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WO2011021484A1 - Composition de céramique de verre, feuille de céramique crue, et substrat céramique multicouche - Google Patents

Composition de céramique de verre, feuille de céramique crue, et substrat céramique multicouche Download PDF

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Publication number
WO2011021484A1
WO2011021484A1 PCT/JP2010/062677 JP2010062677W WO2011021484A1 WO 2011021484 A1 WO2011021484 A1 WO 2011021484A1 JP 2010062677 W JP2010062677 W JP 2010062677W WO 2011021484 A1 WO2011021484 A1 WO 2011021484A1
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Prior art keywords
glass
ceramic
powder
less
particle diameter
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English (en)
Japanese (ja)
Inventor
秋一 川田
和雄 岸田
裕一 飯田
哲雄 金森
隆裕 高田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2011527622A priority Critical patent/JP5633707B2/ja
Publication of WO2011021484A1 publication Critical patent/WO2011021484A1/fr
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
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    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605—Treating the starting powders individually or as mixtures
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    • C04B35/628—Coating the powders or the macroscopic reinforcing agents
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    • C04B35/628—Coating the powders or the macroscopic reinforcing agents
    • C04B35/62892—Coating the powders or the macroscopic reinforcing agents with a coating layer consisting of particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3427—Silicates other than clay, e.g. water glass
    • C04B2235/3463—Alumino-silicates other than clay, e.g. mullite
    • C04B2235/3481—Alkaline earth metal alumino-silicates other than clay, e.g. cordierite, beryl, micas such as margarite, plagioclase feldspars such as anorthite, zeolites such as chabazite
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    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
    • C04B2235/365—Borosilicate glass
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    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer

Definitions

  • the present invention relates to a glass ceramic composition, a ceramic green sheet containing the glass ceramic composition, and a multilayer ceramic substrate formed using the ceramic green sheet, and more particularly for densifying the multilayer ceramic substrate. It is about improvement.
  • Patent Document 1 discloses a glass ceramic composition comprising a mixture of ceramic powder made of alumina having an average particle size of 0.5 to 3 ⁇ m and glass powder made of borosilicate glass having an average particle size of 1 to 5 ⁇ m. Things are disclosed.
  • Patent Document 1 does not disclose a detailed particle size distribution for each of the ceramic powder and the glass powder. Therefore, when the particle size distribution of each of the ceramic powder and the glass powder is not appropriate, the following problems may be encountered.
  • the glass powder 1 has, for example, 90% passing particle diameter D90 or 99% passing particle diameter D99 larger than those of the ceramic powder 2, initially, as shown in FIG.
  • the ceramic powder 2 having a relatively small particle size may surround the relatively coarse glass powder 1 in some cases. Therefore, the enclosed glass powder 1 is sucked into the portion where the ceramic powder 2 is distributed by capillary action after the liquid phase is formed, and the pore 4 is generated in the glass portion 3 as shown in FIG. To do. Therefore, densification of the multilayer ceramic substrate is hindered.
  • the particle size of the ceramic powder is relatively large, the gap formed between the particles of the ceramic powder increases, and the contact between the particles of the ceramic powder and the particles of the glass powder decreases.
  • borosilicate glass has the property that when it becomes a liquid phase and alumina is dissolved therein, the viscosity of the glass is lowered and the fluidity is improved. Therefore, as described above, when the number of contact points between the ceramic powder particles made of alumina and the glass powder particles decreases, it becomes difficult to promote the fluidization of the glass. Therefore, many pores are generated in the multilayer ceramic substrate. As a result, in this case as well, densification of the multilayer ceramic substrate is hindered.
  • the pores as described above cause, for example, unwanted penetration of plating solution or moisture into the multilayer ceramic substrate, causing migration due to this, and lowering the insulation of the multilayer ceramic substrate, This causes problems such as reduced strength.
  • an object of the present invention is to provide a glass ceramic composition, a ceramic green sheet containing the glass ceramic composition, and a multilayer ceramic substrate formed using the ceramic green sheet, which can solve the problems described above. Is to try.
  • the present invention is first directed to a glass ceramic composition
  • a glass ceramic composition comprising a glass powder composed of CaO—SiO 2 —Al 2 O 3 —B 2 O 3 and a ceramic powder composed of Al 2 O 3.
  • each particle size distribution of the glass powder and the ceramic powder is selected as follows.
