WO2010027020A1 - 2-フェニル-4,4’-ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 - Google Patents
2-フェニル-4,4’-ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 Download PDFInfo
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- WO2010027020A1 WO2010027020A1 PCT/JP2009/065423 JP2009065423W WO2010027020A1 WO 2010027020 A1 WO2010027020 A1 WO 2010027020A1 JP 2009065423 W JP2009065423 W JP 2009065423W WO 2010027020 A1 WO2010027020 A1 WO 2010027020A1
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/065—Polyamides; Polyesteramides; Polyimides
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- C07D209/02—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
- C07D209/44—Iso-indoles; Hydrogenated iso-indoles
- C07D209/48—Iso-indoles; Hydrogenated iso-indoles with oxygen atoms in positions 1 and 3, e.g. phthalimide
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- C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
- C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
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- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/249921—Web or sheet containing structurally defined element or component
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- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/24995—Two or more layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2631—Coating or impregnation provides heat or fire protection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions
- the present invention relates to terminal-modified imide oligomers and varnishes and cured products thereof, and particularly relates to materials for members that can be used in a wide range of fields that require easy moldability and high heat resistance, including aircraft and space industry equipment. .
- Aromatic polyimide is used as a material in a wide range of fields because it is a high polymer and has the highest level of heat resistance and is excellent in mechanical and electrical properties.
- Patent Document 1 discloses that a cured product has good heat resistance and mechanical properties and has a highly practical terminal-modified imide oligomer and its cured product.
- a terminal-modified imide oligomer and a cured product thereof are disclosed.
- a novel terminal-modified imide oligomer having high practicality can be obtained, and a novel terminal-modified polyimide having excellent mechanical properties such as heat resistance, elastic modulus, tensile strength and elongation can be obtained. It is described that a cured product can be obtained.
- NMP N-methyl-2-pyrrolidone
- a diamine monomer having a sterically bulky structure such as 9,9-bis (4- (4-aminophenoxy) phenyl) fluorene, as introduced in Patent Document 4 and Patent Document 5, is copolymerized.
- these also generally have a tendency that the glass transition temperature is lowered and the elongation at break is small and brittle.
- the imide oligomer for press-fit and transfer molding as introduced in Patent Document 5 has a method of lowering the degree of polymerization in order to obtain high fluidity or softening the structure of the diamine used. Although the solubility of an imide oligomer improves by this, the glass transition temperature of terminal cured
- the present invention relates to a novel terminal-modified imide oligomer excellent in moldability such as solubility in organic solvents, solution storage stability and low melt viscosity, varnish obtained by dissolving them in an organic solvent, and terminal-modified imide oligomer It is an object of the present invention to provide a cured product having high thermal and mechanical properties such as heat resistance, elastic modulus, tensile breaking strength and tensile breaking elongation, a prepreg, and a fiber-reinforced laminate.
- the melt flowability of the imide oligomer is not seen and it is likely to be infusible and solvent insoluble. At present, it can be molded into a cured product having a glass transition temperature of 270 ° C. or higher.
- terminal-modified imide oligomers having high solvent solubility.
- aromatic diamines containing 2-phenyl-4,4′-diaminodiphenyl ether sufficient melt fluidity can be obtained even when 1,2,4,5-benzenetetracarboxylic acids are used. And the hardened
- the present invention provides a soluble terminal-modified imide oligomer using 2-phenyl-4,4'-diaminodiphenyl ether represented by the general formula (1) as a novel terminal-modified imide oligomer.
- R 1 and R 2 represent a divalent aromatic diamine residue
- R 3 and R 4 represent a tetravalent aromatic tetracarboxylic acid residue
- R 5 and R 6 represent a hydrogen atom or phenyl. One of them represents a phenyl group
- m and n satisfy the relationship of m ⁇ 1, n ⁇ 0, 1 ⁇ m + n ⁇ 20 and 0.05 ⁇ m / (m + n) ⁇ 1 and repeat (The unit arrangement may be either block or random.)
- the aromatic diamine residue in the general formula (1) refers to an aromatic organic group present between two amino groups in the aromatic diamine.
- the aromatic tetracarboxylic acid residue in the general formula (1) refers to an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid.
- the aromatic organic group is an organic group having an aromatic ring.
- the aromatic organic group is preferably an organic group having 4 to 30 carbon atoms, more preferably an organic group having 4 to 18 carbon atoms, and further preferably an organic group having 4 to 12 carbon atoms. .
- the aromatic organic group is preferably a group consisting of carbon and hydrogen having 6 to 30 carbon atoms, more preferably a group consisting of carbon and hydrogen having 6 to 18 carbon atoms, and 6 to 12 carbon atoms.
- the group consisting of carbon and hydrogen is more preferable.
- the aromatic tetracarboxylic acids are 1,2,4,5-benzenetetracarboxylic acids, 3,3 ′, 4,4′-biphenyltetracarboxylic acids, or bis (3,4-carboxyphenyl) ethers, Or a combination of at least two of these is preferred, among which 1,2,4,5-benzenetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, or More preferred is bis (3,4-carboxyphenyl) ether dianhydride.
- the general formula is represented by the following general formula (1-2), respectively. ), Represented by the general formula (1-3).
- R 1 and R 2 represent a divalent aromatic diamine residue.
- R 5 and R 6 represent a hydrogen atom or a phenyl group, and one of them represents a phenyl group.
- the relationship of m ⁇ 1, n ⁇ 0, 1 ⁇ m + n ⁇ 20 and 0.05 ⁇ m / (m + n) ⁇ 1 is satisfied, and the arrangement of repeating units may be either block or random.
- R 1 and R 2 represent a divalent aromatic diamine residue.
- R 5 and R 6 represent a hydrogen atom or a phenyl group, and one of them represents a phenyl group.
- the relationship of m ⁇ 1, n ⁇ 0, 1 ⁇ m + n ⁇ 20 and 0.05 ⁇ m / (m + n) ⁇ 1 is satisfied, and the arrangement of repeating units may be either block or random.
- the terminal-modified imide oligomer is preferably a terminal-modified imide oligomer that can be dissolved in N-methyl-2-pyrrolidone at a solid content concentration of 30% by weight or more at room temperature.
- the present invention also provides a varnish obtained by dissolving the terminal-modified imide oligomer in an organic solvent.
- the present invention also provides a cured product obtained by heat curing the terminal-modified imide oligomer or its varnish.
- the cured product preferably has a glass transition temperature (Tg) of 300 ° C. or higher.
- the present invention also provides a film obtained from the cured product, having a tensile elongation at break of 10% or more.
- the present invention also provides an imide prepreg obtained by impregnating a fiber with the terminal-modified imide oligomer or its varnish and drying it.
- the present invention also provides a fiber-reinforced laminate produced from the terminal-modified imide oligomer or varnish thereof, or an imide prepreg obtained by using them.
- the present invention has excellent moldability such as solubility in organic solvents, solution storage stability and low melt viscosity, and has high heat resistance, and high mechanical properties such as tensile elastic modulus, tensile breaking strength and tensile breaking elongation.
- Novel end-modified imide oligomers and varnishes and cured products thereof can be obtained. Since this imide oligomer varnish is greatly superior in hydrolysis resistance compared to an amic acid oligomer varnish, it can be stored stably for a long period of time without causing a decrease in viscosity.
