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WO2014061767A1 - Composition de résine, feuille adhésive, feuille adhésive de type à ruban de découpage en dés intégré, feuille adhésive de type à ruban d'affûtage du dos intégré, feuille adhésive de type à ruban de découpage du dos/ruban de découpage en dés intégrés et dispositif électronique - Google Patents

Composition de résine, feuille adhésive, feuille adhésive de type à ruban de découpage en dés intégré, feuille adhésive de type à ruban d'affûtage du dos intégré, feuille adhésive de type à ruban de découpage du dos/ruban de découpage en dés intégrés et dispositif électronique Download PDF

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Publication number
WO2014061767A1
WO2014061767A1 PCT/JP2013/078268 JP2013078268W WO2014061767A1 WO 2014061767 A1 WO2014061767 A1 WO 2014061767A1 JP 2013078268 W JP2013078268 W JP 2013078268W WO 2014061767 A1 WO2014061767 A1 WO 2014061767A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
mass
film
adhesive sheet
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/078268
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English (en)
Japanese (ja)
Inventor
研三 前島
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of WO2014061767A1 publication Critical patent/WO2014061767A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H10P72/7402—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10P72/7438—
    • H10W72/01325—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/222—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W72/354—
    • H10W72/9415—
    • H10W72/952—
    • H10W74/15—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Definitions

  • the present invention relates to a resin composition, an adhesive sheet, a dicing tape integrated adhesive sheet, a back grind tape integrated adhesive sheet, a back grind tape and dicing tape integrated adhesive sheet, and an electronic device.
  • This application claims priority based on Japanese Patent Application No. 2012-230737 for which it applied to Japan on October 18, 2012, and uses the content here.
  • the electronic device performs, for example, a process of joining the electrode of the semiconductor element and the electrode of another semiconductor element, the electrode of the semiconductor element and the electrode of the substrate, or the electrode of the substrate and the electrode of another substrate using solder. Manufactured by.
  • thermosetting resin composition is poured into this gap, and then the thermosetting resin is cured to fill gaps between semiconductor elements and the like.
  • Patent Document 1 discloses a solder paste containing an epoxy resin as a main component and containing an organic acid or an organic acid salt and solder particles.
  • Patent Document 2 discloses at least one thermosetting resin selected from an epoxy resin, a phenol resin, a diallyl phthalate resin, and a benzocyclobutene resin, and a flux component.
  • a thermosetting resin sheet characterized by molding a composition containing the above into a sheet shape is disclosed.
  • the present invention relates to a resin composition, an adhesive sheet, a dicing tape integrated adhesive sheet, a back grind tape integrated adhesive sheet, a back grind tape and dicing tape integrated type, which can obtain an electronic device having high bonding reliability between electrodes and high insulation reliability.
  • An electronic device having an adhesive sheet and a cured product of the resin composition is provided.
  • the resin composition of the present invention is a film-like electrode connecting resin composition that is interposed between electrodes facing each other and electrically connects the electrodes facing each other,
  • the resin composition is (A) a polyfunctional epoxy resin having a naphthalene skeleton; (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule; (C) a film-forming resin; It is characterized by containing.
  • the component (B) can be a compound having two or more phenolic hydroxyl groups and one or more carboxyl groups in one molecule.
  • the component (B) can be a compound having two or more phenolic hydroxyl groups in one molecule and one or more carboxyl groups directly bonded to an aromatic ring.
  • the content of the component (A) can be 1% by mass or more and 20% by mass or less with respect to the entire resin composition.
  • the content of the component (B) can be 3% by mass or more and 25% by mass or less with respect to the entire resin composition.
  • the content mass ratio [(B) / (A)] between the component (A) and the component (B) may be 0.2 or more and 16 or less.
  • the resin composition of the present invention can further contain (D) a phenol resin.
  • the adhesive sheet of the present invention has the above resin composition and a base film.
  • the dicing tape-integrated adhesive sheet of the present invention is characterized by having the above resin composition and a dicing tape.
  • the back grind tape integrated adhesive sheet of the present invention is characterized by having the above resin composition and a back grind tape.
  • the back grind tape / dicing tape-integrated adhesive sheet of the present invention is characterized by having the above resin composition and a back grind tape / dicing tape serving as both a dicing tape and a back grind tape.
  • the electronic device of this invention has the hardened
  • the resin composition (A) a polyfunctional epoxy resin having a naphthalene skeleton, (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule; (C) a film-forming resin;
  • a resin composition adhesive sheet, a dicing tape integrated adhesive sheet, a back grind tape integrated adhesive sheet, and a back grind tape that can provide an electronic device having high connectivity between opposing electrodes and high insulation reliability.
  • An electronic device having a dicing tape-integrated adhesive sheet and a cured product of this resin composition and having high connectivity and insulation reliability is provided.
  • [Electronic device] 1 to 3 show a process in which the first substrate 110 having the electrode 111 and the second substrate 120 having the electrode 121 are bonded via the resin composition 130 to form the electronic device 100.
  • FIG. 3 in the electronic device 100, the electrode 111 formed on one surface of the first substrate 110 and the electrode 121 formed on one surface of the second substrate 120 are individually joined to each other, and the first substrate 110.
  • a resin layer 130 is filled between the first substrate 120 and the second substrate 120.
  • the resin composition used for the resin layer 130 is formed on one surface of the second substrate 120 and the electrode 111 (gold 111a / nickel 111b / copper pillar 111c) formed on one surface of the first substrate 110 as an example of the embodiment. It is a resin composition that is introduced between the electrodes 121 (solder bumps 121a / copper pillars 121b) and thermally cured after the solder bumps 111a of the electrodes 111 and the gold 121a of the electrodes 121 are joined. In other words, in the electronic device 100 finally obtained, the resin layer 130 may be formed so as to fill the gap between the first substrate 110 and the second substrate 120.
  • the second substrate 120 is a semiconductor chip.
  • the resin composition in the present invention is A film-like electrode connecting resin composition that is interposed between opposing electrodes and electrically connects the opposing electrodes, (A) a polyfunctional epoxy resin having a naphthalene skeleton; (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule; (C) a film-forming resin; It is characterized by containing.
  • (A) a polyfunctional epoxy resin having a naphthalene skeleton is used.
  • Tg glass transition point
  • the component (A) used in the resin composition of the present invention has a naphthalene structure in the molecular structure and has a structure in which two or more glycidyl ether groups are bonded to the naphthalene ring, or these A mixture is mentioned.
  • the epoxy resin having a naphthalene skeleton is not particularly limited, and examples thereof include those represented by the following general formula (1), general formula (2), general formula (3), or general formula (4). Specific examples include those represented by structural formula (5), structural formula (6), structural formula (7), structural formula (8), and the like. Furthermore, among these, structural formula (7) and structural formula (8) are particularly preferable. Since the naphthalene ring is particularly excellent in heat resistance, the connection reliability of the semiconductor device in a high temperature atmosphere can be improved.
  • the content of the component (A) with respect to the entire resin composition is not particularly limited, but is preferably 1% by mass or more and 20% by mass or less. More preferably, it is 1 mass% or more and 17 mass% or less.
  • thermosetting resins in addition to the component (A), other thermosetting resins can be used together.
  • the thermosetting resin used here is not particularly limited, and examples thereof include epoxy resins, oxetane resins, phenol resins, (meth) acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins.
  • an epoxy resin is preferable.
  • Epoxy resins are excellent in curability and storage stability, heat resistance of cured products, moisture resistance, chemical resistance, and the like.
  • the epoxy resin that can be contained in the resin composition of the present invention may be an epoxy resin that is solid at room temperature or an epoxy resin that is liquid at room temperature, or both of them.
  • the resin composition according to the present invention contains an epoxy resin, the degree of freedom in designing the melting behavior of the resin layer can be further increased.
