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WO2013000574A1 - Prepreg, method for producing a prepeg, method for producing a printed circuit board element and printed circuit board element - Google Patents

Prepreg, method for producing a prepeg, method for producing a printed circuit board element and printed circuit board element Download PDF

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Publication number
WO2013000574A1
WO2013000574A1 PCT/EP2012/002717 EP2012002717W WO2013000574A1 WO 2013000574 A1 WO2013000574 A1 WO 2013000574A1 EP 2012002717 W EP2012002717 W EP 2012002717W WO 2013000574 A1 WO2013000574 A1 WO 2013000574A1
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
layer
circuit board
printed circuit
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/002717
Other languages
German (de)
French (fr)
Inventor
Bernfried Fleiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schweizer Electronic AG
Original Assignee
Schweizer Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schweizer Electronic AG filed Critical Schweizer Electronic AG
Publication of WO2013000574A1 publication Critical patent/WO2013000574A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density

Definitions

  • a prepreg a method for producing a prepreg, a method for producing a printed circuit board element and printed circuit board element
  • the present invention relates to a prepreg for use in the manufacture of printed circuit board elements, a process for producing such a prepreg, and a process for producing a printed circuit board element and a printed circuit board element.
  • Circuit boards with inner layers are known from the prior art, for example, from EP 1 639 869 Bl and DE 20 2007 003 815 Ul.
  • Prepregs for use in the manufacture of printed circuit boards or circuit board elements are also known, for example from US 2010/0044087 AI.
  • a prepreg with the features of claim 1 a method for producing a prepreg with the features of claim 5, a method for producing a printed circuit board element having the feature
  • the idea of the invention is no longer to design prepregs as generally customary as a homogeneous material web, but to provide at least one spacer element in the prepreg.
  • the prepreg layer according to the invention may comprise at least two spacer elements of different thickness.
  • the spacer elements according to the invention may for example be designed as so-called "resin rivets", ie it may be sections in the prepreg layer, which consist of already precompressed resin.
  • the resin rivets may be made of the same material as the remaining prepreg layer (or of the material from which the prepreg layer will be made after compression).
  • the resin rivets can be formed separately and introduced into defined areas of the prepreg layer.
  • the Abstandshalterlemia or resin rivets can be generated by selectively pre-pressing defined portions of the prepreg layer of the material of the prepreg layer. After pre-pressing, the resin rivets produced in this way can be cured.
  • One possible application of the prepreg layer according to the invention is in the production of printed circuit board elements.
  • a prepreg according to the invention having at least one spacer element, a desired distance between the inner layer region and a cover layer can be set in accordance with the thickness of the spacer element. This ensures the formation of Vias desired defined length for contacting the at least one inner layer region.
  • the invention can, for example, be used in printed circuit board elements which have at least two inner layer regions of different thickness and in which the goal is to contact these inner layers with vias of the same length, whereby these vias are to terminate on one plane with a covering layer covering the inner layers, be used.
  • FIG. 1 shows a side sectional view of a prepreg with spacer element according to the invention.
  • FIG. 2 shows a side sectional view of a printed circuit board element produced using a prepreg according to the invention.
  • FIG. 1 shows a detail of a prepreg 21 according to the invention in a side sectional view.
  • the prepreg 21 comprises a prepreg layer 20 made of conventional material known to those skilled in the art which liquefies under pressure and comprises at least one resin component and at least one hardener component.
