[go: up one dir, main page]

WO2011077911A1 - Vacuum chuck - Google Patents

Vacuum chuck Download PDF

Info

Publication number
WO2011077911A1
WO2011077911A1 PCT/JP2010/071458 JP2010071458W WO2011077911A1 WO 2011077911 A1 WO2011077911 A1 WO 2011077911A1 JP 2010071458 W JP2010071458 W JP 2010071458W WO 2011077911 A1 WO2011077911 A1 WO 2011077911A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum chuck
conductive
base
polyimide
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/071458
Other languages
French (fr)
Japanese (ja)
Inventor
康之 天満
良昭 辰巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creative Technology Corp
Original Assignee
Creative Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Technology Corp filed Critical Creative Technology Corp
Priority to JP2011547434A priority Critical patent/JPWO2011077911A1/en
Publication of WO2011077911A1 publication Critical patent/WO2011077911A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H10P72/78—

Definitions

  • the present invention relates to a conductive vacuum chuck that vacuum-sucks a workpiece such as a wafer.
  • this type of vacuum chuck includes a base and a suction portion on which a wafer or the like is placed, and the back surface side of the wafer is made negative pressure or positive pressure to suck the wafer or the like on the suction portion or from the suction portion. I try to release.
  • the entire chuck is formed of a conductive member in order to prevent a situation where static electricity is charged on a wafer or the like.
  • the entire vacuum chuck such as the base and the suction part, is integrally formed by machining or injection molding using conductive polyether ether ketone (hereinafter referred to as “PEEK”) (for example, patents) Reference 1 to 4).
  • PEEK conductive polyether ether ketone
  • the conventional vacuum chuck described above has the following problems.
  • PEEK which is the material of the vacuum chuck, is likely to generate dust when it comes into contact with the wafer, and may contaminate the wafer.
  • a plurality of embosses on which a wafer is placed are formed on the surface of the suction portion of the vacuum chuck to reduce the contact area between the wafer and the suction portion.
  • embossing is formed on PEEK, it must be formed by machining, and fine embossing cannot be formed. For this reason, the contact area between the wafer and the suction portion is not sufficiently reduced, and a sufficient dust generation preventing effect cannot be exhibited.
  • PEEK when PEEK is used, the surface resistance of the attracting part varies in the range of 10 2 to 10 4 ⁇ , and a stable resistance value cannot be obtained. Furthermore, PEEK has a tensile strength of 100 MPa or less and is inferior in mechanical strength.
  • the present invention has been made to solve the above-described problems, and an object thereof is to provide a vacuum chuck having low dust generation, fine embossing, low surface resistance, and high mechanical strength.
  • the invention of claim 1 includes a conductive base and an adsorbing portion fixed to the surface of the base, and the conductive base has an air passage opened on the surface,
  • the suction part is a vacuum chuck having a suction and release hole communicating with the opening of the air passage, a plurality of embosses, and an outer peripheral wall part having a height equal to these embosses. It is made of a conductive resin sheet and is fixed to the surface of the base via a conductive adhesive resin sheet.
  • the vacuum chuck of the present invention has a structure in which the suction portion formed of the conductive resin sheet is fixed to the surface of the base via the conductive adhesive resin sheet Therefore, the static electricity generated in the work flows from the adsorption part to the base side through the adhesive resin sheet. As a result, the workpiece can be prevented from being charged. Further, when a workpiece is processed on a plurality of embosses, dust may be generated due to contact between the workpiece and the emboss. However, in the vacuum chuck of the present invention, since the adsorbing portion is made of a low dusting conductive resin sheet, dusting due to contact between the work and the emboss hardly occurs.
  • the conductive resin sheet is a sheet containing carbon nanotubes.
  • the sheet is a sheet made of conductive polyimide.
  • the sheet containing carbon nanotubes is made of conductive polyimide, it is possible to form a very fine emboss by etching compared to the above-described conventional PEEK. Therefore, the contact area between the workpiece and the emboss can be made very small, and as a result, the dust generation preventing effect can be further enhanced.
  • the surface resistance of the conductive polyimide is stable with no variation compared to PEEK, and the resistance value is very low, so that static electricity generated on the workpiece can be quickly discharged.
  • the mechanical strength of the conductive polyimide is higher than PEEK and is excellent in durability.
  • the insulating polyimide is disposed under the conductive polyimide, and the adsorbing portion is formed of two layers of the insulating polyimide and the conductive polyimide.
  • the structure is fixed to the base via a conductive resin sheet, and a plurality of embosses and outer peripheral wall portions are formed only on conductive polyimide.
  • the invention of claim 5 is the vacuum chuck according to any one of claims 1 to 4,
  • the suction part and the base are configured to be a spin chuck that rotates integrally around a central axis that faces in the vertical direction.
  • the vacuum chuck of the present invention not only can the workpiece be prevented from being charged, but also dust can be effectively prevented.
  • the dust generation preventing effect can be further enhanced.
  • work can be quickly discharged
  • the durability of the chuck can be improved by the conductive polyimide having high mechanical strength.
  • FIG. 1 is an exploded perspective view showing a vacuum chuck according to a first embodiment of the present invention. It is a schematic sectional drawing of a vacuum chuck. It is a partial expanded sectional view which shows the relationship between the height of an adsorption
  • FIG. 4 is a partial enlarged cross-sectional view showing the structure of the suction unit 3. It is process drawing which shows the method of manufacturing the adsorption part of a two-layer structure.
  • FIG. 1 is an exploded perspective view showing a vacuum chuck according to a first embodiment of the present invention
  • FIG. 2 is a schematic sectional view of the vacuum chuck.
  • the vacuum chuck 1 of this embodiment includes a base 2 and a suction portion 3.
  • the base 2 is made of conductive aluminum and includes a main body portion 21 and a shaft portion 22.
  • the main body 21 has a thick disk shape, and has an air passage 24 that opens to the surface 21a at the center thereof.
  • the shaft portion 22 is integrated with the main body portion 21, and the air passage 24 from the main body portion 21 passes in the axial direction.
  • the shaft portion 22 is mechanically connected to the motor 10 and is rotated by the motor 10.
  • the adsorbing part 3 is a thin disk body whose outer diameter is set to be equal to the outer diameter of the main body part 21, and has a plurality of embosses 30 on the surface 3a thereof.
  • the ring-shaped outer peripheral wall portion 33 is provided.
