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WO2014112165A1 - Composition de type thermodurcissable, et structure stratifiée - Google Patents

Composition de type thermodurcissable, et structure stratifiée Download PDF

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Publication number
WO2014112165A1
WO2014112165A1 PCT/JP2013/078032 JP2013078032W WO2014112165A1 WO 2014112165 A1 WO2014112165 A1 WO 2014112165A1 JP 2013078032 W JP2013078032 W JP 2013078032W WO 2014112165 A1 WO2014112165 A1 WO 2014112165A1
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WO
WIPO (PCT)
Prior art keywords
thermosetting composition
hydroxyl group
containing resin
composition
glass transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/078032
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English (en)
Japanese (ja)
Inventor
千弘 舟越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of WO2014112165A1 publication Critical patent/WO2014112165A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Definitions

  • the present invention relates to a thermosetting composition and a laminated structure, and more particularly to a thermosetting composition excellent in adhesiveness and storage stability and a laminated structure obtained using the composition.
  • an adhesive has been used for bonding between layers.
  • an adhesive is applied between a sheet-like IC card circuit board made of insulating resin on which electronic components are mounted and a protective sheet made of plastic such as PET.
  • a laminated structure in which the respective layers are firmly bonded can be formed (for example, Patent Documents 1 and 2).
  • an antenna circuit of an inlay (a sheet in which a non-contact IC module composed of an antenna circuit, an IC chip, etc. is provided on a base material) is attached to the base material surface with an adhesive.
  • an adhesive There is a technique of forming the formed aluminum by etching. In that case, since the adhesive for sticking aluminum remains on the surface of the base material, the conventional adhesive may not be able to sufficiently bond the inlay and other layers such as the core sheet.
  • a two-component adhesive that is, a component that is stored separately so as not to harden, and an adhesive that is mixed at the time of use tends to have better adhesiveness than a one-component adhesive.
  • an adhesive having excellent adhesiveness and excellent storage stability as a one-component type has been demanded.
  • an object of the present invention is to provide a thermosetting composition excellent in adhesiveness and storage stability and a laminated structure obtained using the composition.
  • the present inventors formulated a blocked isocyanate blocked with at least two types of blocking agents, a curing catalyst, and a hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or lower.
  • Tg glass transition temperature
  • thermosetting composition of the present invention comprises (A) a blocked isocyanate blocked with at least two types of blocking agents, (B) a curing catalyst, and (C) a glass transition temperature (Tg) of 25 ° C. or less.
  • Tg glass transition temperature
  • the blocking agent of blocked isocyanate blocked with (A) at least two types of blocking agents is a secondary amine blocking agent and an active methylene blocking agent.
  • the (B) curing catalyst is preferably a salt of a basic compound and an organic acid.
  • thermosetting composition of the present invention preferably further contains a hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C.
  • the hydroxyl group-containing resin (C) having a glass transition temperature (Tg) of 25 ° C. or less is preferably a polyester polyol.
  • thermosetting composition of the present invention is preferably for an adhesive used in the production of an IC card.
  • the laminated structure of the present invention is obtained by using the thermosetting composition described above.
  • thermosetting composition excellent in adhesiveness and storage stability and a laminated structure obtained using the composition by adopting the above configuration.
  • thermosetting composition of the present invention is excellent in storage stability as described above, it can be made into a one-component thermosetting composition.
  • one-component means that all components can be stored together.
  • each component of the thermosetting composition of this invention is explained in full detail.
  • thermosetting composition of the present invention contains a blocked isocyanate blocked with at least two types of blocking agents as the component (A).
  • a blocked isocyanate is a compound having a group in which an isocyanate group is protected by a reaction with a blocking agent and is temporarily inactivated. When the isocyanate is heated to a predetermined temperature, the blocking agent dissociates to form an isocyanate group. Generated.
  • Component (A) is a blocked isocyanate in which at least two types of blocking agents are added in one molecule. For example, an addition reaction between a compound having a plurality of isocyanate groups in one molecule and two or more types of blocking agents. However, it is not limited to this, and any known one can be used.
  • a polyisocyanate compound for example, aromatic polyisocyanate or alicyclic aliphatic polyisocyanate may be used.
  • aromatic polyisocyanate include, for example, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, and m-xylylene diisocyanate and 2,4-tolylene dimer.