  • the epoxy resin that is solid at room temperature is not particularly limited, and examples thereof include bisphenol A type epoxy resins, bisphenol S type epoxy resins, and phenol novolac type epoxy resins. Cresol novolac type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin and the like. These may be used alone or in combination of two or more.
  • the epoxy resin that is liquid at room temperature is not particularly limited, and examples thereof include bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenol novolac type epoxy resins. Allylated bisphenol A type epoxy resin, modified epoxy resin, cyclohexanedimethanol diglycidyl ether and the like. These may be used alone or in combination of two or more.
  • the epoxy equivalent of the epoxy resin that is liquid at room temperature is preferably 120 to 400, more preferably 140 to 360, and still more preferably 160 to 320. Thereby, it can prevent that the shrinkage
  • (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule is used.
  • the flux function can be imparted to the resin composition, the connectivity between the electrodes and the insulation reliability can be improved, and the resin can react with the component (A). Since it can be taken into the skeleton, it can have stable insulating properties.
  • the resin composition of this invention what has one phenolic hydroxyl group and one carboxyl group in 1 molecule can be used as said (B) component.
  • component (B) examples include 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, 1-hydroxy-2-naphthoic acid, 2-hydroxy-1-naphthoic acid, 3-hydroxy- Hydroxynaphthoic acids such as 2-naphthoic acid, 6-hydroxy-1-naphthoic acid, 6-hydroxy-2-naphthoic acid, 2-hydroxycinnamic acid, 3-hydroxycinnamic acid, 4-hydroxycinnamic acid, etc. Examples thereof include hydroxycinnamic acids.
  • Such a component (B) can impart a flux action to the resin composition, and even when an epoxy resin other than the component (A) or the component (A) is used in combination, an addition reaction with these epoxy resins. can do.
  • the resin composition of this invention what has two or more phenolic hydroxyl groups and one or more carboxyl groups in 1 molecule can be used as said (B) component.
  • component (B) include diphenolic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, Benzoic acid derivatives such as 3,4-dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, Examples include naphthoic acid derivatives such as 3,7-dihydroxy-2-naphthoic acid; phenolphthaline; and pamoic acid.
  • Such a component (B) can impart a flux action to the resin composition, and even when an epoxy resin other than the component (A) or the component (A) is used in combination with these epoxy resins.
  • the reaction can act as the curing agent.
  • the component (B) a compound having two or more phenolic hydroxyl groups and one or more carboxyl groups directly bonded to an aromatic ring in one molecule is used. Can do.
  • examples of such component (B) include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3, Benzoic acid derivatives such as 4-dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3, Examples thereof include naphthoic acid derivatives such as 7-dihydroxy-2-naphthoic acid, phenolphthaline, pamoic acid and the like, and these may be used alone or in combination of two or more.
  • Such a component (B) can impart a flux action to the resin composition
  • the resin composition of the present invention can obtain a resin composition having high insulating properties and solder connectivity resulting from a flux action by using the component (A) and the component (B) in combination.
  • the content of the component (B) with respect to the entire resin composition is not particularly limited, but is preferably 3% by mass or more and 25% by mass or less. More preferably, it is 3.5 mass% or more and 20 mass% or less.
  • the mass ratio [(B) / (A)] of the component (A) and the component (B) in the resin composition is 0.2 or more and 16 or less. Preferably there is. More preferably, it is 0.5 or more and 13 or less, and particularly preferably 0.7 or more and 10 or less.
  • action of a resin composition, film formability, and a flexibility can be ensured.
  • the insulation of the resin composition after hardening, film-forming property, and a flexibility can be ensured.
  • a film-forming resin is used in the resin composition of the present invention. Thereby, a resin composition can be easily made into a film form and the electronic device excellent in connectivity and insulation reliability can be produced efficiently.
  • the film-forming resin examples include (meth) acrylic resin, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, siloxane-modified polyimide resin, polybutadiene, polypropylene, styrene-butadiene-styrene copolymer, styrene-ethylene- Butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer Examples include coalescence, polyvinyl acetate, and nylon.
  • (meth) acrylic resins and phenoxy resins are preferable.
  • a (meth) acrylic resin or a phenoxy resin it is possible to achieve both film formability and adhesion to a support and an adherend.
  • the film-forming resin may be used alone or in combination of two or more.
  • the (meth) acrylic resin is a polymer of (meth) acrylic acid and derivatives thereof, or a copolymer of (meth) acrylic acid and derivatives thereof with other monomers. means.
  • (meth) acrylic acid etc. it means acrylic acid or methacrylic acid.
  • acrylic resin used as the film-forming resin examples include polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, and poly-2-ethylhexyl acrylate.
  • Polyacrylic acid ester such as polymethyl methacrylate, polyethyl methacrylate, polybutyl methacrylate; polyacrylonitrile, polymethacrylonitrile, polyacrylamide, butyl acrylate-ethyl acrylate-acrylonitrile copolymer, Acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer , Methyl methacrylate-acrylonitrile copolymer, methyl methacrylate- ⁇ -methylstyrene copolymer, butyl acrylate-ethyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate-methacrylic acid copolymer, buty
  • an acrylic resin used as a film-forming resin by using a (meth) acrylic resin obtained by copolymerizing a monomer having a functional group such as a nitrile group, an epoxy group, a hydroxyl group, or a carboxyl group, the adhesion of the film-like resin composition to the support and adherend, and compatibility with the thermosetting resin and the like can be improved.
  • the weight average molecular weight of the acrylic resin is, for example, 1,000 or more and 1,000,000 or less, and preferably 3000 or more and 900,000 or less. When the weight average molecular weight of the acrylic resin is within the above range, the film-forming property of the resin composition can be further improved and the fluidity at the time of curing can be ensured.
  • a phenoxy resin having a number average molecular weight of 5000 to 20000 is preferable.
  • a phenoxy resin having a number average molecular weight of 5000 to 20000 is preferable.
  • the skeleton of the phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, biphenyl skeleton type, and biphenol skeleton type.
  • the content of the component (C) with respect to the entire resin composition is not particularly limited, but is preferably 0.1% by mass or more and 20% by mass or less, more preferably 0. It is 2 mass% or more and 10 mass% or less.
  • the resin composition of the present invention is not particularly limited, but in addition to the above components (A) to (C), when an epoxy resin is used together with the component (A) as a thermosetting resin, it contains a curing agent. It is preferable to do.
  • curing agent should just act as a hardening
  • polyamines including aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and metaxylylenediamine, aromatic polyamines such as diaminodiphenylmethane, m-phenylenediamine, and diaminodiphenylsulfone, dicyandiamide, and organic acid dihydrazide
  • Amine-based curing agents such as compounds, aliphatic acid anhydrides such as hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, aromatic acid anhydrides such as tritometic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid, etc.
  • Acid anhydride curing agent phenol novolac resin, cresol novolac resin, phenol aralkyl (including phenylene and biphenylene skeleton) resin, naphthol aralkyl (including phenylene and biphenylene skeleton) resin
  • Triphenol methane resin dicyclopentadiene type phenol resin, bis (mono or di t-butylphenol) propane, methylene bis (2-propenyl) phenol, propylene bis (2-propenyl) phenol, bis [(2-propenyloxy) phenyl] Methane, bis [(2-propenyloxy) phenyl] propane, 4,4 ′-(1-methylethylidene) bis [2- (2-propenyl) phenol], 4,4 ′-(1-methylethylidene) bis [ 2- (1-phenylethyl) phenol], 4,4 ′-(1-methylethylidene) bis [2-methyl-6-hydroxymethyl
  • curing agent calculates
  • the equivalent ratio (Ep / OH) of the epoxy group (Ep) of the epoxy resin to the phenolic hydroxyl group (OH) of the curing agent is preferably 0.5 to 1.5, 0.7 Is particularly preferred. By setting it as the said range, heat resistance and preservability of a film-form resin composition can be made compatible.
