[go: up one dir, main page]

WO2012070166A1 - Module de convertisseur et procédé de production associé - Google Patents

Module de convertisseur et procédé de production associé Download PDF

Info

Publication number
WO2012070166A1
WO2012070166A1 PCT/JP2011/002570 JP2011002570W WO2012070166A1 WO 2012070166 A1 WO2012070166 A1 WO 2012070166A1 JP 2011002570 W JP2011002570 W JP 2011002570W WO 2012070166 A1 WO2012070166 A1 WO 2012070166A1
Authority
WO
WIPO (PCT)
Prior art keywords
mems microphone
pedestal
adhesive
recess
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/002570
Other languages
English (en)
Japanese (ja)
Inventor
大輔 井上
佳宏 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2012070166A1 publication Critical patent/WO2012070166A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to a converter module including a converter element to which MEMS (Micro Electro Mechanical Systems) technology is applied, and a method for manufacturing the same, and in particular, a MEMS microphone module including a substrate and a MEMS microphone element mounted on the substrate. It relates to the manufacturing method.
  • MEMS Micro Electro Mechanical Systems
  • a converter module created by using MEMS technology includes a converter that converts diaphragm vibration into an electric signal and a substrate on which the converter is mounted.
  • the converter is bonded onto the substrate via an adhesive and is electrically connected to the substrate by wire bonding or the like (see Patent Document 1).
  • the converter module created using MEMS technology is often fragile and easily affected by stress. For example, there is a problem in that the sensitivity of the converter element deteriorates due to deformation of the diaphragm due to distortion of the converter element due to stress at the time of mounting the converter element. This stress is generated due to a difference in thermal expansion coefficient between the substrate and the transducer element. Conventionally, the adhesive between the substrate and the transducer element serves to absorb stress. In a MEMS microphone element having a diaphragm that vibrates by sound waves, since the diaphragm is particularly fragile, sensitivity deterioration due to the stress becomes significant.
  • Patent Document 1 an adhesive is stored in a groove formed on the bottom surface of the MEMS microphone element, and the MEMS microphone element and the substrate are bonded.
  • the volume of the groove is not sufficient, and a sufficient amount of adhesive that can absorb stress cannot be secured.
  • the adhesive surface of the transducer element that is, the pedestal that supports the diaphragm has a frame shape, like a transducer element with a diaphragm, use a nozzle with an inner diameter that matches the width of the frame.
  • the adhesive must be drawn. However, as the size of the converter element is reduced, the width of the frame becomes narrower. In the technique described in Patent Document 1, the adhesive must be drawn so as to accumulate the adhesive in the groove, and the smaller nozzle Is required. For this reason, when the viscosity of the adhesive is high, the nozzle is likely to be clogged, making it difficult to draw finely.
  • An object of the present invention is to provide a converter module capable of absorbing and having high sensitivity and a method for manufacturing the same.
  • a converter module includes a substrate, a converter element, and an adhesive that bonds the substrate and the converter element.
  • a pedestal having a first main surface and a second main surface that is the opposite surface of the first main surface, and a through-hole penetrating from the first main surface to the second main surface is formed;
  • a diaphragm that is formed on a first main surface of the pedestal and covers a part of the through-hole, and the adhesive bonds the second main surface of the pedestal and the substrate, and A part of the side surface is covered, and at least one recess is formed on the second main surface of the pedestal at the interface with the adhesive.
  • the concave portion is provided on the second main surface of the base of the converter element, and the adhesive is formed so as to cover a part of the side surface of the base, without increasing the viscosity of the adhesive.
  • the volume can be increased. Therefore, the stress to the converter element after mounting can be reduced, the deformation of the fragile diaphragm can be relaxed, and the deterioration of the characteristics of the converter module can be suppressed. That is, according to one aspect of the present invention, a highly sensitive converter module can be realized.
  • the at least one recess may be a V-groove.
  • the recess is a V-groove
  • the adhesive is easily convected, and voids due to unfilled adhesive can be suppressed. Therefore, the stress in the expansion of the void when the adhesive is cured can be reduced, the deformation of the fragile diaphragm can be relaxed, and the mounting accuracy can be improved. Thereby, the characteristic fall of a converter module can be suppressed.
  • an angle formed between the second main surface and the inclined surface of the recess that is a V groove may be 34 to 36 °.
  • an angle formed between the second main surface and the slope of the recess that is a V groove may be 53 to 55 °.
  • the concave portion having an angle of 53 to 55 ° is The depth of the V-groove is deeper than that of the recess having an angle of 34 to 36 °. Therefore, the volume of the adhesive can be increased, and the stress on the transducer element after mounting can be reduced. Thereby, the deformation
  • the side surface of the pedestal facing the through hole may be a dogleg shape.
  • the film thickness of the adhesive may be 10 to 40 ⁇ m.
