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WO2009113640A1 - Module de cellule solaire et son procédé de fabrication - Google Patents

Module de cellule solaire et son procédé de fabrication Download PDF

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Publication number
WO2009113640A1
WO2009113640A1 PCT/JP2009/054808 JP2009054808W WO2009113640A1 WO 2009113640 A1 WO2009113640 A1 WO 2009113640A1 JP 2009054808 W JP2009054808 W JP 2009054808W WO 2009113640 A1 WO2009113640 A1 WO 2009113640A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
inner lead
bonding
cell element
fixing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/054808
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English (en)
Japanese (ja)
Inventor
達章 坂野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2010502882A priority Critical patent/JP5116836B2/ja
Publication of WO2009113640A1 publication Critical patent/WO2009113640A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a solar cell module and a manufacturing method thereof.
  • a solar cell module includes a translucent substrate, a solar cell string provided on the translucent substrate and electrically connected between solar cell elements with inner leads, and a back sheet provided on the solar cell string. It consists of
  • One of the causes that hinders the durability of the solar cell module is peeling of the junction between the solar cell element and the inner lead. When such peeling occurs, the contact area between the solar cell element and the inner lead decreases, the resistance loss at the junction increases, and the output of the solar cell module decreases.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2-295174
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2-295174
  • An object of the present invention is to provide a solar cell module excellent in durability in which peeling of an inner lead from a solar cell element is suppressed, and a manufacturing method thereof.
  • the solar cell module of the present invention includes a plurality of solar cell elements, an inner lead that is disposed so as to straddle adjacent solar cell elements, and electrically connects the adjacent solar cell elements, the inner lead, and the solar cell A solar cell string having a bonding material disposed so as to be interposed between the elements, a sealing material covering the solar cell string, the solar cell element bonding side of the inner lead, and the And a resin material having a coefficient of thermal expansion lower than that of the sealing material, which is disposed in a non-bonded region of the bonding material.
  • the solar cell module is a resin material that is provided on the solar cell element bonding side of the inner lead and has a lower coefficient of thermal expansion than the sealing material in the non-bonding region of the bonding material interposed between the inner lead and the solar cell element.
  • bonding protective resin material for example, the sealing material is prevented from entering a non-bonded region of the bonding material between the inner lead and the solar cell element.
  • FIG. 3 is a diagram showing a state of connection between a plurality of solar cell elements 1 by an inner lead 2.
  • 4 is an enlarged cross-sectional view of a portion where two solar cell elements 1 are adjacent to each other in the solar cell module 20.
  • FIG. It is a figure which shows the state in which only a part of non-joining area
  • 1 is an external perspective view of a manufacturing apparatus 100.
  • FIG. 4 is an exploded perspective view for explaining a state in which the solar cell element 1 and the inner lead 2 are held and fixed in the manufacturing apparatus 100.
  • FIG. 4 is an exploded perspective view for explaining a state in which the solar cell element 1 and the inner lead 2 are held and fixed in the manufacturing apparatus 100.
  • FIG. 6 is a cross-sectional view illustrating a second fixing member 106 in which an opening 112 is formed so as to have a taper 119 at the end on the side in contact with the solar cell element 1. It is a disassembled perspective view for demonstrating a mode that the solar cell element 1 and the inner lead 2 are hold
  • FIG. 4 is an exploded perspective view for explaining a state in which the solar cell element 1 and the inner lead 2 are held and fixed in the manufacturing apparatus 200.
  • FIG. It is sectional drawing which shows the state which hold
  • the solar cell module 20 is a solar cell string formed by connecting a plurality of planarly arranged solar cell elements 1 with inner leads 2 as shown in FIGS. 3 is encapsulated with a sealing material 4, and the encapsulated body is disposed between a translucent substrate 5 and a back sheet (back surface protective film) 6.
  • the solar cell element 1 of the present embodiment is a back contact type in which both an N electrode (negative electrode) 7a and a P electrode (positive electrode) 7b that are output extraction electrodes are provided on the non-light-receiving surface side (back surface side). (BC type) structure.
