TWI474517B - Illumination apparatus and manufacturing method thereof - Google Patents
Illumination apparatus and manufacturing method thereof Download PDFInfo
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- TWI474517B TWI474517B TW101118970A TW101118970A TWI474517B TW I474517 B TWI474517 B TW I474517B TW 101118970 A TW101118970 A TW 101118970A TW 101118970 A TW101118970 A TW 101118970A TW I474517 B TWI474517 B TW I474517B
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- adjustment layer
- light
- shape adjustment
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- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000005286 illumination Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims description 103
- 239000000758 substrate Substances 0.000 claims description 43
- 239000002105 nanoparticle Substances 0.000 claims description 32
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000002861 polymer material Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 23
- 239000011859 microparticle Substances 0.000 claims description 19
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 239000004408 titanium dioxide Substances 0.000 claims description 13
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 10
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 10
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 10
- 239000005022 packaging material Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- -1 polyhexafluoropropylene Polymers 0.000 description 12
- 238000004806 packaging method and process Methods 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
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- Led Device Packages (AREA)
Description
本發明是有關於一種發光裝置及其製造方法。The present invention relates to a light emitting device and a method of fabricating the same.
發光二極體之封裝為發光二極體裝置之主要製程之一，良好的封裝成品不僅能夠有效提升發光二極體之光取出效率，保護內部線路及晶片，以免受潮及受損，還能提供散熱途徑以及用以連接外部線路，因此發光二極體裝置之封裝為不可輕忽之一道製程。The package of the light-emitting diode is one of the main processes of the light-emitting diode device. The good packaged product can not only effectively improve the light extraction efficiency of the light-emitting diode, but also protect the internal circuit and the wafer from moisture and damage. The heat dissipation path and the connection to the external circuit, so the package of the light-emitting diode device is not negligible.
而現今的透鏡型發光二極體封裝製程多利用模製成形的方式製成，即將發光元件置於一封閉模具中，再將液態之封裝材質灌入並填滿此模具，封裝材質硬化後便可完成封裝。但其因製程複雜性較高，更必須使用特定之機台及模具，因此大幅提高機台及製作成本。加上模具之製作時間較長，更增加了時間成本。另一方面，由於模具僅能製出單一種外型之透鏡型發光裝置，因此必須製造多樣的模具來符合不同需求之透鏡型發光裝置外型，同時也增加了模具成本。Nowadays, the lens type LED package process is mostly formed by molding, that is, the light-emitting component is placed in a closed mold, and the liquid package material is poured into and filled with the mold, and the package material is hardened. The package can be completed. However, due to the high complexity of the process, it is necessary to use a specific machine and mold, thus greatly increasing the cost of the machine and production. In addition, the production time of the mold is longer, which increases the time cost. On the other hand, since the mold can only produce a single type of lens type light-emitting device, it is necessary to manufacture a variety of molds to meet the different needs of the lens type light-emitting device, and at the same time increase the mold cost.
本發明之一技術態樣為一種可自成透鏡的發光裝置製造方法，其利用表面能不同的材質形成調整層，再加上封裝材質以點膠法封裝於發光元件上以自成透鏡，達到簡化製程及縮短封裝時間之目的，更進一步的可藉由調整層之 不同設計而輕易達成客製化之透鏡構型。One aspect of the present invention is a method for manufacturing a light-emitting device capable of forming a self-forming lens, which is formed by using a material having different surface energy to form an adjustment layer, and the package material is encapsulated on the light-emitting element by a dispensing method to form a self-forming lens. Simplify the process and shorten the packaging time, and further adjust the layer Customized lens configurations are easily achieved with different designs.
因此，本發明之一實施方式是在提供一種可自成透鏡的發光裝置製造方法，包含下列步驟(應瞭解到，在本實施方式中所提及的步驟，除特別敘明其順序者外，均可依實際需要調整其前後順序，甚至可同時或部分同時執行)：Accordingly, an embodiment of the present invention is directed to a method of fabricating a self-forming lens that includes the following steps (it is understood that the steps mentioned in the present embodiment, unless specifically stated otherwise, They can be adjusted according to actual needs, and can even be executed simultaneously or partially):
(1)提供承載基板，其上設有容置區域。(1) A carrier substrate is provided, on which an accommodation area is provided.
(2)提供第一形狀調整層於承載基板上，第一形狀調整層具有至少一開口而暴露於容置區域。(2) providing a first shape adjustment layer on the carrier substrate, the first shape adjustment layer having at least one opening exposed to the accommodating region.
(3)設置至少一發光元件於開口中的容置區域上。(3) arranging at least one light-emitting element on the accommodating area in the opening.
(4)施加液態狀的封裝材質於開口中，其中第一形狀調整層的表面能比封裝材質的表面能低，以使封裝材質硬化後自行成透鏡結構覆蓋此發光元件。(4) Applying a liquid-like package material to the opening, wherein the surface energy of the first shape-adjusting layer is lower than the surface energy of the package material, so that the package material is hardened and then covered by the lens structure to cover the light-emitting element.
在本發明一或多個實施方式中，第一形狀調整層的材質為表面能低於封裝材質的第一高分子材料。In one or more embodiments of the present invention, the first shape adjustment layer is made of a first polymer material having a surface energy lower than that of the package material.
在本發明一或多個實施方式中，其中第一高分子材料為聚六氟丙烯、聚四氟乙烯、聚全氟乙丙烯、聚三氟乙烯、三氟氯乙烯或上述之任意組合。In one or more embodiments of the present invention, the first polymer material is polyhexafluoropropylene, polytetrafluoroethylene, polyperfluoroethylene propylene, polytrifluoroethylene, chlorotrifluoroethylene or any combination thereof.
