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WO2011065250A1 - Force sensor - Google Patents

Force sensor Download PDF

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Publication number
WO2011065250A1
WO2011065250A1 PCT/JP2010/070324 JP2010070324W WO2011065250A1 WO 2011065250 A1 WO2011065250 A1 WO 2011065250A1 JP 2010070324 W JP2010070324 W JP 2010070324W WO 2011065250 A1 WO2011065250 A1 WO 2011065250A1
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WO
WIPO (PCT)
Prior art keywords
force sensor
silicon substrate
electrical connection
connection support
displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2010/070324
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French (fr)
Japanese (ja)
Inventor
元輝 平山
英冶 梅津
昌彦 石曽根
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to CN2010800411066A priority Critical patent/CN102510998A/en
Priority to JP2011543213A priority patent/JPWO2011065250A1/en
Publication of WO2011065250A1 publication Critical patent/WO2011065250A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
    • G01L5/223—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to joystick controls

Definitions

  • the present invention relates to a piezoresistive force sensor used for load measurement.
  • a force sensor for load measurement has been used for user interfaces such as touch panels and controllers of mobile devices.
  • a bridge formed of a silicon substrate having a diaphragm portion and a plurality of gauge resistors provided on the diaphragm portion opposite to the rim portion
  • An insulating base Panex (registered trademark) glass) having a circuit and a recessed portion in the central portion to be bonded to the diaphragm and having a wiring pad electrically connected to the bridge circuit (pyrex (registered trademark) glass)
  • a ball solder ball
  • the above-described force sensor is required to be miniaturized and reduced in height in accordance with the mobile device to be mounted.
  • the ball size is large and it is difficult to reduce the height.
  • the contact area of the ball is also reduced, so that the load is concentrated in a narrow area, and the sensor is easily broken.
  • wire bonding is used for electrical connection between the wiring pad formed on the base (Pyrex (registered trademark) glass) and the package, so a space such as a cover must be secured to provide a bonding wire. It is difficult for us to reduce the height.
  • An object of this invention is to obtain the force sensor which can be reduced in height by simple structure in view of the said subject.
  • the present invention proposes a new structure of a piezoresistive force sensor, in which a pressure receiving portion is provided on one of the front and back surfaces of a silicon substrate constituting a displacement portion, and a plurality of piezoresistive elements and a supporting portion are provided on the other.
  • a pressure receiving portion is provided on one of the front and back surfaces of a silicon substrate constituting a displacement portion
  • a plurality of piezoresistive elements and a supporting portion are provided on the other.
  • a displacement portion made of a silicon substrate having a predetermined thickness, a pressure receiving portion positioned on one of the front and back surfaces of the silicon substrate to receive an external load, and the opposite side to the pressure receiving portion
  • a plurality of piezoresistive elements disposed on the other of the front and back surfaces of the silicon substrate and whose electrical resistance changes according to the displacement amount of the displacement portion, and protrudingly formed on the other of the front and back surfaces of the silicon substrate It is characterized in that it comprises a plurality of electrical connection support portions which are respectively electrically connected to the element and which displaceably support the displacement portion on the peripheral side of the plurality of piezoresistive elements.
  • the plurality of electrical connection support portions are provided at symmetrical positions with respect to the plane center of the displacement portion.
  • the displacement portion can be stably supported.
  • a silicon substrate can be formed into a planar rectangular shape, and can be provided at each corner of the planar rectangle.
  • the electrical connection support is made of nickel alloy or conductive silicon.
  • the pressure receiving portion be formed in a cylindrical shape or a polygonal columnar shape that is raised above the displacement portion.
  • the sensor sensitivity is stabilized by having this pressure receiving portion.
  • an electrical connection support portion supporting the displacement portion and electrically connected to the plurality of piezoresistive elements to the mounting substrate, so that the conventional base substrate and wire can be used. Bonding is not required and the height can be reduced.
  • FIG. 1 is a cross-sectional view showing a force sensor 1 to which the present invention is applied
  • FIG. 2 is a plan view showing the force sensor 1 from the top side
