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WO2013190777A1 - Moulage de la bagasse - Google Patents

Moulage de la bagasse Download PDF

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Publication number
WO2013190777A1
WO2013190777A1 PCT/JP2013/003386 JP2013003386W WO2013190777A1 WO 2013190777 A1 WO2013190777 A1 WO 2013190777A1 JP 2013003386 W JP2013003386 W JP 2013003386W WO 2013190777 A1 WO2013190777 A1 WO 2013190777A1
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WO
WIPO (PCT)
Prior art keywords
bagasse
acid
mass
molded body
organic sulfonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2013/003386
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English (en)
Japanese (ja)
Inventor
亮 菅原
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Panasonic Corp
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Panasonic Corp
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Filing date
Publication date
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Priority to CN201380018113.8A priority Critical patent/CN104203515A/zh
Priority to JP2014520898A priority patent/JPWO2013190777A1/ja
Publication of WO2013190777A1 publication Critical patent/WO2013190777A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/045—Reinforcing macromolecular compounds with loose or coherent fibrous material with vegetable or animal fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture

Definitions

  • the present invention relates to a bagasse molded article obtained by using bagasse as a plant piece as a raw material, and bonding bagasse with a modified substance contained in bagasse as an adhesive component.
  • Particleboard and fiberboard wooden boards can be manufactured using particles and fine fibers obtained from waste wood and construction waste from lumber production. Wood-based boards are cheaper than plywood, so their production volume is increasing worldwide. In addition, a board using plant pieces is also known as a wooden board. In addition to wood, herbaceous plants such as bamboo, kenaf and flax, rice straw, wheat straw, oil palm fiber, bagasse, beet pulp and the like are used as plant pieces. Oil palm fiber is the fiber after extracting the oil, bagasse is the extract after sugarcane sugar is extracted, and beet pulp is the extract after extracting sugar beet sugar. It is possible to produce a wooden board using particles and fine fibers obtained from these agricultural wastes as raw materials.
  • Particle boards and fiberboards are generally manufactured by mixing particles and fine fibers with a synthetic resin adhesive such as urea resin, melamine resin and phenol resin, and molding the mixture. Therefore, there are cases where it contains components harmful to the human body, such as formaldehyde, which is a raw material for synthetic resin adhesives. Therefore, when such a board such as a particle board or a fiberboard is used as an interior material for a house, harmful components such as formaldehyde may volatilize from the board and adversely affect the health of the resident. When the board is recycled, the board is crushed to prepare particles and the like again, mixed with a synthetic resin adhesive, and then molded into particles.
  • a synthetic resin adhesive such as urea resin, melamine resin and phenol resin
  • JP 60-30309 A Japanese Patent No. 3034956 JP 2002-361611 A WO2010 / 001988
  • a board that adheres with the ingredients of the plant piece itself it is obtained by heat-pressing plant pieces such as particles and fine fibers and bonding the plant pieces together with the adhesive components contained in the plant pieces.
  • plant pieces such as particles and fine fibers
  • a method for producing a binderless board by heat-pressing at a temperature of about 180 ° C. to 230 ° C. using plant materials such as bagasse, corn stalk, sunflower stalk, and flax stalk is disclosed.
  • Patent Document 1 Also disclosed is a method for producing a binderless board by using a mallow family bast fiber plant as a raw material for lignocellulosic material and heat-pressing it at a temperature of about 180 to 250 ° C.
  • the components contained in the plant are modified into an adhesive component, and the board is produced without a binder, so the adhesive component contains many components that are easily denatured.
  • Herbaceous plants are being considered as raw materials for binderless boards.
  • the binderless board is not practically used regardless of whether the raw material is a herbaceous plant or a woody plant. Further, since heating and pressurization is performed in the presence of water vapor, there is a problem that a special press device such as a vapor injection type is required or a long time is required for pressing. In addition, when the presence of water vapor is unnecessary, there is a problem that heating at a high temperature exceeding 200 degrees is required, or that the plant piece is required to be processed into a fine powder.
  • compositions for molding a powdered or fragmented plant-derived material and a polyvalent carboxylic acid, or a powdered or fragmented plant-derived material, a polyvalent carboxylic acid and a saccharide as essential components is used. It has been studied to make a composition for bonding materials or wood (see Patent Document 4).
  • Patent Document 4 has a problem that the physical properties are low if no saccharide is added. Further, in addition to the problem that a long time is required for pressing, there is a problem of deterioration due to the plant pieces on the surface portion being exposed to heat for a long time.
  • particle boards and fiberboards made from herbaceous plants other than woody plants and using ordinary adhesives are not widely used. This is because herbaceous plants contain more low-molecular components than woody plants, and this component causes mold. Moreover, since the low molecular component causes inhibition of adhesion and a decrease in water resistance, the physical properties of the board are inferior to those of particle boards and fiber boards made from woody plants.
  • bagasse which is a squeezed rice cake after sugarcane sugar is collected, is a saccharide that has not been fully squeezed out of its low-molecular components. It will be directly connected.
  • bagasse is used as a raw material, even if a board is produced by the methods of Patent Documents 3 and 4, it takes a long time for molding, and it is difficult to avoid mold generation and it is difficult to put it into practical use. there were. Since bagasse is an agricultural waste and an unused resource, its effective use is desired.
  • the present invention has been made in view of the circumstances as described above, and provides a molded article using bagasse that has high adhesion and water resistance, is less likely to diffuse formaldehyde, and suppresses the generation of mold.
  • the challenge is to do.
  • the bagasse molded article according to the present invention is a bagasse molded article obtained by molding bagasse which is a pomace of sugarcane, The bagasse is bonded by an adhesive component that is generated by modifying the components contained in the bagasse during the heat and pressure molding, The bagasse is bonded in the presence of a polyvalent carboxylic acid and an organic sulfonic acid.
  • the bagasse molded body preferably has one or more features selected from the following.
  • -The bagasse has a sucrose ratio of 3% by mass or more in the dry matter extracted by hot water at 90 ° C. for 3 hours, and the bagasse molded product has a sucrose ratio of 1% in the dry matter by extraction at 90 ° C. for 3 hours in hot water. %.
  • the said polyvalent carboxylic acid contains 1 or more types chosen from a citric acid, itaconic acid, and malic acid.
  • the organic sulfonic acid includes one or more selected from p-toluenesulfonic acid and benzenesulfonic acid.
  • -The bagasse is bonded in the presence of sugars.