在本發明一或多個實施方式中，第一形狀調整層的材質為含有複數個無機奈米粒子之第二高分子材料。In one or more embodiments of the present invention, the material of the first shape adjustment layer is a second polymer material containing a plurality of inorganic nanoparticles.
在本發明一或多個實施方式中，其中無機奈米粒子的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。In one or more embodiments of the present invention, the inorganic nanoparticle is made of titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof.
在本發明一或多個實施方式中，其中無機奈米粒子的粒徑小於100 nm。In one or more embodiments of the invention, the inorganic nanoparticles have a particle size of less than 100 nm.
在本發明一或多個實施方式中，更包含下列步驟：In one or more embodiments of the present invention, the following steps are further included:
形成第二形狀調整層位於容置區域中，其中第二形狀調整層係介於承載基板與發光元件之間，或者介於發光元件與第一形狀調整層間而環繞發光元件，且第二形狀調整層的表面能比第一形狀調整層的表面能高。Forming a second shape adjustment layer in the accommodating region, wherein the second shape adjustment layer is between the carrier substrate and the illuminating element, or between the illuminating element and the first shape adjusting layer to surround the illuminating element, and the second shape is adjusted The surface energy of the layer is higher than the surface energy of the first shape adjustment layer.
在本發明一或多個實施方式中，其中第二形狀調整層的材質為含有複數個無機微米粒子之第三高分子材料。In one or more embodiments of the present invention, the material of the second shape adjustment layer is a third polymer material containing a plurality of inorganic microparticles.
在本發明一或多個實施方式中，其中無機微米粒子的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。In one or more embodiments of the present invention, the material of the inorganic microparticles is titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof.
在本發明一或多個實施方式中，其中發光元件包含發光二極體晶片。In one or more embodiments of the invention, wherein the light emitting element comprises a light emitting diode wafer.
在本發明一或多個實施方式中，其中封裝材質包含熱固性材質。In one or more embodiments of the present invention, the encapsulating material comprises a thermosetting material.
在本發明一或多個實施方式中，其中封裝材質包含波長轉換物質。In one or more embodiments of the invention, the encapsulating material comprises a wavelength converting substance.
本發明之另一技術態樣為依上述方法所製成的發光裝置。此發光裝置包含發光元件、透鏡狀封裝材質及第一形狀調整層。封裝材質覆蓋於發光元件上。第一形狀調整層環繞發光元件周圍以及封裝材質與發光元件鄰接處，且第一形狀調整層的表面能比封裝材質的表面能低以促進封裝材質形成透鏡狀。Another aspect of the present invention is a light-emitting device produced by the above method. The light emitting device includes a light emitting element, a lenticular package material, and a first shape adjustment layer. The package material is overlaid on the light-emitting element. The first shape adjustment layer surrounds the periphery of the light-emitting element and the package material is adjacent to the light-emitting element, and the surface energy of the first shape adjustment layer is lower than the surface energy of the package material to promote the lens material to form a lens shape.
在本發明一或多個實施方式中，更包含承載基板，用以承載第一形狀調整層與發光元件。In one or more embodiments of the present invention, a carrier substrate is further included for carrying the first shape adjustment layer and the light emitting element.
在本發明一或多個實施方式中，第一形狀調整層的材質為表面能低於封裝材質的第一高分子材料。In one or more embodiments of the present invention, the first shape adjustment layer is made of a first polymer material having a surface energy lower than that of the package material.
在本發明一或多個實施方式中，其中第一高分子材料 為聚六氟丙烯、聚四氟乙烯、聚全氟乙丙烯、聚三氟乙烯、三氟氯乙烯或上述之任意組合。In one or more embodiments of the present invention, wherein the first polymer material It is polyhexafluoropropylene, polytetrafluoroethylene, polyperfluoroethylene propylene, polytrifluoroethylene, chlorotrifluoroethylene or any combination of the above.
在本發明一或多個實施方式中，其中第一形狀調整層的材料更可包含有無機奈米粒子之第二高分子材料。In one or more embodiments of the present invention, the material of the first shape adjustment layer may further comprise a second polymer material of inorganic nanoparticles.
在本發明一或多個實施方式中，其中無機奈米粒子的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。In one or more embodiments of the present invention, the inorganic nanoparticle is made of titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof.
在本發明一或多個實施方式中，其中無機奈米粒子的粒徑小於100 nm。In one or more embodiments of the invention, the inorganic nanoparticles have a particle size of less than 100 nm.
在本發明一或多個實施方式中，發光裝置更包含第二形狀調整層，位於容置區域中。In one or more embodiments of the present invention, the light emitting device further includes a second shape adjustment layer located in the accommodating area.
在本發明一或多個實施方式中，其中第二形狀調整層係介於承載基板與發光元件之間，或者介於發光元件與第一形狀調整層間而環繞發光裝置，且第二形狀調整層的表面能比第一形狀調整層的表面能高。In one or more embodiments of the present invention, the second shape adjustment layer is interposed between the carrier substrate and the light emitting element, or between the light emitting element and the first shape adjustment layer to surround the light emitting device, and the second shape adjusting layer The surface energy is higher than the surface energy of the first shape adjustment layer.
在本發明一或多個實施方式中，其中第二形狀調整層之材質為含有複數個無機微米粒子的第三高分子材料。In one or more embodiments of the present invention, the material of the second shape adjustment layer is a third polymer material containing a plurality of inorganic microparticles.
在本發明一或多個實施方式中，其中無機微米粒子的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。In one or more embodiments of the present invention, the material of the inorganic microparticles is titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof.
在本發明一或多個實施方式中，其中發光元件包含發光二極體晶片。In one or more embodiments of the invention, wherein the light emitting element comprises a light emitting diode wafer.