  • FIG. 3 is a plan view showing the force sensor 1 from the bottom side.
  • the force sensor 1 is a piezoresistive force sensor, and includes a silicon substrate 10 having a constant thickness without macroscopic irregularities.
  • the silicon substrate 10 has a planar rectangular shape, and the central portion thereof constitutes a displacement portion 11 which is displaced by a load.
  • a pressure receiving portion 12 for receiving an external load is provided on the surface 10 a of the silicon substrate 10.
  • the pressure receiving portion 12 is a cylindrical convex pressure receiving portion raised above the displacement portion 11, and the upper surface peripheral edge is rounded (R-processed).
  • the pressure receiving portion 12 is made of nickel alloy or silicon (the same material as the silicon substrate 10). Although the pressure receiving portion 12 can be omitted, the sensor sensitivity can be stabilized by providing the pressure receiving portion 12 on the displacement portion 11.
  • a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a
  • a circuit wiring portion 16 is connected to each of the plurality of piezoresistive elements 13, and is electrically connected to the plurality of electrical connection support portions 15 via the circuit wiring portion 16.
  • the plurality of piezoresistive elements 13 and the circuit wiring portion 16 are covered with an insulating film 14.
  • the plurality of electrical connection support portions 15 are positioned further on the peripheral edge of the substrate than the plurality of piezoresistive elements 13 arranged along the peripheral edge of the displacement portion 11 and provided in a state of projecting from the back surface 10b of the silicon substrate 10 There is.
  • the electrical connection support portions 15 each have a quadrangular prism shape, and are arranged at four corner portions of the back surface 10 b of the silicon substrate 10 having a planar rectangular shape.
  • the plurality of electrical connection support portions 15 have a symmetrical positional relationship with respect to the plane center of the displacement portion 11 because a pair of opposing electrical connection support portions 15 on the diagonal of the silicon substrate 10 can stably support the displacement portion 11.
  • Each electrical connection support 15 is made of nickel alloy or low resistance silicon. Further, as described above, the plurality of electrical connection support portions 15 are electrically connected to the plurality of piezoresistive elements 13 via the circuit wiring portion 16 provided in the insulating film 14. That is, the electrical connection support portion 15 has a function as a support portion which supports the displacement portion 11 in a displaceable manner, and a function as an electrical connection portion which holds the plurality of piezoresistive elements 13 in an externally mountable state.
  • the force sensor 1 can be mounted on the external mounting substrate 2 by directly connecting the plurality of electrical connection support portions 15 and the corresponding electrodes 20 of the external mounting substrate 2 as shown in FIG.
  • solder for example, solder, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), nonconductive film (NCF) can be used. .
  • the force sensor 1 supports the displacement portion 11 on the side opposite to the pressure receiving portion 12 side of the silicon substrate 10 and a plurality of the plurality of the piezoresistive elements 13 electrically connected to each other. Since the electrical connection support portion 15 is provided, it can be easily mounted on the external mounting substrate 2 via the plurality of electrical connection support portions 15. As a result, the balls, the base substrate, the package, and the wire bonding, which are essential in the conventional structure, become unnecessary, so that the height can be omitted and the height can be reduced. Further, the force sensor 1 can be realized with a simple configuration, and the cost can be reduced.
  • the plurality of electrical connection support portions 15 are provided in the shape of a square pole, but the planar shapes of the plurality of electrical connection support portions 15 can be modified.
  • 5 to 8 show modifications of the planar shape of the plurality of electrical connection support portions 15.
  • FIG. 5 is a rectangular column with chamfered corner portions of a planar square pillar
  • FIG. 6 is cylindrical
  • FIG. 8 is a case where the flat L-shape in FIG. 7 is chamfered.
  • the position at which the plurality of electrical connection support portions 15 are provided has a degree of freedom as long as it is on the peripheral side of the silicon substrate 10 than the plurality of piezoresistance elements 13. It is preferable to arrange symmetrically with respect to the plane center of.
  • the pressure receiving part 12 may be polygonal pillar shape.
  • the present invention is applicable to a piezoresistive force sensor for load measurement used for a user interface such as a touch panel or a controller of a mobile device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