- the imide prepreg having excellent moldability, excellent moldability, excellent reliability and excellent reliability, and a laminate having very high heat resistance can be obtained using the imide prepreg.
- R 1 and R 2 represent a divalent aromatic diamine residue
- R 3 and R 4 represent a tetravalent aromatic tetracarboxylic acid residue
- R 5 and R 6 represent a hydrogen atom or phenyl. One of them represents a phenyl group, and m and n satisfy the relationship of m ⁇ 1, n ⁇ 0, 1 ⁇ m + n ⁇ 20 and 0.05 ⁇ m / (m + n) ⁇ 1 and repeat (The unit arrangement may be either block or random.)
- the soluble terminal-modified imide oligomer using 2-phenyl-4,4′-diaminodiphenyl ether represented by the following formula is preferably as follows.
- 1,2,4,5-benzenetetracarboxylic acids especially the acid dianhydride
- 3,3 ′, 4,4′-biphenyltetracarboxylic acids especially the acid dianhydride
- R 3 and R 4 are independently selected from residues derived from the various tetracarboxylic acids and may be the same or different from each other. Further, when m> 1 and n> 1, R 3 (R 4 ) may be the same as or different from each other.
- R 5 and R 6 are a hydrogen atom or a phenyl group, and one of them represents a phenyl group, and when m> 1, R 5 is a phenyl group and R 6 is a hydrogen atom; A unit in which 5 is a hydrogen atom and R 6 is a phenyl group may be optionally included.
- the 1,2,4,5-benzenetetracarboxylic acids are 1,2,4,5-benzenetetracarboxylic acid, 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), or It is an acid derivative such as an ester or salt of 1,2,4,5-benzenetetracarboxylic acid, and 1,2,4,5-benzenetetracarboxylic dianhydride is particularly suitable.
- the imide oligomer in the case where R 3 and R 4 are 1,2,4,5-benzenetetracarboxylic acids is represented by the general formula (1-2).
- 3,3 ′, 4,4′-biphenyltetracarboxylic acids are 3,3 ′, 4,4′-biphenyltetracarboxylic acid, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride Product (s-BPDA) or an acid derivative such as an ester or salt of 3,3 ′, 4,4′-biphenyltetracarboxylic acid, in particular, 3,3 ′, 4,4′-biphenyltetracarboxylic acid Anhydrides are optimal.
- the imide oligomer when R 3 and R 4 are 3,3 ′, 4,4′-biphenyltetracarboxylic acids is represented by the general formula (1-3).
- bis (3,4-carboxyphenyl) ethers examples include bis (3,4-carboxyphenyl) ether, bis (3,4-carboxyphenyl) ether dianhydride (s-ODPA), and bis (3 , 4-carboxyphenyl) ether derivatives such as esters or salts, with bis (3,4-carboxyphenyl) ether dianhydride being most suitable.
- 1,2,4,5-benzenetetracarboxylic acid, or 3,3 ′, 4,4′-biphenyltetracarboxylic acid, or bis (3,4-carboxyphenyl) ether Although it is fundamental to use them alone or in combination, 1,2,4,5-benzenetetracarboxylic acids or 3,3 ′, 4,4′-biphenyltetra is effective as long as the effects of the present invention are obtained.
- a part of the carboxylic acid or bis (3,4-carboxyphenyl) ether may be substituted with another aromatic tetracarboxylic acid compound.
- BTDA 4,4′-benzophenonetetracarboxylic dianhydride
- a-BPDA 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride
- i-BPDA 3,3′-biphenyltetracarboxylic dianhydride
- 2,2-bis (3,4-dicarboxyphenyl) methane dianhydride, bis (3,4-carboxyphenyl) ether dianhydride 1,2,3,4-benzenetetracarboxylic dianhydride, etc. which can be used alone or in combination of two or more.
- a part of the above-mentioned 2-phenyl-4,4′-diaminodiphenyl ether is substituted with another aromatic diamine compound such as 1,4-diaminobenzene, 1,3-diaminobenzene, 1,2-diaminobenzene.
- 9,9-bis (4-aminophenyl) fluorene 9,9-bis (4- (4-aminophenoxy) phenyl) fluorene, or 1,3-diaminobenzene is preferable as the aromatic diamine compound.
- 9,9-bis (4-aminophenyl) fluorene 9,9-bis (4- (4-aminophenoxy) phenyl) fluorene, or 1,3-diaminobenzene is particularly preferable.
- it has the outstanding effect that it has high solubility while having high solubility.
- the present invention can be used even if it is not necessarily copolymerization.
- 4- (2-phenylethynyl) phthalic anhydride is preferably used as the unsaturated acid anhydride for terminal modification (end cap).
- the 4- (2-phenylethynyl) phthalic anhydride is preferably used in a proportion in the range of 5-200 mol%, particularly 5-150 mol%, based on the total amount of acids.
- the terminal-modified imide oligomer of the present invention includes, for example, the aforementioned 3,3 ′, 4,4′-biphenyltetracarboxylic acid (especially this acid dianhydride), 1,2,4,5-benzenetetracarboxylic acid (In particular, one or more aromatic tetracarboxylic acid compounds selected from the group consisting of this acid dianhydride) and bis (3,4-carboxyphenyl) ethers (particularly this dianhydride); Aromatic diamines containing 2-phenyl-4,4′-diaminodiphenyl ether and 4- (2-phenylethynyl) phthalic anhydride are all acid anhydride groups (in the case of adjacent dicarboxylic acid groups, carboxyl Each component is used in an organic solvent to be described later in an organic solvent of about 100 ° C.
- polymerization is performed at a reaction temperature of 80 ° C. or less to produce an “oligomer having an amide-acid bond”, and then the amidic acid oligomer (also referred to as an amic acid oligomer) is imidized at a low temperature of about 0 to 140 ° C.
- Imide oligomers having 4- (2-phenylethynyl) phthalic anhydride residues after dehydration and cyclization, by adding an agent or by heating to a high temperature of 140 to 275 ° C. can be obtained.
- a particularly preferable production method of the terminal-modified imide oligomer of the present invention is as follows, for example. First, an aromatic diamine containing 2-phenyl-4,4′-diaminodiphenyl ether is uniformly dissolved in an organic solvent described later, and then 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride or 1 , 2,4,5-benzenetetracarboxylic dianhydride or aromatic tetracarboxylic dianhydride containing bis (3,4-carboxyphenyl) ether is added to the solution and dissolved uniformly to give about 5 to The mixture is stirred at a reaction temperature of 60 ° C.
- the reaction solution is stirred at 140 to 275 ° C. for 5 minutes to 24 hours to imidize the amidic acid oligomer to form a terminal-modified imide oligomer. If necessary, the reaction solution is cooled to near room temperature. Thus, the terminal-modified imide oligomer of the present invention can be obtained.
- an inert gas such as nitrogen gas or argon gas or in a vacuum.
