CN203810826U - Refrigerator - Google Patents

Abstract

The utility model provides a refrigerator, comprising: a first semiconductor refrigerating sheet with a first cold end surface generating cold and a first hot end surface generating heat; a second semiconductor refrigerating sheet having a second cold end surface generating cold and the second hot end surface generating heat; a first heat exchanger, a part of which is thermally connected with the first cold end surface, and another part is thermally connected with the freezer compartment of the refrigerator; a second heat exchanger, a part of which is connected with the said The second cold end surface is thermally connected, and the other part is thermally connected with the refrigerating chamber of the refrigerator; the third heat exchanger, part of which is thermally connected with the second hot end surface, and the other part dissipates heat from the second hot end surface to the surrounding environment middle. In the refrigerator of the utility model, since the cold end of the second semiconductor refrigerating sheet fully radiates heat and cools down the hot end of the first semiconductor refrigerating sheet, the heat dissipation efficiency of the hot end of the first semiconductor refrigerating sheet can be improved, thereby improving the cooling effect of the cold end.

Description

refrigerator

technical field

The utility model relates to refrigeration equipment, in particular to a semiconductor refrigeration refrigerator.

Background technique

Semiconductor refrigerators have the characteristics of environmental protection and high volume ratio, and are widely welcomed by the market. However, limited by the characteristics of semiconductor refrigeration chips, it can only achieve the purpose of refrigeration, but not the standard of freezing, so its application is greatly restricted. In prior art semiconductor refrigerators including refrigerating chambers and freezing chambers, the compression refrigeration system and the semiconductor refrigeration system are usually used for mixed refrigeration, and the hot end or hot end radiator of the semiconductor refrigeration sheet is usually arranged to be connected with the compression refrigeration system. direct contact with the compressor evaporator. The cold energy generated by the compressor evaporator is conducted to the hot end of the semiconductor refrigeration sheet to dissipate heat and cool it down. This scheme of heat dissipation and cooling of the hot end of the semiconductor refrigerating sheet by means of contact conduction is complicated in process and high in cost. In addition, the compression refrigeration system is bulky and occupies the storage space of the refrigerator; and it is noisy during operation.

Contents of the invention

One object of the present utility model is to overcome at least one defect of semiconductor refrigerators with refrigerating chambers and freezing chambers in the prior art, and provide a refrigerator with refrigeration and freezing functions that can efficiently refrigerate.

A further purpose of the utility model is to make the refrigerator work with low noise and large storage space.

For this reason, the utility model provides a kind of refrigerator, comprises:

The first semiconductor refrigeration sheet has a first cold end surface that generates cold energy and a first hot end surface that generates heat;

The second semiconductor refrigeration sheet has a second cold end surface that generates cold energy and a second hot end surface that generates heat;

A first heat exchanger, one part of which is thermally connected to the first cold end surface, and the other part is thermally connected to the freezer compartment of the refrigerator;

A second heat exchanger, one part of which is thermally connected to the second cold end surface, and the other part is thermally connected to the refrigerating chamber of the refrigerator;

A third heat exchanger, a part of which is thermally connected with the second heat end surface, and another part which dissipates heat from the second heat end surface to the surrounding environment.

Optionally, the third heat exchanger includes:

The third refrigerant box defines an inner cavity for containing a refrigerant that coexists in two phases of gas and liquid;

The third refrigerant pipeline communicates with the inner cavity of the third refrigerant tank;

The inner surface of the upper end of the thermal bridge is thermally connected to the second heat end surface, and the outer surface of the lower end is thermally connected to the inner surface of the third refrigerant box.

Optionally, the third heat exchanger also includes:

The upper cooling fins are arranged on the outer surface of the upper end of the heat bridge.

Optionally, the third heat exchanger also includes:

The upper heat dissipation fan is fixed on the outer side of the upper heat dissipation fin by a fastening mechanism, and the air outlet part of the upper heat dissipation fan is arranged facing the upper heat dissipation fin.

Optionally, the third heat exchanger also includes:

The lower cooling fins are arranged on the outer surface of the third refrigerant tank.

Optionally, the third heat exchanger also includes:

The lower heat dissipation fan is fixed on the outer side of the lower heat dissipation fin by a fastening mechanism, and the air outlet part of the lower heat dissipation fan is arranged facing the lower heat dissipation fin.

Optionally, the first heat exchanger includes:

A first refrigerant box defining an inner cavity for containing a gas-liquid two-phase coexistent refrigerant, the first refrigerant box being thermally connected to the first cold end surface; and

The first refrigerant pipeline communicates with the inner chamber of the first refrigerant tank.

Optionally, the second heat exchanger includes:

The second refrigerant box defines an inner cavity for containing a refrigerant in gas-liquid two-phase coexistence, and the two opposite surfaces of the second refrigerant box are respectively connected to the first hot end surface and the second cold end surface. end thermal connections; and

The second refrigerant pipeline communicates with the inner chamber of the second refrigerant tank.