  • the resin composition of the present invention is not particularly limited, but in addition to the above components (A) to (C), when an epoxy resin is used together with the component (A) as a thermosetting resin, curing acceleration An agent can be contained.
  • a curing accelerator may be selected as long as it accelerates the curing reaction between the epoxy resin and the curing agent.
  • Specific examples include amine compounds such as imidazoles and 1,8-diazabicyclo (5,4,0) undecene, and phosphorus compounds such as salts of triphenylphosphine and tetra-substituted phosphonium with polyfunctional phenol compounds.
  • imidazoles and phosphorus compounds that achieve both fast curability of the film-like resin layer, storage stability, and corrosivity of the aluminum pad on the semiconductor element are preferable.
  • the content of the curing accelerator is preferably 0.001 to 10% by mass, more preferably 0.003 to 7% by mass, and 0.01 to 5% by mass with respect to the entire resin composition. % Is more preferable. By setting it as the said range, it becomes possible to maintain the balance of sclerosis
  • the resin composition of the present invention is not particularly limited, but may contain an inorganic filler in addition to the components (A) to (C).
  • an inorganic filler in addition to the components (A) to (C).
  • cured material of a film-form resin composition can be made small, and the connectivity and insulation reliability of an electronic device using this can be improved.
  • the tack force of the film-like resin composition can be more easily adjusted.
  • the peelability from the support is more suitable.
  • the adhesion to a substrate having an electrode, a semiconductor chip or the like can be made particularly excellent.
  • the inorganic filler examples include silver, titanium oxide, silica, mica and the like. Among these, silica is preferable. Moreover, although there exist crushing silica and spherical silica as a shape of a silica, spherical silica is preferable. From the viewpoint of thermal conductivity, aluminum oxide, aluminum nitride, titanium oxide, silicon nitride, boron nitride, or the like can also be used.
  • the average particle size of the inorganic filler is not particularly limited, but is preferably 0.01 ⁇ m or more and 20 ⁇ m or less, and more preferably 0.03 ⁇ m or more and 5 ⁇ m or less. By setting it as the said range, aggregation of the inorganic filler in a film-form resin composition can be suppressed, and the homogeneous resin composition without the aggregate of an inorganic filler can be obtained.
  • the content of the inorganic filler is not particularly limited, but is preferably 1 to 80% by mass, more preferably 20 to 75% by mass, and more preferably 30 to 70% by mass with respect to the entire resin composition. More preferably.
  • the resin composition of the present invention includes a coupling agent, a flux activator for enhancing the activity of a compound having a flux action, a low stress agent, an antioxidant, a leveling agent, and other resins.
  • a coupling agent for enhancing the activity of a compound having a flux action
  • a low stress agent for enhancing the activity of a compound having a flux action
  • a low stress agent for enhancing the activity of a compound having a flux action
  • a low stress agent such as antioxidant
  • a leveling agent such as antioxidant
  • a leveling agent such as compatibility, stability, workability
  • operativity such as compatibility, stability, workability
  • an inorganic filler is added to the resin composition. It can be obtained by preparing a product varnish, applying it to a support having been subjected to a peeling treatment such as a polyester sheet, removing the solvent at a predetermined temperature and drying it.
  • Examples of the solvent used for preparing the resin composition varnish include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol), benzene, xylene, and toluene.
  • ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol), benzene, xylene, and toluene.
  • Aromatic hydrocarbons such as methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve a
  • NMP N-methyl-2-pyrrolidone
  • THF tetrahydrofuran
  • DMF dimethylformamide
  • DBE dibasic acid ester
  • EEP - ethyl ethoxypropionate
  • DMC dimethyl carbonate
  • the thickness (average) of the film-like resin composition is not particularly limited, but is preferably about 3 to 100 ⁇ m, and more preferably about 5 to 50 ⁇ m.
  • the electronic device of the present invention is characterized by having a cured product of the above-described resin composition of the present invention.
  • An example of a method for manufacturing the electronic device 100 of the present invention will be described below.
  • the electrode 111 (gold 111a / nickel 111b / copper pillar 111c) is formed on one surface of the first substrate 110, and the electrode 121 (solder bump 121a / copper pillar 121b) is similarly formed on the second substrate. 120 is formed on one surface.
  • the solder used for joining the electrode 111 and the electrode 121 is not particularly limited and is selected from the group consisting of tin, silver, lead, zinc, bismuth, indium and copper. And alloys containing at least two or more of them.
  • the melting point of the solder is 100 to 350 ° C.
  • a film-like resin composition 130 is introduced between the electrode 111 of the first substrate 110 and the electrode 121 of the second substrate 120, and as shown in FIG.
  • the resin layer 130 is filled between the first substrate 110 and the second substrate 120 while being melt-bonded to the electrode 121 of the second substrate 120.
  • the resin composition 130 is laminated by sandwiching the resin composition 130 between the electrode 111 of the first substrate 110 and the electrode 121 of the second substrate 120, and melt-bonding the electrode 111 and the electrode 121.
  • the material 130 melts and spreads, and the space between the first substrate 110 and the second substrate 120 can be filled with the resin composition 130 while soldering.
  • Solder bonding may be performed at a temperature equal to or higher than the melting point of the solder, for example, 130 to 380 ° C.
  • the resin composition 130 is thermoset. Thereby, the electronic device 100 can be obtained.
  • the heating temperature may be any temperature as long as it is equal to or higher than the curing temperature of the resin composition 130, and is appropriately selected, but is usually 100 to 250 ° C, preferably 150 to 200 ° C.
  • the heating time is appropriately selected depending on the type of the resin composition 130, but is usually 0.5 to 8 hours, preferably 1 to 3 hours.
  • the resin composition 130 when it is cured, it may be pressurized.
  • the pressurization is preferably 0.1 MPa or more and 10 MPa or less, more preferably 0.5 MPa or more and 5 MPa or less. Thereby, generation
  • the pressurization is preferably performed using a fluid, and examples thereof include gases such as nitrogen gas, argon gas, and air. Air is preferable in terms of inexpensiveness, but nitrogen is preferable from the viewpoint of suppressing oxidation of the resin composition.
  • a processing object to be heated is placed in a pressure vessel, and then the pressurized fluid is introduced into the pressure vessel and added.
  • a method of heating an object to be processed while pressing more specifically, the object to be processed is placed in a pressure oven, and processing is performed in a pressure oven while introducing a gas for pressurization into the pressure oven. The method of heating a target object is mentioned.
  • the adhesive sheet of the present invention is characterized by having the above-described resin composition for electrode connection of the present invention (hereinafter also referred to as a resin composition) and a base film.
  • FIG. 4 shows an embodiment of the adhesive sheet of the present invention.
  • an adhesive sheet 200 has a structure in which a resin composition 201 is formed on a base film 202.
  • the form of the adhesive sheet of the present invention is not limited to that shown in FIG. 4.
  • the surface of the resin composition on the surface of the adhesive film opposite to the base film is laminated.
  • the base film 202 functions as a base layer (support layer) of the adhesive film when the adhesive sheet 200 (adhesive film) is laminated on the wafer surface provided with a plurality of individual electrodes and individual circuits, for example. .
  • the material of the base film is not particularly limited.
  • the adhesive sheet of the present invention is obtained by coating the resin composition varnish on the base film, and then drying the resin composition varnish at a predetermined temperature to an extent that does not substantially contain a solvent. Can do. And it can also be set as the form which laminated
  • the dicing tape-integrated adhesive sheet of the present invention includes the adhesive sheet of the present invention and a dicing tape.
  • FIG. 5 shows an embodiment of the dicing tape-integrated adhesive sheet of the present invention.
