[go: up one dir, main page]

WO2016005200A1 - Composant passif connecté côté face inférieure d'un capteur - Google Patents

Composant passif connecté côté face inférieure d'un capteur Download PDF

Info

Publication number
WO2016005200A1
WO2016005200A1 PCT/EP2015/064412 EP2015064412W WO2016005200A1 WO 2016005200 A1 WO2016005200 A1 WO 2016005200A1 EP 2015064412 W EP2015064412 W EP 2015064412W WO 2016005200 A1 WO2016005200 A1 WO 2016005200A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
leadframe
lead frame
filter component
upper side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/064412
Other languages
German (de)
English (en)
Inventor
Jakob Schillinger
Dietmar Huber
Stefan GÜNTHNER
Thomas Fischer
Lothar Biebricher
Michael SCHULMEISTER
Waldemar BAUMUNG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Continental Teves AG and Co OHG
Original Assignee
Continental Automotive GmbH
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH, Continental Teves AG and Co OHG filed Critical Continental Automotive GmbH
Publication of WO2016005200A1 publication Critical patent/WO2016005200A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • H10W74/121—
    • H10W72/5473—
    • H10W74/00—
    • H10W90/753—

Definitions

  • the invention relates to a sensor for detecting a dependent of a physical quantity to be measured physical encoder field.
  • WO 2010/037 810 A1 discloses a sensor with a sensor circuit which is set up to output a sensor signal dependent on the physical variable to be measured via a physical encoder field dependent on a physical quantity to be measured.
  • a sensor for detecting a physical encoder field dependent on a physical variable to be measured comprises a leadframe having an upper side and a lower side opposite the upper side with a placement island, an interface and at least two interconnects leading from the interface to the assembly island sensor circuit carried by the upper side of the mounting island of the leadframe for detecting the encoder field and for outputting a sensor signal dependent on the encoder field via the sensor
  • the sensor is based on the consideration that the filter components mentioned in the context of the above-mentioned sensor electronic protective elements between the interface and the
  • EMC electrostatic discharge
  • the conductor tracks of the leadframe must be mechanically stiffened at the points to be bonded, which is why a support frame, also called dambar, is arranged around the conductor tracks, which mechanically supports the conductor tracks when the bonding wires are connected. So stable clamping of the conductor tracks is ensured during bonding and guaran- tees a consistently high quality of wire bond connections ⁇ .
  • the circumferential dambar is also used as a barrier when wrapping the sensor circuit in a protective mass, such as a thermoset mold.
  • the electronic protection element called filter component is arranged in the above-mentioned sensor, however, on the top of the lead frame, this circumferential dambar and the fil ⁇ terbauteil must be placed, but this unnecessarily increases the space. Therefore, it is proposed in the context of the specified sensor to arrange the filter component on the underside of the leadframe. In this way, the bonding point on the strip conductors of the lead frame can be arranged close to the peripheral dambar and at the same time the filter component within the circumferential dambar actually provided for the sensor circuit. Thus, the specified sensor comes with less space, which is a decisive advantage, especially in the automotive industry.
  • the encircling Dambar itself is removed before the completion, so after the Elnhausen the sensor circuit in the protective mass, so that it is not present on the finished sensor.
  • the filter element should expediently be designed capacitively in ⁇ example in the form of a filter capacitor.
  • the filter component is in a particular embodiment of the specified sensor, if it is to be used, for example, for the suppression of common mode noise, one-sided connected to the reference potential placement island and can be connected on the other side with the conductor of the lead frame, with respect to the suppressing common mode noise to the reference potential.
  • the non-operating electrical signals mentioned above may also contain mode interference which can be suppressed with the filter component thus then in manner known per se, when two Lei ⁇ terbahnen be shorted to each other with respect to this differential-mode interference.
  • the filter element should be targeted ⁇ suitably trained capacitive again.
  • the sensor circuit is electrically contacted with at least one of the conductor tracks via a bonding wire, which is seen from the Be Supplierinsel from the filter component to the conductor track electrically connected. Since the interconnects can be brought in the context of the specified sensor in the production close to the above-mentioned circumferential dambar, as already mentioned, a consistently high quality of the connection of the bonding wire to the conductor ensures, because the conductor during bonding with the bonding wire through the circumferential dambar can be kept mechanically stable.
