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WO2009119440A1 - Micropuce et moule - Google Patents

Micropuce et moule Download PDF

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Publication number
WO2009119440A1
WO2009119440A1 PCT/JP2009/055433 JP2009055433W WO2009119440A1 WO 2009119440 A1 WO2009119440 A1 WO 2009119440A1 JP 2009055433 W JP2009055433 W JP 2009055433W WO 2009119440 A1 WO2009119440 A1 WO 2009119440A1
Authority
WO
WIPO (PCT)
Prior art keywords
flow path
groove
resin substrate
depth
path groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/055433
Other languages
English (en)
Japanese (ja)
Inventor
信 高木
幹司 関原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of WO2009119440A1 publication Critical patent/WO2009119440A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves

Definitions

  • the step portion 5 formed at the intersecting portion 4 where the first channel groove 2 and the second channel groove 3 intersect is used for evaluating the transferability of the channel groove in molding.
  • the resin substrate 1 is manufactured by an injection molding method using a molding die.
  • the molding die is formed with a convex portion corresponding to the first flow channel groove 2 and a convex portion corresponding to the second flow channel groove 3, and the shape of the convex portion of the molding die is a resin.
  • the resin substrate 1 having the first flow path groove 2 and the second flow path groove 3 is produced.
  • a step portion is provided on the upper surface of the convex portion of the molding die, at a position corresponding to the intersecting portion 4 where the first flow path groove 2 and the second flow path groove 3 intersect. Thereby, the step of the molding die is transferred to the resin, and the step portion 5 is formed on the bottom surface of the intersecting portion 4 where the first flow path groove 2 and the second flow path groove 3 intersect.
  • the transferability can be evaluated at a deep portion of the flow path groove.
  • the depth of one of the flow channel grooves becomes deeper than the depth of the other flow channel grooves at the intersecting portion 4.
  • the depth of the second flow path groove 3 is deeper than the depth of the first flow path groove 2.
  • the stepped portion 5 can be easily specified, and further, the stepped portion 5 at the crossing portion 4 can be specified. By confirming the shape, the transferability of the resin substrate 1 can be evaluated.
  • a linear first flow path forming groove 11 and a straight second flow path forming groove 12 are formed on one surface of the electroforming master 10.
  • the first flow path forming groove 11 and the second flow path forming groove 12 are formed orthogonally on the surface of the electroforming master 10.
  • the depth of the first flow path forming groove 11 and the depth of the second flow path forming groove 12 are different, and the intersection where the first flow path forming groove 11 and the second flow path forming groove 12 intersect.
  • a step portion 14 is formed on the bottom surface of 13.
  • the depth of the second flow path forming groove 12 is deeper than the depth of the first flow path forming groove 11. Therefore, a stepped portion 14 that is orthogonal to the length direction of the first flow path forming groove 11 is formed on the bottom surface of the intersecting portion 13 across the width direction of the first flow path forming groove 11.
  • the step portion 14 corresponds to the step portion 5 formed on the resin substrate 1.
  • the second flow path is formed across the width direction of the second flow path forming groove 12 by making the depth of the first flow path forming groove 11 deeper than the depth of the second flow path forming groove 12. You may form the level
  • a method for manufacturing the electroforming master 10 will be described.
  • a metal layer is formed on the surface of the master blank by performing Ni—P plating or Cu plating on the master blank.
  • the first flow path forming groove 11 and the second flow path forming groove 12 are formed by etching the upper surface of the metal layer.
  • the electroforming master 10 obtained in this way becomes a base of a molding die for the resin substrate 1.
  • the first flow path forming groove 11 corresponds to the first flow path groove 2 of the resin substrate 1
  • the second flow path forming groove 12 corresponds to the second flow path groove 3 of the resin substrate 1.
  • the step portion 14 corresponds to the step portion 5 of the resin substrate 1.