  • the solar cell element 1 for example, a single crystal silicon solar cell, a polycrystalline silicon solar cell, a thin film solar cell, a solar cell in which a thin film amorphous silicon is formed on a crystalline silicon substrate, a CIGS solar cell, or a CdTe solar cell is used. It is done. Among these, single crystal silicon solar cells, polycrystalline silicon solar cells, thin film solar cells, or solar cells in which thin film amorphous silicon is formed on a crystalline silicon substrate are preferably used.
  • the thickness of the solar cell element 1 is, for example, about 150 ⁇ m to 250 ⁇ m.
  • the inner lead 2 for example, a low resistance wiring material such as copper or aluminum is used.
  • the surface of this low-resistance wiring material which is solder-coated with a thickness of about 20 ⁇ m to 70 ⁇ m by plating or dipping, may be cut into an appropriate length and used.
  • the substantially straight inner lead 2 is illustrated, but a bent portion or a cutout portion is provided so that a portion other than the joint portion with the solar cell element 1 does not come into contact with the solar cell element 1.
  • the inner lead 2 may be used.
  • the size of the inner lead 2 is not particularly limited.
  • the inner lead 2 has a width of about 1 mm to 3 mm, a thickness of about 0.1 mm to 0.3 mm, and a length. Is about 250 mm to 300 mm.
  • the inner lead 2 is disposed so as to straddle the boundary between adjacent solar cell elements 1 and electrically connects the adjacent solar cell elements 1. Specifically, it is joined to an electrode disposed on the solar cell element 1.
  • the N electrode 7a of one solar cell element 1a and the P electrode 7b of the solar cell element 1b adjacent to the solar cell element 1a are arranged on a straight line, and these N electrodes A substantially linear inner lead 2 is arranged and connected to 7a and P electrode 7b. What is necessary is just to set suitably the electrode pattern in the solar cell element 1 according to arrangement
  • thermosetting resin such as an ethylene vinyl acetate copolymer (EVA).
  • EVA ethylene vinyl acetate copolymer
  • acrylic resin, silicone resin, epoxy resin, EEA (ethylene-ethyl acrylate copolymer) and the like can be used.
  • the joint portion 9 between the solar cell element 1 and the inner lead 2 joins the solar cell element 1, specifically, an electrode disposed on the solar cell element 1 and the inner lead 2. Connected by a material 8.
  • the bonding material 8 is disposed so as to be interposed between the inner lead 2 and the solar cell element 1.
  • solder for example, eutectic solder, lead-free solder
  • the inner lead 2 having a bent portion is used.
  • the bonding region of the bonding material used in the present specification is specifically a region where the solar cell element and the inner lead are bonded by the bonding material, and the non-bonding region of the bonding material is a solar cell. This is a region where the element and the inner lead are not joined by a joining material.
  • the solar cell module 20 is further provided on the solar cell element bonding side of the inner lead 2 and in the non-bonding region 10 of the bonding material 8 (hereinafter simply referred to as the non-bonding region 10).
  • the bonding protection resin material 11 having a lower thermal expansion coefficient than that is disposed.
  • This bonding protective resin material 11 is for suppressing the sealing material 4 from entering the non-bonded region 10 of the bonding material 8 between the solar cell element 1 and the inner lead 2. Therefore, it is preferable that the bonding protection resin material 11 is disposed at least between the inner lead 2 and the solar cell element 1.
  • the bonding protection resin material 11 suppresses the entry of the non-bonding region 10 of the sealing material 4 in this manner, whereby the sealing material 4 that has entered the non-bonding region 10 is obtained. Peeling of the inner lead 2 from the solar cell element 1 that can be caused by repeated thermal expansion and contraction is suppressed.
  • EVA polyimide resin, PEEK (polyether ether ketone) resin
  • a UV curable resin it is cured by irradiating the discharged uncured bonding protection resin material 11 with ultraviolet rays for several seconds to several tens of seconds, so that high production efficiency is obtained.
  • a thermosetting resin can be used as the bonding protection resin material 11.
  • the sealing material 4 tends to enter especially in the place near the side edge part 1e of the solar cell element 1, it is especially preferable to block
  • FIG. 3 the case where the whole non-joining area
  • FIG. 4 illustrates a case where only a part of the non-bonding region 10 is blocked by the bonding protection resin material 11 and a gap 12 exists between the bonding material 8 and the bonding protection resin material 11. Even in the case shown in FIG. 4, the penetration of the sealing material into the non-bonding region 10 is sufficiently suppressed.
