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WO2016006339A1 - Corps poreux, et dispositif de stockage de chaleur - Google Patents

Corps poreux, et dispositif de stockage de chaleur Download PDF

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Publication number
WO2016006339A1
WO2016006339A1 PCT/JP2015/064949 JP2015064949W WO2016006339A1 WO 2016006339 A1 WO2016006339 A1 WO 2016006339A1 JP 2015064949 W JP2015064949 W JP 2015064949W WO 2016006339 A1 WO2016006339 A1 WO 2016006339A1
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WO
WIPO (PCT)
Prior art keywords
heat storage
porous body
heat
glass
storage material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/064949
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English (en)
Japanese (ja)
Inventor
坂本　禎章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2016532484A priority Critical patent/JP6350661B2/ja
Publication of WO2016006339A1 publication Critical patent/WO2016006339A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a porous body and a heat storage device having the same.
  • the number of electronic components such as CPU (central processing unit), power amplifier, FET (field effect transistor), IC (integrated circuit), voltage regulator, etc., which become heat sources, has increased due to the recent improvement in performance of electronic devices.
  • the increase in energy generated overlaps with the problem of heat generation.
  • mobile devices such as smartphones and tablet terminals have a problem that the capacity of the battery deteriorates due to this heat. Therefore, it is required to control the temperature inside the device to a higher degree.
  • Control of the heat generated from the heat source as described above is performed by a cooling fan, a heat pipe, a heat sink, a thermal sheet, a Peltier element, or the like, which is an existing heat management solution.
  • a cooling device in which a fan or a Peltier element is combined is described (see Patent Document 1).
  • the cooling device combining the heat sink and the fan or the Peltier element as described above has a relatively complicated structure and increases the size of the device, particularly for thin devices such as smartphones and tablet terminals. Hateful.
  • the casing (external housing) of the electronic device is hermetically sealed, and is unsuitable because it cannot generate airflow with a cooling fan and exhaust it to the outside.
  • the power consumption of the electronic device further increases in order to obtain higher heat dissipation capability, which is not preferable. In the first place, this method is not efficient because heat is dissipated by energy input with respect to heat generation that is energy loss.
  • the temperature is currently controlled only by means of heat dissipation through the housing, and the heat source and the housing are thermally coupled by a thermal sheet or the like to release heat.
  • JP 2010-223497 Japanese Patent Laid-Open No. 10-89799 JP 2008-1111592 A
  • Heat dissipation through the enclosure as described above is limited because the surface area of the enclosure is limited. Therefore, the temperature of each heat source is measured, and when the temperature exceeds a predetermined temperature, the performance of the CPU or the like is limited (suppressing heat generation itself). That is, the temperature rise of the housing may hinder the performance of the CPU or the like.
  • heat dissipation through such a case in other words, heat dissipation by heat transfer to the entire device, heat is also transferred to the battery, which can lead to a decrease in battery capacity over time.
  • the present inventor has paid attention to a technology for storing and transferring heat, that is, a chemical heat pump, utilizing a chemical reaction of a heat storage material, an adsorption / desorption phenomenon, or the like.
  • the chemical heat pump is a relatively large apparatus that is currently used for the purpose of using exhaust heat in a chemical plant or a power plant, or used in a domestic hot water supply / heating system, a refrigeration vehicle, or the like (for example, Patent Document 2). (See ⁇ 3).
  • Such a conventional chemical heat pump is too large in size as compared with an electronic device, and thus cannot be applied as it is to suppress the temperature rise of the heat generating component. Further, simply reducing the size of the conventional chemical heat pump cannot provide sufficient cooling efficiency to suppress the temperature rise of the heat-generating component.
  • gases other than cohesive components for example, water
  • heat absorption and heat dissipation efficiency of the heat storage material to be reduced are removed from the housing of the chemical heat pump. It can be excluded from the body. This elimination of gas can be achieved by hermetically sealing the housing of the chemical heat pump under reduced pressure. At this time, if the heat storage material is in the form of fine powder, it may rise inside the housing of the chemical heat pump and be sucked out together with the gas. To prevent.
  • the particles granulated as described above have a problem that the volume fraction of the resin is relatively large, the volume of the heat storage material included in the chemical heat pump is reduced, and the heat storage amount as a whole is reduced.