- organic solvent examples include N-methyl-2-pyrrolidone (NMP), N, N-dimethylacetamide (DMAc), N, N-diethylacetamide, N-methylcaprolactam, ⁇ -butyrolactone (GBL), cyclohexanone, and the like. Can be mentioned. These solvents may be used alone or in combination of two or more. With respect to the selection of these solvents, known techniques for soluble polyimides can be applied.
- the terminal-modified imide oligomer produced as described above may be isolated as a powdered product by pouring the reaction solution into water or the like if necessary.
- the imide oligomer may be used in the form of powder or by dissolving the powder product in the solvent when necessary. Further, the reaction solution may be used as it is, or it may be concentrated or diluted as appropriate, and used as a solution composition (varnish) of the terminal-modified imide oligomer.
- the imide oligomer varnish Since the imide oligomer varnish has little fear of hydrolysis, it can be stably stored for a long period of time without causing a decrease in viscosity or the like as compared with an amic acid oligomer varnish.
- a solvent for long-term storage it is desirable to use an amide solvent such as N-methyl-2-pyrrolidone, which is a better solvent, in order to prevent gelation.
- the terminal-modified oligomer of the present invention may be a mixture of different molecular weights. Moreover, you may mix the terminal modified imide oligomer of this invention with another soluble polyimide.
- a soluble terminal-modified imide oligomer using 2-phenyl-4,4′-diaminodiphenyl ether represented by the general formula (1) of the present invention is a solid content of 30% by weight in the above organic solvent, particularly NMP at room temperature. It is preferable that it can be dissolved.
- the above-mentioned terminal-modified imide oligomer varnish can be applied to a support and heat-cured at 280 to 500 ° C. for 5 to 200 minutes to form a film.
- the tensile elongation at break of this film is preferably 10% or more. This measurement is based on the method described later.
- the powder of the terminal-modified imide oligomer is filled into a mold or the like, and is 1 to 1000 kg / cm 2 at 10 to 280 ° C. for about 1 second to 100 minutes.
- a preform can be formed by compression molding, and the preform can be heated at 280 to 500 ° C. for about 10 minutes to 40 hours to obtain a cured product.
- cured material is 300 degreeC or more. This measurement is based on the method described later.
- the imide prepreg of the present invention can be obtained, for example, as follows.
- the powdery terminal-modified imide oligomer is dissolved in an organic solvent, and the reaction solution is left as it is or is concentrated or diluted as appropriate to obtain a terminal-modified imide oligomer solution composition (varnish).
- a prepreg is obtained by impregnating an end-modified imide oligomer varnish with a moderate concentration adjusted into a fiber or fiber fabric aligned in one direction in a plane and drying in a dryer at 20 to 180 ° C. for 1 minute to 20 hours. Can do. At this time, the amount of resin adhering to the fiber or fiber fabric is about 30 to 50% by weight.
- the fiber or fiber fabric that can be used in the present invention is not particularly limited, but in the case of use in an aircraft or the like, a carbon fiber or a fabric thereof can be exemplified.
- the fiber reinforced laminate of the present invention can be obtained, for example, as follows. A predetermined number of the above prepregs are stacked and heat cured at a temperature of 280 to 500 ° C. and a pressure of 1 to 1000 kg / cm 2 using an autoclave or a hot press for about 10 minutes to 40 hours to obtain a laminate. I can do it. Further, in the present invention, in addition to using the above prepreg, a laminate obtained by adhering a powder of the terminal-modified imide oligomer of the present invention to a fiber fabric can be laminated and heat-cured in the same manner as described above to obtain a laminated plate. . Moreover, it is preferable that the fiber reinforced laminated board of this invention obtained as mentioned above has a glass transition temperature (Tg) of 300 degreeC or more. This measurement is based on the method described later.
- Tg glass transition temperature
- Tensile test (elastic modulus measurement test, breaking strength measurement test, breaking elongation measurement test): Tensileon / UTM-II-20 manufactured by Orientec Co., Ltd., at room temperature and a tensile speed of 3 mm / min. I went there.
- the test piece was a film having a length of 20 mm, a width of 3 mm, and a thickness of 80 to 175 ⁇ m.
- Example 1 2-phenyl-4,4′-diaminodiphenyl ether (2.761 g, 10 mmol) and N-methyl-2-pyrrolidone (10 mL) were added to a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, and dissolved. Thereafter, 2.354 g (8 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and 2.4 mL of N-methyl-2-pyrrolidone were added, and the mixture was stirred for 2.5 hours at room temperature under a nitrogen stream. The polymerization reaction was carried out at 60 ° C.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state.
- gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 104 Pa ⁇ sec (340 ° C.).
- a film-like cured product (thickness 109 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 309 ° C. (DSC), 5% by weight of TGA. The decrease temperature was 549 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.23 GPa, the breaking strength was 139 MPa, and the breaking elongation was 14%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in the NMP solvent. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 2 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 2.071 g (7.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4- (4 -Aminophenoxy) phenyl) fluorene 1.332 g (2.5 mmol) and 10 mL of N-methyl-2-pyrrolidone were added and dissolved, and then 2,354 g of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state.
- gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 251 Pa ⁇ sec (352 ° C.).
- a film-like cured product (thickness 105 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 317 ° C. (DSC) and 5% by TGA. The decrease temperature was 549 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.35 GPa, the breaking strength was 125 MPa, and the breaking elongation was 10%.
- Example 3 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 1.3807 g (5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4- (4-amino) was added. Phenoxy) phenyl) fluorene 2.6631 g (5 mmol) and 10 mL of N-methyl-2-pyrrolidone were added and dissolved, and then 2,354 g (8 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride was added.
- N-methyl-2-pyrrolidone (4.6 mL) was added, and polymerization reaction was performed in a nitrogen stream at room temperature for 2.5 hours, at 60 ° C. for 1.5 hours, and further at room temperature for 1 hour to produce an amic acid oligomer.
- 0.993 g (4 mmol) of 4- (2-phenylethynyl) phthalic anhydride was added, reacted at room temperature for 12 hours under a nitrogen stream, and terminally modified, followed by stirring at 195 ° C. for 5 hours to form an imide bond. It was. After cooling, the reaction solution was poured into 200 mL of ion exchange water, and the precipitated powder was separated by filtration.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state.
- gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 398 Pa ⁇ sec (354 ° C.).
- a film-like cured product (thickness 98 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 317 ° C. (DSC) and 5% by TGA. The decrease temperature was 561 ° C. Further, the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.31 GPa, the breaking strength was 126 MPa, and the breaking elongation was 18%.
- the obtained terminal-modified imide oligomer is represented by the general formula (2) in which R 1 is a 4,4′-diaminodiphenyl ether residue or a 9,9-bis (4- (4-aminophenoxy) phenyl) fluorene residue.
- the powdery terminal-modified imide oligomer uncured product obtained above was insoluble in NMP solvent at room temperature.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 1084 Pa ⁇ sec (349 ° C.).
- a film-like cured product (thickness 150 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 330 ° C. (DSC) and a 5% weight by TGA. The decreasing temperature was 550 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.84 GPa, the breaking strength was 117 MPa, and the breaking elongation was 12%.