  • the metal layer may not be formed on the master blank.
  • the master blank may be made of a material such as an aluminum alloy or oxygen-free copper, and the master blank 10 may be manufactured by etching the master blank.
  • an electroformed body is produced by electroforming the electroformed master 10, and then the electroformed body is released from the electroformed master 10.
  • the molding die which has a convex part corresponding to the groove for channel formation of electroforming master 10 can be produced.
  • a molding die produced by the electroforming master 10 is shown in FIG.
  • a linear first convex portion 21 corresponding to the first flow path forming groove 11 and a linear second convex corresponding to the second flow path forming groove 12 are formed on one surface of the molding die 20, a linear first convex portion 21 corresponding to the first flow path forming groove 11 and a linear second convex corresponding to the second flow path forming groove 12 are formed.
  • a portion 22 is formed.
  • the height of the first convex portion 21 and the height of the second convex portion 22 are different, and a step portion 23 is formed on the upper surface of the intersection where the first convex portion 21 and the second convex portion 22 intersect.
  • the height of the second convex portion 22 is higher than the height of the first convex portion 21.
  • the relationship of height d2> height d1 is established between the height d1 of the first convex portion 21 and the height d2 of the second convex portion 22, and the height difference ⁇ t is It
  • the shape of the step portion 5 formed on the resin substrate 1 is observed with an observation device such as a microscope, and the shape of the step portion 5 and the molding die 20 are formed.
  • the shape of the stepped portion 23 is compared. Then, the transferability is evaluated based on the difference in the shape of the step portion.
  • FIG. 7 is an enlarged cross-sectional view of a part of the molding die according to the embodiment of the present invention.
  • the resin substrate 1 is manufactured by injection molding using a mold in which a flat groove for forming a cavity is formed and the molding mold 20 according to this embodiment. With the flat groove inside, the molding die 20 and the mold in which the groove is formed face each other and are brought into contact with each other, so that the molding die 20 and the mold in which the groove is formed are in contact with each other. Cavity is formed in By filling the cavity with resin, the resin substrate 1 to which the shape of the first protrusion 21 and the shape of the second protrusion 22 are transferred is produced.
  • the shape of the step portion 23 formed in the molding die 20 is made of resin. Good transfer onto the substrate 1. Specifically, the shape of the corner of the step portion 23 and the shape of the wall portion are transferred to the resin substrate 1, and the step portion 5 having a shape corresponding to the shape of the step portion 23 is formed on the resin substrate 1. The And when the level difference part 5 is observed with observation apparatuses, such as a microscope, the boundary line of the level difference part 5 can be recognized with a comparatively dark line. As a result, the inspector can confirm that the transfer has been successfully performed.
  • the shape of the step portion 23 formed in the molding die 20 is resin. It is not transferred well to the substrate 1. Specifically, the shape of the corner of the step 23 and the shape of the wall are not transferred well to the resin substrate 1, and the corner and wall of the step 5 formed on the resin substrate 1 are curved. Thus, the shape corresponding to the shape of the stepped portion 23 is not formed on the resin substrate 1. And when the level difference part 5 is observed with observation apparatuses, such as a microscope, the boundary line of the level difference part 5 can be recognized blurry. Thereby, the inspector can confirm that the transfer is not performed well.
  • FIG. 8 is a top view of a resin substrate according to a modification.
  • FIG. 9 is a cross-sectional view of a resin substrate according to a modification, and is a IX-IX cross-sectional view of FIG. In this modification, a resin substrate in which a T-shaped groove is formed by two channel grooves having different depths will be described.
  • the resin substrate 1A is a plate-shaped substrate, and on one surface of the resin substrate 1A, a linear first flow channel groove 2A and a linear second flow channel groove are formed. 3A is formed.
