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WO2013114956A1 - Feuille adhésive étirable, thermiquement détachable - Google Patents

Feuille adhésive étirable, thermiquement détachable Download PDF

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Publication number
WO2013114956A1
WO2013114956A1 PCT/JP2013/050739 JP2013050739W WO2013114956A1 WO 2013114956 A1 WO2013114956 A1 WO 2013114956A1 JP 2013050739 W JP2013050739 W JP 2013050739W WO 2013114956 A1 WO2013114956 A1 WO 2013114956A1
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WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
adhesive sheet
pressure
heat
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/050739
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English (en)
Japanese (ja)
Inventor
村田秋桐
飯田博之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
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Filing date
Publication date
Priority claimed from JP2012017112A external-priority patent/JP2013155295A/ja
Priority claimed from JP2012262010A external-priority patent/JP2013177549A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of WO2013114956A1 publication Critical patent/WO2013114956A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate

Definitions

  • the present invention provides an extensible heat-peelable pressure-sensitive adhesive sheet that can be easily peeled off from an adherend by heat treatment, a method for producing a cut piece using the extensible heat-peelable pressure-sensitive adhesive sheet, and a method for producing the cut piece.
  • the present invention relates to an electronic component and a semiconductor wafer component.
  • An extensible heat-peelable pressure-sensitive adhesive sheet that uses a stretchable film as a base material and is provided with a pressure-sensitive adhesive layer containing a foaming agent on the base material so that the adhesive force can be reduced by foaming or expansion treatment by heating.
  • the pressure-sensitive adhesive sheet is used for temporary fixing at the time of cutting processing of a semiconductor or an electronic component. There has been proposed a method of collecting gaps between the cut pieces by utilizing the method and collecting the cut pieces by peeling by heat treatment (see cited document 1).
  • films such as a soft vinyl chloride film, a soft polyolefin film, and a stretchable polyester film that are specifically exemplified as the base material (base film) of the extensible heat-peelable pressure-sensitive adhesive sheet in Cited Document 1 are not sufficient. Since it does not have high heat resistance, it is necessary to set each process temperature to about 140 ° C. or less in the cutting process of electronic parts, other processing processes before cutting, and heat peeling process after cutting. It was happening. In addition, since the surface of the film exhibits a relatively high coefficient of friction with respect to various materials, the pressure-sensitive adhesive sheet based on the film is used to cut an object to be cut, and then the pressure-sensitive adhesive sheet is stretched and cut.
  • an object of the present invention is to set the processing temperature and the heat peeling temperature when cutting the adherend to obtain a cut piece at a high temperature (for example, 140 ° C. or more), and to extend uniformly and easily. Therefore, an object of the present invention is to provide an extensible heat-peelable pressure-sensitive adhesive sheet excellent in heat resistance and extensibility, which can form and secure a sufficient interval between cut pieces formed by cutting. Furthermore, another object of the present invention is to provide a method for producing a cut piece using the extensible heat-peelable pressure-sensitive adhesive sheet, an electronic component as a cut piece produced by the production method, and a semiconductor wafer part. It is in.
  • an extensible heat-peelable mold having a base material and a thermally expandable adhesive layer containing thermally expandable microspheres on one surface of the base material.
  • a pressure-sensitive adhesive sheet wherein the substrate is made of a fluororesin film (preferably a fluororesin film having a maximum continuous use temperature of 140 ° C. or higher, particularly a polytetrafluoroethylene film), has heat resistance and elongation.
  • a fluororesin film preferably a fluororesin film having a maximum continuous use temperature of 140 ° C. or higher, particularly a polytetrafluoroethylene film
  • the static friction coefficient of steel balls with respect to steel balls is preferably 0.2 or less, and that the tensile stress at 10% elongation (machine direction) and the tensile stress at 10% elongation (width direction) are preferably 25 MPa or less. .
  • the present invention is a substrate having a substrate and a thermally expandable adhesive layer containing thermally expandable microspheres on one surface side of the substrate, and the substrate is made of a fluororesin film.
  • An extensible heat-peelable pressure-sensitive adhesive sheet is provided.
  • the extensible heat-peelable pressure-sensitive adhesive sheet is provided wherein the maximum continuous use temperature (based on UL746B) of the substrate is 140 ° C. or higher.
  • the extensible heat-peelable pressure-sensitive adhesive sheet is provided in which the substrate is a substrate made of a polytetrafluoroethylene film.
  • the extensible heat-peelable pressure-sensitive adhesive sheet has a static friction coefficient (based on ASTM D1894, steel ball of 10 mm ⁇ ) of 0.2 or less on the back surface of the substrate.
  • the extensible heat-peelable pressure-sensitive adhesive sheet having a tensile stress (machine direction) at 10% elongation and a tensile stress (width direction) at 10% elongation of 25 MPa or less is provided.
  • the stretchable heat-peelable pressure-sensitive adhesive sheet is provided in which the polytetrafluoroethylene film is a polytetrafluoroethylene film produced by a compression molding cutting method.
  • the extensible heat-peelable pressure-sensitive adhesive sheet is provided in which the polytetrafluoroethylene film is a polytetrafluoroethylene film produced by a dipping method.
  • the extensible heat-peelable pressure-sensitive adhesive sheet having a rubbery organic elastic layer between the base material and the thermally expandable pressure-sensitive adhesive layer is provided.
  • the extensible heat-peelable pressure-sensitive adhesive sheet is provided in which the rubbery organic elastic layer is an adhesive layer formed of an adhesive substance.
  • this invention mounts a to-be-cut body on the heat
  • the present invention provides an electronic component which is a cut piece manufactured by the above manufacturing method.
  • the present invention also provides a semiconductor wafer component which is a cut piece manufactured by the above manufacturing method.
