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WO2015080159A1 - Photo-curable composition for stereolithography, and method for producing 3d structure - Google Patents

Photo-curable composition for stereolithography, and method for producing 3d structure Download PDF

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Publication number
WO2015080159A1
WO2015080159A1 PCT/JP2014/081264 JP2014081264W WO2015080159A1 WO 2015080159 A1 WO2015080159 A1 WO 2015080159A1 JP 2014081264 W JP2014081264 W JP 2014081264W WO 2015080159 A1 WO2015080159 A1 WO 2015080159A1
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Prior art keywords
compound
group
meth
photocurable composition
molecule
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French (fr)
Japanese (ja)
Inventor
坂根正憲
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Daicel Corp
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Daicel Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds

Definitions

  • the present invention relates to a photocurable composition used in an optical three-dimensional modeling method, and a method for manufacturing a three-dimensional modeled product using the photocurable composition.
  • an optical three-dimensional modeling method in which a three-dimensional model is produced by selectively irradiating light on a liquid photocurable composition based on three-dimensional CAD data.
  • a cured product layer resin having a desired shape pattern by selectively irradiating light onto a liquid surface of a photocurable composition filled in a container.
  • a photocurable composition for one layer is supplied onto the cured product layer, and similarly a cured product layer having a desired shape pattern is formed by light irradiation.
  • a method of producing a three-dimensional object having a desired three-dimensional shape by repeating such a lamination operation (a lamination operation in which a new cured material layer is continuously formed on a previously formed cured material layer) is known.
  • the above-described cured product layer is formed by ejecting fine droplets of a photocurable composition from a nozzle by an inkjet method so as to draw a desired shape pattern, and curing this by light irradiation.
  • An optical three-dimensional modeling method is also known.
  • Such an optical three-dimensional modeling method does not require the use of a mold, and even if it has a complicated three-dimensional shape, it can be easily produced in a short time, which greatly increases the development period of various products. It is expected as a technology that contributes to rapid shortening and cost reduction.
  • photocurable composition used in the above-mentioned optical three-dimensional modeling method
  • a monomer or oligomer that is liquid at 23 ° C. and can be polymerized by a ring-opening reaction, or A resin composition comprising a mixture of monomers and oligomers; an impact modifier comprising one or more block copolymers having at least one block composed of methyl methacrylate; and a curable composition comprising one or more polymerization initiators
  • a thing is known (refer patent document 1).
  • the photocurable composition used in the optical three-dimensional modeling method is required to have sufficient curability (reactivity) to form a cured product layer quickly by light irradiation.
  • three-dimensional objects obtained by optical three-dimensional modeling methods are not only used as models for various products and members, but are themselves used as molds and members, or as test parts for evaluation. Therefore, it is required to have excellent heat resistance and mechanical properties.
  • the photocurable composition described in Patent Document 1 is insufficient from the viewpoint of satisfying all of such curability, heat resistance, and mechanical properties.
  • the photocurable composition is inferior in curability, and has a problem that poor curing tends to occur during the optical three-dimensional modeling method.
  • the object of the present invention is to provide a three-dimensional object that is excellent in curability (reactivity) and excellent in heat resistance and mechanical properties by being subjected to an optical three-dimensional modeling method. It is to provide a composition.
  • the present inventor has obtained a photocurable composition containing an epoxy compound, a (meth) acrylic compound, and a photopolymerization initiator, and a specific epoxy compound as the epoxy compound.
  • the present invention has been completed by finding that a three-dimensionally shaped article excellent in curability (reactivity) and excellent in heat resistance and mechanical properties can be formed by being subjected to an optical three-dimensional modeling method.
  • the present invention includes (a) an epoxy compound, (b) a (meth) acrylic compound, and (c) a photopolymerization initiator, and (a) an epoxy compound having an alicyclic epoxy group in the molecule and a carbonyl
  • a photocurable composition for optical three-dimensional modeling comprising a compound having no group.
  • the epoxy compound is at least one selected from the group consisting of a compound having an alicyclic epoxy group in the molecule, an aromatic epoxy compound, and a compound having an alicyclic ring and a glycidyl ether group in the molecule.
  • the photocurable composition for optical three-dimensional modeling which is a compound, is provided.
  • a compound having an alicyclic epoxy group in the molecule and having no carbonyl group is represented by the following formula (I-1) [In Formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. ]
  • the said photocurable composition for optical three-dimensional modeling which is a compound represented by these is provided.
  • compounds having an alicyclic epoxy group in the molecule and no carbonyl group are 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4-epoxycyclohexyl) propane, At least selected from the group consisting of 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, and bis (3,4-epoxycyclohexylmethyl) ether
  • the photocurable composition for optical three-dimensional modeling which is one type of compound is provided.
  • the above-mentioned photocurable composition for optical three-dimensional modeling which further comprises (a) an epoxy compound further containing a compound having an alicyclic epoxy group and a carbonyl group in the molecule.
  • a compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2) [In Formula (I-2), X 2 represents a divalent group having a carbonyl group. ]
  • the said photocurable composition for optical three-dimensional modeling which is a compound represented by these is provided.
  • R a represents a hydrogen atom or a methyl group.
  • Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or a divalent group formed by linking one or more alkylene groups having 1 to 10 carbon atoms and one or more ether bonds.
  • Ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group.
  • the present invention provides a method for producing a three-dimensional structure, characterized in that a three-dimensional structure is produced by an optical three-dimensional modeling method using the above-mentioned photocurable composition for optical three-dimensional modeling.
  • the present invention relates to the following.
  • a compound having an alicyclic epoxy group in the molecule and having no carbonyl group is represented by the following formula (I-1): [In Formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. ]
  • X 1 in formula (I-1) is a single bond; a linear or branched alkylene group having 1 to 6 carbon atoms; an epoxidized alkenylene group having 2 to 4 carbon atoms; or [3], which is a divalent group having 2 to 10 total carbon atoms formed by linking one or more of 4 linear or branched alkylene groups and one or more of ether bonds (—O—)
  • the photocurable composition for optical three-dimensional modeling of description.
  • a compound having an alicyclic epoxy group in the molecule and having no carbonyl group is 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4 -Epoxycyclohexyl) propane, 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, and bis (3,4-epoxycyclohexylmethyl) ether
  • the photocurable composition for optical three-dimensional modeling according to any one of [1] to [4], which is at least one compound selected from the group.
  • the optical steric structure according to any one of [1] to [5], further comprising (a-2) an epoxy compound (i-2) a compound having an alicyclic epoxy group and a carbonyl group in the molecule.
  • (i-2) A compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2): [In Formula (I-2), X 2 represents a divalent group having a carbonyl group. ]
  • molding as described in [6] which is a compound represented by these.
  • a compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2-1) and formula (I-2-7): [6] or [7], which is at least one selected from the group consisting of compounds (especially compounds represented by formula (I-2-7) wherein m is 1) Photocurable composition.
  • the content of the epoxy compound (a) is 30 to 95% by weight with respect to the total amount (100% by weight) of the photocurable composition, as described in any one of [1] to [9] A photocurable composition for optical three-dimensional modeling.
  • the ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group relative to the total amount (100% by weight) of the (a) epoxy compound is 1 to 50% by weight [1 ]
  • the (b) (meth) acrylic compound includes at least one selected from the group consisting of an alicyclic (meth) acrylic compound, an aromatic (meth) acrylic compound, and an aliphatic (meth) acrylic compound.
  • the curable composition for optical three-dimensional modeling according to any one of [19].
  • (b) (b) As the (meth) acrylic compound the following formula (III) [In the formula (III), R a represents a hydrogen atom or a methyl group. Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or a divalent group formed by linking one or more alkylene groups having 1 to 10 carbon atoms and one or more ether bonds.
  • Ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group.
  • the content of the (b) (meth) acryl compound is 5 to 50 parts by weight with respect to 100 parts by weight of the total amount of the (a) epoxy compound, and any one of [1] to [22] The photocurable composition for optical three-dimensional modeling of description.
  • (b) As a (meth) acrylic compound a monofunctional (meth) acrylic compound having a polycyclic alicyclic ring (especially a bridged carbocyclic ring) (especially Z is a polycyclic structure (especially a bridged carbocyclic ring).
  • (b) As a (meth) acrylic compound a monofunctional (meth) acrylic compound having an alicyclic epoxy group (particularly a compound represented by the formula (III) in which Z is an alicyclic epoxy group)
  • the ratio of the compound is 10 to 50% by weight based on the total amount (100% by weight) of the (b) (meth) acrylic compound [21] to [24]
  • a photocurable composition for three-dimensional modeling is 10 to 50% by weight based on the total amount (100% by weight) of the (b) (meth) acrylic compound [21] to [24]
  • a polyfunctional aliphatic (meth) acrylic compound (particularly, a tri- or tetrafunctional aliphatic (meth) acrylic compound) is included as the (meth) acrylic compound, and the proportion of the compound is (b )
  • the content of the photocationic polymerization initiator is 1 to 15 parts by weight with respect to 100 parts by weight of the total amount of the (a) epoxy compound and other cationically polymerizable compounds contained in the photocurable composition.
  • the content of the photo radical polymerization initiator is 1 to 30 parts by weight with respect to 100 parts by weight of the total amount of (b) (meth) acrylic compound and other radical polymerizable compounds contained in the photocurable composition.
  • the photo-curable composition for optical three-dimensional modeling of the present invention has the above-described configuration, it is excellent in curability when irradiated with light.
  • a three-dimensionally shaped object having a desired shape can be obtained.
  • the said three-dimensional molded item is excellent in heat resistance and mechanical characteristics.
  • the photo-curable composition for optical three-dimensional modeling of the present invention includes (a) an epoxy compound, (b) a (meth) acrylic compound, And (c) a photocurable composition (photocurable resin composition) used for optical three-dimensional modeling, containing a photopolymerization initiator as an essential component.
  • the photocurable composition of the present invention contains (a) a compound having an alicyclic epoxy group in the molecule and having no carbonyl group as an essential component as an epoxy compound.
  • (a) epoxy compound, (b) (meth) acryl compound, and (c) photopolymerization initiator are referred to as component (a), component (b), and component (c), respectively.
  • component (a), component (b), and component (c) respectively.
  • (meth) acryl means acryl and / or methacryl (any one or both of acryl and methacryl), and the same applies to “(meth) acryloyl” and the like.
  • the (a) epoxy compound which is an essential component of the photocurable composition of the present invention is a compound having one or more epoxy groups (oxiranyl groups) in the molecule (in one molecule).
  • the (a) epoxy compound does not include a compound corresponding to the (b) acrylic compound (that is, a compound having one or more epoxy groups and one or more (meth) acryloyl groups in the molecule). .
  • epoxy compound an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound etc. are mentioned, for example.
  • the alicyclic epoxy compound is a compound having one or more alicyclic rings (aliphatic hydrocarbon rings) and one or more epoxy groups in the molecule.
  • the alicyclic epoxy compound may be a known or commonly used alicyclic epoxy compound, and is not particularly limited.
  • alicyclic epoxy group A compound having an epoxy group composed of an oxygen atom
  • a compound in which an epoxy group is directly bonded to the alicyclic ring by a single bond a compound having a glycidyl ether group (glycidyl ether type epoxy compound) and the like.
  • Examples of the alicyclic ring in the alicyclic epoxy compound include monocyclic alicyclic rings such as cyclopentane ring, cyclohexane ring, cyclooctane ring and cyclododecane ring (preferably 3 to 15 members, more preferably 5 or 6 members).
  • a decaline ring (perhydronaphthalene ring), a perhydroindene ring (bicyclo [4.3.0] nonane ring), a perhydroanthracene ring, a perhydrofluorene ring, a perhydrophenanthrene ring, Norbornane ring (bicyclo [2.2.1] heptane ring), isobornane ring, adamantane ring, bicyclo [3.3.0] octane ring, tricyclo [5.2.1.0 2,6 ] decane ring, tricyclo [ 6.2.1.0 2,7 ] Polycyclic (about 2 to 4 rings) alicyclic ring (condensed carbocyclic ring, bridged carbocyclic ring, etc.) such as undecane ring. Moreover, the meaning of the alicyclic ring which comprises the above-mentioned alicyclic epoxy group is also contained in the alicyclic ring which the said
  • the compound (i) having an alicyclic epoxy group in the molecule can be arbitrarily selected from known or commonly used compounds.
  • Examples of the alicyclic epoxy group in the compound having an alicyclic epoxy group in the molecule include an epoxycyclopentyl group, a 3,4-epoxycyclohexyl group, and 3,4-epoxytricyclo [5.2.1.0]. 2,6 ] decane 8- (or 9) yl group (epoxidized dicyclopentadienyl group) and the like.
  • the alicyclic epoxy group is preferably a 3,4-epoxycyclohexyl group from the viewpoint of heat resistance and mechanical strength of the three-dimensional structure. That is, (i) the compound having an alicyclic epoxy group in the molecule is preferably a compound having a 3,4-epoxycyclohexyl group.
  • the photocurable composition of the present invention is a compound having (i-1) an alicyclic epoxy group among (a) epoxy compounds from the viewpoints of curability, heat resistance of a three-dimensional structure, and mechanical properties,
  • a compound having no carbonyl group in the molecule that is, a compound having an alicyclic epoxy group and no carbonyl group in the molecule
  • the compound having an alicyclic epoxy group in the molecule and not having a carbonyl group is particularly a compound represented by the following formula (I-1) from the viewpoints of curability, heat resistance of a three-dimensional structure, and mechanical properties. Is particularly preferred.
  • X 1 represents a single bond or a divalent group having no carbonyl group.
  • the divalent group having no carbonyl group include, for example, a divalent hydrocarbon group, an alkenylene group in which a part or all of a carbon-carbon double bond is epoxidized, an ether bond, and a plurality of these linked. Groups and the like.
  • the compound in which X 1 in the above formula (I-1) is a single bond includes 3,4,3 ′, 4′-diepoxybicyclohexyl (3,4,3 ′, 4′-diepoxybicyclohexane) Is mentioned.
  • Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms, and a divalent alicyclic hydrocarbon group.
  • Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group.
  • divalent alicyclic hydrocarbon group examples include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclopentylene group, And divalent cycloalkylene groups (including cycloalkylidene groups) such as cyclohexylene group, 1,4-cyclohexylene group and cyclohexylidene group.
  • alkenylene group in the alkenylene group in which part or all of the carbon-carbon double bond is epoxidized include, for example, vinylene group, propenylene group, 1-butenylene group And straight-chain or branched alkenylene groups having 2 to 8 carbon atoms such as 2-butenylene group, butadienylene group, pentenylene group, hexenylene group, heptenylene group, octenylene group and the like.
  • the epoxidized alkenylene group is preferably an alkenylene group in which all of the carbon-carbon double bonds are epoxidized, more preferably 2 to 4 carbon atoms in which all of the carbon-carbon double bonds are epoxidized. Alkenylene group.
  • X 1 is a single bond; A linear or branched alkylene group having ⁇ 6; an epoxidized alkenylene group having 2 to 4 carbon atoms; or one or more linear or branched alkylene groups having 1 to 4 carbon atoms and an ether bond (—O A compound having a total number of 2 to 10 carbon atoms formed by linking one or more of-), more preferably 3,4,3 ', 4'-diepoxybicyclohexyl, 2, 2-bis (3,4-epoxycyclohexyl) propane, 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, bis (3,4-epoxy (Cyclohexylmethyl) ether is there.
  • the photocurable composition of the present invention includes (i-2) a compound having an alicyclic epoxy group as an alicyclic epoxy compound, and a compound having a carbonyl group in the molecule (that is, an alicyclic epoxy compound in the molecule).
  • a compound having a group and a carbonyl group A compound having a group and a carbonyl group.
  • the photocurable composition of the present invention has (i-1) an alicyclic epoxy group in the molecule and a carbonyl group. It is preferable to include both a compound having no aliquot and a compound (i-2) having an alicyclic epoxy group and a carbonyl group in the molecule.
  • the compound (i-2) having an alicyclic epoxy group and a carbonyl group in the molecule is particularly represented by the following formula (I-2) from the viewpoint of the balance between the heat resistance and mechanical properties of the three-dimensional structure. Are preferred.
  • X 2 represents a divalent group having a carbonyl group.
  • the divalent group having a carbonyl group include a carbonyl group, an ester bond, an amide bond, a carbonate bond, a divalent group having a carbonyl group such as a group in which a plurality of these are linked; Examples thereof include a divalent group formed by linking one or more divalent groups and one or more divalent groups having no carbonyl group.
  • Examples of the divalent group having no carbonyl group include X 1 in the above formula (I-1) such as a divalent hydrocarbon group, an epoxidized alkenylene group, an ether bond, and a group in which a plurality of these are connected. And the groups exemplified as above.
  • R in the following formula (I-2-5) is an alkylene group having 1 to 8 carbon atoms, and includes a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, an s-butylene group, and a pentylene group.
  • a linear or branched alkylene group such as a hexylene group, a heptylene group, and an octylene group.
  • linear or branched alkylene groups having 1 to 3 carbon atoms such as a methylene group, an ethylene group, a propylene group, and an isopropylene group are preferable.
  • n1 to n6 each represents an integer of 1 to 30.
  • the compound represented by the above formula (I-2) is particularly represented by the above formula (I-2-1) from the viewpoint of achieving both the heat resistance and mechanical properties of the three-dimensional structure at a higher level.
  • a compound represented by the above formula (I-2-7) (particularly a compound represented by the formula (I-2-7) in which m is 1), more preferably a compound in which m is 1. It is a compound represented by (I-2-7).
  • Examples of the compound (ii) in which the epoxy group is directly bonded to the alicyclic ring with a single bond include compounds represented by the following formula (II).
  • R ′ is a group (p-valent organic group) obtained by removing p hydroxyl groups (—OH) from the structural formula of p-valent alcohol, and p and n each represent a natural number.
  • the p-valent alcohol [R ′ (OH) p ] include polyhydric alcohols (such as alcohols having 1 to 15 carbon atoms) such as 2,2-bis (hydroxymethyl) -1-butanol.
  • p is preferably 1 to 6, and n is preferably 1 to 30.
  • n in each group in () (inside the outer parenthesis) may be the same or different.
  • Examples of the compound (iii) having an alicyclic ring and a glycidyl ether group in the molecule include glycidyl ethers of alicyclic alcohols (particularly, alicyclic polyhydric alcohols). More specifically, (iii) Examples of compounds having an alicyclic ring and a glycidyl ether group in the molecule include 2,2-bis [4- (2,3-epoxypropoxy) cyclohexyl] propane, 2,2- A compound obtained by hydrogenating a bisphenol A type epoxy compound such as bis [3,5-dimethyl-4- (2,3-epoxypropoxy) cyclohexyl] propane (hydrogenated bisphenol A type epoxy compound); bis [o, o -(2,3-epoxypropoxy) cyclohexyl] methane, bis [o, p- (2,3-epoxypropoxy) cyclohexyl] methane, bis [p, p- (2,3-e
  • the aromatic epoxy compound is not particularly limited and may be a known or commonly used compound having one or more aromatic rings and one or more epoxy groups in the molecule.
  • the aromatic ring that the aromatic epoxy compound has include a benzene ring, a biphenyl ring, a naphthalene ring, a fluorene ring, an anthracene ring, a stilbene ring, a dibenzothiophene ring, and a carbazole ring.
  • aromatic epoxy compound examples include, for example, an epibis type glycidyl ether type epoxy obtained by a condensation reaction of bisphenols [for example, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, etc.] and epihalohydrin.
  • Resins high molecular weight epibis type glycidyl ether type epoxy resins obtained by further addition reaction of these epibis type glycidyl ether type epoxy resins with the above bisphenols; phenols [for example, phenol, cresol, xylenol, resorcin, catechol Bisphenol A, bisphenol F, bisphenol S, etc.] and aldehydes [eg formaldehyde, acetaldehyde, benzaldehyde, hydroxybenzal A novolac alkyl type glycidyl ether type epoxy resin obtained by condensation reaction of polyhydric alcohols obtained by condensation reaction with hydride, salicylaldehyde, etc.] with epihalohydrin; two phenol skeletons at the 9-position of the fluorene ring And an epoxy compound in which a glycidyl group is bonded to an oxygen atom in a state where a hydrogen atom is removed from a hydroxy group of the phenol
  • the aliphatic epoxy compound is not particularly limited, and any known or commonly used epoxy compound having no cyclic structure such as an aromatic ring or an alicyclic ring in the molecule can be used.
  • the aliphatic epoxy compound include a glycidyl ether of an alcohol having no q-valent cyclic structure (q is a natural number); a monovalent or polyvalent carboxylic acid [for example, acetic acid, propionic acid, butyric acid, stearic acid, Adipic acid, sebacic acid, maleic acid, itaconic acid, etc.] glycidyl ester; epoxidized oils and fats having double bonds such as epoxidized linseed oil, epoxidized soybean oil, epoxidized castor oil; polyolefins such as epoxidized polybutadiene (poly Epoxidized product of alkadiene).
  • Examples of the alcohol having no q-valent cyclic structure include monohydric alcohols such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol and 1-butanol; ethylene glycol, 1,2-propanediol, 1 Divalent alcohols such as 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, polyethylene glycol, polypropylene glycol; Examples include trihydric or higher polyhydric alcohols such as glycerin, diglycerin, erythritol, trimethylolethane, trimethylolpropane, pentaerythritol, dipentaerythritol, and sorbitol. That.
  • the q-valent alcohol may be polyether polyol, polyester polyol, polycarbonate polyo
  • the photocurable composition of the present invention preferably contains both (i) a compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule.
  • a compound having an alicyclic epoxy group in the molecule includes (i-1) a compound having an alicyclic epoxy group in the molecule and having no carbonyl group, and (i-2) ) It is preferable to include both a compound having an alicyclic epoxy group and a carbonyl group in the molecule.
  • the (a) epoxy compound can be used alone or in combination of two or more.
  • the (a) epoxy compound can be produced by a known or conventional method.
  • examples of the (a) epoxy compound include trade names “Celoxide 2021P”, “Epolide GT 401” (manufactured by Daicel Corporation); trade names “YX-8000” (manufactured by Mitsubishi Chemical Corporation), and the like. Commercial products can also be used.
  • the content (blending amount) of the epoxy compound (a) in the photocurable composition of the present invention is not particularly limited, but is 30 to 95% by weight with respect to the total amount (100% by weight) of the photocurable composition. More preferred is 40 to 90% by weight, still more preferred is 50 to 85% by weight.
  • the content is set to 30% by weight or more, there is a tendency that the dimensional accuracy, heat resistance, and mechanical properties of the three-dimensional structure are further improved.
  • the content is 95% by weight or less, the curability of the photocurable composition tends to be further improved.
  • the ratio of the alicyclic epoxy compound ((a) alicyclic epoxy compound which is an epoxy compound) to the total amount (100% by weight) of the (a) epoxy compound contained in the photocurable composition of the present invention is not particularly limited. However, it is preferably 60% by weight or more (for example, 60 to 100% by weight), more preferably 70 to 95% by weight, and still more preferably 80 to 90% by weight. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 60 weight% or more.
  • the photocurable composition of the present invention includes (a) an epoxy compound that includes both (i) a compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule. , (I) having an alicyclic epoxy group in the molecule relative to the total amount (100% by weight) of the compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule
  • the proportion of the compound is not particularly limited, but is preferably 60 to 95% by weight, more preferably 65 to 90% by weight, and still more preferably 70 to 90% by weight.
  • the ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group with respect to the total amount (100% by weight) of the (a) epoxy compound contained in the photocurable composition of the present invention is although not limited, it is preferably 1 to 50% by weight, more preferably 5 to 40% by weight, and still more preferably 10 to 30% by weight.
  • the ratio is 1% by weight or more, the curability of the photocurable composition tends to be further improved.
  • the ratio is 50% by weight or less, the mechanical properties of the three-dimensional structure tend to be further improved.
  • the photocurable composition of the present invention includes (i) a compound having an alicyclic epoxy group in the molecule and (i-1) a compound having an alicyclic epoxy group in the molecule and no carbonyl group (i-2). ) When both a compound having an alicyclic epoxy group and a carbonyl group are included in the molecule, (i-1) a compound having an alicyclic epoxy group in the molecule and not having a carbonyl group and (i-2)
  • the ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group with respect to the total amount (100% by weight) of the compound having an alicyclic epoxy group and a carbonyl group is not particularly limited.
  • It is preferably 50% by weight, more preferably 8 to 40% by weight, still more preferably 10 to 30% by weight.
  • hardenability of a photocurable composition to improve more by making the said ratio into 5 weight% or more.
  • the ratio is 50% by weight or less, the curability of the photocurable composition and the mechanical properties of the three-dimensional structure tend to be improved in a balanced manner.
  • the photocurable composition of the present invention may contain (a) a cationically polymerizable compound other than the epoxy compound (sometimes referred to as “other cationically polymerizable compound”).
  • a cationically polymerizable compound other than the epoxy compound sometimes referred to as “other cationically polymerizable compound”.
  • other cationically polymerizable compounds include oxetane compounds (compounds having one or more oxetanyl groups in the molecule), vinyl ether compounds (compounds having one or more vinyl ether groups in the molecule), and the like.
  • oxetane compound examples include 3,3-bis (vinyloxymethyl) oxetane, 3-ethyl-3- (hydroxymethyl) oxetane, and 3-ethyl-3- (2-ethylhexyloxymethyl).
  • vinyl ether compound examples include 2-hydroxyethyl vinyl ether, 3-hydroxypropyl vinyl ether, 2-hydroxypropyl vinyl ether, 2-hydroxyisopropyl vinyl ether, 4-hydroxybutyl vinyl ether, 3-hydroxybutyl vinyl ether, 2 -Hydroxybutyl vinyl ether, 3-hydroxyisobutyl vinyl ether, 2-hydroxyisobutyl vinyl ether, 1-methyl-3-hydroxypropyl vinyl ether, 1-methyl-2-hydroxypropyl vinyl ether, 1-hydroxymethylpropyl vinyl ether, 4-hydroxycyclohexyl vinyl ether, 1,6-hexanediol monovinyl ether, 1,6-hexanediol divinyl ether 1,4-cyclohexanedimethanol monovinyl ether, 1,4-cyclohexanedimethanol divinyl ether, 1,3-cyclohexanedimethanol monovinyl ether, 1,3-cyclohexanedimethanol divinyl ether,
  • an oxetane compound is preferable from the viewpoint of improving the curability of the photocurable composition and the toughness of the cured product, and more preferably an oxetane compound having one oxetane ring in the molecule ( Monofunctional oxetane compound).
  • the other cationic polymerizable compounds can be used alone or in combination of two or more.
  • Other cationically polymerizable compounds can be produced by known or conventional methods.
  • commercially available products such as trade name “Aron Oxetane OXT-101” (manufactured by Toagosei Co., Ltd.) can be used.
  • the content (blending amount) of the other cationic polymerizable compound in the photocurable composition of the present invention is not particularly limited, but the (a) epoxy compound and other cationic polymerizable compounds contained in the photocurable composition are not limited.
  • the amount is preferably 1 to 40% by weight, more preferably 5 to 30% by weight, based on the total amount (100% by weight).
  • the content of the other cationic polymerizable compound is 40% by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.
  • the content (blending amount) of the oxetane compound (particularly monofunctional oxetane compound) in the photocurable composition of the present invention is not particularly limited, but is 5 to 30 with respect to 100 parts by weight of the total amount of (a) epoxy compound. Part by weight is preferred, and more preferably 8 to 20 parts by weight.
  • the content of the oxetane compound (particularly, the monofunctional oxetane compound) is 5 parts by weight or more, the curability of the photocurable composition and the toughness of the cured product tend to be further improved.
  • the content of the oxetane compound (particularly, the monofunctional oxetane compound) is 30 parts by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.
  • the (b) (meth) acrylic compound in the photocurable composition of the present invention is a compound having one or more (meth) acryloyl groups in the molecule.
  • the number (total number) of (meth) acryloyl groups contained in the molecule of the (meth) acrylic compound is not particularly limited, but is preferably 1 to 6, more preferably 1 to 3. That is, the (b) (meth) acrylic compound may be a monofunctional (meth) acrylic compound having one (meth) acryloyl group in the molecule, or two or more (meth) acrylic compounds in the molecule. It may be a polyfunctional (meth) acryl compound having an acryloyl group.
