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WO2012039610A1 - Procédé et appareil permettant de souder des contacts dans un panneau solaire - Google Patents

Procédé et appareil permettant de souder des contacts dans un panneau solaire Download PDF

Info

Publication number
WO2012039610A1
WO2012039610A1 PCT/NL2011/050635 NL2011050635W WO2012039610A1 WO 2012039610 A1 WO2012039610 A1 WO 2012039610A1 NL 2011050635 W NL2011050635 W NL 2011050635W WO 2012039610 A1 WO2012039610 A1 WO 2012039610A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar panel
contacts
soldering
solder
clamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/NL2011/050635
Other languages
English (en)
Inventor
Bastiaan Henricus Maria Van Straaten
Jacobus Johannes Hendricus Maria Krutwagen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SOLLAND SOLAR ENERGY HOLDING BV
Original Assignee
SOLLAND SOLAR ENERGY HOLDING BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SOLLAND SOLAR ENERGY HOLDING BV filed Critical SOLLAND SOLAR ENERGY HOLDING BV
Publication of WO2012039610A1 publication Critical patent/WO2012039610A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to the assembly of solar panels.
  • Solar panels comprise a number of solar cells and a structure to unite these solar cells, to protect them against the rain and other weather influences and to connect them electrically.
  • the present invention relates more specifically to the assembly of solar cells comprising a back sheet foil with a number of first contacts, a number of solar cells each with a number of second contacts, to be connected to the first contacts, a front layer and solder paste pads applied to the first contacts or second contacts. Further an encapsulant material is added. During assembly these components are stacked and heated under pressure to form a solar panel. The encapsulant material melts and after solidifying thereof a rigid unit is obtained as is described in US-A-5 972 732. Further electrical connections have to be made between the first and second contacts.
  • the present invention proposes a method of the kind referred to above, wherein at least during the soldering the solar panel is compressed in the direction perpendicular to its main plane.
  • the forces thus developed will compress the solar panel to such an extend that the forming of bulges is prevented and the quality of the solder joints is improved.
  • the solar cells and the front layer are mutually bonded.
  • the invention also relates to an apparatus for soldering electrical contacts in a solar panel, the solar panel comprising a back sheet foil with a number of first contacts, a number of solar cells each having a number of second contacts, to be connected to the first contacts, a front layer and solder paste pads applied to the first contacts or to the second contacts, the apparatus comprising means for locally applying heat to the solder paste pads to make the solder melt, a support for locating the solar panel to be soldered and a laser apparatus for heating the solder paste pads to melt these solder paste pads to form a solder joint between the first and the second contacts after solidification, further comprising means for compressing the solar panel in the direction perpendicular to its main plane.
  • the forces may be generated by depositing a body with a substantial weight on the solar panel during the soldering process.
  • the weight of the body should be sufficient to generate the pressure which is sufficient to compress the solar panel to such an extend that the bulging does not appear.
  • This embodiment also provides an apparatus comprising a body with a substantial weight adapted to be located on the solar panel and means for arranging the body on the solar panel and for removing the body from the solar panel.
  • the heat for the soldering process is supplied through laser.
  • the body should hence have such a configuration that the paths of the laser beams is not hampered. This may be reached by providing an aperture in the body adapted to let the laser beams pass, or by using a body which is transparent for the laser beams.
  • the body is substantially flat and it comprises apertures arranged in a pattern coinciding with the pattern of the solder pads.
  • the laser beams can pass the body through the apertures.
  • clamps are brought into engagement with the solar panel, in such a way that during the soldering process the clamps compress the components of the solar panel in a direction perpendicular to the main plane of the solar panel and that after the soldering process the clamps are removed.
  • This embodiment also provides an apparatus comprising clamps adapted to be brought into engagement with the solar panel and means for activating the clamps to compress the components of the solar panel in a direction perpendicular to the main plane of the solar panel.
  • This embodiment avoids the problems with the body having a substantial weight. Again these clamping means must be adapted to avoid hampering the laser beams.
  • the most promising embodiment provides a method wherein during the soldering a pressure lower than the atmospheric pressure is applied on apertures in a support onto which the solar panel rests during the soldering process.
  • the surrounding pressure urges the upper parts of the solar panel to the lower layers so that the layers are pressed together, just as in the preceding embodiments.
  • the pressure lower than the atmospheric pressure can be adapted to obtain the required effect, to a minimum of an approximation of a vacuum.
  • This last embodiment also provides an apparatus comprising apertures located in the support and by a vacuum pump connected to the apertures.
  • the solar panel rests on the support and the lower pressure is applied through the apertures provided in the support.
  • the support comprises preferably a material having some resiliency, like a rubber layer having preferably a thickness of around 2mm and a hardness of 90 shore.
  • a material having some resiliency like a rubber layer having preferably a thickness of around 2mm and a hardness of 90 shore.
  • other materials as support can also be envisaged, like glass, plastic, metal, etc.
