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WO2014024593A1 - Ceramic electronic component - Google Patents

Ceramic electronic component Download PDF

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Publication number
WO2014024593A1
WO2014024593A1 PCT/JP2013/067353 JP2013067353W WO2014024593A1 WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1 JP 2013067353 W JP2013067353 W JP 2013067353W WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1
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WIPO (PCT)
Prior art keywords
layer
electrode layer
resin
insulating resin
ceramic body
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PCT/JP2013/067353
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French (fr)
Japanese (ja)
Inventor
大沢隆司
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2014529379A priority Critical patent/JP5930045B2/en
Publication of WO2014024593A1 publication Critical patent/WO2014024593A1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to a ceramic electronic component, and more particularly, to a ceramic electronic component including a ceramic body and external electrodes formed on the surface thereof.
  • a chip-type multilayer ceramic capacitor which is one of typical ceramic electronic components, is generally a multilayer ceramic capacitor element (ceramic body) in which a plurality of internal electrodes are stacked via a ceramic layer which is a dielectric layer.
  • the external electrodes are arranged on a pair of end faces facing each other so as to be electrically connected to the internal electrodes.
  • a ceramic electronic component having such a structure for example, a ceramic electronic component (multilayer capacitor) having a structure as shown in FIG. 2 has been proposed (see Patent Document 1).
  • a pair of external electrodes 130 are arranged so as to go from the first and second end faces 110c, 110d of the ceramic body 110 to the first and second side faces.
  • Each external electrode 130 has a first metal electrode layer 132 and a conductive resin electrode layer 134.
  • the first metal electrode layer 132 contains a metal as a main component, the first portion 132a formed on the first and second end faces 110c and 110d, and the first and second side faces. 110a, 110b and a second portion 132b formed so as to go around.
  • the conductive resin electrode layer 134 contains a conductive material and covers the first and second portions 132a and 132b over the first and second portions 132a and 132b of the first metal electrode layer 132. At the same time, it is formed so as not to contact the ceramic body 110.
  • a second metal layer 136 made of, for example, a Ni plating film and a third metal electrode layer 138 made of a plating film such as Sn or Sn alloy are formed on the conductive resin electrode layer 134.
  • the conductive resin electrode layer absorbs the bending of the external electrode and suppresses or prevents the occurrence of cracks due to thermal shock. In addition, it is possible to prevent the peeling of the conductive resin electrode layer 134 and to obtain a highly reliable ceramic electronic component.
  • the present invention solves the above problems, and without sacrificing the thermal shock resistance and difficulty of peeling of the external electrode, it is possible to reduce the proportion of the conductive resin electrode layer in the external electrode, An object of the present invention is to provide an economical ceramic electronic component.
  • the ceramic electronic component of the present invention is: A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
  • the external electrode is A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
  • An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
  • the insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer.
  • a conductive resin electrode layer made of a resin containing a conductive material.
  • the insulating resin layer may be formed so that a tip portion thereof does not reach the surface of the ceramic body and does not contact the surface of the ceramic body. preferable.
  • the surface of the said conductive resin electrode layer is coat
  • the external electrode has a metal electrode layer formed on the surface of the ceramic body, and an insulating resin layer formed on the metal electrode layer so as to expose the peripheral edge of the metal electrode layer.
  • a conductive resin electrode layer that covers the insulating resin layer and has a tip (peripheral edge) that reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. Therefore, it is possible to replace a part of the expensive conductive resin electrode layer with an inexpensive insulating resin layer that does not contain a conductive material while ensuring the thermal shock resistance of the external electrode and the difficulty of peeling.
  • the ratio (volume ratio) of the conductive resin electrode layer occupying the entire external electrode can be reduced, and a ceramic electronic component having excellent economy can be obtained.
  • the conductive resin electrode layer as in the prior art (the resin-containing layer without combining the insulating resin layer and the conductive resin electrode layer).
  • the ratio of the conductive resin electrode layer occupying the external electrode can be reduced, and the cost of the entire product can be reduced as compared with the case where all are made conductive resin electrode layers.
  • the present invention it is possible to reduce the manufacturing cost while maintaining the dimensions and shape of the external electrode as compared with the conventional case where the resin-containing layer is entirely made of a conductive resin electrode layer.
  • FIG. 1 is a cross-sectional view showing a configuration of a ceramic electronic component (a multilayer ceramic capacitor in the first embodiment) according to one embodiment (first embodiment) of the present invention.
  • a multilayer ceramic capacitor element (ceramic body) 1 in which a plurality of internal electrodes 2a and 2b are stacked is opposed to each other via a ceramic layer 3 which is a dielectric layer.
  • the pair of end faces 4a and 4b has a structure in which a pair of external electrodes 5a and 5b are disposed so as to be electrically connected to the internal electrodes 2a and 2b.
  • the external electrodes 5a and 5b are (A) Metal electrode layers (a copper electrode layer which is a thick film electrode in the first embodiment) 51a and 51b formed on the surface of the ceramic body 1 and containing metal as a main component; (B) The main part excluding the peripheral part of the metal electrode layers 51a and 51b is covered, but the peripheral part is exposed, and is made of an insulating resin formed on the metal electrode layers 51a and 51b. Resin layers 52a and 52b; (C) The insulating resin layers 52a and 52b are covered, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered by the insulating resin layers 52a and 52b.
  • Conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
  • layers 55a and 55b are examples of the conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
  • Nickel plating film layers 54a and 54b disposed so as to cover the conductive resin electrode layers 53a and 53b, and tin plating films disposed so as to cover the nickel plating film layers 54a and 54b.
  • layers 55a and 55b are examples of the nickel plating film layers 54a and 54b.
  • the insulating resin layers 52a and 52b cover the main part except the peripheral part of the metal electrode layers 51a and 51b, but the tip part (peripheral part) is the peripheral edge of the metal electrode layers 51a and 51b. It is formed only up to the region in front of the part and is not in contact with the surface of the ceramic body 1.
  • the conductive resin electrode layers 53a and 53b also cover the insulating resin layers 52a and 52b, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b. Although it is electrically connected to 51 b, it does not reach the surface of the ceramic body 1, and is arranged in such a manner that it does not contact the surface of the ceramic body 1.
  • each part of the multilayer ceramic capacitor A according to the first embodiment are as follows.
  • ⁇ Nickel plating film layer> Thickness of the nickel plating film layers 54a and 54b on the end faces 4a and 4b of the ceramic body 1: 3.5 ⁇ m
  • ⁇ Tin plating film layer> Thickness of the tin plating film layers 55a and 55b on the end faces 4a and 4b of the ceramic body 1: 3.5 ⁇ m
  • the ceramic body 1 is prepared. There are no particular restrictions on the method of manufacturing the ceramic body 1, and for example, it can be manufactured through a process of laminating ceramic green sheets having internal electrode patterns formed on the surface by applying a conductive paste. Furthermore, the present invention is not limited to the above-described laminating method, and it can be manufactured by a method of forming a laminated body by sequentially applying ceramic slurry, conductive paste, or the like.
  • a conductive paste containing copper powder as a conductive component is applied to the surface of the ceramic body 1 and baked to form metal electrode layers (copper electrode layers) 51a and 51b mainly containing metal.
  • the metal electrode layers (copper electrode layers) 51a and 51b are so-called thick film electrodes.
  • the insulating resin layers 52 a and 52 b are formed so that their tip portions (peripheral portions) do not contact the surface of the ceramic body 1.
  • nickel electroplating is performed to form nickel plating film layers 54a and 54b so as to cover the conductive resin electrode layers 53a and 53b.
  • tin electroplating is performed to form tin plating film layers 55a and 55b so as to cover the nickel plating film layers 54a and 54b. Thereby, a multilayer ceramic capacitor A having a structure as shown in FIG. 1 is obtained.
  • an insulating resin not containing a conductive substance is used in combination with a conductive resin having a desired conductivity. Therefore, the ratio of the resin layer in the external electrode absorbs the deflection. Thus, even when the ratio is necessary to achieve sufficient thermal shock resistance, a part of the expensive conductive resin can be replaced with a low-cost insulating resin. As a result, cost reduction can be achieved without causing deterioration of characteristics such as thermal shock resistance.
  • the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.2%.
  • the insulating resin layer and the conductive resin electrode layer are arranged in such a manner that the peripheral tip portion thereof is not in contact with the ceramic body, the above-mentioned insulating resin layer and conductive resin electrode layer are provided. Thus, it is possible to obtain a highly reliable multilayer ceramic capacitor that can prevent such peeling.
  • a laminated ceramic capacitor was manufactured through the same process under the same conditions as in the first embodiment except that the insulating resin having the above-described composition was used.
  • the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.8%.
  • the chip-type multilayer ceramic capacitor has been described as an example of the ceramic electronic component.
  • the present invention is not limited to the multilayer ceramic capacitor, and for example, a ceramic body such as an LC composite component or a multilayer varistor.
  • the present invention can be applied to various ceramic electronic components having external electrodes on the surface thereof.
  • the insulating resin is used, for example, other insulating resins such as other epoxy resins, phenol resins, urethane resins, polyimide resins, and silicon resins can be used.
  • the plating film layer is a nickel plating film layer and a tin plating film layer has been described as an example.
  • a plating film made of other types of materials may be used.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