  • the suction portion 3 is accommodated in the outer peripheral wall portion 33 of the base 2 and bonded to the surface 21 a of the main body portion 21 via the adhesive resin sheet 4.
  • FIG. 3 is a partial enlarged cross-sectional view showing the height relationship between the suction portion 3 and the outer peripheral wall portion 33. As shown in FIG.
  • the height to the upper surface 30 a of the emboss 30 of the suction portion 3 is set to be equal to the height H of the outer peripheral wall portion 33.
  • suction and release holes 26 and 25 are formed in the center of the suction part 3 and the adhesive resin sheet 4. It communicates with the air passage 24 of the base 2.
  • the vacuum chuck 1 of this embodiment is a spin chuck that sucks and holds the wafer W through the air passage 24 and the holes 25 and 26 and is rotated by the motor 10.
  • the suction portion 3 is formed of a low dusting conductive resin sheet.
  • the conductive resin sheet was formed of a sheet containing carbon nanotubes.
  • a sheet containing carbon nanotubes was formed of a sheet made of conductive polyimide, and the low dust generation property of the adsorption portion 3 was ensured.
  • a resin sheet a conductive polyimide can be adopted among “Kapton RS” (registered trademark) manufactured by DuPont which forms a two-layer structure of an insulating polyimide and a conductive polyimide. This polyimide can have a thickness of 25 ⁇ m, and its surface resistance is 100 ⁇ / sq.
  • the suction portion 3 is bonded to the base 2 with a conductive adhesive resin sheet 4.
  • a conductive adhesive resin sheet 4 As such a conductive adhesive resin sheet 4, "CBF-300" manufactured by Tatsuta System Electronics Co., Ltd. can be used.
  • This adhesive resin sheet 4 has a connection resistance to Ni-SUS304 of 1 ⁇ and a very low resistance value. Further, the tensile strength of this conductive polyimide is about 130 MPa, which is higher than PEEK and excellent in durability.
  • FIG. 4 is a process diagram showing a method for manufacturing the conductive polyimide adsorption portion 3. That is, as shown in FIG. 4A, the resist 11 is arranged in a dotted pattern on the conductive polyimide 3 ′ before processing, and a ring-shaped resist 11 ′ is arranged on the outer peripheral edge. Etching from above the resists 11 and 11 'forms the adsorbing portion 3 having a plurality of embosses 30 and a ring-shaped outer peripheral wall portion 33 as shown in FIG. Can do.
  • the conductive resin sheet of the adsorption portion 3 is made of conductive polyimide, it can be etched as described above, and as a result, a very fine emboss 30 can be formed as compared with the conventional PEEK. Can do.
  • a fine emboss 30 having a height of 25 ⁇ m and a diameter of 0.5 mm can be formed.
  • FIG. 5 is a schematic cross-sectional view for explaining the operation and effect of the vacuum chuck 1, and FIG.
  • the wafer W is placed on the plurality of embosses 30 of the suction unit 3.
  • the air A in the air passage 24 of the base 2 is drawn by a vacuum pump (not shown) as shown by an arrow, the lower side of the wafer W and the inside of the holes 25 and 26 become negative pressure.
  • FIG. 5 shows that when the air A in the air passage 24 of the base 2 is drawn by a vacuum pump (not shown) as shown by an arrow, the lower side of the wafer W and the inside of the holes 25 and 26 become negative pressure.
  • FIG. 5 is a schematic cross-sectional view for explaining the operation and effect of the vacuum chuck 1, and FIG.
  • the back surface of the wafer W is airtightly adsorbed to the upper surfaces 30 a of the plurality of embosses 30 and the upper surfaces 33 a of the outer peripheral wall portions 33.
  • the motor 10 shown in FIG. 5 is driven to rotate the entire vacuum chuck 1 and desired processing can be performed on the rotating wafer W.
  • the vacuum chuck 1 of this embodiment has a configuration in which the suction portion 3 formed of a conductive resin sheet is fixed to the surface of the conductive base 2 via a conductive adhesive resin sheet. For this reason, the static electricity generated on the wafer W flows from the adsorption portion 3 to the base 2 side via the adhesive resin sheet 4, so that the wafer W is hardly charged. Furthermore, since the adsorption
  • FIG. 7 is a schematic sectional view of a vacuum chuck according to the second embodiment of the present invention
  • FIG. 8 is a partially enlarged sectional view showing the structure of the suction portion 3.
  • This embodiment differs from the first embodiment in that the suction part 3 has a two-layer structure. That is, as shown in FIG. 7, the adsorbing portion 3 has a two-layer structure of an insulating polyimide 31 and a conductive polyimide 32 and is adhered to the main body portion 21 of the base 2 via the adhesive resin sheet 4. ing.
  • “Kapton RS” (registered trademark) manufactured by DuPont is used as the insulating polyimide 31 and the conductive polyimide 32, and the adhesive resin is “CBF-300” manufactured by Tatsuta System Electronics. Bonded via sheet 4.
  • the adhesive resin is “CBF-300” manufactured by Tatsuta System Electronics. Bonded via sheet 4.
  • FIG. 8 by providing a plurality of grooves 31a in the insulating polyimide 31, a plurality of base portions 31b are formed in portions other than the grooves 31a.
  • the conductive polyimide 32 is laminated on the insulating polyimide 31 in a state in which most of the conductive polyimide 32 is buried in the groove 31 a of the insulating polyimide 31. Thereby, each emboss 30 protrudes in the state which got on each base part 31b.
  • FIG. 9 is a process diagram showing a method of manufacturing the adsorption portion 3 having a two-layer structure.
  • the conductive polyimide 32 before processing is placed on the insulating polyimide 31. In this state, as shown in FIG.
  • a mold 13 having a plurality of holes 13a corresponding to the emboss 30 and a ring hole 13a 'corresponding to the outer peripheral wall 33 is formed by a press machine (not shown). Press from above the conductive polyimide 32. As a result, most of the conductive polyimide 32 is buried in the groove 31a of the insulating polyimide 31, the emboss 30 protrudes on the base portion 31b, and the outer peripheral wall portion 33 forms a ring shape on the base portion 31b '. Protrusively. As a result, as shown in FIG. 9E, a two-layered adsorption portion 3 having a plurality of embosses 30 and a ring-shaped outer peripheral wall portion 33 is formed. Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a vacuum chuck which is provided with a fine embossed pattern and has reduced dust generation, low surface resistivity and high mechanical strength. Specifically disclosed is a vacuum chuck (1) which comprises an aluminum base (2) and a conductive suction part (3). The suction part (3) is formed from a conductive polyimide, and the polyimide is bonded to a surface (21a) of the base (2) with a conductive adhesive resin sheet (4) interposed therebetween. The surface and the outer peripheral portion of the suction part (3) are provided with a plurality of embossed portions (30) and an outer peripheral wall portion (33) for the purpose of mounting a wafer (W) thereon. The base (2), the adhesive resin sheet (4) and the suction part (3) are provided with an air channel (24) and holes (25, 26) for suction and release. A shaft part (22) of the base (2) is mechanically connected to a motor so that the base (2) is rotated by the motor.