  • the depth of the recess may be 10-30 ⁇ m.
  • the concave portion is filled with sufficient adhesive capable of absorbing the stress, the deformation of the fragile diaphragm can be alleviated and the deterioration of the characteristics of the converter module can be suppressed.
  • the converter element may be a MEMS microphone element.
  • the manufacturing method of the converter module which concerns on 1 aspect of this invention is formed on the said 1st main surface with the base which has a 1st main surface and the 2nd main surface which is a surface opposite to the said 1st main surface.
  • a step of forming at least one recess a step of applying an adhesive to the substrate along the shape of the second main surface of the pedestal, the second main surface of the pedestal via the adhesive, and the Adhering to the substrate.
  • a concave portion is provided on the second main surface of the pedestal of the converter element, and the adhesive volume is formed without increasing the viscosity of the adhesive by forming the adhesive so as to cover a part of the side surface of the pedestal.
  • the at least one recess may be formed as a V groove by wet etching.
  • step of forming the through hole and the step of forming the recess may be performed simultaneously.
  • a MEMS microphone element may be prepared.
  • FIG. 1A is a plan view showing an example of a MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1B is a cross-sectional view showing an example of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1C is an enlarged plan view showing an example of a recess of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1D is an enlarged cross-sectional view showing an example of a recess of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1E is an enlarged cross-sectional view showing an example of a recess of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1A is a plan view showing an example of a MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 1B is a cross-sectional view showing an example of the MEMS microphone module according to Embodiment 1 of the
  • FIG. 2 is a process cross-sectional view illustrating an example of a method for manufacturing the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 3A is a perspective view showing an example of an upper surface and a lower surface of the base of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 3B is a cross-sectional view showing an example of a base of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 3C is a cross-sectional view showing an example of a base of the MEMS microphone module according to Embodiment 1 of the present invention.
  • FIG. 4 is a diagram illustrating an example of a characteristic variation of the diaphragm of the MEMS microphone module according to the embodiment of the present invention.
  • FIG. 5A is a plan view showing an example of a MEMS microphone module according to Embodiment 2 of the present invention.
  • FIG. 5B is a cross-sectional view showing an example of a MEMS microphone module according to Embodiment 2 of the present invention.
  • FIG. 5C is an enlarged plan view showing an example of a recess of the MEMS microphone module according to Embodiment 2 of the present invention.
  • FIG. 5D is an enlarged cross-sectional view showing an example of a recess of the MEMS microphone module according to Embodiment 2 of the present invention.
  • FIG. 6 is a cross-sectional view showing another example of the MEMS microphone module according to Embodiment 2 of the present invention.
  • FIG. 7A is a plan view showing an example of a MEMS microphone module according to a variation of Embodiment 2 of the present invention.
  • FIG. 7B is a cross-sectional view showing an example of a MEMS microphone module according to a variation of Embodiment 2 of the present invention.
  • the conversion body module which concerns on Embodiment 1 of this invention is a MEMS microphone module provided with the board
  • the MEMS microphone element has a first main surface and a second main surface that is a surface opposite to the first main surface, and a through-hole penetrating from the first main surface to the second main surface is formed.
  • the adhesive is formed so as to bond the second main surface of the pedestal and the substrate and cover a part of the side surface of the pedestal.
  • At least one recess is formed at the interface with the adhesive.
  • a plurality of recesses are formed on the second main surface of the pedestal, and these recesses are V-grooves.
  • FIG. 1A is a plan view showing an example of a MEMS microphone module 100 according to Embodiment 1 of the present invention.
  • FIG. 1B is a cross-sectional view showing an example of the MEMS microphone module 100 according to Embodiment 1 of the present invention.
  • the MEMS microphone module 100 is an example of a converter module that includes a diaphragm and converts vibrations of the diaphragm caused by sound waves into an electrical signal.
  • the MEMS microphone module 100 includes a substrate 110, a MEMS microphone element 120, an adhesive 130, a wire 140, an electrode land 150, a wiring 160, and a solder resist 170. .
  • the substrate 110 is a substrate for mounting the MEMS microphone element 120.
  • the substrate 110 is made of glass epoxy resin or the like.
  • the substrate 110 may be a semiconductor substrate.
  • the MEMS microphone element 120 is an example of a converter element, and includes a pedestal 121, a diaphragm 122, and an electrode pad 123.
  • the MEMS microphone element 120 is an example of a converter that converts vibration of the diaphragm 122 into an electric signal.
  • the pedestal 121 is a pedestal for supporting the diaphragm 122, and has a first main surface and a second main surface.