在本發明一或多個實施方式中，其中封裝材質包含熱固性材質。In one or more embodiments of the present invention, the encapsulating material comprises a thermosetting material.
在本發明一或多個實施方式中，其中封裝材質包含波長轉換物質。In one or more embodiments of the invention, the encapsulating material comprises a wavelength converting substance.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1至5圖繪示依照本發明第一實施方式之發光裝置的製造流程剖面圖。請先參照第1圖，製造者可先提供一承載基板100，並先定義一容置區域I-I，此容置區域I-I為之後設置開口122(如第2至5圖所繪示)的位置。在本發明一或多個實施方式中，製造者可先將發光裝置置於承載基板100上以方便製程，並在封裝完成之後，再將發光裝置從承載基板100上剝離取下。1 to 5 are cross-sectional views showing a manufacturing process of a light-emitting device according to a first embodiment of the present invention. Referring to FIG. 1 first, the manufacturer may first provide a carrier substrate 100 and first define an accommodating area I-I, which is a position where the opening 122 (shown in FIGS. 2 to 5) is disposed later. In one or more embodiments of the present invention, the manufacturer may first place the light emitting device on the carrier substrate 100 to facilitate the process, and then remove the light emitting device from the carrier substrate 100 after the package is completed.
接著，如第2圖所示，製造者可在承載基板100上形成第一形狀調整層120，此第一形狀調整層120具有一開口122於容置區域I-I上。第一形狀調整層120的形成方法例如可先以塗佈的方式形成一層第一形狀調整層120於承載基板100上，之後再除去容置區域I-I範圍內的第一形狀調整層120而形成開口122。第一形狀調整層120的材質可為第一高分子材料。在本實施方式中，第一高分子材料可包含聚六氟丙烯、聚四氟乙烯、聚全氟乙丙烯、聚三氟乙烯、三氟氯乙烯或上述之任意組合。應了解到，以上所 舉之第一高分子材料的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇第一高分子材料的材質。Next, as shown in FIG. 2, the manufacturer can form a first shape adjustment layer 120 on the carrier substrate 100. The first shape adjustment layer 120 has an opening 122 on the receiving area I-I. For example, the first shape adjustment layer 120 may be formed on the carrier substrate 100 by coating, and then the first shape adjustment layer 120 in the range of the accommodating region II is removed to form an opening. 122. The material of the first shape adjustment layer 120 may be a first polymer material. In the present embodiment, the first polymer material may comprise polyhexafluoropropylene, polytetrafluoroethylene, polyperfluoroethylene propylene, polytrifluoroethylene, chlorotrifluoroethylene or any combination thereof. It should be understood that the above The materials of the first polymer material are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select the material of the first polymer material according to actual needs.
接著請參照第3圖。如圖所示，製造者在此時可設置一發光模組110於開口122中之容置區域I-I上。發光模組110包含一金屬層112及一發光元件114，且金屬層112位於發光元件114與承載基板100之間。其中發光元件114包含發光二極體晶片。金屬層112用以將發光元件114所產生的熱散出發光裝置。金屬層112的材質可包含鋁、銀、銅或上述之任意組合。Please refer to Figure 3 below. As shown in the figure, the manufacturer can set a light-emitting module 110 on the receiving area I-I in the opening 122 at this time. The light emitting module 110 includes a metal layer 112 and a light emitting element 114 , and the metal layer 112 is located between the light emitting element 114 and the carrier substrate 100 . The light emitting element 114 includes a light emitting diode chip. The metal layer 112 serves to dissipate heat generated by the light-emitting element 114 out of the light-emitting device. The material of the metal layer 112 may comprise aluminum, silver, copper or any combination of the above.
接著請參照第4圖。如圖所示，製造者可於此時施加液態狀的封裝材質140於開口122中，以覆蓋住發光模組110。在本實施方式中，製造者可以點膠(Dispensing)的方式將液態狀的封裝材質140置於開口122中，因封裝材質140的表面能高於第一形狀調整層120的表面能，因此液態狀的封裝材質140在硬化後將能自行成為透鏡結構覆蓋發光模組110。上述之封裝材質140可含有熱固性材質，如環氧樹脂(Epoxy)或矽膠(Silicone)。應了解到，以上所舉之封裝材質140均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇封裝材質140的實施方式。Please refer to Figure 4 below. As shown, the manufacturer can apply a liquid encapsulating material 140 in the opening 122 to cover the light emitting module 110. In this embodiment, the manufacturer can place the liquid packaging material 140 in the opening 122 by means of dispensing, because the surface energy of the packaging material 140 is higher than the surface energy of the first shape adjusting layer 120, and thus the liquid After being hardened, the encapsulating material 140 can be self-contained as a lens structure to cover the light emitting module 110. The above package material 140 may contain a thermosetting material such as epoxy (Epoxy) or silicone (Silicone). It should be understood that the above-mentioned package materials 140 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select an embodiment of the package material 140 according to actual needs.
在本發明一或多個實施方式中，封裝材質140內可進一步包含波長轉換物質。此波長轉換物質可將一部分發光元件114所發出的光，轉換為特定波長的光，並與其他發光元件114所發出的光產生混光效果。例如，波長轉換物 質可為螢光粉。In one or more embodiments of the present invention, the package material 140 may further include a wavelength converting substance. The wavelength converting substance converts light emitted from a part of the light-emitting elements 114 into light of a specific wavelength and generates a light-mixing effect with light emitted from the other light-emitting elements 114. For example, wavelength converter The quality can be fluorescent powder.
