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WO2011070736A1 - Bande de suppression de bruit - Google Patents

Bande de suppression de bruit Download PDF

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Publication number
WO2011070736A1
WO2011070736A1 PCT/JP2010/006881 JP2010006881W WO2011070736A1 WO 2011070736 A1 WO2011070736 A1 WO 2011070736A1 JP 2010006881 W JP2010006881 W JP 2010006881W WO 2011070736 A1 WO2011070736 A1 WO 2011070736A1
Authority
WO
WIPO (PCT)
Prior art keywords
noise suppression
suppression tape
adherend
conductor
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/006881
Other languages
English (en)
Japanese (ja)
Inventor
雅治 今里
博 鳥屋尾
小林　直樹
徳昭 安道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2011545065A priority Critical patent/JP5699937B2/ja
Publication of WO2011070736A1 publication Critical patent/WO2011070736A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Definitions

  • Recent electronic devices particularly high-speed and high-performance electronic devices such as personal computers and workstations, have a problem of generating noise such as harmonic components of clock signals and radiating them outside the device.
  • the radiated noise may interfere with the normal operation of other electronic devices. Therefore, a means for suppressing noise emission from the electronic device is desired.
  • FIG. 6 is a perspective view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-6.
  • FIG. 6 is an equivalent circuit diagram of a unit cell of an EBG structure constituted by the noise suppression tape of Embodiment 1-6.
  • FIG. 3 is a cross-sectional view schematically showing an example of a noise suppression tape and an adherend of Embodiment 2-1. It is sectional drawing which shows typically an example and the to-be-adhered thing of the noise suppression tape of Embodiment 2-2.
  • FIG. 6 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 2-4 and an adherend.
  • “repetition” of the unit cell A includes a case where a part of the configuration is missing in any unit cell A.
  • “repetition” includes a case where the unit cell A is partially missing.
  • “periodicity” a part of the constituent elements (the island-like conductor 1 and the connecting member 3) are shifted in some unit cells A, or the arrangement of some unit cells A itself is shifted. Cases are also included. In other words, even when the periodicity in the strict sense collapses, if the unit cell A is repeatedly arranged, the characteristics as a metamaterial can be obtained, so that “periodicity” has some defect. Permissible.
  • the adhesive layer 18 can be made of, for example, an adhesive.
  • the raw material of the adhesive is not particularly limited, and so-called adhesive raw materials such as natural rubber, acrylic resin, and silicone can be used.
  • Such an adhesive layer 18 may contain a plurality of conductive fillers.
  • the connection member 13 needs to be electrically connected to the adherend surface 21 in a state where the noise suppression tape 10 is attached to the adherend surface 21 having conductivity of the adherend 20. Therefore, if a plurality of conductive fillers are mixed in the adhesive layer 18, the above conduction can be realized more reliably. Note that the thickness of the adhesive layer 18 is a matter of design.
  • the connection member 13 of the embodiment 1-2 includes a conductive first connection member 13A, a conductive second connection member 13B, and a conductive third connection member 13C.
  • One end of the first connecting member 13 ⁇ / b> A penetrates the second surface 17 of the dielectric layer 15 and also penetrates the adhesive layer 18, and is exposed from the surface of the adhesive layer 18 that contacts the adherend 20.
  • the first connection member 13A is electrically connected to the second connection member 13B via the other end side.
  • the other end of the first connecting member 13 ⁇ / b> A may penetrate the first surface 16 of the dielectric layer 15.
  • the first connecting member 13 ⁇ / b> A passes through a hole provided in the island-shaped conductor 11 in a state of non-contact with the island-shaped conductor 11.
  • the second connecting member 13 ⁇ / b> B is provided so as to be electrically connected to the first connecting portion 13 ⁇ / b> A and to face the island-shaped conductor 11.
  • the planar shape of the second connecting member 13B may be a straight line, a curved line, a spiral shape, or other shapes.
  • the other end of the second connecting member 13B is an open end.
  • FIG. 5D and 5E an example at the time of making the 2nd connection member 13B into a spiral shape is shown to FIG. 5D and 5E.
  • 5D is a cross-sectional view of the roll of FIG. 5E
  • FIG. 5E is a plan view of FIG. 5D viewed from the top to the bottom in the drawing.
  • a non-conductive surface layer (not shown) is further provided to cover the first surface (the upper surface in the drawing) of the plurality of island-shaped conductors 11 and the dielectric layer 15 (1) separated from each other. Also good.
  • FIG. 6B is a cross-sectional view illustrating an example of a manufacturing process of the noise suppression tape 10 illustrated in FIG. 6A.
  • a copper foil 13B is formed on the first surface of a substrate (dielectric layer 15 (1)) such as a glass epoxy substrate or a fluororesin substrate. Also, the copper foil 11 is formed on the first surface of another substrate (dielectric layer 15 (2)) such as a glass epoxy substrate or a fluororesin substrate.
  • a pattern is formed by selectively etching a part of the copper foil 13B by photolithography and etching. Further, a pattern (a plurality of island-like conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching.
  • the wiring 1A functions as an open stub, and the portion of the sheet-like conductor 2 facing the wiring 1A and the wiring 1A form a transmission line, for example, a microstrip line.
  • the plurality of unit cells A have the same structure and are arranged in the same direction.
  • the island-like conductor 1 and the opening 1B are square and are arranged so that the centers overlap each other.
  • the wiring 1A extends from the substantially center of one side of the opening 1B substantially perpendicular to the side.
  • this EBG structure noise propagation on the surface of the sheet-like conductor 2 can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 constitute a capacitance. That is, according to the EBG structure of Embodiment 1-6 constituting this EBG structure, noise is propagated on the surface of the adherend surface 21 constituting the sheet-like conductor 2 in the EBG structure. Can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.
  • the noise suppression tape 10 of Embodiment 2-1 can be manufactured according to the method of manufacturing the noise suppression tape 10 described in Embodiment 1. Therefore, detailed description of the manufacturing method here is omitted.
  • Embodiment 2-4 mainly relates to claims 1, 4, 9, 11 to 17, 23.
  • the noise suppression tape based on the configuration of Embodiment 2 includes an EBG structure having two or more types of EBG structures. Various EBG structures are arranged periodically.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

