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WO2011142232A1 - Actionneur piézoélectrique, et tête à jet d'encre le comportant - Google Patents

Actionneur piézoélectrique, et tête à jet d'encre le comportant Download PDF

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Publication number
WO2011142232A1
WO2011142232A1 PCT/JP2011/059914 JP2011059914W WO2011142232A1 WO 2011142232 A1 WO2011142232 A1 WO 2011142232A1 JP 2011059914 W JP2011059914 W JP 2011059914W WO 2011142232 A1 WO2011142232 A1 WO 2011142232A1
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WIPO (PCT)
Prior art keywords
piezoelectric layer
buffer member
piezoelectric
layer
upper electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/059914
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English (en)
Japanese (ja)
Inventor
裕子 吉田
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Konica Minolta Inc
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Konica Minolta Inc
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Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of WO2011142232A1 publication Critical patent/WO2011142232A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based

Definitions

  • the present invention relates to a piezoelectric actuator that deforms a diaphragm toward a pressure chamber and an inkjet head including the piezoelectric actuator.
  • This ink jet printer is provided with an ink jet head for discharging an appropriate amount of ink.
  • an ink jet head a part of a pressure chamber communicating with a nozzle for ejecting ink droplets is constituted by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize ink in the pressure chamber and eject ink droplets from the nozzle.
  • the method of making it known is known.
  • a pressure chamber is formed on a substrate, and an elastic film constituting a diaphragm is provided on the upper surface thereof.
  • a lower electrode, a piezoelectric layer, and an upper electrode are sequentially laminated on the upper surface of the elastic film, and the insulation between the lead portion and the lower electrode that are electrically connected to the upper electrode is ensured. That is, in order to ensure insulation, a piezoelectric layer is laminated on the upper surface of the lower electrode so as to cover the outer peripheral portion of the lower electrode, and the lead portion extends from the upper surface of the piezoelectric layer along the outer peripheral end surface of the piezoelectric layer, and further elastically It extends to the upper surface of the film. Then, by applying a voltage between the upper electrode and the lower electrode to bend and deform the piezoelectric layer and the diaphragm, the pressure in the pressure chamber increases, and ink droplets are ejected from the nozzle.
  • the piezoelectric actuator needs to be finely processed at high density, and the piezoelectric actuator is manufactured by a film forming method such as vapor deposition or sputtering suitable for such processing.
  • the end surface of the piezoelectric layer has a step corresponding to its thickness.
  • Patent Document 2 a lower electrode, a piezoelectric layer, and an upper electrode are sequentially stacked on a substrate, and each end face of the lower electrode and the piezoelectric layer is inclined, and an insulating layer is provided so as to cover each inclined end face. Is formed. A lead portion is formed on the insulating layer, and the lead portion is electrically connected to the upper electrode.
  • the lead-out portion has a uniform thickness and is easy to form a film, but each end face of the lower electrode and the piezoelectric layer is inclined, and the insulating layer has a non-constant thickness.
  • a deposition method such as vapor deposition or sputtering
  • the lower electrode, the piezoelectric layer, and the upper electrode are sequentially stacked on the substrate, and the lower electrode and the upper electrode are located at different positions of the piezoelectric layer.
  • a lead portion extending integrally with each electrode is formed from each end portion of the electrode.
  • a voltage is applied to the lower electrode and the upper electrode through the respective lead portions.
  • the lead-out portion of the upper electrode in order to form the lead-out portion of the upper electrode integrally with the upper electrode, the lead-out portion of the upper electrode is thicker than the upper electrode.
  • the thickness of the electrode and the lead portion formed integrally as described above is locally different, it is difficult to produce the electrode by film formation such as vapor deposition or sputtering, and it is difficult to mass-produce with stable quality.
  • Patent Document 4 a lower electrode, a piezoelectric layer, and an upper electrode are sequentially stacked on a diaphragm, and the piezoelectric layer is continuously arranged across a plurality of pressure chambers. It forms so that it may oppose to the outer side of the side wall of the board
  • JP 2007-6620 (paragraphs [0022], [0023], FIG. 1) JP 2008-227144 A (paragraphs [0025] to [0029], FIG. 1) JP-A-8-116684 (paragraph [0023], FIG. 2) JP 2009-182195 A (paragraphs [0025] to [0031], FIG. 4)
  • the present invention has been made in order to solve the above-described problems, and enables the upper electrode and its lead-out portion to be stably produced by film formation, and the amount of displacement due to deformation of the piezoelectric layer is reduced. It is an object of the present invention to provide a piezoelectric actuator that does not have a possibility of being lowered, and that does not cause a crack even if the piezoelectric layer is repeatedly deformed, and an ink jet head including the piezoelectric actuator.
  • a first aspect of the present invention is a piezoelectric actuator for deforming a diaphragm toward a pressure chamber formed on a substrate, wherein the substrate is positioned above the pressure chamber.