  • the filter component is a passive electronic component, preferably a capacitive electronic passive component, such as a filter capacitor. In this way, the tracks of the leadframe for the external electrical signals can be short-circuited with the filter component, if they are common mode noise and are placed on the aforementioned reference potential, if these are contact noise.
  • the filter component itself can be connected in any way with the conductor tracks of the leadframe.
  • the filter component on the underside of the leadframe is glued to it and / or soldered, because this is mechanically particularly gentle for the bonding connections on the upper side of the leadframe
  • Sensor a worn on the top of the lead frame further filter component.
  • This filter component can then also be bonded to the leadframe together with the sensor circuit in a particularly advantageous manner, in order, for example, to be able to bridge large geometric distances.
  • a method for producing one of the specified sensors comprises the steps of equipping the top side of the leadframe with the sensor circuit, wiring the sensor circuit on the leadframe, and populating the wired and the sensor circuit
  • the indicated sensor may be an airbag acceleration sensor, a wheel speed sensor or an inertial sensor for a vehicle.
  • a vehicle includes a specified sensor.
  • 1 is a schematic view of a vehicle with a vehicle dynamics control
  • FIG. 2 shows a schematic representation of an inertial sensor in the vehicle of FIG. 1, FIG.
  • FIG. 3 shows an embodiment of the inertial sensor of FIG. 2 in a schematic sectional view
  • FIG. 4 shows the inertial sensor of FIG. 3 on a printed circuit board in a schematic side view
  • FIG. 5 shows the inertial sensor of FIG. 3 on a printed circuit board in a schematic plan view.
  • the same technical elements are provided with the same reference numerals and described only once.
  • Fig. 1 shows a schematic view of a vehicle 2 with a known vehicle dynamics control. Details of this driving dynamics control can be found for example in DE 10 2011 080 789 AI.
  • the vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown). It can happen in a manner known to those skilled in that lose the wheels 6 of the vehicle 2 their traction and the vehicle 2 even moves away from a predetermined, for example via a not shown steering wheel trajectory by understeer or oversteer. This is avoided by known control circuits such as ABS (antilock braking system) and ESP (electronic stability program).
  • ABS antilock braking system
  • ESP electronic stability program
  • the below mentioned driving dynamics data 16 inertial data of the vehicle 2 detects the ⁇ example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a longitudinal acceleration and / or vertical acceleration of the vehicle 2 may include.
  • a controller 18 can determine in a manner known to those skilled, whether the vehicle 2 slips on the road or even deviates from the above-mentioned predetermined trajectory and respond with a known controller output signal 20 to respond.
  • the controller output signal 20 may then be used by an actuator 22 to communicate by means of Control signals 24 actuators, such as the brakes 8 to control, which respond to the slippage and deviation from the predetermined trajectory in a conventional manner.
  • the controller 18 may, for example, in a known per se
  • controller 18 and the adjusting device 22 may be formed as a common control device and optionally integrated in the aforementioned engine control.
  • Inertialsensor 14 as driving dynamics data 16, the indicated in Fig. 2 lateral acceleration 26 detected on the vehicle and the yaw rate 28, with which the vehicle 2 rotates about its vertical axis, because they are usually used in the context of the aforementioned stability program.
  • the invention is explained in more detail with reference to the inertial sensor 14, the invention can be applied to any desired sensors, such as the speed sensors 10 mentioned above.
  • Inertialsensors 14 explained in more detail with reference to FIGS. 2 and 3.
  • Inertialsensor 14 a transverse accelerometer 30 is arranged.
  • the Querbeatungsmessaufsmelling 30 is exposed ⁇ 32 of a physical timer field in the form of a Zentrifugalkraftfel that the
  • Querbeschleunmessmessetzillon 30 acts and accelerated to be detected with the lateral acceleration 26 to the vehicle 2.
  • the detected lateral acceleration 26 is then output to a signal conditioning circuit 34.
  • a Coriolis acceleration sensor 36 is arranged in the inertial sensor 14. Of the Coriolis accelerometer 36 is exposed to a physical encoder field in the form of a Coriolis force field 38. In response to the Coriolis force field 38, the
  • Coriolis Beschreibungsmessaufsmelling 36 associated evaluation device 42 can be converted into the yaw rate 28.