接著請參照第5圖。如圖所示，在封裝材質140完成硬化後便形成透鏡結構，因此製造者在此時便可將承載基板100移除，以完成發光裝置的製程。Please refer to Figure 5 below. As shown in the figure, after the package material 140 is hardened, a lens structure is formed, so that the manufacturer can remove the carrier substrate 100 at this time to complete the process of the light-emitting device.
在本實施方式中，由於第一形狀調整層120使用了表面能較封裝材質140低的第一高分子材料，因此封裝材質140能在第一形狀調整層120的開口122中自行成為透鏡結構，並且完整覆蓋發光模組110。如此不但可簡化封裝步驟，而且透鏡結構可以點膠的方式製成，比起傳統的模製成形方式大量縮短了封裝的時間，而且也不必另外添購機台及模具，減少了製作成本。另一方面，製造者只要調整第一形狀調整層120中的開口122大小與形狀，就可以輕易完成不同的透鏡構型，達到客製化之目的。In the present embodiment, since the first shape adjustment layer 120 uses the first polymer material having a lower surface energy than the package material 140, the package material 140 can become a lens structure in the opening 122 of the first shape adjustment layer 120. And completely covering the light emitting module 110. This not only simplifies the packaging step, but also the lens structure can be made by dispensing, which greatly shortens the packaging time compared with the conventional molding method, and does not require additional purchase of the machine table and the mold, thereby reducing the manufacturing cost. On the other hand, if the manufacturer adjusts the size and shape of the opening 122 in the first shape adjustment layer 120, the lens configuration can be easily completed to achieve the purpose of customization.
第6至10圖繪示依照本發明第二實施方式之發光裝置的製造流程剖面圖。請先參照第6圖，製造者可先提供一承載基板100，並先定義一容置區域I-I，此容置區域I-I為之後設置開口122(如第7至10圖所繪示)的位置。在本發明一或多個實施方式中，製造者可先將發光裝置置於承載基板100上以方便製程，並在封裝完成之後，再將發光裝置從承載基板100上剝離取下。6 to 10 are cross-sectional views showing a manufacturing process of a light-emitting device according to a second embodiment of the present invention. Referring to FIG. 6 first, the manufacturer may first provide a carrier substrate 100 and first define an accommodating area I-I, which is a position where the opening 122 (shown in FIGS. 7 to 10) is disposed later. In one or more embodiments of the present invention, the manufacturer may first place the light emitting device on the carrier substrate 100 to facilitate the process, and then remove the light emitting device from the carrier substrate 100 after the package is completed.
接著，如第7圖所示，製造者可在承載基板100上形成第一形狀調整層120，此第一形狀調整層120具有一開口122於容置區域I-I上。第一形狀調整層120的形成方法 例如可先以塗佈的方式形成一層第一形狀調整層120於承載基板100上，之後再除去容置區域I-I範圍內的第一形狀調整層120而形成開口122。第一形狀調整層120為含有複數個無機奈米粒子127的第二高分子材料，且無機奈米粒子127的粒徑小於100 nm。Next, as shown in FIG. 7, the manufacturer can form a first shape adjustment layer 120 on the carrier substrate 100. The first shape adjustment layer 120 has an opening 122 on the receiving area I-I. Method of forming first shape adjustment layer 120 For example, a first shape adjustment layer 120 may be formed on the carrier substrate 100 by coating, and then the first shape adjustment layer 120 in the range of the accommodation region I-I may be removed to form the opening 122. The first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, and the inorganic nanoparticles 127 have a particle diameter of less than 100 nm.
在本實施方式中，無機奈米粒子127的材質可為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。應了解到，以上所舉之無機奈米粒子127的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇無機奈米粒子127的材質。In the present embodiment, the material of the inorganic nanoparticle 127 may be titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof. It should be understood that the materials of the above inorganic nanoparticles 127 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select inorganic nanoparticles 127 according to actual needs. Material.
接著請參照第8圖。如圖所示，製造者在此時可設置一發光模組110於開口122中之容置區域I-I上。發光模組110包含一金屬層112及一發光元件114，且金屬層112位於發光元件114與承載基板100之間。其中發光元件114包含發光二極體晶片。金屬層112用以將發光元件114所產生的熱散出發光裝置。金屬層112的材質可包含鋁、銀、銅或上述之任意組合。Please refer to Figure 8 below. As shown in the figure, the manufacturer can set a light-emitting module 110 on the receiving area I-I in the opening 122 at this time. The light emitting module 110 includes a metal layer 112 and a light emitting element 114 , and the metal layer 112 is located between the light emitting element 114 and the carrier substrate 100 . The light emitting element 114 includes a light emitting diode chip. The metal layer 112 serves to dissipate heat generated by the light-emitting element 114 out of the light-emitting device. The material of the metal layer 112 may comprise aluminum, silver, copper or any combination of the above.
接著請參照第9圖。如圖所示，製造者可於此時施加液態狀的封裝材質140於開口122中，以覆蓋住發光模組110。在本實施方式中，製造者可以點膠(Dispensing)的方式將液態狀的封裝材質140置於開口122中，因封裝材質140的表面能高於第一形狀調整層120的表面能，因此液態狀的封裝材質140在硬化後將能自行成為透鏡結構覆蓋發光模組110。上述之封裝材質140可含有熱固性材質，如環氧樹脂(Epoxy)或矽膠(Silicone)。應了解到，以上所舉 之封裝材質140均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇封裝材質140的實施方式。Please refer to Figure 9 below. As shown, the manufacturer can apply a liquid encapsulating material 140 in the opening 122 to cover the light emitting module 110. In this embodiment, the manufacturer can place the liquid packaging material 140 in the opening 122 by means of dispensing, because the surface energy of the packaging material 140 is higher than the surface energy of the first shape adjusting layer 120, and thus the liquid After being hardened, the encapsulating material 140 can be self-contained as a lens structure to cover the light emitting module 110. The above package material 140 may contain a thermosetting material such as epoxy (Epoxy) or silicone (Silicone). It should be understood that the above The package material 140 is merely illustrative and is not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select an embodiment of the package material 140 according to actual needs.
