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WO2012022662A1 - Source lumineuse - Google Patents

Source lumineuse Download PDF

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Publication number
WO2012022662A1
WO2012022662A1 PCT/EP2011/063787 EP2011063787W WO2012022662A1 WO 2012022662 A1 WO2012022662 A1 WO 2012022662A1 EP 2011063787 W EP2011063787 W EP 2011063787W WO 2012022662 A1 WO2012022662 A1 WO 2012022662A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light source
convection
mounting surface
carrier body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/063787
Other languages
German (de)
English (en)
Inventor
Martin Moeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of WO2012022662A1 publication Critical patent/WO2012022662A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • a light source is indicated.
  • LEDs Light emitting diodes
  • Lighting equipment problematic.
  • the problem of cooling occurs in particular in the luminaire planning, for example, with regard to the thermal with these systems.
  • most modules or circuitry typically, most modules or circuitry.
  • Lighting devices are installed in spotlights and lights integrated in a ceiling to illuminate a room or parts thereof from above.
  • the lights are often upwards thermally insulated, which, for example, on conventional ceiling insulation of buildings, such as
  • the luminaires are often installed in fireproof ceilings that comply, for example, with fire protection class F90.
  • Such ceilings are designed so that flames over a period of time, for example in the fire protection standard F90 for 90 minutes, can not penetrate through the ceiling. Therefore, lights that must then also meet such a fire protection standard, typically secured upwards with a metal pot or the like.
  • a removal of heat for example via convection barely works or no longer works.
  • At least one object of certain embodiments is to provide a light source with a light module.
  • a light source is included
  • a light module has a carrier body with a plurality of light-emitting semiconductor components.
  • the semiconductor components may in particular be arranged on a mounting surface of the carrier body and in operation light along a
  • each of the light-emitting semiconductor devices may have a
  • emission direction is in particular the averaged over all possible radiation directions
  • emission direction denotes, which is particularly preferably perpendicular to the light output surface.
  • the carrier body can be, for example, a connection carrier which, for example, has a base body made of an electrically insulating material, in which or on the electrical connection points, contact points and / or conductor tracks are applied or applied.
  • the carrier body can be designed as a circuit board with electrical contacts for the electrical connection of the plurality of light-emitting semiconductor components.
  • the carrier body can be embodied particularly preferably as a printed circuit board (PCB) or as a metal core printed circuit board (MCPCB).
  • a light-emitting semiconductor component of the plurality of light-emitting semiconductor components may be particularly suitable for light in a wavelength range of
  • the light-emitting semiconductor component can emit monochromatic or mixed-colored light, for example, particularly preferably for illumination purposes, white light.
  • the light-emitting semiconductor device can do so
  • a dye that can convert at least a portion of the radiation generated by a semiconductor layer sequence into light with a different wavelength, so that the semiconductor device can emit mixed-colored light.
  • Semiconductor devices are a high color rendering index and high brightness of the light source possible.
  • the light-emitting semiconductor component can in particular be used as an epitaxially grown semiconductor layer sequence
  • Semiconductor layer sequence may be embodied in particular as a semiconductor chip.
  • the semiconductor layer sequence can be
  • the light-emitting semiconductor component can in particular be designed as a light-emitting diode (LED).
  • LED light-emitting diode
  • the emitting semiconductor component can have, for example, a housing body in which the epitaxially
  • the semiconductor light-emitting device is embedded.
  • the semiconductor light-emitting device may also be epitaxially grown
  • Housing body to be mounted.
  • emitting semiconductor components of the plurality of light-emitting semiconductor components each emit light having a same wavelength or a same wavelength range and thus with a same color impression.
  • Semiconductor devices of the plurality of light-emitting semiconductor devices also radiate different colored light, so that the superposition of different colored light of the plurality of light-emitting Semiconductor devices leads to a mixed-color light for the light module.
  • the light module of the light source has a convection cooling body.
  • the convection cooling body can be arranged in particular laterally to the semiconductor components. This means that the convection cooling body is arranged in the emission direction next to and thus laterally offset from the semiconductor components.
