WO2012002383A1 - Target mounting mechanism - Google Patents

Abstract

A target mounting mechanism detachably mounts a cylindrical target, which is used in a spattering device, to connection sections of cathodes. The target is provided with cylindrical base bodies and also with a target member which covers the base bodies, and the target has a center region in which the target member is disposed and which has connection regions from which the base bodies are exposed at the opposite ends of the target which are located outside the center region. The connection sections of the cathodes each comprise a substantially cylindrical clamp in which the connection section and the connection region are present. A first engagement protrusion section formed in each of the connection regions of the target and a second engagement protrusion section formed in the inner peripheral surface of the clamp are engaged with each other when the connection section and the connection region move relative to each other only in the circumferential direction of the target while the connection section and the connection region are present within the clamp.

Description

Target mounting mechanism

The present invention relates to a target mounting mechanism of a sputtering apparatus, and more particularly to a target mounting mechanism that can easily and reliably mount a cylindrical target to a cathode.
This application claims priority based on Japanese Patent Application No. 2010-146617 filed in Japan on June 28, 2010, the contents of which are incorporated herein by reference.

For example, Low-E glass (low emission glass) is becoming popular as glass for building materials.
This type of Low-E glass is formed by forming a metal thin film on the glass surface. Conventionally, when forming a metal thin film on the surface of glass or the like, film formation is performed using a magnetron sputtering apparatus provided with a flat target (hereinafter simply referred to as a target).

However, with the recent increase in size of glass for building materials, it is difficult for a flat target to form a metal film with a uniform thickness on the entire glass surface.
A sputtering apparatus using a cylindrical target has been proposed as means for depositing a metal film with a uniform thickness and uniformity on such a large area deposition target (see, for example, Patent Document 1). In addition, the cylindrical target is characterized by higher usage efficiency than the flat target.

In a sputtering apparatus using a cylindrical target, the cylindrical target is attached to the cathode electrode at both ends along the rotation axis direction (longitudinal direction). Conventionally, as a configuration for attaching a target to a cathode electrode, for example, a semi-circular groove is formed in a spiral shape in a clamp that engages with the cathode electrode, and a semi-circular groove is also formed in a spiral shape at the end of the target. To form. A coupling system is disclosed in which a target is attached to a cathode electrode by inserting a cylindrical spiral ring into one of the grooves and engaging the spiral ring with the other groove (see Patent Document 2).

JP 2010-1000093 A JP-T-2006-521515

However, in the connection system as described in Patent Document 2 described above, when the cylindrical target is attached to the cathode electrode, the target and the clamp are engaged via the spiral ring. It was difficult to accurately align and attach the center axis of the electrode to the center of rotation of the cathode electrode. For this reason, there is a problem that the target is eccentric and easily rotates, the erosion pattern is not stable, and the life of the target is short.

In addition, for example, when a large target such as several meters in length is used to form a film on a large deposition object such as one side of a film formation surface of several meters, when attaching the target to the cathode electrode, It was necessary to rotate the clamp with a large force using a dedicated tool, and much effort was required for mounting the target.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a target mounting mechanism capable of easily mounting a cylindrical target to a cathode at an accurate mounting position. It is another object of the present invention to provide a target mounting mechanism capable of making the erosion pattern of the target uniform and extending the life of the target.

(1) One aspect of the present invention is a target mounting mechanism that detachably mounts a cylindrical target used in a sputtering apparatus to a connecting portion of a cathode,
The target includes a cylindrical base body and a target material covering the base body, a central region where the target material is disposed, and a connection region where the base body is exposed at both ends excluding the central region. A connecting portion of the cathode formed with a substantially cylindrical clamp that internally includes the connecting portion and the connecting region; a first engaging convex portion formed in the connecting region of the target; The second engagement convex portion formed on the inner peripheral surface of the clamp is relatively moved only along the circumferential direction of the target in a state where the connection portion and the connection region are present in the clamp. Are engaged.

(2) In the aspect described in (1) above, the torque required for the engagement between the first engagement protrusion and the second engagement protrusion is 1 (kgf · cm) or more, It is preferably 20 (kgf · cm) or less.