  • the first main surface is, for example, the upper surface of the pedestal 121
  • the second main surface is a surface opposite to the first main surface, for example, the lower surface of the pedestal 121.
  • the pedestal 121 is made of, for example, silicon.
  • the pedestal 121 is, for example, a prism with a rhombus at the bottom, as shown in FIGS. 1A and 1B. If the four vertices on the bottom surface of the pedestal 121 are ABCD, the angle formed by the side AB and the side DA is 70 °, and the angle formed by the side BC and the side CD is 110 °.
  • the width of the pedestal 121 is about 100 ⁇ m.
  • the width of the pedestal 121 is the distance between the inner wall facing the through hole 124 of the pedestal 121 and the outer wall of the pedestal 121, and indicates the distance of the thinnest portion.
  • the width of the pedestal 121 is the distance between one side of the rhombus pedestal 121 and the nearest side of the hexagonal through hole 124 that is parallel to the one side in FIG. 1A.
  • the pedestal 121 is formed with a through hole 124 penetrating from the first main surface to the second main surface.
  • a through hole 124 that penetrates the base 121 in the thickness direction is formed.
  • the through hole 124 has a prismatic shape with a hexagonal bottom surface.
  • At least one recess 125 is formed on the lower surface of the pedestal 121 at the interface with the adhesive 130.
  • the lower surface of the pedestal 121 has a frame shape, and a plurality of recesses 125 are formed along the frame. The specific shape of the recess 125 will be described later.
  • the diaphragm 122 is a diaphragm that vibrates with sound waves and converts the vibration into an electric signal.
  • the diaphragm 122 is made of, for example, an inorganic metal thin film such as SiO 2 or SiN.
  • the diaphragm 122 is composed of, for example, two inorganic metal thin films that constitute a capacitive element, and converts the vibration into an electric signal by changing the capacitance due to the vibration.
  • the diaphragm 122 is formed on the upper surface of the pedestal 121 and is disposed so as to cover at least a part of the through hole 124.
  • the through hole 124 is formed to make the diaphragm 122 easy to vibrate and improve the accuracy of detecting sound waves.
  • the electrode pad 123 is an electrode pad for outputting the electric signal converted by the diaphragm 122 to the outside of the MEMS microphone element 120. As shown in FIGS. 1A and 1B, a wire 140 is connected to the electrode pad 123.
  • the electrode pad 123 is made of, for example, aluminum or copper.
  • the adhesive 130 bonds the substrate 110 and the MEMS microphone element 120 together. As shown in FIG. 1B, the adhesive 130 is formed so as to bond the lower surface of the pedestal 121 and the substrate 110 and cover a part of the side surface of the pedestal 121. The adhesive 130 is filled in the recess 125.
  • the adhesive 130 is, for example, an epoxy acrylate-based or silicone-based adhesive.
  • the thickness of the adhesive 130 is, for example, 10 to 40 ⁇ m between the lower surface of the base 121 and the substrate 110.
  • the adhesive 130 covers, for example, the side surface in the range of 10 to 250 ⁇ m from the lower surface among the side surfaces of the base 121.
  • the wire 140 is a wire that electrically connects the electrode pad 123 and the electrode land 150.
  • the wire 140 is made of, for example, copper or gold.
  • the distance between the electrode pad 123 and the electrode land 150 is, for example, 0.4 mm. Therefore, the wire 140 has a length equal to or longer than the distance.
  • the electrode land 150 is an electrode for connecting the wire 140.
  • the electrode land 150 is connected to the wiring 160 and transmits an electrical signal output from the MEMS microphone element 120 via the wire 140 to the wiring 160.
  • the electrode land 150 is made of, for example, copper.
  • the electrode land 150 corresponds to a portion of the wiring 160 covered with the solder resist 170 that is exposed to the outside through an opening formed in the solder resist 170.
  • the wiring 160 is a wiring for transmitting an electric signal output from the MEMS microphone element 120 to a predetermined circuit (not shown).
  • the wiring 160 is made of, for example, copper.
  • the predetermined circuit is a circuit that performs amplification of the electric signal, conversion from the electric signal to audio data, and the like.
  • the solder resist 170 is a resist film formed on the wiring 160 and the substrate 110 in order to planarize the surface. As shown in FIG. 1B, the substrate 110 and the MEMS microphone element 120 are bonded by an adhesive 130 via a solder resist 170. That is, the adhesive 130 is formed between the solder resist 170 and the lower surface of the pedestal 121.
  • the thickness of the solder resist 170 is, for example, 25 ⁇ m.
  • an opening is formed in the solder resist 170, and a part of the wiring 160 is exposed as an electrode land 150 in the opening.
  • FIG. 1C is an enlarged plan view showing an example of a recess 125 of the MEMS microphone module 100 according to Embodiment 1 of the present invention.
  • 1D and 1E are enlarged cross-sectional views showing an example of the recess 125 of the MEMS microphone module 100 according to Embodiment 1 of the present invention.
  • the cross section of the recess 125 is preferably V-shaped. More specifically, the recess 125 is preferably a V-groove. Moreover, the planar shape of the recessed part 125 is a shape similar to the rhombus base 121, for example. If the apex of the recess 125 that is a V-groove is abcd, each side is formed in parallel with the side ABCD of the pedestal 121.
