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WO2014082769A1 - Moyen de liaison, pour la liaison d'au moins deux composants en utilisant un processus de frittage - Google Patents

Moyen de liaison, pour la liaison d'au moins deux composants en utilisant un processus de frittage Download PDF

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Publication number
WO2014082769A1
WO2014082769A1 PCT/EP2013/069897 EP2013069897W WO2014082769A1 WO 2014082769 A1 WO2014082769 A1 WO 2014082769A1 EP 2013069897 W EP2013069897 W EP 2013069897W WO 2014082769 A1 WO2014082769 A1 WO 2014082769A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
background material
sintering process
connecting means
fiber mat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/069897
Other languages
German (de)
English (en)
Inventor
Daniel Wolde-Giorgis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2014082769A1 publication Critical patent/WO2014082769A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • C22C49/10—Refractory metals
    • C22C49/11—Titanium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a connection means for connecting at least two components using a sintering process.
  • the present invention further relates to a method for producing such a connection means and to a method for connecting at least two components.
  • Power electronics are used in many areas of technology. Especially in electrical or electronic devices in which large currents flow, the use of power electronics is unavoidable. The currents required in the power electronics lead to a self-heating of the electrical or electronic components contained. In addition, the
  • Components of the power electronics be used in places that are constantly exposed to an elevated temperature. Examples include control units in the automotive sector, which are directly in the engine compartment or in
  • Gear compartment are arranged.
  • the control unit is also exposed to a constant temperature change, whereby the electrical and / or electronic components contained are subjected to high thermal loads.
  • temperature changes in a range up to a temperature of 200 degrees Celsius are common.
  • more and more operating temperatures are increasingly required.
  • overall increased demands are placed on the reliability and reliability of electrical or electronic devices with power electronics.
  • solder joints are known, for example, lead-free solder joints of tin-silver or tin-silver-copper. At higher operating temperatures, lead-containing soldered joints can be used. However, lead-containing solder joints are by law
  • lead-free brazing alloys are available for use at elevated or high temperatures, in particular above 200 degrees Celsius.
  • Lead-free brazing alloys generally have a higher melting point than 200 ° C. The problem with this is that with the use of brazing material to form a bonding layer only a few electrical or electronic components come as joining partners in question, which can withstand the high temperatures during melting of the brazing alloys.
  • Fabric cutting is intended to prevent the adhesive from flowing out.
  • Temperatures can be processed and yet are suitable for operation at elevated temperatures. Disclosure of the invention
  • the subject of the present invention is a connecting means for joining at least two components using a sintering process, comprising an inert support structure and a background material, wherein the
  • Carrier structure forms a carrier layer, and wherein two
  • a connection means may in particular be an element which can be arranged between two components to be connected and thereby serves to connect the components to one another using a sintering process.
  • a sintering process in the sense of the present invention can be in a manner known per se, in particular a process in which, for example, ceramic or metallic substances are heated to a temperature which is below their melting point. In this case, a joining process of two components is realized at such an elevated temperature and in particular under elevated pressure.
  • the sintering process in particular solid substances are connected by heating and by the action of pressure.
  • the sintering process can be referred to in particular as a prototype process, wherein the substances are thermally baked together.
  • Under an inert support structure may further according to the present
  • Invention may be understood in particular a structure that can be basically formed in any suitable manner and in particular can serve as a basic structure or as a basis for applying a background material.
  • a background material is in particular such a material, which may be formed, for example, from a ceramic or metallic material and, in particular at high temperatures and under application of pressure, joining of two components by one
  • the support structure is inert, which means in particular that the support structure among those in a
  • the carrier structure is formed as a carrier layer, wherein on two opposite sides of the carrier layer, a layer of
  • the support structure forms a
  • Base layer or base which is provided on two opposite sides or on more sides or surfaces with one or more layers or layers with the background material.