セラミック電子部品Ceramic electronic components

　本発明は、セラミック電子部品に関し、詳しくは、セラミック素体とその表面に形成された外部電極を備えたセラミック電子部品に関する。 The present invention relates to a ceramic electronic component, and more particularly, to a ceramic electronic component including a ceramic body and external electrodes formed on the surface thereof.

　代表的なセラミック電子部品の一つであるチップ型の積層セラミックコンデンサは、一般的に誘電体層であるセラミック層を介して複数の内部電極が積層された積層セラミックコンデンサ素子（セラミック素体）の、互いに対向する一対の端面に、内部電極と導通するように外部電極が配設された構造を有している。 A chip-type multilayer ceramic capacitor, which is one of typical ceramic electronic components, is generally a multilayer ceramic capacitor element (ceramic body) in which a plurality of internal electrodes are stacked via a ceramic layer which is a dielectric layer. The external electrodes are arranged on a pair of end faces facing each other so as to be electrically connected to the internal electrodes.

　このような構造を有するセラミック電子部品として、例えば、図２に示すような構造を有するセラミック電子部品（積層コンデンサ）が提案されている（特許文献１参照）。 As a ceramic electronic component having such a structure, for example, a ceramic electronic component (multilayer capacitor) having a structure as shown in FIG. 2 has been proposed (see Patent Document 1).

　このセラミック電子部品（積層コンデンサ）においては、セラミック素体１１０の第１および第２の端面１１０ｃ，１１０ｄから第１および第２の側面に回り込むように一対の外部電極１３０が配置されており、一対の外部電極１３０はそれぞれ、第１の金属電極層１３２と、導電性樹脂電極層１３４とを有している。 In this ceramic electronic component (multilayer capacitor), a pair of external electrodes 130 are arranged so as to go from the first and second end faces 110c, 110d of the ceramic body 110 to the first and second side faces. Each external electrode 130 has a first metal electrode layer 132 and a conductive resin electrode layer 134.