(3) In the aspect described in (1) above, the contact surface between the first engagement protrusion and the second engagement protrusion is short in the circumferential direction of the target, and the axis of the target It is preferable that the direction is a longitudinal shape.

(4) In the aspect described in (1) above, a structure may be provided that generates a signal for determining that the engagement operation between the first engagement convex portion and the second engagement convex portion is completed. preferable.

(5) In the aspect described in (1) above, three or more of the second engaging convex portions are formed, are on the same line in the inner peripheral surface direction of the clamp, and are viewed around the rotation axis of the target. The other second engaging projections are also axisymmetric with respect to a line segment that is also on the imaginary circle and passes through the center and at least one of the second engaging projections. It is preferable that they are arranged.

(6) In the aspect described in the above (1), further includes a gasket ring provided at a portion extending perpendicularly to the axis of the connecting portion of the cathode and a contact portion with the base. Is preferred.

(7) In the aspect described in (1) above, it is preferable to further include a fixing unit that closely contacts the base and a portion of the connecting portion of the cathode that extends perpendicular to the axis.

(8) In the aspect described in (1) above, it is preferable to further include a spacer disposed in a gap between the portion of the cathode that extends perpendicularly to the axial center of the connecting portion and the clamp.
(9) In the case of (8) above, it is preferable that the spacer is subjected to a surface treatment.

As described above, according to the aspect described in (1) above, when the cylindrical target is attached to the cathode of the sputtering apparatus, the clamp formed on the cathode is inserted into the connection region at the end of the target. The first engaging convex portion and the second engaging convex portion can be engaged with each other only by relatively moving along the circumferential direction of the target, and the cylindrical target can be attached to the cathode.

For this reason, the center of the cathode and the axis of the target can be easily matched by the engagement of the first engagement convex part and the second engagement convex part, and the target is rotated about the axis. And can be rotated without eccentricity. Thus, the distance between the film formation target and the target is uniform over the entire circumference of the target, and a film having a uniform thickness with no unevenness can be formed over the entire surface of the film formation target.

Even when a large and heavy target is used, when the target is attached, the second engagement convex portion and the first engagement convex portion are simply moved relative to each other only along the circumferential direction of the target. And the target can be attached to the cathode. For this reason, there is no need to rotate the clamp with a large force using a dedicated tool as in the past, and it is easy to rotate the clamp along the circumferential direction of the target with a small force without using a dedicated tool. It becomes possible to attach the target to the cathode.

It is a longitudinal cross-sectional view of the sputtering device which concerns on one Embodiment of this invention. It is a principal part expansion perspective view which shows the area | region containing the target in the sputtering device. It is an expansion perspective view which shows the target attachment mechanism of the embodiment. It is sectional drawing which shows the target attachment mechanism of the embodiment. It is explanatory drawing which shows the attachment process of the target of the embodiment in steps. It is explanatory drawing which shows the attachment process of the target of the embodiment in steps. It is explanatory drawing which shows the attachment process of the target of the embodiment in steps. It is explanatory drawing which shows the attachment process of the target of the embodiment in steps. It is explanatory drawing which shows the attachment process of the target of the embodiment in steps. It is explanatory drawing which shows the example of arrangement | positioning of the 2nd engagement convex part in the embodiment. It is explanatory drawing which shows the example of arrangement | positioning of the 2nd engagement convex part in the embodiment. It is explanatory drawing which shows the example of arrangement | positioning of the 2nd engagement convex part in the embodiment. It is an expansion perspective view which shows another embodiment of the target attachment mechanism of this invention. It is sectional drawing which shows another embodiment of the target attachment mechanism of this invention. It is explanatory drawing which shows the attachment process of the target in another embodiment in steps. It is explanatory drawing which shows the attachment process of the target in another embodiment in steps. It is explanatory drawing which shows the attachment process of the target in another embodiment in steps.

Hereinafter, an embodiment of a target mounting mechanism according to the present invention will be described with reference to the drawings. The present embodiment is specifically described for better understanding of the gist of the invention, and does not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for the sake of convenience. Not necessarily.

