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WO2013038436A2 - Dispositif d'éclairage à diodes électroluminescentes à dissipateur de chaleur intégré - Google Patents

Dispositif d'éclairage à diodes électroluminescentes à dissipateur de chaleur intégré Download PDF

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Publication number
WO2013038436A2
WO2013038436A2 PCT/IT2012/000285 IT2012000285W WO2013038436A2 WO 2013038436 A2 WO2013038436 A2 WO 2013038436A2 IT 2012000285 W IT2012000285 W IT 2012000285W WO 2013038436 A2 WO2013038436 A2 WO 2013038436A2
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
cooling fins
heatsink
leds
connection plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IT2012/000285
Other languages
English (en)
Other versions
WO2013038436A3 (fr
Inventor
Vincenzo TARASCO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201280050923.7A priority Critical patent/CN103874884A/zh
Priority to EP12791276.4A priority patent/EP2756226A2/fr
Publication of WO2013038436A2 publication Critical patent/WO2013038436A2/fr
Publication of WO2013038436A3 publication Critical patent/WO2013038436A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • a LED LIGHTING DEVICE WITH INTEGRATED HEATSINK The present invention concerns the lighting technology.
  • the present invention concerns a LED lighting device comprising a heatsink associated in construction to said device.
  • a heatsink suitable for performing said function bases its working on the absorption, by conduction, of the heat produced by the LEDs and on the further transfer of said heat towards a plurality of cooling fins, of different forms and dimensions, arranged for determining the dissipation of the heat into the surrounding air, in case with the help of one or more ventilation fans.
  • said heatsink often is an autonomous component, separated from the lighting device, and usually it is applied - by means of appropriate thermally conductive adhesives - on the back of the printed circuit board that supports electrically and mechanically the LEDs which form the light source thereof.
  • Said microperforations, lined with copper for realizing a direct contact between said single LEDS and the heatsink associated to the printed circuit working also as a support to the same, may furthermore contain suitable heat-conductive substances which further favour the heat exchange between above mentioned components.
  • the printed circuit board carrying the LEDs is necessarily placed between the same and the relative heatsink, thus forming an element resisting to the passage of the heat and able to hinder the heat exchange between said components;
  • the thermally conductive adhesives usually placed between said printed circuit board and said heatsink in order to determine the reciprocal coupling, also form a resistance element that further hinders the heat exchange between the LEDs and the mentioned heatsink;
  • the heatsink has a structural shape suitable for favouring the dissipation of the heat coming from one single source, evenly distributed on the whole surface of said printed circuit board, while the LEDs placed on the same, instead, generate a plurality of heat sources, of discrete type, highly concentrated in correspondence with their positioning points on said printed circuit board;
  • the production method requires further processing of the printed circuit board and produces a proportional increase of the final cost of the whole lighting device.
  • It is the aim of the present invention to realize a LED lighting device comprising an integrated heatsink, arranged for preventing overheating and the following damaging of the single LEDs forming the light source of said device.
  • a LED lighting device with integrated heatsink comprising:
  • PCB Printed Circuit Board
  • MCPCB Metal Core Printed Circuit Board
  • a heatsink arranged for being associated in construction to said printed circuit, comprising a plurality of cooling fins,
  • cooling fins are arranged for being placed into direct contact with said LEDs, and each single cooling fin is arranged for dissipating only the heat produced by the specific LEDs applied thereon.
  • the heatsink whose cooling fins are placed into direct contact with the single LEDs forming the light source of the device, it eliminates the thermal resistance represented by the printed circuit carrying said LEDs, usually placed between the same and the relative heatsink;
  • heatsink provided with a structural shape optimized for managing a plurality of discrete heat sources
  • figure 1 shows an exploded axonometric view of a LED lighting device with integrated heatsink according to the present invention
  • figure 2 shows in a partial vertical section the structural shape of said lighting device and the system for coupling the same to the relative heatsink;
  • FIGS. 3 and 4 respectively show an axonometric exploded view and a partial vertical section of the structural shape of a possible embodiment of the lighting device according to the present invention
  • FIGS. 5 and 6 show an axonometric view of some possible embodiments only of the heatsink that may be associated to the device according to the present invention.
  • the lighting device accordinghe present invention mainly comprises:
  • a heatsink 2 that may be associated to said printed circuit C, comprising a plurality of cooling fins 3, having indicatively cylindrical shape, provided with upper ends 4 that may be inserted into corresponding housings 1 of said printed circuit C, onto which the LEDs L forming the light source of the device D are directly applied; a connection plate 5, comprised in the structure of said heatsink 2, arranged for reciprocally gathering cooling fins 3, and also arranged for allowing the reciprocal assembling between said heatsink 2 and said printed circuit C, by means of mechanical coupling means 6 of the pin, screw, clip or similar type.
  • the lighting device D shown in figures 1 and 2 comprises a LED L matrix wherein said LEDs are placed in a preferably circular or rectangular order, or in any other regular order, on a printed circuit C of the PCB (Printed Circuit Board) or MCPCB (Metal Core Printed Circuit Board) type, functional to the drive and control of the same.
  • PCB Printed Circuit Board
  • MCPCB Metal Core Printed Circuit Board
  • the printed circuit C has a plurality of housings 1 , vertically crossing its structure, arranged for receiving the upper ends 4 of cooling fins 3 of a special heatsink 2, that may be associated in construction to said printed circuit C in order to ensure proper cooling of LEDs L forming the light source of said device D.