- Example 4 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 2.071 g (7.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4-aminophenyl) ) 0.8711 g (2.5 mmol) of fluorene and 10 mL of N-methyl-2-pyrrolidone were added, and after dissolution, 2.354 g (8 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and N -1.6 mL of methyl-2-pyrrolidone was added and polymerization reaction was carried out in a nitrogen stream at room temperature for 2.5 hours, at 60 ° C for 1.5 hours, and further at room temperature for 1 hour to produce an amic acid oligomer.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state.
- gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 2244 Pa ⁇ sec (345 ° C.).
- a film-like cured product (thickness: 113 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 346 ° C. (DSC), 5% by TGA. The decrease temperature was 553 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.99 GPa, the breaking strength was 155 MPa, and the breaking elongation was 12%.
- the powdery terminal-modified imide oligomer uncured product obtained above was insoluble in NMP solvent. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 5 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 1.3807 g (5 mmol) of 2, phenyl-4,4′-diaminodiphenyl ether and 9,9-bis (4-aminophenyl) fluorene 1.7422 g (5 mmol) and 10 mL of N-methyl-2-pyrrolidone were added, and after dissolution, 2.354 g (8 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and N-methyl- 3.1 mL of 2-pyrrolidone was added, and an amic acid oligomer was produced by polymerization reaction under a nitrogen stream at room temperature for 2.5 hours, at 60 ° C.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 2765 Pa ⁇ sec (344 ° C.).
- a film-like cured product (thickness: 156 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 366 ° C. (DSC) and a 5% weight by TGA. The decrease temperature was 552 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.47 GPa, the breaking strength was 140 MPa, and the breaking elongation was 10%.
- the powdery terminal-modified imide oligomer uncured product obtained above was insoluble in NMP solvent at room temperature.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 1695 Pa ⁇ sec (341 ° C.).
- a film-like cured product (thickness: 155 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 345 ° C. (DSC), 5% by weight of TGA. The decrease temperature was 547 ° C.
- the mechanical properties of this film-shaped cured product by a tensile test were an elastic modulus of 2.82 GPa, a breaking strength of 106 MPa, and a breaking elongation of 14%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 6 Add 2-phenyl-4,4'-diaminodiphenyl ether (2.7613 g, 10 mmol) and N-methyl-2-pyrrolidone (10 mL) to a three-necked 100 mL flask equipped with a thermometer, stirrer, and nitrogen inlet tube and dissolve. Thereafter, 1.7450 g (8 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and 0.8 mL of N-methyl-2-pyrrolidone were added, and the mixture was heated at 60 ° C. for 2.5 hours at room temperature under a nitrogen stream. For 1.5 hours and further at room temperature for 1 hour to produce an amic acid oligomer.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state. It was.
- this solution was allowed to stand at room temperature, gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 208 Pa ⁇ s (343 ° C.).
- a film-like cured product (thickness 99 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 354 ° C. (DSC), The 5% weight loss temperature by TGA was 540 ° C. Further, the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.24 GPa, the breaking strength was 133 MPa, and the breaking elongation was 17%.
- the powdery terminal-modified imide oligomer uncured product obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 7 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 2.6232 g (9.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4- (4 -Aminophenoxy) phenyl) fluorene (0.2661 g, 0.5 mmol) and N-methyl-2-pyrrolidone (10 mL) were added and dissolved, and then 1,2,4,5-benzenetetracarboxylic dianhydride (1.7450 g, 8 mmol) ) And 1.1 mL of N-methyl-2-pyrrolidone were polymerized under a nitrogen stream at room temperature for 2.5 hours, at 60 ° C.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 159 Pa ⁇ s (341 ° C.).
- a film-like cured product (thickness 115 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 352 ° C. (DSC) and a 5% weight by TGA. The decrease temperature was 536 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.87 GPa, the breaking strength was 122 MPa, and the breaking elongation was 21%.
- the mixture was polymerized under a nitrogen stream for 2.5 hours at room temperature, 1.5 hours at 60 ° C., and further for 1 hour at room temperature to produce an amic acid oligomer.
- 0.993 g (4 mmol) of 4- (2-phenylethynyl) phthalic anhydride was added, reacted at room temperature for 12 hours under a nitrogen stream, and terminally modified, followed by stirring at 195 ° C. for 5 hours to form an imide bond. It was. Precipitation of imide oligomers was observed during imidization.
- the reaction solution was poured into 900 mL of ion exchange water, and the precipitated powder was filtered off.
- the powder obtained by washing with 60 mL of methanol for 30 minutes and filtering was dried under reduced pressure at 130 ° C. for 1 day to obtain a product.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 8 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 2.4850 g (9.0 mmol) of 2, phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4- (4 -Aminophenoxy) phenyl) fluorene (0.5326 g, 1.0 mmol) and N-methyl-2-pyrrolidone (10 mL) were added and dissolved, and then 1,2,4,5-benzenetetracarboxylic dianhydride (1.7450 g, 8 mmol) ) And 1.3 mL of N-methyl-2-pyrrolidone were polymerized under a nitrogen stream at room temperature for 2.5 hours, at 60 ° C.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 76 Pa ⁇ s (335 ° C.).
- a film-like cured product (thickness 115 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 350 ° C. (DSC) and a 5% weight by TGA. The decrease temperature was 538 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.79 GPa, the breaking strength was 115 MPa, and the breaking elongation was 19%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 9 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 2.0709 g (7.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4- (4 -Aminophenoxy) phenyl) fluorene (1.3315 g, 2.5 mmol) and N-methyl-2-pyrrolidone (10 mL) were added and dissolved, and then 1,2,4,5-benzenetetracarboxylic dianhydride (1.7450 g, 8 mmol) ) And 2.1 mL of N-methyl-2-pyrrolidone were added and subjected to a polymerization reaction in a nitrogen stream at room temperature for 2.5 hours, at 60 ° C.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 553 Pa ⁇ s (345 ° C.).
- a film-like cured product (thickness 151 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 358 ° C. (DSC), 5% by weight of TGA.
- the decrease temperature was 538 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.96 GPa, the breaking strength was 119 MPa, and the breaking elongation was 17%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 10 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 2.6232 g (9.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4-aminophenyl) was added. ) 0.1742 g (0.5 mmol) of fluorene and 10 mL of N-methyl-2-pyrrolidone were added, and after dissolution, 1.7450 g (8 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and N-methyl were dissolved.
- the powder obtained by washing with 80 mL of methanol for 30 minutes and filtering was dried under reduced pressure at 130 ° C. for 1 day to obtain a product.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 226 Pa ⁇ s (341 ° C.).
- a film-like cured product (thickness 110 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 353 ° C. (DSC) and 5% by TGA.
- the decrease temperature was 538 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.99 GPa, the breaking strength was 122 MPa, and the breaking elongation was 15%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 11 In a three-necked 2000 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 220.79 g (0.80 mol) of 2-phenyl-4,4′-diaminodiphenyl ether and 9,9-bis (4-aminophenyl) were added.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 154 Pa ⁇ s (325 ° C.).
- a film-like cured product (thickness: 111 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 371 ° C. (DSC), 5% by TGA. The decrease temperature was 538 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.97 GPa, the breaking strength was 119 MPa, and the breaking elongation was 13%.