  • -The bagasse has a solid content mass of 0.1 to 20 parts by mass when the dry mass of the bagasse is 100 parts by mass, and the solid content mass of the organic sulfonic acid is Bonding is performed under the condition of 0.1 to 20 parts by mass.
  • -The bagasse molded object is a board.
  • -The said bagasse molded object becomes 0 (no growth) by visual three-stage evaluation by the mold resistance test of JIS Z 2911.
  • bagasse molded article of the present invention since bagasse is bonded in the presence of polyvalent carboxylic acid and organic sulfonic acid, it has high adhesion and water resistance, and formaldehyde is not easily diffused, and mold is hardly generated. can do.
  • the present invention is an invention of a bagasse molded body obtained by molding bagasse, which is a pomace of sugarcane.
  • This bagasse is bonded by an adhesive component generated by modifying the components contained in the bagasse during the heat and pressure molding.
  • This bagasse is bonded in the presence of a polyvalent carboxylic acid and an organic sulfonic acid.
  • woody plants such as conifers and broad-leaved trees, annual or biennial herbaceous plants, or agricultural waste after collecting cereals, vegetable oil, vegetable sugar, etc.
  • specific examples of agricultural waste include herbs such as kenaf, rice, bamboo, and flax, bagasse, beet pulp, rice straw, wheat straw, and oil palm fiber.
  • they are not widely used as plant piece raw materials for wooden boards.
  • These generally contain more hot water-soluble components such as sugars than woody plants.
  • the hot water-soluble components of plants cause mold generation, adhesion inhibition, and water resistance. It is because it will cause sex decline.
  • the physical properties of the board are better when plant pieces with less hot water soluble components are used. For this reason, practical use of boards using annual or biennial herbaceous plants, agricultural wastes, etc. has not progressed.
  • bagasse which is squeezed after sugarcane sugar is collected
  • beet pulp which is squeezed after sugarcane sugar is collected
  • sucrose sucrose
  • bagasse which is a squeezed rice cake after sugarcane sugar is collected, is used as a plant raw material. Bagasse is an agricultural waste, which can be used effectively for resources.
  • the bagasse molded body can be formed as a kind of wood-based board. Strictly speaking, the bagasse shaped body is not made of wood, but it can be shaped like a board (plate material) formed of wood particles and fibers.
  • the bagasse as a raw material of the molded body may include at least one of small pieces and fibers. Bagasse pieces can be obtained by grinding bagasse. The bagasse pieces may be chip-shaped bagasse chips. The bagasse fiber may be a defatted bagasse. Further, the bagasse powder may be used by breaking the bagasse into powder. In view of availability of raw materials, it is preferable to use bagasse pieces.
  • Bagasse can be processed into granular particles having a diameter of several hundred ⁇ m to several cm by pulverization. Bagasse is processed into fine fibers having a diameter (fiber diameter) of about 50 ⁇ m to 2 mm and a length (fiber length) of about 100 ⁇ m to 20 mm by defibrating the bast and stem core. Can do. Using these particles and fine fibers as plant pieces (fine pieces), a bagasse molded body can be produced.
  • bagasse The main components of bagasse are cellulose, hemicellulose, and lignin, as in the case of woody plants such as conifers and broadleaf trees, but there are sugars that could not be squeezed out of bagasse.
  • residual sugar is denatured under heat and pressure, and can function as an adhesive component.
  • the residual sugar can be used, the physical properties can be improved, and the adverse effects of the residual sugar can be suppressed.
  • Bagasse has a high content of low-molecular components such as hemicellulose components and hot water-soluble components compared to woody plants, and is characterized by being rich in components that denature into adhesive components under heat and pressure.
  • Suitable as Specific examples of the hemicellulose component include arabinoglucuronoxylan, glucomannan, and glucuronoxylan.
  • Arabinoglucuronoxylan and glucomannan are components that are mainly contained in conifers.
  • Glucuronoxylan and glucomannan are components that are mainly contained in hardwoods. Bagasse may contain these components or components similar thereto.
  • hot water-soluble component in bagasse examples include low-molecular sugars such as monosaccharides and oligosaccharides, polysaccharides such as pectin, tannins and lignans.
  • low temperature saccharides such as monosaccharides and oligosaccharides, polysaccharides such as pectin, tannins, lignans and the like, which are main hot water soluble components, contribute to adhesion.
  • These hot water-soluble components serve to polymerize the organic sulfonic acid and carboxylic acid as a catalyst, and promote the reaction between the modified products and the reaction between the modified product and the polyvalent carboxylic acid.
  • Low molecular components such as hemicellulose components and hot water soluble components contained in the bagasse plant pieces are modified into adhesive components under heat and pressure, but the reaction is promoted by the coexistence of polyvalent carboxylic acid and organic sulfonic acid, It becomes a strong adhesive component. Further, if low molecular components such as hemicellulose components and hot water soluble components remain in the molded product after molding, this component may cause mold generation, adhesion inhibition, and water resistance reduction. However, since the reaction is promoted by the coexistence of organic sulfonic acid and polyvalent carboxylic acid, the residue of low molecular components such as hemicellulose component and hot water soluble component can be reduced, generation of mold, adhesion inhibition, water resistance Deterioration can be suppressed.
  • Hemicellulose components and sugars are hydrolyzed due to the presence of polyvalent carboxylic acids and organic sulfonic acids, temporarily reduced in molecular weight, then modified to low molecular compounds having a furan ring, and organic sulfonic acids serve as catalysts.
  • the reaction between furan ring compounds is promoted.
  • a furan ring compound is polymerized and contributes to adhesion.
  • Polyvalent carboxylic acids contribute to the modification of hemicellulose components and sugars, and reduce the number of hydroxyl groups that deteriorate water absorption and hygroscopicity by ester bonding with cellulose, hemicellulose, lignin and hot water soluble components in bagasse.
  • the polyvalent carboxylic acid and the organic sulfonic acid are allowed to coexist. If the addition of polyvalent carboxylic acid is lacking, ester bonds with hydroxyl groups are not formed, resulting in a significant decrease in physical properties and the occurrence of mold. If the addition of the organic sulfonic acid is lacking, the reaction between the low molecular compounds having a furan ring in which the sugar is modified is slowed down, the physical properties are greatly lowered, and mold is easily generated.
  • polyvalent carboxylic acids and organic sulfonic acids have less reactivity with metals than inorganic acids, and thus are less likely to be adversely affected by metal equipment during molding.