  • a prepreg layer 20 made of conventional material known to those skilled in the art which liquefies under pressure and comprises at least one resin component and at least one hardener component.
  • the prepreg 21 includes a spacer member 24 formed in the prepreg layer 20.
  • a spacer element 24 of the prepreg 21 is shown, which however may still have further spacer elements.
  • the spacer element 24 has a thickness d which is smaller than the thickness of the prepreg layer 20.
  • the spacer element 24 may, for example, consist of already precompressed resin.
  • One possibility of producing the spacer element 24 according to the invention is to subject a defined section 26 of the prepreg layer 20 to precompression. In the process, the defined section 26 is deliberately pressurized and if necessary also heated in order to compress it to a desired thickness d. Subsequently, the thus compressed portion is cured to form the spacer member 24.
  • the prepreg 21 may - as already mentioned - have several such spacer elements.
  • the spacer elements may also have different thicknesses.
  • different thicknesses of a printed circuit board multilayer structure can be compensated or represented in a defined manner.
  • 2 shows a side sectional view of a multi-layer structure of a printed circuit board element 10.
  • the printed circuit board element 10 comprises a double-sided electrically conductive base layer 12 having recesses, in the inner layer areas 16.1, 16.2 are introduced. While the base layer 12 has a uniform thickness, the inner layers 16.1, 16.2 have different thicknesses.
  • the inner layers 16.1, 16.2 are arranged flush with an upper level of the base layer 12 and close together with this to a prepreg-cover layer 20 ⁇ and 13 at.
  • the vias have the same dimensions and in particular the same length (which corresponds to the thickness d of the spacer elements plus the thickness of the cover layer).
  • the inner layers 16.1, 16.2 are embedded in a resin layer 20 ⁇ .
  • the resin layer 20 ⁇ has different thicknesses and compensates for the differences in level resulting from the different thicknesses of the electrically conductive layer 12 and the inner layers 16.1, 16.2.
  • the construction described is achieved according to the invention in a simple manner by using a prepreg 21 according to the invention with spacer elements 22, 24.
  • the different distances to the opposite copper layer 14 arise during the pressing process in that a fixed distance is established by the spacers and the distances to the copper layer 14 result as a resultant.
  • the multi-layer construction is then subjected to a compression pressure to compress the prepreg and liquefy until the spacer thicknesses are reached. Thereafter, the structure is cured.
  • a first inner layer area (16.1) has a first thickness and a second inner layer area (16.2) has a second thickness, the first thickness is greater than the second thickness, the inner layers (16.1, 16.2 ) are contacted via vias (18) in a cover layer (13) covering the electrically conductive layer (12) and the at least one inner layer region (16.1, 16.2), the lengths of the vias (18) contacting the at least two inner layer regions being equal and on one Close level with the cover layer (13), and the at least two inner layer regions (16.1, 16.2) are pressed with a resin layer (21).
  • the spacer elements 22, 24 may have different thicknesses (not shown), for example for creating vias of different lengths, defined by the different thicknesses of the spacer elements (corresponding to the above description thickness of a spacer element plus thickness of the cover layer). with uniform cover layer.
  • thicknesses not shown
  • the spacer elements may have different thicknesses (not shown), for example for creating vias of different lengths, defined by the different thicknesses of the spacer elements (corresponding to the above description thickness of a spacer element plus thickness of the cover layer). with uniform cover layer.
  • "Pins" made of compressed resin or other suitable material can also be prefabricated and introduced as spacer elements at defined locations / sections in the prepreg layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a prepreg (21) for use in the production of printed circuit boards, said prepreg comprising one or more spacer elements (22, 24).

