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WO2015093593A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2015093593A1
WO2015093593A1 PCT/JP2014/083696 JP2014083696W WO2015093593A1 WO 2015093593 A1 WO2015093593 A1 WO 2015093593A1 JP 2014083696 W JP2014083696 W JP 2014083696W WO 2015093593 A1 WO2015093593 A1 WO 2015093593A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
groove inner
groove
layer
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/083696
Other languages
English (en)
Japanese (ja)
Inventor
邦夫 岩城
聖一 金海
徳雄 吉澤
浩聡 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Sankyo Kasei Co Ltd
Original Assignee
Rohm Co Ltd
Sankyo Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013262508A external-priority patent/JP2017037864A/ja
Priority claimed from JP2013262507A external-priority patent/JP2017037863A/ja
Priority claimed from JP2013262506A external-priority patent/JP2017037862A/ja
Application filed by Rohm Co Ltd, Sankyo Kasei Co Ltd filed Critical Rohm Co Ltd
Publication of WO2015093593A1 publication Critical patent/WO2015093593A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H10W72/884—

Definitions

  • the present invention relates to an electronic device.
  • One electronic device is an optical device.
  • the optical device includes an insulating base, an LED chip, and a plating layer.
  • the LED chip is disposed on an insulating substrate.
  • the plating layer is formed on the insulating substrate.
  • Such an optical device is disclosed as an LED package in Patent Document 1, for example.
  • the LED chip is placed on the insulating substrate. Then, the insulating substrate and the plating layer are diced together for solidification. During this dicing, the plating layer is also cut, so that metal burrs are generated.
  • the occurrence of metal burrs may cause various problems. For example, when a metal burr falls on the circuit of the mounting substrate of the LED package, there is a possibility of causing a short circuit.
  • the present invention has been conceived under the above circumstances, and its main object is to provide an electronic device that can suppress the occurrence of metal burrs.
  • a base made of a resin and having a recess formed thereon; an electrode layer formed on the base; and an electronic element disposed in the recess.
  • a groove that is recessed from the outer surface is formed in the base, and the groove has a groove inner surface, and the groove inner surface is covered with the first groove inner surface exposed portion exposed from the electrode layer and the electrode layer.
  • an electronic device including a groove inner surface covering portion, wherein the first groove inner surface exposed portion is connected to the outer surface.
  • the first groove inner surface exposed portion is a band-shaped region extending along a boundary between the groove inner surface and the outer surface.
  • the width of the exposed portion of the first groove inner surface is 50 to 100 ⁇ m.
  • the inner surface of the groove is located at an end of the groove on a second direction side orthogonal to a first direction which is a direction in which the groove opens in a direction orthogonal to the thickness direction and the thickness direction.
  • a first inclined portion connected to the surface and the outer side surface, and the first inclined portion is away from the surface in the thickness direction, and is in a third direction opposite to the second direction.
  • the groove inner surface is located at an end on the second direction side in the groove and is connected to the back surface and the outer surface.
  • the first inclined portion is inclined with respect to the thickness direction so as to be in the third direction as the distance from the back surface increases in the thickness direction.
  • a part of the first inclined part and a part of the first inclined part constitute the first groove inner surface exposed part.
  • all the first inclined portions constitute the groove inner surface covering portion, and a part of the first inclined portion constitutes the first groove inner surface exposed portion.
  • the first inclined portion is connected to the first inclined portion.
  • the back surface has a first back surface exposed portion exposed from the electrode layer, and the first back surface exposed portion is connected to the outer surface and the first groove inner surface exposed portion.
  • the surface has a first surface exposed portion exposed from the electrode layer, and the first surface exposed portion is connected to the outer surface and the first groove inner surface exposed portion.
  • the groove inner surface has a second groove inner surface exposed portion exposed from the electrode layer, and the second groove inner surface exposed portion is connected to the outer surface.
  • the second groove inner surface exposed portion is a band-shaped region extending along a boundary between the groove inner surface and the outer surface.
  • the width of the exposed portion of the second groove inner surface is 50 to 100 ⁇ m.
  • the inner surface of the groove is opposite to a second direction orthogonal to a first direction which is a direction in which the groove opens in the thickness direction and a direction orthogonal to the thickness direction. It has the 2nd inclined part which is located in the 3 direction side, and is connected with the surface and the outside side, and the 2nd inclined part goes to the 2nd direction, so that it leaves the surface in the thickness direction.
  • the groove is inclined with respect to the thickness direction, and the groove inner surface has a second inclined portion located on the third direction side and connected to the back surface and the outer surface in the groove. The second inclined portion is inclined with respect to the thickness direction so as to be in the third direction as the distance from the back surface increases in the thickness direction.
  • a part of the second inclined part and a part of the second inclined part constitute the second groove inner surface exposed part.
  • all the second inclined portions constitute the groove inner surface covering portion, and a part of the second inclined portion constitutes the second groove inner surface exposed portion.
  • the second inclined portion is connected to the second inclined portion.
  • the groove has a constricted shape at a position near the center in the thickness direction in a side view.
  • the back surface has a second back surface exposed portion exposed from the electrode layer, and the second back surface exposed portion is connected to the outer surface and the second groove inner surface exposed portion.
  • the surface has a second surface exposed portion exposed from the electrode layer, and the second surface exposed portion is connected to the outer surface and the second groove inner surface exposed portion.
  • the groove is formed from the front surface to the back surface.
  • the groove inner surface is connected to the front surface and the back surface.
  • all of the regions facing the first direction which is the direction in which the groove is opened in the direction orthogonal to the thickness direction constitute the groove inner surface covering portion.
  • a part of the boundary between the groove inner surface and the front surface and a part of the boundary between the groove inner surface and the back surface are covered with the electrode layer.
  • the plurality of grooves are arranged on opposite sides of the recess when viewed in the thickness direction.
  • a plurality of the grooves are arranged along the second direction.
  • the electrode layer includes a front surface electrode formed on the front surface, a back surface electrode formed on the back surface, and a connection electrode for conducting the front surface electrode and the back surface electrode, It is formed on the inner surface of the groove.
  • a linear mark is formed on the outer surface.
  • the outer surface and the groove inner surface are all made of resin.
  • the substrate is made of a thermoplastic resin.
  • the concave portion has a concave side surface connected to the surface and surrounding the electronic element in the thickness direction, and the electrode layer is formed from the surface to the concave side surface.
  • the side surface of the recess has an inversely tapered shape.
  • the concave portion has a first concave bottom surface connected to the side surface of the concave portion, and the electrode layer is formed from the concave side surface to the first concave bottom surface.