　そして、第１の金属電極層１３２は、金属を主成分として含有しており、第１および第２の端面１１０ｃ，１１０ｄ上に形成された第１の部分１３２ａと、第１および第２の側面１１０ａ，１１０ｂに回り込むように形成された第２の部分１３２ｂとを有している。 The first metal electrode layer 132 contains a metal as a main component, the first portion 132a formed on the first and second end faces 110c and 110d, and the first and second side faces. 110a, 110b and a second portion 132b formed so as to go around.

　導電性樹脂電極層１３４は、導電性材料を含有しており、第１の金属電極層１３２の第１および第２の部分１３２ａ，１３２ｂ上にわたって当該第１および第２の部分１３２ａ，１３２ｂを覆うとともに、セラミック素体１１０に接触しないように形成されている。 The conductive resin electrode layer 134 contains a conductive material and covers the first and second portions 132a and 132b over the first and second portions 132a and 132b of the first metal electrode layer 132. At the same time, it is formed so as not to contact the ceramic body 110.

　さらに、導電性樹脂電極層１３４上には、例えばＮｉめっき膜からなる第２の金属層１３６、および、例えばＳｎまたはＳｎ合金などのめっき膜からなる第３の金属電極層１３８が形成されている。 Furthermore, a second metal layer 136 made of, for example, a Ni plating film and a third metal electrode layer 138 made of a plating film such as Sn or Sn alloy are formed on the conductive resin electrode layer 134. .

　そして、この特許文献１のセラミック電子部品の場合、上述のような構成を備えていることから、導電性樹脂電極層により外部電極の撓みを吸収し、熱衝撃によるクラックの発生を抑制、防止することができるとともに、導電性樹脂電極層１３４の剥離を防止することが可能で、信頼性の高いセラミック電子部品を得ることができるとされている。 And since the ceramic electronic component of this patent document 1 is equipped with the above structures, the conductive resin electrode layer absorbs the bending of the external electrode and suppresses or prevents the occurrence of cracks due to thermal shock. In addition, it is possible to prevent the peeling of the conductive resin electrode layer 134 and to obtain a highly reliable ceramic electronic component.

　しかしながら、この特許文献１のセラミック電子部品においては、外部電極に占める導電性樹脂電極層の割合が大きく、導電性樹脂電極層の形成に用いられる導電性樹脂が高価であることから材料コストが増大し、製品であるセラミック電子部品の製造コストの上昇を招くという問題点がある。 However, in the ceramic electronic component of Patent Document 1, the proportion of the conductive resin electrode layer in the external electrode is large, and the conductive resin used for forming the conductive resin electrode layer is expensive, so the material cost increases. However, there is a problem that the manufacturing cost of the ceramic electronic component as a product is increased.

特開２００８－１８１９５６号公報JP 2008-181956 A

　本発明は、上記課題を解決するものであり、外部電極の耐熱衝撃性や剥離しにくさを犠牲にすることなく、外部電極に占める導電性樹脂電極層の割合を低くすることが可能で、経済性に優れたセラミック電子部品を提供することを目的とする。 The present invention solves the above problems, and without sacrificing the thermal shock resistance and difficulty of peeling of the external electrode, it is possible to reduce the proportion of the conductive resin electrode layer in the external electrode, An object of the present invention is to provide an economical ceramic electronic component.

　上記課題を解決するために、本発明のセラミック電子部品は、
　セラミック素体と、セラミック素体の表面に形成された外部電極とを備えたセラミック電子部品であって、
　前記外部電極が、
　セラミック素体の表面に形成された、金属を主成分とする金属電極層と、
　前記金属電極層の主要部を被覆し、周縁部を露出させるように前記金属電極層上に形成された、絶縁性の樹脂からなる絶縁性樹脂層と、
　前記絶縁性樹脂層を被覆するとともに、先端部が、前記絶縁性樹脂層により被覆されていない前記金属電極層の前記周縁部に達して、前記金属電極層と接するように前記絶縁性樹脂層上に形成された、導電性材料を含有する樹脂からなる導電性樹脂電極層と
　を備えていることを特徴としている。 In order to solve the above problems, the ceramic electronic component of the present invention is:
A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
The external electrode is
A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
The insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. And a conductive resin electrode layer made of a resin containing a conductive material.

　また、本発明のセラミック電子部品において、前記絶縁性樹脂層は、その先端部が前記セラミック素体の表面にまで達することなく、前記セラミック素体の表面と接しないように形成されていることが好ましい。
　上記構成を備えることにより、絶縁性樹脂層の剥離を抑制して、信頼性を向上させることができる。 In the ceramic electronic component of the present invention, the insulating resin layer may be formed so that a tip portion thereof does not reach the surface of the ceramic body and does not contact the surface of the ceramic body. preferable.
By providing the above configuration, it is possible to suppress peeling of the insulating resin layer and improve reliability.

　また、前記導電性樹脂電極層の表面が、めっき膜層により被覆されていることが好ましい。
　上記構成を備えることにより、はんだ付け性などの特性を向上させることが可能になり、本発明をより実効あらしめることが可能になる。 Moreover, it is preferable that the surface of the said conductive resin electrode layer is coat | covered with the plating film layer.
By providing the above-described configuration, it is possible to improve characteristics such as solderability, and to make the present invention more effective.

