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WO2014162450A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2014162450A1
WO2014162450A1 PCT/JP2013/059928 JP2013059928W WO2014162450A1 WO 2014162450 A1 WO2014162450 A1 WO 2014162450A1 JP 2013059928 W JP2013059928 W JP 2013059928W WO 2014162450 A1 WO2014162450 A1 WO 2014162450A1
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WO
WIPO (PCT)
Prior art keywords
conductive film
emitting device
light emitting
electrode
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/059928
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English (en)
Japanese (ja)
Inventor
賢一 奥山
博樹 丹
雄司 齋藤
正宣 赤木
邦彦 白幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp, Pioneer Corp filed Critical Tohoku Pioneer Corp
Priority to PCT/JP2013/059928 priority Critical patent/WO2014162450A1/fr
Publication of WO2014162450A1 publication Critical patent/WO2014162450A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Definitions

  • the present invention relates to a light emitting device.
  • organic EL Organic Electroluminescence
  • An organic EL element is comprised by the transparent electrode, the other electrode arrange
  • Examples of the technology related to the organic EL element include those described in Patent Document 1 and Patent Document 2.
  • Patent Literature 1 In the self-light emitting panel having an insulating film that insulates the electrode and the light emitting layer for each self light emitting element, the technology described in Patent Literature 1 is arranged in a direction in which the substrate and the sealing member are opposed to the outer side of the outermost self light emitting element. A sipe for separating the insulating film is provided.
  • Patent Document 2 describes a light-emitting element having an electrode composed of a metal line formed in a line shape and a polymer line covering the upper surface and side surfaces of the metal line.
  • a deterioration factor of the light emitting element propagates through the polymer material constituting the electrode and enters the light emitting element. In this case, there is a concern that the light emission characteristics and the like of the light emitting element are deteriorated.
  • An example of a problem to be solved by the present invention is to suppress deterioration of characteristics of a light emitting element.
  • FIG. 2 is a cross-sectional view showing an AA cross section of FIG. 1.
  • FIG. 2 is a cross-sectional view showing a BB cross section of FIG. 1.
  • It is a figure which shows a part of light-emitting device shown in FIG. It is a figure which shows a part of light-emitting device shown in FIG.
  • FIG. 10 is a cross-sectional view showing a CC cross section of FIG. 9.
  • FIG. 10 is a cross-sectional view showing a DD cross section of FIG. 9. It is a figure which shows a part of light-emitting device shown in FIG. It is a figure which shows an example of a structure of the 1st electrically conductive film in 2nd Embodiment.
  • FIG. 1 is a plan view showing a light emitting device 10 according to the first embodiment.
  • 2 is a cross-sectional view showing the AA cross section of FIG. 1
  • FIG. 3 is a cross-sectional view showing the BB cross section of FIG. 4 and 5 are diagrams showing a part of the display device 10 shown in FIG.
  • FIG. 5 shows the configuration of the insulating layer 120.
  • 6 to 8 are diagrams showing an example of the configuration of the first conductive film 110 in the present embodiment.
  • the light emitting device 10 includes a first conductive film 110, a second conductive film 150, and an organic layer 140.
  • the first conductive film 110 includes a conductive polymer.
  • the second conductive film 150 is at least partially opposed to the first conductive film 110.
  • the organic layer 140 is disposed between the first conductive film 110 and the second conductive film 150.
  • the first conductive film 110 is positioned around the first portion 201 that forms at least a part of a region overlapping the second conductive film 150, and is thicker than the first portion 201. Alternatively, at least one of the widths of the second portion 202 is small.
  • the light emitting device 10 may be a lighting device.
  • the light-emitting device 10 is an illumination device
  • the light-emitting device 10 has a configuration in which, for example, a plurality of linear organic layers 140 having different emission colors are arranged repeatedly. Thereby, the illuminating device excellent in color rendering properties is realized.
  • the light-emitting device 10 that is a lighting device may have a planar organic layer 140.
  • the substrate 100 is, for example, a transparent substrate.
  • the substrate 100 can be a glass substrate. Thereby, the light emitting device 10 having excellent heat resistance and the like can be manufactured at low cost.
  • the substrate 100 may be a film-like substrate made of a resin material.
  • a display with particularly high flexibility can be realized.
  • the resin material constituting the film substrate include polyethylene terephthalate, polyethylene naphthalate, and polycarbonate.
  • the light emitting device 10 that is a display has a plurality of organic EL elements 20 arranged in an array on the substrate 100, for example.
  • the organic EL element 20 includes a first electrode 112 provided on the substrate 100, an organic layer 140 provided on the first electrode 112, and a second electrode 152 provided on the organic layer 140. ing. At this time, the organic layer 140 is disposed between the first electrode 112 and the second electrode 152.
  • a plurality of first conductive films 110 extending in the Y direction in the drawing and a plurality of second conductive films 150 extending in the X direction in the drawing are provided on the substrate.
  • a portion of the first conductive film 110 that overlaps the second conductive film 150 constitutes the first electrode 112.