  • the recess has a second recess bottom surface that is closer to the back surface in the thickness direction than the first recess bottom surface, and the electronic element is disposed on the second recess bottom surface.
  • the electrode layer includes an electroless plating layer and an electroplating layer laminated on the electroless plating layer, and the electroless plating layer is interposed between the electroplating layer and the substrate. is doing.
  • the electroless plating layer is made of Cu.
  • the electrolytic plating layer has a Cu layer and an Au layer, and the Cu layer is interposed between the Au layer and the electroless plating layer.
  • the electrolytic plating layer has a Ni layer interposed between the Cu layer and the Au layer.
  • any part of the electrode layer is separated from the boundary between the front surface and the outer surface and the boundary between the rear surface and the outer surface.
  • the electronic element is an optical element.
  • the optical element is a light emitting element or a light receiving element.
  • the optical element is an LED.
  • a wire bonded to both the electronic element and the electrode layer is further provided.
  • a sealing resin portion that covers the electronic element is further provided.
  • the sealing resin portion is made of a material that transmits light.
  • a base made of a resin and having a recess formed thereon; an electrode layer formed on the base; and an electronic element disposed in the recess.
  • a through hole penetrating the base body from the front surface to the back surface is formed in the base body, and the through hole is formed in the base body.
  • the hole has an inner peripheral surface, and the electronic device is provided in which the electrode layer is formed from the front surface to the rear surface through the inner peripheral surface.
  • the boundary between the inner peripheral surface and the surface is all covered with the electrode layer.
  • the entire inner peripheral surface is covered with the electrode layer.
  • a cross-sectional area by a plane orthogonal to a thickness direction that is a direction from the back surface to the front surface gradually decreases from the back surface to the front surface.
  • the inner peripheral surface has a first portion and a second portion facing each other, and both the first portion and the second portion are portions extending from the front surface to the back surface, and in the thickness direction.
  • the inclination angle of the second part with respect to is greater than the inclination angle of the first part with respect to the thickness direction.
  • the second portion has a portion overlapping the concave portion when viewed in the thickness direction.
  • the cross-section of the through hole by a plane orthogonal to the thickness direction, which is a direction from the back surface to the front surface, is rectangular.
  • the plurality of through holes are arranged on opposite sides of each other with the concave portion interposed therebetween.
  • the electrode layer includes a front surface electrode formed on the front surface, a back surface electrode formed on the back surface, and a connection electrode for conducting the front surface electrode and the back surface electrode, It is formed on the inner peripheral surface.
  • the base has an outer surface facing a direction orthogonal to a thickness direction that is a direction from the back surface to the front surface, and linear marks are formed on the outer surface.
  • all the inner peripheral surfaces are made of resin.
  • the substrate is made of a thermoplastic resin.
  • the concave portion has a concave side surface connected to the surface and surrounding the electronic element in the thickness direction, and the electrode layer is formed from the surface to the concave side surface.
  • the side surface of the recess has an inversely tapered shape.
  • the concave portion has a first concave bottom surface connected to the side surface of the concave portion, and the electrode layer is formed from the concave side surface to the first concave bottom surface.
  • the recess has a second recess bottom surface that is closer to the back surface in the thickness direction than the first recess bottom surface, and the electronic element is disposed on the second recess bottom surface.
  • the electrode layer includes an electroless plating layer and an electroplating layer laminated on the electroless plating layer, and the electroless plating layer is interposed between the electroplating layer and the substrate. is doing.
  • the electroless plating layer is made of Cu.
  • the electrolytic plating layer has a Cu layer and an Au layer, and the Cu layer is interposed between the Au layer and the electroless plating layer.
  • the electrolytic plating layer has a Ni layer interposed between the Cu layer and the Au layer.
  • any part of the electrode layer is separated from the boundary between the front surface and the outer surface and the boundary between the rear surface and the outer surface.
  • the electronic element is an optical element.
  • the optical element is a light emitting element or a light receiving element.
  • the optical element is an LED.
  • a wire bonded to both the electronic element and the electrode layer is further provided.
  • a sealing resin portion that covers the electronic element is further provided.
  • the sealing resin portion is made of a material that transmits light.
  • the apparatus includes: a base made of a resin and having a recess formed thereon; an electrode layer formed on the base; and an electronic element disposed in the recess.
  • the electrode layer includes a front surface electrode formed on the front surface and a back surface electrode formed on the back surface, and any part of the front surface electrode is separated from a boundary between the front surface and the outer surface.
  • an electronic device in which any part of the back surface electrode is separated from the boundary between the back surface and the outside surface.
  • the electrode layer is made only of a material derived from electroless plating.
  • the electrode layer includes a first electroless plating layer and a second electroless plating layer laminated on the first electroless plating layer, and the first electroless plating layer includes the second electroless plating layer. It is interposed between the electroless plating layer and the substrate.
  • the first electroless plating layer is made of Cu.
  • the second electroless plating layer has a Cu layer and an Au layer, and the Cu layer is interposed between the Au layer and the first electroless plating layer.
  • the second electroless plating layer has a Ni layer interposed between the Cu layer and the Au layer.
  • the electrode layer includes a connection electrode for conducting the front surface electrode and the back surface electrode.
  • a linear mark is formed on the outer surface.
  • all the outer surfaces are made of resin.
  • the substrate is made of a thermoplastic resin.
  • the concave portion has a concave side surface connected to the surface and surrounding the electronic element in the thickness direction, and the electrode layer is formed from the surface to the concave side surface.
  • the side surface of the recess has an inversely tapered shape.
  • the concave portion has a first concave bottom surface connected to the side surface of the concave portion, and the electrode layer is formed from the concave side surface to the first concave bottom surface.
  • the recess has a second recess bottom surface that is closer to the back surface in the thickness direction than the first recess bottom surface, and the electronic element is disposed on the second recess bottom surface.
  • the electronic element is an optical element.
  • the optical element is a light emitting element or a light receiving element.
  • the optical element is an LED.
  • a wire bonded to both the electronic element and the electrode layer is further provided.
  • a sealing resin portion that covers the electronic element is further provided.
  • the sealing resin portion is made of a material that transmits light.
  • a method of manufacturing an electronic device provided by the third aspect of the present invention, wherein a step of molding a substrate made of a resin and irradiating a laser beam to the substrate.