- the remaining reaction liquid after cooling (solid content concentration: 35% by weight) is a 30 cm ⁇ 30 cm “Wesfight IM-600 6K” plain weave material (fiber basis weight 195 g / m), which has been desized with acetone in advance. Carbon fiber). This was dried in a dryer at 100 ° C. for 10 minutes to obtain an imide prepreg. The resin content in the obtained prepreg was 38%, and the residual volatile content was 17%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 12 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 2.0709 g (7.5 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether, 9,9-bis (4-aminophenyl) ) 0.8711 g (2.5 mmol) of fluorene and 10 mL of N-methyl-2-pyrrolidone were added, and after dissolution, 1.7450 g (8 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and N-methyl were dissolved.
- the powder obtained by washing with 80 mL of methanol for 30 minutes and filtering was dried under reduced pressure at 130 ° C. for 1 day to obtain a product.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 1323 Pa ⁇ s (351 ° C.).
- a film-like cured product (thickness: 175 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer with a hot press at 370 to 420 ° C. for 1 hour has a Tg of 396 ° C. (DSC) and 5 by TGA.
- The% weight loss temperature was 544 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.82 GPa, the breaking strength was 101 MPa, and the breaking elongation was 11%.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was insoluble in NMP solvent at room temperature. Since this powdery terminal-modified imide oligomer did not exhibit melt fluidity even at 300 ° C. or higher, a good molded product (film-like cured product) could not be obtained.
- Example 13 To a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 4.9703 g (18.0 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether and 0.2163 g of 1,3-diaminobenzene ( 2.0 mmol) and 20 mL of N-methyl-2-pyrrolidone were added, and after dissolution, 3.4899 g (16 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and 1 mL of N-methyl-2-pyrrolidone were added.
- the mixture was subjected to a polymerization reaction at room temperature for 2.5 hours under a nitrogen stream to produce an amic acid oligomer.
- This reaction solution 1.9858 g (8 mmol) of 4- (2-phenylethynyl) phthalic anhydride was added and reacted for 12 hours at room temperature under a nitrogen stream, followed by terminal modification, followed by stirring at 195 ° C. for 5 hours for imide bonding. It was. After cooling, the reaction solution was poured into 900 mL of ion exchange water, and the precipitated powder was filtered off. The powder obtained by washing with 80 mL of methanol for 30 minutes and filtering was dried under reduced pressure at 130 ° C. for 1 day to obtain a product.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 199 Pa ⁇ s (343 ° C.).
- a film-like cured product (thickness 111 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg of 365 ° C. (DSC), 5% by TGA.
- the decrease temperature was 541 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.84 GPa, the breaking strength was 116 MPa, and the breaking elongation was 15%.
- Example 14 Add 4-181 g (16 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether and 20 mL of N-methyl-2-pyrrolidone to a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube and dissolve. Thereafter, 1.7450 g (8 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and 3 mL of N-methyl-2-pyrrolidone were added, and a polymerization reaction was carried out at room temperature for 2.5 hours under a nitrogen stream. An oligomer was produced.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature. In the NMP solution (varnish) in which 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 0.8 Pa ⁇ s (325 ° C.).
- a film-like cured product (thickness 80 ⁇ m) obtained by heating the powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 367 ° C.
- the 5% weight loss temperature by TGA was 528 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 3.08 GPa, the breaking strength was 121 MPa, and the breaking elongation was 12%.
- Example 15 Add 3-136 g (12 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether and 10 mL of N-methyl-2-pyrrolidone to a 3-mL 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube and dissolve. Thereafter, 1.7450 g (8 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and 3 mL of N-methyl-2-pyrrolidone were added, and a polymerization reaction was carried out at room temperature for 2.5 hours under a nitrogen stream. An oligomer was produced.
- the uncured product of the powdery terminal-modified imide oligomer obtained above was soluble in NMP solvent by 30% or more at room temperature.
- NMP solution varnish
- 30% by weight of this terminal-modified imide oligomer was dissolved, gelation was not observed even after one month.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 30 Pa ⁇ s (338 ° C.).
- a film-like cured product (thickness 90 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 355 ° C.
- the 5% weight loss temperature by TGA was 529 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.93 GPa, the breaking strength was 120 MPa, and the breaking elongation was 12%.
- Example 16 Add 3-phenyl-4,4′-diaminodiphenyl ether (3.0374 g, 11 mmol) and N-methyl-2-pyrrolidone (10 mL) to a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube and dissolve. After that, 2.1812 g (10 mmol) of 1,2,4,5-benzenetetracarboxylic dianhydride and 3 mL of N-methyl-2-pyrrolidone were added, and a polymerization reaction was carried out at room temperature for 2.5 hours in a nitrogen stream. An oligomer was produced.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state. It was.
- this solution was allowed to stand at room temperature, gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 11100 Pa ⁇ s (330 ° C.).
- a film-like cured product (thickness of 175 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 341 ° C. (DSC), The 5% weight loss temperature by TGA was 542 ° C.
- the mechanical properties of this film-shaped cured product by a tensile test were an elastic modulus of 2.82 GPa, a breaking strength of 110 MPa, and a breaking elongation of 15%.
- Example 17 Add 3-136 g (12 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether and 12 mL of N-methyl-2-pyrrolidone to a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube and dissolve.
- R 1 and R 2 are represented by 2-phenyl-4,4′-diaminodiphenyl ether residue, and R 3 is 1,2,4,5.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state. It was.
- this solution was allowed to stand at room temperature, gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 449 Pa ⁇ s (° C.).
- a film-like cured product (thickness 85 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 350 ° C. (DSC), The 5% weight loss temperature by TGA was 539 ° C.
- the mechanical properties of this film-shaped cured product by a tensile test were an elastic modulus of 3.15 GPa, a breaking strength of 127 MPa, and a breaking elongation of 19%.
- Example 18 Add 3-136 g (12 mmol) of 2-phenyl-4,4′-diaminodiphenyl ether and 12 mL of N-methyl-2-pyrrolidone to a three-necked 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube and dissolve.
- R 1 and R 2 are represented by 2-phenyl-4,4′-diaminodiphenyl ether residue, and R 3 is 1,2,4,5.
- the powdery terminal-modified imide oligomer uncured product obtained above was soluble in NMP solvent at 30% by weight or more at room temperature.
- NMP solution varnish
- gelation was observed after several days, but when heated at 80 ° C. again, it became a solution state.
- gelation was observed again after several days.
- the minimum melt viscosity of the powdery terminal-modified imide oligomer before curing was 159 Pa ⁇ s (° C.).
- a film-like cured product (thickness 85 ⁇ m) obtained by heating this powdery terminal-modified imide oligomer at 370 ° C. for 1 hour using a hot press has a Tg (glass transition temperature) of 344 ° C. (DSC), The 5% weight loss temperature by TGA was 540 ° C.
- the mechanical properties of the cured product in the form of a film were as follows: the elastic modulus was 2.98 GPa, the breaking strength was 135 MPa, and the breaking elongation was 17%.