  • a portion of the second conductive film 150 that overlaps the first conductive film 110 forms the second electrode 152. Therefore, the organic EL element 20 is formed in each portion where the first conductive film 110 and the second conductive film 150 overlap each other in plan view. As a result, a plurality of organic EL elements 20 arranged in an array are formed on the substrate 100.
  • the 1st electrode 112 becomes an anode of an organic EL element, for example.
  • the first electrode 112 is, for example, a transparent electrode that is transparent or translucent to the wavelength of light emitted from the light emitting layer 144 of the organic layer 140 described later.
  • a portion of the first conductive film 110 located in the pixel region 300 constitutes the first electrode 112.
  • the pixel region 300 is a region including a plurality of organic EL elements 20. In the example illustrated in FIG. 4, a region surrounded by a one-dot chain line corresponds to the pixel region 300.
  • a plurality of first conductive films 110 that are separated from each other are arranged on the substrate 100 in a direction perpendicular to the extending direction of the first conductive film 110 (X direction in the drawing).
  • the plurality of first electrodes 112 constituted by the plurality of first conductive films 110 are also arranged in the X direction in the drawing so as to be separated from each other.
  • the first wiring 114 is provided on the substrate 100.
  • the first wiring 114 is electrically connected to the first electrode 112, for example.
  • a plurality of first wirings 114 connected to different first electrodes 112 are provided on the substrate 100. For this reason, the plurality of first electrodes 112 in the present embodiment are each connected to the extraction wiring 134 described later via the first wiring 114.
  • the first wiring 114 is constituted by the first conductive film 110, for example.
  • the first electrode 112 and the first wiring 114 are integrally provided on the substrate 100.
  • a portion of the first conductive film 110 located in the pixel region 300 including the plurality of organic EL elements 20 becomes the first electrode 112.
  • a portion of the first conductive film 110 located outside the pixel region 300 becomes the first wiring 114.
  • a plurality of first conductive films 110 extending in the Y direction in the drawing are provided on the substrate 100.
  • the plurality of first conductive films 110 are arranged in the X direction in the drawing so as to be separated from each other.
  • a portion of the first conductive film 110 located on the end side connected to the extraction wiring 134 from the pixel region 300 indicated by the alternate long and short dash line is the first wiring 114.
  • the first conductive film 110 is made of a conductive material substantially containing a conductive polymer.
  • a transparent conductive material is preferable. In this case, a transparent conductive polymer is used.
  • the first electrode 112 made of the first conductive film 110 is transparent with respect to the wavelength of light emitted from the light emitting layer 144. .
  • the first electrode 112 and the first wiring 114 formed of the first conductive film 110 have transparency.
  • the first conductive film 110 made of a transparent conductive material is formed using, for example, a coating method. In this case, in the step of forming the first conductive film 110, it is possible to suppress a thermal load from being applied to other components such as the substrate 100.
  • the conductive polymer included in the transparent conductive material constituting the first conductive film 110 is a conductive polymer including, for example, a ⁇ -conjugated conductive polymer and a polyanion.
  • the ⁇ -conjugated conductive polymer is not particularly limited.
  • a chain conductive polymer of phenylenes, polyparaphenylene sulfides, polyisothianaphthenes, or polythiazyl compounds can be used. From the viewpoint of conductivity, transparency, stability, etc., polythiophenes or polyanilines are preferable, and polyethylene dioxythiophene is particularly preferable.
  • Polyanions include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, polyacrylic acid butyl sulfonic acid, poly-2-acrylamido-2-methylpropane sulfonic acid, polyisoprene sulfonic acid, polyvinyl Carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacryl carboxylic acid, polymethacryl carboxylic acid, poly-2-acrylamido-2-methylpropane carboxylic acid, polyisoprene carboxylic acid, or polyacrylic acid can be used.
  • the polyanion used in the present embodiment may be a homopolymer of these or two or more kinds of copolymers.
  • the transparent conductive material constituting the first conductive film 110 may further contain a crosslinking agent, a leveling agent, an antifoaming agent, or the like in addition to the transparent conductive polymer.
  • the first conductive film 110 includes a first portion 201 that forms at least a part of a region overlapping with the second conductive film 150, and is positioned around the first portion 201 and is thicker or wider than the first portion 201. And at least one of the second portions 202 is small. At this time, the first portion 201 that constitutes a region of the first conductive film 110 that overlaps the second conductive film 150 constitutes at least a part of the first electrode 112. Further, the second portion 202 may be provided so that only one of the thickness and the width is smaller than the first portion 201, and is smaller than the first portion 201 in both the thickness and the width. It may be provided. In the present embodiment, the first conductive film 110 extends in the first direction when viewed from the lead wiring 134. At this time, the width in the first conductive film 110 refers to the width in the second direction orthogonal to the first direction, for example, in a plane parallel to the plane of the substrate 100.