  • the reaction system does not contain an organic solvent or formaldehyde, and does not contain a tertiary amine or the like that generates formaldehyde by decomposition. Therefore, it becomes easy to suppress the emission of the organic solvent and formaldehyde derived from the molded product.
  • the polyvalent carboxylic acid acts as a reaction catalyst, and a plurality of carboxyl groups of the polyvalent carboxylic acid are ester-bonded with hydroxyl groups such as hemicellulose components and sugars to reduce hydroxyl groups that deteriorate water absorption and hygroscopicity. Crosslink. Therefore, in addition to water resistance, hot water resistance, and moisture resistance, the adhesiveness of a molded object improves.
  • the carboxylic acid not a monovalent carboxylic acid but a polyvalent carboxylic acid is used.
  • the above action is not sufficiently exhibited only by monovalent carboxylic acid. This is because the polyvalent carboxylic acid has two or more carboxylic acids in the molecule and thus has high reactivity. Therefore, polyvalent carboxylic acid is used for bagasse molding.
  • a monovalent carboxylic acid may be further added. Examples of the monovalent carboxylic acid include formic acid, acetic acid, benzoic acid and the like.
  • organic sulfonic acid for example, alkyl sulfonic acid, aromatic sulfonic acid and the like can be used.
  • examples of the organic sulfonic acid include p-toluenesulfonic acid, benzenesulfonic acid, methanesulfonic acid and the like.
  • aromatic sulfonic acids are preferable, and sulfonic acids having a benzene ring are more preferable.
  • p-toluenesulfonic acid is particularly suitable as a material for a molded article because it has a high effect and the reaction between low-molecular modified products proceeds to polymerize and contribute to adhesion.
  • Benzenesulfonic acid is also suitable as a material for a molded article because it is highly effective and the reaction between low-molecular modified products proceeds to polymerize and contribute to adhesion. Therefore, it is preferable to include one or more selected from p-toluenesulfonic acid and benzenesulfonic acid.
  • the organic sulfonic acid may have a molecular weight of 500 or less, preferably 300 or less. When the molecular weight is small, the catalyst efficiency can be increased.
  • the polyvalent carboxylic acid is preferably an organic carboxylic acid having a plurality of carboxyl groups (COOH) in one molecule.
  • a divalent carboxylic acid, a trivalent carboxylic acid, a tetravalent carboxylic acid, a pentavalent or higher carboxylic acid, or the like can be used. Of these, divalent to tetravalent carboxylic acids are preferable because they are easy to use.
  • the polyvalent carboxylic acid may have a hydroxyl group. In that case, adhesiveness can be improved.
  • the polyvalent carboxylic acid may have a molecular weight of 500 or less, preferably 300 or less. When the molecular weight is small, the catalyst efficiency can be increased.
  • An anhydride may be used as the polyvalent carboxylic acid.
  • polyvalent carboxylic acid examples include citric acid, itaconic acid, malic acid, tartaric acid, succinic acid, oxalic acid, adipic acid, malonic acid, phthalic acid, sebacic acid, maleic acid, fumaric acid, pentanedioic acid glutarate, Examples include gluconic acid, glutaconic acid, pentenedioic acid, and the like.
  • the polyvalent carboxylic acid preferably contains one or more selected from citric acid, itaconic acid and malic acid. When one or more selected from citric acid, itaconic acid and malic acid are used, these can be produced from plants. In this case, since the use of fossil resources can be suppressed, the burden on the environment is reduced, which is preferable.
  • the addition rate of the organic sulfonic acid and the polyvalent carboxylic acid is not particularly limited, and can be appropriately adjusted depending on the amount of low molecular components such as hemicellulose component and hot water soluble component contained in the bagasse.
  • the preferable example of the addition rate of organic sulfonic acid and polyhydric carboxylic acid is shown.
  • the addition rate of the organic sulfonic acid is preferably a condition where the solid content mass of the organic sulfonic acid is 0.1 to 20 parts by mass when the dry mass of bagasse is 100 parts by mass.
  • the solid content of the organic sulfonic acid is 0.1 parts by mass or more, the effect as a reaction catalyst is easily obtained.
  • the solid content mass of the organic sulfonic acid is 20 parts by mass or less, hydrolysis reaction of hemicellulose components, sugars and the like is hardly promoted, and polymerization is hardly inhibited.
  • the acid hardly remains to make it difficult to reduce the strength of the molded body, and further, the metal corrosion is difficult to proceed at the time of contact with a press machine or the like during pressurization.
  • the solid content of the organic sulfonic acid is 0.15 to 10 parts by mass. More preferably, the solid content of the organic sulfonic acid is 0.2 to 5 parts by mass.
  • the addition rate of the polyvalent carboxylic acid is preferably such that the solid content mass of the polyvalent carboxylic acid is 0.1 to 20 parts by mass when the dry mass of bagasse is 100 parts by mass.
  • the solid content mass of the polyvalent carboxylic acid is 0.1 parts by mass or more, it is easy to obtain a reaction catalytic effect, and the effect of reducing hydroxyl groups that deteriorate water absorption and hygroscopicity by ester bonds with hydroxyl groups is obtained. It becomes easy.
  • the solid content mass of the polyvalent carboxylic acid is 20 parts by mass or less, hydrolysis reaction of hemicellulose components, sugars and the like is hardly promoted, and polymerization is hardly inhibited.
  • the polycarboxylic acid has a solid content of 1 to 15 parts by mass. More preferably, the polycarboxylic acid has a solid content of 2 to 10 parts by mass.
  • the solid content mass of the polyvalent carboxylic acid is 0.1 to 20 parts by mass when the dry mass of the bagasse is 100 parts by mass, and the solid content mass of the organic sulfonic acid. It is particularly preferable that the bonding is performed under the condition of 0.1 to 20 parts by mass. When bonding is performed under such conditions, the above-described action is further easily obtained.
  • the bagasse preferably has a soluble component ratio of 3% by mass or more in the dry matter by extraction with hot water at 90 ° C. for 3 hours. Thereby, excellent adhesiveness can be obtained.
  • the soluble component ratio by extraction with hot water at 90 ° C. for 3 hours is less than 3% by mass, there is little generation of an adhesive component due to organic sulfonic acid and polyvalent carboxylic acid, and the physical properties as a molded article may be reduced.
  • the upper limit of the soluble component ratio by extraction with hot water at 90 ° C. for 3 hours is not particularly limited, but is preferably 10% by mass or less.
