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WO2013005622A1 - Cooling device and method for manufacturing same - Google Patents

Cooling device and method for manufacturing same Download PDF

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Publication number
WO2013005622A1
WO2013005622A1 PCT/JP2012/066452 JP2012066452W WO2013005622A1 WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1 JP 2012066452 W JP2012066452 W JP 2012066452W WO 2013005622 A1 WO2013005622 A1 WO 2013005622A1
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Prior art keywords
flat plate
cooling device
flow path
refrigerant
flat
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PCT/JP2012/066452
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French (fr)
Japanese (ja)
Inventor
有仁 松永
吉川　実
坂本　仁
正樹 千葉
賢一 稲葉
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NEC Corp
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NEC Corp
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Publication of WO2013005622A1 publication Critical patent/WO2013005622A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn

Definitions

  • the inside of the flat container 10 includes a liquid phase channel 12 having a small volume of the sealed space 8 formed between the recessed portions 6a and a sealed space 8 formed between the protruding portions 6b.
  • a gas phase flow path 11 having a large volume. Therefore, the heat of the heating element 4 arranged on the convex portion 6b boils, and the vapor of the refrigerant 9 whose volume has increased rapidly is provided by the heat radiating portion 5 at the upper part of the flat container 10 along the gas phase flow path 11a having a large volume. It is carried to the gas phase flow path 11b. Since the vapor
  • FIG. 7 is a perspective view of the cooling device 1 in the present embodiment
  • FIGS. 8 and 9 are cross-sectional views.
  • the concave portion 6a provided in the first flat plate 2 and the concave portion 6a provided in the second flat plate 3 are joined. ing.
  • the cooling device 1 in the present embodiment includes a flat container 10 having a box shape and having a sealed space 8 therein.
  • the cooling device 1 is configured by assembling the first flat plate 2 and the second flat plate 3.
  • the peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example.
  • the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside.
  • the heating element 4 and the flat container 10 are thermally connected via a thermally conductive grease.
  • the liquid phase flow path 12 is connected to gas phase flow paths 11 b provided at both upper and lower ends of the flat container 10.
  • the heat radiating part 5 is provided in the region where the liquid phase flow path 12 and the gas phase flow path 11b are connected at the upper end of the flat container 10.
  • the joint portion 13 is provided between the gas phase flow channel 11 a and the liquid phase flow channel 12 to partition the both.
  • a gas phase channel 11 a formed by extending in the vertical direction is provided at the center of the flat container 10, and the joint portion 13 is sandwiched between both sides of the gas phase channel 11 a.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Provided is a cooling device which is capable of preventing deformation due to the internal pressure of a vapor-phase coolant, without causing an increase in the weight. A cooling device of the present invention comprises: a planar container that is provided with a first flat plate and a second flat plate; and a coolant that is sealed in the planar container. The first flat plate and/or the second flat plate has a relief structure.

Description

冷却装置およびその製造方法Cooling device and manufacturing method thereof

　本発明は電子機器のＬＳＩなどの発熱体を冷却するための冷却装置に関し、特に相変化を利用した平板型の冷却装置およびその製造方法に関する。 The present invention relates to a cooling device for cooling a heating element such as an LSI of an electronic device, and more particularly to a flat plate type cooling device using phase change and a method for manufacturing the same.

　発熱量の大きな半導体素子は、半導体素子のパッケージの上部にヒートシンクを設けて伝熱面を拡大させ、送風機などにより拡大した伝熱面に対して強制空冷を行うことで、半導体素子が発する熱の冷却を行っていた。
　近年、実装技術の進展、プリント基板の多層化と共に電子機器の薄型、小型化の要求が高まってきている。そのため電子機器の薄型、小型化の進展と共に、半導体パッケージ上部にヒートシンクなどの冷却部品用のスペースを確保することが困難となってきた。
　そこで密閉空間を有する平板状の金属筺体の内部に冷媒を充填した平板型の沸騰冷却器の研究が進んでいる。平板型沸騰冷却器は、蒸発部において発熱体が発する熱により冷媒を沸騰させ、凝縮部に熱の輸送をすることによって冷却を行う。
　詳細に説明すると、蒸発部において発熱体の熱により蒸発した冷媒の蒸気を、気液の体積差と毛細現象や、気液密度の差による浮力などを利用することで筺体内を循環させ凝縮部に移動させる。そして外気と熱交換を行うことで凝縮部において冷媒が冷却されると、蒸発した冷媒は気体から液体に凝縮し、発熱体で発生した熱を外気へ放熱する。
　特許文献１には、平板型の冷却装置の具体的な構造について記載されている。特許文献１では、２枚の銅板で構成される筐体内部の密閉空間に流路構造を設けている。流路構造は、放熱部、吸熱部を備えており、それぞれ流路の幅が異なる。上記構造とすることで放熱部は、吸熱部に比べて流路幅を広くすることができ、流路中の圧力損失を低減させて冷媒の循環を促進し、熱輸送の効率化を図ることができる。 A semiconductor element with a large calorific value is provided with a heat sink at the top of the package of the semiconductor element to expand the heat transfer surface, and forced air cooling is performed on the heat transfer surface expanded by a blower or the like to reduce the heat generated by the semiconductor element. Cooling was taking place.
In recent years, with the progress of mounting technology and the increase in the number of printed circuit boards, there has been an increasing demand for thinner and smaller electronic devices. For this reason, it has become difficult to secure a space for a cooling component such as a heat sink in the upper part of the semiconductor package as the electronic device becomes thinner and smaller.
Therefore, research on a flat-type boiling cooler in which a refrigerant is filled in a flat metal casing having a sealed space is progressing. The flat plate type boiling cooler performs cooling by boiling the refrigerant with heat generated by the heating element in the evaporation section and transporting the heat to the condensation section.
More specifically, the vapor of the refrigerant evaporated by the heat of the heating element in the evaporation unit is circulated in the enclosure by utilizing the volume difference and capillary phenomenon of gas and liquid, and the buoyancy due to the difference in gas and liquid density. Move to. When the refrigerant is cooled in the condensing unit by exchanging heat with the outside air, the evaporated refrigerant is condensed from gas to liquid, and the heat generated in the heating element is radiated to the outside air.
Patent Document 1 describes a specific structure of a flat plate type cooling device. In Patent Document 1, a flow path structure is provided in a closed space inside a casing constituted by two copper plates. The flow channel structure includes a heat radiating portion and a heat absorbing portion, and the width of each flow channel is different. By adopting the above structure, the heat radiating section can have a wider flow path width than the heat absorbing section, reduce pressure loss in the flow path, promote refrigerant circulation, and improve heat transport efficiency. Can do.

特開２０１０−２１６６７６号公報JP 2010-216676 A

　特許文献１に記載の平板型沸騰冷却装置では、発熱体の発熱量が大きい場合、発熱体を冷却するために多くの冷媒が必要であった。しかし冷媒は液体から気体に相変化すると体積が急激に増加するため、発熱体により冷媒が沸騰して気化すると冷却装置を構成する筐体内部の圧力が上がり、筐体が変形してしまう。筺体の変形を防ぐために、筺体の板厚を厚くすると、冷却装置の重量が増大してしまうという問題があった。
　本発明は、上記課題である気相冷媒の内圧による筺体の変形を防止しようとすると、冷却装置の重量が増大してしまうという課題を解決する冷却装置およびその製造方法を提供することを目的とする。 In the flat-type boiling cooling apparatus described in Patent Document 1, when the heat generation amount of the heating element is large, a large amount of refrigerant is required to cool the heating element. However, since the volume of the refrigerant suddenly increases when the phase changes from liquid to gas, when the refrigerant is boiled and vaporized by the heating element, the pressure inside the casing constituting the cooling device increases and the casing is deformed. If the thickness of the casing is increased in order to prevent deformation of the casing, there is a problem that the weight of the cooling device increases.
An object of the present invention is to provide a cooling device and a method for manufacturing the same, which solves the problem that the weight of the cooling device increases when it is intended to prevent deformation of the housing due to the internal pressure of the gas-phase refrigerant, which is the above-described problem. To do.

　本発明における冷却装置は、第１平板と第２平板とを備えた平板型容器と、平板型容器内に封入された冷媒とを有し、第１平板と第２平板の少なくとも一方に凹凸構造を備える。 The cooling device according to the present invention includes a flat container having a first flat plate and a second flat plate, and a refrigerant sealed in the flat container, and has an uneven structure on at least one of the first flat plate and the second flat plate. Is provided.

　本発明における冷却装置による効果の一例として、冷媒装置の重量の増大を招くことなく、気相冷媒の内圧による冷却装置の変形を防止することができる。 As an example of the effect of the cooling device in the present invention, it is possible to prevent deformation of the cooling device due to the internal pressure of the gas-phase refrigerant without causing an increase in the weight of the refrigerant device.