  • the first conductive film 110 has the second portion 202 that is located around the first portion 201 and has at least one of a thickness or a width smaller than that of the first portion 201.
  • the progress of the deterioration factor from the outside to the first portion 201 can be suppressed in the second portion 202. That is, it is possible to suppress the progress of the deterioration factor to the first electrode 112 configured by the first portion 201. Thereby, it can suppress that the light emission characteristic of the light-emitting device 10 comprised by the 1st electrode 112 deteriorates by a deterioration factor.
  • the first conductive film 110 constitutes, for example, the first electrode 112 and the first wiring 114.
  • the second portion 202 is provided, for example, in a portion constituting the first wiring 114 in the first conductive film 110.
  • a change in thickness or width existing between the second portion 202 and the first portion 201 can be caused in a portion of the first conductive film 110 other than the first electrode 112.
  • the thickness and the width of the first electrode 112 are made constant, and it is possible to suppress the occurrence of luminance variation and the like in each organic EL element 20.
  • the second portion 202 is not limited to the one having the above-described configuration, and may be provided in a portion of the first conductive film 110 that constitutes the first electrode 112.
  • the second portion 202 is configured by a constricted portion having a constricted shape in at least one of the first conductive film 110 in the thickness direction or the width direction, for example.
  • the second portion 202 is positioned between the first portion 201 having a larger width or thickness than the second portion 202 and the third portion 203 having a larger width or thickness than the second portion 202.
  • the third portion 203 constitutes, for example, a portion of the first conductive film 110 that is located between the extraction wiring 134 and the second portion 202.
  • the thickness direction of the first conductive film 110 coincides with the normal direction of the plane of the substrate 100, for example.
  • the second portion 202 is preferably provided along the bonding interface between the first conductive film 110 and the extraction wiring 134. Thereby, it is possible to more effectively suppress the progress of the deterioration factor from the lead-out wiring 134 to the first conductive film 110.
  • FIG. 6 is a cross-sectional view illustrating an example of the configuration of the first conductive film 110.
  • the case where the 2nd part 202 is provided so that it may have a thickness smaller than the 1st part 201 is illustrated.
  • a third portion 203 having a thickness larger than that of the second portion 202 is provided between the second portion 202 and the lead wiring 134.
  • the first conductive film 110 has, for example, a groove extending in the second direction in the region where the second portion 202 is provided. In this case, the groove provided in the first conductive film 110 is provided along the bonding interface between the first conductive film 110 and the extraction wiring 134.
  • the film thickness of the first portion 201 is D1
  • the film thickness of the second portion 202 is D2.
  • the film thickness D2 of the second portion 202 preferably satisfies 0.1 ⁇ D1 ⁇ D2 ⁇ 0.8 ⁇ D1.
  • the first portion 201 of the first conductive film 110 is provided so that the upper surface is flat.
  • the first portion 201 has an upper surface parallel to the plane of the substrate 100, for example.
  • FIG. 7 is a plan view showing an example of the configuration of the first conductive film 110, and shows an example different from FIG. In FIG. 7, the case where the 2nd part 202 is provided so that it may have a width smaller than the 1st part 201 is illustrated.
  • a third portion 203 having a width larger than that of the second portion 202 is provided between the second portion 202 and the lead wiring 134. That is, the second portion 202 is configured by a constricted portion of the first conductive film 110 that is constricted in the width direction.
  • the second portion 202 may be formed by constricting both ends in the width direction, and the second portion 202 is formed by confining only one end in the width direction. Also good.
  • the first conductive film 110 includes a fourth portion 204 that is located on the opposite side of the second portion 202 as viewed from the first portion 201 and that has at least one of thickness or width smaller than that of the first portion 201. You may go out. In this case, the progress of the deterioration factor from the outside to the first portion 201 can be suppressed in the second portion 202 and the fourth portion 204. That is, it is possible to further effectively suppress the progress of the deterioration factor to the first electrode 112 configured by the first portion 201. In the present embodiment, the fourth portion 204 may not be provided. Even in this case, the progress of the deterioration factor from the outside to the first electrode 112 can be suppressed. In addition, the first conductive film 110 can be easily processed.
  • FIG. 8 is a diagram showing an example of the configuration of the first conductive film 110, and shows an example different from those shown in FIGS.
  • the fourth portion 204 is constituted by a constricted portion having a constricted shape in at least one of the first conductive film 110 in the thickness direction or the width direction, for example.
  • the fourth portion 204 is positioned between the first portion 201 having a larger width or thickness than the fourth portion 204 and the fifth portion 205 having a larger width or thickness than the fourth portion 204.
  • the 4th part 204 has the shape constricted in the thickness direction among the 1st electrically conductive films 110 is illustrated.
  • a lead wiring 134 is provided on the substrate 100.
  • the lead wiring 134 is connected to the first conductive film 110.
  • a case where the lead wiring 134 is connected to the first wiring 114 of the first conductive film 110 is exemplified.
  • a plurality of lead wires 134 arranged in the X direction in the figure are provided on the substrate 100 so as to be separated from each other.