  • An object of the present invention is to provide a heat storage material (porous body) that suppresses soaring and has a large amount of heat storage, and a heat storage device that is excellent in cooling efficiency using the heat storage material.
  • the present inventor does not granulate the heat storage material and the resin, but obtains a porous body by compositing the heat storage material and the glass material.
  • the inventors have found that the problem can be solved and have reached the present invention.
  • a porous body that is a composite of a heat storage material and a glass material is provided.
  • a reaction chamber containing the porous body there is provided a heat storage device comprising a condensation evaporation chamber for condensing or evaporating a condensable component generated by heat absorption of the heat storage material.
  • an electronic component comprising the heat storage device.
  • an electronic apparatus comprising the heat storage device or the electronic component.
  • the present invention by making a composite of a heat storage material and a glass material, soaring is prevented and a porous body having a large amount of heat storage is provided. Moreover, the heat storage device excellent in cooling efficiency is provided by using this porous body.
  • cooling means that heat is absorbed (takes away heat) from a substance to be cooled, such as a heat-generating component, and it is not necessary to lower the temperature of the substance to be cooled. What is necessary is just to suppress a raise compared with the case where the heat storage device of this invention is not applied. Therefore, in this specification, the term “cooling” may be used in the same meaning as “suppression of temperature rise”.
  • the “porous body” means a solid having a three-dimensional network structure having voids continuous with the external space.
  • the heat storage material used in the present invention is not particularly limited as long as it absorbs heat generated by the heating element, and any appropriate heat storage material can be used.
  • the heat storage material include a chemical heat storage material that exhibits an endothermic reaction by a chemical reaction, and an adsorption / absorption heat storage material that exhibits an endothermic reaction by an adsorption or absorption reaction.
  • the chemical heat storage material include hydrates such as calcium sulfate and calcium chloride, and hydroxides such as calcium and magnesium.
  • Examples of the adsorption / absorption heat storage material include zeolite, silica gel, mesoporous silica, activated carbon and the like.
  • a preferred heat storage material is at least one heat storage material selected from the group consisting of zeolite, silica gel, mesoporous silica and activated carbon.
  • a more preferable heat storage material is zeolite.
  • the zeolite is a so-called zeolite structure, that is, a crystalline hydrous aluminosilicate having a network structure in which SiO 4 tetrahedron and AlO 4 tetrahedron share apex oxygen and are connected in three dimensions as a basic skeleton.
  • Zeolites can usually be represented by the general formula: (M 1, M 2 1/2) m (Al m Si n O 2 (m + n)) ⁇ xH 2 O (n ⁇ m)
  • M 1 is a monovalent cation such as Li + , Na + , or K +
  • M 2 is a divalent cation such as Ca 2+ , Mg 2+ , or Ba 2+ .
  • Silica gel is a colloidal silica three-dimensional structure having a pore diameter of several nm to several tens of nm and a specific surface area of 5 to 1000 m 2 / g, and the porous material characteristics can be controlled over a wide range. Moreover, the primary particle surface of silica gel is covered with silanol, and polar molecules (such as water) are selectively adsorbed under the influence of silanol.
  • Mesoporous silica is a substance having uniform and regular pores made of silicon dioxide and having a pore diameter of about 2 to 10 nm.
  • Activated carbon is a “porous carbonaceous substance having pores”, which has a large specific surface area and adsorption capacity.
  • the basic skeleton is a two-dimensional lattice planar structure in which carbon atoms are connected at an angle of 120 °.
  • the two-dimensional lattice is irregularly stacked to form a crystal lattice, and this crystal lattice is randomly connected to be activated carbon.
  • the voids between the crystal lattices are activated carbon pores, and water is adsorbed into the pores. .
  • the condensable component is water, but depending on the heat storage material, the condensable component is not limited to water. Any liquid transformation can be used.
  • the glass material used in the present invention is not particularly limited, but glass having a low softening point is preferable.
  • the softening point of the glass material is preferably in a temperature range in which the heat storage material does not substantially undergo chemical alteration, specifically, 500 ° C. or lower is preferable, 400 ° C. or lower is more preferable, and 300 ° C. or lower is preferable. Further preferred.
  • the lower limit of the softening point of the glass material only needs to be higher than the temperature of the environment in which the porous body (heat storage device) of the present invention is installed, for example, 150 ° C. or higher, preferably 200 ° C. or higher, more preferably 250 ° C. That is all you need.
  • the softening point of the glass material can be measured by differential thermal analysis (DTA).
