WO2012005294A1 - Electrostatic chuck device and production method for same - Google Patents

Abstract

Disclosed is an electrostatic chuck device which can suppress, as much as possible, the attachment of particles to a work-piece, can achieve sufficient adsorptive force, and has eliminated concerns of electrical discharge. Also disclosed is a production method for the electrostatic chuck device. The disclosed electrostatic chuck device is provided with an electrostatic chuck which is provided on a base and which internally comprises a work-piece adsorption electrode. The base forms an embossed work-piece adsorption surface having a plurality of protruding sections passing through the electrostatic chuck and protruding from the surface of the electrostatic chuck, with an insulating member lying between the outer periphery surface of the protruding sections and the work-piece adsorption electrode of the electrostatic chuck. In contrast to electrostatic chucks wherein the work-piece electrode has opening sections in positions corresponding to protruding sections, through-holes are formed which are smaller in size than opening sections, and the protrusions of the base are inserted into the through holes, thus superimposing the electrostatic chuck to the base, and forming the electrostatic chuck device.

Description

Electrostatic chuck device and manufacturing method thereof

The present invention relates to an electrostatic chuck device including an electrostatic chuck having a workpiece attracting electrode therein and a manufacturing method thereof.

Electrostatic chuck devices are widely used in the manufacturing processes of semiconductor devices and liquid crystal panel devices, but in recent years, particle management has become an important issue as the density of semiconductor devices increases. Therefore, an electrostatic chuck device having an embossed workpiece attracting surface in which a workpiece (object to be attracted) such as a semiconductor wafer or a glass substrate is supported by a plurality of protrusions is known. The purpose of this is to reduce as much as possible the particles adhering to the back surface of the work by reducing the contact area with the work.

The electrostatic chuck device having the embossed attracting surface is disclosed in, for example, Japanese Patent Application Laid-Open No. 2005-33125 (Patent Document 1), Japanese Patent Application Laid-Open No. 2008-181913 (Patent Document 2), and the like. In addition, a convex portion (protrusion) is provided on the surface of the dielectric to which the workpiece is attracted, and a workpiece attracting electrode is formed inside the dielectric body, or a workpiece attracting electrode is formed under the dielectric. It is common to arrange.

On the other hand, in Japanese Patent Application Laid-Open No. 2008-135736 (Patent Document 3), a conductive region is provided at the tip of a projection formed on the surface of an insulating substrate, and a recess (concave) formed between the projections. On the other hand, a monopolar electrostatic chuck apparatus in which a work adsorption electrode is formed by a conductive coating such as ion plating or sputtering is disclosed. This is because a conductive or semi-conductive wafer (workpiece) is brought into contact with the conductive region at the tip of the protrusion to prevent a voltage drop due to the contact resistance between the protrusion and the work, and between the work and the adsorption electrode. To prevent the generation of a high electric field region, and to configure a unipolar adsorption electrode so that the direction of the electric field between the workpiece and the adsorption electrode is one direction and the direction can be easily controlled. Thus, the peripheral particles are prevented from being attracted to the wafer.

JP 2005-33125 A JP 2008-181913 A JP 2008-135736 A

In an electrostatic chuck device having an embossed attracting surface, as described in Patent Documents 1 and 2, an attracting electrode is formed inside a dielectric body having a protrusion on the surface, or the dielectric In the form in which the suction electrode is arranged in the lower layer, a distance is generated between the workpiece suction electrode and the workpiece, and the suction force may not be sufficiently developed. In particular, in recent years, when an EUV (Extreme Ultra Violet) exposure machine with high resolution is used, the depth of focus (Z direction) is extremely shallow, and high accuracy is also required in the plane direction (XY direction). Quartz glass that can be processed and has low thermal expansibility is used as a dielectric. However, unlike ceramic glass, it is difficult to bury a flat adsorption electrode inside quartz glass. In addition, when trying to make the dielectric thin, quartz glass is insufficient in strength compared to ceramic and easily breaks.

On the other hand, as in the electrostatic chuck device described in Patent Document 3 above, if a suction electrode is provided alone in the recess between the protrusions, a protective film made of polyimide or the like is formed by vapor deposition or ion plating. Even if it is formed on the surface of the adsorption electrode (paragraph 0032 of Patent Document 3), the protective film and the protrusion of the insulating substrate form a bonding interface made of different materials, so the possibility of discharge cannot be excluded. .

