WO2010038366A1 - 光硬化性接着剤組成物 - Google Patents
光硬化性接着剤組成物 Download PDFInfo
- Publication number
- WO2010038366A1 WO2010038366A1 PCT/JP2009/004580 JP2009004580W WO2010038366A1 WO 2010038366 A1 WO2010038366 A1 WO 2010038366A1 JP 2009004580 W JP2009004580 W JP 2009004580W WO 2010038366 A1 WO2010038366 A1 WO 2010038366A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive composition
- mass
- parts
- composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/057—Ester polymer, e.g. polycarbonate, polyacrylate or polyester
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/13332—Front frames
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133325—Assembling processes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Definitions
- the present invention relates to a photocurable adhesive composition, and more particularly to a photocurable adhesive composition suitable for bonding a liquid crystal panel.
- a cover panel for protecting a liquid crystal panel has been arranged in a state slightly lifted from the liquid crystal panel. Adhesion between the cover panel and the liquid crystal panel is achieved by filling a liquid ultraviolet curable resin between them, thereby reducing the thickness, improving the luminance, and improving the module rigidity.
- a liquid ultraviolet curable resin for example, a reaction product obtained by reacting isophorone diisocyanate and alkanediol in a predetermined ratio is reacted with (meth) acrylate having one hydroxyl group in one molecule.
- a method of adhering with a liquid resin inevitably has a problem that bubbles are mixed during bonding due to the effect of a step formed on the cover panel by printing or the like, and the resin protrudes from the end.
- a method of bonding the cover panel and the liquid crystal panel with a double-sided adhesive tape is also known.
- the adhesive tape does not have fluidity, there is a problem that when the cover panel has a step due to printing or the like, the step cannot be filled.
- a photocurable sheet-like adhesive As a method for bonding the cover panel and the liquid crystal panel, it has been considered to use a photocurable sheet-like adhesive.
- a sheet of a photocationically polymerizable adhesive composition containing an acrylic polymer obtained by copolymerizing an acrylic monomer and a radically polymerizable compound having a cationic polymerizable functional group, and a photocationic polymerizable initiator A photo-curing adhesive sheet formed into a shape has been proposed (Patent Document 2).
- the curing reaction by the photocation has a problem that the curing rate is generally slower than the photoradical reaction, and the curing is inhibited by the contained moisture. Therefore, particularly when production efficiency is required, such as adhesion of a liquid crystal panel, adhesion by a curable resin composition containing a photocationic curing system is not preferable.
- Adhesives for use are known (Patent Document 3).
- the adhesive is not used for bonding a liquid crystal panel.
- the curing temperature is as high as 130 ° C., there is a possibility that the liquid crystal itself may be seriously damaged when the liquid crystal panel is used as the adherent member.
- the urethane acrylate used has a weight average molecular weight of about 1,100 and is extremely small.
- the present invention provides a photocurable adhesive composition that can be bonded without causing any gaps between adherent members when adhering between uneven adherend members without damaging the adherend members during bonding. To do.
- the liquid crystal panel and its cover panel can be melted at a low temperature without damaging the liquid crystal panel and follow the steps of the printed cover panel.
- the photocurable adhesive composition which can be bonded together without producing a gap between the two is provided.
- an adhesive that is in a solid state at room temperature is preferable in order to avoid as much as possible the mixing of bubbles and the protrusion of the resin from the end when the liquid crystal panel is bonded to the cover panel. Nevertheless, production efficiency is poor with the photo-cationic polymerizable adhesive. Therefore, it is conceivable to use an adhesive that uses a photoradical reaction.
- an adhesive that is solid at room temperature must be at a relatively high temperature of 100 ° C. or higher in order to melt and cure. Don't be. When cured at such a high temperature, the liquid crystal panel is greatly damaged in the adhesion between the liquid crystal panel and the cover panel.
- the present inventors can obtain an adhesive that can be melted and cured at a temperature that is solid at normal temperature and does not damage the liquid crystal panel, that is, 80 ° C. or lower.
- Various studies have been tried.
- the weight average molecular weight of the urethane (meth) acrylate oligomer is set within a predetermined range, and the blending ratio of the urethane (meth) acrylate oligomer, the phenoxy resin and the photopolymerization initiator is made appropriate, and the loss tangent value is set to the predetermined value. It has been found that the use of the adjusted photocurable adhesive composition can solve the above problems, and the present invention has been completed.
- the present invention (1) (A) 100 parts by mass of a urethane (meth) acrylate oligomer having a weight average molecular weight of 20,000 to 100,000, (B) 5 to 70 parts by mass of a phenoxy resin, and (C) a photopolymerization initiator.
- a photocurable adhesive composition comprising 1 to 10 parts by weight, wherein the loss tangent (loss elastic modulus / storage elastic modulus) of the uncured composition at 25 ° C. is less than 1, and the loss of the uncured composition
- the adhesive composition is characterized in that the temperature at which the tangent is 1 or more is 80 ° C. or less.
- the photocurable adhesive composition of the present invention can be melted at a low temperature, it does not damage the adherend during bonding. In particular, when used for bonding the liquid crystal panel and its cover panel, the liquid crystal panel is not damaged. Further, when adhering between uneven adherend members, the adhering members can be bonded together without generating a gap. In particular, it can follow the steps of the printed cover panel, and can be bonded without creating a gap between the liquid crystal panel and the cover panel. There is no protrusion and the appearance is excellent. Moreover, since it is a solid state at room temperature before hardening, Preferably it is a solid sheet form or film form, it is excellent in handling property. On the other hand, since it is flexible after curing, it does not damage the adherend, particularly the liquid crystal, and does not melt by reheating, so that the cover panel can be stably held.
- the upper limit of the loss tangent of the uncured composition (photocurable adhesive composition before curing) at 25 ° C. is less than 1, preferably 0.6, and the lower limit is Preferably it is 0.1. Beyond the above upper limit, it is difficult for the uncured composition to maintain a solid state at room temperature, for example, not only it becomes difficult to maintain a sheet or film shape, but in the same way as a liquid adhesive, This is not preferable because it tends to cause mixing of bubbles and protrusion of the resin from the end portion.
- the temperature at which the loss tangent of the uncured composition is 1 or more is 80 ° C. or less, preferably 40 to 80 ° C.
- the loss tangent is also referred to as tan ⁇ , and indicates the ratio of loss elastic modulus (G ′′) to storage elastic modulus (G ′) (loss elastic modulus G ′′ / storage elastic modulus G ′).
- the loss tangent is less than 1, the solid property is large, and when the loss tangent is 1 or more, the liquid property is large.
- the upper limit of the weight average molecular weight of the component (A) urethane (meth) acrylate oligomer used in the present invention is 100,000, preferably 70,000, and the lower limit is 20,000, preferably 40,000, more preferably. Is 50,000. If the above upper limit is exceeded, synthesis of urethane (meth) acrylate itself becomes difficult, and in reality, there is almost no possibility of implementation, and even if it is forcibly synthesized and used, it is due to heating of the uncured composition. Flow is less likely to occur and the melting temperature is increased. Therefore, when the liquid crystal panel and the cover panel are bonded together, the liquid crystal is damaged and the step of the cover panel due to printing or the like cannot be followed. If it is less than the said minimum, it will become difficult to maintain the solid state at normal temperature of an uncured composition.
