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WO2014024593A1 - Composant électronique céramique - Google Patents

Composant électronique céramique Download PDF

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Publication number
WO2014024593A1
WO2014024593A1 PCT/JP2013/067353 JP2013067353W WO2014024593A1 WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1 JP 2013067353 W JP2013067353 W JP 2013067353W WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electrode layer
resin
insulating resin
ceramic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/067353
Other languages
English (en)
Japanese (ja)
Inventor
大沢隆司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2014529379A priority Critical patent/JP5930045B2/ja
Publication of WO2014024593A1 publication Critical patent/WO2014024593A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to a ceramic electronic component, and more particularly, to a ceramic electronic component including a ceramic body and external electrodes formed on the surface thereof.
  • a chip-type multilayer ceramic capacitor which is one of typical ceramic electronic components, is generally a multilayer ceramic capacitor element (ceramic body) in which a plurality of internal electrodes are stacked via a ceramic layer which is a dielectric layer.
  • the external electrodes are arranged on a pair of end faces facing each other so as to be electrically connected to the internal electrodes.
  • a ceramic electronic component having such a structure for example, a ceramic electronic component (multilayer capacitor) having a structure as shown in FIG. 2 has been proposed (see Patent Document 1).
  • a pair of external electrodes 130 are arranged so as to go from the first and second end faces 110c, 110d of the ceramic body 110 to the first and second side faces.
  • Each external electrode 130 has a first metal electrode layer 132 and a conductive resin electrode layer 134.
  • the first metal electrode layer 132 contains a metal as a main component, the first portion 132a formed on the first and second end faces 110c and 110d, and the first and second side faces. 110a, 110b and a second portion 132b formed so as to go around.
  • the conductive resin electrode layer 134 contains a conductive material and covers the first and second portions 132a and 132b over the first and second portions 132a and 132b of the first metal electrode layer 132. At the same time, it is formed so as not to contact the ceramic body 110.
  • a second metal layer 136 made of, for example, a Ni plating film and a third metal electrode layer 138 made of a plating film such as Sn or Sn alloy are formed on the conductive resin electrode layer 134.
  • the conductive resin electrode layer absorbs the bending of the external electrode and suppresses or prevents the occurrence of cracks due to thermal shock. In addition, it is possible to prevent the peeling of the conductive resin electrode layer 134 and to obtain a highly reliable ceramic electronic component.
  • the present invention solves the above problems, and without sacrificing the thermal shock resistance and difficulty of peeling of the external electrode, it is possible to reduce the proportion of the conductive resin electrode layer in the external electrode, An object of the present invention is to provide an economical ceramic electronic component.
  • the ceramic electronic component of the present invention is: A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
  • the external electrode is A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
  • An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
  • the insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer.
  • a conductive resin electrode layer made of a resin containing a conductive material.
  • the insulating resin layer may be formed so that a tip portion thereof does not reach the surface of the ceramic body and does not contact the surface of the ceramic body. preferable.
  • the surface of the said conductive resin electrode layer is coat
  • the external electrode has a metal electrode layer formed on the surface of the ceramic body, and an insulating resin layer formed on the metal electrode layer so as to expose the peripheral edge of the metal electrode layer.
  • a conductive resin electrode layer that covers the insulating resin layer and has a tip (peripheral edge) that reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. Therefore, it is possible to replace a part of the expensive conductive resin electrode layer with an inexpensive insulating resin layer that does not contain a conductive material while ensuring the thermal shock resistance of the external electrode and the difficulty of peeling.
  • the ratio (volume ratio) of the conductive resin electrode layer occupying the entire external electrode can be reduced, and a ceramic electronic component having excellent economy can be obtained.
  • the conductive resin electrode layer as in the prior art (the resin-containing layer without combining the insulating resin layer and the conductive resin electrode layer).
  • the ratio of the conductive resin electrode layer occupying the external electrode can be reduced, and the cost of the entire product can be reduced as compared with the case where all are made conductive resin electrode layers.
  • the present invention it is possible to reduce the manufacturing cost while maintaining the dimensions and shape of the external electrode as compared with the conventional case where the resin-containing layer is entirely made of a conductive resin electrode layer.
  • FIG. 1 is a cross-sectional view showing a configuration of a ceramic electronic component (a multilayer ceramic capacitor in the first embodiment) according to one embodiment (first embodiment) of the present invention.
  • a multilayer ceramic capacitor element (ceramic body) 1 in which a plurality of internal electrodes 2a and 2b are stacked is opposed to each other via a ceramic layer 3 which is a dielectric layer.