Description

Prepreg, Verfahren zum Herstellen eines Prepregs, Verfahren zum Herstellen eines Leiterplattenelements sowie Leiterplattenelement  A prepreg, a method for producing a prepreg, a method for producing a printed circuit board element and printed circuit board element

Technisches Gebiet [0001] Die vorliegende Erfindung betrifft ein Prepreg zur Verwendung bei der Herstellung von Leiterplatten bzw. Leiterplattenelementen, ein Verfahren zum Herstellen eines derartigen Prepregs sowie ein Verfahren zum Herstellen eines Leiterplattenelements und ein Leiterplattenelement. Beschreibung des Standes der Technik Technical Field The present invention relates to a prepreg for use in the manufacture of printed circuit board elements, a process for producing such a prepreg, and a process for producing a printed circuit board element and a printed circuit board element. Description of the Prior Art

[0002] Aus dem Stand der Technik sind Leiterplatten mit Innenlagen bekannt, so beispielsweise aus der EP 1 639 869 Bl und der DE 20 2007 003 815 Ul. Circuit boards with inner layers are known from the prior art, for example, from EP 1 639 869 Bl and DE 20 2007 003 815 Ul.

[0003] Prepregs zur Verwendung bei der Herstellung von Leiterplatten bzw. Leiterplattenelementen sind ebenfalls bekannt, so beispielsweise aus der US 2010/0044087 AI. Prepregs for use in the manufacture of printed circuit boards or circuit board elements are also known, for example from US 2010/0044087 AI.

Zusammenfassung der Erfindung Summary of the invention

[0004] Erfindungsgemäß wird ein Prepreg mit den Merkmalen des Anspruchs 1, ein Verfahren zum Herstellen eines Prepegs mit den Merkmalen des Anspruchs 5, ein Verfahren zum Herstellen eines Leiterplattenelements mit dem Merkmal According to the invention, a prepreg with the features of claim 1, a method for producing a prepreg with the features of claim 5, a method for producing a printed circuit board element having the feature

BESTÄTIGUNGSKOPIE des Anspruchs 7 sowie ein Leiterplattenelement mit den Merkmalen des Anspruchs 9 vorgeschlagen. CONFIRMATION COPY of claim 7 and a printed circuit board element with the features of claim 9 proposed.

[0005] Der erfindungsgemäße Gedanke besteht darin, Prepregs nicht mehr wie im allgemeinen üblich als homogene Materialbahn auszugestalten, sondern in dem Prepreg mindestens ein Abstandshalterelement vorzusehen. The idea of the invention is no longer to design prepregs as generally customary as a homogeneous material web, but to provide at least one spacer element in the prepreg.

[0006] Dies ermöglicht es, beim Verpressen des Leiter- plattenmehrschichtaufbaus nicht mehr den Verpressdruck als Verpressmaß zu benutzen, sondern eine abstandsgesteuerte Verpressung vorzunehmen. Mit anderen Worten bedeutet dies, dass mit einem erfindungsgemäßen Prepreg ein Verpressen so lange erfolgt, bis die gesamte Prepreg-Schicht auf die Dicke des Abstandshalters zusammengepresst wurde. This makes it no longer possible to use the compression pressure as a pressing measure when pressing the printed circuit board multilayer structure, but to carry out a distance-controlled pressing. In other words, this means that pressing with a prepreg according to the invention is carried out until the entire prepreg layer has been compressed to the thickness of the spacer.

[0007] Die erfindungsgemäße Prepreg-Schicht kann Ab- Wandlung mindestens zwei Abstandshalterelemente unterschiedlicher Dicke umfassen. The prepreg layer according to the invention may comprise at least two spacer elements of different thickness.

[0008] Die Abstandshalterelemente können erfindungsgemäß beispielsweise als sogenannte "Harznieten" ausgeführt sein, d.h. es kann sich um Abschnitte in der Prepreg- Schicht handeln, die aus bereits vorkomprimiertem Harz bestehen. Die Harznieten können aus dem gleichen Material wie die restliche Prepreg-Schicht bestehen (bzw. aus dem Material, aus dem die Prepreg-Schicht nach dem Verpressen bestehen wird) . [0009] Die Harznieten können separat ausgebildet werden und in definierte Bereiche der Prepreg-Schicht eingebracht werden. [0010] Alternativ können die Abstandshalterlelemente bzw. Harznieten durch selektives Vorverpressen definierter Abschnitte der Prepreg-Schicht aus dem Material der Prepreg-Schicht erzeugt werden. Nach dem Vorverpressen kön- nen die derart erzeugten Harznieten ausgehärtet werden. The spacer elements according to the invention may for example be designed as so-called "resin rivets", ie it may be sections in the prepreg layer, which consist of already precompressed resin. The resin rivets may be made of the same material as the remaining prepreg layer (or of the material from which the prepreg layer will be made after compression). The resin rivets can be formed separately and introduced into defined areas of the prepreg layer. Alternatively, the Abstandshalterlelemente or resin rivets can be generated by selectively pre-pressing defined portions of the prepreg layer of the material of the prepreg layer. After pre-pressing, the resin rivets produced in this way can be cured.