Accordingly, the present inventors have made extensive studies on an electrostatic chuck device that can express a sufficient attracting force and eliminate the risk of electric discharge. An electrostatic chuck is disposed on the base so that the protrusion of the base is passed through the chuck, and an insulating member is interposed between the outer peripheral surface of the protrusion and the work chucking electrode of the electrostatic chuck. As a result, the present inventors have found that the above-mentioned problems can be solved and completed the present invention.

Accordingly, an object of the present invention is to provide an electrostatic chuck device that can express a sufficient attracting force while suppressing the adhesion of particles to a work as much as possible, and that eliminates the risk of discharge. is there.

Another object of the present invention is to provide a manufacturing method suitable for manufacturing the electrostatic chuck device.

That is, the present invention is an electrostatic chuck device having an electrostatic chuck having a workpiece attracting electrode for attracting a workpiece therein, the substrate penetrating through the electrostatic chuck. A plurality of protrusions protruding from the surface of the protrusion, and an embossed workpiece suction surface is formed by the top surface of the protrusion, and between the outer peripheral surface of the protrusion and the workpiece chucking electrode of the electrostatic chuck. Is an electrostatic chuck device in which an insulating member is interposed.

Further, the present invention is a method for manufacturing an electrostatic chuck device having an electrostatic chuck having a workpiece chucking electrode for chucking a workpiece between two insulating sheet members on a substrate, and a plurality of electrostatic chuck devices on the surface. First, using a base having a protrusion of the above and an electrostatic chuck in which the work attracting electrode has an opening at a position corresponding to the protrusion and the opening is filled with an insulating adhesive, A through hole having a size smaller than the opening is formed in the electrostatic chuck so as to pass between the front and back surfaces of the electrostatic chuck through the opening of the workpiece attracting electrode, and then the base protrusion on the through hole. An electrostatic chuck apparatus is characterized in that an electrostatic chuck is superposed on a substrate so as to be inserted, and an embossed workpiece attracting surface is formed by a top surface of a protrusion protruding from the surface of the electrostatic chuck. Is the method.

The electrostatic chuck device of the present invention has an electrostatic chuck disposed on a base so that the protrusion of the base penetrates the electrostatic chuck having a workpiece attracting electrode inside. The top surfaces of the plurality of protrusions protruding toward the chuck form an embossed workpiece suction surface. Regarding the shape of the protrusion, first, the top surface is preferably flattened by lapping or subsequent polishing. In addition, the cross-sectional shape of the protrusion is not particularly limited, such as a circle, an ellipse, or a polygon more than a triangle, but it is desirable that the outer peripheral surface of the protrusion is chamfered, preferably a circle or a shape close thereto. There should be.

In addition, the protrusion height of the protrusion represented by the height from the surface of the electrostatic chuck to the top surface of the protrusion is preferably from the viewpoint of reliably eliminating the possibility of foreign matters such as particles adhering to the back surface of the workpiece. Is preferably 5 μm or more, more preferably 5 μm or more and 20 μm or less. Further, from the viewpoint of the attraction force, the distance represented by the height from the surface of the workpiece attraction electrode to the top surface of the protrusion in the electrostatic chuck is preferably 50 μm or more and 300 μm or less, more preferably. Is preferably 50 μm or more and 100 μm or less.

In the present invention, the substrate is not particularly limited as long as it is formed using a low dusting material. In addition to a substrate made of glass or quartz glass, a resin such as polyimide, or a metal such as aluminum or stainless steel The base made of the product etc. can be mentioned. At that time, if the same material as that of the workpiece or a material whose linear expansion coefficient is closer to that of the workpiece is used, it is possible to prevent rubbing between the workpiece due to the shape change due to thermal expansion, and to generate excessive dust. Can be suppressed. Further, if the base is formed of a low thermal expansion material having a coefficient of thermal expansion of 1 ppm or less, it is advantageous in that it is possible to prevent the occurrence of rubbing as described above and to maintain dimensional accuracy. Since quartz glass and low thermal expansion glass ceramics, which are examples of such materials, have extremely small thermal expansion than ordinary glass, a substrate made of such a low thermal expansion material has EUV as well as low dust generation. The accuracy required when using an exposure machine can be satisfied.

