WO2016088528A1 - エポキシ樹脂用硬化剤、及びこれを用いてなるエポキシ樹脂組成物 - Google Patents
エポキシ樹脂用硬化剤、及びこれを用いてなるエポキシ樹脂組成物 Download PDFInfo
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- WO2016088528A1 WO2016088528A1 PCT/JP2015/081841 JP2015081841W WO2016088528A1 WO 2016088528 A1 WO2016088528 A1 WO 2016088528A1 JP 2015081841 W JP2015081841 W JP 2015081841W WO 2016088528 A1 WO2016088528 A1 WO 2016088528A1
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- epoxy resin
- curing agent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/4853—Epoxides
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/60—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
- C04B41/61—Coating or impregnation
- C04B41/62—Coating or impregnation with organic materials
- C04B41/63—Macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
Definitions
- the present invention relates to an epoxy resin composition capable of forming a coating film having excellent adhesion even on a painted surface that is not completely dried. Specifically, the liquid epoxy resin can be cured at room temperature.
- the present invention also relates to an epoxy resin curing agent that can be applied to a wet surface and an epoxy resin composition using the same.
- the wet surface coating type paints based on the above-mentioned resins are disadvantageous in that the wettability of the concrete is insufficient in applicability or the adhesion of the formed film is insufficient even if it can be applied. was there.
- the problem to be solved by the present invention is a curing agent that can cure an epoxy resin at room temperature, and curing that has excellent adhesion even if it is not a completely dried substrate in an environment. It is providing the hardening
- the present invention provides an epoxy resin curing agent comprising an aromatic amine (a1), an aliphatic amine (a2) having an aromatic ring or a cycloalkane ring, and a curing accelerator (a3), and an epoxy resin
- an epoxy resin composition in combination with a resin is provided.
- an epoxy resin curing system that can be suitably used as a primer for concrete, a repair material for concrete, an injection material, and a joint material in a wet environment.
- the epoxy resin curing agent of the present invention is characterized in that an aromatic amine (a1) and an aliphatic amine (a2) having an aromatic ring or a cycloalkane ring are used in combination.
- the aromatic amine (a1) is known to have poor curability at room temperature even when used in combination with a liquid epoxy resin and a curing accelerator, and a coating film having a dry touch level can be obtained. Is known to be difficult.
- the resulting coating film since it is an aromatic compound, it is also known that the resulting coating film has excellent water resistance and is suitable for application to wet surfaces, but it cannot be heat-cured outdoors. As such, application to room temperature curing systems has been limited to use with very small additive levels.
- aliphatic amines are widely used as materials for general paints because they can react with epoxy resins at room temperature.
- short-chain aliphatic amines are water-soluble, and even for long-chain amines, the water resistance of the cured coating film is often insufficient, which causes whitening of the coating film in a wet environment. Often it became.
- the aromatic amine (a1) that can be used in the present invention is not particularly limited, and examples thereof include phenylenediamine, diaminodiphenylmethane, diaminodiphenyl ether, diaminodiphenylsulfone, 1,3-bis (3-aminophenoxy).
- Benzene, diethyltoluenediamine, orthotoluenediamine, meta-toluenediamine, methylene-bridged poly (phenylene) amine mixtures eg condensation products derived from aniline and formaldehyde
- 2, 2 '-/ 2, 4'- / 4, 4′diaminodiphenylmethane, and the like, or the like, or combinations thereof may be used alone or in combination of two or more.
- the aromatic amine (a1) is solid at room temperature (10 to 30 ° C.), or includes those that are strong in crystallinity and difficult to liquefy.
- the liquid is generally referred to as an epoxy adduct and will be described later. It is preferable to liquefy and use by partially modifying the epoxy resin (B).
- the epoxy adduct a hydroxyl group is generated by ring opening of the epoxy group, and this hydroxyl group has the effect of promoting the reaction between the glycidyl group and the amino group, and also contributes to the adhesion to the substrate. The curability and adhesion will be excellent.
- the epoxy adduct or diaminodiphenylmethane or diethyl of diaminodiphenylmethane is particularly preferred from the viewpoint of excellent adhesion between the obtained cured product and the concrete substrate, fluidity at room temperature, and easy provision of a liquid curing agent. It is preferable to use an epoxy adduct of toluenediamine.
- the aliphatic amine (a2) used in the present invention must have an aromatic ring or a cycloalkane ring in its structure. By having such a ring structure, the water resistance of the cured product is improved without causing whitening even in a wet environment.
- the aliphatic amine (a2) is not particularly limited.
- benzylethylenediamine, benzylamine, metaxylenediamine from the viewpoint of excellent curability when used in combination with an epoxy resin in a wet environment and good adhesion to the substrate of the resulting cured product. Is preferably used.
- the curing agent in the present invention contains a curing accelerator (a3) in addition to the aromatic amine (a1) and the specific aliphatic amine (a2).
