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WO2013005622A1 - Dispositif de refroidissement et son procédé de fabrication - Google Patents

Dispositif de refroidissement et son procédé de fabrication Download PDF

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Publication number
WO2013005622A1
WO2013005622A1 PCT/JP2012/066452 JP2012066452W WO2013005622A1 WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1 JP 2012066452 W JP2012066452 W JP 2012066452W WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1
Authority
WO
WIPO (PCT)
Prior art keywords
flat plate
cooling device
flow path
refrigerant
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/066452
Other languages
English (en)
Japanese (ja)
Inventor
有仁 松永
吉川 実
坂本 仁
正樹 千葉
賢一 稲葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of WO2013005622A1 publication Critical patent/WO2013005622A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/084Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/085Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H10W40/73
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/08Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn

Definitions

  • the inside of the flat container 10 includes a liquid phase channel 12 having a small volume of the sealed space 8 formed between the recessed portions 6a and a sealed space 8 formed between the protruding portions 6b.
  • a gas phase flow path 11 having a large volume. Therefore, the heat of the heating element 4 arranged on the convex portion 6b boils, and the vapor of the refrigerant 9 whose volume has increased rapidly is provided by the heat radiating portion 5 at the upper part of the flat container 10 along the gas phase flow path 11a having a large volume. It is carried to the gas phase flow path 11b. Since the vapor
  • FIG. 7 is a perspective view of the cooling device 1 in the present embodiment
  • FIGS. 8 and 9 are cross-sectional views.
  • the concave portion 6a provided in the first flat plate 2 and the concave portion 6a provided in the second flat plate 3 are joined. ing.
  • the cooling device 1 in the present embodiment includes a flat container 10 having a box shape and having a sealed space 8 therein.
  • the cooling device 1 is configured by assembling the first flat plate 2 and the second flat plate 3.
  • the peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example.
  • the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside.
  • the heating element 4 and the flat container 10 are thermally connected via a thermally conductive grease.
  • the liquid phase flow path 12 is connected to gas phase flow paths 11 b provided at both upper and lower ends of the flat container 10.
  • the heat radiating part 5 is provided in the region where the liquid phase flow path 12 and the gas phase flow path 11b are connected at the upper end of the flat container 10.
  • the joint portion 13 is provided between the gas phase flow channel 11 a and the liquid phase flow channel 12 to partition the both.
  • a gas phase channel 11 a formed by extending in the vertical direction is provided at the center of the flat container 10, and the joint portion 13 is sandwiched between both sides of the gas phase channel 11 a.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur un dispositif de refroidissement, lequel dispositif est apte à empêcher une déformation due à la pression interne d'un agent de refroidissement en phase vapeur, sans provoquer une augmentation du poids. Un dispositif de refroidissement selon la présente invention comprend : un récipient plan qui comporte une première plaque plate et une seconde plaque plate ; et un agent de refroidissement qui est hermétiquement scellé dans le récipient plan. La première plaque plate et/ou la seconde plaque plate ont une structure en relief.
PCT/JP2012/066452 2011-07-07 2012-06-21 Dispositif de refroidissement et son procédé de fabrication Ceased WO2013005622A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011151062 2011-07-07
JP2011-151062 2011-07-07

Publications (1)

Publication Number Publication Date
WO2013005622A1 true WO2013005622A1 (fr) 2013-01-10

Family

ID=47436977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/066452 Ceased WO2013005622A1 (fr) 2011-07-07 2012-06-21 Dispositif de refroidissement et son procédé de fabrication

Country Status (2)

Country Link
JP (1) JPWO2013005622A1 (fr)
WO (1) WO2013005622A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115839A1 (fr) * 2013-01-25 2014-07-31 古河電気工業株式会社 Caloduc
JP2014142143A (ja) * 2013-01-24 2014-08-07 Ntec Co Ltd ヒートパイプ
JP2015200465A (ja) * 2014-04-09 2015-11-12 富士通株式会社 ヒートパイプ内蔵フレーム板及び電子機器
WO2020230499A1 (fr) * 2019-05-10 2020-11-19 古河電気工業株式会社 Dissipateur thermique
WO2023022211A1 (fr) * 2021-08-20 2023-02-23 古河電気工業株式会社 Dissipateur thermique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304384A (ja) * 1992-04-28 1993-11-16 Showa Alum Corp ヒートパイプ式ヒートシンク
JPH1137678A (ja) * 1997-07-22 1999-02-12 Showa Alum Corp ヒートパイプ式放熱器
JP2006526128A (ja) * 2003-05-31 2006-11-16 アイキュリ ラボ ホールディングズ リミテッド ドライアウトが防止された薄板型冷却装置
JP2008197344A (ja) * 2007-02-13 2008-08-28 Showa Denko Kk 光学エンジンの発熱デバイス冷却装置
JP2008267754A (ja) * 2007-04-24 2008-11-06 Showa Denko Kk ヒートパイプ式放熱装置
JP2010216676A (ja) * 2009-03-13 2010-09-30 Furukawa Electric Co Ltd:The 冷却基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304384A (ja) * 1992-04-28 1993-11-16 Showa Alum Corp ヒートパイプ式ヒートシンク
JPH1137678A (ja) * 1997-07-22 1999-02-12 Showa Alum Corp ヒートパイプ式放熱器
JP2006526128A (ja) * 2003-05-31 2006-11-16 アイキュリ ラボ ホールディングズ リミテッド ドライアウトが防止された薄板型冷却装置
JP2008197344A (ja) * 2007-02-13 2008-08-28 Showa Denko Kk 光学エンジンの発熱デバイス冷却装置
JP2008267754A (ja) * 2007-04-24 2008-11-06 Showa Denko Kk ヒートパイプ式放熱装置
JP2010216676A (ja) * 2009-03-13 2010-09-30 Furukawa Electric Co Ltd:The 冷却基板

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014142143A (ja) * 2013-01-24 2014-08-07 Ntec Co Ltd ヒートパイプ
WO2014115839A1 (fr) * 2013-01-25 2014-07-31 古河電気工業株式会社 Caloduc
JP5654186B1 (ja) * 2013-01-25 2015-01-14 古河電気工業株式会社 ヒートパイプ
KR101761037B1 (ko) * 2013-01-25 2017-07-24 후루카와 덴키 고교 가부시키가이샤 히트 파이프
TWI601929B (zh) * 2013-01-25 2017-10-11 Furukawa Electric Co Ltd Heat pipe
US9995537B2 (en) 2013-01-25 2018-06-12 Furukawa Electric Co., Ltd. Heat pipe
JP2015200465A (ja) * 2014-04-09 2015-11-12 富士通株式会社 ヒートパイプ内蔵フレーム板及び電子機器
WO2020230499A1 (fr) * 2019-05-10 2020-11-19 古河電気工業株式会社 Dissipateur thermique
US11246239B2 (en) 2019-05-10 2022-02-08 Furukawa Electric Co., Ltd. Heatsink
WO2023022211A1 (fr) * 2021-08-20 2023-02-23 古河電気工業株式会社 Dissipateur thermique
JPWO2023022211A1 (fr) * 2021-08-20 2023-02-23
JP7654803B2 (ja) 2021-08-20 2025-04-01 古河電気工業株式会社 ヒートシンク

Also Published As

Publication number Publication date
JPWO2013005622A1 (ja) 2015-02-23

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