Disclosed is a force sensor having a simple configuration and a small height. The force sensor is provided with: a displacement section, which is composed of a silicon substrate having a predetermined thickness; a pressure receiving section, which is positioned on the front surface of the silicon substrate and receives a load from the outside; a plurality of piezoelectric resistance elements, which are disposed on the rear surface of the silicon substrate, said rear surface being on the reverse side of the surface having the pressure receiving section thereon, and which change the electric resistance thereof corresponding to the displacement quantity of the displacement section; and a plurality of electrically connecting supporting sections, which are formed on the rear surface of the silicon substrate such that the sections protrude from the surface, and which are electrically connected to the piezoelectric resistance elements, respectively, and support the displacement section on the further circumferential side than the piezoelectric resistance elements such that the displacement section is freely displaced.

Description

フォースセンサForce sensor

　本発明は、荷重測定に用いられるピエゾ抵抗方式のフォースセンサに関する。 The present invention relates to a piezoresistive force sensor used for load measurement.

　近年では、モバイル機器のタッチパネルやコントローラ等のユーザーインターフェースに荷重測定用のフォースセンサが用いられている。フォースセンサは種々あるが、例えば特許文献１の図１に示されるピエゾ抵抗方式では、ダイヤフラム部を有するシリコン基板と、リム部とは反対側のダイヤフラム部上に設けた複数のゲージ抵抗からなるブリッジ回路と、ダイヤフラムと接着される中央部に凹部を有し、ブリッジ回路と電気的に接続する配線パッドを形成した絶縁性の基部（パイレックス（登録商標）ガラス）と、ワイヤーボンディングにより配線パッドと電気的に接続されたパッケージと、ダイヤフラム部上に設けた球（サファイヤ球）とを備えている。この従来のフォースセンサは、サファイヤ球を介して受けた荷重に応じてダイヤフラム部が変位し、その変位量に応じてブリッジ回路の出力が変化することから、荷重を検出することができる。従来構造のピエゾ抵抗式フォースセンサは、例えば特許文献２－５にも記載されている。 In recent years, a force sensor for load measurement has been used for user interfaces such as touch panels and controllers of mobile devices. There are various force sensors. For example, in the piezoresistive method shown in FIG. 1 of Patent Document 1, a bridge formed of a silicon substrate having a diaphragm portion and a plurality of gauge resistors provided on the diaphragm portion opposite to the rim portion An insulating base (Pyrex (registered trademark) glass) having a circuit and a recessed portion in the central portion to be bonded to the diaphragm and having a wiring pad electrically connected to the bridge circuit (pyrex (registered trademark) glass) And a ball (sapphire ball) provided on the diaphragm portion. In this conventional force sensor, the diaphragm portion is displaced according to the load received through the sapphire ball, and the output of the bridge circuit changes according to the displacement amount, so that the load can be detected. A piezoresistive force sensor having a conventional structure is also described, for example, in Patent documents 2-5.

特公平５－７７３０４号公報Japanese Examined Patent Publication 5-77304 特開平１０－３２５７７２号公報Japanese Patent Application Laid-Open No. 10-325772 米国特許第４６８０６０６号U.S. Pat. No. 4,680,606 米国特許第４７４５８１２号U.S. Pat. No. 4,745,812 米国特許第４８６１４２０号U.S. Pat. No. 4,861,420