  • the pair of end faces 4a and 4b has a structure in which a pair of external electrodes 5a and 5b are disposed so as to be electrically connected to the internal electrodes 2a and 2b.
  • the external electrodes 5a and 5b are (A) Metal electrode layers (a copper electrode layer which is a thick film electrode in the first embodiment) 51a and 51b formed on the surface of the ceramic body 1 and containing metal as a main component; (B) The main part excluding the peripheral part of the metal electrode layers 51a and 51b is covered, but the peripheral part is exposed, and is made of an insulating resin formed on the metal electrode layers 51a and 51b. Resin layers 52a and 52b; (C) The insulating resin layers 52a and 52b are covered, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered by the insulating resin layers 52a and 52b.
  • Conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
  • layers 55a and 55b are examples of the conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
  • Nickel plating film layers 54a and 54b disposed so as to cover the conductive resin electrode layers 53a and 53b, and tin plating films disposed so as to cover the nickel plating film layers 54a and 54b.
  • layers 55a and 55b are examples of the nickel plating film layers 54a and 54b.
  • the insulating resin layers 52a and 52b cover the main part except the peripheral part of the metal electrode layers 51a and 51b, but the tip part (peripheral part) is the peripheral edge of the metal electrode layers 51a and 51b. It is formed only up to the region in front of the part and is not in contact with the surface of the ceramic body 1.
  • the conductive resin electrode layers 53a and 53b also cover the insulating resin layers 52a and 52b, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b. Although it is electrically connected to 51 b, it does not reach the surface of the ceramic body 1, and is arranged in such a manner that it does not contact the surface of the ceramic body 1.
  • each part of the multilayer ceramic capacitor A according to the first embodiment are as follows.
  • ⁇ Nickel plating film layer> Thickness of the nickel plating film layers 54a and 54b on the end faces 4a and 4b of the ceramic body 1: 3.5 ⁇ m
  • ⁇ Tin plating film layer> Thickness of the tin plating film layers 55a and 55b on the end faces 4a and 4b of the ceramic body 1: 3.5 ⁇ m
  • the ceramic body 1 is prepared. There are no particular restrictions on the method of manufacturing the ceramic body 1, and for example, it can be manufactured through a process of laminating ceramic green sheets having internal electrode patterns formed on the surface by applying a conductive paste. Furthermore, the present invention is not limited to the above-described laminating method, and it can be manufactured by a method of forming a laminated body by sequentially applying ceramic slurry, conductive paste, or the like.
  • a conductive paste containing copper powder as a conductive component is applied to the surface of the ceramic body 1 and baked to form metal electrode layers (copper electrode layers) 51a and 51b mainly containing metal.
  • the metal electrode layers (copper electrode layers) 51a and 51b are so-called thick film electrodes.
  • the insulating resin layers 52 a and 52 b are formed so that their tip portions (peripheral portions) do not contact the surface of the ceramic body 1.
  • nickel electroplating is performed to form nickel plating film layers 54a and 54b so as to cover the conductive resin electrode layers 53a and 53b.
  • tin electroplating is performed to form tin plating film layers 55a and 55b so as to cover the nickel plating film layers 54a and 54b. Thereby, a multilayer ceramic capacitor A having a structure as shown in FIG. 1 is obtained.
  • an insulating resin not containing a conductive substance is used in combination with a conductive resin having a desired conductivity. Therefore, the ratio of the resin layer in the external electrode absorbs the deflection. Thus, even when the ratio is necessary to achieve sufficient thermal shock resistance, a part of the expensive conductive resin can be replaced with a low-cost insulating resin. As a result, cost reduction can be achieved without causing deterioration of characteristics such as thermal shock resistance.
  • the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.2%.
  • the insulating resin layer and the conductive resin electrode layer are arranged in such a manner that the peripheral tip portion thereof is not in contact with the ceramic body, the above-mentioned insulating resin layer and conductive resin electrode layer are provided. Thus, it is possible to obtain a highly reliable multilayer ceramic capacitor that can prevent such peeling.
  • a laminated ceramic capacitor was manufactured through the same process under the same conditions as in the first embodiment except that the insulating resin having the above-described composition was used.
  • the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.8%.
  • the chip-type multilayer ceramic capacitor has been described as an example of the ceramic electronic component.
  • the present invention is not limited to the multilayer ceramic capacitor, and for example, a ceramic body such as an LC composite component or a multilayer varistor.
  • the present invention can be applied to various ceramic electronic components having external electrodes on the surface thereof.
  • the insulating resin is used, for example, other insulating resins such as other epoxy resins, phenol resins, urethane resins, polyimide resins, and silicon resins can be used.
  • the plating film layer is a nickel plating film layer and a tin plating film layer has been described as an example.
  • a plating film made of other types of materials may be used.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2013/067353 2012-08-09 2013-06-25 Composant électronique céramique Ceased WO2014024593A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014529379A JP5930045B2 (ja) 2012-08-09 2013-06-25 セラミック電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012176859 2012-08-09
JP2012-176859 2012-08-09

