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WO2010104276A3 - Led leadframe package, led package using the same, and method of manufacturing the led package - Google Patents

Led leadframe package, led package using the same, and method of manufacturing the led package Download PDF

Info

Publication number
WO2010104276A3
WO2010104276A3 PCT/KR2010/001134 KR2010001134W WO2010104276A3 WO 2010104276 A3 WO2010104276 A3 WO 2010104276A3 KR 2010001134 W KR2010001134 W KR 2010001134W WO 2010104276 A3 WO2010104276 A3 WO 2010104276A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
package
manufacturing
led package
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001134
Other languages
French (fr)
Other versions
WO2010104276A2 (en
Inventor
The Tran Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nepes Led Corp
Original Assignee
Nepes Led Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/381,408 external-priority patent/US8058667B2/en
Priority claimed from US12/381,409 external-priority patent/US8039862B2/en
Priority to EP10750967.1A priority Critical patent/EP2406835A4/en
Priority to JP2011553937A priority patent/JP2012520565A/en
Priority to CN2010800077963A priority patent/CN102318091A/en
Priority to KR1020107005556A priority patent/KR101111256B1/en
Application filed by Nepes Led Corp filed Critical Nepes Led Corp
Priority to AU2010221920A priority patent/AU2010221920A1/en
Priority to SG2011055852A priority patent/SG173518A1/en
Priority to RU2011134604/28A priority patent/RU2488195C2/en
Publication of WO2010104276A2 publication Critical patent/WO2010104276A2/en
Publication of WO2010104276A3 publication Critical patent/WO2010104276A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Led Device Packages (AREA)

Abstract

A LED lead frame package, a LED package using the LED lead frame package, and a method of manufacturing the LED package. In the manufacture of the LED package, a liquid transparent resin material is disposed over at least two ring-shaped protrusions having a sharp upper edge and inclined sidewalls and at least one ring-shaped groove formed between two of the at least two ring-shaped protrusions, and thus a sealing layer having a convex curvature may be easily formed by using surface tension in one process.
PCT/KR2010/001134 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package Ceased WO2010104276A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
RU2011134604/28A RU2488195C2 (en) 2009-03-10 2010-02-24 Assembly of light-emitting diode (led) lead-frame unit, led group using this lead-frame and method for manufacturing of led group
SG2011055852A SG173518A1 (en) 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package
JP2011553937A JP2012520565A (en) 2009-03-10 2010-02-24 LED lead frame package, LED package using the same, and method of manufacturing the LED package
CN2010800077963A CN102318091A (en) 2009-03-10 2010-02-24 LED lead frame package, LED package using LED lead frame package, and method of manufacturing LED package
KR1020107005556A KR101111256B1 (en) 2009-03-10 2010-02-24 LED leadframe package, LED package using the same, and method of fabricating the LED package
EP10750967.1A EP2406835A4 (en) 2009-03-10 2010-02-24 LED BOX FOR CONNECTION GRID, CONNECTION GRID USING LED BOX, AND METHOD FOR MANUFACTURING LED BOX
AU2010221920A AU2010221920A1 (en) 2009-03-10 2010-02-24 LED leadframe package, LED package using the same, and method of manufacturing the LED package

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/381,408 US8058667B2 (en) 2009-03-10 2009-03-10 Leadframe package for light emitting diode device
US12/381,409 US8039862B2 (en) 2009-03-10 2009-03-10 White light emitting diode package having enhanced white lighting efficiency and method of making the same
US12/381,409 2009-03-10
US12/381,408 2009-03-10

Publications (2)

Publication Number Publication Date
WO2010104276A2 WO2010104276A2 (en) 2010-09-16
WO2010104276A3 true WO2010104276A3 (en) 2010-11-25

Family

ID=42728911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001134 Ceased WO2010104276A2 (en) 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package

Country Status (9)

Country Link
EP (1) EP2406835A4 (en)
JP (1) JP2012520565A (en)
KR (1) KR101111256B1 (en)
CN (1) CN102318091A (en)
AU (1) AU2010221920A1 (en)
RU (1) RU2488195C2 (en)
SG (1) SG173518A1 (en)
TW (1) TW201044646A (en)
WO (1) WO2010104276A2 (en)

