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WO2009038686A3 - Hermetic wafer level cavity package - Google Patents

Hermetic wafer level cavity package Download PDF

Info

Publication number
WO2009038686A3
WO2009038686A3 PCT/US2008/010746 US2008010746W WO2009038686A3 WO 2009038686 A3 WO2009038686 A3 WO 2009038686A3 US 2008010746 W US2008010746 W US 2008010746W WO 2009038686 A3 WO2009038686 A3 WO 2009038686A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer level
cavity
container
cavity package
level cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/010746
Other languages
French (fr)
Other versions
WO2009038686A2 (en
Inventor
Vage Oganesian
David Ovrutsky
Ekaterina Axelrod
Avi Dayan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tessera Technologies Hungary Kft
Original Assignee
Tessera Technologies Hungary Kft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera Technologies Hungary Kft filed Critical Tessera Technologies Hungary Kft
Publication of WO2009038686A2 publication Critical patent/WO2009038686A2/en
Publication of WO2009038686A3 publication Critical patent/WO2009038686A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A microelectronic device (100) comprises a device container comprising top and bottom opposing substrates (110,120) spaced apart by support walls (130) forming a cavity (160) therebetween. A top surface (114) of the bottom substrate (110) comprises a plurality of peripheral regions outside of the cavity (160), with at least one peripheral region comprising a plurality of exposed contacts (140). The microelectronic device 100) further comprises a microelectronic element (150) disposed in the cavity of the device container, and a nonporous metal layer (170) overlying at least a portion of the top substrate and support walls of the container. A wafer level process of fabricating the microelectronic device (100) is also disclosed.
PCT/US2008/010746 2007-09-14 2008-09-12 Hermetic wafer level cavity package Ceased WO2009038686A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99381907P 2007-09-14 2007-09-14
US60/993,819 2007-09-14

Publications (2)

Publication Number Publication Date
WO2009038686A2 WO2009038686A2 (en) 2009-03-26
WO2009038686A3 true WO2009038686A3 (en) 2009-07-09

Family

ID=40468682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/010746 Ceased WO2009038686A2 (en) 2007-09-14 2008-09-12 Hermetic wafer level cavity package

Country Status (1)

Country Link
WO (1) WO2009038686A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2010011563A (en) 2008-04-22 2010-11-12 Schering Corp Phenyl-substituted 2-imino-3-methyl pyrrolo pyrimidinone compounds as bace-1 inhibitors, compositions, and their use.
WO2012171663A1 (en) * 2011-06-15 2012-12-20 Eth Zurich Low-temperature wafer-level packaging and direct electrical interconnection
US9714166B2 (en) 2014-07-16 2017-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film structure for hermetic sealing
JP2017181624A (en) * 2016-03-29 2017-10-05 セイコーエプソン株式会社 Electro-optical device, electro-optical unit, and electronic apparatus
JP7538108B2 (en) * 2018-08-07 2024-08-21 コーニング インコーポレイテッド Hermetically sealed package
DE102023102349A1 (en) * 2023-01-31 2024-08-01 Carl Zeiss Smt Gmbh Method for manufacturing a system with two modules

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20050263866A1 (en) * 2004-05-27 2005-12-01 Chang-Fegn Wan Hermetic pacakging and method of manufacture and use therefore
US20060043601A1 (en) * 2002-11-14 2006-03-02 Wolfgang Pahl Hermetically encapsulated component and waferscale method for the production thereof
US20060076670A1 (en) * 2004-10-08 2006-04-13 Lim Ohk K Micro-electro-mechanical system (MEMS) package having metal sealing member
EP1741668A2 (en) * 2005-07-05 2007-01-10 Shinko Electric Industries Co., Ltd. Method for encasing a MEMS device and packaged device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20060043601A1 (en) * 2002-11-14 2006-03-02 Wolfgang Pahl Hermetically encapsulated component and waferscale method for the production thereof
US20050263866A1 (en) * 2004-05-27 2005-12-01 Chang-Fegn Wan Hermetic pacakging and method of manufacture and use therefore
US20060076670A1 (en) * 2004-10-08 2006-04-13 Lim Ohk K Micro-electro-mechanical system (MEMS) package having metal sealing member
EP1741668A2 (en) * 2005-07-05 2007-01-10 Shinko Electric Industries Co., Ltd. Method for encasing a MEMS device and packaged device

Also Published As

Publication number Publication date
WO2009038686A2 (en) 2009-03-26

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