WO2016002911A1 - 樹脂、感光性樹脂組成物、硬化物、カラーフィルタ及び画像表示装置 - Google Patents
樹脂、感光性樹脂組成物、硬化物、カラーフィルタ及び画像表示装置 Download PDFInfo
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- WO2016002911A1 WO2016002911A1 PCT/JP2015/069210 JP2015069210W WO2016002911A1 WO 2016002911 A1 WO2016002911 A1 WO 2016002911A1 JP 2015069210 W JP2015069210 W JP 2015069210W WO 2016002911 A1 WO2016002911 A1 WO 2016002911A1
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- 0 *Oc1ccccc1 Chemical compound *Oc1ccccc1 0.000 description 8
- VYABQMQHKUWKAI-UHFFFAOYSA-N C(COCC1OC1)OCCOc1ccc(C2(CCCCCCCCCCC2)c(cc2)ccc2OCCOCCOCC2OC2)cc1 Chemical compound C(COCC1OC1)OCCOc1ccc(C2(CCCCCCCCCCC2)c(cc2)ccc2OCCOCCOCC2OC2)cc1 VYABQMQHKUWKAI-UHFFFAOYSA-N 0.000 description 1
- YXXPHIZRGOBGOX-YBFXNURJSA-N C/C(/C(c(cc1)ccc1Sc(cc1)ccc1C(O)=O)=O)=N\OC(C)=O Chemical compound C/C(/C(c(cc1)ccc1Sc(cc1)ccc1C(O)=O)=O)=N\OC(C)=O YXXPHIZRGOBGOX-YBFXNURJSA-N 0.000 description 1
- MEAGLESDIMAOCW-DEDYPNTBSA-N C/C(/C(c(cc1)ccc1Sc(cc1)ccc1OCCO)=O)=N\OC(C)=O Chemical compound C/C(/C(c(cc1)ccc1Sc(cc1)ccc1OCCO)=O)=N\OC(C)=O MEAGLESDIMAOCW-DEDYPNTBSA-N 0.000 description 1
- ZCXPKFMAGLTYSZ-UHFFFAOYSA-N CCC(C)(COC)CON Chemical compound CCC(C)(COC)CON ZCXPKFMAGLTYSZ-UHFFFAOYSA-N 0.000 description 1
- BDTCIUFGZLIUAG-YBFXNURJSA-N CC[n](c(ccc(/C(/C)=N/OC(C)=O)c1)c1c1c2)c1ccc2[N+]([O-])=O Chemical compound CC[n](c(ccc(/C(/C)=N/OC(C)=O)c1)c1c1c2)c1ccc2[N+]([O-])=O BDTCIUFGZLIUAG-YBFXNURJSA-N 0.000 description 1
- BXWJSZFPMIBKFS-ZIADKAODSA-N CC[n](c(ccc(/C(/c(c(C)c1)ccc1OC(C)COC)=N/OC(C)=O)c1)c1c1c2)c1ccc2[N+]([O-])=O Chemical compound CC[n](c(ccc(/C(/c(c(C)c1)ccc1OC(C)COC)=N/OC(C)=O)c1)c1c1c2)c1ccc2[N+]([O-])=O BXWJSZFPMIBKFS-ZIADKAODSA-N 0.000 description 1
- XKIGCIPCGYDJGO-UHFFFAOYSA-N COC1=CC=C[I]=C1 Chemical compound COC1=CC=C[I]=C1 XKIGCIPCGYDJGO-UHFFFAOYSA-N 0.000 description 1
- KZEFKGAYSYUQSG-UHFFFAOYSA-N NOCCCCOc1ccc(C2(CCCCCCCCCCC2)c(cc2)ccc2OCCCCON)cc1 Chemical compound NOCCCCOc1ccc(C2(CCCCCCCCCCC2)c(cc2)ccc2OCCCCON)cc1 KZEFKGAYSYUQSG-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
Definitions
- the present invention relates to a resin, a photosensitive resin composition, a cured product, a color filter, and an image display device.
- a resin of a photosensitive resin composition a resin having good sensitivity and resolution
- a photosensitive resin composition containing the resin a cured product obtained by curing the resin
- a color having the cured product The present invention relates to a filter and an image display device including the color filter.
- a color filter usually forms a black black matrix (hereinafter sometimes abbreviated as “BM”) on the surface of a transparent substrate such as glass or plastic, and then three types such as red, green, and blue.
- BM black black matrix
- the above different pixels are sequentially formed in a striped pattern or a mosaic pattern.
- the pigment dispersion method is currently used as a representative method for producing color filters.
- a photosensitive resin composition containing a black pigment is applied on a transparent substrate, dried, further exposed to an image, developed, and then cured by high-temperature treatment at 200 ° C. or higher to form a BM.
- a color filter is formed by repeating this for each color such as red, green, and blue.
- the BM is generally arranged in a grid, stripe, or mosaic between pixels such as red, green, and blue, and has a role of preventing contrast improvement or light leakage by suppressing color mixture between pixels. Yes. For this reason, the BM is required to have high light shielding properties.
- the pigment content in the photosensitive resin composition tends to be higher in order to exhibit sufficient light shielding properties when thinned.
- a composition containing a coloring material, a dispersant, a solvent, and the like is dispersed with glass beads or the like to prepare a dispersion. Then, it stir-mixes with binder resin, a photoinitiator, etc., and produces the photosensitive resin composition.
- an uncured portion is subjected to alkali development after being cured by UV exposure through a mask so that pixels such as BM, red, green and blue can be formed.
- a removable alkali-soluble resin having a carboxyl group or the like is used.
- an acrylic copolymer resin obtained by copolymerizing acrylic acid has been used as an alkali-soluble resin having a carboxyl group.
- Patent Document 1 describes examples of epoxy acrylate resins having various bisphenoxy skeletons.
- Patent Document 2 describes an example of an epoxy acrylate resin having an adamantyl group.
- Patent Document 3 has a bisphenoxy skeleton and a specific alkylidene group as an epoxy resin used in applications such as light emitting devices such as LEDs or light receiving devices such as solar cells, which are excellent in heat resistance and moisture absorption. Epoxy resins are described.
- Patent Documents 1 and 2 When the present inventors examined, when using the epoxy acrylate resin described in Patent Documents 1 and 2, depending on the color material content ratio in the photosensitive resin composition, the sensitivity or resolving power deteriorates, It has been found that good BM or pixels cannot be formed. In particular, when trying to form a fine line pattern under conditions where the color material content ratio is high, sufficient curing cannot be performed due to a decrease in sensitivity, and the pattern is excessively removed during development, resulting in the width of the opening of the mask. It was found that only a pattern having a narrow width was obtained, and control of the pattern shape was difficult. Further, Patent Document 3 does not describe any photosensitive resin composition for a color filter, and characteristics when used as a resin for the photosensitive resin composition were unknown.
- the present invention is a resin that is excellent in sensitivity and resolution and can form a good color filter regardless of the pigment content in the photosensitive resin composition when applied as a resin in the photosensitive resin composition. It is an object of the present invention to provide a photosensitive resin composition containing the resin, a cured product obtained by curing the photosensitive resin composition, a color filter having the cured product, and an image display device including the color filter.
- a resin including at least a partial structure represented by the following formula (I) and a partial structure represented by the following formula (II).
- R 12 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 5 is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, k is an integer of 1 to 5, and l is an integer of 0 to 13 is there.
- Each * is a bond independently.
- R 1 to R 4 have the same meanings as the formula (II). Each * is a bond independently.
- the resin according to [1], wherein the resin including a partial structure represented by the formulas (I) and (II) is a resin including a partial structure represented by the following formula (IV).
- each R 11 is independently an alkylene group having 1 to 5 carbon atoms, and m is an integer of 0 to 5.
- R 1 to R 5 , k and l are as defined in the above formula (II).
- R 12 is independently synonymous with the formula (I).
- Each * is a bond independently.
- the resin according to [3], wherein the partial structure represented by the formula (IV) is a partial structure represented by the following formula (V).
- R 1 to R 4 , R 11 , R 12 and m are each independently synonymous with the formula (IV). Each * is a bond independently.
- Z ′ represents a polyvalent methylol residue.
- n ′ is an integer of 2 to 6. * Is a bond.
- R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 5 is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, and R 11 is an alkylene group having 1 to 5 carbon atoms.
- k is an integer of 1 to 5
- l is an integer of 0 to 13
- m is an integer of 0 to 5.
- the resin according to [8], wherein the (A-1) epoxy group-containing compound is a compound represented by the following formula (XI).
- R 1 to R 4 , R 11 , and m are each independently synonymous with the formula (X).
- the resin according to [10] which is obtained by further reacting with (A-4) a polybasic acid anhydride and (A-4) a polyhydric alcohol.
- the polyhydric alcohol is at least one selected from the group consisting of trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol.
- a photosensitive resin composition comprising at least the resin (resin (a-1)) according to any one of [1] to [13] and a photopolymerization initiator (b).
- the photosensitive resin composition according to [14] further containing a color material (d).
- the photosensitive resin composition according to [17] wherein the content ratio of the black pigment is 45% by mass or more based on the total solid content.
- An image display device comprising the color filter according to [21].
- a good color filter when applied as a resin in a photosensitive resin composition, a good color filter can be formed with excellent sensitivity and resolution regardless of the pigment content in the photosensitive resin composition.
- a resin, a photosensitive resin composition containing the resin, a cured product obtained by curing the resin, a color filter having the cured product, and an image display device including the color filter can be provided.
- FIG. 1 is a schematic cross-sectional view showing an example of an organic EL device provided with the color filter of the present invention.
- (meth) acryl means “acryl and / or methacryl”, and the same applies to “(meth) acrylate” and “(meth) acryloyl”.
- acid (anhydride) and “(anhydrous)... Acid” mean that both an acid and its anhydride are included.
- total solid content means all components other than the solvent contained in the photosensitive resin composition or in the ink described later.
- the number average molecular weight and the weight average molecular weight mean a number average molecular weight (Mn) and a weight average molecular weight (Mw) in terms of polystyrene by GPC (gel permeation chromatography).
- the “amine value” means an amine value in terms of effective solid content, unless otherwise specified, and is a value represented by the weight of KOH equivalent to the base amount per 1 g of the solid content of the dispersant. It is. The measuring method will be described later.
- the “acid value” represents an acid value in terms of effective solid content unless otherwise specified, and is calculated by neutralization titration.
- the “carboxylic acid residue” means a group remaining after removing all carboxyl groups from the carboxylic acid compound.
- the carboxylic acid residue in the carboxylic acid compound represented by A-COOH means a monovalent group represented by A.
- polyhydric alcohol residue means a group remaining after removing all hydroxyl groups from the polyhydric alcohol compound.
- multivalent methylol residue means a group remaining after removing all methylol groups (—CH 2 —OH groups) from the polyvalent methylol compound.
- the bond may be indicated using “*”.
- the numerical range may be indicated by using “ ⁇ ”, which means a numerical range including an upper limit value and a lower limit value.
- the resin of the present invention includes at least a partial structure represented by the following formula (I) and a partial structure represented by the following formula (II). It is characterized by that.
- the resin (a-1) has a bulky structure as shown in the following formula (II), and also has an ethylenically unsaturated group structure as shown in the following formula (I). Or there exists a tendency which is excellent in hardened
- R 12 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 5 is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, k is an integer of 1 to 5, and l is an integer of 0 to 13 is there.
- Each * is a bond independently.
- R 12 in the partial structure represented by the formula (I) is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- the carbon number of the alkyl group represented by R 12 in formula (I) is usually 1 or more, preferably 6 or less, more preferably 3 or less, and still more preferably 2 or less.
- the number of carbon atoms is in the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is good. Tend to be.
- methyl group, ethyl group, 1-propyl group, 2-propyl group, 1-butyl group, 2-butyl group, 1-pentyl group, 2-pentyl group, 3-pentyl group, 1-hexyl group, 2 A -hexyl group, a 3-hexyl group, or a cyclohexyl group is preferable, a methyl group, an ethyl group, a 1-propyl group, or a 2-propyl group is more preferable, and a methyl group is more preferable.
- the carbon number of the aryl group represented by R 12 in formula (I) is usually 6 or more, usually 20 or less, preferably 15 or less, and more preferably 10 or less.
- the carbon number of the aralkyl group of R 12 in formula (I) is usually 7 or more, and usually 20 or less, preferably 15 or less, more preferably 11 or less.
- the number of carbon atoms is in the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is good.
- R 12 in the formula (I) is preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and a hydrogen atom or a methyl group exhibits the characteristics of the present invention most. It is particularly preferable because it tends to be generated.
- the content of the partial structure represented by the formula (I) is not particularly limited, but is preferably 1% by mass or more based on the total mass of the resin (a-1). It is more preferably 5% by mass or more, more preferably 50% by mass or less, and even more preferably 40% by mass or less.
- the curing characteristics such as chemical resistance tend to be good
- the compatibility with other components tends to be good.
- [Partial structure represented by formula (II)] K in the cycloalkylidene group in the partial structure represented by the formula (II) is an integer of 1 to 5, preferably an integer of 2 or more, preferably an integer of 4 or less, more preferably 3.
- cycloalkylidene group a cycloundecylidene group, a cyclododecylidene group, or a cyclotridecylidene group is preferable, and a cyclododecylidene group is particularly preferable.
- R 5 which is a substituent that the cycloalkylidene group in the partial structure represented by the formula (II) may have is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or An aralkyl group having 7 to 20 carbon atoms.
- the carbon number of the alkyl group of R 5 is usually 1 or more, and usually 20 or less, preferably 15 or less, more preferably 10 or less, further preferably 5 or less, still more preferably 3 or less, and more preferably 2 or less. Particularly preferred. When the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is good. Tend to be.
- a 1-yl group may be mentioned.
- methyl group, ethyl group, 1-propyl group, 2-propyl group, 1-butyl group, 2-butyl group, 1-pentyl group, 2-pentyl group, 3-pentyl group, 1-hexyl group, 2 A -hexyl group, a 3-hexyl group, or a cyclohexyl group is preferable, a methyl group, an ethyl group, a 1-propyl group, or a 2-propyl group is more preferable, and a methyl group is more preferable.
- the carbon number of the aryl group of R 5 is usually 6 or more, usually 20 or less, preferably 15 or less, more preferably 10 or less, and further preferably 8 or less.
- the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is high. There is a tendency to improve.
- a phenyl group or a naphthyl group is preferable, and a phenyl group is more preferable.
- the carbon number of the aralkyl group of R 5 is usually 7 or more, usually 20 or less, preferably 15 or less, more preferably 11 or less, and further preferably 9 or less.
- the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is high. There is a tendency to improve.
- a benzyl group or a methylenenaphthyl group is preferable, and a benzyl group is more preferable.
- R 5 is preferably an alkyl group having 1 to 10 carbon atoms, and more preferably a methyl group from the viewpoint of exhibiting the best resin characteristics.
- l which is the number of substituents R 5 that the cycloalkylidene group may have, is an integer of 0 to 13, preferably an integer of 4 or less, and more Preferably it is an integer of 2 or less.
- l is 0, that is, the case where there is no substituent is particularly preferable.
- R 5 may be the same or different, and the substitution positions may be the same or different.
- R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms. It is.
- the carbon number of the alkyl group in R 1 to R 4 is usually 1 or more, and usually 20 or less, preferably 15 or less, more preferably 10 or less. It is further preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less.
- the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is high. There is a tendency to improve.
- a 1-yl group may be mentioned.
- the carbon number of the aryl group in R 1 to R 4 is usually 6 or more, usually 20 or less, preferably 15 or less, more preferably 10 or less, and further preferably 8 or less. .
- the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is high. There is a tendency to improve.
- a phenyl group or a naphthyl group is preferable, and a phenyl group is more preferable.
- the carbon number of the aralkyl group in R 1 to R 4 is usually 7 or more, usually 20 or less, preferably 15 or less, more preferably 11 or less, and further preferably 9 or less. .
- the number of carbon atoms is within the above range, curing properties such as chemical resistance tend to be good, and when used as a resin in a photosensitive resin composition, compatibility with other components is high. There is a tendency to improve.
- a benzyl group or a methylenenaphthyl group is preferable, and a benzyl group is more preferable.
- R 1 to R 4 may be the same or different.
- R 1 to R 4 are preferably hydrogen atoms from the viewpoint of heat resistance, and are preferably methyl groups from the viewpoint of chemical resistance.
- substitution positions of R 1 to R 4 in the formula (II) are not particularly limited, and examples thereof include any of the positions b to f in the following formula (II ′), and R 1 to R 4 are each independently a carbon.
- R 1 to R 4 are each independently a carbon.
- the substitution position thereof is any one of b, c, e, and f. It is preferably a position, and more preferably a position b or f.
- the substitution position of the cycloalkylidene group may be any of the positions b to f in the following formula (II ′). However, when heat resistance based on the cycloalkylidene group is efficiently obtained, From the point of view, the position d is preferred.
- R 1 to R 5 , k and l have the same definitions as in the formula (II).
- partial structure of the formula (II) include the following, but are not limited to the following.
- numerical value described in the cycloalkylidene group in the following chemical formula indicates the carbon number of the cycloalkylidene group.
- (A-1-9) is particularly preferable.
- the partial structure of the formula (II) is any of these structures, curing characteristics such as chemical resistance tend to be good, and when used as a resin in the photosensitive resin composition, The compatibility with the components tends to be good, and the properties of the resin tend to be expressed well.
- the resin (a-1) includes any structure selected from the following (A-1-29) to (A-1-32) as a structure including the partial structure of (A-1-1). You may go out.
- the content ratio of the partial structure represented by the formula (II) is not particularly limited, but is preferably 10% by mass or more, more preferably 20% by mass or more, The content is preferably 95% by mass or less, and more preferably 90% by mass or less.
- the curing characteristics such as chemical resistance tend to be good, and when used as a resin in the photosensitive resin composition, the compatibility with other components tends to be good. There is.
- partial structure represented by formula (III) is preferably a partial structure represented by the following formula (III).
- R 1 to R 4 have the same meaning as in the above formula (II).
- Each * is a bond independently.
- the reason why the partial structure represented by the formula (II) is preferably a partial structure represented by the formula (III) is that curing properties such as chemical resistance tend to be good, When used as a resin in a photosensitive resin composition, the balance between good compatibility with other components and the effect resulting from the bulkiness of the cycloalkylidene group tends to be excellent, and the handleability is good There is a tendency.
- the partial structure represented by the formula (III) contained in the resin (a-1) may be one type or two or more types.
- the resin (a-1) may contain a partial structure that does not satisfy the formula (III) and satisfies the formula (II).
- the content ratio of the partial structure represented by the formula (III) in the partial structure represented by the formula (II) is such that the characteristics of the resin are easily exhibited well. From the viewpoint, 5% by mass or more is preferable, 10% by mass or more is more preferable, 20% by mass or more is more preferable, 50% by mass or more is more preferable, 80% by mass or more is particularly preferable, and usually 100% by mass. It is as follows.
- the resin (a-1) preferably includes a partial structure represented by the following formula (IV) as the partial structure represented by the formula (I) and the partial structure represented by the formula (II). That is, it is preferable that the resin including the partial structure represented by the formulas (I) and (II) is a resin including the partial structure represented by the following formula (IV).
- each R 11 is independently an alkylene group having 1 to 5 carbon atoms, and m is an integer of 0 to 5.
- R 1 to R 5 , k and l are as defined in the above formula (II).
- R 12 is independently synonymous with the formula (I).
- Each * is a bond independently.
- the reason why it is preferable to include the partial structure represented by the formula (IV) is that the partial structure has a bulky cycloalkylidene group, and the chemical resistance tends to be good.
- the partial structure represented by the formula (I) exists away from the bulky cycloalkylidene group, the influence of the steric hindrance is small, and it is easy to crosslink by ultraviolet irradiation or high heat. Tends to be even larger.
- a sensitivity becomes favorable with the improvement of a crosslinking reaction, and there exists a tendency for the tolerance with an alkali developing solution to become favorable.
- the carbon number in the alkylene group of R 11 in the above formula (IV) is usually 1 or more, preferably 2 or more, and usually 5 or less.
- hardening characteristics such as chemical resistance
- effect of resin of this invention to express favorably.
- the influence of steric hindrance due to the cycloalkylidene group tends to be small, and when the amount is not more than the upper limit value. Tends to have good compatibility with other components.
- the alkylene group for R 11 may be linear or branched. Specifically, methylene group, ethylene group, 1,3-propylene group, 1,2-propylene group, 1,4-butylene group, 1,2-butylene group, 1,5-pentylene group, 1,2- A pentylene group, a 1,3-pentylene group or a cyclopentylene group is preferred, and an ethylene group, a 1,3-propylene group, a 1,2-propylene group, a 1,4-butylene group, a 1,2-butylene group, 1 1,5-pentylene group, 1,2-pentylene group, or 1,3-pentylene group is more preferable.
- m is an integer of 0 to 5, preferably an integer of 2 or less, more preferably 0 or 1, and further preferably 0.
- curing properties such as chemical resistance tend to be good, and the effect of the resin (a-1) tends to be exhibited well.
- the resin (a-1) is used as a resin in the photosensitive resin composition, the influence of the steric hindrance of the cycloalkylidene group tends to be small, and the compatibility with other components is good. Tend to be.
- R 11 may be the same or different.
- * in the formula (IV) is a bond independently.
- the bond can be bonded to a hydrogen atom, or can be bonded to a bond of formula (VI) and / or formula (VII) described later.
- the partial structure represented by the formula (IV) contained in the resin (a-1) may be one type alone or two or more types.
- the content ratio of the partial structure represented by the formula (IV) in the resin (a-1) is not particularly limited, but is preferably 10% by mass or more, more preferably 20% by mass or more, The content is preferably 95% by mass or less, and more preferably 90% by mass or less. When it is within the above range, the curing characteristics such as chemical resistance tend to be good, and when used as a resin in the photosensitive resin composition, the resistance to an alkaline developer tends to be good. .
- the partial structure of the formula (IV) is preferably a partial structure represented by the following formula (V).
- R 1 to R 4 , R 11 , R 12 and m are each independently synonymous with the formula (IV).
- Each * is a bond independently.
- the cycloalkylidene group is a cyclododecylidene group, and thus the curing characteristics such as chemical resistance tend to be improved. It is mentioned that there is a tendency that the effect of can be expressed best. Further, when the resin (a-1) is used as the resin in the photosensitive resin composition, the resistance to the alkali developer tends to be good due to the bulkiness of the cyclododecylidene group. The influence of steric hindrance on the partial structure represented by (I) is also reduced, and the sensitivity or resistance to an alkaline developer tends to be improved.
- the partial structure represented by the formula (V) contained in the resin (a-1) may be one type alone or two or more types.
- the resin (a-1) may include a partial structure that does not satisfy the formula (V) and satisfies the formula (IV).
- the proportion of the partial structure represented by the formula (V) in the partial structure represented by the formula (IV) contained in the resin (a-1) is such that the characteristics of the present invention are easily expressed. From this point of view, it is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, still more preferably 50% by mass or more, and 80% by mass or more. Is particularly preferred. Moreover, it is 100 mass% or less normally.
- * in the formula (V) is a bond independently.
- the bond can be bonded to a hydrogen atom, or can be bonded to a bond of formula (VI) and / or formula (VII) described later.
- the resin (a-1) preferably further includes a partial structure represented by the following formula (VI) and / or a partial structure represented by the following formula (VII).
- X is a divalent carboxylic acid residue.
- Y is a tetravalent carboxylic acid residue.
- Each * is a bond independently.
- the resin (a-1) contains the partial structure represented by the formula (VI), that is, the resin (a-1) has at least one carboxyl group, whereby the resin (a-1) is added to the substrate.
- the resin (a-1) has at least one carboxyl group, whereby the resin (a-1) is added to the substrate.
