WO2010113312A1 - Display device - Google Patents
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- WO2010113312A1 WO2010113312A1 PCT/JP2009/056897 JP2009056897W WO2010113312A1 WO 2010113312 A1 WO2010113312 A1 WO 2010113312A1 JP 2009056897 W JP2009056897 W JP 2009056897W WO 2010113312 A1 WO2010113312 A1 WO 2010113312A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
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- the present invention relates to a display device used for an organic EL display or the like.
- the structure of a display device used in various fields ranging from a small mobile phone to a large television exceeding 100 inches has an anode, an organic functional layer, and a cathode sequentially formed on a substrate.
- a lead electrode connected to the end of the electrode is formed.
- an oxide film is formed on the extraction electrode by plasma treatment, UV treatment, wet treatment, etc. performed before forming the organic functional layer, etc. This oxide film raises the problem that the contact resistance of the electrode increases and the drive voltage becomes high, and (2) the problem that the thermal energy generated by the leakage damages the display device.
- Patent Document 1 it is effective for removing an oxide film that causes an increase in contact resistance.
- the organic functional layer is formed after the removal by laser, particles produced by the oxide film removing process are used. Oxidation and re-oxidation occur in the cleaning process after removal.
- a relaxation layer is used around the electrode to prevent thermal history. However, when thermal energy is generated due to leakage, there is no relaxation layer directly below or directly above the electrode, so that the display device has The problem of damaging it remained.
- the present invention has been made in view of such a problem, and reduces the thermal energy when recovering the contact resistance of the electrode, thermal energy generated by leakage, and damage to the device, thereby providing a highly reliable display.
- the main challenge is to provide devices.
- a first electrode, an organic functional layer, and a second electrode are formed in this order on a substrate, and an end portion of the second electrode
- the second electrode and the second electrode are covered under the third electrode so as to cover a portion where the second electrode and the third electrode are connected.
- a relaxation layer is partially formed on at least one of the top or the second electrode and the second electrode so as to cover a portion where the first electrode and the second electrode intersect with each other. It is characterized by.
- FIG. 1 is a schematic cross-sectional view showing a display device.
- a first electrode 2, an organic functional layer 3, and a second electrode 5 are formed on a substrate 1 in this order, and an end portion of the second electrode 5 is formed.
- the third electrode 6 connected to is formed on the substrate.
- the part where the second electrode and the third electrode are connected is covered under the third electrode, above the second electrode, and the part where the first electrode and the second electrode intersect.
- a relaxing layer is formed below the first electrode and above the second electrode.
- a substrate conventionally used as a substrate of a display device can be used, and is not particularly limited.
- the transparent substrate itself may be used, or a color conversion filter having a color modulation unit provided on the transparent substrate may be used.
- it may be a flexible film formed from polyolefin, acrylic resin (including polymethyl methacrylate), polyester resin (including polyethylene terephthalate), polycarbonate resin, polyimide resin, or the like.
- positioned may be sufficient.
- a substrate passivation layer SiO x , SiN x , SiN x O y , which bears a part of the function of blocking oxygen and / or moisture between the substrate and the first electrode to be described next
- Insulating inorganic oxides such as AlO x , TiO x , TaO x , and ZnO x , inorganic nitrides, inorganic oxynitrides, and the like may be used.
- the thickness of the substrate 1 is not particularly limited, but may be 100 ⁇ m to 2000 ⁇ m.
- the first electrode 2 is formed on the substrate 1, but it may be formed on the transparent substrate itself, or may be formed on the transparent substrate / substrate passivation layer.
- the substrate is composed of a plurality of partial electrodes.
- Examples of the method for forming the first electrode 2 include photolithography patterning, sputtering, and vacuum deposition.
- a conductive metal oxide such as SnO 2 , In 2 O 3 , ITO, indium / zinc oxide (IZO), aluminum-doped zinc oxide (ZnO: Al) is deposited on the substrate 1 by sputtering. Is formed.
- the thickness of the first electrode 2 is not particularly limited, but may be 10 nm to 1000 nm.
- Each of the plurality of partial electrodes constituting the first electrode 2 can have, for example, a stripe shape extending in the first direction. Then, passive matrix driving can be performed by further forming second electrodes 5 to be described later as a plurality of striped electrodes extending in a second direction intersecting (preferably orthogonally intersecting) the first direction. It can be configured as follows.
- Organic functional layer 3 (Organic functional layer 3) The organic functional layer 3 is formed between the first electrode 2 and the second electrode 5.
- the organic functional layer 3 includes at least an organic light emitting layer, and includes a hole transport layer, a hole injection layer, an electron transport layer, and / or an electron injection layer as necessary. Each of these layers is formed to have a film thickness sufficient to realize desired characteristics in each layer. For example, what consists of the following layer structures is employ
- Organic light emitting layer (2) Hole injection layer / organic light emitting layer (3) Organic light emitting layer / electron injection layer (4) Hole injection layer / organic light emitting layer / electron injection layer (5) Hole transport layer / Organic light emitting layer / electron injection layer (6) hole transport layer / organic light emitting layer / electron transport layer (7) hole injection layer / hole transport layer / organic light emitting layer / electron injection layer (8) hole injection layer / Hole transport layer / organic light emitting layer / electron transport layer (9) hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection layer (in the above configuration, the electrode functioning as the anode is on the left side) Connected and the electrode functioning as the cathode is connected to the right side) Any known material can be used as the material of the organic light emitting layer.
- a condensed aromatic ring compound for example, a condensed aromatic ring compound, a ring assembly compound, a metal complex (such as an aluminum complex such as [tris- (8-hydroxyquinoline) aluminum] (Alq 3 )), Styrylbenzene compounds [4,4'-bis (diphenylvinyl) biphenyl (DPVBi), etc.], porphyrin compounds, benzothiazole, benzimidazole, benzoxazole, and other fluorescent brighteners, aromatic dimethylidines Materials such as compounds are preferably used. Or you may form the organic light emitting layer which emits the light of a various wavelength range by adding a dopant to a host compound.
- a metal complex such as an aluminum complex such as [tris- (8-hydroxyquinoline) aluminum] (Alq 3 )
- Styrylbenzene compounds [4,4'-bis (diphenylvinyl) biphenyl (DPVBi), etc.]
- porphyrin compounds such as compounds
- a distyrylarylene compound for example, IDE-120 manufactured by Idemitsu Kosan Co., Ltd.