  • An example of how the yaw rate 28 can be detected based on a correlation field 38 is described in the publication DE 10 2010 002 796 A1, which is why it should be omitted here for the sake of brevity.
  • the detected yaw rate 28 is output to the signal conditioning circuit 34.
  • the thus detected lateral acceleration and yaw rate may 26 be post 28, for example, to reduce the noise band gap and to increase the Sig ⁇ nalches.
  • the thus processed lateral acceleration 26 and yaw rate 28 can then be output to an interface 44, which then sends the two detected signals to the controller 18 as driving dynamics data 16.
  • This interface 44 could, for example, be based on the PSI5 standard or the CAN standard.
  • Interconnections can be realized here via electrical lines in the form of bonding wires 50.
  • the interface 44 may be integrated into the signal conditioning circuit 34 and formed as an application specific integrated circuit, hereinafter called ASIC 34 (application-specific integrated circuit).
  • ASIC 34 application-specific integrated circuit
  • the sensor circuit 46 may also be surrounded by a mechanical decoupling material 51, also called Globetop mass 51, in the form of a silicone material, which in turn is common in a trained as a transfer molding material 52 protective compound 52, such as a thermoset may be encapsulated in the form of an epoxy 52.
  • a mechanical decoupling material 51 also called Globetop mass 51
  • protective compound 52 such as a thermoset may be encapsulated in the form of an epoxy 52.
  • corresponding contact possibilities protrude from the inertial sensor 14, such as legs 54 shown in FIG. 2 for making electrical contact with a circuit such as, for example, the regulator 18.
  • FIGS. 4 and 5 in which a development of the inertial sensor 14 is shown.
  • the leadframe 48 comprises a circumferential holding frame 56 or dambar 56.
  • a Be Glainsel 58 via webs 60 or Dambaranitatien 60 called.
  • These conductor tracks 62 are also held on the circumferential dambar 56.
  • the interconnects 62 within the circumferential dambar 56 are called inner leads, while the interconnects 62 outside the dambar 56 are called outer leads 54.
  • the measuring sensors 30, 36 and the signal conditioning circuit 34 are held together with a filter component in the form of a first filter element 64 on an upper side 66 of the leadframe 48 in the region of the mounting island 58.
  • a filter component in the form of a first filter element 64 on an upper side 66 of the leadframe 48 in the region of the mounting island 58.
  • This is typically a protective diode with at least one bonding point.
  • varistors, zener diodes, resistors, capacitors or the like as the filter element.
  • the bonding wires 50 interconnect the electrical components held on the upper side 66 in the form of the measuring sensors 30, 36, the signal converter. processing circuit 34, the first filter element 64 with the tracks 62 electrically.
  • a second filter element 70 On an underside 68 of the leadframe 48, which is opposite to the upper side 66 of the leadframe 48, further filter components in the form of a second filter element 70, a third filter ⁇ element 72, a fourth filter element 74 and a fifth filter element 76 are arranged. Depending on one of the second filter ⁇ element 70, the third filter element 72 and the fourth filter element 74 binds each one of the not with the
  • the fifth filter element 76 is connected in series in one of the conductor tracks. It is the
  • the leadframe 48 may be made of a copper alloy or a
  • Iron-nickel alloy can be made and as contacting layer for the bonding wires 50 comprise a silver layer.
  • Her ⁇ represent the inertial sensor 14 shown in Fig. 4 and 5 of the inertial sensor 14 on the top 66 is first fitted with the electronic components 30, 36, 34, 64 and electrically connected via the bonding wires 50.
  • Verbonden the bonding wires 50 are bonded to the contacting layer of the lead frame 48 at ⁇ , wherein the lead frame 48 is subjected to mechanical stresses. Therefore, the leadframe 48 becomes during the
  • the leadframe 48 on the underside 68 can be equipped with the remaining filter elements 70 to 76. These filter elements 70 to 76 are preferably glued and / or soldered.
  • the Drahtbondeducationen between the bonding wires 50 and the leadframe 48 should, when loading the leadframe 48 with the remaining filter elements 70 a force and / or wegüberwachter placement head can be used.
  • the inertial sensor 14 in the decoupling ⁇ mass 51 and the protective mass 52 is encased, 4 sake of clarity only the protective mass 52 is shown in Fig., As can also be omitted depending on the sensor to the isolation compound 51.
  • the circumferential dambar 56 is removed, for example, by punching from the finished inertial sensor 14 by free punching of the inertial sensor 14. The sensor thus formed can then be housed in another protective mass, not shown, to him before entering