  • a lower electrode, a piezoelectric layer, and an upper electrode are stacked in this order on the diaphragm, and the piezoelectric layer is disposed on the inner side of the upper surface of the substrate that constitutes the pressure chamber.
  • a piezoelectric layer is disposed, the upper electrode is disposed to face the piezoelectric layer, and a lead portion that is electrically connected to the upper electrode is formed integrally with the upper electrode.
  • a buffer member having substantially the same thickness as the piezoelectric layer and having a Young's modulus smaller than that of the piezoelectric layer extends to the piezoelectric layer above the side wall surface of the substrate. Characterized by being formed adjacent That. Note that the vertical direction described here is a case where the substrate is arranged so that the diaphragm is located above the pressure chamber, and the direction itself is not an indispensable condition, and the following also applies. It is the same.
  • the second invention is characterized in that, in the piezoelectric actuator, the buffer member has an insulating property.
  • an outer piezoelectric layer adjacent to the outside of the buffer member is formed on the upper surface of the lower electrode, and the outer piezoelectric layer is made of the same material as the piezoelectric layer. It has a thickness, and the lead-out part is formed across the upper surfaces of the buffer member and the outer piezoelectric layer.
  • the buffer member is formed adjacent to the entire circumference of the piezoelectric layer, and the outer piezoelectric layer is adjacent to the entire periphery of the buffer member. It is characterized by being formed.
  • the fifth invention is characterized in that, in the above piezoelectric actuator, the lead-out portion is formed only on the upper surface of the buffer member.
  • the sixth invention is characterized in that, in the piezoelectric actuator, the buffer member is made of a photosensitive resin.
  • a seventh invention is an ink jet head provided with the piezoelectric actuator having the above-described configuration.
  • the piezoelectric layer when a voltage is applied between the upper electrode and the lower electrode, the piezoelectric layer is flexibly deformed, and the diaphragm is also deformed toward the pressure chamber following the deformation of the piezoelectric layer. At this time, the piezoelectric layer is disposed avoiding the position above the side wall surface of the substrate, and a buffer member having a Young's modulus smaller than that of the piezoelectric layer is disposed adjacent to the piezoelectric layer on the extension above the side wall surface of the substrate.
  • the buffer member is also deformed when the piezoelectric is driven, so that the amount of displacement due to the deformation of the piezoelectric layer does not decrease, and even if the piezoelectric layer is repeatedly deformed, there is no risk of cracks occurring in the piezoelectric layer.
  • the buffer member since the buffer member has substantially the same thickness as the piezoelectric layer, even if the upper electrode and the lead portion are integrally formed on the piezoelectric layer and the buffer member by a film formation method such as vapor deposition or sputtering, the electrical disconnection occurs. Without this, the upper electrode and the lead portion can be stably manufactured.
  • the buffer member since the buffer member has an insulating property, the lead portion can be insulated from the lower electrode.
  • the piezoelectric layer and the outer piezoelectric layer have the same thickness
  • the buffer member is formed in the gap between the piezoelectric layer and the outer piezoelectric layer. It becomes easy to produce uniformly with substantially the same thickness.
  • the lead-out portion is stably formed across the upper surfaces of the buffer member and the outer piezoelectric layer having substantially the same thickness by a film forming method such as vapor deposition or sputtering.
  • the piezoelectric layer and the outer piezoelectric layer are formed by vapor deposition, sputtering, or the like, and the circumferential gap between the piezoelectric layer and the outer piezoelectric layer is filled with the buffer member. It becomes easy to produce the buffer member uniformly with substantially the same thickness as the piezoelectric layer and the outer piezoelectric layer.
  • the lead-out portion is stably formed across the upper surfaces of the buffer member and the outer piezoelectric layer having substantially the same thickness by a film forming method such as vapor deposition or sputtering. Further, since the buffer member and the outer piezoelectric layer are formed over the entire circumference, the piezoelectric layer can be displaced in a balanced manner.
  • the lead-out portion can be stably formed on the upper surface of the buffer member by a film forming method such as vapor deposition or sputtering.
  • the buffer member is made of a photosensitive resin, the buffer member can be easily formed with a predetermined shape and accuracy.
  • an ink jet head including a piezoelectric actuator that can stably produce the portion by film formation can be obtained.
  • Sectional drawing which shows an inkjet head provided with the piezoelectric actuator which is 1st Embodiment of this invention.
  • a top view showing an ink jet head provided with a piezoelectric actuator which is a 1st embodiment.
  • the top view which shows the piezoelectric actuator which is 4th Embodiment Sectional drawing which shows the piezoelectric actuator which is 5th Embodiment
  • FIG. 1 is a cross-sectional view schematically showing an ink jet head including a piezoelectric actuator according to a first embodiment of the present invention
  • FIG. 2 is a plan view showing the ink jet head including a piezoelectric actuator.