　上述のフォースセンサは、搭載されるモバイル機器に合わせて、小型化及び低背化が要求される。しかし、変位部上に設けた球を介して荷重を受ける従来構造では、球サイズが大きく、低背化が難しい。球サイズを小さくすると、球の接触面積も小さくなるため狭いエリアに荷重が集中することとなり、センサが壊れやすくなってしまう。また、従来構造では、基部（パイレックス（登録商標）ガラス）に形成した配線パッドとパッケージとの電気的接続にワイヤーボンディングを用いているので、ボンディングワイヤーを設けるためにカバーなどのスペースを確保しなければならず、これによっても低背化が難しかった。 The above-described force sensor is required to be miniaturized and reduced in height in accordance with the mobile device to be mounted. However, in the conventional structure which receives a load via a ball provided on the displacement portion, the ball size is large and it is difficult to reduce the height. When the ball size is reduced, the contact area of the ball is also reduced, so that the load is concentrated in a narrow area, and the sensor is easily broken. Also, in the conventional structure, wire bonding is used for electrical connection between the wiring pad formed on the base (Pyrex (registered trademark) glass) and the package, so a space such as a cover must be secured to provide a bonding wire. It is difficult for us to reduce the height.

　本発明は、上記課題を鑑みて、簡単な構成で低背化可能なフォースセンサを得ることを目的とする。 An object of this invention is to obtain the force sensor which can be reduced in height by simple structure in view of the said subject.

　本発明は、ピエゾ抵抗式フォースセンサの新たな構造を提案するもので、変位部を構成するシリコン基板の表裏面の一方に受圧部を、他方に複数のピエゾ抵抗素子と支持部を設け、この支持部を複数のピエゾ抵抗素子と電気的に接続すれば、実装時に該支持部自体を外部実装基板に直接接続でき、従来の球、ベース基板、パッケージ及びワイヤーボンディングは不要となることから、低背化できることに着目して完成されたものである。 The present invention proposes a new structure of a piezoresistive force sensor, in which a pressure receiving portion is provided on one of the front and back surfaces of a silicon substrate constituting a displacement portion, and a plurality of piezoresistive elements and a supporting portion are provided on the other. By electrically connecting the support to a plurality of piezoresistive elements, the support itself can be directly connected to the external mounting substrate at the time of mounting, and the conventional ball, base substrate, package and wire bonding become unnecessary. It was completed focusing on the fact that it can be turned.

　すなわち、本発明は、所定厚さのシリコン基板からなる変位部と、前記シリコン基板の表裏面の一方に位置して外部からの荷重を受ける受圧部と、この受圧部とは反対側となる前記シリコン基板の表裏面の他方に配置され、前記変位部の変位量に応じて電気抵抗が変化する複数のピエゾ抵抗素子と、前記シリコン基板の表裏面の他方に突出形成され、前記複数のピエゾ抵抗素子とそれぞれ電気的に接続し、かつ、該複数のピエゾ抵抗素子よりも周縁側で前記変位部を変位自在に支持する複数の電気接続支持部とを備えたことを特徴としている。 That is, according to the present invention, a displacement portion made of a silicon substrate having a predetermined thickness, a pressure receiving portion positioned on one of the front and back surfaces of the silicon substrate to receive an external load, and the opposite side to the pressure receiving portion A plurality of piezoresistive elements disposed on the other of the front and back surfaces of the silicon substrate and whose electrical resistance changes according to the displacement amount of the displacement portion, and protrudingly formed on the other of the front and back surfaces of the silicon substrate It is characterized in that it comprises a plurality of electrical connection support portions which are respectively electrically connected to the element and which displaceably support the displacement portion on the peripheral side of the plurality of piezoresistive elements.

　前記複数の電気接続支持部は、前記変位部の平面中心に関して対称な位置に設けることが好ましい。この態様によれば、変位部を安定に支持することができる。具体的には例えば、シリコン基板を平面矩形状とし、この平面矩形の角部にそれぞれ設けることができる。 Preferably, the plurality of electrical connection support portions are provided at symmetrical positions with respect to the plane center of the displacement portion. According to this aspect, the displacement portion can be stably supported. Specifically, for example, a silicon substrate can be formed into a planar rectangular shape, and can be provided at each corner of the planar rectangle.