Optionally, the refrigerator also includes:

The first temperature sensor is arranged on the inner wall of the refrigerating room of the refrigerator, and collects the temperature signal of the refrigerating room in the refrigerating room;

The second temperature sensor is arranged on the inner wall of the freezer compartment of the refrigerator, and collects a freezer compartment temperature signal in the freezer compartment; and

A controller, which is electrically connected to the first temperature sensor, the second temperature sensor, the first semiconductor cooling chip and the second semiconductor cooling chip, and the controller receives the temperature signal of the refrigerator compartment sent by the first temperature sensor and the second temperature sensor and the freezer compartment temperature signal, and control the power supply voltages of the first peltier cooler and the second peltier refrigerator according to the refrigerator compartment temperature signal and the freezer compartment temperature signal.

The refrigeration and heat dissipation system of the refrigerator of the utility model adopts the two-stage semiconductor refrigeration technology, which replaces the compressor and the cabin where the compressor is placed compared with the traditional compression refrigeration, so that the effective utilization space of the refrigerator becomes larger. In addition, there is no air duct and evaporator cover inside the refrigerator, and the external heat dissipation pipes are all attached to the inside of the shell, which has a beautiful appearance, clean and generous, and greatly improves the space utilization rate.

In the refrigerator of the present invention, since the cold end of the second semiconductor refrigerating sheet fully dissipates heat and cools down the hot end of the first semiconductor refrigerating sheet, the heat dissipation efficiency of the hot end of the first semiconductor refrigerating sheet can be improved, thereby improving the cooling effect of the cold end.

Further, in the refrigerator of the present invention, there are cooling fins, cooling fans and refrigerant pipelines for dissipating heat from the hot end of the second semiconductor cooling fin, which can effectively reduce the temperature difference between the hot end and the ambient temperature, and improve Cooling capacity at the cold end. When the load of the refrigerator is low, the cooling fan can be properly turned off, which can effectively reduce the noise and energy consumption of the refrigerator, making its overall operation safer and more reliable.

According to the following detailed description of specific embodiments of the utility model in conjunction with the accompanying drawings, those skilled in the art will be more aware of the above and other objectives, advantages and features of the utility model.

Description of drawings

Hereinafter, some specific embodiments of the present utility model will be described in detail in an exemplary rather than restrictive manner with reference to the accompanying drawings. The same reference numerals in the drawings designate the same or similar parts or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the attached picture:

Fig. 1 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of the first heat exchanger shown in Fig. 1;

Fig. 3 is a schematic structural diagram of the third heat exchanger shown in Fig. 1;

Fig. 4 is a schematic graph showing the relationship between the power supply voltage, cooling efficiency and cooling capacity of a semiconductor cooling chip according to an embodiment of the present invention.

Detailed ways

Embodiments of the present utility model are described in detail below, examples of said embodiments are shown in the accompanying drawings, and the embodiments described below with reference to the accompanying drawings are exemplary, only for explaining the present utility model, and cannot be construed as supporting the present invention. Utility model restrictions. In the description of the present utility model, the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "inner" and "outer" are based on the orientation or positional relationship shown in the drawings, only It is for the convenience of describing the utility model and does not require the utility model to be constructed and operated in a specific orientation, so it should not be construed as a limitation of the utility model.

Fig. 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention. The refrigerator of the present utility model may comprise a box body 10, and two chambers of a freezer compartment 11 and a refrigerator compartment 12 are formed in the box body 10 by an inner container. In one embodiment, the refrigerator compartment 12 is located above the box body 10 , and the freezer compartment 11 is located below the box body 10 . A first peltier refrigerated fin 21 , a second peltier refrigerated fin 22 , a first heat exchanger 310 , a second heat exchanger 320 and a third heat exchanger 330 are arranged on the side wall or the back plate of the box body 10 . Wherein, the first semiconductor cooling plate 21 has a first cold end surface that generates cold energy and a first hot end surface that generates heat. A part of the first heat exchanger 310 is thermally connected with the first cold end surface, and another part is thermally connected with the freezer compartment 11 of the refrigerator, so as to transfer the cold energy of the first cold end surface to the freezer compartment of the refrigerator 11 in. The second semiconductor cooling plate 22 has a second cold end surface that generates cold energy and a second hot end surface that generates heat. A part of the second heat exchanger 320 is thermally connected with the second cold end surface, and another part is thermally connected with the refrigerating chamber 12 of the refrigerator, so as to transfer a part of the cold energy of the second cold end surface to the refrigerating chamber of the refrigerator. In the chamber 12 , and offset the remaining cold energy of the second cold end surface against the heat of the first hot end surface of the first semiconductor cooling fin 21 . A part of the third heat exchanger 330 is thermally connected with the second hot end surface, and another part dissipates the heat of the second hot end surface to the surrounding environment. Since the second semiconductor cooling chip 22 is not only responsible for cooling the refrigerator compartment 12, but also absorbs heat from the first cooling end of the first semiconductor cooling chip 21, therefore, the second semiconductor cooling chip 22 should have a stronger cooling capacity. Since the semiconductor refrigeration sheet is a thermoelectric refrigeration device using thermoelectric effect, this scheme can improve the cooling effect of the first cold end surface of the first semiconductor refrigeration sheet 21 and the second cold end surface of the second semiconductor refrigeration sheet 22, thereby realizing the refrigeration effect of the refrigerator. efficient cooling.