  • the inkjet head 23 includes a piezoelectric actuator 1 for applying pressure to ink in the pressure chamber 20, a substrate 10 that forms the pressure chamber 20, and a hole for ejecting ink in the pressure chamber 20.
  • a glass substrate 21 and a nozzle plate 22 are provided.
  • a pressure chamber 20 is formed in the substrate 10 by the side wall surface 10a.
  • the pressure chamber 20 is formed by a hole having a circular horizontal cross section (see also the side wall surface 10a in FIG. 2).
  • the pressure chamber 20 may be an elliptical or polygonal hole.
  • the glass substrate 21 is formed with an ink discharge hole 21 a communicating with the pressure chamber 20, and the nozzle plate 22 is formed with a nozzle 22 a communicating with the hole 21 a of the glass substrate 21.
  • the nozzle 22a is constituted by a two-stage hole for discharging ink. In this way, an ink flow path from the pressure chamber 20 to the nozzle 22a is formed in the substrate 10, the glass substrate 21, and the nozzle plate 22.
  • the piezoelectric actuator 1 includes a diaphragm 11a, a piezoelectric layer 15, a lower electrode 14, an upper electrode 18, a lead portion 24, and a buffer member 25.
  • the substrate 10 and the like are placed on the pressure chamber 20 so that the piezoelectric actuator 1 including the vibration plate 11a is positioned.
  • the direction and the like are not limited thereto.
  • the piezoelectric layer 15 is made of a piezoelectric material such as PZT (lead zirconate titanate) and is formed on the upper surface of the lower electrode 14.
  • the piezoelectric layer 15 is disposed to face the pressure chamber 20. That is, the piezoelectric layer 15 is disposed on the inner side of the surface extending upward from the side wall surface 10a of the substrate 10 forming the pressure chamber 20, and is formed in a circular shape slightly smaller than the pressure chamber 20 (see FIG. 2). If the pressure chamber 20 is an elliptical or polygonal hole, the piezoelectric layer 15 may be formed in the same shape as the pressure chamber 20 and slightly smaller, but does not necessarily have the same shape.
  • PZT lead zirconate titanate
  • the piezoelectric layer 15 bends and deforms toward the pressure chamber 20 by application of a voltage, and the diaphragm 11 a also deforms toward the pressure chamber 20 following the deformation of the piezoelectric layer 15. As a result, the pressure of the ink in the pressure chamber 20 rises, and the ink is ejected from the nozzle 22 a through the hole 21 a communicating with the pressure chamber 20.
  • the piezoelectric layer 15 may be contracted or expanded (stretched).
  • the lower electrode 14 is made of a conductive material such as platinum (Pt), is formed between the vibration plate 11a and the piezoelectric layer 15, and is formed over almost the entire region of the vibration plate 11a. It becomes a common electrode of the piezoelectric actuator that deforms the.
  • a conductive material such as platinum (Pt)
  • the upper electrode 18 is made of a conductive material such as chromium (Cr) and is formed in a circular shape on the upper surface of the piezoelectric layer 15 in the same manner as the piezoelectric layer 15 (see FIG. 2).
  • the upper electrode 18 is formed to be slightly smaller than the piezoelectric layer 15, but may be formed with substantially the same size as the piezoelectric layer 15. If the piezoelectric layer 15 is elliptical or polygonal, the upper electrode 18 may be formed in the same shape as the piezoelectric layer 15.
  • a lead portion 24 is formed integrally with the upper electrode 18, and the lead portion 24 is led out to a position not facing the piezoelectric layer 15 (see also FIG. 2), and the drawn end portion becomes a connection terminal of a drive circuit (not shown). ing.
  • a driving potential is applied to the upper electrode 18 through the lead-out portion 24, the piezoelectric layer 15 is bent and deformed due to a potential difference between the upper electrode 18 and the lower electrode 14.
  • the buffer member 25 is a material having a smaller Young's modulus than the piezoelectric layer 15 and electrically insulating properties, such as a photosensitive resin such as an epoxy resin or an acrylic resin, or a polyamide resin, a fluororesin, a polycarbonate resin, or a synthetic rubber. Thus, it is formed with substantially the same thickness as the piezoelectric layer 15. Accordingly, the buffer member 25 is formed between the upper surface of the lower electrode 14 and the lower surface of the lead portion 24, whereby the lead portion 24 is insulated from the lower electrode 14. In addition, you may form the buffer member 25 using the material which does not have insulation characteristics, and the material which has insulation characteristics together. In that case, the lead portion 24 is insulated from the lower electrode 14 by forming two or more layers of material layers having no insulation characteristics and material layers having insulation characteristics.
  • the buffer member 25 is disposed in an annular shape adjacent to the outer periphery of the piezoelectric layer 15 (see FIG. 2), whereby the buffer member 25 faces the side wall surface 10a of the substrate 10 forming the pressure chamber 20. That is, it is disposed on the extension above the side wall surface 10 a of the substrate 10.