  • a dicing tape integrated adhesive sheet 210 has a structure in which an adhesive sheet 211 is formed on a dicing tape 213. In the form shown in FIG.
  • the dicing tape 213 is composed of two layers, a base layer 213 a of the dicing tape and an adhesive layer 213 b of the dicing tape, and the adhesive layer 213 b of the dicing tape and the adhesive sheet 211 are in contact with each other. Are stacked.
  • the form of the dicing tape-integrated adhesive sheet of the present invention is not limited to that shown in FIG. 5, for example, a form having an intervening layer between the adhesive layer 213 b of the dicing tape and the adhesive sheet 211.
  • the adhesive layer of the dicing tape is preferably higher in adhesiveness than the intervening layer.
  • the adhesive force of the adhesion layer of the dicing tape with respect to an intervening layer and a base material layer becomes larger than the adhesive force of the intervening layer with respect to the adhesive sheet 211. Therefore, in an electronic component manufacturing process, for example, in an electronic component manufacturing process such as a semiconductor chip pickup process, peeling occurs at a desired interface (that is, an interface between an intervening layer and an adhesive sheet) that should cause peeling. Can do.
  • the dicing tape used for the dicing tape-integrated adhesive sheet of the present invention can be any dicing tape that is generally used.
  • the constituent material of the base material layer 213a of the dicing tape is not particularly limited.
  • polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane examples include ethylene vinyl acetate copolymer, ionomer, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polystyrene, vinyl polyisoprene, polycarbonate, polyolefin, etc.
  • One kind or a mixture of two or more kinds can be used.
  • the average thickness of the substrate layer 213a of the dicing tape is not particularly limited, but is preferably 5 to 200 ⁇ m, more preferably about 30 to 150 ⁇ m.
  • the adhesive sheet is securely supported, and the handling of the dicing tape integrated adhesive sheet is facilitated, and the dicing tape integrated adhesive sheet is appropriately By curving, it is possible to improve the adhesion between the adhesive sheet and the adherend having the electrode.
  • a manufacturing method of the base material layer 213a of a dicing tape Common molding methods, such as a calendar method and an extrusion molding method, can be used.
  • a functional group that reacts with the material constituting the adhesive layer 213b such as a hydroxyl group or an amino group, is exposed on the surface of the base material layer 213a.
  • the surface of the base material layer 213a is preferably surface-treated with a corona treatment or an anchor coat.
  • the constituent material of the adhesive layer 213b of the dicing tape is not particularly limited, but for example, a material composed of a resin composition containing an acrylic adhesive, a rubber adhesive, or the like can be used.
  • the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more kinds of these copolymers may be mixed.
  • the copolymer with 1 or more types chosen from is preferable. Thereby, it becomes easy to control the adhesiveness and adhesiveness with a partner (for example, the above-described intervening layer, base material layer, etc.) to which the adhesive layer of the dicing tape adheres.
  • the average thickness of the pressure-sensitive adhesive layer 213b of the dicing tape is not particularly limited, but is preferably about 1 ⁇ m to 100 ⁇ m, and more preferably about 3 to 20 ⁇ m.
  • the average thickness of the pressure-sensitive adhesive layer 213b of the dicing tape is within the above range, the shape following property of the pressure-sensitive adhesive layer 213b of the dicing tape is ensured, and the adhesiveness of the adhesive film such as a semiconductor wafer to the contacted object can be further increased. it can.
  • the said dicing tape can manufacture by apply
  • the adhesive layer 213b may be separately manufactured by coating the adhesive layer 213b on the base material for the adhesive layer 213b and then transferring the adhesive layer 213b on the base material layer 213a of the dicing tape.
  • the intervening layer may be further coated on the adhesive layer 213b, or the intervening layer is separately produced by laminating a material coated on the intervening layer base material.
  • the dicing tape-integrated adhesive sheet of the present invention includes, for example, a dicing tape having a base material layer 213a, an adhesive layer 213b, and an intervening layer, and an adhesive sheet (resin composition + base film) of the present invention. It can also be obtained by laminating such that the intervening layer and the adhesive sheet are in contact with each other.
  • the back grind tape-integrated adhesive sheet of the present invention includes the adhesive sheet of the present invention and a background tape.
  • the said back grind tape is not specifically limited, What has the adhesive layer formed in the single side
  • PET polyethylene terephthalate
  • PE polyethylene
  • PP polypropylene
  • EVA ethylene-vinyl acetate copolymer
  • the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited, but is preferably composed of a pressure-sensitive adhesive containing a polymerizable oligomer and having a pressure-sensitive adhesive force lowered by polymerization crosslinking.
  • a pressure-sensitive adhesive for example, an acrylic acid alkyl ester-based and / or methacrylic acid alkyl ester-based polymerizable polymer having a radiation-polymerizable unsaturated bond in the molecule, and a radiation-polymerizable polyfunctional Examples thereof include a photocurable pressure-sensitive adhesive comprising an oligomer or a monomer as a main component.
  • the polymerizable polymer is, for example, a compound having a functional group that reacts with the functional group in the molecule and a radiation-polymerizable unsaturated bond, in advance, by synthesizing a (meth) acrylic polymer having a functional group in the molecule. It can obtain by making it react.
  • the (meth) acrylic polymer means an acrylic polymer and a methacrylic polymer.
  • the photocurable pressure-sensitive adhesive preferably contains a photopolymerization initiator in addition to the polymerizable polymer and the polyfunctional oligomer or monomer.
  • the manufacturing method of the said back grind tape manufactures by apply
  • the pressure-sensitive adhesive layer can be separately produced by coating on a base material for forming a pressure-sensitive adhesive layer and then transferring it by a method such as laminating on the base material layer of the back grind tape. By laminating the film-like resin composition on the back grind tape thus produced, a back grind tape integrated adhesive sheet can be produced.
  • the back grind tape / dicing tape-integrated adhesive sheet 300 of the present invention comprises a back grind tape / dicing tape 301 and a film-like resin composition 302 as shown in FIG.
  • a release film may be provided between the back grind tape / dicing tape / dicing tape 301 and the film-like resin composition 302.
  • the back grind tape / dicing tape 301 for example, heat resistance and resistance produced by polyolefin such as polyethylene and polypropylene, ethylene vinyl acetate copolymer, polyester, polyimide, polyethylene terephthalate, polyvinyl chloride, polyamide, polyurethane and the like. Any film having excellent chemical properties can be used.
  • the thickness of the back grind tape / dicing tape 1 is not particularly limited, but is usually preferably 30 to 500 ⁇ m.
  • the film-like resin composition 302 is obtained by mixing a crosslinkable resin, a compound having a flux activity, and the like, applying the mixture on a release substrate 321 such as a polyester sheet, and drying at a predetermined temperature. This was half cut to obtain a circular film-shaped resin composition 302. Then, by laminating a back grind tape / dicing tape 301 thereon, a back grind tape function and a dicing tape function constituted by the back grind tape / dicing tape 301, the film-like resin composition 302, and the peeling substrate 321 are provided.
  • a glue sheet 300 can be obtained (FIG. 7).
  • the thickness of the film-like resin composition 302 of the back-grind tape / dicing tape-integrated adhesive sheet 300 formed in this way is not particularly limited, but is preferably 3 ⁇ m or more and 100 ⁇ m or less, particularly 5 ⁇ m or more and 50 ⁇ m or less. More preferably it is. If the thickness is less than the lower limit value, the effect as the back grind tape / dicing tape-integrated adhesive sheet 300 may be reduced. If the thickness exceeds the upper limit value, it may be difficult to manufacture the product and the thickness accuracy may be reduced. is there.
  • the initial melt viscosity is reduced to the minimum melt viscosity.