- the curing accelerator (a3) promotes the reaction between the glycidyl group and the amino group in the epoxy resin, and various aromatic carboxylic acids and amines other than the above (a1) and (a2), Examples thereof include phenols and modified products thereof.
- aromatic carboxylic acids examples include benzoic acid, salicylic acid, trihydroxybenzoic acid, phthalic acid, cinnamic acid, and benzenehexacarboxylic acid.
- amines examples include bis (dimethylaminomethyl) phenol, benzyldimethylamine (BDMA), 2 (dimethylaminomethyl) phenol (DMP-10), 2,4,6- (trisdimethylaminomethyl) phenol (DMP- 30), tertiary amines such as 1,8-diazabiscyclo (5,4,0) undecene-1 (DBU), hydroxylamines such as hydroxylamine and phenoxyamine, imidazole, 1-methylimidazole, 2-methylimidazole And imidazoles such as 4 (5) -methylimidazole, 2-ethyl-4methylimidazole, 2-ethylimidazole and 2-phenylimidazole.
- BDMA benzyldimethylamine
- DMP-10 2,4,6- (trisdimethylaminomethyl) phenol
- DBU 1,8-diazabiscyclo (5,4,0) undecene-1
- hydroxylamines such as
- phenols examples include phenol, cresol, butylphenol, 4-tertiary butylphenol, 4-secondary butylphenol, 2-tertiary-butylphenol, 2-secondary butylphenol, 4-octylphenol, 4-tertiary butylcatechol, nonylphenol, Examples include dodecylphenol and cardanol.
- a modified product of the phenols a Mannich reaction product, a phenol resin, or the like may be used as the curing accelerator (a3).
- phenols or imidazoles are preferably used from the viewpoint of easy preparation of the room temperature curing rate when used in combination with an epoxy resin, and in particular, 4-tertiarybutylphenol and 2-methylimidazole are used. It is preferable. It is also a preferred method to use a mixture of both.
- the proportion of the aromatic amine (a1) and the specific aliphatic amine (a2) used is not particularly limited, but at room temperature when used in combination with an epoxy resin. From the viewpoint of the curability of the cured product and the water resistance and adhesion of the resulting cured product, the mass ratio (a1) / (a2) of the aromatic amine (a1) to the aliphatic amine (a2) is 10/90 to 90 / 10 is preferable, and 50/50 to 80/20 is particularly preferable.
- the proportion of the curing accelerator (a3) used in the curing agent of the present invention is preferably in the range of 10 to 40% by mass with respect to the total mass of the curing agent. It is preferable to use imidazoles. When these are combined, the use ratio is preferably in the range of 80/20 to 100/0 in terms of phenols / imidazoles (mass ratio).
- the uniformity thereof may be insufficient.
- the use ratio of the xylene resin is preferably in the range of 5 to 30% by mass with respect to the total amount of the curing agent, which is preferable from the viewpoint of the room temperature curability and the cured product adhesion and strength. Is.
- the preferred use ratio of the curing agent of the present invention is that the aromatic amine (a1) is 50 to 60 parts by mass and the specific aliphatic amine (a2) is 20 to 30 when the total amount of the curing agent is 100 parts by mass. Parts by mass, 5 to 15 parts by mass of a phenol-based curing accelerator, 0 to 5 parts by mass of an imidazole-based curing accelerator, and 5 to 15 parts by mass of a xylene resin.
- additives and fillers may be added to the curing agent of the present invention as long as the effects of the present invention are not impaired.
- the additive and filler include additives such as surfactants, chelating agents, polycarboxylic acid amine salts, various antifoaming agents, chromate-based, phosphate-based, molybdic acid-based, boric acid-based, lead Anti-corrosion pigments such as acid, ferrite and metal powders, flake pigments, reinforcing fibers, colored pigments usually used in paints, ultra fine silica, calcium carbonate, surface treated calcium carbonate, talc, mica, silicic acid Examples include extender pigments such as aluminum, cement, activated alumina, calcium carbonate, and titanium oxide.
- the curing agent of the present invention functions as a curing agent for various epoxy resins, and the epoxy resin can be appropriately selected depending on the application, physical properties of the cured product, etc., but the curing agent is excellent in a wet environment. In view of the curability, it is preferably combined with the liquid epoxy resin (B) and used as a two-component composition.
- liquid epoxy resin (B) if it reacts with the amino group in the said hardening
- a bisphenol type epoxy resin (b1) it is preferable to use a bisphenol type epoxy resin (b1), and in particular, a bisphenol A type epoxy resin or a bisphenol F type epoxy resin is used. Most preferred.
- liquid epoxy resin (B) in addition to the bisphenol type epoxy resin (b1), from the viewpoint of the fluidity of the composition and the mechanical properties of the cured product, a glycidyl ether of a polyhydric alcohol (b2), an aliphatic carboxylic acid It is preferable to use glycidyl ester (b3) together.
- glycidyl ethers of polyhydric alcohols include polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and ethylene propylene glycol diester.