Description

真空チャックVacuum chuck

　この発明は、ウエハ等のワークを真空吸着する導電性の真空チャックに関するものである。 The present invention relates to a conductive vacuum chuck that vacuum-sucks a workpiece such as a wafer.

　従来、この種の真空チャックは、ベースと、ウエハ等を載せる吸着部とを備え、ウエハの裏面側を負圧又は正圧にすることで、ウエハ等を吸着部上に吸着し又は吸着部から解放するようにしている。
　通常、このような真空チャックでは、静電気がウエハ等に帯電する事態を防止するために、チャック全体を、導電性部材で形成している。具体的には、ベースや吸着部等、真空チャック全体を導電性のポリエーテルエーテルケトン（以下、「ＰＥＥＫ」と記す）を用いて、機械加工や射出成形によって一体成形している（例えば、特許文献１～４参照）。 Conventionally, this type of vacuum chuck includes a base and a suction portion on which a wafer or the like is placed, and the back surface side of the wafer is made negative pressure or positive pressure to suck the wafer or the like on the suction portion or from the suction portion. I try to release.
Usually, in such a vacuum chuck, the entire chuck is formed of a conductive member in order to prevent a situation where static electricity is charged on a wafer or the like. Specifically, the entire vacuum chuck, such as the base and the suction part, is integrally formed by machining or injection molding using conductive polyether ether ketone (hereinafter referred to as “PEEK”) (for example, patents) Reference 1 to 4).

特開２０００－１９１７９５号公報Japanese Patent Laid-Open No. 2000-191795 特開２０００－１９５９３２号公報JP 2000-195932 A 特開２０００－０１０２７５号公報JP 2000-010275 A 特開２００２－１４１４０１号公報Japanese Patent Laid-Open No. 2002-141401

　しかし、上記した従来の真空チャックでは、次のような問題がある。
　真空チャックの素材であるＰＥＥＫは、ウエハとの接触時に発塵が生じ易く、ウエハを汚染するおそれがある。
　また、通常は、ウエハを載せる複数のエンボスを、真空チャックの吸着部表面に形成して、ウエハと吸着部との接触面積の低減化を図る。しかし、エンボスをＰＥＥＫに形成する場合には、機械加工によって形成しなければならず、微細なエンボスを形成することができない。このため、ウエハと吸着部との接触面積が十分に小さくならず、十分な発塵防止効果を発揮することができない。
　また、ＰＥＥＫを用いた場合、吸着部の表面抵抗が、１０２～１０４Ωの範囲でばらつき、安定した抵抗値を得ることができない。
　さらに、ＰＥＥＫは、引張強度が１００ＭＰａ以下であり、機械的強度に劣っている。 However, the conventional vacuum chuck described above has the following problems.
PEEK, which is the material of the vacuum chuck, is likely to generate dust when it comes into contact with the wafer, and may contaminate the wafer.
Further, usually, a plurality of embosses on which a wafer is placed are formed on the surface of the suction portion of the vacuum chuck to reduce the contact area between the wafer and the suction portion. However, when embossing is formed on PEEK, it must be formed by machining, and fine embossing cannot be formed. For this reason, the contact area between the wafer and the suction portion is not sufficiently reduced, and a sufficient dust generation preventing effect cannot be exhibited.
In addition, when PEEK is used, the surface resistance of the attracting part varies in the range of 10 2 to 10 4 Ω, and a stable resistance value cannot be obtained.
Furthermore, PEEK has a tensile strength of 100 MPa or less and is inferior in mechanical strength.

　この発明は、上述した課題を解決するためになされたもので、低発塵性と微細なエンボスと低い表面抵抗と高い機械的強度を備えた真空チャックを提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object thereof is to provide a vacuum chuck having low dust generation, fine embossing, low surface resistance, and high mechanical strength.

　上記課題を解決するために、請求項１の発明は、導電性のベースとこのベースの表面に固着された吸着部とを備え、導電性のベースが、表面で開口した空気通路を有し、吸着部が、空気通路の開口と連通した吸着及び解放用の孔，複数のエンボス，及びこれらエンボスと等しい高さの外周壁部を有する真空チャックであって、吸着部を、低発塵性の導電性樹脂シートで形成し、導電性の接着樹脂シートを介してベースの表面に固着した構成とする。
　かかる構成により、ワークを、吸着部のエンボスと外周壁部との上に載置した状態で、空気通路を負圧にすると、ワークの下側の空気が、空気通路の開口と連通した孔から吸引され、ワークが複数のエンボスと外周壁部の上に吸着した状態になる。かかる状態で、ワークに対して所望の加工を行うことができる。
　この加工時において、静電気がワークに帯電するおそれがあるが、この発明の真空チャックが、導電性樹脂シートで形成された吸着部を導電性の接着樹脂シートを介してベースの表面に固着した構成になっているので、ワークに発生した静電気は、吸着部から接着樹脂シートを介してベース側に流れる。この結果、ワークの帯電を防止することができる。
　また、ワークを複数のエンボス上で加工すると、ワークとエンボスとの接触によって、発塵が生じるおそれがある。しかし、この発明の真空チャックでは、吸着部を、低発塵性の導電性樹脂シートで形成してあるので、ワークとエンボスとの接触による発塵はほとんど生じない。
　加工が終了したときには、空気通路を正圧にし、空気を空気通路の開口と連通した吸着部の孔から排気すると、ワークの下側が正圧になり、ワークを吸着部から解放することができる。 In order to solve the above-mentioned problem, the invention of claim 1 includes a conductive base and an adsorbing portion fixed to the surface of the base, and the conductive base has an air passage opened on the surface, The suction part is a vacuum chuck having a suction and release hole communicating with the opening of the air passage, a plurality of embosses, and an outer peripheral wall part having a height equal to these embosses. It is made of a conductive resin sheet and is fixed to the surface of the base via a conductive adhesive resin sheet.
With such a configuration, when the work is placed on the embossing of the suction portion and the outer peripheral wall portion, when the air passage is set to a negative pressure, the air under the work passes through the hole communicating with the opening of the air passage. The workpiece is sucked and the workpiece is adsorbed on the plurality of embosses and the outer peripheral wall. In such a state, desired machining can be performed on the workpiece.
During this processing, there is a possibility that static electricity may be charged on the workpiece, but the vacuum chuck of the present invention has a structure in which the suction portion formed of the conductive resin sheet is fixed to the surface of the base via the conductive adhesive resin sheet Therefore, the static electricity generated in the work flows from the adsorption part to the base side through the adhesive resin sheet. As a result, the workpiece can be prevented from being charged.
Further, when a workpiece is processed on a plurality of embosses, dust may be generated due to contact between the workpiece and the emboss. However, in the vacuum chuck of the present invention, since the adsorbing portion is made of a low dusting conductive resin sheet, dusting due to contact between the work and the emboss hardly occurs.
When machining is completed, if the air passage is brought to a positive pressure and the air is exhausted from the hole of the suction portion communicating with the opening of the air passage, the lower side of the workpiece becomes a positive pressure, and the workpiece can be released from the suction portion.