在本發明一或多個實施方式中，封裝材質140內可進一步包含波長轉換物質。此波長轉換物質可將一部分發光元件114所發出的光，轉換為特定波長的光，並與其他發光元件114所發出的光產生混光效果。例如，波長轉換物質可為螢光粉。In one or more embodiments of the present invention, the package material 140 may further include a wavelength converting substance. The wavelength converting substance converts light emitted from a part of the light-emitting elements 114 into light of a specific wavelength and generates a light-mixing effect with light emitted from the other light-emitting elements 114. For example, the wavelength converting substance can be a fluorescent powder.
接著請參照第10圖。如圖所示，在封裝材質140完成硬化後便形成透鏡結構，因此製造者在此時便可將承載基板100移除，以完成發光裝置之製程。Please refer to Figure 10 below. As shown in the figure, after the encapsulation material 140 is hardened, a lens structure is formed, so that the manufacturer can remove the carrier substrate 100 at this time to complete the process of the illuminating device.
在此實施方式中，由於第一形狀調整層120為含有複數個無機奈米粒子127的第二高分子材料，因此表面能將較封裝材質140低，使得封裝材質140能在第一形狀調整層120的開口122中自行成為透鏡結構，並且完整覆蓋發光模組110。如此不但可簡化封裝步驟，而且透鏡結構可以點膠的方式製成，比起傳統的模製成形方式大量縮短了封裝的時間，而且也不必另外添購機台及模具，減少了製作成本。另一方面，製造者只要調整第一形狀調整層120中的開口122大小與形狀，就可以輕易完成不同的透鏡構型，達到客製化之目的。In this embodiment, since the first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, the surface energy is lower than the package material 140, so that the package material 140 can be in the first shape adjustment layer. The opening 122 of the 120 itself becomes a lens structure and completely covers the light emitting module 110. This not only simplifies the packaging step, but also the lens structure can be made by dispensing, which greatly shortens the packaging time compared with the conventional molding method, and does not require additional purchase of the machine table and the mold, thereby reducing the manufacturing cost. On the other hand, if the manufacturer adjusts the size and shape of the opening 122 in the first shape adjustment layer 120, the lens configuration can be easily completed to achieve the purpose of customization.
第11至16圖繪示依照本發明第三實施方式之發光裝置的製造流程剖面圖。請先參照第11圖，製造者可先提供 一承載基板100，並先定義一容置區域I-I，此容置區域I-I為之後設置開口122(如第12至16圖所繪示)的位置。在本發明一或多個實施方式中，製造者可先將發光裝置置於承載基板100上以方便製程，並在封裝完成之後，再將發光裝置從承載基板100上剝離取下。11 to 16 are cross-sectional views showing the manufacturing process of a light-emitting device according to a third embodiment of the present invention. Please refer to Figure 11 first, the manufacturer can provide A carrier substrate 100 is defined, and an accommodating area I-I is defined first, and the accommodating area I-I is a position at which the opening 122 (shown in FIGS. 12 to 16) is disposed later. In one or more embodiments of the present invention, the manufacturer may first place the light emitting device on the carrier substrate 100 to facilitate the process, and then remove the light emitting device from the carrier substrate 100 after the package is completed.
接著，如第12圖所示，製造者可在承載基板100上形成第一形狀調整層120，此第一形狀調整層120具有一開口122於容置區域I-I上。第一形狀調整層120的形成方法例如可先以塗佈的方式形成一層第一形狀調整層120於承載基板100上，之後再除去容置區域I-I範圍內的第一形狀調整層120而形成開口122。第一形狀調整層120為含有複數個無機奈米粒子127之第二高分子材料，且無機奈米粒子127的粒徑小於100 nm。Next, as shown in FIG. 12, the manufacturer can form a first shape adjustment layer 120 on the carrier substrate 100. The first shape adjustment layer 120 has an opening 122 on the accommodating area I-I. For example, the first shape adjustment layer 120 may be formed on the carrier substrate 100 by coating, and then the first shape adjustment layer 120 in the range of the accommodating region II is removed to form an opening. 122. The first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, and the inorganic nanoparticles 127 have a particle diameter of less than 100 nm.
在本實施方式中，無機奈米粒子127的材質可為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。應了解到，以上所舉之無機奈米粒子127的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇無機奈米粒子127的材質。In the present embodiment, the material of the inorganic nanoparticle 127 may be titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof. It should be understood that the materials of the above inorganic nanoparticles 127 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select inorganic nanoparticles 127 according to actual needs. Material.
接著請參照第13圖。如圖所示，製造者在此時可形成一第二形狀調整層130於承載基板100上之容置區域I-I中，其中第二形狀調整層130的表面能高於第一形狀調整層120。第二形狀調整層130的材質可為含有複數個無機微米粒子137之第三高分子材料，且無機微米粒子137的粒徑為微米等級。在本實施方式中，無機微米粒子137的材質可為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組 合。應了解到，以上所舉之無機微米粒子137的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇無機微米粒子137的材質。Please refer to Figure 13 below. As shown in the figure, the manufacturer can form a second shape adjustment layer 130 in the accommodating region I-I on the carrier substrate 100, wherein the surface of the second shape adjustment layer 130 can be higher than the first shape adjustment layer 120. The material of the second shape adjustment layer 130 may be a third polymer material containing a plurality of inorganic microparticles 137, and the particle size of the inorganic microparticles 137 is on the order of micrometers. In this embodiment, the inorganic microparticle 137 may be made of titanium dioxide, ceria, zirconia or any of the above groups. Hehe. It should be understood that the materials of the above-mentioned inorganic microparticles 137 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select the material of the inorganic microparticles 137 according to actual needs. .