In some embodiments of the present invention, the first heat exchanger 310 , the second heat exchanger 320 and the third heat exchanger 330 may respectively include a refrigerant tank and a refrigerant pipeline. Wherein, the refrigerant box defines an inner chamber for containing refrigerant in gas-liquid two-phase coexistence, and is configured to allow the refrigerant to undergo phase-change heat therein. The refrigerant pipeline communicates with the inner cavity of the refrigerant tank, and is configured to allow the refrigerant to flow therein and undergo phase conversion heat. When the exchanger is working, the inside of the refrigerant box is filled with refrigerant that coexists in gas-liquid two phases. When the refrigerant box is in thermal contact with the heat source or cold source to exchange heat, the refrigerant conducts heat conduction through the gas-liquid phase change in the refrigerant box and the refrigerant pipeline. The refrigerant filled in the refrigerant tank and the refrigerant pipeline can be carbon dioxide or other refrigerants, and the filling amount of the refrigerant can be obtained by testing. The refrigerant pipeline can be selected from copper tubes, stainless steel tubes, aluminum tubes, etc., preferably copper tubes.

"Thermal connection" or "thermal contact" in the embodiment of the present utility model, the most direct implementation mode known to those skilled in the art is to directly abut contact and conduct heat transfer by means of heat conduction. If thermal conductive silicone grease (graphite or other media) is applied against the contact surface, it can be considered as a part of the contact surface as a thermal conduction layer to improve thermal connection (or thermal contact).

Fig. 2 shows a schematic structural view of a first heat exchanger according to an embodiment of the present invention. As shown in FIG. 2 , the first heat exchanger 310 may include a first refrigerant tank 312 and a first refrigerant pipeline 311 . The first refrigerant pipeline 311 extends downwards in the vertical direction from its first end formed as an open end (as shown in the upper right end of the first refrigerant pipeline 311 in FIG. 2 ) and then bends downwards and extends to its lowest position, Then it bends and extends upwards, and then extends vertically upwards to its second end formed as an open end (as shown in the upper left end of the first refrigerant pipeline 311 in FIG. 2 ). Both the downwardly bent and upwardly bent and extended pipelines need to ensure that the liquid refrigerant can freely flow therein relying on gravity. A first end and a second end formed as an open end of the first refrigerant pipe 311 communicate with the bottom of the first refrigerant tank 312 , respectively. In one embodiment, the first refrigerant tank 312 may be in the shape of a flat cuboid, and the areas of the opposite front side wall and the rear side wall are larger than the other surfaces, and the outer surface of the rear side wall is used as The heat exchange surface that is in contact with the first cold end of the first semiconductor cooling plate 21 . In one embodiment, a mounting flange 313 respectively extends from the front side wall of the first refrigerant tank 312 to the left and right sides, and each mounting flange 313 is provided with one or more mounting holes 314, so as to utilize Fasteners install and fix the first refrigerant box body 312 on the box body 10 of the refrigerator. In one embodiment, the first heat exchanger 310 may also include two refrigerant pipelines, the first end of the two refrigerant pipelines is an open end, the second end is a closed end, and the first ends of the two refrigerant pipelines are respectively connected to the refrigeration unit. The lower part of the inner cavity of the agent tank is connected. The two refrigerant pipelines respectively extend vertically downward from the first end, then bend downward obliquely, and terminate at the second end which is formed as a closed end.

The second heat exchanger 320 of the present invention includes a second refrigerant tank and a second refrigerant pipeline 321 . The second refrigerant pipeline 321 bends obliquely downwards and extends to the lowest position from its first end formed as an open end, then bends obliquely upwards and extends to its second end formed as an open end, bends downwards and extends upwards. All the bent and extended pipelines need to ensure that the liquid refrigerant can flow freely in it relying on gravity. A first end and a second end formed as an open end of the second refrigerant pipe 321 communicate with the bottom of the second refrigerant tank, respectively. In one embodiment, the second heat exchanger 320 may also include two refrigerant pipelines, the first end of the two refrigerant pipelines is an open end, the second end is a closed end, and the first ends of the two refrigerant pipelines are respectively connected to the refrigeration unit. The lower part of the inner cavity of the agent tank is connected. The two refrigerant pipelines bend and extend obliquely downward from their first ends respectively, and terminate at their second ends formed as closed ends.