- the adhesion to the substrate due to the carboxyl group of the polar group can be improved.
- the resin (a-1) is used as a resin in the photosensitive resin composition, it is easy to adjust the solubility during alkali development, and the adhesion to the substrate tends to be improved.
- X in the formula (VI) is not particularly limited as long as it is a divalent carboxylic acid residue, but as described later in the synthesis, from the viewpoint of ease of synthesis, a dibasic acid anhydride ( It is preferably a divalent carboxylic acid residue of dicarboxylic acid anhydride).
- Examples of the divalent carboxylic acid residue include a divalent hydrocarbon group which may have a substituent.
- the hydrocarbon group include aliphatic or aromatic hydrocarbons. What connected the aliphatic hydrocarbon and the aromatic hydrocarbon may be used. Further, it may be a linear or branched chain hydrocarbon group or a cyclic hydrocarbon group.
- the number of carbon atoms of the hydrocarbon group is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 20 or less, preferably 15 or less, from the viewpoint of improving substrate adhesion and chemical resistance. More preferably, it is 10 or less, More preferably, it is 8 or less.
- the substituent include a halogen atom, a hydroxyl group, an ether group, a carbonyl group, and the like, but unsubstituted is preferable.
- divalent carboxylic acid residues such as tetrahydrophthalic anhydride or succinic anhydride are more preferable. These dibasic acid anhydride divalent carboxylic acid residues may be used alone or in combination of two or more.
- the substrate adhesion and chemical resistance tend to be improved. Further, when used as a resin in the photosensitive resin composition, it becomes easy to adjust the solubility during alkali development, and the adhesion to the substrate tends to be improved.
- the resin (a-1) contains a partial structure represented by the above formula (VII), that is, the resin (a-1) has at least two carboxyl groups, so that adhesion to the substrate and chemical resistance are achieved. Tend to improve. Further, when the resin (a-1) is used as a resin in the photosensitive resin composition, it is easy to adjust the solubility during alkali development, and the adhesion to the substrate tends to be improved.
- the partial structure represented by the formula (VII) has two bonds
- two partial structures represented by the formula (IV) or (V) having an ethylenically unsaturated group are included.
- the molecular weight can be increased, and at the same time, the content of ethylenically unsaturated groups can be increased, the crosslinking reaction can be increased during curing, and the substrate adhesion and chemical resistance can be improved. Seem.
- Y in the formula (VII) is not particularly limited as long as it is a tetravalent carboxylic acid residue, but from the viewpoint of ease of synthesis as described later, 4-basic acid anhydride (tetracarboxylic acid anhydride) It is preferable that it is a tetravalent carboxylic acid residue.
- Examples of the tetravalent carboxylic acid residue include a tetravalent hydrocarbon group which may have a substituent.
- the hydrocarbon group may have a hetero atom such as an oxygen atom or a sulfur atom.
- examples of the hydrocarbon group include aliphatic or aromatic hydrocarbons. What connected the aliphatic hydrocarbon and the aromatic hydrocarbon may be used. Further, it may be a linear or branched chain hydrocarbon group or a cyclic hydrocarbon group.
- the number of carbon atoms of the hydrocarbon group is not particularly limited, but is usually 1 or more, preferably 5 or more, and usually 20 or less, preferably 15 or less, from the viewpoint of improving substrate adhesion and chemical resistance. It is.
- examples of the substituent include a halogen atom, a hydroxyl group, an ether group, a carbonyl group, and the like, but unsubstituted is preferable.
- tetravalent carboxylic acid dianhydrides such as pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, biphenyl ether tetracarboxylic dianhydride, etc.
- An acid residue is preferable, and a tetravalent carboxylic acid residue of biphenyltetracarboxylic anhydride is more preferable.
- These tetravalent acid anhydride tetravalent carboxylic acid residues may be used alone or in combination of two or more.
- Resin (a-1) is similar to the partial structure represented by the formula (VI) and / or the partial structure represented by the formula (VII) derived from the polybasic acid anhydride in addition to the partial structure described above.
- a partial structure may be included. Among these, the case where it contains a partial structure represented by the following formula (VI ′) derived from a tribasic acid anhydride is preferable.
- X ′ is a trivalent carboxylic acid residue. * Represents a bond.
- the resin (a-1) contains a partial structure represented by the formula (VI ′), that is, the resin (a-1) has at least two carboxyl groups, so that adhesion to the substrate, chemical resistance, etc. There is a tendency to improve the curing characteristics of. Further, when the resin (a-1) is used as a resin in the photosensitive resin composition, it is easy to adjust the solubility during alkali development, and the adhesion to the substrate tends to be good. .
- X ′ in the formula (VI ′) is not particularly limited as long as it is a trivalent carboxylic acid residue, but from the viewpoint of ease of synthesis as described later, a tribasic acid anhydride (tricarboxylic acid anhydride) is used. It is preferable that it is a trivalent carboxylic acid residue.
- Examples of the trivalent carboxylic acid residue include a trivalent hydrocarbon group which may have a substituent.
- the hydrocarbon group may have a hetero atom such as an oxygen atom or a sulfur atom.
- examples of the hydrocarbon group include aliphatic or aromatic hydrocarbons. What connected the aliphatic hydrocarbon and the aromatic hydrocarbon may be used. Further, it may be a linear or branched chain hydrocarbon group or a cyclic hydrocarbon group.
- the number of carbon atoms of the hydrocarbon group is not particularly limited, but is usually 1 or more, preferably 5 or more, and usually 20 or less, preferably 15 or less, from the viewpoint of improving substrate adhesion and chemical resistance. It is.
- examples of the substituent include a halogen atom, a hydroxyl group, an ether group, a carbonyl group, and the like, but unsubstituted is preferable.
- a trivalent carboxylic acid residue such as trimellitic anhydride or hexahydrotrimellitic anhydride is preferable, and a trivalent carboxylic acid residue of trimellitic anhydride is more preferable.
- the trivalent carboxylic acid residues of these tribasic acid anhydrides may be used alone or in combination of two or more.
- X ′ is as described above, curing characteristics such as substrate adhesion and chemical resistance tend to be improved. Further, when used as a resin in the photosensitive resin composition, it becomes easy to adjust the solubility during alkali development, and the adhesion to the substrate tends to be improved.
- the bond * in the partial structure represented by the formula (VI), the partial structure represented by the formula (VI ′), or the partial structure represented by the formula (VII) is, for example, independently It can be combined with a bond * in the partial structure represented by the formula (IV) or (V).
- the bond * in the partial structure represented by the formula (IV) or the partial structure represented by the formula (V) is, for example, a hydrogen atom or a moiety represented by the formula (VI).
- the structure and / or the bond may be combined with a bond * in the partial structure represented by the formula (VII).
- the partial structure represented by the formula (VI), the partial structure represented by the formula (VI ′), or the partial structure represented by the formula (VII) is represented by the formula (VII).
- a partial structure is preferred.
- the bond between the partial structure represented by the formula (VII) and the partial structure represented by the formula (IV) The ratio of bonds to hands is usually 10 to 90%, preferably 20 to 85%, more preferably 30 to 80%, where the total number of bonds * in the formula (IV) is 100%.
- the bond in the formula (IV) that is not bonded to the bond in the formula (VII) can be bonded to, for example, a hydrogen atom.
- Curing characteristics such as substrate adhesion and chemical resistance are improved by setting the proportion of bonds in the formula (IV) bonded to the bonds in the formula (VII) within the above range. Moreover, when used as a resin in the photosensitive resin composition, the solubility in an alkali developer and the adhesion to a substrate tend to be good.
- the resin of the present invention includes a partial structure represented by the formula (VI) in addition to the partial structure represented by the formula (VII). It is preferable.
- the content ratio is 70:30. It is preferably ⁇ 1: 99, more preferably 60:40 to 1:99.
- the content of the partial structure represented by the formula (VI) is 1 mol% with respect to the total content of the partial structure represented by the formula (VI) and the partial structure represented by the formula (VII). Preferably, it is 70 mol% or less, and more preferably 60 mol% or less.
- the content of the partial structure represented by the formula (VII) with respect to the total content of the partial structure represented by the formula (VI) and the partial structure represented by the formula (VII) is 30 mol%.
- the amount is 40 mol% or more, more preferably 99 mol% or less.
- the partial structure content ratio represented by the formula (VII) By setting the partial structure content ratio represented by the formula (VII) to be equal to or higher than the lower limit value, there is a tendency that a decrease in film properties of the obtained coating film can be suppressed, and the formula (VI) is used.
- the content rate of a partial structure By making the content rate of a partial structure more than the said lower limit, there exists a tendency for the increase in the viscosity of the resin solution obtained to be suppressed and for handleability to become favorable.
- the formula (VI ′) The content of the partial structure represented by) is not particularly limited, but from the viewpoint of curing properties such as substrate adhesion and chemical resistance, the bond of the partial structure represented by the formula (VI ′) and the formula ( The ratio of bonds to the bonds of the partial structure represented by IV) is usually 5 to 70%, preferably 10 to 40%, where the total number of bonds * in the formula (IV) is 100%. is there.
- the total number of bonds * in the formula (IV) is defined as 100%, of which the formula (VI), (VI ′) And the ratio of bonding to the bond of (VII) is usually 10 to 90%, preferably 20 to 85%, more preferably 30 to 80%.
- the bond * in the formula (IV) is, for example, bonded to a hydrogen atom. can do. By setting it within the above range, curing characteristics such as substrate adhesion and chemical resistance tend to be good.
- the bond * in the formula (VI) and the formula (VII) can be independently bonded to the bond * in the formula (IV) or (V).
- * which is a bond in the formula (IV) or (V) is independently a hydrogen atom, a bond * in the formula (VI), or a bond in the formula (VII). Can be combined with *.
- the resin of the present invention includes various embodiments.
- the bond * may be further combined with the bond * in the formula (V). That is, a plurality of partial structures represented by the formula (V) may be linked using the partial structure represented by the formula (VII) as a linking group.
- the resin (a-1) may contain a partial structure represented by the formula (VI ′) in addition to the partial structure represented by the formula (VI) and / or the formula (VII). preferable.
- * Which is a bond in the formula (VI ′) can also be bonded to * which is a bond in the formula (IV) and / or the formula (V).
- a structure containing the partial structure of -9) is preferred.
- the partial structure of (A-2-6) having two partial structures represented by the formula (VII), or the partial structure represented by the formula (VII) and the part represented by the formula (VI) is preferred.
- the bond * in the formula (VII) is further replaced by the partial structure represented by the formula (IV) or ( V) increases the molecular weight by combining with the partial structure represented by V), increases the content of the ethylenically unsaturated group structure, and further increases the content of the carboxyl group. It can be mentioned that there is a tendency to improve the curing properties such as chemical resistance.
- * which is a bond in the formula (IV) or (V) is independently a hydrogen atom, a bond in the formula (VI) *, or a bond in the formula (VI ′). *, Or a bond in a partial structure derived from other polybasic acid anhydrides, in addition to * or a bond in the formula (VII), as long as the effect of the present invention is not adversely affected. May be combined.
- the resin (a-1) preferably has a partial structure represented by the following formula (VIII) in addition to the partial structures of the above formulas (I) to (VII).
- Z is a polyhydric alcohol residue.
- n is an integer of 2 to 8. * Represents a bond.
- the molecular weight of the resin (a-1) can be increased, and the carboxyl group and the ethylenically unsaturated group can be increased. There is a tendency that the amount of introduction can be increased, and curing characteristics such as substrate adhesion or chemical resistance can be further improved.
- n is an integer of 2 to 8, and is preferably an integer of 4 or less.
- curing characteristics such as substrate adhesion or chemical resistance tend to be further improved.
- Z in the formula (VIII) is a polyhydric alcohol residue.
- an alcohol residue such as 1,2,3-propanetriol or a polyhydric alcohol residue such as a sugar alcohol described later can be used. Any compound can be used as long as it satisfies the above formula (VIII).
- Examples of the polyhydric alcohol residue include an n-valent hydrocarbon group which may have a substituent.
- the hydrocarbon group may have a hetero atom such as an oxygen atom or a sulfur atom.
- examples of the hydrocarbon group include aliphatic or aromatic hydrocarbons. What connected the aliphatic hydrocarbon and the aromatic hydrocarbon may be used. Further, it may be a linear or branched chain hydrocarbon group or a cyclic hydrocarbon group.
- the number of carbon atoms of the hydrocarbon group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 20 from the viewpoint of improving substrate adhesion and chemical resistance. Or less, preferably 15 or less, and more preferably 10 or less.
- examples of the substituent include a halogen atom, a hydroxyl group, an ether group, a carbonyl group, and the like, but unsubstituted is preferable.
- partial structure represented by the formula (VIII) include partial structures of the following formulas (A-3-1) to (A-3-4) or a formula (IX) described later.
- the case of having a partial structure represented by the following formula (A-3-1) or formula (IX) described later is more preferable from the viewpoint of curing characteristics such as substrate adhesion or chemical resistance.
- the resin of the present invention may contain a partial structure represented by the following formula (IX) as the partial structure represented by the formula (VIII).
- Z ' is a polyvalent methylol residue.
- n ′ is an integer of 2 to 6. * Represents a bond.
- n ′ is an integer of 2 to 6, but is preferably an integer of 2 to 4 from the viewpoint of curing characteristics such as substrate adhesion or chemical resistance.
- Z ′ in the formula (IX) is a polyvalent methylol residue, preferably a trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, or trimethylolethane polyvalent methylol residue, Others may be used as long as the formula (IX) is satisfied. Specific examples of the partial structure represented by the formula (IX) are given below.
- examples of the polyvalent methylol residue include an n′-valent hydrocarbon group which may have a substituent.
- the hydrocarbon group include aliphatic or aromatic hydrocarbons. What connected the aliphatic hydrocarbon and the aromatic hydrocarbon may be used. Further, it may be a linear or branched chain hydrocarbon group or a cyclic hydrocarbon group.
- the number of carbon atoms of the hydrocarbon group is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 20 or less, preferably 15 or less, from the viewpoint of improving substrate adhesion and chemical resistance. More preferably, it is 10 or less, and particularly preferably 5 or less.
- the substituent include a halogen atom, a hydroxyl group, an ether group, a carbonyl group, and the like, but unsubstituted is preferable.
- one type may be used alone, or two or more types may be used in combination.
- the resin (a-1) of the present invention is a carboxyl group. It can have at least one group.
- the resin (a-1) of the present invention May have at least two carboxyl groups.
- the resin (a-1) of the present invention can have at least two carboxyl groups and further increase the branched structure. Can be used.
- the formulas (A-2-3) and (A-2) having a partial structure represented by the formula (VII). -5), (A-2-6), and (A-2-9) can be combined with a bond in the partial structure.
- the molecular weight of the resin (a-1) of the present invention can be increased and a large amount of carboxyl groups or ethylenically unsaturated groups can be contained.
- * which is a bond in the formulas (VIII) and (IX) is the formula (A-2-3), (A -2-5), (A-2-6), or (A-2-9) is preferably bonded to * which is a bond.
- the content ratio of the partial structure represented by the formula (VIII) or the partial structure represented by the formula (IX) is not particularly limited, but in the formula (IV) or (V)
- the content ratio of the represented partial structure is 100 parts by mass, it is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and preferably 6 parts by mass or less.
- the amount is more preferably 5 parts by mass or less, and further preferably 4 parts by mass or less.
- curing characteristics such as substrate adhesion or chemical resistance tend to be good.
- the acid value of the resin (a-1) is usually 10 mg-KOH / g or more, preferably 50 mg-KOH / g or more, and the acid value is preferably 200 mg-KOH / g or less, 150 mg-KOH / g. The following is more preferable. When it is within the above range, curing characteristics such as substrate adhesion or chemical resistance tend to be well expressed.
- the weight average molecular weight of the resin (a-1) is preferably 1,500 or more, more preferably 2,000 or more, further preferably 3,000 or more, and 4,000 or more. More preferably, it is more preferably 5,000 or more. Moreover, it is preferable that it is 40,000 or less, and it is more preferable that it is 30,000 or less. When it is within the above range, curing characteristics such as substrate adhesion or chemical resistance tend to be well expressed.
- the resin (a-1) is obtained by reacting at least (A-1) an epoxy group-containing compound represented by the following formula (X) with (A-2) an unsaturated carboxylic acid or an unsaturated carboxylic acid ester.
- a resin is preferred.
- the resin obtained by the reaction of (A-1) and (A-2) is further converted into (A-3) a polybasic acid.
- a resin obtained by reacting with an anhydride is more preferable.
- R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms.
- R 5 is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, and
- R 11 is an alkylene group having 1 to 5 carbon atoms.
- k is an integer of 1 to 5
- l is an integer of 0 to 13
- m is an integer of 0 to 5.
- epoxy acrylate resin an epoxy group-containing compound represented by the formula (X) and (A-2) an unsaturated carboxylic acid or unsaturated carboxylic acid ester
- the partial structure represented by the formula (II) can be obtained from the epoxy group-containing compound represented by the formula (X) of (A-1), From the saturated carboxylic acid or unsaturated carboxylic acid ester, the partial structure represented by the formula (I) can be obtained. Moreover, as the epoxy acrylate resin, a resin containing a partial structure represented by the formula (IV) can be obtained.
- R 1 to R 4 , R 5 , R 11 and k, l, and m have the same meanings as the formulas (I) to (IV), and the formulas (I) to (V) Those mentioned above are preferred.
- epoxy group-containing compound represented by the formula (X) examples include (A-1-1) to (A-1-20) and (A-1-29) to (A-1-40). ) Corresponding to (A-1-1 ′) to (A-1-20 ′) and (A-1-29 ′) to (A-1-40 ′).
- any epoxy group-containing compound that satisfies the formula (X) can be applied to the present invention without being limited thereto.
- the numerical value described in the cycloalkylidene group in the following chemical formula indicates the carbon number of the cycloalkylidene group.
- Examples of the epoxy group-containing compound represented by the formula (X) include (A-1-9 ′) to (A-1-12 ′), (A-1-29 ′) to (A-1-40). ') Is preferred, any of (A-1-9') to (A-1-12 ') is more preferred, and (A-1-9') to (A-1- 11 ′) is more preferable, and (A-1-9 ′) is particularly preferable.
- the resin (a-1) tends to have good curing characteristics such as chemical resistance, and the characteristics of the resin (a-1) tend to be exhibited most. .
- the epoxy-containing compound represented by the formula (X) may be used alone or in combination of two or more.
- the epoxy group-containing compound represented by the formula (X) is preferably an epoxy group-containing compound represented by the following formula (XI).
- R 1 to R 4 , R 11 , and m are each independently synonymous with the formula (X).
- the reason why the compound represented by the formula (XI) is preferable is that, as described above, curing properties such as chemical resistance tend to be good, and the effect of the resin (a-1) can be expressed well.
- the epoxy group-containing compound of the formula (XI) is easy to handle and tends to be produced.
- Examples of the unsaturated carboxylic acid used in the synthesis reaction of the resin (a-1) of the present invention include unsaturated carboxylic acids having an ethylenically unsaturated group.
- hydroxyl-containing unsaturated compounds such as pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, trimethylolpropane diacrylate, glycidyl methacrylate acrylic acid adduct, glycidyl methacrylate methacrylic acid adduct
- acid anhydrides such as succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, and phthalic anhydride.
- (meth) acrylic acid are particularly preferred. These may be used alone or in combination of two or more.
- an unsaturated carboxylic acid ester can be used in place of the unsaturated carboxylic acid.
- ⁇ , ⁇ -unsaturated monocarboxylic acid ester can be used. Specific examples thereof include 2-succinoyloxyethyl acrylate, 2-maleoyloxyethyl acrylate, 2-phthaloyloxyethyl acrylate, 2-hexahydrophthaloyloxyethyl acrylate, and methacrylic acid.
- the epoxy group-containing compound and an unsaturated carboxylic acid are converted into a tertiary amine such as triethylamine or benzylmethylamine, a quaternary ammonium salt such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride, or benzyltriethylammonium chloride.
- Carboxylic acid can be added to the epoxy group-containing compound by reacting in an organic solvent at a reaction temperature of 50 to 150 ° C. for several to several tens hours using pyridine, triphenylphosphine or the like as a catalyst.
- the amount of the catalyst used is preferably 0.01 to 10% by mass, particularly preferably 0.3 to 5% by mass, based on the reaction raw material mixture (total of epoxy group-containing compound and unsaturated carboxylic acid).
- a polymerization inhibitor for example, methoquinone, hydroquinone, methylhydroquinone, p-methoxyphenol, pyrogallol, tert-butylcatechol and phenothiazine.
- the amount is preferably 0.01 to 10% by mass, particularly preferably 0.03 to 0.5% by mass, based on the reaction raw material mixture.
- the proportion of the unsaturated carboxylic acid added to the epoxy group of the epoxy group-containing compound is usually preferably from 90 to 100 mol%, more preferably from 95 to 100 mol%, particularly preferably from 100 mol%, based on the epoxy group. preferable. Since residual epoxy groups adversely affect storage stability, the unsaturated carboxylic acid is usually 0.8 to 1.5 equivalents, especially 0.9 to 1. It is preferable to carry out the reaction at a ratio of 1 equivalent.
- an epoxy acrylate resin having the following partial structure (hereinafter sometimes referred to as “(A-5) epoxy acrylate resin”) is obtained.
- An ethylenically unsaturated group can be introduced into the epoxy group-containing compound by an addition reaction between the epoxy group-containing compound and the unsaturated carboxylic acid, thereby imparting ultraviolet reactivity, that is, photocurability.
- the hydroxyl group produced by the addition reaction between the epoxy group-containing compound and the unsaturated carboxylic acid is further subjected to an addition reaction with a polybasic acid anhydride (A-3) described later to convert the carboxyl group as described later. It can be introduced or increased in molecular weight.
- (A-3): Polybasic acid anhydride As the polybasic acid anhydride used in the synthesis reaction of the resin (a-1), dibasic acid anhydride, tribasic acid anhydride, tetrabasic acid anhydride and the like can be preferably used.
- a partial structure represented by the formula (VI) is obtained from the dibasic acid anhydride, and a partial structure represented by the formula (VI ′) is obtained from the tribasic acid anhydride.
- a partial structure represented by the formula (VII) is obtained from the acid anhydride.
- tetrabasic acid anhydrides can be used, such as pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride and biphenyl ether tetracarboxylic acid.
- tetracarboxylic dianhydrides such as dianhydrides. These may be used individually by 1 type and may be used in combination of 2 or more type.
- biphenyltetracarboxylic dianhydride is particularly preferable.
- the polybasic acid anhydride when the resin of the present invention is used as the resin in the photosensitive resin composition, the molecular weight increases due to the crosslinking reaction, and the resulting adhesion to the substrate. There is a tendency that effects such as improvement in solubility, adjustment of solubility, improvement in sensitivity or alkali resistance are obtained.
- dibasic acid anhydride examples include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, Examples thereof include chlorendic anhydride and methyltetrahydrophthalic anhydride. Among these, tetrahydrophthalic anhydride or succinic anhydride is preferable. These dibasic acid anhydrides may be used individually by 1 type, and may be used in combination of 2 or more type.
- the solubility can be easily adjusted when the resin of the present invention is used as the resin in the photosensitive resin composition. There is a tendency for adhesion to improve.
- tribasic acid anhydrides examples include trimellitic anhydride and hexahydrotrimellitic anhydride, with trimellitic anhydride being particularly preferred. These tribasic acid anhydrides may be used individually by 1 type, and may be used in combination of 2 or more type.
- the amount of acid groups introduced into the resin molecule can be increased.
- the sensitivity is increased. , There is a tendency to easily balance the adhesion and developability.
- the addition rate of 4-basic acid anhydride to the hydroxyl group of (A-5) epoxy acrylate resin is usually 10 to 90 mol%, preferably 20 to 85 mol%, more preferably 30 to 80 mol%.