接著請參照第14圖。如圖所示，製造者在此時可接著設置一發光模組110於第二形狀調整層130上，使得第二形狀調整層130介於承載基板100與發光模組110之間。發光模組110包含一金屬層112及一發光元件114，且金屬層112位於發光元件114與第二形狀調整層130之間。其中發光元件114包含發光二極體晶片。金屬層112用以將發光元件114所產生的熱散出發光裝置。金屬層112的材質可包含鋁、銀、銅或上述之任意組合。Please refer to Figure 14 below. As shown in the figure, the manufacturer can then provide a light-emitting module 110 on the second shape-adjusting layer 130 so that the second shape-adjusting layer 130 is interposed between the carrier substrate 100 and the light-emitting module 110. The light emitting module 110 includes a metal layer 112 and a light emitting element 114 , and the metal layer 112 is located between the light emitting element 114 and the second shape adjusting layer 130 . The light emitting element 114 includes a light emitting diode chip. The metal layer 112 serves to dissipate heat generated by the light-emitting element 114 out of the light-emitting device. The material of the metal layer 112 may comprise aluminum, silver, copper or any combination of the above.
接著請參照第15圖。如圖所示，製造者可於此時施加液態狀的封裝材質140於開口122中，以覆蓋住發光模組110。在本實施方式中，製造者可以點膠(Dispensing)方式將液態狀的封裝材質140置於開口122中，因封裝材質140的表面能高於第一形狀調整層120的表面能，因此液態狀的封裝材質140在硬化後將能自行成為透鏡結構覆蓋發光模組110。上述之封裝材質140可含有熱固性材質，如環氧樹脂(Epoxy)或矽膠(Silicone)。應了解到，以上所舉之封裝材質140均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇封裝材質140的實施方式。Please refer to Figure 15 below. As shown, the manufacturer can apply a liquid encapsulating material 140 in the opening 122 to cover the light emitting module 110. In the present embodiment, the manufacturer can place the liquid packaging material 140 in the opening 122 by means of a dispensing method. Since the surface energy of the packaging material 140 is higher than the surface energy of the first shape adjusting layer 120, the liquid state is After being hardened, the encapsulation material 140 can be self-contained as a lens structure to cover the light emitting module 110. The above package material 140 may contain a thermosetting material such as epoxy (Epoxy) or silicone (Silicone). It should be understood that the above-mentioned package materials 140 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select an embodiment of the package material 140 according to actual needs.
在本發明一或多個實施方式中，封裝材質140內可進一步包含波長轉換物質。此波長轉換物質可將一部分發光 元件114所發出的光，轉換為特定波長的光，並與其他發光元件114所發出的光產生混光效果。例如，波長轉換物質可為螢光粉。In one or more embodiments of the present invention, the package material 140 may further include a wavelength converting substance. This wavelength converting substance can emit a part of the light The light emitted by the element 114 is converted into light of a specific wavelength and produces a light mixing effect with the light emitted by the other light-emitting elements 114. For example, the wavelength converting substance can be a fluorescent powder.
接著請參照第16圖。如圖所示，在封裝材質140完成硬化後便形成透鏡結構，因此製造者在此時便可將承載基板100移除，以完成發光裝置之製程。Please refer to Figure 16 below. As shown in the figure, after the encapsulation material 140 is hardened, a lens structure is formed, so that the manufacturer can remove the carrier substrate 100 at this time to complete the process of the illuminating device.
在此實施方式中，由於第一形狀調整層120為含有複數個無機奈米粒子127的第二高分子材料，因此表面能將較封裝材質140以及第二形狀調整層130低，使得封裝材質140能在第一形狀調整層120的開口122中自行成為透鏡結構，並且完整覆蓋發光模組110及第二形狀調整層130。如此不但可簡化封裝步.驟，而且透鏡結構可以點膠的方式製成，比起傳統的模製成形方式大量縮短了封裝的時間，而且也不必另外添購機台及模具，減少了製作成本。另一方面，製造者只要調整第一形狀調整層120中的開口122大小與形狀，就可以輕易完成不同的透鏡構型，達到客製化之目的。In this embodiment, since the first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, the surface energy is lower than the package material 140 and the second shape adjustment layer 130, so that the package material 140 The lens 122 can be self-contained in the opening 122 of the first shape adjustment layer 120 and completely cover the light emitting module 110 and the second shape adjustment layer 130. This not only simplifies the packaging step, but also the lens structure can be made by dispensing. Compared with the conventional molding method, the packaging time is greatly shortened, and the machine and the mold are not separately purchased, thereby reducing the manufacturing cost. On the other hand, if the manufacturer adjusts the size and shape of the opening 122 in the first shape adjustment layer 120, the lens configuration can be easily completed to achieve the purpose of customization.
第17至22圖繪示依照本發明第四實施方式之發光裝置的製造流程剖面圖。請先參照第17圖，製造者可先提供一承載基板100，並先定義一容置區域I-I，此容置區域I-I為之後設置開口122(如第18至22圖之繪示)的位置。在本發明之一或多個實施方式中，製造者可先將發光裝置置於承載基板100上以方便製程，並在封裝完成之後，再將 發光裝置從承載基板100上剝離取下。17 to 22 are cross-sectional views showing the manufacturing process of a light-emitting device according to a fourth embodiment of the present invention. Referring to FIG. 17, the manufacturer may first provide a carrier substrate 100, and first define an accommodating area I-I, which is a position where the opening 122 (shown as shown in FIGS. 18 to 22) is disposed later. In one or more embodiments of the present invention, the manufacturer may first place the light emitting device on the carrier substrate 100 to facilitate the process, and after the package is completed, The light emitting device is detached from the carrier substrate 100 and removed.