  • (meth) acrylic compounds examples include alicyclic (meth) acrylic compounds, aromatic (meth) acrylic compounds, and aliphatic (meth) acrylic compounds.
  • the alicyclic (meth) acrylic compound is a compound having one or more alicyclic rings (aliphatic hydrocarbon rings) and one or more (meth) acryloyl groups in the molecule.
  • Examples of the alicyclic ring that the alicyclic (meth) acrylic compound has include monocyclic alicyclic rings such as cyclopentane ring, cyclohexane ring, cyclooctane ring, cyclododecane ring; decalin ring (perhydronaphthalene ring), Hydroindene ring (bicyclo [4.3.0] nonane ring), perhydroanthracene ring, perhydrofluorene ring, perhydrophenanthrene ring, perhydroacenaphthene ring, perhydrophenalene ring, norbornane ring (bicyclo [2.
  • alicyclic (meth) acrylic compound includes a compound having a (meth) acryloyl group and an alicyclic epoxy group in the molecule.
  • the alicyclic (meth) acrylic compound has a polycyclic alicyclic ring (particularly a bridged carbocyclic ring) and an alicyclic epoxy group as the alicyclic ring in the molecule.
  • the constituting alicyclic ring is preferred. That is, as the alicyclic (meth) acrylic compound, a (meth) acrylic compound having a polycyclic alicyclic ring (particularly, a bridging carbocyclic ring) or a (meth) acrylic compound having an alicyclic epoxy group is preferable.
  • a (meth) acrylic compound having an alicyclic epoxy group is preferred.
  • Examples of the alicyclic epoxy group that the (meth) acrylic compound having an alicyclic epoxy group has include an epoxycyclopentyl ring, a 3,4-epoxycyclohexyl ring, and a 3,4-epoxytricyclo [ 5.2.1.0 2,6 ] decane 8- (or 9-) yl group and the like. Of these, a 3,4-epoxycyclohexyl ring and a 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane 8- (or 9-) yl group are preferable.
  • alicyclic (meth) acrylic compound examples include compounds represented by the following formula (III) (monofunctional alicyclic (meth) acrylic compounds).
  • R a represents a hydrogen atom or a methyl group
  • Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or one or more alkylene groups having 1 to 10 carbon atoms and an ether bond
  • the alkylene group having 1 to 10 carbon atoms include linear or branched alkylene having 1 to 10 carbon atoms such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, and a hexamethylene group. Groups and the like.
  • Y in the above formula (III) is particularly a single bond, an alkylene group having 1 to 6 carbon atoms, an alkyleneoxy group having 1 to 6 carbon atoms (the oxygen atom is at the right end), or an alkylene having 1 to 6 carbon atoms.
  • a poly (alkyleneoxy) group (terminal oxygen atom at the right end) formed by bonding a plurality of oxy groups (for example, about 2 to 20) is preferred.
  • the ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group.
  • the cycloaliphatic hydrocarbon group include a cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, and a cyclododecyl group; a perhydronaphthalenyl group, a perhydroindenyl group (bicyclo [4.3.
  • nonyl group perhydroanthracenyl group, perhydrofluorenyl group, perhydrophenanthrenyl group, perhydroacenaphthenyl group, perhydrophenanthrenyl group, norbornyl group (bicyclo [2. 2.1] heptyl group), isobornyl group, adamantyl group, bicyclo [3.3.0] octyl group, tricyclo [5.2.1.0 2,6 ] decyl group, tricyclo [6.2.1.0 2,7 ] and the like.
  • Examples of the alicyclic epoxy group include epoxycyclopentyl ring, 3,4-epoxycyclohexyl ring, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane 8- (or 9-) yl. Groups and the like.
  • examples of the alicyclic (meth) acrylic compound include cyclohexyl (meth) acrylate, cyclohexanemethanol (meth) acrylate, 1-adamantanol (meth) acrylate, and 1-adamantanmethanol (meth) acrylate.
  • Isobornyl (meth) acrylate, tricyclo [5.2.1.0 2,6 ] decane methanol (meth) acrylate [ dicyclopentanyl (meth) acrylate], dicyclopentanyloxyethyl (meth) acrylate, etc.
  • Monofunctional alicyclic (meth) acrylic compounds 1,4-cyclohexanediol di (meth) acrylate, 1,4-cyclohexanedimethanol di (meth) acrylate, bicyclo [2.2.1] heptanedimethanol di ( (Meth) acrylate, 1,3-a Diamantane di (meth) acrylate, 1,3-adamantane dimethanol di (meth) acrylate, tricyclo [5.2.1.0 2,6] decanedimethanol di (meth) polyfunctional alicyclic acrylates such as (Meth) acrylic compound; 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl (meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, and the like.
  • the alicyclic (meth) acrylic compound is preferably a compound represented by the above formula (III), more preferably dicyclopentanyl (meth) acrylate, from the viewpoint of improving the heat resistance of the three-dimensional structure.
  • 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl (meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane- 9-yl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) acrylate more preferably 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl ( (Meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl (meth) acrylate.
  • the above aromatic (meth) acrylic compound is a compound having one or more aromatic rings and one or more (meth) acryloyl groups in the molecule.
  • the aromatic ring that the aromatic (meth) acrylic compound has include a benzene ring, a biphenyl ring, a naphthalene ring, a fluorene ring, an anthracene ring, a stilbene ring, a dibenzothiophene ring, and a carbazole ring.
  • aromatic (meth) acrylic compound examples include (meth) acrylic acid esters of bisphenols (for example, bisphenol A, bisphenol F, fluorene bisphenol, etc.); ethylene oxide and / or propylene of the bisphenols (Meth) acrylic acid ester of an adduct of oxide; two phenol skeletons are bonded to the 9-position of the fluorene ring, and oxygen atoms in the state in which a hydrogen atom is removed from the hydroxy groups of these two phenol skeletons are directly or (Meth) acrylic acid ester ((meth) acrylic acid ester having a bisarylfluorene skeleton) in which a (meth) acryloyl group is bonded via an alkyleneoxy group; a state in which a hydrogen atom is removed from two hydroxy groups of biphenol Oxygen field To, respectively, either directly or via a alkylene group (meth) acryloyl group is bonded (meth) acrylic acid ester.
  • bisphenols
  • the aliphatic (meth) acrylic compound may be a known or commonly used (meth) acrylic compound having no cyclic structure such as an aromatic ring or alicyclic ring in the molecule, and is not particularly limited.
  • examples of the aliphatic (meth) acrylic compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, and decyl (meth) acrylate.
  • Monofunctional aliphatic (meth) acrylic compounds such as polyethylene glycol (meth) acrylate and polypropylene glycol (meth) acrylate; ethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6 -Hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) Of acrylate, glycerin di (or tri) (meth) acrylate, di (or tri) (meth) acrylate of glycerin ethylene oxide adduct, trimethylolpropane di (or tri) (meth) acrylate, ethylene oxide adduct of trimethylolpropane Di (or tri) (meth) acrylate, pent
  • a monofunctional (meth) acrylic compound having an epoxy group and a polyfunctional aliphatic (meth) acrylic compound are preferable, more preferably a compound represented by the formula (III) and a polyfunctional aliphatic (meth) acrylic compound. is there.
  • the photocurable composition of the present invention includes a compound represented by the formula (III) (one in which Z is a cyclic aliphatic hydrocarbon group or one in which Z is an alicyclic epoxy group) and a polyfunctional fat. It is preferable to include both a group (meth) acrylic compound (particularly a tri- or tetrafunctional aliphatic (meth) acrylic compound).
  • the (b) (meth) acrylic compound can be used alone or in combination of two or more.
  • the (b) (meth) acrylic compound can be produced by a known or common method.
  • Examples of (b) (meth) acrylic compounds include trade names “FA-129AS” and “FA-513AS” (manufactured by Hitachi Chemical Co., Ltd.); trade names “SR499” (manufactured by Sartomer).
  • Commercially available products such as trade names “E-DCPA”, “Cyclomer” series (manufactured by Daicel Co., Ltd.) can also be used.
  • the content (blending amount) of (b) (meth) acrylic compound in the photocurable composition of the present invention is not particularly limited, but it is 5 to 50 parts by weight with respect to 100 parts by weight of the total amount of (a) epoxy compound. It is preferably 10 to 40 parts by weight, more preferably 15 to 30 parts by weight.
  • (B) By making content of a (meth) acryl compound into 5 weight part or more, there exists a tendency which the sclerosis
  • the content of the (b) (meth) acrylic compound is 50 parts by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.
  • the photocurable composition of the present invention is a monofunctional (meth) acrylic compound (in particular, Z is a polycyclic structure) having a polycyclic alicyclic ring (especially a bridged carbon ring) as the (b) (meth) acrylic compound.
  • Z is a polycyclic structure
  • the proportion of the compound is the total amount of (b) (meth) acrylic compound ( 100 to 50% by weight), preferably 10 to 50% by weight, more preferably 20 to 40% by weight.
  • the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 10 weight% or more.
  • the mechanical properties of the three-dimensional structure tend to be further improved.
  • the photocurable composition of the present invention is a (b) (meth) acrylic compound having a monofunctional (meth) acrylic compound having an alicyclic epoxy group (particularly represented by the formula (III) wherein Z is an alicyclic epoxy group).
  • the compound) is preferably 10 to 50% by weight, more preferably 20 to 40% by weight, based on the total amount of the (b) (meth) acrylic compound (100% by weight). is there.
  • the mechanical strength of a three-dimensional molded item tends to be further improved by setting the ratio to 50% by weight or less.
  • the photocurable composition of the present invention contains a polyfunctional aliphatic (meth) acrylic compound (particularly a tri- or tetrafunctional aliphatic (meth) acrylic compound) as the (b) (meth) acrylic compound
  • the proportion of the compound is preferably 40 to 80% by weight, more preferably 50 to 70% by weight, based on the total amount (100% by weight) of the (b) (meth) acrylic compound.
  • the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 40 weight% or more.
  • the mechanical strength of a three-dimensional molded item tends to be further improved by setting the ratio to 80% by weight or less.
  • the photocurable composition of the present invention may contain (b) a radical polymerizable compound other than the (meth) acrylic compound (sometimes referred to as “other radical polymerizable compound”).
  • a radical polymerizable compound other than the (meth) acrylic compound sometimes referred to as “other radical polymerizable compound”.
  • Other radical polymerizable compounds include, for example, styrene compounds [eg, styrene, ⁇ -methylstyrene, etc.], olefin compounds [eg, ethylene, propylene, isobutylene, butadiene, etc.], vinyl ester compounds [eg, acetic acid, etc.
  • Known or commonly used radically polymerizable compounds such as vinyl etc. can be used.
  • another radically polymerizable compound in the photocurable composition of this invention, can also be used individually by 1 type, and can also be used in combination of 2 or more type.
  • the photocurable composition of the present invention may not contain other radical polymerizable compounds.
  • Other radically polymerizable compounds can be produced by known or conventional methods.
  • a commercial item can also be used as another radically polymerizable compound.
  • the content (blending amount) of the other radical polymerizable compound in the photocurable composition of the present invention is not particularly limited, but the (a) (meth) acrylic compound and other radical polymerization contained in the photocurable composition are not particularly limited. It is preferably 10% by weight or less (for example, 0 to 5% by weight), more preferably 3% by weight or less, based on the total amount of the active compound (100% by weight).
  • the content of the other radical polymerizable compound is not particularly limited, but the (a) (meth) acrylic compound and other radical polymerization contained in the photocurable composition are not particularly limited. It is preferably 10% by weight or less (for example, 0 to 5% by weight), more preferably 3% by weight or less, based on the total amount of the active compound (100% by weight).
  • the photopolymerization initiator (c) which is an essential component of the photocurable composition of the present invention is a polymerizable compound (cationic polymerizable) such as component (a) or component (b) in the photocurable composition by light irradiation. Compound, a radically polymerizable compound) that initiates or advances the polymerization reaction.
  • a photoinitiator well-known thru
  • the photocurable composition of the present invention may contain both a cationic photopolymerization initiator and a photoradical polymerization initiator as the photopolymerization initiator (c). preferable.
  • photocationic polymerization initiator known or commonly used photocationic polymerization initiators can be used, and are not particularly limited.
  • sulfonium salt salt of sulfonium ion and anion
  • iodonium salt iodonium ion and Anion
  • selenium salt selenium salt
  • ammonium salt ammonium ion and anion salt
  • phosphonium salt phosphonium ion and anion salt
  • transition metal complex ion and anion examples include salts.
  • sulfonium salt examples include triphenylsulfonium salt, tri-p-tolylsulfonium salt, tri-o-tolylsulfonium salt, tris (4-methoxyphenyl) sulfonium salt, 1-naphthyldiphenylsulfonium salt, and 2-naphthyldiphenyl.
  • Sulfonium salt tris (4-fluorophenyl) sulfonium salt, tri-1-naphthylsulfonium salt, tri-2-naphthylsulfonium salt, tris (4-hydroxyphenyl) sulfonium salt, diphenyl [4- (phenylthio) phenyl] sulfonium salt , Triarylsulfonium salts such as 4- (p-tolylthio) phenyldi- (p-phenyl) sulfonium salt; diphenylphenacylsulfonium salt, diphenyl-4-nitrophenacylsulfonium salt, diphenylbenzi Diarylsulfonium salts such as sulfonium salt and diphenylmethylsulfonium salt; monoarylsulfonium salts such as phenylmethylbenzylsulfonium salt, 4-hydroxyphenylmethylbenzylsul
  • diphenyl [4- (phenylthio) phenyl] sulfonium salt a trade name “CPI-101A” (manufactured by San Apro Co., Ltd., diphenyl [4- (phenylthio) phenyl] sulfonium hexafluoroantimonate 50% propylene carbonate solution), Product name “CPI-100P” (manufactured by San Apro Co., Ltd., diphenyl [4- (phenylthio) phenyl] sulfonium hexafluorophosphate 50% propylene carbonate solution), product name “K1-S” (manufactured by San Apro Co., Ltd., non-manufactured) Commercial products such as antimony triarylsulfonium salts) may be used.
  • CPI-101A manufactured by San Apro Co., Ltd., diphenyl [4- (phenylthio) phenyl]
  • iodonium salt examples include diphenyliodonium salt, di-p-tolyliodonium salt, bis (4-dodecylphenyl) iodonium salt, bis (4-methoxyphenyl) iodonium salt, and the like.
  • selenium salt examples include triaryl selenium such as triphenyl selenium salt, tri-p-tolyl selenium salt, tri-o-tolyl selenium salt, tris (4-methoxyphenyl) selenium salt, and 1-naphthyldiphenyl selenium salt. Salts; diaryl phenacyl selenium salts, diphenyl benzyl selenium salts, diaryl selenium salts such as diphenyl methyl selenium salts; monoaryl selenium salts such as phenyl methyl benzyl selenium salts; trialkyl selenium salts such as dimethyl phenacyl selenium salts .
  • triaryl selenium such as triphenyl selenium salt, tri-p-tolyl selenium salt, tri-o-tolyl selenium salt, tris (4-methoxyphenyl) selenium salt, and 1-naphthyldiphenyl seleni
  • ammonium salt examples include tetramethylammonium salt, ethyltrimethylammonium salt, diethyldimethylammonium salt, triethylmethylammonium salt, tetraethylammonium salt, trimethyl-n-propylammonium salt, and trimethyl-n-butylammonium salt.
  • Pyrodium salts such as alkylammonium salts; N, N-dimethylpyrrolidinium salts, N-ethyl-N-methylpyrrolidinium salts; N, N′-dimethylimidazolinium salts, N, N′-diethylimidazolinium salts, etc.
  • Imidazolinium salts such as N, N′-dimethyltetrahydropyrimidinium salt, N, N′-diethyltetrahydropyrimidinium salt; N, N-dimethylmorpholinium salt, N, N -Diethylmorpholinium Morpholinium salts such as salts; piperidinium salts such as N, N-dimethylpiperidinium salts and N, N-diethylpiperidinium salts; pyridinium salts such as N-methylpyridinium salts and N-ethylpyridinium salts; N, N ′ -Imidazolium salts such as dimethylimidazolium salt; Quinolium salts such as N-methylquinolium salt; Isoquinolium salts such as N-methylisoquinolium salt; Thiazonium salts such as benzylbenzothiazonium salt; And an acridium salt.
  • tetrahydropyrimidinium salts
  • the phosphonium salt examples include tetraarylphosphonium salts such as tetraphenylphosphonium salt, tetra-p-tolylphosphonium salt, tetrakis (2-methoxyphenyl) phosphonium salt; triarylphosphonium salts such as triphenylbenzylphosphonium salt; Examples thereof include tetraalkylphosphonium salts such as benzylphosphonium salt, tributylbenzylphosphonium salt, tetraethylphosphonium salt, tetrabutylphosphonium salt, and triethylphenacylphosphonium salt.
  • tetraarylphosphonium salts such as tetraphenylphosphonium salt, tetra-p-tolylphosphonium salt, tetrakis (2-methoxyphenyl) phosphonium salt
  • triarylphosphonium salts such as triphenylbenzylphosphonium salt
  • Examples of the salt of the transition metal complex ion include chromium such as ( ⁇ 5 -cyclopentadienyl) ( ⁇ 6 -toluene) Cr + and ( ⁇ 5 -cyclopentadienyl) ( ⁇ 6 -xylene) Cr +. Salts of complex cations; salts of iron complex cations such as ( ⁇ 5 -cyclopentadienyl) ( ⁇ 6 -toluene) Fe + and ( ⁇ 5 -cyclopentadienyl) ( ⁇ 6 -xylene) Fe + It is done.
  • Examples of the anion (counter ion) for forming a salt with the cation include SbF 6 ⁇ , PF 6 ⁇ , BF 4 ⁇ , (CF 3 CF 2 ) 3 PF 3 ⁇ , and (CF 3 CF 2 CF 2 ).
  • the photocationic polymerization initiator may be used alone or in combination of two or more.
  • the cationic photopolymerization initiator include, for example, trade names “Syracure UVI-6970”, “Syracure UVI-6974”, “Syracure UVI-6990”, “Syracure UVI-950” (manufactured by Union Carbide, USA).
  • photocationic polymerization initiator from the viewpoint of reducing adverse effects on the environment and the human body, a photocationic polymerization initiator not containing antimony as a constituent atom (non-antimony-based photocationic polymerization initiator; for example, SbF 6 ⁇ are preferred).
  • photo radical polymerization initiator known or conventional photo radical polymerization initiators can be used, and are not particularly limited.
  • photo radical polymerization initiators can be used, and are not particularly limited.
  • benzoin methyl ether benzoin ethyl ether
  • the photocationic polymerization initiator can be used alone or in combination of two or more.
  • the photocationic polymerization initiator include trade names “Kayacure EPA” and “Kayacure DETX” (manufactured by Nippon Kayaku Co., Ltd.); trade name “B-CIM” (Hodogaya Chemical Co., Ltd.).
  • Commercially available products such as trade names “Irgacure 187” and “Irgacure 907” (manufactured by BASF) can also be used.
  • photo radical polymerization initiator among them, a photo radical polymerization initiator not containing antimony as a constituent atom (non-antimony photo radical polymerization initiator) is preferable from the viewpoint of reducing adverse effects on the environment and the human body.
  • the content (blending amount) of the (c) photopolymerization initiator in the photocurable composition of the present invention is not particularly limited, but the total amount of the polymerizable compound contained in the photocurable composition [(a) epoxy compound, The total amount of other cationically polymerizable compounds, (b) (meth) acrylic compounds, and other radically polymerizable compounds] is preferably 1 to 20 parts by weight, more preferably 2 to 15 parts by weight with respect to 100 parts by weight. is there. (C) By making content of a photoinitiator into 1 weight part or more, there exists a tendency which can manufacture a three-dimensional molded item more efficiently by the optical three-dimensional modeling method. On the other hand, when the content of the (c) photopolymerization initiator is 20 parts by weight or less, the heat resistance and mechanical properties of the three-dimensional structure are further improved, and defects such as coloring tend to be suppressed.
  • the content (blending amount) of the photocationic polymerization initiator in the photocurable composition of the present invention is not particularly limited, but (a) an epoxy compound and other cationic polymerizable compounds contained in the photocurable composition
  • the total amount is preferably 1 to 15 parts by weight, more preferably 2 to 10 parts by weight.
  • the content (blending amount) of the photo radical polymerization initiator in the photo curable composition of the present invention is not particularly limited, but (b) (meth) acrylic compounds and other radicals contained in the photo curable composition.
  • the amount is preferably 1 to 30 parts by weight, more preferably 2 to 20 parts by weight, based on 100 parts by weight of the total amount of the polymerizable compounds.
  • the photocurable composition of the present invention may contain (c) a sensitizer (photosensitizer) for improving the sensitivity of the photopolymerization initiator.
  • a sensitizer photosensitizer
  • a known or conventional compound can be used as a sensitizer for a photopolymerization initiator, and is not particularly limited.
  • amine compounds triethanolamine, methyldiethanolamine, triethylamine, diethylamine, etc.
  • Examples include benzophenone, benzoin isopropyl ether, and benzoflavin.
  • a sensitizer can also be used individually by 1 type, and can also be used in combination of 2 or more type.
  • the content (blending amount) of the sensitizer is not particularly limited, and can be appropriately set according to the type and content of the (c) photopolymerization initiator to be used.
  • the photocurable composition of the present invention may further contain a component other than the above-described components (may be referred to as “other components”) as necessary, as long as the effects of the present invention are not impaired.
  • Other components include, for example, dyes, pigments, impact imparting agents (for example, rubber particles, thermoplastic elastomers, etc.), fillers such as talc, curing expandable monomers, resins, adhesion improvers, reinforcing agents, softening agents Agent, plasticizer, viscosity modifier, thixotropic agent, solvent, inorganic or organic particles (such as nanoscale particles), antifoaming agent, leveling agent, coupling agent (such as silane coupling agent), surfactant
  • Various stabilizers such as flame retardants, ultraviolet absorbers, antioxidants, anti-aging agents, light stabilizers, ion adsorbents, phosphors, mold release agents, pigment dispersants (for example, polymer dispersants), Conventional additives such as dis
  • the content (total amount) of other components in the photocurable composition of the present invention is not particularly limited, but is preferably less than 10 wt%, more preferably based on the total amount (100 wt%) of the photocurable composition. Less than 5% by weight.
  • the method for producing the photocurable composition of the present invention is not particularly limited, and a known or conventional method for producing a composition can be applied.
  • the photocurable composition of the present invention can be prepared by, for example, stirring the above-described components while heating them as necessary and mixing them uniformly.
  • blending of each component in the case of the said stirring can also be implemented collectively, and can also be implemented sequentially.
  • the stirring method is not particularly limited, and for example, known or conventional stirring means such as various mixers such as a dissolver and a homogenizer, a kneader, a roll, a bead mill, and a self-revolving stirrer can be used. Further, if necessary, after stirring and mixing, defoaming can be performed under vacuum.
  • the photocurable composition of the present invention preferably exhibits a liquid state (a liquid) at 25 ° C.
  • the viscosity at 25 ° C. of the photocurable composition of the present invention is not particularly limited, but is preferably 0.1 to 10000 mPa ⁇ s, more preferably 1 to 8000 mPa ⁇ s.
  • the handleability of the photocurable composition tends to be further improved.
  • the viscosity at 25 ° C. By setting the viscosity at 25 ° C. to 0.1 mPa ⁇ s or more, the handleability of the photocurable composition tends to be further improved.
  • the viscosity of the photocurable composition of the present invention at 25 ° C. is determined by using, for example, a digital viscometer (model number “DVU-EII type”, manufactured by Tokimec Co., Ltd.), rotor: standard 1 ° 34 ′ ⁇ R24. , Temperature: 25 ° C., rotation speed: 0.5 to 10 rpm.
  • a three-dimensional model formed from a cured product of the photocurable composition can be produced (produced) by an optical three-dimensional modeling method using the photocurable composition of the present invention.
  • the optical three-dimensional modeling method includes a well-known optical three-dimensional modeling method, and is not particularly limited. Specifically, for example, a desired shape pattern is formed on the photocurable composition (liquid) of the present invention.
  • the cured product layer is formed by selectively irradiating light so that a cured product layer (cured product layer) is formed, and then the photocurable composition of the present invention for one layer on the cured product layer.
  • a cured product layer having a desired shape pattern is formed by light irradiation, and a new cured product layer is continuously formed on such a laminating operation (a cured product layer formed in advance).
  • a laminating operation a laminating operation in which a new cured product layer is continuously formed on the previously formed cured product layer
  • a three-dimensional modeled object having a desired three-dimensional shape is obtained. Examples of the method are as follows.
  • the light irradiated to cure the photocurable composition of the present invention in the optical three-dimensional modeling method is not particularly limited, and examples thereof include ultraviolet rays, visible rays, infrared rays, electron beams, X-rays, radiation, and high frequencies. It is done. Of these, ultraviolet rays are preferable in terms of handling and cost.
  • a light source in the case of using ultraviolet rays for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a carbon arc, a metal halide lamp, sunlight, an LED lamp, a laser, or the like can be used.
  • the method of selectively irradiating light to the photocurable composition of the present invention is not particularly limited, and for example, spotting is performed using light that has been focused in a spot shape such as laser light.
  • known or commonly used selective light irradiation methods such as a method of irradiating light by a line drawing method and a method of irradiating light in a planar manner through a planar drawing mask can be used.
  • the planar drawing mask include a mask formed by arranging a plurality of micro light shutters such as a liquid crystal shutter or a digital micromirror shutter (DMD).
  • the three-dimensional modeled object of the present invention after the three-dimensional modeled object is manufactured by the optical three-dimensional modeled method, the three-dimensional modeled object can be further subjected to post-curing treatment.
  • the post-curing treatment method include known or conventional methods, and are not particularly limited. Examples thereof include a method of performing light irradiation, a method of performing heat treatment, a method of performing both light irradiation and heat treatment, and the like. It is done.
  • the method of light irradiation or heat treatment is not particularly limited, and can be appropriately selected from known conditions.
  • the photocurable composition of this invention is excellent in sclerosis
  • the photocurable composition of the present invention when the photocurable composition of the present invention remains on the surface of the three-dimensional modeled object obtained by the optical three-dimensional modeled method, it is necessary to remove it. It can also be washed according to The washing of the three-dimensional structure is not particularly limited, and for example, alcohols such as ethanol and isopropyl alcohol; ketones such as acetone and methyl ethyl ketone; esters such as ethyl acetate; and various organic solvents such as aliphatic hydrocarbons such as terpenes are used. Can be implemented.
  • the said three-dimensional molded item can also be wash
  • a curing treatment can be further performed after the washing.
  • the photocurable composition of the present invention can be widely used in the field of optical three-dimensional modeling, and is not particularly limited.
  • test parts shape confirmation models and functions
  • master model for mold / mold production master model for mold / mold production
  • raw material for producing mold / mold etc.
  • the three-dimensional structure obtained by using the photocurable composition of the present invention can be used in various fields, and is not particularly limited.
  • the medical field for example, artificial bones, artificial joints, human models, medical devices, and the like
  • it is used in the precision instrument field, electrical / electronic field, architectural field, automobile field, aircraft field, ship field, aerospace field, food field, daily life field, and the like.
  • Example 1 [Production of photocurable composition] As shown in Table 1, 3,4,3 ′, 4′-diepoxybicyclohexyl (Compound 1) 10 parts by weight, trade name “Celoxide 2021P” (manufactured by Daicel Corporation), 55 parts by weight, trade name “Aron” 10 parts by weight of Oxetane OXT-101 (manufactured by Toagosei Co., Ltd.), 10 parts by weight of trade name “YX-8000” (manufactured by Mitsubishi Chemical Corporation), trade name “FA-129AS” (Hitachi Chemical Industry Co., Ltd.) 5 parts by weight, product name “FA-513AS” (manufactured by Hitachi Chemical Co., Ltd.), 5 parts by weight “SR499” (manufactured by Sartomer), product name “CPI-100P” (San Apro ( 6 parts by weight) and 2 parts by weight of the product name “Irgacure 184” (manufactured by BA
  • the manufacture of the three-dimensional model was performed by the optical three-dimensional model method (optical modeling). Specifically, the photocurable composition obtained above is put in a resin tank, and the UV curable composition in the resin tank is cured by a UV lamp at a UV irradiation amount of 13.30 mJ / cm 2 and a lamination pitch of 0.1 mm. By making it, the three-dimensional molded item (hardened
  • Comparative Examples 1 and 2 Except having changed the composition of the photocurable composition as shown in Table 1, it carried out similarly to Example 1, and manufactured the photocurable composition and the three-dimensional molded item. In Comparative Examples 1 and 2, the photocurable composition could not be cured by the above-described production method, and a three-dimensional modeled object could not be obtained. For this reason, it was described in Table 1 as “hardening failure”.
  • the photocurable composition of the present invention when used (Examples), the photocurable composition was excellent in curability (reactivity), so that it was quickly obtained by an optical three-dimensional modeling method. A three-dimensional model was manufactured, and the three-dimensional model obtained was excellent in both heat resistance and mechanical properties.
  • the curability of the photocurable compositions obtained in Comparative Examples 1 and 2 was insufficient, and it was impossible to produce a three-dimensional modeled object by the above-described optical three-dimensional modeling method.
  • the photocurable composition obtained in the Example is a non-antimony composition that does not contain antimony, it is less likely to adversely affect the environment and the human body. As shown in Comparative Examples 1 and 2, with the conventional composition, it was not possible to achieve both non-antimony material design and excellent curability.
  • the photocurable composition of the present invention can be widely used in the field of optical three-dimensional modeling, for example, various products and parts used in the product, test parts (shape confirmation model, functional test model, etc.), It can be used as a raw material for producing a master model for mold / mold production, mold / mold, and the like.