First, a magnetron sputtering apparatus (hereinafter referred to as a sputtering apparatus) provided with the target mounting mechanism of the present embodiment will be described.
FIG. 1 is a longitudinal sectional view showing the configuration of the sputtering apparatus. FIG. 2 is an enlarged perspective view of a main part showing a region including the target.
The sputtering apparatus 10 includes a reaction chamber 11, an anode (anode) 12, a cathode (cathode) 13, a vacuum pump 17, and an Ar gas supply device 18. The inside of the reaction chamber 11 can be depressurized by a vacuum pump 17 and is depressurized, for example, to a degree of vacuum of about 6 Pa during film formation.

The anode (anode) 12 is composed of, for example, a plurality of flat electrodes. The anode 12 only needs to be electrically connected to the ground via a power cable. An object to be deposited, for example, a glass plate 19 is placed on one surface of the anode 12 that is such a flat electrode.

The cathode (cathode) 13 constitutes a terminal that is electrically connected to a target 21 described later, and is electrically connected to an alternating current (AC) power supply device 14 via a power cable. In addition, the temperature of the cathode 13 during film formation is suppressed by the cooling water circulation pipe 16 connected to the cooling water supply device 15.

The Ar gas supply device 18 is connected to the inside of the reaction chamber 11 through a gas supply pipe. Thereby, Ar gas is supplied into the reaction chamber 11 as a plasma generating gas during film formation.

As shown in FIG. 2, the entire target 21 is formed in a substantially cylindrical shape. The target 21 includes a hollow cylindrical base (backing tube) 22 and a target material 23 that covers the outer peripheral surface of the base 22 in a central region S1 along the axial direction R of the base 22. Then, both end sides excluding the central region S1 are connected regions S2 where the base 22 is exposed.

The substrate (backing tube) 22 may be formed of, for example, a stainless steel tube having a thickness of about several millimeters. The target material 23 covering the central region S1 of the substrate 22 is a thin film material to be deposited on the deposition object, for example, various metal materials such as W, Ti, Ta, Mo, Al alloy, silicon, indium-tin oxide. (Hereinafter referred to as ITO) or the like may be formed with a predetermined thickness.

When such a cylindrical target 21 is set in the sputtering apparatus 10, a magnet 51 (see FIG. 1) is arranged inside the base 22. The magnet 51 forms a magnetic field around the target material 23 and performs magnetron sputtering. By confining the plasma in the vicinity of the target 21 with such a magnet 51, the sputtering speed is increased and the thin film of the target is prevented from being deposited in the vicinity of the target 21.

The cathode (cathode) 13 is electrically and mechanically connected to both ends of the target 21, that is, the connection region S2. This connection region S2 and the cathode 13 are connected via a clamp 41 formed in the cathode connection portion S3.

For example, two such targets 21 may be formed in parallel. Each target 21 is rotated at a predetermined rotation speed during film formation by a motor (not shown).

When a thin metal film, for example, is formed on one surface of the glass 19 that is the film formation object using the sputtering apparatus 10 having the above-described configuration, first, an Ar gas supply device 18 is placed in the reaction chamber 11 from the Ar gas supply device 18. Gas is introduced, and the inside of the reaction chamber 11 is simultaneously depressurized by the vacuum pump 17, and the pressure is set to 1.3 Pa, for example. Next, the anode 12 on which the glass 19 that is the film formation is placed is made to face the two targets 21 and 21 arranged in parallel.

Then, an alternating current (AC) is passed from the alternating current (AC) power supply device 14 to the two targets 21 and 21 via the cathode 13. At this time, an electric current is applied to one target 21 and the other target 21 so that the cathode and the anode are alternately switched.

When an alternating current (AC) is applied to the targets 21 and 21, the Ar gas in the reaction chamber 11 becomes glow discharge plasma, and a large number of Ar ⁺ ions are generated. The large number of Ar ⁺ ions collide with the target material 23 of the target 21 connected to the cathode 13. The target material 23 is sputtered by the collision of Ar ⁺ , and particles (sputter particles) of the constituent material of the target material are deposited on the glass 19 placed on the anode 12. Thereby, a thin film made of the constituent material of the target material 23 can be formed on one surface of the glass 19.