  • the first flow path groove 2A and the second flow path groove 3A are orthogonally formed on the surface of the resin substrate 1A.
  • the second flow path groove 3A is formed halfway through the first flow path groove 2A.
  • the first channel groove 2A and the second channel groove 3A constitute a T-shaped groove. Since the depth of the second flow path groove 3A is deeper than the depth of the first flow path groove 2A, the intersection of the first flow path groove 2A and the second flow path groove 3A intersects.
  • a step portion 5A is formed on the bottom surface.
  • the depth of the first flow path groove 2A is defined as depth d1
  • the depth of the second flow path groove 3A is defined as depth d2. Since the depth of the second flow path groove 3A is deeper than the depth of the first flow path groove 2A, the relationship of depth d2> depth d1 is established, and the depth difference ⁇ t is the step portion 5A. Of height.
  • a microchip is manufactured by bonding the resin substrate 1A and the flat resin substrate with the surface on which the first flow channel groove 2A and the second flow channel groove 3A are formed inside. To do. As a result, a fine channel is formed by the first channel groove 2A and the second channel groove 3A.
  • the resin substrate 1A is manufactured by an injection molding method using a molding die.
  • the molding die is formed with a convex portion corresponding to the first flow channel groove 2A and a convex portion corresponding to the second flow channel groove 3A, and the shape of the convex portion of the molding die is a resin.
  • the resin substrate 1A having the first flow path groove 2A and the second flow path groove 3A is produced. Further, a step portion is provided on the upper surface of the convex portion of the molding die at a position corresponding to the intersecting portion 4A where the first flow path groove 2A and the second flow path groove 3A intersect.
  • a resin substrate 1A according to the above-described modification was produced.
  • a molding die for producing the resin substrate 1A was produced. Specifically, a molding die having convex portions corresponding to the first channel groove 2A and the second channel groove 3A was produced. Then, by molding PMMA which is a transparent resin material with an injection molding machine using the molding die, the first flow path groove 2A and the second flow path are formed on the surface of a plate-like member having a 30 mm square and a thickness of 1 mm.
  • a resin substrate having a channel groove 3A formed thereon was produced. The dimensions of the groove are shown below.
  • first channel groove 2A 26.5 [ ⁇ m]
  • Depth d2 of second channel groove 3A 26.7 [ ⁇ m]
  • the depth ⁇ t of the step portion 5A 0.18 [ ⁇ m]
  • Width of first flow path groove 2A 40.3 [ ⁇ m] (Evaluation)
  • Two resin substrates 1A were produced by molding PMMA, which is a transparent resin material, using an injection molding machine under two different molding conditions, and the transferability of each resin substrate 1A was examined. The appearance of the stepped portion 5A was observed with a general-purpose optical microscope having a magnification of about 400 times, and the difference in the shape of the stepped portion 5A in the resin substrate 1A could be confirmed. In one resin substrate 1A, the step portion 5A was observed to be thick, and in the other resin substrate 1A, the step portion 5A was observed to be thin.
  • the shape of the two resin substrates 1A was measured with a shape measuring device, and the transferability of the molding was confirmed. It was confirmed that the shape of the resin substrate 1A in which the stepped portion 5A was observed to be thick was largely different from the shape of the molding die, and sufficient molding transfer was not obtained. On the other hand, it was confirmed that the shape of the resin substrate 1A in which the step portion 5A was thinly observed was small in deviation from the shape of the molding die, and sufficient molding transfer was obtained. From the above, the correlation between the observation image by the optical microscope and the molding transferability was confirmed.
  • the materials and dimensions of the resin substrate shown in the above-described embodiments are for confirming the effects of the present invention, and the present invention is not limited to these. For example, even when the resin mentioned in the above-described embodiment is used, transferability in molding can be evaluated by providing a stepped portion.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)