  • the soluble component ratio of bagasse extracted by hot water at 90 ° C. for 3 hours is more preferably 5% by mass or more and 10% by mass or less in the dry matter.
  • the bagasse has a sucrose ratio of 3% by mass or more based on the extraction at 90 ° C. in hot water for 3 hours.
  • adhesiveness can be improved. Saccharose abundantly contained in bagasse, particularly sucrose occupying most, functions as an adhesive component of bagasse. Therefore, the sucrose component is preferably 3% by mass or more.
  • the upper limit of the sucrose ratio in the bagasse is not particularly limited, but is preferably 10% by mass or less.
  • sucrose When it exceeds 10% by mass, it takes time for all sucrose to react, and components such as cellulose are relatively decreased, and the physical properties as a molded article may be lowered. Moreover, when there is much sucrose amount, there exists a possibility that sucrose may remain in a molded object and there exists a possibility of causing generation
  • sucrose can be quantified by analyzing the pulverized extract of bagasse by high performance liquid chromatography (HPLC). In the measurement, it is preferable to use a dried bagasse.
  • HPLC measurement conditions An example of HPLC measurement conditions will be described in the examples described later.
  • the bagasse which is a raw material, usually contains sucrose, but it is better that the formed bagasse formed body contains as little sucrose as possible. Therefore, the bagasse molded body preferably has a sucrose ratio of less than 1% by mass in the dry matter by extraction with hot water at 90 ° C. for 3 hours. Thereby, while being able to improve water resistance, generation
  • the sucrose ratio in the molded product is 1% by mass or more after molding, a large amount of unreacted sucrose remains in the molded product, and mold using sucrose as a nutrient source may easily occur. Moreover, when much sucrose remains, there exists a possibility that the water resistance of a molded object may fall because of it.
  • the sucrose ratio is more preferably 0.2% by mass or less.
  • the sucrose ratio is more preferably less than the measurement limit or 0% by mass.
  • the sucrose ratio of the bagasse molded body is performed by appropriately adjusting the molding conditions for molding.
  • molding conditions about the shaping
  • sucrose can be quantified by analyzing the pulverized extract of the bagasse molded body by high performance liquid chromatography (HPLC).
  • HPLC high performance liquid chromatography
  • the measurement method of HPLC may be the same as the measurement of bagasse as a raw material.
  • Bagasse has a sucrose ratio of 3% by mass or more in a dry matter after extraction with hot water at 90 ° C. for 3 hours, and bagasse molded product has a sucrose ratio of 1% by mass in the dry matter after extraction at 90 ° C. for 3 hours with hot water. More preferably, it is less.
  • a large amount of sucrose is contained before molding, and the sucrose is reduced after molding, so that adhesion and water resistance can be improved, generation of mold can be suppressed, and a better molded product can be obtained.
  • the soluble component ratio and sucrose ratio of bagasse extracted by hot water at 90 ° C. for 3 hours can vary depending on the growth period and the sampling time.
  • the soluble component ratio and the sucrose ratio can also vary depending on the process of obtaining bagasse from sugarcane and the processing conditions such as heat treatment and pulverization when processing bagasse as a raw material. Considering these conditions, bagasse having a desired soluble component ratio and sucrose ratio can be selected. Moreover, you may make it adjust the quantity of a soluble component and sucrose by mixing (blending) several types of bagasse.
  • the bagasse is preferably bonded in the presence of sugars. Thereby, adhesiveness can be improved. Even when bagasse is used, there are cases where a component that is denatured into an adhesive component is scarce. As described above, since bagasse is an agricultural product, the content of components such as sucrose is likely to fluctuate. Therefore, when saccharides are added, the adhesiveness can be improved even when there are few components that denature into the adhesive component.
  • the saccharide since the saccharide is usually contained in the bacus, the presence of the saccharide means the presence of the saccharide added separately from the saccharide contained in the bacas.
  • the saccharide may be any one or more of monosaccharides, oligosaccharides and polysaccharides.
  • monosaccharides include glucose, fructose, ribose, arabinose, rhamnose, xylulose, deoxyribose and the like.
  • oligosaccharide include disaccharides such as sucrose, maltose, trehalose, and tulanose, and fructooligosaccharides, galactooligosaccharides, mannan oligosaccharides, stachyose, and the like.
  • the oligosaccharide may be, for example, a saccharide in which 10 or less sugar chains are linked.
  • polysaccharide examples include starch, agarose, alginic acid, glucomannan, inulin, chitin, chitosan, hyaluronic acid, glycogen, and cellulose.
  • saccharide one or a combination of the above compounds can be used.
  • an oligosaccharide can be preferably used.
  • disaccharides can be preferably used.
  • sucrose and maltose can be used more preferably.
  • the addition rate of saccharide is not particularly limited, and can be appropriately adjusted depending on the amount of low molecular components such as hemicellulose component, sugar, and hot water soluble component contained in bagasse.
  • the saccharide content is preferably 0.1 to 20 parts by mass. Adhesiveness can be improved as content of saccharides is 0.1 mass part or more. When the saccharide content is 20 parts by mass or less, it is possible to easily suppress the occurrence of mold due to the saccharide remaining in the molded body. Moreover, water resistance can be improved and adhesion inhibition can be suppressed. More preferably, the saccharide content is 1 to 15 parts by mass. More preferably, the saccharide content is 2 to 10 parts by mass.
  • the bagasse may be bonded in the presence of a petroleum-based thermosetting resin adhesive.
  • a petroleum-based thermosetting resin adhesive thereby, the adhesiveness and water resistance of a molded object can be improved.
  • wood based boards such as particle boards and fiber boards mainly use amino resins such as phenol resins and urea / melamine resins and isocyanate resin based adhesives.
  • a petroleum thermosetting resin adhesive agent can be added for the further improvement of a physical property.
  • a phenol resin adhesive As the petroleum thermosetting resin adhesive, a phenol resin adhesive, a urea / melamine resin adhesive, an isocyanate adhesive, and the like are suitable, but not particularly limited. It is preferable to select the type and amount of the adhesive depending on the usage of the molded body. When strength is required, the amount added can be increased. When water resistance is required, an adhesive having high water resistance such as a phenol resin adhesive or an isocyanate resin adhesive is suitable.
  • the petroleum-based thermosetting resin adhesive is preferably blended so that the solid content is 3 parts by mass or more and 30 parts by mass or less when the dry mass of bagasse is 100 parts by mass. In that case, the strength of the bagasse molded body can be increased. More preferably, the blending amount of the adhesive is 5 parts by mass or more and 25 parts by mass or less with respect to the dry mass of bagasse.