Further, as a means for providing the protrusions on the base, for example, a method of performing a sandblasting process or an etching process through a mask that matches the arrangement pattern of the protrusions can be used. Other methods may be used, but by forming the protrusion and the base body other than the protrusion from the same material, it is easy to form the protrusion, and a hard and brittle material such as glass is used. Even in this case, a desired protrusion can be formed on the surface of the substrate.

The electrostatic chuck according to the present invention has a workpiece attracting electrode inside, and the electrostatic chuck is provided on the substrate in a state where the workpiece attracting electrode is not exposed on the front and back surfaces and side surfaces of the electrostatic chuck. In addition, an insulating member is interposed between the outer peripheral surface of the protrusion portion of the substrate and the workpiece attracting electrode so as to eliminate a portion where the substrate and the workpiece attracting electrode are in direct contact.

As means for forming such an electrostatic chuck on the substrate, for example, there are the following two methods. In the first method, first, an insulating material is applied to the depression formed between the protrusions on the substrate to form a lower insulating layer, and a work adsorption electrode is formed thereon using the conductive material. Further, from this, an insulating material is applied to form an upper insulating layer. When forming the workpiece attracting electrode, a predetermined gap is provided between the protrusion and the outer peripheral surface so that a part of the insulating material forming the upper insulating layer is filled in the gap. For example, an insulating member made of an insulating material can be interposed between the outer peripheral surface of the protrusion and the adsorption electrode.

In this first method, examples of the insulating material for forming the upper insulating layer and the lower insulating layer include resins and ceramics, and the upper insulating layer and the lower insulating layer may be formed of the same material. Different materials may be used, but at least the upper insulating layer formed on the workpiece adsorption surface is polyimide, polyethylene terephthalate (PET) in consideration of low dust generation and dielectric constant. It is preferably made of a resin such as a liquid crystal polymer. For forming these insulating layers, it is preferable to apply an insulating material by printing using an inkjet apparatus, screen printing, or the like. On the other hand, for the work adsorption electrode, a conductive material may be applied by printing a metal paint with an inkjet device or screen printing, or by sputtering or vapor deposition of metal. A work adsorption electrode made of a conductive material may be formed.

The second method is a method in which an electrostatic chuck having a work attracting electrode is formed between two insulating sheet members, and this is bonded to a substrate to form an electrostatic chuck device. In this case, the workpiece attracting electrode has an opening corresponding to the protrusion of the base in advance, and is smaller than the opening so as to penetrate between the front and back surfaces of the electrostatic chuck through this opening. A through-hole having a size is formed in the electrostatic chuck. Then, the protruding portion of the substrate is inserted into the through hole, the electrostatic chuck is overlapped with the substrate, and an embossed workpiece suction surface is formed by the top surface of the protruding portion protruding on the surface of the electrostatic chuck. That's fine.

In order to form an electrostatic chuck in this second method, first, an adsorption electrode having a predetermined opening is formed on one side of an insulating sheet member made of resin, ceramic, or the like by metal vapor deposition, sputtering, printing, or the like. Form. Or the adsorption | suction electrode which has a predetermined opening part from metal foil is formed by the etching process using a mask with respect to the insulating sheet member previously provided with metal foil, such as copper foil. Next, at least the opening is filled with an insulating adhesive such as silicone or epoxy resin, and another insulating sheet member is bonded to the workpiece adsorption electrode side. At this time, a resin film having an adhesive layer made of a thermoplastic resin or the like on one side may be used as an insulating sheet member, and the adhesive layer of the resin film may be filled in the opening by thermocompression bonding. If a through-hole having a size smaller than the opening is formed in the electrostatic chuck, an insulating member made of an insulating adhesive is provided between the protrusion of the base inserted into the through-hole and the workpiece adsorption electrode. Will be intervened.

The insulating sheet member that corresponds to the upper insulating layer on the workpiece adsorption surface side and the insulating sheet member that corresponds to the lower insulating layer on the substrate side may be formed of the same material or may be made of different materials, but at least the upper insulating layer The insulating sheet member is preferably made of a resin film such as a polyimide film, a PET film, or a liquid crystal polymer film in consideration of low dust generation and dielectric constant, and more preferably an upper insulating material. Both the insulating sheet member corresponding to the layer and the insulating sheet member corresponding to the upper insulating layer are preferably made of these resin films.