　前記電気接続支持部は、ニッケル合金または導電性を有するシリコンからなることが実際的である。 It is practical that the electrical connection support is made of nickel alloy or conductive silicon.

　前記受圧部は、前記変位部上に隆起した円柱状または多角柱状で形成することが好ましい。この受圧部を有することで、センサ感度が安定化する。 It is preferable that the pressure receiving portion be formed in a cylindrical shape or a polygonal columnar shape that is raised above the displacement portion. The sensor sensitivity is stabilized by having this pressure receiving portion.

　本発明によれば、変位部を支持し、かつ、複数のピエゾ抵抗素子と電気的に接続した電気接続支持部を実装基板に対して直に接続することができるので、従来のベース基板及びワイヤーボンディングが不要となり、低背化を図れる。 According to the present invention, it is possible to directly connect an electrical connection support portion supporting the displacement portion and electrically connected to the plurality of piezoresistive elements to the mounting substrate, so that the conventional base substrate and wire can be used. Bonding is not required and the height can be reduced.

本発明を適用したフォースセンサの一実施形態を示す断面図である。It is a sectional view showing one embodiment of a force sensor to which the present invention is applied. 同フォースセンサを上面側から見て示す平面図である。It is a top view which sees the same force sensor seeing from the upper surface side. 同フォースセンサを下面側から見て示す平面図である。It is a top view which sees the same force sensor seeing from the undersurface side. 同フォースセンサの実装状態を示す断面図である。It is sectional drawing which shows the mounting state of the force sensor. 電気接続支持部の第１の変形例を示す平面図である。It is a top view which shows the 1st modification of an electrical connection support part. 電気接続支持部の第２の変形例を示す平面図である。It is a top view which shows the 2nd modification of an electrical connection support part. 電気接続支持部の第３の変形例を示す平面図である。It is a top view which shows the 3rd modification of an electrical connection support part. 電気接続支持部の第４の変形例を示す平面図である。It is a top view which shows the 4th modification of an electrical connection support part.

　図１は本発明を適用したフォースセンサ１を示す断面図、図２はフォースセンサ１を上面側から見て示す平面図、図３はフォースセンサ１を下面側から見て示す平面図である。フォースセンサ１は、ピエゾ抵抗方式のフォースセンサであって、巨視的な凹凸のない一定厚さのシリコン基板１０を備えている。シリコン基板１０は、平面矩形状をなし、その中央部が荷重により変位する変位部１１を構成している。 FIG. 1 is a cross-sectional view showing a force sensor 1 to which the present invention is applied, FIG. 2 is a plan view showing the force sensor 1 from the top side, and FIG. 3 is a plan view showing the force sensor 1 from the bottom side. The force sensor 1 is a piezoresistive force sensor, and includes a silicon substrate 10 having a constant thickness without macroscopic irregularities. The silicon substrate 10 has a planar rectangular shape, and the central portion thereof constitutes a displacement portion 11 which is displaced by a load.

　シリコン基板１０の表面１０ａには、図２に示されるように、外部からの荷重を受ける受圧部１２が設けられている。受圧部１２は、変位部１１の上に隆起した円柱状の凸受圧部であり、その上面周縁に丸め加工（Ｒ加工）が施されている。この受圧部１２は、ニッケル合金またはシリコン（シリコン基板１０と同一材質）からなる。受圧部１２は省略可能であるが、変位部１１上に受圧部１２を設けることでセンサ感度を安定させることができる。 As shown in FIG. 2, a pressure receiving portion 12 for receiving an external load is provided on the surface 10 a of the silicon substrate 10. The pressure receiving portion 12 is a cylindrical convex pressure receiving portion raised above the displacement portion 11, and the upper surface peripheral edge is rounded (R-processed). The pressure receiving portion 12 is made of nickel alloy or silicon (the same material as the silicon substrate 10). Although the pressure receiving portion 12 can be omitted, the sensor sensitivity can be stabilized by providing the pressure receiving portion 12 on the displacement portion 11.