　請求項２の発明は、請求項１に記載の真空チャックにおいて、導電性樹脂シートは、カーボンナノチューブ入りのシートである構成とした。 According to a second aspect of the present invention, in the vacuum chuck according to the first aspect, the conductive resin sheet is a sheet containing carbon nanotubes.

　請求項３の発明は、請求項１又は請求項２に記載の真空チャックにおいて、シートは、導電性のポリイミドを素材とするシートである構成とした。
　かかる構成により、カーボンナノチューブ入りのシートが、導電性のポリイミドを素材としているので、上記した従来のＰＥＥＫに比べて、非常に微細なエンボスを、エッチングによって形成することができる。したがって、ワークとエンボスとの接触面積を非常に小さくすることができ、この結果、発塵防止効果をさらに高めることができる。また、導電性のポリイミドの表面抵抗は、ＰＥＥＫに比べて、バラツキがなく安定しており、しかも、抵抗値が非常に低いので、ワークに生じた静電気を素早く排出することができる。さらに、導電性のポリイミドの機械的強度は、ＰＥＥＫに比べて、高く、耐久性に優れている。 According to a third aspect of the present invention, in the vacuum chuck according to the first or second aspect, the sheet is a sheet made of conductive polyimide.
With this configuration, since the sheet containing carbon nanotubes is made of conductive polyimide, it is possible to form a very fine emboss by etching compared to the above-described conventional PEEK. Therefore, the contact area between the workpiece and the emboss can be made very small, and as a result, the dust generation preventing effect can be further enhanced. Further, the surface resistance of the conductive polyimide is stable with no variation compared to PEEK, and the resistance value is very low, so that static electricity generated on the workpiece can be quickly discharged. Furthermore, the mechanical strength of the conductive polyimide is higher than PEEK and is excellent in durability.

　請求項４の発明は、請求項３に記載の真空チャックにおいて、絶縁性のポリイミドを導電性のポリイミドの下に配して、吸着部をこの絶縁性のポリイミドと導電性のポリイミドとの二層構造にし、導電性樹脂シートを介して、ベースに固着すると共に、導電性のポリイミドにのみ、複数のエンボスと外周壁部とを形成した構成とする。 According to a fourth aspect of the present invention, in the vacuum chuck according to the third aspect, the insulating polyimide is disposed under the conductive polyimide, and the adsorbing portion is formed of two layers of the insulating polyimide and the conductive polyimide. The structure is fixed to the base via a conductive resin sheet, and a plurality of embosses and outer peripheral wall portions are formed only on conductive polyimide.

　請求項５の発明は、請求項１ないし請求項４のいずれに記載の真空チャックにおいて、
　吸着部とベースとが上下方向を向く中心軸の回りで一体回転するスピンチャックである構成とした。 The invention of claim 5 is the vacuum chuck according to any one of claims 1 to 4,
The suction part and the base are configured to be a spin chuck that rotates integrally around a central axis that faces in the vertical direction.

　以上詳しく説明したように、この発明の真空チャックによれば、ワークの帯電を防止することができるだけでなく、発塵を効果的に防止することができる。
　特に、請求項３～５の発明によれば、エッチングによるエンボスの微細加工が可能なので、発塵防止効果をさらに高めることができる。また、表面抵抗の小さな導電性のポリイミドによって、ワークに生じた静電気を素早く排出することができる。さらに、機械的強度の高い導電性のポリイミドによって、チャックの耐久性の向上を図ることができる。 As described in detail above, according to the vacuum chuck of the present invention, not only can the workpiece be prevented from being charged, but also dust can be effectively prevented.
In particular, according to the inventions of claims 3 to 5, since the embossing can be finely processed by etching, the dust generation preventing effect can be further enhanced. Moreover, the static electricity which generate | occur | produced on the workpiece | work can be quickly discharged | emitted with the conductive polyimide with small surface resistance. Furthermore, the durability of the chuck can be improved by the conductive polyimide having high mechanical strength.

この発明の第１実施例に係る真空チャックを示す分解斜視図である。1 is an exploded perspective view showing a vacuum chuck according to a first embodiment of the present invention. 真空チャックの概略断面図である。It is a schematic sectional drawing of a vacuum chuck. 吸着部と外周壁部の高さの関係を示す部分拡大断面図である。It is a partial expanded sectional view which shows the relationship between the height of an adsorption | suction part and an outer peripheral wall part. 導電性のポリイミドの吸着部を製造する方法を示す工程図である。It is process drawing which shows the method of manufacturing the adsorption | suction part of electroconductive polyimide. 真空チャックの作用及び効果を説明するための概略断面図である。It is a schematic sectional drawing for demonstrating the effect | action and effect of a vacuum chuck. 吸着部によるウエハの吸着状態を示す部分拡大断面図である。It is a partial expanded sectional view which shows the adsorption state of the wafer by an adsorption | suction part. この発明の第２実施例に係る真空チャックの概略断面図である。It is a schematic sectional drawing of the vacuum chuck which concerns on 2nd Example of this invention. 吸着部３の構造を示す部分拡大断面図である。FIG. 4 is a partial enlarged cross-sectional view showing the structure of the suction unit 3. 二層構造の吸着部を製造する方法を示す工程図である。It is process drawing which shows the method of manufacturing the adsorption part of a two-layer structure.

　以下、この発明の最良の形態について図面を参照して説明する。 Hereinafter, the best mode of the present invention will be described with reference to the drawings.

　図１は、この発明の第１実施例に係る真空チャックを示す分解斜視図であり、図２は、真空チャックの概略断面図である。
　図１に示すように、この実施例の真空チャック１は、ベース２と吸着部３とを備えている。 FIG. 1 is an exploded perspective view showing a vacuum chuck according to a first embodiment of the present invention, and FIG. 2 is a schematic sectional view of the vacuum chuck.
As shown in FIG. 1, the vacuum chuck 1 of this embodiment includes a base 2 and a suction portion 3.