- TPD N, N′-diphenylbiphenylamine
- Alq 3 or the like can be used as dopants.
- dopants perylene (blue violet), coumarin 6 (blue), quinacridone compounds (blue green to green), rubrene (yellow), 4-dicyanomethylene-2- (p-dimethylaminostyryl) -6-methyl- 4H-pyran (DCM, red), platinum octaethylporphyrin complex (PtOEP, red), or the like can be used.
- phthalocyanines including Pc, CuPc, etc.
- indanthrene compounds can be used as the material for the hole injection layer.
- the hole transport layer can be formed using a material having a triarylamine partial structure, a carbazole partial structure, or an oxadiazole partial structure.
- the material that can be used is preferably TPD, N, N′-bis (naphthalen-1-yl) -N, N′-bis (phenyl) benzidine ( ⁇ -NPD), 1,3,5-tris ⁇ 4- [methylphenyl (phenyl) amino] phenyl ⁇ benzene (MTDAPB, o-, m-, p-), 4,4 ', 4 "-tris [N-3-methylphenyl-N-phenylamino] triphenyl Amine (m-MTDATA) and the like.
- Materials for the electron transport layer include aluminum complexes such as Alq 3 ; 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxathiazole (PBD), 1, Oxadiazole derivatives such as 3,5-tris [5- (4-tert-butylphenyl) -1,3,4-oxathiazol-2-yl] benzene (TPOB); triazole (TAZ) and other triazole derivatives; Use of a triazine derivative having the basic skeleton of the structural formula (I) shown below; phenylquinoxalines; thiophene derivatives such as 5,5′-bis (dimesitylboryl) -2,2′-bithiophene (BMB-2T) Can do.
- an aluminum complex such as Alq 3 or an aluminum quinolinol complex doped with an alkali metal or an alkaline earth metal can be used.
- each layer constituting the organic functional layer 3 is formed by using any means known in the art such as a vacuum deposition method such as a spin coating method, a spray method, a wet method such as an inkjet method, or the like. be able to.
- a vacuum deposition method such as a spin coating method, a spray method, a wet method such as an inkjet method, or the like.
- the insulating film 4 is provided arbitrarily, and is provided between the first electrode 2 and the second electrode 5 and applied to a portion where the light emitting element is not formed (non-light emitting element portion), and a portion where the light emitting element is formed (light emitting) A pattern is formed on the entire substrate so that the element portion or the pixel portion) is an opening.
- the thickness of the insulating film 4 is not particularly limited, but is preferably 0.1 ⁇ m to 5 ⁇ m, more preferably 0.5 ⁇ m to 3 ⁇ m, from the viewpoint of preventing dielectric breakdown between the counter electrodes and leakage current.
- an organic EL layer and a second electrode are further formed on this film, it is possible to energize only the patterned openings, and light emission can be obtained only in those portions.
- the material of the insulating film 4 includes inorganic oxides such as SiO x , SiN x , SiN x O y , AlO x , TiO x , TaO x , ZnO x and the like, inorganic nitrides and inorganic oxynitrides, and organic substances Includes a polymer material such as a resist material and polyimide.
- the formation method of the insulating film 4 is known in the art such as vapor deposition (resistance heating or electron beam heating), sputtering, ion plating, laser ablation in the case of inorganic materials, and spin coating method, casting method, etc. in the case of organic materials. It can be formed using any means.
- vapor deposition resistance heating or electron beam heating
- sputtering ion plating
- laser ablation in the case of inorganic materials
- spin coating method casting method, etc. in the case of organic materials. It can be formed using any means.
- any means known in the art such as photo etching, dry etching, lift-off method can be used.
- the second electrode 5 is composed of a plurality of partial electrodes, and is preferably formed using a highly reflective metal, amorphous alloy, or microcrystalline alloy.
- High reflectivity metals include Al, Ag, Mo, W, Ni, Cr, and the like.
- High reflectivity amorphous alloys include NiP, NiB, CrP, CrB, and the like.
- the highly reflective microcrystalline alloy includes NiAl and the like.
- the formation method of the second electrode 5 may include any means known in the art such as vapor deposition (resistance heating or electron beam heating), sputtering, ion plating, laser ablation, etc., depending on the material used. it can.
- the second electrode 5 made up of a plurality of partial electrodes may be formed using a mask that gives a desired shape, or the second electrode 5 made up of a plurality of partial electrodes using a separating partition having a reverse tapered cross-sectional shape.
- the electrode 5 may be formed.
- the thickness of the second electrode 5 is not particularly limited, but may be 10 nm to 1000 nm.
- Each of the plurality of partial electrodes constituting the second electrode 5 may have a stripe shape extending in the second direction, for example.
- the first direction related to the first electrode 2 and the above-described second direction are preferably crossed, more preferably orthogonal.
- the third electrode 6 is connected to the end of the second electrode 5 and serves as a connection terminal with an external drive circuit.
- the material of the third electrode 6 is not particularly limited, but a material having low electrical resistivity and excellent productivity and stability is preferable, and a simple substance selected from the group consisting of aluminum, molybdenum, nickel, tungsten, or chromium, or those An alloy containing
- the third electrode 6 can be formed by vapor deposition or sputtering.
- the thickness of the third electrode 6 is not particularly limited, but is preferably 100 nm to 10 ⁇ m, more preferably 200 nm to 1 ⁇ m from the viewpoint of electrical contact.
- examples of a method for reducing the contact resistance between the second electrode and the third electrode include laser irradiation with a laser beam, voltage application, and the like.
- the laser beam it is preferable to use an excimer laser capable of finely processing a nanoscale metal thin film. Using these methods, by applying thermal energy to the second electrode and the third electrode, the second electrode and the third electrode are changed in shape, and the contact resistance is lowered.
- the relaxation layer formed below the third electrode 6 is the first relaxation layer 11
- the relaxation layer formed above the second electrode 5 is the second relaxation layer 12
- the first The relaxation layer formed under the electrode 2 will be described as a third relaxation layer 13
- the relaxation layer formed over the second electrode 5 will be described as a fourth relaxation layer 14.
- the second relaxation layer is characterized in that it is partially formed.
- the first relaxing layer 11 is formed under the third electrode 6, but the first relaxing layer 11 is formed only (partially) at a portion where the second electrode 5 and the third electrode 6 are connected. Is preferred.