- urethane (meth) acrylate oligomer used in this invention
- it has a polyol compound which has two or more active hydroxyl groups in a molecule
- It is a urethane (meth) acrylate oligomer comprising a reaction product of an organic isocyanate compound and (meth) acrylate containing at least one hydroxyl group in the molecule.
- polystyrene resin examples include polyether polyol, polyester polyol, caprolactone diol, and polycarbonate diol.
- polycarbonate diol is preferable because a cured composition (photocured adhesive composition after curing) having excellent durability can be obtained. More preferably, since a flexible cured composition that does not damage the liquid crystal is obtained, 1,6-hexanediol, 1,5-pentanediol, and a dialkyl carbonate having 1 to 6 carbon atoms are copolymerized. The polycarbonate diol obtained by is used.
- organic isocyanate compound having two or more isocyanate groups in the molecule examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, and 1,4-xylylene diisocyanate.
- Tetramethylxylylene diisocyanate diphenylmethane diisocyanate, hexamethylene diisocyanate, lysine diisocyanate, isophorone diisocyanate, bis (4-isocyanatocyclohexyl) methane, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanato) Methyl) cyclohexane, norbornane diisocyanate and the like.
- saturated diisocyanates such as isophorone diisocyanate and hexamethylene diisocyanate are preferable because a cured composition having excellent weather resistance can be obtained.
- isophorone diisocyanate bis (4-isocyanatocyclohexyl) methane, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanato) Methyl) cyclohexane is used.
- Examples of the (meth) acrylate containing at least one hydroxyl group in the molecule include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, polyethylene Examples include mono (meth) acrylates of divalent alcohols such as glycol, mono (meth) acrylates or di (meth) acrylates of trivalent alcohols such as trimethylolethane, trimethylolpropane, and glycerin. These may be used alone or in combination.
- the synthesis method of the component (A) urethane (meth) acrylate oligomer is not particularly limited, and a known method can be used.
- a polyol compound having two or more active hydroxyl groups in the molecule and an organic isocyanate compound having two or more isocyanate groups in the molecule are preferably in a molar ratio of 1: 1 to 1: 2.
- a urethane prepolymer is obtained by reacting in a diluent, and further, an isocyanate group remaining in the obtained urethane prepolymer and at least one hydroxyl group in at least a molecule sufficient to react with it.
- a method of synthesizing a urethane (meth) acrylate oligomer by reacting with the contained (meth) acrylate may be mentioned.
- the component (B) phenoxy resin is used for the purpose of film formation assistance for keeping the adhesive composition in a solid state at room temperature.
- the component (B) phenoxy resin include bisphenol type phenoxy resin, novolac type phenoxy resin, naphthalene type phenoxy resin, biphenyl type phenoxy resin, and the like. These may be used alone or in combination.
- a bisphenol type phenoxy resin is particularly preferable from the viewpoint of film formability.
- the weight average molecular weight of the phenoxy resin is preferably 30,000 to 70,000. These phenoxy resins are used to keep the adhesive composition in a solid state at room temperature. In order to prevent unexpected curing due to the reaction, the unmodified phenoxy resin is more preferable.
- a commercial item can be used as a component (B) phenoxy resin.
- Commercially available products include, for example, Tono Kasei phenototo YP-50, phenototo YP-50S, phenototo YP-55, phenototo YP-70 or FX280 (both are trademarks), Japan Epoxy Resin Co., Ltd. JER1256 , JER4250 or JER4275 (both are trademarks), PCHHB, PKHC, PKHH, PKHJ, PKFE, PKHP-200, PKHP-80, PKHB-100 or PKHB-300 (all are trademarks) manufactured by Inchem.
- the blending amount of the component (B) in the present invention is 70 parts by mass, preferably 60 parts by mass, more preferably 50 parts by mass with respect to 100 parts by mass of the component (A), and the lower limit is 5 parts by mass. Preferably it is 10 mass parts, More preferably, it is 40 mass parts. If the above upper limit is exceeded, the uncured composition will be difficult to flow by heating, and if it is less than the above lower limit, the uncured composition will be difficult to maintain a solid state at room temperature, and the adhesiveness will be extremely strong. The handling of the machine becomes worse.
- the component (A) urethane (meth) acrylate oligomer and the component (B) phenoxy resin are not particularly limited as long as they are as described above.
- the weight average molecular weight is 10
- the loss tangent of the uncured composition at 25 ° C. may exceed 1, and the temperature at which the loss tangent of the uncured composition is 1 or more exceeds 80 ° C.
- the component (C) photopolymerization initiator used in the present invention is not particularly limited.
- the compounding amount of the component (C) in the present invention is 10 parts by mass, preferably 6 parts by mass with respect to 100 parts by mass of the component (A), and the lower limit is 0.1 parts by mass, preferably 0.5 parts. Part by mass, more preferably 3 parts by mass.
- the above upper limit is exceeded, the storage stability of the uncured composition is lowered, and the physical properties of the cured composition are lowered.
- it is less than the above lower limit appropriate photocurability cannot be obtained.
- the upper limit of the elastic modulus of the cured composition is preferably 1.0 ⁇ 10 9 Pa, more preferably 1.0 ⁇ 10 7 Pa, and the lower limit is preferably Is 1.0 ⁇ 10 4 Pa, more preferably 1.0 ⁇ 10 5 Pa.
- the elastic modulus here is a storage elastic modulus value measured by a dynamic viscoelasticity measuring apparatus, and is expressed in a unit Pa. If the above upper limit is exceeded, warpage or external stress generated in the cover panel may be transmitted to the liquid crystal panel, causing a display defect of the liquid crystal panel.
- the total light transmittance of this hardening composition is 85% or more. If it is less than 85%, the brightness of the liquid crystal panel decreases.
- various components can be blended as necessary within a range not impairing the effects of the present invention.
- additives such as saturated aliphatic urethane (meth) acrylates, leveling agents, antioxidants, light stabilizers, ultraviolet absorbers, polymerization inhibitors, and silane coupling agents.
- an antioxidant and a light stabilizer is preferable for improving the storage stability of the photocurable adhesive composition and improving the weather resistance of the cured composition.
- Commercial products can be used as the antioxidant and the light stabilizer.
- Sumitomo Chemical Co., Ltd. Sumitizer BHT, Summarizer S, Summarizer BP-76, Summarizer MDP-S, Summarizer GM, Summarizer BBM-S, Summarizer WX-R, Summarizer NW, Summarizer BP-179, Summarizer BP-101, Summarizer GA-80, Sumilizer TNP, Sumilizer TPP-R, Sumilizer P-16 (all are trademarks), Adeka Stub AO-20, Adeka Stub AO-30, Adeka Stub AO-40, Adeka Stub AO-50, Adeka Stub AO-50, manufactured by Asahi Denka Kogyo Co., Ltd.