  • the buffer member 25 having a Young's modulus smaller than that of the piezoelectric layer is provided on the extension above the side wall surface 10a of the substrate 10, the buffer member 25 is also deformed as the piezoelectric layer 15 is deformed during piezoelectric driving.
  • the buffer member 25 is formed with substantially the same thickness as the piezoelectric layer 15. That is, when the difference (step) in the thickness between the buffer member 25 and the piezoelectric layer 15 is equal to or less than the thickness of the lead portion 24 (substantially the same thickness), the lead portion 24 is extended over the upper surfaces of the buffer member 25 and the piezoelectric layer 15. When the film is formed integrally with the electrode 18, the lead portion 24 is not interrupted (disconnected) by the step.
  • the outer piezoelectric layer 15a adjacent to the entire outer periphery of the buffer member 25 is formed (see also FIG. 2).
  • the outer piezoelectric layer 15 a is formed on the upper surface of the lower electrode 14 with the same thickness by the same piezoelectric material as the piezoelectric layer 15.
  • FIG. 3A to FIG. 3N are diagrams schematically showing each manufacturing process of the ink jet head of the present invention.
  • a substrate 10 is prepared.
  • the substrate 10 is a member that becomes the body of the inkjet head and the side wall of the pressure chamber, and Si (silicon) having a thickness of about 200 ⁇ m and high workability is used.
  • Si silicon
  • an upper oxide film 11a and a lower oxide film 11b made of SiO 2 (silicon dioxide) and having a thickness of 2 ⁇ m are formed on the upper and lower surfaces of the substrate 10, respectively.
  • the upper oxide film 11a serves as the above-described diaphragm.
  • a resist 12 is applied to the lower oxide film 11b, exposed and developed to obtain a resist pattern.
  • This pattern is for forming a pressure chamber.
  • the shape of the pattern is a circle having a diameter of 300 ⁇ m. Although it is circular here, the shape is not particularly limited, and a pattern such as an ellipse or a polygon may be used.
  • the lower oxide film 11b is dry-etched with CHF 3 (trifluoromethane) gas by an RIE (Reactive Ion Etching) apparatus. As a result, as shown in FIG. 3C, the lower oxide film 11b not protected by the resist 12 is removed.
  • CHF 3 trifluoromethane
  • the lower electrode adhesion layer 14a is formed on the upper surface of the upper oxide film (vibrating plate) 11a, and the lower electrode layer 14b is formed on the upper surface of the lower electrode adhesion layer 14a.
  • Ti titanium
  • Pt platinum
  • the lower electrode adhesion layer 14 a and the lower electrode layer 14 b become the lower electrode 14.
  • the piezoelectric layer 15 (including the outer piezoelectric layer 15a in FIG. 1) is formed on the upper surface of the lower electrode.
  • a PZT (lead zirconate titanate) layer having a thickness of 5 ⁇ m is formed as the piezoelectric layer 15 by sputtering at a temperature of 600 ° C.
  • the PZT layer is oriented in ⁇ 111> of the perovskite phase that provides piezoelectric characteristics.
  • the piezoelectric layer 15 may be contracted or expanded (stretched) as long as it is deformed by application of a voltage.
  • a resist 16 is applied to the upper surface of the PZT layer (piezoelectric layer 15), exposed and developed to obtain a resist pattern.
  • This pattern is for removing the PZT layer in a predetermined shape and filling the removed portion with the buffer member 25.
  • a circle having an outer diameter of 280 ⁇ m and a circle concentric with the circle and having an inner diameter of 360 ⁇ m on the outer side are combined, and the PZT layer is removed in an annular shape by this pattern.
  • it is removed in an annular shape in accordance with the horizontal cross-sectional shape of the pressure chamber 20, but the shape is not particularly limited. If the horizontal cross-sectional shape of the pressure chamber 20 is an ellipse or a polygon, the resist 16 forms an oval.
  • the PZT layer will be removed in the shape of a strip or polygonal strip.
  • the PZT layer not protected by the resist 16 is removed in an annular shape with a width of 40 ⁇ m as shown in FIG. 3G. .
  • the inner PZT layer removed in an annular shape becomes the piezoelectric layer 15
  • the outer PZT layer removed in an annular shape becomes the outer piezoelectric layer 15a (see FIGS. 1 and 2).
  • a photosensitive resin such as an epoxy resin or an acrylic resin as the buffer member 25 is applied to the upper surfaces of the piezoelectric layer 15 and the outer piezoelectric layer 15a by spin coating.
  • a very thin photosensitive resin film is formed on the piezoelectric layer 15 and the outer piezoelectric layer 15a, and the annular resin groove from which the PZT layer is removed is also filled with the photosensitive resin.
  • the upper surface of the photosensitive resin filled in the annular groove is slightly lower than the height position of the upper surface of the film formed on the piezoelectric layer as shown in FIG. 3H. Is almost equal.