- the thermal conductivity of the first relaxation layer 11 is not particularly limited, but may be 1/10 or less of the thermal conductivity of each of the first, second, and third electrodes. Specifically, if the thermal conductivity of the first, second, and third electrodes is about 100, the thermal conductivity of the first relaxing layer 11 is preferably 0.1 to 10. As a result, heat can be diffused through the electrodes without transmitting thermal damage from the top to the bottom in the drawing.
- the material of the first relaxing layer 11 is not particularly limited, but may be a resin material.
- it may be a polyimide resin, an acrylic resin, a fluorene resin, or a novolac resin.
- the thickness of the first relaxing layer 11 is not particularly limited, but may be 10 nm to 5000 nm. If the thickness is too thin, even if the thermal conductivity is low as described above, thermal damage is transmitted to each layer, and thus the above-described thickness is preferable.
- Examples of the method of forming the first relaxing layer 11 include a photolithographic patterning method, an ink jet method, a CVD method, and a vapor deposition method.
- the thermal conductivity, material, and thickness of the second relaxation layer 12 are the same as those of the first relaxation layer.
- the second relaxing layer 12 is formed on the second electrode 5, but the second relaxing layer 12 is not formed on the entire surface of the second electrode 5, but the second electrode 5 and the third electrode 6 are formed. It is preferable that it is formed only (partially) at the part to be connected.
- Examples of the method of forming the second relaxing layer 12 include an ink jet method, a vapor deposition method, and a CVD method.
- the first relaxation layer under the third electrode 6 and the second relaxation layer over the second electrode 5 so as to cover the portion where the second electrode 5 and the third electrode 6 are connected Is partially formed, it is possible to reduce damage to the display device due to thermal energy even when the surface of the third electrode with increased contact resistance is irradiated with laser to reduce the contact resistance.
- the third relaxing layer 13 is formed below the first electrode 2, but the third relaxing layer 13 is not formed on the entire surface of the substrate 1, but the first electrode 2 and the second electrode 5 intersect each other. It is preferable that it is formed only (partially). Specifically, it is preferably larger than the width of the first electrode 2. Specifically, it is preferably about 1 ⁇ m to 100 ⁇ m larger than the width of the first electrode 2.
- the thermal conductivity of the third relaxation layer 13 is not particularly limited, but may be 1/10 or less of the thermal conductivity of the first, second, and third electrodes. Specifically, assuming that the thermal conductivity of the first, second, and third electrodes is 100, the thermal conductivity of the third relaxing layer 13 is preferably 0.1 to 10.
- the material of the third relaxation layer 13 is not particularly limited, but may be a resin material. In particular, it may be a polyimide resin, an acrylic resin, a fluorene resin, or a novolac resin.
- the thickness of the third relaxing layer 13 is not particularly limited, but may be 10 nm to 5000 nm.
- Examples of the method of forming the third relaxation layer 13 include a photolithographic patterning method, an ink jet method, a CVD method, and a vapor deposition method.
- the third relaxation layer may have an average transmittance of 80% or more in the visible light region.
- the thermal conductivity, material, and thickness of the fourth relaxation layer 14 are the same as those of the third relaxation layer.
- the fourth relaxation layer 14 is formed on the second electrode 5, but the fourth relaxation layer 14 is not formed on the entire surface of the second electrode 5, but the first electrode 2, the second electrode 5, Is preferably formed only (partially) at the intersection.
- the width is preferably larger than the width of the organic functional layer 3 (light emitting portion). Specifically, it is preferably about 1 ⁇ m to 100 ⁇ m larger than the width of the organic functional layer 3 (light emitting portion).
- Examples of the method of forming the fourth relaxation layer 14 include an inkjet method, a vapor deposition method, and a CVD method.
- the fourth relaxation layer 14 may have an average transmittance of 80% or more in the visible light region.
- the relaxation layer has a first relaxation layer under the third electrode, a second relaxation layer above the second electrode, and a first electrode so as to cover a portion where the second electrode and the third electrode are connected.
- the first electrode is formed only on the second relaxing layer above the second electrode and on the second electrode so as to cover the portion where the second electrode and the third electrode are connected, Even if the third relaxation layer is formed under the first electrode and the fourth relaxation layer is formed on the second electrode so as to cover the portion where the second electrode intersects, the effect is obtained. .
- the present invention is described in the passive matrix method, but the same effect can be obtained in the active matrix method.
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Abstract
Description
本発明は、有機ELディスプレイ等に使用される表示デバイスに関する。 The present invention relates to a display device used for an organic EL display or the like.
近年、小型の携帯電話から、100インチを超す大型のテレビに至るまで様々な分野に用いられる表示デバイスの構造は、基板の上に、陽極、有機機能層、陰極が順次形成され、陰極の各々の端部と接続された引き出し電極が形成されているといった構造になっている。 In recent years, the structure of a display device used in various fields ranging from a small mobile phone to a large television exceeding 100 inches has an anode, an organic functional layer, and a cathode sequentially formed on a substrate. In this structure, a lead electrode connected to the end of the electrode is formed.
しかしこのような構造をもつ表示デバイスは、(1)有機機能層等を成膜する前に行っているプラズマ処理、UV処理、ウェット処理等により、引き出し電極上に酸化膜が形成されてしまい、この酸化膜により電極の接触抵抗が上昇し、駆動電圧が高くなってしまうといった問題や、(2)さらに、リークにより発生する熱エネルギーが表示デバイスにダメージを与えるといった問題が生じていた。 However, in the display device having such a structure, (1) an oxide film is formed on the extraction electrode by plasma treatment, UV treatment, wet treatment, etc. performed before forming the organic functional layer, etc. This oxide film raises the problem that the contact resistance of the electrode increases and the drive voltage becomes high, and (2) the problem that the thermal energy generated by the leakage damages the display device.
ここで、(1)に対して、接触抵抗が上昇した引き出し電極表面にレーザを予め照射し酸化膜を除去する発明が開発されている(特許文献1参照)。また、(2)に対して、熱履歴によるクラック防止のため、緩和層を電極周辺に有する発明が開発されている(特許文献2参照)。 Here, in contrast to (1), an invention has been developed in which the surface of the extraction electrode with increased contact resistance is irradiated with a laser in advance to remove the oxide film (see Patent Document 1). In contrast to (2), in order to prevent cracks due to thermal history, an invention having a relaxation layer around the electrode has been developed (see Patent Document 2).