　　ベース２は、導電性を有するアルミニュウムを素材としており、本体部２１と軸部２２とを備えている。
　本体部２１は、肉厚の円板状を成し、その中心に、表面２１ａに開口する空気通路２４有している。
　軸部２２は、図２に示すように、本体部２１と一体をなし、本体部２１からの空気通路２４が軸方向に通っている。また、この軸部２２は、モータ１０に機械的に連結しており、モータ１０によって回転する。 The base 2 is made of conductive aluminum and includes a main body portion 21 and a shaft portion 22.
The main body 21 has a thick disk shape, and has an air passage 24 that opens to the surface 21a at the center thereof.
As shown in FIG. 2, the shaft portion 22 is integrated with the main body portion 21, and the air passage 24 from the main body portion 21 passes in the axial direction. The shaft portion 22 is mechanically connected to the motor 10 and is rotated by the motor 10.

　吸着部３は、図１に示すように、外径が本体部２１の外径と等しく設定された薄い円板体であり、その表面３ａに、複数のエンボス３０を有し、外周縁部に、リング状の外周壁部３３を有している。
　このような吸着部３は、図２に示すように、ベース２の外周壁部３３内に収納され、接着樹脂シート４を介して本体部２１の表面２１ａに接着されている。
　図３は、吸着部３と外周壁部３３との高さの関係を示す部分拡大断面図である。
　図３に示すように、この実施例では、吸着部３のエンボス３０の上面３０ａ迄の高さを外周壁部３３の高さＨと等しくなるように設定している。
　このような吸着部３と接着樹脂シート４との中心には、図１及び図２に示すように、吸着及び解放用の孔２６と孔２５とが穿設され、これら孔２５，２６が、ベース２の空気通路２４に連通している。 As shown in FIG. 1, the adsorbing part 3 is a thin disk body whose outer diameter is set to be equal to the outer diameter of the main body part 21, and has a plurality of embosses 30 on the surface 3a thereof. The ring-shaped outer peripheral wall portion 33 is provided.
As shown in FIG. 2, the suction portion 3 is accommodated in the outer peripheral wall portion 33 of the base 2 and bonded to the surface 21 a of the main body portion 21 via the adhesive resin sheet 4.
FIG. 3 is a partial enlarged cross-sectional view showing the height relationship between the suction portion 3 and the outer peripheral wall portion 33.
As shown in FIG. 3, in this embodiment, the height to the upper surface 30 a of the emboss 30 of the suction portion 3 is set to be equal to the height H of the outer peripheral wall portion 33.
As shown in FIG. 1 and FIG. 2, suction and release holes 26 and 25 are formed in the center of the suction part 3 and the adhesive resin sheet 4. It communicates with the air passage 24 of the base 2.

　以上の構成から明らかなように、この実施例の真空チャック１は、ウエハＷを空気通路２４及び孔２５，２６を通じて吸引保持し、且つモータ１０で回転するスピンチャックである。 As is apparent from the above configuration, the vacuum chuck 1 of this embodiment is a spin chuck that sucks and holds the wafer W through the air passage 24 and the holes 25 and 26 and is rotated by the motor 10.

　このような真空チャック１において、吸着部３を低発塵性の導電性樹脂シートで形成した。具体的には、導電性樹脂シートを、カーボンナノチューブ入りのシートで形成した。特に、この実施例では、カーボンナノチューブ入りのシートを導電性のポリイミドを素材とするシートで形成し、吸着部３の低発塵性を確保した。このような樹脂シートとして、絶縁性のポリイミドと導電性のポリイミドとの二層構造を成すデュポン社製の「カプトンＲＳ」（登録商標）の内、導電性のポリイミドを採用することができる。このポリイミドは、厚さが２５μｍにすることができ、その表面抵抗は、１００Ω／ｓｑである。
　この吸着部３は、導電性の接着樹脂シート４によってベース２に接着されている。このような導電性の接着樹脂シート４としては、タツタシステム・エレクトロニクス社製の「ＣＢＦ－３００」を採用することができる。この接着樹脂シート４は、Ｎｉ－ＳＵＳ３０４に対する接続抵抗が１Ωであり、非常に抵抗値が低い。
　また、この導電性ポリイミドの引張強度は、約１３０ＭＰａであり、ＰＥＥＫに比べて高く、耐久性に優れている。 In such a vacuum chuck 1, the suction portion 3 is formed of a low dusting conductive resin sheet. Specifically, the conductive resin sheet was formed of a sheet containing carbon nanotubes. In particular, in this example, a sheet containing carbon nanotubes was formed of a sheet made of conductive polyimide, and the low dust generation property of the adsorption portion 3 was ensured. As such a resin sheet, a conductive polyimide can be adopted among “Kapton RS” (registered trademark) manufactured by DuPont which forms a two-layer structure of an insulating polyimide and a conductive polyimide. This polyimide can have a thickness of 25 μm, and its surface resistance is 100 Ω / sq.
The suction portion 3 is bonded to the base 2 with a conductive adhesive resin sheet 4. As such a conductive adhesive resin sheet 4, "CBF-300" manufactured by Tatsuta System Electronics Co., Ltd. can be used. This adhesive resin sheet 4 has a connection resistance to Ni-SUS304 of 1Ω and a very low resistance value.
Further, the tensile strength of this conductive polyimide is about 130 MPa, which is higher than PEEK and excellent in durability.

　吸着部３は、エッチングによって形成することができる。
　図４は、導電性のポリイミドの吸着部３を製造する方法を示す工程図である。
　すなわち、図４の（ａ）に示すように、レジスト１１を加工前の導電性ポリイミド３′上に散点状に配すると共に、外周縁部にリング状のレジスト１１′を配した。そして、これらレジスト１１，１１′の上からエッチングすることで、図４の（ｂ）に示すように、複数のエンボス３０とリング状の外周壁部３３とを有した吸着部３を形成することができる。
　吸着部３の導電性樹脂シートが、導電性のポリイミドを素材としているので、上記のようにエッチングすることができ、この結果、従来のＰＥＥＫに比べて、非常に微細なエンボス３０を形成することができる。例えば、高さが２５μｍで直径が０．５ｍｍの微細なエンボス３０を形成することができる。 The adsorption part 3 can be formed by etching.
FIG. 4 is a process diagram showing a method for manufacturing the conductive polyimide adsorption portion 3.
That is, as shown in FIG. 4A, the resist 11 is arranged in a dotted pattern on the conductive polyimide 3 ′ before processing, and a ring-shaped resist 11 ′ is arranged on the outer peripheral edge. Etching from above the resists 11 and 11 'forms the adsorbing portion 3 having a plurality of embosses 30 and a ring-shaped outer peripheral wall portion 33 as shown in FIG. Can do.
Since the conductive resin sheet of the adsorption portion 3 is made of conductive polyimide, it can be etched as described above, and as a result, a very fine emboss 30 can be formed as compared with the conventional PEEK. Can do. For example, a fine emboss 30 having a height of 25 μm and a diameter of 0.5 mm can be formed.

