WO2012062203A1 - Omnidirectional integrated heat exchanger - Google Patents
Omnidirectional integrated heat exchanger Download PDFInfo
- Publication number
- WO2012062203A1 WO2012062203A1 PCT/CN2011/081958 CN2011081958W WO2012062203A1 WO 2012062203 A1 WO2012062203 A1 WO 2012062203A1 CN 2011081958 W CN2011081958 W CN 2011081958W WO 2012062203 A1 WO2012062203 A1 WO 2012062203A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat exchanger
- composite condenser
- condenser
- vertical
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
Definitions
- the invention relates to a comprehensive heat exchanger, in particular to a novel high-efficiency all-round integrated heat exchanger for semiconductor refrigerating and warming.
- One is a semiconductor refrigerator that uses a fan and a heat sink for external heat exchange.
- the box can be both cooled and heated, but the cooling efficiency is low and there is significant noise.
- It is a semiconductor refrigerated box that uses a heat pipe type heat sink for external heat exchange. The cooling efficiency is slightly higher, but the box can only be cooled and cannot be heated.
- the object of the present invention is to provide such a high-efficiency all-round integrated heat exchanger for semiconductor refrigerated warm storage, which has much longer heat exchange capacity with ambient air than ordinary heat exchangers, thereby improving semiconductor refrigeration.
- the characteristics of the refrigeration efficiency and heating efficiency of the heater are particularly important.
- the object of the present invention is achieved by the following technical solutions: using a metal material having good thermal conductivity to form a suitable liquid refrigerant, an external heat exchanger capable of flowing inside, and a composite condenser prepared from a metal material having good thermal conductivity. Selecting a suitable infusion pump, the external heat exchanger, the composite condenser and the infusion pump are connected to each other to form a circulating flow path for the liquid refrigerant flow, characterized in that the composite condenser is composed of a horizontal composite condenser and a vertical composite condenser.
- the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser is connected and connected by one or more vertical single-layer condensers. Composition.
- the working principle of the present invention is as follows.
- the semiconductor refrigerated warm box cooling is used as an example.
- the semiconductor refrigeration heater continuously draws heat from the indoor heat exchanger through the indoor heat exchanger, and transfers the heat to the outdoor heat exchanger.
- the indoor temperature is lowered to achieve the purpose of refrigeration, due to the operation of the infusion pump.
- the liquid refrigerant circulates in such an all-round integrated heat exchanger, bringing the heat from the outdoor heat exchanger to the composite condenser and then to the surrounding air, because the composite condenser is horizontally compounded.
- the condenser and the vertical composite condenser are combined with each other, and the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser is composed of one or more vertical
- the straight single-layer condensers are connected to each other, and the vertical composite condenser is usually placed on the outer back surface of the semiconductor refrigerated warm storage box, and the horizontal composite condenser is usually placed on the outer bottom surface of the semiconductor refrigerated warm storage box.
- the effective heat exchange area of the composite condenser and the external environment is much larger than the usual common composite cold with only a single placement surface.
- the effective heat transfer area with the external environment so the heat exchange efficiency of the external environment Burgundy high, can greatly improve the efficiency of semiconductor refrigerated warm storage tank.
- FIG. 1 is a schematic structural diagram of an embodiment of the present invention
- an external heat exchanger 1 in which a suitable liquid refrigerant can flow inside is made of a metal material having good thermal conductivity, and a composite condenser 2 is prepared from a metal material having good thermal conductivity, and a suitable infusion pump is selected.
- the outer heat exchanger 1, the composite condenser 2 and the infusion pump 3 are connected to each other to constitute a circulating flow path of the liquid refrigerant flow, characterized in that the composite condenser 2 is composed of a horizontal composite condenser 5 and vertical
- the composite condensers 4 are configured by being connected to each other.
- the horizontal composite condenser 5 is composed of one or more horizontal single-layer condensers connected to each other
- the vertical composite condenser 4 is composed of one or more vertical singles.
- the layer condensers are configured by being connected to each other.
- the working principle of the present invention is as follows.
- the semiconductor refrigerating warm box cooling is used as an example.
- the semiconductor refrigerating heater continuously draws heat from the indoor heat exchanger to remove heat. Passed to the outdoor heat exchanger 1, the indoor temperature is lowered, and the purpose of cooling is achieved.
- the liquid refrigerant circulates in such an all-round integrated heat exchanger, and the heat on the outdoor heat exchanger 1 is Brought to the composite condenser 2, and then distributed to the surrounding air, because the composite condenser 2 is composed of a horizontal composite condenser 5 and a vertical composite condenser 4, and the horizontal composite condenser 5 is composed of One or more horizontal single-layer condensers are combined with each other, and the vertical composite condenser 4 is composed of one or more vertical single-layer condensers connected to each other, and the vertical composite condenser 4 is usually Placed on the outer back of the semiconductor refrigerated warm storage box, the horizontal composite condenser 5 is usually placed on the outer bottom surface of the semiconductor refrigerated warm storage box.