  • aliphatic polyisocyanate examples include tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate), isophorone diisocyanate, and bicycloheptane triisocyanate.
  • adducts, burettes and isocyanurates of the above-mentioned isocyanate compounds can be used.
  • the blocked isocyanate blocked with at least two types of blocking agents is either a blocked isocyanate in which the isocyanate group of hexamethylene diisocyanate polyisocyanate is blocked with a blocking agent, or any of its adducts, burettes and isocyanurates. It is preferable that The number of functional groups is preferably 2 or more.
  • the blocking agent examples include phenolic blocking agents such as phenol, cresol, xylenol, chlorophenol and ethylphenol; lactam blocking agents such as ⁇ -caprolactam, ⁇ -palerolactam, ⁇ -butyrolactam and ⁇ -propiolactam; Active methylene blocking agents such as ethyl acetoacetate, acetylacetone and diethylmalonate; methanol, ethanol, propanol, butanol, amyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol Monomethyl ether, benzyl ether, methyl glycolate, butyl glycolate, diacetone Alcohol-based blocking agents such as coal, methyl lactate and ethyl lactate; oxime-based blocking agents such as formaldehyde oxime, acetaldoxime,
  • the blocking agent of blocked isocyanate blocked with at least two kinds of blocking agents is preferably a blocking agent that can be dissociated at 80 to 130 ° C. This is because if a blocked isocyanate blocked with such a blocking agent is used, the adhesion treatment can be performed even at a relatively low temperature. In that case, even if the object to be bonded is made of a material having low heat resistance such as polyethylene terephthalate (PET) or polyvinyl chloride (PVC), the bonding process can be performed.
  • the component (A) is preferably a secondary amine block agent and an active methylene block agent, more preferably a pyrazole block agent and an active methylene block agent, from the viewpoint of adhesiveness. More preferably, 5-dimethylpyrazole and diethyl malonate.
  • the blocked isocyanate blocked with at least two kinds of blocking agents may be commercially available, for example, TRIXENE BI-7992 [HDI (hexamethylene diisocyanate) -based trimer manufactured by Baxenden; 5-dimethylpyrazole and diethyl malonate] and the like.
  • the blocked isocyanate blocked with at least two types of blocking agents is an equivalent ratio of the blocked isocyanate group to the hydroxyl group of the hydroxyl group-containing resin contained in the thermosetting composition of the present invention (block isocyanate group / hydroxyl group). , Preferably 0.01 to 100, more preferably 0.1 to 10. When the equivalent ratio is 0.01 or more, the curing reaction proceeds sufficiently so that high adhesive strength can be obtained. When the equivalent ratio is 100 or less, the strength of the composition is improved.
  • a component can be used individually by 1 type or in combination of 2 or more types. Further, other blocked isocyanates may be blended within a range not impairing the effects of the present invention.
  • thermosetting composition of the present invention contains a curing catalyst as the component (B).
  • the curing catalyst is preferably a urethanization catalyst.
  • DBU 1,8-diazabicyclo [5.4.0] undec-7-ene
  • DBN 1,5-diazabicyclo [4.3.0] non-5-ene
  • Triethylamine triethylenediamine, N, N, N ′, N′-tetramethylpropylenediamine, N, N, N ′, N′-tetrakis (2-hydroxypropyl) ethylenediamine, N-methylmorpholine, 1,2-dimethylimidazole
  • Basic compounds such as amine compounds such as: salts of the basic compounds with organic acids such as formic acid, acetic acid, acetoacetic acid, citric acid, phthalic acid, benzenesulfonic acid, sulfamic acid; stannous octoate, dibut
  • the curing catalyst is excellent in storage stability as a one-part thermosetting composition, it is preferably a salt of the basic compound and the organic acid.
  • a basic compound is blended as it is as a curing catalyst for the purpose of improving adhesiveness
  • the hydroxyl group-containing resin contained in the thermosetting composition of the present invention is a polyol having an ester bond
  • the hydrolysis reaction of the ester is accelerated. This is because the viscosity decreases with time.
  • basic compounds are highly dangerous to the human body, they are difficult to handle as they are.
  • thermosetting composition by adding a salt of a basic compound and an organic acid as a curing catalyst (B) as a curing catalyst, better adhesion and storage stability as a one-component thermosetting composition can be obtained.