しかしながら、特許文献1に記載の発明では、接触抵抗の上昇の原因である酸化膜の除去には有効だが、レーザによる除去を行った後に有機機能層を成膜するため、酸化膜除去工程によるパーティクルの発生、除去後の洗浄工程により再酸化が起こる。さらに、特許文献2に記載の発明では、熱履歴防止のために電極周辺に緩和層を用いているがリークにより熱エネルギーが発生した場合、電極の直下、直上に緩和層がないため表示デバイスにダメージを与えてしまうといった問題が残っていた。 However, in the invention described in Patent Document 1, it is effective for removing an oxide film that causes an increase in contact resistance. However, since the organic functional layer is formed after the removal by laser, particles produced by the oxide film removing process are used. Oxidation and re-oxidation occur in the cleaning process after removal. Furthermore, in the invention described in Patent Document 2, a relaxation layer is used around the electrode to prevent thermal history. However, when thermal energy is generated due to leakage, there is no relaxation layer directly below or directly above the electrode, so that the display device has The problem of damaging it remained.
本発明は、このような問題に鑑みなされたものであり、電極の接触抵抗を回復する際の熱エネルギーと、リークにより発生する熱エネルギーと、デバイスへのダメージを緩和し、信頼性の高い表示デバイスを提供することを主たる課題とする。 The present invention has been made in view of such a problem, and reduces the thermal energy when recovering the contact resistance of the electrode, thermal energy generated by leakage, and damage to the device, thereby providing a highly reliable display. The main challenge is to provide devices.
上記課題を解決するための本発明の表示デバイスは、基板上に、第一電極と、有機機能層と、第二電極と、がこの順で形成され、かつ、前記第ニ電極の端部と接続された第三電極が前記基板上に形成されている表示デバイスにおいて、前記第二電極と前記第三電極とが接続する部分を被覆するように前記第三電極の下と前記第二電極の上、又は、前記第一電極と前記第二電極とが交差する部分を被覆するように前記第一電極の下と前記第ニ電極の上、の少なくともいずれかに緩和層が部分的に形成されていることを特徴とする。 In the display device of the present invention for solving the above-described problem, a first electrode, an organic functional layer, and a second electrode are formed in this order on a substrate, and an end portion of the second electrode In the display device in which the connected third electrode is formed on the substrate, the second electrode and the second electrode are covered under the third electrode so as to cover a portion where the second electrode and the third electrode are connected. A relaxation layer is partially formed on at least one of the top or the second electrode and the second electrode so as to cover a portion where the first electrode and the second electrode intersect with each other. It is characterized by.
本願の表示デバイスの実施形態について図面を用いて説明する。 Embodiments of the display device of the present application will be described with reference to the drawings.
図1は、表示デバイスを示す概略断面図である。 FIG. 1 is a schematic cross-sectional view showing a display device.
図1に示すように、表示デバイスは、基板1上に、第一電極2と、有機機能層3と、第二電極5と、がこの順で形成され、かつ、第ニ電極5の端部と接続された第三電極6が基板上に形成されている。
As shown in FIG. 1, in the display device, a first electrode 2, an organic
ここで、第二電極と第三電極とが接続する部分を被覆するように第三電極の下と、第二電極の上に、かつ、第一電極と第二電極とが交差する部分を被覆するように第一電極の下と、第ニ電極の上に、緩和層が形成されていることに特徴を有している。 Here, the part where the second electrode and the third electrode are connected is covered under the third electrode, above the second electrode, and the part where the first electrode and the second electrode intersect. As described above, a relaxing layer is formed below the first electrode and above the second electrode.
以下に、本願の表示デバイスの各層の構成について具体的に説明する。 Hereinafter, the configuration of each layer of the display device of the present application will be described in detail.
(基板1)
基板1は、表示デバイスの基板として従来使用されているものを使用することができ、特に限定しない。例えば、透明基板そのものでもよく、透明基板上に色変調部を設けた色変換フィルタを有するものであってもよい。あるいは、ポリオレフィン、アクリル樹脂(ポリメチルメタクリレートを含む)、ポリエステル樹脂(ポリエチレンテレフタレートを含む)、ポリカーボネート樹脂、またはポリイミド樹脂などから形成される可撓性フィルムであってもよい。あるいは、EL素子を駆動させるTFTが配置された基板であってもよい。
(Substrate 1)
As the substrate 1, a substrate conventionally used as a substrate of a display device can be used, and is not particularly limited. For example, the transparent substrate itself may be used, or a color conversion filter having a color modulation unit provided on the transparent substrate may be used. Alternatively, it may be a flexible film formed from polyolefin, acrylic resin (including polymethyl methacrylate), polyester resin (including polyethylene terephthalate), polycarbonate resin, polyimide resin, or the like. Or the board | substrate with which TFT which drives an EL element was arrange | positioned may be sufficient.
あるいはまた、前記基板と、次に説明する第一電極との間に、酸素および/または水分などを遮断する機能の一部を負担する基板パッシベーション層(SiOx、SiNx、SiNxOy、AlOx、TiOx、TaOx、ZnOxなどの絶縁性の無機酸化物、無機窒化物、無機酸化窒化物などを用いて形成することができる)を形成してもよい。 Alternatively, a substrate passivation layer (SiO x , SiN x , SiN x O y , which bears a part of the function of blocking oxygen and / or moisture between the substrate and the first electrode to be described next, Insulating inorganic oxides such as AlO x , TiO x , TaO x , and ZnO x , inorganic nitrides, inorganic oxynitrides, and the like may be used.
基板1の厚さは、特に限定しないが、100μm~2000μmであってもよい。 The thickness of the substrate 1 is not particularly limited, but may be 100 μm to 2000 μm.
(第一電極2)
第一電極2は、基板1上に形成されるが、これは前記透明基板そのものの上に形成されるものでもよいし、前記透明基板/前記基板パッシベーション層上に形成するものでもよい。また、通常、前記基板上において、複数の部分電極から構成される。
(First electrode 2)
The first electrode 2 is formed on the substrate 1, but it may be formed on the transparent substrate itself, or may be formed on the transparent substrate / substrate passivation layer. In general, the substrate is composed of a plurality of partial electrodes.
第一電極2の形成方法は、フォトリソパターンニング法、スパッタリング法、真空蒸着法等が挙げられる。例えば、スパッタリング法を用いてSnO2、In2O3、ITO、インジウム・亜鉛酸化物(IZO)、アルミドープ酸化亜鉛(ZnO:Al)などの導電性金属酸化物を基板1上に堆積させることによって形成することが挙げられる。 Examples of the method for forming the first electrode 2 include photolithography patterning, sputtering, and vacuum deposition. For example, a conductive metal oxide such as SnO 2 , In 2 O 3 , ITO, indium / zinc oxide (IZO), aluminum-doped zinc oxide (ZnO: Al) is deposited on the substrate 1 by sputtering. Is formed.