- the effective heat exchange area of the composite condenser 2 and the external environment is much larger than that of the conventional composite condenser having only a single placement surface and the effective heat exchange area of the external environment, so the heat exchange efficiency with the external environment is high, and can be large.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
一种全方位放置综合换热器 技术领域 An all-round comprehensive heat exchanger
本发明涉及到一种综合换热器，特别是一种用于半导体冷藏暖藏上的一 种新型高效率的全方位放置综合换热器. The invention relates to a comprehensive heat exchanger, in particular to a novel high-efficiency all-round integrated heat exchanger for semiconductor refrigerating and warming.
背景技术 Background technique
目前，市场上有两种半导体冷藏箱.一种是用风扇加散热片进行外部换热 的半导体冷藏箱， 箱内既可制冷又可制热， 但制冷效率低且有明显噪音， 还 有一种是用热管式散热装置进行外部换热的半导体冷藏箱， 制冷效率稍高， 但箱内只可制冷不能制热。 At present, there are two types of semiconductor refrigerators on the market. One is a semiconductor refrigerator that uses a fan and a heat sink for external heat exchange. The box can be both cooled and heated, but the cooling efficiency is low and there is significant noise. It is a semiconductor refrigerated box that uses a heat pipe type heat sink for external heat exchange. The cooling efficiency is slightly higher, but the box can only be cooled and cannot be heated.
发明目的 Purpose of the invention
本发明的目的是提供这样一种用于半导体冷藏暖藏上的一种高效率的全 方位放置综合换热器， 它与周围空气的换热能力远大于普通的换热器， 从而 提高半导体制冷制热器的制冷效率和制热效率的特点 . The object of the present invention is to provide such a high-efficiency all-round integrated heat exchanger for semiconductor refrigerated warm storage, which has much longer heat exchange capacity with ambient air than ordinary heat exchangers, thereby improving semiconductor refrigeration. The characteristics of the refrigeration efficiency and heating efficiency of the heater.
本发明的目的是通过下面的技术方案实现的： 用导热性能良好的金属材 料制作成合适的液体冷媒能在内部流动的外换热器， 用导热性能良好的金属 材料制作成复合式冷凝器， 选用合适的输液泵，外换热器、 复合式冷凝器和输 液泵相互连接构成液体冷媒流动的循环流动通路， 其特征是：复合式冷凝器由 水平复合式冷凝器和竖直复合式冷凝器相互连通组合而构成， 水平复合式冷 凝器由一个或一个以上的水平单层冷凝器相互连通组合而构成， 竖直复合式 冷凝器由一个或一个以上的竖直单层冷凝器相互连通组合而构成。 The object of the present invention is achieved by the following technical solutions: using a metal material having good thermal conductivity to form a suitable liquid refrigerant, an external heat exchanger capable of flowing inside, and a composite condenser prepared from a metal material having good thermal conductivity. Selecting a suitable infusion pump, the external heat exchanger, the composite condenser and the infusion pump are connected to each other to form a circulating flow path for the liquid refrigerant flow, characterized in that the composite condenser is composed of a horizontal composite condenser and a vertical composite condenser. The horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser is connected and connected by one or more vertical single-layer condensers. Composition.