- Examples include glycidyl ether, polypropylene glycol diglycidyl ether, diglycidyl aniline, resorcinol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, trimethylolpropane triglycidyl ether, and glycerin triglycidyl ether. May be used.
- Examples of the glycidyl ester (b3) of the aliphatic carboxylic acid include neodecanoic acid glycidyl ester.
- 1,6-hexanediol diglycidyl has good compatibility with the above-mentioned curing agent, and is from the viewpoint of fluidity, curing speed, mechanical strength of the resulting cured product, and the like when used as a composition.
- Ether and neodecanoic acid glycidyl ester are preferably used.
- the use ratio of the bisphenol type epoxy resin (b1) and the glycidyl ether (b2) of the polyhydric alcohol and / or the glycidyl ester (b3) of the polybasic acid is not particularly limited, but the (b1) And the mass ratio (b1) / [(b2) + (b3)] to [(b2) + (b3)], the reaction rate and the strength of the cured product should be in the range of 70/30 to 90/10 And from the viewpoint of excellent balance of adhesion with the substrate.
- the blending adjustment with the curing agent (A) of the present invention is simple, it is preferable to adjust the epoxy equivalent of the epoxy resin (B) in the range of 150 to 250, and in the curing agent (A)
- the ratio of the theoretically active hydrogen equivalent (calculated value) to the epoxy equivalent of the epoxy resin (B) is preferably in the range of 1.0 / 0.7 to 1.0 / 1.2.
- the adhesion with the base material is further improved and the construction in a wet environment becomes easy. More preferable from the viewpoint.
- the silane coupling agent (c) is not particularly limited, and examples thereof include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3 -Glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxy Propyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylme Rudimethoxysilane, N-2- (amino
- an amino group-containing silane coupling agent it is added in advance to the curing agent (A) of the present invention.
- a glycidyl group-containing silane coupling agent it is added to the liquid epoxy resin (B) in advance.
- a preferable blending amount when the silane coupling agent (c) is one component of the composition is, for example, in the range of 1 to 10% by mass, particularly in the range of 1 to 5% by mass. preferable.
- a glycidyl group-containing silane coupling agent is used, it is preferably used in the liquid epoxy resin (B) in the range of 1 to 10% by mass.
- the resin composition of the present invention further includes an ultraviolet absorber, an antioxidant, a silicon-based additive, organic beads, a fluorine-based additive, a rheology control agent, a defoaming agent, an antifogging agent, a colorant, an inorganic filler, and the like.
- An additive may be contained.
- Examples of the ultraviolet absorber include 2- [4- ⁇ (2-hydroxy-3-dodecyloxypropyl) oxy ⁇ -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1, 3,5-triazine, 2- [4- ⁇ (2-hydroxy-3-tridecyloxypropyl) oxy ⁇ -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1,3 Triazine derivatives such as 1,5-triazine, 2- (2'-xanthenecarboxy-5'-methylphenyl) benzotriazole, 2- (2'-o-nitrobenzyloxy-5'-methylphenyl) benzotriazole, 2- And xanthenecarboxy-4-dodecyloxybenzophenone, 2-o-nitrobenzyloxy-4-dodecyloxybenzophenone, and the like.
- antioxidants examples include hindered phenol-based antioxidants, hindered amine-based antioxidants, organic sulfur-based antioxidants, and phosphate ester-based antioxidants. These may be used alone or in combination of two or more.
- silicon-based additive examples include dimethylpolysiloxane, methylphenylpolysiloxane, cyclic dimethylpolysiloxane, methylhydrogenpolysiloxane, polyether-modified dimethylpolysiloxane copolymer, polyester-modified dimethylpolysiloxane copolymer, and fluorine-modified dimethyl.
- examples include polyorganosiloxanes having alkyl groups and phenyl groups, such as polysiloxane copolymers and amino-modified dimethylpolysiloxane copolymers, polydimethylsiloxanes having polyether-modified acrylic groups, and polydimethylsiloxanes having polyester-modified acrylic groups. It is done. These may be used alone or in combination of two or more.
- organic beads examples include polymethyl methacrylate beads, polycarbonate beads, polystyrene beads, polyacryl styrene beads, silicone beads, glass beads, acrylic beads, benzoguanamine resin beads, melamine resin beads, polyolefin resin beads, Examples thereof include polyester resin beads, polyamide resin beads, polyimide resin beads, polyfluorinated ethylene resin beads, and polyethylene resin beads. These may be used alone or in combination of two or more.
- fluorine-based additive examples include DIC Corporation “Mega Fuck” series. These may be used alone or in combination of two or more.
- the amount of the various additives used is preferably in a range where the effects are sufficiently exhibited and the effects of the present invention are not impaired. Specifically, each amount is 0.01 to 40 masses per 100 mass parts of the epoxy resin composition. It is preferable to use within the range of parts.
- the viscosity of each liquid is adjusted to a desired range and used.