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un capteur (14) servant à détecter une zone de détection physique (32, 38) fonction d'une grandeur physique à mesurer (16), comprenant : - une grille de connexion (48) présentant une face supérieure (66) et une face inférieure (68) opposée à la face supérieure (66) et comportant un îlot de montage (58) ; - une interface (54) et au moins deux tracés conducteurs (62) menant de l'interface (54) à l'îlot de montage (58) ; - un circuit de détection (46) placé sur la face supérieure (66) de l'îlot de montage (58) de la grille de connexion (48), et détectant la zone de détection (32, 38) et émettant par l'intermédiaire de l'interface (54) un signal de détection (26, 28) fonction de la zone de détection (32, 38) ; - et un élément filtre (70 à 76) porté sur la face inférieure (68) de la grille de connexion (48) et conçu pour filtrer les signaux électriques étrangers au fonctionnement au niveau des tracés conducteurs (62).
PCT/EP2015/064412 2014-07-08 2015-06-25 Composant passif connecté côté face inférieure d'un capteur Ceased WO2016005200A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213231.2 2014-07-08
DE102014213231.2A DE102014213231A1 (de) 2014-07-08 2014-07-08 Sensorunterseitig verschaltete passive Bauelemente

Publications (1)

Publication Number Publication Date
WO2016005200A1 true WO2016005200A1 (fr) 2016-01-14

Family

ID=53491517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/064412 Ceased WO2016005200A1 (fr) 2014-07-08 2015-06-25 Composant passif connecté côté face inférieure d'un capteur

Country Status (2)

Country Link
DE (1) DE102014213231A1 (fr)
WO (1) WO2016005200A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060022315A1 (en) * 2004-08-02 2006-02-02 Siliconware Precision Industries Co., Ltd. Semiconductor package with stacked chips and method for fabricating the same
US20060220189A1 (en) * 2005-03-30 2006-10-05 Noriaki Sakamoto Semiconductor module and method of manufacturing the same
WO2010037810A1 (fr) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Procédé de réalisation d'un élément de détection de vitesse
DE102010002796A1 (de) 2009-03-11 2010-09-16 Continental Teves Ag & Co. Ohg Doppelaxialer Drehratensensor
DE102011080789A1 (de) 2010-08-10 2012-02-16 Continental Teves Ag & Co. Ohg Verfahren und System zur Regelung der Fahrstabilität
DE102013214915A1 (de) * 2012-07-30 2014-01-30 Continental Teves Ag & Co. Ohg Verdrahtungseinrichtung zum Verdrahten einer elektronischen Vorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2850640B2 (ja) * 1992-04-28 1999-01-27 株式会社デンソー 混成集積回路装置
US6054764A (en) * 1996-12-20 2000-04-25 Texas Instruments Incorporated Integrated circuit with tightly coupled passive components
US6486535B2 (en) * 2001-03-20 2002-11-26 Advanced Semiconductor Engineering, Inc. Electronic package with surface-mountable device built therein
US6608375B2 (en) * 2001-04-06 2003-08-19 Oki Electric Industry Co., Ltd. Semiconductor apparatus with decoupling capacitor
US20080013298A1 (en) * 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
US8116102B2 (en) * 2007-12-26 2012-02-14 Infineon Technologies Ag Integrated circuit device and method of producing
US9666788B2 (en) * 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
DE102012224075A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Sensor zum Erfassen einer Position eines Geberelements