本发明的工作原理是这样的，这里以半导体冷藏暖藏箱制冷来举例说明， 半导体冷藏暖藏箱通电后开始工作，半导体制冷制热器通过室内换热器不断 地从室内吸取热量，把热量传给室外换热器，室内温度降低，达到制冷的目的， 由于输液泵的工作，液体冷媒在这样一种全方位放置综合换热器内循环流动， 将室外换热器上的热量带到复合式冷凝器， 再散发到周围的空气中， 由于复 合式冷凝器由水平复合式冷凝器和竖直复合式冷凝器相互连通组合而构成， 水平复合式冷凝器由一个或一个以上的水平单层冷凝器相互连通组合而构 成， 竖直复合式冷凝器由一个或一个以上的竖直单层冷凝器相互连通组合而 构成， 竖直复合式冷凝器通常被放置于半导体冷藏暖藏箱的外背面， 水平复 合式冷凝器通常被放置于半导体冷藏暖藏箱的外底面， 这种复合式冷凝器与 外部环境的有效换热面积远大于通常的只有单一放置面的普通复合式冷凝器 与外部环境的有效换热面积， 所以与外部环境的换热效率艮高， 可以大幅度 提高半导体冷藏暖藏箱的工作效率。 The working principle of the present invention is as follows. Here, the semiconductor refrigerated warm box cooling is used as an example. After the semiconductor refrigerated warm storage box is energized, the semiconductor refrigeration heater continuously draws heat from the indoor heat exchanger through the indoor heat exchanger, and transfers the heat to the outdoor heat exchanger. The indoor temperature is lowered to achieve the purpose of refrigeration, due to the operation of the infusion pump. The liquid refrigerant circulates in such an all-round integrated heat exchanger, bringing the heat from the outdoor heat exchanger to the composite condenser and then to the surrounding air, because the composite condenser is horizontally compounded. The condenser and the vertical composite condenser are combined with each other, and the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser is composed of one or more vertical The straight single-layer condensers are connected to each other, and the vertical composite condenser is usually placed on the outer back surface of the semiconductor refrigerated warm storage box, and the horizontal composite condenser is usually placed on the outer bottom surface of the semiconductor refrigerated warm storage box. The effective heat exchange area of the composite condenser and the external environment is much larger than the usual common composite cold with only a single placement surface. The effective heat transfer area with the external environment, so the heat exchange efficiency of the external environment Burgundy high, can greatly improve the efficiency of semiconductor refrigerated warm storage tank.
附图说明 DRAWINGS
本发明的附图说明如下： The drawings of the present invention are described as follows:
图 1是本发明的实施例的原理结构示意图； 1 is a schematic structural diagram of an embodiment of the present invention;
图中： 1. 室外换热器； 2.复合式冷凝器； 3. 输液泵； 4.竖直复合式 冷凝器； 5. 水平复合式冷凝器。 In the figure: 1. Outdoor heat exchanger; 2. Composite condenser; 3. Infusion pump; 4. Vertical composite condenser; 5. Horizontal composite condenser.
具体实施方式 detailed description
下面结合附图和实施例对本发明做进一步说明： The present invention will be further described below in conjunction with the accompanying drawings and embodiments:
如图 1所示， 用导热性能良好的金属材料制作成合适的液体冷媒能在内部 流动的外换热器 1， 用导热性能良好的金属材料制作成复合式冷凝器 2， 选用 合适的输液泵 3，外换热器 1、 复合式冷凝器 2和输液泵 3相互连接构成液体冷媒 流动的循环流动通路， 其特征是：复合式冷凝器 2由水平复合式冷凝器 5和竖直 复合式冷凝器 4相互连通组合而构成， 水平复合式冷凝器 5由一个或一个以上 的水平单层冷凝器相互连通组合而构成， 竖直复合式冷凝器 4由一个或一个以 上的竖直单层冷凝器相互连通组合而构成。 As shown in Fig. 1, an external heat exchanger 1 in which a suitable liquid refrigerant can flow inside is made of a metal material having good thermal conductivity, and a composite condenser 2 is prepared from a metal material having good thermal conductivity, and a suitable infusion pump is selected. 3, the outer heat exchanger 1, the composite condenser 2 and the infusion pump 3 are connected to each other to constitute a circulating flow path of the liquid refrigerant flow, characterized in that the composite condenser 2 is composed of a horizontal composite condenser 5 and vertical The composite condensers 4 are configured by being connected to each other. The horizontal composite condenser 5 is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser 4 is composed of one or more vertical singles. The layer condensers are configured by being connected to each other.