  • the convection cooling body can furthermore be particularly preferably thermally connected to the carrier body. As a result, it may be possible to advantageously heat, which in the operation of the semiconductor light-emitting components
  • Convection heat sink can be delivered. Furthermore, the convection cooling body can extend away in the emission direction of the mounting surface. This may mean, in particular, that the convection cooling body radiates in the emission direction from the carrier body and thus from the light
  • the convection heat sink can also be against the
  • Convection heat sink at least two wall elements, between which a plurality of thermally to the
  • Wall elements connected cooling fins is arranged, wherein one of the wall elements adjacent to the carrier body.
  • the two wall elements can be thermally thermally connected to respective opposite edges of each of the cooling fins, so that the wall elements with the cooling fins each form cavities, which of a Cooling medium, in particular air, can be flowed through.
  • a Cooling medium in particular air
  • the cooling fins are arranged such that a cooling medium, in particular air, by convection, the convection cooling body at least
  • the wall elements may extend in particular away from the mounting surface of the carrier body along the emission direction, while the cooling fins between the wall elements at least partially also along the
  • Cooling fins Extend emission direction away from the mounting surface. This may mean, for example, that the cooling fins are arranged perpendicular to the mounting surface. Furthermore, it may also mean that the cooling fins are arranged inclined to the emission direction and thus inclined to the mounting surface. By inclined to the radiation direction cooling fins can with
  • Radiation direction or against the emission direction can be achieved.
  • a chimney effect can be achieved by the convection cooling body, through which the cooling medium, in particular air, effectively the convection cooling body
  • emitting semiconductor devices can be removed.
  • this can reduce the temperature of the light
  • emitting semiconductor components can be lowered or it can be ensured that the temperature in the semiconductor layer sequences of the semiconductor components does not exceed a certain maximum temperature. This may make it possible that the radiated wavelength or the radiated
  • Wavelength range and thus the color temperature of the light emitted by the semiconductor devices light remain more stable compared to known lights with LEDs. As a result, for example, brightness and color drifts can be reduced. Furthermore, due to an effective cooling the
  • Life of the light-emitting semiconductor devices can be extended with advantage.
  • Mounting surface have a shape that is selected from a group, which is formed by a circle, a
  • a spline is referred to as a spline which has curve pieces set against each other continuously and without kinking, each of which can be defined, for example, by polynomial functions, circular functions, elliptical functions and / or trigonometric functions.
  • a spline can thus also as
  • Freeform curve are designated, in particular in
  • the carrier body can have an annular mounting surface.
  • annular mounting surface As an annular
  • Mounting surface is here and hereinafter referred to a mounting surface which is strip-shaped and a
  • the annular mounting surface is designed in the form of a circular ring or an ellipse ring or strip-shaped along a closed spline.
  • the mounting surface can be limited, for example, by at least one edge line and the convection cooling body can adjoin the edge line and follow the edge line.
  • a wall element of the convection cooling body can follow the edge line of the mounting surface.
  • Carrier body is adapted, a large-area connection of the convection cooling body can be achieved to the carrier body, although the carrier body laterally to the
  • Semiconductor devices is arranged.
  • the carrier body is designed such that it has an annular, for example annular or elliptical ring-shaped or strip-shaped, mounting surface running along a closed spline
  • the wall elements of the convection cooling body can be particularly preferably form an equally shaped cylinder ring in which the cooling fins are arranged.
  • the side surface may be diffuse or directionally reflective, that is, in the latter case, shiny executed.
  • the side surface may be formed by a side surface of one of the wall elements of the convection cooling body, which adjoins the carrier body.
  • One or both of the wall elements of the convection cooling body can be arranged parallel to the emission direction of the light-emitting semiconductor components and thus perpendicular to the mounting surface of the carrier body.
  • one or both of the wall elements can also be inclined at an angle different from 90 ° to the mounting surface, in other words, different from 0 ° to the emission direction, be arranged. Is that the light, for example?
  • the light module can have a further convection cooling body, which is likewise arranged laterally to the semiconductor components and is thermally connected to the carrier body.
  • the further convection cooling body can likewise extend away from the mounting surface in the emission direction.
  • the light-emitting semiconductor components are between the
  • the carrier body for example, has a ring shape with two edges, on each of which a convection cooling body is arranged.
  • the further convection cooling body can have one or more of the aforementioned features for the convection cooling body.