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060022315A1 (en) * 2004-08-02 2006-02-02 Siliconware Precision Industries Co., Ltd. Semiconductor package with stacked chips and method for fabricating the same
US20060220189A1 (en) * 2005-03-30 2006-10-05 Noriaki Sakamoto Semiconductor module and method of manufacturing the same
WO2010037810A1 (fr) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Procédé de réalisation d'un élément de détection de vitesse
DE102010002796A1 (de) 2009-03-11 2010-09-16 Continental Teves Ag & Co. Ohg Doppelaxialer Drehratensensor
DE102011080789A1 (de) 2010-08-10 2012-02-16 Continental Teves Ag & Co. Ohg Verfahren und System zur Regelung der Fahrstabilität
DE102013214915A1 (de) * 2012-07-30 2014-01-30 Continental Teves Ag & Co. Ohg Verdrahtungseinrichtung zum Verdrahten einer elektronischen Vorrichtung

Also Published As

Publication number Publication date
DE102014213231A1 (de) 2016-01-14

Similar Documents

Publication Publication Date Title
EP0740365B1 (fr) Module de commande pour automobile
EP2526545B1 (fr) Capteur a attenuation
WO2014095500A1 (fr) Procédé de fabrication d'un ensemble électronique
WO2014020034A1 (fr) Système de câblage d'un dispositif électronique
DE10054964B4 (de) Beschleunigungssensor mit einem Beschleunigungsdetektorchip in dem Durchgangsloch eines Signalverarbeitungschips auf einem Montageträger
DE102009001969A1 (de) Sensormodul
DE10201710A1 (de) Halbleitersensor für eine physikalische Größe
DE102011053434A1 (de) Bauteil zur Verwendung als doppelseitiges Sensorgehäuse
WO2014095316A2 (fr) Dispositif électronique et procédé de production d'un dispositif électronique
DE102008054735A1 (de) Leadless-Gehäusepackung
EP3167253B1 (fr) Découplage de vibration de capteurs
EP3194897B1 (fr) Détection d'humidité au sein d'un capteur
DE102004019428A1 (de) Halbleiterbauteil mit einem Hohlraumgehäuse und Verfahren zur Herstellung desselben
WO2016005609A2 (fr) Détecteur spécifique au client réalisé par triple moulage
WO2015078959A1 (fr) Procédé permettant de produire un module électronique
WO2016005200A1 (fr) Composant passif connecté côté face inférieure d'un capteur
WO2016005201A1 (fr) Capteur pourvu d'une anode sacrificielle
WO2015162014A1 (fr) Surveillance d'un capteur inertiel 3 axes au moyen d'un capteur inertiel 2 axes
DE102015206299B4 (de) Über Leiterplatte auf Leadframe verschaltete Sensorschaltung
DE102009027330A1 (de) Sensoranordnung und Verwendung einer Sensoranordnung
DE10134646A1 (de) Sensorelement
DE102015207533A1 (de) Schirmung als Silikonvergusshalter
DE102014210523A1 (de) Spannungsarmes Verkleben von Sensorchips
DE19903652B4 (de) Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten
WO2018069068A1 (fr) Dispositif capteur de pression micromécanique et procédé de fabrication correspondant

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15732229

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15732229

Country of ref document: EP

Kind code of ref document: A1