  • glass material examples include, but are not limited to, Bi—B—O glass, V—P—O glass, Sn—P—O glass, V—Te—O glass, and the like.
  • the mixing ratio of the heat storage material and the glass material is not particularly limited, but is preferably in the range of 60:40 to 98: 2, more preferably in the range of 80:20 to 95: 5, and more preferably in terms of weight ratio. Is in the range of 90:10 to 95: 5. That is, the ratio of the glass material to the total of the heat storage material and the glass material is preferably 2 to 40% by weight, more preferably 5 to 20% by weight, and even more preferably 5 to 10% by weight. preferable. By setting the ratio of the glass material to the total amount of the heat storage material and the glass material to 40% by weight or less, the ratio of the heat storage material in the porous body increases, so that the heat absorption amount of the porous body can be increased. Moreover, by setting the ratio of the glass material to 2% by weight or more, it is possible to further strengthen the bond between the particles of the heat storage material and further increase the strength of the porous body.
  • the heat storage material in the porous body of the present invention has a volume fraction of 50% or more, preferably 60% or more, more preferably 70% or more.
  • the volume fraction means the proportion of the volume occupied by a certain substance (here, ceramic material) in the apparent volume of the sintered body (that is, the volume including voids inside the sintered body).
  • the porous body of the present invention has a relative density of 50 to 90%, preferably 60 to 80%.
  • the relative density of the porous body By setting the relative density of the porous body to 50% or more, the amount of the heat storage material contained in the porous body is further increased, and the endothermic amount of the entire porous body is further increased. Further, by setting the relative density of the porous body to 90% or less, it becomes possible to form a sufficient amount of pores, and the contact area between the heat storage material and the cohesive component can be increased. , The amount of heat storage becomes larger.
  • the relative density means a proportion of a space occupied by constituent components (for example, when the porous body is made of a heat storage material and a glass material) in the porous body.
  • the relative density means the ratio of the portion excluding the voids (pores) in the porous body.
  • the relative density can be calculated from the density of the raw material and its proportion, and the density of the obtained porous body.
  • the porous body C is obtained from the heat storage material A and the glass material B
  • the relative density can be obtained by the following formula.
  • the apparent density of the sintered body C can be calculated from the apparent volume of the sintered body (that is, the volume including voids inside the sintered body) and its weight.
  • the sintered body when it is a rectangular parallelepiped, it can be calculated from the vertical and horizontal dimensions and weight of the sintered body.
  • Relative density (%) D c / (P A ⁇ D A + P B ⁇ D B ) ⁇ 100
  • D A Density D B of the heat storage material
  • A Density of the glass material
  • D C the porous body C of apparent density
  • P A heat storage material weight ratio of A
  • the porous body of the present invention can be obtained by mixing a heat storage material, a glass material, and a resin, and heat-treating the obtained mixture.
  • the resin used is not particularly limited as long as it can be removed by heat treatment, and examples thereof include vinyl alcohol resins, acrylic resins, butyral resins, and propylene carbonate resins.
  • the mixing amount of the resin is preferably 10 to 50% by volume, more preferably 20 to 40% by volume with respect to the entire mixture (that is, the total of the heat storage material, the glass material and the resin).
  • the temperature of the heat treatment is not less than the softening point of the glass material, not more than the temperature at which the heat storage material does not substantially change, and not less than the decomposition temperature of the resin.
  • the temperature of the heat treatment can range from 300 ° C to 600 ° C.
  • the heat treatment can be performed in the air, but is not limited thereto, and may be an atmosphere in which the resin can be decomposed (or evaporated).
  • the heat treatment time is not particularly limited as long as the resin can be sufficiently removed, and may be, for example, 0.1 to 5 hours.
  • the resin in the mixture is removed, and pores are formed in the portions where the resin was present.
  • the glass material softens and the softened glass connects the particles of the heat storage material, solidifies after cooling, mechanically connects the particles of the heat storage material, and fixes the heat storage material particles.
  • the porous body of the present invention thus obtained can reduce the amount of the glass material than the amount of resin necessary for granulation with the resin, so that the volume fraction of the heat storage material can be increased, The amount of heat storage can be increased.
  • the heat storage material particles are connected by the glass material, it has a strength higher than that required for handling.
  • the shape of the porous body of the present invention is not particularly limited and may be any shape, for example, a shape that matches the shape of the housing of the heat pump.