- a dibasic acid anhydride When used as a resin in the photosensitive resin composition, it is preferable to use a dibasic acid anhydride together with the above-described 4-basic acid anhydride from the viewpoint of viscosity control or solubility control.
- the ratio of the 4-basic acid anhydride to be equal to or higher than the lower limit value, there is a tendency to suppress a decrease in film properties of the obtained coating film, and by setting the ratio of the 2-basic acid anhydride to be equal to or higher than the lower limit value, There exists a tendency which can suppress the handleability fall by the increase in the viscosity of the resin solution obtained.
- 3 bases The amount of the acid anhydride to be used is usually 5 to 70 mol%, preferably 10 to 40 mol%, based on the hydroxyl group of the (A-5) epoxy acrylate resin.
- the addition rate of all polybasic acid anhydrides is usually 10 to 90 mol%, preferably 20 to 85 mol%, more preferably 30 to 80 mol%, based on the hydroxyl group of (A-5) epoxy acrylate resin. It is. (A-5) Of the hydroxyl groups of the epoxy acrylate resin, the portion where the polybasic acid does not undergo addition reaction may remain as hydroxyl groups.
- polyhydric alcohol (A-5)
- A-5 Polyhydric alcohol
- the polybasic acid anhydride can be added to the polybasic acid anhydride together with the polybasic acid anhydride.
- the reaction is preferably carried out using a valent methylol (hereinafter abbreviated as “polyhydric alcohol”).
- polyhydric alcohol By reacting polyhydric alcohols together, there is a tendency that polyhydric alcohols can be added to polybasic acid anhydrides to increase the acid value or increase the molecular weight.
- Partial structures of the above formulas (VIII) and (IX) can be obtained from the polyhydric alcohols used in the synthesis reaction of the resin (a-1).
- the polyhydric alcohol used for the synthesis reaction of the resin (a-1) is not particularly limited as long as it is a compound having two or more hydroxyl groups. From the viewpoint of easiness, specifically, at least one kind selected from the group consisting of trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. Preferably, it is a monohydric alcohol.
- the amount of the polyhydric alcohol used is usually about 0.5 to 6% by mass, preferably about 1 to 4% by mass, based on the (A-5) epoxy acrylate resin, from the viewpoints of the effects of use and handling. is there.
- reaction of epoxy acrylate resin with polybasic acid anhydride and polyhydric alcohol As described above, after obtaining (A-5) an epoxy acrylate resin, a polybasic acid anhydride is added to the epoxy acrylate resin, or a polybasic acid anhydride and a polyhydric alcohol are added. A known method can be used.
- the reaction temperature is usually 80 to 130 ° C., preferably 80 to 110 ° C., and the reaction is continued for 4 to 15 hours until a predetermined acid value, molecular weight, viscosity and the like are reached.
- a predetermined acid value, molecular weight, viscosity and the like are reached.
- the resin (a-1) is preferably used as a resin for a photosensitive resin composition for forming a color filter, a spacer, a coloring spacer, and a member for an image display device such as a liquid crystal display or an organic EL.
- a resin for a photosensitive resin composition for forming a color filter, a spacer, a coloring spacer, and a member for an image display device such as a liquid crystal display or an organic EL.
- it can be preferably used as a color filter resin.
- the photosensitive resin composition preferably contains a photopolymerization initiator (b) in addition to the resin (a-1).
- a photopolymerization initiator b
- it further contains a photopolymerizable monomer (c), a colorant (d), and a dispersant (e), and if necessary, thiols, a dispersion aid (pigment derivative), an adhesion improver, and coating properties.
- It contains other compounding components such as an improver, a development improver, an ultraviolet absorber, an antioxidant, a surfactant and the like, and each compounding component is usually used in a state dissolved or dispersed in a solvent.
- the photosensitive resin composition of the present invention is characterized by containing a resin (a-1) as the resin (a).
- a resin (a-1) as the resin (a).
- the resin (a-1) has a partial structure represented by the above formulas (VI) to (VII)
- the cured film obtained by applying and drying the photosensitive resin composition is exposed and then exposed. It can function as a so-called alkali-soluble resin in which the solubility changes during alkali development with respect to parts and non-exposed parts.
- the photosensitive resin composition of the present invention contains the resin (a-1), it tends to be excellent in sensitivity, development adhesion, stability during development, substrate adhesion and the like as described below.
- the photosensitive resin composition of the present invention may contain other resin (a-2) in addition to resin (a-1).
- the photosensitive resin composition of the present invention contains at least the aforementioned resin (a-1), and the resin contains at least a partial structure represented by the formula (I) and a partial structure represented by (II). To do.
- the photosensitive colored resin composition containing the resin (a-1) tends to be excellent in sensitivity, development adhesion, substrate adhesion and the like.
- the reason for this is that the resin (a-1) has a bulky cycloalkylidene group in the partial structure of the formula (II), so that the resistance to an alkaline developer tends to increase. Because of the bisphenol structure in the partial structure of (II) and the ethylenically unsaturated group structure in the formula (I), the steric hindrance structure around the ethylenically unsaturated group is small and a crosslinking reaction tends to occur. it is conceivable that.
- the overall bulkiness tends to be further increased by crosslinking by ultraviolet irradiation.
- the line width is increased, the resistance to an alkaline developer is increased, and the mechanical strength of the cured film tends to increase, and the sensitivity, development adhesion, substrate adhesion, etc. tend to improve. Conceivable.
- the other resin (a-2) that can be used in combination with the resin (a-1) is not particularly limited, but after exposing the cured film obtained by applying and drying the photosensitive resin composition, an exposed portion and a non-exposed portion It is preferably an alkali-soluble resin whose solubility in alkali development changes, more preferably an alkali-soluble resin having a carboxyl group, and still more preferably an alkali-soluble resin having an ethylenically unsaturated bond and a carboxyl group.
- an epoxy (meth) acrylate resin having a carboxyl group and an acrylic copolymer resin can be mentioned. More preferable examples are described below as (A1-1), (A1-2), (A2-1), (A2-2), (A2-3) and (A2-4). These may be used, and these may be used alone or in combination of two or more. Among these, epoxy (meth) acrylate resins (A1-1) and (A1-2) having a carboxyl group are particularly preferable.
- a resin having an acidic functional group such as a hydroxyl group, a carboxyl group, a phosphoric acid group, or a sulfonic acid group is applied in order to dissolve the non-exposed portion in the alkaline developer.
- a resin having a carboxyl group is preferable.
- the resin has a carboxyl group, it tends to be more soluble in an alkali developer than a hydroxyl group.
- the phosphoric acid group or the sulfonic acid group has higher acidity than the carboxylic acid group, it reacts with a basic initiator, monomer or dispersant, or other additive in the photosensitive resin composition. It tends to be easy and storage stability is poor.
- epoxy (meth) acrylate resins (A1-1) and (A1-2) having a carboxyl group and an ethylenically unsaturated group are particularly preferable.
- (A1-1) and (A1-2) resins, like the resin (a-1) add a lot of unsaturated groups or carboxyl groups, contain a lot of aromatic ring structures, Can contain a bulky alicyclic structure, has good compatibility with the resin (a-1), and developability or pattern shape without reducing the effect of the resin (a-1). This is because it is considered that the characteristics such as can be improved.
- Examples of the epoxy (meth) acrylate resin having a carboxyl group include the following epoxy (meth) acrylate resin (A1-1) and / or epoxy (meth) acrylate resin (A1-2).
- ⁇ Epoxy (meth) acrylate resin (A1-2)> An ⁇ , ⁇ -unsaturated monocarboxylic acid or an ⁇ , ⁇ -unsaturated monocarboxylic acid ester having a carboxyl group is added to an epoxy resin, and further reacted with a polyhydric alcohol and a polybasic acid and / or an anhydride thereof. The alkali-soluble resin obtained by this.
- an alkali-soluble resin (c1) and an alkali-soluble resin described in Japanese Patent Application Laid-Open No. 2013-195681, respectively. (C2) can be used.
- the acrylic copolymer resin include Japanese Patent Application Laid-Open No. 7-207211, Japanese Patent Application Laid-Open No. 8-259987, Japanese Patent Application Laid-Open No. 10-300922, Japanese Patent Application Laid-Open No. 11-140144, Japanese Patent Application Laid-Open No.
- Various polymer compounds described in various publications such as JP-174224, JP-A No. 2000-56118, JP-A No. 2003-233179, and JP-A No. 2007-270147 can be used.
- a resin obtained by addition or a resin obtained by adding a polybasic acid anhydride to at least a part of the hydroxyl group generated by the addition reaction hereinafter sometimes referred to as “(A2-1) resin”).
- (A2-3) Resin in which an epoxy group-containing unsaturated compound is added to the carboxyl group portion of the (A2-2) resin (hereinafter sometimes referred to as “(A2-3) resin”).
- the resin (A2-1) is also included in the concept of epoxy (meth) acrylate resin.
- (A2-1) resin [2-1-1] resin described in Japanese Unexamined Patent Publication No. 2009-052010 can be used.
- (A2-2) resin to (A2-4) resin [2-1-2] resin to [2-1-4] resin described in JP-A-2009-052010 is used. be able to.
- the photosensitive resin composition of the present invention includes (A1-1), (A1-2), (A2-1), (A2-2) as other resins used in combination with the resin (a-1). , (A2-3), and (A2-4) are preferably included.
- the other resin is an alkali-soluble resin containing an ethylenically unsaturated group and is at least one of (A1-1), (A1-2), (A2-1), and (A2-3). More preferably it includes a seed.
- the other resin particularly preferably contains at least one of epoxy acrylate resins (A1-1) and (A1-2) as an alkali-soluble resin containing an ethylenically unsaturated group. .
- alkali-soluble resins other than those described above may be used. Although there is no restriction
- the photosensitive resin composition of this invention contains a photoinitiator (b) with resin (a).
- the photopolymerization initiator is a component having a function of directly absorbing light and causing a decomposition reaction or a hydrogen abstraction reaction to generate a polymerization active radical.
- the photosensitive resin composition of the present invention contains the photopolymerization initiator (b), the crosslinkability is improved by ultraviolet irradiation or the like, and the effect of the resin (a-1) is further improved.
- the photopolymerization initiator (b) when an oxime ester compound is contained as the photopolymerization initiator (b), the effect tends to be further improved.
- Examples of the photopolymerization initiator include metallocene compounds including titanocene compounds described in JP-A Nos. 59-152396 and 61-151197, and JP-A No. 2000-56118.
- N-aryl- ⁇ -amino acids such as halomethylated oxadiazole derivatives, halomethyl-s-triazine derivatives and N-phenylglycine described in Japanese Patent Application Laid-Open No. 10-39503 , N-aryl- ⁇ -amino acid salts, radical activators such as N-aryl- ⁇ -amino acid esters and ⁇ -aminoalkylphenone derivatives; Japanese Unexamined Patent Publication No. 2000-80068 and Japanese Unexamined Patent Publication No. 2006-36750 Examples include oxime ester derivatives described in gazettes, etc.
- titanocene derivatives include dicyclopentadienyl titanium dichloride, dicyclopentadienyl titanium bisphenyl, dicyclopentadienyl titanium bis (2,3,4,5,6-pentafluoro Phen-1-yl), dicyclopentadienyl titanium bis (2,3,5,6-tetrafluorophen-1-yl), dicyclopentadienyl titanium bis (2,4,6-trifluoropheny) 1-yl), dicyclopentadienyltitanium di (2,6-difluorophen-1-yl), dicyclopentadienyltitanium di (2,4-difluorophen-1-yl), di (methylcyclopenta Dienyl) titanium bis (2,3,4,5,6-pentafluorophen-1-yl), di (methylsilane) Ropentadienyl) titanium bis (2,6-difluorophen-1-yl) and
- biimidazole derivatives examples include 2- (2′-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (2′-chlorophenyl) -4,5-bis (3′-methoxyphenyl). ) Imidazole dimer, 2- (2′-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (2′-methoxyphenyl) -4,5-diphenylimidazole dimer and (4′- And methoxyphenyl) -4,5-diphenylimidazole dimer.
- halomethylated oxadiazole derivatives examples include 2-trichloromethyl-5- (2′-benzofuryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- [ ⁇ - (2 '-Benzofuryl) vinyl] -1,3,4-oxadiazole, 2-trichloromethyl-5- [ ⁇ - (2'-(6 "-benzofuryl) vinyl)]-1,3,4-oxadiazole And 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.
- halomethyl-s-triazine derivatives examples include 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxynaphthyl) -4,6- Bis (trichloromethyl) -s-triazine, 2- (4-ethoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine and 2- (4-ethoxycarbonylnaphthyl) -4,6-bis (trichloro Methyl) -s-triazine and the like.
- Examples of ⁇ -aminoalkylphenone derivatives include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 4-dimethylaminoethylbenzoate, 4-dimethylamino Isoamyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis (4-diethylaminobenzal) cyclohexanone, 7-diethylamino-3 -(4-Diethylaminobenzoyl) coumarin and 4- (diethylamino) Chalcone, and the like.
- oxime derivatives As photopolymerization initiators, oxime derivatives (oxime-based and ketoxime-based compounds) are particularly effective in terms of sensitivity, and are disadvantageous in terms of sensitivity when using an alkali-soluble resin containing a phenolic hydroxyl group. In some cases, oxime derivatives (oxime-based and ketoxime-based compounds) excellent in such sensitivity are particularly useful. Among oxime derivatives, oxime esters are preferred from the viewpoint of increasing sensitivity under high pigment concentrations.
- the photopolymerization initiator of oxime ester has both a structure that absorbs ultraviolet rays, a structure that transmits light energy, and a structure that generates radicals. Therefore, it is possible to design a photosensitive resin composition that is stable and sensitive in a small amount.
- the resin (a-1) contained in the photosensitive resin composition of the present invention has a structure in which a biphenyl structure and a greatly expanded alicyclic structure having 10 or more carbon atoms are largely twisted at the joint.
- a cross-linked structure that is twisted and spreads three-dimensionally by ultraviolet irradiation is formed.
- the sensitivity is increased, the line width is increased, the resistance to alkali developer is increased, and the stability to the alkali developer tends to be increased.
- these effects are further improved when combined with a photopolymerization initiator of an oxime ester that exhibits high sensitivity even in a small amount.
- Examples of the oxime compound include a compound containing a structural moiety represented by the following general formula (22), and preferably include an oxime ester compound represented by the following general formula (23).
- R 22 is an optionally substituted alkanoyl group having 2 to 12 carbon atoms, heteroarylalkanoyl group having 1 to 20 carbon atoms, alkenoyl group having 3 to 25 carbon atoms, carbon number A cycloalkanoyl group having 3 to 8 carbon atoms, an alkoxycarbonylalkanoyl group having 3 to 20 carbon atoms, a phenoxycarbonylalkanoyl group having 8 to 20 carbon atoms, a heteroaryloxycarbonylalkanoyl group having 3 to 20 carbon atoms, and a group having 2 to 10 carbon atoms
- R 21a is hydrogen or an optionally substituted alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 25 carbon atoms, an aryl group having 6 to 20 carbon atoms, carbon A heteroarylalkyl group having 1 to 20 carbon atoms, an alkoxycarbonylalkyl group having 3 to 20 carbon atoms, a phenoxycarbonylalkyl group having 8 to 20 carbon atoms, a heteroaryloxycarbonylalkyl group having 1 to 20 carbon atoms or a heteroarylthioalkyl group An aminoalkyl group having 1 to 20 carbon atoms, an alkanoyl group having 2 to 12 carbon atoms, an alkenoyl group having 3 to 25 carbon atoms, a cycloalkanoyl group having 3 to 8 carbon atoms, an aryloyl group having 7 to 20 carbon atoms, and a carbon number 1-20 heteroarylloyl group, C2-C10
- R 21a may form a ring together with R 21b , and the linking group may be a C 1-10 alkylene group which may have a substituent, a polyethylene group (— (CH ⁇ CH) r -), A polyethynylene group (-(C ⁇ C) r- ), or a group formed by a combination thereof (where r is an integer of 0 to 3).
- R 22a represents the same group as R 22 in the above formula (22).
- R 22 in the general formula (22) and R 22a in the general formula (23) are preferably an alkanoyl group having 2 to 12 carbon atoms and a heteroaryl having 1 to 20 carbon atoms.
- examples thereof include an alkanoyl group and a cycloalkanoyl group having 3 to 8 carbon atoms, more preferably an alkanoyl group having 2 to 10 carbon atoms, and still more preferably an alkanoyl group having 2 to 5 carbon atoms.
- R 21a is preferably an alkyl group having 1 to 20 carbon atoms which may be substituted or a carbon number which may be substituted, from the viewpoint of solubility in a solvent and sensitivity.
- Examples thereof include a 1 to 10 cycloalkylalkyl group and an optionally substituted aryl group having 6 to 20 carbon atoms. More preferably, propyl substituted with a methyl group, an ethyl group, a propyl group, a cyclopentylethyl group, a 4- (2-methoxy-1-methyl) ethoxy-2-methylphenyl group or an N-acetyl-N-acetoxyamino group Groups.
- R 21b in the general formula (23) is preferably an optionally substituted carbazole group, an optionally substituted thioxanthonyl group, or an optionally substituted phenyl sulfide group.
- R 21b is more preferable for the reason described above.
- An oxime ester initiator having a carbazole group having a nitro group is also effective.
- oxime ester initiator those containing a carbazole group as R 21b are preferred for the reasons described above.
- the aryl group having 6 to 25 carbon atoms which may be substituted the arylcarbonyl group having 7 to 25 carbon atoms which may be substituted, the heteroaryl group having 5 to 25 carbon atoms which may be substituted,
- a carbazole group having at least one group selected from the group consisting of benzoyl group, toluoyl group, naphthoyl group, thienylcarbonyl group, and nitro group is preferable. These groups are preferably bonded to the 3-position of the carbazole group. Similarly, the C atom in the formula (23) is preferably bonded to the 6-position of the carbazole group.
- the H atom bonded to the N atom of the carbazole group may be substituted with any substituent, and the optional substituent is an alkyl having 1 to 20 carbon atoms from the viewpoint of solubility in a solvent.
- the optional substituent is an alkyl having 1 to 20 carbon atoms from the viewpoint of solubility in a solvent.
- Group is preferable, an alkyl group having 1 to 10 carbon atoms is more preferable, and an alkyl group having 1 to 5 carbon atoms is more preferable.
- An oxime ester is useful as the initiator used in the present invention.
- Oxime ester initiators having a carbazole group are preferred.
- the oxime ester initiator in which R 21a of the general formula (23) has a linear alkyl part and a cycloalkyl part or an oxime ester initiator having a carbazole group having a nitro group is more preferably used.
- Examples of such commercially available initiators include OXE-02 manufactured by BASF, TR-PBG-304, and TR-PBG-314 manufactured by Changzhou Strong Electronics Co., Ltd.
- preferred oxime ester compounds in the present invention include the compounds exemplified below, but are not limited to these compounds.
- ketoxime compound examples include a compound containing a structural moiety represented by the following general formula (24), and preferably an oxime ester compound represented by the following general formula (25).
- R 24 has the same meaning as R 22 in the general formula (22).
- R 23a is a phenyl group, an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 25 carbon atoms, or a heteroarylalkyl having 1 to 20 carbon atoms, which may be substituted.
- alkoxycarbonylalkyl group having 3 to 20 carbon atoms phenoxycarbonylalkyl group having 8 to 20 carbon atoms, alkylthioalkyl group having 2 to 20 carbon atoms, heteroaryloxycarbonylalkyl group having 1 to 20 carbon atoms or heteroarylthio group
- R 23b represents an arbitrary substituent containing an aromatic ring or a heteroaromatic ring.
- R 23a may form a ring together with R 23b , and the linking group may be an alkylene group having 1 to 10 carbon atoms which may have a substituent, a polyethylene group (— (CH ⁇ CH) r -), A polyethynylene group (-(C ⁇ C) r- ) or a group formed by a combination thereof (where r is an integer of 0 to 3).
- R 24a is an optionally substituted alkanoyl group having 2 to 12 carbon atoms, an alkenoyl group having 3 to 25 carbon atoms, a cycloalkanoyl group having 4 to 8 carbon atoms, a benzoyl group having 7 to 20 carbon atoms, a carbon atom Heteroaryloyl group having 3 to 20 carbon atoms, alkoxycarbonyl group having 2 to 10 carbon atoms, aryloxycarbonyl group having 7 to 20 carbon atoms, heteroaryl group having 2 to 20 carbon atoms, or alkylamino having 2 to 20 carbon atoms Represents a carbonyl group.
- R 24 in the general formula (24) and R 24a in the general formula (25) are preferably an alkanoyl group having 2 to 12 carbon atoms, a heteroarylalkanoyl group having 1 to 20 carbon atoms, or 3 to 8 carbon atoms. And a cycloalkanoyl group and an aryloyl group having 7 to 20 carbon atoms.
- R 23a in the general formula (25) is preferably an unsubstituted ethyl group, propyl group, butyl group, or an ethyl group or propyl group substituted with a methoxycarbonyl group.
- R ⁇ 23b> in the said General formula (25) Preferably the carbazoyl group which may be substituted and the phenyl sulfide group which may be substituted are mentioned.
- the case where a carbazole group is contained as R 23b is more preferable for the above reason.
- ketoxime ester compounds in the present invention include compounds exemplified below, but are not limited to these compounds.
- oxime and ketoxime ester compounds are known per se, and are, for example, one of a series of compounds described in Japanese Patent Application Laid-Open No. 2000-80068 or Japanese Patent Application Laid-Open No. 2006-36750. It is.
- the said photoinitiator may be used individually by 1 type, and may use 2 or more types together.
- benzoin alkyl ethers such as benzoin methyl ether, benzoin phenyl ether, benzoin isobutyl ether and benzoin isopropyl ether; 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone and 1-chloroanthraquinone Anthraquinone derivatives; benzophenone derivatives such as benzophenone, Michler's ketone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone and 2-carboxybenzophenone; 2,2-dimethoxy-2 -Phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, ⁇ -hy Loxy-2-methylphenylpropanone, 1-hydroxy-1-methylethyl- (p-
- the photosensitive resin composition of the present invention can be used in combination with an additive such as the following accelerator and sensitizing dye together with a photopolymerization initiator as necessary.
- a mercapto compound having a heterocyclic ring such as 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptobenzoimidazole or an aliphatic polyfunctional mercapto compound is used. Accelerators may be used alone or in combination of two or more.
- the photopolymerization initiator can be used in combination with a sensitizing dye according to the wavelength of the image exposure light source for the purpose of increasing the sensitivity.
- these sensitizing dyes include xanthene dyes described in JP-A-4-221958 and JP-A-4-219756, and heterocyclic rings described in JP-A-3-239703 and JP-A-5-289335.
- amino group-containing sensitizing dyes preferred are amino group-containing sensitizing dyes, and more preferred are compounds having an amino group and a phenyl group in the same molecule. Particularly preferred are, for example, 4,4′-dimethylaminobenzophenone, 4,4′-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4′-diaminobenzophenone, 3,3′-diaminobenzophenone.
- Benzophenone compounds such as 3,4-diaminobenzophenone; 2- (p-dimethylaminophenyl) benzoxazole, 2- (p-diethylaminophenyl) benzoxazole, 2- (p-dimethylaminophenyl) benzo [4,5 ] Benzoxazole, 2- (p-dimethylaminophenyl) benzo [6,7] benzoxazole, 2,5-bis (p-diethylaminophenyl) 1,3,4-oxazole, 2- (p-dimethylaminophenyl) Benzothiazole, 2- (p-di Tilaminophenyl) benzothiazole, 2- (p-dimethylaminophenyl) benzimidazole, 2- (p-diethylaminophenyl) benzimidazole, 2,5-bis (p-diethylaminophenyl) 1,3,4-thiadiazole, p-di
- the photosensitive resin composition of this invention contains a photopolymerizable monomer (c) from points, such as a sensitivity.