  • the angle formed by the slope of the concave portion 125, which is a V-groove, and the bottom surface of the base 121 is 34 to 36 °, and preferably 35 °.
  • the angle formed between the side surface of the concave portion 125 which is a V-groove and the bottom surface of the base 121 is 89 to 91 °, preferably 90 °.
  • the angle at the vertex of the V-shape, that is, the angle formed by the two inclined surfaces of the recess 125 is, for example, 110 °.
  • Each side of the recess 125 which is a V-groove is 15 to 55 ⁇ m, and the depth of the recess 125 is 10 to 30 ⁇ m.
  • the depth of the recess 125 means the depth at the deepest point in the recess 125.
  • the recessed part 125 is formed in multiple numbers by the lower surface of the base 121, as shown to FIG. 1A.
  • the volume filled with the adhesive 130 can be increased, and the MEMS microphone element 120 can be more firmly fixed.
  • the adhesive 130 is drawn with a nozzle along the pattern of the base 121 on the substrate 110 (specifically, the solder resist 170).
  • an epoxy acrylate adhesive having a viscosity of 9500 cP and a thixo ratio of 4.5 is drawn as an adhesive 130 with a nozzle having an inner diameter of 100 ⁇ m, and the MEMS microphone element 120 and the substrate 110 are fixed.
  • a silicone-based adhesive having a viscosity of 10,000 cP may be used as the adhesive 130.
  • the concave portion 125 is filled with a volume of the adhesive 130 that is larger by that volume, and the adhesive 130 crawls up to a part of the side surface of the pedestal 121. That is, the adhesive 130 covers a part of the side surface of the pedestal 121, specifically, a portion of the side surface adjacent to the lower surface.
  • FIG. 2 is a process cross-sectional view illustrating an example of a method for manufacturing MEMS microphone module 100 according to Embodiment 1 of the present invention.
  • a ⁇ 110> wafer is prepared.
  • the ⁇ 110> wafer is an assembly in which a plurality of MEMS microphone elements 120 each having an electrode pad 123, a diaphragm 122, and a pedestal 121 in which no through hole 124 is formed are formed.
  • FIG. 2A shows one MEMS microphone element 120.
  • the MEMS microphone element 120 is formed by a known method.
  • a mask 180 on which a predetermined mask pattern is formed is prepared. Specifically, a mask 180 having a mask pattern along the shape of the through hole 124 and the recess 125 is formed on the bottom surface of the base 121 by a known method. The vertex ABCD of the mask pattern is patterned so as to match the Si (110) surface constituting the pedestal 121. At the same time, the apexes abcd of the mask patterns of the plurality of recesses 125 formed on the bottom of the base 121 are also patterned so as to match the (110) plane.
  • wet etching is performed with a weak alkaline aqueous solution such as TMAH (tetramethylammonium hydroxide aqueous solution) to form the through holes 124 and the plurality of concave portions 125.
  • TMAH tetramethylammonium hydroxide aqueous solution
  • FIG. 3A is a perspective view showing an example of the upper surface and the lower surface of pedestal 121 according to Embodiment 1 of the present invention.
  • 3B and 3C are cross-sectional views showing an example of the base 121 according to Embodiment 1 of the present invention.
  • the plurality of MEMS microphone elements 120 are separated into pieces by stealth dicing (not shown). Thereafter, a plurality of substrates 110 are prepared.
  • a wiring 160 made of glass or the like in glass epoxy resin or the like, a solder resist 170, and an electrode land 150 exposed through an opening formed in the solder resist 170 are known methods. It is formed with.
  • the adhesive 130 is drawn on the substrate 110 (specifically, the solder resist 170) with a nozzle along the shape of the lower surface of the base 121.
  • the adhesive 130 is drawn on the substrate 110 (specifically, the solder resist 170) with a nozzle along the shape of the lower surface of the base 121.
  • an epoxy acrylate adhesive having a viscosity of 9500 cP and a thixo ratio of 4.5 is drawn as an adhesive 130 with a nozzle having an inner diameter of 100 ⁇ m.
  • the MEMS microphone element 120 and the substrate 110 are bonded via the applied adhesive 130. Then, the MEMS microphone element 120 and the substrate 110 are fixed by curing the adhesive 130. At this time, a semiconductor element having an amplification function for amplifying the signal of the MEMS microphone element 120 may be fixed next to the MEMS microphone element 120 (not shown).
  • the electrode pad 123 and the electrode land 150 are electrically connected by wire bonding using the wire 140. Further, when the semiconductor element is also fixed next to the MEMS microphone element 120, the electrode pad 123 and the semiconductor element are electrically connected by a wire, and the semiconductor element and the electrode land 150 are electrically connected. Thus, an amplified signal can be output.
  • a shield cap is sealed on each of the plurality of substrates 110 so as to cover the MEMS microphone element 120 (and the semiconductor element).
  • one substrate including a plurality of wirings 160, solder resists 170, and electrode lands 150 may be used.
  • one substrate is divided into a plurality of substrates 110 (not shown).
  • the MEMS microphone module 100 of Embodiment 1 as shown in FIGS. 1A to 1E can be manufactured.
  • the MEMS microphone module 100 includes the substrate 110, the MEMS microphone element 120, and the adhesive 130, and the adhesive 130 is used for the base 121 of the MEMS microphone element 120.
  • the lower surface and the substrate 110 are bonded together, and a part of the side surface of the pedestal 121 is covered. Further, at least one recess 125 is formed on the lower surface of the base 121 at the interface with the adhesive 130.