- ADK STAB AO-70 ADK STAB AO-80
- ADK STAB AO-330 ADK STAB PEP-4C
- ADK STAB PEP-8 ADK STAB PEP-24G
- ADK STAB PEP-36 ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB 522A, ADK STAB 329K, ADK STAB 1500, ADK STAB C, ADK STAB 135A, ADK STAB 3010 (all are trademarks), CHIBIN BIN 770, CHIBIN BIN 765, CHIBIN BIN 144, CHIBIN Bin 144 622, Tinuvin 111, Tinuvin 123, Tinuvin 292, Funkrill FA-711M, FA-712HM (all are trademarks) manufactured by Hitachi Chemical Co., Ltd., Double Chisorb 292 (trademark) manufactured by Bond Chemical Co., Ltd., and the like.
- the blending amount of these antioxidants and light stabilizers is not particularly limited, but is preferably 0.001 to 5 parts by mass, more preferably 0.001 parts by mass with respect to 100 parts by mass of the component (A) urethane (meth) acrylate oligomer. 01 to 3 parts by mass.
- the composition of the present invention is diluted with a solvent such as methyl ethyl ketone to prepare a liquid coating solution, and then the coating solution is a support such as a polyethylene terephthalate (PET) film that has been subjected to a release treatment in advance.
- PET polyethylene terephthalate
- a sheet or film-like composition having an arbitrary film thickness is obtained by coating on the surface by a flow coating method, a roll coating method, a gravure roll method, a wire bar method, a lip die coating method, and the like, and then drying the solvent. I can do it.
- it can be diluted with a solvent after blending each component, or can be diluted with a solvent in advance before blending each component.
- Urethane acrylate oligomer Urethane acrylate oligomer> Urethane acrylate oligomer (C1): Polycarbonate urethane acrylate, weight average molecular weight 15,000, a substance obtained in Comparative Synthesis Example 1 below (hereinafter sometimes referred to as “UA-C1”)
- Epoxy acrylate weight average molecular weight 520, EA-1020 (trademark) manufactured by Shin-Nakamura Chemical Co., Ltd. (hereinafter sometimes referred to as “UA-C2”)
- Phenoxy resin> Phenoxy resin (1): Phenoxy resin having a bisphenol structure, weight average molecular weight 50,000, Phenototo YP-70 (trademark) manufactured by Tohto Kasei Co., Ltd. (hereinafter sometimes referred to as “YP-70”)
- BM-5 Polyvinyl acetal: weight average molecular weight 53,000, SRECK BM-5 (trademark) manufactured by Sekisui Chemical Co., Ltd. (hereinafter sometimes referred to as “BM-5”)
- urethane acrylate oligomer of component (A) and comparative component (A) was synthesized as follows.
- the weight average molecular weight of each of the above substances is measured by gel permeation chromatography (GPC) and calculated by polystyrene conversion.
- GPC gel permeation chromatography
- the measurement conditions by GPC are as follows. Column: Shodex DS-4 (trademark, manufactured by Showa Denko KK) Column temperature: 40 ° C Mobile phase solvent: tetrahydrofuran (THF) Solvent flow rate: 1.0 ml / min Detector: differential refractometer (RI-71 (trademark), manufactured by Showa Denko KK) Sample concentration: 5.0%
- Test method The test methods used in Examples and Comparative Examples are as follows.
- the adhesive composition was diluted with a solvent (methyl ethyl ketone) having the same mass as the component (A) urethane acrylate oligomer contained in the composition to prepare a coating solution.
- a coating liquid Using this coating liquid, a film was formed on a polyethylene terephthalate (PET) film that had been subjected to a release treatment in advance using a bar coater so that the dry film thickness was 30 ⁇ m.
- the vertical and horizontal dimensions of the membrane were approximately 200 mm and 250 mm.
- this was placed in a drying furnace adjusted to about 80 ° C. to evaporate the solvent, and the state of the obtained sheet-like composition was visually observed in the state of being present on the polyethylene terephthalate film.
- the observation results are indicated by the following symbols.
- ⁇ Uniform, extremely smooth ⁇ : Almost uniform, with very slight irregularities and pinholes on the surface
- ⁇ Not uniform, with numerous irregularities and pinholes on the surface
- the measurement conditions with a rheometer are as follows. Measurement was made in the temperature range of 15 to 120 ° C., and the temperature at which the loss tangent and loss tangent at 25 ° C. were 1 was determined.
- Measuring device DAR-100 (trademark, manufactured by Reologica) Measurement mode: Oscillation strain control Geometry: P25 Gap 0.6mm Frequency: 1Hz Distortion: 1.0 ⁇ 10 ⁇ 3
- ⁇ Elastic modulus after curing (cured composition)> The sheet-like composition on the PET film obtained in the same manner as the film formability test was cured by irradiating with ultraviolet rays so as to obtain an integrated light quantity of 30 kJ / m 2 .
- the elastic modulus of the cured composition was measured.
- a measuring device a dynamic viscoelasticity measuring device (DMS6100 manufactured by Seiko Instruments Inc.) was used.
- a test piece a sheet-shaped composition removed from the PET film was superposed to a thickness of 0.7 mm, and adjusted so that measurement could be performed in a range of 20 mm long ⁇ 10 mm wide.
- the elastic modulus was measured in the temperature range of ⁇ 40 ° C. to 100 ° C., and the elastic modulus at 25 ° C. was obtained.
- the measurement frequency was 1 Hz.
- Step following test> Black ink was printed in a frame shape on one surface of a 0.7 mm ⁇ 50 mm ⁇ 100 mm glass plate with a width of 10 mm from the end of each side. The ink thickness was 10 ⁇ m.
- the sheet-like composition on the PET film obtained in the same manner as the film-formability test is so arranged that the sheet-like composition is in contact with the glass surface over the entire surface of a separately prepared 0.7 mm ⁇ 50 mm ⁇ 100 mm glass plate. Then, the PET film was removed.
- the printed surface of the glass plate printed with black ink was placed in contact with the sheet-like composition, the two glass plates were bonded by thermocompression bonding with a vacuum thermocompression bonding apparatus, and the bonded portion was visually observed. Bonding by the vacuum thermocompression bonding apparatus was performed at a temperature of 80 ° C., a pressure of 0.1 MPa, and a pressure holding time of 90 seconds. The observation results are indicated by the following symbols. ⁇ : The composition is sufficiently filled in the stepped portion of the pass and black ink. ⁇ : The composition is not sufficiently filled in the stepped portion of the rejected and black ink, and the gap remains.
- Tables 1 and 2 show the amount of each component and the results of each test.
- the unit of numerical values for each component is parts by mass.
- the blank of each component means 0 mass part.
- * 1 means that each component was not mixed and could not be formed into a film, and a stable measurement value could not be obtained.
- Examples 1 to 3 vary the weight average molecular weight of the component (A) urethane (meth) acrylate oligomer within the scope of the present invention. All showed good evaluation results.
- the compounding amount of component (B) is reduced with respect to Example 1 within the scope of the present invention. Although all showed the favorable evaluation result, especially Example 5 showed the favorable film formation property and the elasticity modulus after hardening was also appropriate, and showed the very favorable result.