  • Each lead-out wiring 134 is connected to the first conductive film 110, respectively.
  • the plurality of first electrodes 112 constituted by the plurality of first conductive films 110 are respectively connected to the outside via the lead wirings 134.
  • a light emission / non-light emission signal is supplied to the organic EL element 20 through, for example, the first wiring 114 and the lead-out wiring 134.
  • the lead-out wiring 134 includes a metal material.
  • the metal material included in the lead-out wiring 134 for example, a metal material having an electrical resistivity lower than that of the conductive material constituting the first conductive film 110 is used.
  • the first conductive film 110 and the lead wiring 134 are made of different materials.
  • the metal material contained in the lead-out wiring 134 include Ag, Al, Cr, Mo, Ni, Nb, Ti, W, Au, Pt, Cu, and Pd.
  • the lead wire 134 includes one or more of these metal materials.
  • An insulating layer 120 is provided on the substrate 100 so as to cover the first conductive film 110, for example.
  • the insulating layer 120 is provided so as to cover the first electrode 112 and the first wiring 114 and a part of each of the extraction wiring 164 described later.
  • the insulating layer 120 is a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by exposure and development.
  • the insulating layer 120 may be made of a resin material other than polyimide resin, and may be epoxy resin or acrylic resin.
  • the insulating layer 120 is provided with a plurality of first openings 122, for example. As shown in FIG. 5, the plurality of first openings 122 are formed so as to form a matrix, for example. In the present embodiment, the plurality of first openings 122 are formed so as to be located on the first electrode 112 in the first conductive film 110. On each first electrode 112 extending in the Y direction in the figure, for example, a plurality of first openings 122 are arranged in the Y direction in the figure at a predetermined interval. In addition, the plurality of first openings 122 are provided at positions overlapping the second electrode 152 extending in a direction orthogonal to the first electrode 112 (X direction in the figure), for example. For this reason, the plurality of first openings 122 are arranged to form a matrix.
  • the insulating layer 120 is provided with a plurality of second openings 124, for example. As shown in FIG. 5, the second opening 124 is provided, for example, so as to be positioned on a lead wiring 164 described later.
  • the plurality of second openings 124 are arranged along one side of the matrix formed by the first openings 122. When viewed in a direction along this one side (for example, Y direction in the figure), the second openings 124 are arranged at the same interval as the first openings 122.
  • a partition wall 170 is provided on the insulating layer 120. As shown in FIG. 1, the partition 170 is provided so as to extend in the X direction in the drawing. That is, the partition 170 is formed along the extending direction of the second electrode 152. A plurality of partition walls 170 are provided so as to be arranged in the Y direction in the drawing.
  • the partition wall 170 is, for example, a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed.
  • the partition wall 170 may be made of a resin material other than a polyimide resin, or may be an epoxy resin or an acrylic resin.
  • the partition wall 170 has, for example, a trapezoidal cross-sectional shape (reverse trapezoidal shape). That is, the width of the upper surface of the partition wall 170 is larger than the width of the bottom surface of the partition wall 170, for example. In this case, even when the plurality of second electrodes 152 are collectively formed by a sputtering method, a vapor deposition method, or the like, the plurality of second electrodes 152 positioned between the adjacent partition walls 170 can be separated from each other. It becomes. Therefore, the second electrode 152 can be easily formed.
  • the planar shape of the partition wall 170 is not limited to that shown in FIG. Therefore, by changing the planar shape of the partition 170, the planar pattern of the plurality of second electrodes 152 that are separated from each other by the partition 170 can be freely changed.
  • an organic layer 140 is formed in the first opening 122.
  • the organic layer 140 is configured by a stacked body in which, for example, a hole injection layer 142, a light emitting layer 144, and an electron injection layer 146 are sequentially stacked.
  • the hole injection layer 142 is in contact with the first electrode 112
  • the electron injection layer 146 is in contact with the second electrode 152.
  • the organic layer 140 is sandwiched between the first electrode 112 and the second electrode 152.
  • a hole transport layer may be formed between the hole injection layer 142 and the light emitting layer 144, or an electron transport layer may be formed between the light emitting layer 144 and the electron injection layer 146.
  • the organic layer 140 may not include the hole injection layer 142.
  • a partition 170 is provided on the insulating layer 120.
  • the organic layers 140 provided in each of a plurality of regions sandwiched between adjacent partition walls 170 are separated from each other in the Y direction in the drawing.
  • a laminated film made of the same material as the organic layer 140 is formed on the partition wall 170, for example.
  • each layer constituting the organic layer 140 is provided so as to be continuous between adjacent first openings 122 in the X direction in the drawing in which the partition 170 extends.
  • the second electrode 152 becomes a cathode of an organic EL element, for example.
  • the second electrode 152 is provided on the organic layer 140.
  • a portion of the second conductive film 150 located in the pixel region 300 constitutes the second electrode 152.