  • the light module can be an optical element
  • the optical element can be designed, for example, transparent or translucent and
  • the optical element can also be used as an optical diffuser
  • the light source may comprise a plurality of light modules, each of which may have one or more of the aforementioned features and / or one or more of the aforementioned embodiments. Particularly preferred, the light modules to each other
  • the light modules can adjoin one another in such a way that at least one convection cooling body of a light module adjoins the carrier body of an adjacent light module Light module adjacent and thermally with this m contact is. This may mean, in particular, that the majority of
  • Light modules are arranged such that in each case a carrier body is always arranged between two convection cooling bodies. This can advantageously contribute to a convection cooling body, for example for cooling of at least two carrier bodies.
  • a first and a second of the plurality of light modules may be formed annularly of different sizes, wherein the first light module surrounds the second light module and directly adjoins the second light module. This may mean in particular that the first and the second light module are arranged one inside the other. If the light source has more than two light modules, then in a particularly preferred embodiment they can all be of annular design with different sizes and be arranged one inside the other.
  • the mounting surface of the second light module which is surrounded by the first light module, in the emission direction to the mounting surface of the first
  • Light module can be arranged offset.
  • the mounting surface of the second light module can be arranged in the emission direction in front of the mounting surface of the first light module.
  • the carrier body of the light modules can form a staircase or stepped arrangement, whereby the light source, for example, a stepped pyramidal overall shape
  • the light source furthermore has a fastening element on which the at least one light module or the plurality of light modules is arranged and are attached.
  • the fastening element can in particular also serve for the electrical connection of the one or more light modules and for this purpose have suitable electrical leads and connection possibilities for the light modules.
  • the fastener may be formed, for example, column or peg-shaped and the light module may surround the fastener annular.
  • fastening element may also be suitable for being arranged and fastened in an already existing or known lamp socket or mounting device.
  • the light source can be arranged without additional measures, for example, in a known lamp socket.
  • the light source can be designed as a so-called retrofit light source. The fact that the light source has the convection cooling body, no further measures for cooling the light source and in particular the light-emitting
  • Retrofit LED modules which often get too hot when mounted in existing lamp sockets without further cooling, can be advantageously avoided.
  • the light source in a preferred
  • Embodiment a ceiling spotlight or a
  • Ceiling light form which has fixed by means of the fastening element light modules, which are arranged spaced from a ceiling, so that an effective convection can take place through the convection heat sink. As a result, the light emitted by the operation of the light
  • Figure 1 is a schematic representation of a light source
  • Figure 2 is a schematic representation of a light source
  • FIGS. 3A to 3E show different schematic representations of a light source according to another
  • Figure 4 is a schematic representation of a light source
  • FIG. 1 shows an exemplary embodiment of a light source 100 that has a light module 10.
  • the light module 10 has a carrier body 1 with a plurality of light-emitting semiconductor components 3.
  • the carrier body 1 is annular in the embodiment shown.
  • the carrier body 1 has a mounting surface 11, which is annular, in particular annular, is formed.
  • the carrier body 1 is designed as a board which on the mounting surface 11th
  • the light-emitting semiconductor components 3 are designed as epitaxially grown semiconductor layer sequences in the form of semiconductor chips, which are arranged directly on the carrier body 1. For example, the lights
  • LEDs light-emitting diodes
  • Mounting surface 11 of the support body 1 may be arranged, each group at least one light-emitting
  • Semiconductor device 3 which emits red light
  • at least one light-emitting semiconductor device 3 the green Light radiates
  • at least one light-emitting semiconductor device 3 the green Light radiates
  • different colored light can be a mixed-color
  • Semiconductor devices 3 radiated light may be this downstream in the emission and an optical element, such as an optical diffuser (not shown).
  • the semiconductor components 3 emit the light along the emission direction 99 indicated by the arrow.
  • the light module 10 has a convection cooling body 2 which is laterally, that is to say in a plane perpendicular to the emission direction 99, to the semiconductor components 3
  • the convection heat sink 2 is here
  • the convection cooling body 2 has two wall elements 22 and 23, between which a plurality of thermally to the
  • the convection cooling body 2 has a basic shape, which is adapted to the mounting surface 11 of the carrier body 1. This means in the embodiment shown in particular that the convection cooling body 2 is also annular and that the wall elements 22, 23 form a cylindrical ring in which the cooling fins 24 are arranged. Alternatively to the illustrated annular embodiment of
  • Carrier body 1 and the convection heat sink 2 in the shown Embodiment of Figure 1 also have a different shape, such as an elliptical ring shape or a ring shape along a closed spline.