第１実施形態における冷却装置の構成を示す斜視図である。It is a perspective view which shows the structure of the cooling device in 1st Embodiment. 第１実施形態における冷却装置の構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure of the cooling device in 1st Embodiment. 第１実施形態における冷却装置の構成を示す断面図である。It is sectional drawing which shows the structure of the cooling device in 1st Embodiment. 第２実施形態における冷却装置の構成を示す斜視図である。It is a perspective view which shows the structure of the cooling device in 2nd Embodiment. 第２実施形態における冷却装置の構成を示す断面図である。It is sectional drawing which shows the structure of the cooling device in 2nd Embodiment. 第２実施形態における冷却装置の構成を示す断面図である。It is sectional drawing which shows the structure of the cooling device in 2nd Embodiment. 第３実施形態における冷却装置の構成を示す斜視図である。It is a perspective view which shows the structure of the cooling device in 3rd Embodiment. 第３実施形態における冷却装置の構成を示す断面図である。It is sectional drawing which shows the structure of the cooling device in 3rd Embodiment. 第３実施形態における冷却装置の構成を示す断面図である。It is sectional drawing which shows the structure of the cooling device in 3rd Embodiment.

　以下に、本発明を実施するための好ましい形態について図面を用いて説明する。但し、以下に述べる実施形態には、本発明を実施するために技術的に好ましい限定がされているが、発明の範囲を以下に限定するものではない。
　〔第１の実施形態〕本実施形態について図面を参照して詳細に説明する。図１は、本実施形態における冷却装置１の斜視図であり、図２は分解斜視図であり、図３は断面図である。
　〔構造の説明〕図１、２に示すように、本実施形態における冷却装置１は、発熱体４と、放熱部５とを接続して使用する。
　図１、２に示すように冷却装置１は、内部に密閉空間８を有した平板状容器１０を備えている。平板状容器１０は、図２に示すように第１平板２と第２平板３とを組み立てることにより構成される。第１平板２の周辺部と第２平板３の周辺部とを例えば溶接、ろう付けなどにより接続する。なお第１平板２と第２平板３との接続箇所であるつなぎ目は、外から水やほこりが入り込まないように、シリコーンゴムなどの樹脂により封止した密閉構造としてもよい。平板状容器１０の材質は、銅やアルミニウムなど熱伝導性が高い材質で構成される。
　図３に示すように、第１平板２と第２平板３は、少なくとも一方に凹部６ａと凸部６ｂとで構成される凹凸構造６を備えている。ここで凹部６ａは第１平板２または第２平板３が平板状容器１０の外部から内部に突出した形状を有する領域であり、凸部６ｂは第１平板２または第２平板３が平板状容器１０の内部から外部に突出した形状を有する領域である。
　図３に示すように、第１平板２と第２平板３は互いに対向して配置され、第１平板２と第２平板３とを重ね合わせて接続することで平板状容器１０は形成される。つまり第１平板２と第２平板３に設けられている凹凸構造６を対向した位置で重ねあわせることで、平板状容器１０は内部に中空状の密閉空間８を形成する。
　詳細に説明すると、密閉空間８は、第１平板２に形成された凹部６ａと第２平板３に形成された凹部６ａとを重ね合わせた領域と、また第１平板２に形成された凸部６ｂと第２平板３に形成された凸部６ｂとを重ね合わせた領域とで構成される。なお第１平板２と第２平板３の凹凸構造６は、第１平板２、および第２平板３を金型などの加工部材によって押圧することによって製造される。
　発熱体４は、平板状容器１０の少なくとも１つの外側の面に設けられている。発熱体４と平板状容器１０とは、熱伝導グリースなどの熱伝導性が高い接着剤を介して熱的に接続している。なお発熱体４は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。
　平板状容器１０内部の密閉空間８には、冷媒が封入されている。冷媒の具体的な例としてＨＦＣ（ｈｙｄｒｏ　ｆｌｕｏｒｏｃａｒｂｏｎ：ハイドロフルオロカーボン）や、ＨＦＥ（ｈｙｄｒｏ　ｆｌｕｏｒｅｔｈｅｒ：ハイドロフルオロエーテル）や、水などを用いることができるが、材料はこれに限定されない。また平板状容器１０の密閉空間８における冷媒の圧力は、ポンプなどにより減圧された状態である。
　放熱部５は、平板状容器１０の少なくとも１つの外側の面に設けられており、平板状容器１０の鉛直方向の上部に設けられている。放熱部５と平板状容器１０とは、熱伝導グリースなどの熱伝導性が高い接着剤を介して熱的に接続している。これに限らず、ボルト等で固定することとしてもよい。
　放熱部５は、例えばフィン形状であり表面積が大きく、銅やアルミなど熱伝導性が高い材質であれば特に限定されない。放熱部５は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。
　また放熱部５が平板状容器１０に設けられる面は、発熱体４が取り付けられている面と同じ側の面でもよいし、発熱体４が取り付けられている面とは対向する反対側の面でもよい。（図１，２では、発熱体４が取り付けられている面と同じ面に放熱部５が設けられている場合を示す。）なお、発熱部４を複数備え、平板状容器１０の複数の面に設けてもよい。
　平板状容器１０内部の密閉空間８における圧力は、ポンプなどにより減圧された状態で飽和蒸気圧を保っている。上記の低沸点の冷媒を用いることにより、冷媒の沸点を３０度程度まで低下させることができ、冷媒は発熱体４が発生する熱によっても沸騰することができる。
　〔製造方法の説明〕ここで本実施形態における冷却装置１の製造方法について説明を行う。
　まず第１の工程として、金型などの加工部材に第１平板２および第２平板３を押圧することで、第１平板２および第２平板３に凹部６ａ、凸部６ｂを形成する。次に第２の工程に進む。
　次に、第２の工程として、第１平板２の凹部６ａと第２平板３の凹部６ａとが対向するように、また第１平板２の凸部６ｂと第２平板３の凸部６ｂとが対向するように第１平板２と第２平板３とを配置する。次に第３の工程に進む。
　次に、第３の工程として、第１平板２の周辺部と第２平板３の周辺部とを例えば溶接、ろう付けなどにより接続する。上記３つの工程により、本実施形態における平板状容器１０が形成される。
　〔作用・効果の説明〕次に、本実施形態の作用について説明する。
　第１平板２と第２平板３とで構成される平板状容器１０は、熱伝導性の高い材質であり、発熱体４と熱伝導性グリースを介して熱的に接続している。そのため発熱体４が発する熱は、平板状容器１０を介して、平板状容器１０の内部に設けられた冷媒に伝わる。
　なお平板状容器１０内部の密閉空間８に設けられている冷媒の気液界面は、発熱体４が取り付けられている高さよりも高く、密閉空間８の全てが冷媒で満たされないように冷媒の量が調整される。つまり冷媒の気液界面は、放熱部５と発熱体４の間に位置している。
　そして冷媒は、発熱体４が発する熱を受熱することで沸騰する。平板状容器１０の密閉空間８に設けられた冷媒が沸騰することで発生した冷媒の蒸気は、気液密度の差による浮力により、平板状容器１０の上部に運ばれる。
　平板状容器１０の上部に運ばれた冷媒の蒸気は、平板状容器１０を介して平板状容器１０の外壁面に取り付けられた放熱部５により外気と熱交換を行う。放熱部５は、フィン形状であるため表面積が大きく、外気と熱交換を行うことで冷却される。
　放熱部５が冷却されると、放熱部５と熱的に接続する平板状容器１０内部に設けられた冷媒の蒸気も冷却され、そして凝縮して液化する。液化した冷媒は、重力により平板状容器１０の下部に降下し、冷媒の気液界面へと還流する。そして冷媒は、再び発熱体４が発する熱により沸騰し、冷却サイクルが継続して行われる。
　換言すると、平板状容器１０の内部に設けられた冷媒は、発熱体４が発する熱により液体から気体に変化し、そして放熱部５を介して冷却されることで気体から再び液体に凝縮する。つまり冷媒は、液体から気体、そして気体から液体と相変化を繰り返すことで、発熱体４が発生した熱を、放熱部５を介して放熱を行う。
　特許文献１に記載の平板型沸騰冷却器は、発熱体が発する発熱量が大きい場合、発熱体を冷却するために多くの冷媒が必要であった。しかし気体の体積は、液体の体積と比べると大きいため、発熱体が発する熱により冷媒が沸騰して気化すると筺体内部の内圧が上がり、筺体が変形してしまうという問題があった。
　詳細に説明すると、冷媒が液体から気体に相変化すると一般に体積は、数１００倍以上に増加する。そして幅方向には広い形状であるが、冷媒が設けられている密閉空間８の体積としては小さい構造であるため、平板状容器１０は気体に相変化して増大した体積を収容できず変形してしまう。その結果、増大した冷媒の流動性が阻害され、冷却性能が低下してしまうという問題があった。また筺体の変形を防ぐために、筺体の板厚を厚くすると、冷却装置の重量が増大してしまうという問題があった。
　そこで本実施形態における冷却装置１の平板状容器１０は、第１平板２と第２平板３とに凹凸構造６を有している。凹凸構造６を設けることで、平板状容器１０における変形方向の断面二次モーメントを大きくすることができる。
　その結果、冷却装置１は冷媒が液体から気体に相変化し体積が急激に増加する場合であっても、第１平板２、第２平板３の板厚みを増やすことなく剛性を大きくすることができ、平板状容器１０の変形を防ぐことができる。そして、平板状容器１０が変形することにより、冷媒の流動性が阻害されて冷却性能が低下することを防ぐことができる。
　〔第２の実施形態〕次に、第２の実施形態について図面を参照して詳細に説明する。図４は、本実施形態における冷却装置１の斜視図であり、図５、図６は断面図である。
　〔構造の説明〕本実施形態における冷却装置１は、第１平板２と第２平板３とに設けられた凹凸構造６の凹部６ａが液相流路１２（第２流路）を、凸部６ｂが気相流路１１（第１流路）を形成している点である。それ以外の構造、接続関係は、第１の実施形態と同様であり、発熱体４と、放熱部５を接続して使用する。
　本実施形態における冷却装置１は、箱型形状で内部に密閉空間８を有する平板状容器１０を備えている。平板状容器１０は、第１平板２と第２平板３とを組み立てることにより構成される。第１平板２の周辺部と第２平板３の周辺部とを例えば溶接、ろう付けなどにより接続する。なお第１平板２と第２平板３との接続箇所であるつなぎ目は、外から水やほこりが入り込まないように、シリコーンゴムなどの樹脂により封止した密閉構造としてもよい。平板状容器１０の材質は、銅やアルミニウムなど熱伝導性が高い材質で構成される。
　第１平板２と第２平板３とは、少なくとも一方に凹部６ａと凸部６ｂとで構成される凹凸構造６を有している。凹凸構造６は、第１平板２、および第２平板３を金型などの加工部材に押圧することにより形成される。なお凹部６ａは、平板状容器１０の外側から内側に向かって変形した形状であり、凸部６ｂは平板状容器１０の内側から外側に向かって変形した形状である。
　凹凸構造６を設けた第１平板２と、第２平板３とを重ね合わせて接続することで、平板状容器１０は、内部に中空状の密閉空間８を形成する。そして密閉空間８には、冷媒９が封入されている。平板状容器１０内部の密閉空間８における内圧は、ポンプなどにより減圧された状態で飽和蒸気圧を保っている。
　発熱体４は、平板状容器１０の外側の面に熱伝導グリースなどの熱伝導性が高い接着剤を介して熱的に接続している。そして発熱体４は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。
　放熱部５も同様に、平板状容器１０の外側の面に熱伝導グリースなどの熱伝導性の高い接着剤を介して熱的に接続している。これに限らず、ボルト等で固定することとしてもよい。そして放熱部５は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。なお放熱部５は、例えばフィン形状であり表面積が大きく、銅やアルミなど熱伝導性が高い材質であれば特に限定されない。
　図５に示すように、気相流路１１（第１流路）は、互いに対向して配置された第１平板２に形成された凸部６ｂと、第２平板３に形成された凸部６ｂとで構成される領域である。一方、液相流路１２（第２流路）は、互いに対向して配置された第１平板２の凹部６ａと、第２平板３の凹部６ａとで構成される領域である。
　気相流路１１は凸部６ｂに挟まれた領域であるため、液相流路１２より厚さ方向に大きく断面積が大きい。そして気相流路１１は、液相流路１２より断面積が大きいため、体積も大きい。換言すると、気相流路１１の第１平板２および第２平板３の垂直な断面における面積は、液相流路１２の断面における面積よりも大きく構成されている。
　発熱体４が設けられている凸部６ｂと、放熱部５が設けられている凸部６ｂは隣接して連続的に形成されている。つまり発熱体４が設けられている凸部６ｂと、放熱部５が設けられている凸部６ｂとで挟まれた領域で気相流路１１を形成している。例えば本実施形態では、図４、６に示すように、Ｔ字型に凸部６ｂを形成しているが、これに限定されない。このとき気相流路１１は、気相流路１１ａと気相流路１１ｂとにより構成される。
　図６では、平板状容器１０の中央部に鉛直方向に延伸して形成された気相流路１１ａを設けている。第１平板２、または第２平板３の鉛直方向に延伸する気相流路１１ａを形成する凸部６ｂ上には、発熱体４が設けられている。なお気相流路１１ａの両側には、液相流路１２が設けられている。
　図６に示すように、平板状容器１０の上部には、水平方向に延伸して形成された気相流路１１ｂを設けている。第１平板２、または第２平板３の水平方向に延伸する気相流路１１ｂを形成する凸部６ｂ上には、放熱部５が設けられている。なお、気相流路１１ａと気相流路１１ｂとは隣接して連続して形成されている。
　〔作用の説明〕次に、本実施形態の作用について図６を用いて説明する。
　図６に示すように、第１平板２と第２平板３とで構成される平板状容器１０は、熱伝導性の高い材質であり、発熱体４と熱伝導性グリースを介して熱的に接続している。そのため発熱体４が発する熱は、平板状容器１０を介して、平板状容器１０の内部に設けられた冷媒９に伝わる。
　なお平板状容器１０内部の密閉空間８に設けられている冷媒９の気液界面は、発熱体４が取り付けられている高さよりも高く、密閉空間８の全てが冷媒９で満たされないように冷媒９の量が調整されている。つまり冷媒９の気液界面は、放熱部５と発熱体４の間に位置している。
　そして冷媒９は、発熱体４が発する熱を受熱することで沸騰する。平板状容器１０の密閉空間８に設けられた冷媒９が沸騰することで発生した冷媒９の蒸気は、気液密度の差による浮力により、平板状容器１０の上部に運ばれる。
　一般的に、冷媒９が液体から気体に相変化すると、体積は急激に増加して内圧が上昇し、平板状容器１０の形状を変形させてしまう可能性がある。そこで本実施形態における冷却装置１は、平板状容器１０を構成する第１平板２と第２平板３とに凹凸構造６を備えることで、変形方向の断面２次モーメントを大きくすることができる。その結果、第１平板２、および第２平板３の厚みを増やすことなく剛性を大きくすることができ、平板状容器１０が変形するのを防ぐことができる。
　また本実施形態における冷却装置１の平板状容器１０は、発熱体４と放熱部５が平板状容器１０に連続して形成された凸部６ｂ上に設けられている。つまり、気相流路１１は凸部６ｂに挟まれた領域であるため、液相流路１２より厚さ方向に大きく断面積が大きい。そして気相流路１１は、液相流路１２より断面積が大きいため、体積も大きい。換言すると、気相流路１１の第１平板２および第２平板３の垂直な断面における面積は、液相流路１２の断面における面積よりも大きく構成されている。
　上記構成により、発熱体４が発する熱により平板状容器１０内で沸騰することで発生した冷媒９の蒸気は、気液密度の差による浮力により平板状容器１０の上部に運ばれる。このとき、急激に体積が増加した冷媒９の蒸気は、気相流路１１ａに沿って放熱部５に運ばれる。
　詳細に説明すると、平板状容器１０の内部は、凹部６ａに挟まれて形成された密閉空間８の体積が小さい液相流路１２と、凸部６ｂに挟まれて形成された密閉空間８の体積が大きい気相流路１１とが存在する。そのため凸部６ｂに配置された発熱体４が沸騰して、体積が急激に増加した冷媒９の蒸気は、体積が大きい気相流路１１ａに沿って平板状容器１０上部の放熱部５が設けられている気相流路１１ｂに運ばれる。このとき冷媒９の蒸気は急激に増加するため、体積の小さい液相流路１２には流れこまない。
