WO2014021521A1 - 경화성 수지 조성물, 그 경화 방법 및 그로부터 제조된 시트 - Google Patents
경화성 수지 조성물, 그 경화 방법 및 그로부터 제조된 시트 Download PDFInfo
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- WO2014021521A1 WO2014021521A1 PCT/KR2012/011615 KR2012011615W WO2014021521A1 WO 2014021521 A1 WO2014021521 A1 WO 2014021521A1 KR 2012011615 W KR2012011615 W KR 2012011615W WO 2014021521 A1 WO2014021521 A1 WO 2014021521A1
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- resin composition
- curable resin
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- cured product
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
Definitions
- It relates to a curable resin composition, a curing method thereof, and a sheet produced therefrom.
- Another embodiment of the present invention provides a sheet using the curable resin composition.
- a curable resin composition comprising a curable compound, a photoinitiator, and at least two thermal initiators having different initiation reaction temperatures.
- the molecular weight distribution of the cured product of the curable resin composition may have at least two peaks.
- the cured product of the curable resin composition may have at least two glass transition temperatures.
- the thermal initiator comprises a first thermal initiator and a second thermal initiator, wherein the second initiator initiates a curing reaction at a higher temperature than the first thermal initiator.
- the first thermal initiator may initiate a curing reaction at about 30 to about 70 ° C.
- the second thermal initiator may initiate a curing reaction at about 60 to about 100 ° C.
- the curable compound may be an acrylic compound.
- the multifunctional acrylate crosslinking agent may be further included.
- the curable resin composition further includes at least one additive selected from the group consisting of a thermally conductive additive, a flame retardant, a pigment, an antioxidant, an ultraviolet stabilizer, a dispersant, an antifoaming agent, a thickener, a plasticizer, a tackifying resin, a silane coupling agent, and a combination thereof. can do.
- a sheet including the cured product layer of the curable resin composition is provided.
- the cured product layer may have a first peak at a number average molecular weight of about 10 4 to about 10 5 or less, and a second peak at a number average molecular weight of greater than about 10 5 to about 10 6 .
- the cured product layer may have a first glass transition temperature at about 45 to about 85 ° C. and a second glass transition temperature at about 100 to about 130 ° C.
- the cured layer may have a first glass transition temperature at about 45 to about 60 ° C., a second glass transition temperature at about 65 to about 85 ° C., and a third glass transition temperature at about 100 to about 130 ° C. have.
- the sheet is a base film; And the cured product layer formed on one or both surfaces of the base film.
- the cured product layer may be a layer formed of a cured product obtained by sequentially performing the first thermosetting step, the photocuring step by light irradiation, and the second thermosetting step of the curable resin composition.
- the first thermosetting step of performing a thermosetting on the curable resin composition comprising a curable compound, a photoinitiator, at least two thermal initiators having different initiation reaction temperature;
- it provides a curing method comprising a secondary heat curing step of performing a heat curing by heating the result of the photocuring.
- the first heat curing step, the photocuring step and the second heat curing step may be performed sequentially.
- the photocuring step may be performed by irradiation with UV.
- the curable resin composition can improve the curing rate while having a high conversion rate, and is suitable for thick film production.
- a curable compound in one embodiment, provides a curable compound, a photoinitiator, a curable resin composition comprising at least two thermal initiators having different initiation reaction temperatures.
- the curable resin composition may be cured by a photocuring step and a thermosetting step of at least two steps.
- the thermosetting step is performed at each of the different temperatures by at least two thermal initiators that initiate the thermosetting reaction at different temperatures. That is, at least two independent heat curing steps by different kinds of thermal initiators may be performed on the curable resin composition.
- the molecular weight distribution of the cured product has at least two peaks.
- One of the peaks is due to the resin formed by photocuring, and the other at least one peak is due to the resin formed by thermosetting.
- the cured product is formed by at least two heat curing steps, since the resin formed in each heat curing step may have a similar molecular weight distribution, it may be formed as one fused peak without forming a separate peak in the molecular weight distribution. Can be.