- Example 6 differs from Example 1 in that the type of component (B) is changed. As in Example 1, good results were obtained.
- the comparative example 1 makes the weight average molecular weight of a component (A) urethane (meth) acrylate oligomer less than the range of this invention with respect to Example 5.
- FIG. It was already in a liquid state at 25 ° C., and the film forming property was remarkably deteriorated.
- an epoxy acrylate having a remarkably low weight average molecular weight is used in place of the component (A) with respect to Example 5.
- the step following ability was remarkably poor, and the elastic modulus after curing was remarkably high.
- the comparative example 3 increases the compounding quantity of a component (B) beyond the range of this invention.
- the melting temperature of the composition before curing became so high that the liquid crystal panel was damaged, and the step following ability was remarkably poor.
- the comparative example 4 reduces the compounding quantity of a component (B) to less than the range of this invention.
- the film formability deteriorated.
- the comparative example 5 uses polyvinyl acetal instead of the component (B) phenoxy resin. Since each component in the composition was not mixed, film formation could not be performed satisfactorily and stable measurement values could not be obtained. The total light transmittance was also low.
- the photocurable adhesive composition of the present invention can be melted at a low temperature, it does not damage the adherend during bonding. Further, when adhering between uneven adherend members, the adhering members can be bonded together without generating a gap. Therefore, it is particularly effective for bonding the liquid crystal panel and the cover panel, and when used for bonding the liquid crystal panel and the cover panel, the liquid crystal panel is not damaged and has an uneven coating member. At the time of adhesion, the two members can be bonded together without generating a gap between the adherend members.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Adhesive Tapes (AREA)
- Liquid Crystal (AREA)
Abstract
Description
(1)(A)重量平均分子量が20,000~100,000であるウレタン(メタ)アクリレートオリゴマー100質量部、(B)フェノキシ樹脂5~70質量部、及び(C)光重合開始剤0.1~10質量部を含む光硬化性接着剤組成物であって、未硬化組成物の25℃における損失正接(損失弾性率/貯蔵弾性率)が1未満であり、かつ未硬化組成物の損失正接が1以上になる温度が80℃以下であることを特徴とする接着剤組成物である。
(2)(A)ウレタン(メタ)アクリレートオリゴマーの重量平均分子量が、40,000~100,000であるところの上記(1)記載の接着剤組成物、
(3)(A)ウレタン(メタ)アクリレートオリゴマーの重量平均分子量が、50,000~70,000であるところの上記(1)記載の接着剤組成物、
(4)(B)フェノキシ樹脂の配合量が、10~60質量部であるところの上記(1)~(3)のいずれか一つに記載の接着剤組成物、
(5)(B)フェノキシ樹脂の配合量が、40~50質量部であるところの上記(1)~(3)のいずれか一つに記載の接着剤組成物、
(6)(C)光重合開始剤の配合量が、0.5~6質量部であるところの上記(1)~(5)のいずれか一つに記載の接着剤組成物、
(7)(C)光重合開始剤の配合量が、3~6質量部であるところの上記(1)~(5)のいずれか一つに記載の接着剤組成物、
(8)未硬化組成物の25℃における損失正接が、0.1~0.6であるところの上記(1)~(7)のいずれか一つに記載の接着剤組成物、
(9)未硬化組成物の損失正接が1以上になる温度が、40~80℃であるところの上記(1)~(8)のいずれか一つに記載の接着剤組成物、
(10)未硬化組成物が25℃において固体であり、80℃以下の温度で溶融するところの上記(1)~(9)のいずれか一つに記載の接着剤組成物、
(11)未硬化組成物が25℃において固体であり、40~80℃で溶融するところの上記(1)~(9)のいずれか一つに記載の接着剤組成物、
(12)上記未硬化組成物がシート又はフィルム状であるところの上記(1)~(11)のいずれか一つに記載の接着剤組成物、
(13)硬化組成物の弾性率が、1.0×104~1.0×109Paであるところの上記(1)~(12)のいずれか一つに記載の接着剤組成物、
(14)硬化組成物の弾性率が、1.0×105~1.0×107Paであるところの上記(1)~(12)のいずれか一つに記載の接着剤組成物、
(15)硬化組成物の全光線透過率が、85%以上であるところの上記(1)~(14)のいずれか一つに記載の接着剤組成物、
(16)液晶パネル接着用の上記(1)~(15)のいずれか一つに記載の接着剤組成物、
(17)上記(1)~(16)のいずれか一つに記載の接着剤組成物で接着してなる積層構造物、
(18)液晶パネル及びそのカバーパネルを上記(1)~(16)のいずれか一つに記載の接着剤組成物で接着してなる積層構造物
を挙げることができる。
、ビフェニル型フェノキシ樹脂等が挙げられる。これらは、単独で使用してもよく、複数を組み合わせて使用してもよい。フェノキシ樹脂としては、成膜性の観点から、特に、ビスフェノール型フェノキシ樹脂が好ましい。フェノキシ樹脂の重量平均分子量は、30,000~70,000であることが好ましい。これらフェノキシ樹脂は、常温で接着剤組成物を固体状態に保つために使用される。また、反応により予期しない硬化が生ずることを防止するため、フェノキシ樹脂としては、未変性のものがより好ましい。
実施例及び比較例において使用した物質は下記の通りである。
ウレタンアクリレートオリゴマー(1):ポリカーボネートウレタンアクリレート、重量平均分子量60,000、下記の合成例1で得られた物質である(以下、「UA-1」と示すことがある)
ウレタンアクリレートオリゴマー(2):ポリカーボネートウレタンアクリレート、重量平均分子量20,000、下記の合成例2で得られた物質である(以下、「UA-2」と示すことがある)
ウレタンアクリレートオリゴマー(3):ポリエーテルウレタンアクリレート、重量平均分子量33,000、根上工業株式会社製UN-6301(以下、「UA-3」と示すことがある)
ウレタンアクリレートオリゴマー(C1):ポリカーボネートウレタンアクリレート、重量平均分子量15,000、下記の比較合成例1で得られた物質である(以下、「UA-C1」と示すことがある)
エポキシアクリレート:重量平均分子量520、新中村化学工業株式会社製EA-1020(商標)(以下、「UA-C2」と示すことがある)
フェノキシ樹脂(1):ビスフェノール構造のフェノキシ樹脂、重量平均分子量50,000、東都化成株式会社製フェノトートYP-70(商標)(以下、「YP-70」と示すことがある)