  • the photosensitive resin other than the annular groove is removed as shown in FIG. 3J.
  • the photosensitive resin formed in the annular groove acts as a buffer member 25.
  • the Young's modulus of PZT lead zirconate titanate, piezoelectric layer 15, outer piezoelectric layer 15a
  • the Young's modulus of epoxy resin is The Young's modulus of the buffer member 25 is smaller than that of the piezoelectric layer 15, and the buffer member 25 is more easily deformed than the piezoelectric layer 15.
  • Cr chromium
  • Au gold
  • a resist 19 is applied on the upper surface of the Au film, exposed and developed to obtain a resist pattern.
  • This pattern is for forming the Cr film and the Au film in the shape of the upper electrode 18 and the lead portion 24 shown in FIG.
  • the upper electrode 18 is circular with a diameter of 270 ⁇ m, and the width of the lead portion 24 is set as appropriate.
  • the circular size of the upper electrode 18 is slightly smaller than the diameter (280 ⁇ m) of the piezoelectric layer 15, but may be a circular shape having the same size as the piezoelectric layer 15. Further, if the piezoelectric layer 15 is elliptical or polygonal, an elliptical or polygonal pattern is used for the resist 19.
  • the pressure chamber 20 is formed as shown in FIG. 3N.
  • the pressure chamber 20 is formed by deep processing the substrate 10 to a depth reaching the upper oxide film 11a.
  • the pressure chamber 20 is formed in a circular shape by, for example, a Bosch process of an ICP (Inductive Coupled Plasma) apparatus.
  • the horizontal cross section of the pressure chamber 20 is circular with the same diameter of 300 ⁇ m as the lower oxide film 11b.
  • the glass substrate 21 has a thickness of 200 ⁇ m, and a hole 21 a having a diameter of 100 ⁇ m is formed in the glass substrate 21.
  • the nozzle plate 22 is made of a silicon material having a thickness of 300 ⁇ m, and the nozzle plate 22 is formed with two-stage holes having a diameter of 50 ⁇ m and a diameter of 20 ⁇ m.
  • the glass substrate 21 and the nozzle plate 22 are prepared, the glass substrate 21 is bonded to the lower surface of the substrate 10, and the nozzle plate 22 is bonded to the lower surface of the glass substrate 21 by anodic bonding, thereby completing the ink jet head 23.
  • the piezoelectric actuator 1 deforms the diaphragm 11a toward the pressure chamber 20 formed on the substrate 10.
  • the lower electrode 14, the piezoelectric layer 15, and the upper electrode 18 are laminated in this order on the vibration plate 11a.
  • the piezoelectric layer 15 is disposed on the inner side of the upper surface of the side wall surface 10 a of the substrate 10 constituting the pressure chamber 20, and the upper electrode 18 is disposed to face the piezoelectric layer 15.
  • a lead portion 24 is formed integrally with the upper electrode 18, and a buffer member 25 having substantially the same thickness as the piezoelectric layer 15 and having a Young's modulus smaller than that of the piezoelectric layer is formed between the upper surface of the lower electrode 14 and the lower surface of the lead portion 24.
  • the buffer member 25 formed is provided adjacent to the piezoelectric layer 15 on the upward extension of the side wall surface 10 a of the substrate 10.
  • the piezoelectric layer 15 when a voltage is applied between the upper electrode 18 and the lower electrode 14, the piezoelectric layer 15 is flexibly deformed, and the diaphragm 11 a is also deformed toward the pressure chamber 20 following the deformation of the piezoelectric layer 15. To do. At this time, the piezoelectric layer 15 is disposed so as to avoid the position on the upward extension of the side wall surface 10 a of the substrate 10, and the buffer member 25 having a Young's modulus smaller than that of the piezoelectric layer extends upward of the side wall surface 10 a of the substrate 10.
  • the buffer member 25 Since the buffer member 25 is also deformed at the time of piezoelectric driving, there is no fear that the amount of displacement due to the deformation of the piezoelectric layer 15 is reduced, and even if the piezoelectric layer 15 is repeatedly deformed, the piezoelectric layer 15 is not deformed. There is no risk of cracking. Further, since the buffer 25 having insulating characteristics is formed between the lower electrode 14 and the lead portion 24, the lead portion 24 is insulated from the lower electrode 14 by the buffer member 25. Since the buffer member 25 has substantially the same thickness as the piezoelectric layer 15, the upper electrode 18 and the lead portion 24 are integrally formed on the piezoelectric layer 15 and the buffer member 25 by a film forming method such as vapor deposition or sputtering. However, the upper electrode 18 and the lead portion 24 can be stably manufactured without being electrically disconnected.
  • the buffer member 25 is formed adjacent to the entire circumference of the piezoelectric layer 15, and the outer piezoelectric layer 15 a is formed adjacent to the entire circumference of the buffer member 25.