  • the 50% passing particle diameter D50 of the glass powder is less than 3.5 ⁇ m
  • the 99% passing particle diameter D99 of the glass powder is less than 15 ⁇ m
  • the 50% passing particle diameter D50 of the ceramic powder is less than 1.0 ⁇ m. And smaller than the 50% passing particle diameter D50 of the glass powder.
  • the 50% passing particle size D50 of the glass powder when the 50% passing particle size D50 of the glass powder is 1.0 ⁇ m or more and less than 2.5 ⁇ m, the 50% passing particle size D50 of the ceramic powder is 50% passing particle size of the glass powder. It is preferable that it is 1/2 or less of the diameter D50.
  • the 50% passing particle diameter D50 of the glass powder is 2.5 ⁇ m or more and less than 3.5 ⁇ m
  • the 50% passing particle diameter D50 of the ceramic powder is 1/3 or less of the 50% passing particle diameter D50 of the glass powder. Preferably there is.
  • the glass ceramic composition is obtained by further mixing anodized crystal pulverized powder.
  • the 50% passing particle diameter D50 of the anorthic crystal pulverized powder is 50% passing particle diameter D50 of the glass powder. Preferably it is smaller.
  • the present invention is also directed to a ceramic green sheet containing the glass ceramic composition according to the present invention described above.
  • the present invention is further directed to a multilayer ceramic substrate having a plurality of ceramic layers made of a sintered body of the above-mentioned ceramic green sheet.
  • the glass-ceramic composition according to the present invention first, since the 99% passing particle diameter D99 of the glass powder is less than 15 ⁇ m, the generation of huge pores of, for example, 10 ⁇ m or more can be suppressed.
  • the 50% passing particle diameter D50 of the glass powder is less than 3.5 ⁇ m
  • the 50% passing particle diameter D50 of the ceramic powder is less than 1.0 ⁇ m, which is smaller than the 50% passing particle diameter D50 of the glass powder. Therefore, many contacts are generated between the glass powder and the alumina powder. This is a situation where alumina easily dissolves when the borosilicate glass constituting the glass powder is in a liquid phase. Therefore, alumina dissolves in the glass that has become liquid phase in the firing step, and as a result, the viscosity of the glass decreases and the fluidity improves. Therefore, the rearrangement of the ceramic powder is promoted, and the glass can smoothly fill the gap of the ceramic powder.
  • FIG. 1 the structure of a multilayer ceramic substrate constructed using the glass ceramic composition according to the present invention will be described first.
  • the multilayer ceramic substrate 11 shown in FIG. 1 includes a plurality of laminated ceramic layers 12.
  • the multilayer ceramic substrate 11 is provided with various types of wiring conductors.
  • As the wiring conductor for example, inside the multilayer ceramic substrate 11, several internal conductor films 13 to 17 extending along a specific interface between the ceramic layers 12 and the specific ceramic layer 12 are penetrated in the thickness direction.
  • chip parts 21 to 23 are mounted on the upper surface of the multilayer ceramic substrate 11. In order to electrically connect and mechanically fix these chip components 21 to 23, the above-described external conductor film 19 is used.
  • a capacitor 24 is configured with the conductor film 13
  • a capacitor 25 is configured with the conductor film 14
  • an inductor 26 is configured with the conductor film 15.
  • the conductor film 16 functions as a ground electrode.
  • Such a multilayer ceramic substrate 11 is usually manufactured as follows.
  • a ceramic slurry containing a glass ceramic composition is prepared. More specifically, glass powder and ceramic powder are mixed with a binder and a solvent to prepare a ceramic slurry.
  • the ceramic green sheet which should become the above-mentioned ceramic layer 12 is produced by coating a ceramic slurry on a carrier film by a doctor blade method or the like and forming it into a sheet shape.
  • a through-hole penetrating in the thickness direction is formed in the ceramic green sheet, and a conductive paste mainly composed of silver or copper is filled therein to form the via-hole conductor 18.
  • a conductive paste mainly composed of silver or copper is printed by screen printing or the like to form the inner conductor films 13 to 17 and the outer conductor films 19 and 20.
  • a predetermined number of ceramic green sheets having the desired ones of the conductor films 13 to 17 and 19 and 20 are stacked in a predetermined order and pressed to produce a raw stacked body.