  • a plurality of second conductive films 150 that are separated from each other are arranged on the organic layer 140 in a direction (Y direction in the drawing) perpendicular to the extending direction of the second conductive film 150.
  • the plurality of second electrodes 152 constituted by the plurality of second conductive films 150 are also arranged in the Y direction in the drawing so as to be separated from each other.
  • the light emitting device 10 includes a second wiring 154.
  • the second wiring 154 is electrically connected to the second electrode 152, for example.
  • a plurality of second wirings 154 connected to different second electrodes 152 are provided.
  • the plurality of second electrodes 152 in the present embodiment are each connected to the extraction wiring 134 described later via the second wiring 154.
  • part of the second wiring 154 is embedded in the second opening 124, and part of the second wiring 154 is connected to an extraction wiring 164 described later.
  • the second wiring 154 is constituted by the second conductive film 150, for example.
  • the second electrode 152 and the second wiring 154 are provided integrally with each other, for example.
  • a portion of the conductive film 150 located in the pixel region 300 including the plurality of organic EL elements 20 becomes the second electrode 152.
  • a portion of the conductive film 150 located outside the pixel region 300 serves as the second wiring 154.
  • a region surrounded by a one-dot chain line corresponds to the pixel region 300.
  • a plurality of conductive films 150 extending in the X direction in the drawing are provided on the organic layer 140.
  • the plurality of conductive films 150 are arranged in the Y direction in the drawing so as to be separated from each other.
  • a portion located on the end side connected to the extraction wiring 164 with respect to the pixel region 300 becomes the second wiring 154.
  • the second conductive film 150 is made of a metal material such as tin, magnesium, indium, calcium, aluminum, copper, silver, or an alloy thereof. One of these materials may be used alone, or two or more arbitrary combinations may be used. Note that when the second electrode 152 is a cathode, the second conductive film 150 included in the second electrode 152 is preferably formed using a conductive material having a work function smaller than that of the first electrode 112 serving as an anode.
  • the plurality of conductive films 150 are collectively formed on the organic layer 140 using, for example, a sputtering method or a vapor deposition method. Even in such a case, since the partition 170 is formed on the insulating layer 120 in this embodiment, the conductive film 150 provided in each of a plurality of regions sandwiched between adjacent partitions 170 is illustrated in the drawing. They are separated from each other in the Y direction. As a result, it is possible to form a plurality of conductive films 150 arranged in the Y direction in the drawing and extending in the X direction in the drawing so as to be separated from each other. At this time, a film made of the same material as the conductive film 150 is formed over the partition wall 170.
  • a lead wiring 164 is provided on the substrate 100.
  • the second wiring 154 is connected to the outside through the lead wiring 164. Therefore, the second electrode 152 is connected to the outside via the second wiring 154 and the lead wiring 164, and a signal is supplied.
  • the lead wiring 164 is made of, for example, a metal material.
  • the metal material constituting the lead wiring 164 for example, the same material as the lead wiring 134 can be used. In this case, the lead wiring 164 can be formed simultaneously with the lead wiring 134. For this reason, it can suppress that the manufacturing process number of the display apparatus 10 increases.
  • the lead wiring 134 is formed on the substrate 100.
  • the lead wiring 134 is formed on the substrate 100 using, for example, a coating method, a sputtering method, or a vapor deposition method.
  • a coating method used in the said process For example, the inkjet method, the screen printing method, the spray coating method, or the dispenser coating method is mentioned.
  • the coating liquid used when forming the lead wiring 134 by a coating method includes, for example, a binder resin and an organic solvent.
  • the binder resin for example, a cellulose resin, an epoxy resin, or an acrylic resin can be used.
  • the organic solvent for example, a hydrocarbon solvent or an alcohol solvent can be used.
  • the metal particles contained in the coating solution are, for example, Ag, Al, Cr, Mo, Ni, Nb, Ti, W, Au, Pt, Cu, and Pd.
  • the coating liquid contains one or more of these metal particles.
  • the lead wiring 164 is formed on the substrate 100 simultaneously with the step of forming the lead wiring 134.
  • the lead wiring 164 is formed by the same method and material as the lead wiring 134, for example.
  • a lyophilic treatment is performed on the surface of the lead-out wiring 134 to improve the wettability with respect to the transparent conductive material-containing coating liquid described later.
  • the lyophilic process include a roughening process, a plasma process, or a coating process that applies a coupling agent to the surface of the lead-out wiring 134.
  • a first conductive film 110 is formed over the substrate 100.
  • the first electrode 112 and the first wiring 114 constituted by the first conductive film 110 are formed.
  • the first conductive film 110 is formed, for example, by applying a transparent conductive material-containing coating solution on the substrate 100 and drying it.
  • the first conductive film 110 is formed so as to cover a part of the lead wiring 134, for example.
  • the transparent conductive material-containing coating solution is not particularly limited, but is applied onto the substrate 100 using, for example, an ink jet method, a screen printing method, a relief printing method, a gravure printing method, a die coat, a spin coat, or a spray.