  • the volume of the adhesive 130 can be increased without increasing the viscosity of the adhesive 130.
  • the adhesive 130 is formed so as to cover not only the lower surface of the pedestal 121 but also a part of the side surface of the pedestal 121. For this reason, the volume of the adhesive agent 130 can be further increased.
  • stress can be reduced, so that the volume of the adhesive agent 130 is large. Therefore, stress to the MEMS microphone element 120 after mounting can be reduced, deformation of the fragile diaphragm 122 can be relaxed, and deterioration in characteristics of the MEMS microphone module 100 can be suppressed.
  • a recess 125 that is a V-groove is formed on the lower surface of the base 121.
  • voids are likely to occur due to unfilling of the adhesive 130.
  • the void generated by the unfilling of the adhesive 130 expands when the adhesive 130 is cured, so that stress is applied to the MEMS microphone element 120 and deformation of the fragile diaphragm 122 or mounting displacement of the MEMS microphone element 120 occurs.
  • a problem that causes a change in the characteristics of the MEMS microphone element 120 can be considered.
  • the adhesive 130 is formed by making the recess 125 into a V-shaped cross section, more specifically, by making the recess 125 into a V-groove. It becomes easy to convect the inside of the recess 125. Thereby, the void by the unfilling of the adhesive agent 130 can be suppressed, and the stress in the expansion of the void when the adhesive agent 130 is cured can be reduced.
  • FIG. 4 is a graph showing an example of characteristic variation of the diaphragm 122 of the MEMS microphone element 120 according to Embodiment 1 of the present invention.
  • the diaphragm 122 vibrates depending on the sound frequency, and the vibration of the diaphragm 122 is converted into an electric signal.
  • the diaphragm 122 has a resonance frequency, and the resonance frequency is lowered when the sensitivity of the diaphragm 122 is good.
  • the MEMS microphone element 120 is mounted on the substrate 110, the MEMS microphone element 120 is deformed due to thermal stress from the substrate 110, and the resonance frequency when mounted is higher than the resonance frequency of the MEMS microphone element 120 alone. In order to obtain a microphone with high sensitivity, it is important to suppress an increase in the resonance frequency during mounting.
  • FIG. 4 shows the rate (%) of increase in the resonance frequency due to mounting.
  • the adhesive 130 is formed inside the recess 125 formed on the lower surface of the pedestal 121 and on a part of the side surface of the pedestal 121, and has a resonance frequency. A sufficient volume of adhesive 130 is provided to suppress fluctuations. Therefore, according to Embodiment 1 of the present invention, a highly sensitive MEMS microphone module can be provided.
  • the concave portion 125 is a V-groove and the convection of the adhesive 130 is performed smoothly, the adhesive 130 having a low viscosity can be used, and the occurrence of nozzle clogging can be suppressed.
  • a sound hole penetrating the substrate 110 in the thickness direction may be formed immediately below the MEMS microphone element 120 corresponding to the diaphragm 122 (not shown).
  • the converter module according to the second embodiment of the present invention is a MEMS microphone module including a MEMS microphone element as a conversion element, as in the first embodiment.
  • the angle formed by the second main surface of the pedestal and the slope of the concave portion that is a V-groove is larger than the angle in the first embodiment.
  • FIG. 5A is a plan view showing an example of the MEMS microphone module 200 according to Embodiment 2 of the present invention.
  • FIG. 5B is a cross-sectional view showing an example of the MEMS microphone module 200 according to Embodiment 2 of the present invention.
  • FIG. 5C is an enlarged plan view showing an example of a recess 225 of the MEMS microphone module 200 according to Embodiment 2 of the present invention.
  • FIG. 5D is an enlarged cross-sectional view showing an example of a recess 225 of the MEMS microphone module 200 according to Embodiment 2 of the present invention.
  • the second embodiment of the present invention differs from the first embodiment of the present invention in the shape of the base and the shape of the recess. Therefore, in the following description, differences from the above-described first embodiment will be mainly described, and the same constituent elements are denoted by common reference numerals and detailed description thereof is omitted.
  • the MEMS microphone module 200 is different from the MEMS microphone module 100 according to Embodiment 1 in that a MEMS microphone element 220 is provided instead of the MEMS microphone element 120. Further, the MEMS microphone element 220 is different from the MEMS microphone element 120 according to Embodiment 1 in that a pedestal 221 is provided instead of the pedestal 121.
  • the base 221 is a base for supporting the diaphragm 122, and has a first main surface and a second main surface.
  • the base 221 is made of silicon, for example.
  • the base 221 is a prism having a square or rectangular bottom surface (a surface surrounded by the vertex EFGH), that is, a rectangular parallelepiped.
  • the width of the base 221 is about 100 ⁇ m.
  • the width of the pedestal 221 is the distance between the inner wall facing the through hole 224 of the pedestal 221 and the outer wall of the pedestal 221 and indicates the distance of the thinnest portion.
  • the width of the pedestal 221 is the distance between one side of the square pedestal 221 in FIG. 5A and the nearest side of the square through-hole 224 that is parallel to the one side.
