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JP2012114672A - Ｍｅｍｓマイクモジュール及びその製造方法 - Google Patents

Ｍｅｍｓマイクモジュール及びその製造方法 Download PDF

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Publication number
JP2012114672A
JP2012114672A JP2010261855A JP2010261855A JP2012114672A JP 2012114672 A JP2012114672 A JP 2012114672A JP 2010261855 A JP2010261855 A JP 2010261855A JP 2010261855 A JP2010261855 A JP 2010261855A JP 2012114672 A JP2012114672 A JP 2012114672A
Authority
JP
Japan
Prior art keywords
mems microphone
pedestal
main surface
adhesive
microphone module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010261855A
Other languages
English (en)
Japanese (ja)
Inventor
Daisuke Inoue
大輔 井上
Yoshihiro Tomita
佳宏 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2010261855A priority Critical patent/JP2012114672A/ja
Priority to PCT/JP2011/002570 priority patent/WO2012070166A1/fr
Publication of JP2012114672A publication Critical patent/JP2012114672A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
JP2010261855A 2010-11-24 2010-11-24 Ｍｅｍｓマイクモジュール及びその製造方法 Pending JP2012114672A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010261855A JP2012114672A (ja) 2010-11-24 2010-11-24 Ｍｅｍｓマイクモジュール及びその製造方法
PCT/JP2011/002570 WO2012070166A1 (fr) 2010-11-24 2011-05-09 Module de convertisseur et procédé de production associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010261855A JP2012114672A (ja) 2010-11-24 2010-11-24 Ｍｅｍｓマイクモジュール及びその製造方法

Publications (1)

Publication Number Publication Date
JP2012114672A true JP2012114672A (ja) 2012-06-14

Family

ID=46145540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010261855A Pending JP2012114672A (ja) 2010-11-24 2010-11-24 Ｍｅｍｓマイクモジュール及びその製造方法

Country Status (2)

Country Link
JP (1) JP2012114672A (fr)
WO (1) WO2012070166A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014022542A1 (fr) * 2012-08-01 2014-02-06 Szczech John B Ensemble microphone
US10549984B2 (en) 2018-06-29 2020-02-04 Sae Magnetics (H.K.) Ltd. MEMS package and method of manufacturing the same
US10785576B1 (en) 2019-04-30 2020-09-22 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US10836630B2 (en) 2018-09-17 2020-11-17 Sae Magnetics (H.K.) Ltd. MEMS package and method of manufacturing the same
US10863282B2 (en) 2019-01-30 2020-12-08 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package
US10934159B2 (en) 2019-06-03 2021-03-02 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US11350220B2 (en) 2020-01-17 2022-05-31 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115065919A (zh) * 2022-04-29 2022-09-16 潍坊歌尔微电子有限公司 Mems传感器及mems麦克风

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105489A (ja) * 1992-09-24 1994-04-15 Seiko Epson Corp ロータマグネット固定方法
JP4435296B2 (ja) * 2000-11-16 2010-03-17 日本端子株式会社 非可逆回路素子の永久磁石取付け用カバー
JP2008092561A (ja) * 2006-09-04 2008-04-17 Yamaha Corp 半導体マイクユニット、その製造方法、及び、半導体マイクユニットの搭載方法
JP4144640B2 (ja) * 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
JP2010036280A (ja) * 2008-08-01 2010-02-18 Fuji Electric Holdings Co Ltd Ｍｅｍｓ構造体の製造方法
JP2010141870A (ja) * 2008-11-17 2010-06-24 Panasonic Corp シリコンマイクロホンモジュール及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014022542A1 (fr) * 2012-08-01 2014-02-06 Szczech John B Ensemble microphone
US10549984B2 (en) 2018-06-29 2020-02-04 Sae Magnetics (H.K.) Ltd. MEMS package and method of manufacturing the same
US10836630B2 (en) 2018-09-17 2020-11-17 Sae Magnetics (H.K.) Ltd. MEMS package and method of manufacturing the same
US10863282B2 (en) 2019-01-30 2020-12-08 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package
US10785576B1 (en) 2019-04-30 2020-09-22 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US10934159B2 (en) 2019-06-03 2021-03-02 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
US11350220B2 (en) 2020-01-17 2022-05-31 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone and method of manufacturing the MEMS package

Also Published As

Publication number Publication date
WO2012070166A1 (fr) 2012-05-31

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