第一電極2の厚さは、特に限定しないが、10nm~1000nmであってもよい。 The thickness of the first electrode 2 is not particularly limited, but may be 10 nm to 1000 nm.
第一電極2を構成する複数の部分電極のそれぞれは、たとえば、第1の方向に延びるストライプ形状であることができる。そして、第1の方向と交差する(好ましくは直交する)第2の方向に延びる複数のストライプ状電極として、後に説明する第二電極5をさらに形成することによって、パッシブマトリクス駆動を行うことができるように構成できる。
Each of the plurality of partial electrodes constituting the first electrode 2 can have, for example, a stripe shape extending in the first direction. Then, passive matrix driving can be performed by further forming
(有機機能層3)
有機機能層3は、第一電極2と第二電極5の間に形成される。
(Organic functional layer 3)
The organic
有機機能層3は、有機発光層を少なくとも含み、必要に応じて正孔輸送層、正孔注入層、電子輸送層および/または電子注入層を含む。これらの各層は、それぞれにおいて所望される特性を実現するのに充分な膜厚を有して形成される。たとえば、下記のような層構成からなるものが採用される。
(1)有機発光層
(2)正孔注入層/有機発光層
(3)有機発光層/電子注入層
(4)正孔注入層/有機発光層/電子注入層
(5)正孔輸送層/有機発光層/電子注入層
(6)正孔輸送層/有機発光層/電子輸送層
(7)正孔注入層/正孔輸送層/有機発光層/電子注入層
(8)正孔注入層/正孔輸送層/有機発光層/電子輸送層
(9)正孔注入層/正孔輸送層/有機発光層/電子輸送層/電子注入層
(上記の構成において、陽極として機能する電極が左側に接続され、陰極として機能する電極が右側に接続される)
有機発光層の材料としては、任意の公知の材料を用いることができる。たとえば、青色から青緑色の発光を得るためには、例えば縮合芳香環化合物、環集合化合物、金属錯体([トリス-(8-ヒドロキシキノリン)アルミニウム](Alq3)のようなアルミニウム錯体など)、スチリルベンゼン系化合物[4,4’-ビス(ジフェニルビニル)ビフェニル(DPVBi)など]、ポルフィリン系化合物、ベンゾチアゾール系、ベンゾイミダゾール系、べンゾオキサゾール系などの蛍光増白剤、芳香族ジメチリジン系化合物などの材料が好ましく使用される。あるいはまた、ホスト化合物にドーパントを添加することによって、種々の波長域の光を発する有機発光層を形成してもよい。ホスト化合物としては、ジスチリルアリーレン系化合物(たとえば出光興産製IDE-120など)、N,N’-ジトリル-N,N’-ジフェニルビフェニルアミン(TPD)、Alq3等を用いることができる。ドーパントとしては、ペリレン(青紫色)、クマリン6(青色)、キナクリドン系化合物(青緑色~緑色)、ルブレン(黄色)、4-ジシアノメチレン-2-(p-ジメチルアミノスチリル)-6-メチル-4H-ピラン(DCM、赤色)、白金オクタエチルポルフィリン錯体(PtOEP、赤色)などを用いることができる。
The organic
(1) Organic light emitting layer (2) Hole injection layer / organic light emitting layer (3) Organic light emitting layer / electron injection layer (4) Hole injection layer / organic light emitting layer / electron injection layer (5) Hole transport layer / Organic light emitting layer / electron injection layer (6) hole transport layer / organic light emitting layer / electron transport layer (7) hole injection layer / hole transport layer / organic light emitting layer / electron injection layer (8) hole injection layer / Hole transport layer / organic light emitting layer / electron transport layer (9) hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection layer (in the above configuration, the electrode functioning as the anode is on the left side) Connected and the electrode functioning as the cathode is connected to the right side)
Any known material can be used as the material of the organic light emitting layer. For example, in order to obtain light emission from blue to blue-green, for example, a condensed aromatic ring compound, a ring assembly compound, a metal complex (such as an aluminum complex such as [tris- (8-hydroxyquinoline) aluminum] (Alq 3 )), Styrylbenzene compounds [4,4'-bis (diphenylvinyl) biphenyl (DPVBi), etc.], porphyrin compounds, benzothiazole, benzimidazole, benzoxazole, and other fluorescent brighteners, aromatic dimethylidines Materials such as compounds are preferably used. Or you may form the organic light emitting layer which emits the light of a various wavelength range by adding a dopant to a host compound. As the host compound, a distyrylarylene compound (for example, IDE-120 manufactured by Idemitsu Kosan Co., Ltd.), N, N′-ditolyl-N, N′-diphenylbiphenylamine (TPD), Alq 3 or the like can be used. As dopants, perylene (blue violet), coumarin 6 (blue), quinacridone compounds (blue green to green), rubrene (yellow), 4-dicyanomethylene-2- (p-dimethylaminostyryl) -6-methyl- 4H-pyran (DCM, red), platinum octaethylporphyrin complex (PtOEP, red), or the like can be used.
正孔注入層の材料としては、フタロシアニン類(Pc類、CuPcなどを含む)またはインダンスレン系化合物などを用いることができる。正孔輸送層は、トリアリールアミン部分構造、カルバゾール部分構造、オキサジアゾール部分構造を有する材料を用いて形成することができる。用いることができる材料は、好ましくは、TPD、N,N’-ビス(ナフタレン-1-イル)-N,N’-ビス(フェニル)ベンジジン(α-NPD)、1,3,5-トリス{4-[メチルフェニル(フェニル)アミノ]フェニル}ベンゼン(MTDAPB、o-,m-,p-)、4,4’,4”-トリス[N-3-メチルフェニル-N-フェニルアミノ]トリフェニルアミン(m-MTDATA)などを含む。 As the material for the hole injection layer, phthalocyanines (including Pc, CuPc, etc.) or indanthrene compounds can be used. The hole transport layer can be formed using a material having a triarylamine partial structure, a carbazole partial structure, or an oxadiazole partial structure. The material that can be used is preferably TPD, N, N′-bis (naphthalen-1-yl) -N, N′-bis (phenyl) benzidine (α-NPD), 1,3,5-tris { 4- [methylphenyl (phenyl) amino] phenyl} benzene (MTDAPB, o-, m-, p-), 4,4 ', 4 "-tris [N-3-methylphenyl-N-phenylamino] triphenyl Amine (m-MTDATA) and the like.
