhesive to form a pressure-sensitive adhesive layer. Then, the release liner was bonded to the pressure-sensitive adhesive layer and cured at 40 ° C. to obtain a release pressure-sensitive adhesive tape.
  • Example 4 An application tape (polyethylene film adhesive tape, trade name PSPE9493, manufactured by Teraoka Seisakusho Co., Ltd.) having a thickness of 63 ⁇ m is pasted on the release surface of the release adhesive tape obtained in Example 1 for release with application tape. An adhesive tape was obtained.
  • PSPE9493 polyethylene film adhesive tape, trade name PSPE9493, manufactured by Teraoka Seisakusho Co., Ltd.
  • ⁇ Comparative example 2 100 parts of a peroxide curable silicone adhesive stock solution (trade name SH4280, manufactured by Toray Dow Corning Silicone Co., Ltd.) having a solid concentration of 60% by mass, 50 parts of toluene as a diluent, and benzoyl peroxide (Nyper (registered) as a crosslinking agent) (Trademark) BMT-40 (manufactured by NOF Corporation) (3.0 parts) was uniformly mixed to obtain a pressure-sensitive adhesive liquid (5).
  • a peroxide curable silicone adhesive stock solution trade name SH4280, manufactured by Toray Dow Corning Silicone Co., Ltd.
  • the pressure-sensitive adhesive liquid (5) was applied to one side of the primer-treated 51 ⁇ m thick PTFE film so that the thickness after drying was 25 ⁇ m. This was dried at 60 ° C. in a drying oven to remove the solvent, and further dried at 180 ° C. to crosslink and cure the pressure-sensitive adhesive to form a pressure-sensitive adhesive layer. And a release liner was bonded together to the adhesive layer, and the adhesive tape for mold release was obtained.
  • Example 5 A pressure-sensitive adhesive tape for mold release was obtained in the same manner as in Example 1, except that a PTFE film having a thickness of 82 ⁇ m was used.
  • Example 6 A release adhesive tape was obtained in the same manner as in Example 1 except that a PTFE film having a thickness of 25 ⁇ m was used.
  • Example 7 A release adhesive tape with an application tape was obtained in the same manner as in Example 4 except that the release adhesive tape obtained in Example 6 was used.
  • the above Examples and Comparative Examples were evaluated according to the following methods. The results are shown in Tables 1 and 2.
  • the pressure-sensitive adhesive solution was applied on the release liner so that the thickness after drying was 50 ⁇ m. Then, it heated and dried with the drying furnace, and it was set as the adhesive composition, and this was laminated
  • the heating temperature was the same as in each example and comparative example. That is, in the case of the adhesive liquid (1), (2), (4), the adhesive liquid (3), in the case of (6), 60 ° C and 130 ° C, in the case of the adhesive liquid (5) The temperature was 60 ° C and 180 ° C.
  • This 6 mm thick sample was stored in an environment of 23 ° C., and the type 00 durometer hardness (23 ° C.) defined by ASTM D 2240 was measured. Further, the sample was stored in a dryer at 150 ° C. and 200 ° C. for 2 hours, and the type 00 durometer hardness (150 ° C. and 200 ° C.) defined by ASTM D 2240 was measured.
  • the pressure-sensitive adhesive tape cut to a width of 20 mm was attached to a polished SUS plate, pressed once by a roller covered with a rubber layer having a weight of 2 kg, and left in a dryer at 180 ° C. for 2 hours. This was taken out and allowed to cool at room temperature, and the force required to peel off the tape at an angle of 180 ° at a speed of 300 mm / min was measured using a tensile tester. Further, the presence or absence of foaming of the pressure-sensitive adhesive layer after heating and the presence or absence of adhesive residue on the adherend after peeling were visually observed.
  • the reason why the durometer hardness at high temperature is low in Comparative Example 1 is that the amount of low-molecular components such as silicone oil contained in the used silicone adhesive (SD4592) is in the silicone adhesive (SD4584) used in Example 1. Compared to many, this low molecular component promotes softening of the pressure-sensitive adhesive layer at high temperatures. Moreover, the reason why the durometer hardness at normal temperature and high temperature in Comparative Example 2 is low is that the amount of Q resin (ie, Q unit [SiO 2 ]) contained in the used silicone adhesive (SH4280) is used in Example 1. Compared to the silicone adhesive (SD4584), the hardness improving effect of the Q resin is small.
  • Q resin ie, Q unit [SiO 2 ]
  • the reason why the durometer hardness at a normal temperature and a high temperature in Comparative Example 3 is low is that the glass transition point and softening point of the used acrylic pressure-sensitive adhesive (SK Dyne (registered trademark) 1717DT) are those used in Example 1. Is at a lower point.
  • SK Dyne registered trademark
  • Example 3 since an acrylic pressure-sensitive adhesive is used, the adhesive strength is slightly inferior to those in Examples 1 and 2. However, since the durometer hardness is high, the appearance quality with almost no unevenness on the surface is good. It is superior to Comparative Examples 1 to 3 in that a product is obtained.
  • Example 5 the thickness of the fluororesin-based film is as thick as 80 ⁇ m, so that the molded tape has a slight unevenness on the release surface of the pressure-sensitive adhesive tape at the time of molding, and the surface has a slightly uneven feeling. was gotten. However, the unevenness is less than the surface of the molded products of Comparative Examples 1 to 3.
  • Example 6 since the thickness of the fluororesin film was as thin as 25 ⁇ m, an adhesive tape having a weak bending moment (waist) and difficult to stick was obtained. However, a molded product with good appearance quality was obtained in which the release surface of the pressure-sensitive adhesive tape was not marked on the release surface during molding, and the surface had almost no unevenness.
  • Example 7 an application tape was further laminated on the adhesive tape of Example 6, an appropriate bending moment was given by the application tape, and an adhesive tape that was easy to stick to an adherend was obtained.
  • the pressure-sensitive adhesive tape for release of the present invention is useful as a pressure-sensitive adhesive tape for release for accelerating releasability between a press die and a molded product, for example, when continuously hot press-molding at a high temperature. .
  • FRP fiber reinforced plastic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention concerne un ruban adhésif pour le démoulage, ledit ruban adhésif comprenant au moins un film (1) de résine de fluor, qui constitue une surface de démoulage, et une couche adhésive (2) et, si nécessaire, comprenant un ruban d'application (3) et une doublure pelable (4). Le ruban adhésif est caractérisé en ce que la couche adhésive (2) comprend une composition adhésive qui présente une dureté au duromètre de type OO, telle que définie par la Norme ASTM D2240, supérieure ou égale à 60 à 23 °C et supérieure ou égale à 30 à 150 °C. Il ne reste aucune marque rugueuse sur la surface de démoulage du ruban, même si le ruban est pressé à chaud à des températures élevées, et des articles moulés qui présentent une apparence favorable peuvent être obtenus même si les articles sont moulés de manière continue.
PCT/JP2015/062691 2015-04-27 2015-04-27 Ruban adhésif pour le démoulage Ceased WO2016174713A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2015/062691 WO2016174713A1 (fr) 2015-04-27 2015-04-27 Ruban adhésif pour le démoulage
JP2017515303A JP6601921B2 (ja) 2015-04-27 2015-04-27 離型用粘着テープ
CN201580079243.1A CN107530918B (zh) 2015-04-27 2015-04-27 脱模用粘着带