  • the lead portion 24 is formed across the upper surfaces of the buffer member 25 and the outer piezoelectric layer 15a.
  • the piezoelectric layer 15 and the outer piezoelectric layer 15a are formed with the same thickness, and the buffer member 25 is formed by filling a gap between the piezoelectric layer 15 and the outer piezoelectric layer 15a with the same thickness. Can be easily produced with substantially the same thickness as the piezoelectric layer 15 and the outer piezoelectric layer 15a. Then, the buffer member 25 and the outer piezoelectric layer 15a have substantially the same thickness, and the lead portion 24 is stably manufactured so as to straddle the upper surfaces of the buffer member 25 and the outer piezoelectric layer 15a by a film forming method such as vapor deposition or sputtering. be able to.
  • a film forming method such as vapor deposition or sputtering.
  • the buffer member 25 is made of a photosensitive resin, the buffer member 25 can be easily formed with a predetermined shape and accuracy by exposure to ultraviolet rays.
  • the buffer member 25 is a step of forming the photosensitive resin by ultraviolet exposure.
  • the present invention is not limited to this, and the buffer member 25 is formed of a resin other than the photosensitive resin. May be.
  • the gap between the piezoelectric layer 15 and the outer piezoelectric layer 15a is filled with a squeegee so that an insulating material such as fluororesin, polycarbonate resin, or synthetic rubber does not protrude from the upper surfaces of the piezoelectric layer 15 and the outer piezoelectric layer 15a. Also good.
  • the buffer member 25 can be easily and accurately filled between the piezoelectric layer 15 and the outer piezoelectric layer 15a. Further, as described above, when a material having no insulating property and a material having an insulating property are used in combination as the buffer member 25, the layer of one material is formed by the above filling method and then the other material layer is overlapped. Good.
  • FIG. 4 is a cross-sectional view schematically showing the piezoelectric actuator according to the second embodiment.
  • description of the same parts as those in the first embodiment will be omitted, and different parts will be described.
  • the upper oxide film 11a is formed in the step of deep-drilling the substrate 10 (step of FIG. 3N of the first embodiment). Deep drilling is stopped just before it reaches. This is suitable when the upper oxide film 11a as the vibration plate cannot be thickened.
  • the deep oxide film 11a is stopped by leaving the Si layer 10b, for example, about 2 ⁇ m between the pressure chamber 20 and the upper oxide film 11a.
  • the Si layer 10b is used as a diaphragm.
  • the piezoelectric layer 15 when a voltage is applied between the upper electrode 18 and the lower electrode 14, the piezoelectric layer 15 is flexibly deformed, and following the deformation of the piezoelectric layer 15, a vibration composed of the upper oxide film 11 a and the Si layer 10 b. The plate is also deformed toward the pressure chamber 20. At this time, the piezoelectric layer 15 is disposed so as to avoid the position on the upward extension of the side wall surface 10 a of the substrate 10, and the buffer member 25 having a Young's modulus smaller than that of the piezoelectric layer extends upward of the side wall surface 10 a of the substrate 10.
  • the buffer member 25 Since the buffer member 25 is also deformed at the time of piezoelectric driving, there is no fear that the amount of displacement due to the deformation of the piezoelectric layer 15 is reduced, and even if the piezoelectric layer 15 is repeatedly deformed, the piezoelectric layer 15 is not deformed. There is no risk of cracking.
  • FIG. 5 is a sectional view schematically showing the piezoelectric actuator according to the third embodiment
  • FIG. 6 is a plan view showing the piezoelectric actuator according to the third embodiment.
  • the buffer member 25 is not formed over the entire circumference of the piezoelectric layer 15. That is, the buffer member 25 is formed only on the upper surface of the side wall surface 10 a of the substrate 10 and on the lower surface of the drawer portion 24. On the other upper extension of the side wall surface 10 a of the substrate 10, the buffer member 25 is not formed, and the gap portion 31 where the lower electrode 14 is exposed is formed. As described above, even if a part of the buffer member 25 is formed on the upper extension of the side wall surface 10a of the substrate 10 and the gap portion 31 is formed in the other part, the piezoelectric layer 15 remains in the pressure chamber 20 during piezoelectric driving.
  • the deformation of the piezoelectric layer 15 does not decrease and the amount of displacement due to the deformation of the piezoelectric layer 15 does not decrease. Even if the piezoelectric layer 15 is repeatedly deformed, there is no possibility of cracking in the piezoelectric layer 15.
  • a buffer member 25 is formed between the upper surface of the lower electrode 14 and the lower surface of the lead portion 24 by using a material having an insulating property in part or in whole. Insulated.
  • the PZT layer is removed in an annular shape by wet-etching a PZT (lead zirconate titanate) layer with a mixed solution of hydrofluoric acid and nitric acid.