  • the transparent conductive material-containing coating solution used in the step of forming the first conductive film 110 includes, for example, an organic solvent and water in addition to the above-described transparent conductive material.
  • the organic solvent for example, an alcohol solvent can be used.
  • a transparent conductive material-containing coating solution is applied onto the substrate 100 and dried, a flat first conductive film 110 is formed if it is normal.
  • lyophilic treatment can be performed on the surface of the lead-out wiring 134.
  • the portion of the transparent conductive material-containing coating solution applied on the substrate 100 that is close to the extraction wiring 134 is the extraction wiring 134 that has been subjected to lyophilic treatment. Attracted by the surface.
  • the second portion 202 having a thickness or width smaller than that of the first portion 201 can be formed in a part of the first conductive film 110.
  • the shape of the second portion 202 can be controlled by highly controlling the processing conditions in the lyophilic processing, the film thickness ratio between the first conductive film 110 and the lead wiring 134, and the like.
  • a step of forming the fourth portion 204 in the first conductive film 110 may be further included.
  • the fourth portion 204 is at least part of the structure.
  • the first conductive film 110 is formed so as to cover the film.
  • the portion close to the structure in the transparent conductive material-containing coating liquid applied on the substrate 100 is subjected to lyophilic treatment. Attracted by the surface of As a result, the fourth portion 204 is formed in a part of the first conductive film 110.
  • the shape of the fourth portion 204 can be controlled by highly controlling the processing conditions in the lyophilic treatment for the structure, the shape of the structure, and the like.
  • the second portion 202 is formed in the first conductive film 110 formed on the substrate 100 by performing a lyophobic treatment for improving the lyophobic property with respect to the coating liquid containing the transparent conductive material on a part of the surface of the substrate 100. May be.
  • the second portion 202 having a thickness smaller than that of the first portion 201 is formed by reducing the thickness of the coating liquid held on a part of the substrate 100 that has been subjected to the lyophobic treatment.
  • the lyophobic treatment include a method in which a chemical solution having lyophobic properties with respect to the transparent conductive material-containing coating solution is applied to a part of the substrate 100 using an inkjet method or the like.
  • the lyophobic treatment can be performed on the portion of the surface of the substrate 100 where the fourth portion 204 is formed.
  • the second portion 202 and the fourth portion 204 may be formed by etching a part of the first conductive film 110 after the first conductive film 110 is formed.
  • first conductive film 110 heat treatment is performed on the first conductive film 110.
  • the cohesive force of the conductive polymer is increased, and the first conductive film 110 can be made a strong film.
  • the first conductive film 110 is cured by performing a heat treatment on the first conductive film 110.
  • the transparent conductive material constituting the first conductive film 110 includes a photosensitive material
  • the first conductive film 110 may be cured by UV irradiation. The structure obtained at this stage is shown in FIG.
  • the insulating layer 120 is formed on the substrate 100, the first conductive film 110, and the lead wiring 164.
  • the insulating layer 120 is patterned into a predetermined shape using dry etching or wet etching. As a result, a plurality of first openings 122 and a plurality of second openings 124 are formed in the insulating layer 120. At this time, the plurality of first openings 122 are formed, for example, such that a part of the first conductive film 110 is exposed from each first opening 122.
  • a partition wall 170 is formed on the insulating layer 120.
  • the partition wall 170 is obtained by patterning an insulating film provided over the insulating layer 120 into a predetermined shape using dry etching or wet etching.
  • the cross-sectional shape of the partition wall 170 can be changed to an inverted trapezoid by adjusting the conditions during exposure and development. The structure obtained at this stage is shown in FIG.
  • a hole injection layer 142, a light emitting layer 144, and an electron injection layer 146 are sequentially formed in the first opening 122. These are formed using, for example, a coating method or a vapor deposition method. Thereby, the organic layer 140 is formed.
  • the second conductive film 150 is formed on the organic layer 140. Thereby, the second electrode 152 and the second wiring 154 configured by the second conductive film 150 are formed. At this time, the second conductive film 150 is formed so that, for example, a part of the second conductive film 150 is located in the second opening 124.
  • the second conductive film 150 is formed using, for example, a vapor deposition method or a sputtering method. Thereby, the organic EL element 20 including the first electrode 112, the second electrode 152, and the organic layer 140 disposed therebetween is formed on the substrate 100. In the present embodiment, for example, the light emitting device 10 is formed in this way.
  • the first conductive film 110 has the second portion 202 positioned around the first portion 201 and having a thickness or width smaller than that of the first portion 201.
  • the progress of the deterioration factor from the outside to the first portion 201 can be suppressed in the second portion 202. That is, it is possible to suppress the progress of the deterioration factor to the first electrode 112 configured by the first portion 201. For this reason, it can suppress that the light emission characteristic of the light-emitting device 10 comprised by the 1st electrode 112 deteriorates by a deterioration factor.
  • FIG. 9 is a plan view showing the light emitting device 12 according to the second embodiment, and corresponds to FIG. 1 according to the first embodiment.