[0011] Eine mögliche Anwendung der erfindungsgemäßen Prepreg-Schicht liegt bei der Herstellung von Leiterplattenelementen. Durch Verwendung eines erfindungsgemäßen Prepregs mit mindestens einem Abstandshalterelement kann ein gewünschter Abstand zwischen Innenlagenbereich und einer Deckschicht entsprechend der Dicke des Abstandshalter- elements eingestellt werden. Dies gewährleistet die Ausbildung von Vias gewünschter definierter Länge zur Ankontaktierung des mindestens einen Innenlagenbereichs . [0012] Die Erfindung kann bspw. in Leiterplattenelementen, die mindestens zwei Innenlagenbereiche unterschiedlicher Dicke aufweisen und bei denen das Ziel besteht, diese Innenlagen mit Vias gleicher Länge anzukontaktieren, wobei diese Vias auf einer Ebene mit einer die Innenlagen be- deckenden Deckschicht abschließen sollen, eingesetzt werden . One possible application of the prepreg layer according to the invention is in the production of printed circuit board elements. By using a prepreg according to the invention having at least one spacer element, a desired distance between the inner layer region and a cover layer can be set in accordance with the thickness of the spacer element. This ensures the formation of Vias desired defined length for contacting the at least one inner layer region. The invention can, for example, be used in printed circuit board elements which have at least two inner layer regions of different thickness and in which the goal is to contact these inner layers with vias of the same length, whereby these vias are to terminate on one plane with a covering layer covering the inner layers, be used.

[0013] Weitere Vorteile und Ausgestaltungen der Erfindung ergeben sich aus der Beschreibung und der beiliegenden Zeichnung. [0014] Es versteht sich, dass die voranstehend genannten und die nachstehend noch zu erläuternden Merkmale nicht nur in der jeweils angegebenen Kombination, sondern auch in anderen Kombinationen oder in Alleinstellung verwendbar sind, ohne den Rahmen der vorliegenden Erfindung zu verlas- sen. [0015] Die Erfindung ist zur Veranschaulichung anhand von Ausführungsbeispielen in der Zeichnung stark schematisch und nicht maßstabsgetreu dargestellt und wird im folgenden unter Bezugnahme auf die Zeichnung ausführlich be- schrieben. Further advantages and embodiments of the invention will become apparent from the description and the accompanying drawings. It is understood that the features mentioned above and those yet to be explained below can be used not only in the particular combination indicated, but also in other combinations or in isolation, without departing from the scope of the present invention. By way of example, the invention is illustrated in a highly schematic and not to scale with reference to exemplary embodiments in the drawing and will be described in detail below with reference to the drawing.

Kurzbeschreibung der Zeichnung Brief description of the drawing

[0016] [0016]

Figur 1 zeigt in seitlicher Schnittdarstellung ein erfindungsgemäßes Prepreg mit Abstandshalterelement . Figur 2 zeigt in seitlicher Schnittdarstellung ein unter Verwendung eines erfindungsgemäßen Prepregs hergestelltes Leiterplattenelement. FIG. 1 shows a side sectional view of a prepreg with spacer element according to the invention. FIG. 2 shows a side sectional view of a printed circuit board element produced using a prepreg according to the invention.

Ausführliche Beschreibung Detailed description

[0017] Figur 1 zeigt einen Ausschnitt aus einem erfin- dungsgemäßen Prepreg 21 in seitlicher Schnittdarstellung. Das Prepreg 21 umfasst eine Prepreg-Schicht 20, die aus üblichem und dem Fachmann geläufigem Material besteht, das sich unter Druck verflüssigt und mindestens eine Harzkomponente und mindestens eine Härterkomponente umfasst. Bei- spielhaft ist auf die US 2010/0044087 AI verwiesen. FIG. 1 shows a detail of a prepreg 21 according to the invention in a side sectional view. The prepreg 21 comprises a prepreg layer 20 made of conventional material known to those skilled in the art which liquefies under pressure and comprises at least one resin component and at least one hardener component. For example, reference is made to US 2010/0044087 AI.