The electrostatic chuck superimposed on the substrate may be fixed on the substrate using an adhesive or an adhesive sheet coated with an adhesive, but preferably the coefficient of thermal expansion between the electrostatic chuck and the substrate. It is preferable to bond the electrostatic chuck and the substrate so that the stress generated at these interfaces is released due to the difference. This is particularly effective when the substrate is made of a low thermal expansion material such as quartz glass. As a specific means, for example, an electrostatic chuck and a substrate are bonded via a resin film that expresses van der Waals force (intermolecular force). This adhesive film is considered to have a fine projection having a fiber structure with a high aspect ratio on the order of submicron on the surface, and exhibit adhesive force due to a very weak intermolecular force. As a material for forming such an adhesive film, for example, silicone resin, polyamide, styrene butadiene rubber, chlorosulfonated polyethylene rubber, acrylonitrile butadiene rubber, ethylene propylene rubber, chloroprene rubber, butadiene rubber, fluorine rubber, isobutylene isoprene rubber, Examples thereof include urethane rubber.

Further, as another example, there is a method in which the electrostatic chuck has a substrate attracting electrode for attracting the substrate inside. That is, an intermediate insulating sheet member is provided between the workpiece adsorption electrode and the substrate adsorption electrode, having a workpiece adsorption electrode for adsorbing the workpiece between the two insulation sheet members and a substrate adsorption electrode for adsorbing the substrate. An electrostatic chuck with a gap interposed between them. At that time, the workpiece adsorption electrode and the substrate adsorption electrode have openings at positions corresponding to the protrusions of the substrate, respectively, and these openings are filled with an insulating adhesive and are smaller than the openings. If a through-hole of a size is formed in the electrostatic chuck, an insulating adhesive is formed between the base protrusion and the work suction electrode, and between the base protrusion and the base suction electrode. An insulating member will be interposed.

In both the first method and the second method, the thickness of the upper insulating layer on the workpiece adsorption surface side is preferably 25 μm or more and 200 μm or less, and preferably 50 μm or more and 100 μm or less. If at least the thickness of the upper insulating layer on the workpiece suction surface side is 25 μm, electrical insulation of the workpiece suction electrode can be ensured, and if it is 50 μm or more, the reliability can be further improved. . On the other hand, if the thickness of the upper insulating layer is 200 μm or less, there will be no problem in terms of expressing the adsorption force to the workpiece, and if it is 100 μm or less, it is advantageous in that the workpiece can be adsorbed with a sufficient force. is there. In addition, the thickness of the insulating member interposed between the outer peripheral surface of the protrusion and the work adsorption electrode (the distance between the outer peripheral surface of the protrusion and the work adsorption electrode) is 0.5 mm or more in order to ensure the insulation more reliably. Preferably, it is 0.7 mm or more and 1.5 mm or less. Insulating properties are easily ensured as the thickness of the insulating member increases. However, if the thickness of the insulating member exceeds 2 mm, the effect is not only saturated, but also the area of the workpiece attracting electrode is reduced with respect to the workpiece, which is not desirable.

Furthermore, as the work attracting electrode, a so-called monopolar type that applies a voltage to a work such as a semiconductor wafer or a glass substrate may be adopted, or a so-called bipolar type that provides a potential difference between the electrodes. May be adopted. In the case of a bipolar work attracting electrode, the electrodes may be arranged on the same plane, or the electrodes may be arranged vertically via an interelectrode insulating layer. The selection of the monopolar type or the bipolar type can be appropriately determined according to the conditions under which the apparatus is used. Moreover, the shape of the workpiece | work adsorption | suction electrode can be suitably determined according to the kind of workpiece | work etc., such as flat shape, semicircle shape, a comb-like shape, and a pattern shape like a mesh, for example. Furthermore, the thickness of the workpiece attracting electrode is not particularly limited, but is practically about 0.1 μm or more and 30 μm or less in consideration of design and the like.

According to the electrostatic chuck device of the present invention, it is possible to develop a sufficient attracting force while preventing the adhesion of particles to the work as much as possible, and to prevent discharge. In particular, even when quartz glass having a low thermal expansion, low thermal expansion glass ceramics, or the like is used as a base, an excellent adsorption force can be expressed, so that it is suitable for use in an EUV exposure machine or the like.