  • a photosensitive resin is applied to the annular grooves from which the upper surfaces of the piezoelectric layer 15 and the outer piezoelectric layer 15a and the PZT layer have been removed, masked with a predetermined shape, and exposed to ultraviolet rays, whereby the buffer member 25 is exposed. It is formed.
  • the buffer member 25 having substantially the same thickness as that of the piezoelectric layer 15 and the outer piezoelectric layer 15a is obtained, and the upper electrode 18 and the lead portion 24 are connected to the buffer member 25, the piezoelectric layer 15 and the outer layer by a film forming method such as vapor deposition or sputtering. Even when the piezoelectric layer 15a is formed so as to straddle each upper surface, the upper electrode 18 and the lead portion 24 can be stably manufactured without being electrically disconnected.
  • FIG. 7 is a sectional view schematically showing the piezoelectric actuator according to the fourth embodiment
  • FIG. 8 is a plan view showing the piezoelectric actuator according to the fourth embodiment.
  • the buffer member 25 is formed only on the upper surface of the side wall surface 10 a of the substrate 10 and on the lower surface of the lead portion 24, and the outer piezoelectric layer 15 a is formed only on the lower surface of the lead portion 24.
  • a part of the buffer member 25 is formed on the upper extension of the side wall surface 10a of the substrate 10, and the piezoelectric layer 15 is disposed so as to avoid the upper extension of the side wall surface 10a of the substrate 10. 15 is flexibly deformed in the side wall surface 10a constituting the pressure chamber 20, and the amount of displacement due to the deformation of the piezoelectric layer 15 does not decrease. Even if the piezoelectric layer 15 is repeatedly deformed, cracks are generated in the piezoelectric layer 15. There is no fear.
  • the buffer member 25 is formed between the upper surface of the lower electrode 14 and the lower surface of the lead portion 24 by using a material having an insulating property, in part or in whole, so that the lead portion 24 is located with respect to the lower electrode 14. Insulated.
  • a PZT (lead zirconate titanate) layer is formed on the upper surface of the lower electrode 14 by sputtering at a temperature of 600 ° C.
  • a mask having a predetermined shape is formed on the upper surface of the PZT layer, and the PZT layer is wet-etched with a mixed solution of hydrofluoric acid and nitric acid, whereby the circular piezoelectric layer 15 and the island-shaped outer piezoelectric layer 15a are formed. It is formed.
  • the buffer member 25 is formed by applying a photosensitive resin to the upper surface of the piezoelectric layer 15 and the outer piezoelectric layer 15a and the upper surface of the lower electrode 14, masking it in a predetermined shape and exposing it with ultraviolet rays.
  • the buffer member 25 having substantially the same thickness as the piezoelectric layer 15 and the outer piezoelectric layer 15a is obtained, and the upper electrode 18 and the lead portion 24 are connected to the buffer member 25, the piezoelectric layer 15 and the outer layer by a film forming method such as vapor deposition or sputtering. Even when the piezoelectric layer 15a is formed so as to straddle each upper surface, the upper electrode 18 and the lead portion 24 can be stably manufactured without being electrically disconnected.
  • FIG. 9 is a sectional view schematically showing the piezoelectric actuator according to the fifth embodiment
  • FIG. 10 is a plan view showing the piezoelectric actuator according to the fifth embodiment.
  • the buffer member 25 is formed on the upper extension of the side wall surface 10 a of the substrate 10 and on the lower surface of the drawer portion 24.
  • the outer piezoelectric layer 15a is removed. Accordingly, a part of the buffer member 25 is formed on the extension above the side wall surface 10a of the substrate 10, and the piezoelectric layer 15 is disposed so as to avoid the extension above the side wall surface 10a of the substrate 10, so that at the time of piezoelectric driving
  • the piezoelectric layer 15 bends and deforms in the side wall surface 10a constituting the pressure chamber 20, and the amount of displacement due to the deformation of the piezoelectric layer 15 does not decrease. Even if the piezoelectric layer 15 is repeatedly deformed, the piezoelectric layer 15 is cracked. There is no risk of occurrence.
  • the buffer member 25 is formed between the upper surface of the lower electrode 14 and the lower surface of the lead portion 24 by using a material having an insulating property, in part or in whole, so that the lead portion 24 is located with respect to the lower electrode 14. Insulated.
  • the piezoelectric layer 15 is formed by removing a portion other than the piezoelectric layer 15 with a resist pattern from the PZT layer formed to have a predetermined thickness.
  • a photosensitive resin is applied to the upper surface of the piezoelectric layer 15 and the upper surface of the lower electrode 14, masked with a predetermined shape, and exposed to ultraviolet rays, thereby forming the buffer member 25.
  • the buffer member 25 having substantially the same thickness as that of the piezoelectric layer 15 is obtained, and the upper electrode 18 and the lead portion 24 are straddled over the upper surfaces of the buffer member 25 and the piezoelectric layer 15 by a film forming method such as vapor deposition or sputtering. Even if formed, the upper electrode 18 and the lead portion 24 can be stably manufactured without being electrically disconnected.