  • the minimum melt viscosity in the case of having a property of further increasing after reaching is not particularly limited, but is preferably 50,000 Pa ⁇ s or less, more preferably 20,000 Pa ⁇ s or less, and 10,000 Pa ⁇ s or less. More preferably. Further, it is preferably 0.1 Pa ⁇ s or more, more preferably 1 Pa ⁇ s or more, and even more preferably 10 Pa ⁇ s or more.
  • melt viscosity By setting the melt viscosity to the lower limit value or more, it is possible to suppress a decrease in adhesion reliability due to the film-like resin composition 302 protruding from the adherend during heating, and it is possible to suppress contamination of peripheral members due to the protrusion. . Furthermore, defects such as generation of bubbles and unfilling of the upper and lower circuit boards can be prevented. Furthermore, it is possible to prevent a problem that the solder is wet and spreads too much and short-circuits between adjacent electrodes. Further, by setting the value to the upper limit value or less, since the resin between the solder bump and the circuit board electrode is eliminated when the solder bump and the circuit board electrode are metal-bonded, it is possible to suppress the bonding failure.
  • the melt viscosity of the film-like resin composition 302 is obtained by, for example, the following measurement method. Using a viscoelasticity measuring device (manufactured by RheoStressRS-10HAAKE) viscoelasticity measuring device (manufactured by Thermo Fisher Scientific “MARS”), a film-shaped resin composition having a thickness of 100 ⁇ m is parallel plate 20 mm ⁇ , gap 0.05 mm, The value at which the melt viscosity measured at a rate of temperature increase of 10 ° C./min and a frequency of 0.1 Hz was minimized was taken as the measured value.
  • a viscoelasticity measuring device manufactured by RheoStressRS-10HAAKE
  • MMARS Thermo Fisher Scientific
  • the film-like resin composition 302 is not particularly limited, but preferably has transparency to the extent that the surface of the semiconductor element can be recognized. Thereby, the position alignment when joining a chip
  • the peeling substrate 321 of the back grind tape and dicing tape integrated adhesive sheet 300 obtained by the above-described method is peeled off and bonded so that the film-like resin composition 302 and the functional surface 331 of the semiconductor wafer 303 come into contact with each other ( FIG. 8).
  • the upper surface (upper side in FIG. 9) of the back grind tape / dicing tape 301 is fixed to the polishing stage 304 of the polishing apparatus.
  • the polishing apparatus is not particularly limited, and a commercially available apparatus can be used.
  • the thickness of the semiconductor wafer 303 after back grinding is not particularly limited, but is preferably about 10 ⁇ m to 300 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m.
  • the back grind tape / dicing tape integrated adhesive sheet 300 of the present invention can be directly laminated on the functional surface 331 of the semiconductor wafer 303 because the film-like resin composition 302 is a resin composition containing a compound having flux activity. It is.
  • the semiconductor wafer 303 after the back grinding is placed on the dicer table 305 so that the back grinding tape / dicing tape 301 is in contact with the upper surface (the upper side in FIG. 10) of the dicer table 305 (FIG. 10).
  • a wafer ring 306 is installed around the semiconductor wafer 303 to fix the semiconductor wafer 303.
  • the semiconductor wafer 303 is cut with the blade 307 to divide the semiconductor wafer 303 into individual pieces to obtain a semiconductor element having the film-like resin composition 302.
  • the back grind tape / dicing tape-integrated adhesive sheet 300 has a buffering action, and prevents the semiconductor element from being cracked or chipped when the semiconductor wafer 303 is cut.
  • the semiconductor wafer 303 and the wafer ring 306 may be attached in advance to the back grind tape / dicing tape integrated adhesive sheet 300 and then placed on the dicer table 305.
  • the back grind tape / dicing tape-integrated adhesive sheet 300 is stretched with an expanding device, and the semiconductor elements having the film-shaped resin composition 302 separated into pieces are opened at regular intervals, and then picked up to obtain a substrate.
  • the back grind tape and dicing tape integrated adhesive sheet of the present invention has a back grind tape function and a dicing tape function, and the adhesive layer has a flux activity, so the function of omitting the flux application process and the like can be omitted. Etc. Therefore, the flux cleaning process is unnecessary, the productivity is excellent, and the workability of the semiconductor wafer can be improved.
  • A Polyfunctional epoxy resin having a naphthalene skeleton (a1) Bifunctional naphthalene type epoxy resin (manufactured by DIC Corporation / “EPICLON HP-4770”), epoxy equivalent 204 (A2) Trifunctional naphthalene type epoxy resin (manufactured by DIC Corporation / “EPICLON HP-4750”), epoxy equivalent 188 (A3) Tetrafunctional naphthalene type epoxy resin (DIC Corporation / “EPICLON HP-4700”), epoxy equivalent 165
  • the obtained resin composition varnish was applied to a polyester film substrate (base film, manufactured by Teijin DuPont Films, trade name: Purex A53) to a thickness of 50 ⁇ m, and then dried at 100 ° C. for 5 minutes. Then, the solvent was removed by evaporation to obtain a film-shaped resin composition having a thickness of 25 ⁇ m.
  • base film manufactured by Teijin DuPont Films, trade name: Purex A53
  • a semiconductor wafer having a film-like resin composition obtained above and a soldered copper electrode made of an alloy containing tin and silver as a low melting point conductive metal (size: 200 mm ⁇ , size of individual circuit) 10 mm ⁇ 10 mm, thickness 100 ⁇ m, electrode height 15 ⁇ m, electrode width 30 ⁇ m, distance between electrodes 30 ⁇ m, and 100 mm using a vacuum laminator (MVLP, manufactured by Meiki Co., Ltd.) Lamination was performed at 0 ° C. and 0.8 MPa for 30 seconds to obtain a semiconductor wafer with a film-like resin composition.
  • MVLP vacuum laminator
  • a dicing tape was bonded to the surface of the semiconductor wafer opposite to the surface on which the film-shaped resin composition was bonded with a laminator.
  • the bonding conditions at this time were 25 ° C., a pressure of 0.8 MPa, and 2 mm / s, and the semiconductor wafer with the film-like resin composition and the dicing tape were bonded together.
  • the dicing tape was fixed to the wafer ring and set on a dicing table of a dicing saw (DFD6360, manufactured by DISCO Corporation). Furthermore, it diced (cut
  • a flip chip bonder manufactured by Panasonic, FCB3
  • a silicon circuit board size 200 mm ⁇ , thickness 200 ⁇ m, individual circuit size
  • a protruding electrode made of copper coated with gold and nickel at the tip. 12 mm ⁇ 12 mm, electrode height 15 ⁇ m, electrode width 30 ⁇ m, distance between electrodes 30 ⁇ m
  • a predetermined alignment mark of the semiconductor chip with a film-like resin composition so that the soldered copper electrode comes into contact with Alignment is performed by automatically recognizing a predetermined alignment mark on the silicon circuit board with a flip chip bonder, and the semiconductor chip is heated to 235 ° C. for 5 seconds to melt the solder of the soldered copper electrode. Solder connection was made.
  • the film-shaped resin composition was cured by heating in an atmosphere of fluid pressure (air pressure) of 0.8 MPa at 180 ° C. for 60 minutes.
  • a dicing tape was bonded to the surface of the silicon circuit board opposite to the surface on which the semiconductor chip was mounted with a laminator. At this time, the bonding conditions were 25 ° C., pressure 0.8 MPa, and 2 mm / s.
  • the dicing tape was fixed to the wafer ring and set on a dicing table of a dicing saw (DFD6360, manufactured by DISCO Corporation). Further, dicing (cutting) was performed between the mounted semiconductor chip and the semiconductor chip using a dicing saw under the following conditions. As a result, a silicon circuit board on which a semiconductor chip is mounted is separated into pieces, and the following dicing size electronic device in which the semiconductor chip and the silicon circuit board are bonded via a cured product of a film-like resin composition ( Semiconductor device) was obtained.