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Abstract

 Provided is a photo-curable composition for stereolithography with outstanding curing properties (reactivity), and with which it is possible to obtain a 3D structure having excellent heat resistance and mechanical properties through application to stereolithography. The present invention pertains to a photo-curable composition for stereolithography, characterized by containing: an epoxy compound (a); a (meth)acrylic compound (b); and a photopolymerization initiator (c), wherein a compound containing an alicyclic epoxy group but not containing a carboxylic group within the molecule is contained as epoxy compound (a). The epoxy compound (a) is preferably at least one compound selected from the group consisting of: a compound having an alicyclic epoxy group within the molecule; an aromatic epoxy compound; and a compound having an alicyclic group and glycidyl ether within the molecule.

Description

光学的立体造形用光硬化性組成物、及び立体造形物の製造方法Photo-curable composition for optical three-dimensional modeling, and method for manufacturing three-dimensional model

 本発明は、光学的立体造形法に用いられる光硬化性組成物、及び該光硬化性組成物を用いた立体造形物の製造方法に関する。本願は、2013年11月29日に日本に出願した特願2013-248240号の優先権を主張し、その内容をここに援用する。 The present invention relates to a photocurable composition used in an optical three-dimensional modeling method, and a method for manufacturing a three-dimensional modeled product using the photocurable composition. This application claims the priority of Japanese Patent Application No. 2013-248240 for which it applied to Japan on November 29, 2013, and uses the content here.

 近年、三次元CADデータに基づいて、液状の光硬化性組成物に対して選択的に光を照射することによって立体造形物を作製する、光学的立体造形法に注目が集められている。このような光学的立体造形法の具体例としては、例えば、容器内に充填された光硬化性組成物の液面に光を選択的に照射して所望の形状パターンを有する硬化物層(樹脂硬化物層)を形成し、引き続き、当該硬化物層の上に一層分の光硬化性組成物を供給して同様に光照射により所望の形状パターンを有する硬化物層を形成し、さらに、このような積層操作(先行して形成した硬化物層上に新たな硬化物層を連続して形成する積層操作)を繰り返すことによって、所望の立体形状を有する立体造形物を作製する方法が知られている。また、上述の硬化物層の形成を、インクジェット方式によりノズルから光硬化性組成物の微小液滴を所望の形状パターンを描画するように吐出し、これを光照射により硬化させることにより行う、インクジェット法による光学的立体造形法も知られている。このような光学的立体造形法は金型を使用する必要がなく、また、複雑な立体形状を有するものであっても容易に短時間で作製することができるため、各種製品の開発期間の大幅な短縮やコスト削減に資する技術として期待されている。 In recent years, attention has been focused on an optical three-dimensional modeling method in which a three-dimensional model is produced by selectively irradiating light on a liquid photocurable composition based on three-dimensional CAD data. As a specific example of such an optical three-dimensional modeling method, for example, a cured product layer (resin having a desired shape pattern by selectively irradiating light onto a liquid surface of a photocurable composition filled in a container. Then, a photocurable composition for one layer is supplied onto the cured product layer, and similarly a cured product layer having a desired shape pattern is formed by light irradiation. A method of producing a three-dimensional object having a desired three-dimensional shape by repeating such a lamination operation (a lamination operation in which a new cured material layer is continuously formed on a previously formed cured material layer) is known. ing. In addition, the above-described cured product layer is formed by ejecting fine droplets of a photocurable composition from a nozzle by an inkjet method so as to draw a desired shape pattern, and curing this by light irradiation. An optical three-dimensional modeling method is also known. Such an optical three-dimensional modeling method does not require the use of a mold, and even if it has a complicated three-dimensional shape, it can be easily produced in a short time, which greatly increases the development period of various products. It is expected as a technology that contributes to rapid shortening and cost reduction.

 上述の光学的立体造形法に用いられる光硬化性組成物(光学的立体造形用光硬化性組成物)としては、例えば、23℃において液体であり、開環反応によって重合しうるモノマー又はオリゴマーあるいはモノマーとオリゴマーの混合物を含む樹脂組成物;メチルメタクリレートから構成される少なくとも1つのブロックを有する1種類以上のブロックコポリマーを含む耐衝撃性改良剤;及び1種類以上の重合開始剤を含む硬化性組成物が知られている(特許文献1参照)。 As a photocurable composition (photocurable composition for optical three-dimensional modeling) used in the above-mentioned optical three-dimensional modeling method, for example, a monomer or oligomer that is liquid at 23 ° C. and can be polymerized by a ring-opening reaction, or A resin composition comprising a mixture of monomers and oligomers; an impact modifier comprising one or more block copolymers having at least one block composed of methyl methacrylate; and a curable composition comprising one or more polymerization initiators A thing is known (refer patent document 1).

特表2010-520949号公報Japanese translation of PCT publication 2010-520949

 光学的立体造形法に用いられる光硬化性組成物には、光照射により速やかに硬化物層を形成できるだけの十分な硬化性(反応性)を有することが求められる。また、光学的立体造形法により得られる立体造形物は、近年、各種製品や部材等のモデルとしてだけではなく、それ自身が金型や部材等として使用されたり、評価用テストパーツ等として使用されることが増えているために、優れた耐熱性及び機械特性を兼ね備えることが要求される。しかしながら、特許文献1に記載の光硬化性組成物は、このような硬化性、耐熱性、及び機械特性の全てを充足するという観点では、不十分であった。特に、上記光硬化性組成物は硬化性に劣っており、光学的立体造形法に際して硬化不良が生じやすいという問題を有していた。 The photocurable composition used in the optical three-dimensional modeling method is required to have sufficient curability (reactivity) to form a cured product layer quickly by light irradiation. In addition, in recent years, three-dimensional objects obtained by optical three-dimensional modeling methods are not only used as models for various products and members, but are themselves used as molds and members, or as test parts for evaluation. Therefore, it is required to have excellent heat resistance and mechanical properties. However, the photocurable composition described in Patent Document 1 is insufficient from the viewpoint of satisfying all of such curability, heat resistance, and mechanical properties. In particular, the photocurable composition is inferior in curability, and has a problem that poor curing tends to occur during the optical three-dimensional modeling method.

 従って、本発明の目的は、硬化性(反応性)に優れ、かつ光学的立体造形法に付すことによって耐熱性及び機械特性に優れた立体造形物が得られる、光学的立体造形用光硬化性組成物を提供することにある。 Therefore, the object of the present invention is to provide a three-dimensional object that is excellent in curability (reactivity) and excellent in heat resistance and mechanical properties by being subjected to an optical three-dimensional modeling method. It is to provide a composition.

 なお、近年、各種分野において、環境や人体に及ぶ悪影響を低減するために、アンチモンを含まない製品の開発が求められている。このため、光学的立体造形法に用いられる光硬化性組成物においても同様に、上述の硬化性、耐熱性、及び機械特性を満足することに加え、アンチモンを含まない材料設計が可能であることが望まれている。 In recent years, in various fields, development of products that do not contain antimony is required in order to reduce adverse effects on the environment and the human body. For this reason, in the photocurable composition used for the optical three-dimensional modeling method, in addition to satisfying the above-described curability, heat resistance, and mechanical properties, it is possible to design a material that does not contain antimony. Is desired.

 本発明者は上記課題を解決するため鋭意検討した結果、エポキシ化合物と、(メタ)アクリル化合物と、光重合開始剤とを含み、上記エポキシ化合物として特定のエポキシ化合物を含む光硬化性組成物が、硬化性(反応性)に優れ、かつ光学的立体造形法に付すことによって耐熱性及び機械特性に優れた立体造形物を形成できることを見出し、本発明を完成させた。 As a result of intensive studies to solve the above problems, the present inventor has obtained a photocurable composition containing an epoxy compound, a (meth) acrylic compound, and a photopolymerization initiator, and a specific epoxy compound as the epoxy compound. The present invention has been completed by finding that a three-dimensionally shaped article excellent in curability (reactivity) and excellent in heat resistance and mechanical properties can be formed by being subjected to an optical three-dimensional modeling method.

 すなわち、本発明は、(a)エポキシ化合物、(b)(メタ)アクリル化合物、及び(c)光重合開始剤を含み、(a)エポキシ化合物として、分子内に脂環エポキシ基を有しカルボニル基を有しない化合物を含有することを特徴とする光学的立体造形用光硬化性組成物を提供する。 That is, the present invention includes (a) an epoxy compound, (b) a (meth) acrylic compound, and (c) a photopolymerization initiator, and (a) an epoxy compound having an alicyclic epoxy group in the molecule and a carbonyl Provided is a photocurable composition for optical three-dimensional modeling, comprising a compound having no group.

 さらに、(a)エポキシ化合物が、分子内に脂環エポキシ基を有する化合物、芳香族エポキシ化合物、及び分子内に脂環とグリシジルエーテル基とを有する化合物からなる群より選択される少なくとも1種の化合物である前記の光学的立体造形用光硬化性組成物を提供する。 Furthermore, (a) the epoxy compound is at least one selected from the group consisting of a compound having an alicyclic epoxy group in the molecule, an aromatic epoxy compound, and a compound having an alicyclic ring and a glycidyl ether group in the molecule. The photocurable composition for optical three-dimensional modeling, which is a compound, is provided.

 さらに、分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、下記式(I-1)

Figure JPOXMLDOC01-appb-C000004
[式(I-1)中、X1は、単結合、又はカルボニル基を有しない二価の基を示す。]
で表される化合物である前記の光学的立体造形用光硬化性組成物を提供する。 Further, a compound having an alicyclic epoxy group in the molecule and having no carbonyl group is represented by the following formula (I-1)
Figure JPOXMLDOC01-appb-C000004
[In Formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. ]
The said photocurable composition for optical three-dimensional modeling which is a compound represented by these is provided.

 さらに、分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、3,4,3',4'-ジエポキシビシクロヘキシル、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、1,2-ビス(3,4-エポキシシクロヘキシル)エタン、2,3-ビス(3,4-エポキシシクロヘキシル)オキシラン、及びビス(3,4-エポキシシクロヘキシルメチル)エーテルからなる群より選択される少なくとも1種の化合物である前記の光学的立体造形用光硬化性組成物を提供する。 Further, compounds having an alicyclic epoxy group in the molecule and no carbonyl group are 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4-epoxycyclohexyl) propane, At least selected from the group consisting of 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, and bis (3,4-epoxycyclohexylmethyl) ether The photocurable composition for optical three-dimensional modeling which is one type of compound is provided.

 さらに、(a)エポキシ化合物として、さらに、分子内に脂環エポキシ基及びカルボニル基を有する化合物を含む前記の光学的立体造形用光硬化性組成物を提供する。 Furthermore, the above-mentioned photocurable composition for optical three-dimensional modeling, which further comprises (a) an epoxy compound further containing a compound having an alicyclic epoxy group and a carbonyl group in the molecule.

 さらに、分子内に脂環エポキシ基及びカルボニル基を有する化合物が、下記式(I-2)

Figure JPOXMLDOC01-appb-C000005
[式(I-2)中、X2は、カルボニル基を有する二価の基を示す。]
で表される化合物である前記の光学的立体造形用光硬化性組成物を提供する。 Further, a compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2)
Figure JPOXMLDOC01-appb-C000005
[In Formula (I-2), X 2 represents a divalent group having a carbonyl group. ]
The said photocurable composition for optical three-dimensional modeling which is a compound represented by these is provided.

 さらに、(b)(メタ)アクリル化合物として、下記式(III)

Figure JPOXMLDOC01-appb-C000006
[式(III)中、Raは、水素原子又はメチル基を示す。Yは、単結合、炭素数1~10のアルキレン基、又は、炭素数1~10のアルキレン基の1以上とエーテル結合の1以上とが連結して形成された二価の基を示す。環Zは、環状脂肪族炭化水素基、又は脂環エポキシ基を示す。]
で表される化合物、及び多官能の脂肪族(メタ)アクリル化合物からなる群より選択される少なくとも一種の化合物を含む前記の光学的立体造形用光硬化性組成物を提供する。 Furthermore, as the (b) (meth) acrylic compound, the following formula (III)
Figure JPOXMLDOC01-appb-C000006
[In the formula (III), R a represents a hydrogen atom or a methyl group. Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or a divalent group formed by linking one or more alkylene groups having 1 to 10 carbon atoms and one or more ether bonds. Ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group. ]
And at least one compound selected from the group consisting of polyfunctional aliphatic (meth) acrylic compounds, and the above-mentioned photocurable composition for optical three-dimensional modeling.

 また、本発明は、前記の光学的立体造形用光硬化性組成物を使用して光学的立体造形法により立体造形物を作製することを特徴とする立体造形物の製造方法を提供する。 Also, the present invention provides a method for producing a three-dimensional structure, characterized in that a three-dimensional structure is produced by an optical three-dimensional modeling method using the above-mentioned photocurable composition for optical three-dimensional modeling.

 即ち、本発明は以下に関する。 That is, the present invention relates to the following.

 [1](a)エポキシ化合物、(b)(メタ)アクリル化合物、及び(c)光重合開始剤を含み、(a)エポキシ化合物として、(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物を含有することを特徴とする光学的立体造形用光硬化性組成物。
 [2](a)エポキシ化合物が、(i)分子内に脂環エポキシ基を有する化合物、芳香族エポキシ化合物、及び(iii)分子内に脂環とグリシジルエーテル基とを有する化合物からなる群より選択される少なくとも1種の化合物である[1]に記載の光学的立体造形用光硬化性組成物。
 [3](i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、下記式(I-1)

Figure JPOXMLDOC01-appb-C000007
[式(I-1)中、X1は、単結合、又はカルボニル基を有しない二価の基を示す。]
で表される化合物である[1]又は[2]に記載の光学的立体造形用光硬化性組成物。
 [4]式(I-1)におけるX1が、単結合;炭素数1~6の直鎖又は分岐鎖状のアルキレン基;炭素数2~4のエポキシ化アルケニレン基、又は;炭素数1~4の直鎖又は分岐鎖状のアルキレン基の1以上とエーテル結合(-O-)の1以上とが連結して形成された総炭素数2~10の二価の基である[3]に記載の光学的立体造形用光硬化性組成物。
 [5](i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、3,4,3',4'-ジエポキシビシクロヘキシル、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、1,2-ビス(3,4-エポキシシクロヘキシル)エタン、2,3-ビス(3,4-エポキシシクロヘキシル)オキシラン、及びビス(3,4-エポキシシクロヘキシルメチル)エーテルからなる群より選択される少なくとも1種の化合物である[1]~[4]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [6](a)エポキシ化合物として、さらに、(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物を含む[1]~[5]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [7](i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物が、下記式(I-2)
Figure JPOXMLDOC01-appb-C000008
[式(I-2)中、X2は、カルボニル基を有する二価の基を示す。]
で表される化合物である[6]に記載の光学的立体造形用光硬化性組成物。
 [8](i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物が、後述の式(I-2-1)で表される化合物及び式(I-2-7)で表される化合物(特に、mが1である式(I-2-7)で表される化合物)からなる群より選択される少なくとも1種である[6]又は[7]に記載の光学的立体造形用光硬化性組成物。
 [9](a)エポキシ化合物として、(iii)分子内に脂環及びグリシジルエーテル基を有する化合物を含む[1]~[8]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [10](a)エポキシ化合物の含有量が、光硬化性組成物の全量(100重量%)に対して、30~95重量%である[1]~[9]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [11](a)エポキシ化合物の全量(100重量%)に対する脂環式エポキシ化合物の割合が、60~100重量%である[2]~[10]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [12](i)分子内に脂環エポキシ基を有する化合物と(iii)分子内に脂環及びグリシジルエーテル基を有する化合物の全量(100重量%)に対する(i)分子内に脂環エポキシ基を有する化合物の割合が、60~95重量%である[9]~[11]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [13](a)エポキシ化合物の全量(100重量%)に対する(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物の割合が、1~50重量%である[1]~[12]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [14](i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物と(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物の全量(100重量%)に対する(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物の割合が、5~50重量%である[6]~[13]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [15](a)エポキシ化合物以外のカチオン重合性化合物(その他のカチオン重合性化合物)を含む[1]~[14]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [16]その他のカチオン重合性化合物が、オキセタン化合物(特に、単官能オキセタン化合物)である[15]に記載の光学的立体造形用硬化性組成物。
 [17]その他のカチオン重合性化合物の含有量が、光硬化性組成物に含まれる(a)エポキシ化合物及びその他のカチオン重合性化合物の全量(100重量%)に対して、1~40重量%である[15]又は[16]に記載の光学的立体造形用硬化性組成物。
 [18]オキセタン化合物(特に、単官能オキセタン化合物)の含有量が、(a)エポキシ化合物の全量100重量部に対して、5~30重量部である[16]又は[17]に記載の光学的立体造形用硬化性組成物。
 [19](b)(メタ)アクリル化合物が分子内に有する(メタ)アクリロイル基の数(総数)が1~6個である[1]~[18]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [20](b)(メタ)アクリル化合物として、脂環式(メタ)アクリル化合物、芳香族(メタ)アクリル化合物、及び脂肪族(メタ)アクリル化合物からなる群より選択される少なくとも1種を含む[1]~[19]のいずれか1つに記載の光学的立体造形用硬化性組成物。
 [21](b)(メタ)アクリル化合物として、下記式(III)
Figure JPOXMLDOC01-appb-C000009
[式(III)中、Raは、水素原子又はメチル基を示す。Yは、単結合、炭素数1~10のアルキレン基、又は、炭素数1~10のアルキレン基の1以上とエーテル結合の1以上とが連結して形成された二価の基を示す。環Zは、環状脂肪族炭化水素基、又は脂環エポキシ基を示す。]
で表される化合物、及び多官能の脂肪族(メタ)アクリル化合物からなる群より選択される少なくとも一種の化合物を含む[1]~[20]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [22]多官能の脂肪族(メタ)アクリル化合物が、3又は4官能の脂肪族(メタ)アクリル化合物である[21]に記載の光学的立体造形用光硬化性組成物。
 [23](b)(メタ)アクリル化合物の含有量が、(a)エポキシ化合物の全量100重量部に対して、5~50重量部である[1]~[22]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [24](b)(メタ)アクリル化合物として、多環の脂環(特に橋架け炭素環)を有する単官能の(メタ)アクリル化合物(特に、Zが多環構造(特に、橋架け炭素環構造)を有する環状脂肪族炭化水素基である式(III)で表される化合物)を含み、該化合物の割合が、(b)(メタ)アクリル化合物の全量(100重量%)に対して、10~50重量%である[21]~[23]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [25](b)(メタ)アクリル化合物として、脂環エポキシ基を有する単官能の(メタ)アクリル化合物(特に、Zが脂環エポキシ基である式(III)で表される化合物)を含み、該化合物の割合が、(b)(メタ)アクリル化合物の全量(100重量%)に対して、10~50重量%である[21]~[24]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [26](b)(メタ)アクリル化合物として、多官能の脂肪族(メタ)アクリル化合物(特に、3又は4官能の脂肪族(メタ)アクリル化合物)を含み、該化合物の割合が、(b)(メタ)アクリル化合物の全量(100重量%)に対して、40~80重量%である[1]~[25]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [27](c)光重合開始剤として、光カチオン重合開始剤及び光ラジカル重合開始剤のいずれか一方又は両方を含有する[1]~[26]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [28]光カチオン重合開始剤が、非アンチモン系光カチオン重合開始剤である[27]に記載の光学的立体造形用光硬化性組成物。
 [29]光ラジカル重合開始剤が、非アンチモン系光ラジカル重合開始剤である[27]又は[28]に記載の光学的立体造形用光硬化性組成物。
 [30](c)光重合開始剤の含有量が、光硬化性組成物に含まれる重合性化合物の全量100重量部に対して、1~20重量部である[1]~[29]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [31]光カチオン重合開始剤の含有量が、光硬化性組成物に含まれる(a)エポキシ化合物及びその他のカチオン重合性化合物の全量100重量部に対して、1~15重量部である[27]~[30]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [32]光ラジカル重合開始剤の含有量が、光硬化性組成物に含まれる(b)(メタ)アクリル化合物及びその他のラジカル重合性化合物の全量100重量部に対して、1~30重量部である[27]~[31]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [33]25℃で液体である[1]~[32]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [34]25℃における粘度が0.1~10000mPa・sである[1]~[33]のいずれか1つに記載の光学的立体造形用光硬化性組成物。
 [35][1]~[34]のいずれか1つに記載の光学的立体造形用光硬化性組成物を使用して光学的立体造形法により立体造形物を作製することを特徴とする立体造形物の製造方法。 [1] (a) an epoxy compound, (b) a (meth) acrylic compound, and (c) a photopolymerization initiator. (A) an epoxy compound having (i-1) an alicyclic epoxy group in the molecule A photocurable composition for optical three-dimensional modeling, comprising a compound having no carbonyl group.
[2] From the group consisting of (a) an epoxy compound comprising (i) a compound having an alicyclic epoxy group in the molecule, an aromatic epoxy compound, and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule. The photocurable composition for optical three-dimensional modeling according to [1], which is at least one selected compound.
[3] (i-1) A compound having an alicyclic epoxy group in the molecule and having no carbonyl group is represented by the following formula (I-1):
Figure JPOXMLDOC01-appb-C000007
[In Formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. ]
The photocurable composition for optical three-dimensional model | molding as described in [1] or [2] which is a compound represented by these.
[4] X 1 in formula (I-1) is a single bond; a linear or branched alkylene group having 1 to 6 carbon atoms; an epoxidized alkenylene group having 2 to 4 carbon atoms; or [3], which is a divalent group having 2 to 10 total carbon atoms formed by linking one or more of 4 linear or branched alkylene groups and one or more of ether bonds (—O—) The photocurable composition for optical three-dimensional modeling of description.
[5] (i-1) A compound having an alicyclic epoxy group in the molecule and having no carbonyl group is 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4 -Epoxycyclohexyl) propane, 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, and bis (3,4-epoxycyclohexylmethyl) ether The photocurable composition for optical three-dimensional modeling according to any one of [1] to [4], which is at least one compound selected from the group.
[6] The optical steric structure according to any one of [1] to [5], further comprising (a-2) an epoxy compound (i-2) a compound having an alicyclic epoxy group and a carbonyl group in the molecule. Photocurable composition for modeling.
[7] (i-2) A compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2):
Figure JPOXMLDOC01-appb-C000008
[In Formula (I-2), X 2 represents a divalent group having a carbonyl group. ]
The photocurable composition for optical three-dimensional model | molding as described in [6] which is a compound represented by these.
[8] (i-2) A compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2-1) and formula (I-2-7): [6] or [7], which is at least one selected from the group consisting of compounds (especially compounds represented by formula (I-2-7) wherein m is 1) Photocurable composition.
[9] The photo-curing property for optical three-dimensional modeling according to any one of [1] to [8], wherein (a) the epoxy compound includes (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule. Composition.
[10] The content of the epoxy compound (a) is 30 to 95% by weight with respect to the total amount (100% by weight) of the photocurable composition, as described in any one of [1] to [9] A photocurable composition for optical three-dimensional modeling.
[11] (a) The optical steric structure according to any one of [2] to [10], wherein the ratio of the alicyclic epoxy compound to the total amount (100% by weight) of the epoxy compound is 60 to 100% by weight. Photocurable composition for modeling.
[12] (i) alicyclic epoxy group in the molecule relative to the total amount (100% by weight) of (i) a compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule [9] The curable composition for optical three-dimensional modeling according to any one of [9] to [11], wherein the proportion of the compound having the above is 60 to 95% by weight.
[13] The ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group relative to the total amount (100% by weight) of the (a) epoxy compound is 1 to 50% by weight [1 ] The curable composition for optical three-dimensional modeling according to any one of [12] to [12].
[14] Total amount (100% by weight) of (i-1) a compound having an alicyclic epoxy group in the molecule and no carbonyl group and (i-2) a compound having an alicyclic epoxy group and a carbonyl group in the molecule (I-1) The optical component according to any one of [6] to [13], wherein the proportion of the compound having an alicyclic epoxy group in the molecule and having no carbonyl group is 5 to 50% by weight Three-dimensional modeling curable composition.
[15] The curable composition for optical three-dimensional modeling according to any one of [1] to [14], comprising (a) a cationically polymerizable compound other than an epoxy compound (other cationically polymerizable compounds).
[16] The curable composition for optical three-dimensional modeling according to [15], wherein the other cationically polymerizable compound is an oxetane compound (particularly a monofunctional oxetane compound).
[17] The content of the other cationic polymerizable compound is 1 to 40% by weight based on the total amount (100% by weight) of the epoxy compound and other cationic polymerizable compound contained in the photocurable composition. The curable composition for optical three-dimensional modeling according to [15] or [16].
[18] The optical system according to [16] or [17], wherein the content of the oxetane compound (particularly a monofunctional oxetane compound) is 5 to 30 parts by weight with respect to 100 parts by weight of the total amount of the (a) epoxy compound. Curable composition for three-dimensional modeling.
[19] The optical component according to any one of [1] to [18], wherein the number (total number) of (meth) acryloyl groups (b) in the molecule of the (b) (meth) acrylic compound is 1 to 6. Three-dimensional modeling curable composition.
[20] The (b) (meth) acrylic compound includes at least one selected from the group consisting of an alicyclic (meth) acrylic compound, an aromatic (meth) acrylic compound, and an aliphatic (meth) acrylic compound. [1] The curable composition for optical three-dimensional modeling according to any one of [19].
[21] (b) As the (meth) acrylic compound, the following formula (III)
Figure JPOXMLDOC01-appb-C000009
[In the formula (III), R a represents a hydrogen atom or a methyl group. Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or a divalent group formed by linking one or more alkylene groups having 1 to 10 carbon atoms and one or more ether bonds. Ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group. ]
And at least one compound selected from the group consisting of polyfunctional aliphatic (meth) acrylic compounds, and for optical three-dimensional modeling according to any one of [1] to [20] Photocurable composition.
[22] The photocurable composition for optical three-dimensional modeling according to [21], wherein the polyfunctional aliphatic (meth) acrylic compound is a trifunctional or tetrafunctional aliphatic (meth) acrylic compound.
[23] The content of the (b) (meth) acryl compound is 5 to 50 parts by weight with respect to 100 parts by weight of the total amount of the (a) epoxy compound, and any one of [1] to [22] The photocurable composition for optical three-dimensional modeling of description.
[24] (b) As a (meth) acrylic compound, a monofunctional (meth) acrylic compound having a polycyclic alicyclic ring (especially a bridged carbocyclic ring) (especially Z is a polycyclic structure (especially a bridged carbocyclic ring). A compound represented by formula (III) which is a cycloaliphatic hydrocarbon group having a structure), and the proportion of the compound is (b) relative to the total amount (100% by weight) of the (meth) acrylic compound, The photocurable composition for optical three-dimensional modeling according to any one of [21] to [23], which is 10 to 50% by weight.
[25] (b) As a (meth) acrylic compound, a monofunctional (meth) acrylic compound having an alicyclic epoxy group (particularly a compound represented by the formula (III) in which Z is an alicyclic epoxy group) The ratio of the compound is 10 to 50% by weight based on the total amount (100% by weight) of the (b) (meth) acrylic compound [21] to [24] A photocurable composition for three-dimensional modeling.
[26] (b) A polyfunctional aliphatic (meth) acrylic compound (particularly, a tri- or tetrafunctional aliphatic (meth) acrylic compound) is included as the (meth) acrylic compound, and the proportion of the compound is (b ) The photocurable composition for optical three-dimensional modeling according to any one of [1] to [25], which is 40 to 80% by weight relative to the total amount (100% by weight) of the (meth) acrylic compound.
[27] (c) The optical steric structure according to any one of [1] to [26], which contains one or both of a cationic photopolymerization initiator and a radical photopolymerization initiator as a photopolymerization initiator. Photocurable composition for modeling.
[28] The photocurable composition for optical three-dimensional modeling according to [27], wherein the cationic photopolymerization initiator is a non-antimony photocationic polymerization initiator.
[29] The photocurable composition for optical three-dimensional modeling according to [27] or [28], wherein the photoradical polymerization initiator is a non-antimony photoradical polymerization initiator.
[30] (c) The content of the photopolymerization initiator is 1 to 20 parts by weight with respect to 100 parts by weight of the total amount of the polymerizable compounds contained in the photocurable composition. The photocurable composition for optical three-dimensional model | molding as described in any one.
[31] The content of the photocationic polymerization initiator is 1 to 15 parts by weight with respect to 100 parts by weight of the total amount of the (a) epoxy compound and other cationically polymerizable compounds contained in the photocurable composition. [27] The photocurable composition for optical three-dimensional modeling according to any one of [30] to [30].
[32] The content of the photo radical polymerization initiator is 1 to 30 parts by weight with respect to 100 parts by weight of the total amount of (b) (meth) acrylic compound and other radical polymerizable compounds contained in the photocurable composition. The photocurable composition for optical three-dimensional modeling according to any one of [27] to [31].
[33] The photocurable composition for optical three-dimensional modeling according to any one of [1] to [32], which is liquid at 25 ° C.
[34] The photocurable composition for optical three-dimensional modeling according to any one of [1] to [33], which has a viscosity at 25 ° C. of 0.1 to 10,000 mPa · s.
[35] A three-dimensional object produced by an optical three-dimensional modeling method using the photocurable composition for optical three-dimensional modeling according to any one of [1] to [34] Manufacturing method of a model.