  • the processing process temperature such as cutting of the adherend and the heat-peeling temperature can be set to a high temperature (for example, 140 ° C. or higher), and its application range (process) Seeds, component types, etc.). Furthermore, since it is possible to extend uniformly and easily when a sufficient interval is formed and secured between the cut pieces formed by the cutting process, the operability and workability of such work can be remarkably improved, and consequently The productivity of cut pieces (for example, electronic parts and semiconductor wafer parts) can be greatly improved.
  • FIG. 1 A method for producing a cut piece using the extensible heat-peelable pressure-sensitive adhesive sheet shown in FIG. 1 (a state in which a cut object (before cutting) is placed on the extensible heat-peelable pressure-sensitive adhesive sheet and then cut into a predetermined size) It is explanatory drawing of. It is explanatory drawing of the manufacturing method (The state after giving an extending
  • the extensible heat-peelable pressure-sensitive adhesive sheet of the present invention (sometimes simply referred to as “pressure-sensitive adhesive sheet”) has a base material (base material layer) and one or more layers of thermally expandable micro-sheets on one surface side of the base material.
  • a pressure-sensitive adhesive sheet having at least a thermally expandable pressure-sensitive adhesive layer containing spheres.
  • the adhesive sheet of this invention may have a rubber-like organic elastic layer between the said base material and the said thermally expansible adhesive layer as needed.
  • the term “adhesive sheet” includes a tape-shaped one, that is, “adhesive tape”.
  • FIG. 1 is a schematic sectional view showing an example of the pressure-sensitive adhesive sheet of the present invention.
  • the pressure-sensitive adhesive sheet of the present invention shown in FIG. 1 has a heat-expandable pressure-sensitive adhesive layer 3 on one surface of a substrate 1, and the surface of the heat-expandable pressure-sensitive adhesive layer 3 (surface opposite to the substrate 1 side). ) Is a pressure-sensitive adhesive sheet having a separator (release liner) 4.
  • FIG. 2 is a schematic cross-sectional view showing another example of the pressure-sensitive adhesive sheet of the present invention.
  • the pressure-sensitive adhesive sheet has a heat-expandable pressure-sensitive adhesive layer 3 and further has a separator 4 on the surface of the heat-expandable pressure-sensitive adhesive layer 3 (the surface opposite to the rubbery organic elastic layer 2 side).
  • the adhesive sheet of this invention does not necessarily need to have a separator,
  • excluding the separator 4 from the adhesive sheet shown in FIG. 1, FIG. 2 may be sufficient.
  • the surface of the thermally expandable pressure-sensitive adhesive layer is brought into contact with the surface of the base material in the pressure-sensitive adhesive sheet (sometimes referred to as “back surface of base material”). It may be protected by being wound into a roll.
  • the base material (1 in FIGS. 1 and 2) in the pressure-sensitive adhesive sheet of the present invention is a support base (support) such as a heat-expandable pressure-sensitive adhesive layer, and the base material is a base material made of a fluororesin film. is there.
  • the said fluororesin film is a film formed from the fluororesin in which a fluorine atom is contained in molecular structure. Although content of the fluororesin in the said fluororesin film (100 weight%) is not specifically limited, 50 weight% or more is preferable, More preferably, it is 70 weight% or more.
  • the fluororesin film may have a single layer form or a multilayer (multi-layer) form.
  • the form of the “fluororesin film” includes a sheet form.
  • the base material may be the fluororesin film, or may be a laminate of the fluororesin film and other layers (for example, a film, a sheet, etc.) as long as the effects of the present invention are not impaired. .
  • the “base material” does not include a separator that is peeled off when the adhesive sheet is used (attached).
  • the maximum continuous use temperature of the substrate is not particularly limited, but is preferably 140 ° C. or higher (eg, 140 to 300 ° C.), more preferably 160 ° C. or higher, from the viewpoint of heat resistance. Preferably it is 200 degreeC or more.
  • the maximum continuous use temperature is a temperature at which the value after 40,000 hours has elapsed from the initial value, which is determined in accordance with UL746B of the tensile strength of the base material (particularly, the fluororesin film).
  • the base material (particularly the fluororesin film) is not particularly limited, but it is preferable that the static friction coefficient with respect to a 10 mm ⁇ steel ball (a steel ball having a diameter of 10 mm) on at least one surface is 0.2 or less, more preferably. 0.15 or less.
  • the pressure-sensitive adhesive sheet having the base material having a static friction coefficient of 0.2 or less as the back surface of the base material has a high slidability on the back surface of the base material, and the operability and workability in the extension work tend to be remarkably improved.
  • the static friction coefficient can be measured under conditions of, for example, a load of 200 gf and a sliding speed of 150 mm / min in accordance with ASTM D1894, with a steel ball having a diameter of 10 mm as a friction target.
  • the tensile stress at 10% elongation in the machine direction (longitudinal direction) of the substrate (particularly the fluororesin film) (referred to as “tensile stress (machine direction)”) is not particularly limited, but is preferably 25 MPa or less, more Preferably it is 20 MPa or less.
  • tensile stress (machine direction) is not particularly limited, but is preferably 25 MPa or less, more Preferably it is 20 MPa or less.
  • the tensile stress (machine direction) at the time of 10% elongation is, for example, in accordance with JIS K7127, under the conditions of test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5%. Can be measured.
  • the tensile stress (referred to as “tensile stress (width direction)”) at 10% elongation in the width direction of the base material (particularly the fluororesin film) is not particularly limited, but is preferably 25 MPa or less, more preferably 20 MPa or less. It is.
  • tensile stress (width direction) at 10% elongation exceeding 25 MPa is used as the base material, excessive force is required to stretch the base material in the adhesive sheet, and workability in the stretching work May cause trouble.
