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WO2009038118A1 - Mold release film - Google Patents

Mold release film Download PDF

Info

Publication number
WO2009038118A1
WO2009038118A1 PCT/JP2008/066840 JP2008066840W WO2009038118A1 WO 2009038118 A1 WO2009038118 A1 WO 2009038118A1 JP 2008066840 W JP2008066840 W JP 2008066840W WO 2009038118 A1 WO2009038118 A1 WO 2009038118A1
Authority
WO
WIPO (PCT)
Prior art keywords
release film
mold release
roughness curve
roughness
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066840
Other languages
French (fr)
Japanese (ja)
Inventor
Masahiro Tsuchiya
Hirotake Matsumoto
Yasushi Goto
Nobuhiro Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40467928&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2009038118(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN2008800166391A priority Critical patent/CN101678605B/en
Publication of WO2009038118A1 publication Critical patent/WO2009038118A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

Disclosed is a mold release film having both of a crease-resistant property and mold releasability. Specifically disclosed is a mold release film, in which at least one of the surfaces has a maximum height roughness (Rz) of 0.5 to 20 μm in the roughness curve and an average length (RSm) of the roughness curve element of 50 to 500 μm as measured in accordance with JIS B0601:2001 by using a sensing pin having a tip radius of 2 μm and a conical taper angle of 60° under such conditions that the measurement force is 0.75 mN and a cut-off values λs and λc are 2.5 μm and 0.8 mm, respectively.
PCT/JP2008/066840 2007-09-21 2008-09-18 Mold release film Ceased WO2009038118A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800166391A CN101678605B (en) 2007-09-21 2008-09-18 Mold release film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245140 2007-09-21
JP2007245140 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038118A1 true WO2009038118A1 (en) 2009-03-26

Family

ID=40467928

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066840 Ceased WO2009038118A1 (en) 2007-09-21 2008-09-18 Mold release film

Country Status (5)

Country Link
JP (1) JP4332204B2 (en)
KR (2) KR20100090728A (en)
CN (1) CN101678605B (en)
TW (1) TW200920589A (en)
WO (1) WO2009038118A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253854A (en) * 2009-04-27 2010-11-11 Sekisui Chem Co Ltd Multi-layer release film
WO2011111826A1 (en) * 2010-03-12 2011-09-15 積水化学工業株式会社 Mold release film and method for manufacturing mold release film
WO2014061392A1 (en) * 2012-10-19 2014-04-24 三井化学東セロ株式会社 Release film
WO2014141512A1 (en) * 2013-03-14 2014-09-18 三井化学東セロ株式会社 Release film
WO2015019933A1 (en) * 2013-08-05 2015-02-12 積水化学工業株式会社 Mold release film
JP2019217780A (en) * 2013-08-05 2019-12-26 積水化学工業株式会社 Release film
WO2023032793A1 (en) * 2021-08-31 2023-03-09 東洋紡株式会社 Mold release film for resin sheet molding

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5245497B2 (en) * 2008-03-31 2013-07-24 住友ベークライト株式会社 Release film
JP5565230B2 (en) * 2010-09-16 2014-08-06 日本ゼオン株式会社 Optical film roll and method for producing optical film roll
JP5907786B2 (en) * 2012-04-09 2016-04-26 倉敷紡績株式会社 Transfer film
JP5874768B2 (en) * 2013-04-30 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP5874774B2 (en) * 2013-06-06 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP6205874B2 (en) * 2013-06-07 2017-10-04 東レ株式会社 Release film
WO2015008759A1 (en) * 2013-07-16 2015-01-22 倉敷紡績株式会社 Mold-release film
JP5804141B1 (en) * 2014-06-18 2015-11-04 住友ベークライト株式会社 Release film
JP5862740B1 (en) * 2014-09-30 2016-02-16 住友ベークライト株式会社 Release film and method of using release film
JP6531555B2 (en) * 2014-10-31 2019-06-19 東レ株式会社 Polyester film for optical film production
JP6494761B2 (en) * 2015-07-24 2019-04-03 富士フイルム株式会社 Release film and adhesive laminate
JP2017047594A (en) * 2015-09-01 2017-03-09 大日本印刷株式会社 Decorative sheet, decorative molded product, and method for producing decorative molded product
JP6391554B2 (en) * 2015-12-14 2018-09-19 住友ベークライト株式会社 Release film
JP6970025B2 (en) * 2018-01-10 2021-11-24 タツタ電線株式会社 Electromagnetic wave shield film
JP7400263B2 (en) * 2018-08-23 2023-12-19 東レ株式会社 Film and film manufacturing method
WO2021010412A1 (en) * 2019-07-17 2021-01-21 株式会社クラレ Water-soluble film and package
TWI788659B (en) * 2020-04-24 2023-01-01 南亞塑膠工業股份有限公司 Method of manufacturing porous anti-adhesion film
KR102297307B1 (en) * 2020-08-18 2021-09-02 황진상 Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof
JP2023059203A (en) * 2021-10-14 2023-04-26 東レ株式会社 Release film for compression mold
KR102799321B1 (en) * 2023-01-27 2025-04-23 (주)상아프론테크 Fluorine-based release film, Semiconductor package manufacturing method using the same and Semiconductor package
JP7619507B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP7619505B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP7619506B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04101840A (en) * 1990-08-22 1992-04-03 Mitsui Petrochem Ind Ltd Mat film
JPH0623840A (en) * 1985-08-02 1994-02-01 Mitsui Petrochem Ind Ltd Method for producing roughened film and sheet made of poly-4-methyl-1-pentene for producing multilayer printed wiring board
JP2002155476A (en) * 2000-11-17 2002-05-31 Dainippon Printing Co Ltd Release paper and synthetic leather manufactured using the same
JP2006130796A (en) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd Laminated body including polymethylpentene resin layer and method for producing the same
WO2006120983A1 (en) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. Laminate comprising 4-methyl-1-pentene polymer and release film comprising the same
JP2007083459A (en) * 2005-09-20 2007-04-05 Tohcello Co Ltd Surface-roughened film and its application