  • Said heatsink 2 consists of a plurality of cooling fins 3, made out of metals with high thermal conductivity or with composite alloys, having an approximately cylindrical shape and reciprocally gathered, by a connection plate 5, in an order corresponding to the one of the LEDs L present on the printed circuit C.
  • connection plate 5 allows the reciprocal assembling between said heatsink 2 and said printed circuit 2, by means of mechanical coupling means of the pin, screw, clip or similar type.
  • connection plate 5 helps to determine the correct alignment of upper ends 4 of cooling fins 3 with the upper plane P of the printed circuit C, following to their insertion in the corresponding housings 1 of the same.
  • the LEDs L forming the light source of device D may thus be connected to the electric component of said printed circuit C and successively directly applied to upper ends 4 of cooling fins 3 of the relative heatsink 2, with the help of limited amounts of thermally conductive adhesives.
  • each of said cooling fin 3 will be able to dissipate only, directly and with extreme efficiency the heat produced by the single LED L corresponding thereto, giving the heatsink 2 the capacity of managing in an extremely optimized manner, the plurality of heat sources, of discrete type, generated by the LED L matrix, forming the heat source of device D.
  • the total efficiency of heatsink 2 will be advantageously increased by the elimination of the thermal resistance elements usually placed between the same and LEDs L, obtained by the application thereof in direct correspondence with cooling fins 3 of said component.
  • the foregoing allows to contain the working temperature of the LEDs L within the safety limits determined by the manufacturing companies, preventing possible overheating and the following damaging deriving from a possible burning.
  • said heatsink 2 may be provided with additional cooling fins 7, with lamellar structure and a transversal position to said cooling fins 3, arranged for increasing the heat exchange surface of the heatsink 2 so as do adapt the dissipation capacity of said component to the specific heat amount produced by the lighting device D associated thereto.
  • Cooling fins 3, connection plate 5 and additional cooling fins 7 may form separate elements that may be reciprocally assembled by means of welding or glueing processes, or mechanically, or grouped in a single metal body that may be realized by melting processes.
  • the heatsink 2 integrated in lighting device D comprises a plurality of cooling fins 8, with lamellar structure, arranged radial to a connection plate 9 of discoidal shape.
  • connection plate 9 has a housing 10 arranged for containing the printed circuit C responsible for driving and controlling LEDs L forming the light source of device D, the structure thereof comprising a plurality of passing through openings 1 1 coincident in number and order with housings 1 comprised in the structure of said printed circuit C.
  • connection plate 9 is preferably out of plastic materials suitable for favouring electric insulation of the printed circuit C, and of cooling fins 8 of heatsink 2, and is arranged for acting as a support to accessory elements to lighting device D like lens, diffusers, ventilation fans V and other, that may be associated to said connection plate 9 by means of mechanical connection means of known kind, not shown.
  • Cooling fins 8 are provided with a special end 12 that, passing through said openings 1 1 and getting inserted in housings 1 of printed circuit C, makes it possible to apply LEDs L in correspondence with upper ends 4 of the same with the help of small amounts of thermally conductive adhesives.
  • Said cooling fins 8 are preferably made out of high thermal conductivity metals or out of composite alloys.
  • cooling fins 8 as well as relative connection plate 9 may form separate elements that can be reciprocally assembled by means of welding or glueing processes, or mechanically, or grouped in one single metal body that may be realized by melting processes.
  • the heatsink 2 integrated in lighting device D comprises cooling fins with prismatic shape, with a respectively square base 13 or rectangular base 14, possibly provided with end structures 15, arranged for forming striking surfaces 16 for favouring the correct alignment of upper ends 4 with upper plane P of printed circuit C, following to their insertion in corresponding housings 1 of the same.
  • Said cooling fins 3, 14 are integral with a flat base 17, arranged for allowing the reciprocal assembling between heatsink 2 and printed circuit C, carrying LEDs L, by means of mechanical coupling means 6 of pin, screw, clip or similar type.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention porte sur un dispositif d'éclairage (D) à diodes électroluminescentes (L) présentant un dissipateur de chaleur intégré (2), lequel dispositif comprend : un circuit imprimé (C) du type carte de circuits imprimés ou carte de circuits imprimés à cœur métallique, agencé pour supporter électriquement et mécaniquement une matrice de diodes électroluminescentes (L), formant la source de lumière dudit dispositif (D) ; un dissipateur de chaleur (2) qui peut être associé, dans la construction, audit circuit imprimé (C), comprenant une pluralité d'ailettes de refroidissement (3, 8, 13, 14), caractérisé en ce que lesdites ailettes de refroidissement (3, 8, 13, 14) sont agencées de façon à être disposées en contact direct avec lesdites diodes électroluminescentes (L) et en ce que chaque ailette de refroidissement unique (3, 8, 13, 14) est agencée pour dissiper seulement la chaleur produite par les diodes électroluminescentes spécifiques (L) appliquées sur celle-ci. Le dissipateur de chaleur (2) comprend des ailettes de refroidissement (3) présentant une forme cylindrique (8), présentant une structure lamellaire ou présentant une forme prismatique avec des bases carrées (13) ou des bases rectangulaires (14) ou avec une autre forme régulière, comportant des extrémités (4) agencées de façon à permettre l'application de diodes électroluminescentes (L), et réalisées en des alliages composites ou en des métaux à conductivité thermique élevée.
PCT/IT2012/000285 2011-09-16 2012-09-13 Dispositif d'éclairage à diodes électroluminescentes à dissipateur de chaleur intégré Ceased WO2013038436A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280050923.7A CN103874884A (zh) 2011-09-16 2012-09-13 具有集成热沉的led照明设备
EP12791276.4A EP2756226A2 (fr) 2011-09-16 2012-09-13 Dispositif d'éclairage à diodes électroluminescentes à dissipateur de chaleur intégré