[0018] Des weiteren umfasst das Prepreg 21 ein Abstandshalterelement 24, das in der Prepreg-Schicht 20 ausgebildet ist. In dem dargestellten Ausschnitt ist ein Abstandshalterelement 24 des Prepregs 21 dargestellt, das je- doch noch weitere Abstandshalterelemente aufweisen kann. [0019] Das Abstandshalterelement 24 weist eine Dicke d auf, die kleiner ist, als die Dicke der Prepreg-Schicht 20. Bei einer Verwendung des erfindungsgemäßen Prepregs 21 kann das Abstandshalterelement 24 somit beim Zusammenpressen bzw. Verpressen der Prepreg-Schicht 20 als „Anschlag" dienen, d.h. wenn die Prepreg-Schicht 20 auf eine Dicke entsprechend der Dicke d des Abstandshalterelements 24 zusam- mengepresst wurde, wird der Pressvorgang angehalten. Further, the prepreg 21 includes a spacer member 24 formed in the prepreg layer 20. In the illustrated detail, a spacer element 24 of the prepreg 21 is shown, which however may still have further spacer elements. The spacer element 24 has a thickness d which is smaller than the thickness of the prepreg layer 20. When using the prepreg 21 according to the invention, the spacer element 24 can thus be used as a stop when compressing the prepreg layer 20 , ie, when the prepreg layer 20 has been compressed to a thickness corresponding to the thickness d of the spacer member 24, the pressing operation is stopped.

[0020] Das Abstandshalterelement 24 kann bspw. aus be- reits vorkomprimiertem Harz bestehen. Eine Möglichkeit der Herstellung des Abstandshalterelements 24 besteht erfindungsgemäß darin, einen definierten Abschnitt 26 der Prepreg-Schicht 20 einer Vorkomprimierung zu unterziehen. Dabei wird gezielt der definierte Abschnitt 26 unter Druck gesetzt und ggf. auch erhitzt, um ihn bis auf eine gewünschte Dicke d zu komprimieren. Anschließend wird der derart komprimierte Abschnitt unter Erzeugung des Abstandshalterelements 24 ausgehärtet. The spacer element 24 may, for example, consist of already precompressed resin. One possibility of producing the spacer element 24 according to the invention is to subject a defined section 26 of the prepreg layer 20 to precompression. In the process, the defined section 26 is deliberately pressurized and if necessary also heated in order to compress it to a desired thickness d. Subsequently, the thus compressed portion is cured to form the spacer member 24.