FIG. 3 shows a schematic structural diagram of a third heat exchanger 330 according to an embodiment of the present invention. The third heat exchanger 330 also includes a third refrigerant tank 338 and two third refrigerant pipelines 331 . The two third refrigerant pipelines 331 bend and extend upwards from their first ends formed as open ends (as shown in the lower ends of the two third refrigerant pipelines 331 in FIG. 3 ), and end at the second ends formed as closed ends. end (like the upper ends of the two third refrigerant pipelines 331 in Figure 3); connected. The third heat exchanger 330 can also include a three-way device 339, which has a first end, a second end and a third end communicating with each other, wherein the first end of the three-way device 339 is connected to the inner part of the third refrigerant tank 338. The cavity is communicated, the second end of which is connected to the first end formed as an open end of a third refrigerant pipe 331, and the third end is a normally closed end configured to be operatively opened to receive refrigerant injected from the outside. Utilizing the three-way device 339 reduces the difficulty of filling the refrigerant and provides convenience for maintenance. In one embodiment, the third heat exchanger 330 may also include a refrigerant pipeline, the first end and the second end of the refrigerant pipeline are both open ends, and the first end and the second end of the refrigerant pipeline are respectively connected to the refrigeration unit. The upper part of the inner cavity of the agent tank is connected. The refrigerant pipelines are respectively bent upwards from the first end to the highest position, and then bent downwards to the second end.

In order to describe the structure of the refrigerator of the utility model, the side adjacent to the rear wall of the refrigerator liner in the utility model can be called the inner side, and the side far away from the rear wall of the refrigerator liner can be called the outside. In the embodiment shown in FIG. 1 , the inner surface of the first refrigerant box 312 can be installed on the top of the back panel of the refrigerator box 10 through fasteners, and the first cold end surface of the first semiconductor refrigeration sheet 21 is connected to the first The outer surfaces of the refrigerant tank 312 are in thermal contact. At least part of the bent and extended first refrigerant pipeline 311 is in contact with the outer surface of the inner container forming the freezing chamber 11 . The inner surface of the second refrigerant box is in thermal contact with the first hot end surface of the first semiconductor cooling fin 21 , and its outer surface is in thermal contact with the second cold end surface of the second semiconductor cooling fin 22 . At least part of the second refrigerant pipeline 321 is in contact with the outer surface of the inner container forming the refrigerating chamber 12 . The third refrigerant box 338 can be supported near the middle of the backboard of the refrigerator box 10 (for example, above the freezer compartment 11 ) through the plastic part 337 . The third refrigerant pipeline 331 is in contact with the inner surface of the refrigerator shell. The third heat exchanger 330 may also include a thermal bridge 332, the inner surface of the upper end is in thermal contact with the second hot end surface, and the outer surface of the lower end is in thermal contact with the inner surface of the third refrigerant tank 338, so as to connect the second heat end Part of the heat generated by the hot end surface is transferred down to the third refrigerant tank 338 .

The refrigerator of the present utility model can have three working states: the refrigerating chamber 12 is refrigerated alone, the refrigerating chamber 11 is refrigerated alone, and the refrigerating chamber 12 and the refrigerating chamber 11 are simultaneously refrigerated.

When the refrigerating chamber 12 is refrigerated alone, the first semiconductor cooling chip 21 is not energized, and the second semiconductor cooling chip 22 is powered on alone to work. At this time, the second semiconductor cooling chip 22 is only responsible for cooling the refrigerator compartment 12 and not dissipating heat to the first semiconductor cooling chip 21 . After the second semiconductor cooling plate 22 is energized, the temperature of the second cold end surface drops, and through the conduction of the inner wall of the second refrigerant box, the gaseous refrigerant in it undergoes a phase change and condenses when it is cold, and changes into a low-temperature liquid refrigerant , the liquid refrigerant will flow down along the inner wall of the second refrigerant pipeline 321 by gravity, and the condensed refrigerant flowing down in the second refrigerant pipeline 321 will change into a gaseous state by absorbing the heat inside the refrigerating chamber 12 due to phase change and evaporation. . The gaseous steam will rise under the pressure of the heat source, and the gaseous refrigerant will rise to the second refrigerant box and continue to condense, thereby circulating refrigeration to transfer the cold energy from the cold end of the second semiconductor cooling plate 22 to the refrigerator compartment within 12.