  • the raw laminate After cutting the raw laminate as necessary, it is fired at a temperature of 1050 ° C. or lower, for example, to sinter the ceramic green sheets, the conductor films 13 to 17, 19 and 20, and the via-hole conductor 18 Thus, the multilayer ceramic substrate 11 is obtained.
  • the glass ceramic composition according to the present invention is used as the glass ceramic composition contained in the ceramic slurry prepared in step (1) of the above production method.
  • the glass ceramic composition according to the present invention comprises a mixture of a glass powder made of CaO—SiO 2 —Al 2 O 3 —B 2 O 3 (borosilicate glass) and a ceramic powder made of Al 2 O 3 (alumina). It will be.
  • the mixing ratio of the glass powder and the ceramic powder is preferably 55 to 60% by weight for the glass powder and 40 to 45% by weight for the ceramic powder.
  • each particle size distribution of glass powder and ceramic powder is selected as follows.
  • the 50% passing particle diameter D50 of the glass powder is less than 3.5 ⁇ m, and the 99% passing particle diameter D99 of the glass powder is less than 15 ⁇ m.
  • the 50% passing particle diameter D50 of the ceramic powder is less than 1.0 ⁇ m and smaller than the 50% passing particle diameter D50 of the glass powder.
  • Sintering of the glass-ceramic composition is achieved by the glass becoming liquid phase, the ceramic powder as the filler being rearranged, and the liquid phase glass filling the gaps between the ceramic particles and densifying.
  • the particle size of the ceramic powder when the particle size of the ceramic powder is small, rearrangement tends to occur, and the sintered body of the glass ceramic composition tends to be densified.
  • the viscosity of the glass when alumina constituting the ceramic powder is dissolved into the liquid phase glass, the viscosity of the glass is lowered and the glass powder is likely to spread, which promotes rearrangement of the ceramic powder. Therefore, according to the present invention, as described above, since the particle size of the ceramic powder is reduced such that the 50% passing particle size D50 of the ceramic powder is less than 1.0 ⁇ m, the rearrangement is improved.
  • the densification of the sintered body is promoted by increasing the amount of alumina dissolved in the glass due to the increase in the interface between the ceramic powder and the glass.
  • the pores remaining in the sintered body are relatively generated in the gaps between the ceramic powders, but particularly large pores are considered to be caused by the coarse particles of the glass.
  • the ceramic powder 2 that is relatively fine particles adheres around the coarse glass powder 1 as shown in FIG.
  • the glass powder 1 has a core-shell structure in which the core is the core and the ceramic powder 2 is the shell, the surrounding shell tends to be thicker as the glass powder 1 contains larger coarse particles.
  • the glass powder 1 is absorbed by the capillary action between the surrounding ceramic powders 2 after the glass powder 1 is liquidified, and the glass part 3 constituting the central core is hollowed out. As a result, the pore 4 is left.
  • the multilayer ceramic substrate 11 including a plurality of ceramic layers 12 formed using the glass ceramic composition as described above, if the above-mentioned huge pores exist, the huge pores exist. Since the thickness of the ceramic layer 12 becomes extremely thin only at the location, electric field concentration is caused there, and dielectric breakdown tends to occur.
  • the glass powder is prevented from containing large coarse particles such that the 99% passing particle diameter D99 of the glass powder is less than 15 ⁇ m.
  • the generation of huge pores is suppressed, dielectric breakdown is less likely to occur, and the insulation reliability of the multilayer ceramic substrate can be improved.
  • the feature of the present invention is not limited to the fact that the 50% passing particle diameter D50 of the ceramic powder is less than 1.0 ⁇ m and the 99% passing particle diameter D99 of the glass powder is less than 15 ⁇ m as described above. Absent. If each of the ceramic powder and the glass powder is merely fine, in some cases, the sintered body is hardly densified, and various characteristics of the multilayer ceramic substrate may be deteriorated. The reason is as follows.
  • a crystalline phase such as wollastonite precipitates at a relatively low temperature at the glass-glass interface provided between the glass powders.
  • the crystal phase as described above is likely to precipitate at a relatively low temperature. Therefore, after the glass is softened, the flow of the glass is inhibited by crystallization before a sufficient flow occurs.
  • the ceramic powder 2 is finer than the glass powder 1, more specifically, the 50% passing particle diameter D50 of the ceramic powder 2 is 50% passing particle diameter of the glass powder 1. It is necessary to be smaller than D50.
  • the multilayer ceramic substrate 11 can be densified.
