WO2012129459A1 - Solutions autonettoyantes pour implantation de carbone - Google Patents
Solutions autonettoyantes pour implantation de carbone Download PDFInfo
- Publication number
- WO2012129459A1 WO2012129459A1 PCT/US2012/030228 US2012030228W WO2012129459A1 WO 2012129459 A1 WO2012129459 A1 WO 2012129459A1 US 2012030228 W US2012030228 W US 2012030228W WO 2012129459 A1 WO2012129459 A1 WO 2012129459A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solution
- benzyl
- ion source
- cleaning agent
- torr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H10P30/204—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H10P30/208—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
- H10D30/797—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being in source or drain regions, e.g. SiGe source or drain
Definitions
- the present invention relates to self cleaning compounds for use as carbon implantation sources.
- US J ultra-shallow junctions
- Aromatic Carbon implant technology is also available from Axcelis Technologies. Those heavy carbon-based PAI methods have displayed advantages in performance and cost. They are also useful in making source and drain stressor materials. However, formation of hydrocarbon film residue in ion source chambers is a critical issue in this technology.
- the present invention provides improved methods and formulas for use in the PAI of substrates used in semiconductor manufacturing.
- the present invention relates to methods and formulas for providing implantation ions to accomplish PAI of substrates, particularly for the formation of ultra-shallow junctions.
- This source may be provided in a liquid sub-atmospheric pressure package, such as the Genii technology available from the Linde Group.
- the compound liquid vapor pressure should be greater than 1 Torr at temperatures below 100°C, and the preferable vapor pressure is greater than 5 Torr and less than lOOTorr at temperatures between 10°C and 100°C.
- the C7 ions upon ionization, the C7 ions are highly concentrated in mass spectra with the C7 ion (with a mass about 91 amu, C 7 H 7 + ) being the most abundant ion peak in the mass spectra.
- the cleaning agent(s) dissociates from the parent molecule upon ionization and produces highly concentrated and reactive neutral or charged radicals. These radicals then react with hydrocarbon residue to form volatile gas produces, such as, C0 2 , CO, H 2 0, H 2 S, CH 4 , NH 3 , CC14, or the like.
- the cleaning agent compound could contain reactive oxygen function groups but it is not a source for C7 ion.
- the cleaning agent produces volatile products that help to avoid the formation of hydrocarbon film residue inside of the chamber.
- the cleaning agent may also produce oxygen, chlorine, nitrogen, or fluorine radicals to remove the hydrocarbon residue.
- the cleaning capacity of the cleaning agent may be reduced, leading to the need for downtime cleaning of the chamber.
- a number of cleaning agents having comparable vapor pressures may be used in the present invention.
- the vapor pressures of 1-chloropentane, cyclo entylamine, isopropyl butyl ether, ethyl isobutyrate, peracetic acid, 3-methyl-2-butanol and 2- methyl- l-propanol have vapor pressures near enough to that of toluene to be useful according to the present invention.
- Examples of single self-cleaning compounds useful as PAI sources according to the present invention include compounds having a C7 ion source portion with a composition of C7 or C7Hx, selected from benzyl chloride (C6H5CH2CI), benzyl acetate (C 9 Hio0 2 ), benzyl ethyl ether (C 9 Hi 2 0), benzyl formate (C 6 H 5 CH 2 OOCH), or benzyl mercaptan (C 6 HsCH 2 SH). These compounds may also be useful as carbon sources for other carbon implantation purposes.
- benzyl chloride C6H5CH2CI
- benzyl acetate C 9 Hio0 2
- benzyl ethyl ether C 9 Hi 2 0
- benzyl formate C 6 H 5 CH 2 OOCH
- benzyl mercaptan C 6 HsCH 2 SH
- the compounds according to the present invention may be packaged for use in several different ways.
- the Genii technology from the Linde Group provides the compounds as standard sub-atmospheric pressure ion implantation sources in a cylinder with a membrane separator and with temperature control on the cylinder wall and delivery line up to 100°C.
- an inert carrier gas may be used, wherein the inert gas flows through the source liquid in a bubbler configuration at room temperature.
- the source compound may be delivered by direct liquid injection with a bubbler and liquid mass flow controller at room temperature.
- the compounds of the present invention will require heating between 50°C and 100°C if the pure vapor phase of liquid is delivered.
- the present invention provides many advantages.
- the compounds of the present invention are self-cleaning C7 implantation sources that provide high C7H7 ion beam intensity as well as self-cleaning radicals with high concentration.
- component separation is not necessary making processing simpler and less expensive.
- the single molecule liquid compounds of the present invention exhibit a single vapor pressure curve, reducing operation parameters and simplifying processing.
- the compounds of the present invention provide self- cleaning properties and therefore, longer ion chamber life can be achieved and the need for shutdown for cleaning can be reduced or eliminated. Consequently, manufacturing and operation costs are reduced.
- the compounds of the present invention may be useful for implantation of semiconductor devices, for implantation of structural engineered materials, or for implantation of photovoltaic materials.