- the polyhydric alcohol glycidyl ether (b2) and the aliphatic carboxylic acid glycidyl ester (b3) are preferably used in the range of 20 to 3000 mPa ⁇ s, more preferably 50 to 1500 mPa ⁇ s. Adjust to achieve viscosity.
- the viscosity is in the above range, the coating property and the penetrability to a dry and wet substrate are excellent, and the curability at low temperature is more excellent.
- the method for preparing the composition is not particularly limited, and both may be mixed and mixed so as to be uniform.
- the epoxy resin composition of the present invention when applied to a concrete surface, it penetrates into the fine pores present in the concrete surface, and also has an excellent effect of discharging moisture, It penetrates into the inside of the substrate and can be firmly bonded. Therefore, it is not necessary to remove rust, deposits and the like on the ground such as a concrete surface to which the epoxy resin composition of the present invention is applied, and it is not necessary to have a smooth surface.
- the epoxy resin composition of the present invention When the epoxy resin composition of the present invention is cured in an outdoor environment, it is not necessary to prepare moisture in the environment, and the temperature is preferably in the range of 10 to 30 ° C., and the time until the touch is generally dried. 16 to 40 hours.
- the curability of the epoxy resin composition of the present invention is not affected by water and is not hindered, it is possible to form a primer layer that is firmly bonded and cured with a wet substrate.
- the resin coating layer applied on the primer layer can be formed using various resins having a coating film forming ability.
- urethane resin acrylic rubber, chloroprene rubber, acrylic resin, acrylic resin, rubber asphalt, fiber reinforced resin, and other waterproof coating materials
- epoxy resin polyurethane resin, polyurea resin, polyester resin , Vinyl ester resins, acrylic resins, and the like, and resin (polymer) mortar, resin (polymer) concrete, and the like using these resins can also be used as coating material to be formed on the primer.
- the epoxy resin composition of the present invention can be suitably used as a repairing or injecting material for cracks on the concrete surface, and can also be used as a joining material.
- Synthesis example 2 In Synthesis Example 1, preparation was performed in the same manner as in Synthesis Example 1 except that bisphenol F-type epoxy resin (DIC Corporation, EPICLON 830, epoxy equivalent 172) was used instead of bisphenol A-type epoxy resin. The main ingredient containing the epoxy resin of this was obtained.
- bisphenol F-type epoxy resin DIC Corporation, EPICLON 830, epoxy equivalent 172
- Example 1 A glass four-necked flask equipped with a temperature controller, temperature sensor, stirrer, condenser, and nitrogen line was charged with 4,4′-diaminodiphenylmethane, 550 g (manufactured by SHUANG-BANG INDUSTRIAL CORP., ISOCLOSSSMDA, active hydrogen equivalent 49. 6, melting point 90 ° C.), and heated at 100 ° C. and sufficiently dissolved. After confirming dissolution of 4,4′-diaminodiphenylmethane, it was kept at the same temperature for 30 minutes.
- 4,4′-diaminodiphenylmethane 550 g (manufactured by SHUANG-BANG INDUSTRIAL CORP., ISOCLOSSSMDA, active hydrogen equivalent 49. 6, melting point 90 ° C.), and heated at 100 ° C. and sufficiently dissolved. After confirming dissolution of 4,4′-diaminodiphenylmethane, it was kept at the same temperature for 30
- Example 2 A glass four-necked flask equipped with a temperature controller, temperature sensor, stirrer, condenser, and nitrogen line was charged with 550 g of diethyltoluenediamine (Lonza Japan, DETDA-80, active hydrogen equivalent 58), 250 g of benzylethylenediamine ( PTI Japan KK, Hardener OH-802, active hydrogen equivalent 50) was added and stirred, heated to 80 ° C. and held for 30 minutes. After cooling to 80 ° C., 100 g of 4-tertiarybutylphenol (DIC Corporation, DIC-PTBP) was added and sufficiently dissolved at 80 ° C. After confirming dissolution of 4-tert-butylphenol, it was kept at the same temperature for 30 minutes.
- diethyltoluenediamine Lionza Japan, DETDA-80, active hydrogen equivalent 58
- benzylethylenediamine PTI Japan KK, Hardener OH-802, active hydrogen equivalent 50
- Example 3 In Example 1, preparation was carried out in the same manner as in Example 1 except that benzylamine (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53.5) was used instead of benzylethylenediamine. A curing agent was obtained.
- benzylamine Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53.5
- Example 4 preparation was carried out in the same manner as in Example 2 except that benzylamine (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53.5) was used instead of benzylethylenediamine. A curing agent was obtained.
- benzylamine Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53.5
- Example 5 4,4-diaminodiphenylmethane, 400 g (manufactured by SHUANG-BANG INDUSTRIAL CORP., ISOCLOSSMDA, active hydrogen equivalent 49.6), in a glass four-necked flask equipped with a temperature controller, temperature sensor, stirrer, condenser, and nitrogen line (Melting point 90 ° C.) was added, and the mixture was heated at 100 ° C. and sufficiently dissolved. After confirmation of dissolution of 4,4′-diaminodiphenylmethane, 150 g of bisphenol A type epoxy resin (DIC Corporation, EPICLON 850, epoxy equivalent 188) was gradually added and dissolved while paying attention to heat generation. The temperature was raised to 110 ° C.