  • the multilayer ceramic substrate 11 is thus densified, it is possible to make it difficult for water or a plating solution to enter the multilayer ceramic substrate 11.
  • water or a plating solution is infiltrated into the multilayer ceramic substrate 11, if the inner conductor films 13 to 17 and the via-hole conductor 18 contain Ag as a conductive component, a short circuit failure due to Ag migration tends to occur.
  • it is possible to make it difficult for water or a plating solution to enter the multilayer ceramic substrate 11 it is difficult for such short-circuit defects to occur, and the reliability of the multilayer ceramic substrate 11 can be improved.
  • the amount of anorthite crystallized at the interface also increases.
  • the dielectric constant of the ceramic layer 12 can be increased.
  • this also contributes to the improvement of the strength of the multilayer ceramic substrate 11.
  • the ceramic powder when the glass powder 50% passing particle diameter D50 is 1.0 ⁇ m or more and less than 2.5 ⁇ m, the ceramic When the 50% passing particle diameter D50 of the powder is set to 1 ⁇ 2 or less of the 50% passing particle diameter D50 of the glass powder, while the 50% passing particle diameter D50 of the glass powder is 2.5 ⁇ m or more and less than 3.5 ⁇ m
  • the ceramic powder preferably has a 50% passing particle diameter D50 of 1/3 or less of the 50% passing particle diameter D50 of the glass powder.
  • the crystallization temperature can be adjusted depending on the content thereof, and the precipitated crystal phase for each production lot can be stabilized.
  • the 50% passing particle diameter D50 of the anosite crystal pulverized powder is smaller than the 50% passing particle diameter D50 of the glass powder.
  • the particle size of the anorthite crystal pulverized powder is larger than the particle size of the glass powder, the reaction between the glass powders is likely to occur, and for example, other crystal phases such as wollastonite are likely to precipitate, thereby inhibiting the flow of the glass. Because it is done.
  • the anorthite pulverized powder is more effective as it is finer, it is necessary to limit the particle size so that the added amount is easy to handle.
  • the passing particle diameter D50 of the anosite crystal pulverized powder is preferably 1 to 2 ⁇ m.
  • the mixing ratio of the anosite crystal pulverized powder is preferably 0.01% by weight to 1.0% by weight based on the total amount of the alumina powder and the glass powder.
  • Ceramic powders A1 to A4 made of alumina and glass powders G1 to G5 each having a particle size distribution as shown in Table 1 were prepared. Glass powders G1 to G5 having a composition containing 59% SiO 2 , 26.5% CaO, 8.7% B 2 O 3 , and 5.7% Al 2 O 3 , respectively, A pulverization step using a dry mill was performed. The glass powders G1 to G4 were obtained through a classification process using a classifier after the pulverization process. A classifier was not used for the glass powder G5.
  • anorsite crystal pulverized powder was prepared by pulverizing the sintered body. Specifically, the anorthite crystal pulverized powder was obtained by pulverizing a multilayer ceramic substrate prepared by firing a ceramic green sheet containing a ceramic composition composed of the ceramic powder and the glass powder.
  • the ceramic powder among the ceramic powders A1 to A4 shown in Table 1, those shown in the column of “Ceramic powder” in Table 2 are used, and for the glass powder, the glass powder G1 shown in Table 1 is used. Among G5, those shown in the column of “Glass Powder” in Table 2 were used. Further, the anosite crystal pulverized powder having a passing particle diameter D50 of 1.1 ⁇ m, a passing particle diameter D90 of 3.7 ⁇ m, and a passing particle diameter D99 of 8.1 ⁇ m was used.
  • PSZ boulder having a diameter of 5 mm, a toluene / alcohol mixed solvent, a dispersant and a plasticizer (DOA) were added to the polypot, followed by a dispersion treatment for 3 hours, and then an organic binder was added, followed by another 3 hours. Then, dispersion treatment was performed to obtain a slurry.
  • DOA plasticizer
  • a green sheet having a thickness of 50 ⁇ m was formed from the obtained slurry by a doctor blade method.
  • a conductor film having a thickness of 10 ⁇ m was formed on the green sheet, and then the green sheets were laminated to produce a green sheet laminate having a thickness of 600 ⁇ m.
  • the green sheet laminate has a thickness of 300 ⁇ m as a result of the subsequent firing step.