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/062691 WO2016174713A1 (fr) 2015-04-27 2015-04-27 Ruban adhésif pour le démoulage

Publications (1)

Publication Number Publication Date
WO2016174713A1 true WO2016174713A1 (fr) 2016-11-03

Family

ID=57199772

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/062691 Ceased WO2016174713A1 (fr) 2015-04-27 2015-04-27 Ruban adhésif pour le démoulage

Country Status (3)

Country Link
JP (1) JP6601921B2 (fr)
CN (1) CN107530918B (fr)
WO (1) WO2016174713A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465639A (zh) * 2017-12-11 2020-07-28 三菱化学株式会社 层叠薄膜、脱模薄膜和层叠体
WO2021225051A1 (fr) * 2020-05-08 2021-11-11 三菱瓦斯化学株式会社 Ruban auxiliaire pour usinage de matériau composite renforcé par des fibres, et procédé d'usinage par découpe
JPWO2021225052A1 (fr) * 2020-05-08 2021-11-11
KR20230004554A (ko) 2020-03-31 2023-01-06 가부시키가이샤 데라오카 세이사쿠쇼 수지 조성물 및 점착 테이프
US11738526B2 (en) * 2019-09-30 2023-08-29 The Boeing Company Method for using composite tooling to manufacture composite parts
US11981839B2 (en) 2019-09-30 2024-05-14 The Boeing Company Method and apparatus for fabrication of composite tooling
US12285920B2 (en) 2019-09-30 2025-04-29 The Boeing Company Method and apparatus for fabrication of composite tooling

