WO2013005622A1 - Dispositif de refroidissement et son procédé de fabrication - Google Patents
Dispositif de refroidissement et son procédé de fabrication Download PDFInfo
- Publication number
- WO2013005622A1 WO2013005622A1 PCT/JP2012/066452 JP2012066452W WO2013005622A1 WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1 JP 2012066452 W JP2012066452 W JP 2012066452W WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flat plate
- cooling device
- flow path
- refrigerant
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- H10W40/73—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn
Definitions
- the inside of the flat container 10 includes a liquid phase channel 12 having a small volume of the sealed space 8 formed between the recessed portions 6a and a sealed space 8 formed between the protruding portions 6b.
- a gas phase flow path 11 having a large volume. Therefore, the heat of the heating element 4 arranged on the convex portion 6b boils, and the vapor of the refrigerant 9 whose volume has increased rapidly is provided by the heat radiating portion 5 at the upper part of the flat container 10 along the gas phase flow path 11a having a large volume. It is carried to the gas phase flow path 11b. Since the vapor
- FIG. 7 is a perspective view of the cooling device 1 in the present embodiment
- FIGS. 8 and 9 are cross-sectional views.
- the concave portion 6a provided in the first flat plate 2 and the concave portion 6a provided in the second flat plate 3 are joined. ing.
- the cooling device 1 in the present embodiment includes a flat container 10 having a box shape and having a sealed space 8 therein.
- the cooling device 1 is configured by assembling the first flat plate 2 and the second flat plate 3.
- the peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example.
- the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside.
- the heating element 4 and the flat container 10 are thermally connected via a thermally conductive grease.
- the liquid phase flow path 12 is connected to gas phase flow paths 11 b provided at both upper and lower ends of the flat container 10.
- the heat radiating part 5 is provided in the region where the liquid phase flow path 12 and the gas phase flow path 11b are connected at the upper end of the flat container 10.
- the joint portion 13 is provided between the gas phase flow channel 11 a and the liquid phase flow channel 12 to partition the both.
- a gas phase channel 11 a formed by extending in the vertical direction is provided at the center of the flat container 10, and the joint portion 13 is sandwiched between both sides of the gas phase channel 11 a.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
L'invention porte sur un dispositif de refroidissement, lequel dispositif est apte à empêcher une déformation due à la pression interne d'un agent de refroidissement en phase vapeur, sans provoquer une augmentation du poids. Un dispositif de refroidissement selon la présente invention comprend : un récipient plan qui comporte une première plaque plate et une seconde plaque plate ; et un agent de refroidissement qui est hermétiquement scellé dans le récipient plan. La première plaque plate et/ou la seconde plaque plate ont une structure en relief.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011151062 | 2011-07-07 | ||
| JP2011-151062 | 2011-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013005622A1 true WO2013005622A1 (fr) | 2013-01-10 |
Family
ID=47436977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/066452 Ceased WO2013005622A1 (fr) | 2011-07-07 | 2012-06-21 | Dispositif de refroidissement et son procédé de fabrication |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2013005622A1 (fr) |
| WO (1) | WO2013005622A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014115839A1 (fr) * | 2013-01-25 | 2014-07-31 | 古河電気工業株式会社 | Caloduc |
| JP2014142143A (ja) * | 2013-01-24 | 2014-08-07 | Ntec Co Ltd | ヒートパイプ |
| JP2015200465A (ja) * | 2014-04-09 | 2015-11-12 | 富士通株式会社 | ヒートパイプ内蔵フレーム板及び電子機器 |
| WO2020230499A1 (fr) * | 2019-05-10 | 2020-11-19 | 古河電気工業株式会社 | Dissipateur thermique |
| WO2023022211A1 (fr) * | 2021-08-20 | 2023-02-23 | 古河電気工業株式会社 | Dissipateur thermique |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304384A (ja) * | 1992-04-28 | 1993-11-16 | Showa Alum Corp | ヒートパイプ式ヒートシンク |
| JPH1137678A (ja) * | 1997-07-22 | 1999-02-12 | Showa Alum Corp | ヒートパイプ式放熱器 |
| JP2006526128A (ja) * | 2003-05-31 | 2006-11-16 | アイキュリ ラボ ホールディングズ リミテッド | ドライアウトが防止された薄板型冷却装置 |
| JP2008197344A (ja) * | 2007-02-13 | 2008-08-28 | Showa Denko Kk | 光学エンジンの発熱デバイス冷却装置 |
| JP2008267754A (ja) * | 2007-04-24 | 2008-11-06 | Showa Denko Kk | ヒートパイプ式放熱装置 |
| JP2010216676A (ja) * | 2009-03-13 | 2010-09-30 | Furukawa Electric Co Ltd:The | 冷却基板 |
-
2012
- 2012-06-21 WO PCT/JP2012/066452 patent/WO2013005622A1/fr not_active Ceased
- 2012-06-21 JP JP2013522918A patent/JPWO2013005622A1/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304384A (ja) * | 1992-04-28 | 1993-11-16 | Showa Alum Corp | ヒートパイプ式ヒートシンク |
| JPH1137678A (ja) * | 1997-07-22 | 1999-02-12 | Showa Alum Corp | ヒートパイプ式放熱器 |
| JP2006526128A (ja) * | 2003-05-31 | 2006-11-16 | アイキュリ ラボ ホールディングズ リミテッド | ドライアウトが防止された薄板型冷却装置 |
| JP2008197344A (ja) * | 2007-02-13 | 2008-08-28 | Showa Denko Kk | 光学エンジンの発熱デバイス冷却装置 |
| JP2008267754A (ja) * | 2007-04-24 | 2008-11-06 | Showa Denko Kk | ヒートパイプ式放熱装置 |
| JP2010216676A (ja) * | 2009-03-13 | 2010-09-30 | Furukawa Electric Co Ltd:The | 冷却基板 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014142143A (ja) * | 2013-01-24 | 2014-08-07 | Ntec Co Ltd | ヒートパイプ |
| WO2014115839A1 (fr) * | 2013-01-25 | 2014-07-31 | 古河電気工業株式会社 | Caloduc |
| JP5654186B1 (ja) * | 2013-01-25 | 2015-01-14 | 古河電気工業株式会社 | ヒートパイプ |
| KR101761037B1 (ko) * | 2013-01-25 | 2017-07-24 | 후루카와 덴키 고교 가부시키가이샤 | 히트 파이프 |
| TWI601929B (zh) * | 2013-01-25 | 2017-10-11 | Furukawa Electric Co Ltd | Heat pipe |
| US9995537B2 (en) | 2013-01-25 | 2018-06-12 | Furukawa Electric Co., Ltd. | Heat pipe |
| JP2015200465A (ja) * | 2014-04-09 | 2015-11-12 | 富士通株式会社 | ヒートパイプ内蔵フレーム板及び電子機器 |
| WO2020230499A1 (fr) * | 2019-05-10 | 2020-11-19 | 古河電気工業株式会社 | Dissipateur thermique |
| US11246239B2 (en) | 2019-05-10 | 2022-02-08 | Furukawa Electric Co., Ltd. | Heatsink |
| WO2023022211A1 (fr) * | 2021-08-20 | 2023-02-23 | 古河電気工業株式会社 | Dissipateur thermique |
| JPWO2023022211A1 (fr) * | 2021-08-20 | 2023-02-23 | ||
| JP7654803B2 (ja) | 2021-08-20 | 2025-04-01 | 古河電気工業株式会社 | ヒートシンク |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013005622A1 (ja) | 2015-02-23 |
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