電子輸送層の材料としては、Alq3のようなアルミニウム錯体;2-(4-ビフェニルイル)-5-(4-tert-ブチルフェニル)-1,3,4-オキサチアゾール(PBD)、1,3,5-トリス[5-(4-tert-ブチルフェニル)-1,3,4-オキサチアゾール-2-イル]ベンゼン(TPOB)のようなオキサジアゾール誘導体;トリアゾール(TAZ)その他トリアゾール誘導体;以下に示す構造式(I)の基本骨格を有するトリアジン誘導体;フェニルキノキサリン類;5,5’-ビス(ジメシチルボリル)-2,2’-ビチオフェン(BMB-2T)のようなチオフェン誘導体などを用いることができる。電子注入層の材料としては、Alq3のようなアルミニウム錯体、あるいはアルカリ金属ないしアルカリ土類金属をドープしたアルミニウムのキノリノール錯体などを用いることができる。 Materials for the electron transport layer include aluminum complexes such as Alq 3 ; 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxathiazole (PBD), 1, Oxadiazole derivatives such as 3,5-tris [5- (4-tert-butylphenyl) -1,3,4-oxathiazol-2-yl] benzene (TPOB); triazole (TAZ) and other triazole derivatives; Use of a triazine derivative having the basic skeleton of the structural formula (I) shown below; phenylquinoxalines; thiophene derivatives such as 5,5′-bis (dimesitylboryl) -2,2′-bithiophene (BMB-2T) Can do. As the material for the electron injection layer, an aluminum complex such as Alq 3 or an aluminum quinolinol complex doped with an alkali metal or an alkaline earth metal can be used.
有機機能層3を構成するそれぞれの層の形成方法は、スピンコート法、スプレー法、インクジェット法等の湿式法等、真空蒸着法などの当該技術において知られている任意の手段を用いて形成することができる。
The formation method of each layer constituting the organic
(絶縁膜4)
絶縁膜4は、任意に設けられるものであり、第一電極2と第二電極5の間にあって、発光素子を形成しない部分(非発光素子部分)に施され、発光素子を形成する部分(発光素子部分または画素部分)を開口部とするように、基板全体にパターン形成される。
(Insulating film 4)
The insulating film 4 is provided arbitrarily, and is provided between the first electrode 2 and the
絶縁膜4の厚さは、特に限定しないが、対向電極間の絶縁破壊やリーク電流等の防止の観点から、好ましくは0.1μm~5μm、より好ましくは0.5μm~3μmである。この膜の上にさらに有機EL層及び第二電極を形成すると、パターン加工された開口部のみに通電可能となり、その部分のみに発光が得られる。 The thickness of the insulating film 4 is not particularly limited, but is preferably 0.1 μm to 5 μm, more preferably 0.5 μm to 3 μm, from the viewpoint of preventing dielectric breakdown between the counter electrodes and leakage current. When an organic EL layer and a second electrode are further formed on this film, it is possible to energize only the patterned openings, and light emission can be obtained only in those portions.
絶縁膜4の材料は、無機物としては、SiOx、SiNx、SiNxOy、AlOx、TiOx、TaOx、ZnOxなどの無機酸化物、無機窒化物および無機酸化窒化物、有機物としては、レジスト材料、ポリイミドなどの高分子材料が挙げられる。 The material of the insulating film 4 includes inorganic oxides such as SiO x , SiN x , SiN x O y , AlO x , TiO x , TaO x , ZnO x and the like, inorganic nitrides and inorganic oxynitrides, and organic substances Includes a polymer material such as a resist material and polyimide.
絶縁膜4の形成方法は、無機物の場合、蒸着(抵抗加熱または電子ビーム加熱)、スパッタ、イオンプレーティング、レーザーアブレーション、また、有機物の場合、スピンコート法、キャスト法などの当該技術において知られている任意の手段を用いて形成することができる。絶縁膜4のパターン加工には、フォトエッチング、ドライエッチング、リフトオフ法などの当該技術において知られている任意の手段を用いることができる。 The formation method of the insulating film 4 is known in the art such as vapor deposition (resistance heating or electron beam heating), sputtering, ion plating, laser ablation in the case of inorganic materials, and spin coating method, casting method, etc. in the case of organic materials. It can be formed using any means. For the patterning of the insulating film 4, any means known in the art such as photo etching, dry etching, lift-off method can be used.
(第二電極5)
第二電極5は、複数の部分電極からなり、高反射率の金属、アモルファス合金、微結晶性合金を用いて形成されることが好ましい。高反射率の金属は、Al、Ag、Mo、W、Ni、Crなどを含む。高反射率のアモルファス合金は、NiP、NiB、CrPおよびCrBなどを含む。高反射率の微結晶性合金は、NiAlなどを含む。
(Second electrode 5)
The
第二電極5の形成方法は、用いる材料に依存して、蒸着(抵抗加熱または電子ビーム加熱)、スパッタ、イオンプレーティング、レーザーアブレーションなどの当該技術において知られている任意の手段を挙げることができる。所望の形状を与えるマスクを用いて複数の部分電極からなる第二電極5を形成してもよいし、あるいは、逆テーパー状の断面形状を有する分離隔壁を用いて複数の部分電極からなる第二電極5を形成してもよい。
The formation method of the
第二電極5の厚さは、特に限定しないが、10nm~1000nmであってもよい。
The thickness of the
第二電極5を構成する複数の部分電極のそれぞれは、たとえば、第2の方向に延びるストライプ形状であることができる。ここで、第一電極2に関する第1の方向と、前述の第2の方向とは交差していることが好ましく、直交していることがより好ましい。そのような構成を採ることによって、第一電極2を構成する部分電極の1つと、第二電極5を構成する部分電極の1つとに電界を印加することによって、それら部分電極の交差する部位の発光層を発光させる、パッシブマトリクス駆動を行うことができる。
Each of the plurality of partial electrodes constituting the
(第三電極6)
第三電極6は、第二電極5の端部と接続されるものであり、外部の駆動回路との接続端子の役割を果たす。
(Third electrode 6)
The
第三電極6の材料は、特に限定しないが、電気抵抗率が低く生産性、安定性に優れたものが好ましく、アルミ、モリブデン、ニッケル、タングステン、若しくはクロムからなる群から選択される単体またはそれらを含む合金が挙げられる。
The material of the
第三電極6の形成方法は、蒸着法あるいはスパッタ法により形成することができる。
The
第三電極6の厚さは、特に限定しないが、電気的接触性の観点から、好ましくは100nm~10μm、より好ましくは200nm~1μmである。
The thickness of the
また、第二電極と第三電極間の接触抵抗を下げる方法としては、レーザービームによるレーザ照射、電圧印加等を挙げることができる。レーザービームとしては、ナノスケールの金属薄膜の微細加工ができるエキシマレーザーを用いることが好ましい。これらの方法を用いて、第二電極と第三電極に熱エネルギーを与えることにより、第二電極と第三電極を形状変化させ接触抵抗を下げる。 Also, examples of a method for reducing the contact resistance between the second electrode and the third electrode include laser irradiation with a laser beam, voltage application, and the like. As the laser beam, it is preferable to use an excimer laser capable of finely processing a nanoscale metal thin film. Using these methods, by applying thermal energy to the second electrode and the third electrode, the second electrode and the third electrode are changed in shape, and the contact resistance is lowered.