　放熱部５が設けられている気相流路１１ｂに運ばれた冷媒９の蒸気は、平板状容器１０を介して外壁面に設けられた放熱部５により外気と熱交換を行う。放熱部５が冷却されると、放熱部５と熱的に接続する平板状容器１０内部に設けられた冷媒９の蒸気も冷却され、そして凝縮して液化する。
　ここで凝縮して液化した冷媒９は、気体のときに比べて急激に体積が減少するため、急激に体積が増加した冷媒９の蒸気が発熱部４から放熱部５に移動している気相流路１１ではなく、液相流路１２を通り平板状容器１０の下部に設けられている冷媒９の気液界面に還流する。
　ここで図６を用いて具体的に説明すると、平板状容器１０における気相流路１１は点線に囲まれた斜線部のようにＴ字状に形成されている。まず平板状容器１０の中央部に鉛直方向に延伸して設けられた気相流路１１ａにおいて、発熱体４により沸騰した冷媒９の蒸気は気相流路１１ａを通り平板状容器１０の上部に運ばれる。
　平板状容器１０の上部に運ばれた冷媒９の蒸気は、放熱部５が設けられている気相流路１１ｂにおいて凝縮して液化する。そして液化した凝縮液は、気相流路１１ａの両側に設けられた液相流路１２から平板状容器１０の下部に運ばれる。
　〔効果の説明〕次に、本実施形態の効果について説明を行う。
　平板状容器１０は、第１平板２および第２平板３に凹凸構造６を備えているので、変形方向の断面二次モーメントを大きくすることができる。その結果、冷媒９が沸騰して体積が急激に増加することによる平板状容器１０の変形を防止することができる。
　また同時に、上記構成により、沸騰することで体積が増加した冷媒９の蒸気が放熱部５に運ばれる気相流路１１と、凝縮することにより体積が減少した冷媒９の凝縮液が平板状容器１０の下部に位置する気液界面に流動する液相流路１２が形成することができる。
　また平板状容器１０は、第１平板２および第２平板３に凹凸構造６を設けることで、厚さ方向に断面積を変化させることができる。その結果、平板状の流路幅を変化させた構造に比べて、仕切り板や流路フィンを設ける必要がないため、発熱体４が発する熱により沸騰した冷媒９の蒸気を平板状容器１０上部に運ぶ気相流路１１と、放熱部５において凝縮して液化した冷媒９を平板状容器１０下部に運ぶ液相流路１２とを容易に形成することができる。
　その結果、冷却装置１の重量の増大を招くことなく、冷媒９の内圧による平板状容器１０の変形を防止することができる。また平板状容器１０の変形を防止することで、発熱体４が発する熱を受熱して沸騰した冷媒９の蒸気を、放熱部５を介して冷却させて再び液化するという沸騰冷却の冷却サイクルを向上し、冷却性能を向上することができる。
　〔第３の実施形態〕次に、第３の実施形態について図面を参照して詳細に説明する。図７は、本実施形態における冷却装置１の斜視図であり、図８、図９は断面図である。
　〔構造の説明〕本実施形態における冷却装置１の平板状容器１０は、図８に示すように第１平板２に設けられた凹部６ａと第２平板３に設けられた凹部６ａとが接合している。それ以外の構造、接続関係は、第１の実施形態と同様であり発熱体４と、放熱部５とを接続して使用する。
　本実施形態における冷却装置１は、箱型形状で内部に密閉空間８を有した平板状容器１０を備えている。冷却装置１は、第１平板２と第２平板３とを組み立てることにより構成される。第１平板２の周辺部と第２平板３の周辺部とを例えば溶接、ろう付けなどにより接続する。なお第１平板２と第２平板３との接続箇所であるつなぎ目は、外から水やほこりが入り込まないように、シリコーンゴムなどの樹脂により封止した密閉構造としてもよい。平板状容器１０の材質は、銅やアルミニウムなど熱伝導性が高い材質で構成される。
　第１平板２と第２平板３とは、少なくとも一方に凹部６ａと凸部６ｂとで構成される凹凸構造６を有している。凹凸構造６は、第１平板２、および第２平板３を金型などの加工部材に押圧することにより形成する。なお凹部６ａは、平板状容器１０の外側から内側に向かって変形した形状であり、凸部６ｂは平板状容器１０の内側から外側に向かって変形した形状である。
　凹凸構造６を設けた第１平板２と、第２平板３とを重ね合わせて接続することで、平板状容器１０の内部に中空状の密閉空間８が構成される。そして密閉空間８には、冷媒９が設けられている。平板状容器１０内部の密閉空間８における内圧は、ポンプなどにより減圧された状態で飽和蒸気圧を保っている。
　発熱体４は、平板状容器１０の外側の面に熱伝導グリースなどの熱伝導性が高い接着剤を介して熱的に接続している。そして発熱体４は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。
　放熱部５も同様に、平板状容器１０の外側の面に熱伝導グリースのなどの熱伝導性の高い接着剤を介して熱的に接続している。これに限らず、ボルト等で固定することとしてもよい。そして放熱部５は、第１平板２、または第２平板３の凸部６ｂ上に取り付けられている。なお放熱部５は、例えばフィン形状であり表面積が大きく、銅やアルミなど熱伝導性が高い材質であれば特に限定されない。
　図８に示すように、気相流路１１と液相流路１２は、第１平板２と第２平板３に形成された凸部６ｂが対向した領域である。第１平板２と第２平板３とに形成された凹部６ａ同士はロウ付けや、溶接などにより互いに接合している。気相流路１１の垂直な断面における面積は、液相流路１２の断面における面積よりも大きく構成されている。
　第１平板２と第２平板３とに形成された凹部６ａが接合している領域を、接合部１３とする。接合部１３は、気相流路１１と液相流路１２の間に設けられている。
　気相流路１１と液相流路１２は、それぞれ少なくとも１つずつ設けられ、鉛直方向に延伸して形成されている。気相流路１１を形成する第１平板２あるいは第２平板３の少なくとも一方の凸部６ｂ上に発熱体４が接続される。発熱体４と平板状容器１０は、熱伝導性グリースを介して熱的に接続している。
　液相流路１２は、平板状容器１０の上下両端部に設けられた気相流路１１ｂと接続している。平板状容器１０の上端部における液相流路１２と気相流路１１ｂとが接続する領域に、放熱部５が設けられている。一方、平板状容器１０の上下両端部以外の場所では、接合部１３が、気相流路１１ａと液相流路１２との間に設けられ両者を仕切っている。
　図９に示すように、平板状容器１０の中央部に鉛直方向に延伸して形成された気相流路１１ａが設けられており、気相流路１１ａの両側に、接合部１３を挟んで延伸して形成された液相流路１２が設けられている。気相流路１１と液相流路１２とは、平板状容器１０の上下端部において互いに接続している。なお、平板状容器１０における気相流路１１は点線に囲まれた斜線部のようにＴ字状に形成されている。
　〔作用・効果の説明〕次に、本実施形態の作用・効果について説明する。
　第１平板２と第２平板３とで構成される平板状容器１０は、熱伝導性の高い材質であり、発熱体４と熱伝導性グリースを介して熱的に接続している。そのため発熱体４が発する熱は、平板状容器１０を介して、平板状容器１０の内部に設けられた冷媒９に伝わる。
　なお平板状容器１０内部の密閉空間８に設けられている冷媒９の気液界面は、発熱体４が取り付けられている高さよりも高く、密閉空間８の全てが冷媒９で満たされないように冷媒９の量が調整される。つまり冷媒９の気液界面は、放熱部５と発熱体４の間に位置している。
　そして冷媒９は、発熱体４が発する熱を受熱することで沸騰する。平板状容器１０の密閉空間８に設けられた冷媒９が沸騰することで発生した冷媒９の蒸気は、気液密度の差による浮力により、平板状容器１０の上部に運ばれる。
　一般的に、冷媒９が液体から気体に相変化すると、体積は急激に増加して内圧が上昇して平板状容器１０の形状を変形させてしまう可能性がある。しかし本実施形態によれば、平板状容器１０を構成する第１平板２と第２平板３とに凹凸構造６が構成されているので、変形方向の断面２次モーメントを大きくすることができる。その結果、第１平板２、および第２平板３の厚みを増やすことなく剛性を大きくすることができ、平板状容器１０が変形するのを防ぐことができる。
　また本実施形態における冷却装置１の平板状容器１０は、第１平板２と第２平板３とに凹凸構造６を設けることで、冷媒９の蒸気を平板状容器１０の上部に運ぶ気相流路１１と、放熱部５において冷媒９の蒸気が液化した凝縮液を平板状容器１０下部に運ぶ液相流路１２とを形成することができる。
　そして気相流路１１と液相流路１２は平板状容器１０の上下両端部において接続しており、凹部６ａ同士が接合した接合部１３が仕切り部材として、気相流路１１と液相流路１２とのあいだに設けられている。
　詳細に説明すると、気相流路１１と液相流路１２は、第１平板２と第２平板３の凸部６ｂに挟まれた領域である。一方、第１平板２の凹部６ａと第２平板３の凹部６ａとをロウ付けや溶接などで接合した接合部１３は、新たな構成部品を要することなく、気相流路１１と液相流路１２とを仕切ることができる。
　さらに第１平板２と第２平板３とに設けた凹部６ａ同士を接合した構成とすることにより、第１平板２と第２平板３とは、外縁部だけでなく接合部１３において接合される。そのため接合箇所が増大し、平板状容器１０の強度を第１、２の実施形態に比べてさらに増大することができる。
　その結果、冷媒９が液体から気体に相変化して体積が急激に増加することにより内圧が上昇して平板状容器１０の形状が変形することを防ぐことができる。つまり第１平板２、および第２平板３の厚みを増やすことなくさらに剛性を大きくすることができ、平板状容器１０が変形を防ぐことができる。
　以上、実施形態を参照して本願発明を説明したが、本願発明は上記実施形態に限定されるものではない。本願発明の構成や詳細には、本願発明のスコープ内で当業者が理解し得る様々な変更をすることができる。
　この出願は、２０１１年７月７日に出願された日本出願特願２０１１−１５１０６２を基礎とする優先権を主張し、その開示の全てをここに取り込む。 Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. However, the preferred embodiments described below are technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following.
[First Embodiment] This embodiment will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a cooling device 1 in the present embodiment, FIG. 2 is an exploded perspective view, and FIG. 3 is a cross-sectional view.
[Description of Structure] As shown in FIGS. 1 and 2, the cooling device 1 in this embodiment uses a heating element 4 and a heat radiating section 5 connected to each other.
As shown in FIGS. 1 and 2, the cooling device 1 includes a flat container 10 having a sealed space 8 therein. The flat container 10 is constructed by assembling the first flat plate 2 and the second flat plate 3 as shown in FIG. The peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example. In addition, the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside. The material of the flat container 10 is made of a material having high thermal conductivity such as copper or aluminum.
As shown in FIG. 3, the 1st flat plate 2 and the 2nd flat plate 3 are provided with the uneven structure 6 comprised by the recessed part 6a and the convex part 6b in at least one. Here, the recess 6a is a region having a shape in which the first flat plate 2 or the second flat plate 3 protrudes from the outside to the inside of the flat plate container 10, and the convex portion 6b is the flat plate container of the first flat plate 2 or the second flat plate 3. 10 is a region having a shape protruding from the inside to the outside.
As shown in FIG. 3, the first flat plate 2 and the second flat plate 3 are arranged to face each other, and the flat plate container 10 is formed by overlapping and connecting the first flat plate 2 and the second flat plate 3. . That is, the flat container 10 forms a hollow sealed space 8 inside by overlapping the concavo-convex structure 6 provided on the first flat plate 2 and the second flat plate 3 at opposing positions.
More specifically, the sealed space 8 includes a region where the concave portion 6a formed in the first flat plate 2 and the concave portion 6a formed in the second flat plate 3 are overlapped, and a convex portion formed in the first flat plate 2. 6b and a region where the convex portions 6b formed on the second flat plate 3 are overlapped. The uneven structure 6 of the first flat plate 2 and the second flat plate 3 is manufactured by pressing the first flat plate 2 and the second flat plate 3 with a processing member such as a mold.
The heating element 4 is provided on at least one outer surface of the flat container 10. The heating element 4 and the flat container 10 are thermally connected via an adhesive having high thermal conductivity such as thermal conductive grease. The heating element 4 is mounted on the convex portion 6 b of the first flat plate 2 or the second flat plate 3.
A refrigerant is sealed in the sealed space 8 inside the flat container 10. As specific examples of the refrigerant, HFC (hydrofluorocarbon), HFE (hydrofluoroether), water, and the like can be used, but the material is not limited to this. Moreover, the pressure of the refrigerant | coolant in the sealed space 8 of the flat container 10 is the state pressure-reduced with the pump etc.