[0021] Das Prepreg 21 kann - wie bereits erwähnt - mehrere derartige Abstandshalterelemente aufweisen. Die Abstandshalterelemente können auch unterschiedlicher Dicke aufweisen. Damit können in definierter Weise unterschiedliche Dicken eines Leiterplatten-Mehrschichtaufbaus ausgeglichen bzw. dargestellt werden. [0022] Figur 2 zeigt in seitlicher Schnittdarstellung einen Mehrschichtaufbau eines Leiterplattenelements 10. Das Leiterplattenelement 10 umfasst eine beidseitig elektrisch leitende Basisschicht 12, die Ausnehmungen aufweist, in die Innenlagenbereiche 16.1, 16.2 eingebracht sind. Während die Basisschicht 12 eine gleichförmige Dicke aufweist, haben die Innenlagen 16.1, 16.2 unterschiedliche Dicken. [0023] Die Innenlagen 16.1, 16.2 sind bündig mit einer oberen Ebene der Basisschicht 12 angeordnet und schließen gemeinsam mit dieser an eine Prepreg-Deck-Schicht 20 Λ und 13 an. Durch die Prepreg-Deck-Schicht 20 und 13 hindurch sind mehrere Vias 18 zur Ankontaktierung der Innenlagen 16.1, 16.2 vorgesehen. Die Vias haben gleiche Abmessungen und insbesondere gleiche Länge (die der Dicke d der Ab- standshalterelemente plus der Dicke der Deckschicht entspricht) . [0024] Die Innenlagen 16.1, 16.2 sind in eine Harzschicht 20 Λ eingebettet. Die Harzschicht 20 Λ weist unterschiedliche Dicken auf und gleicht die durch die unterschiedlichen Dicken der elektrisch leitenden Schicht 12 und der Innenlagen 16.1, 16.2 entstandenen Niveauunterschiede aus. The prepreg 21 may - as already mentioned - have several such spacer elements. The spacer elements may also have different thicknesses. Thus, different thicknesses of a printed circuit board multilayer structure can be compensated or represented in a defined manner. 2 shows a side sectional view of a multi-layer structure of a printed circuit board element 10. The printed circuit board element 10 comprises a double-sided electrically conductive base layer 12 having recesses, in the inner layer areas 16.1, 16.2 are introduced. While the base layer 12 has a uniform thickness, the inner layers 16.1, 16.2 have different thicknesses. The inner layers 16.1, 16.2 are arranged flush with an upper level of the base layer 12 and close together with this to a prepreg-cover layer 20 Λ and 13 at. Through the prepreg cover layer 20 and 13 through a plurality of vias 18 are provided for Ankontaktierung the inner layers 16.1, 16.2. The vias have the same dimensions and in particular the same length (which corresponds to the thickness d of the spacer elements plus the thickness of the cover layer). The inner layers 16.1, 16.2 are embedded in a resin layer 20 Λ . The resin layer 20 Λ has different thicknesses and compensates for the differences in level resulting from the different thicknesses of the electrically conductive layer 12 and the inner layers 16.1, 16.2.

[0025] Der beschriebene Aufbau wird erfindungsgemäß auf einfache Art und Weise durch Verwendung eines erfindungsgemäßen Prepregs 21 mit Abstandshalterelementen 22, 24 erzielt. Die unterschiedlichen Abstände zur gegenüberlie- genden Kupferschicht 14 entstehen beim Verpressvorgang dadurch, dass sich eine fester Abstand durch die Abstandshalter einstellt und die Abstände zur Kupferschicht 14 sich als Resultierende ergeben. The construction described is achieved according to the invention in a simple manner by using a prepreg 21 according to the invention with spacer elements 22, 24. The different distances to the opposite copper layer 14 arise during the pressing process in that a fixed distance is established by the spacers and the distances to the copper layer 14 result as a resultant.

[0026] Der Mehrschichtaufbau wird dann einem Verpressdruck ausgesetzt, um das Prepreg zusammenzupressen und zu verflüssigen, bis die Abstandshalterdicken erreicht sind. Danach wird die Struktur ausgehärtet. The multi-layer construction is then subjected to a compression pressure to compress the prepreg and liquefy until the spacer thicknesses are reached. Thereafter, the structure is cured.

[0027] In Leiterplattenelement (10) mit einer beidseitig elektrisch leitenden Basisschicht (12) und mindestens zwei in Ausnehmungen der Basisschicht angeordneten Innenla- genbereichen (16.1, 16.2), wobei ein erster Innenlagenbe- reich (16.1) eine erste Dicke aufweist und ein zweiter In- nenlagenbereich (16.2) eine zweite Dicke aufweist, die erste Dicke größer ist als die zweite Dicke, die Innenlagen (16.1, 16.2) über Vias (18) in einer die elektrisch leitende Schicht (12) und den mindestens einen Innenlagenbereich (16.1, 16.2) abdeckenden Deckschicht (13) ankontaktiert sind, die Längen der die mindestens zwei Innenlagenbereiche ankontaktierenden Vias (18) gleich sind und auf einer Ebene mit der Deckschicht (13) abschließen, und die mindestens zwei Innenlagenbereiche (16.1, 16.2) mit einer Harzschicht (21) verpresst sind. In printed circuit board element (10) with a base layer (12) which is electrically conductive on both sides and at least two inner layers arranged in recesses of the base layer A first inner layer area (16.1) has a first thickness and a second inner layer area (16.2) has a second thickness, the first thickness is greater than the second thickness, the inner layers (16.1, 16.2 ) are contacted via vias (18) in a cover layer (13) covering the electrically conductive layer (12) and the at least one inner layer region (16.1, 16.2), the lengths of the vias (18) contacting the at least two inner layer regions being equal and on one Close level with the cover layer (13), and the at least two inner layer regions (16.1, 16.2) are pressed with a resin layer (21).

