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WO2010090489A3 - 절연된 도전성 패턴의 제조 방법 및 적층체 - Google Patents

절연된 도전성 패턴의 제조 방법 및 적층체 Download PDF

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Publication number
WO2010090489A3
WO2010090489A3 PCT/KR2010/000765 KR2010000765W WO2010090489A3 WO 2010090489 A3 WO2010090489 A3 WO 2010090489A3 KR 2010000765 W KR2010000765 W KR 2010000765W WO 2010090489 A3 WO2010090489 A3 WO 2010090489A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive pattern
laminate
insulated conductive
insulation layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/000765
Other languages
English (en)
French (fr)
Other versions
WO2010090489A2 (ko
Inventor
황지영
민성준
황인석
이동욱
전상기
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090127756A external-priority patent/KR20100090628A/ko
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to US13/147,995 priority Critical patent/US9060452B2/en
Priority to JP2011547819A priority patent/JP5491528B2/ja
Priority to CN201080007009.5A priority patent/CN102308367B/zh
Priority to EP14177997.5A priority patent/EP2825006B1/en
Priority to EP10738773A priority patent/EP2395542A4/en
Publication of WO2010090489A2 publication Critical patent/WO2010090489A2/ko
Publication of WO2010090489A3 publication Critical patent/WO2010090489A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

본 발명은 기판상에 도전성 막 및 절연층 패턴을 형성(forming)하고, 상기 절연층 패턴을 마스크로 이용하여 상기 도전성 막을 에칭함으로써 도전성 패턴을 형성한 후, 상기 도전성 패턴을 덮도록(covering) 상기 절연층 패턴을 재형성(reforming)하는 것을 특징으로 하는 절연된 도전성 패턴의 제조 방법 및 이에 따라 제조된 적층체를 제공한다. 본 발명에 따르면, 기존의 공정에 비해 공정 수가 대폭 줄어들고, 경제성이 크게 향상될 수 있다.
PCT/KR2010/000765 2009-02-06 2010-02-08 절연된 도전성 패턴의 제조 방법 및 적층체 Ceased WO2010090489A2 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US13/147,995 US9060452B2 (en) 2009-02-06 2010-02-08 Method for manufacturing insulated conductive pattern and laminate
JP2011547819A JP5491528B2 (ja) 2009-02-06 2010-02-08 絶縁された導電性パターンの製造方法及び積層体
CN201080007009.5A CN102308367B (zh) 2009-02-06 2010-02-08 制造绝缘导电图形的方法和层压体
EP14177997.5A EP2825006B1 (en) 2009-02-06 2010-02-08 Method for manufacturing insulated conductive pattern
EP10738773A EP2395542A4 (en) 2009-02-06 2010-02-08 METHOD FOR MANUFACTURING INSULATED CONDUCTOR PATTERN AND LAMINATE

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR10-2009-0009750 2009-02-06
KR20090009750 2009-02-06
KR10-2009-0127759 2009-12-21
KR1020090127756A KR20100090628A (ko) 2009-02-06 2009-12-21 절연된 도전성 패턴의 제조 방법
KR20090127757 2009-12-21
KR10-2009-0127757 2009-12-21
KR10-2009-0127756 2009-12-21
KR20090127759 2009-12-21

Publications (2)

Publication Number Publication Date
WO2010090489A2 WO2010090489A2 (ko) 2010-08-12
WO2010090489A3 true WO2010090489A3 (ko) 2010-11-25

Family

ID=42756175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000765 Ceased WO2010090489A2 (ko) 2009-02-06 2010-02-08 절연된 도전성 패턴의 제조 방법 및 적층체

Country Status (6)

Country Link
US (1) US9060452B2 (ko)
EP (2) EP2825006B1 (ko)
JP (1) JP5491528B2 (ko)
KR (1) KR101137192B1 (ko)
CN (1) CN102308367B (ko)
WO (1) WO2010090489A2 (ko)

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CN104205250A (zh) * 2012-03-30 2014-12-10 阿尔卑斯电气株式会社 导电图案形成基板的制造方法
CN103258596B (zh) * 2013-04-27 2016-12-28 苏州诺菲纳米科技有限公司 导电薄膜的消影方法
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WO2014204117A1 (ko) * 2013-06-18 2014-12-24 주식회사 엘지화학 절연층 형성방법 및 이를 이용하여 제조된 터치 스크린
KR101617521B1 (ko) 2013-06-18 2016-05-02 주식회사 엘지화학 절연층 형성방법 및 이를 이용하여 제조된 터치 스크린
TWI552656B (zh) * 2013-08-16 2016-10-01 樂金顯示科技股份有限公司 導電基板及其製造方法
JP6533382B2 (ja) * 2014-11-13 2019-06-19 株式会社フジクラ 配線基板及びその製造方法
CN107170679B (zh) * 2017-05-19 2020-02-07 京东方科技集团股份有限公司 一种导电图形的制作方法、导电图形及显示基板
CN108170316B (zh) * 2018-01-02 2022-03-29 京东方科技集团股份有限公司 半成品显示用基板及制备方法、半成品显示面板、显示面板的制备方法
CN108628503B (zh) * 2018-05-08 2021-08-10 张家港康得新光电材料有限公司 导电膜、电容式触摸屏和导电膜的制作方法
KR102708891B1 (ko) * 2019-11-01 2024-09-25 삼성디스플레이 주식회사 광 센서의 제조 방법
CN112935566A (zh) * 2021-02-02 2021-06-11 广州视源电子科技股份有限公司 激光拼接方法、导电膜、触控模组、电容屏及电子设备

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EP2395542A2 (en) 2011-12-14
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WO2010090489A2 (ko) 2010-08-12
EP2825006B1 (en) 2018-12-19
EP2825006A1 (en) 2015-01-14
KR20100090668A (ko) 2010-08-16
JP5491528B2 (ja) 2014-05-14
KR101137192B1 (ko) 2012-04-19
CN102308367B (zh) 2015-06-10
US20110290548A1 (en) 2011-12-01
EP2395542A4 (en) 2012-10-31
CN102308367A (zh) 2012-01-04

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