L'invention concerne une bande de suppression de bruit comprenant : une couche diélectrique (15) comprenant un diélectrique ; un premier conducteur qui comprend un matériau conducteur, dont une partie au moins possède une structure répétitive, et qui est disposé dans la couche diélectrique (15) ou sur une première surface (16) de la couche diélectrique (15) de manière à être opposé à une seconde surface (17), ladite seconde surface étant la surface sur le côté de la couche diélectrique (15) opposé à la première surface (16) ; et un élément de connexion (13) disposé dans la couche diélectrique (15) et exposé sur le côté de la seconde surface (17) de la couche diélectrique (15).
PCT/JP2010/006881 2009-12-08 2010-11-25 Bande de suppression de bruit Ceased WO2011070736A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011545065A JP5699937B2 (ja) 2009-12-08 2010-11-25 ノイズ抑制テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009278873 2009-12-08
JP2009-278873 2009-12-08

Publications (1)

Publication Number Publication Date
WO2011070736A1 true WO2011070736A1 (fr) 2011-06-16

Family

ID=44145301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/006881 Ceased WO2011070736A1 (fr) 2009-12-08 2010-11-25 Bande de suppression de bruit

Country Status (2)

Country Link
JP (1) JP5699937B2 (fr)
WO (1) WO2011070736A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012169104A1 (fr) * 2011-06-10 2012-12-13 日本電気株式会社 Dispositif électronique, structure et dissipateur de chaleur
JP2012257315A (ja) * 2010-02-26 2012-12-27 Ntt Docomo Inc マッシュルーム構造を有する装置
US8830126B2 (en) 2010-02-26 2014-09-09 Ntt Docomo, Inc. Apparatus having mushroom structures
JP2018107214A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 金属箔テープ
JP2018107213A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 金属箔テープ
CN108909113A (zh) * 2018-08-24 2018-11-30 深圳市飞鸿达科技有限公司 一种导热电磁噪声抑制片及其制备方法
WO2021255811A1 (fr) * 2020-06-16 2021-12-23 三菱電機株式会社 Dispositif de commande de couplage électromagnétique
US12354979B2 (en) 2021-10-05 2025-07-08 Sumitomo Electric Industries, Ltd. High frequency device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240593A (ja) * 1994-02-28 1995-09-12 Nippon Telegr & Teleph Corp <Ntt> ノイズフィルタテープおよびノイズフィルタテープ作製法およびノイズフィルタテープ作製装置
JP2001251054A (ja) * 2000-03-08 2001-09-14 Ibiden Co Ltd 多層プリント配線板用回路基板の製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2007527629A (ja) * 2004-03-05 2007-09-27 レイセオン・カンパニー 周期的な電磁バンドギャップ構造を使用する改良されたフリップチップｍｍｃボード上性能
WO2008104501A1 (fr) * 2007-02-28 2008-09-04 International Business Machines Corporation ISOLATION AMÉLIORÉE DU BRUIT DE SYSTÈMES NUMÉRIQUES MONTÉ DANS DES BOÎTIERS OU SUR DES CARTES DE CIRCUIT IMPRIMÉS (PCBs)