接著，如第18圖所示，製造者可在承載基板100上形成第一形狀調整層120，此第一形狀調整層120具有一開口122於容置區域I-I上。第一形狀調整層120的形成方法例如可先以塗佈的方式形成一層第一形狀調整層120於承載基板100上，之後再除去容置區域I-I範圍內的第一形狀調整層120而形成開口122。第一形狀調整層120為含有複數個無機奈米粒子127之第二高分子材料，且無機奈米粒子127的粒徑小於100 nm。Next, as shown in FIG. 18, the manufacturer can form a first shape adjustment layer 120 on the carrier substrate 100. The first shape adjustment layer 120 has an opening 122 on the accommodating area I-I. For example, the first shape adjustment layer 120 may be formed on the carrier substrate 100 by coating, and then the first shape adjustment layer 120 in the range of the accommodating region II is removed to form an opening. 122. The first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, and the inorganic nanoparticles 127 have a particle diameter of less than 100 nm.
在本實施方式中，無機奈米粒子127的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。應了解到，以上所舉之無機奈米粒子127的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇無機奈米粒子127的材質。In the present embodiment, the material of the inorganic nanoparticle 127 is titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof. It should be understood that the materials of the above inorganic nanoparticles 127 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select inorganic nanoparticles 127 according to actual needs. Material.
接著請參照第19圖。如圖所示，製造者在此時可接著設置一發光模組110於開口122中之容置區域I-I上。發光模組110包含一金屬層112及一發光元件114，且金屬層112位於發光元件114與承載基板100之間。其中發光元件114包含發光二極體晶片。金屬層112用以將發光元件114所產生的熱散出發光裝置。金屬層112的材質可包含鋁、銀、銅或上述之任意組合。Please refer to Figure 19 below. As shown in the figure, the manufacturer can then set a light-emitting module 110 on the receiving area I-I in the opening 122. The light emitting module 110 includes a metal layer 112 and a light emitting element 114 , and the metal layer 112 is located between the light emitting element 114 and the carrier substrate 100 . The light emitting element 114 includes a light emitting diode chip. The metal layer 112 serves to dissipate heat generated by the light-emitting element 114 out of the light-emitting device. The material of the metal layer 112 may comprise aluminum, silver, copper or any combination of the above.
接著請參照第20圖。如圖所示，製造者在此時可形成一第二形狀調整層130於承載基板100上之容置區域I-I中，且位於發光模組110與第一形狀調整層120間而環繞發光模組110，其中第二形狀調整層130的表面能高於第 一形狀調整層120。第二形狀調整層130的材質可為含有複數個無機微米粒子137之第三高分子材料，且無機微米粒子137的粒徑為微米等級。在本實施方式中，無機微米粒子137的材質為二氧化鈦、二氧化矽、二氧化鋯或上述之任意組合。應了解到，以上所舉之無機微米粒子137的材質均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇無機微米粒子137的材質。Please refer to Figure 20 below. As shown in the figure, the manufacturer can form a second shape adjustment layer 130 in the accommodating area II on the carrier substrate 100, and between the light emitting module 110 and the first shape adjusting layer 120 to surround the light emitting module. 110, wherein the surface of the second shape adjustment layer 130 is higher than the first A shape adjustment layer 120. The material of the second shape adjustment layer 130 may be a third polymer material containing a plurality of inorganic microparticles 137, and the particle size of the inorganic microparticles 137 is on the order of micrometers. In the present embodiment, the material of the inorganic microparticles 137 is titanium dioxide, cerium oxide, zirconium dioxide or any combination thereof. It should be understood that the materials of the above-mentioned inorganic microparticles 137 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select the material of the inorganic microparticles 137 according to actual needs. .
接著請參照第21圖。如圖所示，製造者可於此時施加液態狀的封裝材質140於開口122中，以覆蓋住發光模組110及第二形狀調整層130。在本實施方式中，製造者可以點膠(Dispensing)方式將液態狀的封裝材質140置於開口122中，因封裝材質140的表面能高於第一形狀調整層120的表面能，因此液態狀的封裝材質140在硬化後將能自行成為透鏡結構覆蓋發光模組110。上述之封裝材質140可含有熱固性材質，如環氧樹脂(Epoxy)或矽膠(Silicone)。應了解到，以上所舉之封裝材質140均僅為例示，並非用以限制本發明，本發明所屬技術領域中具有通常知識者，應視實際需要，彈性選擇封裝材質140的實施方式。Please refer to Figure 21 below. As shown, the manufacturer can apply a liquid encapsulating material 140 in the opening 122 to cover the light emitting module 110 and the second shape adjusting layer 130. In the present embodiment, the manufacturer can place the liquid packaging material 140 in the opening 122 by means of a dispensing method. Since the surface energy of the packaging material 140 is higher than the surface energy of the first shape adjusting layer 120, the liquid state is After being hardened, the encapsulation material 140 can be self-contained as a lens structure to cover the light emitting module 110. The above package material 140 may contain a thermosetting material such as epoxy (Epoxy) or silicone (Silicone). It should be understood that the above-mentioned package materials 140 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select an embodiment of the package material 140 according to actual needs.
在本發明一或多個實施方式中，封裝材質140內可進一步包含波長轉換物質。此波長轉換物質可將一部分發光元件114所發出的光，轉換為特定波長的光，並與其他發光元件114所發出的光產生混光效果。例如，波長轉換物質可為螢光粉。In one or more embodiments of the present invention, the package material 140 may further include a wavelength converting substance. The wavelength converting substance converts light emitted from a part of the light-emitting elements 114 into light of a specific wavelength and generates a light-mixing effect with light emitted from the other light-emitting elements 114. For example, the wavelength converting substance can be a fluorescent powder.