- the cured product has at least two glass transition temperatures.
- One of the at least two glass transition temperatures is due to the resin formed by photocuring, and the other at least one glass transition temperature is due to the resin formed by thermosetting.
- the cured product is formed by at least two thermosetting steps, the resin formed in each thermosetting step may be formed as a resin having similar characteristics and structures, and thus have no different glass transition temperature and thus close to similar glass transition temperatures. It can have However, depending on the type of resin used, it is possible to form a resin having characteristics and structures which are distinguished according to each thermosetting step having a different starting temperature. In this case, the cured product of the curable resin composition may have at least three glass transition temperatures. Can be represented.
- the thermal initiator is a curing reaction at a temperature higher than the initiation temperature of the curing reaction of the first thermal initiator and the first thermal initiator at about 30 to 70 °C, specifically about 40 to 60 °C
- Two kinds of thermal initiators may be used, including the second thermal initiator that discloses.
- the second thermal initiator may be, for example, a thermal initiator that reacts at about 60 to about 100 ° C, specifically about 70 to about 90 ° C.
- the photoinitiator may be reacted by light irradiation such as UV in the manufacturing process of the pressure sensitive adhesive sheet to initiate a curing reaction of the pressure sensitive adhesive composition.
- a specific kind of the photoinitiator is not particularly limited, and examples thereof include ⁇ -hydroxy ketone compounds (ex. IRGACURE 184, IRGACURE 500, IRGACURE 2959, DAROCUR 1173; Ciba Specialty Chemicals (manufactured)); Phenylglyoxylate compounds (ex. IRGACURE 754, DAROCUR MBF; Ciba Specialty Chemicals); Benzyl dimethyl ketal compounds (ex. IRGACURE 651; Ciba Specialty Chemicals); ⁇ -amino ketone compounds (ex.
- MAPO Monoacylphosphin
- the photoinitiator may adjust the degree of polymerization of the pressure-sensitive adhesive according to the amount thereof used, for example, about 0.01 parts by weight to about 10 parts by weight, specifically about 0.1 parts by weight to about 5 parts by weight, based on 100 parts by weight of the curable compound. Specifically, it may be included in an amount of about 0.1 parts by weight to about 3 parts by weight, more specifically about 0.1 parts by weight to about 1.5 parts by weight.
- a photoinitiator may be included in the content in the above range to allow a curing reaction of the curable resin composition to be smoothly performed and to reduce residual components after the curing reaction.
- the specific kind of the thermal initiator is not particularly limited, and examples thereof include 2,2'-azobis (2-methylbutyronitrile), 2,2'-azobis (isobutyronitrile), and 2,2'- Azobis (2,4-dimethylvaleronitrile), 4,4-azobis (4-cyanovaleric acid), 1,1'-azobis (cyclohexanecarbonitrile) and 2,2'-azobis ( Azo compounds such as 4-methoxy-2,4-dimethylvaleronitrile); Tetramethylbutyl peroxy neodecanoate (ex. Perocta ND, NOF Co., Ltd.), bis (4-butylcyclohexyl) peroxydicarbonate (ex.
- Perhexyl ND, NOF Co., Ltd. dimethoxybutyl peroxy dicarbonate (ex. Peroyl MBP, NOF Co., Ltd.), bis (3-methoxy 3-methoxybutyl) peroxy dicarbonate (ex. Peroyl SOP, NOF Co., Ltd.), dibutyl peroxy dicarbonate, dicetyl peroxy dicarbonate, dimyristyl peroxy di Carbonate, 1,1,3,3-te Lamethylbutyl peroxypivalate, hexyl peroxy pivalate (ex. Perhexyl PV, NOF Co., Ltd.), butyl peroxy pivalate (ex.