  • a step of selectively roughening and surface-modifying the surface of the substrate a step of bringing the substrate into contact with an ion catalyst comprising metal ions, a step of reducing the ion catalyst to a metal with a reducing agent, and Forming an electrode layer, wherein the step of forming the electrode layer includes a step of forming an electroless plating layer on a portion of the substrate that becomes a circuit.
  • FIG. 3 is a right side view of the electronic device shown in FIG. 2.
  • FIG. 3 is a perspective view showing a part of the electronic device shown in FIG. 2.
  • FIG. 5 is a partial enlarged cross-sectional view taken along line VI-VI in FIG. 4.
  • FIG. 5 is a partially enlarged sectional view taken along line VII-VII in FIG. 4. It is sectional drawing which expands and shows typically the laminated structure of the electrode layer concerning 1st Embodiment of this invention.
  • FIG. 1 It is a figure which shows the linear trace formed in the outer surface. It is a figure which shows 1 process of the manufacturing method of the electronic device of 1st Embodiment of this invention. It is a figure which shows one process following FIG. It is a perspective view which shows a part of electronic device of the 1st modification of 1st Embodiment of this invention. It is a right view which shows the electronic device of the 2nd modification of 1st Embodiment of this invention. It is sectional drawing of the electronic device of 2nd Embodiment of this invention. It is a top view of the electronic device of 2nd Embodiment of this invention. It is a bottom view of the electronic device of 2nd Embodiment of this invention.
  • FIG. 1 is a cross-sectional view of the mounting structure of the first embodiment of the present invention.
  • the electronic device mounting structure 800 shown in FIG. 1 includes an electronic device 101, a mounting substrate 891, and a conductive joint 895.
  • the mounting board 891 is, for example, a printed wiring board.
  • the mounting substrate 891 includes, for example, an insulating substrate and a pattern electrode (not shown) formed on the insulating substrate.
  • the electronic device 101 is mounted on a mounting substrate 891.
  • a conductive joint 895 is interposed between the electronic device 101 and the mounting substrate 891.
  • the conductive joint portion 895 is made of, for example, solder, and joins the electronic device 101 and the mounting substrate 891.
  • FIG. 2 is a plan view of the electronic device according to the first embodiment of the present invention.
  • FIG. 3 is a bottom view of the electronic device according to the first embodiment of the present invention.
  • 4 is a right side view of the electronic device shown in FIG.
  • FIG. 5 is a perspective view showing a part of the electronic device shown in FIG.
  • the electronic device of FIG. 1 is a cross-sectional view taken along the line II of FIG.
  • the electronic device 101 is a MID (Molded Interconnect Device).
  • the MID is a circuit molded part in which an electric circuit, an electrode, and a pattern are formed on an injection molded product.
  • the substrate 1 is made of resin.
  • the substrate 1 is made of a thermoplastic resin, for example, aromatic polyamide or liquid crystalline polyester.
  • the base 1 has a front surface 11, a back surface 12, and an outer surface 13.
  • the surface 11 faces the thickness direction Z1.
  • the surface 11 is flat.
  • the back surface 12 faces the direction (direction Z2) opposite to the direction (thickness direction Z1) to which the front surface 11 faces.
  • the back surface 12 is flat.
  • the outer side surface 13 faces the direction orthogonal to the thickness direction Z1 which is the direction from the back surface 12 toward the front surface 11.
  • the outer side surface 13 is a surface that goes around the outer periphery of the base 1 as viewed in the thickness direction Z1.
  • the outer side surface 13 includes a first side surface 131, a second side surface 132, a third side surface 133, and a fourth side surface 134.
  • the first side surface 131 faces the first direction X1 and is flat.
  • the first side 131 is connected to the front surface 11 and the back surface 12.
  • the second side surface 132 faces the second direction X2 and is flat.
  • the second side surface 132 is connected to the front surface 11 and the back surface 12.
  • the third side surface 133 faces the third direction X3 and is flat.
  • the third side surface 133 is connected to the front surface 11 and the back surface 12.
  • the fourth side surface 134 faces the fourth direction X4 and is flat.
  • the fourth side surface 134 is connected to the front surface 11 and the back surface 12.
  • the first side surface 131 and the second side surface 132 are connected to each other, the second side surface 132 and the fourth side surface 134 are connected to each other, the first side surface 131 and the third side surface 133 are connected to each other, and the third side surface The side surface 133 and the fourth side surface 134 are connected to each other.
  • the base body 1 is made of resin
  • the first side surface 131, the second side surface 132, the third side surface 133, and the fourth side surface 134 are all made of resin alone.
  • the substrate 1 is formed by being diced after being injection-molded using a mold.
  • the first side surface 131 and the fourth side surface 134 are surfaces formed by dicing. Therefore, a linear mark 131A (see FIG. 9) formed by the dicing blade remains on the first side surface 131, and a linear mark 134A (see FIG. 9) formed by the dicing blade remains on the fourth side surface 134. ) Remains.
  • the second side surface 132 and the third side surface 133 are surfaces formed by a mold.
  • a recess 16 is formed in the base 1. Specifically, a recess 16 is formed in the surface 11 of the substrate 1.
  • the shape of the recess 16 is rectangular, but the shape of the recess 16 is not limited to this.
  • the recess 16 has a recess inner side surface 161, a first recess bottom surface 162, a second recess bottom surface 163, and an upright surface 164.
  • the inner surface 161 of the recess is connected to the surface 11 and surrounds the electronic element 61 as viewed in the thickness direction Z1.
  • the inner surface 161 of the recess is slightly reversely tapered. This is because the base body 1 is formed of a mold as described above, so that the mold can be easily removed from the recess 16.
  • the first concave bottom surface 162 faces the thickness direction Z1.
  • the first concave bottom surface 162 is connected to the concave inner side surface 161.
  • the second recess bottom surface 163 faces the thickness direction Z1.
  • the second recess bottom surface 163 is closer to the back surface 12 in the thickness direction Z1 than the first recess bottom surface 162.
  • the second recess bottom surface 163 is located closer to the direction Z2 than the first recess bottom surface 162.
  • the first recess bottom surface 162 is located between the second recess bottom surface 163 and the surface 11 in the thickness direction Z1.
  • the second recess bottom surface 163 is connected to the recess inner side surface 161.
  • the standing surface 164 rises from the second concave bottom surface 163 and is connected to the concave inner surface 161, the first concave bottom surface 162, and the second concave bottom surface 163.
  • a plurality of grooves 3 are formed in the base 1.
  • the groove 3 will be described after the electrode layer 4 is described.
  • the electrode layer 4 shown in FIGS. 1 to 5 and the like is formed on the substrate 1.
