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WO2016016026A1 - Capteur de pression et procédé de fabrication d'un capteur de pression - Google Patents

Capteur de pression et procédé de fabrication d'un capteur de pression Download PDF

Info

Publication number
WO2016016026A1
WO2016016026A1 PCT/EP2015/066513 EP2015066513W WO2016016026A1 WO 2016016026 A1 WO2016016026 A1 WO 2016016026A1 EP 2015066513 W EP2015066513 W EP 2015066513W WO 2016016026 A1 WO2016016026 A1 WO 2016016026A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
flexible printed
membrane
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/066513
Other languages
German (de)
English (en)
Inventor
Andreas Kugler
Georg Eifler
Ruben Wahl
Patrik Patzner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2016016026A1 publication Critical patent/WO2016016026A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means

Definitions

  • the invention relates to a pressure sensor and a method for producing a pressure sensor.
  • DE 10 2009 044 980 AI discloses a sensor component comprising a deformation body and a piezoresistive sensor layer, which on the Deforming body is applied, wherein the piezoresistive sensor layer comprises at least one metal and carbon and / or hydrocarbon.
  • the present invention provides a pressure sensor with a membrane which is exposed to a medium to be measured and from the deflection thereof by means of a piezoresistive sensor element to the measured pressure
  • Printed circuit board which contacts the piezoresistive sensor element electrically and mechanically.
  • the present invention further provides a method of manufacturing a pressure sensor.
  • the method includes providing a membrane exposed to a medium to be measured.
  • the method further comprises providing a piezoresistive sensor element, by which, from a deflection of the membrane a measured pressure
  • the method further includes providing a flexible printed circuit board which is piezoresistive
  • One idea of the present invention is to design the pressure sensor such that it covers a low, medium, and high pressure region, while providing sufficient sensitivity of the pressure sensor.
  • the piezoresistive sensor element by a bending-sensitive semiconductor chip or one of a Semiconductor material formed thin-film measuring structure is formed.
  • a high measurement accuracy can be achieved.
  • by reducing the joints and the reliability of the pressure sensor can be increased.
  • the piezoresistive sensor element is embedded in the flexible printed circuit board, arranged on the flexible printed circuit board or on the membrane.
  • the piezoresistive sensor element can thus be selected according to individual requirements.
  • the thin-film measuring structure is applied to the flexible printed circuit board by a photolithographic process, or printed on the membrane.
  • the applied structure thus makes it possible to safely and reliably detect resistance changes induced in the mOhm range by the deflection of the membrane.
  • the thin-film measuring structure is printed on the membrane with electrically conductive inks which have gold or silver particles.
  • electrically conductive inks which have gold or silver particles.
  • the flexible printed circuit board arranged adjacent to the membrane, flexibly formed first region in which the flexible printed circuit board is materially connected to the membrane, a substantially rigid second region formed in which an evaluation circuit for evaluating the of the piezoresistive Sensor element is arranged to generate electrical signal, and a flexible
  • connecting region which is arranged between the first and second region. Due to the flexible design of the first region arranged adjacent to the membrane, this region is likewise movable when the membrane is deflected.
  • the rigid design of the second area allows the arrangement of the evaluation circuit in this area.
  • the flexible forming of the connection region between the first and second region allows a space-saving design of the pressure sensor, wherein the flexible printed circuit board is foldable, at least in the connecting region.
  • the evaluation circuit has at least one application-specific integrated circuit embedded in the flexible printed circuit board, and at least one passive or active component arranged on a surface of the flexible printed circuit board or outside the flexible printed circuit board.
  • Evaluation circuit can thus be arranged to save space in the pressure sensor.
  • a thickness of the flexible printed circuit board is less than or equal to 100 micrometers, preferably between 30 and 100 micrometers, and that a thickness of the
  • bend-sensitive semiconductor chip is less than or equal to 50 microns, preferably between 10 and 20 microns, with a