  • 10 is a cross-sectional view showing a CC cross section of FIG. 9, and
  • FIG. 11 is a cross-sectional view showing a DD cross section of FIG.
  • FIG. 12 is a diagram showing a part of the light emitting device 12 shown in FIG. FIG. 12 particularly shows the positional relationship between the first conductive film 110 and the second conductive film 130.
  • FIG. 13 is a diagram showing an example of the configuration of the first conductive film 110 in the present embodiment.
  • the light emitting device 12 has the same configuration as the light emitting device 10 according to the first embodiment except for the configuration of the first conductive film 110 and the lead-out wiring 134.
  • the configuration of the light emitting device 12 will be described.
  • the first conductive film 110 is disposed in a matrix in the pixel region 300 on the substrate 100, for example.
  • the plurality of first conductive films 110 arranged in a matrix are separated from each other.
  • the pixel region 300 is a region including a plurality of organic EL elements 20. In the example illustrated in FIG. 9, a region surrounded by a one-dot chain line corresponds to the pixel region 300.
  • the first conductive film 110 is made of the conductive material shown in the first embodiment. That is, the first conductive film 110 includes a conductive polymer.
  • the first conductive film 110 constitutes the first electrode 112 of the organic EL element.
  • the lead-out wiring 134 extends in the Y direction in the figure.
  • a plurality of lead wires 134 arranged in the X direction in the figure are provided on the substrate 100 so as to be separated from each other.
  • Each lead-out wiring 134 is connected to a plurality of first electrodes 112 arranged in the Y direction. For this reason, the plurality of first electrodes 112 are each connected to the outside via the lead wiring 134.
  • a light emission / non-light emission signal is supplied to the organic EL element 20 through the lead wiring 134.
  • the shape of the first conductive film 110 according to the present embodiment is not particularly limited and can be selected as appropriate in accordance with the design of the organic EL element 20, but is, for example, rectangular.
  • the first wiring 114 constituting the light emitting device 10 according to the first embodiment is not provided.
  • the first conductive film 110 includes a first portion 201 that forms at least a part of a region overlapping with the second conductive film 150, and is positioned around the first portion 201 and is thicker or wider than the first portion 201. And at least one of the second portions 202 is small.
  • the first conductive film 110 constitutes the first electrode 112 as a whole, for example.
  • both the first portion 201 and the second portion 202 are provided on the first electrode 112.
  • the 1st part 201 and the 2nd part 202 can have the same shape as 1st Embodiment.
  • the second portion 202 has a smaller thickness than the first portion 201 and is provided so as to surround the first portion 201. Thereby, it is possible to more effectively suppress the progression of the deterioration factor from the outside to the first portion 201 surrounded by the second portion 202.
  • the 2nd part 202 is provided so that the center part which mainly contributes to light emission by the light-emitting device 12 among the 1st electrodes 112 comprised by the 1st electrically conductive film 110 may be enclosed. This makes it possible to achieve stable light emission characteristics for the light emitting device 12.
  • FIG. 13 is a plan view showing an example of the configuration of the first conductive film 110 according to the present embodiment.
  • FIG. 13 illustrates a case where the second portion 202 is thinner than the first portion 201 and is provided so as to surround the first portion 201.
  • the second portion 202 is constituted by a constricted portion having a constricted shape in the thickness direction of the first conductive film 110.
  • the first conductive film 110 is formed with a frame-shaped groove that includes the second portion 202 and surrounds the first portion 201.
  • the planar shape of the groove is, for example, a frame shape in which a region surrounded by the groove has a planar shape such as a rectangle, a circle, or an ellipse.
  • the insulating layer 120 is formed so as to cover the lead wiring 134, for example.
  • the insulating layer 120 is provided on the substrate 100 so as to cover a part of each of the extraction wiring 134 and the extraction wiring 164.
  • the insulating layer 120 is made of the same material as that of the first embodiment, for example.
  • the insulating layer 120 has a first opening 122 that overlaps at least part of the first conductive film 110.
  • the first conductive film 110 is formed in the first opening 122, for example. In this case, the entire first conductive film 110 overlaps the first opening 122.
  • a plurality of first openings 122 are formed so as to form a matrix.
  • a plurality of first conductive films 110 arranged in a matrix on the substrate 100 are formed.
  • the plurality of first conductive films 110 are separated from each other by the insulating layer 120.
  • the first opening 122 is formed, for example, so as to overlap a part of the lead wiring 134 in a plan view. In this case, a part of the lead wiring 134 that overlaps the first opening 122 in plan view is connected to the first conductive film 110 formed in the first opening 122.
  • the second portion 202 is, for example, smaller in thickness than the first portion 201 and is provided inside the first opening 122 in plan view so as to follow the outer edge of the first opening 122.