The heat dissipating part 5 is provided on at least one outer surface of the flat container 10 and is provided on the upper part of the flat container 10 in the vertical direction. The heat radiation part 5 and the flat container 10 are thermally connected via an adhesive having high thermal conductivity such as thermal conductive grease. Not only this but it is good also as fixing with a volt | bolt etc.
The heat dissipating part 5 is not particularly limited as long as it has a fin shape, a large surface area, and a material having high thermal conductivity such as copper or aluminum. The heat dissipating part 5 is attached on the first flat plate 2 or the convex part 6 b of the second flat plate 3.
The surface on which the heat radiating part 5 is provided on the flat container 10 may be the same surface as the surface on which the heating element 4 is attached, or the surface on the opposite side to the surface on which the heating element 4 is attached. But you can. (In FIGS. 1 and 2, the case where the heat radiating portion 5 is provided on the same surface as the surface on which the heat generating element 4 is mounted is shown.) May be provided.
The pressure in the sealed space 8 inside the flat container 10 maintains the saturated vapor pressure in a state where the pressure is reduced by a pump or the like. By using the low boiling point refrigerant, the boiling point of the refrigerant can be lowered to about 30 degrees, and the refrigerant can be boiled by heat generated by the heating element 4.
[Description of Manufacturing Method] A method of manufacturing the cooling device 1 in this embodiment will now be described.
First, as the first step, the first flat plate 2 and the second flat plate 3 are pressed against a processing member such as a mold to form the concave portions 6 a and the convex portions 6 b on the first flat plate 2 and the second flat plate 3. Next, the process proceeds to the second step.
Next, as a second step, the convex portion 6b of the first flat plate 2 and the convex portion 6b of the second flat plate 3 are arranged so that the concave portion 6a of the first flat plate 2 and the concave portion 6a of the second flat plate 3 face each other. The first flat plate 2 and the second flat plate 3 are arranged so as to face each other. Next, the process proceeds to the third step.
Next, as a third step, the peripheral portion of the first flat plate 2 and the peripheral portion of the second flat plate 3 are connected by, for example, welding or brazing. The flat container 10 in this embodiment is formed by the above three steps.
[Description of Functions and Effects] Next, functions of this embodiment will be described.
The flat container 10 composed of the first flat plate 2 and the second flat plate 3 is made of a material having high thermal conductivity, and is thermally connected to the heating element 4 via thermal conductive grease. Therefore, the heat generated by the heating element 4 is transmitted to the refrigerant provided inside the flat container 10 through the flat container 10.
In addition, the gas-liquid interface of the refrigerant | coolant provided in the sealed space 8 inside the flat container 10 is higher than the height in which the heat generating body 4 is attached, and the quantity of the refrigerant | coolant is used so that the whole sealed space 8 may not be filled with a refrigerant | coolant. Is adjusted. That is, the gas-liquid interface of the refrigerant is located between the heat radiating portion 5 and the heating element 4.
And a refrigerant | coolant boils by receiving the heat which the heat generating body 4 generate | occur | produces. The refrigerant vapor generated by boiling the refrigerant provided in the sealed space 8 of the flat container 10 is carried to the upper part of the flat container 10 by buoyancy due to the difference in gas-liquid density.
The refrigerant vapor carried to the upper part of the flat container 10 exchanges heat with the outside air by the heat radiating unit 5 attached to the outer wall surface of the flat container 10 via the flat container 10. Since the heat radiating part 5 has a fin shape, it has a large surface area and is cooled by exchanging heat with the outside air.
When the heat dissipating part 5 is cooled, the refrigerant vapor provided inside the flat container 10 thermally connected to the heat dissipating part 5 is also cooled and condensed and liquefied. The liquefied refrigerant descends to the lower part of the flat container 10 by gravity and returns to the gas-liquid interface of the refrigerant. Then, the refrigerant again boils by the heat generated by the heating element 4, and the cooling cycle is continued.
In other words, the refrigerant provided in the flat container 10 changes from a liquid to a gas by the heat generated by the heating element 4 and is condensed via the heat radiating unit 5 to be condensed again from the gas to the liquid. That is, the refrigerant radiates the heat generated by the heating element 4 through the heat radiating unit 5 by repeating the phase change from liquid to gas and from gas to liquid.
The flat plate boiling cooler described in Patent Document 1 requires a large amount of refrigerant to cool the heating element when the heating value generated by the heating element is large. However, since the volume of the gas is larger than the volume of the liquid, there is a problem that when the refrigerant boils and vaporizes due to the heat generated by the heating element, the internal pressure inside the casing increases and the casing is deformed.
More specifically, when the refrigerant changes phase from liquid to gas, the volume generally increases several hundred times or more. And although it is a wide shape in the width direction, since the volume of the sealed space 8 in which the refrigerant is provided is small, the flat container 10 can not accommodate the increased volume due to the phase change to gas and deforms. End up. As a result, there has been a problem that the increased fluidity of the refrigerant is hindered and the cooling performance is lowered. Further, if the thickness of the casing is increased in order to prevent deformation of the casing, there is a problem that the weight of the cooling device increases.
Therefore, the flat container 10 of the cooling device 1 according to the present embodiment has the uneven structure 6 on the first flat plate 2 and the second flat plate 3. By providing the concavo-convex structure 6, it is possible to increase the cross-sectional second moment in the deformation direction in the flat container 10.
As a result, the cooling device 1 can increase the rigidity without increasing the plate thickness of the first flat plate 2 and the second flat plate 3 even when the volume of the refrigerant suddenly increases because the phase of the refrigerant changes from liquid to gas. And deformation of the flat container 10 can be prevented. And when the flat container 10 deform | transforms, it can prevent that the fluidity | liquidity of a refrigerant | coolant is inhibited and cooling performance falls.
[Second Embodiment] Next, a second embodiment will be described in detail with reference to the drawings. FIG. 4 is a perspective view of the cooling device 1 in the present embodiment, and FIGS. 5 and 6 are cross-sectional views.