  • the side edge part 1e of a solar cell element means the side part or edge part in the main surface of a solar cell element.
  • the bonding protective resin material 11 is on the inner lead (on the solar cell element bonding side) and is adjacent to the boundary portion of the adjacent solar cell elements 1. Are continuously disposed between the bonding regions. Thereby, when the sealing material 4 is filled, it is possible to effectively suppress the sealing material 4 from entering the non-joining regions 10 of the respective solar cell elements 1 along the inner leads 2. .
  • the bonding protective resin material 11 may contain a colorant.
  • the colorant include metal oxides such as titanium oxide and cobalt-based oxides, inorganic pigments such as metal powders, azo-based, phthalocyanine-based, and lake-based organic pigments.
  • the bonding protection resin material 11 when the bonding protection resin material 11 is continuously arranged on the inner lead 2, the bonding protection resin material 11 has a color similar to the color of the light receiving surface of the solar cell element 1. By including the coloring agent to be exhibited, the effect of suppressing the reflection of light of the inner lead 2 and improving the appearance of the solar cell module 20 is obtained.
  • the non-bonding region 10 between the solar cell element 1 and the inner lead 2 and not bonded by the bonding material 8 is heated more than the sealing material 4.
  • the bonding protective resin material 11 having a low expansion coefficient the sealing material 4 is prevented from entering the non-bonding region 10, so that the solar caused by the invasion of the sealing material 4 due to such thermal expansion and thermal contraction Peeling of the inner lead 2 from the battery element 1 (decrease in bonding area) is suitably suppressed.
  • a method for manufacturing the solar cell module 20 according to this embodiment will be described.
  • a plurality of solar cell elements 1 and inner leads 2 are abutted and fixed with a bonding material 8 interposed therebetween, and the bonding material 8 is heated and melted to heat the solar cell elements 1 and the inner leads 2.
  • the solar cell string 3 in which the solar cell element 1 and the inner lead are electrically connected is sandwiched between the translucent substrate 5 and the back sheet 6 in a state where the solar cell string 3 is sealed with the sealing material 4.
  • the step of integrating may be included.
  • a manufacturing apparatus 100 as shown in FIG. 5 is used for the fixing step, the joining step, and the attaching step.
  • the manufacturing apparatus 100 mainly includes a fixing unit 110 that performs the fixing step, a heating unit 120 that performs the bonding step, and an attachment unit 130 that performs the bonding step.
  • a fixing unit 110 that performs the fixing step
  • a heating unit 120 that performs the bonding step
  • an attachment unit 130 that performs the bonding step.
  • the solar cell element 1 and the inner lead 2 that are to be held and fixed in the manufacturing apparatus 100 are also collectively referred to as a holding object A.
  • the fixing means 110 mainly includes a first fixing member 111, a second fixing member 112, and a pressing plate 113.
  • Through holes 114 are formed in a row in the first fixing member 111, and a pressing bar 115 that is inserted through the through hole 114 is disposed on the pressing plate 113 corresponding to the through hole 114.
  • the second fixing member 112 is provided with an opening 116 used in the attaching process.
  • the first fixing member 111 supports the holding object A from below when the holding object A is sandwiched between the first fixing member 111 and the second fixing member 112.
  • Examples of the material of the first fixing member 111 include metals such as iron, stainless steel, and aluminum, light metals, and ceramic plates.
  • the inner lead 2 having a cross-sectional view as shown in FIG. 7 is used for the purpose of alleviating the thermal stress generated between the back electrode (N electrode 7a and P electrode 7b) of the solar cell element 1.
  • the cross-sectional shape of the sandwiching surface 111a of the first fixing member 111 is preferably wavy.
  • the first fixing member 111 may be provided with a guide 111g for guiding the second fixing member 112 in the vicinity of the four end portions of the holding surface 111a that holds the holding object A, for example.
  • the through hole 114 formed from the clamping surface 111 a of the first fixing member 111 to the opposite surface is a hole for inserting the pressing rod 115 disposed on the pressing plate 113. It is formed corresponding to the arrangement position.
  • the through holes 115 are also arranged in a straight line so as to correspond to the straight inner leads 2. The arrangement of the through-holes 115 can be used for positioning the inner lead 2 at the time of joining.