  • a capacitor is formed by facing the outer conductor film and the inner conductor film in the surface layer portion.
  • a first composite laminate was obtained by laminating three of the restraining green sheets above and below the green sheet laminate.
  • a green sheet laminate having a thickness of 1200 ⁇ m was produced by laminating the above green sheet, which was molded and did not have a conductor film formed thereon.
  • the green sheet laminate has a thickness of 600 ⁇ m as a result of the subsequent firing step.
  • a second composite laminate was obtained by laminating three of the restraining green sheets on the top and bottom of the green sheet laminate.
  • each of the first and second composite laminates is fired in the air to a temperature of 750 ° C., degreased, and then fired at a temperature of 890 ° C. in an N 2 atmosphere.
  • the constraining layer derived from the constraining green sheet was removed. In this way, the first multilayer ceramic substrate on which the conductor film is formed is obtained from the first composite laminate, and the second multilayer ceramic substrate on which the conductor film is not formed is obtained from the second composite laminate. It was.
  • the “maximum pore diameter” was determined by SEM observation of the first multilayer ceramic substrate.
  • the “bending strength” was obtained by performing a three-point bending test on the second multilayer ceramic substrate.
  • the “density” was obtained by applying the Archimedes method to the second multilayer ceramic substrate.
  • “Initial IR” was obtained by applying a DC voltage of 50 V to the portion constituting the capacitor in the first multilayer ceramic substrate and measuring the resistance value.
  • D50 is 1 for the ceramic powder while using any of the glass powders G1 to G3 that satisfy the condition that D50 is less than 3.5 ⁇ m and D99 is less than 15 ⁇ m.
  • maximum pore diameter is less than 10 ⁇ m
  • “crystallinity” is 1.1 or more
  • “bending strength” is 180 MPa or more
  • “ ⁇ ” is 7 or more
  • “initial IR” is 13 Log or more. I was able to.
  • Samples 8 and 9 since ceramic powder A4 having D50 of 1.0 ⁇ m or more was used, the glass-ceramic interface could not be increased, and “crystallinity”, “bending strength”, “ ⁇ ” and It was inferior in terms of “initial IR”. Samples 8 and 9 were inferior to samples 6 and 7 in terms of “crystallinity” and “bending strength” because ceramic powder A4 having a D50 larger than that of ceramic powder A3 was used. Sample 9 was also inferior to samples 6 and 7 in terms of “initial IR”.
  • the glass powder G2 having a larger particle diameter than the glass powder G1 used in the sample 8 was used, so that the “maximum pore diameter” was larger, and “crystallization” It was inferior in terms of “degree” and “bending strength”.
  • the external conductor film did not peel off because the particle size of the glass powder was larger in the sample 9 than in the sample 8, so that the flowability of the glass was low and the constraining layer This is presumably because the adhesion strength to the sample was not as strong as that of the sample 8.
  • Sample 10 uses ceramic powder A2 that satisfies the condition that D50 is less than 1.0 ⁇ m for the ceramic powder, and further satisfies the condition that D50 of ceramic powder A2 is smaller than D50 of glass powder G4. Since D50 of the glass powder G4 used is 3.5 ⁇ m or more and D99 is 15 ⁇ m or more, the “maximum pore diameter” is very large as 13.2 ⁇ m, and “crystallinity”, “bending strength” ”,“ ⁇ ”, and“ Initial IR ”were all inferior.
  • Sample 11 uses ceramic powder A2 that satisfies the condition that D50 is less than 1.0 ⁇ m for the ceramic powder, and further satisfies the condition that D50 of ceramic powder A2 is smaller than D50 of glass powder G5.
  • D50 of the used glass powder G5 is less than 3.5 ⁇ m, but since this glass powder G5 did not go through the classification step, D99 was 15 ⁇ m or more, and the “maximum pore diameter” was very large as 11.2 ⁇ m. Also, it was inferior in terms of “initial IR”.
  • Samples 1, 2, 6 and 8 use glass powder G1 having a D50 of 1.0 ⁇ m or more and less than 2.5 ⁇ m.
  • the results show good results in terms of “maximum pore diameter”, “crystallinity”, “bending strength” and “ ⁇ ”, Further, in terms of “initial IR”, a better result than that of the sample 6 was shown.
  • Samples 3, 4, 5, 7, 9, and 11 use glass powder G2, G3, or G5 having a D50 of 2.5 ⁇ m or more and less than 3.5 ⁇ m.