- Example 19 A polyimide film was placed as a release film on a 30 cm ⁇ 30 cm stainless steel plate, and 12 prepregs produced in Example 11 were laminated thereon. Furthermore, the polyimide film and the stainless steel plate were overlapped, and heated to 260 ° C. at a heating rate of 5 ° C./min under vacuum conditions on a hot press. After heating at 260 ° C. for 2 hours, the temperature was increased to 370 ° C. at a rate of temperature increase of 3 ° C./min at 1.3 MPa, and heated and pressurized at 370 ° C. for 1 hour. Judging from the appearance, ultrasonic flaw detection test, and cross-sectional observation test, a good laminate without large voids was obtained. The obtained laminate had a glass transition temperature of 358 ° C., a fiber volume content (V f ) of 0.60, and a resin content of 33% by weight.
- V f fiber volume content
- the present invention is excellent in moldability such as solubility in organic solvents, solution storage stability and low melt viscosity, can be easily formed into a film, and has mechanical properties such as heat resistance and elastic modulus, tensile strength and elongation of the cured product.
- moldability such as solubility in organic solvents, solution storage stability and low melt viscosity
- mechanical properties such as heat resistance and elastic modulus, tensile strength and elongation of the cured product.
- These are highly terminally modified imide oligomers and varnishes, and cured products thereof, which can be used in a wide range of fields that require easy moldability and high heat resistance, including aircraft and space industry equipment.
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Abstract
Description
で表される2-フェニル-4,4’-ジアミノジフェニルエーテルを用いた可溶性末端変性イミドオリゴマーは、以下のものであることが好ましい。
従って、式中R3およびR4は、それぞれ独立に上記各種のテトラカルボン酸類に由来する残基から選択され、互いに同一であっても、異なっていても良い。また、m>1およびn>1の場合、R3(R4)は、互いに同一であっても、異なっていても良い。また、R5およびR6は水素原子又はフェニル基であって、いずれか一方がフェニル基を表し、m>1の場合は、R5がフェニル基でR6が水素原子である単位と、R5が水素原子でR6がフェニル基である単位とが任意に含まれていて良い。
本発明の末端変性イミドオリゴマーは、例えば、前記の3,3’,4,4’-ビフェニルテトラカルボン酸類(特に、この酸二無水物)、1,2,4,5-ベンゼンテトラカルボン酸類(特に、この酸二無水物)、およびビス(3,4-カルボキシフェニル)エーテル類(特に、この二無水物)からなる群より選ばれる1種あるいは2種以上の芳香族テトラカルボン酸類化合物と、2-フェニル-4,4’-ジアミノジフェニルエーテルを含む芳香族ジアミン類、および4-(2-フェニルエチニル)無水フタル酸とが、全成分の酸無水基(隣接するジカルボン酸基の場合は、カルボキシル基2モル当たり1モルの酸無水基とみなす)の全量とアミノ基の全量とがほぼ等量になるように使用して、各成分を、後述の有機溶媒中で、約100℃以下、特に80℃以下の反応温度で重合させて、「アミド-酸結合を有するオリゴマー」を生成し、次いで、そのアミド酸オリゴマー(アミック酸オリゴマーともいう)を、約0~140℃の低温でイミド化剤を添加する方法によるか、あるいは140~275℃の高温に加熱する方法によるかして、脱水・環化させて、末端に4-(2-フェニルエチニル)無水フタル酸残基を有するイミドオリゴマーを得ることができる。
粉末状の末端変性イミドオリゴマーを有機溶媒に溶解して、また、反応液をそのままか、あるいは適宜濃縮または希釈するかして、末端変性のイミドオリゴマーの溶液組成物(ワニス)とする。適度に濃度調整した末端変性イミドオリゴマーワニスを、平面状に一方向に引き揃えた繊維あるいは繊維織物に含浸させ、20~180℃の乾燥機中で1分~20時間乾燥させてプリプレグを得ることができる。この際に繊維あるいは繊維織物に付着する樹脂量は30~50重量%前後となる。本発明で用いることができる繊維あるいは繊維織物としては、特に制限はないが、航空機等での利用の場合は、炭素繊維あるいはその織物などが例示できる。
前記のプリプレグを所定枚数重ねて、オートクレーブまたはホットプレス等を用いて、280~500℃の温度かつ1~1000kg/cm2の圧力で10分から40時間程度加熱硬化して、積層板を得ることが出来る。また、本発明では、上記のプリプレグを用いるほか、本発明の末端変性イミドオリゴマーの粉末を繊維織物に付着させたものを積層し、前記と同様にして加熱硬化し、積層版を得ることもできる。
また、上記のようにして得られた本発明の繊維強化積層板は、ガラス転移温度(Tg)が300℃以上であることが好ましい。尚、この測定は後述の方法による。
<試験方法>
(1)5%重量減少温度測定:TAインスツルメンツ製SDT-2960型熱重量分析装置(TGA)を用い、窒素気流下、5℃/min.の昇温速度により測定した。
(2)硬化物のガラス転移温度測定:TAインスツルメンツ製DSC-2010型示差走査熱量計(DSC)を用い、窒素気流下、5℃/min.の昇温速度により測定した。
(3)繊維強化積層板のガラス転移温度測定:TAインスツルメンツ製DMA-Q-800型動的粘弾性測定(DMA)装置を用い、片持ち梁方式、0.1%のひずみ、1Hzの周波数、窒素気流下、3℃/min.の昇温速度により測定した。貯蔵弾性率が低下する変曲点をガラス転移温度とした。
(4)最低溶融粘度測定:TAインスツルメンツ製AR2000型レオメーターを用い、25mmパラレルプレートで4℃/min.の昇温速度により測定した。
(5)引張試験(弾性率測定試験、破断強度測定試験、破断伸び測定試験):オリエンテック社製TENSILON/UTM-II-20を用い、室温にて、引張速度3mm/min.で行った。試験片形状は、長さ20mm、幅3mm、厚さ80-175μmのフィルムとした。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.761g(10mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン2.4mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、下記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=4、n=0である(尚、より具体的には一般式(1-3)で示される構造を有する。実施例2~5についても同様である。)。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル2.002g(10mmol)とN-メチル-2-ピロリドン16mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)を加えて窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて175℃で5時間攪拌しイミド結合させた。イミド化反応中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、下記一般式(2)において、R1が4,4’-ジアミノジフェニルエーテル残基で表され、平均としてm=4、n=0である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.071g(7.5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン1.332g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン3.7mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2がフルオレニリデンジフェニルエーテル残基で表され、R3およびR4が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=3、n=1である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル1.3807g(5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン2.6631g(5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン4.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、R3およびR4が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=2、n=2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.001g(5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン2.6631g(5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン4.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化反応中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(2)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、平均としてm=2、n=2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.071g(7.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.8711g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン1.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で、R3およびR4が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=3、n=1である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.5018g(7.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.8711g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン1.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化反応終了後、室温まで冷却中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(2)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=3、n=1である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、NMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル1.3807g(5mmol)、9,9-ビス(4-アミノフェニル)フルオレン1.7422g(5mmol)、とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン3.1mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で、R3およびR4が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=2、n=2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.0012g(5mmol)、9,9-ビス(4-アミノフェニル)フルオレン1.7422g(5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン1.