フェノキシ樹脂(2):ビスフェノール構造のフェノキシ樹脂、重量平均分子量52,000、Inchem社製Phenoxy
Resin PKHH(商標)(以下、「PKHH」と示すことがある)
ポリビニルアセタール:重量平均分子量53,000、積水化学工業株式会社製エスレックBM-5(商標)(以下、「BM-5」と示すことがある)
Irgacure
184(2‐ヒドロキシ‐2‐メチル‐1‐フェニルプロパン‐1‐オン、チバスペシャリティケミカルズ株式会社製)(以下、「184」と示すことがある)
温度計、攪拌機及び還流管を備えたガラス製反応容器に、メチルエチルケトン582.26質量部、イソホロンジイソシアネート59.94質量部、4‐メトキシフェノール0.05質量部及びジブチルスズジラウレート0.1質量部を仕込み、撹拌しながら60℃に加温した。これに、70℃に加温したポリカーボネートジオール(T5651(商標)、旭化成ケミカルズ株式会社製)520質量部を滴下した。滴下終了後、3時間撹拌して反応させた。次いで、2‐ヒドロキシエチルアクリレート2.32質量部を滴下し、滴下終了後、3時間撹拌して反応させた。赤外分光によって、イソシアネート基が消失するのを確認して反応終了とし、ポリカーボネートウレタンアクリレートを得た。重量平均分子量は60,000であった。
メチルエチルケトン511.3質量部、イソホロンジイソシアネート55.5質量部、4‐メトキシフェノール0.1質量部、ジブチルスズジラウレート0.1質量部、ポリカーボネートジオール450質量部及び2‐ヒドロキシエチルアクリレート5.8質量部を使用した以外は、合成例1と同一に実施した。得られたポリカーボネートウレタンアクリレートの重量平均分子量は20,000であった。
メチルエチルケトン413.58質量部、イソホロンジイソシアネート46.62質量部、4‐メトキシフェノール0.1質量部、ジブチルスズジラウレート0.1質量部、ポリカーボネートジオール360質量部及び2‐ヒドロキシエチルアクリレート6.96質量部を使用した以外は、合成例1と同一に実施した。得られたポリカーボネートウレタンアクリレートの重量平均分子量は15,000であった。
重量平均分子量が120,000程度のポリカーボネートウレタンアクリレートを製造するために、メチルエチルケトン620質量部、イソホロンジイソシアネート63質量部、4‐メトキシフェノール0.1質量部、ジブチルスズジラウレート0.1質量部、ポリカーボネートジオール550質量部及び2‐ヒドロキシエチルアクリレート1.2質量部を使用した以外は、合成例1と同一に実施した。しかし、反応中反応物がゲル化して、所望のポリカーボネートウレタンアクリレートを得ることができなかった。
カラム:Shodex DS-4(商標、昭和電工株式会社製)
カラム温度:40℃
移動相溶媒:テトラヒドロフラン(THF)
溶媒流量:1.0ミリリットル/分
検出器:示差屈折率計(RI-71(商標)、昭和電工株式会社製)
試料濃度:5.0%
実施例及び比較例において使用した試験法は下記の通りである。
接着剤組成物を、該組成物中に含まれる成分(A)ウレタンアクリレートオリゴマーと同質量の溶剤(メチルエチルケトン)で希釈して塗液を調製した。該塗液を使用して、予め離型処理が施されたポリエチレンテレフタレート(PET)フィルム上に、乾燥膜厚が30μmとなるようにバーコーターを用いて成膜した。なお、該膜の縦及び横の寸法はおよそ200mm及び250mmであった。次いで、これを約80℃に調節された乾燥炉に装入して溶剤を蒸発させた後、得られたシート状組成物の状態を、ポリエチレンテレフタレートフィルム上に存在する状態で目視観察した。観察結果を下記の記号で示した。
◎:一様であり、極めて平滑
○:ほぼ一様であり、表面に極僅かに凹凸及びピンホールあり
×:一様でなく、表面に多数の凹凸及びピンホールあり
成膜性試験と同一にしてシート状組成物を得た。次いで、該シート状組成物をPETフィルム上から取り外し、これを重ね合わせて厚さ0.6mmにした。これを試験片として、レオメーターを使用して損失正接を測定した。損失正接が1未満であると固体的性質が大きいことを示す。一方、損失正接が1以上であると液体的性質が大きいことを示す。
測定装置:DAR‐100(商標、Reologica社製)
測定モード:Oscillation strain control
ジオメトリー:P25 Gap0.6mm
周波数:1Hz
歪:1.0×10-3
成膜性試験と同一にして得たPETフィルム上のシート状組成物に、積算光量30kJ/m2となるように紫外線を照射して硬化した。次いで、該硬化組成物の弾性率を測定した。測定装置として、動的粘弾性測定装置(セイコーインスツルメンツ株式会社製DMS6100)を使用した。試験片としては、PETフィルム上から取り外したシート状組成物を重ね合わせて厚さ0.7mmとしたものを用意して、縦20mm×横10mmの範囲で測定し得るように調節した。弾性率は-40℃~100℃の温度範囲で測定し、25℃における弾性率を求めた。また、測定周波数は1Hzとした。
成膜性試験と同一にして得たPETフィルム上のシート状組成物を、3.0mm×25mm×50mmのガラス板の一面全面に、シート状組成物がガラス面に接するようにして貼り付け、積算光量30kJ/m2となるように紫外線を照射して硬化した。次いで、これからPETフィルムを取り外したものを試験片として使用した。この試験片の全光線透過率を、JIS-K-7361-1に準拠して、濁度計(日本電色工業株式会社製NDH2000(商標))を用いて測定した。その結果を下記の記号で示した。
○:合格、全光線透過率は85%以上
×:不合格、全光線透過率は85%未満
0.7mm×50mm×100mmのガラス板の一面に、各辺の端部から夫々10mmの幅で黒色インクを枠状に印刷した。インクの厚みを10μmとした。一方、成膜性試験と同一にして得たPETフィルム上のシート状組成物を、別途用意した0.7mm×50mm×100mmのガラス板の一面全面に、シート状組成物がガラス面に接するようにして貼り付けた後、PETフィルムを取り外した。次いで、黒色インクで印刷されたガラス板の印刷面とシート状組成物が接するよう配置し、両者のガラス板を真空熱圧着装置で熱圧着して貼り合わせ、貼り合わせ部分を目視観察した。真空熱圧着装置による貼り合わせは、温度80℃、圧力0.1MPa、圧力保持時間90秒とした。観察結果を下記の記号で示した。
○:合格、黒色インクの段差部分に組成物が十分に充填されている
×:不合格、黒色インクの段差部分に組成物が十分には充填されておらず空隙が残る
表1及び2に各成分の配合量及び各試験の結果を示した。これらの表中、各成分の数値の単位は質量部である。また、各成分の空欄は0質量部を意味する。
Claims (10)
- (A)重量平均分子量が20,000~100,000であるウレタン(メタ)アクリレートオリゴマー100質量部、(B)フェノキシ樹脂5~70質量部、及び(C)光重合開始剤0.1~10質量部を含む光硬化性接着剤組成物であって、未硬化組成物の25℃における損失正接(損失弾性率/貯蔵弾性率)が1未満であり、かつ未硬化組成物の損失正接が1以上になる温度が80℃以下であることを特徴とする接着剤組成物。
- 未硬化組成物の25℃における損失正接が、0.1~0.6であるところの請求項1記載の接着剤組成物。
- 未硬化組成物の損失正接が1以上になる温度が、40~80℃であるところの請求項1又は2記載の接着剤組成物。
- 未硬化組成物が25℃において固体であり、40~80℃で溶融するところの請求項1~3のいずれか一つに記載の接着剤組成物。
- 上記未硬化組成物がシート又はフィルム状であるところの請求項1~4のいずれか一つに記載の接着剤組成物。
- 硬化組成物の弾性率が、1.0×105~1.0×107Paであるところの請求項1~5のいずれか一つに記載の接着剤組成物。
- 硬化組成物の全光線透過率が、85%以上であるところの請求項1~6のいずれか一つに記載の接着剤組成物。
- 液晶パネル接着用の請求項1~7のいずれか一つに記載の接着剤組成物。
- 請求項1~8のいずれか一つに記載の接着剤組成物で接着してなる積層構造物。
- 液晶パネル及びそのカバーパネルを請求項1~8のいずれか一つに記載の接着剤組成物で接着してなる積層構造物。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009801389917A CN102171305B (zh) | 2008-10-04 | 2009-09-14 | 光固化性粘合剂组合物 |
| US13/122,521 US20110206869A1 (en) | 2008-10-04 | 2009-09-14 | Photocurable adhesive composition |
| KR1020117007233A KR101667777B1 (ko) | 2008-10-04 | 2009-09-14 | 광경화성 접착제 조성물 |
| US14/633,855 US9790405B2 (en) | 2008-10-04 | 2015-02-27 | Photocurable adhesive composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008259127A JP5716881B2 (ja) | 2008-10-04 | 2008-10-04 | 光硬化性接着剤組成物 |