  • a salt of a basic compound and an organic acid any known salt can be used.
  • the salt of the basic compound and the organic acid is preferably a salt of an amine compound and an organic acid, more preferably a salt of a cyclic amine compound and an organic acid, and 1,8-diazabicyclo [5.4.0] undeca
  • a salt of -7-ene and an organic acid or a salt of 1,5-diazabicyclo [4.3.0] non-5-ene and an organic acid is more preferable.
  • the above 1,8-diazabicyclo [5.4.0] undec-7-ene has the following structural formula (1)
  • the above 1,5-diazabicyclo [4.3.0] non-5-ene has the following structural formula. It is represented by (2).
  • the curing catalyst is an equivalent ratio of the chemical equivalent of the curing catalyst to the hydroxyl equivalent of the hydroxyl group-containing resin contained in the thermosetting composition of the present invention (chemical equivalent of the curing catalyst / hydroxyl equivalent), preferably 0.01. To 100, more preferably 0.1 to 10.
  • a component can be used individually by 1 type or in combination of 2 or more types.
  • the equivalent ratio of the chemical equivalent of the basic compound to the hydroxyl equivalent of the hydroxyl group-containing resin contained in the thermosetting composition of the present invention is preferably 0.01 to 100, more preferably 0.1 to 10.
  • the equivalent ratio is 0.01 or more, the dissociation reaction of the blocked isocyanate proceeds efficiently, and good adhesiveness is obtained.
  • the equivalent ratio is 100 or less, the strength of the composition is improved.
  • thermosetting composition of the present invention contains a hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or lower as the component (C). Since the component (C) has a hydroxyl group, it reacts with an isocyanate group generated from the component (A) by dissociation of the blocking agent. In the present invention, excellent adhesion can be obtained by using a hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or lower. Any known hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or lower can be used. In addition, the glass transition temperature (Tg) as used in the field of this invention is measured by the differential scanning calorimeter (DSC) according to the method described in “5.17.5 DSC method” of JIS C6481: 1996 ( Tg).
  • DSC differential scanning calorimeter
  • the hydroxyl group-containing resin in component (C) is a resin having a hydroxyl group in one molecule, and is usually a resin having a hydroxyl value of 0.01 to 1000 mgKOH / g, preferably 0.1 to 500 mgKOH / g.
  • Specific examples of the hydroxyl group-containing resin include polyester polyol, polyether polyol, polyurethane polyol, polycarbonate polyol, polycaprolactone polyol, and polyacryl polyol.
  • the hydroxyl group-containing resin in component (C) is preferably a polyester polyol.
  • a hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or lower may be a commercially available product.
  • Tg glass transition temperature
  • (C) Hydroxyl-containing resins having a glass transition temperature (Tg) of 25 ° C. or lower can be used singly or in combination of two or more. Moreover, other hydroxyl-containing resin may be mix
  • thermosetting composition of the present invention preferably further contains a hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. Thereby, it is easy to finely adjust the shift of the position when bonding the objects to be bonded, and it is difficult for dust to be attached, so that a thermosetting composition excellent in workability can be obtained. Any known hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. can be used.
  • the hydroxyl group-containing resin in the hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. is a resin having a hydroxyl group in one molecule.
  • Specific examples of the hydroxyl group-containing resin include the same resins as the component (C).
  • the hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. may be a commercially available one.
  • glass transition temperature (Tg) should just exceed 25 degreeC, Preferably, it is 90 degreeC or less larger than 25 degreeC, More preferably, it is 30 degreeC or more and 85 degrees C or less.
  • the compounding amount when a hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. is calculated in terms of solid content with respect to 100 parts by mass of the hydroxyl group-containing resin having a glass transition temperature (Tg) of 25 ° C. or less. And preferably 1 to 10000 parts by mass, more preferably 10 to 1000 parts by mass, and still more preferably 50 to 200 parts by mass. In the case of 1 part by mass or more, it is easy to adjust the position shift when bonding the objects to be bonded, and it is possible to suppress the adhesion of dust. In the case of 10,000 parts by mass or less, the adhesive strength is improved.
  • the hydroxyl group-containing resin component having a glass transition temperature (Tg) exceeding 25 ° C. can be used alone or in combination of two or more.
  • thermosetting composition of the present invention may contain an organic solvent in order to adjust the viscosity of the composition.