  • the cooling ribs 24 are arranged such that a cooling medium, in particular air, by convection the convection cooling body 2 at least partially in or against the emission direction 99th
  • the light source 100 can be used with the light module 10 as ceiling lighting, so that air by convection against the
  • Abstrahlraum 99 can flow through the convection heat sink 2. According to the number of light-emitting
  • Abstrahlraum 99 are arranged. This can be a
  • Convection heat sink 2 are also the cooling fins 24th
  • emitting semiconductor devices 3 can be increased with advantage and on the other brightness and color variations that can be caused by temperature fluctuations or drifts can be reduced.
  • the convection cooling body 2 is made of a thermally highly conductive material, such as a metal such as aluminum and / or copper. To increase the emission of light in the emission direction 99, the convection cooling body 2 has a light
  • Side surface of the wall member 22 is formed and which is formed reflective.
  • the side surface 25 depending on the desired Abstrahl characterizing be diffused or directed reflective.
  • the wall element 22 of the convection cooling body 2 can be any wall element 22 of the convection cooling body 2.
  • Mounting surface 11 in other words, for parallel arrangement to the emission direction 99, also be inclined, so with an angle different from 90 ° to
  • Mounting surface 11 in other words, different from 0 ° to the emission direction 99. This may advantageously by the reflective properties of the side surface 25 a desired light distribution and emission characteristics
  • the light source 100 and in particular the light module 10 may additionally have other elements such as fastening, mounting and / or electrical connection elements, which are not shown for clarity.
  • Semiconductor devices 3 are not required convection cooling body or active cooling such as by fans for the light source 100 shown.
  • convection cooling body or active cooling such as by fans for the light source 100 shown.
  • emitting semiconductor devices 3 are efficiently transferred to the air flowing through the convection heat sink 2.
  • the further figures show further exemplary embodiments of light sources 200, 300, 400 which are based on the principle of the light source 100 according to the exemplary embodiment in FIG. In the following description are therefore in the following description.
  • FIG 2 an embodiment of a light source 200 is shown, wherein the view of the light source 200 in a Direction to the light-emitting semiconductor devices 3 opposite to the emission direction 99 is shown.
  • the light source 200 has a light module 10 according to the previous one
  • Embodiment in particular ring circular, that is with a correspondingly shaped mounting surface 11 of the carrier body 1 and a correspondingly shaped
  • Convection heat sink 2 is formed.
  • the light source 200 has a further light module 20, which has a carrier body 1 'with a mounting surface 21 on which further light-emitting semiconductor components 3 are arranged.
  • the light module 20 furthermore has a convection cooling body 2 ', which is thermally connected to the carrier body 1 and which extends laterally relative to the carrier body 1 or the light-emitting semiconductor components 3 arranged in the emission direction away from the mounting surface 21 of the carrier body 1'.
  • the light module 20 surrounds the light module 10, the support body 1 of the light module 10 also being in thermal contact with the convection cooling body 2 'of the light module 20.
  • the carrier body 1 of the light module 20 is thermally connected both to the convection heat sink 2 and to the convection heat sink 2 ', whereby a very effective heat dissipation of the light-emitting semiconductor devices 3 of the light module 10 can be ensured to the surrounding air.
  • the light module 20 additionally has another one
  • Mounting surface 21 of the support body 1 ' is connected.
  • emitting semiconductor devices 3 are aligned to the most effective convection through the
  • Convection heat sink 2, 2 ', 2' 'reflective designed to allow effective light emission in the emission direction and thus a desired light distribution.
  • the light-emitting semiconductor components 3 of the light module 10 and of the light module 20 can in each case be made different from one another or else the same, in order to produce a desired fixed or variable luminous impression
  • Semiconductor devices 3 between or in the emission direction over the convection heat sinks 2, 2 ', 2' 'optical elements such as optical diffusers or lenses may be arranged downstream to a desired homogeneous
  • Luminous surface the light-emitting semiconductor devices 3, in particular translucent
  • more than two light modules can also be arranged one inside the other.
  • FIGS. 3A to 3E show an exemplary embodiment of a light source 300.
  • the following description refers equally to all figures 3A to 3E.
  • FIG. 3A a schematic representation of FIG.
  • Light source 300 in an oblique view and in Figure 3E is a schematic representation shown in a side view, wherein in Figures 3A and 3E, the light source is shown in each case with all light modules. Individual light modules of the light source 300 are shown in FIGS. 3B, 3C and 3D for easier understanding.