  • a petroleum-based thermosetting resin adhesive is contained, formaldehyde is likely to be generated. Therefore, from the viewpoint of formaldehyde suppression, it is preferable not to contain a petroleum-based thermosetting resin adhesive.
  • blended the one where the quantity is smaller is preferable.
  • the solid content of the petroleum-based thermosetting resin adhesive is more preferably 20 parts by mass or less, more preferably 15 parts by mass or less, when the dry mass of bagasse is 100 parts by mass. Even more preferably, it is 10 parts by mass or less.
  • the amount thereof can be reduced, so that the generation of formaldehyde can be suppressed.
  • petroleum-based thermosetting resin adhesives may cause harmful gas generation during combustion at the time of disposal, but this adhesive may not be used or the amount of adhesive used may be reduced. By doing so, generation of harmful gases can be suppressed.
  • the bagasse molded body can be produced by adding polyvalent carboxylic acid and organic sulfonic acid and other components as required to bagasse, which is a sugar cane residue, and then heating and pressing these mixtures.
  • the bagasse used as a raw material may be a dry raw material. Thereby, handling becomes easy.
  • pulverized the bagasse molded object can also be used as bagasse. In that case, the bagasse can be reused.
  • heat and pressure molding can be efficiently performed by using a polyvalent carboxylic acid and an organic sulfonic acid in combination. For this reason, heating and pressing can be performed in a shorter time.
  • the bagasse molded article is preferably obtained by attaching a polyvalent carboxylic acid and an organic sulfonic acid to the bagasse shown above, and heat-pressing the bagasse to which the deposit is attached.
  • a bagasse by attaching an aqueous solution in which polyvalent carboxylic acid and organic sulfonic acid are dissolved in water, and then heating and pressing the mixture.
  • water polyvalent carboxylic acid and organic sulfonic acid can be efficiently attached to the surface of bagasse.
  • an organic solvent may be used instead of the aqueous solution, but the aqueous solution is more advantageous from the viewpoint of manufacturability.
  • One or both of the saccharide and the petroleum-based thermosetting resin adhesive described above may be added to the aqueous solution as necessary.
  • the bagasse is bonded by an adhesive component generated by modifying the components contained in the bagasse itself by heat and pressure molding. At this time, the bagasse is firmly bonded by bonding in the presence of the polyvalent carboxylic acid and the organic sulfonic acid. Moreover, the amount of sucrose falls.
  • an appropriate attachment method can be used. For example, it can be made to adhere by spraying aqueous solution toward bagasse by spray etc. Moreover, it can be made to adhere by immersing bagasse in aqueous solution. Moreover, it can be made to adhere by apply
  • the conditions for heat and pressure molding for example, the molding pressure, molding temperature, molding time, and the like can be appropriately set depending on the type and shape of bagasse, the surface state thereof, the thickness of the molded body, and the like.
  • the molding temperature is preferably 160 ° C. or higher and 220 ° C. or lower. When the molding temperature is 220 ° C. or lower, the deterioration of the components hardly proceeds, so that the physical properties as a molded body are not easily lowered. In addition, when the molding temperature is 160 ° C. or higher, the reaction rate is unlikely to decrease and curing is likely to be sufficient.
  • the molding pressure is appropriately set depending on the thickness and specific gravity of the molded body, but is preferably 0.5 MPa or more and 4 MPa or less. When the molding pressure is 0.5 MPa or more, it is possible to sufficiently press-bond and easily improve the strength of the molded body. If the molding pressure is 4 MPa or less, the molding pressure is not too high, and the molded body is hardly broken.
  • the molding time for example, it can be in the range of 1 minute to 60 minutes, preferably 3 minutes to 45 minutes, more preferably 5 minutes to 30 minutes, and even more preferably 7 minutes to 20 minutes. It is also preferable to set the molding time to 10 minutes or longer. Thereby, water resistance can be improved.
  • the bagasse molded body is preferably a board. Thereby, it can be easily used for various uses such as architecture.
  • the bagasse molded body is a so-called bagasse molded board.
  • the bagasse molded body may have a three-dimensional shape other than the board. For example, a molded body that is partially raised or a molded body that is bent in the middle. In this case, it becomes a bagasse solid molded object. In the case of a three-dimensional shape, a shape that matches the purpose of use can be obtained.
  • the board is preferable because the usability is enhanced and the board can be applied to various applications.
  • the bagasse molded product has a visual three-stage evaluation of 0 (no growth) according to the fungus resistance test of JIS Z 2911. Thereby, the molded object which suppressed generation
  • Such mold resistance can be obtained by the material of the molded body and the method for manufacturing the molded body described above.
  • the mold resistance test (JIS Z 2911) can be performed by a test detailed in the following examples.
  • the outline is a method in which a mold spore solution is dropped onto a specimen (bagasse shaped body), and after culturing at 26 ° C./99% RH for 28 days, the growth of mold on the specimen is observed.
  • evaluation is made in three stages: “0: no growth”, “1: growth less than 1/3 of the test area”, and “2: growth of 1/3 or more of the test area”. In the case of “0: no growth”, it can be said that the occurrence of mold is sufficiently suppressed.
  • the bagasse molded product since the bagasse as the raw material is bonded in the presence of polyvalent carboxylic acid and organic sulfonic acid, after molding, traces of polyvalent carboxylic acid and organic sulfonic acid were confirmed during molding Can be done.
  • the bagasse molded article may contain polyvalent carboxylic acid.
  • organic sulfonic acid remains after shaping
  • the polyvalent carboxylic acid and the organic sulfonic acid are modified by the reaction, and the modified products are included in the bagasse molded article.
  • a molecular skeleton derived from a polyvalent carboxylic acid or a molecular skeleton derived from an organic sulfonic acid can be confirmed in the bagasse molded article.
  • the presence of these molecular skeletons makes it possible to confirm that bagasse is adhered in the presence of a polyvalent carboxylic acid and an organic sulfonic acid. Detection of polyvalent carboxylic acid and organic sulfonic acid or their modified products can be performed by chemical analysis.
  • the low-molecular compound is not contained in the bagasse molded article. Therefore, it is a preferred embodiment that the bagasse molded body does not contain any polyvalent carboxylic acid or organic sulfonic acid.
  • the bagasse molded body may be provided with a surface material on one side or both sides thereof.