　次に、この実施例の真空チャックが示す作用及び効果について説明する。
　図５は、真空チャック１の作用及び効果を説明するための概略断面図であり、図６は、吸着部３によるウエハＷの吸着状態を示す部分拡大断面図である。
　図５に示すように、ワークとしてのウエハＷを吸着部３上に載置すると、ウエハＷが吸着部３の複数のエンボス３０上に載る。
　かかる状態で、図示しない真空ポンプにより、矢印で示すように、ベース２の空気通路２４内の空気Ａを引くと、ウエハＷ下側及び孔２５，２６内が負圧になる。これにより、図６に示すように、ウエハＷの裏面が、複数のエンボス３０の上面３０ａと外周壁部３３の上面３３ａとに気密に吸着された状態になる。
　この状態で、図５に示すモータ１０を駆動して真空チャック１全体を回転させ、回転するウエハＷに対して所望の加工を行うことができる。 Next, operations and effects of the vacuum chuck of this embodiment will be described.
FIG. 5 is a schematic cross-sectional view for explaining the operation and effect of the vacuum chuck 1, and FIG.
As shown in FIG. 5, when the wafer W as a workpiece is placed on the suction unit 3, the wafer W is placed on the plurality of embosses 30 of the suction unit 3.
In this state, when the air A in the air passage 24 of the base 2 is drawn by a vacuum pump (not shown) as shown by an arrow, the lower side of the wafer W and the inside of the holes 25 and 26 become negative pressure. As a result, as shown in FIG. 6, the back surface of the wafer W is airtightly adsorbed to the upper surfaces 30 a of the plurality of embosses 30 and the upper surfaces 33 a of the outer peripheral wall portions 33.
In this state, the motor 10 shown in FIG. 5 is driven to rotate the entire vacuum chuck 1 and desired processing can be performed on the rotating wafer W.

　この加工時に、静電気がウエハＷに帯電することがある。しかし、この実施例の真空チャック１は、導電性樹脂シートで形成された吸着部３を導電性の接着樹脂シートを介して導電性のベース２の表面に固着した構成になっている。このため、ウエハＷに発生した静電気は、吸着部３から接着樹脂シート４を介してベース２側に流れるので、ウエハＷが帯電することはほとんどない。
　さらに、吸着部３を導電性のポリイミドで形成しているので、その表面抵抗が、ＰＥＥＫに比べて、バラツキがなく安定しており、しかも非常に低い。このため、ウエハＷの帯電防止効果がさらに高まる。
　ところで、ウエハＷを複数のエンボス３０上で加工を行うと、ウエハＷとエンボス３０との接触によって、発塵が生じるおそれがある。しかし、この実施例の真空チャック１では、吸着部３を、低発塵性の導電性ポリイミドで形成してあるので、ウエハＷとエンボス３０との接触による発塵はほとんど生じない。
　また、エンボス３０をエッチングによって微細加工するので、ウエハＷとエンボス３０との接触面積が非常に小さく、発塵防止効果がさらに高められている。 During this processing, static electricity may be charged on the wafer W. However, the vacuum chuck 1 of this embodiment has a configuration in which the suction portion 3 formed of a conductive resin sheet is fixed to the surface of the conductive base 2 via a conductive adhesive resin sheet. For this reason, the static electricity generated on the wafer W flows from the adsorption portion 3 to the base 2 side via the adhesive resin sheet 4, so that the wafer W is hardly charged.
Furthermore, since the adsorption | suction part 3 is formed with electroconductive polyimide, its surface resistance is stable without variation compared with PEEK, and is very low. For this reason, the antistatic effect of the wafer W is further enhanced.
By the way, when the wafer W is processed on the plurality of embosses 30, dust may be generated due to contact between the wafer W and the embosses 30. However, in the vacuum chuck 1 of this embodiment, since the adsorbing portion 3 is formed of low-dust conductive polyimide, dust generation due to contact between the wafer W and the emboss 30 hardly occurs.
Further, since the emboss 30 is finely processed by etching, the contact area between the wafer W and the emboss 30 is very small, and the dust generation preventing effect is further enhanced.

　加工が終了したときには、図示しない真空ポンプにより、ベース２の空気通路２４内に空気を入れる。すると、ウエハＷ下側及び孔２５，２６内が正圧になり、ウエハＷが複数のエンボス３０と外周壁部３３とから解放された状態になる。 When the processing is completed, air is introduced into the air passage 24 of the base 2 by a vacuum pump (not shown). Then, the lower side of the wafer W and the inside of the holes 25 and 26 become positive pressure, and the wafer W is released from the plurality of embosses 30 and the outer peripheral wall portion 33.

　次に、この発明の第２実施例について説明する。
　図７は、この発明の第２実施例に係る真空チャックの概略断面図であり、図８は、吸着部３の構造を示す部分拡大断面図である。
　この実施例は、吸着部３を二層構造にした点が、上記第１実施例と異なる。
　すなわち、図７に示すように、吸着部３は、絶縁性ポリイミド３１と導電性ポリイミド３２との二層構造になっており、接着樹脂シート４を介して、ベース２の本体部２１に接着されている。この実施例では、絶縁性ポリイミド３１と導電性ポリイミド３２として、前記デュポン社製の「カプトンＲＳ」（登録商標）を採用し、前記タツタシステム・エレクトロニクス社製の「ＣＢＦ－３００」である接着樹脂シート４を介して接着した。
　詳しくは、図８に示すように、複数の溝３１ａを、絶縁性ポリイミド３１に設けることで、溝３１ａ以外の部分に、複数の台部３１ｂを形成している。導電性ポリイミド３２は、このような絶縁性ポリイミド３１の溝３１ａ内にその大部分を埋没させた状態で、この絶縁性ポリイミド３１の上に積層されている。これにより、各エンボス３０が各台部３１ｂの上に乗り上がった状態で突出している。 Next explained is the second embodiment of the invention.
FIG. 7 is a schematic sectional view of a vacuum chuck according to the second embodiment of the present invention, and FIG. 8 is a partially enlarged sectional view showing the structure of the suction portion 3.
This embodiment differs from the first embodiment in that the suction part 3 has a two-layer structure.
That is, as shown in FIG. 7, the adsorbing portion 3 has a two-layer structure of an insulating polyimide 31 and a conductive polyimide 32 and is adhered to the main body portion 21 of the base 2 via the adhesive resin sheet 4. ing. In this embodiment, “Kapton RS” (registered trademark) manufactured by DuPont is used as the insulating polyimide 31 and the conductive polyimide 32, and the adhesive resin is “CBF-300” manufactured by Tatsuta System Electronics. Bonded via sheet 4.
Specifically, as shown in FIG. 8, by providing a plurality of grooves 31a in the insulating polyimide 31, a plurality of base portions 31b are formed in portions other than the grooves 31a. The conductive polyimide 32 is laminated on the insulating polyimide 31 in a state in which most of the conductive polyimide 32 is buried in the groove 31 a of the insulating polyimide 31. Thereby, each emboss 30 protrudes in the state which got on each base part 31b.