  • the light source 300 has three light modules 10, 20, 30, which are designed according to the light modules of the light sources of the previous embodiments.
  • each of the light modules 10, 20, 30 has light-emitting
  • each light module 10, 20, 30 has a convection cooling body 2, 2 ', 2' ', which according to the description of the previous embodiments
  • the light modules 10, 20, 30 are arranged in one another such that the mounting surfaces 21 and 31 of the light modules 20 and 30, which are each surrounded by another light module, namely the light modules 10 and 20, to the respective
  • Mounting surface of the surrounding light module in the emission direction is arranged offset. This results in a staircase or stepped arrangement of the mounting surfaces 11, 21, 31 and thus a corresponding step-shaped
  • the light modules 10, 20, 30 are arranged and fixed to a fastening element 4, which is also provided for the electrical connection of the light modules 10, 20, 30 and corresponding electrical lines and
  • Fastening elements by means of which the light modules 10, 20, 30 can be fixed to the fastening element 4, not shown.
  • the fastening element 4 is in this case
  • Ceiling element 5 can be arranged and fixed, wherein the ceiling element 5, for example, an existing version or holder for a known
  • Ceiling lighting element for example with a
  • Metal vapor lamp or other known lamp having.
  • the light source 300 is thus referred to as a so-called retrofit
  • Light source running which can be attached to an existing socket or an existing lamp holder and easily already known ceiling light sources can replace.
  • the fastening element 4 is designed in such a way that the light module 10 arranged closest to the ceiling element 5 has a spacing of approximately 5 cm or more, so that warm air flowing through the convection cooling bodies 2, 2 'and 2 "due to the convection projects upward and can flow away to the side.
  • those emitting the light may also be used.
  • Light source 300 according to the embodiment shown with a distance of the uppermost light module 10 to the ceiling element 5 of about 6 cm have shown that effective cooling of the light-emitting semiconductor devices 3 at a
  • Figure 4 is another embodiment of a
  • Light source 400 is shown having compared to the light source 300 according to the figures 3A to 3E three light modules 10, 20, 30 with different diameters which are arranged inside each other, wherein the mounting surfaces 11, 21, 31 of the respective light source modules 10, 20, 30 in a level are arranged. This can be a very flat

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne une source lumineuse comportant un module lumineux (10), un corps de support (1) pourvu d'une pluralité d'éléments semi-conducteurs électroluminescents (3) et d'un corps de refroidissement par convection (2). Les éléments semi-conducteurs (3) sont agencés sur une surface de montage (11) du corps de support (1), et lorsqu'ils fonctionnent, ils émettent de la lumière dans une direction de rayonnement (99). Le corps de refroidissement par convection (2) est disposé latéralement par rapport aux éléments semi-conducteurs (3), est relié thermiquement au corps de support (1), et s'étend dans la direction de rayonnement (99) à partir de la surface de montage (11).
PCT/EP2011/063787 2010-08-18 2011-08-10 Source lumineuse Ceased WO2012022662A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010034664.0 2010-08-18
DE102010034664.0A DE102010034664B4 (de) 2010-08-18 2010-08-18 Lichtquelle

Publications (1)

Publication Number Publication Date
WO2012022662A1 true WO2012022662A1 (fr) 2012-02-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/063787 Ceased WO2012022662A1 (fr) 2010-08-18 2011-08-10 Source lumineuse

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DE (1) DE102010034664B4 (fr)
WO (1) WO2012022662A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010034664B4 (de) 2010-08-18 2018-06-14 Osram Opto Semiconductors Gmbh Lichtquelle
DE102012205072A1 (de) * 2012-03-29 2013-10-02 Osram Gmbh Halbleiterlampe mit kühlkörper
CN104603534B (zh) * 2012-08-17 2018-08-07 飞利浦照明控股有限公司 具有分裂烟囱结构的散热结构
JP6199970B2 (ja) * 2012-08-17 2017-09-20 フィリップス ライティング ホールディング ビー ヴィ 分割されたチムニー構造を有する熱放散構造
DE102018121705B4 (de) * 2018-09-05 2020-12-10 Eckart Neuhaus LED-Leuchtengehäuse für LED-Leuchte mit induzierter rotierender Wärmekonvektionsströmung

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