[Description of Structure] In the cooling device 1 according to this embodiment, the concave portion 6a of the concave-convex structure 6 provided on the first flat plate 2 and the second flat plate 3 has the liquid phase flow path 12 (second flow path) as the convex section. 6b is the point which forms the gaseous-phase flow path 11 (1st flow path). Other structures and connection relationships are the same as in the first embodiment, and the heating element 4 and the heat radiating part 5 are connected and used.
The cooling device 1 according to the present embodiment includes a flat container 10 having a box shape and having a sealed space 8 therein. The flat container 10 is configured by assembling the first flat plate 2 and the second flat plate 3. The peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example. In addition, the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside. The material of the flat container 10 is made of a material having high thermal conductivity such as copper or aluminum.
At least one of the first flat plate 2 and the second flat plate 3 has a concavo-convex structure 6 including a concave portion 6a and a convex portion 6b. The uneven structure 6 is formed by pressing the first flat plate 2 and the second flat plate 3 against a processing member such as a mold. In addition, the recessed part 6a is a shape which deform | transformed toward the inner side from the outer side of the flat container 10, and the convex part 6b is a shape which deform | transformed toward the outer side from the inner side of the flat container 10. FIG.
By overlapping and connecting the first flat plate 2 provided with the concavo-convex structure 6 and the second flat plate 3, the flat container 10 forms a hollow sealed space 8 inside. A refrigerant 9 is sealed in the sealed space 8. The internal pressure in the sealed space 8 inside the flat container 10 maintains the saturated vapor pressure in a state where the pressure is reduced by a pump or the like.
The heating element 4 is thermally connected to the outer surface of the flat container 10 through an adhesive having high thermal conductivity such as thermal conductive grease. And the heat generating body 4 is attached on the convex part 6b of the 1st flat plate 2 or the 2nd flat plate 3. FIG.
Similarly, the heat dissipating part 5 is thermally connected to the outer surface of the flat container 10 through an adhesive having high heat conductivity such as heat conductive grease. Not only this but it is good also as fixing with a volt | bolt etc. The heat dissipating part 5 is mounted on the first flat plate 2 or the convex part 6 b of the second flat plate 3. The heat dissipating part 5 is not particularly limited as long as it has a fin shape, a large surface area, and a material having high thermal conductivity such as copper or aluminum.
As shown in FIG. 5, the gas phase flow path 11 (first flow path) includes a convex portion 6 b formed on the first flat plate 2 and a convex portion formed on the second flat plate 3. 6b. On the other hand, the liquid phase flow path 12 (second flow path) is an area constituted by the concave portion 6 a of the first flat plate 2 and the concave portion 6 a of the second flat plate 3 that are arranged to face each other.
Since the gas phase channel 11 is a region sandwiched between the convex portions 6 b, the gas phase channel 11 is larger in the thickness direction than the liquid phase channel 12 and has a larger sectional area. Since the gas phase channel 11 has a larger cross-sectional area than the liquid phase channel 12, the volume is large. In other words, the area in the vertical cross section of the first flat plate 2 and the second flat plate 3 of the gas phase flow path 11 is configured to be larger than the area in the cross section of the liquid phase flow path 12.
The convex part 6b in which the heat generating body 4 is provided and the convex part 6b in which the heat radiating part 5 is provided are continuously formed adjacent to each other. That is, the gas phase flow path 11 is formed in a region sandwiched between the convex portion 6b where the heating element 4 is provided and the convex portion 6b where the heat radiating portion 5 is provided. For example, in this embodiment, as shown in FIGS. 4 and 6, the convex portion 6b is formed in a T-shape, but the present invention is not limited to this. At this time, the gas phase channel 11 includes a gas phase channel 11a and a gas phase channel 11b.
In FIG. 6, a gas phase channel 11 a formed by extending in the vertical direction is provided at the center of the flat container 10. On the convex part 6b which forms the gaseous-phase flow path 11a extended | stretched in the perpendicular direction of the 1st flat plate 2 or the 2nd flat plate 3, the heat generating body 4 is provided. A liquid phase channel 12 is provided on both sides of the gas phase channel 11a.
As shown in FIG. 6, a gas phase flow path 11 b formed by extending in the horizontal direction is provided on the upper portion of the flat container 10. On the convex part 6b which forms the gaseous-phase flow path 11b extended in the horizontal direction of the 1st flat plate 2 or the 2nd flat plate 3, the thermal radiation part 5 is provided. The gas phase channel 11a and the gas phase channel 11b are continuously formed adjacent to each other.
[Explanation of Action] Next, the action of this embodiment will be described with reference to FIG.
As shown in FIG. 6, the flat container 10 composed of the first flat plate 2 and the second flat plate 3 is made of a material having high thermal conductivity, and thermally through the heating element 4 and the thermal conductive grease. Connected. Therefore, the heat generated by the heating element 4 is transmitted to the refrigerant 9 provided inside the flat container 10 through the flat container 10.
Note that the gas-liquid interface of the refrigerant 9 provided in the sealed space 8 inside the flat container 10 is higher than the height at which the heating element 4 is attached, so that the entire sealed space 8 is not filled with the refrigerant 9. The amount of 9 is adjusted. That is, the gas-liquid interface of the refrigerant 9 is located between the heat radiating portion 5 and the heating element 4.
And the refrigerant | coolant 9 boils by receiving the heat which the heat generating body 4 generate | occur | produces. The vapor | steam of the refrigerant | coolant 9 which generate | occur | produced when the refrigerant | coolant 9 provided in the sealed space 8 of the flat container 10 boiled is conveyed to the upper part of the flat container 10 by the buoyancy by the difference in gas-liquid density.
In general, when the refrigerant 9 undergoes a phase change from a liquid to a gas, the volume suddenly increases and the internal pressure increases, which may deform the shape of the flat container 10. Therefore, the cooling device 1 according to the present embodiment can increase the sectional secondary moment in the deformation direction by providing the first flat plate 2 and the second flat plate 3 constituting the flat plate container 10 with the uneven structure 6. As a result, the rigidity can be increased without increasing the thickness of the first flat plate 2 and the second flat plate 3, and the flat container 10 can be prevented from being deformed.
Moreover, the flat container 10 of the cooling device 1 in this embodiment is provided on the convex part 6b in which the heating element 4 and the heat radiating part 5 are continuously formed on the flat container 10. That is, since the gas phase channel 11 is a region sandwiched between the convex portions 6 b, the gas phase channel 11 is larger in the thickness direction than the liquid phase channel 12 and has a larger sectional area. Since the gas phase channel 11 has a larger cross-sectional area than the liquid phase channel 12, the volume is large. In other words, the area in the vertical cross section of the first flat plate 2 and the second flat plate 3 of the gas phase flow path 11 is configured to be larger than the area in the cross section of the liquid phase flow path 12.