  • the electrode layer 4 is formed on the front surface 11, the back surface 12, the concave inner surface 161, and the first concave bottom surface 162.
  • the electrode layer 4 includes a front electrode 44, a back electrode 45, a connecting electrode 46, an inner side electrode 47, and a bottom electrode 48.
  • a front electrode 44 a back electrode 45
  • a connecting electrode 46 an inner side electrode 47
  • a bottom electrode 48 a bottom electrode 48.
  • four sets of the surface electrode 44 and the like are formed, with the front electrode 44, the back electrode 45, the connecting electrode 46, the inner surface electrode 47, and the bottom electrode 48 as one set.
  • the surface electrode 44 is formed on the surface 11.
  • the surface electrode 44 has a base portion 441 and a connection portion 442.
  • the base portion 441 is a portion interposed between the inner surface electrode 47 and the connection electrode 46.
  • the connection portion 442 is connected to the base portion 441 and reaches the edge of the surface 11 (the boundary between the surface 11 and the outer surface 13).
  • the connection portion 442 is a portion for conducting with the connection portion 442 in the surface electrode 44 of another electronic device 101 when electrolytic plating is performed when the electrode layer 4 is formed.
  • the back electrode 45 is formed on the back surface 12.
  • the back electrode 45 is connected to the connection electrode 46.
  • the back electrode 45 has a rectangular shape, but the back electrode 45 may have any shape.
  • the conductive bonding portion 895 is in contact with the back electrode 45 in the mounting structure 800.
  • the connecting electrode 46 is connected to the front electrode 44 and the back electrode 45, and makes the front electrode 44 and the back electrode 45 conductive.
  • the connection electrode 46 is formed on the groove inner surface 31 (described later) of the groove 3.
  • the inner surface electrode 47 is formed on the inner surface 161 of the recess and is connected to the surface electrode 44.
  • the electrode layer 4 is formed from the surface 11 to the inner surface 161 of the recess.
  • the inner surface electrode 47 has a shape extending from the surface electrode 44 along the direction Z2.
  • the bottom electrode 48 is formed on the first concave bottom surface 162.
  • the bottom electrode 48 is connected to the inner surface electrode 47.
  • the electrode layer 4 is formed from the concave inner surface 161 to the first concave bottom surface 162.
  • the bottom electrode 48 is rectangular, but the shape of the bottom electrode 48 may be any shape.
  • the laminated structure of the electrode layer 4 is as follows.
  • the electrode layer 4 includes a plating layer 41A (electroless plating layer) and a plating layer 42A (electrolytic plating layer).
  • the plating layer 41A is interposed between the plating layer 42A and the base 1.
  • the plating layer 41A is formed by electroless plating as will be described later.
  • the plating layer 41A is made of Cu, for example.
  • the thickness of the plating layer 41A is, for example, 0.3 to 0.8 ⁇ m.
  • the plating layer 42A is laminated on the plating layer 41A.
  • the plated layer 42A is formed by electrolytic plating as will be described later.
  • the plating layer 42A includes a Cu layer 421A and an Au layer 422A.
  • the Cu layer 421A is interposed between the Au layer 422A and the plating layer 41A.
  • the plating layer 42A includes a Ni layer 423A.
  • the Ni layer 423A is interposed between the Cu layer 421A and the Au layer 422A.
  • the plating layer 42A may not include the Ni layer 423A.
  • the thickness of the Cu layer 421A is, for example, 10 to 30 ⁇ m
  • the thickness of the Au layer 422A is, for example, 0.2 to 0.5 ⁇ m
  • the thickness of the Ni layer 423A is, for example, 2 to 8 ⁇ m.
  • the base 1 is formed with a groove 3 that is recessed from the outer surface 13.
  • the groove 3 is formed from the front surface 11 to the back surface 12.
  • a plurality of (four) grooves 3 are arranged on opposite sides of the recess 16 as viewed in the thickness direction Z1.
  • a plurality of grooves 3 are arranged along the second direction X2. Specifically, two grooves 3 recessed from the first side surface 131 are formed, and two grooves 3 recessed from the fourth side surface 134 are formed.
  • FIG. 6 is a partially enlarged sectional view taken along the line VI-VI in FIG.
  • FIG. 7 is a partially enlarged sectional view taken along line VII-VII in FIG.
  • the groove 3 shown in FIGS. 1 to 7 has a groove inner surface 31.
  • the groove inner surface 31 is connected to the front surface 11, the back surface 12, and the outer surface 13.
  • a part of the groove inner surface 31 is covered with the electrode layer 4 (specifically, the connecting electrode 46).
  • Part of the boundary between the groove inner surface 31 and the front surface 11 and part of the boundary between the groove inner surface 31 and the back surface 12 are covered with the electrode layer 4.
  • the groove inner surface 31 includes a groove inner surface covering portion 310, a first groove inner surface exposed portion 311 and a second groove inner surface exposed portion 312.
  • the groove inner surface covering portion 310 is a portion of the groove inner surface 31 covered with the electrode layer 4. Of the groove inner surface 31, the entire region facing the first direction X ⁇ b> 1, which is the direction in which the groove 3 is opened, in the direction orthogonal to the thickness direction Z ⁇ b> 1 constitutes the groove inner surface covering portion 310.
  • the first groove inner surface exposed portion 311 is a portion of the groove inner surface 31 exposed from the electrode layer 4.
  • the first groove inner surface exposed portion 311 is located on the second direction X2 side of the groove inner surface 31.
  • the first groove inner surface exposed portion 311 is connected to the outer surface 13.
  • the first groove inner surface exposed portion 311 is a band-shaped region extending along the boundary between the groove inner surface 31 and the outer surface 13.
  • the width L11 (see FIG. 6) of the first groove inner surface exposed portion 311 is, for example, 50 to 100 ⁇ m.
  • the second groove inner surface exposed portion 312 is a portion of the groove inner surface 31 exposed from the electrode layer 4.
  • the second groove inner surface exposed portion 312 is located on the third direction X3 side of the groove inner surface 31. That is, the second groove inner surface exposed portion 312 and the first groove inner surface exposed portion 311 are located on the opposite sides of the groove 3 in the X2-X3 direction.
  • the second groove inner surface exposed portion 312 is connected to the outer surface 13.
  • the second groove inner surface exposed portion 312 is a band-shaped region extending along the boundary between the groove inner surface 31 and the outer surface 13.
  • the width L12 (see FIG. 7) of the second groove inner surface exposed portion 312 is, for example, 50 to 100 ⁇ m.