  • the surface material constitutes an adherend. By providing the surface material, the strength of the molded body can be increased.
  • the surface material may be a board shape, a sheet shape, or the like. In this case, the bagasse molded body becomes a part of the composite molded body composed of the composite material. In the case of a board, it becomes a composite board containing a bagasse molded body.
  • the surface material may be provided by being bonded to the bagasse molded body after the bagasse molding, or may be provided by being bonded by an adhesive component generated from the bagasse by being overlapped when the bagasse molded body is molded.
  • a board-like material such as wood, particle board or fiberboard, a veneer obtained by thinly slicing wood, a decorative sheet made of plastic or paper, a sheet-like material such as a moisture-proof sheet, etc.
  • a board-like material such as wood, particle board or fiberboard, a veneer obtained by thinly slicing wood, a decorative sheet made of plastic or paper, a sheet-like material such as a moisture-proof sheet, etc.
  • part shows a mass part
  • a bagasse chip was obtained by cutting bagasse (squeezed residue) after squeezing sugar of sugarcane, which is a herbaceous plant, into a length of about 5 cm and pulverizing it with a pulverizer (hammer mill). The dimensions of this chip were an average length of 15 mm, an average width of 5 mm, and an average thickness of 2 mm. The soluble component ratio of the bagasse chips extracted by hot water at 90 ° C. for 3 hours was 8.2% by mass in the dry bagasse chips.
  • the hot water extract of this bagasse chip was subjected to high performance liquid chromatography analysis (HPLC) under the following conditions, and the sucrose ratio in the dry portion of the bagasse chip obtained by extracting the bagasse chip with hot water at 90 ° C. for 3 hours (based on the total amount) The ratio of the sucrose component was determined.
  • HPLC high performance liquid chromatography analysis
  • sucrose ratio obtained by extracting the bagasse chips with hot water at 90 ° C. for 3 hours was 5.1% by mass in the dried bagasse chips.
  • P-Toluenesulfonic acid manufactured by Wako Pure Chemical Industries, Ltd., hereinafter the same
  • Citric acid manufactured by Wako Pure Chemical Industries, Ltd., hereinafter the same
  • PTSA-CA aqueous solution a p-toluenesulfonic acid / citric acid mixed aqueous solution
  • the PTSA-CA aqueous solution was sprayed on 100 parts of the bagasse chip by spraying so that the solid content addition rate was 10 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • this bagasse chip board was pulverized, and this pulverized product was extracted with hot water under the conditions of extraction at 90 ° C. for 3 hours.
  • This hot water extract is subjected to high performance liquid chromatography analysis (HPLC) under the above-mentioned HPLC conditions, and the sucrose ratio in the dry bagasse chipboard is obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours by quantifying the sucrose peak. It was.
  • HPLC high performance liquid chromatography analysis
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • Example 1 The PTSA-IA aqueous solution was sprayed on the bagasse chip 100 parts used in Example 1 by spraying so that the solid content addition rate was 10 parts. Thereafter, a bagasse chip board was obtained in the same manner as in Example 1.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • Example 3 Bagasse harvested at a different time from Example 1 was pulverized to obtain bagasse chips having an average length of 15 mm, an average width of 5 mm, and an average thickness of 2 mm.
  • the soluble component ratio of the bagasse chips extracted by hot water at 90 ° C. for 3 hours was 3.8% in the dry bagasse chips.
  • tip was 3.1 mass% in a bagasse chip
  • the BSA-IA aqueous solution was sprayed on 100 parts of the bagasse chip by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed for 7.5 minutes at a surface pressure of 2 MPa while being heated to 200 ° C. with a heating press device to form a molded body.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • This PTSA-CA aqueous solution was sprayed on 100 parts of bagasse chip used in Example 1 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed for 7.5 minutes at a surface pressure of 2 MPa while being heated to 200 ° C. with a heating press device to form a molded body.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • P-Toluenesulfonic acid was used as the organic sulfonic acid.
  • Citric acid was used as the polyvalent carboxylic acid.
  • Sucrose (manufactured by Wako Pure Chemical Industries, Ltd., hereinafter the same) was used as the saccharide. These were mixed with water to prepare a mixed aqueous solution of p-toluenesulfonic acid / citric acid / sucrose (hereinafter referred to as “PTSA-CA-SR aqueous solution”).
  • This PTSA-CA-SR aqueous solution was sprayed on 100 parts of bagasse chip used in Example 3 so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed for 7.5 minutes at a surface pressure of 2 MPa while being heated to 200 ° C. with a heating press device to form a molded body.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • This PTSA-CA-SR aqueous solution was sprayed on 100 parts of bagasse chip used in Example 3 so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • Benzenesulfonic acid was used as the organic sulfonic acid.
  • Citric acid was used as the polyvalent carboxylic acid.
  • Maltose (manufactured by Wako Pure Chemical Industries, Ltd.) was used as the saccharide.
  • a phenolic resin adhesive (“Aika PX-431” manufactured by Aika Industry Co., Ltd.) was used as the petroleum thermosetting resin adhesive. This phenolic resin adhesive is commercially available in aqueous solution. These and water were mixed to prepare a phenol resin-containing benzenesulfonic acid / citric acid / maltose mixed aqueous solution (hereinafter referred to as “phenol resin-containing BSA-CA-MT aqueous solution”).
  • the phenol resin-containing BSA-CA-MT aqueous solution was sprayed on 100 parts of bagasse chip used in Example 3 so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio was not detected by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours. D. It was (below the measurement limit) and was 0% by mass in the dry matter of the molded article.
  • the melamine resin-containing PTSA-MA aqueous solution was sprayed on the bagasse chip 100 parts used in Example 1 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 0.2% by mass in the dry matter of the molded body.
  • Benzenesulfonic acid was used as the organic sulfonic acid.
  • Malic acid was used as the polyvalent carboxylic acid.
  • a urea-melamine resin adhesive (“Oshika Resin MC32” manufactured by Oshika Co., Ltd. (containing a curing agent)) was used.
  • This urea-melamine resin adhesive is commercially available as an aqueous solution.
  • These were mixed with water to prepare a melamine resin-containing benzenesulfonic acid / malic acid mixed aqueous solution (hereinafter referred to as “melamine resin-containing BSA-MA aqueous solution”).
  • the melamine resin-containing BSA-MA aqueous solution was sprayed on the bagasse chip 100 parts used in Example 1 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed for 7.5 minutes at a surface pressure of 2 MPa while being heated to 200 ° C. with a heating press device to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 0.2% by mass in the dry matter of the molded body.