With the above configuration, the vapor of the refrigerant 9 generated by boiling in the flat container 10 by the heat generated by the heating element 4 is carried to the upper part of the flat container 10 by buoyancy due to the difference in gas-liquid density. At this time, the vapor | steam of the refrigerant | coolant 9 whose volume increased rapidly is conveyed to the thermal radiation part 5 along the gaseous-phase flow path 11a.
More specifically, the inside of the flat container 10 includes a liquid phase channel 12 having a small volume of the sealed space 8 formed between the recessed portions 6a and a sealed space 8 formed between the protruding portions 6b. There is a gas phase flow path 11 having a large volume. Therefore, the heat of the heating element 4 arranged on the convex portion 6b boils, and the vapor of the refrigerant 9 whose volume has increased rapidly is provided by the heat radiating portion 5 at the upper part of the flat container 10 along the gas phase flow path 11a having a large volume. It is carried to the gas phase flow path 11b. Since the vapor | steam of the refrigerant | coolant 9 increases rapidly at this time, it does not flow into the liquid phase flow path 12 with a small volume.
The vapor of the refrigerant 9 transported to the gas phase flow path 11b in which the heat radiating unit 5 is provided exchanges heat with the outside air by the heat radiating unit 5 provided on the outer wall surface via the flat container 10. When the heat radiating part 5 is cooled, the vapor of the refrigerant 9 provided in the flat container 10 thermally connected to the heat radiating part 5 is also cooled and condensed and liquefied.
Since the volume of the refrigerant 9 condensed and liquefied here is drastically reduced as compared with the case of gas, the vapor of the refrigerant 9 whose volume has suddenly increased is transferred from the heat generating part 4 to the heat radiating part 5. It returns to the gas-liquid interface of the refrigerant 9 provided in the lower part of the flat container 10 through the liquid phase channel 12 instead of the channel 11.
Specifically, using FIG. 6, the gas phase flow path 11 in the flat container 10 is formed in a T shape like a hatched portion surrounded by a dotted line. First, in the gas phase flow path 11a provided in the central portion of the flat container 10 so as to extend in the vertical direction, the vapor of the refrigerant 9 boiled by the heating element 4 passes through the gas phase flow path 11a and reaches the upper portion of the flat container 10. Carried.
The vapor | steam of the refrigerant | coolant 9 conveyed to the upper part of the flat container 10 is condensed and liquefied in the gaseous-phase flow path 11b in which the thermal radiation part 5 is provided. And the liquefied condensate is carried to the lower part of the flat container 10 from the liquid phase flow path 12 provided in the both sides of the gaseous-phase flow path 11a.
[Explanation of Effects] Next, the effects of this embodiment will be described.
Since the flat container 10 includes the concavo-convex structure 6 on the first flat plate 2 and the second flat plate 3, the cross-sectional secondary moment in the deformation direction can be increased. As a result, the deformation of the flat container 10 due to the boiling of the refrigerant 9 and the rapid increase in volume can be prevented.
At the same time, due to the above configuration, the vapor phase flow path 11 in which the vapor of the refrigerant 9 whose volume has been increased by boiling is carried to the heat radiating section 5 and the condensate of the refrigerant 9 whose volume has been reduced by the condensation are flat plate containers. The liquid phase flow path 12 which flows to the gas-liquid interface located in the lower part of 10 can be formed.
Moreover, the flat container 10 can change a cross-sectional area in the thickness direction by providing the uneven structure 6 in the 1st flat plate 2 and the 2nd flat plate 3. As a result, it is not necessary to provide a partition plate or channel fins as compared with the structure in which the flat channel width is changed, so that the vapor of the refrigerant 9 boiled by the heat generated by the heating element 4 is transferred to the upper portion of the flat container 10. It is possible to easily form the gas phase channel 11 for transporting to the bottom and the liquid phase channel 12 for transporting the refrigerant 9 condensed and liquefied in the heat dissipating part 5 to the lower part of the flat container 10.
As a result, the flat container 10 can be prevented from being deformed by the internal pressure of the refrigerant 9 without increasing the weight of the cooling device 1. Further, by preventing deformation of the flat container 10, a cooling cycle of boiling cooling is performed in which the vapor of the refrigerant 9 that has received and boiled the heat generated by the heating element 4 is cooled through the heat radiating unit 5 and liquefied again. The cooling performance can be improved.
[Third Embodiment] Next, a third embodiment will be described in detail with reference to the drawings. FIG. 7 is a perspective view of the cooling device 1 in the present embodiment, and FIGS. 8 and 9 are cross-sectional views.
[Description of Structure] In the flat container 10 of the cooling device 1 in the present embodiment, as shown in FIG. 8, the concave portion 6a provided in the first flat plate 2 and the concave portion 6a provided in the second flat plate 3 are joined. ing. Other structures and connection relationships are the same as in the first embodiment, and the heating element 4 and the heat radiating part 5 are connected and used.
The cooling device 1 in the present embodiment includes a flat container 10 having a box shape and having a sealed space 8 therein. The cooling device 1 is configured by assembling the first flat plate 2 and the second flat plate 3. The peripheral part of the 1st flat plate 2 and the peripheral part of the 2nd flat plate 3 are connected by welding, brazing, etc., for example. In addition, the joint which is a connection location of the 1st flat plate 2 and the 2nd flat plate 3 is good also as an airtight structure sealed with resin, such as silicone rubber, so that water and dust may not enter from the outside. The material of the flat container 10 is made of a material having high thermal conductivity such as copper or aluminum.
At least one of the first flat plate 2 and the second flat plate 3 has a concavo-convex structure 6 including a concave portion 6a and a convex portion 6b. The uneven structure 6 is formed by pressing the first flat plate 2 and the second flat plate 3 against a processing member such as a mold. In addition, the recessed part 6a is a shape which deform | transformed toward the inner side from the outer side of the flat container 10, and the convex part 6b is a shape which deform | transformed toward the outer side from the inner side of the flat container 10. FIG.
A hollow sealed space 8 is formed inside the flat container 10 by connecting the first flat plate 2 provided with the concavo-convex structure 6 and the second flat plate 3 in an overlapping manner. A refrigerant 9 is provided in the sealed space 8. The internal pressure in the sealed space 8 inside the flat container 10 maintains the saturated vapor pressure in a state where the pressure is reduced by a pump or the like.