  • the groove 3 has a constricted shape at a position near the center in the thickness direction Z1 in a side view.
  • the groove inner surface 31 has a first inclined portion 315A, a second inclined portion 315B, a first inclined portion 316A, and a second inclined portion 316B.
  • the first inclined portion 315A, the second inclined portion 315B, the first inclined portion 316A, and the second inclined portion 316B are all flat.
  • the first inclined portion 315A shown in FIGS. 5, 6, etc. is a direction in which the groove 3 opens in the groove 3 in the direction perpendicular to the thickness direction Z1 and the thickness direction Z1 (in this embodiment, the first direction X1). Is located at the end on the side (second direction X2 in the present embodiment) orthogonal to.
  • the first inclined portion 315 ⁇ / b> A is connected to the surface 11 and the outer surface 13.
  • the first inclined portion 315A is inclined with respect to the thickness direction Z1 so as to be in the third direction X3 opposite to the second direction X2 as the distance from the surface 11 in the thickness direction Z1 increases.
  • a portion of the first inclined portion 315A constitutes a first groove inner surface exposed portion 311.
  • the first inclined portion 316A shown in FIGS. 5 and 6 is a direction in which the groove 3 is opened in the groove 3 in the direction perpendicular to the thickness direction Z1 and the thickness direction Z1 (in the present embodiment, the first direction X1). (The second direction X2 in the present embodiment) that is orthogonal to the end.
  • the first inclined portion 316A is connected to the back surface 12 and the outer surface 13.
  • the first inclined portion 316A is inclined with respect to the thickness direction Z1 so as to be in the third direction X3 opposite to the second direction X2 as the distance from the back surface 12 increases in the thickness direction Z1.
  • a part of the first inclined portion 316A constitutes a first groove inner surface exposed portion 311.
  • a first inclined portion 315A is connected to the first inclined portion 316A.
  • the second inclined portion 315B shown in FIG. 5, FIG. 7, etc. is a direction in which the groove 3 is opened in the groove 3 in the direction perpendicular to the thickness direction Z1 and the thickness direction Z1 (in this embodiment, the first direction X1). Is located at the end on the side (in the present embodiment, the third direction X3) orthogonal to.
  • the second inclined portion 315 ⁇ / b> B is connected to the surface 11 and the outer surface 13.
  • the second inclined portion 315B is inclined with respect to the thickness direction Z1 so as to be in the second direction X2 as the distance from the surface 11 in the thickness direction Z1 increases.
  • a part of the second inclined portion 315B constitutes a second groove inner surface exposed portion 312.
  • the second inclined portion 316B shown in FIG. 5, FIG. 7 and the like is a direction in which the groove 3 is opened in the groove 3 in the direction perpendicular to the thickness direction Z1 and the thickness direction Z1 (in this embodiment, the first direction X1). (The third direction X3 in this embodiment) is located at the end orthogonal to the.
  • the second inclined portion 316B is connected to the back surface 12 and the outer surface 13.
  • the second inclined portion 316B is inclined with respect to the thickness direction Z1 so as to be in the second direction X2 as the distance from the back surface 12 increases in the thickness direction Z1.
  • a part of the second inclined portion 316B constitutes the second groove inner surface exposed portion 312.
  • a second inclined portion 315B is connected to the second inclined portion 316B.
  • the surface 11 has a first surface exposed portion 111 and a second surface exposed portion 112. Both the first surface exposed portion 111 and the second surface exposed portion 112 are exposed from the electrode layer 4.
  • the first surface exposed portion 111 is connected to the outer surface 13 and the first groove inner surface exposed portion 311, and the second surface exposed portion 112 is connected to the outer surface 13 and the second groove inner surface exposed portion 312.
  • the back surface 12 has a first back surface exposed portion 121 and a second back surface exposed portion 122. Both the first back surface exposed portion 121 and the second back surface exposed portion 122 are exposed from the electrode layer 4.
  • the first back surface exposed portion 121 is connected to the outer surface 13 and the first groove inner surface exposed portion 311, and the second back surface exposed portion 122 is connected to the outer surface 13 and the second groove inner surface exposed portion 312.
  • the electronic element 61 shown in FIGS. 1 and 2 is disposed in the recess 16. Specifically, the electronic element 61 is disposed on the second recess bottom surface 163.
  • the electronic element 61 is an optical element.
  • the optical element is a light emitting element or a light receiving element, and is an LED in this embodiment.
  • the electronic element 61 is not limited to an optical element, and may be an LSI or a diode that is not an optical element.
  • the electronic element 61 is not limited to what consists of semiconductors, For example, an inductor and resistance may be sufficient.
  • the electronic device 101 includes three electronic elements 61, but the number of electronic elements 61 is not limited to this, and may be 1, 2, or 4 or more.
  • Three of the plurality of wires 62 are bonded to both the electronic element 61 and the electrode layer 4 (bottom electrode 48 in the present embodiment). Thereby, the electronic element 61 and the electrode layer 4 are mutually connected.
  • One of the plurality of wires 62 is bonded to the wiring layer formed on the second recess bottom surface 163 and the electrode layer 4 (bottom electrode 48 in the present embodiment).
  • the sealing resin portion 7 covers the electronic element 61 and the wire 62.
  • the sealing resin portion 7 is made of a material that transmits light.
  • a substrate 1 'made of resin shown in FIG. 10 is formed by injection molding using a mold.
  • surface modification of the substrate 1 ' is performed.
  • the surface modification is performed, for example, by irradiating the surface of the substrate 1 'with ultraviolet rays.
  • the surface of the substrate 1 ' is selectively roughened and surface-modified.
  • the substrate 1 ' is brought into contact with an ion catalyst made of metal ions to adsorb the ion catalyst. Specifically, a palladium ion catalyst is adsorbed on the substrate 1 'and further reduced to a metal. Thereafter, a plated layer 41A 'made of Cu is formed on the entire surface of the substrate 1' by electroless plating.
  • the Cu layer 421A shown in FIG. 8 is formed by electrolytic plating.
  • the Ni layer 423A and the Au layer 422A shown in FIG. 8 are formed by electrolytic plating.
  • the electrode layer 4 ' is formed.
  • the electronic element 61 is disposed in the recess 16 and the wire 62 is bonded to the electronic element 61 or the like.
  • the recess 16 is filled with the sealing resin portion 7.
  • a plurality of electronic devices 101 can be obtained by cutting the substrate 1 'along the cutting line Ds1 using a dicing blade. Note that the first side surface 131 and the fourth side surface 134 are formed by this cutting.