| JP2008-259127 | 2008-10-04 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/122,521 A-371-Of-International US20110206869A1 (en) | 2008-10-04 | 2009-09-14 | Photocurable adhesive composition |
| US14/633,855 Division US9790405B2 (en) | 2008-10-04 | 2015-02-27 | Photocurable adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010038366A1 true WO2010038366A1 (ja) | 2010-04-08 |
Family
ID=42073151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2009/004580 Ceased WO2010038366A1 (ja) | 2008-10-04 | 2009-09-14 | 光硬化性接着剤組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20110206869A1 (ja) |
| JP (1) | JP5716881B2 (ja) |
| KR (1) | KR101667777B1 (ja) |
| CN (1) | CN102171305B (ja) |
| TW (1) | TWI470048B (ja) |
| WO (1) | WO2010038366A1 (ja) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013122144A1 (ja) * | 2012-02-17 | 2013-08-22 | 株式会社スリーボンド | 光学用光硬化性シート型接着剤組成物 |
| WO2015068558A1 (ja) | 2013-11-05 | 2015-05-14 | 三菱樹脂株式会社 | 粘着剤組成物 |
| JP2015163699A (ja) * | 2015-03-19 | 2015-09-10 | 協立化学産業株式会社 | 光学表示体又はタッチセンサー貼り合せ用光硬化型接着組成物及びこれを用いて貼り合わせた光学表示体又はタッチセンサー |
| WO2015137178A1 (ja) * | 2014-03-10 | 2015-09-17 | 三菱樹脂株式会社 | 画像表示装置構成用積層体の製造方法 |
| JP2016199758A (ja) * | 2016-06-17 | 2016-12-01 | 協立化学産業株式会社 | 光学表示体又はタッチセンサー貼り合せ用光硬化型接着組成物及びこれを用いて貼り合わせた光学表示体又はタッチセンサー |
| KR20170008804A (ko) | 2014-08-12 | 2017-01-24 | 미쓰비시 쥬시 가부시끼가이샤 | 투명 점착 시트 |
| KR20180015716A (ko) | 2015-06-02 | 2018-02-13 | 미쯔비시 케미컬 주식회사 | 광경화형 점착 시트, 점착 시트 및 화상 표시 장치 |
| US10982122B2 (en) | 2014-09-05 | 2021-04-20 | 3M Innovative Properties Company | Heat conformable curable adhesive films |
| JP2021181560A (ja) * | 2020-05-14 | 2021-11-25 | 株式会社スリーボンド | 光硬化性組成物 |
| JPWO2022080044A1 (ja) * | 2020-10-13 | 2022-04-21 |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101147841B1 (ko) * | 2010-06-08 | 2012-05-21 | 도레이첨단소재 주식회사 | 전자부품 제조용 점착테이프 |
| TW201317315A (zh) * | 2011-08-26 | 2013-05-01 | Denki Kagaku Kogyo Kk | 固化性樹脂組成物 |
| JP5895585B2 (ja) * | 2012-02-23 | 2016-03-30 | 日立金属株式会社 | 接着剤、接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム |
| JP6049302B2 (ja) * | 2012-05-18 | 2016-12-21 | 旭化成株式会社 | 光学機能部材 |
| WO2013176436A1 (ko) * | 2012-05-21 | 2013-11-28 | 주식회사 동진쎄미켐 | 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트 |
| CN104334662B (zh) * | 2012-05-21 | 2018-11-09 | 东进世美肯株式会社 | 光固化型光学透明粘合剂组合物及包含其的粘合片 |
| JP6150546B2 (ja) * | 2013-02-08 | 2017-06-21 | 蘇州凡賽特材料科技有限公司 | 画像表示装置用粘着シート、画像表示装置の製造方法及び画像表示装置 |
| JP6163824B2 (ja) * | 2013-03-28 | 2017-07-19 | 日立化成株式会社 | 画像表示装置用粘着性樹脂組成物、画像表示装置用粘着シート、画像表示装置の製造方法及び画像表示装置 |
| KR20140123779A (ko) * | 2013-04-15 | 2014-10-23 | 동우 화인켐 주식회사 | 광경화 코팅 조성물, 이를 이용한 코팅 필름 및 편광판 |
| JP6115284B2 (ja) * | 2013-04-22 | 2017-04-19 | Dic株式会社 | 紫外線硬化型粘着剤組成物及び粘着剤 |
| JP6274206B2 (ja) | 2013-04-24 | 2018-02-07 | 王子ホールディングス株式会社 | 粘着シート及び積層体とその製造方法 |
| JP6056641B2 (ja) * | 2013-05-07 | 2017-01-11 | 日立化成株式会社 | 画像表示装置用粘着シート、画像表示装置の製造方法及び画像表示装置 |
| JP6422641B2 (ja) * | 2013-09-27 | 2018-11-14 | Dic株式会社 | 接着シート、画像表示装置及びその製造方法 |
| US20160251497A1 (en) * | 2013-10-21 | 2016-09-01 | Adeka Corporation | Method for producing stabilized polymer |
| JP6159290B2 (ja) * | 2013-10-31 | 2017-07-05 | 日東電工株式会社 | 液晶パネル及び該液晶パネルに用いられる偏光子積層体 |
| GB201404021D0 (en) | 2014-03-05 | 2014-04-23 | Lumina Adhesives Ab | Low cytotoxity switchable adhesive compositions, medical dressings and skin coverings, and methods of treatment using same |
| KR20180057681A (ko) * | 2015-09-21 | 2018-05-30 | 로오드 코포레이션 | 접착제 조성물 및 접합 방법 |
| JP6771715B2 (ja) * | 2015-09-29 | 2020-10-21 | 協立化学産業株式会社 | 相溶組成物、接着剤組成物、複合構造物並びに複合構造物の製造方法及び解体方法 |
| WO2017061547A1 (ja) | 2015-10-07 | 2017-04-13 | 積水化学工業株式会社 | ポリビニルアセタール樹脂組成物、接着シート及び接着シートの製造方法 |
| US11141919B2 (en) | 2015-12-09 | 2021-10-12 | Holo, Inc. | Multi-material stereolithographic three dimensional printing |
| JP6762033B2 (ja) * | 2016-11-01 | 2020-09-30 | 協立化学産業株式会社 | 相溶組成物、接着剤組成物、複合構造物、複合構造物の製造方法及び解体方法、チップの表面加工方法並びに複合体の製造方法 |
| US11208576B2 (en) | 2017-03-03 | 2021-12-28 | 3M Innovative Properties Company | High performance photocurable optically clear adhesive |
| WO2018160614A1 (en) | 2017-03-03 | 2018-09-07 | 3M Innovative Properties Company | High performance photocurable optically clear adhesive |
