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WO2010013790A1 - Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe - Google Patents

Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe Download PDF

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Publication number
WO2010013790A1
WO2010013790A1 PCT/JP2009/063616 JP2009063616W WO2010013790A1 WO 2010013790 A1 WO2010013790 A1 WO 2010013790A1 JP 2009063616 W JP2009063616 W JP 2009063616W WO 2010013790 A1 WO2010013790 A1 WO 2010013790A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
alloy material
electrical
electronic components
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/063616
Other languages
English (en)
Japanese (ja)
Inventor
邦照 三原
亮佑 松尾
立彦 江口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2010507743A priority Critical patent/JP5224415B2/ja
Priority to CN2009801303117A priority patent/CN102112639A/zh
Priority to EP09803032A priority patent/EP2319947A4/fr
Publication of WO2010013790A1 publication Critical patent/WO2010013790A1/fr
Priority to US13/016,260 priority patent/US20110186192A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

L’invention concerne un matériau en alliage de cuivre pour composants électriques et électroniques, présentant la composition suivante : 0,5-2 % en masse de Co et 0,1-0,5 % en masse de Si, le reste étant constitué de Cu et d’impuretés inévitables. Le diamètre de grain cristallin de l’alliage de cuivre du matériau de base est de 3-35 mm, le diamètre de particule d’un précipité composé de Co et de Si est de 5-50 nm et la densité du précipité est comprise entre 1×108 et 1×1010 particules/mm2. La résistance à la traction de ce matériau en alliage de cuivre est d’au moins 550 MPa et la conductivité est d’au moins 50 % I.A.C.S.
PCT/JP2009/063616 2008-07-31 2009-07-30 Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe Ceased WO2010013790A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010507743A JP5224415B2 (ja) 2008-07-31 2009-07-30 電気電子部品用銅合金材料とその製造方法
CN2009801303117A CN102112639A (zh) 2008-07-31 2009-07-30 用于电气电子部件的铜合金材料及其制造方法
EP09803032A EP2319947A4 (fr) 2008-07-31 2009-07-30 Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe
US13/016,260 US20110186192A1 (en) 2008-07-31 2011-01-28 Copper alloy material for electric/electronic parts and method of producing the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008-197677 2008-07-31
JP2008197677 2008-07-31
JP2008-197672 2008-07-31
JP2008197672 2008-07-31
JP2008202468 2008-08-05
JP2008-202468 2008-08-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/016,260 Continuation US20110186192A1 (en) 2008-07-31 2011-01-28 Copper alloy material for electric/electronic parts and method of producing the same

Publications (1)

Publication Number Publication Date
WO2010013790A1 true WO2010013790A1 (fr) 2010-02-04

Family

ID=41610488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/063616 Ceased WO2010013790A1 (fr) 2008-07-31 2009-07-30 Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe

Country Status (6)