  • the connecting means thus has a background material and a carrier structure embedded in the base material.
  • the latter may in particular mean that the background material does not need to be present exclusively in the corresponding layers of the background material depending on the design of the support structure, but optionally also a layer may be provided within the plane of the support structure in order to envelop or embed the support structure so completely
  • the sintering process can continue to be particularly cost-effective and lead to particularly stable connections.
  • the support structure is formed of an inert material, the material or the support structure after a sintering process between the joined components and thus in the
  • Sintered layer remain.
  • a suitable selection of the material of the carrier structure a particularly stable adhesion of the components to one another can be realized.
  • the support structure can in particular advantageously influence the mechanical properties and preferably the stability of the sintered layer.
  • the support structure can improve, for example, an improved stability of a not yet sintered green body.
  • connection means can be manufactured and stored independently of a sintering process.
  • the generation of the connecting means is thus possible independently of the manufacture or processing of the elements to be connected.
  • connecting means can be stored in a suitable number and fed to a use, ie a sintering process, immediately when a sintering process is carried out.
  • a sintering process using the above-described connecting means is particularly free and dynamically applicable.
  • damage to the components to be joined can be prevented, for example, by applying background material to the latter.
  • the connecting means can be arranged in a sintering process between the zu Stahlden components in a simple manner and a joining by setting suitable sintering parameters, in particular an elevated temperature and an increased pressure can be realized.
  • the carrier structure can be used in particular as a carrier material for the
  • the connecting means may be completely solid, or in particular the backing material may have a pasty consistency on the carrier material, so that processing of the Lanyard and thus the background material particularly simple, inexpensive and defined may be possible.
  • Expansion coefficient of the sintered layer can be significantly reduced. As a result, a particularly stable sintered layer can be produced and, furthermore, particularly reproducible products can be obtained. Furthermore, damage to the components to be joined or the layers to be joined can be significantly reduced or even completely prevented.
  • the carrier structure can further increase the thermal conduction
  • the carrier structure can serve as a binder for the background material, as a result of which a particularly homogeneous configuration, in particular of a sintered layer, that is to say of a layer after a sintering process, can be produced.
  • the carrier material serving as a binder can form a chemical compound to the background material
  • the material to be sintered can be optimally brought into contact with one another.
  • the support structure may be configured as a fiber mat, and may on at least two opposite sides of the Fiber mat may be provided a layer comprising the background material.
  • a defined support structure can be realized, which can advantageously serve as a basic structure of a connecting means.
  • a fiber mat with a defined mesh width, with a defined thickness and with homogeneous properties throughout the mat are produced, so that both the properties of the bonding agent and the properties of the sintered layer after the sintering process are particularly defined adjustable. It is on the fiber mat in particular
  • Background material can adhere particularly stable to the fiber mat, so as to achieve, for example, a particularly preferred storage stability and sintered connection can.
  • a fiber mat can form a base layer, wherein on two opposite sides of the base layer, the background material can be applied in a simple manner.
  • the fiber mat can be surrounded on both sides by the background material, whereby, during a joining process, the components to be joined essentially come into contact only with the background material but not with the support structure only to a limited extent.
  • a particularly stable and defined sintering result can be generated.
  • the fiber mat alone or already provided with background material, in a simple and defined
  • Manner be divided into a plurality of storable connecting means of a suitable size.
  • a fiber mat may in particular be a structure which has a width in comparison with its width
  • Length has low height and thus substantially leaf-like
  • a fiber material which can be woven for producing the mat, for example.
  • an open-pore foamed material can be used or a material designed as a lattice.
  • the carrier structure can be embedded in the background material, wherein the