  • the groove inner surface 31 includes a first groove inner surface exposed portion 311 exposed from the electrode layer 4 and a groove inner surface covering portion 310 covered with the electrode layer 4.
  • the first groove inner surface exposed portion 311 is connected to the outer surface 13.
  • the first inclined portion 315A is inclined with respect to the thickness direction Z1 so as to be in the third direction X3 opposite to the second direction X2 as the distance from the surface 11 in the thickness direction Z1 increases.
  • the laser beam is irradiated from the inner surface 31 (specifically, the first inclined portion) without tilting the base body 1 ′ from the state in which the surface 11 is irradiated with the laser beam. 315A). This saves the trouble of inclining the base body 1 ′ to irradiate the groove inner surface 31 with laser light, and thus contributes to the efficiency of manufacturing the electronic device 101.
  • the first inclined portion 316A moves toward the third direction X3 opposite to the second direction X2 with respect to the thickness direction Z1 as the distance from the back surface 12 increases in the thickness direction Z1. Inclined.
  • the laser beam is irradiated from the inner surface 31 (specifically, the first inclined portion) without tilting the base body 1 ′ from the state in which the surface 11 is irradiated with the laser beam. 316A). This saves the trouble of inclining the base body 1 ′ to irradiate the groove inner surface 31 with laser light, and thus contributes to the efficiency of manufacturing the electronic device 101.
  • the second inclined portion 315B is inclined with respect to the thickness direction Z1 so as to be away from the surface 11 in the thickness direction Z1 so as to be directed to the second direction X2.
  • the laser beam can be irradiated to the groove inner surface 31 (specifically, the second inclined portion 315B) without tilting the base body 1 ′ from the state in which the back surface 12 is irradiated with the laser beam. .
  • This saves the trouble of inclining the base body 1 ′ to irradiate the groove inner surface 31 with laser light, and thus contributes to the efficiency of manufacturing the electronic device 101.
  • the second inclined portion 316B is inclined with respect to the thickness direction Z1 so as to be in the second direction X2 as the distance from the back surface 12 increases in the thickness direction Z1.
  • the laser beam is irradiated from the inner surface 31 (specifically, the second inclined portion) without tilting the base body 1 ′ from the state where the back surface 12 is irradiated with the laser beam. 316B). This saves the trouble of inclining the base body 1 ′ to irradiate the groove inner surface 31 with laser light, and thus contributes to the efficiency of manufacturing the electronic device 101.
  • the conductive joint 895 When the conductive joint 895 is attached to the connection electrode 46, the conductive joint 895 may creep up toward the surface 11 side.
  • the groove 3 has a constricted shape at a position near the center in the thickness direction Z1 in a side view. According to such a configuration, the conductive joint 895 is formed in a region near the boundary between the first inclined portion 315A and the first inclined portion 316A and the boundary between the second inclined portion 315B and the second inclined portion 316B. Can stay.
  • the shape of the groove 3 in a side view is a wedge shape
  • the shape of the groove 3 is not limited to this.
  • the groove inner surface 31 may not have any inclined portion.
  • the groove inner surface 31 may have a shape that does not include the first inclined portion 315A and the first inclined portion 316A.
  • the groove inner surface 31 may have a shape that does not include the second inclined portion 315B and the second inclined portion 316B.
  • FIG. 12 is a perspective view showing a part of the electronic device of the first modification of the first embodiment of the present invention.
  • all of the first inclined portions 315A constitute the groove inner surface covering portion 310
  • all of the second inclined portions 315B constitute the groove inner surface covering portion 310. 101 and mainly different.
  • the first surface exposed portion 111 and the second surface exposed portion 112 of the electronic device 101 shown in FIG. 5 are not formed. Therefore, the entire boundary between the groove inner surface 31 and the surface 11 is covered with the electrode layer 4.
  • the resin material constituting the sealing resin portion 7 flows on the surface 11 when the sealing resin portion 7 is formed, the resin material is the groove inner surface 31 and the surface 11 in the electrode layer 4. It is dammed to the part along the boundary. Therefore, the inconvenience that the resin material reaches the back surface 12 side through the connection electrode 46 can be avoided. Moreover, the metal burr
  • FIG. 13 is a right side view showing an electronic device according to a second modification of the first embodiment of the present invention.
  • the groove 3 has a wedge shape in which the opening dimension becomes smaller from the front surface 11 toward the back surface 12 in the thickness direction Z1 in a side view.
  • the groove inner surface 31 has a first inclined portion 315A and a second inclined portion 315B.
  • the first inclined portion 315A and the second inclined portion 315B are both flat.
  • the first inclined portion 315A is orthogonal to the direction (the first direction X1 in the present embodiment) orthogonal to the thickness direction Z1 and the direction in which the groove 3 is opened among the directions orthogonal to the thickness direction Z1 (this embodiment). In the form, it is located at the end on the second direction X2) side.
  • the first inclined portion 315 ⁇ / b> A is connected to the front surface 11, the back surface 12, and the outer surface 13.
  • the first inclined portion 315A is inclined with respect to the thickness direction Z1 so as to go in the third direction X3 opposite to the second direction X2 as it goes from the front surface 11 to the back surface 12 in the thickness direction Z1.
  • a portion of the first inclined portion 315A constitutes a first groove inner surface exposed portion 311.
  • the second inclined portion 315B is perpendicular to the direction (the first direction X1 in the present embodiment) orthogonal to the direction in which the groove 3 is opened among the directions perpendicular to the thickness direction Z1 and the thickness direction Z1 (this embodiment). In the form, it is located at the end on the third direction X3) side.
  • the second inclined portion 315 ⁇ / b> B is connected to the front surface 11, the back surface 12, and the outer surface 13.
  • the second inclined portion 315B is inclined with respect to the thickness direction Z1 so as to go in the second direction X2 as it goes from the front surface 11 to the back surface 12 in the thickness direction Z1.
  • a part of the second inclined portion 315B constitutes a second groove inner surface exposed portion 312.
  • FIG. 14 is a cross-sectional view of an electronic device according to a second embodiment of the present invention.
  • FIG. 15 is a plan view of the electronic device according to the second embodiment of the present invention.
  • FIG. 16 is a bottom view of the electronic device according to the second embodiment of the present invention.
  • the electronic device 102 shown in these drawings includes a base 1, an electrode layer 4, an electronic element 61, a wire 62, and a sealing resin portion 7.
  • the substrate 1 shown in FIGS. 14 to 16 has a front surface 11, a back surface 12, and an outer surface 13.