  • the presser bar 115 is to support the inner lead 2.
  • the presser bar 115 preferably includes a spring. The inner lead 2 is pressed against the solar cell element 1 with an appropriate force by the spring.
  • the second fixing member 112 is a member disposed above the holding object A.
  • the second fixing member 112 is made of a material that can efficiently apply heat generated by the heating means 120 to the bonding material 8.
  • a material having high thermal conductivity such as aluminum
  • a material having high light transmittance such as glass can be used depending on the configuration of the heating unit 120.
  • the second fixing member 112 is made of a glass material such as soda lime glass, borosilicate glass, and quartz glass that efficiently transmits infrared rays. Is preferred.
  • the second fixing member 112 When the self-weight of the second fixing member 112 is used for fixing the holding object A with the first fixing member 111, the second fixing member has a weight that does not cause cracks in the solar cell element 1. It is preferable to use the member 112.
  • the second fixing member 112 having a thickness such that stress applied to the solar cell element 1 is 0.75g / cm 2 ⁇ 2.5g / cm 2 is used.
  • the 2nd fixing member 112 may be lighter than the above-mentioned requirement in the range which a position shift does not produce.
  • the second fixing member 112 is provided with an opening 116 as shown in FIGS.
  • the opening 116 is in the vicinity of the side end portion 1e of the adjacent solar cell elements 1 (that is, the bonding protection resin). It is provided at a location where the adhesion target portion of the material 11 is located.
  • the opening 116 is provided in order to perform the adhesion treatment of the bonding protection resin material 11 to the non-bonding region 10 between the solar cell element 1 and the inner lead 2.
  • the opening 116 Since the opening 116 is provided, a part of the holding object A is exposed even when the holding object A is sandwiched between the first fixing member 111 and the second fixing member 112. A cooling effect can be obtained in which the object A is cooled by being in contact with the surrounding atmosphere. For example, when the ambient temperature is lower than the temperature of the exposed portion of the holding object A from the opening 116, the solar cell element 1 and the inner lead 2 are joined by heating and melting the joining material 8. Residual stress accompanying thermal expansion / contraction of the inner lead 2 can be reduced. Note that, for the purpose of enhancing the cooling effect, the opening 116 may be provided at a location other than the location where the adhesion target portion of the bonding protection resin material 11 is exposed. In such a case, since the time required for heat dissipation after heating is shortened, the production efficiency of the solar cell module 20 is improved.
  • FIGS. 5 and 6 illustrate a case where the opening 116 has a simple cylindrical shape.
  • it may be an opening 116 having a taper 117 as shown in FIG. In this case, the shearing force applied to the solar cell element 1 around the opening 116 is reduced. Note that the stress applied to the solar cell element 1 may be adjusted depending on the size and shape of the opening 116 of the second fixing member 112.
  • the material of the pressing plate 113 for example, a metal such as iron, stainless steel, or aluminum, a light metal, a ceramic plate, or the like is used.
  • the manufacturing apparatus 100 in order to hold and fix the solar cell element 1 that is the holding object A and the inner lead 2, first, between the solar cell element 1 and the inner lead 2, The bonding material 8 before melting is interposed in advance at a bonding target position (position to be a bonding region).
  • a bonding target position position to be a bonding region
  • the solder previously coated on the inner lead 2 may be used, or a solder paste may be newly applied to the joining position of the inner lead 2.
  • the holding object A with the bonding material 8 interposed therebetween is placed on the first fixing member 111, and the second fixing member 112 is placed along the guide 111g from above to hold the holding object A. Hold A from above and below. Then, the sandwiched body thus obtained is placed on the pressing plate 113. After the holding body is placed on the pressing plate 113, the holding object A is held by the presser bar 116 and the second fixing member 112.
  • the heating means 120 is provided for the purpose of melting the bonding material 8 such as solder interposed between the solar cell element 1 and the inner lead 2. Thereby, the solar cell element 1 and the inner lead 2 are joined.
  • the heating unit 120 is provided so that the bonding material 8 can be heated and melted in a state where the holding object A is held by the pressing bar 115 of the pressing plate 113 and the second fixing member 112. As shown in FIG. 5, the heating means 120 is attached to an arm 141 that is movable in the horizontal direction by being guided by a rail 140.