Country Link
US (1) US20110186192A1 (fr)
EP (1) EP2319947A4 (fr)
JP (1) JP5224415B2 (fr)
KR (1) KR101570555B1 (fr)
CN (1) CN102112639A (fr)
WO (1) WO2010013790A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152124A1 (fr) * 2010-05-31 2011-12-08 Jx日鉱日石金属株式会社 Alliage de cuivre à base de cu-co-si pour un matériau électronique et son procédé de production
WO2012026488A1 (fr) * 2010-08-24 2012-03-01 Jx日鉱日石金属株式会社 Alliage de cuivre-cobalt-silicium pour matériau d'électrode
JP2012167319A (ja) * 2011-02-14 2012-09-06 Jx Nippon Mining & Metals Corp Ｃｕ−Ｃｏ−Ｓｉ系合金、伸銅品、電子部品、コネクタ及びＣｕ−Ｃｏ−Ｓｉ系合金の製造方法
WO2012132805A1 (fr) 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 FEUILLE D'ALLIAGE DE CUIVRE À BASE DE Co-Si
JP2012201905A (ja) * 2011-03-24 2012-10-22 Jx Nippon Mining & Metals Corp Ｃｏ−Ｓｉ系銅合金板
JP2012207264A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
CN102812139A (zh) * 2010-03-30 2012-12-05 Jx日矿日石金属株式会社 Cu-Co-Si 合金材料
CN102844452A (zh) * 2010-04-14 2012-12-26 Jx日矿日石金属株式会社 电子材料用Cu-Si-Co系合金及其制备方法
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
CN103443310A (zh) * 2011-03-29 2013-12-11 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系铜合金条及其制造方法
EP2578708A4 (fr) * 2010-06-03 2014-04-09 Jx Nippon Mining & Metals Corp Tôle en un alliage à base de cu-co-si et son procédé de production
EP2664685A4 (fr) * 2011-01-13 2014-04-09 Jx Nippon Mining & Metals Corp Matière d'alliage de cu-co-si-zr et son procédé de fabrication
EP2692878A4 (fr) * 2011-03-28 2014-09-10 Jx Nippon Mining & Metals Corp Alliage de cuivre à base de cu-si-co pour matériaux électroniques et son procédé de fabrication
US9476109B2 (en) 2010-03-31 2016-10-25 Jx Nippon Mining & Metals Corporation Cu—Ni—Si—Co copper alloy for electronic material and process for producing same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2570506B1 (fr) 2010-05-14 2016-04-13 Mitsubishi Materials Corporation Alliage de cuivre pour un dispositif électronique, procédé de production de cet alliage et matériau laminé en alliage de cuivre pour ce dispositif
JP5903832B2 (ja) 2011-10-28 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品
JP5903838B2 (ja) * 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP6039999B2 (ja) * 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
CN104812944B (zh) * 2012-11-20 2019-02-19 Jx日矿日石金属株式会社 附载体铜箔
US9394619B2 (en) * 2013-03-12 2016-07-19 Intel Corporation Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
CN105018782B (zh) * 2015-07-23 2017-09-26 宁波博威合金板带有限公司 一种含钴硅的铜合金
JP6246173B2 (ja) * 2015-10-05 2017-12-13 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
KR101810925B1 (ko) * 2017-10-18 2017-12-20 주식회사 풍산 내열성 및 방열성이 우수한 구리 합금 판재
CN112725657B (zh) * 2020-12-24 2021-09-17 国工恒昌新材料沧州有限公司 一种c70350镍硅青铜带材的制备方法
KR102804249B1 (ko) 2022-11-24 2025-05-13 신영금속 (주) 전기저항 및 내마모성이 개선된 Ag-Pd-Cu계 합금재 및 이를 이용하여 제조된 전기전자 부품

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JPS6187838A (ja) 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
JPS63307232A (ja) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金
JPH02129326A (ja) 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd 高力銅合金
JPH02277735A (ja) 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
JPH1112714A (ja) * 1997-06-25 1999-01-19 Dowa Mining Co Ltd ダイレクトボンディング性及びはんだ付け性に優れた銅および銅基合金とその製造方法
JP2005243821A (ja) * 2004-02-25 2005-09-08 Dowa Mining Co Ltd 半導体装置用の放熱板およびその製造法
JP2007169765A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金とその製造方法
JP2007177274A (ja) * 2005-12-27 2007-07-12 Kobe Steel Ltd 高強度および優れた曲げ加工性を備えた銅合金およびその製造方法
JP2008007839A (ja) * 2006-06-30 2008-01-17 Nikko Kinzoku Kk 高強度で曲げ加工性に優れたＣｕ−Ｚｎ系合金
JP2008056977A (ja) 2006-08-30 2008-03-13 Mitsubishi Electric Corp 銅合金及びその製造方法
JP2008088512A (ja) 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法
JP2008197677A (ja) 1997-02-17 2008-08-28 Seiko Epson Corp 表示装置
JP2008197672A (ja) 2005-08-05 2008-08-28 Seiko Epson Corp 液晶装置
JP2008202468A (ja) 2007-02-19 2008-09-04 Toyota Motor Corp エンジンシステムの出力収束値算出装置