  • Track width is less than or equal to 20 microns and a conductor track thickness is less than or equal to 5 microns, preferably 1 micrometer. This allows a sufficient flexibility of the flexible printed circuit board, in particular in the region of the piezoresistive sensor element, as well as a substantially thin design of the bending-sensitive semiconductor chip with a high
  • an electrical contacting of the flexible printed circuit board with a power supply is formed by connectable with the flexible printed circuit board through-pins.
  • the flexibility of the flexible printed circuit board can be adapted to a design of the pressure sensor and yet a simple and reliable contacting of the flexible printed circuit board with the power supply can be provided.
  • a measuring range of the piezoresistive sensor element is between 0.1 and 2200 bar.
  • the pressure sensor can thus a low, middle and
  • the piezoresistive sensor element is formed by a bending-sensitive semiconductor chip or by a thin-film measuring structure, wherein the piezoresistive sensor element embedded in the flexible circuit board, applied to the flexible circuit board or applied to the membrane.
  • a high measurement accuracy can be achieved.
  • the piezoresistive sensor element can thus also be selected according to individual requirements.
  • an evaluation circuit for evaluating the electrical signal which can be generated by the piezoresistive sensor element is embedded in the flexible printed circuit board.
  • the rigid design of the second area allows the arrangement of the
  • the evaluation circuit in this area.
  • the evaluation circuit can thus be arranged to save space in the pressure sensor.
  • the thin-film measuring structure on the flexible circuit board by a
  • photolithographic process is applied or printed on the membrane.
  • the applied structure thus makes it possible to safely and reliably detect resistance changes induced in the mOhm range by the deflection of the membrane.
  • the thin-film measurement structure is printed on the membrane by a printing process with electrically conductive inks which have gold or silver particles.
  • Embodiments of the invention mediate. They illustrate
  • Fig. 1 is a sectional view of a pressure sensor according to the invention according to a first embodiment of the invention
  • Fig. 2 is a sectional view of the pressure sensor according to the invention according to a second embodiment of the invention
  • Fig. 3 is a sectional view of the pressure sensor according to a third
  • Fig. 1 shows a sectional view of a pressure sensor according to the invention according to a first embodiment of the invention.
  • the pressure sensor 10 has a membrane 12, which is preferably made of steel. Alternatively, the membrane 12 may be formed of another suitable material.
  • the membrane 12 is formed with a steel base 13 in one piece. In the steel base 13, a channel is formed, through which the membrane 12 with a pressure P of a to be measured
  • the pressure sensor 10 furthermore has a piezoresistive sensor element 14a and a flexible printed circuit board 16.
  • the piezoresistive sensor element 14a is formed in the present first embodiment by a bending-sensitive semiconductor chip 14a.
  • the flexion-sensitive semiconductor chip 14a is preferably embedded in the flexible printed circuit board 16, and configured to form from the deflection of the membrane 12 a measured pressure P
  • the flexible printed circuit board 16 contacts the bend-sensitive semiconductor chip electrically and mechanically.
  • the flexible circuit board 16 is preferably connected to the membrane 12 by an adhesive layer. Alternatively, the flexible circuit board 16 may also be connected to the membrane 12 by another suitable connection means.
  • the flexible circuit board 16 has a membrane 12 adjacent
  • the flexible printed circuit board 16 furthermore has a substantially rigidly formed second region 16b, in which an evaluation circuit 18 is arranged for evaluating the electrical signal S that can be generated by the bending-sensitive semiconductor chip 14a.
  • the flexible printed circuit board 16 moreover has a flexibly formed connecting region 16c, which is arranged between the first and second regions 16a, 16b.
  • the evaluation circuit 18 has an application-specific integrated circuit 18 a embedded in the flexible printed circuit board 16 and a passive component 18 b arranged on a surface of the flexible printed circuit board 16.
  • the application-specific integrated circuit 18a can alternatively also be used on a Surface of the flexible circuit board 16 may be arranged.
  • the component 18b may alternatively also be arranged outside the flexible printed circuit board 16 and / or be formed by an active component. An electrical contacting of the flexible printed circuit board 16 with a
  • Power supply 20 is preferably formed by connectable with the flexible circuit board 16 through-pins 22.
  • the electrical contacting of the flexible printed circuit board 16 may also be formed by other suitable electrical contacting means.