  • the present invention provides a heat storage device including the porous body.
  • the heat storage device of the present invention only needs to have a reaction chamber containing the porous body of the present invention in the housing.
  • the heat storage device of the present invention comprises a reaction chamber containing the porous body of the present invention and a condensing evaporation chamber for condensing or evaporating a condensable component generated by heat absorption of the heat storage material. More preferably, it has a communication part for connecting the reaction chamber and the condensation evaporation chamber so that the condensable component can move between the reaction chamber and the condensation evaporation chamber.
  • a device having such a configuration can be understood as a so-called heat pump.
  • the present invention also provides an electronic component and an electronic apparatus having the heat storage device of the present invention.
  • the electronic component is not particularly limited, but for example, an integrated circuit (IC) such as a central processing unit (CPU), a power management IC (PMIC), a power amplifier (PA), a transceiver IC, and a voltage regulator (VR).
  • IC integrated circuit
  • CPU central processing unit
  • PMIC power management IC
  • PA power amplifier
  • TFT field effect transistors
  • mobile electronic devices such as a smart phone, a mobile phone, a tablet-type terminal, a laptop personal computer, a portable game machine, a portable music player, a digital camera, etc. are mentioned. It is done.
  • Example 1 Zeolite powder (density: 2 g / cc D50: 10 ⁇ m) as heat storage material, glass powder (composition: Sn—PO density: 3 g / cc D50: 10 ⁇ m) as glass material, vinyl alcohol resin as resin These were mixed with water to form a slurry, and formed into a sheet on a carrier film by the doctor blade method. The mixing ratio of zeolite / glass material / resin / water was 95/5/10/100 by weight. The obtained sheets were laminated, press-bonded, and cut into a predetermined size (50 mm ⁇ 50 mm). This was heat-treated in the air at 400 ° C., and the resin was removed to obtain a porous body. The external dimensions of the sheet before the heat treatment and the external dimensions of the porous body after the heat treatment were substantially the same. The porosity was 30%.
  • Comparative Example 1 As a heat storage material, the same zeolite powder as in Example 1, the same vinyl alcohol resin as in Example 1 (density: 1 g / cc) and water mixed into a slurry were granulated and dried, and the average particle size was 200 ⁇ m. Of granulated powder was obtained. This granulation size is such a size that it is difficult for a dance to occur during hermetic sealing. The mixing ratio of zeolite / resin / water was 100/10/80 by weight.
  • Example 1 -Production of heat storage device
  • the porous body of Example 1 obtained above was stored in the reaction chamber of the housing of the heat storage device having the same internal dimensions as the porous body, and the lid was laser-welded and hermetically sealed.
  • the granulated powder of Comparative Example 1 was stored in a reaction chamber having the same dimensions as described above.
  • a plate heater was brought into contact with the surface of the reaction chamber of the enclosure, and a thermocouple was fixed on the opposite surface of the heater. The heater was heated at 1 W, and the time from the start of heating to 100 ° C. was compared.
  • Example 1 In the porous body of Example 1, it was 1200 seconds, whereas in the granulated powder of Comparative Example 1, it was 550 seconds.
  • the porous body of Example 1 was able to alleviate the temperature rise as compared with the granulated powder of Comparative Example 1. This is considered to be largely due to the difference in the volume fraction of zeolite.
  • the volume fraction of zeolite in the porous body ie relative to the reaction chamber volume
  • the volume fraction in the particles was 57%, and this was regarded as a sphere and was packed most closely (filling rate 76%).
  • the volume fraction of zeolite relative to is 43%.
  • the porous body of this invention can enlarge the volume fraction of a zeolite, it is thought that the heat storage amount became large. Furthermore, in the granulated powder of Comparative Example 1, since the zeolite particles are covered with the resin, there can be relatively many particles that cannot desorb water molecules. On the other hand, in the porous body of Example 1, there can be a small amount of glass around the zeolite particles, but there are many spaces (pores) formed by removing the resin, so that the zeolite particles cannot desorb water molecules. Is relatively low. For the above reasons, it is considered that there is a difference in the heat absorption of the heater.
  • the present invention is suitable for suppressing temperature rise of heat-generating components in mobile electronic devices such as smartphones, mobile phones, tablet terminals, laptop computers, portable game machines, portable music players, and digital cameras.
  • mobile electronic devices such as smartphones, mobile phones, tablet terminals, laptop computers, portable game machines, portable music players, and digital cameras.
  • the present invention is not limited to this.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