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112936914A (zh) * 2019-12-11 2021-06-11 东丽先端材料研究开发（中国）有限公司 一种复合薄膜及其应用
KR102322414B1 (ko) * 2020-08-14 2021-11-04 재단법인 한국탄소산업진흥원 탄소복합소재 제조용 간이 몰드 제작 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241607A (ja) * 1996-03-08 1997-09-16 Lintec Corp 熱硬化型シリコーン粘接着剤
JP2011157476A (ja) * 2010-02-01 2011-08-18 Nitto Denko Corp 両面粘着テープおよびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101531080A (zh) * 2004-05-27 2009-09-16 三菱树脂株式会社 脱模用层压膜
JP2013141793A (ja) * 2012-01-11 2013-07-22 Teijin Dupont Films Japan Ltd 成形用離型ポリエステルフィルム
JP5541468B2 (ja) * 2012-02-20 2014-07-09 信越ポリマー株式会社 離型用フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241607A (ja) * 1996-03-08 1997-09-16 Lintec Corp 熱硬化型シリコーン粘接着剤
JP2011157476A (ja) * 2010-02-01 2011-08-18 Nitto Denko Corp 両面粘着テープおよびその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465639A (zh) * 2017-12-11 2020-07-28 三菱化学株式会社 层叠薄膜、脱模薄膜和层叠体
CN111465639B (zh) * 2017-12-11 2023-09-05 三菱化学株式会社 层叠薄膜、脱模薄膜和层叠体
US11738526B2 (en) * 2019-09-30 2023-08-29 The Boeing Company Method for using composite tooling to manufacture composite parts
US11981839B2 (en) 2019-09-30 2024-05-14 The Boeing Company Method and apparatus for fabrication of composite tooling
US12285920B2 (en) 2019-09-30 2025-04-29 The Boeing Company Method and apparatus for fabrication of composite tooling
KR20230004554A (ko) 2020-03-31 2023-01-06 가부시키가이샤 데라오카 세이사쿠쇼 수지 조성물 및 점착 테이프
WO2021225051A1 (fr) * 2020-05-08 2021-11-11 三菱瓦斯化学株式会社 Ruban auxiliaire pour usinage de matériau composite renforcé par des fibres, et procédé d'usinage par découpe
JPWO2021225051A1 (fr) * 2020-05-08 2021-11-11
JPWO2021225052A1 (fr) * 2020-05-08 2021-11-11
WO2021225052A1 (fr) * 2020-05-08 2021-11-11 三菱瓦斯化学株式会社 Matériau auxiliaire pour usinage de matériau composite renforcé par des fibres, et procédé d'usinage par découpe

Also Published As

Publication number Publication date
CN107530918B (zh) 2020-08-04
JP6601921B2 (ja) 2019-11-06
CN107530918A (zh) 2018-01-02
JPWO2016174713A1 (ja) 2018-01-11

Similar Documents

Publication Publication Date Title
JP6601921B2 (ja) 離型用粘着テープ
DK3027392T3 (en) PROCEDURE FOR FORMING A BODY IN A FORM
US10350855B2 (en) Method for adhesively bonding two film-shaped substrates
CN105196660B (zh) 一种可热压成型保护膜及其制备方法
JP7131017B2 (ja) シリコーンゴム複合体
TWI680174B (zh) 各向異性黏著性片
JPWO2020040240A1 (ja) 離型フィルムおよび成型品の製造方法
WO2015146349A1 (fr) Procédé de production de feuille thermoconductrice
JP7405166B2 (ja) 積層体および物品
KR101591409B1 (ko) 이형필름
CN107810246A (zh) 胶带、特别地可用于在模具中模塑物体的方法的胶带
JP2022167967A (ja) シリコーンゴム複合体及びそれを使用した成形体の製造方法
JP6974479B2 (ja) シリコーン系粘着剤組成物及び粘着テープ
JP6521538B2 (ja) 異方粘着性シート
JP5093897B2 (ja) カバーレイフィルム熱圧着用シート
CN104231960A (zh) 热喷涂遮蔽带
CN107406726A (zh) 粘接片
KR20190012228A (ko) 감압 점착 시트
JP7362852B2 (ja) プリプレグの処理方法及び成形品の製造方法
JP6463085B2 (ja) ２層ｐｐフィルムの製造方法
CN115362218B (zh) 树脂组合物及粘合带
JP2024005501A (ja) ゴム金属接合体の製造方法、粘接着シート及び接着シート
WO2023163076A1 (fr) Feuille de modification de surface, objet multicouche, élément modifié en surface, objet revêtu, objet lié, procédé de production d'élément modifié en surface, procédé de production d'objet revêtu, et procédé de production d'objet lié
US10538068B2 (en) Method for producing functional-substance thin film material, functional-substance thin film material, and laminate thereof
JP6674707B2 (ja) 剥離シートおよび粘着体

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15890697

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017515303

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15890697

Country of ref document: EP

Kind code of ref document: A1