- xylene resin Nikanol Y-50, manufactured by Fudou Co., Ltd.
- xylene resin Nakanol Y-50, manufactured by Fudou Co., Ltd.
- Example 6 To a glass four-necked flask equipped with a temperature controller, temperature sensor, stirrer, condenser, and nitrogen line was added 350 g of a phenolic Mannich reaction product (manufactured by DIC Corporation, racamide F4, active hydrogen equivalent 80), and the temperature reached 80 ° C. Warming and fully dissolved. Thereafter, 125 g of xylene resin (manufactured by Fudou Co., Ltd., Nikanol LLL) was added and held at the same temperature for 30 minutes.
- a phenolic Mannich reaction product manufactured by DIC Corporation, racamide F4, active hydrogen equivalent 80
- meta-xylenediamine modified product 250 g (Mitsubishi Gas Chemical Co., Ltd., Gascamine 240, active hydrogen equivalent 103), benzylamine 125 g (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53.5), diethyltoluenediamine 150 g (Lonza Japan Co., Ltd., DETDA-80, active hydrogen equivalent 58) was added and held at the same temperature for 30 minutes. A curing agent having an active hydrogen equivalent of 80 was obtained.
- Example 7 To a glass four-necked flask equipped with a temperature control device, a temperature sensor, a stirrer, a condenser, and a nitrogen line, add 300 g of a phenolic Mannich reactant (DIC Corporation, racamide F4, active hydrogen equivalent 80) to 80 ° C. Warming and fully dissolved. Thereafter, 50 g of xylene resin (manufactured by Fudou Co., Ltd., Nikanol LLL) was added and held at the same temperature for 30 minutes.
- a phenolic Mannich reactant DIDIC Corporation, racamide F4, active hydrogen equivalent 80
- Example 2 Production was carried out in the same manner as in Example 2 except that triethylenetetramine (Tosoh Corporation, TETA, active hydrogen equivalent 24.3) was used instead of diethyltoluenediamine, and curing of active hydrogen equivalent 36 was achieved. An agent was obtained.
- triethylenetetramine Tosoh Corporation, TETA, active hydrogen equivalent 24.3
- Example 2 In Example 1, production was carried out in the same manner as in Example 1 except that tetraethylenepentamine (Tosoh Corporation, TEPA, active hydrogen equivalent 27.1) was used instead of diethyltoluenediamine. A curing agent was obtained.
- tetraethylenepentamine Tosoh Corporation, TEPA, active hydrogen equivalent 27.1
- Example 2 triethylenetetramine (Tosoh Corporation, TETA, active hydrogen equivalent 24.3) instead of diethyltoluenediamine, and benzylamine (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53) instead of benzylethylenediamine .5) was used in the same manner as in Example 2 to obtain a curing agent having an active hydrogen equivalent of 37.
- TETA triethylenetetramine
- benzylamine Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent 53
- Example 2 tetraethylenepentamine (Tosoh Corporation, TEPA, active hydrogen equivalent 27,1) instead of diethyltoluenediamine, benzylamine (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent) instead of benzylethylenediamine 53.5) was used in the same manner as in Example 2 to obtain a curing agent having an active hydrogen equivalent of 40.
- tetraethylenepentamine Tosoh Corporation, TEPA, active hydrogen equivalent 27,1
- benzylamine (Guangei Chemical Industry Co., Ltd., benzylamine, active hydrogen equivalent) instead of benzylethylenediamine 53.5) was used in the same manner as in Example 2 to obtain a curing agent having an active hydrogen equivalent of 40.
- Example 1 production was carried out in the same manner as in Example 1 except that 4-tertiarybutylphenol was not added and 100 g of xylene resin was changed to 200 g, and a curing agent having an active hydrogen equivalent of 62 was obtained.
- Comparative Example 6 Production was carried out in the same manner as in Example 1 except that 4-tertiarybutylphenol was not added and 100 g of xylene resin was changed to 200 g, and a curing agent having an active hydrogen equivalent of 58 was obtained.
- Tables 1 and 2 show the composition of 100 g of the main agent and the composition of the corresponding curing agent.
- Dry to touch After curing for 24 hours at a temperature of 25 ° C. and a humidity of 50%, the surface was directly pressed lightly with a finger, and the situation at this time was evaluated according to the following criteria. ⁇ : The finger does not have a fingerprint and is dry. ⁇ : Drying is progressing but fingerprints are attached. ⁇ : not dry
- Peeling status The resin / mortar interface was peeled off with a gold spatula. The evaluation situation at this time was evaluated according to the following criteria. ⁇ : The material was completely destroyed and strong adhesion was confirmed. ⁇ : Partial material destruction was confirmed. X: Interfacial peeling or poor curability.