L'invention fournit un corps poreux qui présente un important volume de stockage de chaleur, et qui consiste en un corps composite d'un matériau accumulant la chaleur et d'un matériau de verre.
PCT/JP2015/064949 2014-07-11 2015-05-25 Corps poreux, et dispositif de stockage de chaleur Ceased WO2016006339A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016532484A JP6350661B2 (ja) 2014-07-11 2015-05-25 多孔質体および蓄熱デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-143223 2014-07-11
JP2014143223 2014-07-11

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WO2016006339A1 true WO2016006339A1 (fr) 2016-01-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016153040A1 (ja) * 2015-03-26 2017-12-14 株式会社村田製作所 ヒートポンプ
KR102094412B1 (ko) * 2018-09-28 2020-03-27 한국에너지기술연구원 허니컴 구조의 열화학 열 저장재 및 그 제조 방법

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JPS62191456A (ja) * 1986-01-11 1987-08-21 デグツサ・アクチエンゲゼルシヤフト ゼオライト成形体、およびその製造法
JPH05293371A (ja) * 1992-04-20 1993-11-09 Matsushita Electric Ind Co Ltd 吸着剤組成物およびその製造方法
JPH0640783A (ja) * 1992-07-21 1994-02-15 Ngk Spark Plug Co Ltd 絶縁基板及びその製造方法
JP2008169265A (ja) * 2007-01-10 2008-07-24 Kaneka Corp 電気絶縁性高熱伝導性熱可塑性樹脂組成物及び高熱伝導性成形体
WO2014021262A1 (fr) * 2012-08-03 2014-02-06 株式会社村田製作所 Appareil électronique
WO2014068628A1 (fr) * 2012-10-29 2014-05-08 株式会社 日立製作所 Système de stockage de chaleur et système de génération d'énergie

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JP2004351244A (ja) * 2003-05-27 2004-12-16 Merutekku:Kk ガラス発泡体に触媒剤を積層してなる触媒体及びその触媒体の製造方法
JP5356305B2 (ja) * 2010-04-07 2013-12-04 株式会社ノリタケカンパニーリミテド 絶縁層を有する高熱伝導性基板ならびに該絶縁層形成用材料
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Publication number Priority date Publication date Assignee Title
JPS547760B2 (fr) * 1970-05-27 1979-04-10
JPS62191456A (ja) * 1986-01-11 1987-08-21 デグツサ・アクチエンゲゼルシヤフト ゼオライト成形体、およびその製造法
JPH05293371A (ja) * 1992-04-20 1993-11-09 Matsushita Electric Ind Co Ltd 吸着剤組成物およびその製造方法
JPH0640783A (ja) * 1992-07-21 1994-02-15 Ngk Spark Plug Co Ltd 絶縁基板及びその製造方法
JP2008169265A (ja) * 2007-01-10 2008-07-24 Kaneka Corp 電気絶縁性高熱伝導性熱可塑性樹脂組成物及び高熱伝導性成形体
WO2014021262A1 (fr) * 2012-08-03 2014-02-06 株式会社村田製作所 Appareil électronique
WO2014068628A1 (fr) * 2012-10-29 2014-05-08 株式会社 日立製作所 Système de stockage de chaleur et système de génération d'énergie

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016153040A1 (ja) * 2015-03-26 2017-12-14 株式会社村田製作所 ヒートポンプ
KR102094412B1 (ko) * 2018-09-28 2020-03-27 한국에너지기술연구원 허니컴 구조의 열화학 열 저장재 및 그 제조 방법

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JP6350661B2 (ja) 2018-07-04
JPWO2016006339A1 (ja) 2017-04-27

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