- the thermal initiator may adjust the degree of polymerization of the pressure-sensitive adhesive according to the amount used, for example, about 0.01 parts by weight to about 10 parts by weight, specifically about 0.1 parts by weight to about 5 parts by weight, based on 100 parts by weight of the curable compound, More specifically, it may be included in an amount of about 0.1 parts by weight to about 3 parts by weight, more specifically about 0.1 parts by weight to about 1.5 parts by weight.
- a photoinitiator may be included in the content in the above range to allow a curing reaction of the curable resin composition to be smoothly performed and to reduce residual components after the curing reaction.
- the curable resin composition may have a weight ratio of the photoinitiator and the thermal initiator, and a [thermal initiator / photoinitiator] of about 0.5 to about 10, specifically about 0.5 to about 5, and more specifically about 0.5 to about 3.
- the said curable compound can use a well-known compound without a restriction
- the kind of the acryl-based compound is not particularly limited, and specifically, may be an alkyl (meth) acrylic acid ester compound having a C1-C12 alkyl group. More specifically, the alkyl (meth) acrylic acid ester compound is methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) ) Acrylate, t-butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n -Octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acryl
- Examples of the crosslinkable functional group-containing monomer that can be used at this time include, but are not limited to, hydroxy group-containing monomers, carboxyl group-containing monomers and nitrogen-containing monomers.
- Examples of the hydroxy group-containing monomers above include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) Acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate, and examples of the carboxyl group-containing monomer are (meth ) Acrylic acid, 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid and maleic acid Anhydrides can be
- the crosslinkable functional group-containing monomer may be included in an amount of about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the (meth) acrylic acid ester compound in the aforementioned copolymer.
- the curable resin composition may further include from about 0.05 part by weight to about 5 parts by weight of a crosslinking agent based on 100 parts by weight of the curable compound in view of improving cohesion.
- a crosslinking agent based on 100 parts by weight of the curable compound in view of improving cohesion.
- the adhesive physical properties can be adjusted.
- crosslinking agent is not specifically limited, It is preferable that it is a component which can participate in the hardening reaction by ultraviolet irradiation and heat.
- crosslinking agents include polyfunctional acrylates.
- the multifunctional acrylate include 1,2-ethylene glycol diacrylate, 1,12-dodetandiol acrylate, 1,4-butanediol di (meth) acrylate, and 1,6-hexanediol di ( Meta) acrylate, neopentylglycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, neopentylglycol adipate di (meth) acrylate, hydroxyl piivalic acid neo Pentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (meth) acrylate, di (meth) ) Acryloxy ethyl isocyanurate, allylated cyclohexyl di (meth) acrylate,
- Such a crosslinking agent may be included in an amount of about 0.05 parts by weight to about 5 parts by weight based on 100 parts by weight of the curable compound.
- the curable resin composition suitably includes at least one additive selected from the group consisting of a thermally conductive additive, a flame retardant, a pigment, an antioxidant, an ultraviolet stabilizer, a dispersant, an antifoaming agent, a thickener, a plasticizer, a tackifying resin, a silane coupling agent, and a combination thereof. can do.
- the step of performing the first heat curing on the curable resin composition comprising a curable compound, a photoinitiator, at least two thermal initiators having different initiation reaction temperature;
- it provides a curing method comprising a secondary heat curing step of performing a secondary heat curing by heating the result of the photocuring.
- the first heat curing step is carried out at about 30 to about 70 °C, specifically about 40 to about 60 °C
- the second heat curing step is carried out at about 60 to about 100 °C, specifically about 70 to about 90 °C can do.
- the secondary thermal curing step may be performed at a higher temperature than the primary thermal curing step.
- the primary thermal curing step, the photocuring step, and the secondary thermal curing step may be sequentially performed.
- the first heat curing step may be performed for about 30 minutes to about 60 minutes, for example.
- the photocuring step may be performed by light irradiation such as UV.
- the first heat curing step may be performed for about 30 minutes to about 60 minutes, and then converted into a photocuring step by light irradiation.