 本発明の光学的立体造形用光硬化性組成物は上記構成を有するため、光を照射した際の硬化性に優れ、該光硬化性組成物を光学的立体造形法に付すことによって、速やかに所望の形状の立体造形物を得ることができる。上記立体造形物は、耐熱性及び機械特性に優れる。 Since the photo-curable composition for optical three-dimensional modeling of the present invention has the above-described configuration, it is excellent in curability when irradiated with light. By subjecting the photo-curable composition to an optical three-dimensional modeling method, A three-dimensionally shaped object having a desired shape can be obtained. The said three-dimensional molded item is excellent in heat resistance and mechanical characteristics.

<光学的立体造形用光硬化性組成物>
 本発明の光学的立体造形用光硬化性組成物(以下、単に「本発明の光硬化性組成物」と称する場合がある)は、(a)エポキシ化合物、(b)(メタ)アクリル化合物、及び(c)光重合開始剤を必須成分として含む、光学的立体造形に用いられる光硬化性組成物(光硬化性樹脂組成物)である。本発明の光硬化性組成物は、後述のように、(a)エポキシ化合物として分子内に脂環エポキシ基を有しカルボニル基を有しない化合物を必須成分として含有する。
<Photocurable composition for optical three-dimensional modeling>
The photo-curable composition for optical three-dimensional modeling of the present invention (hereinafter sometimes simply referred to as “the photo-curable composition of the present invention”) includes (a) an epoxy compound, (b) a (meth) acrylic compound, And (c) a photocurable composition (photocurable resin composition) used for optical three-dimensional modeling, containing a photopolymerization initiator as an essential component. As described later, the photocurable composition of the present invention contains (a) a compound having an alicyclic epoxy group in the molecule and having no carbonyl group as an essential component as an epoxy compound.

 なお、本明細書においては、(a)エポキシ化合物、(b)(メタ)アクリル化合物、(c)光重合開始剤を、それぞれ、成分(a)、成分(b)、成分(c)と称する場合がある。また、本明細書において「(メタ)アクリル」は、アクリル及び/又はメタクリル(アクリル及びメタクリルのいずれか一方又は両方)を意味するものとし、「(メタ)アクリロイル」等についても同様である。 In the present specification, (a) epoxy compound, (b) (meth) acryl compound, and (c) photopolymerization initiator are referred to as component (a), component (b), and component (c), respectively. There is a case. In the present specification, “(meth) acryl” means acryl and / or methacryl (any one or both of acryl and methacryl), and the same applies to “(meth) acryloyl” and the like.

[(a)エポキシ化合物]
 本発明の光硬化性組成物の必須成分である(a)エポキシ化合物は、分子内(一分子中)に1個以上のエポキシ基(オキシラニル基)を有する化合物である。但し、(a)エポキシ化合物には、(b)アクリル化合物に該当する化合物(即ち、分子内に1個以上のエポキシ基と1個以上の(メタ)アクリロイル基とを有する化合物)は含まれない。
[(A) Epoxy compound]
The (a) epoxy compound which is an essential component of the photocurable composition of the present invention is a compound having one or more epoxy groups (oxiranyl groups) in the molecule (in one molecule). However, the (a) epoxy compound does not include a compound corresponding to the (b) acrylic compound (that is, a compound having one or more epoxy groups and one or more (meth) acryloyl groups in the molecule). .

 (a)エポキシ化合物としては、例えば、脂環式エポキシ化合物、芳香族エポキシ化合物、脂肪族エポキシ化合物等が挙げられる。 (A) As an epoxy compound, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound etc. are mentioned, for example.

 上記脂環式エポキシ化合物は、分子内に1個以上の脂環(脂肪族炭化水素環)と1個以上のエポキシ基とを有する化合物である。上記脂環式エポキシ化合物としては、公知乃至慣用の脂環式エポキシ化合物を使用することができ、特に限定されないが、例えば、(i)分子内に脂環を構成する隣接する2つの炭素原子と酸素原子とで構成されるエポキシ基(「脂環エポキシ基」と称する)を有する化合物;(ii)脂環にエポキシ基が直接単結合で結合している化合物;(iii)分子内に脂環及びグリシジルエーテル基を有する化合物(グリシジルエーテル型エポキシ化合物)等が挙げられる。 The alicyclic epoxy compound is a compound having one or more alicyclic rings (aliphatic hydrocarbon rings) and one or more epoxy groups in the molecule. The alicyclic epoxy compound may be a known or commonly used alicyclic epoxy compound, and is not particularly limited. For example, (i) two adjacent carbon atoms constituting the alicyclic ring in the molecule and A compound having an epoxy group composed of an oxygen atom (referred to as an “alicyclic epoxy group”); (ii) a compound in which an epoxy group is directly bonded to the alicyclic ring by a single bond; (iii) an alicyclic ring in the molecule And a compound having a glycidyl ether group (glycidyl ether type epoxy compound) and the like.

 上記脂環式エポキシ化合物における脂環としては、例えば、シクロペンタン環、シクロヘキサン環、シクロオクタン環、シクロドデカン環等の単環の脂環(好ましくは3~15員、より好ましくは5員又は6員程度のシクロアルカン環等);デカリン環(パーヒドロナフタレン環)、パーヒドロインデン環(ビシクロ[4.3.0]ノナン環)、パーヒドロアントラセン環、パーヒドロフルオレン環、パーヒドロフェナントレン環、ノルボルナン環(ビシクロ[2.2.1]ヘプタン環)、イソボルナン環、アダマンタン環、ビシクロ[3.3.0]オクタン環、トリシクロ[5.2.1.02,6]デカン環、トリシクロ[6.2.1.02,7]ウンデカン環等の多環(2~4環程度)の脂環(縮合炭素環や橋架け炭素環等)等が挙げられる。また、上記脂環式エポキシ化合物が分子内に有する脂環には、例えば、上述の脂環エポキシ基を構成する脂環の意味も含まれる。 Examples of the alicyclic ring in the alicyclic epoxy compound include monocyclic alicyclic rings such as cyclopentane ring, cyclohexane ring, cyclooctane ring and cyclododecane ring (preferably 3 to 15 members, more preferably 5 or 6 members). A decaline ring (perhydronaphthalene ring), a perhydroindene ring (bicyclo [4.3.0] nonane ring), a perhydroanthracene ring, a perhydrofluorene ring, a perhydrophenanthrene ring, Norbornane ring (bicyclo [2.2.1] heptane ring), isobornane ring, adamantane ring, bicyclo [3.3.0] octane ring, tricyclo [5.2.1.0 2,6 ] decane ring, tricyclo [ 6.2.1.0 2,7 ] Polycyclic (about 2 to 4 rings) alicyclic ring (condensed carbocyclic ring, bridged carbocyclic ring, etc.) such as undecane ring. Moreover, the meaning of the alicyclic ring which comprises the above-mentioned alicyclic epoxy group is also contained in the alicyclic ring which the said alicyclic epoxy compound has in a molecule | numerator, for example.

 上述の(i)分子内に脂環エポキシ基を有する化合物としては、公知乃至慣用のものの中から任意に選択して使用することができる。(i)分子内に脂環エポキシ基を有する化合物における脂環エポキシ基としては、例えば、エポキシシクロペンチル基、3,4-エポキシシクロヘキシル基、3,4-エポキシトリシクロ[5.2.1.02,6]デカン8-(又は9)イル基(エポキシ化ジシクロペンタジエニル基)等が挙げられる。中でも上記脂環エポキシ基としては、立体造形物の耐熱性及び機械強度の観点で、3,4-エポキシシクロヘキシル基が好ましい。即ち、(i)分子内に脂環エポキシ基を有する化合物としては、3,4-エポキシシクロヘキシル基を有する化合物が好ましい。 The compound (i) having an alicyclic epoxy group in the molecule can be arbitrarily selected from known or commonly used compounds. (I) Examples of the alicyclic epoxy group in the compound having an alicyclic epoxy group in the molecule include an epoxycyclopentyl group, a 3,4-epoxycyclohexyl group, and 3,4-epoxytricyclo [5.2.1.0]. 2,6 ] decane 8- (or 9) yl group (epoxidized dicyclopentadienyl group) and the like. Among them, the alicyclic epoxy group is preferably a 3,4-epoxycyclohexyl group from the viewpoint of heat resistance and mechanical strength of the three-dimensional structure. That is, (i) the compound having an alicyclic epoxy group in the molecule is preferably a compound having a 3,4-epoxycyclohexyl group.

 本発明の光硬化性組成物は、硬化性、立体造形物の耐熱性及び機械物性の観点で、(a)エポキシ化合物の中でも、(i-1)脂環エポキシ基を有する化合物であって、分子内にカルボニル基を有しない化合物(即ち、分子内に脂環エポキシ基を有しカルボニル基を有しない化合物)を必須成分として含む。上述の分子内に脂環エポキシ基を有しカルボニル基を有しない化合物としては、硬化性、立体造形物の耐熱性及び機械物性の観点で、特に下記式(I-1)で表される化合物が特に好ましい。

Figure JPOXMLDOC01-appb-C000010
The photocurable composition of the present invention is a compound having (i-1) an alicyclic epoxy group among (a) epoxy compounds from the viewpoints of curability, heat resistance of a three-dimensional structure, and mechanical properties, A compound having no carbonyl group in the molecule (that is, a compound having an alicyclic epoxy group and no carbonyl group in the molecule) is included as an essential component. The compound having an alicyclic epoxy group in the molecule and not having a carbonyl group is particularly a compound represented by the following formula (I-1) from the viewpoints of curability, heat resistance of a three-dimensional structure, and mechanical properties. Is particularly preferred.
Figure JPOXMLDOC01-appb-C000010

 式(I-1)中、X1は、単結合、又はカルボニル基を有しない二価の基を示す。上記カルボニル基を有しない二価の基としては、例えば、二価の炭化水素基、炭素-炭素二重結合の一部又は全部がエポキシ化されたアルケニレン基、エーテル結合、これらが複数個連結した基等が挙げられる。 In formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. Examples of the divalent group having no carbonyl group include, for example, a divalent hydrocarbon group, an alkenylene group in which a part or all of a carbon-carbon double bond is epoxidized, an ether bond, and a plurality of these linked. Groups and the like.

 上記式(I-1)中のX1が単結合である化合物としては、3,4,3',4'-ジエポキシビシクロヘキシル(3,4,3',4'-ジエポキシビシクロヘキサン)が挙げられる。 The compound in which X 1 in the above formula (I-1) is a single bond includes 3,4,3 ′, 4′-diepoxybicyclohexyl (3,4,3 ′, 4′-diepoxybicyclohexane) Is mentioned.

 上記二価の炭化水素基としては、例えば、炭素数が1~18の直鎖又は分岐鎖状のアルキレン基、二価の脂環式炭化水素基等が挙げられる。炭素数が1~18の直鎖又は分岐鎖状のアルキレン基としては、例えば、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基等が挙げられる。上記二価の脂環式炭化水素基としては、例えば、1,2-シクロペンチレン基、1,3-シクロペンチレン基、シクロペンチリデン基、1,2-シクロヘキシレン基、1,3-シクロヘキシレン基、1,4-シクロヘキシレン基、シクロヘキシリデン基等の二価のシクロアルキレン基(シクロアルキリデン基を含む)等が挙げられる。 Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms, and a divalent alicyclic hydrocarbon group. Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group. Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclopentylene group, And divalent cycloalkylene groups (including cycloalkylidene groups) such as cyclohexylene group, 1,4-cyclohexylene group and cyclohexylidene group.

 上記炭素-炭素二重結合の一部又は全部がエポキシ化されたアルケニレン基(「エポキシ化アルケニレン基」と称する場合がある)におけるアルケニレン基としては、例えば、ビニレン基、プロペニレン基、1-ブテニレン基、2-ブテニレン基、ブタジエニレン基、ペンテニレン基、ヘキセニレン基、ヘプテニレン基、オクテニレン基等の炭素数2~8の直鎖又は分岐鎖状のアルケニレン基等が挙げられる。特に、上記エポキシ化アルケニレン基としては、炭素-炭素二重結合の全部がエポキシ化されたアルケニレン基が好ましく、より好ましくは炭素-炭素二重結合の全部がエポキシ化された炭素数2~4のアルケニレン基である。 Examples of the alkenylene group in the alkenylene group in which part or all of the carbon-carbon double bond is epoxidized (sometimes referred to as “epoxidized alkenylene group”) include, for example, vinylene group, propenylene group, 1-butenylene group And straight-chain or branched alkenylene groups having 2 to 8 carbon atoms such as 2-butenylene group, butadienylene group, pentenylene group, hexenylene group, heptenylene group, octenylene group and the like. In particular, the epoxidized alkenylene group is preferably an alkenylene group in which all of the carbon-carbon double bonds are epoxidized, more preferably 2 to 4 carbon atoms in which all of the carbon-carbon double bonds are epoxidized. Alkenylene group.

 上述の(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物としては、特に光硬化性組成物の硬化性の観点で、特に、X1が単結合;炭素数1~6の直鎖又は分岐鎖状のアルキレン基;炭素数2~4のエポキシ化アルケニレン基、又は;炭素数1~4の直鎖又は分岐鎖状のアルキレン基の1以上とエーテル結合(-O-)の1以上とが連結して形成された総炭素数2~10の二価の基である化合物が好ましく、より好ましくは3,4,3',4'-ジエポキシビシクロヘキシル、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、1,2-ビス(3,4-エポキシシクロヘキシル)エタン、2,3-ビス(3,4-エポキシシクロヘキシル)オキシラン、ビス(3,4-エポキシシクロヘキシルメチル)エーテルである。 As the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group, particularly from the viewpoint of curability of the photocurable composition, X 1 is a single bond; A linear or branched alkylene group having ˜6; an epoxidized alkenylene group having 2 to 4 carbon atoms; or one or more linear or branched alkylene groups having 1 to 4 carbon atoms and an ether bond (—O A compound having a total number of 2 to 10 carbon atoms formed by linking one or more of-), more preferably 3,4,3 ', 4'-diepoxybicyclohexyl, 2, 2-bis (3,4-epoxycyclohexyl) propane, 1,2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, bis (3,4-epoxy (Cyclohexylmethyl) ether is there.

 本発明の光硬化性組成物は、脂環式エポキシ化合物として、(i-2)脂環エポキシ基を有する化合物であって、分子内にカルボニル基を有する化合物(即ち、分子内に脂環エポキシ基及びカルボニル基を有する化合物)を含んでいてもよい。特に、硬化性と、立体造形物の耐熱性及び機械物性とのバランスの観点で、本発明の光硬化性組成物は、(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物と、(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物の両方を含むことが好ましい。 The photocurable composition of the present invention includes (i-2) a compound having an alicyclic epoxy group as an alicyclic epoxy compound, and a compound having a carbonyl group in the molecule (that is, an alicyclic epoxy compound in the molecule). A compound having a group and a carbonyl group). In particular, from the viewpoint of balance between curability, heat resistance and mechanical properties of a three-dimensional structure, the photocurable composition of the present invention has (i-1) an alicyclic epoxy group in the molecule and a carbonyl group. It is preferable to include both a compound having no aliquot and a compound (i-2) having an alicyclic epoxy group and a carbonyl group in the molecule.

 上述の(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物としては、特に立体造形物の耐熱性及び機械物性のバランスの観点で、特に下記式(I-2)で表される化合物が好ましい。

Figure JPOXMLDOC01-appb-C000011
The compound (i-2) having an alicyclic epoxy group and a carbonyl group in the molecule is particularly represented by the following formula (I-2) from the viewpoint of the balance between the heat resistance and mechanical properties of the three-dimensional structure. Are preferred.
Figure JPOXMLDOC01-appb-C000011

 式(I-2)中、X2は、カルボニル基を有する二価の基を示す。上記カルボニル基を有する二価の基としては、例えば、カルボニル基、エステル結合、アミド結合、カーボネート結合、これらが複数個連結した基等のカルボニル基を有する二価の基;これらのカルボニル基を有する二価の基の1以上と、カルボニル基を有しない二価の基の1以上とが連結して形成された二価の基等が挙げられる。上記カルボニル基を有しない二価の基としては、例えば、二価の炭化水素基、エポキシ化アルケニレン基、エーテル結合、これらが複数個連結した基等の上記式(I-1)中のX1として例示した基等が挙げられる。 In formula (I-2), X 2 represents a divalent group having a carbonyl group. Examples of the divalent group having a carbonyl group include a carbonyl group, an ester bond, an amide bond, a carbonate bond, a divalent group having a carbonyl group such as a group in which a plurality of these are linked; Examples thereof include a divalent group formed by linking one or more divalent groups and one or more divalent groups having no carbonyl group. Examples of the divalent group having no carbonyl group include X 1 in the above formula (I-1) such as a divalent hydrocarbon group, an epoxidized alkenylene group, an ether bond, and a group in which a plurality of these are connected. And the groups exemplified as above.

 上記式(I-2)で表される化合物の代表的な例としては、下記式(I-2-1)~(I-2-10)で表される化合物等が挙げられる。なお、下記式(I-2-5)、(I-2-7)中のl、mは、それぞれ1~30の整数を表す。下記式(I-2-5)中のRは炭素数1~8のアルキレン基であり、メチレン基、エチレン基、プロピレン基、イソプロピレン基、ブチレン基、イソブチレン基、s-ブチレン基、ペンチレン基、ヘキシレン基、ヘプチレン基、オクチレン基等の直鎖又は分岐鎖状のアルキレン基が挙げられる。これらの中でも、メチレン基、エチレン基、プロピレン基、イソプロピレン基等の炭素数1~3の直鎖又は分岐鎖状のアルキレン基が好ましい。下記式(I-2-9)、(I-2-10)中のn1~n6は、それぞれ1~30の整数を示す。

Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013
Representative examples of the compound represented by the above formula (I-2) include compounds represented by the following formulas (I-2-1) to (I-2-10). In the following formulas (I-2-5) and (I-2-7), l and m each represents an integer of 1 to 30. R in the following formula (I-2-5) is an alkylene group having 1 to 8 carbon atoms, and includes a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, an s-butylene group, and a pentylene group. , A linear or branched alkylene group such as a hexylene group, a heptylene group, and an octylene group. Among these, linear or branched alkylene groups having 1 to 3 carbon atoms such as a methylene group, an ethylene group, a propylene group, and an isopropylene group are preferable. In the following formulas (I-2-9) and (I-2-10), n1 to n6 each represents an integer of 1 to 30.
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013

 上記式(I-2)で表される化合物としては、立体造形物の耐熱性と機械物性とをより高いレベルで両立させる観点で、特に、上記式(I-2-1)で表される化合物、上記式(I-2-7)で表される化合物(特に、mが1である式(I-2-7)で表される化合物)が好ましく、より好ましくはmが1である式(I-2-7)で表される化合物である。 The compound represented by the above formula (I-2) is particularly represented by the above formula (I-2-1) from the viewpoint of achieving both the heat resistance and mechanical properties of the three-dimensional structure at a higher level. A compound represented by the above formula (I-2-7) (particularly a compound represented by the formula (I-2-7) in which m is 1), more preferably a compound in which m is 1. It is a compound represented by (I-2-7).

 上述の(ii)脂環にエポキシ基が直接単結合で結合している化合物としては、例えば、下記式(II)で表される化合物等が挙げられる。

Figure JPOXMLDOC01-appb-C000014
Examples of the compound (ii) in which the epoxy group is directly bonded to the alicyclic ring with a single bond include compounds represented by the following formula (II).
Figure JPOXMLDOC01-appb-C000014

 式(II)中、R'は、p価のアルコールの構造式からp個の水酸基(-OH)を除いた基(p価の有機基)であり、p、nはそれぞれ自然数を表す。p価のアルコール[R'(OH)p]としては、2,2-ビス(ヒドロキシメチル)-1-ブタノール等の多価アルコール(炭素数1~15のアルコール等)等が挙げられる。pは1~6が好ましく、nは1~30が好ましい。pが2以上の場合、それぞれの( )内(外側の括弧内)の基におけるnは同一でもよく異なっていてもよい。上記式(II)で表される化合物としては、具体的には、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン付加物[例えば、商品名「EHPE3150」((株)ダイセル製)等]等が挙げられる。 In the formula (II), R ′ is a group (p-valent organic group) obtained by removing p hydroxyl groups (—OH) from the structural formula of p-valent alcohol, and p and n each represent a natural number. Examples of the p-valent alcohol [R ′ (OH) p ] include polyhydric alcohols (such as alcohols having 1 to 15 carbon atoms) such as 2,2-bis (hydroxymethyl) -1-butanol. p is preferably 1 to 6, and n is preferably 1 to 30. When p is 2 or more, n in each group in () (inside the outer parenthesis) may be the same or different. Specific examples of the compound represented by the above formula (II) include 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol [for example, , Trade name “EHPE3150” (manufactured by Daicel Corporation), etc.].

 上述の(iii)分子内に脂環及びグリシジルエーテル基を有する化合物としては、例えば、脂環式アルコール(特に、脂環式多価アルコール)のグリシジルエーテルが挙げられる。より詳しくは、(iii)分子内に脂環及びグリシジルエーテル基を有する化合物としては、例えば、2,2-ビス[4-(2,3-エポキシプロポキシ)シクロへキシル]プロパン、2,2-ビス[3,5-ジメチル-4-(2,3-エポキシプロポキシ)シクロへキシル]プロパン等のビスフェノールA型エポキシ化合物を水素化した化合物(水素化ビスフェノールA型エポキシ化合物);ビス[o,o-(2,3-エポキシプロポキシ)シクロへキシル]メタン、ビス[o,p-(2,3-エポキシプロポキシ)シクロへキシル]メタン、ビス[p,p-(2,3-エポキシプロポキシ)シクロへキシル]メタン、ビス[3,5-ジメチル-4-(2,3-エポキシプロポキシ)シクロへキシル]メタン等のビスフェノールF型エポキシ化合物を水素化した化合物(水素化ビスフェノールF型エポキシ化合物);水素化ビフェノール型エポキシ化合物;水素化フェノールノボラック型エポキシ化合物;水素化クレゾールノボラック型エポキシ化合物;ビスフェノールAの水素化クレゾールノボラック型エポキシ化合物;水素化ナフタレン型エポキシ化合物;トリスフェノールメタンから得られるエポキシ化合物の水素化エポキシ化合物等が挙げられる。 Examples of the compound (iii) having an alicyclic ring and a glycidyl ether group in the molecule include glycidyl ethers of alicyclic alcohols (particularly, alicyclic polyhydric alcohols). More specifically, (iii) Examples of compounds having an alicyclic ring and a glycidyl ether group in the molecule include 2,2-bis [4- (2,3-epoxypropoxy) cyclohexyl] propane, 2,2- A compound obtained by hydrogenating a bisphenol A type epoxy compound such as bis [3,5-dimethyl-4- (2,3-epoxypropoxy) cyclohexyl] propane (hydrogenated bisphenol A type epoxy compound); bis [o, o -(2,3-epoxypropoxy) cyclohexyl] methane, bis [o, p- (2,3-epoxypropoxy) cyclohexyl] methane, bis [p, p- (2,3-epoxypropoxy) cyclo Hexyl] methane, bis [3,5-dimethyl-4- (2,3-epoxypropoxy) cyclohexyl] methane and other bisphenol F type epoxy Compound hydrogenated compound (hydrogenated bisphenol F type epoxy compound); Hydrogenated biphenol type epoxy compound; Hydrogenated phenol novolac type epoxy compound; Hydrogenated cresol novolak type epoxy compound; Hydrogenated cresol novolak type epoxy compound of bisphenol A; Examples thereof include hydrogenated naphthalene type epoxy compounds; hydrogenated epoxy compounds of epoxy compounds obtained from trisphenolmethane.

 上記芳香族エポキシ化合物としては、分子内に1個以上の芳香環と1個以上のエポキシ基とを有する公知乃至慣用の化合物を使用でき、特に限定されない。上記芳香族エポキシ化合物が有する芳香環としては、例えば、ベンゼン環、ビフェニル環、ナフタレン環、フルオレン環、アントラセン環、スチルベン環、ジベンゾチオフェン環、カルバゾール環等が挙げられる。 The aromatic epoxy compound is not particularly limited and may be a known or commonly used compound having one or more aromatic rings and one or more epoxy groups in the molecule. Examples of the aromatic ring that the aromatic epoxy compound has include a benzene ring, a biphenyl ring, a naphthalene ring, a fluorene ring, an anthracene ring, a stilbene ring, a dibenzothiophene ring, and a carbazole ring.

 上記芳香族エポキシ化合物としては、具体的には、例えば、ビスフェノール類[例えば、ビスフェノールA、ビスフェノールF、ビスフェノールS、フルオレンビスフェノール等]と、エピハロヒドリンとの縮合反応により得られるエピビスタイプグリシジルエーテル型エポキシ樹脂;これらのエピビスタイプグリシジルエーテル型エポキシ樹脂を上記ビスフェノール類とさらに付加反応させることにより得られる高分子量エピビスタイプグリシジルエーテル型エポキシ樹脂;フェノール類[例えば、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF、ビスフェノールS等]とアルデヒド[例えば、ホルムアルデヒド、アセトアルデヒド、ベンズアルデヒド、ヒドロキシベンズアルデヒド、サリチルアルデヒド等]とを縮合反応させて得られる多価アルコール類を、さらにエピハロヒドリンと縮合反応させることにより得られるノボラック・アルキルタイプグリシジルエーテル型エポキシ樹脂;フルオレン環の9位に2つのフェノール骨格が結合し、かつこれらフェノール骨格のヒドロキシ基から水素原子を除いた状態における酸素原子に、それぞれ、直接又はアルキレンオキシ基を介してグリシジル基が結合しているエポキシ化合物等が挙げられる。 Specific examples of the aromatic epoxy compound include, for example, an epibis type glycidyl ether type epoxy obtained by a condensation reaction of bisphenols [for example, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, etc.] and epihalohydrin. Resins; high molecular weight epibis type glycidyl ether type epoxy resins obtained by further addition reaction of these epibis type glycidyl ether type epoxy resins with the above bisphenols; phenols [for example, phenol, cresol, xylenol, resorcin, catechol Bisphenol A, bisphenol F, bisphenol S, etc.] and aldehydes [eg formaldehyde, acetaldehyde, benzaldehyde, hydroxybenzal A novolac alkyl type glycidyl ether type epoxy resin obtained by condensation reaction of polyhydric alcohols obtained by condensation reaction with hydride, salicylaldehyde, etc.] with epihalohydrin; two phenol skeletons at the 9-position of the fluorene ring And an epoxy compound in which a glycidyl group is bonded to an oxygen atom in a state where a hydrogen atom is removed from a hydroxy group of the phenol skeleton, either directly or via an alkyleneoxy group.