Moreover, in the manufacturing method of the electrostatic chuck device of the present invention as described in the second method, since the electrostatic chuck is formed in advance, the performance such as insulation is confirmed and then bonded to the substrate. be able to. Therefore, even if there is a design trouble or the like, it can be grasped in advance, and an electrostatic chuck device with excellent reliability can be obtained.

FIG. 1 is a perspective explanatory view showing an electrostatic chuck device of the present invention. FIG. 2 is a cross-sectional explanatory view of the electrostatic chuck device of FIG. FIG. 3 is a schematic diagram showing a procedure for forming an electrostatic chuck. FIG. 4 is a schematic plan view showing the state of the attracting electrode in the electrostatic chuck. FIG. 5 is a cross-sectional explanatory view showing a modification of the electrostatic chuck device of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the attached drawings.

[First embodiment]
FIG. 1 is a perspective explanatory view showing an electrostatic chuck device of the present invention. FIG. 1 (a) shows a state in which an electrostatic chuck 2 is bonded to a substrate 1, and FIG. The state after bonding is shown. FIG. 2 is a partial cross-sectional explanatory view showing the AA cross section in FIG. Of these, the substrate 1 is formed by forming a number of quartz glass projections 1b having a height of 170 μm and a top surface diameter of 1 mm on the surface of a quartz glass substrate body 1a having a diameter of 300 mm and a thickness of 10 mm. In the cross-sectional view shown in FIG. 2, the protrusions 1b are arranged adjacent to each other with a center distance of 10 mm. The substrate 1 is formed by grinding and removing surface damage by etching to form a protrusion 1b. The top surface of the protrusion 1b is flattened to a flatness of 0.2 μm by lapping. Has been processed. The base body 1a is formed with a refrigerant path (not shown) through which a cooling gas or the like flows.

Moreover, the electrostatic chuck 2 disposed on the substrate has a work attracting electrode 3 formed of copper foil inside, and is represented by the height from the surface of the electrostatic chuck 2 to the top surface of the protrusion 1a. the protruding height h ₁ of the protrusions to be a 10 [mu] m, a height h ₂ from the surface of the workpiece chucking electrode 3 to the top surface of the projecting portion 1a is 60 [mu] m. And between the outer peripheral surface of the protrusion part 1b of the base | substrate 1, and the workpiece | work adsorption | suction electrode 3, the insulating member 6 which consists of an adhesive agent made from silicone interposes.

The electrostatic chuck 2 according to this example was manufactured as follows. First, as shown to Fig.3 (a), what provided the copper foil 3 with a thickness of 10 micrometers on the single side | surface side of the insulating sheet member 4 which consists of a polyimide film with a thickness of 50 micrometers was used. The copper foil 3 is subjected to an etching process through a mask, and as shown in FIG. 3B, the opening diameter d ₁ = 2 mm corresponding to the position and shape of the protruding portion 1b of the substrate 1. A workpiece attracting electrode 3 having an opening 3c was formed. As shown in FIG. 4, the workpiece attracting electrode 3 is a bipolar workpiece attracting electrode having a semicircular first attracting electrode 3a and a second attracting electrode 3b. Connected to.

Next, as shown in FIG. 3C, the opening 3c of the work adsorption electrode 3 is filled with the silicone adhesive 6, and the insulating sheet member 5 made of a polyimide film having a thickness of 75 μm is stacked and pressed, The excess adhesive 6 formed an adhesive layer between the insulating sheet member 4 and the insulating sheet member 5 to obtain a laminate. Next, in order to be concentric with the opening 3c of the attracting electrode 3, so as to prevent the formation of burrs and suppress the generation of particles, the front and back surfaces of the laminate are penetrated by laser processing, and FIG. The electrostatic chuck 2 was obtained by forming a through hole 7 having an opening diameter d ₂ = 1.1 mm as shown in FIG.