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Abstract
Description
合成例1
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコにビスフェノールA型エポキシ樹脂800g(DIC株式会社製、EPICLON 850、エポキシ当量188)、1,6-ヘキサンジオールジグリシジルエーテル170g(阪本薬品工業株式会社製、SR-16HS、エポキシ当量155)、3-グリシドキシプロピルトリメトキシシラン30g(信越化学工業株式会社製、KBM-403、エポキシ当量236)を加え、攪拌混合し、80℃で1時間保持した。均一溶解を確認し、エポキシ当量183のエポキシ樹脂を含有する主剤を得た。
合成例1において、ビスフェノールA型エポキシ樹脂の代わりにビスフェノールF型エポキシ樹脂(DIC株式会社製、EPICLON 830、エポキシ当量172)を用いた以外は合成例1と同様にして調製を行い、エポキシ当量170のエポキシ樹脂を含有する主剤を得た。
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコに、4,4’-ジアミノジフェニルメタン、550g(SHUANG-BANG INDUSTRIAL CORP.製、ISOCLOSSMDA、活性水素当量49.6、融点90℃)を加え、100℃にて加温、十分に溶解させた。4,4’-ジアミノジフェニルメタン溶解確認後、同温度で30分間保持した。その後、ベンジルエチレンジアミン250g(ピィ・ティ・アイジャパン株式会社製、ハードナーOH-802、活性水素当量50)、を加え30分間保持した。80℃に冷却し、4-ターシャリブチルフェノール100g(DIC株式会社製、DIC-PTBP)を加え、80℃にて十分溶解させた。4-ターシャリブチルフェノール溶解確認後、同温度で30分間保持した。60℃に冷却し、キシレン樹脂100gg(フドー株式会社製、ニカノールY-50)を加え60℃にて溶解させた。キシレン樹脂溶解確認後、同温度で30分間保持し、活性水素当量62の硬化剤を得た。
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコに、ジエチルトルエンジアミン550g(ロンザジャパン株式会社製、DETDA-80、活性水素当量58)、ベンジルエチレンジアミン250g(ピィ・ティ・アイジャパン株式会社製、ハードナーOH-802、活性水素当量50)を加え攪拌し80℃に昇温、30分間保持した。80℃に冷却し、4-ターシャリブチルフェノール100g(DIC株式会社製、DIC-PTBP)を加え、80℃にて十分溶解させた。4-ターシャリブチルフェノール溶解確認後、同温度で30分間保持した。60℃に冷却し、キシレン樹脂100g(フドー株式会社製、ニカノールY-50)を加え60℃にて溶解させた。キシレン樹脂溶解確認後、同温度で30分間保持した。活性水素当量58の硬化剤を得た。
実施例1において、ベンジルエチレンジアミンの代わりにベンジルアミン(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)を用いた以外は実施例1と同様にして調製を行い、活性水素当量63の硬化剤を得た。
実施例2おいて、ベンジルエチレンジアミンの代わりにベンジルアミン(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)を用いた以外は実施例2と同様にして調製を行い、活性水素当量59の硬化剤を得た。
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコに4,4-ジアミノジフェニルメタン、400g(SHUANG-BANG INDUSTRIAL CORP.製、ISOCLOSSMDA、活性水素当量49.6、融点90℃)を加え、100℃にて加温、十分に溶解させた。4,4’-ジアミノジフェニルメタンの溶解確認後、ビスフェノールA型エポキシ樹脂150g(DIC株式会社製、EPICLON 850、エポキシ当量188)を発熱に注意しながら徐々に投入し溶解させた。110℃に昇温し、同温度で1時間保持した。その後1時間かけて180℃迄昇温させた。同温度にて2時間保持し反応させた。温度を120℃迄冷却し、ベンジルエチレンジアミン250g(ピィ・ティ・アイジャパン株式会社製、ハードナーOH-802、活性水素当量50)を加え30分間保持した。80℃に冷却し、4-ターシャリブチルフェノール100g(DIC株式会社製、DIC-PTBP)を加え、80℃にて十分溶解させた。4-ターシャリブチルフェノール溶解確認後、同温度で30分間保持した。その後、キシレン樹脂100g(フドー株式会社製、ニカノールY-50)を加え80℃にて溶解させた。キシレン樹脂溶解確認後、同温度で30分間保持し、活性水素当量82の硬化剤を得た。
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコにフェノール系マンニッヒ反応物350g(DIC株式会社製、ラッカマイド F4、活性水素当量80)を加え、80℃に加温、十分に溶解させた。その後、キシレン樹脂125g(フドー株式会社製、ニカノールLLL)を加え同温度にて30分間保持した。その後、メタキシレンジアミン変性物250g(三菱ガス化学株式会社製、ガスカミン240、活性水素当量103)、ベンジルアミン125g(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)、ジエチルトルエンジアミン150g(ロンザジャパン株式会社製、DETDA-80、活性水素当量58)を加え同温度にて30分間保持した。活性水素当量80の硬化剤を得た。