 上記脂肪族エポキシ化合物としては、分子内に芳香環や脂環等の環状構造を有しない公知乃至慣用のエポキシ化合物を使用でき、特に限定されない。上記脂肪族エポキシ化合物としては、例えば、q価の環状構造を有しないアルコール(qは自然数である)のグリシジルエーテル;一価又は多価カルボン酸[例えば、酢酸、プロピオン酸、酪酸、ステアリン酸、アジピン酸、セバシン酸、マレイン酸、イタコン酸等]のグリシジルエステル;エポキシ化亜麻仁油、エポキシ化大豆油、エポキシ化ひまし油等の二重結合を有する油脂のエポキシ化物;エポキシ化ポリブタジエン等のポリオレフィン(ポリアルカジエンを含む)のエポキシ化物等が挙げられる。なお、上記q価の環状構造を有しないアルコールとしては、例えば、メタノール、エタノール、1-プロピルアルコール、イソプロピルアルコール、1-ブタノール等の一価のアルコール;エチレングリコール、1,2-プロパンジオール、1,3-プロパンジオール、1,4-ブタンジオール、ネオペンチルグリコール、1,6-ヘキサンジオール、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ジプロピレングリコール、ポリエチレングリコール、ポリプロピレングリコール等の二価のアルコール;グリセリン、ジグリセリン、エリスリトール、トリメチロールエタン、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、ソルビトール等の三価以上の多価アルコール等が挙げられる。また、q価のアルコールは、ポリエーテルポリオール、ポリエステルポリオール、ポリカーボネートポリオール、ポリオレフィンポリオール等であってもよい。 The aliphatic epoxy compound is not particularly limited, and any known or commonly used epoxy compound having no cyclic structure such as an aromatic ring or an alicyclic ring in the molecule can be used. Examples of the aliphatic epoxy compound include a glycidyl ether of an alcohol having no q-valent cyclic structure (q is a natural number); a monovalent or polyvalent carboxylic acid [for example, acetic acid, propionic acid, butyric acid, stearic acid, Adipic acid, sebacic acid, maleic acid, itaconic acid, etc.] glycidyl ester; epoxidized oils and fats having double bonds such as epoxidized linseed oil, epoxidized soybean oil, epoxidized castor oil; polyolefins such as epoxidized polybutadiene (poly Epoxidized product of alkadiene). Examples of the alcohol having no q-valent cyclic structure include monohydric alcohols such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol and 1-butanol; ethylene glycol, 1,2-propanediol, 1 Divalent alcohols such as 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, polyethylene glycol, polypropylene glycol; Examples include trihydric or higher polyhydric alcohols such as glycerin, diglycerin, erythritol, trimethylolethane, trimethylolpropane, pentaerythritol, dipentaerythritol, and sorbitol. That. The q-valent alcohol may be polyether polyol, polyester polyol, polycarbonate polyol, polyolefin polyol, or the like.

 (a)エポキシ化合物としては、中でも特に、光硬化性組成物の硬化性、立体造形物の耐熱性及び機械特性の観点で、(i)分子内に脂環エポキシ基を有する化合物、芳香族エポキシ化合物、(iii)分子内に脂環及びグリシジルエーテル基を有する化合物が好ましく、より好ましくは、(i)分子内に脂環エポキシ基を有する化合物、(iii)分子内に脂環及びグリシジルエーテル基を有する化合物である。特に、本発明の光硬化性組成物は、(i)分子内に脂環エポキシ基を有する化合物と(iii)分子内に脂環及びグリシジルエーテル基を有する化合物との両方を含むことが好ましい。なお、(i)分子内に脂環エポキシ基を有する化合物としては、上述のように、(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物と、(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物の両方を含むことが好ましい。 (A) As an epoxy compound, in particular, from the viewpoint of curability of a photocurable composition, heat resistance of a three-dimensional structure, and mechanical properties, (i) a compound having an alicyclic epoxy group in the molecule, an aromatic epoxy Compound, (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule is preferred, more preferably (i) a compound having an alicyclic epoxy group in the molecule, (iii) an alicyclic ring and a glycidyl ether group in the molecule It is a compound which has this. In particular, the photocurable composition of the present invention preferably contains both (i) a compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule. As described above, (i) a compound having an alicyclic epoxy group in the molecule includes (i-1) a compound having an alicyclic epoxy group in the molecule and having no carbonyl group, and (i-2) ) It is preferable to include both a compound having an alicyclic epoxy group and a carbonyl group in the molecule.

 本発明の光硬化性組成物において(a)エポキシ化合物は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。また、(a)エポキシ化合物は、公知乃至慣用の方法により製造できる。なお、(a)エポキシ化合物としては、例えば、商品名「セロキサイド2021P」、「エポリードGT401」(以上、(株)ダイセル製);商品名「YX-8000」(三菱化学(株)製)等の市販品を使用することもできる。 In the photocurable composition of the present invention, the (a) epoxy compound can be used alone or in combination of two or more. The (a) epoxy compound can be produced by a known or conventional method. Examples of the (a) epoxy compound include trade names “Celoxide 2021P”, “Epolide GT 401” (manufactured by Daicel Corporation); trade names “YX-8000” (manufactured by Mitsubishi Chemical Corporation), and the like. Commercial products can also be used.

 本発明の光硬化性組成物における(a)エポキシ化合物の含有量(配合量)は、特に限定されないが、光硬化性組成物の全量(100重量%)に対して、30~95重量%が好ましく、より好ましくは40~90重量%、さらに好ましくは50~85重量%である。含有量を30重量%以上とすることにより、立体造形物の寸法精度、耐熱性及び機械物性がより向上する傾向がある。一方、含有量を95重量%以下とすることにより、光硬化性組成物の硬化性がより向上する傾向がある。 The content (blending amount) of the epoxy compound (a) in the photocurable composition of the present invention is not particularly limited, but is 30 to 95% by weight with respect to the total amount (100% by weight) of the photocurable composition. More preferred is 40 to 90% by weight, still more preferred is 50 to 85% by weight. By setting the content to 30% by weight or more, there is a tendency that the dimensional accuracy, heat resistance, and mechanical properties of the three-dimensional structure are further improved. On the other hand, when the content is 95% by weight or less, the curability of the photocurable composition tends to be further improved.

 本発明の光硬化性組成物に含まれる(a)エポキシ化合物の全量(100重量%)に対する脂環式エポキシ化合物((a)エポキシ化合物である脂環式エポキシ化合物)の割合は、特に限定されないが、60重量%以上(例えば、60~100重量%)が好ましく、より好ましくは70~95重量%、さらに好ましくは80~90重量%である。上記割合を60重量%以上とすることにより、立体造形物の耐熱性がより向上する傾向がある。 The ratio of the alicyclic epoxy compound ((a) alicyclic epoxy compound which is an epoxy compound) to the total amount (100% by weight) of the (a) epoxy compound contained in the photocurable composition of the present invention is not particularly limited. However, it is preferably 60% by weight or more (for example, 60 to 100% by weight), more preferably 70 to 95% by weight, and still more preferably 80 to 90% by weight. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 60 weight% or more.

 本発明の光硬化性組成物が(a)エポキシ化合物として、(i)分子内に脂環エポキシ基を有する化合物と(iii)分子内に脂環及びグリシジルエーテル基を有する化合物の両方を含む場合、(i)分子内に脂環エポキシ基を有する化合物と(iii)分子内に脂環及びグリシジルエーテル基を有する化合物の全量(100重量%)に対する(i)分子内に脂環エポキシ基を有する化合物の割合は、特に限定されないが、60~95重量%が好ましく、より好ましくは65~90重量%、さらに好ましくは70~90重量%である。上記割合を60重量%以上とすることにより、立体造形物の耐熱性がより向上する傾向がある。一方、上記割合を95重量%以下とすることにより、立体造形物の機械物性がより向上する傾向がある。 When the photocurable composition of the present invention includes (a) an epoxy compound that includes both (i) a compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule. , (I) having an alicyclic epoxy group in the molecule relative to the total amount (100% by weight) of the compound having an alicyclic epoxy group in the molecule and (iii) a compound having an alicyclic ring and a glycidyl ether group in the molecule The proportion of the compound is not particularly limited, but is preferably 60 to 95% by weight, more preferably 65 to 90% by weight, and still more preferably 70 to 90% by weight. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 60 weight% or more. On the other hand, when the ratio is 95% by weight or less, the mechanical properties of the three-dimensional modeled object tend to be further improved.

 本発明の光硬化性組成物に含まれる(a)エポキシ化合物の全量(100重量%)に対する(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物の割合は、特に限定されないが、1~50重量%が好ましく、より好ましくは5~40重量%、さらに好ましくは10~30重量%である。上記割合を1重量%以上とすることにより、光硬化性組成物の硬化性がより向上する傾向がある。一方、上記割合を50重量%以下とすることにより、立体造形物の機械物性がより向上する傾向がある。 The ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group with respect to the total amount (100% by weight) of the (a) epoxy compound contained in the photocurable composition of the present invention is Although not limited, it is preferably 1 to 50% by weight, more preferably 5 to 40% by weight, and still more preferably 10 to 30% by weight. When the ratio is 1% by weight or more, the curability of the photocurable composition tends to be further improved. On the other hand, when the ratio is 50% by weight or less, the mechanical properties of the three-dimensional structure tend to be further improved.

 本発明の光硬化性組成物が(i)分子内に脂環エポキシ基を有する化合物として、(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物と(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物の両方を含む場合、(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物と(i-2)分子内に脂環エポキシ基及びカルボニル基を有する化合物の全量(100重量%)に対する(i-1)分子内に脂環エポキシ基を有しカルボニル基を有しない化合物の割合は、特に限定されないが、5~50重量%が好ましく、より好ましくは8~40重量%、さらに好ましくは10~30重量%である。上記割合を5重量%以上とすることにより、光硬化性組成物の硬化性がより向上する傾向がある。一方、上記割合を50重量%以下とすることにより、光硬化性組成物の硬化性と立体造形物の機械物性とがバランスよく向上する傾向がある。 The photocurable composition of the present invention includes (i) a compound having an alicyclic epoxy group in the molecule and (i-1) a compound having an alicyclic epoxy group in the molecule and no carbonyl group (i-2). ) When both a compound having an alicyclic epoxy group and a carbonyl group are included in the molecule, (i-1) a compound having an alicyclic epoxy group in the molecule and not having a carbonyl group and (i-2) The ratio of the compound (i-1) having an alicyclic epoxy group in the molecule and not having a carbonyl group with respect to the total amount (100% by weight) of the compound having an alicyclic epoxy group and a carbonyl group is not particularly limited. It is preferably 50% by weight, more preferably 8 to 40% by weight, still more preferably 10 to 30% by weight. There exists a tendency for the sclerosis | hardenability of a photocurable composition to improve more by making the said ratio into 5 weight% or more. On the other hand, when the ratio is 50% by weight or less, the curability of the photocurable composition and the mechanical properties of the three-dimensional structure tend to be improved in a balanced manner.

[その他のカチオン重合性化合物]
 本発明の光硬化性組成物は、(a)エポキシ化合物以外のカチオン重合性化合物(「その他のカチオン重合性化合物」と称する場合がある)を含んでいてもよい。その他のカチオン重合性化合物としては、例えば、オキセタン化合物(分子内に1個以上のオキセタニル基を有する化合物)、ビニルエーテル化合物(分子内に1個以上のビニルエーテル基を有する化合物)等が挙げられる。
[Other cationic polymerizable compounds]
The photocurable composition of the present invention may contain (a) a cationically polymerizable compound other than the epoxy compound (sometimes referred to as “other cationically polymerizable compound”). Examples of other cationically polymerizable compounds include oxetane compounds (compounds having one or more oxetanyl groups in the molecule), vinyl ether compounds (compounds having one or more vinyl ether groups in the molecule), and the like.

 上記オキセタン化合物としては、具体的には、例えば、3,3-ビス(ビニルオキシメチル)オキセタン、3-エチル-3-(ヒドロキシメチル)オキセタン、3-エチル-3-(2-エチルヘキシルオキシメチル)オキセタン、3-エチル-3-[(フェノキシ)メチル]オキセタン、3-エチル-3-(ヘキシルオキシメチル)オキセタン、3-エチル-3-(クロロメチル)オキセタン、3,3-ビス(クロロメチル)オキセタン、1,4-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]ベンゼン、ビス{[1-エチル(3-オキセタニル)]メチル}エーテル、4,4'-ビス[(3-エチル-3-オキセタニル)メトキシメチル]ビシクロヘキシル、1,4-ビス[(3-エチル-3-オキセタニル)メトキシメチル]シクロヘキサン、1,4-ビス{〔(3-エチル-3-オキセタニル)メトキシ〕メチル}ベンゼン、3-エチル-3{〔(3-エチルオキセタン-3-イル)メトキシ〕メチル)}オキセタン、キシリレンビスオキセタン、3-エチル-3-{[3-(トリエトキシシリル)プロポキシ]メチル}オキセタン、オキセタニルシルセスキオキサン、フェノールノボラックオキセタン等が挙げられる。 Specific examples of the oxetane compound include 3,3-bis (vinyloxymethyl) oxetane, 3-ethyl-3- (hydroxymethyl) oxetane, and 3-ethyl-3- (2-ethylhexyloxymethyl). Oxetane, 3-ethyl-3-[(phenoxy) methyl] oxetane, 3-ethyl-3- (hexyloxymethyl) oxetane, 3-ethyl-3- (chloromethyl) oxetane, 3,3-bis (chloromethyl) Oxetane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, bis {[1-ethyl (3-oxetanyl)] methyl} ether, 4,4′-bis [(3-ethyl- 3-Oxetanyl) methoxymethyl] bicyclohexyl, 1,4-bis [(3-ethyl-3-oxetanyl) methoxymethyl ] Cyclohexane, 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl)} oxetane, xyl Examples include lenbisoxetane, 3-ethyl-3-{[3- (triethoxysilyl) propoxy] methyl} oxetane, oxetanylsilsesquioxane, phenol novolac oxetane, and the like.

 上記ビニルエーテル化合物としては、具体的には、例えば、2-ヒドロキシエチルビニルエーテル、3-ヒドロキシプロピルビニルエーテル、2-ヒドロキシプロピルビニルエーテル、2-ヒドロキシイソプロピルビニルエーテル、4-ヒドロキシブチルビニルエーテル、3-ヒドロキシブチルビニルエーテル、2-ヒドロキシブチルビニルエーテル、3-ヒドロキシイソブチルビニルエーテル、2-ヒドロキシイソブチルビニルエーテル、1-メチル-3-ヒドロキシプロピルビニルエーテル、1-メチル-2-ヒドロキシプロピルビニルエーテル、1-ヒドロキシメチルプロピルビニルエーテル、4-ヒドロキシシクロヘキシルビニルエーテル、1,6-ヘキサンジオールモノビニルエーテル、1,6-ヘキサンジオールジビニルエーテル、1,4-シクロヘキサンジメタノールモノビニルエーテル、1,4-シクロヘキサンジメタノールジビニルエーテル、1,3-シクロヘキサンジメタノールモノビニルエーテル、1,3-シクロヘキサンジメタノールジビニルエーテル、1,2-シクロヘキサンジメタノールモノビニルエーテル、1,2-シクロヘキサンジメタノールジビニルエーテル、p-キシレングリコールモノビニルエーテル、p-キシレングリコールジビニルエーテル、m-キシレングリコールモノビニルエーテル、m-キシレングリコールジビニルエーテル、o-キシレングリコールモノビニルエーテル、o-キシレングリコールジビニルエーテル、ジエチレングリコールモノビニルエーテル、ジエチレングリコールジビニルエーテル、トリエチレングリコールモノビニルエーテル、トリエチレングリコールジビニルエーテル、テトラエチレングリコールモノビニルエーテル、テトラエチレングリコールジビニルエーテル、ペンタエチレングリコールモノビニルエーテル、ペンタエチレングリコールジビニルエーテル、オリゴエチレングリコールモノビニルエーテル、オリゴエチレングリコールジビニルエーテル、ポリエチレングリコールモノビニルエーテル、ポリエチレングリコールジビニルエーテル、ジプロピレングリコールモノビニルエーテル、ジプロピレングリコールジビニルエーテル、トリプロピレングリコールモノビニルエーテル、トリプロピレングリコールジビニルエーテル、テトラプロピレングリコールモノビニルエーテル、テトラプロピレングリコールジビニルエーテル、ペンタプロピレングリコールモノビニルエーテル、ペンタプロピレングリコールジビニルエーテル、オリゴプロピレングリコールモノビニルエーテル、オリゴプロピレングリコールジビニルエーテル、ポリプロピレングリコールモノビニルエーテル、ポリプロピレングリコールジビニルエーテル、イソソルバイドジビニルエーテル、オキサノルボルネンジビニルエーテル、フェニルビニルエーテル、n-ブチルビニルエーテル、オクチルビニルエーテル、シクロヘキシルビニルエーテル、ハイドロキノンジビニルエーテル、1,4-ブタンジオールジビニルエーテル、シクロヘキサンジメタノールジビニルエーテル等が挙げられる。 Specific examples of the vinyl ether compound include 2-hydroxyethyl vinyl ether, 3-hydroxypropyl vinyl ether, 2-hydroxypropyl vinyl ether, 2-hydroxyisopropyl vinyl ether, 4-hydroxybutyl vinyl ether, 3-hydroxybutyl vinyl ether, 2 -Hydroxybutyl vinyl ether, 3-hydroxyisobutyl vinyl ether, 2-hydroxyisobutyl vinyl ether, 1-methyl-3-hydroxypropyl vinyl ether, 1-methyl-2-hydroxypropyl vinyl ether, 1-hydroxymethylpropyl vinyl ether, 4-hydroxycyclohexyl vinyl ether, 1,6-hexanediol monovinyl ether, 1,6-hexanediol divinyl ether 1,4-cyclohexanedimethanol monovinyl ether, 1,4-cyclohexanedimethanol divinyl ether, 1,3-cyclohexanedimethanol monovinyl ether, 1,3-cyclohexanedimethanol divinyl ether, 1,2-cyclohexanedimethanol mono Vinyl ether, 1,2-cyclohexanedimethanol divinyl ether, p-xylene glycol monovinyl ether, p-xylene glycol divinyl ether, m-xylene glycol monovinyl ether, m-xylene glycol divinyl ether, o-xylene glycol monovinyl ether, o-xylene Glycol divinyl ether, diethylene glycol monovinyl ether, diethylene glycol divinyl ether, triethyleneglycol Monovinyl ether, triethylene glycol divinyl ether, tetraethylene glycol monovinyl ether, tetraethylene glycol divinyl ether, pentaethylene glycol monovinyl ether, pentaethylene glycol divinyl ether, oligoethylene glycol monovinyl ether, oligoethylene glycol divinyl ether, polyethylene glycol monovinyl ether, Polyethylene glycol divinyl ether, dipropylene glycol monovinyl ether, dipropylene glycol divinyl ether, tripropylene glycol monovinyl ether, tripropylene glycol divinyl ether, tetrapropylene glycol monovinyl ether, tetrapropylene glycol divinyl ether, penta Propylene glycol monovinyl ether, pentapropylene glycol divinyl ether, oligopropylene glycol monovinyl ether, oligopropylene glycol divinyl ether, polypropylene glycol monovinyl ether, polypropylene glycol divinyl ether, isosorbide divinyl ether, oxanorbornene divinyl ether, phenyl vinyl ether, n-butyl Examples thereof include vinyl ether, octyl vinyl ether, cyclohexyl vinyl ether, hydroquinone divinyl ether, 1,4-butanediol divinyl ether, and cyclohexane dimethanol divinyl ether.

 中でも、その他のカチオン重合性化合物としては、光硬化性組成物の硬化性及び硬化物の靱性向上の観点で、オキセタン化合物が好ましく、より好ましくは分子内に1個のオキセタン環を有するオキセタン化合物(単官能オキセタン化合物)である。 Among these, as the other cationic polymerizable compound, an oxetane compound is preferable from the viewpoint of improving the curability of the photocurable composition and the toughness of the cured product, and more preferably an oxetane compound having one oxetane ring in the molecule ( Monofunctional oxetane compound).

 なお、本発明の光硬化性組成物においてその他のカチオン重合性化合物は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。また、その他のカチオン重合性化合物は、公知乃至慣用の方法により製造できる。なお、その他のカチオン重合性化合物としては、例えば、商品名「アロンオキセタンOXT-101」(東亞合成(株)製)等の市販品を使用することもできる。 In addition, in the photocurable composition of the present invention, the other cationic polymerizable compounds can be used alone or in combination of two or more. Other cationically polymerizable compounds can be produced by known or conventional methods. As other cationically polymerizable compounds, for example, commercially available products such as trade name “Aron Oxetane OXT-101” (manufactured by Toagosei Co., Ltd.) can be used.

 本発明の光硬化性組成物におけるその他のカチオン重合性化合物の含有量(配合量)は、特に限定されないが、光硬化性組成物に含まれる(a)エポキシ化合物及びその他のカチオン重合性化合物の全量(100重量%)に対して、1~40重量%が好ましく、より好ましくは5~30重量%である。その他のカチオン重合性化合物の含有量を1重量%以上とすることにより、光硬化性組成物の硬化性がより向上する傾向がある。一方、その他のカチオン重合性化合物の含有量を40重量%以下とすることにより、立体造形物の耐熱性がより向上する傾向がある。 The content (blending amount) of the other cationic polymerizable compound in the photocurable composition of the present invention is not particularly limited, but the (a) epoxy compound and other cationic polymerizable compounds contained in the photocurable composition are not limited. The amount is preferably 1 to 40% by weight, more preferably 5 to 30% by weight, based on the total amount (100% by weight). By setting the content of the other cationic polymerizable compound to 1% by weight or more, the curability of the photocurable composition tends to be further improved. On the other hand, when the content of the other cationic polymerizable compound is 40% by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.

 本発明の光硬化性組成物におけるオキセタン化合物(特に、単官能オキセタン化合物)の含有量(配合量)は、特に限定されないが、(a)エポキシ化合物の全量100重量部に対して、5~30重量部が好ましく、より好ましくは8~20重量部である。オキセタン化合物(特に、単官能オキセタン化合物)の含有量を5重量部以上とすることにより、光硬化性組成物の硬化性及び硬化物の靱性がより向上する傾向がある。一方、オキセタン化合物(特に、単官能オキセタン化合物)の含有量を30重量部以下することにより、立体造形物の耐熱性がより向上する傾向がある。 The content (blending amount) of the oxetane compound (particularly monofunctional oxetane compound) in the photocurable composition of the present invention is not particularly limited, but is 5 to 30 with respect to 100 parts by weight of the total amount of (a) epoxy compound. Part by weight is preferred, and more preferably 8 to 20 parts by weight. By setting the content of the oxetane compound (particularly, the monofunctional oxetane compound) to 5 parts by weight or more, the curability of the photocurable composition and the toughness of the cured product tend to be further improved. On the other hand, when the content of the oxetane compound (particularly, the monofunctional oxetane compound) is 30 parts by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.

[(b)(メタ)アクリル化合物]
 本発明の光硬化性組成物における(b)(メタ)アクリル化合物は、分子内に1個以上の(メタ)アクリロイル基を有する化合物である。(b)(メタ)アクリル化合物が分子内に有する(メタ)アクリロイル基の数(総数)は、特に限定されないが、1~6個が好ましく、より好ましくは1~3個である。即ち、(b)(メタ)アクリル化合物は、分子内に1個の(メタ)アクリロイル基を有する単官能の(メタ)アクリル化合物であってもよいし、分子内に2個以上の(メタ)アクリロイル基を有する多官能の(メタ)アクリル化合物であってもよい。
[(B) (Meth) acrylic compound]
The (b) (meth) acrylic compound in the photocurable composition of the present invention is a compound having one or more (meth) acryloyl groups in the molecule. (B) The number (total number) of (meth) acryloyl groups contained in the molecule of the (meth) acrylic compound is not particularly limited, but is preferably 1 to 6, more preferably 1 to 3. That is, the (b) (meth) acrylic compound may be a monofunctional (meth) acrylic compound having one (meth) acryloyl group in the molecule, or two or more (meth) acrylic compounds in the molecule. It may be a polyfunctional (meth) acryl compound having an acryloyl group.

 (b)(メタ)アクリル化合物としては、例えば、脂環式(メタ)アクリル化合物、芳香族(メタ)アクリル化合物、脂肪族(メタ)アクリル化合物等が挙げられる。 (B) Examples of (meth) acrylic compounds include alicyclic (meth) acrylic compounds, aromatic (meth) acrylic compounds, and aliphatic (meth) acrylic compounds.

 上記脂環式(メタ)アクリル化合物は、分子内に1個以上の脂環(脂肪族炭化水素環)と1個以上の(メタ)アクリロイル基とを有する化合物である。上記脂環式(メタ)アクリル化合物が有する脂環としては、例えば、シクロペンタン環、シクロヘキサン環、シクロオクタン環、シクロドデカン環等の単環の脂環;デカリン環(パーヒドロナフタレン環)、パーヒドロインデン環(ビシクロ[4.3.0]ノナン環)、パーヒドロアントラセン環、パーヒドロフルオレン環、パーヒドロフェナントレン環、パーヒドロアセナフテン環、パーヒドロフェナレン環、ノルボルナン環(ビシクロ[2.2.1]ヘプタン環)、イソボルナン環、アダマンタン環、ビシクロ[3.3.0]オクタン環、トリシクロ[5.2.1.02,6]デカン環、トリシクロ[6.2.1.02,7]ウンデカン環等の多環の脂環(縮合炭素環や橋架け炭素環等)等が挙げられる。また、上記脂環式(メタ)アクリル化合物が分子内に有する脂環には、例えば、上述の脂環エポキシ基を構成する脂環の意味も含まれる。即ち、上記脂環式(メタ)アクリル化合物には、分子内に(メタ)アクリロイル基と脂環エポキシ基とを有する化合物も包含される。 The alicyclic (meth) acrylic compound is a compound having one or more alicyclic rings (aliphatic hydrocarbon rings) and one or more (meth) acryloyl groups in the molecule. Examples of the alicyclic ring that the alicyclic (meth) acrylic compound has include monocyclic alicyclic rings such as cyclopentane ring, cyclohexane ring, cyclooctane ring, cyclododecane ring; decalin ring (perhydronaphthalene ring), Hydroindene ring (bicyclo [4.3.0] nonane ring), perhydroanthracene ring, perhydrofluorene ring, perhydrophenanthrene ring, perhydroacenaphthene ring, perhydrophenalene ring, norbornane ring (bicyclo [2. 2.1] heptane ring), isobornane ring, adamantane ring, bicyclo [3.3.0] octane ring, tricyclo [5.2.1.0 2,6 ] decane ring, tricyclo [6.2.1.0. 2,7 ] Polycyclic alicyclic rings such as undecane rings (condensed carbocycles, bridged carbocycles, etc.) and the like. Moreover, the meaning of the alicyclic ring which comprises the above-mentioned alicyclic epoxy group is contained in the alicyclic ring which the said alicyclic (meth) acryl compound has in a molecule | numerator, for example. That is, the alicyclic (meth) acrylic compound includes a compound having a (meth) acryloyl group and an alicyclic epoxy group in the molecule.