  • the tensile stress (width direction) at the time of 10% elongation is, for example, in accordance with JIS K7127, under conditions of test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5%. Can be measured.
  • the elongation rate in the machine direction (referred to as “elongation rate (machine direction)”) of the substrate (particularly the fluororesin film) is not particularly limited, but is preferably 20% or more, and more preferably 150% or more.
  • the upper limit of the elongation (machine direction) is not particularly limited, but is preferably about 1000%, more preferably about 800% in order not to sag due to the weight of the adherend.
  • the elongation rate (machine direction) of the substrate is measured under the conditions of, for example, test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5% in accordance with JIS K7127. can do.
  • the elongation rate in the width direction of the substrate is not particularly limited, but is preferably 20% or more, and more preferably 150% or more.
  • the upper limit of the elongation (in the width direction) is not particularly limited, but is preferably about 1000%, more preferably about 800% in order not to sag due to the weight of the adherend.
  • the elongation rate (width direction) of the said base material is measured on the conditions of the test piece type 5, test speed 300mm / min, temperature 23 ⁇ 2 degreeC, and relative humidity 50 ⁇ 5% based on JISK7127, for example. can do.
  • a film formed of a fluororesin (a resin containing at least a fluorine atom as a constituent atom) can be used.
  • a fluororesin a resin containing at least a fluorine atom as a constituent atom
  • a fluororesin film in the base material a film formed of a fluororesin (a resin containing at least a fluorine atom as a constituent atom)
  • a film formed of a fluororesin a resin containing at least a fluorine atom as a constituent atom
  • a PTFE film is preferable from the viewpoint of various physical properties (for example, maximum continuous use temperature, static friction coefficient, tensile stress at 10% elongation, etc.),
  • the thickness of the substrate is not particularly limited, and operability and workability in each process such as sticking to an adherend, cutting of the adherend, peeling and recovery of the cut piece, and the like.
  • the thickness is preferably 10 ⁇ m to 1 mm, more preferably 20 to 300 ⁇ m.
  • the base material (particularly, the fluororesin film) can be produced by a known or conventional method, and is not particularly limited, but particularly from the viewpoint of producing (forming a film) a base material having a thickness in the above range.
  • Examples thereof include a compression molding cutting method, a dipping method, a paste extrusion method, and a melt extrusion method.
  • the dipping method is particularly preferable from the viewpoint of isotropic tensile stress at 10% elongation.
  • Conventional chromic acid is used on the surface of the base material (particularly the fluororesin film) on the side where the heat-expandable adhesive layer or the rubber-like organic elastic layer is provided in order to improve adhesion and retention with adjacent layers. It is preferable to perform chemical or physical easy adhesion treatment such as treatment, ozone treatment, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, surface easy adhesion treatment with an alkali metal ammonium solution, and the like. When such treatment has not been performed, when the adhesive sheet is peeled off from the adherend when it is peeled off by heating, the adjacent thermally expandable adhesive layer or the rubbery organic elastic layer falls off from the substrate, There is a possibility of causing problems such as adhesive residue.
  • the heat-expandable pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet of the present invention contains heat-expandable microspheres (microcapsules) so that the pressure-sensitive adhesive sheet adhered to the adherend can be easily removed from the adherend by heat treatment. To do.
  • the heat-expandable pressure-sensitive adhesive layer (foamed and / or expanded) is obtained by heating the heat-expandable pressure-sensitive adhesive layer at any time and foaming and / or expanding the heat-expandable microspheres in the heat-expandable pressure-sensitive adhesive layer.
  • the adhesion area between the post-expansion treatment and the adherend decreases, and as a result, the pressure-sensitive adhesive sheet can be easily peeled off.
  • a foaming agent that is not microencapsulated is used instead of the heat-expandable microspheres, good peelability (heat peelability) cannot be stably exhibited.
  • the heat-expandable microsphere examples include a microsphere in which a substance that is easily gasified and exhibits thermal expandability, such as isobutane, propane, and pentane, is encapsulated in an elastic shell.
  • the shell is often formed of a material that is softened (melted) by heat or destroyed by thermal expansion.
  • the material that forms the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, Examples thereof include polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
  • the thermally expandable microspheres can be produced by a conventional method such as a coacervation method or an interfacial polymerization method.
  • thermally expandable microspheres examples include “Matsumoto Microsphere” (trade name, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), “Daifoam” (trade name, manufactured by Dainichi Seika Kogyo Co., Ltd.), etc. Commercial products can also be used.
  • the expansion start temperature (foam start temperature) of the thermally expandable microsphere is not particularly limited, but from the viewpoint of achieving the gist of the present invention, specifically, excellent heat resistance and heat peelability for the pressure-sensitive adhesive sheet.
  • 150 ° C. or higher (for example, 150 to 300 ° C.) is preferable, and 170 ° C. or higher is more preferable.
  • the expansion start temperature is less than 150 ° C., for example, when heat is applied in a processing step such as cutting, the pressure-sensitive adhesive sheet is peeled off, and workability may be reduced.
  • expansion start temperature refers to a thermal expansion device (“TMA / SS6100”, manufactured by SII / Nanotechnology Co., Ltd.) and an expansion method (load: 0.1 N, probe) : Temperature at which the expansion of the thermally expandable microspheres was measured at a measurement speed of 3 mm ⁇ and a heating rate of 5 ° C./min.
  • the average particle size (before expansion) of the thermally expandable microspheres is not particularly limited, but is preferably about 1 to 50 ⁇ m from the viewpoint of dispersibility and thin layer formation.
  • thermally expandable microspheres are preferably 2 times or more, more preferably 7 times or more, and still more preferably from the viewpoint of lowering the adhesive strength of the thermally expandable pressure-sensitive adhesive layer by heat treatment. Thermally expandable microspheres that do not rupture until 10 times or more are preferred.