| US10935891B2 (en) | 2017-03-13 | 2021-03-02 | Holo, Inc. | Multi wavelength stereolithography hardware configurations |
| GB2564956B (en) | 2017-05-15 | 2020-04-29 | Holo Inc | Viscous film three-dimensional printing systems and methods |
| JP6704013B2 (ja) * | 2017-06-01 | 2020-06-03 | 株式会社有沢製作所 | 両面接着シート、3d液晶パネル及びその製造方法 |
| US10245785B2 (en) | 2017-06-16 | 2019-04-02 | Holo, Inc. | Methods for stereolithography three-dimensional printing |
| JP7306015B2 (ja) * | 2018-03-27 | 2023-07-11 | Dic株式会社 | 硬化性接着剤組成物、それを用いた接着シート、それを含む積層体及びその製造方法 |
| JP7306014B2 (ja) * | 2018-03-27 | 2023-07-11 | Dic株式会社 | 硬化性接着剤組成物、及びそれを用いた接着シート、その接着シートを含む積層体及びその製造方法 |
| JP7453606B2 (ja) * | 2018-03-27 | 2024-03-21 | Dic株式会社 | 接着シートを含む積層体の製造方法 |
| KR102323585B1 (ko) * | 2018-09-03 | 2021-11-05 | 아라까와 가가꾸 고교 가부시끼가이샤 | 활성 에너지선 경화형 점착제 조성물, 경화물 및 점착시트 |
| JP7097582B2 (ja) * | 2018-12-18 | 2022-07-08 | 協立化学産業株式会社 | 複合体の製造方法及び複合体 |
| CN113474147A (zh) | 2018-12-26 | 2021-10-01 | 霍洛公司 | 用于三维打印系统和方法的传感器 |
| WO2020167665A1 (en) | 2019-02-11 | 2020-08-20 | Holo, Inc. | Methods and systems for three-dimensional printing |
| KR102098274B1 (ko) * | 2019-10-31 | 2020-04-07 | 주식회사 에디스플레이 | 열가소성 핫 멜트 접착제 조성물 및 이의 용도 |
| KR102098275B1 (ko) * | 2019-10-31 | 2020-04-07 | 주식회사 에디스플레이 | 디스플레이 액정 글라스용 열가소성 핫 멜트 접착제 조성물 및 이의 접합방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238538A (ja) * | 1998-02-23 | 1999-08-31 | Hitachi Chem Co Ltd | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
| JP2001163931A (ja) * | 1999-12-13 | 2001-06-19 | Three Bond Co Ltd | 光硬化性シール剤組成物及びシール層付き部材 |
| JP2009120683A (ja) * | 2007-11-13 | 2009-06-04 | Three Bond Co Ltd | 硬化性樹脂組成物および硬化方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH086070B2 (ja) | 1986-09-27 | 1996-01-24 | 住友ベークライト株式会社 | 接着剤組成物 |
| JPS6383184A (ja) | 1986-09-27 | 1988-04-13 | Sumitomo Bakelite Co Ltd | フイルム状接着剤 |
| GB9110783D0 (en) * | 1991-05-18 | 1991-07-10 | Ciba Geigy | Adhesives |
| US5731050A (en) * | 1995-02-14 | 1998-03-24 | Bridgestone Corporation | Adhesive compositions for liquid crystal displays |
| JP3759294B2 (ja) | 1997-08-29 | 2006-03-22 | 日立化成工業株式会社 | 電極の接続方法 |
| JPH11116903A (ja) | 1997-10-20 | 1999-04-27 | Sekisui Chem Co Ltd | 光硬化型粘接着シート |
| JP4151101B2 (ja) | 1998-02-23 | 2008-09-17 | 日立化成工業株式会社 | 電極接続用接着剤及びこれを用いた微細電極の接続構造、並びに、電極の接続方法 |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| JP2004197016A (ja) | 2002-12-20 | 2004-07-15 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
| US7531580B2 (en) * | 2003-04-10 | 2009-05-12 | Unimatec Co., Ltd. | Process for production of uv-curable liquid polyurethane resin |
| JPWO2005090509A1 (ja) * | 2004-03-19 | 2008-01-31 | 株式会社スリーボンド | 光硬化性感熱フィルム状接着剤組成物 |
| KR101081671B1 (ko) * | 2005-03-16 | 2011-11-09 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조체 및 반도체 장치 |
| JP2007023147A (ja) | 2005-07-15 | 2007-02-01 | Toagosei Co Ltd | 光学材料用活性エネルギー線硬化型組成物 |
| JP2006173100A (ja) | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
| JP5052050B2 (ja) | 2006-06-16 | 2012-10-17 | 日立化成工業株式会社 | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
-
2008
- 2008-10-04 JP JP2008259127A patent/JP5716881B2/ja active Active
-
2009
- 2009-09-14 CN CN2009801389917A patent/CN102171305B/zh active Active
- 2009-09-14 US US13/122,521 patent/US20110206869A1/en not_active Abandoned
- 2009-09-14 KR KR1020117007233A patent/KR101667777B1/ko active Active
- 2009-09-14 WO PCT/JP2009/004580 patent/WO2010038366A1/ja not_active Ceased
- 2009-09-29 TW TW98132854A patent/TWI470048B/zh active
-
2015
- 2015-02-27 US US14/633,855 patent/US9790405B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238538A (ja) * | 1998-02-23 | 1999-08-31 | Hitachi Chem Co Ltd | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
| JP2001163931A (ja) * | 1999-12-13 | 2001-06-19 | Three Bond Co Ltd | 光硬化性シール剤組成物及びシール層付き部材 |
| JP2009120683A (ja) * | 2007-11-13 | 2009-06-04 | Three Bond Co Ltd | 硬化性樹脂組成物および硬化方法 |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9562172B2 (en) | 2012-02-17 | 2017-02-07 | Three Bond Fine Chemical Co., Ltd. | Photocurable sheet-type adhesive composition for optical use |
| JPWO2013122144A1 (ja) * | 2012-02-17 | 2015-05-18 | スリーボンドファインケミカル株式会社 | 光学用光硬化性シート型接着剤組成物 |