　本発明のセラミック電子部品は、外部電極が、セラミック素体の表面に形成された金属電極層と、金属電極層の周縁部を露出させるように金属電極層上に形成された絶縁性樹脂層と、絶縁性樹脂層を被覆するとともに、先端部（周縁部）が、絶縁性樹脂層により被覆されていない金属電極層の周縁部に達して、金属電極層と接する導電性樹脂電極層とを備えているので、外部電極の耐熱衝撃性や剥離しにくさを確保しつつ、高価な導電性樹脂電極層の一部を、導電性材料を含まず、安価な絶縁性樹脂層で置き換えることが可能になり、外部電極全体に占める導電性樹脂電極層の割合（体積割合）を低くして、経済性に優れたセラミック電子部品を得ることが可能になる。 In the ceramic electronic component of the present invention, the external electrode has a metal electrode layer formed on the surface of the ceramic body, and an insulating resin layer formed on the metal electrode layer so as to expose the peripheral edge of the metal electrode layer. And a conductive resin electrode layer that covers the insulating resin layer and has a tip (peripheral edge) that reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. Therefore, it is possible to replace a part of the expensive conductive resin electrode layer with an inexpensive insulating resin layer that does not contain a conductive material while ensuring the thermal shock resistance of the external electrode and the difficulty of peeling. Thus, the ratio (volume ratio) of the conductive resin electrode layer occupying the entire external electrode can be reduced, and a ceramic electronic component having excellent economy can be obtained.

　すなわち、本発明によれば、従来のように、耐熱衝撃性などの特性を導電性樹脂電極層により確保するようにした場合（絶縁性樹脂層と導電性樹脂電極層を組み合わせることなく樹脂含有層をすべて導電性樹脂電極層とした場合）に比べて、外部電極に占める導電性樹脂電極層の割合を低くして、製品全体のコストを低減することができる。 That is, according to the present invention, when the characteristics such as thermal shock resistance are ensured by the conductive resin electrode layer as in the prior art (the resin-containing layer without combining the insulating resin layer and the conductive resin electrode layer). The ratio of the conductive resin electrode layer occupying the external electrode can be reduced, and the cost of the entire product can be reduced as compared with the case where all are made conductive resin electrode layers.

　また、本発明によれば、従来のように樹脂含有層をすべて導電性樹脂電極層とした場合と比べて、外部電極の寸法や形状を維持したまま、製造コストの低減を図ることができる。 In addition, according to the present invention, it is possible to reduce the manufacturing cost while maintaining the dimensions and shape of the external electrode as compared with the conventional case where the resin-containing layer is entirely made of a conductive resin electrode layer.

本発明の一実施形態にかかるセラミック電子部品（積層セラミックコンデンサ）の構成を示す断面図である。It is sectional drawing which shows the structure of the ceramic electronic component (multilayer ceramic capacitor) concerning one Embodiment of this invention. 従来のセラミック電子部品（積層セラミックコンデンサ）を示す断面図である。It is sectional drawing which shows the conventional ceramic electronic component (multilayer ceramic capacitor).

　以下に本発明の実施形態を示して、本発明の特徴とするところをさらに詳しく説明する。 Embodiments of the present invention will be described below, and the features of the present invention will be described in more detail.

［実施形態１］
　図１は、本発明の一実施形態（実施形態１）にかかるセラミック電子部品（この実施形態１では積層セラミックコンデンサ）の構成を示す断面図である。図１に示すように、この積層セラミックコンデンサＡは、誘電体層であるセラミック層３を介して複数の内部電極２ａ，２ｂが積層された積層セラミックコンデンサ素子（セラミック素体）１の互いに対向する一対の端面４ａ，４ｂに、内部電極２ａ，２ｂと導通するように一対の外部電極５ａ，５ｂが配設された構造を有している。 [Embodiment 1]
FIG. 1 is a cross-sectional view showing a configuration of a ceramic electronic component (a multilayer ceramic capacitor in the first embodiment) according to one embodiment (first embodiment) of the present invention. As shown in FIG. 1, in this multilayer ceramic capacitor A, a multilayer ceramic capacitor element (ceramic body) 1 in which a plurality of internal electrodes 2a and 2b are stacked is opposed to each other via a ceramic layer 3 which is a dielectric layer. The pair of end faces 4a and 4b has a structure in which a pair of external electrodes 5a and 5b are disposed so as to be electrically connected to the internal electrodes 2a and 2b.

　そして、外部電極５ａ，５ｂは、
　（ａ）セラミック素体１の表面に形成された、金属を主成分とする金属電極層（この実施形態１では、厚膜電極である銅電極層）５１ａ，５１ｂと、
　（ｂ）金属電極層５１ａ，５１ｂの周縁部を除く主要部は被覆するが、周縁部は露出させるような態様で、金属電極層５１ａ，５１ｂ上に形成された、絶縁性樹脂からなる絶縁性樹脂層５２ａ，５２ｂと、
　（ｃ）絶縁性樹脂層５２ａ，５２ｂを被覆するとともに、先端部（周縁部）が、絶縁性樹脂層５２ａ，５２ｂにより被覆されていない金属電極層５１ａ，５１ｂの周縁部に達して、金属電極層５１ａ，５１ｂと接するような態様で、絶縁性樹脂層５２ａ，５２ｂ上に形成された、導電性材料を含有する樹脂からなる導電性樹脂電極層５３ａ，５３ｂと、
　（ｄ）導電性樹脂電極層５３ａ，５３ｂを被覆するように配設された、ニッケルめっき膜層５４ａ，５４ｂ、および、ニッケルめっき膜層５４ａ，５４ｂを被覆するように配設されたスズめっき膜層５５ａ，５５ｂと
　を備えている。 The external electrodes 5a and 5b are
(A) Metal electrode layers (a copper electrode layer which is a thick film electrode in the first embodiment) 51a and 51b formed on the surface of the ceramic body 1 and containing metal as a main component;
(B) The main part excluding the peripheral part of the metal electrode layers 51a and 51b is covered, but the peripheral part is exposed, and is made of an insulating resin formed on the metal electrode layers 51a and 51b. Resin layers 52a and 52b;
(C) The insulating resin layers 52a and 52b are covered, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered by the insulating resin layers 52a and 52b. Conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
(D) Nickel plating film layers 54a and 54b disposed so as to cover the conductive resin electrode layers 53a and 53b, and tin plating films disposed so as to cover the nickel plating film layers 54a and 54b. And layers 55a and 55b.