  • a dicing saw D6360, manufactured by DISCO Corporation
  • Example 2 In preparing the resin composition, (E) 6 parts by mass of “EPICLON HP-4750” as component (A), 6 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” are mixed and mixed. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 3> In preparing the resin composition, (E) 6 parts by mass of “EPICLON HP-4700” as component (A), 6 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” are mixed and mixed. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 4 In preparing the resin composition, (E) 1 part by weight of “EPICLON HP-4700” as component (A), 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 21.7 of “jER806” Part by weight, 19 parts by weight of “PR-55617”, 0.1 part by weight of “2P4MZ”, 0.2 part by weight of “KBE403”, and 50 parts by weight of “SC1050-LC” are mixed and dissolved. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 5 In preparing the resin composition, In addition to 1 part by weight of “EPICLON HP-4700” as component (A), 25 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 21.7 “jER806” Part by mass, 0.1 part by mass of “2P4MZ” and 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further 50 parts by mass of “SC1050-LC” are mixed to obtain a resin composition having a solid content ratio of 50% by mass. A product varnish was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 6> In preparing the resin composition, (A) 20 parts by weight of “EPICLON HP-4700” as component, 3 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 13 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” are mixed and mixed. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 7 In preparing the resin composition, (E) 15 parts by weight of “EPICLON HP-4700” as component (A), 15 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 6 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” are mixed and mixed. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 8> In preparing the resin composition, In addition to 0.5 parts by weight of “EPICLON HP-4700” as component (A), 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 29 .5 parts by mass, 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” were dissolved in methyl ethyl ketone. By mixing, a resin composition varnish with a solid content ratio of 50 mass% was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 9 In preparing the resin composition, (A) 21 parts by weight of “EPICLON HP-4700” as component, 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 9 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403”, and 50 parts by mass of “SC1050-LC” are mixed and mixed. A resin composition varnish having a fraction of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 10 In preparing the resin composition, (E) 6 parts by weight of “EPICLON HP-4700” as component (A), 2 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 15.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 11 In preparing the resin composition, (E) 2 parts by weight of “EPICLON HP-4700” as component (A), 26 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 19.7 of “jER806” Part by mass, 0.1 part by mass of “2P4MZ” and 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further 50 parts by mass of “SC1050-LC” are mixed to obtain a resin composition having a solid content ratio of 50% by mass. A product varnish was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 12 In preparing the resin composition, (A) 6 parts by mass of “EPICLON HP-4700” as component, 6 parts by mass of “diphenolic acid” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ” and 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 13> In preparing the resin composition, (E) 6 parts by weight of “EPICLON HP-4700” as component (A), 6 parts by weight of “2-hydroxybenzoic acid” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 24 Part by mass, 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ” and 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed. Then, a resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 14 In preparing the resin composition, (E) 6 parts by mass of “EPICLON HP-4700” as component (A), 4 parts by mass of “phenol phthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 13.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 15 In preparing the resin composition, (A) 6 parts by mass of “EPICLON HP-4700” as component, 5 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 12.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 16> In preparing the resin composition, (A) 1 part by weight of “EPICLON HP-4700” as component, 17 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 5.7 parts by weight of “PR-55617”, 0.1 part by weight of “2P4MZ” and 0.2 part by weight of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by weight of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 17 In preparing the resin composition, In addition to 1 part by weight of “EPICLON HP-4700” as component (A), 13.5 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 24 Part by mass, 9.2 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ” and 0.2 parts by mass of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed. Then, a resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 18 In preparing the resin composition, In addition to 1 part by weight of “EPICLON HP-4700” as component (A), 11.5 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 24 Part by mass, 11.2 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ” and 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed. Then, a resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 19 In preparing the resin composition, (A) 1 part by weight of “EPICLON HP-4700” as component, 9 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 13.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and further 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 20> In preparing the resin composition, (A) 3 parts by weight of “EPICLON HP-4700” as component, 12 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 8.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.2 part by mass of “KBE403” are dissolved in methyl ethyl ketone, and 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • Example 21 In preparing the resin composition, (E) 6 parts by mass of “EPICLON HP-4700” as component (A), 12 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 5.7 parts by weight of “PR-55617”, 0.1 part by weight of “2P4MZ” and 0.2 part by weight of “KBE403” are dissolved in methyl ethyl ketone, and further, 50 parts by weight of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared. Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.
  • connection resistance value between the semiconductor chip and the silicon circuit board is measured with a digital multimeter, and the evaluation result based on the connection resistance value is based on the following criteria. Judged. [ ⁇ ]: The connection resistance value of all 10 electronic devices was 10 ⁇ or less. [ ⁇ ]: Connection resistance values of all 10 electronic devices were higher than 10 ⁇ and 30 ⁇ or lower. [ ⁇ ]: One or more electronic devices having a connection resistance value higher than 30 ⁇ .
  • dicing property evaluation was performed by evaluating whether or not the alignment marks of 10 semiconductor chips with a film-like resin composition can be automatically recognized. The evaluation results were determined according to the following criteria. [ ⁇ ]: Of the 10 semiconductor chips with a film-like resin composition, all 10 were automatically recognized. [ ⁇ ]: Among 10 semiconductor chips with a film-like resin composition, 6 or more and 9 or less could be automatically recognized. [X]: Of the 10 semiconductor chips with a film-like resin composition, 5 or less could be automatically recognized.
  • the film-like resin compositions of the Examples and Comparative Examples obtained by the preparation of the resin compositions described above were prepared at 100 ° C., 0 ° C. using a vacuum laminator (MVLP, manufactured by Meiki Co., Ltd.) on the wafer on which the SiN film was formed.
  • the laminate was laminated at 8 MPa for 30 seconds, and a 2 mm square chip with a film-shaped resin composition was produced by dicing. Further, a 6 mm square chip is manufactured by dicing a separate wafer on which the SiN film is formed, and the chip with the 2 mm square film-shaped resin composition is placed on the surface of the chip on which the SiN film is formed.
  • Tables 1 to 3 show the composition of the resin compositions and the evaluation results of the electronic devices in the above Examples and Comparative Examples.
  • each of Examples 1 to 21 is a resin composition containing the component (A), the component (B), and the component (C), and any electronic device using this is a resin composition. Excellent connectivity and insulation reliability.
  • the component (A) is a trifunctional epoxy resin and / or a tetrafunctional epoxy resin, and the component (B) is in one molecule.
  • the comparative example 1 uses adipic acid without using the component (B), adipic acid that does not participate in the reaction with the epoxy resin is present in the resin composition although the flux function can be provided. Therefore, the insulation reliability has been greatly reduced.
  • the component (B) was not used, but the flux function could not be expressed and the connectivity was greatly reduced.
  • the comparative example 3 was a thing which did not use the (A) component, since the heat resistance was insufficient, the insulation reliability fell significantly.
  • Example 22 ⁇ Manufacture of adhesive sheet> Using the resin composition varnish having a solid content ratio of 50% by mass in Example 1, a base polyester film (base film, manufactured by Teijin DuPont Films, trade name “Purex A53”, a dicing tape integrated adhesive sheet later) It corresponds to a cover film.) And was dried at 100 ° C. for 5 minutes to obtain an adhesive sheet on which a film-shaped resin composition having a thickness of 25 ⁇ m was formed.