Then, the protrusion 1b of the substrate 1 is inserted into the through hole 7 of the electrostatic chuck 2 obtained as described above, and the both are overlapped, and an electrostatic chuck is used by using a silicone adhesive (not shown). 2 was bonded to the base body 1a to complete the electrostatic chuck device according to this example. In the obtained electrostatic chuck device, the protrusion 1b of the substrate 1 forms a workpiece attracting surface for attracting a workpiece such as a semiconductor wafer or a glass substrate, and is made of silicone remaining in the opening 3a of the workpiece attracting electrode 3. The adhesive 6 forms the insulating member 6 between the outer peripheral surface of the protrusion 1b and the workpiece attracting electrode 3.

The electrostatic chuck device thus obtained can exhibit a high adsorption force while eliminating the risk of electric discharge, and the substrate including the protrusions is made of quartz glass. Very few. Therefore, rubbing between a workpiece such as a semiconductor wafer or a glass substrate and the suction surface is unlikely to occur, and since an embossed workpiece suction surface is provided, particle adhesion to the workpiece can be suppressed as much as possible. . Furthermore, since the shape change of the substrate is extremely small, it is possible to achieve a high level of accuracy required for an EUV exposure machine.

Further, when the electrostatic chuck 2 is bonded to the base body 1a, a 50 μm thick silicone resin film (manufactured by Fuso Rubber Industrial Co., Ltd .: trade name Sirius) may be used instead of the silicone adhesive. Since this resin film has fine protrusions formed on the surface and exhibits an adhesive force due to a very weak intermolecular force, the electrostatic chuck 2 can be adhered to the substrate body 1a, and an EUV exposure machine or the like. Thus, even if the electrostatic chuck device is used and exposed to a high temperature, only the electrostatic chuck 2 is not expanded and the base 1 is not distorted. Furthermore, since this resin film can be repeatedly bonded and the electrostatic chuck 2 and the substrate 1 can be easily separated, it is advantageous in terms of maintenance.

[Second Embodiment]
FIG. 5 shows a modification of the electrostatic chuck device according to the first embodiment, in which the electrostatic chuck 2 attracts the substrate 1 in addition to the workpiece attracting electrode 3 that attracts the workpiece. 8 is provided inside. In obtaining this electrostatic chuck 2, until the work attracting electrode 3 is formed by using an insulating sheet member 4 made of a polyimide film having a thickness of 50 μm and having a copper foil 3 having a thickness of 10 μm on one side. It is the same as that of one embodiment. In the present embodiment, the insulating sheet member 5 made of a polyimide film having a thickness of 50 μm is provided with a copper foil 8 having a thickness of 10 μm on one side, and the copper foil 8 is interposed through a mask. Etching is performed to form an opening with an opening diameter d ₁ = 2 mm corresponding to the position and shape of the protrusion 1b of the substrate 1 in the same manner as in the case of the workpiece adsorption electrode 3, and a comb-like electrode Bipolar substrate adsorption electrodes 8 in which the portions 8a and 8b were alternately incorporated were formed. At that time, the width of the electrode portions 8a and 8b was set to 0.7 mm, respectively, and the distance between the electrodes of the electrode portions 8a and 8b was set to 0.7 mm. The substrate suction electrode 8 can be connected to a DC power source (not shown) different from the workpiece suction electrode 3.

Next, a silicone adhesive 6 is applied to each of the workpiece adsorption electrode 3 and the substrate adsorption electrode 8 so that the adhesive 6 is filled in the openings and the gaps between the electrodes. The insulating sheet member 4 and the insulating sheet member 5 were stacked and pressed by interposing an intermediate insulating sheet member 9 made of a polyimide film. Next, in the same manner as in the first embodiment, a through hole 7 having an opening diameter d ₂ = 1.1 mm was formed, and the electrostatic chuck 2 was obtained.

Then, the protrusion 1b is superposed on the same base 1 as in the first embodiment except that the height of the protrusion 1b is adjusted so that the protrusion 1b is inserted through the through hole 7 of the electrostatic chuck 2. Thus, an electrostatic chuck device having a height h ₁ = 10 μm and a height h ₂ = 60 μm from the workpiece attracting electrode 3 to the top surface of the protrusion 1a was obtained. In this electrostatic chuck device, the electrostatic chuck 2 is held on the substrate by applying a voltage to the substrate attracting electrode 8, and on the other hand, a workpiece such as a semiconductor wafer or a glass substrate is applied by applying a voltage to the workpiece attracting electrode 3. Can be adsorbed. Therefore, even when the electrostatic chuck device is exposed to a high temperature, only the electrostatic chuck 2 does not expand and does not distort the substrate 1, and the electrostatic chuck 2 and the substrate 1 can be easily separated. Therefore, it is advantageous also in terms of maintenance.