 中でも、立体造形物の耐熱性の観点で、上記脂環式(メタ)アクリル化合物が分子内に有する脂環としては、多環の脂環(特に、橋架け炭素環)、脂環エポキシ基を構成する脂環が好ましい。即ち、上記脂環式(メタ)アクリル化合物としては、多環の脂環(特に、橋架け炭素環)を有する(メタ)アクリル化合物、脂環エポキシ基を有する(メタ)アクリル化合物が好ましく、より好ましくは脂環エポキシ基を有する(メタ)アクリル化合物である。なお、脂環エポキシ基を有する(メタ)アクリル化合物が有する脂環エポキシ基としては、例えば、エポキシシクロペンチル環、3,4-エポキシシクロヘキシル環、下記式で表される3,4-エポキシトリシクロ[5.2.1.02,6]デカン8-(又は9-)イル基等が挙げられる。中でも、3,4-エポキシシクロヘキシル環、3,4-エポキシトリシクロ[5.2.1.02,6]デカン8-(又は9-)イル基が好ましい。

Figure JPOXMLDOC01-appb-C000015
Among them, from the viewpoint of heat resistance of the three-dimensional model, the alicyclic (meth) acrylic compound has a polycyclic alicyclic ring (particularly a bridged carbocyclic ring) and an alicyclic epoxy group as the alicyclic ring in the molecule. The constituting alicyclic ring is preferred. That is, as the alicyclic (meth) acrylic compound, a (meth) acrylic compound having a polycyclic alicyclic ring (particularly, a bridging carbocyclic ring) or a (meth) acrylic compound having an alicyclic epoxy group is preferable. A (meth) acrylic compound having an alicyclic epoxy group is preferred. Examples of the alicyclic epoxy group that the (meth) acrylic compound having an alicyclic epoxy group has include an epoxycyclopentyl ring, a 3,4-epoxycyclohexyl ring, and a 3,4-epoxytricyclo [ 5.2.1.0 2,6 ] decane 8- (or 9-) yl group and the like. Of these, a 3,4-epoxycyclohexyl ring and a 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane 8- (or 9-) yl group are preferable.
Figure JPOXMLDOC01-appb-C000015

 上記脂環式(メタ)アクリル化合物としては、例えば、下記式(III)で表される化合物(単官能の脂環式(メタ)アクリル化合物)が挙げられる。

Figure JPOXMLDOC01-appb-C000016
Examples of the alicyclic (meth) acrylic compound include compounds represented by the following formula (III) (monofunctional alicyclic (meth) acrylic compounds).
Figure JPOXMLDOC01-appb-C000016

 上記式(III)中、Raは水素原子又はメチル基を示し;Yは、単結合、炭素数1~10のアルキレン基、又は、炭素数1~10のアルキレン基の1以上とエーテル結合(-O-)の1以上とが連結して形成された二価の基を示す。上述の炭素数1~10のアルキレン基としては、例えば、メチレン基、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ヘキサメチレン基等の炭素数1~10の直鎖又は分岐鎖状のアルキレン基等が挙げられる。 In the above formula (III), R a represents a hydrogen atom or a methyl group; Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or one or more alkylene groups having 1 to 10 carbon atoms and an ether bond ( A divalent group formed by linking one or more of —O—. Examples of the alkylene group having 1 to 10 carbon atoms include linear or branched alkylene having 1 to 10 carbon atoms such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, and a hexamethylene group. Groups and the like.

 上記式(III)中のYとしては、特に、単結合、炭素数1~6のアルキレン基、炭素数1~6のアルキレンオキシ基(酸素原子が右端)、又は、炭素数1~6のアルキレンオキシ基が複数個(例えば、2~20程度)結合して形成されたポリ(アルキレンオキシ)基(末端酸素原子が右端)が好ましい。 Y in the above formula (III) is particularly a single bond, an alkylene group having 1 to 6 carbon atoms, an alkyleneoxy group having 1 to 6 carbon atoms (the oxygen atom is at the right end), or an alkylene having 1 to 6 carbon atoms. A poly (alkyleneoxy) group (terminal oxygen atom at the right end) formed by bonding a plurality of oxy groups (for example, about 2 to 20) is preferred.

 上記式(III)中、環Zは、環状脂肪族炭化水素基、又は脂環エポキシ基を示す。上記環状脂肪族炭化水素基としては、例えば、シクロペンチル基、シクロヘキシル基、シクロオクチル基、シクロドデシル基等のシクロアルキル基;パーヒドロナフタレニル基、パーヒドロインデニル基(ビシクロ[4.3.0]ノニル基)、パーヒドロアントラセニル基、パーヒドロフルオレニル基、パーヒドロフェナントレニル基、パーヒドロアセナフテニル基、パーヒドロフェナントレニル基、ノルボルニル基(ビシクロ[2.2.1]ヘプチル基)、イソボルニル基、アダマンチル基、ビシクロ[3.3.0]オクチル基、トリシクロ[5.2.1.02,6]デシル基、トリシクロ[6.2.1.02,7]ウンデシル基等が挙げられる。上記脂環エポキシ基としては、例えば、エポキシシクロペンチル環、3,4-エポキシシクロヘキシル環、3,4-エポキシトリシクロ[5.2.1.02,6]デカン8-(又は9-)イル基等が挙げられる。 In the above formula (III), the ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group. Examples of the cycloaliphatic hydrocarbon group include a cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, and a cyclododecyl group; a perhydronaphthalenyl group, a perhydroindenyl group (bicyclo [4.3. 0] nonyl group), perhydroanthracenyl group, perhydrofluorenyl group, perhydrophenanthrenyl group, perhydroacenaphthenyl group, perhydrophenanthrenyl group, norbornyl group (bicyclo [2. 2.1] heptyl group), isobornyl group, adamantyl group, bicyclo [3.3.0] octyl group, tricyclo [5.2.1.0 2,6 ] decyl group, tricyclo [6.2.1.0 2,7 ] and the like. Examples of the alicyclic epoxy group include epoxycyclopentyl ring, 3,4-epoxycyclohexyl ring, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane 8- (or 9-) yl. Groups and the like.

 上記式(III)で表される化合物の具体例としては、例えば、下記式(III-1)~(III-3)で表される化合物等が挙げられる。

Figure JPOXMLDOC01-appb-C000017
[上記式(III-1)~(III-3)中、Ra及びYは、式(III)におけるものと同じ。] Specific examples of the compound represented by the above formula (III) include compounds represented by the following formulas (III-1) to (III-3).
Figure JPOXMLDOC01-appb-C000017
[In the above formulas (III-1) to (III-3), R a and Y are the same as those in formula (III). ]

 上記脂環式(メタ)アクリル化合物としては、より具体的には、例えば、シクロヘキシル(メタ)アクリレート、シクロヘキサンメタノール(メタ)アクリレート、1-アダマンタノール(メタ)アクリレート、1-アダマンタンメタノール(メタ)アクリレート、イソボルニル(メタ)アクリレート、トリシクロ[5.2.1.02,6]デカンメタノール(メタ)アクリレート[=ジシクロペンタニル(メタ)アクリレート]、ジシクロペンタニルオキシエチル(メタ)アクリレート等の単官能の脂環式(メタ)アクリル化合物;1,4-シクロヘキサンジオールジ(メタ)アクリレート、1,4-シクロヘキサンジメタノールジ(メタ)アクリレート、ビシクロ[2.2.1]ヘプタンジメタノールジ(メタ)アクリレート、1,3-アダマンタンジオールジ(メタ)アクリレート、1,3-アダマンタンジメタノールジ(メタ)アクリレート、トリシクロ[5.2.1.02,6]デカンジメタノールジ(メタ)アクリレート等の多官能の脂環式(メタ)アクリル化合物;3,4-エポキシトリシクロ[5.2.1.02,6]デカン-8-イル(メタ)アクリレート、3,4-エポキシトリシクロ[5.2.1.02,6]デカン-9-イル(メタ)アクリレート、3,4-エポキシシクロヘキシルメチル(メタ)アクリレート等が挙げられる。 More specifically, examples of the alicyclic (meth) acrylic compound include cyclohexyl (meth) acrylate, cyclohexanemethanol (meth) acrylate, 1-adamantanol (meth) acrylate, and 1-adamantanmethanol (meth) acrylate. , Isobornyl (meth) acrylate, tricyclo [5.2.1.0 2,6 ] decane methanol (meth) acrylate [= dicyclopentanyl (meth) acrylate], dicyclopentanyloxyethyl (meth) acrylate, etc. Monofunctional alicyclic (meth) acrylic compounds; 1,4-cyclohexanediol di (meth) acrylate, 1,4-cyclohexanedimethanol di (meth) acrylate, bicyclo [2.2.1] heptanedimethanol di ( (Meth) acrylate, 1,3-a Diamantane di (meth) acrylate, 1,3-adamantane dimethanol di (meth) acrylate, tricyclo [5.2.1.0 2,6] decanedimethanol di (meth) polyfunctional alicyclic acrylates such as (Meth) acrylic compound; 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl (meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, and the like.

 中でも、上記脂環式(メタ)アクリル化合物としては、立体造形物の耐熱性向上の観点で、上記式(III)で表される化合物が好ましく、より好ましくはジシクロペンタニル(メタ)アクリレート、3,4-エポキシトリシクロ[5.2.1.02,6]デカン-8-イル(メタ)アクリレート、3,4-エポキシトリシクロ[5.2.1.02,6]デカン-9-イル(メタ)アクリレート、3,4-エポキシシクロヘキシルメチル(メタ)アクリレートであり、さらに好ましくは3,4-エポキシトリシクロ[5.2.1.02,6]デカン-8-イル(メタ)アクリレート、3,4-エポキシトリシクロ[5.2.1.02,6]デカン-9-イル(メタ)アクリレートである。 Among them, the alicyclic (meth) acrylic compound is preferably a compound represented by the above formula (III), more preferably dicyclopentanyl (meth) acrylate, from the viewpoint of improving the heat resistance of the three-dimensional structure. 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl (meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane- 9-yl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) acrylate, more preferably 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl ( (Meth) acrylate, 3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl (meth) acrylate.

 上記芳香族(メタ)アクリル化合物は、分子内に1個以上の芳香環と1個以上の(メタ)アクリロイル基とを有する化合物である。上記芳香族(メタ)アクリル化合物が有する芳香環としては、例えば、ベンゼン環、ビフェニル環、ナフタレン環、フルオレン環、アントラセン環、スチルベン環、ジベンゾチオフェン環、カルバゾール環等が挙げられる。 The above aromatic (meth) acrylic compound is a compound having one or more aromatic rings and one or more (meth) acryloyl groups in the molecule. Examples of the aromatic ring that the aromatic (meth) acrylic compound has include a benzene ring, a biphenyl ring, a naphthalene ring, a fluorene ring, an anthracene ring, a stilbene ring, a dibenzothiophene ring, and a carbazole ring.

 上記芳香族(メタ)アクリル化合物としては、具体的には、例えば、ビスフェノール類(例えば、ビスフェノールA、ビスフェノールF、フルオレンビスフェノール等)の(メタ)アクリル酸エステル;上記ビスフェノール類のエチレンオキシド及び/又はプロピレンオキシドの付加体の(メタ)アクリル酸エステル;フルオレン環の9位に2つのフェノール骨格が結合し、かつこれら2つのフェノール骨格のヒドロキシ基から水素原子を除いた状態における酸素原子に、それぞれ直接又はアルキレンオキシ基を介して(メタ)アクリロイル基が結合している(メタ)アクリル酸エステル[ビスアリールフルオレン骨格を有する(メタ)アクリル酸エステル];ビフェノールの2つのヒドロキシ基から水素原子を除いた状態における酸素原子に、それぞれ、直接又はアルキレンオキシ基を介して(メタ)アクリロイル基が結合している(メタ)アクリル酸エステル等が挙げられる。 Specific examples of the aromatic (meth) acrylic compound include (meth) acrylic acid esters of bisphenols (for example, bisphenol A, bisphenol F, fluorene bisphenol, etc.); ethylene oxide and / or propylene of the bisphenols (Meth) acrylic acid ester of an adduct of oxide; two phenol skeletons are bonded to the 9-position of the fluorene ring, and oxygen atoms in the state in which a hydrogen atom is removed from the hydroxy groups of these two phenol skeletons are directly or (Meth) acrylic acid ester ((meth) acrylic acid ester having a bisarylfluorene skeleton) in which a (meth) acryloyl group is bonded via an alkyleneoxy group; a state in which a hydrogen atom is removed from two hydroxy groups of biphenol Oxygen field To, respectively, either directly or via a alkylene group (meth) acryloyl group is bonded (meth) acrylic acid ester.

 上記脂肪族(メタ)アクリル化合物としては、分子内に芳香環や脂環等の環状構造を有しない公知乃至慣用の(メタ)アクリル化合物を使用でき、特に限定されない。上記脂肪族(メタ)アクリル化合物としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、ノニル(メタ)アクリレート、デシル(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、ポリプロピレングリコール(メタ)アクリレート等の単官能の脂肪族(メタ)アクリル化合物;エチレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、1,9-ノナンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、グリセリンジ(又はトリ)(メタ)アクリレート、グリセリンのエチレンオキシド付加体のジ(又はトリ)(メタ)アクリレート、トリメチロールプロパンジ(又はトリ)(メタ)アクリレート、トリメチロールプロパンのエチレンオキシド付加体のジ(又はトリ)(メタ)アクリレート、ペンタエリスリトールジ(又はトリ、又はテトラ)(メタ)アクリレート、ペンタエリスリトールのエチレンオキシド付加体のジ(又はトリ、又はテトラ)(メタ)アクリレート、ジペンタエリスリトールジ(又はトリ、又はテトラ、又はペンタ、又はヘキサ)(メタ)アクリレート、ジペンタエリスリトールのエチレンオキシド付加体のジ(又はトリ、又はテトラ、又はペンタ、又はヘキサ)(メタ)アクリレート等の多官能の脂肪族(メタ)アクリル化合物等が挙げられる。 The aliphatic (meth) acrylic compound may be a known or commonly used (meth) acrylic compound having no cyclic structure such as an aromatic ring or alicyclic ring in the molecule, and is not particularly limited. Examples of the aliphatic (meth) acrylic compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, and decyl (meth) acrylate. Monofunctional aliphatic (meth) acrylic compounds such as polyethylene glycol (meth) acrylate and polypropylene glycol (meth) acrylate; ethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6 -Hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) Of acrylate, glycerin di (or tri) (meth) acrylate, di (or tri) (meth) acrylate of glycerin ethylene oxide adduct, trimethylolpropane di (or tri) (meth) acrylate, ethylene oxide adduct of trimethylolpropane Di (or tri) (meth) acrylate, pentaerythritol di (or tri or tetra) (meth) acrylate, di (or tri or tetra) (meth) acrylate of pentaerythritol ethylene oxide adduct, dipentaerythritol di ( Or tri-, tetra-, penta-, or hexa) (meth) acrylate, di- or tri-, tetra-, tetra-, penta-, or hexa) (meth) acrylate polyfunctional fats such as dipentaerythritol ethylene oxide adduct (Meth) acrylic compounds.

 (b)(メタ)アクリル化合物としては、中でも特に、立体造形物の機械特性の観点で、多環の脂環(特に、橋架け炭素環)を有する単官能の(メタ)アクリル化合物、脂環エポキシ基を有する単官能の(メタ)アクリル化合物、多官能の脂肪族(メタ)アクリル化合物が好ましく、より好ましくは式(III)で表される化合物、多官能の脂肪族(メタ)アクリル化合物である。特に、本発明の光硬化性組成物は、式(III)で表される化合物(Zが環状脂肪族炭化水素基であるもの、又はZが脂環エポキシ基であるもの)と多官能の脂肪族(メタ)アクリル化合物(特に、3又は4官能の脂肪族(メタ)アクリル化合物)との両方を含むことが好ましい。 As the (b) (meth) acrylic compound, in particular, from the viewpoint of the mechanical properties of the three-dimensional structure, a monofunctional (meth) acrylic compound or alicyclic ring having a polycyclic alicyclic ring (particularly a bridged carbocyclic ring). A monofunctional (meth) acrylic compound having an epoxy group and a polyfunctional aliphatic (meth) acrylic compound are preferable, more preferably a compound represented by the formula (III) and a polyfunctional aliphatic (meth) acrylic compound. is there. In particular, the photocurable composition of the present invention includes a compound represented by the formula (III) (one in which Z is a cyclic aliphatic hydrocarbon group or one in which Z is an alicyclic epoxy group) and a polyfunctional fat. It is preferable to include both a group (meth) acrylic compound (particularly a tri- or tetrafunctional aliphatic (meth) acrylic compound).

 本発明の光硬化性組成物において(b)(メタ)アクリル化合物は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。また、(b)(メタ)アクリル化合物は、公知乃至慣用の方法により製造できる。なお、(b)(メタ)アクリル化合物としては、例えば、商品名「FA-129AS」、「FA-513AS」(以上、日立化成工業(株)製);商品名「SR499」(サートマー社製);商品名「E-DCPA」、「サイクロマー」シリーズ(以上、(株)ダイセル製)等の市販品を使用することもできる。 In the photocurable composition of the present invention, the (b) (meth) acrylic compound can be used alone or in combination of two or more. The (b) (meth) acrylic compound can be produced by a known or common method. Examples of (b) (meth) acrylic compounds include trade names “FA-129AS” and “FA-513AS” (manufactured by Hitachi Chemical Co., Ltd.); trade names “SR499” (manufactured by Sartomer). Commercially available products such as trade names “E-DCPA”, “Cyclomer” series (manufactured by Daicel Co., Ltd.) can also be used.

 本発明の光硬化性組成物における(b)(メタ)アクリル化合物の含有量(配合量)は、特に限定されないが、(a)エポキシ化合物の全量100重量部に対して、5~50重量部が好ましく、より好ましくは10~40重量部、さらに好ましくは15~30重量部である。(b)(メタ)アクリル化合物の含有量を5重量部以上とすることにより、光硬化性組成物の硬化性がより向上する傾向がある。一方、(b)(メタ)アクリル化合物の含有量を50重量部以下とすることにより、立体造形物の耐熱性がより向上する傾向がある。 The content (blending amount) of (b) (meth) acrylic compound in the photocurable composition of the present invention is not particularly limited, but it is 5 to 50 parts by weight with respect to 100 parts by weight of the total amount of (a) epoxy compound. It is preferably 10 to 40 parts by weight, more preferably 15 to 30 parts by weight. (B) By making content of a (meth) acryl compound into 5 weight part or more, there exists a tendency which the sclerosis | hardenability of a photocurable composition improves more. On the other hand, when the content of the (b) (meth) acrylic compound is 50 parts by weight or less, the heat resistance of the three-dimensional structure tends to be further improved.

 本発明の光硬化性組成物が(b)(メタ)アクリル化合物として、多環の脂環(特に、橋架け炭素環)を有する単官能の(メタ)アクリル化合物(特に、Zが多環構造(特に、橋架け炭素環構造)を有する環状脂肪族炭化水素基である式(III)で表される化合物)を含む場合、該化合物の割合は、(b)(メタ)アクリル化合物の全量(100重量%)に対して、10~50重量%が好ましく、より好ましくは20~40重量%である。上記割合を10重量%以上とすることにより、立体造形物の耐熱性がより向上する傾向がある。一方、上記割合を50重量%以下とすることにより、立体造形物の機械物性がより向上する傾向がある。 The photocurable composition of the present invention is a monofunctional (meth) acrylic compound (in particular, Z is a polycyclic structure) having a polycyclic alicyclic ring (especially a bridged carbon ring) as the (b) (meth) acrylic compound. (In particular, a compound represented by the formula (III) which is a cyclic aliphatic hydrocarbon group having a bridged carbocyclic structure), the proportion of the compound is the total amount of (b) (meth) acrylic compound ( 100 to 50% by weight), preferably 10 to 50% by weight, more preferably 20 to 40% by weight. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 10 weight% or more. On the other hand, when the ratio is 50% by weight or less, the mechanical properties of the three-dimensional structure tend to be further improved.

 本発明の光硬化性組成物が(b)(メタ)アクリル化合物として、脂環エポキシ基を有する単官能の(メタ)アクリル化合物(特に、Zが脂環エポキシ基である式(III)で表される化合物)を含む場合、該化合物の割合は、(b)(メタ)アクリル化合物の全量(100重量%)に対して、10~50重量%が好ましく、より好ましくは20~40重量%である。上記割合を10重量%以上とすることにより、立体造形物の耐熱性がより向上する傾向がある。一方、上記割合を50重量%以下とすることにより、立体造形物の機械強度がより向上する傾向がある。 The photocurable composition of the present invention is a (b) (meth) acrylic compound having a monofunctional (meth) acrylic compound having an alicyclic epoxy group (particularly represented by the formula (III) wherein Z is an alicyclic epoxy group). The compound) is preferably 10 to 50% by weight, more preferably 20 to 40% by weight, based on the total amount of the (b) (meth) acrylic compound (100% by weight). is there. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 10 weight% or more. On the other hand, the mechanical strength of a three-dimensional molded item tends to be further improved by setting the ratio to 50% by weight or less.

 本発明の光硬化性組成物が(b)(メタ)アクリル化合物として、多官能の脂肪族(メタ)アクリル化合物(特に、3又は4官能の脂肪族(メタ)アクリル化合物)を含む場合、該化合物の割合は、(b)(メタ)アクリル化合物の全量(100重量%)に対して、40~80重量%が好ましく、より好ましくは50~70重量%である。上記割合を40重量%以上とすることにより、立体造形物の耐熱性がより向上する傾向がある。一方、上記割合を80重量%以下とすることにより、立体造形物の機械強度がより向上する傾向がある。 When the photocurable composition of the present invention contains a polyfunctional aliphatic (meth) acrylic compound (particularly a tri- or tetrafunctional aliphatic (meth) acrylic compound) as the (b) (meth) acrylic compound, The proportion of the compound is preferably 40 to 80% by weight, more preferably 50 to 70% by weight, based on the total amount (100% by weight) of the (b) (meth) acrylic compound. There exists a tendency for the heat resistance of a three-dimensional molded item to improve more by making the said ratio into 40 weight% or more. On the other hand, the mechanical strength of a three-dimensional molded item tends to be further improved by setting the ratio to 80% by weight or less.

[その他のラジカル重合性化合物]
 本発明の光硬化性組成物は、(b)(メタ)アクリル化合物以外のラジカル重合性化合物(「その他のラジカル重合性化合物」と称する場合がある)を含んでいてもよい。その他のラジカル重合性化合物としては、例えば、スチレン系化合物[例えば、スチレン、α-メチルスチレン等]、オレフィン系化合物[例えば、エチレン、プロピレン、イソブチレン、ブタジエン等]、ビニルエステル系化合物[例えば、酢酸ビニル等]等の公知乃至慣用のラジカル重合性化合物を使用することができる。
[Other radical polymerizable compounds]
The photocurable composition of the present invention may contain (b) a radical polymerizable compound other than the (meth) acrylic compound (sometimes referred to as “other radical polymerizable compound”). Other radical polymerizable compounds include, for example, styrene compounds [eg, styrene, α-methylstyrene, etc.], olefin compounds [eg, ethylene, propylene, isobutylene, butadiene, etc.], vinyl ester compounds [eg, acetic acid, etc. Known or commonly used radically polymerizable compounds such as vinyl etc. can be used.

 なお、本発明の光硬化性組成物においてその他のラジカル重合性化合物は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。本発明の光硬化性組成物はその他のラジカル重合性化合物を含まなくてもよい。また、その他のラジカル重合性化合物は、公知乃至慣用の方法により製造できる。なお、その他のラジカル重合性化合物としては、市販品を使用することもできる。 In addition, in the photocurable composition of this invention, another radically polymerizable compound can also be used individually by 1 type, and can also be used in combination of 2 or more type. The photocurable composition of the present invention may not contain other radical polymerizable compounds. Other radically polymerizable compounds can be produced by known or conventional methods. In addition, a commercial item can also be used as another radically polymerizable compound.

 本発明の光硬化性組成物におけるその他のラジカル重合性化合物の含有量(配合量)は、特に限定されないが、光硬化性組成物に含まれる(a)(メタ)アクリル化合物及びその他のラジカル重合性化合物の全量(100重量%)に対して、10重量%以下(例えば、0~5重量%)が好ましく、より好ましくは3重量%以下である。その他のラジカル重合性化合物の含有量を10重量%以下とすることにより、立体造形物の耐熱性がより向上し、着色等の不具合が抑制される傾向がある。 The content (blending amount) of the other radical polymerizable compound in the photocurable composition of the present invention is not particularly limited, but the (a) (meth) acrylic compound and other radical polymerization contained in the photocurable composition are not particularly limited. It is preferably 10% by weight or less (for example, 0 to 5% by weight), more preferably 3% by weight or less, based on the total amount of the active compound (100% by weight). By setting the content of the other radical polymerizable compound to 10% by weight or less, there is a tendency that the heat resistance of the three-dimensional structure is further improved and defects such as coloring are suppressed.

[(c)光重合開始剤]
 本発明の光硬化性組成物の必須成分である(c)光重合開始剤は、光照射により光硬化性組成物中の成分(a)や成分(b)等の重合性化合物(カチオン重合性化合物、ラジカル重合性化合物)の重合反応を開始乃至進行させる化合物である。(c)光重合開始剤としては、公知乃至慣用の光重合開始剤を使用することができ、特に限定されないが、光カチオン重合開始剤、光ラジカル重合開始剤等が挙げられる。中でも、硬化物をより効率的に形成する観点で、本発明の光硬化性組成物は(c)光重合開始剤として、光カチオン重合開始剤と光ラジカル重合開始剤の両方を含有することが好ましい。
[(C) Photopolymerization initiator]
The photopolymerization initiator (c) which is an essential component of the photocurable composition of the present invention is a polymerizable compound (cationic polymerizable) such as component (a) or component (b) in the photocurable composition by light irradiation. Compound, a radically polymerizable compound) that initiates or advances the polymerization reaction. (C) As a photoinitiator, well-known thru | or a usual photoinitiator can be used, Although it does not specifically limit, A photocationic polymerization initiator, a photoradical polymerization initiator, etc. are mentioned. Among these, from the viewpoint of more efficiently forming a cured product, the photocurable composition of the present invention may contain both a cationic photopolymerization initiator and a photoradical polymerization initiator as the photopolymerization initiator (c). preferable.

 上記光カチオン重合開始剤としては、公知乃至慣用の光カチオン重合開始剤を使用することができ、特に限定されないが、例えば、スルホニウム塩(スルホニウムイオンとアニオンとの塩)、ヨードニウム塩(ヨードニウムイオンとアニオンとの塩)、セレニウム塩(セレニウムイオンとアニオンとの塩)、アンモニウム塩(アンモニウムイオンとアニオンとの塩)、ホスホニウム塩(ホスホニウムイオンとアニオンとの塩)、遷移金属錯体イオンとアニオンとの塩等が挙げられる。 As the photocationic polymerization initiator, known or commonly used photocationic polymerization initiators can be used, and are not particularly limited. For example, sulfonium salt (salt of sulfonium ion and anion), iodonium salt (iodonium ion and Anion), selenium salt (selenium ion and anion salt), ammonium salt (ammonium ion and anion salt), phosphonium salt (phosphonium ion and anion salt), transition metal complex ion and anion Examples include salts.

 上記スルホニウム塩としては、例えば、トリフェニルスルホニウム塩、トリ-p-トリルスルホニウム塩、トリ-o-トリルスルホニウム塩、トリス(4-メトキシフェニル)スルホニウム塩、1-ナフチルジフェニルスルホニウム塩、2-ナフチルジフェニルスルホニウム塩、トリス(4-フルオロフェニル)スルホニウム塩、トリ-1-ナフチルスルホニウム塩、トリ-2-ナフチルスルホニウム塩、トリス(4-ヒドロキシフェニル)スルホニウム塩、ジフェニル[4-(フェニルチオ)フェニル]スルホニウム塩、4-(p-トリルチオ)フェニルジ-(p-フェニル)スルホニウム塩等のトリアリールスルホニウム塩;ジフェニルフェナシルスルホニウム塩、ジフェニル4-ニトロフェナシルスルホニウム塩、ジフェニルベンジルスルホニウム塩、ジフェニルメチルスルホニウム塩等のジアリールスルホニウム塩;フェニルメチルベンジルスルホニウム塩、4-ヒドロキシフェニルメチルベンジルスルホニウム塩、4-メトキシフェニルメチルベンジルスルホニウム塩等のモノアリールスルホニウム塩;ジメチルフェナシルスルホニウム塩、フェナシルテトラヒドロチオフェニウム塩、ジメチルベンジルスルホニウム塩等のトリアルキルスルホニウム塩等が挙げられる。 Examples of the sulfonium salt include triphenylsulfonium salt, tri-p-tolylsulfonium salt, tri-o-tolylsulfonium salt, tris (4-methoxyphenyl) sulfonium salt, 1-naphthyldiphenylsulfonium salt, and 2-naphthyldiphenyl. Sulfonium salt, tris (4-fluorophenyl) sulfonium salt, tri-1-naphthylsulfonium salt, tri-2-naphthylsulfonium salt, tris (4-hydroxyphenyl) sulfonium salt, diphenyl [4- (phenylthio) phenyl] sulfonium salt , Triarylsulfonium salts such as 4- (p-tolylthio) phenyldi- (p-phenyl) sulfonium salt; diphenylphenacylsulfonium salt, diphenyl-4-nitrophenacylsulfonium salt, diphenylbenzi Diarylsulfonium salts such as sulfonium salt and diphenylmethylsulfonium salt; monoarylsulfonium salts such as phenylmethylbenzylsulfonium salt, 4-hydroxyphenylmethylbenzylsulfonium salt and 4-methoxyphenylmethylbenzylsulfonium salt; dimethylphenacylsulfonium salt, phena And trialkylsulfonium salts such as siltetrahydrothiophenium salt and dimethylbenzylsulfonium salt.