  • the heating means 120 for example, an infrared irradiation device, an irradiation device (laser light source) for irradiating a laser beam such as a semiconductor laser or a YAG laser having a high energy density similar to infrared rays, a hot air applying device, and a sandwiching device provided with a temperature raising mechanism Examples thereof include devices. It is more preferable to increase production efficiency by using a plurality of heating means 108 in combination.
  • the heating means 120 may be mechanical. It is preferable to use an infrared irradiation device with a small load.
  • the second fixing member 112 is made of glass, it is preferable to use an infrared irradiation device that can irradiate near infrared rays that pass through the glass. Near-infrared irradiation has the effect of giving a high energy density to the object to be heated and raising the temperature of the object to be heated in a relatively short time. If performed, an improvement in processing speed and a reduction in power consumption are realized.
  • a near infrared light source a halogen lamp, a xenon lamp, or the like can be used.
  • the heating means 120 irradiates near infrared rays from above the second fixing member 112 toward the joining target position of the holding object A (toward the opening 116 provided on the joining target position).
  • the solar cell element 1 (strictly, its N electrode 7a and P electrode 7b) and the inner lead 2 are joined by heating and melting the bonding material 8 located on the back side of the solar cell element 1 through the fixing member 112.
  • the bonding material 8 can be heated and melted sequentially at a plurality of positions to be bonded, and the bonded portion between the solar cell element 1 and the inner lead 2 can be formed.
  • the formation of the joint portion between the solar cell element 1 and the inner lead 2 is performed in a state where the solar cell element 1 and the inner lead 2 are held and fixed in this way, Occurrence of misalignment of the joining position due to the difference is suppressed.
  • the exposed portion of the inner lead 2 is increased by enlarging the opening 116 of the second fixing member 112 so that the solar cell element 1 and the inner lead 2 are in direct contact with the hot air. It is preferable.
  • the shear due to the displacement of the sandwiching position is obtained by matching the sandwiching positions of the light receiving surface and the back surface by the sandwiching device. It is preferable to suppress the solar cell element 1 from being damaged by force.
  • the adhering unit 130 mainly includes a resin discharging unit 131, a camera 132, and a UV irradiation unit 133. As shown in FIG. 5, these components are attached to an arm 141 that is movable in the horizontal direction by being guided by a rail 140. Thereby, each component can be moved in the horizontal direction by being guided by the rail 140.
  • FIG. 5 shows a mode in which these components are attached to a common arm 141, but this is not essential, and a mode in which individual moving means are provided corresponding to each component. It may be.
  • Resin discharging means 131 is, for example, an inkjet head.
  • the resin discharge means 131 discharges the uncured bonding protection resin material 11 supplied from a resin supply unit (not shown) to the discharge target position of the holding target A held and fixed on the pressing plate 113.
  • the resin discharge means 131 is applied to the inner lead 2 exposed in the vicinity of the non-bonded region 10 at both ends of the solar cell element 1 or further in the opening 116 provided in the second fixing member 112. Ejects the bonding protection resin material 11 and attaches it.
  • the resin discharge means 131 discharges the bonding protection resin material 11 to the discharge target position in a non-contact state with the holding target A, almost no external force acts on the inner lead 2 during the discharge. That is, it is preferable that the resin discharge means 131 is constituted by an ink jet head in terms of preventing damage to the joint portion 9 between the solar cell element 1 and the inner lead 2.
  • the individual inner leads 2 used for connection are the same as shown in FIG. Since it is joined to the solar cell element 1 at the height position, the discharge target position of the resin discharge means 131 is also at a certain height position. Therefore, in the case of the present embodiment, the control in the height direction is simplified in spite of the fact that an inkjet head whose control in the height direction is complicated is generally used as the resin discharge means 131.
  • the camera 132 is used when specifying the discharge target position of the resin discharge means 131.
  • the position of the inner lead 2 is detected based on the captured image obtained by the camera 132, and the discharge position of the bonding protection resin material 11 from the resin discharge means 131 is determined according to the detection result, thereby protecting the bonding.
  • the resin material 11 can be attached to the non-bonding region 10 with high accuracy.
  • the UV irradiation means 133 irradiates the uncured bonding protection resin material 11 after being discharged from the resin discharge means 131 with ultraviolet light.
  • the UV irradiation means 133 is realized by, for example, a mercury lamp.