  • a through hole 224 that penetrates from the upper surface to the lower surface is formed in the base 221.
  • the through hole 224 has a frustum shape in which the upper surface and the lower surface are square or rectangular and the lower surface is wider than the upper surface. That is, the through hole 224 has a truncated pyramid shape or a truncated cone shape.
  • At least one recess 225 is formed on the lower surface of the base 221 at the interface with the adhesive 130.
  • a plurality of recesses 225 are formed.
  • the cross section of the plurality of recesses 225 is preferably V-shaped. More specifically, the recess 225 is preferably a V-groove.
  • the planar shape of the recess 225 is similar to the pedestal 221, for example. If the vertex of the recess 225 that is a V-groove is efgh, each side is formed in parallel with the side EFGH of the base 221.
  • the angle formed by the inclined surface of the recess 225 that is a V groove and the lower surface of the base 221 is 53 to 55 °, preferably 54 °. is there.
  • Each side of the concave portion 225 which is a V-groove is 12 to 45 ⁇ m, and the depth of the concave portion 225 is 10 to 30 ⁇ m.
  • the depth of the recess 225 means the depth at the deepest point in the recess 225.
  • the manufacturing method of the MEMS microphone module 200 according to the second embodiment of the present invention is different from the manufacturing method according to the first embodiment in that the crystal orientation of the wafer, the patterning for forming the through holes 224 and the recesses 225 are performed. Is different. Therefore, in the following, different points will be mainly described, and description of the same points will be omitted. That is, the MEMS microphone module 200 according to Embodiment 2 of the present invention can be manufactured according to the process cross-sectional view shown in FIG.
  • a ⁇ 100> wafer is prepared (corresponding to FIG. 2A).
  • the ⁇ 100> wafer is an assembly in which a plurality of MEMS microphone elements 220 each having an electrode pad 123, a diaphragm 122, and a base 221 in which the through hole 224 is not formed are formed.
  • the MEMS microphone element 220 is formed by a known method.
  • a mask on which a predetermined mask pattern is formed is prepared (corresponding to FIG. 2B). Specifically, a mask having a mask pattern along the shape of the through hole 224 and the recess 225 is formed on the bottom surface of the base 221 by a known method.
  • the vertex EFGH of the mask pattern is patterned so as to match the Si (110) surface constituting the base 221.
  • pattern vertices efgh of the mask pattern of the plurality of recesses 225 formed on the bottom of the base 221 are also patterned to match the (110) plane.
  • anisotropic etching is performed on the base 221 by wet etching using a weak alkaline aqueous solution such as TMAH (tetramethylammonium hydroxide aqueous solution) to form the through holes 224 and the plurality of recesses 225 (FIG. 2C). Equivalent).
  • TMAH tetramethylammonium hydroxide aqueous solution
  • the formation of the through hole 224 and the plurality of recesses 225 can be performed in separate steps, but it is preferable to perform them simultaneously.
  • the MEMS microphone element 220 is separated into pieces, the substrate 110 is prepared, the adhesive 130 is applied, the substrate 110 and the MEMS microphone element 220 are bonded, and wire bonding is performed.
  • the MEMS microphone module 200 as shown in FIGS. 5A to 5D can be manufactured.
  • the MEMS microphone module 200 includes the substrate 110, the MEMS microphone element 220, and the adhesive 130, as in the first embodiment.
  • the bottom surface of the pedestal 221 of the MEMS microphone element 220 and the substrate 110 are bonded together, and a part of the side surface of the pedestal 221 is covered. Further, at least one recess 225 is formed on the lower surface of the base 221 at the interface with the adhesive 130.
  • the angle formed between the lower surface of the base 221 and the inclined surface of the recess 225 that is a V groove is larger than that of the MEMS microphone module 100 according to Embodiment 1. Specifically, in Embodiment 1, it is about 35 °, while in Embodiment 2, it is about 54 °.
  • the concave portion 225 having an angle of about 54 ° When the width of the concave portion 125 that is a V-groove having an angle of about 35 ° is the same as the width of the concave portion 225 that is a V-groove having an angle of about 54 °, the concave portion 225 having an angle of about 54 ° The depth of the V-groove is deeper than that of the recess 125. Therefore, the volume of the adhesive 130 can be increased, and the stress on the MEMS microphone element 220 after mounting can be reduced. Thereby, the deformation
  • the side surface of the through hole 224a may be formed in a dogleg shape. That is, in the cross section of the pedestal 221a (for example, a cross section including a straight line parallel to the side EF or the side EH), the side surface of the pedestal 221a facing the through hole 224a may be a dogleg shape.
  • a concave portion is formed on the side surface of the base 221a facing the through hole 224a so as to increase the volume of the through hole 224a, and the shape of the concave portion is a dogleg shape.
  • the MEMS microphone element 220a is prepared.
  • the MEMS microphone element 220a includes a diaphragm 122, Poly-Si corresponding to a region immediately below the diaphragm 122, and a base 221a in which the through hole 224a is not formed.
  • the bottom surface of the pedestal 221a is patterned and wet etching is performed in the same manner as in the above manufacturing method.
  • the Poly-Si is isotropically etched.