　なお、絶縁性樹脂層５２ａ，５２ｂは、上述のように、金属電極層５１ａ，５１ｂの周縁部を除く主要部は被覆するが、その先端部（周縁部）が金属電極層５１ａ，５１ｂの周縁部の手前の領域までしか形成されておらず、セラミック素体１の表面と接していない。 As described above, the insulating resin layers 52a and 52b cover the main part except the peripheral part of the metal electrode layers 51a and 51b, but the tip part (peripheral part) is the peripheral edge of the metal electrode layers 51a and 51b. It is formed only up to the region in front of the part and is not in contact with the surface of the ceramic body 1.

　また、導電性樹脂電極層５３ａ，５３ｂも、絶縁性樹脂層５２ａ，５２ｂを被覆するとともに、先端部（周縁部）が、金属電極層５１ａ，５１ｂの周縁部に達して、金属電極層５１ａ，５１ｂと導通するが、セラミック素体１の表面にまでは達することがなく、セラミック素体１の表面と接しないような態様で配設されている。 The conductive resin electrode layers 53a and 53b also cover the insulating resin layers 52a and 52b, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b. Although it is electrically connected to 51 b, it does not reach the surface of the ceramic body 1, and is arranged in such a manner that it does not contact the surface of the ceramic body 1.

　なお、この実施形態１にかかる積層セラミックコンデンサＡの各部の寸法は以下の通りである。 The dimensions of each part of the multilayer ceramic capacitor A according to the first embodiment are as follows.

　＜セラミック素体＞
　長さ：３．２ｍｍ、幅：２．５ｍｍ、高さ：２．５ｍｍ <Ceramic body>
Length: 3.2mm, width: 2.5mm, height: 2.5mm

　＜金属電極層＞
　（ａ）セラミック素体１の端面４ａ，４ｂにおける金属電極層５１ａ，５１ｂの厚さ：５０μｍ
　（ｂ）金属電極層５１ａ，５１ｂの、セラミック素体１の端面から側面に回り込んだ部分の長さ（ｅ1）：４００μｍ <Metal electrode layer>
(A) Thickness of the metal electrode layers 51a and 51b on the end faces 4a and 4b of the ceramic body 1: 50 μm
(B) Length (e 1 ) of the portion of the metal electrode layers 51a and 51b that wraps around from the end surface of the ceramic body 1 to the side surface: 400 μm

　＜絶縁性樹脂層＞
　（ａ）セラミック素体１の端面４ａ，４ｂにおける絶縁性樹脂層５２ａ，５２ｂの厚さ：８０μｍ
　（ｂ）絶縁性樹脂層５２ａ，５２ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法（ｅ2）：２００μｍ <Insulating resin layer>
(A) Thickness of the insulating resin layers 52a and 52b on the end faces 4a and 4b of the ceramic body 1: 80 μm
(B) Dimensions (e 2 ) of the portions of the insulating resin layers 52a and 52b that wrap around the side surfaces from the end faces 4a and 4b of the ceramic body 1: 200 μm

　＜導電性樹脂電極層＞
　（ａ）セラミック素体１の端面４ａ，４ｂにおける導電性樹脂電極層５３ａ，５３ｂの厚さ：３０μｍ
　（ｂ）導電性樹脂電極層５３ａ，５３ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法（ｅ3）：３００μｍ <Conductive resin electrode layer>
(A) Thickness of the conductive resin electrode layers 53a, 53b on the end faces 4a, 4b of the ceramic body 1: 30 μm
(B) Size (e 3 ) of the portion of the conductive resin electrode layers 53a and 53b that wraps around from the end surfaces 4a and 4b of the ceramic body 1 to the side surface: 300 μm

　＜ニッケルめっき膜層＞
　（ａ）セラミック素体１の端面４ａ，４ｂにおけるニッケルめっき膜層５４ａ，５４ｂの厚さ：３．５μｍ
　なお、ニッケルめっき膜層５４ａ，５４ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法は、金属電極５１ａ，５１ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法（ｅ1）と同じである。 <Nickel plating film layer>
(A) Thickness of the nickel plating film layers 54a and 54b on the end faces 4a and 4b of the ceramic body 1: 3.5 μm
The dimensions of the portions of the nickel plating film layers 54a and 54b that wrap around from the end faces 4a and 4b of the ceramic body 1 to the side faces of the metal electrodes 51a and 51b from the end faces 4a and 4b of the ceramic body 1 to the side faces. It is the same as the dimension (e 1 ) of the wraparound part.

　＜スズめっき膜層＞
　（ａ）セラミック素体１の端面４ａ，４ｂにおけるスズめっき膜層５５ａ，５５ｂの厚さ：３．５μｍ
　なお、スズめっき膜層５５ａ，５５ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法は、金属電極５１ａ，５１ｂの、セラミック素体１の端面４ａ，４ｂから側面に回り込んだ部分の寸法（ｅ1）と同じである。 <Tin plating film layer>
(A) Thickness of the tin plating film layers 55a and 55b on the end faces 4a and 4b of the ceramic body 1: 3.5 μm
The dimensions of the portions of the tin plating film layers 55a and 55b that wrap around from the end faces 4a and 4b of the ceramic body 1 to the side faces of the metal electrodes 51a and 51b from the end faces 4a and 4b of the ceramic body 1 to the side faces. It is the same as the dimension (e 1 ) of the wraparound part.