  • the discharged uncured bonding protective resin material is irradiated with ultraviolet rays from the UV irradiation means 133 for several seconds to several tens of seconds, the bonding protective resin material is cured, so that high production efficiency can be obtained.
  • the discharge position is determined by imaging with the camera 132 and shown in FIG.
  • the bonding protective resin material 11 is discharged from the resin discharge means 131 provided above the second fixing member 112 to the non-bonded region 10 in the opening 116 and the exposed portion of the inner lead 2. Thereby, the bonding protection resin material 11 can be attached to the non-bonding region 10 with high accuracy.
  • thermosetting resin material 11 when a thermosetting resin is used as the bonding protection resin material 11, a means for performing hot air drying after discharge may be appropriately provided.
  • the manufacturing apparatus 100 is used, and the solar cell element 1 and the inner lead 2 are held and fixed, and the bonding of the bonding material 8 by heat melting and the non-bonding region are maintained.
  • the bonding protective resin material 11 is attached to the substrate 10 using a single device.
  • the bonding process of the bonding protective resin material 11 is performed after the bonding process of the solar cell element and the inner lead by heating and melting the bonding material 8, the heated inner lead 2 is thermally expanded. By heat shrinking, the occurrence of cracks and peeling to the bonded protective resin material 11 is reduced.
  • the first fixing member 111 it is preferable to provide a mechanism for providing a predetermined pore (not shown) on the holding surface 111 a for holding the holding object A and generating a negative pressure through the pore.
  • a negative pressure is applied to the clamping surface 111a with the holding object A held between the first fixing member 111 and the second fixing member 112
  • the holding object A is attracted and fixed to the holding surface 111a. Thereby, the position shift of the holding object A is suppressed.
  • the first fixing member 111 it is preferable to provide an exhaust groove or an exhaust hole (not shown) that can vent outward from the holding surface 111a.
  • an exhaust groove or an exhaust hole (not shown) that can vent outward from the holding surface 111a.
  • the flux gas generated when the bonding material 8 previously interposed at the bonding target position is heated and melted can be discharged to the outside. Stain can be suppressed. This has the effect of reducing the defect rate.
  • a mechanism for sucking in the gas discharged from the exhaust groove or the exhaust hole described above may be provided outside the first fixing member 111.
  • the bonding material 8 or its surroundings in advance to a predetermined temperature before heating and melting the bonding material 8.
  • a preheating device into the pressing plate 113, the first fixing member 111, or the second fixing member 112.
  • the ambient temperature is low, a part of the heat applied to connect the solar cell element 1 and the inner lead 2 may be released to the surroundings. , Such defects are effectively suppressed.
  • a groove 117 into which the inner lead 2 can be fitted is formed in the first fixing member 111 shown in FIG.
  • the groove 117 is formed with a depth larger than the thickness of the inner lead 2.
  • a through hole 115 is provided from the bottom surface of the groove 117 to the opposite surface.
  • first fixing member 111 When such a first fixing member 111 is used, in joining the solar cell element 1 and the inner lead 2, the first fixing member 111 and the second fixing member in which the inner lead 2 is fitted in the groove 117.
  • the solar cell element 1 is sandwiched by 112. Even when the first fixing member 111 is used, when the sandwiching body is placed on the pressing plate 113, each pressing bar 115 is inserted into the corresponding through hole 114, and as shown in FIG.
  • the front end of the presser bar 115 protrudes from the clamping surface 111a.
  • the solar cell element 1 and the inner lead 2 are not in contact with each other before the sandwiched body is placed on the pressing plate 113, and the solar cell element 1 and the inner lead are not placed until the sandwiched body is placed on the pressing plate 113.
  • 2 makes contact with the solar cell element 1 and the inner lead 2, and the time for applying a pressing load to the solar cell element 1 and the inner lead 2 can be shortened, and an unnecessary load is applied to the solar cell element 1 and the inner lead 2 before the bonding process. Is suitably suppressed.
  • the upper surface of the second fixing member 112 is preferably provided with a light shielding property by applying a reflective paint or the like.