| WO2013122144A1 (ja) * | 2012-02-17 | 2013-08-22 | 株式会社スリーボンド | 光学用光硬化性シート型接着剤組成物 |
| WO2015068558A1 (ja) | 2013-11-05 | 2015-05-14 | 三菱樹脂株式会社 | 粘着剤組成物 |
| JPWO2015068558A1 (ja) * | 2013-11-05 | 2017-03-09 | 三菱樹脂株式会社 | 粘着剤組成物 |
| JPWO2015137178A1 (ja) * | 2014-03-10 | 2017-04-06 | 三菱樹脂株式会社 | 画像表示装置構成用積層体の製造方法 |
| CN106104658B (zh) * | 2014-03-10 | 2019-11-29 | 三菱化学株式会社 | 图像显示装置构成用层叠体的制造方法 |
| WO2015137178A1 (ja) * | 2014-03-10 | 2015-09-17 | 三菱樹脂株式会社 | 画像表示装置構成用積層体の製造方法 |
| CN106104658A (zh) * | 2014-03-10 | 2016-11-09 | 三菱树脂株式会社 | 图像显示装置构成用层叠体的制造方法 |
| KR20170008804A (ko) | 2014-08-12 | 2017-01-24 | 미쓰비시 쥬시 가부시끼가이샤 | 투명 점착 시트 |
| US10611932B2 (en) | 2014-08-12 | 2020-04-07 | Mitsubishi Chemical Corporation | Transparent adhesive sheet |
| US10982122B2 (en) | 2014-09-05 | 2021-04-20 | 3M Innovative Properties Company | Heat conformable curable adhesive films |
| JP2015163699A (ja) * | 2015-03-19 | 2015-09-10 | 協立化学産業株式会社 | 光学表示体又はタッチセンサー貼り合せ用光硬化型接着組成物及びこれを用いて貼り合わせた光学表示体又はタッチセンサー |
| KR20180015716A (ko) | 2015-06-02 | 2018-02-13 | 미쯔비시 케미컬 주식회사 | 광경화형 점착 시트, 점착 시트 및 화상 표시 장치 |
| KR20200019792A (ko) | 2015-06-02 | 2020-02-24 | 미쯔비시 케미컬 주식회사 | 광경화형 점착 시트, 점착 시트 및 화상 표시 장치 |
| JP2016199758A (ja) * | 2016-06-17 | 2016-12-01 | 協立化学産業株式会社 | 光学表示体又はタッチセンサー貼り合せ用光硬化型接着組成物及びこれを用いて貼り合わせた光学表示体又はタッチセンサー |
| JP2021181560A (ja) * | 2020-05-14 | 2021-11-25 | 株式会社スリーボンド | 光硬化性組成物 |
| JP7719352B2 (ja) | 2020-05-14 | 2025-08-06 | 株式会社スリーボンド | 光硬化性組成物 |
| JPWO2022080044A1 (ja) * | 2020-10-13 | 2022-04-21 | ||
| WO2022080044A1 (ja) * | 2020-10-13 | 2022-04-21 | 株式会社スリーボンド | 燃料電池用光硬化型シート状シール剤、硬化物、燃料電池およびシール工法 |
| JP7747976B2 (ja) | 2020-10-13 | 2025-10-02 | 株式会社スリーボンド | 燃料電池用光硬化型シート状シール剤、硬化物、燃料電池およびシール工法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI470048B (zh) | 2015-01-21 |
| US20110206869A1 (en) | 2011-08-25 |
| JP5716881B2 (ja) | 2015-05-13 |
| US20150166842A1 (en) | 2015-06-18 |
| TW201022387A (en) | 2010-06-16 |
| CN102171305A (zh) | 2011-08-31 |
| JP2010090204A (ja) | 2010-04-22 |
| CN102171305B (zh) | 2013-07-17 |
| KR20110066156A (ko) | 2011-06-16 |
| KR101667777B1 (ko) | 2016-10-19 |
| US9790405B2 (en) | 2017-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5716881B2 (ja) | 光硬化性接着剤組成物 | |
| KR101598160B1 (ko) | 활성 에너지선 경화형 수지 조성물, 접착제 및 적층 필름 | |
| JP6625534B2 (ja) | タッチパネル用紫外線硬化型接着剤組成物及び物品 | |
| WO2013122144A1 (ja) | 光学用光硬化性シート型接着剤組成物 | |
| EP3184568A1 (en) | Acrylate-terminated urethane polybutadienes from low-monomer 1:1 monoadductes from reactive olefinic compounds and diisocyanates and hydroxy-terminated polybutadienes for liquid optically clear adhesives (locas) | |
| JP6778106B2 (ja) | タッチパネル用紫外線硬化型樹脂組成物、それを用いた貼り合せ方法及び物品 | |
| JP2012131847A (ja) | 活性エネルギー線硬化性粘着剤組成物、粘着剤シート及び表示装置 | |
| WO2016121706A1 (ja) | 感光性樹脂組成物及びその硬化物 | |
| JP2018024785A (ja) | Uv硬化型樹脂組成物 | |
| JP6722584B2 (ja) | タッチパネル用紫外線硬化型樹脂組成物、それを用いた貼り合せ方法及び物品 | |
| JP5534125B2 (ja) | 硬化性シート組成物 | |
| WO2015190558A1 (ja) | 画像表示装置用両面粘着シート及び物品 | |
| JP5098722B2 (ja) | 硬化性樹脂組成物、貼付用フィルム積層体、及び衝撃吸収用積層体 | |
| KR20230126753A (ko) | 수지 조성물, 수지 조성물의 제공을 포함하는 접착 부재 제조 방법, 및 접착 부재를 포함하는 표시 장치 | |
| JP7184853B2 (ja) | 紫外線硬化型接着剤組成物、それを用いた貼り合せ方法及び物品 | |
| JP2010265402A (ja) | 光及び熱硬化併用型樹脂組成物、電子ペーパー用の光及び熱硬化併用型防湿シール材、電子ペーパー及びその製造方法 | |
| JP2016222861A (ja) | 画像表示装置用両面粘着シート及び物品 | |
| KR20150112818A (ko) | 활성 에너지선 경화형 수지 조성물, 경화물, 접착제 및 적층 필름 | |
| JPWO2019093157A1 (ja) | 紫外線硬化型接着剤組成物、その硬化物および紫外線硬化型接着剤組成物を用いた光学部材の製造方法 | |
| CN108690548B (zh) | 无溶剂型粘合剂组合物、粘合剂和粘合片 | |
| JP2021070707A (ja) | 紫外線硬化型接着剤組成物 | |
| JP2025101079A (ja) | 活性エネルギー線硬化型接着剤 | |
| JP2019189712A (ja) | 紫外線硬化型の接着剤組成物、それを用いた貼り合わせ方法及び物品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200980138991.7 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09817409 Country of ref document: EP Kind code of ref document: A1 |
|
| DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
| ENP | Entry into the national phase |
Ref document number: 20117007233 Country of ref document: KR Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 13122521 Country of ref document: US |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 09817409 Country of ref document: EP Kind code of ref document: A1 |