　吸着部３は、エッチングとプレスによって形成する。
　図９は、二層構造の吸着部３を製造する方法を示す工程図である。
　まず、図９の（ａ）に示すように、加工前の絶縁性ポリイミド３１の表面にエンボス用のレジスト１２と外周壁部用のレジスト１２′を配置した後、エッチングによって、図９の（ｂ）に示すように、溝３１ａと台部３１ｂ，３１ｂ′とを形成する。
　しかる後、図９の（ｃ）に示すように、加工前の導電性ポリイミド３２を絶縁性ポリイミド３１の上に載置する。かかる状態で、図９の（ｄ）に示すように、エンボス３０に対応した複数の穴１３ａと外周壁部３３に対応したリング穴１３ａ′とを有する型枠１３を、図示しないプレス機によって、導電性ポリイミド３２の上から押圧する。
　これにより、導電性ポリイミド３２の大部分が、絶縁性ポリイミド３１の溝３１ａ内に埋没して、エンボス３０が台部３１ｂ上で突出すると共に、外周壁部３３が台部３１ｂ′上でリング状に突出する。この結果、図９の（ｅ）に示すように、複数のエンボス３０とリング状の外周壁部３３とを有した二層構造の吸着部３が形成される。
　その他の構成、作用及び効果は、上記第１実施例と同様であるので、その記載は省略する。 The adsorption part 3 is formed by etching and pressing.
FIG. 9 is a process diagram showing a method of manufacturing the adsorption portion 3 having a two-layer structure.
First, as shown in FIG. 9A, an embossing resist 12 and an outer peripheral wall resist 12 'are arranged on the surface of the insulating polyimide 31 before processing, and then etching is performed as shown in FIG. ), Grooves 31a and pedestals 31b and 31b 'are formed.
Thereafter, as shown in FIG. 9C, the conductive polyimide 32 before processing is placed on the insulating polyimide 31. In this state, as shown in FIG. 9 (d), a mold 13 having a plurality of holes 13a corresponding to the emboss 30 and a ring hole 13a 'corresponding to the outer peripheral wall 33 is formed by a press machine (not shown). Press from above the conductive polyimide 32.
As a result, most of the conductive polyimide 32 is buried in the groove 31a of the insulating polyimide 31, the emboss 30 protrudes on the base portion 31b, and the outer peripheral wall portion 33 forms a ring shape on the base portion 31b '. Protrusively. As a result, as shown in FIG. 9E, a two-layered adsorption portion 3 having a plurality of embosses 30 and a ring-shaped outer peripheral wall portion 33 is formed.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

　１…真空チャック、　２…ベース、　３…吸着部、　３ａ，２１ａ…表面、　４…接着樹脂シート、　１０…モータ、　１１，１２…レジスト、　１３…型枠、　１３ａ…穴、　２１…本体部、　２２…軸部、　３３…外周壁部、　３０ａ，３３ａ…上面、　２４…空気通路、　２５，２６…孔、　３０…エンボス、　３１…絶縁性ポリイミド、　３１ａ…溝、　３１ｂ…台部、　３２…導電性ポリイミド、　Ｗ…ウエハ。 DESCRIPTION OF SYMBOLS 1 ... Vacuum chuck, 2 ... Base, 3 ... Adsorption part, 3a, 21a ... Surface, 4 ... Adhesive resin sheet, 10 ... Motor, 11, 12 ... Resist, 13 ... Formwork, 13a ... Hole, 21 ... Main part, 22 ... shaft portion, 33 ... outer peripheral wall portion, 30a, 33a ... upper surface, 24 ... air passage, 25,26 ... hole, 30 ... emboss, 31 ... insulating polyimide, 31a ... groove, 31b ... base, 32 ... conductive Polyimide, W ... wafer.

Claims (5)

　導電性のベースとこのベースの表面に固着された吸着部とを備え、上記導電性のベースが、表面で開口した空気通路を有し、上記吸着部が、上記空気通路の開口と連通した吸着及び解放用の孔，複数のエンボス，及びこれらエンボスと等しい高さの外周壁部を有する真空チャックであって、
　上記吸着部を、低発塵性の導電性樹脂シートで形成し、導電性の接着樹脂シートを介して上記ベースの表面に固着した、
　ことを特徴とする真空チャック。 A conductive base and an adsorbing portion fixed to the surface of the base, the conductive base having an air passage opened at the surface, and the adsorbing portion communicated with the opening of the air passage; And a vacuum chuck having a release hole, a plurality of embossments, and an outer peripheral wall portion having a height equal to these embossments,
The adsorbing part is formed of a low dusting conductive resin sheet, and is fixed to the surface of the base via a conductive adhesive resin sheet.
A vacuum chuck characterized by that. 　請求項１に記載の真空チャックにおいて、
　上記導電性樹脂シートは、カーボンナノチューブ入りのシートである、
　ことを特徴とする真空チャック。 The vacuum chuck according to claim 1, wherein
The conductive resin sheet is a sheet containing carbon nanotubes,
A vacuum chuck characterized by that. 　請求項１又は請求項２に記載の真空チャックにおいて、
　上記シートは、導電性のポリイミドを素材とするシートである、
　ことを特徴とする真空チャック。 The vacuum chuck according to claim 1 or 2,
The sheet is a sheet made of conductive polyimide,
A vacuum chuck characterized by that. 　請求項３に記載の真空チャックにおいて、
　絶縁性のポリイミドを上記導電性のポリイミドの下に配して、上記吸着部をこの絶縁性のポリイミドと上記導電性のポリイミドとの二層構造にし、上記導電性樹脂シートを介して、上記ベースに固着すると共に、
　上記導電性のポリイミドにのみ、上記複数のエンボスと外周壁部とを形成した、
　ことを特徴とする真空チャック。 The vacuum chuck according to claim 3,
An insulating polyimide is arranged under the conductive polyimide, and the adsorbing portion is formed into a two-layer structure of the insulating polyimide and the conductive polyimide, and the base is interposed through the conductive resin sheet. And stick to
Only the conductive polyimide, the plurality of embossed and outer peripheral wall portions were formed,
A vacuum chuck characterized by that. 　請求項１ないし請求項４のいずれに記載の真空チャックにおいて、
　上記吸着部とベースとが上記上下方向を向く中心軸の回りで一体回転するスピンチャックである、
　ことを特徴とする真空チャック。 The vacuum chuck according to any one of claims 1 to 4,
A spin chuck in which the suction part and the base rotate integrally around a central axis facing the vertical direction;
A vacuum chuck characterized by that.
PCT/JP2010/071458 2009-12-25 2010-12-01 Vacuum chuck Ceased WO2011077911A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011547434A JPWO2011077911A1 (en) 2009-12-25 2010-12-01 Vacuum chuck