  • a recess 16 is formed in the base 1.
  • the description described in the electronic device 101 can be applied, and thus the description thereof is omitted in this embodiment.
  • the groove 3 is not formed in the base 1.
  • a through hole 18 is formed in the base 1.
  • the through hole 18 penetrates the base body 1 from the front surface 11 to the back surface 12.
  • a plurality of (four) through holes 18 are arranged on opposite sides of the recess 16 as viewed in the thickness direction Z1.
  • a plurality of through holes 18 are arranged along the second direction X2. Specifically, two through holes 18 are formed on the first side surface 131 side, and two through holes 18 are formed on the fourth side surface 134 side.
  • the through hole 18 has an inner peripheral surface 181.
  • the inner peripheral surface 181 is connected to the front surface 11 and the back surface 12.
  • the inner peripheral surface 181 is covered with the electrode layer 4 (specifically, the connection electrode 46).
  • the entire inner peripheral surface 181 is covered with the electrode layer 4.
  • the boundary between the inner peripheral surface 181 and the front surface 11 and the boundary between the inner peripheral surface 181 and the back surface 12 are all covered with the electrode layer 4.
  • the electrode layer 4 is formed from the front surface 11 to the back surface 12 via the inner peripheral surface 181.
  • the through-hole 18 has a gradually decreasing cross-sectional area from the back surface 12 toward the front surface 11 by a plane orthogonal to the thickness direction Z1 that is a direction from the back surface 12 toward the front surface 11.
  • the cross section of the through-hole 18 by a plane orthogonal to the thickness direction Z1, which is the direction from the back surface 12 toward the front surface 11, is rectangular.
  • the cross-sectional shape of the through-hole 18 by a plane orthogonal to the thickness direction Z1, which is the direction from the back surface 12 to the front surface 11, is not limited to a rectangular shape, and may be, for example, a circular shape.
  • the inner peripheral surface 181 has a first portion 181A and a second portion 181B facing each other.
  • the first part 181A and the second part 181B are both parts from the front surface 11 to the back surface 12. That is, the first portion 181A and the second portion 181B are both connected to the front surface 11 and the back surface 12.
  • the second portion 181B is located closer to the recess 16 than the first portion 181A in the thickness direction Z1 view.
  • the second portion 181B has a portion that overlaps the concave portion 16 when viewed in the thickness direction Z1.
  • the inclination angle ⁇ 2 of the second portion 181B with respect to the thickness direction Z1 is larger than the inclination angle ⁇ 1 of the first portion 181A with respect to the thickness direction Z1.
  • the through hole 18 has a cross-sectional area by a plane orthogonal to the thickness direction Z1, which is a direction from the back surface 12 to the front surface 11, and is constant from the back surface 12 to the front surface 11. Good.
  • the front electrode 44 and the back electrode 45 are electrically connected by the connecting electrode 46. Therefore, the electrode layer 4 is not formed on the outer side surface 13, and all the outer side surfaces 13 are exposed from the electrode layer 4.
  • the plating layer 41A ′ and the plating layer 42A ′ (Cu layer 421A ′, Au layer 422A ′, and Ni are obtained through the same steps as those described with reference to FIGS. Layer 423A ′) is formed.
  • a plurality of electronic devices 102 can be obtained by cutting the substrate 1 'using a dicing blade. Note that the first side surface 131 and the fourth side surface 134 are formed by this cutting.
  • the base 1 is formed with a through-hole 18 extending through the base 1 from the front surface 11 to the back surface 12.
  • the through hole 18 has an inner peripheral surface 181.
  • the electrode layer 4 is formed from the front surface 11 to the back surface 12 via the inner peripheral surface 181. According to such a configuration, when the substrate 1 ′ is cut with the dicing blade, the number of locations where the electrode layer 4 ′ and the dicing blade are in contact with each other can be reduced. Thereby, when the base
  • the boundary between the inner peripheral surface 181 and the surface 11 is entirely covered with the electrode layer 4. According to such a configuration, even when the resin material constituting the sealing resin portion 7 flows on the surface 11 when the sealing resin portion 7 is formed, the resin material is the same as the inner peripheral surface 181 of the electrode layer 4. It is dammed to a portion along the boundary with the surface 11. Therefore, the inconvenience that the resin material passes through the through hole 18 and reaches the back surface 12 side can be avoided.
  • the cross-sectional area by a plane orthogonal to the thickness direction Z ⁇ b> 1 that is the direction from the back surface 12 toward the front surface 11 gradually decreases from the back surface 12 toward the front surface 11.
  • Such a configuration is suitable for reducing the opening area of the through hole 18 on the surface 11.
  • This is suitable for miniaturization of the electronic device 102 when viewed in the thickness direction Z1.
  • the surface modification of the inner peripheral surface 181 can be appropriately performed by irradiating ultraviolet rays for surface modification of the base body 1 ′ from the back surface 12 toward the inner peripheral surface 181.
  • FIG. 17 is a plan view of an electronic device according to a third embodiment of the present invention.
  • FIG. 18 is a bottom view of the electronic device according to the third embodiment of the present invention.
  • the electronic device 101A shown in these drawings includes a base 1, an electrode layer 4, an electronic element 61, a wire 62, and a sealing resin portion 7 (not shown in the present embodiment).
  • the manufacturing method of the electrode layer 4 is different from the manufacturing method of the electronic device 101.
  • the electrode layer 4 is made only of a material derived from electroless plating. This will be specifically described below.
  • the base 1, the electronic element 61, the wire 62, and the sealing resin portion 7 can be applied to the description described with respect to the electronic device 101, the description thereof is omitted in this embodiment.
  • the electrode layer 4 is formed on the substrate 1.
  • the electrode layer 4 is formed on the front surface 11, the back surface 12, the concave inner surface 161, and the first concave bottom surface 162.
  • the electrode layer 4 includes a front electrode 44, a back electrode 45, a connecting electrode 46, an inner side electrode 47, and a bottom electrode 48.
  • the electrode layer 4 consists only of the material derived from electroless plating. Therefore, the surface electrode 44 does not have the connection portion 442 (see FIGS. 2 and 5) in the electronic device 101. Any part of the surface electrode 44 is separated from the boundary between the front surface 11 and the outer surface 13, and any part of the back electrode 45 is separated from the boundary between the rear surface 12 and the outer surface 13.
  • the laminated structure of the electrode layer 4 is as follows.
  • the electrode layer 4 includes a plating layer 41B (first electroless plating layer) and a plating layer 42B (second electroless plating layer).