  • the solar cell element 1 which has an electrode on both surfaces of an element as 2nd Embodiment of this invention is demonstrated. More specifically, the solar cell element 1 according to the present embodiment has a light receiving surface electrode (not shown) on one surface and a back electrode (not shown) on the other surface. In such a case, in order to join the adjacent solar cell elements 1, it is necessary to connect one light receiving surface electrode and the other back surface electrode by the inner lead 2. In the case where the inner leads 2 are arranged in such a manner, it is preferable that the inner leads 2 have the same shape on both sides from the viewpoint of balancing the stress of the inner leads 2 with respect to the solar cell element 1 on both sides.
  • the shape of the inner lead 2 disposed on one side is linear
  • the shape of the inner lead 2 positioned on the other side is also linear (see FIGS. 11 and 12).
  • the other inner lead 2 is also waved so that the wave positions on both sides coincide. If it does in this way, since the stress from the inner lead 2 balances with both surfaces of the solar cell element 1, it is suppressed that deformation
  • the manufacturing apparatus 200 is used when the solar cell element 1 and the inner lead 2 are bonded and the bonding protective resin material 11 is adhered, similarly to the manufacturing apparatus 100. Similar to the manufacturing apparatus 100, the manufacturing apparatus 200 mainly includes a first fixing member 111, a second fixing member 112, and a pressing plate 113 as components for holding and fixing the holding object A. All of these are basically made of the same material as that of the first embodiment, but the structure differs depending on the difference in the structure of the solar cell element 1 to be joined.
  • a groove 117 into which the inner lead 2 can be fitted is formed at the same position as the thickness of the inner lead 2 at the position of the inner lead 2 on the clamping surface 111a.
  • a through hole 115 is provided from the bottom surface of the groove 117 to the opposite surface.
  • the pressing plate 113 is formed with a pressing bar 115 (first pressing bar 115a) corresponding to the arrangement position of the through hole 114.
  • the second fixing member 112 is provided with an opening 116 larger than that of the first embodiment so that the entire inner lead 2 located on the light receiving surface side of the solar cell element 1 is exposed.
  • the manufacturing apparatus 200 having such a configuration, when the solar cell element 1 that is the holding object A and the inner lead 2 are held and fixed, first, between the solar cell element 1 and the inner lead 2, A bonding material 8, for example, solder before melting (not shown) is interposed in advance at the position to be bonded, and then the holding object A is placed on the first fixing member 111, and the second from above is placed. The holding object A is sandwiched from above and below by placing the fixing member 112. Then, the sandwiched body thus obtained is placed on the pressing plate 113.
  • a bonding material 8 for example, solder before melting
  • the inner lead 2 may be pressed toward the solar cell element 1 from above through the opening 116 by the second pressing rod 115b.
  • the solar cell element 1 and the inner lead 2 are joined by heating and melting the joining material 8.
  • the heating means 108 similar to that in the first embodiment can be used.
  • the hot air application device can reduce the stress caused by the deformation by averaging the heat distribution during heating, or temporary heating (preheating) means for raising the temperature to a certain temperature in advance to increase production efficiency In combination with other heating means, it can be suitably used.
  • a process of attaching the joining protective resin material 11 is performed. Also in the present embodiment, this can be performed by the resin discharge means 131, the camera 132, and the UV irradiation means 133 as in the first embodiment.
  • the bonding protection resin material 11 is substantially discharged with the inner lead 2 exposed in the opening 116 as the discharge target position. Thereby, the effect similar to 1st Embodiment can be acquired.
  • the solar cell element 1 and the inner lead 2 in this embodiment are held and fixed by the short side of the opening 116 of the second fixing member 112 instead of the presser bar 115 b of the second embodiment.
  • a wire 150 passed from one end of the direction to the other end is used.
  • the wire 150 is made of, for example, stainless steel or brass.
  • the wire 150 is disposed upward by the thickness of the inner lead 2 from the position of the holding surface 112a of the second fixing member 112. As a result, the weight load of the second fixing member 112 is not concentrated on the inner lead 2 but distributed over the entire surface of the solar cell element 1.
  • the wire 150 having the spring property is fixed to the second fixing member 112 in a state where the wire 150 is curved downward, an appropriate load is applied from the wire 150 to the inner lead 2. Can be fixed.
  • the aesthetic influence can be reduced by setting the diameter of the wire 120 to a desired fineness.
  • the load applied to the solar cell element 1 can be more effectively dispersed.