　一方、シリコン基板１０の裏面１０ｂには、図３に示されるように、複数のピエゾ抵抗素子１３と複数の電気接続支持部１５が設けられている。複数のピエゾ抵抗素子１３は、変位部１１の周縁部に沿って、隣り合う素子同士が９０°異なる位相（互いに直交する位置関係）で配置されている。受圧部１２で受けた荷重により変位部１１が変位すると、その変位量に応じて複数のピエゾ抵抗素子１３の電気抵抗が変化し、この複数のピエゾ抵抗素子１３によって構成されたブリッジ回路の中点電位が変化し、この中点電位がセンサ出力として公知の測定装置に出力される。複数のピエゾ抵抗素子１３には回路配線部１６がそれぞれ接続されており、この回路配線部１６を介して上記複数の電気接続支持部１５と電気的に接続されている。複数のピエゾ抵抗素子１３と回路配線部１６は、絶縁膜１４によって覆われている。 On the other hand, on the back surface 10b of the silicon substrate 10, as shown in FIG. 3, a plurality of piezoresistive elements 13 and a plurality of electrical connection support portions 15 are provided. The plurality of piezoresistive elements 13 are arranged along the peripheral edge portion of the displacement portion 11 so that adjacent elements have phases (positional relationship orthogonal to each other) different by 90 °. When the displacement portion 11 is displaced by the load received by the pressure receiving portion 12, the electrical resistances of the plurality of piezoresistive elements 13 change according to the displacement amount, and the midpoint of the bridge circuit formed by the plurality of piezoresistive elements 13 The potential changes and this midpoint potential is output as a sensor output to a known measuring device. A circuit wiring portion 16 is connected to each of the plurality of piezoresistive elements 13, and is electrically connected to the plurality of electrical connection support portions 15 via the circuit wiring portion 16. The plurality of piezoresistive elements 13 and the circuit wiring portion 16 are covered with an insulating film 14.

　複数の電気接続支持部１５は、変位部１１の周縁部に沿って配置した複数のピエゾ抵抗素子１３よりもさらに基板周縁側に位置し、シリコン基板１０の裏面１０ｂから突出した状態で設けられている。本実施形態では図３に示すように、各電気接続支持部１５が四角柱状をなし、平面矩形状をなすシリコン基板１０の裏面１０ｂの４つの角部にそれぞれ配置されている。複数の電気接続支持部１５は、シリコン基板１０の対角線上で対向する一対が変位部１１の平面中心に関して対称な位置関係にあるので、変位部１１を安定に支持することができる。各電気接続支持部１５は、ニッケル合金または低抵抗シリコンからなる。また、上述のように複数の電気接続支持部１５は、絶縁膜１４内に設けた回路配線部１６を介して、複数のピエゾ抵抗素子１３とそれぞれ電気的に接続されている。つまり、電気接続支持部１５は、変位部１１を変位自在に支持する支持部としての機能と、複数のピエゾ抵抗素子１３を外部実装可能な状態に保持する電気接続部としての機能とを有する。 The plurality of electrical connection support portions 15 are positioned further on the peripheral edge of the substrate than the plurality of piezoresistive elements 13 arranged along the peripheral edge of the displacement portion 11 and provided in a state of projecting from the back surface 10b of the silicon substrate 10 There is. In the present embodiment, as shown in FIG. 3, the electrical connection support portions 15 each have a quadrangular prism shape, and are arranged at four corner portions of the back surface 10 b of the silicon substrate 10 having a planar rectangular shape. The plurality of electrical connection support portions 15 have a symmetrical positional relationship with respect to the plane center of the displacement portion 11 because a pair of opposing electrical connection support portions 15 on the diagonal of the silicon substrate 10 can stably support the displacement portion 11. Each electrical connection support 15 is made of nickel alloy or low resistance silicon. Further, as described above, the plurality of electrical connection support portions 15 are electrically connected to the plurality of piezoresistive elements 13 via the circuit wiring portion 16 provided in the insulating film 14. That is, the electrical connection support portion 15 has a function as a support portion which supports the displacement portion 11 in a displaceable manner, and a function as an electrical connection portion which holds the plurality of piezoresistive elements 13 in an externally mountable state.