The heating element 4 is thermally connected to the outer surface of the flat container 10 through an adhesive having high thermal conductivity such as thermal conductive grease. And the heat generating body 4 is attached on the convex part 6b of the 1st flat plate 2 or the 2nd flat plate 3. FIG.
Similarly, the heat radiating portion 5 is thermally connected to the outer surface of the flat container 10 through an adhesive having high thermal conductivity such as thermal conductive grease. Not only this but it is good also as fixing with a volt | bolt etc. The heat dissipating part 5 is mounted on the first flat plate 2 or the convex part 6 b of the second flat plate 3. The heat dissipating part 5 is not particularly limited as long as it has a fin shape, a large surface area, and a material having high thermal conductivity such as copper or aluminum.
As shown in FIG. 8, the gas phase channel 11 and the liquid phase channel 12 are regions where the convex portions 6 b formed on the first flat plate 2 and the second flat plate 3 face each other. The recesses 6a formed in the first flat plate 2 and the second flat plate 3 are joined to each other by brazing or welding. The area in the vertical cross section of the gas phase channel 11 is configured to be larger than the area in the cross section of the liquid phase channel 12.
A region where the concave portions 6 a formed in the first flat plate 2 and the second flat plate 3 are joined is referred to as a joint portion 13. The junction 13 is provided between the gas phase channel 11 and the liquid phase channel 12.
At least one each of the gas phase channel 11 and the liquid phase channel 12 is provided, and is formed by extending in the vertical direction. The heating element 4 is connected to at least one protrusion 6 b of the first flat plate 2 or the second flat plate 3 that forms the gas phase flow path 11. The heating element 4 and the flat container 10 are thermally connected via a thermally conductive grease.
The liquid phase flow path 12 is connected to gas phase flow paths 11 b provided at both upper and lower ends of the flat container 10. The heat radiating part 5 is provided in the region where the liquid phase flow path 12 and the gas phase flow path 11b are connected at the upper end of the flat container 10. On the other hand, at a place other than the upper and lower end portions of the flat container 10, the joint portion 13 is provided between the gas phase flow channel 11 a and the liquid phase flow channel 12 to partition the both.
As shown in FIG. 9, a gas phase channel 11 a formed by extending in the vertical direction is provided at the center of the flat container 10, and the joint portion 13 is sandwiched between both sides of the gas phase channel 11 a. A liquid phase channel 12 formed by stretching is provided. The gas phase channel 11 and the liquid phase channel 12 are connected to each other at the upper and lower ends of the flat container 10. In addition, the gas phase flow path 11 in the flat container 10 is formed in a T shape like a hatched portion surrounded by a dotted line.
[Description of Functions and Effects] Next, functions and effects of this embodiment will be described.
The flat container 10 composed of the first flat plate 2 and the second flat plate 3 is made of a material having high thermal conductivity, and is thermally connected to the heating element 4 via thermal conductive grease. Therefore, the heat generated by the heating element 4 is transmitted to the refrigerant 9 provided inside the flat container 10 through the flat container 10.
Note that the gas-liquid interface of the refrigerant 9 provided in the sealed space 8 inside the flat container 10 is higher than the height at which the heating element 4 is attached, so that the entire sealed space 8 is not filled with the refrigerant 9. The amount of 9 is adjusted. That is, the gas-liquid interface of the refrigerant 9 is located between the heat radiating portion 5 and the heating element 4.
And the refrigerant | coolant 9 boils by receiving the heat which the heat generating body 4 generate | occur | produces. The vapor | steam of the refrigerant | coolant 9 which generate | occur | produced when the refrigerant | coolant 9 provided in the sealed space 8 of the flat container 10 boiled is conveyed to the upper part of the flat container 10 by the buoyancy by the difference in gas-liquid density.
In general, when the refrigerant 9 undergoes a phase change from a liquid to a gas, there is a possibility that the volume rapidly increases and the internal pressure rises to deform the shape of the flat container 10. However, according to the present embodiment, since the concavo-convex structure 6 is formed on the first flat plate 2 and the second flat plate 3 constituting the flat container 10, it is possible to increase the cross-sectional second moment in the deformation direction. As a result, the rigidity can be increased without increasing the thickness of the first flat plate 2 and the second flat plate 3, and the flat container 10 can be prevented from being deformed.
Moreover, the flat container 10 of the cooling device 1 according to the present embodiment is provided with the uneven structure 6 on the first flat plate 2 and the second flat plate 3, so that the vapor of the refrigerant 9 is transported to the upper part of the flat container 10. It is possible to form the path 11 and the liquid phase channel 12 that conveys the condensate obtained by liquefying the vapor of the refrigerant 9 in the heat radiating unit 5 to the lower part of the flat container 10.
The gas phase channel 11 and the liquid phase channel 12 are connected to each other at both upper and lower ends of the flat container 10, and the gas phase channel 11 and the liquid phase flow are formed by using the joint 13 where the recesses 6a are joined as a partition member. It is provided between the road 12.
More specifically, the gas phase channel 11 and the liquid phase channel 12 are regions sandwiched between the convex portions 6 b of the first flat plate 2 and the second flat plate 3. On the other hand, the joint portion 13 in which the concave portion 6a of the first flat plate 2 and the concave portion 6a of the second flat plate 3 are joined by brazing, welding, or the like does not require a new component, and does not require a new component. The road 12 can be partitioned.
Furthermore, by setting it as the structure which joined the recessed part 6a provided in the 1st flat plate 2 and the 2nd flat plate 3, the 1st flat plate 2 and the 2nd flat plate 3 are joined not only in an outer edge part but in the junction part 13. FIG. . Therefore, a joining location increases and the intensity | strength of the flat container 10 can further be increased compared with 1st, 2nd embodiment.
As a result, it is possible to prevent the internal pressure from rising due to the phase change of the refrigerant 9 from the liquid to the gas and the volume abruptly increasing, thereby deforming the shape of the flat container 10. That is, the rigidity can be further increased without increasing the thickness of the first flat plate 2 and the second flat plate 3, and the flat container 10 can be prevented from being deformed.
While the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.
This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2011-151062 for which it applied on July 7, 2011, and takes in those the indications of all here.