  • Any known solvent can be used as long as it can dissolve the components (A) to (C).
  • any known solvent can be used as long as it can dissolve the components (A) to (C).
  • Examples thereof include monomethyl ether acetate, terpineol, methyl ethyl ketone, carbitol, carbitol acetate, butyl carbitol, and butyl carbitol acetate.
  • a solvent can be appropriately selected according to the printing method. Two or
  • thermosetting composition of the present invention components generally blended in the composition can be blended as long as the effects of the present invention are not impaired.
  • Such components include binders, colorants, surface treatment agents, antifoaming agents, leveling agents, surface tension reducing agents, plasticizers, fillers, coupling agents, thixotropic agents, stabilizers, antioxidants, A dispersing agent etc. are mentioned.
  • the touch-drying property (tack property) of the thermosetting composition of this invention can also be improved by mix
  • thermosetting composition of the present invention can be used as an adhesive.
  • the bonding method is not particularly limited.
  • the composition is applied on at least one adhesion target by a printing method or the like and dried, and the adhesion target is positioned so that the applied composition is positioned between the adhesion targets.
  • the objects to be bonded can be bonded by bonding and curing the composition while thermocompression bonding.
  • any printing method may be used.
  • the composition may be applied by a screen printing method, an offset printing method, a gravure printing method, a die coating method, or the like.
  • the screen printing method is preferably used because the film thickness can be easily controlled by selecting the plate and printing conditions.
  • the temperature of thermocompression bonding needs to be a temperature at which the object to be bonded is not deformed. For example, it is preferably set to 140 ° C. or less for a PET substrate.
  • the object to be bonded is not particularly limited, but a sheet formed of a plastic such as PET, PET-G (polyethylene terephthalate copolymerized with cyclohexanedimethanol), PVC, polycarbonate, or the like; formed of an adhesive such as polyethylene or polyurethane Adhesive layer: It can be suitably used for adhesion of metals such as aluminum and copper.
  • a plastic such as PET, PET-G (polyethylene terephthalate copolymerized with cyclohexanedimethanol), PVC, polycarbonate, or the like
  • an adhesive such as polyethylene or polyurethane Adhesive layer: It can be suitably used for adhesion of metals such as aluminum and copper.
  • the adhesive using the thermosetting composition of the present invention can be used for producing a laminated structure such as an IC card.
  • a laminated structure such as an IC card.
  • an IC card it can be used for adhesion between a circuit board (or inlay), a sheet-like base material formed of PET or the like, and an adhesive layer formed thereon.
  • the substrate and the circuit board (or inlay) are applied to the substrate and dried via the thermosetting composition.
  • a laminated IC card can be provided by bonding and curing the thermosetting composition while thermocompression bonding the base material to the circuit board (or inlay).
  • thermosetting composition of the present invention can be used as a paint by adding colorants such as pigments, dyes, and pigments.
  • colorants such as pigments, dyes, and pigments.
  • the kind of colorant to be added is not particularly limited as long as it can be dispersed in the composition.
  • conventionally known colorants such as red, blue, green, yellow, white, black, purple, orange, brown can be used, and any of pigments, dyes, and pigments may be used.
  • a color index (CI; issued by The Society of Dyers and Colorists) number is given.
  • red colorant examples include monoazo, diazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone compounds.
  • blue colorants include metal-substituted or unsubstituted phthalocyanine-based and anthraquinone-based compounds.
  • green colorant examples include metal-substituted or unsubstituted phthalocyanine-based, anthraquinone-based, and perylene-based compounds.
  • yellow colorants examples include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, and anthraquinone compounds.
  • Examples of the black colorant include carbon black.
  • Examples of the white colorant include rutile type or anatase type titanium oxide, zinc oxide, basic lead carbonate, basic lead sulfate, lead sulfate, zinc sulfide, antimony oxide, and barium sulfate. Titanium oxide is preferably rutile titanium oxide because it has little influence on the deterioration of the resin and can suppress an increase in the viscosity of the composition. Titanium oxide is not limited by a production method such as a chlorine method or a sulfuric acid method. Moreover, what gave surface treatments, such as an alumina process and a silica process, can be used suitably.