接著請參照第22圖。如圖所示，在封裝材質140完成 硬化後便形成透鏡結構，因此製造者在此時便可將承載基板100移除，以完成發光裝置之製程。Please refer to Figure 22 below. As shown, the package material 140 is completed After hardening, the lens structure is formed, so that the manufacturer can remove the carrier substrate 100 at this time to complete the process of the light-emitting device.
在此實施方式中，由於第一形狀調整層120為含有複數個無機奈米粒子127的第二高分子材料，因此表面能將較封裝材質140以及第二形狀調整層130低，使得封裝材質140能在第一形狀調整層120的開口122中自行成為透鏡結構，並且完整覆蓋發光模組110及第二形狀調整層130。如此不但可簡化封裝步驟，而且透鏡結構可以點膠的方式製成，比起傳統的模製成形方式大量縮短了封裝的時間，而且也不必另外添購機台及模具，減少了製作成本。另一方面，製造者只要調整第一形狀調整層120中的開口122大小與形狀，就可以輕易完成不同的透鏡構型，達到客製化之目的。In this embodiment, since the first shape adjustment layer 120 is a second polymer material containing a plurality of inorganic nanoparticles 127, the surface energy is lower than the package material 140 and the second shape adjustment layer 130, so that the package material 140 The lens 122 can be self-contained in the opening 122 of the first shape adjustment layer 120 and completely cover the light emitting module 110 and the second shape adjustment layer 130. This not only simplifies the packaging step, but also the lens structure can be made by dispensing, which greatly shortens the packaging time compared with the conventional molding method, and does not require additional purchase of the machine table and the mold, thereby reducing the manufacturing cost. On the other hand, if the manufacturer adjusts the size and shape of the opening 122 in the first shape adjustment layer 120, the lens configuration can be easily completed to achieve the purpose of customization.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧承載基板100‧‧‧bearing substrate
110‧‧‧發光模組110‧‧‧Lighting module
112‧‧‧金屬層112‧‧‧metal layer
114‧‧‧發光元件114‧‧‧Lighting elements
120‧‧‧第一形狀調整層120‧‧‧First shape adjustment layer
122‧‧‧開口122‧‧‧ openings
127‧‧‧無機奈米粒子127‧‧‧Inorganic Nanoparticles
130‧‧‧第二形狀調整層130‧‧‧Second shape adjustment layer
137‧‧‧無機微米粒子137‧‧‧Inorganic microparticles
140‧‧‧封裝材質140‧‧‧Package material
I-I‧‧‧容置區域I-I‧‧‧ accommodating area
第1至5圖繪示依照本發明第一實施方式之發光裝置的製造流程剖面圖。1 to 5 are cross-sectional views showing a manufacturing process of a light-emitting device according to a first embodiment of the present invention.
第6至10圖繪示依照本發明第二實施方式之發光裝置的製造流程剖面圖。6 to 10 are cross-sectional views showing a manufacturing process of a light-emitting device according to a second embodiment of the present invention.
第11至16圖繪示依照本發明第三實施方式之發光裝 置的製造流程剖面圖。11 to 16 illustrate a lighting device according to a third embodiment of the present invention A cross-section of the manufacturing process.
第17至22圖繪示依照本發明第四實施方式之發光裝置的製造流程剖面圖。17 to 22 are cross-sectional views showing the manufacturing process of a light-emitting device according to a fourth embodiment of the present invention.
100‧‧‧承載基板100‧‧‧bearing substrate
110‧‧‧發光模組110‧‧‧Lighting module
112‧‧‧金屬層112‧‧‧metal layer
114‧‧‧發光元件114‧‧‧Lighting elements
120‧‧‧第一形狀調整層120‧‧‧First shape adjustment layer
122‧‧‧開口122‧‧‧ openings
127‧‧‧無機奈米粒子127‧‧‧Inorganic Nanoparticles
140‧‧‧封裝材質140‧‧‧Package material
I-I‧‧‧容置區域I-I‧‧‧ accommodating area
Claims (20)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI260804B (en) * | 2005-10-28 | 2006-08-21 | Lustrous Technology Ltd | Light emitting diode package with at least a groove |
| TW201044646A (en) * | 2009-03-10 | 2010-12-16 | Nepes Led Corp | LED leadframe package, LED package using the same, and method of manufacturing the LED package |
| US20110309390A1 (en) * | 2009-03-11 | 2011-12-22 | SemiLEDs Optoelectronics Co., Ltd. | Lighting Device Comprising Leds With Phosphor Layers |
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| CN101937962A (en) * | 2010-07-30 | 2011-01-05 | 晶科电子（广州）有限公司 | A kind of LED packaging structure and packaging method thereof |
| CN102130235B (en) * | 2010-12-31 | 2012-12-26 | 深圳中景科创光电科技有限公司 | Method and device for packaging LED chip |
| CN102437273B (en) * | 2011-12-02 | 2014-08-27 | 华中科技大学 | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI260804B (en) * | 2005-10-28 | 2006-08-21 | Lustrous Technology Ltd | Light emitting diode package with at least a groove |
| TW201044646A (en) * | 2009-03-10 | 2010-12-16 | Nepes Led Corp | LED leadframe package, LED package using the same, and method of manufacturing the LED package |
| US20110309390A1 (en) * | 2009-03-11 | 2011-12-22 | SemiLEDs Optoelectronics Co., Ltd. | Lighting Device Comprising Leds With Phosphor Layers |
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