- the photopolymerizable monomer used in the present invention include compounds having at least one ethylenically unsaturated group in the molecule (hereinafter sometimes referred to as “ethylenic monomer”). Specifically, for example, (meth) acrylic acid, (meth) acrylic acid alkyl ester, acrylonitrile, styrene, a carboxylic acid having one ethylenically unsaturated bond, a monoester of polyhydric or monohydric alcohol, etc. It is done.
- a polyfunctional ethylenic monomer having two or more ethylenically unsaturated groups in one molecule examples include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds. Examples thereof include esters obtained by an esterification reaction of a polyvalent hydroxy compound such as a hydroxy compound with an unsaturated carboxylic acid and a polybasic carboxylic acid.
- ester of the aliphatic polyhydroxy compound and the unsaturated carboxylic acid examples include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, and pentaerythritol triacrylate.
- Acrylate esters of aliphatic polyhydroxy compounds such as acrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate, etc.
- Acid esters, itaconate instead of itaconate Maleic acid esters in which instead of the crotonic acid ester or maleate was changed to Kuroneto the like.
- ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid examples include acrylic acid esters and methacrylic esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcin diacrylate, resorcin dimethacrylate, and pyrogallol triacrylate. Acid ester etc. are mentioned.
- the ester obtained by the esterification reaction of a polybasic carboxylic acid and an unsaturated carboxylic acid and a polyvalent hydroxy compound is not necessarily a single substance, but representative examples include acrylic acid, phthalic acid, and ethylene. Examples include a condensate of glycol, a condensate of acrylic acid, maleic acid, and diethylene glycol, a condensate of methacrylic acid, terephthalic acid, and pentaerythritol, a condensate of acrylic acid, adipic acid, butanediol, and glycerin.
- polyfunctional ethylenic monomer used in the present invention for example, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate ester or a polyisocyanate compound and a polyol and a hydroxyl group-containing (meth) acrylate ester are reacted.
- the photosensitive resin composition of the present invention preferably contains a coloring material (d) when used for forming a pixel of a color filter or a black matrix.
- a coloring material means what colors the photosensitive resin composition of this invention.
- dyes and pigments can be used as the coloring material. From the viewpoints of heat resistance, light resistance, etc., and from the viewpoint of light shielding properties or color characteristics, pigments are preferable. It is preferable to contain.
- the pigment examples include pigments of various colors such as a blue pigment, a green pigment, a red pigment, a yellow pigment, a purple pigment, an orange pigment, a brown pigment, and a black pigment.
- the structure includes, for example, various inorganic pigments in addition to organic pigments such as azo, phthalocyanine, quinacridone, benzimidazolone, isoindolinone, dioxazine, indanthrene, and perylene. Is also available.
- pigments that can be used in the present invention are shown by pigment numbers. Note that terms such as “CI Pigment Red 2” mentioned below mean a color index (CI).
- red pigments examples include C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53, 53: 1, 53: 2, 53: 3, 57, 57: 1, 57: 2, 58: 4, 60, 63, 63: 1, 63: 2, 64, 64: 1, 68, 69, 81, 81: 1, 81: 2, 81: 3, 81: 4, 83, 88, 90: 1, 101, 101: 1, 104, 108, 108: 1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 17 , 181, 185, 187, 188, 190, 193, 194, 200
- C.I. I. Pigment Red 48 1, 122, 168, 177, 202, 206, 207, 209, 224, 242, 254, more preferably C.I. I. And CI Pigment Red 177, 209, 224 and 254.
- blue pigments examples include C.I. I. Pigment Blue 1, 1: 2, 9, 14, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78 and 79.
- green pigments examples include C.I. I. Pigment green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54 and 55. Of these, C.I. I. CI pigment green 7, 36 and 58.
- yellow pigments examples include C.I. I. Pigment Yellow 1, 1: 1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62: 1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127: 1, 128, 129, 133, 134, 136, 138, 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 17 174, 175, 176, 180, 181, 182, 183, 184
- C.I. I. Pigment yellow 83, 117, 129, 138, 139, 150, 154, 155, 180 and 185 more preferably C.I. I. And CI pigment yellow 83, 138, 139, 150 and 180.
- orange pigments examples include C.I. I. Pigment Orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78 and 79. Of these, C.I. I. And CI pigment oranges 38 and 71.
- purple pigments examples include C.I. I. Pigment Violet 1, 1: 1, 2, 2: 2, 3, 3: 1, 3: 3, 5, 5: 1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49 and 50. Of these, C.I. I. Pigment violet 19 and 23, more preferably C.I. I. And CI Pigment Violet 23.
- the photosensitive resin composition of the present invention is a photosensitive resin composition for a resin black matrix of a color filter
- a black color material can be used as the color material (d).
- the black color material may be a single black color material or a mixture of red, green, blue, and the like. These color materials can be appropriately selected from inorganic or organic pigments and dyes.
- C.I. I Yellow pigments 20, 24, 86, 93, 109, 110, 117, 125, 137, 138, 147, 148, 153, 154 and 166
- C.I. I. Orange pigments 36, 43, 51, 55, 59 and 61 C.I. I. Red pigments 9, 97, 122, 123, 149, 168, 177, 180, 192, 215, 216, 217, 220, 223, 224, 226, 227, 228 and 240, C.I. I. Violet pigments 19, 23, 29, 30, 37, 40, 50, C.I. I. Blue pigment 15, 15: 1, 15: 4, 22, 60 and 64, C.I. I. Green pigment 7 and C.I. I. Examples thereof include brown pigments 23, 25, and 26.
- a black pigment is preferable in order to obtain a high light-shielding property.
- the black pigment include carbon black, acetylene black, lamp black, bone black, graphite, iron black, aniline black, cyanine black, and titanium black.
- carbon black is preferable from the viewpoints of light shielding rate and image characteristics.
- Examples of the carbon black include the following carbon black.
- Printex (registered trademark; same applies hereinafter) 3, Printex3OP, Printex30, Printex30OP, Printex40, Printex45, Printex55, Printex60, Printex75, Printex80, PrintP85, PrintP85, PrintP85 U, Printex V, PrintexG, SpecialBlack550, SpecialBlack350, SpecialBlack250, SpecialBlack100, SpecialBlack6, SpecialBlack5, SpecialBlack4, BlackBlack4 lor Black FW2, Color Black FW2V, Color Black FW18, Color Black FW18, Color Black FW200, Color Black S160, Color Black S170 Cabot Corporation: 80, Mon (registered trademark: 80, Mon) Monarch900, Monarch1000, Monarch1100, Monarch1300, Monarch1400, Monarch4630, REGAL (registered trademark, the same applies hereinafter) 99, REGAL99R, REGAL415, REGAL415R, REGAL250, REGAL250R, RE AL330, REGAL400R, RE
- RAVEN Made by Colombian Carbon: RAVEN (registered trademark; the same shall apply hereinafter) 11, RAVEN14, RAVEN15, RAVEN16, RAVEN22RAVEN30, RAVEN35, RAVEN40, RAVEN410, RAVEN420, RAVEN450, RAVEN500, RAVEN780, RAVEN850, RA401000RA, VENT20 , RAVEN1080U, RAVEN1170, RAVEN1190U, RAVEN1250, RAVEN1500, RAVEN2000, RAVEN2500U, RAVEN3500, RAVEN5000, RAVEN5250, RAVEN5750 and RAVEN7000
- black pigments for example, titanium black, aniline black and iron oxide black pigments, and organic pigments of three colors of red, green and blue can be mixed and used as black pigments.
- Carbon black coated with resin may be used.
- Use of carbon black coated with a resin has the effect of improving adhesion to a glass substrate and volume resistance.
- As the carbon black coated with the resin for example, carbon black described in Japanese Patent Application Laid-Open No. 09-71733 is preferable.
- the total content of Na and Ca is preferably 100 ppm or less.
- Carbon black is composed of raw material oil or combustion oil (or gas) at the time of normal production, reaction stop water or granulated water, or Na, Ca, K, Mg, Al or Fe mixed from the furnace material of the reactor, etc. Ashes are contained in the order of percent.
- Na or Ca is generally contained in several hundred ppm or more, but if they are present in large quantities, they penetrate into the transparent electrode (ITO) or other electrodes, causing electrical shorts. This is because there is a case.
- the surface of these black pigments is often acidic. Therefore, in order to disperse the black pigment satisfactorily, the dispersant to be combined is preferably a polymer compound having a basic functional group.
- the pigment barium sulfate, lead sulfate, titanium oxide, yellow lead, bengara, chromium oxide, or the like can be used. These various pigments can be used in combination. For example, in order to adjust chromaticity, a green pigment and a yellow pigment can be used in combination, or a blue pigment and a violet pigment can be used in combination.
- the average primary particle size of the pigment that can be used as the colorant (d) is any pigment that can produce a desired color when used as a colored layer of a color filter.
- the average primary particle size of the pigment that can be used as the colorant (d) is any pigment that can produce a desired color when used as a colored layer of a color filter.
- Well not particularly limited, and it varies depending on the type of pigment used, but is preferably in the range of 10 to 100 nm, more preferably in the range of 10 to 70 nm.
- the average primary particle size of the pigment is within the above range, the color characteristics of the image display device manufactured using the negative resist composition for color filter of the present invention tend to be of high quality. There is.
- the average primary particle diameter of the pigment is preferably 100 nm or less, more preferably 60 nm or less, and further preferably 50 nm or less. Further, when the pigment is carbon black, the average primary particle diameter of the pigment is preferably 20 nm or more. When the pigment becomes too large, scattering increases and color characteristics such as light shielding properties or contrast deteriorate. On the other hand, if the pigment particle size is too small, a large amount of dispersant is required, and the dispersibility is lowered.
- the average primary particle size of the pigment can be determined by directly measuring the size of the primary particles from an electron micrograph. Specifically, the minor axis diameter and major axis diameter of each primary particle are measured, and the average is taken as the particle diameter of the particle. Next, for 100 or more particles, the volume (weight) of each particle is obtained by approximating the obtained particle size to a rectangular parallelepiped, and the volume average particle size is obtained and used as the average primary particle size. The same result can be obtained regardless of whether the electron microscope is a transmission type (TEM) or a scanning type (SEM).
- TEM transmission type
- SEM scanning type
- the photosensitive resin composition of the present invention preferably contains at least a pigment, but in addition, a dye may be used in combination as long as the effect of the present invention is not affected.
- a dye may be used in combination as long as the effect of the present invention is not affected.
- dyes that can be used in combination include azo dyes, anthraquinone dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, and methine dyes.
- azo dyes include C.I. I. Acid Yellow 11, C.I. I. Acid Orange 7, C.I. I. Acid Red 37, C.I. I. Acid Red 180, C.I. I. Acid Blue 29, C.I. I. Direct Red 28, C.I. I. Direct Red 83, C.I. I. Direct Yellow 12, C.I. I. Direct Orange 26, C.I. I. Direct Green 28, C.I. I. Direct Green 59, C.I. I. Reactive Yellow 2, C.I. I. Reactive Red 17, C.I. I. Reactive Red 120, C.I. I. Reactive Black 5, C.I. I. Disperse Orange 5, C.I. I. Disperse thread 58, C.I. I. Disperse blue 165, C.I. I. Basic Blue 41, C.I. I. Basic Red 18, C.I. I. Molded Red 7, C.I. I. Moldant Yellow 5 and C.I. I. Examples thereof include Moldant Black 7.
- anthraquinone dyes examples include C.I. I. Bat Blue 4, C.I. I. Acid Blue 40, C.I. I. Acid Green 25, C.I. I. Reactive Blue 19, C.I. I. Reactive Blue 49, C.I. I. Disperse thread 60, C.I. I. Disperse Blue 56 and C.I. I. Disperse Blue 60 etc. are mentioned.
- phthalocyanine dye examples include C.I. I. Pad Blue 5 and the like are quinone imine dyes such as C.I. I. Basic Blue 3, C.I. I. Basic blue 9 etc. are mentioned.
- quinoline dyes examples include C.I. I. Solvent Yellow 33, C.I. I. Acid Yellow 3, C.I. I. Disperse Yellow 64 and the like are nitro dyes such as C.I. I. Acid Yellow 1, C.I. I. Acid Orange 3, C.I. I. Disperse Yellow 42 and the like.
- ⁇ Dispersant (e)> In the photosensitive resin composition of the present invention, when the color material (d) is used, it is important to ensure the quality stability that the color material is finely dispersed and the dispersion state is stabilized. Therefore, it is preferable to include a dispersant.
- a polymer dispersant having a functional group is preferable, and further, from the viewpoint of dispersion stability, a carboxyl group; a phosphoric acid group; a sulfonic acid group; or a base thereof; a primary, secondary, or tertiary amino group.
- a polymer dispersant having a basic functional group such as a primary, secondary, or tertiary amino group; a quaternary ammonium base; a group derived from a nitrogen-containing heterocycle such as pyridine, pyrimidine, or pyrazine is particularly preferable.
- Dispersibility can be improved by using a polymer dispersant having these basic functional groups, and particularly when a black pigment is used as a coloring material, there is a tendency that high light shielding properties can be achieved.
- polymer dispersants include urethane dispersants, acrylic dispersants, polyethyleneimine dispersants, polyallylamine dispersants, dispersants composed of amino group-containing monomers and macromonomers, and polyoxyethylene alkyl ethers.
- examples thereof include a system dispersant, a polyoxyethylene diester dispersant, a polyether phosphate dispersant, a polyester phosphate dispersant, a sorbitan aliphatic ester dispersant, and an aliphatic modified polyester dispersant.
- EFKA registered trademark, manufactured by EFKA Chemicals Beebuy (EFKA)
- Disperbyk registered trademark, manufactured by BYK Chemie
- Disparon registered trademark, Enomoto Kasei
- SOLSPERSE registered trademark, manufactured by Lubrizol Corporation
- KP manufactured by Shin-Etsu Chemical Co., Ltd.
- Polyflow Florene (manufactured by Kyoeisha Chemical Co., Ltd.)
- Florene manufactured by Kyoeisha Chemical Co., Ltd.
- Ajisper registered trademark, manufactured by Ajinomoto Finetech Co., Ltd.
- These polymer dispersants may be used alone or in combination of two or more.
- the dispersant (e) contains a urethane-based polymer dispersant and / or an acrylic-based polymer dispersant having a basic functional group in terms of adhesion and linearity.
- a urethane-based polymer dispersant is preferable in terms of adhesion.
- a polymer dispersant having a basic functional group and having a polyester and / or polyether bond is preferred.
- the weight average molecular weight (Mw) of the polymer dispersant is usually 700 or more, preferably 1000 or more, and usually 100,000 or less, preferably 50,000 or less, and particularly preferably 30,000 or less.
- Mw weight average molecular weight
- the alkali developability tends to be good even when the pigment concentration is high.
- urethane-based and acrylic polymer dispersants examples include Disperbyk 160 to 167 and 182 series (both are urethane-based), Disperbyk 2000 and 2001 (all are acrylic-based) (all manufactured by Big Chemie).
- Disperbyk 167, 182 and the like are particularly preferred urethane polymer dispersants having a basic functional group and having a polyester and / or polyether bond and having a weight average molecular weight of 30,000 or less.
- a preferable chemical structure as a urethane-based polymer dispersant include, for example, the same as a polyisocyanate compound and a compound having one or two hydroxyl groups in the molecule and a number average molecular weight of 300 to 10,000.
- examples thereof include a dispersion resin having a weight average molecular weight of 1,000 to 200,000 obtained by reacting a compound having an active hydrogen and a tertiary amino group in the molecule.
- polyisocyanate compound examples include paraphenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, naphthalene-1,5-diisocyanate, and tolidine diisocyanate.
- Aromatic diisocyanates hexamethylene diisocyanates, lysine methyl ester diisocyanates, aliphatic diisocyanates such as 2,4,4-trimethylhexamethylene diisocyanate and dimer diisocyanate, isophorone diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate) and ⁇ , ⁇ Alicyclic diisocyanates such as ′ -diisocyanate dimethylcyclohexane, xylylene diisocyanate and ⁇ , , ⁇ ′, ⁇ ′-tetramethylxylylene diisocyanate and other aliphatic diisocyanates, lysine ester triisocyanates, 1,6,11-undecane triisocyanate, 1,8-diisocyanate-4-isocyanate methyloctane, , 3,6-hexamethylene triisocyanate, bicycloheptane triis
- polyisocyanate is a trimer of organic diisocyanate, and the most preferred is a trimer of tolylene diisocyanate and a trimer of isophorone diisocyanate. These may be used alone or in combination of two or more.
- the polyisocyanate may be converted into an isocyanate group using an appropriate trimerization catalyst such as tertiary amines, phosphines, alkoxides, metal oxides, carboxylates and the like. And the trimerization is stopped by adding a catalyst poison, and then the unreacted polyisocyanate is removed by solvent extraction and thin-film distillation to obtain the desired isocyanurate group-containing polyisocyanate.
- an appropriate trimerization catalyst such as tertiary amines, phosphines, alkoxides, metal oxides, carboxylates and the like.
- Examples of compounds having one or two hydroxyl groups in the same molecule and having a number average molecular weight of 300 to 10,000 include, for example, polyether glycol, polyester glycol, polycarbonate glycol, polyolefin glycol, etc. Examples thereof include those alkoxylated with an alkyl group of 1 to 25 and a mixture of two or more of these.
- polyether glycol examples include polyether diol, polyether ester diol, and a mixture of two or more of these.
- Polyether diols are those obtained by homopolymerizing or copolymerizing alkylene oxides, such as polyethylene glycol, polypropylene glycol, polyethylene-propylene glycol, polyoxytetramethylene glycol, polyoxyhexamethylene glycol, polyoxyoctamethylene glycol, and The mixture of 2 or more types of those is mentioned.
- Polyether ester diols include those obtained by reacting a mixture of ether group-containing diols or other glycols with dicarboxylic acids or their anhydrides or reacting polyester glycols with alkylene oxides, such as poly (poly And oxytetramethylene) adipate.
- the most preferable polyether glycol is polyethylene glycol, polypropylene glycol, polyoxytetramethylene glycol or a compound in which one terminal hydroxyl group of these compounds is alkoxylated with an alkyl group having 1 to 25 carbon atoms.
- polyester glycol examples include dicarboxylic acids (for example, succinic acid, glutaric acid, adipic acid, sebacic acid, fumaric acid, maleic acid, and phthalic acid) or anhydrides thereof and glycols (for example, ethylene glycol, diethylene glycol, triglyceride).
- dicarboxylic acids for example, succinic acid, glutaric acid, adipic acid, sebacic acid, fumaric acid, maleic acid, and phthalic acid
- glycols for example, ethylene glycol, diethylene glycol, triglyceride
- polylactone diol or polylactone monool obtained by using the diols or monohydric alcohols having 1 to 25 carbon atoms as an initiator can be mentioned.
- Specific examples include polycaprolactone glycol and polymethylvalerolactone, and mixtures of two or more thereof.
- Most preferred as the polyester glycol is polycaprolactone glycol or polycaprolactone initiated with an alcohol having 1 to 25 carbon atoms.
- polycarbonate glycol examples include poly (1,6-hexylene) carbonate and poly (3-methyl-1,5-pentylene) carbonate.
- polyolefin glycol examples include polybutadiene glycol, hydrogenated polybutadiene glycol, and hydrogenated polyisoprene glycol. These may be used alone or in combination of two or more.
- the number average molecular weight of the compound having one or two hydroxyl groups in the same molecule is usually 300 to 10,000, preferably 500 to 6,000, and more preferably 1,000 to 4,000.
- the compound having an active hydrogen and a tertiary amino group in the same molecule used in the present invention will be described.
- the active hydrogen that is, a hydrogen atom directly bonded to an oxygen atom, a nitrogen atom, or a sulfur atom
- a hydrogen atom in a functional group such as a hydroxyl group, an amino group, and a thiol group.
- a hydrogen atom of a primary amino group is preferred.
- the tertiary amino group is not particularly limited, and examples thereof include an amino group having an alkyl group having 1 to 4 carbon atoms, or a heterocyclic structure, more specifically, an imidazole ring or a triazole ring.
- Examples of the compound having active hydrogen and tertiary amino group in the same molecule include N, N-dimethyl-1,3-propanediamine, N, N-diethyl-1,3-propanediamine, N, N-dipropyl-1,3-propanediamine, N, N-dibutyl-1,3-propanediamine, N, N-dimethylethylenediamine, N, N-diethylethylenediamine, N, N-dipropylethylenediamine, N, N- Dibutylethylenediamine, N, N-dimethyl-1,4-butanediamine, N, N-diethyl-1,4-butanediamine, N, N-dipropyl-1,4-butanediamine, N, N-dibutyl-1, 4-butanediamine and the like can be mentioned.
- examples of the nitrogen-containing heterocyclic ring include a pyrazole ring, an imidazole ring, a triazole ring, a tetrazole ring, an indole ring, a carbazole ring, an indazole ring, and a benzimidazole ring.
- N-containing hetero 5-membered rings such as benzotriazole ring, benzoxazole ring, benzothiazole ring, benzothiadiazole ring, pyridine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, acridine ring and isoquinoline ring
- a 6-membered ring is mentioned.
- nitrogen-containing heterocycles preferred are an imidazole ring or a triazole ring.
- Examples of these compounds having an imidazole ring and an amino group include 1- (3-aminopropyl) imidazole, histidine, 2-aminoimidazole and 1- (2-aminoethyl) imidazole.
- Examples of the compound having a triazole ring and an amino group include 3-amino-1,2,4-triazole, 5- (2-amino-5-chlorophenyl) -3-phenyl-1H-1,2,4. -Triazole, 4-amino-4H-1,2,4-triazole-3,5-diol, 3-amino-5-phenyl-1H-1,3,4-triazole, 5-amino-1,4-diphenyl -1,2,3-triazole and 3-amino-1-benzyl-1H-2,4-triazole.
- N, N-dimethyl-1,3-propanediamine, N, N-diethyl-1,3-propanediamine, 1- (3-aminopropyl) imidazole, and 3-amino-1,2,4-triazole preferable. These may be used alone or in combination of two or more.
- the preferred blending ratio of the raw materials for producing the urethane polymer dispersant is 10 compounds having a number average molecular weight of 300 to 10,000 having one or two hydroxyl groups in the same molecule with respect to 100 parts by mass of the polyisocyanate compound.
- the production of the urethane-based polymer dispersant is performed according to a known method for producing a polyurethane resin.
- a solvent for production usually, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, isophorone, esters such as ethyl acetate, butyl acetate, cellosolve acetate, benzene, toluene, xylene, hexane Hydrocarbons such as diacetone alcohol, isopropanol, sec-butanol, tert-butanol, etc., chlorides such as methylene chloride and chloroform, ethers such as tetrahydrofuran and diethyl ether, dimethylformamide, N-methyl Aprotic polar solvents such as pyrrolidone and dimethyl sulfoxide are used. These may be used alone or in combination of
- a urethanization reaction catalyst is usually used.
- the catalyst include tin-based compounds such as dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioctate, and stannous octoate, iron-based compounds such as iron acetylacetonate and ferric chloride, triethylamine, and triethylenediamine. 1 type, or 2 or more types, such as a secondary amine type
- the tertiary amine value of a dispersant such as a block copolymer is represented by the amount of KOH equivalent to the amount of base per gram of solid content excluding the solvent in the dispersant sample, and can be measured by the following method.
- Disperse 0.5-1.5 g of the dispersant sample in a 100 mL beaker and dissolve with 50 mL of acetic acid. This solution is neutralized and titrated with 0.1 mol / L HClO 4 (perchloric acid) acetic acid solution using an automatic titrator equipped with a pH electrode. Using the inflection point of the titration pH curve as the end point of titration, the amine value is determined by the following formula.