温度制御装置、温度センサー、攪拌機、冷却管、窒素ラインを備えたガラス製4つ口フラスコにフェノール系マンニッヒ反応物300g(DIC株式会社製、ラッカマイド F4、活性水素当量80)を加え、80℃に加温、十分に溶解させた。その後、キシレン樹脂50g(フドー株式会社製、ニカノールLLL)を加え同温度にて30分間保持した。その後、メタキシレンジアミン変性物250g(三菱ガス化学株式会社製、ガスカミン240、活性水素当量103)、ベンジルアミン150g(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)、ジエチルトルエンジアミン150g(ロンザジャパン株式会社製、DETDA-80、活性水素当量58)を加え同温度にて30分間保持した。その後、サリチル酸100g(ローディアジャパン株式会社製)を加え同温度にて60分間保持した。活性水素当量80の硬化剤を得た。
実施例2において、ジエチルトルエンジアミンの代わりにトリエチレンテトラミン(東ソー株式会社、TETA、活性水素当量24.3)を用いた以外は実施例2と同様にして製造を行い、活性水素当量36の硬化剤を得た。
実施例1において、ジエチルトルエンジアミンの代わりにテトラエチレンペンタミン(東ソー株式会社、TEPA、活性水素当量27.1)を用いた以外は実施例1と同様にして製造を行い、活性水素当量40の硬化剤を得た。
実施例2において、ジエチルトルエンジアミンの代わりにトリエチレンテトラミン(東ソー株式会社、TETA、活性水素当量24.3)、ベンジルエチレンジアミンの代わりにベンジルアミン(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)を用いた以外は実施例2と同様にして製造を行い、活性水素当量37の硬化剤を得た。
実施例2において、ジエチルトルエンジアミンの代わりにテトラエチレンペンタミン(東ソー株式会社、TEPA、活性水素当量27,1)、ベンジルエチレンジアミンの代わりにベンジルアミン(広栄化学工業株式会社、ベンジルアミン、活性水素当量53.5)を用いた以外は実施例2と同様にして製造を行い、活性水素当量40の硬化剤を得た。
実施例1において、4-ターシャリブチルフェノールを投入せず、キシレン樹脂100gを200gに変更した以外は実施例1と同様にして製造を行い、活性水素当量62の硬化剤を得た。
実施例1において4-ターシャリブチルフェノールを投入せず、キシレン樹脂100gを200gに変更した以外は実施例1と同様にして製造を行い、活性水素当量58の硬化剤を得た。
<簡易接着評価>
JISモルタル(70mm×70mm×20mm)を#240研磨紙にて養生層表面を平滑に研磨し、その後水道水中に1時間浸漬させた。JISモルタルを引き上げウエスで軽く拭いた。研磨面上に枠として幅8mm、高さ5mmの糊付きバッカーを接着した。枠内に水を2gスポットし、その上に樹脂組成物(主剤・硬化剤混合液)を3g塗布し温度25℃、湿度50%の条件で24時間養生した。指触乾燥性、剥離状況を下記の方法で評価した。
温度25℃、湿度50%、24時間養生後、指で直接塗膜上を軽く押し、このときの状況を下記の基準で評価した。
○:指に指紋が付かず乾燥している。
△:乾燥が進んでいるが指紋が付く。
×:乾燥していない
金ヘラ(皮すき)にて樹脂/モルタル界面を剥離した。このときの評価状況を下記の基準で評価した。
○: 完全に材料破壊し強固な接着が確認された。
△:一部材料破壊が確認された。
×:界面剥離または硬化性不良であった。
JIS A6024「建築補修用注入エポキシ樹脂」に記載のある環境条件(標準・湿潤時・乾湿繰り返し時)にて養生した。各養生後、標準状態で接着強さの試験を行った。
Claims (13)
- 芳香族アミン(a1)、芳香環あるいはシクロアルカン環を有する脂肪族アミン(a2)及び硬化促進剤(a3)を含有することを特徴とするエポキシ樹脂用硬化剤。
- 前記芳香族アミン(a1)が、ジアミノジフェニルメタン、ジエチルトルエンジアミン又はこれらの変性物である請求項1記載のエポキシ樹脂用硬化剤。
- 前記硬化促進剤(a3)が、フェノール類及びその変性物、芳香族カルボン酸、又はイミダゾール類である請求項1又は2記載のエポキシ樹脂用硬化剤。
- 前記芳香環あるいはシクロアルカン環を有する脂肪族アミン(a2)がベンジルエチレンジアミン、ベンジルアミン又はメタキシレンジアミンである請求項1~3の何れか1項記載のエポキシ樹脂用硬化剤。
- 前記芳香族アミン(a1)と前記脂肪族アミン(a2)との使用割合が、(a1)/(a2)で表される質量比として、10/90~90/10の範囲である請求項1~4の何れか1項記載のエポキシ樹脂用硬化剤。
- 更にキシレン樹脂を含有する請求項1~5の何れか1項記載のエポキシ樹脂用硬化剤。
- 請求項1~6の何れか1項記載のエポキシ樹脂用硬化剤(A)と、液状エポキシ樹脂(B)とを含有することを特徴とするエポキシ樹脂組成物。
- 前記液状エポキシ樹脂(B)が、ビスフェノール型エポキシ樹脂(b1)と、多価アルコールのグリシジルエーテル(b2)及び/又は脂肪族カルボン酸のグリシジルエステル(b3)とを含有するものである請求項7記載のエポキシ樹脂組成物。