  • Example 1 20 parts of water was sprayed on the 100 parts of bagasse chip used in Example 3. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 2.0% by mass in the dry matter of the molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 1.5% by mass in the dry matter of the molded body.
  • Benzenesulfonic acid was used as the organic sulfonic acid. No polyvalent carboxylic acid was used.
  • This benzenesulfonic acid aqueous solution was sprayed on the bagasse chip 100 parts used in Example 3 by spraying so that the solid content addition rate was 2 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 0.4% by mass in the dry matter of the molded body.
  • the p-toluenesulfonic acid aqueous solution was sprayed on 100 parts of the bagasse chip used in Example 1 so that the solid content addition rate was 10 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 0.3% by mass in the dry matter of the molded body.
  • This itaconic acid aqueous solution was sprayed on 100 parts of the bagasse chip used in Example 1 so that the solid content addition rate was 10 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 0.1% by mass in the dry matter of the molded body.
  • Benzenesulfonic acid was used as the organic sulfonic acid. No polyvalent carboxylic acid was used.
  • This benzenesulfonic acid aqueous solution was sprayed on the 100 parts of the bagasse chip used in Example 3 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed with a heating press device at 200 ° C. at a surface pressure of 2 MPa for 7.5 minutes to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 0.3% by mass in the dry matter of the molded body.
  • the citric acid aqueous solution was sprayed on the bagasse chip 100 parts used in Example 1 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed for 7.5 minutes at a surface pressure of 2 MPa while being heated to 200 ° C. with a heating press device to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 0.2% by mass in the dry matter of the molded body.
  • Citric acid was used as the polyvalent carboxylic acid.
  • Sucrose was used as a saccharide.
  • Citric acid, sucrose, and water were mixed to prepare a citric acid / sucrose mixed aqueous solution.
  • the citric acid / sucrose mixed aqueous solution was sprayed on the bagasse chip 100 parts used in Example 3 by spraying so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed with a heating press device at 200 ° C. at a surface pressure of 2 MPa for 7.5 minutes to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chip board with hot water at 90 ° C. for 3 hours was 0.2% by mass in the dry matter of the molded body.
  • the phenol resin adhesive diluted water was sprayed on 100 parts of the bagasse chip used in Example 1 so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 4.3% by mass in the dry matter of the molded body.
  • the urea / melamine resin adhesive dilution water was sprayed on 100 parts of bagasse chips used in Example 1 so that the solid content addition rate was 20 parts. Thereafter, bagasse chips were laminated to form a laminated mat, and this laminated mat was pressed at a surface pressure of 2 MPa for 15 minutes while being heated to 200 ° C. with a heating press apparatus to form a molded body.
  • sucrose ratio obtained by extracting the bagasse chipboard with hot water at 90 ° C. for 3 hours was 4.2% by mass in the dry matter of the molded body.
  • a hot water absorption thickness expansion coefficient was measured when a 200 mm square sample was immersed in warm water at 80 ° C. for 5 minutes.
  • the amount of formaldehyde released was measured according to JIS A 5905.
  • “+” indicates that the amount of formaldehyde emitted from the same amount of bagasse chips is “+”, and “ ⁇ ” indicates that the amount of formaldehyde emitted from the same amount of bagasse chips is equal to or less than that. .
  • “+” Is a sample having formaldehyde emission in addition to the bagasse chip.
  • "-” Is a sample with no formaldehyde emission other than bagasse chips.
  • JIS Z 2911 Mold resistance test
  • Five types of fungi (Aspergillus, Penicillium, Rhizopus, Cladosporium, Chaetomium) designated by JIS Z 2911 are pre-cultured (PDA / 25 ° C./10 days).
  • PDA Proliferative Determination Protocol
  • 20 mL of DW distilled water
  • Each is filtered with gauze to remove the mycelium.
  • About 1.4 ml of the spore solution is dropped on the surface of the compact sample placed in the petri dish, and then cultured at 26 ° C./99% RH for 28 days.
  • Table 1 shows the board configuration, bonding conditions, board molding conditions, and evaluation results.
  • Comparative Example 1 only a board with low physical properties was obtained. In addition, mold occurred.
  • Comparative Example 2 was molded at a higher temperature and longer time than Comparative Example 1, but water resistance and hot water resistance were low, and mold was generated. In Comparative Examples 1 and 2, since the modification of the components in the bagasse has not progressed sufficiently, it is considered that the deterioration of physical properties and generation of mold occurred.
  • Comparative Examples 3 and 4 it was possible to produce a board by adding organic sulfonic acid, but water resistance and hot water resistance were low, and mold was generated in the JIS test.
  • Comparative Example 5 it was possible to produce a board by adding a polyvalent carboxylic acid and no mold was generated, but the board had low water resistance and hot water resistance.
  • the board could be produced by adding organic sulfonic acid or carboxylic acid, but the physical properties were greatly reduced. It is thought that it is also influenced by shortening the molding time. Since either of these organic sulfonic acids and polyvalent carboxylic acids is not added, it takes time to modify the sugar contained in the bagasse chip or the added sugar, and it is considered that the physical properties are lowered. Moreover, sugar remained on the board, and mold was generated in the JIS mold test.
  • Comparative Examples 9 to 10 it was possible to produce a board having high physical properties except for mold by adding a petroleum-based thermosetting resin adhesive, but sucrose in the board remained. For this reason, very many molds were generated.
  • Examples 1 to 10 it was possible to produce a board having high physical properties and hardly causing mold by adding organic sulfonic acid and polyvalent carboxylic acid to bagasse.
  • the water absorption thickness expansion coefficient of normal temperature water and the water absorption thickness expansion coefficient of hot water are less than 20%, and it is considered that the boards can withstand the use of interior building materials.
  • Example 4 even if the molding time was shortened, the physical properties exceeded that of Comparative Example 6 in which only organic sulfonic acid was added and Comparative Example 7 in which only polyvalent carboxylic acid was added, and no mold was generated.
  • the water absorption thickness expansion coefficient of normal temperature water and the water absorption thickness expansion coefficient of hot water were 15% or less.
  • Example 5 the addition of organic sulfonic acid, polyvalent carboxylic acid and saccharide significantly increased the physical properties compared to Comparative Example 8 in which no organic sulfonic acid was added.
  • Example 5 even when the molding time was shortened, the water absorption thickness expansion coefficient of normal temperature water and the water absorption thickness expansion coefficient of hot water were less than 20%.