(緩和層11~14)
図1に示すように、第二電極5と第三電極6とが接続する部分を被覆するように第三電極6の下と第二電極5の上、又は、第一電極2と第二電極5とが交差する部分を被覆するように第一電極2の下と第ニ電極5の上、の少なくともいずれかに緩和層が部分的に形成されていることに特徴を有する。なお、第二電極5と第三電極6とが接続する部分を被覆するように、第三電極6の下と、第二電極5の上、かつ、第一電極2と第二電極5とが交差する部分を被覆するように、第一電極2の下と、第ニ電極5の上に、緩和層が部分的に形成されている場合について以下説明する。この際に以下説明しやすいように、第三電極6の下に形成された緩和層を第一緩和層11、第二電極5の上に形成された緩和層を第二緩和層12、第一電極2の下に形成された緩和層を第三緩和層13、第ニ電極5の上に形成された緩和層を第四緩和層14として説明する。
(Relaxation layers 11-14)
As shown in FIG. 1, under the
まず、図1に示すように、第二電極5と第三電極6とが接続する部分を被覆するように、第三電極6の下に第一緩和層2と、第二電極5の上に第ニ緩和層と、が部分的に形成されていることに特徴を有する。
First, as shown in FIG. 1, on the first relaxing layer 2 below the
第一緩和層11は、第三電極6の下に形成されるが、第一緩和層11は、第二電極5と第三電極6が接続する部分のみ(部分的)に形成されていることが好ましい。
The first
これにより、仮に基板側から水分等が浸入した場合であっても、緩和層を伝って他の層等の全体に広がることを防止することができる。 As a result, even if moisture or the like enters from the substrate side, it can be prevented that it spreads through the relaxation layer and spreads all over other layers.
第一緩和層11の熱伝導率は、特に限定はしないが、第一、第二、第三電極の各熱伝導率の1/10以下であってもよい。具体的には、第一、第二、第三電極の熱伝導率がそれぞれ100程度であるとすると、第一緩和層11の熱伝導率は0.1~10であることが好ましい。これにより、図示する上から下の方向に熱ダメージを伝えずに電極を通して熱を拡散させることができる。
The thermal conductivity of the
第一緩和層11の材質は、特に限定はしないが、樹脂材料であってもよい。特に、ポリイミド系樹脂、アクリル系樹脂、フルオレン系樹脂、ノボラック系樹脂であってもよい。
The material of the first
第一緩和層11の厚さは、特に限定しないが、10nm~5000nmであってもよい。厚さが薄すぎると、熱伝導率が上述の様に低い場合でも熱ダメージが各層へ伝わってしまうことから上述の厚さであること好ましい。
The thickness of the first
第一緩和層11の形成方法は、フォトリソパターンニング法、インクジェット法、CVD法、蒸着法等が挙げられる。
Examples of the method of forming the first
第二緩和層12の熱伝導率、材質、厚さは第一緩和層と同様である。
The thermal conductivity, material, and thickness of the
第二緩和層12は、第二電極5の上に形成されるが、第二緩和層12は第二電極5表面全面に形成されているのではなく、第二電極5と第三電極6が接続する部分のみ(部分的)に形成されていることが好ましい。
The second
これにより、仮に第二緩和層12の上方向(外部)から水分等が浸入した場合であっても、緩和層を伝って他の層等の全体に広がることを防止することができる。
Thereby, even if moisture or the like enters from the upper direction (outside) of the second
第二緩和層12の形成方法は、インクジェット法、蒸着法、CVD法等が挙げられる。
Examples of the method of forming the second
このように、第二電極5と第三電極6とが接続する部分を被覆するように、第三電極6の下に第一緩和層と、第二電極5の上に第ニ緩和層と、が部分的に形成されていることによって、接触抵抗が上昇した第三電極表面にレーザを照射し接触抵抗を減少させる場合においても、熱エネルギーによって表示デバイスへ与えるダメージを緩和することができる。
Thus, the first relaxation layer under the
次に、第一電極2と第二電極5とが交差する部分を被覆するように、第一電極2の下に第三緩和層13と、第ニ電極5の上に第四緩和層14と、が形成されていることに特徴を有する。
Next, a
第三緩和層13は、第一電極2の下に形成されるが、第三緩和層13は基板1表面全面に形成されているのではなく、第一電極2と第二電極5とが交差する部分のみ(部分的)に形成されていることが好ましい。具体的には、第一電極2の幅よりも大きいことが好ましい。具体的には、第一電極2の幅よりも1μm~100μm程度大きいことが好ましい。
The third
これにより、仮に第一電極側から水分等が浸入した場合であっても、緩和層を伝って他の層等の全体に広がることを防止することができる。 Thereby, even if moisture or the like enters from the first electrode side, it can be prevented from spreading through the relaxing layer to other layers.