 上記ジフェニル[4-(フェニルチオ)フェニル]スルホニウム塩としては、商品名「CPI-101A」(サンアプロ(株)製、ジフェニル[4-(フェニルチオ)フェニル]スルホニウムヘキサフルオロアンチモネート50%炭酸プロピレン溶液)、商品名「CPI-100P」(サンアプロ(株)製、ジフェニル[4-(フェニルチオ)フェニル]スルホニウムヘキサフルオロホスファート50%炭酸プロピレン溶液)、商品名「K1-S」(サンアプロ(株)製、非アンチモン系トリアリールスルホニウム塩)等の市販品を使用してもよい。 As the diphenyl [4- (phenylthio) phenyl] sulfonium salt, a trade name “CPI-101A” (manufactured by San Apro Co., Ltd., diphenyl [4- (phenylthio) phenyl] sulfonium hexafluoroantimonate 50% propylene carbonate solution), Product name “CPI-100P” (manufactured by San Apro Co., Ltd., diphenyl [4- (phenylthio) phenyl] sulfonium hexafluorophosphate 50% propylene carbonate solution), product name “K1-S” (manufactured by San Apro Co., Ltd., non-manufactured) Commercial products such as antimony triarylsulfonium salts) may be used.

 上記ヨードニウム塩としては、例えば、ジフェニルヨードニウム塩、ジ-p-トリルヨードニウム塩、ビス(4-ドデシルフェニル)ヨードニウム塩、ビス(4-メトキシフェニル)ヨードニウム塩等が挙げられる。 Examples of the iodonium salt include diphenyliodonium salt, di-p-tolyliodonium salt, bis (4-dodecylphenyl) iodonium salt, bis (4-methoxyphenyl) iodonium salt, and the like.

 上記セレニウム塩としては、例えば、トリフェニルセレニウム塩、トリ-p-トリルセレニウム塩、トリ-o-トリルセレニウム塩、トリス(4-メトキシフェニル)セレニウム塩、1-ナフチルジフェニルセレニウム塩等のトリアリールセレニウム塩;ジフェニルフェナシルセレニウム塩、ジフェニルベンジルセレニウム塩、ジフェニルメチルセレニウム塩等のジアリールセレニウム塩;フェニルメチルベンジルセレニウム塩等のモノアリールセレニウム塩;ジメチルフェナシルセレニウム塩等のトリアルキルセレニウム塩等が挙げられる。 Examples of the selenium salt include triaryl selenium such as triphenyl selenium salt, tri-p-tolyl selenium salt, tri-o-tolyl selenium salt, tris (4-methoxyphenyl) selenium salt, and 1-naphthyldiphenyl selenium salt. Salts; diaryl phenacyl selenium salts, diphenyl benzyl selenium salts, diaryl selenium salts such as diphenyl methyl selenium salts; monoaryl selenium salts such as phenyl methyl benzyl selenium salts; trialkyl selenium salts such as dimethyl phenacyl selenium salts .

 上記アンモニウム塩としては、例えば、テトラメチルアンモニウム塩、エチルトリメチルアンモニウム塩、ジエチルジメチルアンモニウム塩、トリエチルメチルアンモニウム塩、テトラエチルアンモニウム塩、トリメチル-n-プロピルアンモニウム塩、トリメチル-n-ブチルアンモニウム塩等のテトラアルキルアンモニウム塩;N,N-ジメチルピロリジウム塩、N-エチル-N-メチルピロリジウム塩等のピロリジウム塩;N,N'-ジメチルイミダゾリニウム塩、N,N'-ジエチルイミダゾリニウム塩等のイミダゾリニウム塩;N,N'-ジメチルテトラヒドロピリミジウム塩、N,N'-ジエチルテトラヒドロピリミジウム塩等のテトラヒドロピリミジウム塩;N,N-ジメチルモルホリニウム塩、N,N-ジエチルモルホリニウム塩等のモルホリニウム塩;N,N-ジメチルピペリジニウム塩、N,N-ジエチルピペリジニウム塩等のピペリジニウム塩;N-メチルピリジニウム塩、N-エチルピリジニウム塩等のピリジニウム塩;N,N'-ジメチルイミダゾリウム塩等のイミダゾリウム塩;N-メチルキノリウム塩等のキノリウム塩;N-メチルイソキノリウム塩等のイソキノリウム塩;ベンジルベンゾチアゾニウム塩等のチアゾニウム塩;ベンジルアクリジウム塩等のアクリジウム塩等が挙げられる。 Examples of the ammonium salt include tetramethylammonium salt, ethyltrimethylammonium salt, diethyldimethylammonium salt, triethylmethylammonium salt, tetraethylammonium salt, trimethyl-n-propylammonium salt, and trimethyl-n-butylammonium salt. Pyrodium salts such as alkylammonium salts; N, N-dimethylpyrrolidinium salts, N-ethyl-N-methylpyrrolidinium salts; N, N′-dimethylimidazolinium salts, N, N′-diethylimidazolinium salts, etc. Imidazolinium salts; tetrahydropyrimidinium salts such as N, N′-dimethyltetrahydropyrimidinium salt, N, N′-diethyltetrahydropyrimidinium salt; N, N-dimethylmorpholinium salt, N, N -Diethylmorpholinium Morpholinium salts such as salts; piperidinium salts such as N, N-dimethylpiperidinium salts and N, N-diethylpiperidinium salts; pyridinium salts such as N-methylpyridinium salts and N-ethylpyridinium salts; N, N ′ -Imidazolium salts such as dimethylimidazolium salt; Quinolium salts such as N-methylquinolium salt; Isoquinolium salts such as N-methylisoquinolium salt; Thiazonium salts such as benzylbenzothiazonium salt; And an acridium salt.

 上記ホスホニウム塩としては、例えば、テトラフェニルホスホニウム塩、テトラ-p-トリルホスホニウム塩、テトラキス(2-メトキシフェニル)ホスホニウム塩等のテトラアリールホスホニウム塩;トリフェニルベンジルホスホニウム塩等のトリアリールホスホニウム塩;トリエチルベンジルホスホニウム塩、トリブチルベンジルホスホニウム塩、テトラエチルホスホニウム塩、テトラブチルホスホニウム塩、トリエチルフェナシルホスホニウム塩等のテトラアルキルホスホニウム塩等が挙げられる。 Examples of the phosphonium salt include tetraarylphosphonium salts such as tetraphenylphosphonium salt, tetra-p-tolylphosphonium salt, tetrakis (2-methoxyphenyl) phosphonium salt; triarylphosphonium salts such as triphenylbenzylphosphonium salt; Examples thereof include tetraalkylphosphonium salts such as benzylphosphonium salt, tributylbenzylphosphonium salt, tetraethylphosphonium salt, tetrabutylphosphonium salt, and triethylphenacylphosphonium salt.

 上記遷移金属錯体イオンの塩としては、例えば、(η5-シクロペンタジエニル)(η6-トルエン)Cr+、(η5-シクロペンタジエニル)(η6-キシレン)Cr+等のクロム錯体カチオンの塩;(η5-シクロペンタジエニル)(η6-トルエン)Fe+、(η5-シクロペンタジエニル)(η6-キシレン)Fe+等の鉄錯体カチオンの塩等が挙げられる。 Examples of the salt of the transition metal complex ion include chromium such as (η 5 -cyclopentadienyl) (η 6 -toluene) Cr + and (η 5 -cyclopentadienyl) (η 6 -xylene) Cr +. Salts of complex cations; salts of iron complex cations such as (η 5 -cyclopentadienyl) (η 6 -toluene) Fe + and (η 5 -cyclopentadienyl) (η 6 -xylene) Fe + It is done.

 上記カチオンと塩を形成するためのアニオン(対イオン)としては、例えば、SbF6 -、PF6 -、BF4 -、(CF3CF23PF3 -、(CF3CF2CF23PF3 -、(C654-、(C654Ga-、スルホン酸アニオン(トリフルオロメタンスルホン酸アニオン、ペンタフルオロエタンスルホン酸アニオン、ノナフルオロブタンスルホン酸アニオン、メタンスルホン酸アニオン、ベンゼンスルホン酸アニオン、p-トルエンスルホン酸アニオン)、(CF3SO23-、(CF3SO22-、過ハロゲン酸イオン、ハロゲン化スルホン酸イオン、硫酸イオン、炭酸イオン、アルミン酸イオン、ヘキサフルオロビスマス酸イオン、カルボン酸イオン、アリールホウ酸イオン、チオシアン酸イオン、硝酸イオン等が挙げられる。 Examples of the anion (counter ion) for forming a salt with the cation include SbF 6 , PF 6 , BF 4 , (CF 3 CF 2 ) 3 PF 3 , and (CF 3 CF 2 CF 2 ). 3 PF 3 , (C 6 F 5 ) 4 B , (C 6 F 5 ) 4 Ga , sulfonate anion (trifluoromethanesulfonate anion, pentafluoroethanesulfonate anion, nonafluorobutanesulfonate anion, methane Sulfonate anion, benzenesulfonate anion, p-toluenesulfonate anion), (CF 3 SO 2 ) 3 C , (CF 3 SO 2 ) 2 N , perhalogenate ion, halogenated sulfonate ion, sulfate ion , Carbonate ion, aluminate ion, hexafluorobismuth ion, carboxylate ion, arylborate ion, thiocyanate ion, nitrate ion Etc.

 本発明の光硬化性組成物において光カチオン重合開始剤は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。また、上記光カチオン重合開始剤としては、例えば、商品名「サイラキュアUVI-6970」、「サイラキュアUVI-6974」、「サイラキュアUVI-6990」、「サイラキュアUVI-950」(以上、米国ユニオンカーバイド社製);商品名「イルガキュア250」、「イルガキュア261」、「イルガキュア264」、「CG-24-61」(以上、BASF社製);商品名「SP-150」、「SP-151」、「SP-170」、「オプトマーSP-171」(以上、(株)ADEKA製);商品名「DAICATII」((株)ダイセル製);商品名「UVAC1590」、「UVAC1591」(以上、ダイセル・サイテック(株)製);商品名「CI-2064」、「CI-2639」、「CI-2624」、「CI-2481」、「CI-2734」、「CI-2855」、「CI-2823」、「CI-2758」、「CIT-1682」(以上、日本曹達(株)製);商品名「PI-2074」(ローディア社製、ペンタフルオロフェニルボレートトルイルクミルヨードニウム塩);商品名「FFC509」(3M社製);商品名「BBI-102」、「BBI-101」、「BBI-103」、「MPI-103」、「TPS-103」、「MDS-103」、「DTS-103」、「NAT-103」、「NDS-103」(以上、ミドリ化学(株)製);商品名「CD-1010」、「CD-1011」、「CD-1012」(以上、米国、サートマー社製);商品名「CPI-100P」、「CPI-101A」(以上、サンアプロ(株)製)等の市販品を使用することもできる。 In the photocurable composition of the present invention, the photocationic polymerization initiator may be used alone or in combination of two or more. Examples of the cationic photopolymerization initiator include, for example, trade names “Syracure UVI-6970”, “Syracure UVI-6974”, “Syracure UVI-6990”, “Syracure UVI-950” (manufactured by Union Carbide, USA). ); Trade names “Irgacure 250”, “Irgacure 261”, “Irgacure 264”, “CG-24-61” (above, manufactured by BASF); trade names “SP-150”, “SP-151”, “SP” -170 "," Optomer SP-171 "(manufactured by ADEKA Corporation); trade name" DAICATII "(manufactured by Daicel Corporation); trade names" UVAC1590 "," UVAC1591 "(above, Daicel Cytec Corporation) Product name “CI-2064”, “CI-2039”, “CI-2624”, “C” -2481, "CI-2734", "CI-2855", "CI-2823", "CI-2758", "CIT-1682" (above, Nippon Soda Co., Ltd.); trade name "PI-2074" (Trade name “FFC509” (manufactured by 3M); trade names “BBI-102”, “BBI-101”, “BBI-103”, “MPI” -103 "," TPS-103 "," MDS-103 "," DTS-103 "," NAT-103 "," NDS-103 "(manufactured by Midori Chemical Co., Ltd.); trade name" CD-1010 " ”,“ CD-1011 ”,“ CD-1012 ”(above, manufactured by Sartomer, USA); trade names“ CPI-100P ”,“ CPI-101A ”(above, manufactured by San Apro Co., Ltd.) ) Etc. can also be used.

 中でも、上記光カチオン重合開始剤としては、環境や人体に及ぶ悪影響を低減する観点で、アンチモンを構成原子として含まない光カチオン重合開始剤(非アンチモン系光カチオン重合開始剤;例えば、SbF6 -を含まないもの等)が好ましい。 Among them, as the above-mentioned photocationic polymerization initiator, from the viewpoint of reducing adverse effects on the environment and the human body, a photocationic polymerization initiator not containing antimony as a constituent atom (non-antimony-based photocationic polymerization initiator; for example, SbF 6 Are preferred).

 上記光ラジカル重合開始剤としては、公知乃至慣用の光ラジカル重合開始剤を使用することができ、特に限定されないが、例えば、ベンジルジメチルケトン、1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、ジエトキシアセトフェノン、1-(4-イソプロピルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、1-(4-ドデシルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、4-(2-ヒドロキシエトキシ)-フェニル(2-ヒドロキシ-2-プロピル)ケトン、アセトフェノン、ジメトキシアセトフェノン、ジメトキシフェニルアセトフェノン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノプロパン-1、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインn-ブチルエーテル、ベンゾインフェニルエーテル、ベンジルジメチルケタール、ベンゾフェノン、ベンゾイル安息香酸、ベンゾイル安息香酸メチル(例えば、オルトベンゾイル安息香酸メチル等)、4-ジメチルアミノ安息香酸エチル、4-フェニルベンゾフェノン、ヒドロキシベンゾフェノン、アクリル化ベンゾフェノン、テトラ(t-ブチルパーオキシカルボニル)ベンゾフェノン、2,4-ジエチルチオキサントン、2-アミノ-2-ベンゾイル-1-フェニルアルカン化合物(例えば、2-ジメチルアミノ-2-(4-モルホリノ)ベンゾイル-1-フェニルプロパン等)、アミノベンゼン誘導体(例えば、4,4-ビスジエチルアミノベンゾフェノン等)、イミダゾール化合物(例えば、2,2'-ビス(2-クロロフェニル)-4,5,4',5'-テトラフェニル-1,2'-ビイミダゾ-ル等)、ハロメチル化トリアジン化合物(例えば、2,6-ビス(トリクロロメチル)-4-(4-メトキシナフタレン-1-イル)-1,3,5-トリアジン等)、ハロメチルオキサジアゾール化合物(2-トリクロロメチル-5-(2-ベンゾフラン2-イル-エテニル)-1,3,4-オキサジアゾール等)、ベンジル、ジフェニルジサルファイト等が挙げられる。 As the photo radical polymerization initiator, known or conventional photo radical polymerization initiators can be used, and are not particularly limited. For example, benzyl dimethyl ketone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl -1-phenylpropan-1-one, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl) -2-hydroxy-2 -Methylpropan-1-one, 4- (2-hydroxyethoxy) -phenyl (2-hydroxy-2-propyl) ketone, acetophenone, dimethoxyacetophenone, dimethoxyphenylacetophenone, 2-methyl-1- [4- (methylthio) Phenyl] -2-morpholinopropane-1, ben In, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin phenyl ether, benzyldimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate (for example, methyl orthobenzoylbenzoate), 4- Ethyl dimethylaminobenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, tetra (t-butylperoxycarbonyl) benzophenone, 2,4-diethylthioxanthone, 2-amino-2-benzoyl-1-phenylalkane compound ( For example, 2-dimethylamino-2- (4-morpholino) benzoyl-1-phenylpropane and the like), aminobenzene derivatives (for example, 4,4- Sudiethylaminobenzophenone, etc.), imidazole compounds (eg, 2,2′-bis (2-chlorophenyl) -4,5,4 ′, 5′-tetraphenyl-1,2′-biimidazole, etc.), halomethylated triazines Compounds (for example, 2,6-bis (trichloromethyl) -4- (4-methoxynaphthalen-1-yl) -1,3,5-triazine, etc.), halomethyloxadiazole compounds (2-trichloromethyl-5 -(2-benzofuran-2-yl-ethenyl) -1,3,4-oxadiazole etc.), benzyl, diphenyl disulfite and the like.

 なお、本発明の光硬化性組成物において光カチオン重合開始剤は、一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。また、上記光カチオン重合開始剤としては、例えば、商品名「カヤキュアEPA」、「カヤキュアDETX」(以上、日本化薬(株)製);商品名「B-CIM」(保土谷化学(株)製);商品名「イルガキュア187」、「イルガキュア907」(以上、BASF社製)等の市販品を使用することもできる。 In the photocurable composition of the present invention, the photocationic polymerization initiator can be used alone or in combination of two or more. Examples of the photocationic polymerization initiator include trade names “Kayacure EPA” and “Kayacure DETX” (manufactured by Nippon Kayaku Co., Ltd.); trade name “B-CIM” (Hodogaya Chemical Co., Ltd.). Commercially available products such as trade names “Irgacure 187” and “Irgacure 907” (manufactured by BASF) can also be used.

 上記光ラジカル重合開始剤としては、中でも、環境や人体に及ぶ悪影響を低減する観点で、アンチモンを構成原子として含まない光ラジカル重合開始剤(非アンチモン系光ラジカル重合開始剤)が好ましい。 As the photo radical polymerization initiator, among them, a photo radical polymerization initiator not containing antimony as a constituent atom (non-antimony photo radical polymerization initiator) is preferable from the viewpoint of reducing adverse effects on the environment and the human body.

 本発明の光硬化性組成物における(c)光重合開始剤の含有量(配合量)は、特に限定されないが、光硬化性組成物に含まれる重合性化合物の全量[(a)エポキシ化合物、その他のカチオン重合性化合物、(b)(メタ)アクリル化合物、及びその他のラジカル重合性化合物の全量]100重量部に対して、1~20重量部が好ましく、より好ましくは2~15重量部である。(c)光重合開始剤の含有量を1重量部以上とすることにより、光学的立体造形法によりいっそう効率的に立体造形物を製造できる傾向がある。一方、(c)光重合開始剤の含有量を20重量部以下とすることにより、立体造形物の耐熱性及び機械物性がより向上し、着色等の不具合が抑制される傾向がある。 The content (blending amount) of the (c) photopolymerization initiator in the photocurable composition of the present invention is not particularly limited, but the total amount of the polymerizable compound contained in the photocurable composition [(a) epoxy compound, The total amount of other cationically polymerizable compounds, (b) (meth) acrylic compounds, and other radically polymerizable compounds] is preferably 1 to 20 parts by weight, more preferably 2 to 15 parts by weight with respect to 100 parts by weight. is there. (C) By making content of a photoinitiator into 1 weight part or more, there exists a tendency which can manufacture a three-dimensional molded item more efficiently by the optical three-dimensional modeling method. On the other hand, when the content of the (c) photopolymerization initiator is 20 parts by weight or less, the heat resistance and mechanical properties of the three-dimensional structure are further improved, and defects such as coloring tend to be suppressed.

 中でも、本発明の光硬化性組成物における光カチオン重合開始剤の含有量(配合量)は、特に限定されないが、光硬化性組成物に含まれる(a)エポキシ化合物及びその他のカチオン重合性化合物の全量100重量部に対して、1~15重量部が好ましく、より好ましくは2~10重量部である。光カチオン重合開始剤の含有量を1重量部以上とすることにより、光学的立体造形法によりいっそう効率的に立体造形物を製造できる傾向がある。一方、光カチオン重合開始剤の含有量を15重量部以下とすることにより、得られる立体造形物の耐熱性及び機械物性がより向上し、着色等の不具合が抑制される傾向がある。 Among them, the content (blending amount) of the photocationic polymerization initiator in the photocurable composition of the present invention is not particularly limited, but (a) an epoxy compound and other cationic polymerizable compounds contained in the photocurable composition The total amount is preferably 1 to 15 parts by weight, more preferably 2 to 10 parts by weight. By setting the content of the cationic photopolymerization initiator to 1 part by weight or more, there is a tendency that a three-dimensional model can be manufactured more efficiently by an optical three-dimensional model method. On the other hand, when the content of the cationic photopolymerization initiator is 15 parts by weight or less, the heat resistance and mechanical properties of the resulting three-dimensional structure are further improved, and defects such as coloring tend to be suppressed.

 また、本発明の光硬化性組成物における光ラジカル重合開始剤の含有量(配合量)は、特に限定されないが、光硬化性組成物に含まれる(b)(メタ)アクリル化合物及びその他のラジカル重合性化合物の全量100重量部に対して、1~30重量部が好ましく、より好ましくは2~20重量部である。光ラジカル重合開始剤の含有量を1重量部以上とすることにより、光学的立体造形法によりいっそう効率的に立体造形物を製造できる傾向がある。一方、光ラジカル重合開始剤の含有量を30重量部以下とすることにより、得られる立体造形物の耐熱性及び機械物性がより向上し、着色等の不具合が抑制される傾向がある。 Further, the content (blending amount) of the photo radical polymerization initiator in the photo curable composition of the present invention is not particularly limited, but (b) (meth) acrylic compounds and other radicals contained in the photo curable composition. The amount is preferably 1 to 30 parts by weight, more preferably 2 to 20 parts by weight, based on 100 parts by weight of the total amount of the polymerizable compounds. By setting the content of the photoradical polymerization initiator to 1 part by weight or more, there is a tendency that a three-dimensional modeled object can be manufactured more efficiently by an optical three-dimensional model method. On the other hand, when the content of the radical photopolymerization initiator is 30 parts by weight or less, the heat resistance and mechanical properties of the resulting three-dimensional structure are further improved, and defects such as coloring tend to be suppressed.

[光増感剤]
 本発明の光硬化性組成物は、(c)光重合開始剤の感度を向上させるための増感剤(光増感剤)を含んでいてもよい。上記増感剤としては、光重合開始剤の増感剤として公知乃至慣用の化合物を使用することができ、特に限定されないが、例えば、アミン系化合物(トリエタノールアミン、メチルジエタノールアミン、トリエチルアミン、ジエチルアミン等)、チオキサントン、チオキサントンの誘導体(2-クロロチオキサントン等)、アントラキノン、アントラキノンの誘導体、アントラセン、アントラセンの誘導体、ペリレン、ペリレンの誘導体、ピレン、ピレンの誘導体、アクリジン、アクリジンの誘導体(アクリジンオレンジ等)、ベンゾフェノン、ベンゾインイソプロピルエーテル、ベンゾフラビン等が挙げられる。なお、増感剤は一種を単独で使用することもできるし、二種以上を組み合わせて使用することもできる。増感剤の含有量(配合量)は、特に限定されず、使用する(c)光重合開始剤の種類やその含有量等に応じて適宜設定することができる。
[Photosensitizer]
The photocurable composition of the present invention may contain (c) a sensitizer (photosensitizer) for improving the sensitivity of the photopolymerization initiator. As the sensitizer, a known or conventional compound can be used as a sensitizer for a photopolymerization initiator, and is not particularly limited. For example, amine compounds (triethanolamine, methyldiethanolamine, triethylamine, diethylamine, etc.) ), Thioxanthone, thioxanthone derivatives (2-chlorothioxanthone, etc.), anthraquinone, anthraquinone derivatives, anthracene, anthracene derivatives, perylene, perylene derivatives, pyrene, pyrene derivatives, acridine, acridine derivatives (acridine orange, etc.), Examples include benzophenone, benzoin isopropyl ether, and benzoflavin. In addition, a sensitizer can also be used individually by 1 type, and can also be used in combination of 2 or more type. The content (blending amount) of the sensitizer is not particularly limited, and can be appropriately set according to the type and content of the (c) photopolymerization initiator to be used.

[その他の成分]
 本発明の光硬化性組成物は、さらに、本発明の効果を損なわない範囲で、必要に応じて上述した成分以外の成分(「その他の成分」と称する場合がある)を含んでいてもよい。その他の成分としては、例えば、染料、顔料、耐衝撃性付与剤(例えば、ゴム粒子、熱可塑性エラストマー等)、タルク等のフィラー、硬化膨張性モノマー、樹脂、密着性向上剤、補強剤、軟化剤、可塑剤、粘度調整剤、チクソトロピー性付与剤、溶剤、無機又は有機粒子(ナノスケール粒子等)、消泡剤、レベリング剤、カップリング剤(例えば、シランカップリング剤等)、界面活性剤、難燃剤、紫外線吸収剤、酸化防止剤、老化防止剤、光安定剤等の各種安定化剤、イオン吸着体、蛍光体、離型剤、顔料分散剤(例えば、高分子分散剤等)、分散助剤(例えば、顔料誘導体等)等の慣用の添加剤等が挙げられる。本発明の光硬化性組成物におけるその他の成分の含有量(総量)は、特に限定されないが、光硬化性組成物の全量(100重量%)に対して10重量%未満が好ましく、より好ましくは5重量%未満である。
[Other ingredients]
The photocurable composition of the present invention may further contain a component other than the above-described components (may be referred to as “other components”) as necessary, as long as the effects of the present invention are not impaired. . Other components include, for example, dyes, pigments, impact imparting agents (for example, rubber particles, thermoplastic elastomers, etc.), fillers such as talc, curing expandable monomers, resins, adhesion improvers, reinforcing agents, softening agents Agent, plasticizer, viscosity modifier, thixotropic agent, solvent, inorganic or organic particles (such as nanoscale particles), antifoaming agent, leveling agent, coupling agent (such as silane coupling agent), surfactant Various stabilizers such as flame retardants, ultraviolet absorbers, antioxidants, anti-aging agents, light stabilizers, ion adsorbents, phosphors, mold release agents, pigment dispersants (for example, polymer dispersants), Conventional additives such as dispersion aids (for example, pigment derivatives and the like) and the like can be mentioned. The content (total amount) of other components in the photocurable composition of the present invention is not particularly limited, but is preferably less than 10 wt%, more preferably based on the total amount (100 wt%) of the photocurable composition. Less than 5% by weight.

 本発明の光硬化性組成物の製造方法は特に限定されず、公知乃至慣用の組成物の製造方法を適用できる。本発明の光硬化性組成物は、例えば、上述の各成分を必要に応じて加熱しながら攪拌して、均一に混合することにより調製することができる。なお、上記攪拌に際しての各成分の配合は、一括で実施することもできるし、逐次実施することもできる。上記攪拌の方法は特に限定されず、例えば、ディゾルバー、ホモジナイザー等の各種ミキサー、ニーダー、ロール、ビーズミル、自公転式攪拌装置等の公知乃至慣用の攪拌手段を使用できる。また、必要に応じて攪拌・混合後、真空下にて脱泡することもできる。 The method for producing the photocurable composition of the present invention is not particularly limited, and a known or conventional method for producing a composition can be applied. The photocurable composition of the present invention can be prepared by, for example, stirring the above-described components while heating them as necessary and mixing them uniformly. In addition, the mixing | blending of each component in the case of the said stirring can also be implemented collectively, and can also be implemented sequentially. The stirring method is not particularly limited, and for example, known or conventional stirring means such as various mixers such as a dissolver and a homogenizer, a kneader, a roll, a bead mill, and a self-revolving stirrer can be used. Further, if necessary, after stirring and mixing, defoaming can be performed under vacuum.