  • Figure 1 a detailed cross sectional view of a solar panel of the type to which the present invention pertains
  • Figure 2 a cross sectional view of a solar panel, wherein a first embodiment is applied
  • Figure 3 a cross sectional view of a solar panel, wherein a second embodiment is applied.
  • Figure 4 a cross sectional view of a solar panel, wherein a third embodiment is applied.
  • Figure 1 depicts a section of a solar panel 1 which has been assembled but which is not yet soldered. It comprises a glass plate 2 on top, under which a solar cell 3 has been arranged. At its underside the solar cell 1 is provided of a number of second solder contacts 4, of which only one has been depicted.
  • the solar cell 3 is of the so called back contact type, in particular of the metal wrap through type, so that the contacts of both polarities are present on the back side of the cell 3.
  • the lowest layer of the solar panel 1 is a foil 5 of an electrically insulating material, on top of which metal tracks 6 and first solder contacts 7 have been provided.
  • a solder pad 8 has been provided on each of the first solder contacts 7, although it is also possible to have the solder pad 8 applied to the second solder contacts 4. Further between the glass plate 2, the foil 5 and in between the solar cells a filling and adhesive material 9 has been provided which unites, after being heated, all parts of the solar panel.
  • solder pads 8 which are still solid, need to be melted to form a connection between the first and second solder contacts 7, 4 after solidifying. Therefore use is made of laser beams, not depicted in this figure and which act locally to melt the solder pads. It will be clear that the heating of the solder pads will also heat the parts in the area
  • Said body comprises apertures 13, which are each aligned with the locations of the solder connections 8 to be made.
  • the apertures are adapted in location and shape to allow the beams 14 of a laser source 15 located above the support 11 to reach the solder pads 8.
  • the weight of the body 12 compresses the solar panel 1 to avoid bulging thereof, so that the reliability of the solder connections is assured.
  • the solar panels which are produced in large numbers, are supplied on a conveyor, which forms the support. Soldering takes place on a non moving support. As soon as a solar panel has been soldered, it is conveyed further.
  • FIG 3 shows an embodiment wherein the solar panel 1 is compressed.
  • the solar panel 1 is located onto a support 21, of which the width is smaller than the width of the solar panel 1, so that the solar panel protrudes over the support 21. It is possible that instead of or in addition to protruding in de direction of the width, the solar panel 1 protrudes in the direction of the length over the support.
  • the clamps 22 serve to compress the solar panel 1.
  • the clamps 22 comprise each a fixed part 23 adapted to contact the lower face of the solar panel 1 and a moveable part 24 connected hinged to the fixed part 23.
  • a linear actuator 25 is hinged connected between the fixed part 23 and the moveable part 24 so that actuation of the linear actuator 25 causes the clamp 22 to compress the parts present between the fixed part 23 and the moveable part 24 of the clamp.
  • clamps 22 with a hydraulic actuation are foreseen, but the use of clamps having other kinds of actuation, such as pneumatic or electromagnetic are not excluded.
  • the drawings show two clamps 22 only, but a skilled man will understand that other numbers of clamps, such as four, six or eight may be used, in dependence of the size of the solar panel 1 and of the clamps.
  • the clamps 22 are mounted moveably in substantial horizontal direction in a structure not depicted in the drawings, so that the clamps 22 may be moved from the position depicted in the drawings to a position more sideways of the solar panel 1 to allow the solar panel 1 to be moved into and out of the position depicted in figure 3. Further it will be clear that preceding the soldering action of the solar panel, the clamps will be actuated to compress the solar panel and after the soldering action the clamps will be released.
  • FIG. 4 shows an solar panel 1 resting on a support 31, which is preferably made of rubber or of another material with a hardness or another material having a some resiliency and which is provided with a number of apertures 32.
  • the apertures 32 are all connected to a vacuum pump 33 via tubing 34.
  • the action of this embodiment is such that preceding the soldering of the solar panel 1 located on the support 31, the vacuum pump 33 is actuated to reduce the pressure under the solar panel and to make the ambient pressure compressing the solar panel. After the soldering the vacuum pump is switched off and the tubing connected with the ambient to allow the vacuum to release, making the solar panel ready for the next processing step.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé et un appareil permettant de souder des contacts électriques dans un panneau solaire. Le procédé et l'appareil comprennent une feuille arrière qui présente un certain nombre de premiers contacts, un certain nombre de cellules solaires présentant chacune un certain nombre de seconds contacts devant être raccordés aux premiers contacts, une couche avant et des plots de pâte à souder appliqués aux premiers contacts ou aux seconds contacts; la chaleur étant appliquée localement à la soudure pour la faire fondre et former des connexions après solidification. Au moins pendant le soudage, le panneau solaire est comprimé dans la direction perpendiculaire à son plan principal. Les forces ainsi développées comprimeront le panneau solaire de manière à empêcher la formation de bulles et à améliorer la qualité des joints de soudure.
PCT/NL2011/050635 2010-09-24 2011-09-20 Procédé et appareil permettant de souder des contacts dans un panneau solaire Ceased WO2012039610A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL2005397 2010-09-24
NL2005397 2010-09-24
NL2005811 2010-12-03
NL2005811A NL2005811C2 (en) 2010-09-24 2010-12-03 Method and apparatus for soldering contacts in a solar panel.