- Amine value [mgKOH / g] (561 ⁇ V) / (W ⁇ S) [However, W: Weighing amount of dispersant sample [g], V: Titration amount at the end of titration [mL], S: Solid content concentration [mass%] of the dispersant sample. ]
- the introduction amount of the compound having active hydrogen and tertiary amino group in the same molecule is preferably controlled in the range of 1 to 100 mgKOH / g in terms of the amine value after the reaction. More preferably, it is in the range of 5 to 95 mgKOH / g.
- the amine value is a value obtained by neutralizing and titrating a basic amino group with an acid, and representing the acid value in mg of KOH. When the amine value is lower than the above range, the dispersing ability tends to be lowered, and when it exceeds the above range, the developability tends to be lowered.
- the weight average molecular weight (Mw) of the urethane-based polymer dispersant is usually in the range of 1,000 to 200,000, preferably 2,000 to 100,000, more preferably 3,000 to 50,000. In particular, 30,000 or less is preferable. If the molecular weight is less than 1,000, the dispersibility and dispersion stability are poor, and if it exceeds 200,000, the solubility tends to be low and the dispersibility is poor, and at the same time, the reaction tends to be difficult to control. When the molecular weight is 30,000 or less, alkali developability tends to be good even when the pigment concentration is particularly high. Examples of such a particularly preferred commercially available urethane dispersant include Disperbyk 167 and 182 (Bic Chemie).
- acrylic polymer dispersant an unsaturated group-containing monomer having a functional group (the functional group here is the functional group described above as the functional group contained in the polymer dispersant); It is preferable to use a random polymer, a graft copolymer, or a block copolymer with an unsaturated group-containing monomer having no functional group. These copolymers can be produced by a known method.
- Examples of the unsaturated group-containing monomer having a functional group include (meth) acrylic acid, 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyloxyethylphthalic acid, and 2- (meth) acrylic acid. ) Tertiary amino such as unsaturated monomers having a carboxyl group such as acryloyloxyethyl hexahydrophthalic acid and acrylic acid dimer, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate and quaternized products thereof And unsaturated monomers having a quaternary ammonium base. These may be used alone or in combination of two or more.
- Examples of the unsaturated group-containing monomer having no functional group include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, Isobutyl (meth) acrylate, t-butyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxymethyl (meth) acrylate, 2-ethylhexyl ( (Meth) acrylate, isobornyl (meth) acrylate, tricyclodecane (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, N-vinylpyrrolidone, styrene and its derivative
- an acrylic block copolymer containing a nitrogen atom is used as a dispersant in order to improve the dispersibility of the colorant and improve the dispersion stability.
- the acrylic block copolymer containing such nitrogen atoms has a nitrogen atom contained therein having an affinity for the colorant surface, and a portion other than the nitrogen atom increases the affinity for the medium, It is estimated that it contributes to the improvement of dispersion stability.
- the performance of a dispersant is its adsorption behavior on the solid surface. The reason why the block copolymer is excellent in adsorption behavior is not clear in detail, but the following is presumed.
- the monomer constituting the copolymer is stably arranged in the copolymer sterically and / or electrically during the copolymerization. . Since the portion (molecule) in which the monomer is stably arranged is sterically and / or electrically stable, it may be an obstacle when adsorbing to the colorant.
- a portion that prevents the adsorption of the dispersant can be arranged at a position away from the adsorption portion of the pigment and the dispersant. That is, an optimum portion for adsorption can be arranged in the adsorbing portion between the colorant and the dispersing agent, and a portion suitable for it can be arranged in a portion requiring solvent affinity.
- the dispersion of a coloring material containing a colorant having a small crystallite size is presumed that this molecular arrangement affects the good dispersibility.
- An acrylic block copolymer containing a nitrogen atom is preferable in that it can disperse the colorant used in the present invention very efficiently. The reason is not clear, but it is presumed that because the molecular arrangement is controlled, there are few structures that obstruct the dispersing agent when adsorbed to the colorant.
- an AB block copolymer comprising an A block having a quaternary ammonium base and / or amino group in a side chain and a B block having no quaternary ammonium base and amino group. And / or BAB block copolymers are preferred.
- the quaternary ammonium base is preferably —N + R 51 R 52 R 53 ⁇ M ⁇ (wherein R 51 , R 52 and R 53 are each independently hydrogen Represents an atom or an optionally substituted cyclic or chain hydrocarbon group, or two or more of R 51 , R 52 and R 53 may be bonded to each other to form a cyclic structure; M ⁇ represents a counter anion.
- the quaternary ammonium base may be directly bonded to the main chain, but may be bonded to the main chain via a divalent linking group.
- the cyclic structure formed by combining two or more of R 51 , R 52 and R 53 with each other is, for example, a 5- to 7-membered nitrogen-containing heterocyclic monocycle Or the condensed ring formed by condensing two of these is mentioned.
- the nitrogen-containing heterocycle preferably has no aromaticity, more preferably a saturated ring. Specific examples include the following. These cyclic structures may further have a substituent.
- R represents any one of R 51 to R 53 .
- R 51 - R 53 in -N + R 51 R 52 R 53 more preferably may have an alkyl group, or a substituent of 1-3 1 carbon atoms which may have a substituent It is a phenyl group or a benzyl group which may have a substituent.
- the A block having a quaternary ammonium base is particularly preferably one containing a partial structure represented by the following general formula (e1).
- R 51 , R 52 , and R 53 each independently represent a hydrogen atom or an optionally substituted cyclic or chain hydrocarbon group. Alternatively, two or more of R 51 , R 52 and R 53 may be bonded to each other to form a cyclic structure.
- R 54 represents a hydrogen atom or a methyl group.
- X represents a divalent linking group, and M ⁇ represents a counter anion.
- the hydrocarbon groups of R 51 , R 52 , and R 53 are each independently a substituent having an alkyl group having 1 to 10 carbon atoms or an aromatic group having 6 to 20 carbon atoms. preferable. Specific examples include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a benzyl group, and a phenyl group. Of these, a methyl group, an ethyl group, a propyl group, and a benzyl group are preferable.
- examples of the divalent linking group X include an alkylene group having 1 to 10 carbon atoms, an arylene group, —CONH—R 55 —, —COO—R 56 — (provided that R 55 and R 56 represents a direct bond, an alkylene group having 1 to 10 carbon atoms, or an ether group having 1 to 10 carbon atoms (—R 57 —O—R 58 —: R 57 and R 58 are each independently an alkylene group). And the like, preferably —COO—R 56 —.
- Examples of the counter anion M ⁇ include Cl ⁇ , Br ⁇ , I ⁇ , ClO 4 ⁇ , BF 4 ⁇ , CH 3 COO ⁇ and PF 6 ⁇ .
- the partial structure containing the specific quaternary ammonium base as described above may be contained in one or more A blocks.
- two or more quaternary ammonium base-containing partial structures may be contained in the A block in any form of random copolymerization or block copolymerization.
- the partial structure which does not contain this quaternary ammonium base may be contained in the A block, and examples of the partial structure include a partial structure derived from a (meth) acrylic acid ester monomer described later. It is done.
- the content of the partial structure containing no quaternary ammonium base in the A block is preferably 0 to 50% by mass, more preferably 0 to 20% by mass. Most preferably, it is not included in the A block.
- the A block of the acrylic block copolymer described above may have an unreacted tertiary amino group that is not quaternized.
- the amino group may be any one of primary to tertiary.
- the content of the monomer having a primary to tertiary amino group is preferably 20 mol% or more, more preferably 50 mol% or more, in the monomer composition constituting the acrylic block copolymer. It is.
- This amino group may be directly bonded to the main chain, but may be bonded to the main chain via a divalent linking group.
- the primary to tertiary amino group is preferably —NR 61 R 62 (wherein R 61 and R 42 each independently represents a cyclic or chain alkyl group which may have a substituent, An aryl group which may have a substituent or an aralkyl group which may have a substituent is preferable.
- R 61 and R 42 each independently represents a cyclic or chain alkyl group which may have a substituent, An aryl group which may have a substituent or an aralkyl group which may have a substituent is preferable.
- R 61 and R 42 each independently represents a cyclic or chain alkyl group which may have a substituent, An aryl group which may have a substituent or an aralkyl group which may have a substituent is preferable.
- R 61 and R 42 each independently represents a cyclic or chain alkyl group which may have a substituent, An aryl group which may have a substituent or an aralkyl
- R 61 and R 62 are synonymous with R 61 and R 62 above, R 63 is 1 or more alkylene groups having a carbon number, R 64 represents a hydrogen atom or a methyl group. Among them, R 61 and R 62 are preferably methyl groups, R 63 is preferably a methylene group and an ethylene group, and R 64 is preferably a hydrogen atom or a methyl group.
- a structure derived from dimethylaminoethyl acrylate or dimethylaminoethyl methacrylate represented by the following general formula is particularly preferably used.
- R 64 has the same meaning as described above.
- two or more kinds of partial structures containing the amino group may be contained in one A block.
- two or more types of amino group-containing partial structures may be contained in the A block in any form of random copolymerization or block copolymerization.
- a partial structure not containing an amino group may be partially contained in the A block.
- examples of such a partial structure include a partial structure derived from a (meth) acrylic acid ester monomer.
- the content of such a partial structure not containing an amino group in the A block is preferably 0 to 50% by mass, more preferably 0 to 20% by mass. Most preferably it is not included.
- the A block may have either a quaternary ammonium base or an amino group, or both.
- the B block constituting the acrylic block copolymer has no quaternary ammonium base and amino group as described above, and is composed of a monomer that can be copolymerized with the monomer constituting the A block as described above.
- the B block is a solvophilic site that does not have a nitrogen atom-containing functional group serving as a pigment adsorbing group, and has an affinity for the solvent, and thus has a function of stabilizing the pigment adsorbed on the dispersant in the solvent. .
- B block examples include styrene monomers such as styrene and ⁇ -methylstyrene; methyl (meth) acrylate, ethyl (meth) acrylate (propyl) (meth) acrylate, isopropyl (meth) acrylate, (meth) acrylic.
- the B block one containing a partial structure derived from a (meth) acrylic acid ester monomer represented by the following formula (e2) is particularly preferable.
- R 61 represents a hydrogen atom or a methyl group.
- R62 represents a cyclic or chain alkyl group which may have a substituent, an allyl group which may have a substituent, or an aralkyl group which may have a substituent.
- the partial structure derived from the (meth) acrylic acid ester monomer may be contained in two or more kinds in one B block.
- the B block may further contain a partial structure other than these.
- each partial structure is contained in the B block in any form of random copolymerization or block copolymerization. May be.
- the content in the B block of the partial structure other than the (meth) acrylate monomer is preferably Is 0 to 99% by mass, more preferably 0 to 85% by mass.
- the acrylic dispersant used in the present invention is an AB block or BAB block copolymer type polymer compound composed of such an A block and a B block.
- a block copolymer Is prepared, for example, by a living polymerization method.
- Living polymerization methods include anion living polymerization method, cationic living polymerization method, and radical living polymerization method.
- anion living polymerization method cationic living polymerization method
- radical living polymerization method for example, the method described in Japanese Patent Application Laid-Open No. 2007-270147 can be mentioned.
- the amine value of the acrylic block copolymer is usually about 1 to 300 mgKOH / g in terms of effective solid content, but the preferred range is when the A block has a quaternary ammonium base and when it does not. It is different.
- the amine value is a value expressed in mg of KOH corresponding to the molar equivalent of acid necessary for neutralizing the amino group in 1 g of the copolymer.
- the amount of the quaternary ammonium base in 1 g of the copolymer is In general, the amount is preferably 0.1 to 10 mmol, and outside this range, it may not be possible to combine good heat resistance and dispersibility.
- Such a block copolymer usually contains an amino group produced in the production process, but its amine value is usually about 1 to 100 mgKOH / g, preferably 1 to 80 mgKOH / g. . More preferably, it is 1 to 50 mgKOH / g.
- the amine value of the copolymer is usually about 50 to 300 mgKOH / g, preferably 50 to 200 mgKOH / g, more preferably 80 mgKOH / g or more and 150 mgKOH / g. Hereinafter, it is more preferably 90 to 150 mgKOH / g.
- the acid value of such an acrylic block copolymer depends on the presence and type of the acid group that is the basis of the acid value, but generally it is preferably lower, usually 100 mgKOH / g or less, preferably 50 mgKOH / g. g or less, more preferably 40 mgKOH / g or less.
- the molecular weight of the acrylic block copolymer is usually in the range of 1000 or more and 100,000 or less in terms of polystyrene-equivalent weight average molecular weight (Mw) measured by GPC.
- Mw polystyrene-equivalent weight average molecular weight
- the content of the acrylic block copolymer containing a nitrogen atom is usually 5% by mass or more and 90% by mass or less, preferably 5% by mass or more and 60% by mass or less, more preferably based on the pigment. It is 5 mass% or more and 40 mass% or less. If the content of the acrylic block copolymer containing a nitrogen atom is too small, sufficient dispersibility may not be obtained. If it is too much, the proportion of other components will decrease and the voltage holding ratio will decrease. On the other hand, the shape of the colored spacer and the formation of the step may not be possible.
- a dispersant other than an acrylic block copolymer containing a nitrogen atom may be used in combination.
- the dispersant used in combination is preferably a polymer dispersant, and is preferably a polymer having a completely different structure from the colorant.
- dispersant used in combination examples include a urethane-based dispersant, a polyallylamine-based dispersant, a dispersant comprising a monomer having an amino group and a macromonomer, a polyoxyethylene alkyl ether-based dispersant, a polyoxyethylene diester-based dispersant, Examples thereof include polyether phosphate dispersants, polyester phosphate dispersants, sorbitan aliphatic ester dispersants, and aliphatic modified polyester dispersants.
- graft copolymer containing nitrogen atoms those having a repeating unit containing a nitrogen atom in the main chain are preferred. Especially, it is preferable to have a repeating unit represented by the following general formula (i) or / and a repeating unit represented by the following general formula (ii).
- R 91 represents a linear or branched alkylene group having 1 to 5 carbon atoms such as methylene, ethylene or propylene, preferably an alkylene group having 2 to 3 carbon atoms. And more preferably an ethylene group.
- A represents a hydrogen atom or any one of the following general formulas (iii) to (v), preferably the following general formula (iii).
- W1 represents a linear or branched alkylene group having 2 to 10 carbon atoms, and an alkylene group having 4 to 7 carbon atoms such as butylene, pentylene, hexylene and the like is particularly preferable.
- p represents an integer of 1 to 20, preferably an integer of 5 to 10.
- G 1 represents a divalent linking group. Among them, an alkylene group having 1 to 4 carbon atoms such as ethylene and propylene and an alkyleneoxy group having 1 to 4 carbon atoms such as ethyleneoxy and propyleneoxy are included. preferable.
- W 2 represents a linear or branched alkylene group having 2 to 10 carbon atoms such as ethylene, propylene or butylene, and among them, an alkylene group having 2 to 3 carbon atoms such as ethylene or propylene is preferable.
- G 2 represents a hydrogen atom or —CO—R 92
- R 92 represents an alkyl group having 1 to 10 carbon atoms such as ethyl, propyl, butyl, pentyl, hexyl, etc., among which carbon number 2 such as ethyl, propyl, butyl, pentyl, etc. To 5 alkyl groups are preferred).
- q represents an integer of 1 to 20, preferably an integer of 5 to 10.
- W 3 represents an alkyl group having 1 to 50 carbon atoms or a hydroxyalkyl group having 1 to 50 carbon atoms having 1 to 5 hydroxyl groups.
- an alkyl group having 10 to 20 carbon atoms such as stearyl
- a C10-20 hydroxyalkyl group having 1-2 hydroxyl groups such as monohydroxystearyl is preferred.
- the content of the repeating unit represented by the general formula (i) or (ii) in the graft copolymer containing a nitrogen atom is preferably higher, and is usually 50 mol% or more in total, preferably 70 mol%. That's it.
- the repeating unit represented by the general formula (i) and the repeating unit represented by the general formula (ii) may both be present, and the content ratio is not particularly limited, but is preferably the general formula ( It is preferable that the repeating unit i) is contained in a larger amount.
- the total number of repeating units represented by general formula (i) or general formula (ii) in the graft copolymer is 1 or more, preferably 10 or more, more preferably 20 or more, and usually 100 or less, preferably 70. Hereinafter, it is more preferably 50 or less.
- the graft copolymer may contain a repeating unit other than the general formula (i) and the general formula (ii), and examples of the other repeating unit include an alkylene group and an alkyleneoxy group.
- the graft copolymer in the present invention preferably has a terminal having —NH 2 and —R 91 —NH 2 (R 91 is as defined in formulas (i) and (ii)).
- the main chain may be linear or branched.
- the mass average molecular weight of the graft copolymer measured by GPC is preferably 3,000 or more, particularly 5,000 or more, and preferably 100,000 or less, particularly 50,000 or less. If the mass average molecular weight is less than 3,000, the color material cannot be aggregated, and may increase in viscosity or gel. If it exceeds 100,000, the viscosity itself increases. This is not preferable because the solubility in an organic solvent is insufficient.
- a known method can be adopted, and for example, a method described in Japanese Patent Publication No. 63-30057 can be used.
- thiols it is preferable to add thiols to the photosensitive resin composition of the present invention in order to increase sensitivity and improve adhesion to the substrate.
- the thiols include hexanedithiol, decanedithiol, 1,4-dimethylmercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, ethylene glycol bisthioglycolate, trimethylolpropane tristhiol.
- polyfunctional thiols such as PGMB, TPMB, TPMIB, Karenz MT BD1, Karenz MT PE1, Karenz MT NR1, among which Karenz MT BD1, Karenz MT PE1 and Karenz MT NR1 are more preferable, and Karenz MT PE1 is Particularly preferred.
- the photosensitive resin composition of the present invention usually has a resin (a), a photopolymerization initiator (b), a photopolymerizable monomer (c), a colorant (d), a dispersant (e), and as necessary.
- Various materials used are used in a state of being dissolved or dispersed in an organic solvent.
- organic solvent it is preferable to select an organic solvent having a boiling point (under a pressure of 1013.25 [hPa], hereinafter the same for the boiling point) in the range of 100 to 300 ° C.
- a solvent having a boiling point of 120 to 280 ° C. is more preferable.
- organic solvents include the following. Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol t-butyl ether, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, triethylene glycol monomethyl ether, triethylene glycol Monoe Ether, glycol monoalkyl ethers such as tripropylene glycol methyl ether;
- Glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, dipropylene glycol dimethyl ether;
- Glycol diacetates such as ethylene glycol diacetate, 1,3-butylene glycol diacetate, 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, Ethers such as dibutyl ether, diamyl ether, ethyl isobutyl ether, dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone , Methyl butyl ketone, methyl hexyl ketone, methyl non
- Aromatic hydrocarbons such as benzene, toluene, xylene, cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, Propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, 3-methoxy Linear or cyclic esters such as ethyl propionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate and ⁇ -butyrolactone; alkoxy groups such as 3-methoxypropionic acid
- Halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile; # 2, Apco # 18 Solvent, Apco Thinner, Soak Solvent No. 1 and no. 2, Solvesso # 150, Shell TS28, Solvent, Carbitol, Ethylcarbitol, Butylcarbitol, Methylcellosolve (“Cellosolve” is a registered trademark, the same shall apply hereinafter), Ethylcellosolve, Ethylcellosolve acetate, Methylcellosolve acetate, Diglyme (all Product name).
- organic solvents may be used alone or in combination of two or more.
- an organic solvent having a boiling point in the range of 100 to 200 ° C. More preferably, it has a boiling point of 120 to 170 ° C.
- glycol alkyl ether acetates are preferable from the viewpoints of good balance in coating properties, surface tension, and the like, and relatively high solubility of constituent components in the composition.
- glycol alkyl ether acetates may be used alone or in combination with other organic solvents.
- organic solvent used in combination glycol monoalkyl ethers are particularly preferable.
- propylene glycol monomethyl ether is particularly preferred because of the solubility of the constituent components in the composition.
- glycol monoalkyl ethers are highly polar, and if the amount added is too large, the pigment tends to aggregate, and the storage stability tends to decrease such as the viscosity of the photosensitive resin composition obtained later increases.
- the proportion of glycol monoalkyl ethers in the solvent is preferably 5% by mass to 30% by mass, and more preferably 5% by mass to 20% by mass.
- an organic solvent having a boiling point of 150 ° C. or higher hereinafter sometimes referred to as “high boiling point solvent”.
- diethylene glycol mono-n-butyl ether diethylene glycol mono-n-butyl ether acetate, and diethylene glycol monoethyl ether acetate are particularly preferred because of their high effects.
- the content of the high boiling point solvent in the organic solvent is preferably 3% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, further preferably 5% by mass to 30% by mass, and further preferably 5% by mass to 10% by mass. % Is particularly preferred. If the amount of the high boiling point solvent is too small, for example, a coloring material may precipitate and solidify at the tip of the slit nozzle to cause a foreign matter defect, and if it is too much, the drying temperature of the composition will be slowed down. There is a concern that it may cause problems such as a tact defect in the vacuum drying process or a pin mark of prebaking in the filter manufacturing process.
- the high boiling point solvent having a boiling point of 150 ° C. or higher may be glycol alkyl ether acetates or glycol alkyl ethers. In this case, a high boiling point solvent having a boiling point of 150 ° C. or higher is not separately contained. It doesn't matter.
- Preferred high boiling solvents include, for example, diethylene glycol mono-n-butyl ether acetate, diethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, 1,3-butylene glycol diacetate, 1,6-hexanol among the above-mentioned various solvents. Examples include diacetate and triacetin.
- the photosensitive resin composition of the present invention includes an adhesion improver, a coatability improver, a development improver, an ultraviolet absorber, an antioxidant, a silane coupling agent, a surfactant, a pigment derivative, and the like. Can be appropriately blended.
- an adhesion improver may be included in the photosensitive resin composition of the present invention.
- a silane coupling agent e.g., silane coupling agent, a phosphoric acid adhesion improver, other adhesion improvers, etc. Can be mentioned.
- silane coupling agent various types such as epoxy, (meth) acrylic, amino and the like can be used singly or in combination of two or more.
- Preferred silane coupling agents include, for example, (meth) acryloxysilanes such as 3-methacryloxypropylmethyldimethoxysilane and 3-methacryloxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxy Epoxy silanes such as silane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane, and ureidosilanes such as 3-ureidopropyltriethoxysilane And isocyanate silanes such as 3-isocyanatopropyltriethoxysilane, and particularly preferred are epoxy silane silane coupling agents.
- (meth) acryloxysilanes such as 3-methacryloxypropylmethyldimethoxysilane and 3-methacryloxypropyltrimethoxysilane
- (meth) acryloyloxy group-containing phosphates are preferable, and those represented by the following general formulas (g1), (g2), and (g3) are particularly preferable.
- R 51 represents a hydrogen atom or a methyl group
- l and l ′ are integers of 1 to 10
- m is 1, 2, or 3.
- adhesion improvers examples include TEGO * Add Bond LTH (manufactured by Evonik). These phosphoric acid group-containing compounds or other adhesives may be used alone or in combination of two or more.
- the photosensitive resin composition of the present invention may contain a surfactant in order to improve applicability.
- a surfactant for example, anionic, cationic, nonionic and amphoteric surfactants can be used.
- nonionic surfactants are preferably used because they are less likely to adversely affect various properties, and among them, fluorine-based or silicon-based surfactants are effective in terms of coatability.
- surfactants examples include TSF4460 (manufactured by GE Toshiba Silicone), DFX-18 (manufactured by Neos), BYK-300, BYK-325, BYK-330 (manufactured by BYK Chemie), and KP340 (Shin-Etsu Silicone).