  • a fiber mat in the sense of the present invention can be understood to mean any open-pored structure.
  • the fiber mat may comprise aramid fibers, glass fibers or carbon fibers or consist of one or more of the aforementioned fibers.
  • the aforementioned fiber materials have particularly preferred properties in order not to be destroyed during a sintering process or in the conditions prevailing in a sintering process or not to be damaged. In this case, the aforementioned materials are inert, so that a sintering process is not adversely affected by these materials. Furthermore, by the aforementioned materials, a particularly good distribution of heat within the
  • the fiber mat a a
  • Mesh width in a range of greater than or equal to 0.15mm to less than or equal to 1, 5mm. Such a mesh size may be suitable in a particularly advantageous manner, as a basic structure for the
  • a mesh size can be within the meaning of the present
  • Invention in particular the size or the diameter of pores present in a fiber mat.
  • the fiber mat may have a thickness in a range of greater than or equal to 5 ⁇ to less than or equal to 500 ⁇ .
  • the fiber mat can have a sufficient thickness to the advantages described above in a particularly advantageous
  • connection means is easily applicable even in particularly small or compact components, which is a particularly wide variety of applications
  • the background material may be selected from the group consisting of silver (Ag), silver oxide (Ag 2 0), silver carbonate (Ag 2 C0 3 ), copper (Cu), copper oxide (CuO, Cu 2 0) or
  • Combinations comprising one or more of the aforementioned substances, optionally in combination with organic or inorganic
  • Solvents and / or with fatty acids can be advantageously applied to the basic structure or to the carrier structure in processes that can be applied easily and inexpensively, and form a stable structure with them.
  • the connecting means is particularly stable even before a sintering process and can still have defined properties after storage or after a transport process and produce particularly stable and reproducible sintered connections.
  • very stable sintered layers can be produced even at high temperatures or large temperature fluctuations.
  • the solvents can also serve to improve the consistency of the
  • the fatty acids may in particular be used as inhibitors on the surface of the silver base particles such as
  • the subject matter of the present invention is furthermore a method for producing a connecting means designed as described above, the method comprising the method steps:
  • connection means can be provided, using which a sintering process can lead to particularly defined properties and to a particularly stable connection, and wherein the sintering process can be carried out in a particularly cost-effective, simple and reproducible manner.
  • the method described above comprises at least the following method steps.
  • a carrier structure In a first method step a), provision is made of a carrier structure.
  • the carrier structure can basically be any carrier structure which is suitable for carrying a background material.
  • the carrier structure can basically be any carrier structure which is suitable for carrying a background material.
  • the carrier structure can basically be any carrier structure which is suitable for carrying a background material.
  • Carrier structure a carrier layer or carrier layer, such as a fiber mat, be, which may not be designed to be limiting
  • Aramid fibers, glass fibers and / or carbon fibers Aramid fibers, glass fibers and / or carbon fibers.
  • Background material on at least two opposite sides of the support structure takes place on two opposite sides of the carrier layer.
  • this can thus form a central layer or a base, wherein each two
  • the background material is in particular on the flat sides, ie on the top and the bottom with the largest Extension applied.
  • the background material should be applied in such a way that at least the joints, ie the locations which serve for a connection and come into contact with the material to be joined, are substantially completely covered with the background material.
  • Components are arranged and the two components are connected together in the following by a sintering process.
  • the background material on the image As part of an embodiment, the background material on the image
  • Carrier structure can be applied by printing, for example by stencil printing or screen printing, dispensing, troweling, dipping the support structure in the background material, stamping spraying or rolling.
  • printing for example by stencil printing or screen printing, dispensing, troweling, dipping the support structure in the background material, stamping spraying or rolling.
  • Such processes are mature in terms of their litigation, so that the process is easily, inexpensively and particularly defined feasible.
  • the aforementioned methods can apply the background material in a particularly stable manner to the support structure, so that a stable connection means can arise.