  • the second portion 202 is provided so as to be positioned between the insulating layer 120 and the first portion 201 in plan view. Accordingly, the second portion 202 can suppress the deterioration factor of the light emitting device 12 from propagating through the insulating layer 120 made of an organic material or the like and entering the first portion 201. Thereby, it becomes possible to suppress that the light emission characteristic etc. of the light-emitting device 12 deteriorate by a deterioration factor.
  • the partition 170, the organic layer 140, the second electrode 152, the second wiring 154, and the extraction wiring 164 in the present embodiment have the same configuration as that of the first embodiment, for example.
  • the first conductive film 110 is formed in each first opening 122.
  • the first conductive film 110 can be formed by the same method as in the first embodiment, and is formed in each first opening 122 by using, for example, an ink jet method or the like. Except for this point, the method for manufacturing the light emitting device 12 according to the present embodiment can be performed in the same manner as the method for manufacturing the light emitting device 10 according to the first embodiment.
  • Example 1 First, a metal film made of silver was formed on a glass substrate by a sputtering method. Next, this metal film was patterned into a line shape by dry etching to form a lead wiring. Next, an insulating film having an opening through which a part of the lead wiring is exposed was formed on the glass substrate. Next, a chemical solution having lyophobic properties with respect to the transparent conductive material-containing coating solution was applied to a part of the glass substrate surface exposed from the opening. Next, a transparent conductive material-containing coating solution was applied into the opening by an ink jet method, and dried to form a first conductive film.
  • the transparent conductive material-containing coating solution a solution obtained by dispersing poly (3,4-ethylenedioxythiophene) / polystyrene sulfonate (PEDOT-PSS, CLEVIOS PH510 (manufactured by Heraeus)) in a solvent was used.
  • a second portion having a shape constricted in the thickness direction was formed in a portion of the first conductive film located on a part of the glass substrate to which the chemical solution was applied.
  • the second portion was formed so as to constitute a frame-like groove surrounding the first portion of the first conductive film.
  • the organic layer and the second conductive film according to the second embodiment were formed in this order on the first conductive film to obtain a light emitting device.
  • the first conductive film includes a first portion that forms part of a region overlapping with the second conductive film, and a second portion that is located around the first portion and has a smaller thickness than the first portion. And had.
  • the second portion is provided inside the opening in plan view so as to follow the outer edge of the opening provided in the insulating film. Further, when the film thickness of the first portion was D1 and the second portion was D2, 0.1 ⁇ D1 ⁇ D2 ⁇ 0.8 ⁇ D1 was satisfied.
  • the light emitting device according to Example 1 exhibited sufficient light emission characteristics after long-time operation.

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

Cette invention concerne un dispositif électroluminescent (10), comprenant un premier film conducteur (110) qui comprend un polymère conducteur, un second film conducteur (150) et une couche organique (140) agencée entre le premier film conducteur (110) et le second film conducteur (150). Le premier film conducteur (110) comprend : une première section qui constitue au moins une partie d'une région qui chevauche le second film conducteur (150) ; et une seconde section qui est disposée autour de la première section et dont l'épaisseur et/ou la largeur est inférieure à celle de la première section.
PCT/JP2013/059928 2013-04-01 2013-04-01 Dispositif électroluminescent Ceased WO2014162450A1 (fr)

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Application Number Priority Date Filing Date Title
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WO2014162450A1 true WO2014162450A1 (fr) 2014-10-09

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332388A (ja) * 2000-03-13 2001-11-30 Seiko Epson Corp 有機エレクトロルミネッセンス素子およびその製造方法
JP2005056864A (ja) * 2004-11-26 2005-03-03 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
JP2005285523A (ja) * 2004-03-30 2005-10-13 Nippon Seiki Co Ltd 有機ｅｌパネル
JP2006252866A (ja) * 2005-03-09 2006-09-21 Toyota Industries Corp エレクトロルミネッセンス素子
JP2009048808A (ja) * 2007-08-15 2009-03-05 Panasonic Electric Works Co Ltd 発光装置
JP2011029539A (ja) * 2009-07-29 2011-02-10 Sumitomo Chemical Co Ltd 発光装置
JP2013012303A (ja) * 2011-06-28 2013-01-17 Nippon Seiki Co Ltd 有機ｅｌ照明装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332388A (ja) * 2000-03-13 2001-11-30 Seiko Epson Corp 有機エレクトロルミネッセンス素子およびその製造方法
JP2005285523A (ja) * 2004-03-30 2005-10-13 Nippon Seiki Co Ltd 有機ｅｌパネル
JP2005056864A (ja) * 2004-11-26 2005-03-03 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
JP2006252866A (ja) * 2005-03-09 2006-09-21 Toyota Industries Corp エレクトロルミネッセンス素子
JP2009048808A (ja) * 2007-08-15 2009-03-05 Panasonic Electric Works Co Ltd 発光装置
JP2011029539A (ja) * 2009-07-29 2011-02-10 Sumitomo Chemical Co Ltd 発光装置
JP2013012303A (ja) * 2011-06-28 2013-01-17 Nippon Seiki Co Ltd 有機ｅｌ照明装置

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