- the photocuring step can be carried out, for example, for about 0.5 minutes to about 5 minutes.
- the photocuring method is not particularly limited, and may be performed by, for example, irradiating ultraviolet rays to a material to be cured (the curable resin composition) using a means such as a high pressure mercury lamp, an electrodeless lamp, or a xenon lamp. have.
- the irradiation amount of ultraviolet rays is not particularly limited as long as it is controlled to such a degree that sufficient curing is achieved without compromising the overall physical properties of the cured product.
- the photocuring reaction by the photoinitiator in the curable material (the curable resin composition or the curable resin composition subjected to the first thermosetting) is induced, but the photocuring reaction is performed at this time. Since heat generated may be insufficient to induce a secondary thermosetting reaction, it is possible to perform a stepwise, sequential three-step curing reaction by initiating a secondary thermosetting polymerization reaction by a thermal initiator through a separate temperature rising step.
- the additional temperature raising step may be performed by means such as hot air or infrared heating after ultraviolet irradiation.
- a sheet including a cured product layer containing a cured product of the curable resin composition is provided.
- the sheet may include a cured product layer formed as a cured product by using the curable resin composition, and thus may include a single cured layer of a thick thickness manufactured by a simple process while maintaining uniform physical properties of the surface and the inside.
- the cured product layer is a layer formed by curing the above-described curable resin composition by an independent and sequential primary thermosetting-photocuring-secondary thermosetting step, and the molecular weight distribution of the cured product layer has at least two peaks. Can be.
- the cured layer may have one peak at a number average molecular weight of about 10 4 to about 10 5 or less and another peak at a number average molecular weight of greater than about 10 5 to about 10 6 .
- the cured product layer is a layer formed by the curable resin composition described above independently cured by a sequential primary thermosetting-photocuring-secondary thermosetting step, the cured product layer is at least two glass transition temperature. It can have
- the cured layer may have one glass transition temperature at about 45 to about 85 ° C. and another glass transition temperature at about 100 to about 130 ° C.
- the cured layer may have a first glass transition temperature at about 50 to about 70 ° C., and a second glass transition temperature at about 100 to about 130 ° C.
- the specific kind of the base film included in the sheet is not particularly limited, and a general film known in the art may be used without limitation. Specifically, various plastic films, papers, nonwovens, glass, or metals can be used as the base film.
- the base film may use a plastic film such as polyethylene terephthalate (PET).
- the curable resin composition can be cured according to the above-described method to produce a thick film having a uniform physical property inside and on the surface thereof.
- the thickness of the cured layer may be about 3 mm or more, specifically about 4.0 mm or more, and more specifically about 5.0 mm or more.
- an upper limit of the thickness of the cured product layer is not particularly limited, and may be, for example, about 10 mm or less, about 9 mm or less, or about 8 mm or less.
- the cured product layer may be made of a thick film having a thickness in the above range so that it may not require excessive energy by excellent curing efficiency, thereby suppressing damage occurring on the surface of the layer.
- each monomer (ex. (Meth) acrylic acid ester monomer and crosslinkable functional group-containing monomer) contained in the copolymer which will form the curable resin is partially polymerized, preferably partially polymerized by heat, and the thermal initiator is And by adding an additive including a photoinitiator, it is possible to prepare a coating liquid by adjusting the viscosity in an appropriate range (ex. 100 cps to 10,000 cps).
- the coating solution prepared as described above is coated on a base film or a release paper, and then the first thermal curing-photocuring-secondary thermosetting as in the above-described method.
- a cured layer was formed in the same manner as in Example 1 except that the photocuring step by UV irradiation was increased to 2.0 minutes.