- F-470, F-475, F-478, F-559 (Dainippon Ink & Chemicals), SH7PA (Toray Silicone), DS-401 (Daikin), L-77 Nippon Unicar) and FC4430 (Sumitomo 3M).
- 1 type may be used for surfactant and it may use 2 or more types together by arbitrary combinations and a ratio.
- the photosensitive resin composition of the present invention further includes a polymerization accelerator, a photoacid generator, a crosslinking agent, a plasticizer, a storage stabilizer, a surface protective agent, an organic carboxylic acid, and an organic carboxylic acid anhydride.
- a polymerization accelerator for polymerization accelerator
- a photoacid generator for polymerization accelerator
- a crosslinking agent for polymerization
- a plasticizer for polymerizing agent
- a storage stabilizer a surface protective agent
- an organic carboxylic acid and an organic carboxylic acid anhydride.
- the photosensitive coloring composition of the present invention may contain a pigment derivative for improving dispersibility and storage stability.
- pigment derivatives include azo, phthalocyanine, quinacridone, benzimidazolone, quinophthalone, isoindolinone, dioxazine, anthraquinone, indanthrene, perylene, perinone, diketopyrrolopyrrole. And derivatives of dioxazine and the like. Of these, phthalocyanine and quinophthalone are preferable.
- substituent of the pigment derivative examples include a sulfonic acid group, a sulfonamide group and a quaternary salt thereof, a phthalimidomethyl group, a dialkylaminoalkyl group, a hydroxyl group, a carboxyl group, and an amide group directly on the pigment skeleton or an alkyl group, an aryl group. Examples thereof include those bonded via a group and a heterocyclic group, and a sulfonic acid group is preferred. Further, a plurality of these substituents may be substituted on one pigment skeleton.
- pigment derivatives examples include phthalocyanine sulfonic acid derivatives, quinophthalone sulfonic acid derivatives, anthraquinone sulfonic acid derivatives, quinacridone sulfonic acid derivatives, diketopyrrolopyrrole sulfonic acid derivatives, and dioxazine sulfonic acid derivatives. These may be used alone or in combination of two or more.
- the content ratio of the resin (a) is usually 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, based on the total solid content of the photosensitive resin composition of the present invention. More preferably, it is 20% by mass or more, particularly preferably 25% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 50% by mass or less, Preferably it is 40 mass% or less, Most preferably, it is 30 mass% or less.
- the content ratio of the resin (a) When the content ratio of the resin (a) is remarkably small, the solubility of the unexposed portion in the developing solution is lowered, and it tends to induce development failure. On the other hand, when the content ratio of the resin (a) is too large, the permeability of the developer into the exposed portion tends to be high, and the sharpness or adhesion of the pixel may be lowered.
- the resin (a) can contain other resin (a-2) together with the resin (a-1).
- the content ratio of the resin (a-1) is preferably 10% by mass or more based on the total mass of the resin (a). More preferably, it is more preferably 60% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, and more preferably 90% by mass or more. Most preferably, it is usually 100% by mass or less.
- the resin (a) may contain other resin (a-2).
- the mass ratio of the resin (a-1) to the other resin (a-2) is not particularly limited, but the sensitivity, adhesion and other resin characteristics of the resin (a-1) of the present invention are not limited. From the viewpoint of achieving balance, it is preferably 1:99 to 99: 1, more preferably 5:95 to 95: 5, and even more preferably 10:90 to 90:10.
- the content ratio of the resin (a-1) to the resin (a) is preferably 1% by mass or more, and 90% by mass. % Or less, more preferably 50% by mass or less, and further preferably 60% by mass or less.
- the content rate of a photoinitiator (b) is 0.1 mass% or more normally with respect to the total solid of the photosensitive resin composition of this invention, Preferably it is 0.5 mass% or more, More preferably, it is 0.00. 7% or more, more preferably 1% by mass or more, still more preferably 3% by mass or more, still more preferably 5% by mass or more, and usually 30% by mass or less, preferably 20% by mass. Or less, more preferably 10% by mass or less. If the content of the photopolymerization initiator (b) is too small, the sensitivity may be lowered. On the other hand, if the content is too large, the solubility of the unexposed portion in the developer is lowered, and development failure is likely to be induced.
- the proportion of the oxime ester compound in the photopolymerization initiator (b) is usually 10% by mass or more, preferably 50% by mass or more, more preferably 90% by mass or more, and usually 100% by mass or less. is there.
- the development stability can be improved by increasing the line width by improving the sensitivity and by improving the resistance to alkali developer.
- the content rate of an accelerator is 0.01 mass% or more normally with respect to the total solid of the photosensitive resin composition of this invention, Preferably it is 0.02. It is 10% by mass or less, preferably 5% by mass or less.
- the accelerator is preferably used in a proportion of 0.1 to 50% by mass, particularly 0.1 to 10% by mass with respect to the photopolymerization initiator (b).
- the photopolymerization initiator (b) and the accelerator above the lower limit value, the sensitivity to exposure light tends to be sufficient, and by using the photopolymerization initiator below the upper limit value, the solubility of the unexposed part in the developer is good. Tend to be.
- the blending ratio of the sensitizing dye in the photosensitive resin composition of the present invention is usually 0 to 20% by mass, preferably 0 to 0% in the total solid content in the photosensitive resin composition. It is 15% by mass, more preferably 0 to 10% by mass.
- the content of the photopolymerizable monomer (c) is usually 90% by mass or less, preferably 70% by mass or less, more preferably 50% by mass or less, further preferably 30%, based on the total solid content of the photosensitive resin composition. It is 10% by mass or less, particularly preferably 10% by mass or less.
- the content ratio of the photopolymerizable monomer is not more than the above upper limit, the penetrability of the developer into the exposed area becomes appropriate and a good image tends to be obtained.
- the lower limit of the content of the photopolymerizable monomer (c) is usually 1% by mass or more, preferably 5% by mass or more. By being more than the said minimum, it exists in the tendency for the photocuring by ultraviolet irradiation to improve, and for alkali developability to also become favorable.
- the content ratio of the coloring material (d) can be usually selected in the range of 1 to 70% by mass with respect to the total solid content in the photosensitive resin composition. In this range, 20 to 70% by mass is more preferable.
- the photosensitive resin composition of the present invention can be used for various applications as described above, but excellent image forming properties are particularly effective when used for forming a black matrix for a color filter. .
- the black color material such as carbon black or titanium black described above as the color material (d), or mix several types of color materials other than black and adjust to black. That's fine. Among these, it is particularly preferable to use carbon black.
- the present invention is particularly effective in the region where the pigment concentration of the black pigment increases. Particularly in recent years, it is necessary to increase the black pigment concentration in order to increase the degree of light shielding.
- the content of the black pigment exhibiting a great effect is preferably 40% by mass or more, more preferably more than 40% by mass, further preferably 45% by mass or more, based on the total solid content of the photosensitive resin composition. Especially preferably, it is 50 mass% or more, and is 70 mass% or less normally.
- the photosensitive resin composition by setting the content of the black pigment within the above range, a photosensitive resin composition having a high light shielding property (optical density, OD value) can be obtained.
- optical density optical density
- the optical density when the black matrix having a thickness of 1 ⁇ m is formed using the colored photosensitive resin composition of the present invention is 4.
- the value can be 0 or more.
- the optical density is more preferably 4.2 or more. In regions with high light shielding properties, ultraviolet rays are difficult to penetrate deeper, and crosslinking by photopolymerization is weak particularly in the area where the substrate and the fine wire are in close contact, but particularly when the photosensitive resin composition of the present invention is used, the pigment concentration When the value is large, the effect of the present invention can be confirmed well.
- the pigment concentration is particularly effective from 40 to 65% by mass based on the total solid content.
- the content of the color material is set to the lower limit value or more, the film thickness with respect to the color density does not become too large, and there is a tendency that adverse effects on gap control and the like during the liquid crystal cell formation can be prevented.
- the amount of the resin (a) with respect to 100 parts by mass of the color material (d) is usually 20 parts by mass or more, preferably 30 parts by mass or more, more preferably 40 parts by mass. In addition, it is usually 500 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and further preferably 100 parts by mass or less.
- the solubility of the unexposed portion in the developer tends to be sufficient, and it is desired to be equal to or lower than the upper limit value. It tends to be easy to obtain the pixel film thickness.
- the content ratio of the thiol compound is usually 0.1% by mass or more, preferably 0.3% by mass or more, and more preferably 0% with respect to the total solid content of the photosensitive resin composition of the present invention. 0.5 mass% or more, usually 10 mass% or less, preferably 5 mass% or less. There exists a tendency which can make sensitivity sufficient by making content of a thiol compound more than the said lower limit, and there exists a tendency for storage stability to become favorable by making it below the said upper limit.
- the content of the dispersant (e) is usually 50% by mass or less, preferably 30% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less, in the solid content of the photosensitive resin composition. 1 mass% or more, preferably 3 mass% or more, more preferably 5 mass% or more.
- the content of the dispersant is usually 5 parts by mass or more, preferably 10 parts by mass or more, more preferably 15 parts by mass or more, and usually 200 parts by mass or less, with respect to 100 parts by mass of the coloring material (d). Preferably it is 80 mass parts or less, More preferably, it is 50 mass parts or less.
- the blending ratio of the pigment derivative is usually 0 with respect to the total solid content of the photosensitive resin composition of the present invention. .1% by mass or more, preferably 0.5% by mass or more, usually 10% by mass or less, preferably 5% by mass or less, more preferably 3% by mass or less.
- the content thereof is usually 0.001% by mass or more, preferably 0.005% by mass or more, more preferably 0.01% by mass with respect to the total solid content in the photosensitive resin composition. Or more, more preferably 0.03% by mass or more, particularly preferably 0.05% by mass or more, and usually 10% by mass or less, preferably 1% by mass or less, more preferably 0.5% by mass or less, more preferably It is 0.3 mass% or less.
- the smoothness and uniformity of the coating film can be improved by setting the content of the surfactant to the lower limit value or more, and the smoothness of the coating film by setting the upper limit value or less, In addition to improving the uniformity, there is a tendency that deterioration of other characteristics can be suppressed.
- the photosensitive resin composition of the present invention has the solid content concentration of usually 5% by mass or more, preferably 10% by mass or more, and usually 50% by mass or less, preferably 30 by using the organic solvent described above.
- the liquid is prepared so as to be not more than mass%, more preferably not more than 20 mass%.
- the photosensitive resin composition of the present invention (hereinafter sometimes referred to as “resist”) is produced according to a conventional method.
- the color material (d) it is preferable to disperse the color material (d) in advance using a paint conditioner, a sand grinder, a ball mill, a roll mill, a stone mill, a jet mill, a homogenizer or the like. Since the color material (d) is finely divided by the dispersion treatment, the resist coating characteristics are improved. Further, when a black color material is used as the color material (d), it contributes to an improvement in light shielding ability.
- the dispersion treatment is usually preferably carried out in a system in which a coloring material (d), a dispersant (e), an organic solvent, and, if necessary, a part or all of the resin (a) are used together (hereinafter referred to as dispersion treatment).
- a coloring material (d) a coloring material (d), a dispersant (e), an organic solvent, and, if necessary, a part or all of the resin (a) are used together
- the composition obtained by the treatment may be referred to as “ink” or “pigment dispersion”).
- it is preferable to use a polymer dispersant as the dispersant because thickening of the obtained ink and resist with time is suppressed (excellent dispersion stability).
- a highly reactive component may be denatured due to heat generated during the dispersion treatment. Therefore, it is preferable to perform the dispersion treatment in a system containing a polymer dispersant.
- the temperature is usually from 0 ° C. to 100 ° C., and preferably from room temperature to 80 ° C.
- the dispersion time is appropriately adjusted because the appropriate time varies depending on the composition of the liquid and the size of the dispersion treatment apparatus.
- the standard of dispersion is to control the gloss of the ink so that the resist 20-degree specular gloss [JIS Z8741 (1997)] is in the range of 100-200.
- the dispersion treatment is not sufficient, and rough pigment (coloring material) particles often remain, which may result in insufficient developability, adhesion, resolution, and the like.
- the dispersion treatment is performed until the gloss value exceeds the above range, the pigment is crushed and a large number of ultrafine particles are generated, so that the dispersion stability tends to be impaired.
- the ink obtained by the dispersion treatment and the other components contained in the resist are mixed to obtain a uniform solution.
- fine dust is often mixed in the liquid, and thus the obtained resist is preferably filtered with a filter or the like.
- a cured product can be obtained by curing the photosensitive resin composition of the present invention.
- a cured product obtained by curing the photosensitive resin composition can be preferably used as a black matrix or a colored spacer.
- the support for forming the black matrix is not particularly limited as long as it has an appropriate strength.
- a transparent substrate is mainly used, but the material is, for example, a polyester resin such as polyethylene terephthalate, a polyolefin resin such as polypropylene or polyethylene, a sheet made of a thermoplastic resin such as polycarbonate, polymethyl methacrylate or polysulfone, or an epoxy resin. And thermosetting resin sheets such as unsaturated polyester resins and poly (meth) acrylic resins, and various glasses. Among these, glass and heat resistant resin are preferable from the viewpoint of heat resistance.
- a transparent electrode such as ITO or IZO is formed on the surface of the substrate. Other than the transparent substrate, it can be formed on the TFT array.
- the support may be subjected to corona discharge treatment, ozone treatment, thin film formation treatment of various resins such as a silane coupling agent or a urethane-based resin, if necessary, in order to improve surface properties such as adhesiveness.
- the thickness of the transparent substrate is usually 0.05 to 10 mm, preferably 0.1 to 7 mm.
- the film thickness is usually 0.01 to 10 ⁇ m, preferably 0.05 to 5 ⁇ m.
- the photosensitive resin composition of the present invention is applied on a transparent substrate and dried, and then the sample is formed.
- a black mask is formed by placing a photomask on the substrate and exposing the image through the photomask, developing, and thermosetting or photocuring as necessary.
- a photosensitive resin composition for a black matrix onto a transparent substrate is, for example, spinner method, wire bar method, flow coating method, It can be performed by a die coating method, a roll coating method, a spray coating method, or the like.
- the die coating method significantly reduces the amount of coating solution used, and has no influence from mist adhering to the spin coating method. To preferred.
- the thickness of the coating film is too thick, pattern development becomes difficult, and it may be difficult to adjust the gap in the liquid crystal cell forming process. May become impossible.
- the thickness of the coating film is usually preferably in the range of 0.2 to 10 ⁇ m, more preferably in the range of 0.5 to 6 ⁇ m, and still more preferably in the range of 1 to 4 ⁇ m, as the film thickness after drying. is there.
- drying of coating film after the photosensitive resin composition is applied to the substrate is preferably carried out by a drying method using a hot plate, IR oven, or convection oven. Drying conditions can be appropriately selected according to the type of the solvent component, the performance of the dryer used, and the like.
- the drying time is usually selected within the range of 15 seconds to 5 minutes at a temperature of 40 to 200 ° C., preferably 50 to 130 ° C., depending on the type of solvent component and the performance of the dryer used. It is selected in the range of 30 seconds to 3 minutes.
- the drying process of this coating film may be a reduced pressure drying method in which drying is performed in a reduced pressure chamber without increasing the temperature.
- Exposure Image exposure is performed by overlaying a negative mask pattern on the coating film of the photosensitive resin composition and irradiating an ultraviolet or visible light source through this mask pattern. At this time, if necessary, exposure may be performed after an oxygen blocking layer such as a polyvinyl alcohol layer is formed on the photopolymerizable coating film in order to prevent a decrease in sensitivity of the photopolymerizable layer due to oxygen.
- the light source used for the above image exposure is not particularly limited.
- the light source include lamp light sources such as xenon lamps, halogen lamps, tungsten lamps, high pressure mercury lamps, ultrahigh pressure mercury lamps, metal halide lamps, medium pressure mercury lamps, low pressure mercury lamps, carbon arc and fluorescent lamps, and argon ion lasers, YAG lasers, Examples include laser light sources such as excimer laser, nitrogen laser, helium cadmium laser, and semiconductor laser.
- An optical filter can also be used when irradiating light of a specific wavelength.
- the black matrix according to the present invention comprises an organic solvent or an aqueous solution containing a surfactant and an alkaline compound after the coating film made of the photosensitive resin composition is image-exposed with the above-mentioned light source.
- An image can be formed on a substrate by development using a film.
- This aqueous solution may further contain an organic solvent, a buffering agent, a complexing agent, a dye or a pigment.
- alkaline compound examples include sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium silicate, potassium silicate, sodium metasilicate, sodium phosphate, phosphorus Inorganic alkaline compounds such as potassium phosphate, sodium hydrogen phosphate, potassium hydrogen phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate and ammonium hydroxide, and mono-di- or triethanolamine, mono-di- Or trimethylamine, mono-di- or triethylamine, mono- or diisopropylamine, n-butylamine, mono-di- or triisopropanolamine, ethyleneimine, ethylenediimine, tetramethylammonium hydroxide (TMA ) And organic alkaline compounds, such as choline. These alkaline compounds may be a mixture of two or more.
- surfactant examples include nonionic surfactants such as polyoxyethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, polyoxyethylene alkyl esters, sorbitan alkyl esters and monoglyceride alkyl esters, and alkylbenzene sulfonic acids.
- nonionic surfactants such as polyoxyethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, polyoxyethylene alkyl esters, sorbitan alkyl esters and monoglyceride alkyl esters, and alkylbenzene sulfonic acids.
- anionic surfactants such as salts, alkylnaphthalene sulfonates, alkyl sulfates, alkyl sulfonates and sulfosuccinate esters
- amphoteric surfactants such as alkylbetaines and amino acids.
- organic solvent examples include isopropyl alcohol, benzyl alcohol, ethyl cellosolve, butyl cellosolve, phenyl cellosolve, propylene glycol and diacetone alcohol.
- the organic solvent may be used alone or in combination with an aqueous solution.
- the development processing conditions are not particularly limited, and the development temperature is usually in the range of 10 to 50 ° C., particularly 15 to 45 ° C., particularly preferably 20 to 40 ° C.
- the development methods are immersion development, spray development, brush Any of a developing method, an ultrasonic developing method and the like can be used.
- thermosetting treatment The substrate after development is subjected to thermosetting treatment or photocuring treatment, preferably thermosetting treatment.
- the thermosetting treatment conditions at this time are selected such that the temperature is in the range of 100 to 280 ° C., preferably in the range of 150 to 250 ° C., and the time is in the range of 5 to 60 minutes.
- the black matrix formed as described above has a bottom width of usually 3 to 50 ⁇ m, preferably 4 to 30 ⁇ m, particularly 4 to 8 ⁇ m in the case of a high fine wire, and a height of usually 0.5 to 5 ⁇ m, preferably Is 1 to 4 ⁇ m.
- the low volume efficiency is 1 ⁇ 10 13 ⁇ ⁇ cm or more, preferably 1 ⁇ 10 14 ⁇ ⁇ cm or more, and the relative dielectric constant is 6 or less, preferably 5 or less.
- the optical density (OD) per 1 ⁇ m thickness is 3.0 or more, preferably 3.5 or more, more preferably 4.0 or more, and particularly preferably 4.2 or more.
- a photosensitive colored resin composition containing a color material of one color of red, green, and blue is applied by the same process as the above (3-1) to (3-5), After drying, a photomask is overlaid on the coating film, and a pixel image is formed through image exposure, development, and heat curing or photocuring as necessary through this photomask to form a colored layer.
- a photosensitive colored resin compositions of three colors of red, green, and blue pixels of the color filter can be formed. The order of these is not limited to the above.
- the colored photosensitive composition of the present embodiment can be used as a resist for a colored spacer other than the black matrix.
- the spacer When the spacer is used in a TFT type LCD, the TFT may malfunction as a switching element due to light incident on the TFT, and the colored spacer is used to prevent this.
- Japanese Patent Application Laid-Open No. 8-234212 describes that a spacer is light-shielding.
- the colored spacer can be formed in the same manner as the black matrix described above except that a mask for the colored spacer is used.
- the color filter is used as a part of parts such as a color display and a liquid crystal display by forming a transparent electrode such as ITO on the image as it is.
- a transparent electrode such as ITO
- a top coat layer such as polyamide or polyimide can be provided on the image as necessary.
- the transparent electrode may not be formed.
- the image display device of the present invention is not particularly limited as long as it is a device that displays an image or video, and examples thereof include a liquid crystal display device and an organic EL display described later.
- the liquid crystal display device of the present invention is manufactured using the above-described black matrix of the present invention, and is not particularly limited in terms of formation order and formation position of color pixels and black matrix.
- a liquid crystal display device usually forms an alignment film on a color filter, spreads spacers on the alignment film, and then bonds to a counter substrate to form a liquid crystal cell, injects liquid crystal into the formed liquid crystal cell, Complete by connecting to the counter electrode.
- the alignment film a resin film such as polyimide is preferable.
- the alignment film For the formation of the alignment film, a gravure printing method and / or a flexographic printing method is usually employed, and the thickness of the alignment film is several tens of nm. After the alignment film is cured by thermal baking, it is surface-treated by irradiation with ultraviolet rays or a rubbing cloth to be processed into a surface state in which the tilt of the liquid crystal can be adjusted.
- spacer a spacer having a size corresponding to a gap with the counter substrate is used, and a spacer of 2 to 8 ⁇ m is usually preferable.
- a photo spacer (PS) of a transparent resin film is formed on the color filter substrate by photolithography, and this can be used instead of the spacer.
- the counter substrate an array substrate is usually used, and a TFT (thin film transistor) substrate is particularly preferable.
- the gap for bonding to the counter substrate varies depending on the use of the liquid crystal display device, but is usually selected in the range of 2 to 8 ⁇ m.
- a sealing material such as an epoxy resin.
- the sealing material is cured by UV irradiation and / or heating, and the periphery of the liquid crystal cell is sealed.
- the liquid crystal cell whose periphery is sealed is cut into panel units, then decompressed in a vacuum chamber, the liquid crystal injection port is immersed in liquid crystal, and then the liquid crystal is injected into the liquid crystal cell by leaking in the chamber.
- the degree of decompression in the liquid crystal cell is usually 1 ⁇ 10 ⁇ 2 to 1 ⁇ 10 ⁇ 7 Pa, preferably 1 ⁇ 10 ⁇ 3 to 1 ⁇ 10 ⁇ 6 Pa.
- the heating temperature is usually 30 to 100 ° C., more preferably 50 to 90 ° C.
- the warming holding at the time of depressurization is usually in the range of 10 to 60 minutes, and then immersed in the liquid crystal.
- the liquid crystal cell into which the liquid crystal is injected has a liquid crystal display device (panel) completed by sealing the liquid crystal injection port by curing the UV curable resin.
- liquid crystal there are no particular restrictions on the type of liquid crystal, and it is a conventionally known liquid crystal such as an aromatic, aliphatic, or polycyclic compound, and may be any of lyotropic liquid crystal, thermotropic liquid crystal, and the like.
- thermotropic liquid crystal nematic liquid crystal, smectic liquid crystal, cholesteric liquid crystal, and the like are known, but any of them may be used.
- Organic EL display The organic EL display of the present invention is produced using the color filter of the present invention.
- an organic EL display is produced using the color filter of the present invention, for example, as shown in FIG. 1, first, a pattern (that is, the pixel 20 and adjacent) formed on the transparent support substrate 10 by the colored resin composition.
- a color filter in which a resin black matrix (not shown) provided between the pixels 20 is formed is manufactured, and the organic light-emitting body 500 is formed on the color filter via the organic protective layer 30 and the inorganic oxide film 40.
- the organic EL element 100 can be manufactured.
- at least one of the pixel 20 and the resin black matrix is produced using the photosensitive colored resin composition of the present invention.
- a transparent anode 50, a hole injection layer 51, a hole transport layer 52, a light emitting layer 53, an electron injection layer 54, and a cathode 55 are sequentially formed on the upper surface of the color filter.