  • a thickness of the flexible circuit board 16 is preferably 100 micrometers. Alternatively, the thickness of the flexible circuit board may be less than 100
  • Micrometers in particular preferably between 30 and 100 micrometers.
  • a thickness of the flex-sensitive semiconductor chip 14a is preferably 50 micrometers. Alternatively, the thickness of the
  • bending-sensitive semiconductor chips 14a are also less than 50 micrometers, in particular preferably between 10 and 20 micrometers.
  • a trace width of the flex-sensitive semiconductor chip 14a is preferably 20 micrometers. Alternatively, the track width may be less than 20 microns.
  • Semiconductor chips 14a is preferably 5 micrometers. Alternatively, the conductor track thickness can also be less than 5 micrometers, preferably 1 micrometer. A measuring range of the bending-sensitive semiconductor chip 14a is preferably between 0.1 and 2200 bar.
  • Fig. 2 shows a sectional view of the pressure sensor according to the invention according to a second embodiment of the invention.
  • a piezoresistive sensor element 14b is in the present second
  • the thin-film measuring structure 14b is preferably arranged on the flexible printed circuit board 16.
  • the thin-film measuring structure 14b is further preferably applied to the flexible printed circuit board 16 by a photolithographic process.
  • the thin film sensing structure 14b may also be applied to the flexible printed circuit board 16 by another suitable method be upset.
  • a trace width of the thin-film sensing structure 14b is preferably 20 micrometers.
  • the track width may be less than 20 microns.
  • a trace thickness of the thin-film sensing structure 14b is preferably 5 micrometers.
  • the conductor track thickness can also be less than 5 micrometers, preferably 1 micrometer.
  • Fig. 3 shows a sectional view of the pressure sensor according to a third
  • a piezoresistive sensor element 14c is formed according to the third embodiment by a formed of a semiconductor material thin-film measuring structure 14c.
  • the thin film measuring structure 14 c is preferably on the membrane 12
  • the thin-film measuring structure 14 c is preferably printed on the membrane 12.
  • the thin film sensing structure 14c is printed on the membrane 12 by an aerosol jet of electrically conductive inks comprising gold or silver particles.
  • the thin film sensing structure 14c may also be printed by another suitable printing method, such as inkjet printing.
  • a trace width of the thin film sensing structure 14c is preferably 20 micrometers. Alternatively, the track width may be less than 20 microns.
  • a trace thickness of the thin-film sensing structure 14c is preferably 5 micrometers. Alternatively, the conductor track thickness can also be less than 5 micrometers, preferably 1 micrometer.
  • FIG. 4 shows a flowchart of a method for producing a
  • the method for producing a pressure sensor 10 comprises, in step S1, providing a membrane 12 which is exposed to a medium to be measured.
  • the method further comprises, in step S2, providing a piezoresistive sensor element 14a; 14b; 14c, through which a, from a deflection of the diaphragm 12 a measured pressure P proportional electrical signal S can be generated.
  • the method further comprises, in step S3, providing a flexible circuit board 16 which is the piezoresistive
  • Sensor element 14a; 14b; 14c electrically and mechanically contacted.
  • the method further comprises that the piezoresistive sensor element 14a; 14b; 14c through a bending-sensitive semiconductor chip 14a or through a thin-film measuring structure 14b formed of a semiconductor material; 14c is formed, wherein the piezoresistive sensor element 14a; 14b; 14c embedded in the flexible printed circuit board 16 in step S4, applied to the flexible printed circuit board 16 or applied to the membrane 12.
  • material and thickness of the flexible printed circuit board 16 and the membrane 12 can be adapted to individual requirements.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un capteur de pression (10) muni d'une membrane (12) qui est exposée à un fluide à mesurer et dont la déviation au moyen d'un élément de détection piézorésistif (14a ; 14b ; 14c) permet de produire un signal électrique (S) proportionnel à la pression mesurée (P), et d'une carte de circuit imprimé (16) qui vient en contact électrique et mécanique avec l'élément de détection piézorésistif (14a ; 14b ; 14c). L'invention concerne par ailleurs un procédé associé de fabrication d'un capteur de pression (10).
PCT/EP2015/066513 2014-07-28 2015-07-20 Capteur de pression et procédé de fabrication d'un capteur de pression Ceased WO2016016026A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014214753.0 2014-07-28
DE102014214753.0A DE102014214753A1 (de) 2014-07-28 2014-07-28 Drucksensor und Verfahren zum Herstellen eines Drucksensors