　上記フォースセンサ１は、図４に示すように、複数の電気接続支持部１５と外部実装基板２の対応する電極２０とを直接接続することにより、外部実装基板２に実装できる。この実装には、例えば半田、異方性導電膜（ＡＣＦ；Ａｎｉｓｏｔｒｏｐｉｃ　Ｃｏｎｄｕｃｔｉｖｅ　Ｆｉｌｍ）、異方性導電ペースト（ＡＣＰ；Ａｎｉｓｏｔｒｏｐｉｃ　Ｃｏｎｄｕｃｔｉｖｅ　Ｐａｓｔｅ）、非導電性膜（ＮＣＦ；Ｎｏｎ　Ｃｏｎｄｕｃｔｉｖｅ　Ｆｉｌｍ）を用いることができる。 The force sensor 1 can be mounted on the external mounting substrate 2 by directly connecting the plurality of electrical connection support portions 15 and the corresponding electrodes 20 of the external mounting substrate 2 as shown in FIG. For this mounting, for example, solder, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), nonconductive film (NCF) can be used. .

　以上のように本実施形態のフォースセンサ１は、シリコン基板１０の受圧部１２側とは反対側に、変位部１１を支持し、かつ、複数のピエゾ抵抗素子１３と電気的に接続した複数の電気接続支持部１５を備えたので、この複数の電気接続支持部１５を介して外部実装基板２に容易に実装することができる。これにより、従来構造では必須であった球、ベース基板、パッケージ及びワイヤーボンディングは不要となるので、これらの高さ分を省略できて低背化を図れる。また、簡単な構成でフォースセンサ１を実現でき、低コスト化も図れる。 As described above, the force sensor 1 according to the present embodiment supports the displacement portion 11 on the side opposite to the pressure receiving portion 12 side of the silicon substrate 10 and a plurality of the plurality of the piezoresistive elements 13 electrically connected to each other. Since the electrical connection support portion 15 is provided, it can be easily mounted on the external mounting substrate 2 via the plurality of electrical connection support portions 15. As a result, the balls, the base substrate, the package, and the wire bonding, which are essential in the conventional structure, become unnecessary, so that the height can be omitted and the height can be reduced. Further, the force sensor 1 can be realized with a simple configuration, and the cost can be reduced.

　本実施形態では、複数の電気接続支持部１５を四角柱状で設けたが、複数の電気接続支持部１５の平面形状は変形可能である。図５～図８は複数の電気接続支持部１５の平面形状の変形例であって、図５は平面正方形の柱の角部を面取りした四角柱状、図６は円柱状、図７は平面Ｌ字形の柱状、図８は図７の平面Ｌ字形を面取りした柱状とした場合である。また、複数の電気接続支持部１５を設ける位置は、複数のピエゾ抵抗素子１３よりもシリコン基板１０の周縁側であれば自由度があるが、変位部１１を安定に支持するために変位部１１の平面中心に関して対称に配置することが好ましい。 In the present embodiment, the plurality of electrical connection support portions 15 are provided in the shape of a square pole, but the planar shapes of the plurality of electrical connection support portions 15 can be modified. 5 to 8 show modifications of the planar shape of the plurality of electrical connection support portions 15. FIG. 5 is a rectangular column with chamfered corner portions of a planar square pillar, FIG. 6 is cylindrical, FIG. A letter-like column, and FIG. 8 is a case where the flat L-shape in FIG. 7 is chamfered. Further, the position at which the plurality of electrical connection support portions 15 are provided has a degree of freedom as long as it is on the peripheral side of the silicon substrate 10 than the plurality of piezoresistance elements 13. It is preferable to arrange symmetrically with respect to the plane center of.