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITRM2011A000485 2011-09-16
IT000485A ITRM20110485A1 (it) 2011-09-16 2011-09-16 Dispositivo di illuminazione a led con dissipatore di calore integrato.

Publications (2)

Publication Number Publication Date
WO2013038436A2 true WO2013038436A2 (fr) 2013-03-21
WO2013038436A3 WO2013038436A3 (fr) 2013-06-27

Family

ID=44908005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2012/000285 Ceased WO2013038436A2 (fr) 2011-09-16 2012-09-13 Dispositif d'éclairage à diodes électroluminescentes à dissipateur de chaleur intégré

Country Status (4)

Country Link
EP (1) EP2756226A2 (fr)
CN (1) CN103874884A (fr)
IT (1) ITRM20110485A1 (fr)
WO (1) WO2013038436A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107044599B (zh) * 2017-04-27 2019-11-05 东莞市闻誉实业有限公司 散热灯具
EP4219167A1 (fr) * 2022-02-01 2023-08-02 GEW (EC) Limited Système de refroidissement pour appareil de durcissement à led
EP4219166A1 (fr) 2022-02-01 2023-08-02 GEW (EC) Limited Appareil de durcissement de del et module de refroidissement
CN117167685A (zh) * 2023-10-07 2023-12-05 常州星宇车灯股份有限公司 车灯矩阵式led散热装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6864513B2 (en) * 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US20050212439A1 (en) * 2004-03-25 2005-09-29 Integrated Illumination Systems, Inc. Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs
KR20070091590A (ko) * 2007-08-13 2007-09-11 이영섭 터보 냉각방식의 led 램프 가로등 .
TWM362362U (en) * 2009-03-06 2009-08-01 Acpa Energy Conversion Devices Co Ltd Heat conduction structure for heating element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Also Published As

Publication number Publication date
EP2756226A2 (fr) 2014-07-23
ITRM20110485A1 (it) 2013-03-17
CN103874884A (zh) 2014-06-18
WO2013038436A3 (fr) 2013-06-27

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