  • the pedestal 221a is anisotropically etched from the front surface (bottom surface), and the side surface of the through hole 224a can be formed in a dogleg shape.
  • the MEMS microphone module and the manufacturing method thereof according to the present invention have been described based on the embodiments.
  • the present invention is not limited to these embodiments. Unless it deviates from the meaning of this invention, the form which carried out the various deformation
  • FIG. 7A is a plan view showing an example of a MEMS microphone module 300 according to a variation of Embodiment 2 of the present invention.
  • FIG. 7B is a cross-sectional view showing an example of a MEMS microphone module 300 according to a modification of the second embodiment of the present invention.
  • the concave portion which is a V groove is formed on the entire lower surface of the pedestal. Is different.
  • the MEMS microphone module 300 is different from the MEMS microphone module 200 according to Embodiment 2 in that a MEMS microphone element 320 is provided instead of the MEMS microphone element 220. Further, the MEMS microphone element 320 is different from the MEMS microphone element 220 according to Embodiment 2 in that a pedestal 321 is provided instead of the pedestal 221.
  • the base 321 is different from the base 221 in the shape of the recess formed on the lower surface. Specifically, a recess 325 is formed on the lower surface of the base 321 at the interface with the adhesive 130.
  • the concave portion 325 is formed along the shape of the lower surface of the base 321 as shown in FIG. 7A. That is, the recess 325 is formed so as to surround the through hole 224. Moreover, as shown to FIG. 7B, it is preferable that the cross section of the recessed part 325 is V-shaped. More specifically, the recess 325 is preferably a V-groove. The angle formed between the slope of the recess 325 that is a V-groove and the lower surface of the pedestal 321 is the same as in the second embodiment.
  • the manufacturing method of the MEMS microphone module 300 according to the variation of the second embodiment is different from the manufacturing method according to the second embodiment only in the patterning for forming the concave portion 325 that is a V groove. Specifically, when patterning the bottom surface of the pedestal 321, an area narrower than the width of the pedestal 321 is patterned over the entire circumference of the pedestal 321, and the recess 325 is formed by wet etching.
  • the following effects can be obtained in addition to the second embodiment. Since the recess 325 that is a V-groove is formed on the entire circumference of the base 321, the volume of the recess 325 increases. For this reason, the volume of the adhesive agent 130 can be increased and the stress to the MEMS microphone element 320 after mounting can be reduced. Therefore, deformation of the fragile diaphragm 122 can be alleviated and deterioration of the characteristics of the MEMS microphone module 300 can be suppressed. However, the shear strength decreases as the surface area to be bonded decreases as compared with the second embodiment.
  • the configuration of the MEMS microphone module shown in each embodiment is for illustrating the present invention specifically, and the MEMS microphone module according to the present invention necessarily includes all of the above configurations. There is no need. In other words, the MEMS microphone module according to the present invention only needs to have a minimum configuration capable of realizing the effects of the present invention.
  • the converter module according to the present invention has an effect that stress on the converter element can be reduced at the time of mounting.
  • the microphone element such as the MEMS microphone module described in the embodiment but also a fragile diaphragm or the like.
  • a device having a structure is intended in general, and includes, for example, a pressure sensor.
  • MEMS microphone module 100, 200, 200a, 300 MEMS microphone module 110 Substrate 120, 220, 220a, 320 MEMS microphone element 121, 221, 221a, 321 Base 122 Diaphragm 123 Electrode pad 124, 224, 224a Through hole 125, 225, 325 Recess 130 Adhesion Agent 140 Wire 150 Electrode Land 160 Wiring 170 Solder Resist 180 Mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un module de microphone MEMS ayant une bonne sensibilité et susceptible d'absorber suffisamment une tension même en cas d'utilisation à l'aide d'un adhésif de faible viscosité de telle manière que le colmatage est improbable même en cas d'utilisation d'une buse de faible diamètre. Ce module de microphone MEMS (100) comprend un substrat (110), un élément de microphone MEMS (120) et un adhésif (130) pour raccorder le substrat (110) et l'élément de microphone MEMS (120). L'élément de microphone MEMS (120) comprend : une base (121) qui a une première surface principale et une seconde surface principale sur la surface opposée à partir de la première surface principale, et un orifice de passage (124) formé dans celle-ci pour traverser de la première surface principale à la seconde surface principale ; et un diaphragme (122) pour recouvrir une partie de l'orifice de passage (124) et formé sur la première surface principale de la base (121). L'adhésif (130) raccorde la seconde surface principale de la base (121) et le substrat (110), et recouvre une partie du côté de la base (121). Au moins un renfoncement (125) est formé dans la seconde surface principale de la base (121) au niveau de l'interface avec l'adhésif (130).
PCT/JP2011/002570 2010-11-24 2011-05-09 Module de convertisseur et procédé de production associé Ceased WO2012070166A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010261855A JP2012114672A (ja) 2010-11-24 2010-11-24 Ｍｅｍｓマイクモジュール及びその製造方法
JP2010-261855 2010-11-24