During such sputtering, by rotating the targets 21 and 21 at a predetermined speed with the axial center direction R as the center of rotation, the target material 23 is reduced in uniform thickness, and the entire surface of the large-area glass 19 is applied. On the other hand, a thin film having a uniform thickness can be formed.

(First embodiment)
FIG. 3 is an enlarged perspective view showing the target mounting mechanism of the present invention. FIG. 4 is a cross-sectional view showing the target mounting mechanism of the present invention.
In the connection region S <b> 2 where the base body 22 is exposed at both ends of the target 21, first engaging convex portions 61 are formed along the circumferential direction of the base body 22. The first engaging protrusions 61 are protrusions that protrude outward from the peripheral surface 22 a of the base material 22, and are equally disposed at, for example, six locations along the circumferential direction Q of the base body 22. The first engaging convex portion 61 may be formed integrally with the base body 22.

The first engaging convex portion 61 has an introduction portion 61a that protrudes at a low position from the peripheral surface 22a of the base member 22 and outward from the peripheral surface 22a along the circumferential direction Q of the base body 22 from the introduction portion 61a. An inclined portion 61b that is inclined in a direction away from the engaging portion 61b, and a locking portion 61c that is connected to the inclined portion 61b and rises (inclines) outward from the peripheral surface 22a at a steeper angle (larger angle) than the inclined portion 61b. (See also the cross-sectional view of FIG. 5A). Further, the inclined portion 61b has a shape in which the width increases along the axial direction R of the target 21 from the side continuous with the introduction portion 61a toward the side continuous with the locking portion 61c.

A clamp 71 is rotatably attached to the connecting portion S3 that forms one end of the cathode (cathode) 13. The clamp 71 is formed in a hollow, substantially cylindrical shape that internally includes the connecting portion S3 of the cathode 13 and the connecting region S2 of the target 21. That is, the target 21 is formed such that the hollow inner diameter is the same as or larger than the diameter of the connecting portion S3 of the cathode 13 and the connecting region S2 of the target 21, and when the target 21 is attached, the connecting portion S3 and the connecting region S2 are formed. Forms a covering shape.

A second engaging projection 72 is formed on the inner peripheral surface 71 a of the clamp 71 along the inner peripheral direction D of the clamp 71. The second engaging projections 72 are cylindrical rod-like members supported (fixed) on both side surfaces of a groove 71b having a predetermined width dug down from the inner peripheral surface 71a toward the outside of the clamp 71. The grooves 71b are evenly arranged at, for example, six locations along the inner circumferential direction D of the clamp 71. On the other hand, the second engaging projections 72 are equally formed at every other three of these six grooves 71b.

The groove 71b has six first engagement protrusions 61 formed in the inner circumferential direction D when the first engagement protrusion 61 and the second engagement protrusion 72 are engaged. Face to face. And the second engagement convex part 72 and the first engagement convex part 61 formed in the three grooves 71b out of the six grooves 71b slide and come into contact with each other. 21 is fixed to the clamp 71 (engagement between the target 21 and the clamp 71 will be described later).

At one end side of the clamp 71, a fixing means 75 including a tightening screw 73 and a screw hole 74 is formed. When the clamp 71 is engaged with the target 21, the fixing means 75 tightens the clamping screw 73 along the axial direction R toward the target 21, so that the clamp 71 extends along the inner circumferential direction D. It is fixed so as not to loosen.

A spacer 76 is further provided in the gap T formed between the connecting portion S3 of the cathode 13 extending vertically with respect to the axial direction and the inner surface of the clamp 71. The spacer 76 is a disk-shaped member provided with a hole through which the cathode 13 passes in the center, and may be formed of, for example, stainless steel or aluminum. The spacer 76 prevents the tip of the spacer 76 from coming into direct contact with the connecting portion S3 of the cathode 13 and being damaged when the fastening screw 73 constituting the fixing means 75 is fastened.