When the freezing compartment 11 is refrigerated alone, both the first peltier refrigerating plate 21 and the second peltier refrigerating plate 22 are energized to work, and the second peltier refrigerating plate 22 is only used to dissipate heat from the first hot end surface of the first peltier refrigerating plate 21 . In order to prevent the second semiconductor refrigerating sheet 22 from working and causing waste by cooling the refrigerating chamber 12 through the second refrigerant pipeline 321, an adjustable cooling device can be installed at the connection between the second refrigerant pipeline 321 and the second refrigerant box. When the freezer compartment 11 is refrigerated separately, the stop valve is closed so that the second semiconductor refrigeration chip 22 does not refrigerate the freezer compartment 12, thereby realizing the independent work of the freezer compartment 11. After energizing the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 respectively, the temperature of the first cold end surface of the first semiconductor refrigeration sheet 21 drops, and the temperature of its first hot end surface rises; meanwhile, the temperature of the second semiconductor refrigeration sheet 22 The temperature of the second cold end surface decreases, and the temperature of the second hot end surface increases. Since the second semiconductive refrigeration sheet 22 has a larger refrigeration capacity than the first semiconductive refrigeration sheet 21, as the temperature of the second cold end surface of the second semiconductive refrigeration sheet 22 decreases, the temperature of the second refrigerant box decreases accordingly, and the temperature of the second refrigerant box decreases accordingly. Two, the conduction of the inner wall of the refrigerant box, the temperature of the first hot end surface of the first semiconducting cooling plate 21 drops, and correspondingly, the temperature of its first cold end surface drops, thereby transferring more cold energy to the freezing chamber 11, making the freezing chamber The temperature of 11 is sufficient. Through the conduction of the inner wall of the first refrigerant box 312, the temperature of the first refrigerant box 312 drops accordingly, and the gaseous refrigerant in it undergoes a phase change and condenses when it is cold, and changes into a low-temperature liquid refrigerant. Gravity flows down along the inner wall of the first refrigerant pipeline 311 , and the condensed downstream refrigerant absorbs the heat inside the freezing chamber 11 in the first refrigerant pipeline 311 and undergoes a phase change and evaporates, changing into a gaseous state. The gaseous steam will rise under the pressure of the heat source, and the gaseous refrigerant will rise to the first refrigerant box 312 and continue to condense, thereby circulating refrigeration to transfer the cold energy from the cold end of the first semiconductor cooling plate 21 to the freezing chamber 11 Inside.

In this working process, when the second semiconductor refrigeration sheet 22 dissipates heat to the first hot end surface of the first semiconductor refrigeration sheet 21, the temperature of the second cold end surface of the second semiconductor refrigeration sheet 22 will be higher than that of the first semiconductor refrigeration sheet 21. The temperature of the first cold end surface; in turn, the temperature of the second hot end surface of the second peltier cooler 22 is higher. The third refrigerant box 338 exchanges heat with the second hot end surface of the second semiconductor cooling plate 22 through the heat bridge, and forms an evaporator through heat exchange with the second hot end surface, and the liquid refrigerant in it is heated. The phase change evaporates and changes into a high-temperature gaseous refrigerant. The gaseous refrigerant rises along the third refrigerant pipeline 331 under the pressure of the heat source, transfers heat to the outer shell of the refrigerator, and then transfers the heat to the external space through natural convection. At this time, the third refrigerant pipeline 331 forms a condenser , the refrigerant condenses and releases heat to become liquid, and flows back down to the third refrigerant tank 338 by gravity, reabsorbing heat from the hot end to evaporate, forming a thermal cycle.

When the refrigerating chamber 12 and the freezing chamber 11 are cooling simultaneously, the first semiconductor cooling sheet 21 and the second semiconductor cooling sheet 22 are all energized to work, because the second semiconductor cooling sheet 22 needs to cool the refrigerator 12 and absorb the second semiconductor cooling sheet 22 simultaneously. The heat generated by a peltier refrigerating sheet 21, therefore, requires it to generate more cooling capacity than that in the case of the freezing compartment 11 being refrigerated alone, and correspondingly, it will also generate more heat. At this time, as the temperature of the second cold end surface of the second semiconductor cooling plate 22 decreases, the temperature of the second refrigerant tank decreases accordingly, and the shut-off valve on the second refrigerant pipeline 321 conducts to cool the refrigerator compartment 12 . At the same time, the first refrigerant box 312 cools the freezing compartment 11 . The third refrigerant tank 338 and the third refrigerant pipeline dissipate heat to the second hot end surface of the second semiconductor cooling fin 22 . Wherein, the process of cooling the freezing chamber 11 and the process of dissipating heat from the second hot end surface can refer to the case of cooling the freezing chamber 11 alone.

As can be seen from the above description, since the second semiconductor refrigeration sheet 22 is not only responsible for cooling the refrigerator compartment 12, but also absorbs heat from the first heat dissipation end of the first semiconductor refrigeration sheet 21, the cooling capacity of the second semiconductor refrigeration sheet 22 is very large. Correspondingly, a lot of heat will be generated. If these heats cannot be dissipated well, the cooling efficiency of the two semiconductor refrigerating sheets will be greatly reduced, making it difficult for the cold ends of the two semiconductor refrigerating sheets to reach a lower refrigeration temperature, thereby making it difficult to ensure that the refrigerator compartment 12 and the freezer compartment The temperature in 11 reaches the refrigerating set temperature and the freezing set temperature respectively.

In one embodiment, in order to better dissipate heat from the second heat end surface, upper heat dissipation fins 333 may be provided on the outer surface of the upper end of the heat bridge 332 . The upper heat dissipation fins 333 can greatly increase the heat dissipation area, which is beneficial to quickly dissipate heat from the second hot end surface. In a further embodiment, the third heat exchanger 330 may also include an upper heat dissipation fan (or an upper heat dissipation fan) 334, which is fixed on the upper heat dissipation fin 333 by a fastening mechanism, and the air outlet part of the upper heat dissipation fan 334 faces The upper heat dissipation fins 333 are arranged to dissipate the heat transferred from the second hot end surface to the upper heat dissipation fins 333 by forced convection. In this way, the heat of the second hot end surface can be quickly dissipated to the surrounding environment. In a further embodiment, the third heat exchanger 330 may further include lower cooling fins 335 disposed on the outer surface of the third refrigerant tank 338 . In a further preferred embodiment, the third heat exchanger 330 may also include a lower cooling fan (or a lower cooling fan) 336, which is fixed on the lower cooling fin 335 by a fastening mechanism, and the air outlet part of the lower cooling fan 336 faces The lower cooling fins 335 are arranged to dissipate the heat transferred from the second hot end surface to the lower cooling fins 335 by forced convection.