- a method of adhering the organic light-emitting body 500 formed on another substrate onto the inorganic oxide film 40 can be used.
- Organic EL display (Ohm, Inc., August 20, 2004, light emission, Shizushi Tokito, Chiba Adachi, Hideyuki Murata) using the organic EL element 100 manufactured in this manner, etc.
- Organic EL display can be produced.
- color filter of the present invention can be applied to both passive drive type organic EL displays and active drive type organic EL displays.
- a pigment, a dispersant, a dispersion aid, and a solvent were prepared with the following composition, and a carbon black dispersion ink was prepared by the following method.
- the solid content and the solvent of the pigment, the dispersant, and the dispersion aid were prepared as follows.
- Pigment R1060 (carbon black produced by Colombia); 100 parts by mass / dispersant: BYK167 (basic urethane dispersant manufactured by Big Chemie); 20 parts by mass (in terms of solid content)
- a dispersion treatment was carried out for 6 hours in the range of 25 to 45 ° C. using a paint shaker.
- the beads zirconia beads having a diameter of 0.5 mm were used, and 60 parts by mass of the dispersion and 180 parts by mass of the beads were added. After the dispersion was completed, the beads were separated by a filter to prepare a carbon black dispersion ink having a solid content of 35% by mass.
- the obtained epoxy acrylate solution, trimethylolpropane (TMP), biphenyltetracarboxylic dianhydride (BPDA), tetrahydrophthalic anhydride (THPA), and propylene glycol monomethyl ether acetate (PGMEA) are listed in Table 1 below.
- TMP trimethylolpropane
- BPDA biphenyltetracarboxylic dianhydride
- THPA tetrahydrophthalic anhydride
- PMEA propylene glycol monomethyl ether acetate
- TMP trimethylolpropane
- BPDA biphenyltetracarboxylic dianhydride
- THPA tetrahydrophthalic anhydride
- the resin solution becomes transparent, it is diluted with methoxybutyl acetate to prepare a solid content of 40% by mass, an acid value of 110 mg-KOH / g, an alkali-soluble resin having a polystyrene-equivalent weight average molecular weight of 4000 measured by GPC ( 5) was obtained.
- An epoxy compound having the above structure (epoxy equivalent 217), 2.4 g of acrylic acid, 6.4 g of propylene glycol monomethyl ether acetate, 0.18 g of tetraethylammonium chloride, and 0.008 g of p-methoxyphenol were thermometer, stirrer, The reaction mixture was placed in a flask equipped with a condenser and stirred at 100 ° C. until the acid value was 5 mg-KOH / g or less. The reaction took 9 hours to obtain an epoxy acrylate solution.
- the structure of the photopolymerization initiator (1) is as follows.
- Example 5> (Preparation of black resist 1) Using the carbon black dispersion ink prepared in ⁇ Preparation of carbon black dispersion ink>, the components shown in Table 3 were mixed in the proportions shown in Table 3, and stirred and dissolved with a stirrer to prepare black resist 1. .
- the amount of each component used in the carbon black dispersed ink and others is a solid content value.
- the usage-amount in a solvent is the total usage-amount of a solvent also including the solvent contained in carbon black dispersion
- Alkali-soluble resin (1) Resin synthesized in Example 1.
- Photopolymerization initiator (1) Photopolymerization initiator synthesized in Synthesis Example 1.
- Photopolymerizable monomer (1) Dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd.) -Surfactant: F559 (manufactured by DIC)
- Example 6> (Preparation of black resist 2) A black resist 2 was prepared in the same manner as in Example 5 except that the alkali-soluble resin (1) was changed to the alkali-soluble resin (2) synthesized in Example 2.
- Example 7 (Preparation of black resist 3) A black resist 3 was prepared in the same manner as in Example 5 except that the alkali-soluble resin (1) was changed to the alkali-soluble resin (3) synthesized in Example 3.
- Example 8> (Preparation of black resist 4) A black resist 4 was prepared in the same manner as in Example 5 except that the alkali-soluble resin (1) was changed to the alkali-soluble resin (4) synthesized in Example 4.
- Example 9> (Preparation of black resist 5) A black resist 5 was prepared in the same manner as in Example 5 except that the photopolymerization initiator was changed to photopolymerization initiator (2) (TR-PBG-304, manufactured by Changzhou Strong Electronics Co., Ltd.).
- Example 10> (Preparation of black resist 6) A black resist 6 was prepared in the same manner as in Example 5 except that the photopolymerization initiator was changed to photopolymerization initiator (3) (NCI-831, manufactured by ADEKA).
- Example 11> (Preparation of black resist 7) A black resist 7 was prepared in the same manner as in Example 5 except that the photopolymerization initiator was changed to photopolymerization initiator (4) (OX02, manufactured by BASF).
- Example 12 (Preparation of black resist 8) A black resist 8 was prepared in the same manner as in Example 5 except that the content ratio of each component was changed to that shown in Table 4 so that the content ratio of carbon black with respect to the total solid content was 45% by mass.
- Example 13> (Preparation of black resist 9) A black resist 9 was prepared in the same manner as in Example 5 except that the content ratio of each component was changed to that shown in Table 4 so that the content ratio of carbon black with respect to the total solid content was 40% by mass.
- Comparative Example 3 (Preparation of comparative black resist 10) A comparative black resist 10 was prepared in the same manner as in Example 5 except that the alkali-soluble resin (1) was changed to the alkali-soluble resin (5) synthesized in Comparative Example 1.
- Comparative example 4 (Preparation of comparative black resist 11) A comparative black resist 11 was prepared in the same manner as in Example 5 except that the alkali-soluble resin (1) was changed to the alkali-soluble resin (6) synthesized in Comparative Example 2.
- BM resist patterns were obtained by spray development using an aqueous solution as an alkaline developer for 80 seconds, 100 seconds, or 120 seconds.
- formation line width (sensitivity) and resolving power (development adhesion) were evaluated according to the criteria described in (2) and (3) below, and the results are shown in Table 5.
- Formation line width evaluation method (sensitivity) Using an exposure mask with an opening of 10 ⁇ m (a striped opening with a width of 10 ⁇ m), the formation line width of the BM resist pattern obtained by the method (1) above is observed with a microscope at a magnification of 200 times, and the formation line width is measured. did. When evaluated with the same exposure amount and the same development time, the larger the formation line width, the higher the sensitivity.
- a BM resist pattern was formed by the method of (1) above using an exposure mask having an opening of 1 ⁇ m to 10 ⁇ m (a striped opening with a width of 1 to 10 ⁇ m in 1 ⁇ m increments). The BM resist pattern was observed visually or using an optical microscope. Among the BM resist patterns remaining on the glass substrate with no chipping or surface roughness, the value of the opening width of the exposure mask corresponding to the pattern having the narrowest line width was defined as the development adhesion value. A smaller development adhesion value means better adhesion to the substrate and higher resolution.
- a substrate having a thickness of 1.20 ⁇ m and a 2.5 cm square BM was prepared by the same process as in (II) above (however, the entire surface was exposed without using an exposure mask).
- An aluminum stud pin (P / N: 901106U, diameter 2.7 mm) (Quad Group) was joined using a thermosetting sealant Structbond XN-21-S (Mitsui Chemicals).
- a tensile test was performed on the prepared sample at a rate of 2.0 kg / s using a thin film adhesion strength measuring device Romulus (manufactured by Quad Group), and the breaking strength and bonding area when the black matrix and the glass substrate were broken.
- the substrate adhesion stress was determined by the following equation.
- the substrate adhesion force (%) in Table 6 is a relative value (%) when the value of substrate adhesion stress (kg / cm 2 ) in Example 5 is 100%.
- the resin of the present invention has excellent sensitivity (formation line width) and resolution (development adhesion) when applied to a photosensitive resin composition, and also has excellent substrate adhesion. It turns out that.
- the photosensitive resin compositions of Examples 5 to 13 of the present invention have good development adhesion at a long development time of 80 to 120 seconds, and the formation line width is large and high. Sensitivity was obtained.
- the resins in the photosensitive resin compositions of Examples 5 to 13 of the present invention have a bulky ring structure in which the alkylidene group at the bisphenoxy site is greatly spread in a planar shape as in the above formula (II). Therefore, the hydrophobicity is high, the resistance to an alkaline developer is large, and since it has a bisphenoxy structure, the steric hindrance around the acrylic group is small and the crosslinking reaction is likely to occur as described above. . Further, comparison between Example 5 and Example 12 and Example 13 confirmed that both the formation line width and the development adhesion were good regardless of the pigment content.
- the photosensitive resin composition of Comparative Example 3 had a smaller line width and lower sensitivity than Examples 1 to 4, and the development adhesion was also worse than that of Examples 5 to 13. Also, in the substrate adhesion evaluation of Table 4, it decreased to about three-quarters of Example 1.
- the resin in the photosensitive resin composition of Comparative Example 3 has two adamantyl group structures and has a large number of carbons, but does not have a bulky structure spread in a plane. Since it does not have a phenoxy structure, it is considered that resistance to an alkali developer and high sensitivity could not be obtained.
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Abstract
Description
上記式(II)中、R1~R4はそれぞれ独立に、水素原子、炭素数1~20のアルキル基、炭素原子6~20のアリール基、又は、炭素原子7~20のアラルキル基であり、R5は炭素数1~20のアルキル基、炭素数6~20アリール基、又は炭素数7~20アラルキル基であり、kは1~5の整数であり、lは0~13の整数である。
また、*はそれぞれ独立に結合手である。]
[2]前記式(II)で表される部分構造が、下記式(III)で表される部分構造である[1]に記載の樹脂。
また、*はそれぞれ独立に結合手である。]
[3]前記式(I)及び(II)で表される部分構造を含む樹脂が、下記式(IV)で表される部分構造を含む樹脂である[1]に記載の樹脂。
また、R1~R5、k及びlは前記式(II)と同義である。また、R12は各々独立に前記式(I)と同義である。
また、*はそれぞれ独立に結合手である。]
[4]前記式(IV)で表される部分構造が、下記式(V)で表される部分構造である[3]に記載の樹脂。
また、*はそれぞれ独立に結合手である。]
[5]さらに下記式(VI)で表される部分構造及び下記式(VII)で表される部分構造の少なくとも一方を含む[1]~[4]のいずれか1に記載の樹脂。
また、*はそれぞれ独立に結合手である。]
[6]さらに下記式(VIII)で表される部分構造を有する[5]に記載の樹脂。
また、*は結合手である。]
[7]さらに下記式(IX)で表される部分構造を有する[5]に記載の樹脂。
また、*は結合手である。]
[8]少なくとも
(A-1)下記式(X)で表されるエポキシ基含有化合物と
(A-2)不飽和カルボン酸もしくは不飽和カルボン酸エステル
を反応させることにより得られる樹脂。
[9](A-1)エポキシ基含有化合物が、下記式(XI)で表される化合物である[8]に記載の樹脂。
[10][8]又は[9]に記載の樹脂を、(A-3)多塩基酸無水物と反応させることにより得られる樹脂。
[11](A-3)多塩基酸無水物と共に、さらに(A-4)多価アルコールと反応させることにより得られる[10]に記載の樹脂。
[12](A-4)多価アルコールが、トリメチロールプロパン、ジトリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリメチロールエタン、及び1,2,3-プロパントリオールからなる群から選ばれる少なくとも1種の多価アルコールである[11]に記載の樹脂。
[13]カラーフィルタ用樹脂である[1]~[12]のいずれか1に記載の樹脂。
[15]さらに色材(d)を含有する[14]に記載の感光性樹脂組成物。
[16]色材(d)が顔料であり、さらに分散剤(e)を含有する[15]に記載の感光性樹脂組成物。
[17]色材(d)が黒色顔料であり、かつ、分散剤(e)が塩基性官能基を有する高分子化合物である[16]に記載の感光性樹脂組成物。
[18]前記黒色顔料の含有割合が全固形分中45質量%以上である[17]に記載の感光性樹脂組成物。
[19]光重合開始剤(b)として、少なくともオキシムエステル化合物を含有する[14]~[18]のいずれか1に記載の感光性樹脂組成物。
[21][20]に記載の硬化物からなる画素及びブラックマトリックスの少なくとも一方を含むカラーフィルタ。
[22][21]に記載のカラーフィルタを備える画像表示装置。
また、本発明において、「カルボン酸残基」とは、カルボン酸化合物から全てのカルボキシル基を除いた後に残る基を意味する。例えば、A-COOHで表されるカルボン酸化合物におけるカルボン酸残基は、Aで表される1価の基を意味する。同様に、「多価アルコール残基」とは、多価アルコール化合物から全ての水酸基を除いた後に残る基を意味する。また、「多価メチロール残基」とは、多価メチロール化合物から全てのメチロール基(-CH2-OH基)を除いた後に残る基を意味する。
本発明の樹脂(以下、「樹脂(a-1)」と称することがある。)は、少なくとも下記式(I)で表される部分構造及び下記式(II)で表される部分構造を含むことを特徴とする。
また、*はそれぞれ独立に結合手である。
前記式(I)で表される部分構造におけるR12は、水素原子、炭素数1~10のアルキル基、炭素数6~20のアリール基、又は炭素数7~20のアラルキル基である。
前記式(II)で表される部分構造中のシクロアルキリデン基におけるkは1~5の整数であり、好ましくは2以上の整数であり、また、好ましくは4以下の整数であり、より好ましくは3である。
これらの中でも、耐熱性の観点からはR1~R4が水素原子であることが好ましく、また、耐薬品性の観点からはメチル基であることが好ましい。
樹脂(a-1)において、前記式(II)で表される部分構造は、下記式(III)で表される部分構造であることが好ましい。
樹脂(a-1)は、前記式(I)で表される部分構造及び前記式(II)で表される部分構造として、下記式(IV)で表される部分構造を含むことが好ましい。つまり、前記式(I)及び(II)で表される部分構造を含む樹脂が、下記式(IV)で表される部分構造を含む樹脂であることが好ましい。
樹脂(a-1)において、前記式(IV)の部分構造は、下記式(V)で示される部分構造であることが好ましい。
樹脂(a-1)は、さらに下記式(VI)で表される部分構造及び/又は下記式(VII)で表される部分構造を含むことが好ましい。
樹脂(a-1)は、前記式(I)~(VII)の部分構造以外に、下記式(VIII)で表される部分構造を有することが好ましい。
本発明の樹脂は、前記式(VIII)で表される部分構造として、下記式(IX)で表される部分構造を含有していていもよい。
樹脂(a-1)の酸価は、通常10mg-KOH/g以上、好ましくは50mg-KOH/g以上であり、酸価は200mg-KOH/g以下であることが好ましく、150mg-KOH/g以下であることがより好ましい。前記範囲内の場合には、基板密着性または耐薬品性などの硬化特性が良好に発現される傾向がある。
樹脂(a-1)は、少なくとも
(A-1)下記式(X)で表されるエポキシ基含有化合物と
(A-2)不飽和カルボン酸もしくは不飽和カルボン酸エステル
を反応させることにより得られる樹脂であることが好ましい。
前記式(X)中のR1~R4、R5、R11、及びk、l、mは、前記式(I)~(IV)と同義であり、前記式(I)~(V)にて挙げたものが好ましい。
本発明の樹脂(a-1)の合成反応に用いられる不飽和カルボン酸としては、例えば、エチレン性不飽和基を有する不飽和カルボン酸が挙げられる。具体例としては、(メタ)アクリル酸、クロトン酸、o-ビニル安息香酸、m-ビニル安息香酸、p-ビニル安息香酸、ケイヒ酸、α-位がハロアルキル基、アルコキシル基、ハロゲン原子、ニトロ基、又はシアノ基で置換された(メタ)アクリル酸などのモノカルボン酸;2-(メタ)アクリロイロキシエチルコハク酸、2-(メタ)アクリロイロキシエチルアジピン酸、2-(メタ)アクリロイロキシエチルフタル酸、2-(メタ)アクリロイロキシエチルヘキサヒドロフタル酸、2-(メタ)アクリロイロキシエチルマレイン酸、2-(メタ)アクリロイロキシプロピルコハク酸、2-(メタ)アクリロイロキシプロピルアジピン酸、2-(メタ)アクリロイロキシプロピルテトラヒドロフタル酸、2-(メタ)アクリロイロキシプロピルフタル酸、2-(メタ)アクリロイロキシプロピルマレイン酸、2-(メタ)アクリロイロキシブチルコハク酸、2-(メタ)アクリロイロキシブチルアジピン酸、2-(メタ)アクリロイロキシブチルヒドロフタル酸、2-(メタ)アクリロイロキシブチルフタル酸、2-(メタ)アクリロイロキシブチルマレイン酸などの、2塩基酸の(メタ)アクリロイロキシアルキルエステル;(メタ)アクリル酸にε-カプロラクトン、β-プロピオラクトン、γ-ブチロラクトン、δ-バレロラクトン等のラクトン類を付加させたものである単量体;(メタ)アクリル酸ダイマーなどが挙げられる。
樹脂(a-1)の合成反応に用いられる多塩基酸無水物としては、2塩基酸無水物、3塩基酸無水物、4塩基酸無水物等を好ましく用いることができる。