- Example 1 First glass transition temperature 53.3 2nd glass transition temperature 79.3 3rd glass transition temperature 123.2
- Example 2 First glass transition temperature 53.1 2nd glass transition temperature 77.5 3rd glass transition temperature 121.5
- Example 3 First glass transition temperature 53.0 2nd glass transition temperature 75.4 3rd glass transition temperature 120.5
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- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Description
| 구분 | 수평균 분자량(Mn) | 중량평균 분자량(Mw) | 다분산지수(PDI = Mw/Mn) |
| 제1 피크 | 1.08 x 105 | 1.57 x 105 | 1.45 |
| 제2 피크 | 1.17 x 106 | 1.40 x 106 | 1.20 |
| 구분 | Tg 측정값 (℃) | |
| 실시예 1 | 제1 유리전이온도 | 53.3 |
| 제2 유리전이온도 | 79.3 | |
| 제3 유리전이온도 | 123.2 | |
| 실시예 2 | 제1 유리전이온도 | 53.1 |
| 제2 유리전이온도 | 77.5 | |
| 제3 유리전이온도 | 121.5 | |
| 실시예 3 | 제1 유리전이온도 | 53.0 |
| 제2 유리전이온도 | 75.4 | |
| 제3 유리전이온도 | 120.5 | |
Claims (20)
- 경화성 화합물, 광개시제, 개시반응 온도가 다른 적어도 2종의 열개시제를 포함하는 경화성 수지 조성물.
- 제1항에 있어서,상기 경화성 수지 조성물의 경화물의 분자량 분포가 적어도 2개의 피크를 갖는경화성 수지 조성물.
- 제1항에 있어서,상기 경화성 수지 조성물의 경화물은 적어도 2개의 유리전이온도를 갖는경화성 수지 조성물.
- 제1항에 있어서,상기 열개시제는 제1 열개시제 및 제2 열개시제를 포함하고, 상기 제2 열개시제는 상기 제1 열개시제보다 높은 온도에서 경화반응을 개시하는경화성 수지 조성물.
- 제4항에 있어서,상기 제1 열개시제는 30 내지 70℃에서 경화 반응을 개시하는경화성 수지 조성물.
- 제1항에 있어서,상기 제2 열개시제는 60 내지 100℃에서 경화 반응을 개시하는경화성 수지 조성물.
- 제1항에 있어서,상기 경화성 화합물이 아크릴계 화합물인경화성 수지 조성물.
- 제1항에 있어서,상기 다관능성 아크릴레이트 가교제를 더 포함하는경화성 수지 조성물.
- 제1항에 있어서,상기 경화성 수지 조성물이 열전도성 첨가제, 난연제, 안료, 산화 방지제, 자외선 안정제, 분산제, 소포제, 증점제, 가소제, 점착성 부여 수지, 실란 커플링제 및 이들의 조합으로 이루어진 군으로부터 선택된 적어도 하나의 첨가제를 더 포함하는경화성 수지 조성물.
- 제1항 내지 제9항 중 어느 한 항에 따른 경화성 수지 조성물의 경화물 층을 포함하는 시트.
- 제10항에 있어서,상기 경화물 층은 수평균 분자량 104 내지 105 이하에서 제1 피크를 갖고, 수평균 분자량 105 초과 내지 약 106에서 제2 피크를 갖는시트.
- 제10항에 있어서,상기 경화물 층은 45 내지 85℃에서 제1 유리전이온도를 갖고, 100 내지 130℃에서 제2 유리전이온도를 갖는시트.
- 제10항에 있어서,상기 경화물 층은 45 내지 60℃에서 제1 유리전이온도를 갖고, 65 내지 85℃에서 제2 유리전이온도를 갖고, 100 내지 130℃에서 제3 유리전이온도를 갖는시트.
- 제10항에 있어서,기재 필름; 및상기 기재 필름의 일면 또는 양면에 형성된 상기 경화물 층을 포함하는 시트.
- 제10항에 있어서,상기 경화물 층의 두께는 3.0 mm 내지 10.0 mm임시트.
- 제10항에 있어서,상기 경화물 층은 상기 경화성 수지 조성물을 1차 열경화 단계, 광조사에 의한 광경화 단계 및 2차 열경화 단계를 순차적으로 수행하여 얻어진 경화물로 형성된 층인시트.