The spacer 76 is preferably subjected to a surface treatment. For example, an alumite film may be formed on the surface of the spacer 76 formed from aluminum. Further, for example, a hard alumite film rich in fine irregularities such as microcracks may be formed on the surface of the spacer 76 made of aluminum, and a film in which a fine fluorine resin is combined may be formed.

Further, for example, electroless nickel and fluororesin are co-deposited in the treatment liquid on the surface of the spacer 76 formed of iron, stainless steel, copper alloy, etc., and the fluororesin is uniformly distributed in the film by about 30% with respect to the volume ratio. It may be included, and heat treatment may be performed after the film formation to form a film in which the electroless nickel and the fluororesin are firmly adhered.

Further, for example, the surface of the spacer 76 formed of iron, stainless steel, copper alloy, or the like is subjected to a surface treatment in which a fluorine resin is combined with the electroless nickel deposited in the form of particles on the base. May be formed.
As described above, by performing the surface treatment of the spacer 76, it is possible to realize improvement in wear resistance, improvement in sliding property, prevention of galling, and the like of the spacer 76.

A gasket ring 77 is formed at the end of the connecting portion S3 of the cathode 13. The gasket ring 77 is made of, for example, aluminum or copper alloy, and keeps the hollow interior of the base material 22 airtight by contacting the end of the base material 22 of the target 21.

The operation of the target mounting mechanism of the present invention having such a configuration will be described.
When the cylindrical target 21 is attached to the cathode 13 of the sputtering apparatus 10 by the target mounting mechanism of the present embodiment, as shown in FIG. 5A, the cathode 13 is connected to the connection region S2 where the base material 22 of the target 21 is exposed. The clamp 71 formed in the connecting portion S3 is moved closer. Then, the connection region S <b> 2 of the base material 22 is inserted into the clamp 71.

After the connection region S2 of the base material 22 is inserted into the clamp 71, the clamp 71 is then rotated around the axial direction R only along the circumferential direction Q of the target 21, as shown in FIG. 5B. When the clamp 71 starts to rotate only along the circumferential direction Q, the second engaging convex portions 72 formed in the three grooves 71b are connected to the introduction portion 61a of the first engaging convex portion 61 and the inner peripheral surface. It overlaps in the radial direction of 71a. In this state, since the height from the peripheral surface 22a of the introduction part 61a is low, the second engagement convex part 72 and the first engagement convex part 61 hardly contact each other.

As shown in FIGS. 5C to 5E, when the clamp 71 is further rotated only along the circumferential direction Q of the target 21, the second engaging convex portion 72 gradually moves toward the rotation direction of the clamp 71. It abuts on the inclined portion 61b which is inclined so as to be higher. And the 2nd engagement convex part 72 slides so that it may just climb the inclination part 61b, when it sees from a side surface.

When the clamp 71 rotates only along the circumferential direction Q of the target 21 and slides on the inclined portion 61b, the inclined portion 61b is directed from the side connected to the introducing portion 61a to the side connected to the locking portion 61c. Since the width of the target 21 increases along the axial direction R of the target 21, the contact area between the second engagement convex portion 72 and the first engagement convex portion 61 gradually increases. To go. In addition, since the 2nd engagement convex part 72 is formed in the column shape, the clamp 71 rotates smoothly along the circumferential direction Q of the target 21.

When the clamp 71 is further rotated, the second engaging convex part 72 comes into contact with the engaging part 61c that rises at a steeper angle than the inclined part 61b after climbing the inclined part 61b. Further, further rotation along the circumferential direction Q is suppressed. As a result, the target 21 is engaged with the clamp 71. In such an engagement state, the contact surface B between the first engagement convex portion 61 and the second engagement convex portion 72 is short in the circumferential direction Q of the target 21, and the axial direction (axis of the target 21) (Direction) R is a long and narrow rectangle.

By suppressing the contact surface between the first engagement protrusion 61 and the second engagement protrusion 72 to be small, the connection region S2 of the target 21 is inserted into the clamp 71, and then the clamp 71 is moved to the target 21. The rotational torque required to rotate only along the circumferential direction Q and until the second engaging convex portion 72 abuts on the locking portion 61c is 1 (kgf · cm) or more and 20 (kgf · cm). ) As a result, for example, the operator can engage the target 21 with the clamp 71 only by lightly rotating the clamp 71 by hand without using a dedicated tool or the like.