　次に、上述の積層セラミックコンデンサＡの製造方法について説明する。
　（１）上述の積層セラミックコンデンサＡを製造するにあたっては、まず、セラミック素体１を用意する。このセラミック素体１の作製方法に特別の制約はなく、例えば、導電性ペーストを塗布することにより表面に内部電極パターンを形成したセラミックグリーンシートを積層する工程を経て作製することができる。さらに、上述のような積層工法に限らず、セラミックスラリー、導電性ペーストなどを順次塗布して積層体を形成する工法などによっても作製することができる。 Next, a method for manufacturing the above-described multilayer ceramic capacitor A will be described.
(1) In manufacturing the above-described multilayer ceramic capacitor A, first, the ceramic body 1 is prepared. There are no particular restrictions on the method of manufacturing the ceramic body 1, and for example, it can be manufactured through a process of laminating ceramic green sheets having internal electrode patterns formed on the surface by applying a conductive paste. Furthermore, the present invention is not limited to the above-described laminating method, and it can be manufactured by a method of forming a laminated body by sequentially applying ceramic slurry, conductive paste, or the like.

　（２）次に、セラミック素体１の表面に銅粉末を導電成分とする導電性ペーストを塗布し、焼き付けることにより、金属を主成分とする金属電極層（銅電極層）５１ａ，５１ｂを形成する。この実施形態１では、金属電極層（銅電極層）５１ａ，５１ｂはいわゆる厚膜電極である。 (2) Next, a conductive paste containing copper powder as a conductive component is applied to the surface of the ceramic body 1 and baked to form metal electrode layers (copper electrode layers) 51a and 51b mainly containing metal. To do. In the first embodiment, the metal electrode layers (copper electrode layers) 51a and 51b are so-called thick film electrodes.

　（３）それから、セラミック素体１に形成された金属電極層５１ａ，５１ｂの、周縁部を除く主要部は被覆するが、周縁部は露出させるような態様で、ビスＡエポキシ樹脂（ＪＥＲ８２８）と、イミダゾール（２Ｅ４ＭＺ）を配合した樹脂（ビスＡエポキシ樹脂／イミダゾール＝１００／５ｐｈｒ）を、銅電極層（金属電極層）５１ａ，５１ｂ上に塗布し、硬化させることにより、絶縁性樹脂層５２ａ，５２ｂを形成する。なお、絶縁性樹脂層５２ａ，５２ｂを形成するにあたっては、その先端部（周縁部）がセラミック素体１の表面と接しないように形成する。 (3) Then, the metal electrode layers 51a and 51b formed on the ceramic body 1 are covered with the main portion except the peripheral portion, but the peripheral portion is exposed, with the bis A epoxy resin (JER828) and The resin (bis A epoxy resin / imidazole = 100/5 phr) blended with imidazole (2E4MZ) is applied onto the copper electrode layers (metal electrode layers) 51a and 51b and cured, whereby the insulating resin layers 52a, 52b is formed. In forming the insulating resin layers 52 a and 52 b, the insulating resin layers 52 a and 52 b are formed so that their tip portions (peripheral portions) do not contact the surface of the ceramic body 1.

　（４）次に、ビスＡエポキシ樹脂（ＪＥＲ８２８）と、イミダゾール（２Ｅ４ＭＺ）と、球状銀粉末（Ｄ50＝１．０μｍ）と、偏平状銀粉末（Ｄ50＝３．５μｍ）と、ブチルカルビトールを配合した導電性樹脂材料（ビスＡエポキシ樹脂／イミダゾール／球状銀粉末／偏平状銀粉末／ブチルカルビトール＝１００／５／３５０／３５０／７０ｐｈｒ）を、絶縁性樹脂層５２ａ，５２ｂを被覆するとともに、先端部（周縁部）が、絶縁性樹脂層５２ａ，５２ｂにより被覆されていない金属電極層５１ａ，５１ｂの周縁部に達して、金属電極層５１ａ，５１ｂと接するように塗布する。
　そして、塗布された導電性樹脂膜を１００℃で５時間乾燥した後、１２０℃で１時間加熱して硬化させることにより、導電性樹脂電極層５３ａ，５３ｂを形成する。 (4) Next, bis A epoxy resin (JER828), imidazole (2E4MZ), spherical silver powder (D 50 = 1.0 μm), flat silver powder (D 50 = 3.5 μm), butyl carbite Conductive resin material blended with Thor (bis A epoxy resin / imidazole / spherical silver powder / flat silver powder / butyl carbitol = 100/5/350/350/70 phr) and covering the insulating resin layers 52a and 52b At the same time, the coating is performed so that the front end portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered with the insulating resin layers 52a and 52b and come into contact with the metal electrode layers 51a and 51b.
Then, the applied conductive resin film is dried at 100 ° C. for 5 hours, and then heated and cured at 120 ° C. for 1 hour to form the conductive resin electrode layers 53a and 53b.

　（５）次に、ニッケル電解めっきを行って、導電性樹脂電極層５３ａ，５３ｂを被覆するようにニッケルめっき膜層５４ａ，５４ｂを形成する。 (5) Next, nickel electroplating is performed to form nickel plating film layers 54a and 54b so as to cover the conductive resin electrode layers 53a and 53b.

　（６）さらに、スズ電解めっきを行って、ニッケルめっき膜層５４ａ，５４ｂは被覆するようにスズめっき膜層５５ａ，５５ｂを形成する。
　これにより、図１に示すような構造を有する積層セラミックコンデンサＡが得られる。 (6) Further, tin electroplating is performed to form tin plating film layers 55a and 55b so as to cover the nickel plating film layers 54a and 54b.
Thereby, a multilayer ceramic capacitor A having a structure as shown in FIG. 1 is obtained.