　また本実施形態では、円柱状の受圧部１２を設けたが、受圧部１２は多角柱状であってもよい。 Moreover, although the cylindrical pressure receiving part 12 was provided in this embodiment, the pressure receiving part 12 may be polygonal pillar shape.

　本願発明は、モバイル機器のタッチパネルやコントローラ等のユーザーインターフェースに用いられる荷重測定用のピエゾ抵抗式フォースセンサに適用可能である。 The present invention is applicable to a piezoresistive force sensor for load measurement used for a user interface such as a touch panel or a controller of a mobile device.

　　１　　フォースセンサ
　　２　　外部実装基板
　１０　　シリコン基板
　１０ａ　表面
　１０ｂ　裏面
　１１　　変位部
　１２　　受圧部
　１３　　ピエゾ抵抗素子
　１４　　絶縁膜
　１５　　電気接続支持部
　１６　　コンタクト部
　２０　　電極 Reference Signs List 1 force sensor 2 external mounting substrate 10 silicon substrate 10 a front surface 10 b rear surface 11 displacement portion 12 pressure receiving portion 13 piezoresistive element 14 insulating film 15 electrical connection support portion 16 contact portion 20 electrode

Claims (5)

所定厚さのシリコン基板からなる変位部と、
　前記シリコン基板の表裏面の一方に位置して外部からの荷重を受ける受圧部と、
　この受圧部とは反対側となる前記シリコン基板の表裏面の他方に配置され、前記変位部の変位量に応じて電気抵抗が変化する複数のピエゾ抵抗素子と、
　前記シリコン基板の表裏面の他方に突出形成され、前記複数のピエゾ抵抗素子とそれぞれ電気的に接続し、かつ、該複数のピエゾ抵抗素子よりも周縁側で前記変位部を変位自在に支持する複数の電気接続支持部と、
を備えたことを特徴とするフォースセンサ。 A displacement portion made of a silicon substrate having a predetermined thickness;
A pressure receiving portion positioned on one of the front and back surfaces of the silicon substrate to receive an external load;
A plurality of piezoresistive elements disposed on the other of the front and back surfaces of the silicon substrate opposite to the pressure receiving portion, the electric resistance of which changes in accordance with the amount of displacement of the displacement portion;
A plurality of projections formed on the other of the front and back surfaces of the silicon substrate, electrically connected to the plurality of piezoresistive elements, and displaceably supporting the displacement portion on the peripheral side of the plurality of piezoresistive elements The electrical connection support of the
Force sensor characterized by having. 請求の範囲第１項に記載のフォースセンサにおいて、前記複数の電気接続支持部は、前記変位部の平面中心に関して対称な位置に設けたフォースセンサ。 The force sensor according to claim 1, wherein the plurality of electrical connection support portions are provided at symmetrical positions with respect to a plane center of the displacement portion. 請求の範囲第２項に記載のフォースセンサにおいて、前記複数の電気接続支持部は、平面矩形状をなすシリコン基板の角部にそれぞれ設けられているフォースセンサ。 The force sensor according to claim 2, wherein the plurality of electrical connection support portions are respectively provided at corner portions of a silicon substrate having a planar rectangular shape. 請求の範囲第１項ないし第３項のいずれか一項に記載のフォースセンサにおいて、前記電気接続支持部は、ニッケル合金または導電性を有するシリコンからなるフォースセンサ。 The force sensor according to any one of claims 1 to 3, wherein the electrical connection support is made of nickel alloy or conductive silicon. 請求の範囲第１項に記載のフォースセンサにおいて、前記受圧部は、前記変位部上に隆起した円柱状または多角柱状であるフォースセンサ。 The force sensor according to claim 1, wherein the pressure receiving portion is a cylindrical or polygonal column that is raised above the displacement portion.
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