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化反応終了後、室温まで冷却中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(2)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=2、n=2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、9,9-ビス(4-アミノフェニル)フルオレン3.4844g(10mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物2.354g(8mmol)とN-メチル-2-ピロリドン4.6mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化反応中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1およびR2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=0、n=4である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.7613g(10mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン0.8mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、下記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=4、n=0である(尚、より具体的には一般式(1-2)で示される構造を有する。実施例7~16についても同様である。)。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル2.0024g(10mmol)とN-メチル-2-ピロリドン9.3mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化反応中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、下記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基で表され、平均としてm=4、n=0である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.6232g(9.5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン0.2661g(0.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン1.1mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3.8、n=0.2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.9023g(9.5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン0.2661g(0.5mmol)とN-メチル-2-ピロリドン9.7mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、平均としてm=3.8、n=0.2である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.4850g(9.0mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン0.5326g(1.0mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン1.3mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3.6、n=0.4である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.8022g(9.0mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン0.5326g(1.0mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、平均としてm=3.6、n=0.4である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.0709g(7.5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン1.3315g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン2.1mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を200mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3、n=1である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.5018g(7.5mmol)、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン1.3315g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン4.4mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で、R2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、平均としてm=3、n=1である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン5.3261g(10mmol)とN-メチル-2-ピロリドン15mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン0.9mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1およびR2が9,9-ビス(4-(4-アミノフェノキシ)フェニル)フルオレン残基で表され、平均としてm=0、n=4である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.6232g(9.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.1742g(0.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン0.9mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3.8、n=0.2である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.9023g(9.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.1742g(0.5mmol)とN-メチル-2-ピロリドン9.6mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=3.8、n=0.2である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の2000mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル220.79g(0.80mol)、9,9-ビス(4-アミノフェニル)フルオレン30.95g(0.089mol)とN-メチル-2-ピロリドン860mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物155.04g(0.711mol)とN-メチル-2-ピロリドン33mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸88.22g(0.355mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液の一部を500mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3.6、n=0.4である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.8022g(9.0mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.3484g(1.0mmol)とN-メチル-2-ピロリドン9.6mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=3.6、n=0.4である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル2.0709g(7.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.8711g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン1.2mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.9929g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3、n=1である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、4,4’-ジアミノジフェニルエーテル1.5018g(7.5mmol)、9,9-ビス(4-アミノフェニル)フルオレン0.8711g(2.5mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)を入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。60mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1が4,4’-ジアミノジフェニルエーテル残基または9,9-ビス(4-アミノフェニル)フルオレン残基で、R2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=3、n=1である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、9,9-ビス(4-アミノフェニル)フルオレン3.4844g(10mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン2.3mLを入れ、窒素気流下、室温で2.5時間、60℃で1.5時間、さらに室温で1時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.993g(4mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。イミド化中にイミドオリゴマーの析出が見られた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(3)において、R1およびR2が9,9-ビス(4-アミノフェニル)フルオレン残基で表され、平均としてm=0、n=4である。
上記で得られた粉末状の末端変性イミドオリゴマーの未硬化物は、室温条件下においてNMP溶媒に不溶であった。この粉末状の末端変性イミドオリゴマーは300℃以上においても溶融流動性を示さなかったため、良好な成形体(フィルム状硬化物)を得ることができなかった。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル4.9703g(18.0mmol)、1,3-ジアミノベンゼン0.2163g(2.0mmol)とN-メチル-2-ピロリドン20mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物3.4899g(16mmol)とN-メチル-2-ピロリドン1mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸1.9858g(8mmol)を入れ、窒素気流下、室温で12時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。80mLのメタノールで30分洗浄し、濾別して得られた粉末を130℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基または1,3-ジアミノベンゼン残基で、R2が1,3-ジアミノベンゼン残基で、R3およびR4が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=3.6、n=0.4である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル4.4181g(16mmol)とN-メチル-2-ピロリドン20mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン3mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸3.9717g(16mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。濾別して得られた粉末を100℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=1、n=0である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル3.3136g(12mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.7450g(8mmol)とN-メチル-2-ピロリドン3mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸1.9858g(8mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。濾別して得られた粉末を100℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=2、n=0である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル3.0374g(11mmol)とN-メチル-2-ピロリドン10mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物2.1812g(10mmol)とN-メチル-2-ピロリドン3mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸0.4964g(2mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。濾別して得られた粉末を100℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で表され、平均としてm=10、n=0である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル3.3136g(12mmol)とN-メチル-2-ピロリドン12mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.8846g(8.64mmol)と3,3’,4,4’-ビフェニルテトラカルボン酸二無水物0.2824g(0.96mmol)とN-メチル-2-ピロリドン3mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸1.1915g(4.8mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。濾別して得られた粉末を150℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1およびR2が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で、R4が3,3’,4,4’-ビフェニルテトラカルボン酸二無水物残基で表され、平均としてm=3.6、n=0.4である。