第三緩和層13の熱伝導率は、特に限定はしないが、第一、第二、第三電極の熱伝導率の1/10以下であってもよい。具体的には、第一、第二、第三電極の熱伝導率が100であるとすると、第三緩和層13の熱伝導率は0.1~10であることが好ましい。
The thermal conductivity of the
第三緩和層13の材質は、特に限定はしないが、樹脂材料であってもよい。特に、ポリイミド系樹脂、アクリル系樹脂、フルオレン系樹脂、ノボラック系樹脂であってもよい。
The material of the
第三緩和層13の厚さは、特に限定しないが、10nm~5000nmであってもよい。
The thickness of the third
第三緩和層13の形成方法は、フォトリソパターンニング法、インクジェット法、CVD法、蒸着法等が挙げられる。
Examples of the method of forming the
基板1側から光を取り出す場合には、第三緩和層は、可視光領域での平均透過率は80%以上であってもよい。 When extracting light from the substrate 1 side, the third relaxation layer may have an average transmittance of 80% or more in the visible light region.
第四緩和層14の熱伝導率、材質、厚さは第三緩和層と同様である。
The thermal conductivity, material, and thickness of the
第四緩和層14は、第二電極5の上に形成されるが、第四緩和層14は第二電極5表面全面に形成されているのではなく、第一電極2と第二電極5とが交差する部分のみ(部分的)に形成されていることが好ましい。具体的には、有機機能層3(発光部分)の幅よりも大きいことが好ましい。具体的には、有機機能層3(発光部分)の幅よりも1μm~100μm程度大きいことが好ましい。
The
これにより、仮に第四緩和層の上方向(外部)から水分等が浸入した場合であっても、緩和層を伝って他の層等の全体に広がることを防止することができる。 Thus, even if moisture or the like enters from above (outside) the fourth relaxation layer, it can be prevented from spreading to other layers through the relaxation layer.
第四緩和層14の形成方法は、インクジェット法、蒸着法、CVD法等が挙げられる。
Examples of the method of forming the
基板1と逆側から光を取り出す場合には、第四緩和層14は、可視光領域での平均透過率は80%以上であってもよい。
When extracting light from the side opposite to the substrate 1, the
このように、第一電極と第二電極とが交差する部分を被覆するように緩和層を形成することにより、リークにより熱エネルギーが発生した場合においても、電極の直下、直上に緩和層が形成されているため、熱エネルギーによって表示デバイスへ与えるダメージを緩和することができる。 In this way, by forming a relaxation layer so as to cover the intersection of the first electrode and the second electrode, even if thermal energy is generated due to leakage, a relaxation layer is formed immediately below and immediately above the electrode. Therefore, damage to the display device due to thermal energy can be reduced.
なお、緩和層は、第二電極と第三電極とが接続する部分を被覆するように第三電極の下に第一緩和層、第二電極の上に第二緩和層、かつ、第一電極と第二電極とが交差する部分を被覆するように第一電極の下に第三緩和層、第ニ電極の上に第四緩和層が形成されている場合について説明したが、緩和層が、第二電極と第三電極とが接続する部分を被覆するように第三電極の下に第一緩和層、第二電極の上に第二緩和層にのみ形成されている場合、第一電極と第二電極とが交差する部分を被覆するように第一電極の下に第三緩和層、第ニ電極の上に第四緩和層が形成されている場合であっても効果を有するものである。また、本実施形態において本発明を説明する際にパッシブマトリクス方式において説明したが、アクティブマトリクス方式においても同様の効果を有することができる。 The relaxation layer has a first relaxation layer under the third electrode, a second relaxation layer above the second electrode, and a first electrode so as to cover a portion where the second electrode and the third electrode are connected. The case where the third relaxation layer is formed under the first electrode and the fourth relaxation layer is formed over the second electrode so as to cover the portion where the second electrode and the second electrode cross each other, When the first electrode is formed only on the second relaxing layer above the second electrode and on the second electrode so as to cover the portion where the second electrode and the third electrode are connected, Even if the third relaxation layer is formed under the first electrode and the fourth relaxation layer is formed on the second electrode so as to cover the portion where the second electrode intersects, the effect is obtained. . Further, in the present embodiment, the present invention is described in the passive matrix method, but the same effect can be obtained in the active matrix method.
1・・・基板
2・・・第一電極
3・・・有機機能層
4・・・絶縁層
5・・・第二電極
6・・・第三電極
10・・・表示デバイス
11・・・第一緩和層
12・・・第二緩和層
13・・・第三緩和層
14・・・第四緩和層
DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ...
Claims (5)
前記第二電極と前記第三電極とが接続する部分を被覆するように前記第三電極の下と前記第二電極の上、又は、前記第一電極と前記第二電極とが交差する部分を被覆するように前記第一電極の下と前記第ニ電極の上、の少なくともいずれかに緩和層が部分的に形成されていることを特徴とする表示デバイス。 A first electrode, an organic functional layer, and a second electrode are formed on the substrate in this order, and a third electrode connected to an end of the second electrode is formed on the substrate. Display device
A portion under the third electrode and the second electrode, or a portion where the first electrode and the second electrode intersect so as to cover a portion where the second electrode and the third electrode are connected. A display device, wherein a relaxation layer is partially formed on at least one of the first electrode and the second electrode so as to cover the display device.
前記緩和層の熱伝導率は、第一電極、第二電極、及び第三電極の各熱伝導率の1/10以下であることを特徴とする表示デバイス。 The display device according to claim 1.
A thermal conductivity of the relaxation layer is 1/10 or less of each thermal conductivity of the first electrode, the second electrode, and the third electrode.
前記緩和層は、樹脂材料で形成されていることを特徴とする表示デバイス。 The display device according to claim 1 or 2,
The display device, wherein the relaxation layer is formed of a resin material.
前記緩和層の厚さは、10~5000nmであることを特徴とする表示デバイス。 The display device according to any one of claims 1 to 3,
A display device, wherein the thickness of the relaxation layer is 10 to 5000 nm.
前記基板と逆側から光を取り出す場合には、前記第ニ電極の上の緩和層は、可視光領域での平均透過率が80%以上であり、
前記基板側から光を取り出す場合には、前記第一電極の下の緩和層は、可視光領域での平均透過率が80%以上であることを特徴とする表示デバイス。 The display device according to any one of claims 1 to 4,
When extracting light from the side opposite to the substrate, the relaxation layer on the second electrode has an average transmittance of 80% or more in the visible light region,
When light is extracted from the substrate side, the relaxation layer under the first electrode has an average transmittance of 80% or more in the visible light region.
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| PCT/JP2009/056897 WO2010113312A1 (en) | 2009-04-02 | 2009-04-02 | Display device |
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| PCT/JP2009/056897 WO2010113312A1 (en) | 2009-04-02 | 2009-04-02 | Display device |
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