(A-5)エポキシアクリレート樹脂に多塩基酸無水物を付加させる際に、該多塩基酸無水物と共に、該多塩基酸無水物に付加可能な(A-4)多価アルコール及び/又は多価メチロール(以下、「多価アルコール類」と略記する)を用いて反応させることが好ましい。多価アルコール類を共に反応させることにより、多塩基酸無水物に多価アルコール類を付加させて、酸価を増大させたり、高分子量化させたりすることができる傾向がある。
樹脂(a-1)の合成反応に用いられる多価アルコール類としては、2個以上の水酸基を有する化合物であれば特に限定されないが、基板密着性と耐薬品性の硬化特性の観点、及び取扱い易さの観点から、具体的には、トリメチロールプロパン、ジトリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリメチロールエタン、及び1,2,3-プロパントリオールからなる群から選ばれる少なくとも1種の多価アルコール類であることが好ましい。
前記のように(A-5)エポキシアクリレート樹脂を得た後、該エポキシアクリレート樹脂に多塩基酸無水物を付加させる、又は多塩基酸無水物と多価アルコール類とを付加させる方法としては、公知の方法を用いることができる。
樹脂(a-1)は、カラーフィルタ、スペーサー、着色スペーサー用、及び液晶ディスプレイまたは有機ELなどの画像表示装置用部材などを形成するための感光性樹脂組成物の樹脂として好ましく用いられる。特に、カラーフィルタ用樹脂として好ましくに用いることができる。
樹脂(a-1)と併用できる、その他の樹脂(a-2)としては特に限定されないが、感光性樹脂組成物を塗布、乾燥して得られる硬化膜を露光後、露光部と非露光部のアルカリ現像に対する溶解性が変化するアルカリ可溶性樹脂であることが好ましく、カルボキシル基を有するアルカリ可溶性樹脂であるのがより好ましく、エチレン性不飽和結合とカルボキシル基を有するアルカリ可溶性樹脂が更に好ましい。
エポキシ樹脂にα,β-不飽和モノカルボン酸又はカルボキシル基を有するα,β-不飽和モノカルボン酸エステルを付加させ、さらに、多塩基酸及び/又はその無水物を反応させることによって得られたアルカリ可溶性樹脂。
エポキシ樹脂にα,β-不飽和モノカルボン酸又はカルボキシル基を有するα,β-不飽和モノカルボン酸エステルを付加させ、さらに、多価アルコール、及び多塩基酸及び/又はその無水物と反応させることによって得られたアルカリ可溶性樹脂。
アクリル共重合樹脂としては、例えば、日本国特開平7-207211号、日本国特開平8-259876号、日本国特開平10-300922号、日本国特開平11-140144号、日本国特開平11-174224号、日本国特開2000-56118号、日本国特開2003-233179号、日本国特開2007-270147号などの各公報等に記載された様々な高分子化合物を使用することができる。好ましくは、以下の(A2-1)~(A2-4)の樹脂等が挙げられ、中でも、(A2-1)樹脂が特に好ましい。
本発明の感光性樹脂組成物は、樹脂(a)とともに、光重合開始剤(b)を含むものである。光重合開始剤は、光を直接吸収し、分解反応又は水素引き抜き反応を起こし、重合活性ラジカルを発生する機能を有する成分である。
加速剤としては、例えば、2-メルカプトベンゾチアゾール、2-メルカプトベンゾオキサゾール、2-メルカプトベンゾイミダゾール等の複素環を有するメルカプト化合物又は脂肪族多官能メルカプト化合物等が用いられる。加速剤は、1種類を単独で用いても、2種以上を組み合わせて使用してもよい。
光重合開始剤には、必要に応じて、感応感度を高める目的で、画像露光光源の波長に応じた増感色素を併用させることができる。これら増感色素としては、日本国特開平4-221958号公報、同4-219756号公報に記載のキサンテン色素、日本国特開平3-239703号公報、同5-289335号公報に記載の複素環を有するクマリン色素、日本国特開平3-239703号公報、同5-289335号公報に記載の3-ケトクマリン化合物、日本国特開平6-19240号公報に記載のピロメテン色素、その他、日本国特開昭47-2528号公報、同54-155292号公報、日本国特公昭45-37377号公報、日本国特開昭48-84183号公報、同52-112681号公報、同58-15503号公報、同60-88005号公報、同59-56403号公報、日本国特開平2-69号公報、日本国特開昭57-168088号公報、日本国特開平5-107761号公報、日本国特開平5-210240号公報、日本国特開平4-288818号公報に記載のジアルキルアミノベンゼン骨格を有する色素等を挙げることができる。
本発明の感光性樹脂組成物は、感度等の点から光重合性モノマー(c)を含有することが好ましい。本発明に用いられる光重合性モノマーとしては、分子内にエチレン性不飽和基を少なくとも1個有する化合物(以下、「エチレン性単量体」と称することがある)を挙げることができる。具体的には、例えば(メタ)アクリル酸、(メタ)アクリル酸アルキルエステル、アクリロニトリル、スチレン、及びエチレン性不飽和結合を1個有するカルボン酸と、多価又は1価アルコールのモノエステル等が挙げられる。
本発明の感光性樹脂組成物は、カラーフィルタの画素またはブラックマトリックスの形成等に用いられる場合には、色材(d)を含有することが好ましい。色材(d)を含有することにより、カラーフィルタの遮光性または色特性を付与することができる。色材は、本発明の感光性樹脂組成物を着色するものをいう。色材としては、染顔料が使用できるが、耐熱性、耐光性等の点から、また、遮光性または色特性の観点から、顔料が好ましく、さらに顔料を良好に分散するために後述の分散剤を含有することが好ましい。
本発明の感光性樹脂組成物において、色材(d)として用いることができる顔料の平均1次粒径としては、カラーフィルタの着色層とした場合に、所望の発色が可能なものであればよく、特に限定されず、用いる顔料の種類によっても異なるが、10~100nmの範囲内であることが好ましく、10~70nmの範囲内であることがより好ましい。
本発明の感光性樹脂組成物においては、色材(d)を用いる場合には、該色材を微細に分散させ、且つその分散状態を安定化させることが品質の安定性確保には重要なため、分散剤を含むことが好ましい。
ウレタン系高分子分散剤として好ましい化学構造を具体的に例示するならば、例えば、ポリイソシアネート化合物と、分子内に水酸基を1個又は2個有する数平均分子量300~10,000の化合物と、同一分子内に活性水素と3級アミノ基を有する化合物とを反応させることによって得られる、重量平均分子量1,000~200,000の分散樹脂等が挙げられる。
ブロック共重合体等の分散剤の3級アミン価は、分散剤試料中の溶剤を除いた固形分1gあたりの塩基量と当量のKOHの質量で表し、次の方法により測定することができる。100mLのビーカーに分散剤試料の0.5~1.5gを精秤し、50mLの酢酸で溶解する。pH電極を備えた自動滴定装置を使って、この溶液を0.1mol/LのHClO4(過塩素酸)酢酸溶液にて中和滴定する。滴定pH曲線の変曲点を滴定終点とし次式によりアミン価を求める。
〔但し、W:分散剤試料秤取量[g]、V:滴定終点での滴定量[mL]、S:分散剤試料の固形分濃度[質量%]を表す。〕
アクリル系高分子分散剤としては、官能基(ここでいう官能基とは、高分子分散剤に含有される官能基として前述した官能基である。)を有する不飽和基含有単量体と、官能基を有さない不飽和基含有単量体とのランダム重合体、グラフト共重合体、ブロック共重合体を使用することが好ましい。これらの共重合体は公知の方法で製造することができる。
本発明の感光性樹脂組成物は、着色剤の分散性の向上、分散安定性の向上のために、分散剤として窒素原子を含有するアクリル系ブロック共重合体が用いられる。このような窒素原子を含有するアクリル系ブロック共重合体は、これに含まれる窒素原子が着色剤表面に対して親和性を持ち、窒素原子以外の部分が媒質に対する親和性を高めることにより、全体として分散安定性の向上に寄与するものと推定される。分散剤の性能は、その固体表面に対する吸着挙動である。ブロック共重合体が吸着挙動に優れている理由は、詳しいメカニズムは不明だが、以下のことが推察される。
尚、上述するアクリル系ブロック共重合体のAブロックは、4級化されていない未反応の3級アミノ基を有していてもよい。
窒素原子を含有するグラフト共重合体としては、主鎖に窒素原子を含有する繰り返し単位を有するものが好ましい。中でも、下記一般式(i)で表される繰り返し単位又は/及び下記一般式(ii)で表される繰り返し単位を有することが好ましい。
本発明の感光性樹脂組成物は、高感度化、基板への密着性の向上のため、チオール類を添加することが好ましい。チオール類の種類としては、例えば、ヘキサンジチオール、デカンジチオール、1,4-ジメチルメルカプトベンゼン、ブタンジオールビスチオプロピオネート、ブタンジオールビスチオグリコレート、エチレングリコールビスチオグリコレート、トリメチロールプロパントリスチオグリコレート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、トリメチロールプロパントリスチオグリコレート、ペンタエリスリトールテトラキスチオプロピオネート、ペンタエリスリトールテトラキスチオグリコレート、トリスヒドロキシエチルトリスチオプロピオネート、エチレングリコールビス(3-メルカプトブチレート)、プロピレングリコールビス(3-メルカプトブチレート);(略してPGMB),ブタンジオールビス(3-メルカプトブチレート)、1,4-ビス(3-メルカプトブチリルオキシ)ブタン;[商品名;カレンズ(登録商標。以下同じ。)MT BD1、昭和電工(株)製]、ブタンジオールトリメチロールプロパントリス(3-メルカプトブチレート)、ペンタエリスリトールテトラキス(3-メルカプトブチレート);(商品名;カレンズMT PE1、昭和電工(株)製)、ペンタエリスリトールトリス(3-メルカプトブチレート)、エチレングリコールビス(3-メルカプトイソブチレート)、ブタンジオールビス(3-メルカプトイソブチレート)、トリメチロールプロパントリス(3-メルカプトイソブチレート)、トリメチロールプロパントリス(3-メルカプトブチレート);(略してTPMB)トリメチロールプロパントリス(2-メルカプトイソブチレート);(略してTPMIB)、1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン;(商品名;カレンズMT NR1、昭和電工(株)製)等が挙げられる。これらは種々のものが1種を単独で、或いは2種以上を混合して使用できる。好ましくは上記、PGMB、TPMB、TPMIB、カレンズMT BD1、カレンズMT PE1、カレンズMT NR1などの多官能チオールが好ましく、その中でもカレンズMT BD1、カレンズMT PE1、カレンズMT NR1がさらに好ましく、カレンズMT PE1が特に好ましい。
本発明の感光性樹脂組成物は、通常、樹脂(a)、光重合開始剤(b)、光重合性モノマー(c)、色材(d)、分散剤(e)、及び必要に応じて使用される各種材料等を、有機溶剤に溶解又は分散した状態で使用される。
本発明の感光性樹脂組成物には、上述の成分の他、密着向上剤、塗布性向上剤、現像改良剤、紫外線吸収剤、酸化防止剤、シランカップリング剤、界面活性剤、顔料誘導体等を適宜配合することができる。
基板との密着性を改善するため、密着向上剤を本発明の感光性樹脂組成物に含有させてもよく、例えば、シランカップリング剤、リン酸系密着向上剤、その他の密着向上剤等が挙げられる。
本発明の感光性樹脂組成物には、塗布性向上ため、界面活性剤を含有させてもよい。界面活性剤としては、例えば、アニオン系、カチオン系、非イオン系および両性界面活性剤等各種のものを用いることができる。中でも、諸特性に悪影響を及ぼす可能性が低い点で、非イオン系界面活性剤を用いるのが好ましく、中でもフッ素系またはシリコン系の界面活性剤が塗布性の面で効果的である。
本発明の感光性樹脂組成物には、上記の成分の他に、さらに重合加速剤、光酸発生剤、架橋剤、可塑剤、保存安定剤、表面保護剤、有機カルボン酸、有機カルボン酸無水物、現像改良剤、熱重合防止剤等を含んでいてもよい。
本発明の感光性着色組成物には、分散性、保存性向上のため、顔料誘導体を含有させてもよい。顔料誘導体としては、例えば、アゾ系、フタロシアニン系、キナクリドン系、ベンズイミダゾロン系、キノフタロン系、イソインドリノン系、ジオキサジン系、アントラキノン系、インダンスレン系、ペリレン系、ペリノン系、ジケトピロロピロール系およびジオキサジン系等の誘導体が挙げられる。中でもフタロシアニン系、キノフタロン系が好ましい。
樹脂(a)の含有割合は、本発明の感光性樹脂組成物の全固形分に対して、通常5質量%以上、好ましくは10質量%以上であり、より好ましくは15質量%以上であり、さらに好ましくは20質量%以上であり、特に好ましくは25質量%以上であり、また、通常90質量%以下であり、好ましくは70質量%以下であり、より好ましくは50質量%以下であり、さらに好ましくは40質量%以下であり、特に好ましくは30質量%以下である。
本発明の感光性樹脂組成物(以下、「レジスト」と称することがある。)は、常法に従って製造される。
本発明の感光性樹脂組成物を硬化させることで、硬化物を得ることができる。感光性樹脂組成物を硬化してなる硬化物は、ブラックマトリックスや着色スペーサーとして好ましく用いることができる。
次に、本発明の感光性樹脂組成物を用いたブラックマトリックスについて、その製造方法に従って説明する。
ブラックマトリックスを形成するための支持体としては、適度の強度があれば、その材質は特に限定されるものではない。おもに透明基板が使用されるが、材質としては、例えば、ポリエチレンテレフタレートなどのポリエステル系樹脂、ポリプロピレン、ポリエチレンなどのポリオレフィン系樹脂、ポリカーボネート、ポリメチルメタクリレート、ポリスルフォンなどの熱可塑性樹脂製シート、エポキシ樹脂、不飽和ポリエステル樹脂、ポリ(メタ)アクリル系樹脂などの熱硬化性樹脂シート、又は各種ガラスなどが挙げられる。この中でも、耐熱性の観点からガラス、耐熱性樹脂が好ましい。また、基板の表面にITO、IZO等の透明電極が成膜されている場合も有る。透明基板以外では、TFTアレイ上に形成することも可能である。
透明基板の厚さは、通常0.05~10mm、好ましくは0.1~7mmの範囲とされる。また各種樹脂の薄膜形成処理を行う場合、その膜厚は、通常0.01~10μm、好ましくは0.05~5μmの範囲である。
上述の本発明の感光性樹脂組成物により、本発明のブラックマトリックスを形成するには、透明基板上に本発明の感光性樹脂組成物を塗布して乾燥した後、該試料の上にフォトマスクを置き、該フォトマスクを介して画像露光、現像、必要に応じて熱硬化或いは光硬化することによりブラックマトリックスを形成させる。
(3-1)感光性樹脂組成物の塗布
ブラックマトリックス用の感光性樹脂組成物の透明基板上への塗布は、例えば、スピナー法、ワイヤーバー法、フローコート法、ダイコート法、ロールコート法、又はスプレーコート法などによって行うことができる。中でも、ダイコート法によれば、塗布液使用量が大幅に削減され、かつ、スピンコート法によった際に付着するミストなどの影響が全くなく、異物発生が抑制されるなど、総合的な観点から好ましい。
基板に感光性樹脂組成物を塗布した後の塗膜の乾燥は、ホットプレート、IRオーブン、又はコンベクションオーブンを使用した乾燥法によるのが好ましい。乾燥の条件は、前記溶剤成分の種類、使用する乾燥機の性能などに応じて適宜選択することができる。
(3-3)露光
画像露光は、感光性樹脂組成物の塗膜上に、ネガのマスクパターンを重ね、このマスクパターンを介し、紫外線又は可視光線の光源を照射して行う。この際、必要に応じ、酸素による光重合性層の感度の低下を防ぐため、光重合性の塗膜上にポリビニルアルコール層などの酸素遮断層を形成した後に露光を行ってもよい。
本発明に係るブラックマトリックスは、感光性樹脂組成物による塗膜を、上記の光源によって画像露光を行った後、有機溶剤、又は、界面活性剤とアルカリ性化合物とを含む水溶液を用いる現像によって、基板上に画像を形成して作製することができる。この水溶液には、更に有機溶剤、緩衝剤、錯化剤、染料又は顔料を含ませることができる。
現像の後の基板には、熱硬化処理又は光硬化処理、好ましくは熱硬化処理を施す。この際の熱硬化処理条件は、温度は100~280℃の範囲、好ましくは150~250℃の範囲で選ばれ、時間は5~60分間の範囲で選ばれる。
ブラックマトリックスを設けた透明基板上に、上記(3-1)~(3-5)と同じプロセスで赤色、緑色、青色のうち一色の色材を含有する感光性着色樹脂組成物を塗布し、乾燥した後、塗膜の上にフォトマスクを重ね、このフォトマスクを介して画像露光、現像、必要に応じて熱硬化又は光硬化により画素画像を形成させ、着色層を作成する。この操作を、赤色、緑色、青色の三色の感光性着色樹脂組成物についてそれぞれ行うことによって、カラーフィルタの画素を形成することができる。これらの順番は上記に限定されるものではない。
本実施の形態の着色感光性組成物は、ブラックマトリックス以外に着色スペーサー用のレジストとして使用することも可能である。スペーサーをTFT型LCDに使用する場合、TFTに入射する光によりスイッチング素子としてTFTが誤作動を起こすことがあり、着色スペーサーはこれを防止するために用いられる。例えば、日本国特開平8-234212号公報にスペーサーを遮光性とすることが記載されている。着色スペーサーは着色スペーサー用のマスクを用いる以外は前述のブラックマトリックスと同様の方法で形成することができる。
カラーフィルタは、このままの状態で画像上にITOなどの透明電極を形成して、カラーディスプレー、液晶表示装置などの部品の一部として使用されるが、表面平滑性や耐久性を高めるため、必要に応じ、画像上にポリアミド、ポリイミドなどのトップコート層を設けることもできる。また一部、平面配向型駆動方式(IPSモード)などの用途においては、透明電極を形成しないこともある。
本発明の画像表示装置としては、画像や映像を表示する装置であれば特に限定は受けないが、後述する液晶表示装置または有機ELディスプレイ等が挙げられる。
本発明の液晶表示装置は、上述の本発明のブラックマトリックスを用いて作製されたものであり、カラー画素やブラックマトリックスの形成順序や形成位置等特に制限を受けるものではない。
本発明の有機ELディスプレイは、本発明のカラーフィルタを用いて作製されたものである。
以下の組成で顔料、分散剤、分散助剤、溶剤を調合し、以下の方法でカーボンブラック分散インクを調製した。
まず、顔料、分散剤、分散助剤の固形分と溶剤が以下となるように調合した。
・顔料:
R1060(コロンビア社製カーボンブラック);100質量部
・分散剤:
BYK167(ビックケミー社製塩基性ウレタン分散剤);20質量部(固形分換算)
・分散助剤(顔料誘導体):
S12000(ルーブリゾール社製、酸性基を有するフタロシアニン顔料誘導体);2質量部
・溶剤;プロピレングリコールメチルエーテルアセテート:226.6質量部
次に、ペイントシェーカーにより25~45℃の範囲で6時間分散処理を行い分散液を得た。ビーズとしては、直径0.5mmのジルコニアビーズを用い、分散液60質量部とビーズ180質量部を加えた。分散終了後、フィルターによりビーズを分離して、固形分35質量%のカーボンブラック分散インクを調製した。
(ジケトン体)
エチルカルバゾール(5g、25.61mmol)とo-ナフトイルクロリド(5.13g、26.89mmol)を30mlのジクロロメタンに溶解し、氷水バスにて2℃に冷却して攪拌し、AlCl3(3.41g、25.61mmol)を添加した。さらに室温にて3時間攪拌後、反応液にクロトノイルクロリド(2.81g、26.89mmol)の15mlジクロロメタン溶液を加え、AlCl3(4.1g、30.73mmol)を添加し、さらに1時間30分攪拌した。反応液を氷水200mlにあけ、ジクロロメタン200mlを添加し有機層を分液した。回収した有機層を無水硫酸マグネシウムで乾燥後、減圧下濃縮し、白色固体(10g)のジケトン体を得た。
ジケトン体(3.00g、7.19mmol)、NH2OH・HCl(1.09g、15.81mmol)、及び酢酸ナトリウム(1.23g、15.08mmol)をイソプロパノール30mlに混合し、3時間還流した。
反応終了後、反応液を濃縮し、得られた残渣に酢酸エチル30mlを加え、飽和炭酸水素ナトリウム水溶液30ml、飽和食塩水30mlで洗浄、無水硫酸マグネシウムで乾燥した。ろ過後、有機層を減圧下濃縮し、固体1.82gを得た。これをカラムクロマトグラフィーで精製し、淡黄色固体2.22gのオキシム体を得た。
オキシム体(2.22g、4.77mmol)とアセチルクロリド(1.34g、17.0mmol)をジクロロメタン20mlに加えて氷冷し、トリエチルアミン(1.77g、17.5mmol)を滴下して、そのまま1時間反応した。薄層クロマトグラフィーにより原料の消失を確認した後、水を加えて反応を停止した。反応液を飽和炭酸水素ナトリウム水溶液5mlで2回、飽和食塩水5mlで2回洗浄し、無水硫酸ナトリウムで乾燥した。濾過後、有機層を減圧下濃縮し、得られた残渣をカラムクロマトグラフィー(酢酸エチル/ヘキサン=2/1)で精製して、0.79gの淡黄色固体の光重合開始剤(1)を得た。光重合開始剤(1)の1H-NMRの化学シフトを以下に示す。
(ブラックレジスト1の調製)
<カーボンブラック分散インクの調製>で調製したカーボンブラック分散インクを用いて、表3に記載の各成分を表3に示す割合で混合し、スターラーにより攪拌、溶解させて、ブラックレジスト1を調製した。
・アルカリ可溶性樹脂(1):実施例1で合成した樹脂。
・光重合開始剤(1):合成例1で合成した光重合開始剤。
・光重合性モノマー(1):ジペンタエリスリトールヘキサアクリレート(日本化薬社製)
・界面活性剤:F559(DIC社製)
(ブラックレジスト2の調製)
アルカリ可溶性樹脂(1)を、実施例2で合成したアルカリ可溶性樹脂(2)に変更した以外は実施例5と同様にブラックレジスト2を調製した。
(ブラックレジスト3の調製)
アルカリ可溶性樹脂(1)を、実施例3で合成したアルカリ可溶性樹脂(3)に変更した以外は実施例5と同様にブラックレジスト3を調製した。
(ブラックレジスト4の調製)
アルカリ可溶性樹脂(1)を、実施例4で合成したアルカリ可溶性樹脂(4)に変更した以外は実施例5と同様にブラックレジスト4を調製した。
(ブラックレジスト5の調製)
光重合開始剤を、光重合開始剤(2)(TR-PBG-304、常州強力電子社製)に変更した以外は実施例5と同様にブラックレジスト5を調製した。
(ブラックレジスト6の調製)
光重合開始剤を、光重合開始剤(3)(NCI-831、ADEKA社製)に変更した以外は実施例5と同様にブラックレジスト6を調製した。
(ブラックレジスト7の調製)
光重合開始剤を、光重合開始剤(4)(OXE02、BASF社製)に変更した以外は実施例5と同様にブラックレジスト7を調製した。
(ブラックレジスト8の調製)
全固形分に対するカーボンブラックの含有割合が45質量%となるように、各成分の含有割合を表4に示すものに変更した以外は実施例5と同様にブラックレジスト8を調製した。
(ブラックレジスト9の調製)
全固形分中に対するカーボンブラックの含有割合が40質量%となるように、各成分の含有割合を表4に示すものに変更した以外は実施例5と同様にブラックレジスト9を調製した。
(比較ブラックレジスト10の調製)
アルカリ可溶性樹脂(1)を、比較例1で合成したアルカリ可溶性樹脂(5)に変更した以外は実施例5と同様に比較ブラックレジスト10を調製した。
(比較ブラックレジスト11の調製)
アルカリ可溶性樹脂(1)を、比較例2で合成したアルカリ可溶性樹脂(6)に変更した以外は実施例5と同様に比較ブラックレジスト11を調製した。
(I)形成線幅評価・現像密着評価
(1)ブラックマトリックス(BM)レジストパターンの作製方法
調製したブラックレジスト1~9、比較ブラックレジスト10、11をスピンコーターにてガラス基板に塗布し、減圧乾燥後、ホットプレートで100℃にて120秒間乾燥して乾燥塗布膜を得た。続いて、得られた乾燥塗布膜に対し、高圧水銀灯により40mJで、後述の露光マスクを通してパターン露光を行った後、室温(23℃)下、超純水で0.04質量%に調整したKOH水溶液をアルカリ現像液として用いて、80秒、100秒、又は120秒間スプレー現像することにより各種BMレジストパターンを得た。形成されたBMレジストパターンについて、形成線幅(感度)、解像力(現像密着)、を後述の(2)及び(3)に記載の基準で評価し、結果を表5に示す。
10μm開口(幅が10μmのストライプ状の開口)の露光マスクを用いて、前記(1)の方法により得られるBMレジストパターンの形成線幅を200倍の倍率で顕微鏡観察し、形成線幅を測定した。同じ露光量、同じ現像時間で評価した場合に、形成線幅が大きいほど感度が高いことを意味する。
1μm~10μm開口(幅が1~10μmの範囲で1μm刻みの、ストライプ状の開口)の露光マスクを用いて、前記(1)の方法によりBMレジストパターンを作成した。BMレジストパターンを目視、または光学顕微鏡を用いて観察した。欠け、表面荒れがなく、ガラス基板上に残ったBMレジストパターンの内、最も線幅の細いパターンについて、そのパターンに対応する露光マスクの開口幅の値を現像密着の値とした。現像密着の値が小さいほど、基板との密着性がよく、解像力が高いことを意味する。
調製したブラックレジスト1~9(実施例5~13)、比較ブラックレジスト10(比較例3)、11(比較例4)を用いて、前記(I)の(1)で作製した各種BMレジストパターンを230度のオーブンで30分間ポストベークを行い、BMを作製した。その膜厚を段差測定装置Alpha-Step-500(KLA-Tencor社)で測定し、OD値を透過濃度測定装置GretagMacbeth D200-II(GretagMacbeth社)で測定した。これより1μmあたりのOD値(単位OD値)を求めた。その結果、いずれのBMもOD値が4.0/μmであった。
調製したブラックレジスト1(実施例5)、比較ブラックレジスト10(比較例3)、11(比較例4)を用いて以下のようにして作製したBMの基板密着力を評価した。基板密着力は以下のように求めた。
Claims (22)
- 請求項8又は9に記載の樹脂を、(A-3)多塩基酸無水物と反応させることにより得られる樹脂。
- (A-3)多塩基酸無水物と共に、さらに(A-4)多価アルコールと反応させることにより得られる請求項10に記載の樹脂。
- (A-4)多価アルコールが、トリメチロールプロパン、ジトリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリメチロールエタン、及び1,2,3-プロパントリオールからなる群から選ばれる少なくとも1種の多価アルコールである請求項11に記載の樹脂。
- カラーフィルタ用樹脂である請求項1乃至12のいずれか1項に記載の樹脂。
- 少なくとも請求項1乃至13のいずれか1項に記載の樹脂、及び光重合開始剤(b)を含む感光性樹脂組成物。
- さらに色材(d)を含有する請求項14に記載の感光性樹脂組成物。
- 色材(d)が顔料であり、さらに分散剤(e)を含有する請求項15に記載の感光性樹脂組成物。
- 色材(d)が黒色顔料であり、かつ、分散剤(e)が塩基性官能基を有する高分子化合物である請求項16に記載の感光性樹脂組成物。
- 前記黒色顔料の含有割合が全固形分中45質量%以上である請求項17に記載の感光性樹脂組成物。
- 光重合開始剤(b)として、少なくともオキシムエステル化合物を含有する請求項14乃至18のいずれか1項に記載の感光性樹脂組成物。
- 請求項14乃至19のいずれか1項に記載の感光性樹脂組成物を硬化して得られる硬化物。
- 請求項20に記載の硬化物からなる画素及びブラックマトリックスの少なくとも一方を含むカラーフィルタ。
- 請求項21に記載のカラーフィルタを備える画像表示装置。
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2018095608A (ja) * | 2016-12-15 | 2018-06-21 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品 |
| JP2018156093A (ja) * | 2016-09-16 | 2018-10-04 | 三菱ケミカル株式会社 | 感光性樹脂組成物、硬化物及び画像表示装置 |
| JPWO2017138605A1 (ja) * | 2016-02-12 | 2018-12-06 | 三菱ケミカル株式会社 | 着色スペーサー形成用感光性着色組成物、硬化物、着色スペーサー、画像表示装置 |
| WO2021024616A1 (ja) * | 2019-08-08 | 2021-02-11 | 三井化学株式会社 | 画像表示装置封止材 |
| WO2023068201A1 (ja) * | 2021-10-20 | 2023-04-27 | 三菱ケミカル株式会社 | 顔料分散液、感光性樹脂組成物、硬化物、ブラックマトリックス及び画像表示装置 |
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| KR102361604B1 (ko) * | 2017-08-07 | 2022-02-10 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물, 이를 포함하는 컬러필터 및 이를 포함하는 표시장치 |
| JP7568413B2 (ja) * | 2019-04-12 | 2024-10-16 | 日鉄ケミカル&マテリアル株式会社 | 感光性樹脂組成物、それを硬化してなる硬化膜、およびその硬化膜を有する表示装置 |
| CN115516039B (zh) * | 2020-05-22 | 2023-09-15 | 富士胶片株式会社 | 树脂组合物、膜、滤光器、固体摄像元件及图像显示装置 |
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| JP2018156093A (ja) * | 2016-09-16 | 2018-10-04 | 三菱ケミカル株式会社 | 感光性樹脂組成物、硬化物及び画像表示装置 |
| JP2018095608A (ja) * | 2016-12-15 | 2018-06-21 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品 |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20170026449A (ko) | 2017-03-08 |
| JPWO2016002911A1 (ja) | 2017-04-27 |
| JP6620743B2 (ja) | 2019-12-18 |
| CN106488941A (zh) | 2017-03-08 |
| TWI647270B (zh) | 2019-01-11 |
| TW201602210A (zh) | 2016-01-16 |
| KR102305058B1 (ko) | 2021-09-24 |
| CN106488941B (zh) | 2019-12-10 |
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