  • the plating layer 41B is interposed between the plating layer 42B and the base 1.
  • the plating layer 41B is formed by electroless plating.
  • the plating layer 41B is made of Cu, for example.
  • the thickness of the plating layer 41B is, for example, 0.3 to 0.8 ⁇ m.
  • the plating layer 42B is laminated on the plating layer 41B.
  • the plating layer 42B is formed by electroless plating.
  • the plating layer 42B includes a Cu layer 421B and an Au layer 422B.
  • the Cu layer 421B is interposed between the Au layer 422B and the plating layer 41B.
  • the plating layer 42B includes a Ni layer 423B.
  • the Ni layer 423B is interposed between the Cu layer 421B and the Au layer 422B.
  • the plated layer 42B may not include the Ni layer 423B.
  • the thickness of the Cu layer 421B is, for example, 10 to 30 ⁇ m
  • the thickness of the Au layer 422B is, for example, 0.2 to 0.5 ⁇ m
  • the thickness of the Ni layer 423B is, for example, 2 to 8 ⁇ m.
  • the plated layer 42B is formed by a method similar to the method for forming the plated layer 42A (plated layer 42A ') described in the electronic device 101.
  • the Cu layer 421B, the Ni layer 423B, and the Au layer 422B shown in FIG. 19 are sequentially formed by electroless plating.
  • the electronic device 101A is manufactured by arranging the electronic element 61 in the recess 16 or the like.
  • any part of the front electrode 44 is separated from the boundary between the front surface 11 and the outer surface 13, and any part of the rear electrode 45 is separated from the boundary between the rear surface 12 and the outer surface 13. is doing.
  • FIG. 20 is a plan view of an electronic device according to a fourth embodiment of the present invention.
  • FIG. 21 is a bottom view of the electronic device according to the fourth embodiment of the present invention.
  • the electronic device 102A shown in these drawings includes a base 1, an electrode layer 4, an electronic element 61, a wire 62, and a sealing resin portion 7 (not shown in the present embodiment).
  • the manufacturing method of the electrode layer 4 is different from the manufacturing method of the electronic device 102.
  • the electrode layer 4 is made only of a material derived from electroless plating. Since the description described regarding the electronic device 101A can be applied to the specific description, the description is omitted in the present embodiment.
  • any part of the front electrode 44 is separated from the boundary between the front surface 11 and the outer surface 13, and any part of the rear electrode 45 is separated from the boundary between the rear surface 12 and the outer surface 13. is doing.
  • the electronic device 102A having such a configuration it is not necessary to form the connection portion 442 in the electronic device 102 according to the second embodiment. Therefore, it is possible to prevent the occurrence of metal burrs that can be formed in the vicinity of the connection portion 442 when the base body 1 ′ is diced.
  • the present invention is not limited to the embodiment described above.
  • the specific configuration of each part of the present invention can be changed in various ways.

Landscapes

  • Led Device Packages (AREA)

Abstract

Le problème à résoudre dans le cadre de la présente invention consiste à fournir un dispositif électronique pour lequel la formation de bavures métalliques peut être empêchée. La solution proposée consiste en un dispositif électronique qui comprend : une base (1) qui est composée d'une résine et comprend un évidement (16) ; une couche d'électrode (4) qui est agencée sur la base (1) ; et un élément électronique (61) qui est agencé dans l'évidement (16). La base (1) comprend : une surface avant (11) qui comporte l'évidement (16) ; une surface arrière (12) qui est orientée dans une direction qui est opposée à la direction dans laquelle est orientée la surface avant (11) ; et une surface latérale externe (13) qui est orientée dans une direction perpendiculaire au sens de l'épaisseur (Z1) qui est la direction allant de la surface arrière (12) vers la surface avant (11). La base (1) comprend une rainure (3) qui est creusée depuis la surface latérale externe (13) et la rainure (3) comporte une surface de rainure interne (31). La surface de rainure interne (31) comporte une première partie exposée de surface de rainure interne (311) qui est exposée depuis la couche d'électrode (4) et une partie recouverte de surface de rainure interne (310) qui est recouverte par la couche d'électrode (4). La première partie exposée de surface de rainure interne (311) prolonge la surface latérale externe (13).
PCT/JP2014/083696 2013-12-19 2014-12-19 Dispositif électronique Ceased WO2015093593A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2013-262507 2013-12-19
JP2013262508A JP2017037864A (ja) 2013-12-19 2013-12-19 電子装置および電子装置の製造方法
JP2013-262506 2013-12-19
JP2013-262508 2013-12-19
JP2013262507A JP2017037863A (ja) 2013-12-19 2013-12-19 電子装置
JP2013262506A JP2017037862A (ja) 2013-12-19 2013-12-19 電子装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017033998A (ja) * 2015-07-29 2017-02-09 ローム株式会社 半導体装置およびその製造方法
CN111106220A (zh) * 2018-10-25 2020-05-05 一诠精密电子工业(中国)有限公司 光学模块承载座

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Publication number Priority date Publication date Assignee Title
JP2002270901A (ja) * 2001-03-12 2002-09-20 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
JP2006060058A (ja) * 2004-08-20 2006-03-02 Matsushita Electric Works Ltd 表面実装型電子部品、及び表面実装型電子部品を備えた照明器具
JP2008042211A (ja) * 2006-08-08 2008-02-21 Lg Electronics Inc 発光素子パッケージ及びその製造方法
JP2008218678A (ja) * 2007-03-05 2008-09-18 Nichia Chem Ind Ltd 発光装置
JP2013219090A (ja) * 2012-04-04 2013-10-24 Sankyo Kasei Co Ltd Ｌｅｄパッケージ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270901A (ja) * 2001-03-12 2002-09-20 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
JP2006060058A (ja) * 2004-08-20 2006-03-02 Matsushita Electric Works Ltd 表面実装型電子部品、及び表面実装型電子部品を備えた照明器具
JP2008042211A (ja) * 2006-08-08 2008-02-21 Lg Electronics Inc 発光素子パッケージ及びその製造方法
JP2008218678A (ja) * 2007-03-05 2008-09-18 Nichia Chem Ind Ltd 発光装置
JP2013219090A (ja) * 2012-04-04 2013-10-24 Sankyo Kasei Co Ltd Ｌｅｄパッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017033998A (ja) * 2015-07-29 2017-02-09 ローム株式会社 半導体装置およびその製造方法
CN111106220A (zh) * 2018-10-25 2020-05-05 一诠精密电子工业(中国)有限公司 光学模块承载座

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