In a preferred embodiment of the present invention, for the heat dissipation of the second heat end surface of the second semiconductor cooling fin 22, the third refrigerant tank 338 and the third refrigerant pipeline 331 included in the third heat exchanger 330 can be Effectively reduce the heat flux density of the second heat end surface of the second semi-conductor refrigeration sheet 22; the heat dissipation fins and the heat dissipation fan (or heat dissipation fan) respectively arranged on the outer surface of the upper end of the heat bridge and the outer surface of the third refrigerant box 338 can Efficiently dissipate the generated heat to the outside space. Since the third heat exchanger 330 can dissipate the heat of the second hot end surface to the external environment in time, even when the first peltier refrigerating fin 21 and the second peltier cooling fin 22 are both in the working state of generating the maximum cooling capacity, It can avoid the temperature of the second hot end surface from being too high, so as to avoid burning out the second semiconductor cooling chip 22, and effectively ensure the stable operation of the refrigerator.

When the load of the refrigerator is small (for example, there are fewer articles stored in the refrigerator compartment 12 and/or the freezer compartment 11), the first semiconductive refrigeration sheet 21 and the second semiconductive refrigeration section 22 are both in the working state of generating a small cooling capacity, and The heat produced by the second hot end surface of the second semiconductor cooling plate 22 is less, and at this time one of the heat dissipation fans (or heat dissipation fans) can be turned off, or even two heat dissipation fans (or heat dissipation fans) are all turned off, relying only on the third refrigerant The box body 338, the third refrigerant pipeline 331, the upper cooling fins 333 and the lower cooling fins 335 conduct heat dissipation, which can effectively reduce the noise and energy consumption of the refrigerator, and avoid the phenomenon of large horse-drawn carts.

In some embodiments, the refrigerator of the present invention may further include a first temperature sensor, a second temperature sensor, and a controller. The first temperature sensor is arranged on the inner wall of the refrigerating chamber 12 of the refrigerator, and collects the refrigerating chamber temperature signal in the refrigerating chamber 12; Freezer temperature signal. The controller is electrically connected to the first temperature sensor, the second temperature sensor, the first semiconductor cooling chip 21 and the second semiconductor cooling chip 22 respectively, and the controller receives the temperature signal of the refrigerator compartment sent by the first temperature sensor and the second temperature sensor and the freezer compartment temperature signal, and control the power supply voltages of the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 according to the refrigerator compartment temperature signal and the freezer compartment temperature signal, so that the refrigerator compartment 12 and the freezer compartment 11 of the refrigerator maintain At refrigerated set temperature and freezer set temperature. In one embodiment, the controller may include a power supply module, and the power supply module controls the power supply voltage of the first peltier refrigerated piece 21 and the second peltier refrigerated piece 22 .

Fig. 4 is a schematic graph showing the relationship between the power supply voltage, cooling efficiency and cooling capacity of a semiconductor cooling chip according to an embodiment of the present invention. In the embodiment of the present utility model, according to the requirements for the refrigeration efficiency of the semiconductor refrigeration refrigerator, the voltage U _m1 and the voltage U _m2 are the maximum values of the power supply voltages of the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 determined according to experiments respectively. (corresponding to U _m in FIG. 4 ); voltage U _s1 and voltage U _s2 are the minimum values of the power supply voltages of the first peltier refrigerating plate 21 and the second peltier cooling plate 22 (corresponding to U _s in FIG. 4 ) respectively determined according to experiments. The power supply voltages of the first peltier refrigerated sheet 21 and the second peltier refrigerated sheet 22 are within the voltage ranges defined by U _s1 -U _m1 and U _s2 -U _m2 respectively. As can be seen from Fig. 4, when the operating voltages of the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 are located at U _s1 and U _s2 respectively, the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 respectively have the maximum The refrigeration efficiencies P _s1 and P _s2 are Q _cs1 and Q _cs2 respectively. It can be seen that the semiconductor refrigeration chip does not produce the maximum cooling capacity when it works at its maximum cooling efficiency, and its cooling capacity is the smallest within the power supply voltage range (between U _s -U _m ) determined according to the experiment. When the operating voltages of the first peltier refrigerated sheet 21 and the second peltier refrigerated sheet 22 are located at U _m1 and U _m2 respectively, the first peltier refrigerated sheet 21 and the second peltier refrigerated sheet 22 have the maximum cooling capacity Q _cm1 and Q _{cm2 respectively} , its refrigeration efficiency P _m1 , P _m2 are within the power supply voltage range determined according to experiments (the power supply voltages of the first semiconductive refrigeration sheet 21 and the second semiconductive refrigeration sheet 22 are respectively between U _s1 -U _m1 and U _s2 -U _m2 between) min.