  • the blending amount of the white colorant is preferably 100 to 350 parts by mass, more preferably 150 to 300 parts by mass with respect to 100 parts by mass of the hydroxyl group-containing resin (C) having a glass transition temperature (Tg) of 25 ° C. or less.
  • the blending amount of the colorant other than white is not particularly limited, but is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the hydroxyl group-containing resin (C) having a glass transition temperature (Tg) of 25 ° C. or less. Particularly preferred is 0.1 to 5 parts by mass.
  • thermosetting composition of the present invention can be used as a conductive adhesive, a conductive paint, or an anisotropic conductive adhesive by adding conductive particles.
  • the conductive particles are not particularly limited as long as they can be dispersed in the composition.
  • conductive fine particles silver (Ag), gold (Au), nickel (Ni), copper (Cu), aluminum (Al), tin (Sn), lead (Pb), zinc (Zn), iron (Fe) ,
  • Metals such as platinum (Pt), iridium (Ir), osmium (Os), palladium (Pd), rhodium (Rh), ruthenium (Ru), tungsten (W), molybdenum (Mo) and their alloys, Examples thereof include metal oxides such as tin oxide (SnO 2 ), indium oxide (In 2 O 3 ), and indium tin oxide (ITO), and carbon black.
  • fatty acids particularly low-carbon carboxylic acids having 6 to 8 carbon atoms, specifically hexanoic acid, heptanoic acid, octanoic acid, sorbic acid, benzoic acid, salicylic acid, m-hydroxybenzoic acid, p-hydroxybenzoic acid. It is preferable that the length is about.
  • the conductive fine particles Cu, Ag, and Al are preferable, and Ag is more preferable.
  • the primary particle size of the conductive fine particles is less than 1 ⁇ m. Is more preferably 300 nm or less, still more preferably 100 nm or less, particularly preferably 60 nm or less, and most preferably 20 nm or less.
  • the primary particle diameter of the conductive fine particles is an average particle diameter calculated from 10 random conductive fine particles observed with an electron microscope.
  • the blending amount of the conductive fine particles is appropriately in a proportion of 5 to 90% by mass, preferably 10 to 90% by mass, more preferably 15 to 90% by mass, based on the solid content.
  • amount of the conductive fine particles is 5 to 90% by mass, the line width shrinkage and disconnection of the electrode circuit can be suppressed, and a stable good dispersion (paste) can be easily produced.
  • a laminated structure means a structure in which a member to be bonded and an adhesive member are bonded via a cured product of a thermosetting composition pattern on the member to be bonded.
  • members of arbitrary properties according to a use such as various insulating members, various conductive members, various transparent or translucent members, or colored members, can be used.
  • thermosetting composition of this invention is applicable also as coating material uses, such as adhesion
  • composition of the example and the comparative example was applied to a white PET film having a thickness of 250 ⁇ m (Tetron film U2 manufactured by Teijin DuPont Films Co., Ltd.) by a screen printing method using a 100-mesh polyester bias plate with a film thickness of 20 ⁇ m on the entire surface. Printing was done. This was dried in a hot air circulating drying oven at 50 ° C. for 30 minutes.
  • an acidic chemical solution mainly composed of hydrochloric acid mainly composed of hydrochloric acid.
  • All the adhesive layers made of an adhesive for affixing aluminum were exposed.
  • the exposed adhesive layer was placed on the composition application surface on a white PET film and thermocompression bonded at 140 ° C. with a press pressure of 0.2 MPa for 60 minutes.
  • a specimen of a laminated structure was obtained by naturally cooling to room temperature and cutting to a required size. After the test piece of this laminated structure was left at room temperature for one day, the adhesive strength was evaluated according to the JISX6305-1 delamination test method.
  • Adhesive strength B The composition of the example and the comparative example was solid-printed with a film thickness of 20 ⁇ m on the entire surface of a copper plate having a thickness of 200 ⁇ m by a screen printing method using a 100 mesh polyester bias plate. This was dried in a hot air circulating drying oven at 50 ° C. for 30 minutes. A 200 ⁇ m-thick transparent polycarbonate film (Iupilon FE2000 manufactured by Mitsubishi Gas Chemical Company) was placed on the composition coated surface on the copper plate, and thermocompression bonded at 180 ° C. with a press pressure of 0.5 MPa for 10 seconds. A specimen of a laminated structure was obtained by naturally cooling to room temperature and cutting to a required size. After the test piece of this laminated structure was left at room temperature for one day, the adhesive strength was evaluated according to the JISX6305-1 delamination test method.