  • Connection means the method according to the invention for connecting at least two components, the use according to the invention, the figure and the description of the figures referenced.
  • the subject matter of the present invention is furthermore a method for joining at least two components, comprising the method steps:
  • Components are in contact with the background material; and e) connecting the components while performing a sintering process.
  • two components can be connected or joined together by a sintering process and thus attached to each other, wherein the sintering process can lead to particularly stable connections and also can lead to defined properties and can be particularly cost-effective, simple and reproducible feasible.
  • the method is applicable in the field of electronic devices. Specific exemplary and non-limiting examples include passive or active electrical or electronic
  • circuit substrates such as circuit boards, other substrates, ceramic substrates, IMS substrates, stamped gratings, Flexfolien.
  • circuit substrates such as circuit boards, other substrates, ceramic substrates, IMS substrates, stamped gratings, Flexfolien.
  • Circuit carriers can be realized with each other.
  • a connecting means is thus initially provided in a method step c).
  • the connecting means may in particular be such as described above.
  • the connecting means may comprise, for example as a base layer, a fiber mat which is provided on both sides with a layer of background material.
  • the connecting means is arranged between at least two, for example exactly two, components to be connected in such a way that the components to be connected are in contact with the background material.
  • the connection means is arranged such that the background material can form a stable connection with the components to be joined in a sintering process. This is done according to the method essentially by a sintering process according to method step e).
  • an action of elevated temperature for example and without limitation in a range of greater than or equal to 150 ° C to less than or equal to 250 ° C, optionally under the action of an increased pressure, for example in a range of greater than or equal to 0.1 MPa less than or equal to 20 MPa, on the background material and optionally on the components to be joined or their joining surfaces.
  • the subject matter of the present invention is furthermore a use of a connecting means designed as described above or of a method configured as described above for connecting at least two components by means of a sintering process.
  • Lead sintering process to specially defined properties and thereby be particularly cost-effective, simple and reproducible feasible.
  • particularly stable compounds can be produced.
  • connection means according to the invention, the method according to the invention for producing a connection means, the method for connecting at least two components, the figure and the description of the figures.
  • Fig. 1 is a schematic representation of an embodiment of a
  • FIG. 1 shows a schematic illustration of a connection means 10 for connecting at least two components.
  • Connecting means 10 may serve, for example, to connect electronic elements, for example with carriers, using a sintering process.
  • the connecting means 10 has an inert support structure 12 and a
  • Background material 14 wherein the support structure 12 is surrounded by at least two opposite sides of the background material 14.
  • the carrier structure 12 can form a carrier layer or carrier layer, which is provided, for example coated, with a background material 14 on two opposite sides.
  • the support structure 12 is designed as a fiber mat.
  • the fiber mat for example, have a mesh size in a range of greater than or equal to 0.15 mm to less than or equal to 1, 5mm and / or have a thickness in a range of greater than or equal to 5 ⁇ to less than or equal to 500 ⁇ .
  • the fiber mat may include, for example, aramid fibers, glass fibers such as E-glass fibers, or carbon fibers. Such fibers have particularly advantageous properties, as shown in Table 1.
  • Temperature coefficient of the carrier layer or the sintered layer can be well adapted to the joining partners. For example, so at a exemplary assembly of silicon chips to circuit board
  • Carrier material of carbon fiber may be preferred. Furthermore, by the choice of the carrier material, the thermal conductivity can be adapted to the desired field of application. In addition, sufficient stability up to high temperatures is recognizable.
  • the fiber mat further comprises on at least two opposite sides a layer 16, 18 comprising the backing material 12.
  • Background material 12 or the layer 16, 18 can be applied to the support structure 12, for example, by printing, spraying or rolling.
  • the background material may be selected from the group consisting of silver (Ag), silver oxide (Ag 2 0), silver carbonate (Ag 2 C0 3 ), copper (Cu), copper oxide (CuO, Cu 2 0) or combinations comprising one or more of aforementioned substances, optionally in combination with organic or inorganic solvents and / or with fatty acids.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Products (AREA)