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

L'invention porte sur un module de cellule solaire à excellente durabilité, et dans lequel une séparation des conducteurs internes du dispositif de cellule solaire n'est pas possible, et sur un procédé de fabrication du module de cellule solaire. Le module de cellule solaire présente : une chaîne de cellules solaires qui possède une pluralité d'éléments de cellule solaire, des conducteurs internes qui connectent électriquement des éléments de cellule solaire adjacents et sont agencés pour enjamber les parties attenantes des éléments de cellule solaire adjacents, et un matériau de jonction qui est agencé de façon à s'introduire entre les conducteurs internes et les éléments de cellule solaire ; un produit d'étanchéité qui couvre la chaîne de cellules solaires, et un matériau résineux qui a un taux de dilatation thermique inférieur à celui du produit d'étanchéité, installé sur le côté où les conducteurs internes rejoignent les éléments de cellule solaire et agencé dans la zone de la zone de non-jonction du matériau de jonction.
PCT/JP2009/054808 2008-03-12 2009-03-12 Module de cellule solaire et son procédé de fabrication Ceased WO2009113640A1 (fr)

Priority Applications (1)

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JP2010502882A JP5116836B2 (ja) 2008-03-12 2009-03-12 太陽電池モジュールおよびその製造方法

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JP2008063109 2008-03-12
JP2008-063109 2008-03-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005811C2 (en) * 2010-09-24 2012-03-27 Solland Solar Cells B V Method and apparatus for soldering contacts in a solar panel.
CN105081626A (zh) * 2015-07-23 2015-11-25 晶科能源有限公司 一种太阳能电池焊接辅助装置及焊接方法
IT201700084020A1 (it) * 2017-07-24 2019-01-24 Vismunda S R L "metodo e impianto di assemblaggio d'un pannello fotovoltaico di tipo back-contact, con stampa su cella combinata a carico e pre-fissaggio"
WO2024142868A1 (fr) * 2022-12-27 2024-07-04 株式会社カネカ Module de cellules photovoltaïques

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JPS6359351U (fr) * 1986-10-03 1988-04-20
JP2005011869A (ja) * 2003-06-17 2005-01-13 Sekisui Jushi Co Ltd 太陽電池モジュールおよびその製造方法
JP2005268254A (ja) * 2004-03-16 2005-09-29 Sharp Corp 太陽電池、その製造方法および太陽電池モジュール
JP2007123522A (ja) * 2005-10-27 2007-05-17 Kyocera Corp 太陽電池モジュール製造装置

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JPS6359351U (fr) * 1986-10-03 1988-04-20
JP2005011869A (ja) * 2003-06-17 2005-01-13 Sekisui Jushi Co Ltd 太陽電池モジュールおよびその製造方法
JP2005268254A (ja) * 2004-03-16 2005-09-29 Sharp Corp 太陽電池、その製造方法および太陽電池モジュール
JP2007123522A (ja) * 2005-10-27 2007-05-17 Kyocera Corp 太陽電池モジュール製造装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005811C2 (en) * 2010-09-24 2012-03-27 Solland Solar Cells B V Method and apparatus for soldering contacts in a solar panel.
WO2012039610A1 (fr) * 2010-09-24 2012-03-29 Solland Solar Energy Holding B.V. Procédé et appareil permettant de souder des contacts dans un panneau solaire
CN105081626A (zh) * 2015-07-23 2015-11-25 晶科能源有限公司 一种太阳能电池焊接辅助装置及焊接方法
IT201700084020A1 (it) * 2017-07-24 2019-01-24 Vismunda S R L "metodo e impianto di assemblaggio d'un pannello fotovoltaico di tipo back-contact, con stampa su cella combinata a carico e pre-fissaggio"
WO2019021053A1 (fr) * 2017-07-24 2019-01-31 Vismunda S.R.L. Procédé d'assemblage et installation de panneau photovoltaïque du type contact arrière, avec impression sur les cellules combinées de chargement et pré-fixation
US11217712B2 (en) 2017-07-24 2022-01-04 Vismunda Srl Assembly method and plant of photovoltaic panel of the back-contact type, with printing on the cells combined with loading and pre-fixing
WO2024142868A1 (fr) * 2022-12-27 2024-07-04 株式会社カネカ Module de cellules photovoltaïques

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