On the other hand, when the second engaging convex portion 72 climbs up the inclined portion 61b and contacts the locking portion 61c, the engaging operation between the first engaging convex portion 61 and the second engaging convex portion 72 is performed. Any structure may be used as long as it generates a signal for determining that the process has been completed. For example, such a signal may be a sound. In this embodiment, the clamp 71 is set to a predetermined engagement by having a structure in which a contact sound is emitted when the second engaging convex portion 72 hits the locking portion 61c of the first engaging convex portion 61. It can be perceived that it has been rotated to a position. Thereby, poor engagement due to insufficient rotation of the clamp 71 can be prevented.

Thereafter, by tightening the fastening screw 73 of the fixing means 75 shown in FIG. 4 toward the target 21 along the axial direction R, the cathode 13 is pushed toward the target 21, and the first engaging convex portion 61 and the groove 71b are in close contact with each other, and the clamp 71 does not easily rotate with respect to the target 21. For this reason, the engagement (contact) state of the 1st engagement convex part 61 and the 2nd engagement convex part 72 is maintained.

As described above, according to the target mounting mechanism of the present embodiment, when the cylindrical target 21 is attached to the cathode 13 of the sputtering apparatus 10, the clamp 71 formed on the cathode 13 is connected to the end region of the target 21. The cylindrical target 21 can be attached to the cathode 13 by simply inserting the first engaging convex portion 61 and the second engaging convex portion 72 into engagement after being inserted into S2.

Further, for example, even when a large target having a length of several meters or the like is used, when the target 21 is attached, the clamp 71 is rotated only along the circumferential direction so that the second engagement convex portion 72 is obtained. The target 21 can be attached to the cathode 13 simply by engaging the first engaging convex portion 61 with the first engaging convex portion 61. For this reason, there is no need to rotate the clamp with a large force using a dedicated tool as in the prior art. For example, the rotational torque of the clamp 71 is 1 (kgf · cm) or more with a small force without using a dedicated tool. , The target 21 can be easily attached to the cathode 13 simply by turning within a range of 20 (kgf · cm) or less.

In the above-described embodiment, the second engagement protrusions 72 are equally formed at every other three positions among the six grooves 71b. That is, as shown in FIG. 6A, three second engaging convex portions 72 are formed and are on the same line P1 in the direction of the inner peripheral surface 71a of the clamp 71, and the rotation axis of the target 21, that is, the axial direction R Is located on a virtual circle P2 that is regarded as the center, and is arranged symmetrically with respect to a line segment L that passes through the center and the second engaging convex portion 72.

With such a configuration, when the first engaging convex portion 61 and the second engaging convex portion 72 are engaged, the rotational axis of the target 21 and the axis of the inner peripheral surface 71a of the clamp 71 are accurately set. It becomes possible to match. Therefore, the target 21 does not rotate eccentrically during film formation, and the erosion pattern is uniformly formed, and the life of the target 21 can be increased.

As shown in FIG. 6B, the second engagement convex portion is on the same line P1 and also on the virtual circle P2, and the line segment L passing through the center and the second engagement convex portion 81 is provided. The four positions may be arranged so as to be axially symmetric. Further, for example, as shown in FIG. 6C, the axis is symmetrical with respect to a line segment L that is on the same line P1 and also on the virtual circle P2 and that passes through the center and the second engagement convex part 82 Five locations may be arranged so that

For this reason, the center of the cathode 13 and the axis of the target 21 can be easily matched by the engagement of the first engaging convex portion 61 and the second engaging convex portion 72, The shaft center can be rotated without being decentered. As a result, the distance between the film formation target and the target 21 is uniform over the entire circumference of the target 21, and a film having a uniform thickness with no unevenness can be formed over the entire surface of the film formation target. become.