 本発明の光硬化性組成物は、25℃において液状を呈するものであること(液体であること)が好ましい。具体的には、本発明の光硬化性組成物の25℃における粘度は、特に限定されないが、0.1~10000mPa・sが好ましく、より好ましくは1~8000mPa・sである。25℃における粘度を0.1mPa・s以上とすることにより、光硬化性組成物の取り扱い性がいっそう向上する傾向がある。一方、25℃における粘度を10000mPa・s以下とすることにより、例えば、粘度が適度に低いためにインクジェット方式に適用可能である等、より広範な光学的立体造形法に適用できる傾向がある。なお、本発明の光硬化性組成物の25℃における粘度は、例えば、デジタル粘度計(型番「DVU-EII型」、(株)トキメック製)を用いて、ローター:標準1°34′×R24、温度:25℃、回転数:0.5~10rpmの条件で測定することができる。 The photocurable composition of the present invention preferably exhibits a liquid state (a liquid) at 25 ° C. Specifically, the viscosity at 25 ° C. of the photocurable composition of the present invention is not particularly limited, but is preferably 0.1 to 10000 mPa · s, more preferably 1 to 8000 mPa · s. By setting the viscosity at 25 ° C. to 0.1 mPa · s or more, the handleability of the photocurable composition tends to be further improved. On the other hand, by setting the viscosity at 25 ° C. to 10000 mPa · s or less, there is a tendency that it can be applied to a wider range of optical three-dimensional modeling methods, for example, it can be applied to an inkjet method because the viscosity is moderately low. The viscosity of the photocurable composition of the present invention at 25 ° C. is determined by using, for example, a digital viscometer (model number “DVU-EII type”, manufactured by Tokimec Co., Ltd.), rotor: standard 1 ° 34 ′ × R24. , Temperature: 25 ° C., rotation speed: 0.5 to 10 rpm.

<立体造形物の製造方法>
 本発明の光硬化性組成物を使用して光学的立体造形法により、当該光硬化性組成物の硬化物より形成された立体造形物が製造(作製)できる。光学的立体造形法としては、周知の光学的立体造形法が挙げられ、特に限定されないが、具体的には例えば、本発明の光硬化性組成物(液状)に対して、所望の形状パターンを有する硬化物の層(硬化物層)が形成されるように光を選択的に照射して硬化物層を形成し、引き続き、当該硬化物層の上に一層分の本発明の光硬化性組成物を供給して同様に光照射により所望の形状パターンを有する硬化物層を形成し、さらに、このような積層操作(先行して形成した硬化物層上に新たな硬化物層を連続して形成する積層操作)を繰り返すことによって、所望の立体形状を有する立体造形物を作製する方法;インクジェット方式によりノズルから本発明の光硬化性組成物の微小液滴を所望の形状パターンを描画するように吐出し、ここに光を照射して硬化物層を形成し、引き続き、当該硬化物層の上に一層分の本発明の光硬化性組成物をインクジェット方式により供給して同様に光照射により所望の形状パターンを有する硬化物層を形成し、さらに、このような積層操作(先行して形成した硬化物層上に新たな硬化物層を連続して形成する積層操作)を繰り返すことによって、所望の立体形状を有する立体造形物を作製する方法等が挙げられる。
<Method for manufacturing a three-dimensional model>
A three-dimensional model formed from a cured product of the photocurable composition can be produced (produced) by an optical three-dimensional modeling method using the photocurable composition of the present invention. The optical three-dimensional modeling method includes a well-known optical three-dimensional modeling method, and is not particularly limited. Specifically, for example, a desired shape pattern is formed on the photocurable composition (liquid) of the present invention. The cured product layer is formed by selectively irradiating light so that a cured product layer (cured product layer) is formed, and then the photocurable composition of the present invention for one layer on the cured product layer. In the same manner, a cured product layer having a desired shape pattern is formed by light irradiation, and a new cured product layer is continuously formed on such a laminating operation (a cured product layer formed in advance). A method for producing a three-dimensional structure having a desired three-dimensional shape by repeating a stacking operation to form; a microscopic droplet of the photocurable composition of the present invention is drawn from a nozzle by a inkjet method in a desired shape pattern Discharge to and irradiate light here Then, a cured product layer is formed, and then a single layer of the photocurable composition of the present invention is supplied onto the cured product layer by an ink jet method, and a cured product layer having a desired shape pattern is similarly formed by light irradiation. Further, by repeating such a laminating operation (a laminating operation in which a new cured product layer is continuously formed on the previously formed cured product layer), a three-dimensional modeled object having a desired three-dimensional shape is obtained. Examples of the method are as follows.

 光学的立体造形法において本発明の光硬化性組成物を硬化させるために照射する光は、特に限定されず、例えば、紫外線、可視光線、赤外線、電子線、X線、放射線、高周波等が挙げられる。中でも、取り扱い性やコスト面で、紫外線が好ましい。紫外線を用いる場合の光源としては、例えば、高圧水銀ランプ、超高圧水銀ランプ、キセノンランプ、カーボンアーク、メタルハライドランプ、太陽光、LEDランプ、レーザー等が使用できる。 The light irradiated to cure the photocurable composition of the present invention in the optical three-dimensional modeling method is not particularly limited, and examples thereof include ultraviolet rays, visible rays, infrared rays, electron beams, X-rays, radiation, and high frequencies. It is done. Of these, ultraviolet rays are preferable in terms of handling and cost. As a light source in the case of using ultraviolet rays, for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a carbon arc, a metal halide lamp, sunlight, an LED lamp, a laser, or the like can be used.

 光学的立体造形法において本発明の光硬化性組成物に対して選択的に光を照射する方法は、特に限定されず、例えば、レーザー光等の点状に絞られた光を使用して点描又は線描方式で光を照射する方法や、面状描画マスクを通して光を面状に照射する方法等の公知乃至慣用の選択的光照射方法が挙げられる。なお、面状描画マスクとしては、例えば、液晶シャッター又はデジタルマイクロミラーシャッター(DMD)等のような微小光シャッターを複数配置して形成したもの等が挙げられる。 In the optical three-dimensional modeling method, the method of selectively irradiating light to the photocurable composition of the present invention is not particularly limited, and for example, spotting is performed using light that has been focused in a spot shape such as laser light. Alternatively, known or commonly used selective light irradiation methods such as a method of irradiating light by a line drawing method and a method of irradiating light in a planar manner through a planar drawing mask can be used. Examples of the planar drawing mask include a mask formed by arranging a plurality of micro light shutters such as a liquid crystal shutter or a digital micromirror shutter (DMD).

 本発明の立体造形物の製造方法においては、光学的立体造形法により立体造形物を作製した後、さらに、当該立体造形物に対して後硬化処理を施すこともできる。後硬化処理の方法としては、公知乃至慣用の方法が挙げられ、特に限定されないが、例えば、さらに光照射を行う方法、加熱処理を行う方法、光照射と加熱処理の両方を行う方法等が挙げられる。光照射や加熱処理の方法は、特に限定されず、周知の条件から適宜選択することが可能である。このような後硬化処理を行うことにより、立体造形物に生じる歪みや変形を低減することができ、立体造形物の外観、耐熱性、機械物性等が向上する場合がある。なお、本発明の光硬化性組成物は硬化性に優れており、光学的立体造形法における光照射によって十分に硬化反応を進行させることができるため、必ずしも上述の後硬化処理を施す必要はない。 In the manufacturing method of the three-dimensional modeled object of the present invention, after the three-dimensional modeled object is manufactured by the optical three-dimensional modeled method, the three-dimensional modeled object can be further subjected to post-curing treatment. Examples of the post-curing treatment method include known or conventional methods, and are not particularly limited. Examples thereof include a method of performing light irradiation, a method of performing heat treatment, a method of performing both light irradiation and heat treatment, and the like. It is done. The method of light irradiation or heat treatment is not particularly limited, and can be appropriately selected from known conditions. By performing such post-curing treatment, distortion and deformation generated in the three-dimensional structure can be reduced, and the appearance, heat resistance, mechanical properties, and the like of the three-dimensional structure may be improved. In addition, since the photocurable composition of this invention is excellent in sclerosis | hardenability and can fully advance hardening reaction by the light irradiation in an optical three-dimensional modeling method, it is not necessarily necessary to perform the above-mentioned post-curing process. .

 また、本発明の立体造形物の製造方法においては、光学的立体造形法により得られた立体造形物の表面に本発明の光硬化性組成物が残存する場合には、これを除去し、必要に応じて洗浄することもできる。立体造形物の洗浄は、特に限定されず、例えば、エタノール、イソプロピルアルコール等のアルコール;アセトン、メチルエチルケトン等のケトン;酢酸エチル等のエステル;テルペン類等の脂肪族炭化水素の各種有機溶剤を使用して実施することができる。また、上記有機溶剤の代わりに、低粘度の熱硬化性樹脂や活性エネルギー線硬化性樹脂(例えば、本発明の光硬化性組成物等)を使用して上記立体造形物を洗浄することもできる。特に、熱硬化性樹脂や活性エネルギー線硬化性樹脂を使用して洗浄した場合には、洗浄後、さらに硬化処理を行うこともできる。 Moreover, in the manufacturing method of the three-dimensional modeled object of the present invention, when the photocurable composition of the present invention remains on the surface of the three-dimensional modeled object obtained by the optical three-dimensional modeled method, it is necessary to remove it. It can also be washed according to The washing of the three-dimensional structure is not particularly limited, and for example, alcohols such as ethanol and isopropyl alcohol; ketones such as acetone and methyl ethyl ketone; esters such as ethyl acetate; and various organic solvents such as aliphatic hydrocarbons such as terpenes are used. Can be implemented. Moreover, the said three-dimensional molded item can also be wash | cleaned using a low-viscosity thermosetting resin and active energy ray curable resin (for example, photocurable composition of this invention etc.) instead of the said organic solvent. . In particular, when washing is performed using a thermosetting resin or an active energy ray curable resin, a curing treatment can be further performed after the washing.

 本発明の光硬化性組成物は、光学的立体造形分野において広く使用することができ、特に限定されないが、例えば、各種製品や該製品に使用される部品等、テストパーツ(形状確認モデルや機能試験モデル等)、金型・鋳型製造用のマスターモデル、金型・鋳型等を作製するための原料として使用できる。本発明の光硬化性組成物を用いて得られる立体造形物は各種分野において使用することができ、特に限定されないが、例えば、医療分野(例えば、人工骨、人工関節、人体模型、医療機器及びその部材等として)、精密機器分野、電気・電子分野、建築分野、自動車分野、航空機分野、船舶分野、航空宇宙分野、食品分野、生活用品分野等において使用される。 The photocurable composition of the present invention can be widely used in the field of optical three-dimensional modeling, and is not particularly limited. For example, test parts (shape confirmation models and functions) such as various products and parts used in the products. Test model, etc.), master model for mold / mold production, and raw material for producing mold / mold, etc. The three-dimensional structure obtained by using the photocurable composition of the present invention can be used in various fields, and is not particularly limited. For example, the medical field (for example, artificial bones, artificial joints, human models, medical devices, and the like) As its members, etc.), it is used in the precision instrument field, electrical / electronic field, architectural field, automobile field, aircraft field, ship field, aerospace field, food field, daily life field, and the like.

 以下に、実施例に基づいて本発明をより詳細に説明するが、本発明はこれらの実施例により限定されるものではない。なお、表1における「-」は、当該成分の配合を行わなかったことを意味する。また、以下の記載及び表1における商品名「CPI-100P」及び「CPI-101A」の配合量は、商品そのものの量で示した。 Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In Table 1, “-” means that the component was not blended. The blending amounts of the trade names “CPI-100P” and “CPI-101A” in the following description and Table 1 are shown in terms of the amount of the product itself.

 実施例1
[光硬化性組成物の製造]
 表1に示すように、3,4,3',4'-ジエポキシビシクロヘキシル(化合物1)10重量部、商品名「セロキサイド2021P」((株)ダイセル製)55重量部、商品名「アロンオキセタンOXT-101」(東亞合成(株)製)10重量部、商品名「YX-8000」(三菱化学(株)製)10重量部、商品名「FA-129AS」(日立化成工業(株)製)5重量部、商品名「FA-513AS」(日立化成工業(株)製)5重量部、商品名「SR499」(サートマー社製)5重量部、商品名「CPI-100P」(サンアプロ(株)製)6重量部、及び商品名「イルガキュア184」(BASF社製)2重量部を、自公転式攪拌装置(商品名「あわとり練太郎AR-250」、(株)シンキー製)を使用して均一に混合し、脱泡して、光硬化性組成物(光学的立体造形用光硬化性組成物)を製造した。
Example 1
[Production of photocurable composition]
As shown in Table 1, 3,4,3 ′, 4′-diepoxybicyclohexyl (Compound 1) 10 parts by weight, trade name “Celoxide 2021P” (manufactured by Daicel Corporation), 55 parts by weight, trade name “Aron” 10 parts by weight of Oxetane OXT-101 (manufactured by Toagosei Co., Ltd.), 10 parts by weight of trade name “YX-8000” (manufactured by Mitsubishi Chemical Corporation), trade name “FA-129AS” (Hitachi Chemical Industry Co., Ltd.) 5 parts by weight, product name “FA-513AS” (manufactured by Hitachi Chemical Co., Ltd.), 5 parts by weight “SR499” (manufactured by Sartomer), product name “CPI-100P” (San Apro ( 6 parts by weight) and 2 parts by weight of the product name “Irgacure 184” (manufactured by BASF), and a self-revolving stirrer (trade name “Awatori Nerita AR-250”, manufactured by Shinky Corp.) Use to mix evenly and degas Te photocurable composition (stereolithography photocurable composition) was prepared.

[立体造形物の製造]
 立体造形物の製造は、光学的立体造形法(光造形)により行った。
 具体的には、上記で得た光硬化性組成物を樹脂槽に入れ、UVランプにより樹脂槽中の光硬化性組成物をUV照射量13.30mJ/cm2、積層ピッチ0.1mmで硬化させることにより、長さ100mm、幅100mm、厚さ4mmの立体造形物(硬化物)を製造した。
[Manufacture of 3D objects]
The manufacture of the three-dimensional model was performed by the optical three-dimensional model method (optical modeling).
Specifically, the photocurable composition obtained above is put in a resin tank, and the UV curable composition in the resin tank is cured by a UV lamp at a UV irradiation amount of 13.30 mJ / cm 2 and a lamination pitch of 0.1 mm. By making it, the three-dimensional molded item (hardened | cured material) of length 100mm, width 100mm, and thickness 4mm was manufactured.

実施例2~7、比較例1、2
 光硬化性組成物の組成を表1に示すように変更したこと以外は実施例1と同様にして、光硬化性組成物及び立体造形物を製造した。
 なお、比較例1、2においては、上述の製造方法では光硬化性組成物を硬化させることができず、立体造形物を得ることができなかった。このため、表1には「硬化不良」と記載した。
Examples 2 to 7, Comparative Examples 1 and 2
Except having changed the composition of the photocurable composition as shown in Table 1, it carried out similarly to Example 1, and manufactured the photocurable composition and the three-dimensional molded item.
In Comparative Examples 1 and 2, the photocurable composition could not be cured by the above-described production method, and a three-dimensional modeled object could not be obtained. For this reason, it was described in Table 1 as “hardening failure”.

 上記で得られた立体造形物について、以下の評価を行った。 The following evaluation was performed on the three-dimensional modeled object obtained above.

[耐熱性]
 上記で得られた立体造形物を、長さ10mm、幅5mm、厚さ4mmのサイズに加工し、試験片を作製した。当該試験片のガラス転移温度(Tg、℃)を熱機械測定装置(TMA)(セイコーインスツルメント(株)製)を使用して測定し、これを硬化物の耐熱性の指標とした。結果を表1に示す。
[Heat-resistant]
The three-dimensional model obtained above was processed into a size of 10 mm in length, 5 mm in width, and 4 mm in thickness to produce a test piece. The glass transition temperature (Tg, ° C.) of the test piece was measured using a thermomechanical measurement device (TMA) (manufactured by Seiko Instruments Inc.), and this was used as an index of heat resistance of the cured product. The results are shown in Table 1.

[曲げ強度試験(曲げ弾性率及び曲げ強度)]
 上記で得られた立体造形物を、長さ80mm、幅10mm、厚さ4mmのサイズに加工し、試験片を作製した。当該試験片の曲げ強度試験をJIS K6911に準拠し、曲げ速度1mm/分の条件で行い、曲げ弾性率及び曲げ強度を測定した。結果を表1に示す。
[Bending strength test (flexural modulus and bending strength)]
The three-dimensional model obtained above was processed into a size of 80 mm in length, 10 mm in width, and 4 mm in thickness to prepare a test piece. The bending strength test of the test piece was performed according to JIS K6911 under the condition of a bending speed of 1 mm / min, and the bending elastic modulus and bending strength were measured. The results are shown in Table 1.

Figure JPOXMLDOC01-appb-T000018
Figure JPOXMLDOC01-appb-T000018

 表1に示すように、本発明の光硬化性組成物を用いた場合(実施例)は、該光硬化性組成物が硬化性(反応性)に優れているため光学的立体造形法により速やかに立体造形物を製造でき、得られた立体造形物は耐熱性と機械特性の両方に優れていた。一方、比較例1、2で得られた光硬化性組成物の硬化性は不十分であり、上述の光学的立体造形法によっては立体造形物を製造することはできなかった。なお、実施例で得られた光硬化性組成物は、アンチモンを含まない非アンチモン系の組成物であるため、環境や人体に対して悪影響を及ぼしにくいものである。比較例1、2に示されるように、従来の組成では、非アンチモン系の材料設計と優れた硬化性とを両立させることはできなかった。 As shown in Table 1, when the photocurable composition of the present invention was used (Examples), the photocurable composition was excellent in curability (reactivity), so that it was quickly obtained by an optical three-dimensional modeling method. A three-dimensional model was manufactured, and the three-dimensional model obtained was excellent in both heat resistance and mechanical properties. On the other hand, the curability of the photocurable compositions obtained in Comparative Examples 1 and 2 was insufficient, and it was impossible to produce a three-dimensional modeled object by the above-described optical three-dimensional modeling method. In addition, since the photocurable composition obtained in the Example is a non-antimony composition that does not contain antimony, it is less likely to adversely affect the environment and the human body. As shown in Comparative Examples 1 and 2, with the conventional composition, it was not possible to achieve both non-antimony material design and excellent curability.

 実施例及び比較例で使用した成分は、以下の通りである。
 化合物1 : 3,4,3',4'-ジエポキシビシクロヘキシル
 化合物2 : 2,2-ビス(3,4-エポキシシクロヘキシル)プロパン
 化合物3 : 2,3-ビス(3,4-エポキシシクロヘキシル)オキシラン
 化合物4 : ビス(3,4-エポキシシクロヘキシルメチル)エーテル
 化合物5 : 1,2-ビス(3,4-エポキシシクロヘキシル)エタン
 化合物6 : エポキシ化ジシクロペンテニルアクリレート(E-DCPA)
 CELLOXIDE 2021P:商品名「セロキサイド2021P」((株)ダイセル製)、3,4-エポキシシクロヘキシルメチル(3,4-エポキシ)シクロヘキサンカルボキシレート
 CELLOXIDE 2081:商品名「セロキサイド2081」((株)ダイセル製)、ε-カプロラクトン変性3,4-エポキシシクロヘキシルメチル(3,4-エポキシ)シクロヘキサンカルボキシレート[式(I-2-7)で表される化合物]
 OXT-101 : 商品名「アロンオキセタンOXT-101」(東亞合成(株)製)、3-エチル-3-(ヒドロキシメチル)オキセタン
 YX-8000 : 商品名「YX-8000」(三菱化学(株)製)、高純度水添ビスフェノールA型エポキシ樹脂
 FA-129AS : 商品名「FA-129AS」(日立化成工業(株)製)、ノナンジオールジアクリレート
 FA-513AS : 商品名「FA-513AS」(日立化成工業(株)製)、ジシクロペンタニルアクリレート
 SR499 : 商品名「SR499」(サートマー社製)、エトキシ化トリメチロールプロパントリアクリレート
 CPI-100P : 商品名「CPI-100P」(サンアプロ(株)製)、PF6トリアリールスルホニウム塩プロピレンカーボネート溶液
 CPI-101A : 商品名「CPI-101A」(サンアプロ(株)製)、SbF6トリアリールスルホニウム塩プロピレンカーボネート溶液
 イルガキュア184 :商品名「イルガキュア184」(BASF製)、光ラジカル重合開始剤
The components used in Examples and Comparative Examples are as follows.
Compound 1: 3,4,3 ′, 4′-diepoxybicyclohexyl Compound 2: 2,2-bis (3,4-epoxycyclohexyl) propane Compound 3: 2,3-bis (3,4-epoxycyclohexyl) Oxirane Compound 4: Bis (3,4-epoxycyclohexylmethyl) ether Compound 5: 1,2-bis (3,4-epoxycyclohexyl) ethane Compound 6: Epoxidized dicyclopentenyl acrylate (E-DCPA)
CELLOXIDE 2021P: trade name “Celoxide 2021P” (manufactured by Daicel Corporation), 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate CELLOXIDE 2081: trade name “Celoxide 2081” (manufactured by Daicel Corporation) , Ε-caprolactone-modified 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate [compound represented by formula (I-2-7)]
OXT-101: Trade name “Aron Oxetane OXT-101” (manufactured by Toagosei Co., Ltd.), 3-ethyl-3- (hydroxymethyl) oxetane YX-8000: Trade name “YX-8000” (Mitsubishi Chemical Corporation) ), High-purity hydrogenated bisphenol A type epoxy resin FA-129AS: trade name “FA-129AS” (manufactured by Hitachi Chemical Co., Ltd.), nonanediol diacrylate FA-513AS: trade name “FA-513AS” (Hitachi) Kasei Kogyo Co., Ltd.), dicyclopentanyl acrylate SR499: trade name “SR499” (Sartomer), ethoxylated trimethylolpropane triacrylate CPI-100P: trade name “CPI-100P” (San Apro) ), PF 6 triarylsulfonium salts solution in propylene carbonate CP -101A: (manufactured by San-Apro Ltd.) trade name "CPI-101A", SbF 6 triarylsulfonium salts solution in propylene carbonate IRGACURE 184: trade name "Irgacure 184" (manufactured by BASF), a radical photopolymerization initiator

 本発明の光硬化性組成物は、光学的立体造形分野において広く使用することができ、例えば、各種製品や該製品に使用される部品等、テストパーツ(形状確認モデルや機能試験モデル等)、金型・鋳型製造用のマスターモデル、金型・鋳型等を作製するための原料として使用できる。 The photocurable composition of the present invention can be widely used in the field of optical three-dimensional modeling, for example, various products and parts used in the product, test parts (shape confirmation model, functional test model, etc.), It can be used as a raw material for producing a master model for mold / mold production, mold / mold, and the like.

Claims (8)

 (a)エポキシ化合物、(b)(メタ)アクリル化合物、及び(c)光重合開始剤を含み、(a)エポキシ化合物として、分子内に脂環エポキシ基を有しカルボニル基を有しない化合物を含有することを特徴とする光学的立体造形用光硬化性組成物。 (A) an epoxy compound, (b) a (meth) acryl compound, and (c) a photopolymerization initiator, and (a) a compound having an alicyclic epoxy group in the molecule and no carbonyl group as the epoxy compound. A photocurable composition for optical three-dimensional modeling characterized by containing.  (a)エポキシ化合物が、分子内に脂環エポキシ基を有する化合物、芳香族エポキシ化合物、及び分子内に脂環とグリシジルエーテル基とを有する化合物からなる群より選択される少なくとも1種の化合物である請求項1に記載の光学的立体造形用光硬化性組成物。 (A) The epoxy compound is at least one compound selected from the group consisting of a compound having an alicyclic epoxy group in the molecule, an aromatic epoxy compound, and a compound having an alicyclic ring and a glycidyl ether group in the molecule. The photocurable composition for optical three-dimensional modeling according to claim 1.  分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、下記式(I-1)
Figure JPOXMLDOC01-appb-C000001
[式(I-1)中、X1は、単結合、又はカルボニル基を有しない二価の基を示す。]
で表される化合物である請求項1又は2に記載の光学的立体造形用光硬化性組成物。
A compound having an alicyclic epoxy group in its molecule and no carbonyl group is represented by the following formula (I-1)
Figure JPOXMLDOC01-appb-C000001
[In Formula (I-1), X 1 represents a single bond or a divalent group having no carbonyl group. ]
The photocurable composition for optical three-dimensional model | molding of Claim 1 or 2 which is a compound represented by these.
 分子内に脂環エポキシ基を有しカルボニル基を有しない化合物が、3,4,3',4'-ジエポキシビシクロヘキシル、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、1,2-ビス(3,4-エポキシシクロヘキシル)エタン、2,3-ビス(3,4-エポキシシクロヘキシル)オキシラン、及びビス(3,4-エポキシシクロヘキシルメチル)エーテルからなる群より選択される少なくとも1種の化合物である請求項1~3のいずれか1項に記載の光学的立体造形用光硬化性組成物。 Compounds having an alicyclic epoxy group in the molecule and no carbonyl group are 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4-epoxycyclohexyl) propane, 1, At least one selected from the group consisting of 2-bis (3,4-epoxycyclohexyl) ethane, 2,3-bis (3,4-epoxycyclohexyl) oxirane, and bis (3,4-epoxycyclohexylmethyl) ether The photocurable composition for optical three-dimensional modeling according to any one of claims 1 to 3, which is a compound of  (a)エポキシ化合物として、さらに、分子内に脂環エポキシ基及びカルボニル基を有する化合物を含む請求項1~4のいずれか1項に記載の光学的立体造形用光硬化性組成物。 5. The photocurable composition for optical three-dimensional modeling according to any one of claims 1 to 4, further comprising (a) a compound having an alicyclic epoxy group and a carbonyl group in the molecule as the epoxy compound.  分子内に脂環エポキシ基及びカルボニル基を有する化合物が、下記式(I-2)
Figure JPOXMLDOC01-appb-C000002
[式(I-2)中、X2は、カルボニル基を有する二価の基を示す。]
で表される化合物である請求項5に記載の光学的立体造形用光硬化性組成物。
A compound having an alicyclic epoxy group and a carbonyl group in the molecule is represented by the following formula (I-2)
Figure JPOXMLDOC01-appb-C000002
[In Formula (I-2), X 2 represents a divalent group having a carbonyl group. ]
The photocurable composition for optical three-dimensional model | molding of Claim 5 which is a compound represented by these.
 (b)(メタ)アクリル化合物として、下記式(III)
Figure JPOXMLDOC01-appb-C000003
[式(III)中、Raは、水素原子又はメチル基を示す。Yは、単結合、炭素数1~10のアルキレン基、又は、炭素数1~10のアルキレン基の1以上とエーテル結合の1以上とが連結して形成された二価の基を示す。環Zは、環状脂肪族炭化水素基、又は脂環エポキシ基を示す。]
で表される化合物、及び多官能の脂肪族(メタ)アクリル化合物からなる群より選択される少なくとも一種の化合物を含む請求項1~6のいずれか1項に記載の光学的立体造形用光硬化性組成物。
(B) As the (meth) acrylic compound, the following formula (III)
Figure JPOXMLDOC01-appb-C000003
[In the formula (III), R a represents a hydrogen atom or a methyl group. Y represents a single bond, an alkylene group having 1 to 10 carbon atoms, or a divalent group formed by linking one or more alkylene groups having 1 to 10 carbon atoms and one or more ether bonds. Ring Z represents a cyclic aliphatic hydrocarbon group or an alicyclic epoxy group. ]
The photo-curing for optical three-dimensional modeling according to any one of claims 1 to 6, comprising at least one compound selected from the group consisting of a compound represented by formula (II) and a polyfunctional aliphatic (meth) acrylic compound. Sex composition.
 請求項1~7のいずれか1項に記載の光学的立体造形用光硬化性組成物を使用して光学的立体造形法により立体造形物を作製することを特徴とする立体造形物の製造方法。 A method for producing a three-dimensional structure, comprising producing a three-dimensional structure by an optical three-dimensional modeling method using the photocurable composition for optical three-dimensional modeling according to any one of claims 1 to 7. .
PCT/JP2014/081264 2013-11-29 2014-11-26 Photo-curable composition for stereolithography, and method for producing 3d structure Ceased WO2015080159A1 (en)

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