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CN102130236A (en) * 2010-12-31 2011-07-20 北京大学深圳研究生院 A kind of LED chip packaging method and packaging device
TW201238086A (en) * 2011-03-03 2012-09-16 Lextar Electronics Corp Chip package structure
CN102185042A (en) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system
US9159886B2 (en) 2011-04-19 2015-10-13 Intellectual Discovery Co., Ltd. Lighting apparatus with a carrier layer
US8721097B2 (en) * 2011-05-19 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. LED lamp with improved light output
TWI418742B (en) * 2011-06-30 2013-12-11 隆達電子股份有限公司 Light-emitting component packaging structure
KR101148780B1 (en) * 2011-11-16 2012-05-24 김종율 A led package and a manufacturing method therefor
KR101287484B1 (en) * 2012-03-07 2013-07-19 삼성전자주식회사 Light emitting diode package
KR20130103080A (en) * 2012-03-09 2013-09-23 서울반도체 주식회사 Led illumination apparatus
KR20130110997A (en) * 2012-03-30 2013-10-10 서울반도체 주식회사 Lens for light emitting diode and method for manufacturing the same
TWI489657B (en) * 2012-04-12 2015-06-21 隆達電子股份有限公司 LED package
TWI474517B (en) * 2012-05-28 2015-02-21 Lextar Electronics Corp Illumination apparatus and manufacturing method thereof
KR101321101B1 (en) * 2012-06-01 2013-10-23 주식회사 코스텍시스 Substrate and semiconductor device package using the same
CN103515517B (en) * 2012-06-20 2016-03-23 展晶科技(深圳)有限公司 Light emitting diode module
CN103515502A (en) * 2012-06-29 2014-01-15 展晶科技(深圳)有限公司 Light emitting diode device
US9608177B2 (en) 2013-08-27 2017-03-28 Lumens Co., Ltd. Light emitting device package and backlight unit having the same
KR101504309B1 (en) * 2013-08-27 2015-03-20 주식회사 루멘스 Light emitting device package and backlight unit having it
KR102188500B1 (en) 2014-07-28 2020-12-09 삼성전자주식회사 Light emitting diode package and lighting device using the same
JP6730017B2 (en) 2014-11-10 2020-07-29 エルジー イノテック カンパニー リミテッド Light emitting device package and lighting system including the same
KR20160149363A (en) * 2015-06-17 2016-12-28 삼성전자주식회사 Semiconductor light emitting device
CN106784260A (en) * 2016-11-30 2017-05-31 深圳市聚飞光电股份有限公司 A kind of preparation method of direct LED backlight
KR102261288B1 (en) * 2017-03-14 2021-06-04 현대자동차 주식회사 Light emitting diode package for automobile exterior
CN109585632B (en) * 2019-02-14 2019-07-30 旭宇光电（深圳）股份有限公司 High-power long-distance fluorescent powder type white light LEDs cooling encapsulation
JP7445120B2 (en) * 2020-02-21 2024-03-07 日亜化学工業株式会社 light emitting device
CN112467010B (en) * 2020-11-13 2022-03-22 中山市聚明星电子有限公司 Diode packaging process and packaging diodes
KR102338707B1 (en) * 2021-06-14 2021-12-13 주식회사 소룩스 Light source and Lighting device
KR102634521B1 (en) 2023-10-31 2024-02-07 장연식 Medicine injection system

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US20070045646A1 (en) * 2005-09-01 2007-03-01 Low Tek B Surface mount optoelectronic component with lens
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KR20080033496A (en) * 2005-08-04 2008-04-16 크리 인코포레이티드 Package for semiconductor light emitting device using the encapsulated material and method of packaging the same

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Also Published As

Publication number Publication date
EP2406835A2 (en) 2012-01-18
AU2010221920A1 (en) 2011-09-29
SG173518A1 (en) 2011-09-29
WO2010104276A2 (en) 2010-09-16
EP2406835A4 (en) 2013-09-18
JP2012520565A (en) 2012-09-06
KR20100106297A (en) 2010-10-01
KR101111256B1 (en) 2012-02-22
RU2488195C2 (en) 2013-07-20
CN102318091A (en) 2012-01-11
TW201044646A (en) 2010-12-16
RU2011134604A (en) 2013-04-20

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