  • samples 3, 4, 5, 7, 9, and 11 samples 3, 4, 5 using ceramic powder A1 or A2 that satisfies the condition that D50 of ceramic powder is 1/3 or less of D50 of glass powder.
  • samples 3, 4, 5 show better results in terms of “crystallinity”, “bending strength” and “ ⁇ ” compared to samples 7 and 9 using ceramic powder A3 or A4 that does not satisfy the above conditions. It was.
  • FIG. 3 shows an SEM image obtained by photographing a cross section of the capacitor portion of the first multilayer ceramic substrate according to Sample 1.
  • FIG. 4 shows an SEM image obtained by photographing a cross section of the capacitor portion of the first multilayer ceramic substrate according to the sample 9. Comparing FIG. 3 and FIG. 4, it can be confirmed that according to the sample 1, the denseness is clearly improved as compared with the sample 9.

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Abstract

La présente invention a pour objet un substrat céramique multicouche de haute densité. La composition de céramique de verre permettant de former une couche céramique du substrat céramique multicouche est un mélange d'une poudre de verre (1) comprenant CaO-SiO2-Al2O3-B2O3 et d'une poudre céramique (2) comprenant Al2O3. La taille de passage des particules (D50) de 50 % de la poudre de verre (1) contenue dans la composition de céramique de verre est inférieure à 3,5 µm, et la taille de passage des particules (D99) de 99 % de la poudre de verre (1) contenue dans la composition de céramique de verre est inférieure à 15 µm, tandis que la taille de passage des particules (D50) de 50 % de la poudre de céramique (2) contenue dans la composition de céramique de verre est inférieure à 1,0 µm, et est inférieure à la taille de passage des particules (D50) de 50 % de la poudre de verre (1).
PCT/JP2010/062677 2009-08-18 2010-07-28 Composition de céramique de verre, feuille de céramique crue, et substrat céramique multicouche Ceased WO2011021484A1 (fr)

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WO2013099944A1 (fr) * 2011-12-27 2013-07-04 株式会社村田製作所 Substrat céramique multi-couches et composant électronique l'utilisant
JPWO2014196348A1 (ja) * 2013-06-05 2017-02-23 株式会社村田製作所 セラミック基板用組成物およびセラミック回路部品
JP2020174210A (ja) * 2016-12-08 2020-10-22 株式会社村田製作所 多層セラミック基板及び電子装置
CN115483029A (zh) * 2021-06-16 2022-12-16 株式会社村田制作所 层叠陶瓷电子部件
JPWO2023068159A1 (fr) * 2021-10-18 2023-04-27
CN117303866A (zh) * 2023-08-21 2023-12-29 中国建筑材料科学研究总院有限公司 陶瓷基板材料的介电常数调控方法及制备方法

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JP2001010858A (ja) * 1999-06-22 2001-01-16 Murata Mfg Co Ltd セラミック基板用組成物およびセラミック回路部品
JP2001010868A (ja) * 1999-06-22 2001-01-16 Murata Mfg Co Ltd セラミック基板用組成物およびセラミック回路部品
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WO2013099944A1 (fr) * 2011-12-27 2013-07-04 株式会社村田製作所 Substrat céramique multi-couches et composant électronique l'utilisant
JPWO2014196348A1 (ja) * 2013-06-05 2017-02-23 株式会社村田製作所 セラミック基板用組成物およびセラミック回路部品
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JP2020174210A (ja) * 2016-12-08 2020-10-22 株式会社村田製作所 多層セラミック基板及び電子装置
JP7309666B2 (ja) 2016-12-08 2023-07-18 株式会社村田製作所 多層セラミック基板及び電子装置
CN115483029A (zh) * 2021-06-16 2022-12-16 株式会社村田制作所 层叠陶瓷电子部件
JPWO2023068159A1 (fr) * 2021-10-18 2023-04-27
JP7801359B2 (ja) 2021-10-18 2026-01-16 日本特殊陶業株式会社 アルミナ質焼結体、および静電チャック
CN117303866A (zh) * 2023-08-21 2023-12-29 中国建筑材料科学研究总院有限公司 陶瓷基板材料的介电常数调控方法及制备方法
CN117303866B (zh) * 2023-08-21 2025-12-02 中国建筑材料科学研究总院有限公司 陶瓷基板材料的介电常数调控方法及制备方法

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