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2701924B2 (en) * 1989-03-13 1998-01-21 三井石油化学工業株式会社 Release film made of poly-4-methyl-1-pentene having both surfaces roughened and method for producing the same
JPH0361011A (en) * 1989-07-28 1991-03-15 Mitsui Petrochem Ind Ltd Release film and its manufacturing method
WO2001015896A1 (en) * 1999-08-31 2001-03-08 Mitsubishi Plastics, Inc. Releasing laminated film
CN100577389C (en) * 2003-09-30 2010-01-06 积水化学工业株式会社 multilayer sheet
US7407712B2 (en) * 2003-12-26 2008-08-05 Sekisui Chemical Co., Ltd. Release film
JP4894344B2 (en) 2006-04-25 2012-03-14 パナソニック電工株式会社 Single-sided board manufacturing method and multilayer printed wiring board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623840A (en) * 1985-08-02 1994-02-01 Mitsui Petrochem Ind Ltd Method for producing roughened film and sheet made of poly-4-methyl-1-pentene for producing multilayer printed wiring board
JPH04101840A (en) * 1990-08-22 1992-04-03 Mitsui Petrochem Ind Ltd Mat film
JP2002155476A (en) * 2000-11-17 2002-05-31 Dainippon Printing Co Ltd Release paper and synthetic leather manufactured using the same
JP2006130796A (en) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd Laminated body including polymethylpentene resin layer and method for producing the same
WO2006120983A1 (en) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. Laminate comprising 4-methyl-1-pentene polymer and release film comprising the same
JP2007083459A (en) * 2005-09-20 2007-04-05 Tohcello Co Ltd Surface-roughened film and its application

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253854A (en) * 2009-04-27 2010-11-11 Sekisui Chem Co Ltd Multi-layer release film
WO2011111826A1 (en) * 2010-03-12 2011-09-15 積水化学工業株式会社 Mold release film and method for manufacturing mold release film
JPWO2011111826A1 (en) * 2010-03-12 2013-06-27 積水化学工業株式会社 Release film and method for producing release film
WO2014061392A1 (en) * 2012-10-19 2014-04-24 三井化学東セロ株式会社 Release film
JP2014098138A (en) * 2012-10-19 2014-05-29 Mitsui Chemicals Tohcello Inc Release film
WO2014141512A1 (en) * 2013-03-14 2014-09-18 三井化学東セロ株式会社 Release film
JPWO2014141512A1 (en) * 2013-03-14 2017-02-16 三井化学東セロ株式会社 Release film
WO2015019933A1 (en) * 2013-08-05 2015-02-12 積水化学工業株式会社 Mold release film
JP2015052099A (en) * 2013-08-05 2015-03-19 積水化学工業株式会社 Release film
JP2019217780A (en) * 2013-08-05 2019-12-26 積水化学工業株式会社 Release film
WO2023032793A1 (en) * 2021-08-31 2023-03-09 東洋紡株式会社 Mold release film for resin sheet molding
CN117858800A (en) * 2021-08-31 2024-04-09 东洋纺株式会社 Release film for resin sheet molding

Also Published As

Publication number Publication date
JP4332204B2 (en) 2009-09-16
KR20100090728A (en) 2010-08-16
KR20090120519A (en) 2009-11-24
CN101678605A (en) 2010-03-24
TW200920589A (en) 2009-05-16
CN101678605B (en) 2013-04-10
TWI318599B (en) 2009-12-21
KR101018621B1 (en) 2011-03-03
JP2009090647A (en) 2009-04-30

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