Publications (1)

Publication Number Publication Date
WO2014024593A1 true WO2014024593A1 (fr) 2014-02-13

Family

ID=50067834

Family Applications (1)

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PCT/JP2013/067353 Ceased WO2014024593A1 (fr) 2012-08-09 2013-06-25 Composant électronique céramique

Country Status (2)

Country Link
JP (1) JP5930045B2 (fr)
WO (1) WO2014024593A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090977A (ja) * 2013-11-05 2015-05-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシタ
JP2016134616A (ja) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミック電子部品、その製造方法及び電子部品が実装された回路基板
US20190131076A1 (en) * 2017-10-31 2019-05-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP2020113673A (ja) * 2019-01-15 2020-07-27 Tdk株式会社 電子部品
JP2020113677A (ja) * 2019-01-15 2020-07-27 Tdk株式会社 電子部品
JP2021015950A (ja) * 2019-07-16 2021-02-12 株式会社村田製作所 積層セラミックコンデンサ
JP2022117648A (ja) * 2021-02-01 2022-08-12 Tdk株式会社 電子部品
US11430609B2 (en) 2019-08-21 2022-08-30 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
CN116168949A (zh) * 2018-09-06 2023-05-26 三星电机株式会社 多层陶瓷电子组件
JP7640798B1 (ja) 2024-09-12 2025-03-05 ノリタケ株式会社 積層セラミック電子部品の内部電極用ペースト、および、積層セラミック電子部品の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208395B2 (ja) 1992-07-30 2001-09-10 静岡製機株式会社 乾燥貯蔵精米装置
JP6904309B2 (ja) * 2018-06-21 2021-07-14 株式会社村田製作所 電子部品および電子部品の製造方法
KR102473420B1 (ko) * 2018-09-06 2022-12-02 삼성전기주식회사 적층 세라믹 전자부품
JP7081550B2 (ja) * 2019-03-27 2022-06-07 株式会社村田製作所 積層セラミック電子部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684687A (ja) * 1992-08-31 1994-03-25 Toshiba Corp セラミックチップ部品およびチップ部品実装構造
JPH10135073A (ja) * 1996-10-30 1998-05-22 Matsushita Electric Ind Co Ltd 複合セラミック電子部品およびその製造方法
JP2011137128A (ja) * 2009-12-04 2011-07-14 Murata Mfg Co Ltd 導電性樹脂組成物およびチップ型電子部品
JP2011171650A (ja) * 2010-02-22 2011-09-01 Kyocera Corp 回路基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684687A (ja) * 1992-08-31 1994-03-25 Toshiba Corp セラミックチップ部品およびチップ部品実装構造
JPH10135073A (ja) * 1996-10-30 1998-05-22 Matsushita Electric Ind Co Ltd 複合セラミック電子部品およびその製造方法
JP2011137128A (ja) * 2009-12-04 2011-07-14 Murata Mfg Co Ltd 導電性樹脂組成物およびチップ型電子部品
JP2011171650A (ja) * 2010-02-22 2011-09-01 Kyocera Corp 回路基板

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101983154B1 (ko) 2013-11-05 2019-05-28 삼성전기주식회사 적층 세라믹 커패시터
KR20150051667A (ko) * 2013-11-05 2015-05-13 삼성전기주식회사 적층 세라믹 커패시터
JP2015090977A (ja) * 2013-11-05 2015-05-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシタ
JP2016134616A (ja) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミック電子部品、その製造方法及び電子部品が実装された回路基板
KR102242091B1 (ko) * 2017-10-31 2021-04-20 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서
KR20190049479A (ko) * 2017-10-31 2019-05-09 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서
US10950385B2 (en) * 2017-10-31 2021-03-16 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor with outer electrodes including resin layers
US20190131076A1 (en) * 2017-10-31 2019-05-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
CN116168949B (zh) * 2018-09-06 2025-04-15 三星电机株式会社 多层陶瓷电子组件
CN116168949A (zh) * 2018-09-06 2023-05-26 三星电机株式会社 多层陶瓷电子组件
JP7234638B2 (ja) 2019-01-15 2023-03-08 Tdk株式会社 電子部品
JP2020113673A (ja) * 2019-01-15 2020-07-27 Tdk株式会社 電子部品
JP2020113677A (ja) * 2019-01-15 2020-07-27 Tdk株式会社 電子部品
JP7230517B2 (ja) 2019-01-15 2023-03-01 Tdk株式会社 電子部品
JP2021015950A (ja) * 2019-07-16 2021-02-12 株式会社村田製作所 積層セラミックコンデンサ
JP7275951B2 (ja) 2019-07-16 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
US11430609B2 (en) 2019-08-21 2022-08-30 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
JP7471040B2 (ja) 2021-02-01 2024-04-19 Tdk株式会社 電子部品
JP2022117648A (ja) * 2021-02-01 2022-08-12 Tdk株式会社 電子部品
JP7640798B1 (ja) 2024-09-12 2025-03-05 ノリタケ株式会社 積層セラミック電子部品の内部電極用ペースト、および、積層セラミック電子部品の製造方法

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Publication number Publication date
JPWO2014024593A1 (ja) 2016-07-25
JP5930045B2 (ja) 2016-06-08

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