  • the content (blending amount) of the heat-expandable microspheres can be determined as appropriate according to the expansion ratio of the heat-expandable pressure-sensitive adhesive layer, the ability to reduce the adhesive force, and the like.
  • the amount is preferably 1 to 150 parts by weight, more preferably 10 to 130 parts by weight, and still more preferably 25 to 100 parts by weight with respect to 100 parts by weight of the base polymer.
  • the heat-expandable pressure-sensitive adhesive layer is formed of a composition (pressure-sensitive adhesive composition) containing the heat-expandable microspheres and a pressure-sensitive substance.
  • the adhesive substance can express adhesiveness (adhesive properties) with respect to the thermally expandable adhesive layer, and allows the expansion and / or expansion of the thermally expandable microspheres upon heating, Sometimes, those that do not restrain the expansion and / or expansion of thermally expandable microspheres as much as possible can be preferably used.
  • Specific examples of the adhesive substance include rubber adhesives, acrylic adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, and urethane adhesives.
  • Styrene-diene block copolymer-based pressure-sensitive adhesives known pressure-sensitive adhesives such as pressure-sensitive adhesives having improved creep properties by blending a heat-meltable resin having a melting point of about 200 ° C. or lower (for example, Japanese Patent Laid-Open No. 56-61468)
  • pressure-sensitive adhesives described in JP-A No. 61-174857, JP-A No. 63-17981 and JP-A No. 56-13040 can be used.
  • the pressure-sensitive adhesive may be a blend of appropriate additives such as a crosslinking agent, a tackifier, a plasticizer, a filler, and an anti-aging agent.
  • the adhesive substance for example, a rubber-based adhesive having a base polymer of natural rubber or various synthetic rubbers; methyl group, ethyl group, propyl group, butyl group, pentyl group (amyl group) , Hexyl, heptyl, 2-ethylhexyl, isooctyl, isodecyl, dodecyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, etc.
  • the base polymer is an acrylic polymer (or acrylic copolymer) obtained by polymerizing one or more of esters ((meth) acrylic acid alkyl esters) such as acrylic acid and methacrylic acid having the following alkyl groups: Examples include acrylic adhesives. Note that “(meth) acryl” means “acryl” and / or “methacryl” (one or both of “acryl” and “methacryl”).
  • the acrylic polymer may be, for example, acrylic acid, methacrylic acid, for the purpose of modifying the cohesive force, heat resistance, crosslinkability, etc. of the heat-expandable adhesive layer, if necessary.
  • Carboxyl group-containing monomers such as carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid; acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth) acrylate, Hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxylauryl (meth) acrylate, (4 -Hydroxymethylcyclohexyl) -methyl Hydroxy
  • the base polymer constituting the adhesive substance is particularly from room temperature (for example, 25 ° C.) from the viewpoint of the balance between moderate adhesive strength before heat treatment and lowering of adhesive strength after heat treatment.
  • Those having a dynamic elastic modulus at 150 ° C. in the range of 50,000 to 10 million dyn / cm 2 are preferred.
  • the dynamic elastic modulus can be measured by, for example, dynamic viscoelasticity measurement.
  • a base polymer layer having a thickness of about 2.5 to 3.5 mm is formed and manufactured by Rheometric Scientific, Inc.
  • AWS Advanced Rheometric Expansion System
  • the pressure-sensitive adhesive composition for forming the heat-expandable pressure-sensitive adhesive layer includes a crosslinking agent (for example, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a polyurethane-based adhesive).
  • a crosslinking agent for example, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a polyurethane-based adhesive.
  • tackifiers for example, rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenol resins, etc.
  • plasticizers for example, rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenol resins, etc.
  • fillers for anti-aging agents, and other suitable additives may be blended. .
  • the heat-expandable pressure-sensitive adhesive layer is prepared by preparing a pressure-sensitive adhesive composition by mixing the above-mentioned heat-expandable microspheres and pressure-sensitive substances using a solvent as necessary.
  • a method of applying on a substrate (or a rubber-like organic elastic layer) or a thermally expandable adhesive layer formed on a separator according to the method is transferred onto the substrate (or a rubber-like organic elastic layer). It can implement by appropriate systems, such as a system.
  • the thickness of the heat-expandable pressure-sensitive adhesive layer (before heat treatment) is not particularly limited, but is preferably 300 ⁇ m or less, more preferably 100 ⁇ m or less. When the thickness is too thick (for example, exceeding 300 ⁇ m), the adhesive layer that easily adheres to the adherend tends to be generated due to cohesive failure of the thermally expandable adhesive layer (after the heat treatment) during peeling after the heat treatment. On the other hand, if the thickness of the heat-expandable pressure-sensitive adhesive layer is too thin, the degree of deformation of the heat-expandable pressure-sensitive adhesive layer by heat treatment is small, the adhesive force is difficult to decrease, or the particle diameter of the heat-expandable microspheres to be included is reduced. It becomes necessary to make it too small. From this point, the thickness of the thermally expandable pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, and further preferably 15 ⁇ m or more.
  • the thermally expandable pressure-sensitive adhesive layer may have a single layer form or a multilayer (multi-layer) form.
  • the rubbery organic elastic layer disposed between the base material and the heat-expandable pressure-sensitive adhesive layer adheres to the surface when the pressure-sensitive adhesive sheet is adhered to the adherend, if necessary.
  • the rubbery organic elastic layer is not particularly limited, but natural rubber, synthetic rubber, or rubber having a Shore hardness (according to ASTM D1706) of preferably D50 or less (more preferably D40 or less) due to the above-described function and the like. It is preferable to form with the synthetic resin which has elasticity.