　１　冷却装置
　２　第１平板
　３　第２平板
　４　発熱体
　５　放熱部
　６　凹凸構造
　６ａ　凹部
　６ｂ　凸部
　８　密閉空間
　９　冷媒
　１０　平板状容器
　１１　気相流路
　１２　液相流路
　１３　接合部 DESCRIPTION OF SYMBOLS 1 Cooling device 2 1st flat plate 3 2nd flat plate 4 Heat generating body 5 Heat radiating part 6 Concave-convex structure 6a Concave part 6b Convex part 8 Sealed space 9 Refrigerant 10 Flat container 11 Gas phase flow path 12 Liquid phase flow path 13 Joint part

Claims (17)

　第１平板と第２平板とを備えた平板型容器と、
　前記平板型容器内に封入された冷媒とを有し、
　前記第１平板と前記第２平板の少なくとも一方に凹凸構造を備える冷却装置。 A flat container comprising a first flat plate and a second flat plate;
Having a refrigerant sealed in the flat plate container,
A cooling device comprising an uneven structure on at least one of the first flat plate and the second flat plate. 　前記第１平板は、第１凸部と、第１凹部とを備え、
　前記第２平板は、第２凸部と、第２凹部とを備え、
　前記第１凸部と、前記第１凸部と対向して配置された前記第２凸部とにより構成される第１流路と、
　前記第１凹部と、前記第１凹部と対向して配置された前記第２凹部とにより構成される第２流路とを備える請求項１に記載の冷却装置。 The first flat plate includes a first convex portion and a first concave portion,
The second flat plate includes a second convex portion and a second concave portion,
A first flow path constituted by the first convex portion and the second convex portion disposed to face the first convex portion;
The cooling device according to claim 1, further comprising: a second flow path configured by the first recess and the second recess disposed to face the first recess. 　前記第１流路は、前記第１平板および前記第２平板に垂直な断面における面積が、前記第２流路の前記断面における面積よりも大きく構成されている請求項２に記載の冷却装置。 The cooling device according to claim 2, wherein the first flow path is configured such that an area in a cross section perpendicular to the first flat plate and the second flat plate is larger than an area in the cross section of the second flow path. 　前記第１流路は、前記第１平板または前記第２平板を通して伝達される熱により気化した前記冷媒の蒸気が流動し、
　前記第２流路は、前記冷媒の蒸気が放熱して凝縮した液相の冷媒が流動する請求項２または３に記載の冷却装置。 In the first flow path, the vapor of the refrigerant vaporized by heat transmitted through the first flat plate or the second flat plate flows,
4. The cooling device according to claim 2, wherein in the second flow path, a liquid-phase refrigerant in which the refrigerant vapor is dissipated and condensed is flowed. 　前記第１凸部と前記第２凸部の少なくとも一方に、発熱体および放熱部がそれぞれ接続されている請求項２から４のいずれか一項に記載の冷却装置。 The cooling device according to any one of claims 2 to 4, wherein a heating element and a heat radiating portion are connected to at least one of the first convex portion and the second convex portion, respectively. 　前記第１流路と、前記第２流路とが隣接して形成されている請求項２から５のいずれか一項に記載の冷却装置。 The cooling device according to any one of claims 2 to 5, wherein the first flow path and the second flow path are formed adjacent to each other. 　前記第１平板は、第１凸部と、第１凹部とを備え、
　前記第２平板は、第２凸部と、第２凹部とを備え、
　前記第１凹部と前記第２凹部とが接続した接合部と、
　第１流路、および第２流路は、前記第１凸部と、前記第１凸部と対向して配置された前記第２凸部とにより構成され、
　前記第１流路を構成する前記第１凸部、および前記第２凸部の少なくとも一方に発熱体が設けられている請求項１に記載の冷却装置。 The first flat plate includes a first convex portion and a first concave portion,
The second flat plate includes a second convex portion and a second concave portion,
A joint where the first recess and the second recess are connected;
A 1st flow path and a 2nd flow path are comprised by the said 1st convex part and the said 2nd convex part arrange | positioned facing the said 1st convex part,
The cooling device according to claim 1, wherein a heating element is provided on at least one of the first convex portion and the second convex portion constituting the first flow path. 　前記第１流路は、前記第１平板および前記第２平板に垂直な断面における面積が、前記第２流路前記断面における面積よりも大きく構成されている請求項２に記載の冷却装置。 The cooling device according to claim 2, wherein the first flow path is configured such that an area in a cross section perpendicular to the first flat plate and the second flat plate is larger than an area in the cross section of the second flow path. 　前記接合部は、ロウ付けにより接合している請求項７に記載の筺体。 The casing according to claim 7, wherein the joint is joined by brazing. 　前記接合部は、溶接により接合している請求項７に記載の筺体。 The casing according to claim 7, wherein the joint is joined by welding. 　前記冷媒の気液界面は、前記発熱体と前記放熱部との間に設けられている請求項５から１０のいずれか一項に記載の筺体。 The housing according to any one of claims 5 to 10, wherein a gas-liquid interface of the refrigerant is provided between the heat generating body and the heat radiating portion. 　前記凹凸構造は、押圧加工により形成される請求項１から１１のいずれか一項に記載の筺体。 The casing according to any one of claims 1 to 11, wherein the uneven structure is formed by pressing. 　前記第１平板および前記第２平板の材料は、銅、またはアルミニウムのどれか１つである請求項１から１２のいずれか一項に記載の冷却装置。 The cooling device according to any one of claims 1 to 12, wherein a material of the first flat plate and the second flat plate is one of copper and aluminum. 　前記冷媒の材料は、ハイドロフルオロカーボン、ハイドロフルオロエーテル、および水のいずれか１つである請求項１から１３のいずれか一項に記載の冷却装置。 The cooling device according to any one of claims 1 to 13, wherein a material of the refrigerant is any one of hydrofluorocarbon, hydrofluoroether, and water. 　前記放熱部は、フィン形状である請求項５に記載の冷却装置。 The cooling device according to claim 5, wherein the heat radiating portion has a fin shape. 　前記平板状容器の内圧は、減圧されている請求項１から１５のいずれか一項に記載の冷却装置。 The cooling device according to any one of claims 1 to 15, wherein an internal pressure of the flat container is reduced. 　第１平板に加圧部材を押圧することにより第１凸部と、第１凹部とを形成し、
　第２平板に加圧部材を押圧することにより第２凸部と、第２凹部とを形成し、
　前記第１凸部と前記第２凸部とが対向し、
　前記第１凹部と前記第２凹部とが対向するように前記第１平板と第２平板とを配置し、
　前記第１平板の周辺部と前記第２平板の周辺部とを接続する冷却装置の製造方法。 By pressing the pressure member on the first flat plate, the first convex portion and the first concave portion are formed,
By pressing a pressure member on the second flat plate, a second convex portion and a second concave portion are formed,
The first convex portion and the second convex portion are opposed to each other,
The first flat plate and the second flat plate are arranged so that the first concave portion and the second concave portion face each other,
The manufacturing method of the cooling device which connects the peripheral part of the said 1st flat plate, and the peripheral part of the said 2nd flat plate.
PCT/JP2012/066452 2011-07-07 2012-06-21 Cooling device and method for manufacturing same Ceased WO2013005622A1 (en)

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