In the refrigerator of the present utility model, for the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22, their working states are mainly divided into a stable operation stage and a pull-down recovery stage. Wherein, in the stable stage, the temperatures in the refrigerating chamber 12 and the freezing chamber 11 are respectively within the ranges of the refrigerating set temperature and the freezing set temperature. For example, the set temperature for refrigeration and the set temperature for freezing are respectively 5°C and -18°C. When the ambient temperature is 25°C, the steady state stage is that the refrigerator compartment 12 maintains 5°C, and the freezer compartment 11 maintains a constant temperature of -18°C. process. The pull-down recovery process is the process in which the temperature in the refrigerator compartment 12 drops from 25°C to 5°C from the ambient temperature, and the temperature in the freezer compartment 11 drops from 25°C to -18°C from the ambient temperature; The process of temperature recovery from temperatures above 5°C and -18°C to 5°C and -18°C, respectively.

When the first temperature sensor and the second temperature sensor detect that the temperatures of the refrigerating chamber 12 and the freezing chamber 11 are 5°C and -18°C respectively, the refrigerator is in a stable stage. In the present invention, it is preferable to design and select the first semiconductive cooling chip 21 and the second semiconductive cooling chip 22 as far as possible in a stable stage, so that the chip has the highest cooling efficiency or close to the highest cooling efficiency. Table 1 shows the parameters of the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 when the refrigerator is in a stable operating state.

Table 1

Voltage electric current power Chip cooling capacity chip heat The first semiconductor refrigerator U _s1 I _s1 P _s1 Q _{cs1 wxya} The second semiconductor cooler U _s2 I _s2 P _s2 Q _{cs2 wxya}

In order to maintain a steady state where the temperature of the refrigerating chamber 12 is 5°C and the temperature of the freezing chamber 11 is -18°C, the controller stipulates that the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 operate under the corresponding working parameters in Table 1 At this time, the voltage and current of the first semiconductor refrigerating plate 21 and the second refrigerating plate 22 are not the maximum value, and the power is not the maximum, and the cooling capacity produced by the two refrigerating plates is not the highest, but it can meet the needs of steady-state operation At this time, the refrigeration efficiency of the two semiconductive refrigeration chips is the optimum value or a higher value close to the optimum value.

At this time, the voltage of the first semiconductor cooling chip 21 is U _s1 , the current is I _s1 , the input power is P _s1 , and the generated cooling capacity is Q _cs1 , since the first semiconductor cooling chip 21 is responsible for cooling the freezer compartment 11, therefore, The cooling capacity Q _cs1 produced by the first semiconductor cooling plate 21 needs to meet the heat load or cooling capacity demand Q _d not lower than the freezer compartment, because the cooling capacity is inevitably transferred from the cold end of the first semiconductor cooling plate 21 to the space of the freezing compartment 11 There is heat loss, therefore, Q _cs1 is greater than Q _d , generally Q _cs1 is 1.5 to 2 times of Q _d , the heat generated by the first hot end of the first semiconductor cooling plate 21 is Q _hs1 , Q _hs1 =P _s1 +Q _cs1 .

The voltage of the second semiconductor cooling plate 22 is U _s2 , the current is I _s2 , the input power is P _s2 , and the generated cooling capacity is Q _cs2 . The heat generated by the first hot end of a semiconductive refrigeration sheet 21, therefore, the cooling capacity _Qcs2 produced by the second semiconductive refrigeration sheet 22 needs to meet the cooling capacity demand Q _c of the refrigerator compartment 12 and the first semiconductive refrigeration sheet 21. The sum of the heat Q _hs1 of a hot end, due to the inevitable loss in the process of transferring the cold energy from the second semiconductor refrigeration sheet 22 to the refrigerator compartment 12 and absorbing the heat of the first semiconductor refrigeration sheet 21, _Qcs2 is greater than Qc _and The sum of Q _hs1 is generally desirable, and Q _cs2 is 1.5 to 2 times the sum of Q _c and Q _hs1 , and the heat generated by the hot end of the second semiconductor cooling plate 22 is Q _hs2 , Q _hs2 =Q _cs2 +P _s2 .

When the refrigerator is in the pull-down recovery stage, in order to reach a stable state where the temperature of the refrigerating chamber 12 is 5°C and the temperature of the freezing chamber 11 is -18°C as soon as possible, the controller stipulates that the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 22 operate Under the working parameters corresponding to Table 2, the voltage and current of the first peltier refrigerated plate 21 and the second peltier refrigerated plate 22 are the maximum value at this moment, and the power is the largest. The cooling capacity is far higher than the cooling capacity demand of the refrigerator, but the efficiency of the first semiconductor cooling sheet 21 and the second semiconductor cooling sheet 22 is not the optimum value at this time, and the first semiconductor cooling sheet 21 and the second semiconductor cooling sheet 22 produce Maximum cooling capacity. The maximum cooling capacity produced by the second peltier refrigerating plate 22 is greater than the maximum refrigerating capacity produced by the first peltier cooling plate 21 .