  • Examples of the synthetic rubber as a constituent material for forming the rubbery organic elastic layer include synthetic rubbers such as nitrile synthetic rubber, diene synthetic rubber, and acrylic synthetic rubber.
  • Examples of the synthetic resin (synthetic resin having rubber elasticity) as the constituent material include thermoplastic elastomers such as polyolefin-based thermoplastic elastomers and polyester-based thermoplastic elastomers, ethylene-vinyl acetate copolymers, polyurethane, polybutadiene, and soft Examples thereof include synthetic resins having rubber elasticity such as polyvinyl chloride.
  • the rubbery organic elastic layer may be an adhesive layer formed of an adhesive substance.
  • the thickness of the rubbery organic elastic layer is not particularly limited, but is preferably 500 ⁇ m or less, more preferably 3 to 300 ⁇ m, still more preferably 5 to 150 ⁇ m.
  • the thickness exceeds 500 ⁇ m, the pressure-sensitive adhesive sheet becomes too soft, and defects in the cutting process (for example, chip chipping or defective cutting dimensions) may occur.
  • the thickness is too thin, the adherence to the uneven surface of the adherend may be reduced, and sufficient adhesive force may not be obtained.
  • the rubber-like organic elastic layer is formed by, for example, a method in which the above-mentioned constituent material is applied onto a substrate; a method in which a rubber-like organic elastic layer is formed on a separator in accordance with this and transferred onto the substrate. It can be carried out by an appropriate method such as a method of adhering a film or the like made of the above-mentioned constituent material to a substrate.
  • the rubber-like organic elastic layer in the present invention may be formed of an adhesive substance mainly composed of natural rubber, synthetic rubber, or a synthetic resin having rubber elasticity, and may be natural rubber, synthetic rubber, rubber elasticity. It may be formed of a foamed film or the like whose main component (main component) is a synthetic resin having.
  • the rubbery organic elastic layer may have a single layer form or a multilayer (multi-layer) form.
  • the pressure-sensitive adhesive sheet of the present invention may have a separator.
  • a separator a known or conventional separator can be used, and is not particularly limited.
  • plastic or paper whose surface is coated with a release agent such as a silicone resin, a long-chain alkyl acrylate resin, or a fluorine resin.
  • a separator made of a non-polar polymer such as polyethylene or polypropylene can be used.
  • the pressure-sensitive adhesive sheet of the present invention may have a layer other than the base material, the heat-expandable pressure-sensitive adhesive layer, the rubbery organic elastic layer, and the separator (for example, an undercoat layer and an intermediate layer).
  • the static friction coefficient with respect to the 10 mm ⁇ steel ball on the back surface of the base material in the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 0.2 or less, more preferably 0.15 or less.
  • the static friction coefficient on the back surface of the substrate is 0.2 or less, the operability and workability in the stretching work tend to be remarkably improved.
  • the coefficient of static friction exceeds 0.2, the frictional force between the back surface of the base material and the stretching device (device for stretching the pressure-sensitive adhesive sheet) that comes into contact with it increases, and the uniform stretchability of the pressure-sensitive adhesive sheet is impaired. There is a fear.
  • the static friction coefficient can be measured under conditions of, for example, a load of 200 gf and a sliding speed of 150 mm / min in accordance with ASTM D1894, with a steel ball having a diameter of 10 mm as a friction target.
  • the tensile stress (machine direction) at the time of 10% elongation of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 25 MPa or less, more preferably 20 MPa or less.
  • the tensile stress (machine direction) at 10% elongation is 25 MPa or less, the pressure-sensitive adhesive sheet can be easily stretched, so that operability and workability in stretching work tend to be improved. If the tensile stress (machine direction) at 10% elongation exceeds 25 MP, an excessive force is required to stretch the pressure-sensitive adhesive sheet, and workability in stretching work may be hindered.
  • the tensile stress (machine direction) at the time of 10% elongation is, for example, in accordance with JIS K7127, under the conditions of test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5%. Can be measured.
  • the tensile stress (width direction) at the time of 10% elongation of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 25 MPa or less, more preferably 20 MPa or less.
  • the tensile stress at 10% elongation (width direction) is 25 MPa or less, the pressure-sensitive adhesive sheet can be easily stretched, so that the operability and workability in stretching work tend to be improved. If the tensile stress at 10% elongation (in the width direction) exceeds 25 MP, an excessive force is required to stretch the pressure-sensitive adhesive sheet, which may hinder workability in the stretching operation.
  • the tensile stress (width direction) at the time of 10% elongation is, for example, in accordance with JIS K7127, under conditions of test piece type 5, test speed 300 mm / min, temperature 23 ⁇ 2 ° C., and relative humidity 50 ⁇ 5%. Can be measured.
  • the pressure-sensitive adhesive sheet of the present invention is used for temporarily fixing a material to be cut on the pressure-sensitive adhesive sheet, cutting the material to be cut into cut pieces, and then separating and collecting the cut pieces from the pressure-sensitive adhesive sheet. It can be preferably used for (for cutting). More specifically, the pressure-sensitive adhesive sheet of the present invention has a cut body placed (temporarily fixed) on the thermally expandable pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, cut into the cut body, and then cut into pieces. After performing the process which expands the space
  • FIG. 3 and 4 are explanatory views of the usage state of the pressure-sensitive adhesive sheet of the present invention (a method for producing a cut piece using the pressure-sensitive adhesive sheet of the present invention). More specifically, FIG. 3 shows a state in which an adherend (object to be cut; before cutting) is attached and held (placed) on the heat-peelable pressure-sensitive adhesive sheet shown in FIG. It is a schematic sectional drawing shown. FIG. 4 is a schematic cross-sectional view showing a state after further extending and heating from the state shown in FIG. In FIG. 3, 5 indicates an adherend (cut object), and 6 indicates a cutting line of the adherend 5. In FIG. 4, 3 ′ indicates a thermally expandable adhesive layer after heat treatment, and 7 indicates a cut piece formed by cutting the adherend 5.