- 경화성 화합물, 광개시제, 개시반응 온도가 다른 적어도 2종의 열개시제를 포함하는 경화성 수지 조성물에 대하여 열경화 수행하는 1차 열경화 단계;상기 열경화 수행된 결과물에 광조사하여 광경화 수행하는 광경화 단계; 및상기 광경화 수행된 결과물을 승온하여 열경화를 수행하는 2차 열경화 단계를 포함하는 경화 방법.
- 제17항에 있어서,상기 1차 열경화 단계, 상기 광경화 단계 및 상기 2차 열경화 단계를 순차적으로 수행하는경화 방법.
- 제17항에 있어서,상기 1차 열경화 단계를 30 내지 70℃에서 수행하고, 상기 2차 열경화 단계를 60 내지 100℃에서 수행하고,상기 2차 열경화 단계는 상기 1차 열경화 단계에서 보다 높은 온도에서 수행하는경화 방법.
- 제17항에 있어서,상기 광경화 단계는 UV를 조사하여 수행하는경화 방법.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015525313A JP6425229B2 (ja) | 2012-07-30 | 2012-12-27 | 硬化性樹脂組成物、その硬化方法及びそれから製造されたシート |
| CN201280075066.6A CN104507983B (zh) | 2012-07-30 | 2012-12-27 | 固化性树脂组合物及其固化方法以及由该方法制备的薄片 |
| US14/415,030 US10590217B2 (en) | 2012-07-30 | 2012-12-27 | Curable resin composition, method for curing same, and sheet manufactured therefrom |
| EP12882190.7A EP2881405B1 (en) | 2012-07-30 | 2012-12-27 | Curable resin composition, method for curing same, and sheet manufactured therefrom |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120083539A KR101545377B1 (ko) | 2012-07-30 | 2012-07-30 | 경화성 수지 조성물, 그 경화 방법 및 그로부터 제조된 시트 |
| KR10-2012-0083539 | 2012-07-30 |
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| PCT/KR2012/011615 Ceased WO2014021521A1 (ko) | 2012-07-30 | 2012-12-27 | 경화성 수지 조성물, 그 경화 방법 및 그로부터 제조된 시트 |
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| Country | Link |
|---|---|
| US (1) | US10590217B2 (ko) |
| EP (1) | EP2881405B1 (ko) |
| JP (1) | JP6425229B2 (ko) |
| KR (1) | KR101545377B1 (ko) |
| CN (1) | CN104507983B (ko) |
| TW (1) | TWI542606B (ko) |
| WO (1) | WO2014021521A1 (ko) |
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| WO2018216969A1 (ko) | 2017-05-22 | 2018-11-29 | 주식회사 엘지하우시스 | 내오염성이 우수한 저광택 경화물 및 이의 제조방법 |
| CN112175586B (zh) * | 2020-09-28 | 2021-12-07 | 杭州应星新材料有限公司 | 一种uv固化丙烯酸导热组合物、导热片及其制备方法 |
| JP7199611B2 (ja) * | 2021-02-01 | 2023-01-05 | ナガセケムテックス株式会社 | 光硬化性樹脂組成物および三次元光造形物 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10590217B2 (en) | 2020-03-17 |
| KR20140016665A (ko) | 2014-02-10 |
| US20150183909A1 (en) | 2015-07-02 |
| EP2881405A4 (en) | 2015-07-08 |
| JP6425229B2 (ja) | 2018-11-21 |
| EP2881405A1 (en) | 2015-06-10 |
| TWI542606B (zh) | 2016-07-21 |
| TW201406800A (zh) | 2014-02-16 |
| JP2015523452A (ja) | 2015-08-13 |
| EP2881405B1 (en) | 2016-08-31 |
| CN104507983A (zh) | 2015-04-08 |
| KR101545377B1 (ko) | 2015-08-18 |
| CN104507983B (zh) | 2017-04-12 |
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