Publications (1)

Publication Number Publication Date
WO2016016026A1 true WO2016016026A1 (fr) 2016-02-04

Family

ID=53673099

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/066513 Ceased WO2016016026A1 (fr) 2014-07-28 2015-07-20 Capteur de pression et procédé de fabrication d'un capteur de pression

Country Status (2)

Country Link
DE (1) DE102014214753A1 (fr)
WO (1) WO2016016026A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111408034A (zh) * 2020-03-17 2020-07-14 多感科技(上海)有限公司 微针给药检测装置、微针给药系统及微针给药检测方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111060251B (zh) * 2019-12-31 2024-11-26 苏州能斯达电子科技有限公司 一种柔性压力传感器自动检测标定装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1286148A1 (fr) * 2001-02-08 2003-02-26 TGK CO., Ltd. Procede de reglage d'un capteur de pression
JP3445894B2 (ja) * 1996-02-14 2003-09-08 長野計器株式会社 圧力変換器
DE102007016475A1 (de) * 2007-04-05 2008-10-09 Robert Bosch Gmbh Anschlusseinheit für einen Drucksensor
DE102009044980A1 (de) 2009-09-24 2011-03-31 Robert Bosch Gmbh Verfahren zur Herstellung eines Sensorbauelementes ohne Passivierung sowie Sensorbauelement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI224190B (en) * 2003-05-28 2004-11-21 Au Optronics Corp Semiconductor pressure sensor
DE102005024215A1 (de) * 2004-06-03 2005-12-22 Denso Corp., Kariya Drucksensor
JP2007192773A (ja) * 2006-01-23 2007-08-02 Denso Corp 圧力センサ素子の取付構造
US20100057046A1 (en) * 2008-09-03 2010-03-04 Keimar, Inc Systems for characterizing physiologic parameters and methods for use therewith
ES2928766T3 (es) * 2010-02-22 2022-11-22 Swiss Tech Enterprise Gmbh Procedimiento para producir un módulo semiconductor
DE102010011047A1 (de) * 2010-03-11 2011-09-15 Johnson Matthey Catalysts (Germany) Gmbh Biegewandler
DE102012024659A1 (de) * 2012-12-17 2014-06-18 Harald Kobolla Anordnung und Verfahren zur Information eines Patienten über eine Auftrittsbelastung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3445894B2 (ja) * 1996-02-14 2003-09-08 長野計器株式会社 圧力変換器
EP1286148A1 (fr) * 2001-02-08 2003-02-26 TGK CO., Ltd. Procede de reglage d'un capteur de pression
DE102007016475A1 (de) * 2007-04-05 2008-10-09 Robert Bosch Gmbh Anschlusseinheit für einen Drucksensor
DE102009044980A1 (de) 2009-09-24 2011-03-31 Robert Bosch Gmbh Verfahren zur Herstellung eines Sensorbauelementes ohne Passivierung sowie Sensorbauelement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
STEFANO STASSI ET AL: "Flexible Tactile Sensing Based on Piezoresistive Composites: A Review", SENSORS, vol. 14, no. 3, 14 March 2014 (2014-03-14), pages 5296 - 5332, XP055217418, DOI: 10.3390/s140305296 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111408034A (zh) * 2020-03-17 2020-07-14 多感科技(上海)有限公司 微针给药检测装置、微针给药系统及微针给药检测方法

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