[0028] In Abwandlung können die Abstandshalterelemente 22, 24 unterschiedliche Dicken aufweisen (nicht darge- stellt) , bspw. zur Erzeugung von Vias unterschiedlicher Länge, definiert durch die unterschiedlichen Dicken der Abstandshalterelemente (entsprechend der voranstehenden Beschreibung Dicke eines Abstandshalterelements plus Dicke der Deckschicht) bei gleichförmiger Deckschicht. [0029] Selbstverständlich gibt es mehrere Möglichkeiten, ein erfindungsgemäßes Prepreg herzustellen. Bspw. können „Stifte" aus komprimiertem Harz oder auch aus anderem geeigneten Material auch vorgefertigt und als Abstandshalterelemente an definierten Stellen/Abschnitten in die Prepreg-Schicht eingebracht werden. Alternatively, the spacer elements 22, 24 may have different thicknesses (not shown), for example for creating vias of different lengths, defined by the different thicknesses of the spacer elements (corresponding to the above description thickness of a spacer element plus thickness of the cover layer). with uniform cover layer. Of course, there are several ways to prepare an inventive prepreg. For example. "Pins" made of compressed resin or other suitable material can also be prefabricated and introduced as spacer elements at defined locations / sections in the prepreg layer.

Claims

Patentansprüche claims 1. Prepreg (21) zur Verwendung bei der Herstellung von Leiterplatten, das ein oder mehrere Abstandshalterelemente (22, 24) umfasst. A prepreg (21) for use in the manufacture of circuit boards comprising one or more spacer elements (22, 24). 2. Prepreg (21) nach Anspruch 1, dessen mindestens ein Abstandshalterelement (22, 24) aus bereits komprimiertem Harz gebildet ist. 2. Prepreg (21) according to claim 1, wherein at least one spacer element (22, 24) is formed from already compressed resin. 3. Prepreg (21) nach Anspruch 2, dessen mindestens ein Abstandshalterelement (22, 24) durch selektives Vorverpressen mindestens eines Abschnitts (26) des Prepregs (20) gebildet ist. 3. prepreg (21) according to claim 2, wherein at least one spacer element (22, 24) by selective pre-pressing at least a portion (26) of the prepreg (20) is formed. 4. Prepreg (21) nach einem der Ansprüche 1 bis 3, das mindestens zwei Abstandshalterelemente (22,24) unterschiedlicher Länge umfasst. 4. prepreg (21) according to any one of claims 1 to 3, comprising at least two spacer elements (22,24) of different lengths. 5. Verfahren zum Herstellen eines Prepregs (21) zur Verwendung in der Leiterplattenherstellung, mit den folgenden Schritten : A method of making a prepreg (21) for use in circuit board manufacture, comprising the steps of: - Bereitstellen einer Prepreg-Schicht (20), Providing a prepreg layer (20), - Vorverpressen mindestens eines Abschnitts (26) der - Pre-pressing at least a portion (26) of the Prepreg-Schicht (20), bis dieser Abschnitt (26) eine gewünschte Dicke (d) aufweist, - Aushärten des mindestens eines vorverpressten Abschnitts (26) zur Ausbildung als Abstandshalterele- ment (22, 24) . Prepreg layer (20) until said section (26) has a desired thickness (d), - Curing the at least one pre-compressed portion (26) for formation as a spacer element (22, 24). 6. Verfahren nach Anspruch 5, bei dem mindestens zwei Abschnitte der Prepreg-Schicht (20) auf zwei unterschiedliche Dicken vorverpresst und ausgehärtet werden. 6. The method of claim 5, wherein at least two portions of the prepreg layer (20) are pre-pressed to two different thicknesses and cured. 