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-294424 2009-12-25
JP2009294424 2009-12-25

Publications (1)

Publication Number Publication Date
WO2011077911A1 true WO2011077911A1 (en) 2011-06-30

Family

ID=44195448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/071458 Ceased WO2011077911A1 (en) 2009-12-25 2010-12-01 Vacuum chuck

Country Status (3)

Country Link
JP (1) JPWO2011077911A1 (en)
TW (1) TW201131693A (en)
WO (1) WO2011077911A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130126488A (en) * 2012-05-10 2013-11-20 가부시기가이샤 디스코 Retaining table
JP2016058433A (en) * 2014-09-05 2016-04-21 株式会社ディスコ Chuck table
CN114927459A (en) * 2022-07-19 2022-08-19 上海隐冠半导体技术有限公司 Multi-gas-path adsorption device
JP7810957B1 (en) 2024-12-13 2026-02-04 住友電気工業株式会社 Support member, wafer holder, and method for manufacturing the support member

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7106298B2 (en) * 2018-03-05 2022-07-26 株式会社ディスコ CHUCK TABLE, CUTTING DEVICE, AND CHUCK TABLE MODIFICATION METHOD OF CUTTING DEVICE

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107131A (en) * 1996-09-25 1998-04-24 Teikoku Seiki Kk Suction table and element thereof
JPH10150097A (en) * 1996-11-21 1998-06-02 Dainippon Screen Mfg Co Ltd Spin chuck for substrate processing equipment
JP2001267403A (en) * 2000-03-21 2001-09-28 Nhk Spring Co Ltd Semiconductor wafer heating / cooling device
JP2003001182A (en) * 2001-04-17 2003-01-07 Tokyo Electron Ltd Coating film forming apparatus and spin chuck
JP2003249540A (en) * 2002-02-22 2003-09-05 Nippon Futsuso Kogyo Kk Work holder
JP2008034481A (en) * 2006-07-26 2008-02-14 Tohoku Univ Substrate stage and heat treatment apparatus
JP2009055017A (en) * 2007-07-30 2009-03-12 Kyocera Corp Holding jig and suction device using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107131A (en) * 1996-09-25 1998-04-24 Teikoku Seiki Kk Suction table and element thereof
JPH10150097A (en) * 1996-11-21 1998-06-02 Dainippon Screen Mfg Co Ltd Spin chuck for substrate processing equipment
JP2001267403A (en) * 2000-03-21 2001-09-28 Nhk Spring Co Ltd Semiconductor wafer heating / cooling device
JP2003001182A (en) * 2001-04-17 2003-01-07 Tokyo Electron Ltd Coating film forming apparatus and spin chuck
JP2003249540A (en) * 2002-02-22 2003-09-05 Nippon Futsuso Kogyo Kk Work holder
JP2008034481A (en) * 2006-07-26 2008-02-14 Tohoku Univ Substrate stage and heat treatment apparatus
JP2009055017A (en) * 2007-07-30 2009-03-12 Kyocera Corp Holding jig and suction device using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130126488A (en) * 2012-05-10 2013-11-20 가부시기가이샤 디스코 Retaining table
JP2013236002A (en) * 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd Holding table
US9463542B2 (en) 2012-05-10 2016-10-11 Disco Corporation Holding table
KR101911962B1 (en) * 2012-05-10 2018-10-25 가부시기가이샤 디스코 Holding table
JP2016058433A (en) * 2014-09-05 2016-04-21 株式会社ディスコ Chuck table
CN114927459A (en) * 2022-07-19 2022-08-19 上海隐冠半导体技术有限公司 Multi-gas-path adsorption device
JP7810957B1 (en) 2024-12-13 2026-02-04 住友電気工業株式会社 Support member, wafer holder, and method for manufacturing the support member

Also Published As

Publication number Publication date
TW201131693A (en) 2011-09-16
JPWO2011077911A1 (en) 2013-05-02

Similar Documents

Publication Publication Date Title
JP4825220B2 (en) Electrode sheet for electrostatic chuck and electrostatic chuck
JP5094863B2 (en) Substrate adsorption apparatus and manufacturing method thereof
KR101559947B1 (en) Electrostatic chuck, and method for manufacturing the chuck
WO2011077911A1 (en) Vacuum chuck
JP4417588B2 (en) Metal dome sheet
WO2012005294A1 (en) Electrostatic chuck device and production method for same
JPWO2008108146A1 (en) Electrostatic chuck
JPH1022184A (en) Substrate bonding equipment
JP4976915B2 (en) Electrostatic chuck and method of manufacturing electrostatic chuck
JP2004259792A (en) Suction device, sheet for suction device, polishing device, semiconductor device and semiconductor device manufacturing method
JP2024000905A (en) Substrate fixing device and method for manufacturing the substrate fixing device
JP2004014603A (en) Suction chuck
JP2012028900A (en) Capacitor microphone
KR102093991B1 (en) Elastomer rubber diaphragm type electro static chuck and fabrication method for the same
JP2007324449A (en) Suction pad for semiconductor wafer
JP5459829B2 (en) Suction board
JP2021122896A (en) Elastic membrane
JP2009246325A (en) Electrostatic chuck
CN102039521A (en) Electrostatic chuck assembling device
JP4611292B2 (en) Semiconductor manufacturing equipment
CN216967413U (en) Retainer ring and substrate grinding device comprising same
JP7564586B1 (en) Substrate holding device and substrate processing device
WO2015146472A1 (en) Protector for pickup device for wafers having micro-protrusions and pickup device for wafers having micro-protrusions
JP2019012808A (en) Chuck table
JP2011176149A (en) Workpiece holding device and embossing forming method of the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10839146

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2011547434

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10839146

Country of ref document: EP

Kind code of ref document: A1