  • Example 6 the water absorption thickness expansion coefficient of normal temperature water and the water absorption thickness expansion coefficient of hot water were less than 10%, and a high-performance board was obtained.
  • Example 9 petroleum-based thermosetting resin adhesive was added in half the amount of Comparative Example 10, and the pressing time was shortened to 7.5 minutes. Although the physical properties tended to decrease slightly due to the shortening of the press time, the water absorption thickness expansion coefficient of room temperature water and the water absorption thickness expansion coefficient of hot water were 15% or less. There was no mold. However, the emission of formaldehyde other than that derived from bagasse was confirmed.
  • bagasse which is a sugarcane pomace that is an unused resource as a plant piece, it is a very simple process by adding together organic sulfonic acid and polyvalent carboxylic acid, and high performance It was found that a bagasse molded body of the above was obtained.
  • This bagasse molded article has high adhesiveness and water resistance, and formaldehyde is hardly diffused, and has the performance of suppressing the generation of mold.

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Abstract

La présente invention se rapporte au moulage de la bagasse qui est obtenu en moulant la bagasse qui est un résidu filtré de la canne à sucre. La bagasse est liée à un composant adhésif qui est un composant de bagasse dénaturé qui a été formé au cours d'un moulage par pressage à chaud. La bagasse est liée en présence d'un acide carboxylique polyvalent et d'un acide sulfonique organique. Grâce à l'utilisation combinée de l'acide carboxylique polyvalent et de l'acide sulfonique organique, on peut obtenir un moulage qui présente une forte adhésivité et une forte tolérance à l'eau et libère peu de formaldéhyde et pour lequel le développement de champignons est éliminé.
PCT/JP2013/003386 2012-06-19 2013-05-29 Moulage de la bagasse Ceased WO2013190777A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015056367A1 (fr) * 2013-10-15 2015-04-23 パナソニックＩｐマネジメント株式会社 Composition liante et panneau
US20200172733A1 (en) * 2017-11-14 2020-06-04 Panasonic Intellectual Property Management Co., Ltd. Biomass composition and biomass molded body
JP2020089988A (ja) * 2018-12-03 2020-06-11 パナソニックＩｐマネジメント株式会社 バイオマス成形体の製造方法
JP2021024250A (ja) * 2019-08-08 2021-02-22 永大産業株式会社 竹材組織の分離方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111516087B (zh) * 2020-03-20 2022-07-22 洪家敏 阻燃工业大麻秸秆纤维板及其制造方法
CN116512373B (zh) * 2023-05-05 2024-07-26 武汉大学 一种纤维素基板材及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030309A (ja) * 1983-07-07 1985-02-15 Ota Shoji リグノセルロ−ス材料から複合製品を製造する方法
JPH0647713A (ja) * 1992-06-19 1994-02-22 Iida Kogyo Kk リグノセルロースまたはこれを含む材料の成形方法
JP2002361611A (ja) * 2001-06-08 2002-12-18 Koyo Sangyo Co Ltd 易分解性リグノセルロースボードおよびその製造方法
WO2010001988A1 (fr) * 2008-07-03 2010-01-07 国立大学法人京都大学 Composition durcie par application de chaleur/pression à celle-ci
JP2012214687A (ja) * 2011-03-31 2012-11-08 Panasonic Corp 接着用組成物及びボード
JP2012214013A (ja) * 2011-03-30 2012-11-08 Panasonic Corp 木質系ボード及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352661B1 (en) * 1999-08-17 2002-03-05 Bayer Corporation PMDI wood binders containing hydrophobic diluents
DE10129875A1 (de) * 2001-06-21 2003-01-09 Basf Coatings Ag Beschichtete mitteldichte Faserplatten, Verfahren zu ihrer Herstellung und ihre Verwendung
US7193029B2 (en) * 2004-07-09 2007-03-20 E. I. Du Pont De Nemours And Company Sulfonated copolyetherester compositions from hydroxyalkanoic acids and shaped articles produced therefrom
DE102005020741A1 (de) * 2005-05-02 2006-03-30 Basf Ag Verwendung von flüssigen Farbmittelzubereitungen zur Einfärbung von Cellulose/Polymer-Verbundwerkstoffen
MX2007013706A (es) * 2005-05-02 2008-01-28 Basf Ag Metodo para impermeabilizar materiales lignocelulosicos.
FI20065150L (fi) * 2006-03-06 2007-09-07 Valtion Teknillinen Modifioitu luonnonrasvahappopohjainen hybridihartsi ja menetelmä sen valmistamiseksi
WO2009006356A1 (fr) * 2007-07-02 2009-01-08 Yin Wang Composition polymère pour le couplage et la modification de matériaux cellulosiques

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030309A (ja) * 1983-07-07 1985-02-15 Ota Shoji リグノセルロ−ス材料から複合製品を製造する方法
JPH0647713A (ja) * 1992-06-19 1994-02-22 Iida Kogyo Kk リグノセルロースまたはこれを含む材料の成形方法
JP2002361611A (ja) * 2001-06-08 2002-12-18 Koyo Sangyo Co Ltd 易分解性リグノセルロースボードおよびその製造方法
WO2010001988A1 (fr) * 2008-07-03 2010-01-07 国立大学法人京都大学 Composition durcie par application de chaleur/pression à celle-ci
JP2012214013A (ja) * 2011-03-30 2012-11-08 Panasonic Corp 木質系ボード及びその製造方法
JP2012214687A (ja) * 2011-03-31 2012-11-08 Panasonic Corp 接着用組成物及びボード

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WO2015056367A1 (fr) * 2013-10-15 2015-04-23 パナソニックＩｐマネジメント株式会社 Composition liante et panneau
US20200172733A1 (en) * 2017-11-14 2020-06-04 Panasonic Intellectual Property Management Co., Ltd. Biomass composition and biomass molded body
US11725108B2 (en) * 2017-11-14 2023-08-15 Panasonic Intellectual Property Management Co., Ltd. Biomass composition and biomass molded body
JP2020089988A (ja) * 2018-12-03 2020-06-11 パナソニックＩｐマネジメント株式会社 バイオマス成形体の製造方法
JP2021024250A (ja) * 2019-08-08 2021-02-22 永大産業株式会社 竹材組織の分離方法
JP7280145B2 (ja) 2019-08-08 2023-05-23 永大産業株式会社 竹材組織の分離方法

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