Abstract

L'invention concerne un moyen de liaison (10), pour la liaison d'au moins deux composants en utilisant un processus de frittage, présentant une structure support inerte (12), et un matériau de base de frittage (14), la structure support (12) se présentant sous la forme d'une couche support (13), une couche (16, 18) du matériau de base de frittage (14) étant disposée sur les deux côtés opposés de la couche support (13). Le moyen de liaison précité (10) permet de disposer d'un processus de frittage particulièrement reproductible, pour lequel, en outre, une détérioration des composants à assembler est réduite, voire complètement empêchée. Le processus de frittage peut, de surcroît, être mis en oeuvre à un coût particulièrement réduit, et permettre d'obtenir des assemblages particulièrement stables. L'invention concerne en outre un procédé de production d'un moyen de liaison (10), un procédé de liaison d'au moins deux composants, ainsi que l'utilisation d'un moyen de liaison (10).
PCT/EP2013/069897 2012-11-30 2013-09-25 Moyen de liaison, pour la liaison d'au moins deux composants en utilisant un processus de frittage Ceased WO2014082769A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012221990.0A DE102012221990A1 (de) 2012-11-30 2012-11-30 Verbindungsmittel zum Verbinden von wenigstens zwei Komponenten unter Verwendung eines Sinterprozesses
DE102012221990.0 2012-11-30

Publications (1)

Publication Number Publication Date
WO2014082769A1 true WO2014082769A1 (fr) 2014-06-05

Family

ID=49293609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/069897 Ceased WO2014082769A1 (fr) 2012-11-30 2013-09-25 Moyen de liaison, pour la liaison d'au moins deux composants en utilisant un processus de frittage

Country Status (2)

Country Link
DE (1) DE102012221990A1 (fr)
WO (1) WO2014082769A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN111085674A (zh) * 2019-12-25 2020-05-01 东北大学 一种可协同延展的碳纤维增强金属基复合材料及制备装置和方法

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US4381602A (en) 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
EP0141146A1 (fr) * 1983-09-12 1985-05-15 American Cyanamid Company Substrat métallique renforcé
DE3625596A1 (de) 1985-08-16 1987-02-19 Burr Brown Corp Verfahren zum verbinden von oberflaechen unter verwendung von klebepasten oder nicht-trockener film-klebstoffe
JP2010236016A (ja) * 2009-03-31 2010-10-21 Sumitomo Precision Prod Co Ltd 高熱伝導性複合材料及びその製造方法
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US20110027119A1 (en) * 2007-12-28 2011-02-03 Messier-Dowty Sa Method for making parts with an insert made of a metal-matrix composite material

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DE10029791C2 (de) * 2000-06-16 2002-04-18 Infineon Technologies Ag Verfahren zur Herstellung einer stabilen Verbindung zwischen zwei Wafern
DE102008008535A1 (de) * 2008-02-11 2009-08-13 Robert Bosch Gmbh Einrichtung zur Fixierung eines elektronischen Bausteins wie Halbleiterelement
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US4381602A (en) 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
EP0141146A1 (fr) * 1983-09-12 1985-05-15 American Cyanamid Company Substrat métallique renforcé
DE3625596A1 (de) 1985-08-16 1987-02-19 Burr Brown Corp Verfahren zum verbinden von oberflaechen unter verwendung von klebepasten oder nicht-trockener film-klebstoffe
US20110027119A1 (en) * 2007-12-28 2011-02-03 Messier-Dowty Sa Method for making parts with an insert made of a metal-matrix composite material
JP2010236016A (ja) * 2009-03-31 2010-10-21 Sumitomo Precision Prod Co Ltd 高熱伝導性複合材料及びその製造方法
JP2010236015A (ja) * 2009-03-31 2010-10-21 Sumitomo Precision Prod Co Ltd 高熱伝導性複合材料及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111085674A (zh) * 2019-12-25 2020-05-01 东北大学 一种可协同延展的碳纤维增强金属基复合材料及制备装置和方法
CN111085674B (zh) * 2019-12-25 2021-09-03 东北大学 一种可协同延展的碳纤维增强金属基复合材料及制备装置和方法

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