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CN101124345B (zh) * 2005-03-02 2011-02-09 古河电气工业株式会社 铜合金及其制造方法
JP2008266787A (ja) * 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The 銅合金材およびその製造方法
US20100326573A1 (en) * 2008-01-30 2010-12-30 Kuniteru Mihara Copper alloy material for electric/electronic component and method for manufacturing the same

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Publication number Priority date Publication date Assignee Title
JPS6187838A (ja) 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
JPS63307232A (ja) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金
JPH02129326A (ja) 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd 高力銅合金
JPH02277735A (ja) 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
JP2008197677A (ja) 1997-02-17 2008-08-28 Seiko Epson Corp 表示装置
JPH1112714A (ja) * 1997-06-25 1999-01-19 Dowa Mining Co Ltd ダイレクトボンディング性及びはんだ付け性に優れた銅および銅基合金とその製造方法
JP2005243821A (ja) * 2004-02-25 2005-09-08 Dowa Mining Co Ltd 半導体装置用の放熱板およびその製造法
JP2008197672A (ja) 2005-08-05 2008-08-28 Seiko Epson Corp 液晶装置
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JP2008007839A (ja) * 2006-06-30 2008-01-17 Nikko Kinzoku Kk 高強度で曲げ加工性に優れたＣｕ−Ｚｎ系合金
JP2008056977A (ja) 2006-08-30 2008-03-13 Mitsubishi Electric Corp 銅合金及びその製造方法
JP2008088512A (ja) 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法
JP2008202468A (ja) 2007-02-19 2008-09-04 Toyota Motor Corp エンジンシステムの出力収束値算出装置

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See also references of EP2319947A4