JP2008288770A (ja) * 2007-05-16 2008-11-27 Mitsubishi Electric Corp Ｅｂｇマテリアル
WO2009082003A1 (fr) * 2007-12-26 2009-07-02 Nec Corporation Elément à bande interdite électromagnétique, et antenne et filtre l'utilisant
JP2009231793A (ja) * 2008-03-19 2009-10-08 Samsung Electro Mech Co Ltd 電磁気バンドギャップ構造物及び印刷回路基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009131140A1 (fr) * 2008-04-22 2009-10-29 日本電気株式会社 Structure électromagnétique de bande interdite et son procédé de fabrication, élément de filtre et élément de filtre incorporant une carte à circuit imprimé

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240593A (ja) * 1994-02-28 1995-09-12 Nippon Telegr & Teleph Corp <Ntt> ノイズフィルタテープおよびノイズフィルタテープ作製法およびノイズフィルタテープ作製装置
JP2001251054A (ja) * 2000-03-08 2001-09-14 Ibiden Co Ltd 多層プリント配線板用回路基板の製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2007527629A (ja) * 2004-03-05 2007-09-27 レイセオン・カンパニー 周期的な電磁バンドギャップ構造を使用する改良されたフリップチップｍｍｃボード上性能
WO2008104501A1 (fr) * 2007-02-28 2008-09-04 International Business Machines Corporation ISOLATION AMÉLIORÉE DU BRUIT DE SYSTÈMES NUMÉRIQUES MONTÉ DANS DES BOÎTIERS OU SUR DES CARTES DE CIRCUIT IMPRIMÉS (PCBs)
JP2008288770A (ja) * 2007-05-16 2008-11-27 Mitsubishi Electric Corp Ｅｂｇマテリアル
WO2009082003A1 (fr) * 2007-12-26 2009-07-02 Nec Corporation Elément à bande interdite électromagnétique, et antenne et filtre l'utilisant
JP2009231793A (ja) * 2008-03-19 2009-10-08 Samsung Electro Mech Co Ltd 電磁気バンドギャップ構造物及び印刷回路基板

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012257315A (ja) * 2010-02-26 2012-12-27 Ntt Docomo Inc マッシュルーム構造を有する装置
US8830126B2 (en) 2010-02-26 2014-09-09 Ntt Docomo, Inc. Apparatus having mushroom structures
WO2012169104A1 (fr) * 2011-06-10 2012-12-13 日本電気株式会社 Dispositif électronique, structure et dissipateur de chaleur
US9629282B2 (en) 2011-06-10 2017-04-18 Nec Corporation Electronic device, structure, and heat sink
JP2018107214A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 金属箔テープ
JP2018107213A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 金属箔テープ
CN108909113A (zh) * 2018-08-24 2018-11-30 深圳市飞鸿达科技有限公司 一种导热电磁噪声抑制片及其制备方法
CN108909113B (zh) * 2018-08-24 2024-09-24 深圳市飞鸿达科技有限公司 一种导热电磁噪声抑制片及其制备方法
WO2021255811A1 (fr) * 2020-06-16 2021-12-23 三菱電機株式会社 Dispositif de commande de couplage électromagnétique
JPWO2021255811A1 (fr) * 2020-06-16 2021-12-23
JP7138822B2 (ja) 2020-06-16 2022-09-16 三菱電機株式会社 電磁結合制御装置
US12354979B2 (en) 2021-10-05 2025-07-08 Sumitomo Electric Industries, Ltd. High frequency device

Also Published As

Publication number Publication date
JPWO2011070736A1 (ja) 2013-04-22
JP5699937B2 (ja) 2015-04-15

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