  • base polyester film base film, manufactured by Teijin DuPont Films, trade name “Purex A53”, a dicing tape integrated adhesive sheet later
  • ⁇ Dicing tape integrated adhesive sheet> Formation of Intervening Layer of Dicing Tape 100 parts by mass of a copolymer having a weight average molecular weight of about 300,000 obtained by copolymerizing 30% by mass of 2-ethylhexyl acrylate and 70% by mass of vinyl acetate, and a molecular weight Is about 700 parts of a pentafunctional acrylate monomer, 5 parts by weight of 2,2-dimethoxy-2-phenylacetophenone, and 3 parts by weight of tolylene diisocyanate (trade name “Coronate T-100” manufactured by Nippon Polyurethane Industry Co., Ltd.) was applied to a surface of a polyester film having a thickness of 38 ⁇ m that had been subjected to a release treatment in advance so that the thickness after drying was 10 ⁇ m, and then dried at 80 ° C. for 5 minutes. And the ultraviolet-ray 500mJ / cm ⁇ 2 > was irradiated with respect to the obtained coating film, and
  • the adhesion layer of the dicing tape was formed into a film on the polyester film. Thereafter, a polyethylene sheet having a thickness of 100 ⁇ m was laminated (laminated) on the side of the pressure-sensitive adhesive layer opposite to the polyester film as a base layer of the dicing tape to obtain a dicing tape.
  • an electronic device was produced by the following procedure.
  • Semiconductor wafer having a soldered copper electrode made of an alloy containing tin and silver as a low melting point conductive metal on the surface size 200 mm ⁇ , individual circuit size 10 mm ⁇ 10 mm, thickness 100 ⁇ m, electrode height 15 ⁇ m, electrode width 30 ⁇ m, and the distance between the electrodes was 30 ⁇ m).
  • the cover film was peeled from the dicing tape-integrated adhesive sheet, and the dicing tape-integrated adhesive sheet and the semiconductor wafer were laminated so that the peeled surface was in contact with the surface having the soldered copper electrode of the semiconductor wafer.
  • This was laminated with a laminator at a bonding temperature of 80 ° C. and a pressure applied to the dicing tape integrated adhesive sheet of 0.8 MPa for 30 seconds to obtain a semiconductor wafer with a dicing tape integrated adhesive sheet.
  • the semiconductor wafer with the dicing tape-integrated adhesive sheet was diced (cut) under the following conditions from the semiconductor wafer side using a dicing saw (DFD 6360, manufactured by Disco Corporation). As a result, the semiconductor wafer was separated into individual pieces, and semiconductor chips having the following dicing size were obtained. In addition, the notch formed by this dicing had the front-end
  • one of the semiconductor chips was pushed up with a needle from the support film side (the substrate layer side of the dicing tape) of the dicing tape-integrated adhesive sheet, and the pushed-up surface of the semiconductor chip was pulled up while adsorbing with the collet of the die bonder . This picked up the semiconductor chip with an adhesive sheet.
  • a silicon circuit (size 200 mm ⁇ , individual circuit size 12 mm ⁇ 12 mm, thickness, having a protruding electrode made of copper coated with gold and nickel at the tip) 200 ⁇ m, electrode height 15 ⁇ m, electrode width 30 ⁇ m, distance between electrodes 30 ⁇ m), a predetermined alignment mark of the semiconductor chip with the adhesive sheet and a predetermined alignment mark of the silicon circuit board are connected with a flip chip bonder. Positioning was performed by automatic recognition, and the semiconductor chip was heated on a silicon circuit board at 235 ° C. for 5 seconds to melt the solder of the solder bumps, thereby performing solder connection.
  • the film-shaped resin composition is cured by heating in an atmosphere of fluid pressure (air pressure) of 0.8 MPa at 180 ° C. for 60 minutes, and the semiconductor chip and the silicon circuit board are cured adhesive films.
  • a bonded electronic device was obtained.
  • a dicing tape was bonded to the surface of the silicon circuit board opposite to the surface on which the semiconductor chip was mounted with a laminator. At this time, the bonding conditions were 25 ° C., pressure 0.8 MPa, and 2 mm / s.
  • the dicing tape was fixed to the wafer ring and set on a dicing table of a dicing saw (DFD6360, manufactured by DISCO Corporation). Further, dicing (cutting) was performed between the mounted semiconductor chip and the semiconductor chip using a dicing saw under the following conditions. As a result, a silicon circuit board on which a semiconductor chip is mounted is separated into pieces, and the following dicing size electronic device in which the semiconductor chip and the silicon circuit board are bonded via a cured product of a film-like resin composition ( Semiconductor device) was obtained.
  • a dicing saw D6360, manufactured by DISCO Corporation
  • Example 23 ⁇ Manufacture of adhesive sheet> Using the resin composition varnish with a solid content ratio of 50% by mass in Example 1, a base polyester film (base film, manufactured by Teijin DuPont Films, trade name “Purex A53”, later back grind tape integrated adhesive sheet The film was applied to a thickness of 50 ⁇ m and dried at 100 ° C. for 5 minutes to obtain an adhesive sheet on which a film-shaped resin composition having a thickness of 25 ⁇ m was formed.
  • base polyester film base film, manufactured by Teijin DuPont Films, trade name “Purex A53”, later back grind tape integrated adhesive sheet
  • the film was applied to a thickness of 50 ⁇ m and dried at 100 ° C. for 5 minutes to obtain an adhesive sheet on which a film-shaped resin composition having a thickness of 25 ⁇ m was formed.
  • ⁇ Back grind tape integrated adhesive sheet> (1) Manufacture of back grind tape integrated adhesive sheet 44 parts by mass of alkyl acrylate copolymer Nissetsu KP-2254E (Nippon Carbide Industries), urethane acrylate HC-15 (Daiichi Seika Kogyo) 45 Mass parts, 8 parts by mass of isocyanate-based cross-linking agent Coronate L (manufactured by Nippon Polyurethane Industry), 3 parts by mass of photopolymerization initiator Irgacure 651 (manufactured by BASF Japan) are dissolved in ethyl acetate, and the varnish for the adhesive layer of the back grind tape was prepared.
  • the pressure-sensitive adhesive layer varnish of the back grind tape was applied to a 38 ⁇ m-thick polyester film surface that had been subjected to release treatment in advance so that the thickness after drying was 10 ⁇ m, and then dried at 80 ° C. for 5 minutes. And the adhesive layer of the back grind tape was formed into a film on the polyester film. Then, a film made of polyethylene and ethylene / vinyl acetate copolymer (EVA) having a thickness of 120 ⁇ m is laminated (laminated) on the side of the pressure-sensitive adhesive layer opposite to the polyester film as a base layer of the back grind tape. Was transferred to a film made of polyethylene and an ethylene / vinyl acetate copolymer (EVA) to obtain a back grind tape.
  • EVA ethylene / vinyl acetate copolymer
  • the adhesive sheet is punched out to the same size as that of the semiconductor wafer, and after removing unnecessary portions, the adhesive layer and the film-like resin of the back grind tape obtained above
  • a back grind tape integrated adhesive sheet in which the substrate of the back grind tape, the adhesive layer of the back grind tape, the film-like resin composition, and the cover film are laminated in this order is obtained. Obtained.
  • an electronic device was produced by the following procedure using the back grind tape integrated adhesive sheet obtained above.
  • Semiconductor wafer having a soldered copper electrode made of an alloy containing tin and silver as a low melting point conductive metal on the surface (size 200 mm ⁇ , individual circuit size 10 mm ⁇ 10 mm, thickness 725 ⁇ m, electrode height 15 ⁇ m, electrode width 30 ⁇ m and a distance between electrodes of 30 ⁇ m) were prepared.
  • the cover film is peeled from the back grind tape integrated adhesive sheet, and the background tape integrated adhesive sheet and the semiconductor wafer are laminated so that the peeled surface is in contact with the surface having the soldered copper electrode of the semiconductor wafer.
  • a semiconductor wafer with a background tape integrated adhesive sheet was obtained.
  • the surface of the semiconductor wafer with the background tape integrated adhesive sheet is ground on the opposite side of the surface of the semiconductor wafer with the back grind tape integrated adhesive sheet.
  • the background tape integrated adhesive was peeled from the interface between the pressure-sensitive adhesive layer of the sheet and the film-like resin composition.