　この積層セラミックコンデンサにおいては、導電性物質を含まない絶縁性樹脂と、所望の導電性を備えた導電性樹脂とを組み合わせて用いているので、外部電極における樹脂層の割合が、撓みを吸収して、十分な耐熱衝撃性を実現するのに必要な割合となるようにした場合にも、高価な導電性樹脂の一部を、低コストの絶縁性樹脂に置き換えることが可能になる。その結果、耐熱衝撃性などの特性の低下を招いたりすることなく、コストダウンを図ることができる。 In this multilayer ceramic capacitor, an insulating resin not containing a conductive substance is used in combination with a conductive resin having a desired conductivity. Therefore, the ratio of the resin layer in the external electrode absorbs the deflection. Thus, even when the ratio is necessary to achieve sufficient thermal shock resistance, a part of the expensive conductive resin can be replaced with a low-cost insulating resin. As a result, cost reduction can be achieved without causing deterioration of characteristics such as thermal shock resistance.

　具体的には、この実施形態１の構成の場合、絶縁性樹脂層と導電性樹脂電極層とを組み合わせることなく、樹脂層をすべて導電性樹脂電極層とした場合に比べて、寸法や形状を維持したまま、製品全体のコストを３．２％低減することができる。 Specifically, in the case of the configuration of the first embodiment, the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.2%.

　また、絶縁性樹脂層、導電性樹脂電極層を、その周縁先端部がセラミック素体と接しないような態様で配設するようにしているので、上述の絶縁性樹脂層、導電性樹脂電極層などの剥離を防止することが可能な、信頼性の高い積層セラミックコンデンサを得ることができる。 Further, since the insulating resin layer and the conductive resin electrode layer are arranged in such a manner that the peripheral tip portion thereof is not in contact with the ceramic body, the above-mentioned insulating resin layer and conductive resin electrode layer are provided. Thus, it is possible to obtain a highly reliable multilayer ceramic capacitor that can prevent such peeling.

［実施形態２］
　上記の実施形態１では、絶縁性樹脂として、ビスＡエポキシ樹脂（ＪＥＲ８２８）と、イミダゾール（２Ｅ４ＭＺ）を配合した樹脂（ビスＡエポキシ樹脂／イミダゾール＝１００／５ｐｈｒ）を用いたが、この実施形態２では、絶縁性樹脂として、ビスＡエポキシ樹脂（ＪＥＲ８２８）と、イミダゾール（２Ｅ４ＭＺ）と、球状シリカ（東亜合成ＨＰＳ－３５００）とを、ビスＡエポキシ樹脂／イミダゾール／球状シリカ＝１００／５／５０ｐｈｒの割合で配合したものを用いて、積層セラミックコンデンサを作製した。 [Embodiment 2]
In the first embodiment, a resin (bis A epoxy resin / imidazole = 100/5 phr) containing bis A epoxy resin (JER828) and imidazole (2E4MZ) was used as the insulating resin. Then, as the insulating resin, bis A epoxy resin (JER828), imidazole (2E4MZ), and spherical silica (Toa Gosei HPS-3500), bis A epoxy resin / imidazole / spherical silica = 100/5/50 phr. A monolithic ceramic capacitor was produced using the compounded in proportion.

　なお、この実施形態２では、絶縁性樹脂として上述の組成のものを用いたことを除いて、上記実施形態１の場合と同じ条件で、同じ工程を経て、積層セラミックコンデンサを作製した。 In the second embodiment, a laminated ceramic capacitor was manufactured through the same process under the same conditions as in the first embodiment except that the insulating resin having the above-described composition was used.

　この実施形態２の場合にも、上記実施形態１の場合と同様の作用効果を得ることができる。 In the case of the second embodiment, the same operation and effect as in the first embodiment can be obtained.

　具体的には、この実施形態２の構成の場合、絶縁性樹脂層と導電性樹脂電極層とを組み合わせることなく、樹脂層をすべて導電性樹脂電極層とした場合に比べて、寸法や形状を維持したまま、製品全体のコストを３．８％低減することができる。 Specifically, in the case of the configuration of the second embodiment, the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.8%.

　上記実施形態１および２では、セラミック電子部品としてチップ型の積層セラミックコンデンサを例にとって説明したが、本発明は、積層セラミックコンデンサに限らず、例えば、ＬＣ複合部品や積層バリスタなどの、セラミック素体の表面に外部電極を有する種々のセラミック電子部品に適用することが可能である。 In the first and second embodiments, the chip-type multilayer ceramic capacitor has been described as an example of the ceramic electronic component. However, the present invention is not limited to the multilayer ceramic capacitor, and for example, a ceramic body such as an LC composite component or a multilayer varistor. The present invention can be applied to various ceramic electronic components having external electrodes on the surface thereof.

　また、上記実施形態１および２では、絶縁性樹脂層の形成に、ビスＡエポキシ樹脂／イミダゾール＝１００／５ｐｈｒの絶縁性樹脂あるいは、ビスＡエポキシ樹脂／イミダゾール／球状シリカ＝１００／５／５０ｐｈｒの絶縁性樹脂を使用したが、例えば、他のエポキシ樹脂、フェノール樹脂、ウレタン樹脂、ポリイミド樹脂、シリコン樹脂などの他の絶縁樹脂を用いることも可能である。 In the first and second embodiments, the insulating resin layer is formed by using bis A epoxy resin / imidazole = 100/5 phr insulating resin or bis A epoxy resin / imidazole / spherical silica = 100/5/50 phr. Although the insulating resin is used, for example, other insulating resins such as other epoxy resins, phenol resins, urethane resins, polyimide resins, and silicon resins can be used.