Table 2

Voltage electric current power Chip cooling capacity chip heat The first semiconductor refrigerator U _m I _m1 P _m1 Q _{cm1 wxya} The second semiconductor cooler U _m2 I _m2 P _m2 Q _{cm2 wxya}

At this time, the voltage of the first semiconductor cooling plate 21 is U _m1 , the current is I _m1 , the input power is P _m1 , and the generated cooling capacity is Q _cm1 , which is much higher than the cooling capacity demand Q _d of the freezer. The heat generated by the first hot end of the semiconductor cooling plate 21 is Q _hm1 , Q _hm1 =P _m1 +Q _cm1 .

The voltage of the second semiconductor refrigerating sheet 22 is U _m2 , the current is I _m2 , the input power is P _m2 , and the generated cooling capacity is Q _cm2 , which is much higher than the cooling capacity demand Q _c of the refrigerator compartment and the first semiconductor cooling sheet The sum of heat Q _hm1 of the first hot end of 21, and the heat generated by the second hot end of the second semiconductor cooling plate 22 is Q _hm2 , Q _hm2 =Q _cm2 +P _m2 .

So far, those skilled in the art should recognize that although a number of exemplary embodiments of the present invention have been shown and described in detail herein, they can still be used according to the present invention without departing from the spirit and scope of the present invention. Many other variations or modifications that conform to the principles of the utility model are directly determined or derived from the disclosed content of the new model. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (9)

1. a refrigerator, is characterized in that comprising:

The first semiconductor chilling plate, has the first cold junction face that produces cold and the first hot junction face that produces heat;

The second semiconductor chilling plate, has the second cold junction face that produces cold and the second hot junction face that produces heat;

The first heat exchanger, its part is thermally coupled with described the first cold junction face, and the refrigerating chamber of another part and described refrigerator is thermally coupled;

The second heat exchanger, its part is thermally coupled with described the second cold junction face, and the refrigerating chamber of another part and described refrigerator is thermally coupled;

The 3rd heat exchanger, its a part with described the second hot junction face thermally coupled, another part by the dissipation of heat of the second hot junction face in surrounding environment.

2. refrigerator according to claim 1, is characterized in that

Described the 3rd heat exchanger comprises:

The 3rd cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists;

The 3rd refrigerant line, is communicated with the inner chamber of described the 3rd cold-producing medium casing;

Heat bridge, its upper end inner surface and described the second hot junction face are thermally coupled, and the inner surface of lower end outer surface and described the 3rd cold-producing medium casing is thermally coupled.

3. refrigerator according to claim 2, is characterized in that

Described the 3rd heat exchanger also comprises:

Top radiating fin, is arranged on the upper end outer surface of described heat bridge.

4. refrigerator according to claim 3, is characterized in that

Described the 3rd heat exchanger also comprises:

Top cooling fan, is fixed on the outside of described top radiating fin by retention mechanism, the outlet section plane of described top cooling fan is arranged described top radiating fin.

5. refrigerator according to claim 4, is characterized in that

Described the 3rd heat exchanger also comprises:

Bottom radiating fin, is arranged on the outer surface of described the 3rd cold-producing medium casing.

6. refrigerator according to claim 5, is characterized in that

Described the 3rd heat exchanger also comprises:

Bottom cooling fan, is fixed on the outside of described bottom radiating fin by retention mechanism, the outlet section plane of described bottom cooling fan is arranged described bottom radiating fin.

7. refrigerator according to claim 1, is characterized in that

Described the first heat exchanger comprises:

The first cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and described the first cold-producing medium casing and described the first cold junction face are thermally coupled; And

The first refrigerant line, is communicated with the inner chamber of described the first cold-producing medium casing.

8. refrigerator according to claim 1, is characterized in that

Described the second heat exchanger comprises:

Second refrigerant casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and two relative surfaces of described second refrigerant casing are thermally coupled with described the first hot junction face and the second cold junction face respectively; And

Second refrigerant pipeline, is communicated with the inner chamber of described second refrigerant casing.

9. according to the refrigerator described in any one in claim 1-8, it is characterized in that

Described refrigerator also comprises:

The first temperature sensor, is arranged on the inwall of refrigerating chamber of described refrigerator, gathers the temperature of refrigerating chamber signal in described refrigerating chamber;

The second temperature sensor, is arranged on the inwall of refrigerating chamber of described refrigerator, gathers the freezer temperature signal in described refrigerating chamber; And

Controller, it is electrically connected with the first temperature sensor, the second temperature sensor, the first semiconductor chilling plate and the second semiconductor chilling plate respectively, described controller receives temperature of refrigerating chamber signal and the freezer temperature signal of the first temperature sensor and the transmission of the second temperature sensor, and according to the supply voltage of the first semiconductor chilling plate described in described temperature of refrigerating chamber signal and freezer temperature signal controlling and described the second semiconductor chilling plate.