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102812139A (zh) * 2010-03-30 2012-12-05 Jx日矿日石金属株式会社 Cu-Co-Si 合金材料
CN102812139B (zh) * 2010-03-30 2014-10-29 Jx日矿日石金属株式会社 Cu-Co-Si 合金材料
EP2554692A4 (fr) * 2010-03-30 2014-04-09 Jx Nippon Mining & Metals Corp Matériau d'alliage de cu-co-si
US9476109B2 (en) 2010-03-31 2016-10-25 Jx Nippon Mining & Metals Corporation Cu—Ni—Si—Co copper alloy for electronic material and process for producing same
EP2559777A4 (fr) * 2010-04-14 2014-04-09 Jx Nippon Mining & Metals Corp Alliage cu-si-co pour matériaux électroniques et son procédé de fabrication
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same
CN102844452B (zh) * 2010-04-14 2015-02-11 Jx日矿日石金属株式会社 电子材料用Cu-Si-Co系合金及其制备方法
CN102844452A (zh) * 2010-04-14 2012-12-26 Jx日矿日石金属株式会社 电子材料用Cu-Si-Co系合金及其制备方法
EP2578709A4 (fr) * 2010-05-31 2014-04-09 Jx Nippon Mining & Metals Corp Alliage de cuivre à base de cu-co-si pour un matériau électronique et son procédé de production
US9460825B2 (en) 2010-05-31 2016-10-04 Jx Nippon Mining & Metals Corporation Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same
CN102575320A (zh) * 2010-05-31 2012-07-11 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系铜合金及其制造方法
JP2011252188A (ja) * 2010-05-31 2011-12-15 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
WO2011152124A1 (fr) * 2010-05-31 2011-12-08 Jx日鉱日石金属株式会社 Alliage de cuivre à base de cu-co-si pour un matériau électronique et son procédé de production
CN102575320B (zh) * 2010-05-31 2014-01-08 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系铜合金及其制造方法
KR101377316B1 (ko) 2010-05-31 2014-03-25 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｃｏ-Ｓｉ계 구리 합금 및 그 제조 방법
EP2578708A4 (fr) * 2010-06-03 2014-04-09 Jx Nippon Mining & Metals Corp Tôle en un alliage à base de cu-co-si et son procédé de production
CN103052728A (zh) * 2010-08-24 2013-04-17 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系合金
WO2012026488A1 (fr) * 2010-08-24 2012-03-01 Jx日鉱日石金属株式会社 Alliage de cuivre-cobalt-silicium pour matériau d'électrode
CN103052728B (zh) * 2010-08-24 2015-07-08 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系合金
KR101917416B1 (ko) 2010-08-24 2018-11-09 제이엑스금속주식회사 전자 재료용 Cu-Co-Si 계 합금
EP2607508A4 (fr) * 2010-08-24 2014-04-09 Jx Nippon Mining & Metals Corp Alliage de cuivre-cobalt-silicium pour matériau d'électrode
JP2012046774A (ja) * 2010-08-24 2012-03-08 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
US10056166B2 (en) 2010-08-24 2018-08-21 Jx Nippon Mining & Metals Corporation Copper-cobalt-silicon alloy for electrode material
EP2623619A4 (fr) * 2010-09-29 2014-04-09 Jx Nippon Mining & Metals Corp Alliage de cuivre à base de cuivre-cobalt-silicium pour un matériau électronique et procédé de production de ce dernier
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
EP2664685A4 (fr) * 2011-01-13 2014-04-09 Jx Nippon Mining & Metals Corp Matière d'alliage de cu-co-si-zr et son procédé de fabrication
JP2012167319A (ja) * 2011-02-14 2012-09-06 Jx Nippon Mining & Metals Corp Ｃｕ−Ｃｏ−Ｓｉ系合金、伸銅品、電子部品、コネクタ及びＣｕ−Ｃｏ−Ｓｉ系合金の製造方法
JP2012201905A (ja) * 2011-03-24 2012-10-22 Jx Nippon Mining & Metals Corp Ｃｏ−Ｓｉ系銅合金板
TWI450985B (zh) * 2011-03-28 2014-09-01 Jx Nippon Mining & Metals Corp Co-Si copper alloy plate
EP2692878A4 (fr) * 2011-03-28 2014-09-10 Jx Nippon Mining & Metals Corp Alliage de cuivre à base de cu-si-co pour matériaux électroniques et son procédé de fabrication
WO2012132805A1 (fr) 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 FEUILLE D'ALLIAGE DE CUIVRE À BASE DE Co-Si
US9478323B2 (en) 2011-03-28 2016-10-25 Jx Nippon Mining & Metals Corporation Cu—Si—Co-based copper alloy for electronic materials and method for producing the same
CN103443310A (zh) * 2011-03-29 2013-12-11 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系铜合金条及其制造方法
US9490039B2 (en) 2011-03-29 2016-11-08 Jx Nippon Mining & Metals Corporation Strip of Cu—Co—Si-based copper alloy for electronic materials and the method for producing the same
CN103443310B (zh) * 2011-03-29 2016-08-17 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si系铜合金条及其制造方法
EP2692879A4 (fr) * 2011-03-29 2014-09-10 Jx Nippon Mining & Metals Corp Bande d'alliage de cuivre à base de cu-co-si pour matériau électronique, et son procédé de fabrication
JP2012207264A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金

Also Published As

Publication number Publication date
JPWO2010013790A1 (ja) 2012-01-12
US20110186192A1 (en) 2011-08-04
KR101570555B1 (ko) 2015-11-19
CN102112639A (zh) 2011-06-29
JP5224415B2 (ja) 2013-07-03
KR20110038143A (ko) 2011-04-13
EP2319947A1 (fr) 2011-05-11
EP2319947A4 (fr) 2011-11-23

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