  • the present invention can be used for a piezoelectric actuator that deforms a diaphragm toward a pressure chamber and an ink jet head including the piezoelectric actuator.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

L'invention porte sur un actionneur piézoélectrique et sur une tête à jet d'encre le comportant, lequel actionneur piézoélectrique ne présente pas de diminution de déplacement provoquée par la déformation de la couche piézoélectrique, pas de possibilité d'apparition de fissures même si la couche piézoélectrique est déformée de façon répétée, et permet également la fabrication stable d'une électrode supérieure et d'une section de sortie de celle-ci par un procédé de formation de film. L'actionneur piézoélectrique décrit (1) a une électrode inférieure (14), une couche piézoélectrique (15) et une électrode supérieure (18) en couches dans cet ordre sur un diaphragme (11a). La couche piézoélectrique (15) est disposée sur l'intérieur des surfaces s'étendant vers le haut de surfaces de paroi latérale (10a) d'un substrat (10) qui forment une chambre de pression (20). L'électrode supérieure (18) est disposée de façon à faire face à la couche piézoélectrique (15). Une section de sortie (24) connectée électriquement à l'électrode supérieure (18) est formée d'un seul tenant avec l'électrode supérieure (18), et un élément tampon (25) ayant approximativement la même épaisseur que la couche piézoélectrique (15) et comprenant une résine ayant un module de Young inférieur à celui de la couche piézoélectrique (15) est formé entre la surface supérieure de l'électrode inférieure (14) et la surface inférieure de la section de sortie (24). L'élément tampon (25) est disposé de façon contiguë à la couche piézoélectrique (15) sur l'extension vers le haut des surfaces de paroi latérale (10a) du substrat (10).
PCT/JP2011/059914 2010-05-11 2011-04-22 Actionneur piézoélectrique, et tête à jet d'encre le comportant Ceased WO2011142232A1 (fr)

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JP2010109410 2010-05-11
JP2010-109410 2010-05-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012144305A1 (fr) * 2011-04-18 2012-10-26 コニカミノルタホールディングス株式会社 Actionneur piézoélectrique et tête de jet d'encre équipée de celui-ci

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Publication number Priority date Publication date Assignee Title
WO1997003834A1 (fr) * 1995-07-14 1997-02-06 Seiko Epson Corporation Tete laminee pour impression par jets d'encre, son procede de fabrication et imprimantes en etant equipees
JP2000085124A (ja) * 1998-09-14 2000-03-28 Matsushita Electric Ind Co Ltd インクジェットヘッド及びその製造方法
JP2003110160A (ja) * 2001-10-02 2003-04-11 Matsushita Electric Ind Co Ltd 強誘電体素子およびそれを用いたアクチュエータ、インクジェットヘッドならびにインクジェット記録装置
JP2008211965A (ja) * 2007-01-30 2008-09-11 Matsushita Electric Ind Co Ltd 圧電体素子、インクジェットヘッドおよびインクジェット式記録装置
JP2008227144A (ja) * 2007-03-13 2008-09-25 Seiko Epson Corp 圧電アクチュエータおよびその製造方法ならびに液体噴射ヘッド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003834A1 (fr) * 1995-07-14 1997-02-06 Seiko Epson Corporation Tete laminee pour impression par jets d'encre, son procede de fabrication et imprimantes en etant equipees
JP2000085124A (ja) * 1998-09-14 2000-03-28 Matsushita Electric Ind Co Ltd インクジェットヘッド及びその製造方法
JP2003110160A (ja) * 2001-10-02 2003-04-11 Matsushita Electric Ind Co Ltd 強誘電体素子およびそれを用いたアクチュエータ、インクジェットヘッドならびにインクジェット記録装置
JP2008211965A (ja) * 2007-01-30 2008-09-11 Matsushita Electric Ind Co Ltd 圧電体素子、インクジェットヘッドおよびインクジェット式記録装置
JP2008227144A (ja) * 2007-03-13 2008-09-25 Seiko Epson Corp 圧電アクチュエータおよびその製造方法ならびに液体噴射ヘッド

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012144305A1 (fr) * 2011-04-18 2012-10-26 コニカミノルタホールディングス株式会社 Actionneur piézoélectrique et tête de jet d'encre équipée de celui-ci
JPWO2012144305A1 (ja) * 2011-04-18 2014-07-28 コニカミノルタ株式会社 圧電アクチュエータおよびそれを備えたインクジェットヘッド
US8979249B2 (en) 2011-04-18 2015-03-17 Konica Minolta, Inc. Piezoelectric actuator and ink-jet head including same
EP2701217A4 (fr) * 2011-04-18 2015-07-15 Konica Minolta Inc Actionneur piézoélectrique et tête de jet d'encre équipée de celui-ci

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