Publications (1)

Publication Number Publication Date
WO2012039610A1 true WO2012039610A1 (fr) 2012-03-29

Family

ID=45874015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2011/050635 Ceased WO2012039610A1 (fr) 2010-09-24 2011-09-20 Procédé et appareil permettant de souder des contacts dans un panneau solaire

Country Status (2)

Country Link
NL (1) NL2005811C2 (fr)
WO (1) WO2012039610A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016100239A1 (fr) * 2014-12-16 2016-06-23 Sunpower Corporation Couche d'amortissement épaisse utilisable en vue de la métallisation, faisant appel à une feuille métallique, de photopiles
CN108687442A (zh) * 2017-03-30 2018-10-23 法拉第未来公司 用于焊接的系统和方法
WO2019195806A3 (fr) * 2018-04-06 2020-11-05 Sunpower Corporation Formation de motifs et métallisation locales de structures semi-conductrices à l'aide d'un faisceau laser

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972732A (en) 1997-12-19 1999-10-26 Sandia Corporation Method of monolithic module assembly
WO2009113640A1 (fr) * 2008-03-12 2009-09-17 京セラ株式会社 Module de cellule solaire et son procédé de fabrication
WO2010027265A2 (fr) * 2008-09-05 2010-03-11 Solland Solar Energy Holding B.V. Procede d'assemblage de module photovoltaïque monolithique
DE102008047517A1 (de) * 2008-09-16 2010-03-25 Paul, Cornelius, Dipl.-Ing. Verfahren zur Assemblierung von Solarzellen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972732A (en) 1997-12-19 1999-10-26 Sandia Corporation Method of monolithic module assembly
WO2009113640A1 (fr) * 2008-03-12 2009-09-17 京セラ株式会社 Module de cellule solaire et son procédé de fabrication
WO2010027265A2 (fr) * 2008-09-05 2010-03-11 Solland Solar Energy Holding B.V. Procede d'assemblage de module photovoltaïque monolithique
DE102008047517A1 (de) * 2008-09-16 2010-03-25 Paul, Cornelius, Dipl.-Ing. Verfahren zur Assemblierung von Solarzellen

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H. KNAUSS, M. MC CANN, W. NEU, P. FATH, W. JOOSS, M. KLENK, S. KELLER, D. W. K. EIKELBOOM, A. SCHÖNECKER, T. BRUTON, S. ROBERTS: "The advantage project: development of new interconnection and encapsulation techniques for back-contact solar cells", NINETEENTH EUROPEAN PHOTOVOLTAIC SOLAR ENERGY CONFERENCE : PROCEEDINGS OF THE INTERNATIONAL CONFERENCE HELD IN PARIS, FRANCE, 7 - 11 JUNE 2004, MÜNCHEN : WIP-MUNICH ; FLORENCE : ETA-FLORENCE, 7 June 2004 (2004-06-07), XP040510965, ISBN: 978-3-936338-15-7 *
M. GAST, M. KÖNTGES, R. BRENDEL: "In-laminate laser soldering - A gentle method to assemble and interconnect silicon solar cells to modules", 21ST EUROPEAN PHOTOVOLTAIC SOLAR ENERGY CONFERENCE : PROCEEDINGS OF THE INTERNATIONAL CONFERENCE HELD IN DRESDEN, GERMANY, 4 - 8 SEPTEMBER 2006, WIP RENEWABLE ENERGIES, MÜNCHEN, 4 September 2006 (2006-09-04), XP040512740, ISBN: 978-3-936338-20-1 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016100239A1 (fr) * 2014-12-16 2016-06-23 Sunpower Corporation Couche d'amortissement épaisse utilisable en vue de la métallisation, faisant appel à une feuille métallique, de photopiles
US9461192B2 (en) 2014-12-16 2016-10-04 Sunpower Corporation Thick damage buffer for foil-based metallization of solar cells
US10199521B2 (en) 2014-12-16 2019-02-05 Sunpower Corporation Thick damage buffer for foil-based metallization of solar cells
CN108687442A (zh) * 2017-03-30 2018-10-23 法拉第未来公司 用于焊接的系统和方法
WO2019195806A3 (fr) * 2018-04-06 2020-11-05 Sunpower Corporation Formation de motifs et métallisation locales de structures semi-conductrices à l'aide d'un faisceau laser
US11362234B2 (en) 2018-04-06 2022-06-14 Sunpower Corporation Local patterning and metallization of semiconductor structures using a laser beam

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