  • Adhesion of the adherend (5 in FIG. 3) to the surface of the heat-expandable pressure-sensitive adhesive layer (3 in FIG. 3) of the pressure-sensitive adhesive sheet of the present invention is subjected to a pressure-bonding treatment by an appropriate pressing means such as a rubber roller, a laminate roll, or a press device. It can be done by a method.
  • the temperature of the thermally expandable microspheres is not expanded according to the type of the adhesive substance constituting the thermally expandable adhesive layer (for example, the thermally expandable microsphere). It may be heated (at a temperature below the sphere expansion start temperature).
  • the adherend (5 in FIG. 3) can be cut by using a conventional cutting means, for example, a dicer or a press-cutting device.
  • the process of extending the pressure-sensitive adhesive sheet of the present invention (elongation process), that is, the process of expanding the interval between the cut pieces by extending the pressure-sensitive adhesive sheet, It can be carried out by using a conventional stretching means used for stretching, for example, a die bonder with a stretching function.
  • the conditions for the heat treatment for heat-peeling the pressure-sensitive adhesive sheet are the surface condition and heat resistance of the adherend (5 in FIG. 3) or the cut piece (7 in FIG. 4).
  • the heat-expandable pressure-sensitive adhesive layer can be appropriately set according to the type of heat-expandable microspheres, the heat resistance of the pressure-sensitive adhesive sheet, and the like.
  • the processing time (heating time) is preferably 30 minutes or less, more preferably 150 to 300 ° C., and the processing time is 1 to 90 seconds (hot plate or the like) or 5 to 15 minutes (hot air dryer or the like).
  • the heat-expandable microspheres in the heat-expandable pressure-sensitive adhesive layer expand and / or foam and the heat-expandable pressure-sensitive adhesive layer expands and deforms, and usually the adhesive strength is reduced or lost.
  • the heat treatment can be performed at an appropriate stage depending on the purpose of use.
  • examples of the heat treatment method include a hot air heating method, a hot plate contact method, an infrared heating method, etc., and the thermally expandable adhesive layer can be uniformly foamed or expanded, and the adherend is There is no particular limitation as long as it does not contaminate or break.
  • the pressure-sensitive adhesive sheet of the present invention has a thermally expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive substance, when the adherend (5 in FIG. 3) is cut and processed, the adherend is not displaced or peeled off. The cutting to a predetermined dimension can be performed efficiently.
  • the pressure-sensitive adhesive sheet of the present invention has a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, the heat-expandable microspheres are quickly foamed and / or expanded by heat treatment. The volume of the adhesive layer is changed to form an uneven three-dimensional structure, and the contact area with the cut piece (7 in FIG. 4) and the adhesive strength are greatly reduced.
  • the base material has high heat resistance (for example, 150 degreeC or more heat resistance)
  • transformation of the base material by the said heat processing is suppressed, and the smoothness of the adhesive sheet surface is hold
  • the processing process temperature such as the cutting process of the adherend and the heat peeling temperature can be set to a high temperature (for example, 150 ° C. or higher)
  • the application range of the process type and the part type can be expanded.
  • the base material since the base material has high stretchability and slipperiness, each piece (in FIG. 7) It is possible to easily and uniformly widen the interval between them to a desired interval.
  • the pressure-sensitive adhesive sheet of the present invention can be used for the purpose of permanently adhering the adherend, but after adhering the adherend for a predetermined period and after achieving the purpose of adhesion, the adhesion state is released.
  • Specific examples of such applications include, for example, ceramic tapes and semiconductor wafer fixing materials, carrier tapes for parts transportation and provisional fastening in assembly processes of various electrical and electronic devices, display devices, and provisional fastenings.
  • examples thereof include a surface protective material or a masking material for the purpose of preventing contamination damage such as a material or a fixing material, a metal plate, a plastic plate, and a glass plate.
  • it can be preferably used for applications such as picking up the surface of the cut surface of a semiconductor chip or the like by separating and collecting it, or for recovering a multilayer chip capacitor. .
  • Example 1 100 parts by weight of an acrylic copolymer (copolymer of 50 parts by weight of 2-ethylhexyl acrylate, 50 parts by weight of ethyl acrylate, 5 parts by weight of methyl methacrylate, and 3 parts by weight of hydroxyethyl acrylate) and polyurethane-based cross-linking
  • an acrylic copolymer copolymer of 50 parts by weight of 2-ethylhexyl acrylate, 50 parts by weight of ethyl acrylate, 5 parts by weight of methyl methacrylate, and 3 parts by weight of hydroxyethyl acrylate
  • a pressure-sensitive adhesive containing 2 parts by weight of the agent
  • heat-expandable microsphere A (“Matsumoto Microsphere F-100VSD”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd., expansion start temperature 130 ° C.
  • a pressure-sensitive adhesive composition (toluene solution) comprising 30 parts by weight of a maximum expansion
  • the pressure-sensitive adhesive composition is applied onto the sputter-treated surface of a 50 ⁇ m-thick single-sided sputter-treated PTFE film (“No. 901W-UL” manufactured by Nitto Denko Corporation) produced by a compression molding cutting method. It applied so that the thickness after drying might be set to 50 micrometers, and it was made to dry and the heat-expandable adhesion layer (adhesion layer) was formed. Thereafter, a silicone release-treated PET separator (“MRF38”, manufactured by Mitsubishi Resin Co., Ltd.) was further bonded to the thermally expandable adhesive layer to obtain an adhesive sheet (extensible heat-peelable adhesive sheet).