  • the composition of the example and the comparative example was printed on a white PET film (Tetron film U2 manufactured by Teijin DuPont Films Co., Ltd.) having a thickness of 250 ⁇ m using a 100-mesh polyester bias plate with a thickness of 20 ⁇ m on the entire surface by screen printing. Went. This was dried in a hot air circulating drying oven at 50 ° C. for 30 minutes. After cooling to room temperature, a Toray Lumirror T-60 was placed on the composition-coated surface of the white PET film, and a load of 10 g / cm 2 was applied. After standing at room temperature for 24 hours, the adhesion of the white PET film and Lumirror T-60 was evaluated.
  • ⁇ Good workability (no sticking)
  • ⁇ Slight workability (slightly sticking)
  • ⁇ Workability failure (with a large amount of sticking)
  • compositions of Examples and Comparative Examples were printed with a 1 mm width and a 40 mm length evaluation pattern on a Toray Lumirror T-60 by screen printing, and dried in a hot air circulation drying oven at 50 ° C. for 30 minutes. It was. After cooling to room temperature, it hardened
  • the adhesives of Examples 1 to 9 containing the components (A) to (C) showed high adhesive strength. Moreover, the viscosity did not increase even after mixing each component, and a one-part thermosetting composition excellent in storage stability could be obtained. Further, the adhesives of Examples 3 to 7 containing a hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. were excellent in workability. On the other hand, instead of the component (A), the adhesive of Comparative Example 1 containing a blocked isocyanate blocked with only one type of blocking agent had low adhesive strength and poor workability.
  • Comparative Example 2 Although the adhesive of Comparative Example 2 containing an isocyanate not blocked with a blocking agent instead of the component (A) is excellent in adhesive strength, the viscosity increases when each component is mixed. As a liquid adhesive, it was inferior in storage stability.
  • the adhesive of Comparative Example 3 containing no component (B) had low adhesive strength and was inferior in workability.
  • Comparative Example 4 using a hydroxyl group-containing resin having a glass transition temperature (Tg) exceeding 25 ° C. instead of the component (C), the adhesive strength was low.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention fournit une composition de type thermodurcissable dont l'adhérence et la stabilité à la conservation sont excellentes, et une structure stratifiée obtenue à l'aide de cette composition. Plus précisément, l'invention concerne une composition de type thermodurcissable et une structure stratifiée obtenue à l'aide de celle-ci, laquelle composition de type thermodurcissable est caractéristique en ce qu'elle contient (A) un isocyanate séquencé qui a été séquencé à l'aide d'au moins deux sortes d'agent de séquençage, (B) un catalyseur de durcissement et (C) une résine comprenant un groupe hydroxy dont le point de transition vitreuse (Tg) est inférieur ou égal à 25°C.
PCT/JP2013/078032 2013-01-21 2013-10-16 Composition de type thermodurcissable, et structure stratifiée Ceased WO2014112165A1 (fr)

Applications Claiming Priority (2)

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JP2013-008041 2013-01-21
JP2013008041 2013-01-21

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WO2014112165A1 true WO2014112165A1 (fr) 2014-07-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4008757A4 (fr) * 2019-08-01 2022-08-31 Asahi Kasei Kabushiki Kaisha Composition de polyisocyanate bloqué, composition de revêtement monocomposant, film de revêtement, et article revêtu

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JP2001072738A (ja) * 2000-08-17 2001-03-21 Inoac Corp 無黄変ポリウレタンフォーム
JP2002119911A (ja) * 2000-10-13 2002-04-23 Kansai Paint Co Ltd プラスチック成型品の塗装方法
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JP2008266579A (ja) * 2007-03-01 2008-11-06 Kao Corp ポリウレタン成形品の製造方法
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JP2011231306A (ja) * 2010-02-08 2011-11-17 Asahi Kasei Chemicals Corp ブロックポリイソシアネート組成物及びこれを含む塗料組成物
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Publication number Priority date Publication date Assignee Title
EP4008757A4 (fr) * 2019-08-01 2022-08-31 Asahi Kasei Kabushiki Kaisha Composition de polyisocyanate bloqué, composition de revêtement monocomposant, film de revêtement, et article revêtu

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