Abstract

L'invention porte sur une micropuce pour laquelle l'aptitude au transfert en moulage peut être évaluée sans mesurer quantitativement les formes de rainures de canaux d'écoulement. Une première rainure de canal d'écoulement (2) et une seconde rainure de canal d'écoulement (3) sont formées de façon à ce qu'elles se coupent l'une l'autre dans une surface d'un substrat en résine (1). Une partie de marche (5) est disposée à une intersection de celles-ci. La profondeur d1 de la première rainure de canal d'écoulement (2) et la profondeur d2 de la seconde rainure de canal d'écoulement (3) satisfont à la relation : profondeur d2 > profondeur d1, et une différence dt de profondeur est la hauteur de la partie de marche (5). Des rainures de canaux d'écoulement du substrat en résine (1) sont fabriquées par moulage à l'aide d'un moule. La partie de marche (5) est utilisée pour évaluer l'aptitude au transfert dans le moulage. La forme de la partie de marche (5) est examinée par un dispositif d'observation tel qu'un microscope et l'aptitude au transfert est évaluée sur la base de l'observation.
PCT/JP2009/055433 2008-03-27 2009-03-19 Micropuce et moule Ceased WO2009119440A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008082716 2008-03-27
JP2008-082716 2008-03-27

Publications (1)

Publication Number Publication Date
WO2009119440A1 true WO2009119440A1 (fr) 2009-10-01

Family

ID=41113635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/055433 Ceased WO2009119440A1 (fr) 2008-03-27 2009-03-19 Micropuce et moule

Country Status (2)

Country Link
TW (1) TW200948706A (fr)
WO (1) WO2009119440A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014136304A (ja) * 2013-01-18 2014-07-28 Dainippon Printing Co Ltd 成形型及びその製造方法、並びに構造物及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003114229A (ja) * 2001-10-03 2003-04-18 Mitsubishi Chemicals Corp マイクロチャネルチップ，マイクロチャネルチップを使用した測定装置及び測定方法
JP2004503392A (ja) * 2000-06-15 2004-02-05 スリーエム　イノベイティブ　プロパティズ　カンパニー マイクロ流体製品を製造するためのプロセス
JP2004523728A (ja) * 2000-07-21 2004-08-05 アクララ バイオサイエンシーズ， インコーポレイテッド ノルボルネンベースの表面コーティングを用いるキャピラリー電気泳動のための方法およびデバイス。
JP2005300333A (ja) * 2004-04-12 2005-10-27 National Institute Of Advanced Industrial & Technology マイクロ液流制御方法及び制御装置
JP2006071388A (ja) * 2004-09-01 2006-03-16 Horiba Ltd マイクロチップおよびマイクロチップ中における流体制御方法
JP2007216123A (ja) * 2006-02-15 2007-08-30 Ymc Co Ltd マイクロチャネルチップ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503392A (ja) * 2000-06-15 2004-02-05 スリーエム　イノベイティブ　プロパティズ　カンパニー マイクロ流体製品を製造するためのプロセス
JP2004523728A (ja) * 2000-07-21 2004-08-05 アクララ バイオサイエンシーズ， インコーポレイテッド ノルボルネンベースの表面コーティングを用いるキャピラリー電気泳動のための方法およびデバイス。
JP2003114229A (ja) * 2001-10-03 2003-04-18 Mitsubishi Chemicals Corp マイクロチャネルチップ，マイクロチャネルチップを使用した測定装置及び測定方法
JP2005300333A (ja) * 2004-04-12 2005-10-27 National Institute Of Advanced Industrial & Technology マイクロ液流制御方法及び制御装置
JP2006071388A (ja) * 2004-09-01 2006-03-16 Horiba Ltd マイクロチップおよびマイクロチップ中における流体制御方法
JP2007216123A (ja) * 2006-02-15 2007-08-30 Ymc Co Ltd マイクロチャネルチップ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014136304A (ja) * 2013-01-18 2014-07-28 Dainippon Printing Co Ltd 成形型及びその製造方法、並びに構造物及びその製造方法

Also Published As

Publication number Publication date
TW200948706A (en) 2009-12-01

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