  • MRF38 silicone release-treated PET separator
  • Example 2 100 parts by weight of an acrylic copolymer (copolymer of 40 parts by weight of 2-ethylhexyl acrylate, 60 parts by weight of ethyl acrylate, and 3 parts by weight of hydroxyethyl acrylate) and 1 part by weight of a polyurethane-based crosslinking agent
  • An adhesive toluene solution
  • the above-mentioned pressure-sensitive adhesive was applied on a separator (“MRF38”, manufactured by Mitsubishi Plastics Co., Ltd.) so that the thickness after drying was 35 ⁇ m and dried to form a rubbery organic elastic layer.
  • the rubber-like organic elastic layer was bonded to a 100 ⁇ m-thick single-sided easy-adhesion treated PTFE film (“No. 901UL”, manufactured by Nitto Denko Corporation) produced by a compression molding cutting method.
  • 100 parts by weight (solid content) of a pressure-sensitive adhesive containing 100 parts by weight of the acrylic copolymer and 2 parts by weight of a polyurethane-based crosslinking agent was added to the thermally expandable microsphere B (“Die Form H-1100D”,
  • a pressure-sensitive adhesive composition (toluene solution) was prepared by blending 50 parts by weight of Daiichi Seika Kogyo Co., Ltd., with an expansion start temperature of 190 ° C.
  • the pressure-sensitive adhesive composition is applied onto a separator (“MRF38”, manufactured by Mitsubishi Plastics Co., Ltd.) so that the thickness after drying is 45 ⁇ m, and dried to form a thermally expandable pressure-sensitive adhesive layer (pressure-sensitive adhesive layer). did. Thereafter, the surface of the heat-expandable pressure-sensitive adhesive layer was bonded to the rubber-like organic elastic layer side of the PTFE film to which the rubber-like organic elastic layer was transferred to obtain a pressure-sensitive adhesive sheet (extensible heat-peelable pressure-sensitive adhesive sheet).
  • MRF38 manufactured by Mitsubishi Plastics Co., Ltd.
  • Example 3 Sputter etching was performed on one side of a 50 ⁇ m thick PFA film (Asahi Glass Co., Ltd.) under the conditions of Ar gas, atmospheric pressure 2.666 Pa, 30 W seconds / cm 2 . Then, the same operation as in Example 2 was performed except that this was used as a base material (that is, the above-mentioned sputter-etched PFA film was used instead of the single-sided easy-adhesion-treated PTFE film). A heat-peelable pressure-sensitive adhesive sheet) was obtained.
  • Example 4 Distilled water was added to a commercially available PTFE dispersion (“Fluon AD911L”, manufactured by Asahi Glass Co., Ltd., solid content concentration 60 wt%) to adjust the specific gravity to 1.50.
  • a commercially available aluminum foil having a thickness of 200 ⁇ m (made by Toyo Aluminum Co., Ltd., rough surface soft foil) was used as the electrode plate, and one side of this electrode plate was masked with a masking adhesive tape.
  • the masked electrode plate was passed through the PTFE dispersion (PTFE dispersion with adjusted specific gravity) at a dipping speed of 100 mm / min to apply PTFE dispersion on one surface of the electrode plate.
  • the electrode plate was placed in a 180 ° C.
  • a PTFE film having a thickness (film thickness) of 35 ⁇ m was formed on an electrode plate having a thickness of 200 ⁇ m.
  • one side of a 35 ⁇ m thick PTFE film produced by the dipping method was subjected to an easy adhesion treatment with an ammonia solution of metallic sodium.
  • the pressure-sensitive adhesive composition was applied to the easy-adhesion treated surface of the PTFE film obtained above so that the thickness after drying was 75 ⁇ m and dried to form a thermally expandable pressure-sensitive adhesive layer (pressure-sensitive adhesive layer). Thereafter, a separator (“PET75_1SS-4A”, manufactured by Nipper Co., Ltd.) was bonded to the surface of the thermally expandable adhesive layer to obtain an adhesive sheet (extensible heat-peelable adhesive sheet).
  • a separator (“PET75_1SS-4A”, manufactured by Nipper Co., Ltd.) was bonded to the surface of the thermally expandable adhesive layer to obtain an adhesive sheet (extensible heat-peelable adhesive sheet).
  • Comparative Example 1 Using a flexible polyolefin resin (“CAP350”, manufactured by Ube Lexen) as an intermediate layer base material, it is composed of polyethylene / soft polyolefin resin (CAP350) / polyethylene having a total thickness of 80 ⁇ m by coextrusion molding with polyethylene. A three-layer film was obtained, and an adhesive sheet was obtained according to Example 1 except that this was used as a substrate.
  • CAP350 flexible polyolefin resin
  • Comparative Example 2 A pressure-sensitive adhesive sheet was obtained according to Example 2 except that a PET film having a thickness of 100 ⁇ m (“Lumirror S10”, manufactured by Toray Industries, Inc.) was used as the substrate.
  • a PET film having a thickness of 100 ⁇ m (“Lumirror S10”, manufactured by Toray Industries, Inc.) was used as the substrate.
  • the following evaluation test was implemented about the adhesive sheet obtained by the Example and the comparative example.
  • the maximum continuous use temperature of the base material in the pressure-sensitive adhesive sheet was measured according to UL746B. Specifically, the temperature at which the value after the lapse of 40,000 hours determined in accordance with UL746B of the tensile strength of the substrate was reduced from the initial value was determined as the maximum continuous use temperature.
  • the static friction coefficient with respect to the 10 mm diameter steel ball of the base material back surface of an adhesive sheet was measured according to ASTM D1894.