　また、上記実施形態１および２では、導電性樹脂電極層の形成に、ビスＡエポキシ樹脂／イミダゾール／球状銀粉末／偏平状銀粉末／ブチルカルビトール＝１００／５／３５０／７０ｐｈｒ）の導電性樹脂を用いたが、導電性樹脂電極層を形成するための導電性樹脂としては、例えば、他のエポキシ樹脂、フェノール樹脂、ウレタン樹脂、ポリイミド樹脂、シリコン樹脂などの樹脂に、銅粉末、銀コート銅粉末、錫コート銅粉末、ニッケル粉末、銀コートニッケル粉末、錫粉末などの導電性粉末を配合したものなど、他の組成の導電性樹脂を用いることも可能である。 In the first and second embodiments, the conductive resin electrode layer is formed by the conductivity of bis A epoxy resin / imidazole / spherical silver powder / flat silver powder / butyl carbitol = 100/5/350/70 phr). Resin was used, but as conductive resin for forming conductive resin electrode layer, for example, other epoxy resin, phenol resin, urethane resin, polyimide resin, silicon resin, etc., copper powder, silver coating It is also possible to use conductive resins having other compositions such as those containing conductive powders such as copper powder, tin-coated copper powder, nickel powder, silver-coated nickel powder and tin powder.

　また、上記実施形態１および２では、めっき膜層がニッケルめっき膜層およびスズめっき膜層である場合を例にとって説明したが、他の種類の材料からなるめっき膜とすることも可能である。
　また、場合によっては、めっき膜層を備えていない構成とすることも可能である。 In the first and second embodiments, the case where the plating film layer is a nickel plating film layer and a tin plating film layer has been described as an example. However, a plating film made of other types of materials may be used.
In some cases, it is possible to adopt a configuration in which no plating film layer is provided.

　本発明はさらにその他の点においても上記実施形態１および２に限定されるものではなく、発明の範囲内において、種々の応用、変形を加えることが可能である。 The present invention is not limited to Embodiments 1 and 2 in other points, and various applications and modifications can be added within the scope of the invention.

　１　　　　　　　　セラミック素体（積層セラミックコンデンサ素子）
　２ａ，２ｂ　　　　内部電極
　３　　　　　　　　セラミック層
　４ａ，４ｂ　　　　セラミック素体の互いに対向する一対の両端面
　５ａ，５ｂ　　　　外部電極
　５１ａ，５１ｂ　　金属電極層（銅電極層）
　５２ａ，５２ｂ　　絶縁性樹脂層
　５３ａ，５３ｂ　　導電性樹脂電極層
　５４ａ，５４ｂ　　ニッケルめっき膜層
　５５ａ，５５ｂ　　スズめっき膜層
　ｅ1　金属電極層のセラミック素体の端面から側面に回り込んだ部分の長さ
　ｅ2　絶縁性樹脂層のセラミック素体の端面から側面に回り込んだ部分の長さ
　ｅ3　導電性樹脂電極層のセラミック素体の端面から側面に回り込んだ部分の長さ
　Ａ　　　　　　　　積層セラミックコンデンサ（セラミック電子部品） 1 Ceramic body (multilayer ceramic capacitor element)
2a, 2b Internal electrode 3 Ceramic layer 4a, 4b A pair of opposite end faces 5a, 5b of the ceramic body 5a, 5b External electrode 51a, 51b Metal electrode layer (copper electrode layer)
52a, 52b Insulating resin layer 53a, 53b Conductive resin electrode layer 54a, 54b Nickel plating film layer 55a, 55b Tin plating film layer e 1 Length of the portion of the metal electrode layer that extends from the end surface to the side surface of the ceramic body e 2 Length of the portion of the insulating resin layer that extends from the end surface of the ceramic body to the side surface e 3 Length of the portion of the conductive resin electrode layer that extends from the end surface of the ceramic body to the side surface A Multilayer ceramic capacitor ( Ceramic electronic components)

Claims (3)

　セラミック素体と、セラミック素体の表面に形成された外部電極とを備えたセラミック電子部品であって、
　前記外部電極が、
　セラミック素体の表面に形成された、金属を主成分とする金属電極層と、
　前記金属電極層の主要部を被覆し、周縁部を露出させるように前記金属電極層上に形成された、絶縁性の樹脂からなる絶縁性樹脂層と、
　前記絶縁性樹脂層を被覆するとともに、先端部が、前記絶縁性樹脂層により被覆されていない前記金属電極層の前記周縁部に達して、前記金属電極層と接するように前記絶縁性樹脂層上に形成された、導電性材料を含有する樹脂からなる導電性樹脂電極層と
　を備えていることを特徴とするセラミック電子部品。 A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
The external electrode is
A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
The insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. A ceramic electronic component comprising: a conductive resin electrode layer made of a resin containing a conductive material. 　前記絶縁性樹脂層は、その先端部が前記セラミック素体の表面にまで達することなく、前記セラミック素体の表面と接しないように形成されていることを特徴とする請求項１記載のセラミック電子部品。 2. The ceramic electronic according to claim 1, wherein the insulating resin layer is formed so that a tip portion thereof does not reach a surface of the ceramic body and does not contact a surface of the ceramic body. 3. parts. 　前記導電性樹脂電極層の表面が、めっき膜層により被覆されていることを特徴とする請求項１または２記載のセラミック電子部品。 3. The ceramic electronic component according to claim 1, wherein a surface of the conductive resin electrode layer is covered with a plating film layer.
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