In the above-described embodiment, the clamp 71 is rotated and engaged with the target 21 only along the circumferential direction Q. However, the first engagement convex portion and the second engagement convex portion are Need only be relatively moved and engaged along the circumferential direction of the target. That is, the first engaging convex portion and the second engaging convex portion are rotated by rotating the target instead of the clamp, or by rotating both the target and the clamp in different directions in the circumferential direction. Or may be configured to engage with each other.

(Second embodiment)
FIG. 7 is an enlarged perspective view showing another embodiment of the target mounting mechanism of the present invention. FIG. 8 is a cross-sectional view of the target mounting mechanism.
In this embodiment, the first engagement convex portion 31 is formed along the circumferential direction of the base body 22 in the connection region S <b> 2 where the base body 22 is exposed at both ends of the target 21. The first engagement protrusions 31 are protrusions that protrude outward from the peripheral surface 22 a of the base material 22, and are equally disposed at, for example, six locations along the circumferential direction of the base body 22. The first engagement protrusion 31 only needs to be formed integrally with the base body 22.

As shown in FIG. 9A, the first engagement convex portion 31 is formed in, for example, a substantially L shape in plan view. The first engagement convex portion 31 includes a first engagement means E1 extending along the axial direction R of the target 21 and a second engagement means E2 extending along the circumferential direction Q of the target 21. And third engaging means E3 arranged in a direction substantially perpendicular to the circumferential direction Q of the target 21.

A clamp 41 is rotatably attached to the connecting portion S3 that forms one end of the cathode (cathode) 13. The clamp 41 is formed in a hollow, substantially cylindrical shape that includes the connecting portion S3 of the cathode 13 and the connecting region S2 of the target 21. That is, the target 21 is formed such that the hollow inner diameter is the same as or larger than the diameter of the connecting portion S3 of the cathode 13 and the connecting region S2 of the target 21, and when the target 21 is attached, the connecting portion S3 and the connecting region S2 are formed. Forms a covering shape.

A second engagement convex portion 42 is formed along the inner circumferential direction D on the inner circumferential surface 41 a of the clamp 41. The second engagement protrusions 42 are protrusions that protrude in the center direction from the inner peripheral surface 41 a, and are equally disposed along, for example, six locations along the inner peripheral direction D. The second engaging convex part 42 only needs to be formed integrally with the clamp 41.

As shown in FIG. 9A, the second engagement convex portion 42 is formed, for example, in a substantially rectangular shape in plan view. The second engagement protrusions 42 are formed such that the width W along the inner circumferential direction D is the same as or smaller than the interval between the first engagement protrusions 31 adjacent to each other. Just do it.
With such a configuration, the first engaging convex portion 31 and the second engaging convex portion 42 are arranged to be able to engage with each other when the target 21 is attached.

A fixing means 45 including a fastening screw 43 and a screw hole 44 is formed on one end side of the clamp 41. When the clamp 41 is engaged with the target 21, the fixing means 45 tightens the tightening screw 43 along the axial direction R toward the target 21, so that The second engaging convex portion 42 can be brought into close contact.

A spacer 46 is further provided in the gap T formed between the portion extending perpendicularly to the axial direction in the connecting portion S3 of the cathode 13 and the inner surface of the clamp 41. The spacer 46 is a disk-shaped member provided with a hole through which the cathode 13 penetrates in the center, and may be made of, for example, stainless steel. Such a spacer 46 prevents the tip of the spacer 46 from coming into direct contact with the connecting portion S3 of the cathode 13 and being damaged when the fastening screw 43 constituting the fixing means 45 is fastened.

A gasket ring 47 is formed at the end of the connecting portion S3 of the cathode 13. The gasket ring 47 is made of, for example, aluminum, and keeps the hollow interior of the base material 22 airtight by contacting the end of the base material 22 of the target 21.

The operation of the target mounting mechanism of the present embodiment having such a configuration will be described.
When the cylindrical target 21 is attached to the cathode 13 of the sputtering apparatus 10 by the target mounting mechanism of the present embodiment, as shown in FIG. 9A, the cathode 13 is connected to the connection region S2 where the base material 22 of the target 21 is exposed. The clamp 41 formed in the connecting portion S3 is brought closer. Then, the respective second engagement convex portions 42 formed on the clamp 41 are aligned so as to pass between the first engagement convex portions 31 formed on the base member 22, and then the clamp 41. The connection region S2 of the base material 22 is inserted into the inner surface of.