- the variations of the present invention also include other carbon-based molecules other than C7.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
L'invention concerne des procédés et des composés à utiliser comme matériaux sources pour une implantation de pré-amorphisation dans la formation de jonctions ultrasuperficielles. Certains composés présentent des propriétés de sources d'ions autonettoyants Cn (n = 5 - 30), chaque molécule du composé comprenant une partie de source d'ions Cn (n = 5 - 30) et une partie d'agent de nettoyage. D'autres composés comprennent des solutions binaires qui présentent des propriétés de sources autonettoyantes Cn (n = 5 - 30), la solution contenant une composante source d'ions Cn (n = 5 - 30) et une composante agent de nettoyage.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161467038P | 2011-03-24 | 2011-03-24 | |
| US201161467042P | 2011-03-24 | 2011-03-24 | |
| US61/467,038 | 2011-03-24 | ||
| US61/467,042 | 2011-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012129459A1 true WO2012129459A1 (fr) | 2012-09-27 |
Family
ID=46879752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2012/030228 Ceased WO2012129459A1 (fr) | 2011-03-24 | 2012-03-23 | Solutions autonettoyantes pour implantation de carbone |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201245112A (fr) |
| WO (1) | WO2012129459A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020070672A1 (en) * | 1999-12-13 | 2002-06-13 | Horsky Thomas N. | Electron beam ion source with integral low-temperature vaporizer |
| US20050233529A1 (en) * | 2001-02-12 | 2005-10-20 | Pomarede Christophe F | Integration of high k gate dielectric |
| US20090081874A1 (en) * | 2007-09-21 | 2009-03-26 | Cook Kevin S | Method for extending equipment uptime in ion implantation |
| US20090206281A1 (en) * | 2006-06-12 | 2009-08-20 | Dror Oved | Vapor delivery system useful with ion sources and vaporizers for use in such system |
| US20090252887A1 (en) * | 2008-04-02 | 2009-10-08 | Raytheon Company | System and method for growing nanotubes with a specified isotope composition via ion implantation using a catalytic transmembrane |
-
2012
- 2012-03-23 WO PCT/US2012/030228 patent/WO2012129459A1/fr not_active Ceased
- 2012-03-26 TW TW101110424A patent/TW201245112A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020070672A1 (en) * | 1999-12-13 | 2002-06-13 | Horsky Thomas N. | Electron beam ion source with integral low-temperature vaporizer |
| US20050233529A1 (en) * | 2001-02-12 | 2005-10-20 | Pomarede Christophe F | Integration of high k gate dielectric |
| US20090206281A1 (en) * | 2006-06-12 | 2009-08-20 | Dror Oved | Vapor delivery system useful with ion sources and vaporizers for use in such system |
| US20090081874A1 (en) * | 2007-09-21 | 2009-03-26 | Cook Kevin S | Method for extending equipment uptime in ion implantation |
| US20090252887A1 (en) * | 2008-04-02 | 2009-10-08 | Raytheon Company | System and method for growing nanotubes with a specified isotope composition via ion implantation using a catalytic transmembrane |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201245112A (en) | 2012-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5856565B2 (ja) | イオン源構成要素を洗浄するための方法 | |
| KR102138400B1 (ko) | 이온 주입 조성물, 시스템 및 방법 | |
| US9455147B2 (en) | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation | |
| US9064795B2 (en) | Technique for processing a substrate | |
| US20100112795A1 (en) | Method of forming ultra-shallow junctions for semiconductor devices | |
| KR20130097758A (ko) | 동위원소-농축된 붕소-함유 화합물, 및 이의 제조 및 사용 방법 | |
| KR20090085695A (ko) | 원자층 증착을 위한 기법 | |
| KR20130102595A (ko) | 이온 소스의 수명 연장 방법 | |
| US8003957B2 (en) | Ethane implantation with a dilution gas | |
| US9269582B2 (en) | Cluster ion implantation of arsenic and phosphorus | |
| KR102277836B1 (ko) | 이온 주입을 위한 안티몬 함유 물질 | |
| US7397048B2 (en) | Technique for boron implantation | |
| US7875125B2 (en) | Method for extending equipment uptime in ion implantation | |
| KR20090127366A (ko) | 반도체 디바이스용 극저 접합 형성 방법 | |
| US8524584B2 (en) | Carbon implantation process and carbon ion precursor composition | |
| WO2012129459A1 (fr) | Solutions autonettoyantes pour implantation de carbone | |
| Kawasaki et al. | Ultra-shallow junction formation by B18H22 ion implantation | |
| KR102801283B1 (ko) | 이온 주입을 위한 플라즈마 침지 방법 | |
| Onigbinde et al. | Gas chromatography/chemical ionization mass spectrometry of polyethylene glycol monoalkyl ethers | |
| Torregrosa et al. | PULSION®: A Versatile 200 to 300 mm Bridge Tool Plasma Immersion Ion Implanter for Ultra‐Shallow Doping and Nanotechology Applications. | |
| Borland et al. | Ge & Ge+ B infusion doping and deposition for ultra-shallow junction, blanket and localized SiGe or Ge formation on Cz and SOI wafers | |
| Neugebauer et al. | Role of defects and impurities in doping of GaN | |
| Borland et al. | doping and deposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12761405 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 12761405 Country of ref document: EP Kind code of ref document: A1 |