  • Adhesive strength before and after heating Adhesive strength of each adhesive sheet (20 mm width) obtained in Examples and Comparative Examples to the stainless steel plate before heating on the adhesive layer surface side was measured (in accordance with JIS Z0237-2000, (Tensile speed: 300 mm / min, peeling angle: 180 °). Moreover, after heating on the heating conditions shown in Table 1 in the state which bonded each adhesive sheet (20 mm width) obtained by the Example and the comparative example to the stainless steel plate, the adhesive force with respect to a stainless steel plate (adhesive strength after a heating) Measurement was performed (in accordance with JIS Z0237-2000, tensile speed: 300 mm / min, peeling angle: 180 °).
  • bonding (pressure bonding) of the adhesive sheet to the stainless steel plate was performed by reciprocating a 2 kg roller once.
  • the heating temperature in the heating conditions of each pressure-sensitive adhesive sheet shown in Table 1 is set near the maximum expansion temperature of the thermally expandable microspheres in the pressure-sensitive adhesive sheet.
  • the heating time was 10 minutes.
  • the hot air dryer was used for the heating source. The same applies to the following evaluations.
  • the expansion and contraction behavior of the pressure-sensitive adhesive sheet (base material in the pressure-sensitive adhesive sheet) after heat treatment (after heating) was also confirmed in the same manner. Furthermore, whether or not the base material of the pressure-sensitive adhesive sheet was melted by heat treatment under the heating conditions shown in Table 1 was visually observed and confirmed.
  • the pressure-sensitive adhesive sheet (extensible heat-peelable pressure-sensitive adhesive sheet) obtained in the examples could be uniformly extended regardless of before and after heating.
  • the adhesive strength could be greatly reduced after heating, and there was no adhesive residue on the adherend, and it could be easily peeled off.
  • the adhesive sheet obtained in Comparative Example 1 was found to melt the substrate after heating.
  • the pressure-sensitive adhesive sheet obtained in Comparative Example 2 could not be extended regardless of before and after heating.
  • the pressure-sensitive adhesive sheet of the present invention can be used for the purpose of permanently adhering the adherend, but after adhering the adherend for a predetermined period and after achieving the purpose of adhesion, the adhesion state is released.
  • Specific examples of such applications include, for example, ceramic tapes and semiconductor wafer fixing materials, carrier tapes for parts transportation and provisional fastening in assembly processes of various electrical and electronic devices, display devices, and provisional fastenings.
  • examples thereof include a surface protective material or a masking material for the purpose of preventing contamination damage such as a material or a fixing material, a metal plate, a plastic plate, and a glass plate.
  • it can be preferably used for applications such as picking up the surface of the cut surface of a semiconductor chip or the like by separating and collecting it, or for recovering a multilayer chip capacitor. .
  • the pressure-sensitive adhesive sheet of the present invention is used for temporarily fixing a material to be cut on the pressure-sensitive adhesive sheet, cutting the material to be cut into cut pieces, and then separating and collecting the cut pieces from the pressure-sensitive adhesive sheet. It can be preferably used for (for cutting). More specifically, the pressure-sensitive adhesive sheet of the present invention has a cut body placed (temporarily fixed) on the thermally expandable pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, cut into the cut body, and then cut into pieces. After performing the process which expands the space
  • Base material 2 Rubber-like organic elastic layer 3: Thermally expandable adhesive layer 3 ′: Thermally expandable adhesive layer 4 after heat treatment 4: Separator 5: Adhered body (object to be cut) 6: Cutting line 7: Cut piece

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une feuille adhésive étirable, thermiquement détachable, qui présente une résistance à la chaleur et une aptitude à l'étirage excellentes ; permet le réglage de la température de traitement et de la température de détachement thermique sur une valeur élevée lors de la découpe d'une partie adhérée,et l'obtention d'une pièce découpée; et permet la formation et le maintien d'intervalles suffisants entre des pièces découpées obtenues pendant la découpe, en raison du fait que la feuille peut être étirée facilement et de manière homogène. Cette feuille adhésive étirable, thermiquement détachable, est caractérisée en ce qu'elle présente: un substrat et une couche adhésive thermiquement dilatable contenant des microsphères thermiquement dilatables et positionnée sur une surface du substrat; et en ce que le substrat comprend un film de résine de fluor.
PCT/JP2013/050739 2012-01-30 2013-01-17 Feuille adhésive étirable, thermiquement détachable Ceased WO2013114956A1 (fr)

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CN110462816B (zh) * 2017-03-31 2023-09-19 琳得科株式会社 半导体装置的制造方法及粘合片
CN110462816A (zh) * 2017-03-31 2019-11-15 琳得科株式会社 半导体装置的制造方法及粘合片
JP2022034889A (ja) * 2020-08-19 2022-03-04 ニッカン工業株式会社 加熱発泡シートおよび接着方法
JP7529251B2 (ja) 2020-08-19 2024-08-06 ニッカン工業株式会社 加熱発泡シートおよび接着方法
JP7109698B1 (ja) * 2021-09-02 2022-07-29 株式会社寺岡製作所 熱剥離型粘着テープ
WO2023032135A1 (fr) * 2021-09-02 2023-03-09 株式会社寺岡製作所 Ruban autocollant amovible à la chaleur
KR20230107892A (ko) * 2021-09-02 2023-07-18 가부시키가이샤 데라오카 세이사쿠쇼 열박리형 점착 테이프
CN116829665A (zh) * 2021-09-02 2023-09-29 株式会社寺冈制作所 热剥离型粘合带
TWI824417B (zh) * 2021-09-02 2023-12-01 日商寺岡製作所股份有限公司 熱剝離型黏貼帶
CN116829665B (zh) * 2021-09-02 2024-03-15 株式会社寺冈制作所 热剥离型粘合带
KR102656756B1 (ko) 2021-09-02 2024-04-12 가부시키가이샤 데라오카 세이사쿠쇼 열박리형 점착 테이프

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