- 前記多価アルコールのグリシジルエーテル(b2)が、1,6-ヘキサンジオールジグリシジルエーテルである請求項8記載のエポキシ樹脂組成物。
- 更に反応性官能基含有シランカップリング剤(c)を含有する請求項7~9の何れか1項記載のエポキシ樹脂組成物。
- 前記反応性官能基含有シランカップリング剤(c)が、グリシジル基含有シランカップリング剤である請求項10記載のエポキシ樹脂組成物。
- コンクリート用プライマー、コンクリート用打継材又はコンクリート用補修材である請求項7~11の何れか1項記載のエポキシ樹脂組成物。
- 湿潤面へ適用するものである請求項7~12の何れか1項記載のエポキシ樹脂組成物。
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| US15/527,874 US10435583B2 (en) | 2014-12-03 | 2015-11-12 | Curing agent for epoxy resins, and epoxy resin composition obtained using same |
| CN201580065894.5A CN107001590B (zh) | 2014-12-03 | 2015-11-12 | 环氧树脂用固化剂和使用其的环氧树脂组合物 |
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| GB2561638A (en) * | 2017-11-10 | 2018-10-24 | Total E&P Danmark As | Environmentally friendly epoxy compositions |
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| JPWO2019225186A1 (ja) * | 2018-05-24 | 2021-07-01 | 三菱瓦斯化学株式会社 | 水系エポキシ樹脂用硬化剤、水系エポキシ樹脂組成物及びその硬化物 |
| JP7276331B2 (ja) | 2018-05-24 | 2023-05-18 | 三菱瓦斯化学株式会社 | 水系エポキシ樹脂用硬化剤、水系エポキシ樹脂組成物及びその硬化物 |
| JP2022501454A (ja) * | 2018-10-01 | 2022-01-06 | シーカ テクノロジー アクチェンゲゼルシャフト | エポキシ樹脂用硬化剤 |
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| JP7612220B2 (ja) | 2019-08-06 | 2025-01-14 | ファースト ポイント エー.エス. | 補強表面処理用コンパウンド |
| JP2022543087A (ja) * | 2019-08-06 | 2022-10-07 | ファースト ポイント エー.エス. | 補強表面処理用コンパウンド |
| JP2023515316A (ja) * | 2020-02-24 | 2023-04-13 | シーカ テクノロジー アクチェンゲゼルシャフト | エポキシ樹脂コーティング用の硬化剤 |
| JP7809061B2 (ja) | 2020-02-24 | 2026-01-30 | シーカ テクノロジー アクチェンゲゼルシャフト | エポキシ樹脂コーティング用の硬化剤 |
| KR20230038759A (ko) * | 2021-03-01 | 2023-03-21 | 세키스이 풀러 가부시키가이샤 | 에폭시계 조성물 |
| JP7270318B2 (ja) | 2021-03-01 | 2023-05-10 | 積水フーラー株式会社 | エポキシ系組成物 |
| WO2022186203A1 (ja) * | 2021-03-01 | 2022-09-09 | 積水フーラー株式会社 | エポキシ系組成物 |
| JPWO2022186203A1 (ja) * | 2021-03-01 | 2022-09-09 | ||
| KR102872552B1 (ko) | 2021-03-01 | 2025-10-17 | 세키스이 풀러 가부시키가이샤 | 에폭시계 조성물 |
| WO2023084904A1 (ja) * | 2021-11-10 | 2023-05-19 | 三菱瓦斯化学株式会社 | 水中硬化型エポキシ樹脂組成物、水中硬化型塗料、これらの硬化物、並びに水中硬化型エポキシ樹脂硬化剤混合物 |
| WO2023203891A1 (ja) * | 2022-04-20 | 2023-10-26 | 三菱瓦斯化学株式会社 | エポキシ樹脂硬化剤、エポキシ樹脂組成物及びその硬化物、繊維強化複合材、高圧ガス容器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6048619B2 (ja) | 2016-12-21 |
| CN107001590A (zh) | 2017-08-01 |
| US10435583B2 (en) | 2019-10-08 |
| JPWO2016088528A1 (ja) | 2017-04-27 |
| CN107001590B (zh) | 2019-12-06 |
| US20180327629A1 (en) | 2018-11-15 |
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