1: Base
1a: Main body
1b: Protrusion part 2: Electrostatic chuck 3: Adsorption electrode
3a: First adsorption electrode
3b: Second adsorption electrode
3c: Opening part 4: Insulating sheet member 5: Insulating sheet member 6: Adhesive (insulating member)
7: Through hole 8: Substrate adsorption electrode
8a: First adsorption electrode
8b: Second adsorption electrode

Claims (13)

An electrostatic chuck device having an electrostatic chuck having a workpiece chucking electrode inside for chucking a workpiece on a substrate,
The base has a plurality of protrusions that penetrate the electrostatic chuck and protrude from the surface of the electrostatic chuck, and an embossed workpiece suction surface is formed by the top surface of the protrusion. An electrostatic chuck device, wherein an insulating member is interposed between the surface and the workpiece chucking electrode of the electrostatic chuck. 2. The electrostatic chuck device according to claim 1, wherein a distance represented by a height from the surface of the workpiece attracting electrode to the top surface of the protrusion is 50 μm or more and 300 μm or less. The electrostatic chuck device according to claim 1, wherein the base is made of a low thermal expansion material having a coefficient of thermal expansion of 1 ppm or less. The electrostatic chuck device according to any one of claims 1 to 3, wherein the electrostatic chuck has a bipolar work suction electrode. 5. The electrostatic chuck includes a substrate adsorption electrode for adsorbing the substrate inside, and an insulating member is interposed between the outer peripheral surface of the protrusion of the substrate and the substrate adsorption electrode. An electrostatic chuck apparatus according to claim 1. The electrostatic chuck device according to any one of claims 1 to 4, wherein the electrostatic chuck and the substrate are bonded via a resin film that exhibits van der Waals force. A method of manufacturing an electrostatic chuck device comprising an electrostatic chuck having a workpiece chucking electrode for chucking a workpiece between two insulating sheet members on a substrate,
Using a substrate having a plurality of protrusions on the surface, and an electrostatic chuck in which a work adsorption electrode has an opening at a position corresponding to the protrusion, and the opening is filled with an insulating adhesive And
First, a through-hole having a size smaller than the opening is formed in the electrostatic chuck so as to penetrate between the front and back surfaces of the electrostatic chuck through the opening of the work attracting electrode.
Next, the embossed workpiece attracting surface is formed by the top surface of the projecting portion protruding on the surface of the electrostatic chuck by superimposing the electrostatic chuck on the substrate so that the projecting portion of the substrate is inserted into the through hole. A method of manufacturing an electrostatic chuck device characterized by the above. An electrostatic chuck is formed by forming a work adsorption electrode having an opening in one insulating sheet member, and then bonding the other insulating sheet member so that at least the opening is filled with an insulating adhesive. The manufacturing method of the electrostatic chuck apparatus of Claim 7 which obtains. The method for manufacturing an electrostatic chuck device according to claim 7 or 8, wherein a distance represented by a height from a surface of the workpiece attracting electrode to a top surface of the protrusion is not less than 50 µm and not more than 300 µm. 10. The method for manufacturing an electrostatic chuck device according to claim 7, wherein the substrate is made of a low thermal expansion material having a coefficient of thermal expansion of 1 ppm or less. The method for manufacturing an electrostatic chuck device according to any one of claims 7 to 10, wherein the electrostatic chuck is provided with a bipolar work attracting electrode. It has a work adsorption electrode for adsorbing a workpiece between two insulating sheet members and a substrate adsorption electrode for adsorbing the substrate, and an intermediate insulation sheet member is interposed between the workpiece adsorption electrode and the substrate adsorption electrode The workpiece chucking electrode and the substrate chucking electrode have openings at positions corresponding to the protrusions of the substrate, respectively, and these openings are filled with an insulating adhesive. The method of manufacturing an electrostatic chuck device according to any one of claims 7 to 11, wherein an adhesive is used. The method of manufacturing an electrostatic chuck device according to any one of claims 7 to 11, wherein the electrostatic chuck and the substrate are bonded via a resin film that expresses van der Waals force.

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