At the time of this insertion, the first engaging means E1 constituting the first engaging convex portion 31 and the one surface L1 of the second engaging convex portion 42 slide along the axial direction R. Meanwhile, the connection region S <b> 2 of the base material 22 is inserted into the clamp 41.

As shown in FIG. 9B, the clamp 41 is rotated only along the circumferential direction Q of the target 21, and the one surface L1 of the second engagement convex portion 42 and the first engagement means E1 are in the circumferential direction. After inserting up to a position that does not overlap in Q, next, the clamp 41 is rotated along the circumferential direction Q of the target 21, as shown in FIG. 9C. During this rotation, the second engagement means E2 constituting the first engagement protrusion 31 and the other surface L2 of the second engagement protrusion 42 slide along the circumferential direction Q. While doing this, the clamp 41 rotates.

When the clamp 41 is rotated by a predetermined amount, one surface L1 of the second engagement convex portion 42 comes into contact with the third engagement means E3 constituting the first engagement convex portion 31. The contact of the third engagement means E3 and the second engagement convex portion 42 prevents the clamp 41 from rotating along the circumferential direction.

Thereafter, by tightening the fastening screw 43 of the fixing means 45 shown in FIG. 8 toward the target 21 along the axial direction R, the first engaging convex portion 31 and the second engaging convex portion 42 And the clamp 41 does not easily rotate with respect to the target 21.

DESCRIPTION OF SYMBOLS 10 ... Sputtering device 12 ... Anode 13 ... Cathode 21 ... Target 22 ... Base | substrate 23 ... Target material 61 ... 1st engagement convex part 71 ... Clamp 72 ... 2nd engagement convex part

Claims (9)

A target mounting mechanism for detachably mounting a cylindrical target used in a sputtering apparatus to a connecting portion of a cathode,
The target includes a cylindrical base body and a target material covering the base body, a central region where the target material is disposed, and a connection region where the base body is exposed at both ends excluding the central region. Have;
A substantially cylindrical clamp is formed in the connecting portion of the cathode, and the connecting portion and the connecting region are formed inside;
A first engagement convex portion formed on the connection region of the target and a second engagement convex portion formed on an inner peripheral surface of the clamp include the connection portion and the connection region serving as the clamp. Engaged by being relatively moved only along the circumferential direction of the target in an indwelling state;
A target mounting mechanism characterized by that. The torque required for the engagement between the first engagement convex portion and the second engagement convex portion is 1 (kgf · cm) or more and 20 (kgf · cm) or less. The target mounting mechanism according to claim 1. The contact surface between the first engagement convex portion and the second engagement convex portion has a shape in which the circumferential direction of the target is short and the axial direction of the target is long. The target mounting mechanism according to claim 1. 2. The target mounting mechanism according to claim 1, further comprising a structure for generating a signal for determining that the engagement operation between the first engagement convex portion and the second engagement convex portion is completed. Three or more of the second engaging convex portions are formed, are on the same line in the inner peripheral surface direction of the clamp, are on a virtual circle with the rotation axis of the target as the center, and the center The other second engaging convex portions are axially symmetrical with respect to a line segment passing through at least one of the second engaging convex portions. The target mounting mechanism described. The target mounting mechanism according to claim 1, further comprising a gasket ring provided at a portion extending perpendicularly to the axis of the connecting portion of the cathode and a contact portion with the base. . 2. The target mounting mechanism according to claim 1, further comprising a fixing means for closely contacting a portion of the connecting portion of the cathode that extends perpendicularly to an axial center with the base. 2. The target mounting mechanism according to claim 1, further comprising a spacer disposed in a gap between the portion of the cathode that extends perpendicular to the axial center of the connecting portion and the clamp. The target mounting mechanism according to claim 8, wherein the spacer is subjected to a surface treatment.

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