Publications (1)

Publication Number Publication Date
WO2012070166A1 true WO2012070166A1 (fr) 2012-05-31

Family

ID=46145540

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/002570 Ceased WO2012070166A1 (fr) 2010-11-24 2011-05-09 Module de convertisseur et procédé de production associé

Country Status (2)

Country Link
JP (1) JP2012114672A (fr)
WO (1) WO2012070166A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115065919A (zh) * 2022-04-29 2022-09-16 潍坊歌尔微电子有限公司 Mems传感器及mems麦克风

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140064546A1 (en) * 2012-08-01 2014-03-06 Knowles Electronics, Llc Microphone assembly
US10549984B2 (en) 2018-06-29 2020-02-04 Sae Magnetics (H.K.) Ltd. MEMS package and method of manufacturing the same
CN110902642B (zh) 2018-09-17 2024-12-24 新科实业有限公司 Mems封装件及制造其的方法
US10863282B2 (en) 2019-01-30 2020-12-08 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package
US10785576B1 (en) 2019-04-30 2020-09-22 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US10934159B2 (en) 2019-06-03 2021-03-02 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US11350220B2 (en) 2020-01-17 2022-05-31 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105489A (ja) * 1992-09-24 1994-04-15 Seiko Epson Corp ロータマグネット固定方法
JP2002158506A (ja) * 2000-11-16 2002-05-31 Nippon Tanshi Kk 非可逆回路素子の永久磁石取付け用カバー
JP2008092561A (ja) * 2006-09-04 2008-04-17 Yamaha Corp 半導体マイクユニット、その製造方法、及び、半導体マイクユニットの搭載方法
JP2008098524A (ja) * 2006-10-13 2008-04-24 Omron Corp 振動センサ及びその製造方法
JP2010036280A (ja) * 2008-08-01 2010-02-18 Fuji Electric Holdings Co Ltd Ｍｅｍｓ構造体の製造方法
JP2010141870A (ja) * 2008-11-17 2010-06-24 Panasonic Corp シリコンマイクロホンモジュール及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105489A (ja) * 1992-09-24 1994-04-15 Seiko Epson Corp ロータマグネット固定方法
JP2002158506A (ja) * 2000-11-16 2002-05-31 Nippon Tanshi Kk 非可逆回路素子の永久磁石取付け用カバー
JP2008092561A (ja) * 2006-09-04 2008-04-17 Yamaha Corp 半導体マイクユニット、その製造方法、及び、半導体マイクユニットの搭載方法
JP2008098524A (ja) * 2006-10-13 2008-04-24 Omron Corp 振動センサ及びその製造方法
JP2010036280A (ja) * 2008-08-01 2010-02-18 Fuji Electric Holdings Co Ltd Ｍｅｍｓ構造体の製造方法
JP2010141870A (ja) * 2008-11-17 2010-06-24 Panasonic Corp シリコンマイクロホンモジュール及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115065919A (zh) * 2022-04-29 2022-09-16 潍坊歌尔微电子有限公司 Mems传感器及mems麦克风

Also Published As

Publication number Publication date
JP2012114672A (ja) 2012-06-14

Similar Documents

Publication Publication Date Title
WO2012070166A1 (fr) Module de convertisseur et procédé de production associé
US11111131B2 (en) MEMS microphone, a manufacturing method thereof and an electronic apparatus
TWI443061B (zh) 微機電系統（ｍｅｍｓ）麥克風封裝體及其製造方法
US20090175477A1 (en) Vibration transducer
CN102860038B (zh) 麦克风及其制造方法
TWI616103B (zh) 微機電系統（ｍｅｍｓ）傳感器封裝
KR101205645B1 (ko) 음향 센서
US7763972B2 (en) Stacked package structure for reducing package volume of an acoustic micro-sensor
JP5382029B2 (ja) マイクロフォンの製造方法
TWI727164B (zh) 包括微機電系統裝置的組件及包括組件的電子裝置
CN104030233A (zh) 顶部端口微机电系统腔体封装
US8948420B2 (en) MEMS microphone
CN103503481A (zh) 声音传感器及其制造方法
CN111422820B (zh) 传感器的封装结构及封装方法
CN102642802A (zh) 微机电系统(mems)封装
TWI613769B (zh) 晶圓級ｍｅｍｓ傳感器封裝
CN102815660A (zh) 包括插件的封装器件和将管芯附接到衬底的方法
JP2012006092A (ja) Ｍｅｍｓデバイス及びその製造方法並びにｍｅｍｓデバイスを有するパッケージ
CN101734607B (zh) 微机电系统的封装结构
JP2008271424A (ja) 音響センサ
CN108124228A (zh) 麦克风芯片及麦克风
JP2012182683A (ja) 半導体装置及びその製造方法
KR101118624B1 (ko) Ｍｅｍｓ 마이크로폰 패키지 및 제조방법
CN102209287B (zh) Mems麦克风芯片及其制造方法
KR20130120284A (ko) 반도체 디바이스

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11843321

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11843321

Country of ref document: EP

Kind code of ref document: A1