7. Verfahren zum Herstellen eines Leiterplattenelements (10) mit mindestens einem Innenlagenbereich (16.1, 16.2), mit den folgenden Schritten: 7. A method for producing a printed circuit board element (10) having at least one inner layer region (16.1, 16.2), comprising the following steps: - Bereitstellen einer Kupferfolie (14), Providing a copper foil (14), - Auflegen eines Schichtaufbaus mit mindestens einer Basisschicht (12) und mindestens einem in diese Basisschicht (12) eingefügten Innenlagenbereich (16.1, 16.2) ,  Applying a layer structure with at least one base layer (12) and at least one inner layer region (16.1, 16.2) inserted into this base layer (12), - Auflegen einer Prepreg-Schicht (20) mit mindestens einem in der Prepreg-Schicht (20) enthaltenen Ab- standshalterelement (22, 24), derart dass das mindestens eine Abstandshalterelement (22, 24) über dem mindestens einen Innenlagenbereich (16.1, 16.2) zu liegen kommt,  - Laying a prepreg layer (20) with at least one spacer element (22, 24) contained in the prepreg layer (20) such that the at least one spacer element (22, 24) over the at least one inner layer region (16.1, 16.2 ) comes to rest - Auflegen einer weiteren Kupferfolie (13),  - placing another copper foil (13), - Verpressen der Schichtanordnung bis die Prepreg- - pressing the layer arrangement until the prepreg Schicht auf die Höhe des auf dem mindestens einen Innenlagenbereich (16.1, 16.2) aufsetzenden Abstands- halterelements zusammengepresst ist. Layer is compressed to the height of the on the at least one inner layer region (16.1, 16.2) placing spacer holder element. 8. Leiterplattenelement, das nach dem Verfahren gemäß An spruch 7 hergestellt ist. 8. printed circuit board element, which is prepared by the method according to claim 7 at. 9. Leiterplattenelement (10) mit einer beidseitig elektrisch leitenden Basisschicht (12) und mindestens einem in Ausnehmungen der Basisschicht (12) angeordneten Innenlagen- bereich (16.1, 16.2), wobei in einer über dem mindestens einen Innenlagenbereich (16.1, 16.2) liegenden Harzschicht (20 ) mindestens ein Abstandshalterelement (22, 24) vorgesehen ist, dessen Dicke (d) den Abstand zwischen Innenlagenbereich (16.1, 16.2) und einer Deckschicht (13) definiert . 9. printed circuit board element (10) having a base layer (12) which is electrically conductive on both sides and at least one inner layer region (16.1, 16.2) arranged in recesses of the base layer (12), wherein a resin layer lying above the at least one inner layer region (16.1, 16.2) (20) at least one spacer element (22, 24) is provided, whose thickness (d) defines the distance between inner layer region (16.1, 16.2) and a cover layer (13). 10. Leiterplattenelement (10) nach Anspruch 9, das des weiteren in der Deck-Prepreg-Schicht (13, 20Λ) ausgebildetes Vias (18) aufweist, deren Länge durch die Dicke (d) des mindestens einen Abstandshalterelements (22, 24) definiert 10. printed circuit board element (10) according to claim 9, which further in the cover prepreg layer (13, 20 Λ ) formed vias (18) whose length by the thickness (d) of the at least one spacer element (22, 24) Are defined
PCT/EP2012/002717 2011-06-28 2012-06-28 Prepreg, method for producing a prepeg, method for producing a printed circuit board element and printed circuit board element Ceased WO2013000574A1 (en)

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US10699986B2 (en) 2016-06-28 2020-06-30 Abb Schweiz Ag Cooled electronics package with stacked power electronics components
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same

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JP2004262951A (en) * 2003-01-17 2004-09-24 Matsushita Electric Ind Co Ltd Release sheet for substrate production and substrate production method using the same
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US10699986B2 (en) 2016-06-28 2020-06-30 Abb Schweiz Ag Cooled electronics package with stacked power electronics components
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same

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