  • the semiconductor wafer was diced to obtain a semiconductor chip with a film-like resin composition. Using the obtained semiconductor chip with a film-like resin composition, an electronic device was produced in the same manner as in Example 22, and the same evaluation was performed.
  • Example 24 Production of Back Grinding Tape / Dicing Tape-Integrated Adhesive Sheet Using the resin composition varnish with a solid content ratio of 50% by mass of Example 1, a polyester film substrate (base film, manufactured by Teijin DuPont Films, Inc., trade name: Pew Rex A53, which corresponds to a cover film of a back grind tape and dicing tape integrated adhesive sheet later.) To a thickness of 50 ⁇ m, and then dried at 100 ° C. for 5 minutes to evaporate and remove the solvent. A film-shaped resin composition having a thickness of 25 ⁇ m was obtained.
  • base film manufactured by Teijin DuPont Films, Inc., trade name: Pew Rex A53, which corresponds to a cover film of a back grind tape and dicing tape integrated adhesive sheet later.
  • a film having a thickness of 100 ⁇ m was formed with an extruder, and the surface was subjected to corona treatment to obtain a base film.
  • a copolymer having a weight average molecular weight of 500,000 obtained by copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of butyl acrylate, 37 parts by mass of vinyl acetate, and 3 parts by mass of 2-hydroxyethyl methacrylate.
  • the polymer was release-treated on a polyester film having a thickness of 38 ⁇ m so that the thickness after drying was 10 ⁇ m, and dried at 80 ° C.
  • an electronic device was manufactured by the following procedure using the back grind tape-integrated adhesive sheet obtained above.
  • Semiconductor wafer having a soldered copper electrode made of an alloy containing tin and silver as a low melting point conductive metal on the surface (size 200 mm ⁇ , individual circuit size 10 mm ⁇ 10 mm, thickness 725 ⁇ m, electrode height 15 ⁇ m, electrode width 30 ⁇ m, and the distance between the electrodes was 30 ⁇ m).
  • the cover film of the back grind tape / dicing tape integrated adhesive sheet is peeled off, and the film-like resin composition is attached to the surface of the semiconductor wafer with the soldered copper electrode at a temperature of 90 ° C. and a pressure of 0.3 MPa.
  • a semiconductor wafer with a grind tape and dicing tape integrated adhesive sheet was obtained.
  • the upper surface (upper side in FIG. 9) of the back grind tape / dicing tape-integrated adhesive sheet 1 is fixed to the polishing stage 304 of the polishing apparatus, and is ground until the thickness of the semiconductor wafer 303 becomes 725 ⁇ m to 200 ⁇ m. Went.
  • this semiconductor wafer is placed so that the back grind tape and dicing tape integrated adhesive sheet 1 and the upper surface of the dicer table 305 are in contact with each other, and a spindle rotating speed of 30 is used using a dicing saw.
  • the wafer was diced (cut) into a 10 mm ⁇ 10 mm square semiconductor chip at 1,000 rpm and a cutting speed of 50 mm / sec.
  • Comparative Example 4 An electronic device was produced and evaluated in the same manner as in Example 22 except that the resin composition of Example 22 was changed to the resin composition of Comparative Example 1. As in Comparative Example 1, the result of inferior insulation reliability was “x”.
  • Comparative Example 5 An electronic device was produced and evaluated in the same manner as in Example 23 except that the resin composition of Example 23 was changed to the resin composition of Comparative Example 1. As in Comparative Example 1, the result of inferior insulation reliability was “x”.
  • Comparative Example 6 An electronic device was produced and evaluated in the same manner as in Example 24 except that the resin composition of Example 24 was changed to the resin composition of Comparative Example 1. As in Comparative Example 1, the result of inferior insulation reliability was “x”.
  • the present invention comprises a resin composition required to provide an electronic device having high connectivity between opposing electrodes and high insulation reliability, and a cured product of the resin composition. It can be applied to electronic devices that require insulation reliability.
  • Electrode 111a Formed on First Substrate Gold 111b Nickel 111c Copper Pillar 120 Second Substrate 121 Electrode 121a Formed on First Substrate Solder Bump 121b Copper Pillar 130 Resin Composition 301 Back Grinding Tape Combined dicing tape adhesive sheet 302 Adhesive layer 321 Release substrate 303 Semiconductor wafer 331 Functional surface 304 Polishing stage 305 Dicer table 306 Wafer ring 307 Blade 300 Film for semiconductor

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne une composition de résine permettant d'obtenir un dispositif électronique présentant une adhérence élevée entre des électrodes et une fiabilité d'isolation élevée, ainsi qu'un dispositif électronique pourvu d'un produit durci de la composition de résine. Cette composition de résine est de type à film et elle est destinée à relier des électrodes, la composition étant disposée entre des électrodes se faisant face pour les connecter électriquement. La composition selon l'invention se caractérise en ce qu'elle contient : (A) une résine époxyde polyfonctionnelle à squelette naphtalène; (B) un composé pourvu d'un groupe hydroxyle phénolique et un groupe carboxyle par molécule; et (C) une résine filmogène.
PCT/JP2013/078268 2012-10-18 2013-10-18 Composition de résine, feuille adhésive, feuille adhésive de type à ruban de découpage en dés intégré, feuille adhésive de type à ruban d'affûtage du dos intégré, feuille adhésive de type à ruban de découpage du dos/ruban de découpage en dés intégrés et dispositif électronique Ceased WO2014061767A1 (fr)

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US10597507B2 (en) 2016-02-13 2020-03-24 Greenmantra Recycling Technologies Ltd. Polymer-modified asphalt with wax additive
US10723858B2 (en) 2018-09-18 2020-07-28 Greenmantra Recycling Technologies Ltd. Method for purification of depolymerized polymers using supercritical fluid extraction
US10870739B2 (en) 2016-03-24 2020-12-22 Greenmantra Recycling Technologies Ltd. Wax as a melt flow modifier and processing aid for polymers
US11072676B2 (en) 2016-09-29 2021-07-27 Greenmantra Recycling Technologies Ltd. Reactor for treating polystyrene material

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TWI666237B (zh) * 2015-09-16 2019-07-21 日商琳得科股份有限公司 保護膜形成用薄膜
TWI664229B (zh) * 2015-09-16 2019-07-01 日商琳得科股份有限公司 保護膜形成用薄膜
JP7031141B2 (ja) * 2017-06-01 2022-03-08 昭和電工マテリアルズ株式会社 半導体加工用テープ
JP7285209B2 (ja) * 2019-12-26 2023-06-01 信越化学工業株式会社 下層膜形成材料、下層膜の形成方法、及びパターン形成方法

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JP2008013710A (ja) * 2006-07-07 2008-01-24 Sumitomo Bakelite Co Ltd 樹脂組成物、封止材、半導体装置および半導体装置の製造方法
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JP2008013710A (ja) * 2006-07-07 2008-01-24 Sumitomo Bakelite Co Ltd 樹脂組成物、封止材、半導体装置および半導体装置の製造方法
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Publication number Priority date Publication date Assignee Title
US10472487B2 (en) 2015-12-30 2019-11-12 Greenmantra Recycling Technologies Ltd. Reactor for continuously treating polymeric material
US10597507B2 (en) 2016-02-13 2020-03-24 Greenmantra Recycling Technologies Ltd. Polymer-modified asphalt with wax additive
US10870739B2 (en) 2016-03-24 2020-12-22 Greenmantra Recycling Technologies Ltd. Wax as a melt flow modifier and processing aid for polymers
US11072676B2 (en) 2016-09-29 2021-07-27 Greenmantra Recycling Technologies Ltd. Reactor for treating polystyrene material
US10723858B2 (en) 2018-09-18 2020-07-28 Greenmantra Recycling Technologies Ltd. Method for purification of depolymerized polymers using supercritical fluid extraction

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