温度計、攪拌子、窒素導入管を備えた3つ口の100mLフラスコに、2-フェニル-4,4’-ジアミノジフェニルエーテル3.3136g(12mmol)とN-メチル-2-ピロリドン12mLを加え、溶解後、1,2,4,5-ベンゼンテトラカルボン酸二無水物1.8846g(8.64mmol)とビス(3,4-カルボキシフェニル)エーテル二無水物0.2978g(0.96mmol)とN-メチル-2-ピロリドン3mLを入れ、窒素気流下、室温で2.5時間重合反応させアミド酸オリゴマーを生成した。この反応溶液に4-(2-フェニルエチニル)無水フタル酸1.1915g(4.8mmol)を入れ、窒素気流下、室温で18時間反応させ末端変性し、続けて195℃で5時間攪拌しイミド結合させた。
冷却後、反応液を900mLのイオン交換水に投入し、析出した粉末を濾別した。濾別して得られた粉末を150℃で1日間減圧乾燥し、生成物を得た。得られた末端変性イミドオリゴマーは、前記一般式(1)において、R1およびR2が2-フェニル-4,4’-ジアミノジフェニルエーテル残基で表され、R3が1,2,4,5-ベンゼンテトラカルボン酸二無水物残基で、R4がビス(3,4-カルボキシフェニル)エーテル二無水物残基で表され、平均としてm=3.6、n=0.4である。
30cm×30cmのステンレス板上に、剥離フィルムとしてポリイミドフィルムを置き、その上に実施例11で作製したプリプレグを12枚積層した。さらにポリイミドフィルムとステンレス板を重ね、ホットプレス上、真空条件下、昇温速度5℃/minで260℃まで加熱した。260℃で2時間加熱後、1.3MPaで昇温速度3℃/minで370℃まで昇温し、そのまま370℃で1時間加熱加圧させた。外観や超音波探傷試験、断面観察試験から判断して大きなボイドのない良好な積層板が得られた。得られた積層板のガラス転移温度は、358℃であり、繊維体積含有率(Vf)は0.60であり、樹脂含有量は33重量%であった。
Claims (15)
- 前記4価の芳香族テトラカルボン酸類が、1,2,4,5-ベンゼンテトラカルボン酸類、3,3’,4,4’-ビフェニルテトラカルボン酸類、ビス(3,4-カルボキシフェニル)エーテル類のうち少なくとも2種類を併用してなる請求項1に記載のイミドオリゴマー。
- N-メチル-2-ピロリドンに対し室温で固形分濃度30重量%以上溶解可能な請求項1に記載の末端変性イミドオリゴマー。
- 請求項1から5のいずれかに記載の末端変性イミドオリゴマーを有機溶媒に溶解してなるワニス。
- 請求項1から5のいずれかに記載の末端変性イミドオリゴマーを加熱硬化して得られる硬化物。
- 請求項6に記載のワニスを加熱硬化して得られる硬化物。
- ガラス転移温度(Tg)が300℃以上である請求項7または8に記載の硬化物。
- 引張破断伸びが10%以上である、請求項7または8に記載の硬化物から得られるフィルム。
- 請求項6に記載のワニスを繊維に含浸させて、乾燥させてなることを特徴とするイミドプリプレグ。
- 樹脂含量が30~50重量%である請求項11に記載のイミドプリプレグ。
- 請求項11または12に記載のイミドプリプレグを積層し、加熱硬化して得られることを特徴とする繊維強化積層板。
- 請求項1に記載の末端変性イミドオリゴマーの粉末を繊維織物に付着させたものを積層し、加熱硬化して得られることを特徴とする繊維強化積層板。
- ガラス転移温度(Tg)が300℃以上である請求項13または14に記載の繊維強化積層板。
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| EP20090811545 EP2333004B1 (en) | 2008-09-03 | 2009-09-03 | Soluble terminally modified imide oligomer using 2-phenyl-4,4'-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance |
| ES09811545T ES2457445T3 (es) | 2008-09-03 | 2009-09-03 | Oligómero de imida soluble modificado terminalmente mediante el uso de 2-fenil-4,4'-diaminodifenil éter, barniz, producto curado del mismo, imida preimpregnada del mismo y laminado reforzado con fibra con una excelente resistencia térmica |
| JP2010527816A JP5522479B2 (ja) | 2008-09-03 | 2009-09-03 | 2−フェニル−4,4’−ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 |
| US13/062,132 US8846552B2 (en) | 2008-09-03 | 2009-09-03 | Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance |
| CN2009801344954A CN102143989B (zh) | 2008-09-03 | 2009-09-03 | 使用2-苯基-4,4’-二氨基二苯基醚类的可溶性末端改性酰亚胺低聚物、清漆、其固化物、及其酰亚胺预浸料、以及耐热性优异的纤维增强层合板 |
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Families Citing this family (1)
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09507510A (ja) * | 1993-12-22 | 1997-07-29 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 高いTgを有する溶融加工用ポリイミド |
| JP2000219741A (ja) | 1998-11-25 | 2000-08-08 | Ube Ind Ltd | 末端変性イミドオリゴマ―およびその硬化物 |
| JP2003526704A (ja) | 1999-05-18 | 2003-09-09 | アメリカ合衆国 | 圧入、トランスファー成形用高能力樹脂組成物とその製造法 |
| JP2004331801A (ja) | 2003-05-07 | 2004-11-25 | Jsr Corp | ポリアミック酸オリゴマー、ポリイミドオリゴマー、溶液組成物、および繊維強化複合材料 |
| JP2006312699A (ja) | 2005-05-09 | 2006-11-16 | Japan Aerospace Exploration Agency | 可溶性末端変性イミドオリゴマーおよびワニス並びにその硬化物 |
| JP2006312700A (ja) * | 2005-05-09 | 2006-11-16 | Japan Aerospace Exploration Agency | イミドプリプレグおよび積層板 |
| JP2007099969A (ja) | 2005-10-06 | 2007-04-19 | Japan Aerospace Exploration Agency | 可溶性末端変性イミドオリゴマーおよびワニス並びにその硬化物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0751168B1 (en) * | 1995-06-28 | 1999-02-10 | Mitsui Chemicals, Inc. | Linear polyamic acid, linear polyimide and thermoset polyimide |
| AUPO830697A0 (en) * | 1997-07-30 | 1997-08-21 | Commonwealth Scientific And Industrial Research Organisation | Aqueous polyimide process |
| US6359107B1 (en) * | 2000-05-18 | 2002-03-19 | The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration | Composition of and method for making high performance resins for infusion and transfer molding processes |
| JP3891441B2 (ja) * | 2004-10-21 | 2007-03-14 | 独立行政法人 宇宙航空研究開発機構 | 繊維強化ポリイミド複合材料の製造方法 |
-
2009
- 2009-09-03 WO PCT/JP2009/065423 patent/WO2010027020A1/ja not_active Ceased
- 2009-09-03 ES ES09811545T patent/ES2457445T3/es active Active
- 2009-09-03 EP EP20090811545 patent/EP2333004B1/en active Active
- 2009-09-03 US US13/062,132 patent/US8846552B2/en active Active
- 2009-09-03 JP JP2010527816A patent/JP5522479B2/ja active Active
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09507510A (ja) * | 1993-12-22 | 1997-07-29 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 高いTgを有する溶融加工用ポリイミド |
| JP2000219741A (ja) | 1998-11-25 | 2000-08-08 | Ube Ind Ltd | 末端変性イミドオリゴマ―およびその硬化物 |
| JP2003526704A (ja) | 1999-05-18 | 2003-09-09 | アメリカ合衆国 | 圧入、トランスファー成形用高能力樹脂組成物とその製造法 |
| JP2004331801A (ja) | 2003-05-07 | 2004-11-25 | Jsr Corp | ポリアミック酸オリゴマー、ポリイミドオリゴマー、溶液組成物、および繊維強化複合材料 |
| JP2006312699A (ja) | 2005-05-09 | 2006-11-16 | Japan Aerospace Exploration Agency | 可溶性末端変性イミドオリゴマーおよびワニス並びにその硬化物 |
| JP2006312700A (ja) * | 2005-05-09 | 2006-11-16 | Japan Aerospace Exploration Agency | イミドプリプレグおよび積層板 |
| JP2007099969A (ja) | 2005-10-06 | 2007-04-19 | Japan Aerospace Exploration Agency | 可溶性末端変性イミドオリゴマーおよびワニス並びにその硬化物 |
Non-Patent Citations (3)
| Title |
|---|
| P. M. HERGENROTHER; J. G. SMITH JR., POLYMER, vol. 35, 1994, pages 4857 |
| R. YOKOTA; S. YAMAMOTO; S. YANO; T. SAWAGUCHI; M. HASEGAWA; H. YAMAGUCHI; H. OZAWA; R. SATO, HIGH PERFORM. POLYM., vol. 13, 2001, pages S61 |
| See also references of EP2333004A4 |
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Also Published As
| Publication number | Publication date |
|---|---|
| ES2457445T3 (es) | 2014-04-25 |
| US8846552B2 (en) | 2014-09-30 |
| JP5522479B2 (ja) | 2014-06-18 |
| EP2333004A4 (en) | 2012-01-25 |
| US20110165809A1 (en) | 2011-07-07 |
| CN102143989B (zh) | 2013-03-13 |
| CN102143989A (zh) | 2011-08-03 |
| JPWO2010027020A1 (ja) | 2012-02-02 |
| EP2333004A1 (en) | 2011-06-15 |
| EP2333004B1 (en) | 2014-03-05 |
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