本发明的工作原理是这样的，这里以半导体冷藏暖藏箱制冷来举例说明， 半导体冷藏暖藏箱通电后开始工作，半导体制冷制热器通过室内换热器不断 地从室内吸取热量，把热量传给室外换热器 1，室内温度降低，达到制冷的目的, 由于输液泵 3的工作，液体冷媒在这样一种全方位放置综合换热器内循环流动, 将室外换热器 1上的热量带到复合式冷凝器 2 , 再散发到周围的空气中， 由于 复合式冷凝器 2由水平复合式冷凝器 5和竖直复合式冷凝器 4相互连通组合而 构成， 水平复合式冷凝器 5由一个或一个以上的水平单层冷凝器相互连通组合 而构成， 竖直复合式冷凝器 4由一个或一个以上的竖直单层冷凝器相互连通组 合而构成， 竖直复合式冷凝器 4通常被放置于半导体冷藏暖藏箱的外背面， 水 平复合式冷凝器 5通常被放置于半导体冷藏暖藏箱的外底面， 这种复合式冷凝 器 2与外部环境的有效换热面积远大于通常的只有单一放置面的普通复合式 冷凝器与外部环境的有效换热面积， 所以与外部环境的换热效率艮高， 可以 大幅度提高半导体冷藏暖藏箱的工作效率。 The working principle of the present invention is as follows. Here, the semiconductor refrigerating warm box cooling is used as an example. After the semiconductor refrigerating warm box is energized, the semiconductor refrigerating heater continuously draws heat from the indoor heat exchanger to remove heat. Passed to the outdoor heat exchanger 1, the indoor temperature is lowered, and the purpose of cooling is achieved. Due to the operation of the infusion pump 3, the liquid refrigerant circulates in such an all-round integrated heat exchanger, and the heat on the outdoor heat exchanger 1 is Brought to the composite condenser 2, and then distributed to the surrounding air, because the composite condenser 2 is composed of a horizontal composite condenser 5 and a vertical composite condenser 4, and the horizontal composite condenser 5 is composed of One or more horizontal single-layer condensers are combined with each other, and the vertical composite condenser 4 is composed of one or more vertical single-layer condensers connected to each other, and the vertical composite condenser 4 is usually Placed on the outer back of the semiconductor refrigerated warm storage box, the horizontal composite condenser 5 is usually placed on the outer bottom surface of the semiconductor refrigerated warm storage box. The effective heat exchange area of the composite condenser 2 and the external environment is much larger than that of the conventional composite condenser having only a single placement surface and the effective heat exchange area of the external environment, so the heat exchange efficiency with the external environment is high, and can be large. The increase in the efficiency of the semiconductor refrigerated warm storage box.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020618668XU CN201852369U (en) | 2010-11-11 | 2010-11-11 | Directionally-placed comprehensive heat exchanger |
| CN201020618668.X | 2010-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012062203A1 true WO2012062203A1 (en) | 2012-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2011/081958 Ceased WO2012062203A1 (en) | 2010-11-11 | 2011-11-08 | Omnidirectional integrated heat exchanger |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201852369U (en) |
| WO (1) | WO2012062203A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201852369U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
| CN102466367A (en) * | 2010-11-11 | 2012-05-23 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
| CN201852351U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Omnibearing placed cold-heat complementary comprehensive heat exchanger |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2773362A (en) * | 1953-05-18 | 1956-12-11 | Whirlpool Seeger Corp | Refrigerators for freezing food and storage of frozen food |
| US2959939A (en) * | 1958-05-01 | 1960-11-15 | Carrier Corp | Refrigerated storage unit |
| US4301663A (en) * | 1978-12-28 | 1981-11-24 | The General Corporation | Refrigerating cabinet |
| CN2563529Y (en) * | 2002-08-30 | 2003-07-30 | 广东科龙电器股份有限公司 | Inner tube combination structure for electric refrigerator |
| CN201331212Y (en) * | 2008-12-28 | 2009-10-21 | 刘万辉 | A new high-efficiency hot and cold complementary type integrated heat exchanger |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
| CN201852351U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Omnibearing placed cold-heat complementary comprehensive heat exchanger |
| CN201852369U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
| CN201954832U (en) * | 2010-12-29 | 2011-08-31 | 刘万辉 | Novel efficient and practical semiconductor refrigerating and heating box |
| CN202063404U (en) * | 2010-12-29 | 2011-12-07 | 刘万辉 | Multifunctional box of two uses of refrigeration and warm insulation of new high efficiency and utility type |
-
2010
- 2010-11-11 CN CN201020618668XU patent/CN201852369U/en not_active Expired - Fee Related
-
2011
- 2011-11-08 WO PCT/CN2011/081958 patent/WO2012062203A1/en not_active Ceased
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2773362A (en) * | 1953-05-18 | 1956-12-11 | Whirlpool Seeger Corp | Refrigerators for freezing food and storage of frozen food |
| US2959939A (en) * | 1958-05-01 | 1960-11-15 | Carrier Corp | Refrigerated storage unit |
| US4301663A (en) * | 1978-12-28 | 1981-11-24 | The General Corporation | Refrigerating cabinet |
| CN2563529Y (en) * | 2002-08-30 | 2003-07-30 | 广东科龙电器股份有限公司 | Inner tube combination structure for electric refrigerator |
| CN201331212Y (en) * | 2008-12-28 | 2009-10-21 | 刘万辉 | A new high-efficiency hot and cold complementary type integrated heat exchanger |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
| CN201852351U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Omnibearing placed cold-heat complementary comprehensive heat exchanger |
| CN201852369U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
| CN201954832U (en) * | 2010-12-29 | 2011-08-31 | 刘万辉 | Novel efficient and practical semiconductor refrigerating and heating box |
| CN202063404U (en) * | 2010-12-29 | 2011-12-07 | 刘万辉 | Multifunctional box of two uses of refrigeration and warm insulation of new high efficiency and utility type |
Also Published As
| Publication number | Publication date |
|---|---|
| CN201852369U (en) | 2011-06-01 |
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